Electronic component and manufacturing method therefor

Abstract

The present invention relates to an electronic component and a manufacturing method therefor and, more specifically, to a surface-mounted electronic component provided at an electronic device, and a manufacturing method therefor. An electronic component according to an embodiment of the present invention may be mounted on a circuit board. The electronic component includes: a functional part executing a function in response to a supply of power; an electrode part of which at least a portion is provided on the mounting surface of the functional part; and a diffusion part of which at least a portion is provided on the mounting surface of the functional part so as to diffuse a bonding material for connecting the electrode part to the circuit board.

Description

Electronic components and methods for manufacturing the same

[0001] The present invention relates to electronic components and a method for manufacturing the same, and more particularly, to surface-mounted electronic components provided in electronic devices and a method for manufacturing the same.

[0002] Electronic components are widely used in various electronic devices, including home appliances and portable devices. Meanwhile, the frequency bands of electronic devices are gradually expanding into the high-frequency range due to advancements in multi-functionality and digital communication. Therefore, the electronic components used in these devices are also facing a critical challenge of responding to high frequencies.

[0003] Power inductors, a type of electronic component, are used in power circuits or converter circuits that handle large currents. With the increasing frequency and miniaturization of power circuits, power inductors are increasingly being used as replacements for conventional wound choke coils. Furthermore, power inductor development is progressing toward miniaturization, higher current, and lower resistance, driven by the shrinking size and increasing functionality of electronic devices.

[0004] Power inductors are mounted on a printed circuit board (PCB) by soldering electrodes, at least part of which are arranged on the mounting surface, to the PCB using a bonding agent containing solder and flux. However, the printed circuit board has a fine oxide film formed by reacting with oxygen in the air after manufacturing, and the oxide film formed on the printed circuit board reacts with the flux to form voids within the bonding agent that is melted and solidified. When voids are formed within the bonding agent, the height at which the power inductor is placed from the printed circuit board increases, and there is a problem that a short circuit may occur with the shield can covering the power inductor.

[0005] (Prior art literature)

[0006] Korean Patent Publication No. 10-2016-0092543

[0007] The present invention provides an electronic component that can be stably mounted on a circuit board and a method for manufacturing the same.

[0008] An electronic component according to an embodiment of the present invention is an electronic component that can be mounted on a circuit board, comprising: a functional portion that receives power and performs a function; an electrode portion that is at least partially provided on a mounting surface of the functional portion; and a diffusion portion that is at least partially provided on the mounting surface of the functional portion so as to diffuse a bonding material for connecting the electrode portion to the circuit board.

[0009] The above diffusion portion may be provided in an area of ​​the mounting surface of the functional portion excluding an area where the electrode portion is provided.

[0010] The above-mentioned diffusion portion may include a plurality of protrusions formed on the surface.

[0011] The above diffusion portion may include an insulating layer at least partially provided on the mounting surface of the functional portion; and a plurality of particles distributed on the insulating layer so as to form the plurality of protrusions.

[0012] The above particles may include magnetic powder.

[0013] The above plurality of protrusions may have an average height of 1 to 25 μm.

[0014] The above diffusion portion may include an insulating layer having a hydrophilic surface.

[0015] The above insulating layer may contain an additive including at least one of a silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer.

[0016]

[0017] In addition, a method for manufacturing an electronic component according to an embodiment of the present invention is a method for manufacturing an electronic component that can be mounted on a circuit board, comprising: a process of forming a functional unit that is supplied with power and performs a function; a process of forming an insulating layer on at least a portion of a surface including a mounting surface of the functional unit; a process of forming an electrode unit on at least a portion of a surface including a mounting surface of the functional unit; and a process of treating the insulating layer before or after the process of forming the electrode unit so as to allow diffusion of a bonding material for connecting the electrode unit to the circuit board.

[0018] The process of forming the above insulating layer can form the insulating layer in an area excluding the area for forming the electrode portion among the mounting surfaces of the functional portion.

[0019] The process of processing the above insulating layer may include a process of forming a plurality of protrusions on the surface of the insulating layer.

[0020] The process of forming the plurality of protrusions may include a process of polishing and wearing down the surface of the insulating layer.

[0021] The insulating layer has a hydrophobic surface, and the process of treating the insulating layer may include a process of modifying the surface of the insulating layer into a hydrophilic surface.

[0022] The process of modifying the surface into the hydrophilic surface may include at least one of a process of plasma treating the surface of the insulating layer, a process of chemically reacting the surface of the insulating layer, and a process of irradiating the surface of the insulating layer.

[0023] In addition, a method for manufacturing an electronic component according to an embodiment of the present invention is a method for manufacturing an electronic component that can be mounted on a circuit board, comprising: a process of forming a functional portion that performs a function by supplying power; a process of forming an insulating layer having a plurality of protrusions on at least a portion of a surface including a mounting surface of the functional portion; and a process of forming an electrode portion on at least a portion of a surface including a mounting surface of the functional portion.

