Systems and methods for heat dissipation in acoustic resonators

Abstract

Systems and methods for heat dissipation in acoustic resonators are disclosed. In one aspect, a filter that relies on an acoustic resonator (i.e., an acoustic filter), one or more existing thermal bumps within the acoustic filter are expanded to a relatively large planar structure, including relatively large edge portions. This approach allows heat generated within the acoustic filter to be more readily conducted to an edge and dissipated, thereby protecting elements within the structure from heat damage. In a further aspect, a planar structure may connect two thermal bumps, such as an interior thermal bump and an exterior edge thermal bump. Again, this approach allows heat to be brought to an edge and dissipated.

Description

SYSTEMS AND METHODS FOR HEAT DISSIPATION IN ACOUSTIC RESONATORSPRIORITY APPLICATION

[0001] The present application claims priority to U.S. Provisional Patent Application Serial No. 63 / 575,955, entitled SYSTEMS AND METHODS FOR HEAT DISSIPATION IN ACOUSTIC RESONATORS, filed on April 8, 2024, the contents of which is hereby incorporated by reference in its entirety.BACKGROUNDI. Field of the Disclosure

[0002] The technology of the disclosure relates generally to filters that rely on acoustic resonators, such as may be used in wireless transceivers and ways to improve heat dissipation for such acoustic filters.II. Background

[0003] Computing devices abound in modern society, and more particularly, mobile communication devices have become increasingly common. The prevalence of these mobile communication devices is driven in part by the many functions that are now enabled on such devices. Increased processing capabilities in such devices means that mobile communication devices have evolved from pure communication tools into sophisticated mobile entertainment centers, thus enabling enhanced user experiences. With the advent of the myriad functions available to such devices, there has been increased pressure to find ways to send and receive more data over wireless communication links. This pressure has resulted in the continued evolution of cellular standards and the related evolution of the circuitry used to support such standards. In particular, the newer wireless standards have resulted in increased peak power that generates heat in a relatively confined space. Providing ways to dissipate such heat provides room for innovation.SUMMARY

[0004] Aspects disclosed in the detailed description include systems and methods for heat dissipation in acoustic resonators. In particular, in a filter that relies on an acoustic resonator (i.e., an acoustic filter), one or more existing thermal bumps within the acousticfilter are expanded to a relatively large planar structure to draw heat away from the resonators. In some aspects, the thermal bumps include relatively large edge portions. This approach allows heat generated within the acoustic filter to be more readily conducted away from the resonator (and potentially to an edge) and dissipated, thereby protecting elements within the structure from heat damage. In a further aspect, a planar structure may connect two thermal bumps, such as an interior thermal bump and an exterior edge thermal bump. Again, this approach allows heat to be pulled away from the resonators and dissipated.

[0005] In this regard, in one aspect, an acoustic filter is included. The acoustic filter includes a substrate comprising a surface comprising a first plane, a plurality of acoustic resonators positioned on the first plane, and a first thermal bump configured to couple the first plane to a heat dissipation plane and to convey heat generated in at least one of the plurality of acoustic resonators away from the first plane. The acoustic filter also includes metallization elements positioned on the first plane and coupled to the first thermal bump and configured to spread heat through the first plane away from the at least one of the plurality of acoustic resonators.

[0006] In another aspect, a device is disclosed. The device includes a wireless transceiver chain comprising: a laminate comprising a heat dissipation plane. The device also includes an acoustic filter comprising: a substrate comprising a surface comprising a first plane, a plurality of acoustic resonators positioned on the first plane, and a first thermal bump coupling the first plane to the heat dissipation plane and to convey heat generated in at least one of the plurality of acoustic resonators away from the first plane. The device further includes a metallization element positioned on the first plane and coupled to the first thermal bump and configured to spread heat through the first plane away from the at least one of the plurality of acoustic resonators.

