The invention relates to a grooved surface acoustic filter
chip packaging structure and a manufacturing method thereof. The structure comprises a surface acoustic filter
chip wafer (1), and the surface of the surface acoustic filter
chip wafer (1) includes
electrode areas (1.1) and an induction area (1.2). A first
metal layer (2) is arranged on the surface of each
electrode area (1.1). A laminated
wafer (4) is arranged above the surface acoustic filter chip wafer (1). A cavity (7) is formed between the laminated wafer (4) and the induction area (1.2). The laminated wafer (4) is provided with holes (8) at the positions of the
electrode areas (1.1), a
metal ball (6) is arranged in each hole (8), and the
metal balls (6) are in contact with the first metal
layers (2) respectively. According to the grooved surface acoustic filter chip packaging structure and the manufacturing method thereof of the invention, a surface acoustic filter of smaller area and size and lower manufacturing cost can be provided.