[0024] The process of forming the insulating layer having the plurality of protrusions may include a process of applying a mixture of insulating paste and a plurality of particles to at least a portion of the surface including the mounting surface of the functional portion; and a process of curing the mixture.

[0025] The above particles may include magnetic powder.

[0026] The above insulating layer may contain an additive including at least one of a silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer.

[0027] According to an embodiment of the present invention, it is possible to prevent voids from being formed in a bonding material connecting an electronic component and a circuit board when surface-mounting the electronic component.

[0028] That is, in order to solder the electrode portion of an electronic component and the circuit board through the diffusion portion, the molten bonding agent is diffused around the electrode portion, thereby releasing air bubbles within the bonding agent to the outside, thereby preventing the formation of voids.

[0029] Accordingly, the height at which electronic components are placed from the circuit board can be lowered, miniaturizing the electronic components, and effectively preventing short circuits with the shield can covering the electronic components.

[0030] FIG. 1 is a schematic drawing showing an electronic component according to an embodiment of the present invention.

[0031] Figure 2 is a drawing showing the internal appearance of an electronic component according to an embodiment of the present invention.

[0032] FIG. 3 is a drawing showing an electronic component according to an embodiment of the present invention cut along line AA' of FIG. 1.

[0033] Figure 4 is a drawing showing a diffusion part according to one embodiment of the present invention.

[0034] FIG. 5 is a drawing showing a diffusion section according to another embodiment of the present invention.

[0035] FIG. 6 is a drawing showing an electronic component mounted on a circuit board according to an embodiment of the present invention.

[0036] Figure 7 is a drawing showing how voids are formed depending on the content of additives included in an insulating layer for forming a diffusion portion.

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments of the present invention are provided solely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. For the purpose of explaining the invention in detail, the drawings may be exaggerated, and like reference numerals throughout the drawings represent like elements.

[0038]

[0039] Fig. 1 is a schematic drawing showing an electronic component according to an embodiment of the present invention. Fig. 2 is a drawing showing the internal appearance of an electronic component according to an embodiment of the present invention, and Fig. 3 is a drawing showing an electronic component according to an embodiment of the present invention cut along line AA' of Fig. 1.

[0040] Referring to FIGS. 1 to 3, an electronic component according to an embodiment of the present invention is an electronic component that can be mounted on a circuit board, and includes a functional unit (100) that is supplied with power to perform a function, an electrode unit (200) at least part of which is provided on a mounting surface of the functional unit (100), and a diffusion unit (300) at least part of which is provided on the mounting surface of the functional unit (100) so as to diffuse a bonding material for connecting the electrode unit (200) to the circuit board.

[0041] Electronic components can be various components used in various electronic devices. Furthermore, electronic components can be passive elements that perform various functions within an electronic device when powered. For example, electronic components can include noise filters, diodes, varistors, RF inductors, power inductors, and combinations thereof.

[0042] Here, a power inductor is a device that stores electricity in the form of a magnetic field, maintaining an output voltage and stabilizing the power supply. A power inductor can be defined as a highly efficient inductor that exhibits less change in capacitance (inductance) than a typical inductor when DC power is applied. In other words, a power inductor can be viewed as incorporating the functions of a typical inductor plus DC bias characteristics (changes in inductance when DC current is applied).

[0043] Below, a detailed structural example of a power inductor as the electronic component is described. However, electronic components are not limited to this, and may include various components installed in electronic devices and performing various functions when power is applied.

[0044] The functional unit (100) may have a polyhedral shape. For example, the functional unit (100) may have a hexahedral shape. That is, the functional unit (100) may have an approximately hexahedral shape having a predetermined length in the X-axis direction, a predetermined width in the Y-axis direction, and a predetermined height in the Z-axis direction. In this case, the functional unit (100) may have four side surfaces facing each other in the X-axis and Y-axis directions, and an upper surface and a lower surface facing each other in the Z-axis direction, and the lower surface of the functional unit (100) forms a mounting surface for mounting an electronic component on a circuit board. That is, the electronic component may be mounted on a circuit board by positioning the lower surface of the functional unit (100) toward the circuit board included in an electronic device, etc. Here, the circuit board may include a printed circuit board (PCB) on which various wirings for operating an electronic device, etc. are printed.

[0045] Such a functional part (100) may include a body (110) and a spiral coil pattern (130) provided within the body (110) and connected to an electrode part (200) described later.

[0046] The body (110) forms the outer shape of the functional portion (100). Accordingly, the body (110) may have a polyhedral shape, similar to the functional portion (100), and may have a hexahedral shape, for example. Such a body (110) may be formed by mixing metal powder and an insulator.

[0047] The metal powder may be a single particle of the same size or two or more types of particles, or a single particle of multiple sizes or two or more types of particles. In this case, the metal powder may be powder of the same substance or powder of different substances. When the metal powders have different average particle sizes, the metal powders can be uniformly mixed and distributed throughout the body (110), thereby maintaining a uniform investment rate. In addition, when two or more types of metal powders of different sizes are used, the filling rate can be increased, thereby maximizing the capacity.