[0007] In another aspect, a method of forming an acoustic filter is disclosed. The method includes forming a first plane and positioning a plurality of acoustic resonators on the first plane. The method also includes adding a thermal bump proximate at least one of the plurality of acoustic resonators to couple the first plane to a heat dissipation plane and adding a metallization element in the first plane coupled to the thermal bump.BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a block diagram of an exemplary transceiver chain with an acoustic filter disposed between a front-end module and an antenna;

[0009] Figure 2A is a top-plan view of a conventional acoustic filter with limited thermal bumps;

[0010] Figure 2B is a side-top perspective view of the acoustic filter of Figure 2A, highlighting how thermal bumps bring heat to a dissipating plane;

[0011] Figure 3A is a top-plan view of an exemplary acoustic filter with expanded thermal bumps according to aspects of the present disclosure;

[0012] Figure 3B is a side-top perspective view of the acoustic filter of Figure 3A, highlighting how the expanded thermal bumps may facilitate reduction in thermal resistance so that heat may be moved away from heat producing;

[0013] Figure 3C is a side elevational view of the acoustic filter of Figure 3A, with exploded views of the acoustic resonator structure and the metallization element as well as highlighting the thermal path through the thermal bumps;

[0014] Figure 4 is a flowchart illustrating an exemplary process for dissipating heat in an acoustic filter using expanded thermal bumps; and

[0015] Figure 5 is a block diagram of a mobile terminal, which may include the transceiver chain of Figure 1 and the acoustic filter of Figures 3A-3C according to the present disclosure.DETAILED DESCRIPTION

[0016] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

[0017] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and similarly, a second element could betermed a first element without departing from the scope of the present disclosure. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0018] It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element, or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, no intervening elements are present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, no intervening elements are present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, no intervening elements are present.

[0019] Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

[0020] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a," “an,” and “the” are intended to include the plural forms as well unless the context clearly indicates otherwise. It will be further understood that the terms “comprises," “comprising," “includes,” and / or “including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0021] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms usedherein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0022] In keeping with the above admonition about definitions, the present disclosure uses transceiver in a broad manner. Current industry literature uses “transceiver” in two ways. The first way uses transceiver broadly to refer to a plurality of circuits that send and receive signals. Exemplary circuits may include a baseband processor, an up / down conversion circuit, filters, amplifiers, couplers, and the like coupled to one or more antennas. A second way, used by some authors in the industry literature, refers to a circuit positioned between a baseband processor and a power amplifier circuit as a transceiver. This intermediate circuit may include the up / down conversion circuits, mixers, oscillators, filters, and the like but generally does not include the power amplifiers. As used herein, the term transceiver is used in the first sense. Where relevant to distinguish between the two definitions, the terms “transceiver chain” and “transceiver circuit” are used respectively.

[0023] Aspects disclosed in the detailed description include systems and methods for heat dissipation in acoustic resonators. In particular, in a filter that relies on an acoustic resonator (i.e., an acoustic filter), one or more existing thermal bumps within the acoustic filter are expanded to a relatively large planar structure to draw heat away from the resonators. In some aspects, the thermal bumps include relatively large edge portions. This approach allows heat generated within the acoustic filter to be more readily conducted away from the resonator (and potentially to an edge) and dissipated, thereby protecting elements within the structure from heat damage. In a further aspect, a planar structure may connect two thermal bumps, such as an interior thermal bump and an exterior edge thermal bump. Again, this approach allows heat to be pulled away from the resonators and dissipated.

[0024] In this regard, Figure 1 is a block diagram of a transceiver chain 100 having a baseband processor 102 coupled to a transceiver circuit 104. The transceiver circuit 104 is coupled to a front-end module (FEM) 106. The FEM 106 is coupled to a filter 108. The filter 108 may be an acoustic filter, so called because it has one or more acoustic resonators therein. The use of acoustic resonators in filters is well understood, and the assignee of the present disclosure is also the owner of numerous patents in this space for bulk acoustic wave (BAW) filters and surface acoustic wave (SAW) filters.

[0025] The filter 108 may be upstream or downstream of an antenna switch (not shown) but is proximate to an antenna 110, and signals passing through the filter 108 are at power levels ready to be transmitted through the antenna 110. That is, the signals passing through the filter 108 are generally high-power signals. High-power signals generate heat as they pass through circuits. This heat, if left unchecked, may be sufficient to damage one or more elements within the filter 108. Even when the heat does not damage elements in the filter 108, the heat may affect the performance of the filter 108 by increasing insertion loss, particularly at the upper band edge (UBE). To offset insertion losses, the power levels of the signals may be increased, which adds to the heat in the filter 108. Alternatively, the UBE may be shifted upward so that the drop-off affects frequencies above the frequencies of greatest interest. However, this shift may result in poor isolation between transmit signals and receive signals.

[0026] In the past, one solution was to implement various protection mechanisms that monitor heat levels and shut down the operation of the transceiver chain before the heat could damage components. While this shutdown may preserve the functionality of the transceiver chain, such a shutdown negatively impacts the user experience. Another solution is to increase the die size of the filter. Increasing the die size is commercially impractical in view of pressures to shrink die sizes. This pressure to shrink die sizes also exacerbates the heat issue as smaller die sizes put heat generating elements in closer proximity, resulting in higher power density and higher temperatures.

[0027] Still another solution is to add thermal bumps to the filter to assist in heat dissipation. The conventional version of this solution is illustrated in Figures 2 A and 2B. Acoustic resonators lie generally in a first plane, and thermal bumps couple that first plane to a heat dissipation plane (e.g., a ground plane or other structure in an external laminate) parallel to and above the first plane. The thermal bumps couple the first plane to the heat dissipation plane and provide a path to conduct heat from the first plane to the heat dissipation plane. More specifically, a filter 200 includes a first plane 202, which may be a silicon substrate or a silicon dioxide (SiO2) layer on a silicon substrate, on or in which series acoustic resonators 204(l)-204(5) and shunt acoustic resonators 206(l)-206(5) are positioned. It should be appreciated that resonators 204(l)-204(5) and 206(l)-206(5) have some thickness (i.e., top electrodes 204T, 206T, bottom electrodes 204B, 206B, and piezoelectric material (e.g., aluminum nitride (AIN) 204P, 206P sandwiched therebetween) and are not strictly planar. Collectively, the resonators 204(l)-204(5) and206(1 )-206(5) form a filter. While not shown, there are metal vias that may couple a top electrode layer to a bottom electrode layer (e.g., between different resonators). Ground vias 208(l)-208(4) couple the bottom electrodes 204B or 206B in the first plane 202 to a second planar element 210 in a second plane parallel to and above (in a z-axis), which may also be considered a constant temperature or heat dissipation plane. Note that the second planar element 210 may be a ground plane and may be separate from and distinct from the constant temperature plane.

[0028] Signals to be transmitted arrive at node 212, and signals to the antenna leave the filter 200 at the node 214. As such, the nodes 212, 214 may also act as vias that bring signals to / from the first plane 202. Additionally, recognizing that heat buildup is an issue, there are a plurality of thermal bumps 216( 1 )-216(8). The thermal bumps 216(1)-216(8) extend from the first plane 202 to the heat dissipation plane and provide a thermal path with a relatively low thermal resistance (Rth) so that heat may be transferred away from the areas close to the acoustic resonators 204(l)-204(5), 206(l)-206(5). It should be appreciated that some of the thermal bumps 216(2)-216(4) and 216(8) are spaced internally from a circumferential edge 218 of the first plane 202, while others of the thermal bumps 216(1), 216(5)-216(7) are proximate to the circumferential edge 218.

[0029] The trend to reduce the available size of a filter 200 has resulted in the structure illustrated in Figures 2A and Figure 2B no longer being capable of removing heat quickly enough to allow efficient and uninterrupted operation of the filter 200. As noted above, other conventional solutions incur less optimal tradeoffs.

[0030] Aspects of the present disclosure offer a solution that reduces thermal resistance for the thermal bumps and allows for more efficient heat dissipation. The more efficient heat dissipation allows the passbands of the filters (and particularly the UBE) to be spaced further from the receive passbands, providing better isolation therebetween while also allowing the overall size of the filter to be kept small. In particular, aspects of the present disclosure contemplate adding metallization in the first plane that pulls heat from interior heat producing elements (i.e., acoustic resonators) and may assist in moving this internal heat to thermal bumps proximate a circumferential edge of the first plane and / or to additional thermal bumps. The metallization provides a greater overall area through which the heat can conduct, reducing the thermal resistance and speeding heat dissipation.

[0031] The improved filter 300 is illustrated in Figures 3A-3C. In this regard, the filter 300 includes a first plane 302, which is a “top” surface of a substrate having a relatively high thermal resistance. Series acoustic resonators 304(l)-304(M) and shunt acoustic resonators 306(l)-306(P) are positioned on or in the plane 302 (where M=P=5 as shown, although it should be appreciated that M does not have to equal P and other numbers are possible without departing from the present disclosure). As with the filter 200, the acoustic resonators 304(l)-304(M), 306(l)-306(P) have some thickness due to the top electrodes 304T, 306T, bottom electrodes 304B, 306B, and piezoelectric material 304P, 306P sandwiched therebetween (see also Figure 3C). Collectively, the resonators 304(l)-304(M) and 306(l)-306(P) form a filter. Ground vias 308(l)-308(Q) (where Q = 4 as shown) couple bottom electrodes 304B or 306B in the first plane 302 to a heat dissipation plane 310 (see Figure 3C) in a second plane parallel to and above (in a z-axis), which may also be considered a constant temperature plane. Note that the heat dissipation plane 310 may be separate from and distinct from the constant temperature plane that is a part of (or belong to) the module package (e.g. laminate).