[0048] These metal powders can be made of iron (Fe) as a base, and can include metal materials such as silicon (Si), boron (B), niobium (Nb), and copper (Cu). For example, the metal powders can include one or more metals selected from the group consisting of iron-silicon (Fe-Si), iron-nickel-silicon (Fe-Ni-Si), iron-silicon-boron (Fe-Si-B), iron-silicon-chromium (Fe-Si-Cr), iron-silicon-aluminum (Fe-Si-Al), iron-silicon-chromium-boron (Fe-Si-Cr-B), iron-aluminum-chromium (Fe-Al-Cr), iron-silicon-boron-niobium-copper (Fe-Si-B-Nb-Cu), and iron-silicon-chromium-boron-niobium-copper (Fe-Si-Cr-B-Nb-Cu). That is, the metal powder can have a magnetic structure including iron (Fe) or be formed into a magnetic metal alloy to have a predetermined investment rate.

[0049] An insulator may be mixed with the metal powder to insulate between the metal powders. That is, the metal powder may cause a problem of increased eddy current loss and hysteresis loss at high frequencies, which may lead to increased material loss. To reduce this material loss, the body (110) may include an insulator that insulates between the metal powders. The insulator may include, but is not limited to, one or more selected from the group consisting of epoxy, polyimide, and liquid crystal polymer (LCP). In addition, the insulator may of course be made of a thermosetting resin such as an epoxy resin to provide insulation between the metal powders.

[0050] The coil pattern (130) has a spiral shape and is provided within the body (110). Such a coil pattern (130) may be formed on at least one side, preferably both sides, of the support layer (120). Such a coil pattern (130) may be formed in a spiral shape in a predetermined region of the support layer (120), for example, from the center to the outside, and two coil patterns (130) formed on both sides of the support layer (120) may be connected to form one coil. That is, the coil pattern (130) may be formed in a spiral shape from the outside of a through hole formed in the center of the support layer (120) and may be connected to each other through a conductive via (122) formed in the support layer (120). Here, the upper coil pattern (132) and the lower coil pattern (134) may be formed in the same shape and may be formed at the same height.

[0051] Here, the support layer (120) may be provided in the form of a metal foil attached to the upper and lower surfaces of a base having a predetermined thickness. Here, the base may include glass-reinforced fiber, plastic, ferrite, etc. For example, the support layer (120) may include copper clad lamination (CCL) in which copper foil is bonded to glass-reinforced fiber.

[0052] Meanwhile, as described above, a coil pattern (130) is formed on at least one surface of the support layer (120), and an internal insulating layer may be provided to cover the upper surface and side surfaces of the coil pattern (130) to insulate the coil pattern (130) and the metal powder within the body. The internal insulating layer may be formed to cover not only the upper surface and side surfaces of the coil pattern (130) but also the support layer (120), and may be formed in the entire area where the support layer (120) and the coil pattern (130) are exposed to the body (110).

[0053] The electrode portion (200) is provided at least in part on the mounting surface of the functional portion (100). That is, the electrode portion (200) may be provided at least in part on the lower surface of the functional portion (100). Such electrode portions (200) are provided to be mutually separated from each other on the surface of the functional portion (100) so as to supply power to the coil pattern (130) within the functional portion (100), more specifically, the body (110). In this case, the electrode portion (200) may include a first electrode (210) and a second electrode (220) provided on opposite sides of the functional portion (100), for example, opposite sides in the X-axis direction. The first electrode (210) may have an 'L' shape extending from one side of the functional portion (100) to the lower surface of the functional portion (100), and the second electrode (220) may have an 'L' shape extending from the other side of the functional portion (100) to the lower surface of the functional portion (100). However, the structures of the first electrode (210) and the second electrode (220) are not limited thereto, and the first electrode (210) may partially extend from one side of the functional portion (100) to the front, rear, upper, and lower surfaces of the functional portion (100), and the second electrode (220) may partially extend from the other side of the functional portion (100) to the front, rear, upper, and lower surfaces of the functional portion (100), and may have various structures in which at least a portion is provided on the mounting surface of the functional portion (100).

[0054] The electrode portion (200) may be formed of a metal having electrical conductivity. For example, the electrode portion (200) may be formed of one or more metals selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), tin (Sn), nickel (Ni), palladium (Pd), and alloys thereof. In addition, the electrode portion (200) may include a first electrode layer formed on the surface of the functional portion (100) and a second electrode layer formed on the first electrode layer. Here, the first electrode layer may be formed of a material including copper (Cu), and the second electrode layer may be formed of a material including nickel (Ni) or tin (Sn). In addition, the second electrode layer may be formed of a plurality of layers and may have various structures, such as, for example, an electrode layer including tin (Sn) is formed on an electrode layer including nickel (Ni). The electrode portion (200) may be formed, for example, through a plating process.