[0032] Signals to be transmitted arrive at node 312, and signals to the antenna leave the filter 300 at the node 314. As such, the nodes 312, 314 may also act as vias that bring signals to / from the first plane 302. Additionally, there are a plurality of thermal bumps 316(1 )-316(N), where N=8 as shown. The thermal bumps are coupled to vias that extend from the first plane 302 to the heat dissipation plane and provide a thermal path with relatively low thermal resistance (Rth) so that heat may be transferred away from the plane 302. It should be appreciated that some of the thermal bumps 316(2)-316(4) and 316(8) are spaced internally from a circumferential edge 318 of the first plane 302, while others of the thermal bumps 316(1), 316(5)-316(7) are proximate to the circumferential edge 318.

[0033] In contrast to the filter 200, the filter 300 includes one or more metallization elements 320( 1 )-320(S) (where S=5 as shown) on or in the first plane 302. (again, these metallization elements 320(l)-320(S) may have a thickness corresponding to the thickness of the resonators 304(l)-304(M), 306(l)-306(P) including top sheets 320T and bottom sheets 320B and vias 320V therebetween (see Figure 3C)). These metallization elements 320(l)-320(S) may be, for example, copper, silver, gold, platinum, or the like that has a low thermal resistance and may be made using the same processes used to create the conductive elements of the filter 300 (e.g., the conductors coupling to the electrodesof an acoustic resonator (or the metal layers forming the electrodes themselves)). The metallization elements 320(l)-320(S) have multiple functions and are placed and sized accordingly. A first function is to draw heat away from the acoustic resonators 304(1)- 304(M), 306(l)-306(P), particularly in those cases where the resonators are spaced towards the center of the plane 302 (e.g., resonators 304(2)-304(4)) by providing a low thermal resistance path. Thermal resistance is a function of surface area and thickness, so having a relatively large surface area reduces thermal resistance. In effect, the metallization elements 320(l)-320(S) replace a relatively high thermal resistance path of the substrate that forms plane 302 with the low thermal resistance of the metal. By drawing heat away from the acoustic resonators 304(l)-304(M), 306(l)-306(P), the operation of the acoustic resonators is not heat compromised, and overall functionality is improved. A second function is to couple an interior thermal bump to an external thermal bump (e.g., 316(2) and 316(1)) so that heat generated proximate to the internal thermal bump has multiple paths through which it may be conducted to the heat dissipation plane. Again, the metal provides a low thermal resistance path for the heat to move away from the acoustic resonators. Illustrated examples of this in filter 300 include metallization elements 320(1), 320(2). A third function is to provide as much surface area as possible to proximate the circumferential edge 318 so that heat may radiate away from the filter 300 along this edge 318 as well as be conducted to the heat dissipation plane 310. Having multiple places where heat can be dissipated through such radiation accelerates (perhaps marginally) heat dissipation. Illustrated examples of this in filter 300 include metallization elements 320(3), 320(4). Included in this function is merely bringing a thermal path from an interior thermal bump to an external edge (e.g., metallization element 320(S)).

[0034] Figure 3C highlights the thickness (in the z-axis direction) of the resonators 304(l)-304(M), 306(l)-306(P) as well as the thickness of the metallization elements 320(1 )-320(S). Figure 3C also shows how the filter die 350 is coupled to a laminate 352 that may act as a heat sink for the filter die 350. The laminate 352 may include vias and internal metal layers such as the heat dissipation plane 310 (which, as noted, may be a ground plane). However, the heat may be moved past the laminate 352. An overmold material 354 may encapsulate the filter die 350. Metal pads 356 together with solder bumps 358 may couple the laminate 352 to a PCB 360 and allow heat flow 362 from the resonators 304(l)-304(M), 306(l)-306(P) to the PCB 360.

[0035] It should be appreciated that the size and shape of the metallization elements 320(l)-320(S) will be dictated in part by the size, shape, and placement of the acoustic resonators 304(l)-304(M), 306(l)-306(P). Thus, the present disclosure contemplates generally square or rectangular metallization elements (e.g., metallization elements 320(1), 320(S)), L-shaped with squared-off angles (e.g., 320(2), 320(4)) or oblique angles (e.g., 320(3)), or the like, but any shape can be used.

[0036] A method for designing a filter according to aspects of the present disclosure is provided with reference to Figure 4. The process 400 begins by arranging acoustic resonators (block 402) that are being used by a filter. Then, the most likely heat sources are identified (block 404), and thermal bumps are placed (block 406) proximate to the heat sources as best they can fit.

[0037] The process 400 continues by adding metallization elements to connect thermal bumps (block 408) to one another where practical and with a goal of coupling interior thermal bumps to exterior thermal bumps so as to draw heat away from the acoustic resonators 304(l)-304(M), 306( l)-306(P). Additional metallization elements are added to couple interior thermal bumps to an edge (block 410) and to spread heat at the edge (block 412) or otherwise allow heat to move away from the acoustic resonators 304(l)-304(M), 306(l)-306(P).

[0038] The systems and methods for heat dissipation in acoustic resonators, according to aspects disclosed herein, may be provided in or integrated into any processor-based device. Examples, without limitation, include a set-top box, an entertainment unit, a navigation device, a communications device, a fixed location data unit, a mobile location data unit, a global positioning system (GPS) device, a mobile phone, a cellular phone, a smartphone, a session initiation protocol (SIP) phone, a tablet, a phablet, a server, a computer, a portable computer, a mobile computing device, a wearable computing device (e.g., a smartwatch, a health or fitness tracker, eyewear, etc.), a desktop computer, a personal digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, a vehicle component, avionics systems, a drone, and a multicopter.

[0039] With reference to Figure 5, the concepts described above may be implemented in various types of user elements 500, such as mobile terminals, smart watches, tablets,computers, navigation devices, access points, and like wireless communication devices that support wireless communications, such as cellular, wireless local area network (WLAN), Bluetooth, and near field communications. The user elements 500 will generally include a control system 502, a baseband processor 504, transmit circuitry 506, receive circuitry 508, antenna switching circuitry 510, multiple antennas 512, and user interface circuitry 514. In a non-limiting example, the control system 502 can be a field- programmable gate array (FPGA) or an application-specific integrated circuit (ASIC), as an example. In this regard, the control system 502 can include at least a microprocessor(s), an embedded memory circuit(s), and a communication bus interface(s). The receive circuitry 508 receives radio frequency signals via the antennas 512 and through the antenna switching circuitry 510 from one or more base stations. A low noise amplifier and a filter of the receive circuitry 508 cooperate to amplify and remove broadband interference from the received signal for processing. Downconversion and digitization circuitry (not shown) will then downconvert the filtered, received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams using an analog-to-digital converter(s) (ADC).

[0040] The baseband processor 504 processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations. The baseband processor 504 is generally implemented in one or more digital signal processors (DSPs) and ASICs.

[0041] For transmission, the baseband processor 504 receives digitized data, which may represent voice, data, or control information, from the control system 502, which it encodes for transmission. The encoded data is output to the transmit circuitry 506, where a digital-to-analog converter(s) (DAC) converts the digitally encoded data into an analog signal, and a modulator modulates the analog signal onto a carrier signal that is at a desired transmit frequency or frequencies. A power amplifier will amplify the modulated carrier signal to a level appropriate for transmission and deliver the modulated carrier signal to the antennas 512 through the antenna switching circuitry 510 to the antennas 512. The multiple antennas 512 and the replicated transmit and receive circuitries 506, 508 may provide spatial diversity. Modulation and processing details will be understood by those skilled in the art.