[0055] The diffusion portion (300) is provided at least partially on the mounting surface of the functional portion (100). That is, the diffusion portion (300) may be provided at least partially on the lower surface of the functional portion (100). Such a diffusion portion (300) may serve to diffuse a bonding material for connecting the electrode portion (200) to the circuit board.

[0056] Electronic components, for example, power inductors, have electrode portions (200) at least partially disposed on a mounting surface, which are soldered to a printed circuit board (PCB) using a bonding material including solder and flux, and are mounted on a circuit board, for example, a printed circuit board.

[0057] However, printed circuit boards have a fine oxide film formed by reacting with oxygen in the air after manufacturing, and the oxide film formed on the printed circuit board reacts with the flux to form voids in the bonding material that is melted and solidified. When voids are formed in the bonding material, the height at which the power inductor is placed from the printed circuit board increases, and there is a problem that a short circuit may occur with a shield can covering the power inductor. Therefore, in an embodiment of the present invention, a diffusion part (300) is included, at least a portion of which is provided on the mounting surface of the functional part (100), so as to diffuse a bonding material for connecting the electrode part (200) to the circuit board, thereby preventing voids from being formed in the bonding material that connects the electronic part and the circuit board when surface-mounting the electronic part.

[0058] The diffusion portion (300) may be provided in an area of ​​the mounting surface of the functional portion (100) excluding an area where the electrode portion (200) is provided. That is, the diffusion portion (300) may be formed in an area of ​​the lower surface of the functional portion (100) where the electrode portion (200) is not formed. Such diffusion portion (300) may be formed not only on the lower surface of the functional portion (100) but also on other surfaces. For example, the diffusion portion (300) may be formed on the entire surface of the functional portion (100) where the electrode portion (200) is not formed. Such diffusion portion (300) may have various structures capable of diffusing a bonding material for connecting the electrode portion (200) to a circuit board, which will be described in more detail below with reference to FIGS. 4 and 5.

[0059] FIG. 4 is a drawing showing a diffusion unit according to one embodiment of the present invention, and FIG. 5 is a drawing showing a diffusion unit according to another embodiment of the present invention. Here, FIG. 4 shows an enlarged view of the P region of FIG. 3 in the case of having a diffusion unit according to one embodiment of the present invention, and FIG. 5 shows an enlarged view of the P region of FIG. 3 in the case of having a diffusion unit according to another embodiment of the present invention.

[0060] As illustrated in FIG. 4, the diffusion portion (300) according to an embodiment of the present invention may include a plurality of protrusions (310) formed on the surface. For example, when the diffusion portion (300) is formed on the lower surface of the functional portion (100), a plurality of protrusions (310) may be distributed and formed on the lower surface of the diffusion portion (300) where the diffusion portion (300) is exposed to the outside. Here, the protrusions (310) may have various shapes such as forming a curved surface or an uneven surface on the lower surface of the diffusion portion (300). When the protrusions (310) are formed on the surface of the diffusion portion (300) in this way, the surface area of ​​the diffusion portion (300) increases, and a bonding material for connecting the electrode portion (200) to the circuit board during mounting can be easily diffused along the surface of the diffusion portion (300).

[0061] Here, the plurality of protrusions (310) may have an average height (H2) of 1 to 25 μm. For example, the diffusion portion (300) may be formed with a thickness (H1) of 5 to 30 μm on the surface of the functional portion (100) as a whole, and among these, the plurality of protrusions (310) may be formed to have an average height (H2) of 1 μm or more and 25 μm or less. Accordingly, the diffusion portion (300) may have a structure in which a base layer in contact with the surface of the functional portion (100) has a thickness (H3) of 1 to 28 μm, and a plurality of protrusions (310) are formed on the base layer with an average height (H2) of 1 to 25 μm. If the average height (H2) of the plurality of protrusions (310) is less than 1 ㎛, the effect of increasing the surface area is minimal, and if the average height (H2) of the plurality of protrusions (310) exceeds 25 ㎛, an unnecessary curved surface or uneven surface is formed, which reduces the diffusion property again and increases the overall size. Accordingly, the plurality of protrusions (310) can be formed with an average height (H2) of 1 to 25 ㎛.

[0062] In this way, the diffusion portion (300) having a plurality of protrusions (310) can be formed by forming an insulating layer on the surface of the functional portion (100) and treating the formed insulating layer. Here, the insulating layer can be formed of epoxy. That is, the diffusion portion (300) can be formed to have a plurality of protrusions (310) by forming an insulating layer with a predetermined thickness on the surface of the functional portion (100) and polishing and wearing down the surface of the formed insulating layer. Such polishing can be performed by mechanically polishing the insulating layer without using a separate polishing agent, and can be performed using various methods capable of polishing and wearing down the surface of the insulating layer, such as forming the insulating layer using alumina (Al2O3) or silicon carbide (SiC) as an abrasive.

[0063] In contrast, the diffusion part (300) having a plurality of protrusions (310) can be formed by applying a mixture of an insulating paste and a plurality of particles to the surface of the functional part (100) and curing the mixture. That is, the diffusion part (300) can be formed by applying a mixture of an insulating paste containing epoxy and a plurality of particles having a predetermined particle size to the surface of the functional part (100) and curing the mixture. Accordingly, the diffusion part (300) has a structure including an insulating layer provided at least partially on the mounting surface of the functional part (100) and a plurality of particles distributed on the insulating layer so as to form a plurality of protrusions. Here, the plurality of particles can have an average particle size of 0.5 to 20 μm, and thereby, a plurality of protrusions (310) having an average height (H2) of 1 to 25 μm can be formed on the surface of the diffusion part (300). Meanwhile, the particles mixed into the insulating paste may include magnetic powder, thereby further improving the magnetic properties of the electronic component.

[0064] As illustrated in FIG. 5, a diffusion unit (300) according to another embodiment of the present invention may include an insulating layer having a hydrophilic surface (320). For example, when the diffusion unit (300) is formed on the lower surface of the functional unit (100), a hydrophilic surface (320) may be formed on the lower surface of the diffusion unit (300) where the diffusion unit (300) is exposed to the outside. Here, the hydrophilic surface (320) may be formed by modifying the surface of the insulating layer. For example, when the insulating layer is formed of a hydrophobic material such as epoxy and has a hydrophobic surface, the surface of the insulating layer may be modified into a hydrophilic surface, thereby forming the diffusion unit (300) in a form in which an insulating layer having hydrophobicity in contact with the functional unit (100) and a surface layer having hydrophilicity are laminated on the insulating layer.

[0065] In order to modify the surface of a hydrophobic insulating layer into a hydrophilic surface, the surface of the insulating layer can be subjected to plasma treatment, a chemical reaction on the surface of the insulating layer, or irradiation. Furthermore, two or more of the above methods can be combined. For example, the plasma treatment can be performed by exposing the surface of the insulating layer to plasma using gases such as argon (Ar), nitrogen (N2), hydrogen (H2), helium (He), and ammonia (NH3). Furthermore, the chemical reaction can be performed by wet reaction of the surface of the insulating layer with a solution such as a strong acid or strong oxidizing salt, a sodium-naphthalene solution, or dopamine (3,4-dihydroxyphenylalanine). Furthermore, the irradiation treatment can be performed by irradiating the surface of the insulating layer with an electron beam including ions, gamma rays, ultraviolet rays, and electrons. In addition, various known methods for modifying the surface of a hydrophobic insulating layer into a hydrophilic surface can be applied, and a detailed description thereof will be omitted.

[0066] FIG. 6 is a drawing showing an electronic component mounted on a circuit board according to an embodiment of the present invention. Here, FIG. 6(a) is a drawing showing an electronic component provided with a general insulating layer mounted on a circuit board, and FIG. 6(b) is a drawing showing an electronic component provided with a diffusion portion according to an embodiment of the present invention mounted on a circuit board.

[0067] As illustrated in Fig. 6(a), a conventional electronic component, for example, a power inductor, has an insulating layer (300') formed of epoxy or the like formed in an area excluding an area where an electrode portion (200) is provided. Such an insulating layer (300') generally has a hydrophobic property with weak or no affinity for moisture. Meanwhile, the circuit board (10) has a fine oxide film formed by reacting with oxygen in the air after manufacturing. In this case, when the electronic component is mounted on the circuit board (10) through a bonding material (S) including solder and flux to electrically connect the electrode portion (200) and the electrode pattern (12) of the circuit board (12), the oxide film of the circuit board and the carboxyl group (-COOH) contained in the flux react with each other to generate moisture in the form of water vapor. However, as described above, since the insulating layer generally has hydrophobicity, the molten bonding agent (S) cannot easily diffuse into the area where the insulating layer is formed. Accordingly, the generated moisture is trapped within the molten bonding agent (S), and when the bonding agent (S) solidifies, a void (V) exists within the bonding agent (S). When a void (V) is formed within the bonding agent (S) in this way, the height (h') at which the electronic component is placed from the circuit board (10) increases, and a short circuit may occur with the shield can (not shown) covering the electronic component, resulting in a defect.

[0068] On the other hand, as illustrated in FIG. 6(b), if a diffusion portion (300) is provided so as to diffuse a bonding material (S) for connecting the electrode portion (200) to the circuit board (10) according to an embodiment of the present invention, voids (V) can be prevented from being formed in the bonding material (S) for connecting the electronic component and the circuit board (10). That is, according to an embodiment of the present invention, the molten bonding material (S) for soldering the electrode portion (200) of the electronic component and the circuit board (100) can be easily diffused around the electrode portion (200) through the diffusion portion (300). Accordingly, moisture or voids (V) in the bonding material (S) can be released to the outside from the bonding material (S), thereby preventing the formation of voids (V), and reducing the height (h) at which the electronic component is arranged from the circuit board (10), thereby miniaturizing the electronic component, and effectively preventing a short circuit with a shield can covering the electronic component.