[0042] It is also noted that the operational steps described in any of the exemplary aspects herein are described to provide examples and discussion. The operations described may be performed in numerous different sequences other than the illustrated sequences. Furthermore, operations described in a single operational step may actually be performed in a number of different steps. Additionally, one or more operational steps discussed in the exemplary aspects may be combined. It is to be understood that the operational steps illustrated in the flowchart diagrams may be subject to numerous different modifications, as will be readily apparent to one of skill in the art. Those of skill in the art will also understand that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0043] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

AMENDED CLAIMS received by the International Bureau on 04 September 2025 (04.09.2025)1. (Previously Presented) An acoustic filter comprising: a substrate comprising a surface comprising a first plane; a plurality of acoustic resonators positioned on the first plane; a first thermal bump configured to couple the first plane to a heat dissipation plane and to convey heat generated in at least one of the plurality of acoustic resonators away from the first plane; a metallization element positioned on the first plane and coupled to the first thermal bump and configured to spread heat through the first plane away from the at least one of the plurality of acoustic resonators; and a second thermal bump coupled to the metallization element, the second thermal bump spaced from the first thermal bump and thermally coupled to the first thermal bump through the metallization element.

2. (Original) The acoustic filter of claim 1, wherein the at least one of the plurality of acoustic resonators comprises a shunt resonator.

3. (Original) The acoustic filter of claim 1, wherein the at least one of the plurality of acoustic resonators comprises a series resonator.

4. Canceled5. (Previously Presented) The acoustic filter of claim 1 , wherein the first thermal bump is spaced from a circumferential edge of the first plane and the second thermal bump is proximate the circumferential edge.

6. (Original) The acoustic filter of claim 1 , wherein the first thermal bump is spaced from a circumferential edge, and the metallization element extends from the first thermal bump to the circumferential edge.

7. (Original) The acoustic filter of claim 1 , further comprising an antenna node coupled to the at least one of the plurality of acoustic resonators, the antenna node configured to couple to an antenna.

8. (Original) The acoustic filter of claim 1 , further comprising a ground via configured to couple the first plane to a ground plane.

9. (Original) The acoustic filter of claim 1 , wherein the metallization element has a first layer and a second layer coupled by vias.

10. (Previously Presented) A device comprising: a wireless transceiver chain comprising: a laminate comprising a heat dissipation plane; an acoustic filter of claim 1 comprising: a substrate comprising a surface comprising a first plane; a plurality of acoustic resonators positioned on the first plane; a first thermal bump coupling the first plane to the heat dissipation plane and to convey heat generated in at least one of the plurality of acoustic resonators away from the first plane; and a metallization element positioned on the first plane and coupled to the first thermal bump and configured to spread heat through the first plane away from the at least one of the plurality of acoustic resonators.

11. (Original) The device of 10 integrated into a device selected from the group consisting of: a set-top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smartphone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable musicplayer; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; a vehicle component; avionics systems; a drone; and a multicopter.

12. (Original) The device of claim 10, further comprising an antenna coupled to the acoustic filter.

13. (Original) The device of claim 10, further comprising: a baseband processor; a transceiver circuit coupled to the baseband processor; and a front-end module coupled to the transceiver circuit and the acoustic filter.

14. (Original) The device of claim 10, wherein the plurality of acoustic resonators comprises at least one shunt acoustic resonator and at least one series acoustic resonator.

15. (Original) The device of claim 10, wherein the acoustic filter further comprises a plurality of metallization elements, at least one metallization element extending between the first thermal bump and a circumferential edge of the first plane.

16. (Previously Presented) A device comprising: a wireless transceiver chain comprising: a laminate comprising a heat dissipation plane; an acoustic filter comprising: a substrate comprising a surface comprising a first plane; a plurality of acoustic resonators positioned on the first plane; a first thermal bump coupling the first plane to the heat dissipation plane and to convey heat generated in at least one of the plurality of acoustic resonators away from the first plane; and a plurality of metallization elements positioned on the first plane, at least one metallization element extending between the first thermal bump and a circumferential edge of the first plane, each of the plurality of metallization elements configured to spread heat through the first plane away from the at least one of the plurality of acoustic resonators; anda second thermal bump, at least a second metallization element coupling the first thermal bump with the second thermal bump.

17. (Previously Presented) A method of forming an acoustic filter, comprising: forming a first plane; positioning a plurality of acoustic resonators on the first plane; adding a thermal bump proximate at least one of the plurality of acoustic resonators to couple the first plane to a heat dissipation plane; and adding a metallization element in the first plane coupled to the thermal bump and configured to conduct heat to a circumferential edge of the first plane.

18. (Original) The method of claim 17, wherein adding the metallization element comprises coupling the thermal bump to a second thermal bump in the first plane.

19. Canceled20. (Original) The method of claim 17, further comprising coupling at least one of the plurality of acoustic resonators to an antenna node.

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