[0069] Figure 7 is a drawing showing how voids are formed depending on the content of additives included in the insulating layer for forming a diffusion portion.

[0070] As described above, the diffusion portion (300) according to an embodiment of the present invention can be formed by forming an insulating layer on the surface of the functional portion (100) and polishing the formed insulating layer or modifying the surface of the formed insulating layer. In addition, the diffusion portion (300) can be formed as an insulating layer having a plurality of protrusions by applying a mixture of an insulating paste and a plurality of particles to the surface of the functional portion (100). At this time, the insulating layer can be formed of epoxy, but when the insulating layer includes an additive other than epoxy, the formation of voids (V) within the bonding material (S) can be more effectively controlled.

[0071] Experimental Example 1 of Fig. 7 shows how voids (V) are formed within the bonding material (S) when the insulating layer for forming the diffusion portion (300) does not contain other additives. As shown in Experimental Example 1, it can be seen that when the insulating layer for forming the diffusion portion (300) does not contain other additives, a number of voids (V) are formed on both sides of the electronic component, i.e., within the bonding material (S).

[0072] Meanwhile, Experimental Examples 2 to 4 of FIG. 7 show that voids (V) are formed in the bonding material (S) when the insulating layer for forming the diffusion portion (300) contains an additive including at least one of silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer. As shown in Experimental Examples 2 to 4, it can be seen that only a small number of voids (V) are formed in the bonding material (S) when the insulating layer for forming the diffusion portion (300) contains an additive including at least one of silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer. In particular, it can be seen that almost no voids (V) are formed in the bonding material (S) when the additive is contained in an amount of 0.5 to 10 wt% based on the total weight of the insulating layer. This is thought to be because the wettability of the insulating layer is improved by the additive, reducing the surface tension, or the reaction between the epoxy component in the insulating layer and the bonding agent (S) during soldering is minimized by the additive, improving the bonding strength.

[0073] On the other hand, Experimental Example 5 of Fig. 7 shows that voids (V) are formed in the bonding material (S) when the insulating layer for forming the diffusion portion (300) includes an additive including at least one of silane and a leveling agent at 15 wt% with respect to the total weight of the insulating layer. As shown in Experimental Example 5, it can be seen that a plurality of voids (V) are formed in the bonding material (S) when the insulating layer for forming the diffusion portion (300) includes an additive including at least one of silane and a leveling agent at 15 wt% with respect to the total weight of the insulating layer.

[0074] Accordingly, in an embodiment of the present invention, the insulating layer for forming the diffusion portion (300) may contain an additive including at least one of a silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer, and in this case, the formation of voids (V) may be suppressed. In addition, the insulating layer for forming the diffusion portion (300) may contain an additive including at least one of a silane and a leveling agent in an amount of 0.5 to 10 wt% based on the total weight of the insulating layer, and in this case, the formation of voids (V) may be suppressed more effectively. Here, the leveling agent may be a general leveling agent used for forming the insulating layer, and for example, the leveling agent may include at least one selected from a silicone leveling agent, an acrylic leveling agent, a polyacrylate leveling agent, and a polysiloxane leveling agent, but is not limited thereto.

[0075]

[0076] Hereinafter, a method for manufacturing an electronic component according to an embodiment of the present invention will be described. The method for manufacturing an electronic component according to an embodiment of the present invention may be a method for manufacturing an electronic component having the aforementioned configuration. Accordingly, the aforementioned content regarding the electronic component can be applied as is, and therefore, a description of redundant content will be omitted.

[0077] A method for manufacturing an electronic component according to an embodiment of the present invention is a method for manufacturing an electronic component that can be mounted on a circuit board, the method including: a process of forming a functional unit (100) that is supplied with power and performs a function; a process of forming an insulating layer on at least a portion of a surface including a mounting surface of the functional unit (100); a process of forming an electrode unit (200) on at least a portion of a surface including a mounting surface of the functional unit (100); and a process of treating the insulating layer before or after the process of forming the electrode unit (200) so as to allow diffusion of a bonding material for connecting the electrode unit (200) to the circuit board.

[0078] According to the manufacturing method of such an electronic component, an electronic component including a diffusion portion (300) in which a plurality of protrusions (310) are formed by polishing an insulating layer in an electronic component according to the embodiment of the present invention described above can be manufactured, or an electronic component including a diffusion portion (300) made of an insulating layer having a hydrophilic surface can be manufactured.

[0079] The process of forming the functional part (100) forms the functional part (100) including a body (110) and a spiral coil pattern (130) provided within the body (110). For example, the process of forming the functional part (100) includes first preparing a plurality of sheets made of a material including metal powder and an insulator, stacking and pressing the plurality of sheets with a support layer (120) having a coil pattern (130) formed on at least one surface therebetween, and then forming the sheets. Then, the formed body may be cut into unit elements to form the functional part (100) including the body (110) and the spiral coil pattern (130) provided within the body (110).

[0080] The process of forming an insulating layer forms an insulating layer on the surface of the functional part (100) except for the area where the electrode part (200) is to be formed. The process of forming the insulating layer may form the insulating layer on at least a portion of the surface including the mounting surface of the functional part (100), may form the insulating layer on an area of ​​the lower surface of the functional part (100) where the electrode part (200) is not formed, may be formed on other surfaces as well as the lower surface of the functional part (100), and may be formed on the entire surface of the functional part (100) except for the area where the electrode part (200) is to be formed. Such an insulating layer may be formed using epoxy, and the process of forming the insulating layer may be performed by applying or printing such a resin to a predetermined area of ​​the body (110). However, the process of forming the insulating layer is not limited thereto, and may be performed using various methods such as a chemical or physical deposition method. At this time, the insulating layer may be formed to a thickness that is the same as or different from the thickness of the electrode part (200) to be formed later, and may be formed to a thickness of, for example, 5 to 30 μm.

[0081] The process of forming the electrode portion (200) forms the electrode portion (200) on at least a portion of the surface including the mounting surface of the functional portion (100). The process of forming the electrode portion (200) may form the electrode portion (200) on at least a portion of the surface including the mounting surface of the functional portion (100), whereby at least a portion of the electrode portion (200) may be provided on the lower surface of the functional portion (100). Such an electrode portion (200) may be formed by a method such as electroless plating or electrolytic plating.

[0082] The process of processing the insulating layer may be performed before or after the process of forming the electrode portion (200). That is, the process of processing the insulating layer may be performed before forming the electrode portion (200) or may be performed after forming the electrode portion (200). Such a process of processing the insulating layer processes the insulating layer so that a bonding material for connecting the electrode portion (200) to the circuit board can be diffused. That is, the process of processing the insulating layer may be a process of processing the insulating layer and transforming it into a diffusion layer.

[0083] For example, the process of treating the insulating layer may be a process of forming a plurality of protrusions (310) on the surface of the insulating layer. That is, the process of treating the insulating layer may include a process of polishing and wearing away the surface of the insulating layer formed on the surface of the functional portion (100), thereby forming a diffusion portion (300) having a plurality of protrusions (310). Such polishing may be performed by mechanically polishing the insulating layer without using a separate polishing agent, and may be performed using various methods capable of polishing and wearing away the surface of the insulating layer, such as forming the insulating layer using alumina (Al2O3) or silicon carbide (SiC) as an abrasive, as described above.

[0084] In addition, the process of treating the insulating layer may include a process of modifying the surface of the insulating layer into a hydrophilic surface (320). That is, the insulating layer generally has hydrophobicity, and the process of treating the insulating layer may modify the surface of the insulating layer having such hydrophobicity into a hydrophilic surface, thereby forming a diffusion portion (300) having a hydrophilic surface (320). In order to modify the surface of the insulating layer having hydrophobicity into a hydrophilic surface, the surface of the insulating layer may be subjected to plasma treatment, the surface of the insulating layer may be chemically reacted, or the surface of the insulating layer may be subjected to irradiation treatment. As described above, two or more of the above methods may be combined, and therefore, a duplicate description thereof will be omitted.

[0085] In contrast, a method for manufacturing an electronic component according to an embodiment of the present invention is a method for manufacturing an electronic component that can be mounted on a circuit board, the method including: forming a functional portion (100) that is supplied with power and performs a function; forming a diffusion portion (300) having a plurality of protrusions (310) on at least a portion of a surface including a mounting surface of the functional portion (100); and forming an electrode portion (200) on at least a portion of a surface including a mounting surface of the functional portion (100).

[0086] According to the method for manufacturing an electronic component as described above, an electronic component including a diffusion portion (300) in which a plurality of protrusions (310) are formed by a plurality of particles distributed in an insulating layer in the electronic component according to the embodiment of the present invention described above can be manufactured. Here, the process of forming the functional portion (100) and the process of forming the electrode portion (200) are the same as the case of manufacturing an electronic component including a diffusion portion (300) in which a plurality of protrusions (310) are formed by polishing an insulating layer or manufacturing an electronic component including a diffusion portion (300) made of an insulating layer having a hydrophilic surface, so redundant descriptions will be omitted.

[0087] Here, the process of forming the diffusion part (300) may be a process of forming the diffusion part (300) having a plurality of protrusions (310) by using a plurality of particles distributed on an insulating layer. Here, the process of forming the diffusion part (300) may include a process of applying a mixture of an insulating paste and a plurality of particles to at least a portion of the surface including the mounting surface of the functional part (100) and a process of curing the mixture. For example, the process of forming the diffusion part may be performed by applying a mixture of an insulating paste including epoxy and a plurality of particles having a predetermined particle size to the surface of the functional part (100) and curing the applied mixture. As a result, the diffusion part (300) has a structure including a plurality of particles distributed on the insulating layer so as to form an insulating layer and a plurality of protrusions, at least a portion of which is provided on the mounting surface of the functional part (100). As described above, the particles mixed in the insulating paste may include magnetic powder, and thereby the magnetic properties of the electronic component may be further improved.

[0088] Meanwhile, in the method for manufacturing an electronic component according to an embodiment of the present invention, the insulating layer for forming the diffusion portion (300) may contain an additive including at least one of silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer, in which case the formation of voids (V) can be suppressed. In addition, the insulating layer for forming the diffusion portion (300) may contain an additive including at least one of silane and a leveling agent in an amount of 0.5 to 10 wt% based on the total weight of the insulating layer, in which case the formation of voids (V) can be suppressed more effectively.

[0089]

[0090] While the preferred embodiments of the present invention have been described and illustrated using specific terms above, such terms are solely for the purpose of clearly describing the present invention, and it is to be understood that various modifications and variations may be made to the embodiments and terms described herein without departing from the spirit and scope of the appended claims. Such modified embodiments should not be construed individually from the spirit and scope of the present invention, but should be considered to fall within the scope of the claims.

Claims

1. As an electronic component that can be mounted on a circuit board, A functional unit that is supplied with power and performs a function; An electrode part provided on the mounting surface of the functional part at least in part; and An electronic component comprising a diffusion portion, at least a portion of which is provided on the mounting surface of the functional portion, so as to enable diffusion of a bonding material for connecting the electrode portion to the circuit board.

2. In claim 1, The above diffusion part is an electronic component provided in an area of ​​the mounting surface of the functional part excluding an area where the electrode part is provided.

3. In claim 1, The above diffusion portion is an electronic component including a plurality of protrusions formed on the surface.

4. In claim 3, The above diffusion part, An insulating layer provided on at least a portion of the mounting surface of the functional portion; and An electronic component comprising a plurality of particles distributed in the insulating layer so as to form the plurality of protrusions.

5. In claim 4, The above particles are electronic components containing magnetic powder.

6. In claim 3, An electronic component wherein the plurality of protrusions have an average height of 1 to 25 μm.

7. In claim 1, The above diffusion part is an electronic component including an insulating layer having a hydrophilic surface.

8. In claim 4 or 7, An electronic component in which the insulating layer contains an additive including at least one of silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer.

9. A method for manufacturing an electronic component that can be mounted on a circuit board, The process of forming a functional unit that is supplied with power and performs a function; A process of forming an insulating layer on at least a portion of the surface including the mounting surface of the above functional unit; A process of forming an electrode part on at least a portion of the surface including the mounting surface of the above functional part; and A method for manufacturing an electronic component, comprising: a process of treating the insulating layer so as to enable diffusion of a bonding material for connecting the electrode portion to the circuit board, before or after the process of forming the electrode portion.

10. In claim 9, The process of forming the above insulating layer is: A method for manufacturing an electronic component, wherein an insulating layer is formed in an area excluding an area for forming the electrode portion among the mounting surfaces of the above functional portion.

11. In claim 9, The process of processing the above insulating layer is as follows: A method for manufacturing an electronic component, comprising: forming a plurality of protrusions on the surface of the insulating layer.

12. In claim 11, The process of forming the above plurality of protrusions is: A method for manufacturing an electronic component, comprising: a process of polishing and wearing down the surface of the insulating layer.

13. In claim 9, The above insulating layer has a hydrophobic surface, The process of processing the above insulating layer is as follows: A method for manufacturing an electronic component, comprising: a process of modifying the surface of the insulating layer into a hydrophilic surface.

14. In claim 13, The process of modifying the above hydrophilic surface is as follows: A method for manufacturing an electronic component, comprising at least one of a process of plasma treating the surface of the insulating layer, a process of chemically reacting the surface of the insulating layer, and a process of irradiating the surface of the insulating layer.

15. A method for manufacturing an electronic component that can be mounted on a circuit board, The process of forming a functional unit that is supplied with power and performs a function; A process of forming an insulating layer having a plurality of protrusions on at least a portion of the surface including the mounting surface of the above functional part; and A method for manufacturing an electronic component, comprising: forming an electrode portion on at least a portion of a surface including a mounting surface of the above functional portion.

16. In claim 15, The process of forming an insulating layer having the above-mentioned plurality of protrusions is as follows: A process of applying a mixture of insulating paste and a plurality of particles to at least a portion of the surface including the mounting surface of the above functional part; and A method for manufacturing an electronic component, comprising: a process of curing the above mixture.

17. In claim 16, The above particles are a method for manufacturing an electronic component including magnetic powder.

18. In claim 9 or 15, A method for manufacturing an electronic component, wherein the insulating layer contains an additive including at least one of a silane and a leveling agent in an amount of 0.1 to 10 wt% based on the total weight of the insulating layer.

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