Display panel and manufacturing method therefor

Abstract

Embodiments of the present application provide a display panel and a manufacturing method therefor. Before signal lines are formed, a first inorganic layer is patterned, the first inorganic layer in a preset area is removed to form a plurality of recess structures, and the recess structures expose a first organic layer, so that after the signal lines are formed, the lower parts of the signal lines are in contact with the first organic layer.

Description

Display panel and manufacturing method thereof

[0001] The present application claims priority to the Chinese patent application No. 202410465094.3, filed on April 17, 2024, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, for example, to a display panel and a manufacturing method thereof. BACKGROUND

[0003] With the development of display technology, the application of flexible display devices is becoming more and more widespread.

[0004] In the related art, the display device has poor flexibility, which affects the yield and reliability of the product. SUMMARY

[0005] The present application provides a display panel and a manufacturing method thereof to improve the flexibility of the display panel and improve the yield and reliability of the product.

[0006] In a first aspect, the embodiments of the present application provide a display panel, comprising:

[0007] a first organic layer,

[0008] a plurality of signal lines located on one side of the first organic layer and in contact with the first organic layer;

[0009] a second organic layer, the plurality of signal lines being located between the first organic layer and the second organic layer.

[0010] In a second aspect, the embodiments of the present application further provide a manufacturing method of a display panel, comprising:

[0011] providing a first organic layer;

[0012] forming a first inorganic layer on one side of the first organic layer;

[0013] performing patterning on the first inorganic layer to remove the first inorganic layer in a preset region to form a plurality of recessed structures, the recessed structures exposing the first organic layer; wherein the preset region includes a region where the signal lines are to be formed;

[0014] forming a plurality of signal lines in the plurality of recessed structures;

[0015] forming a second organic layer on a side of the signal lines away from the first organic layer.

[0016] The display panel and the manufacturing method thereof provided in the embodiments of the present application can form a plurality of recess structures by patterning the first inorganic layer before forming the signal line, removing the first inorganic layer in the preset area, and exposing the first organic layer, so that the signal line is in contact with the first organic layer after the signal line is formed. By arranging the signal line between the first organic layer and the second organic layer, the upper layer and the lower layer of the signal line are both organic film layers, so that the flexibility of the upper layer and the lower layer of the signal line is good, and the probability of cracks in the upper layer and the lower layer of the signal line is reduced when the display panel is deformed, the breakage of the signal line is reduced, and the yield and reliability of the display panel are improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] FIG. 1 is a partial top view of a display panel provided in an embodiment of the present application;

[0018] FIG. 2 is a cross-sectional view of a display panel provided in an embodiment of the present application;

[0019] FIG. 3 is a partial top view of another display panel provided in an embodiment of the present application;

[0020] FIG. 4A is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0021] FIG. 4B is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0022] FIG. 4C is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0023] FIG. 5A is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0024] FIG. 5B is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0025] FIG. 6A is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0026] FIG. 6B is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0027] FIG. 7 is a cross-sectional view of another display panel provided in an embodiment of the present application;

[0028] FIG. 8A is a structural schematic view of another display panel provided in an embodiment of the present application;

[0029] FIG. 8B is a structural schematic view of another display panel provided in an embodiment of the present application;

[0030] FIG. 9 is a structural schematic view of another display panel provided in an embodiment of the present application;

[0031] FIG. 10A is a sectional view of yet another display panel according to an embodiment of the present application;

[0032] FIG. 10B is a sectional view of yet another display panel according to an embodiment of the present application;

[0033] FIG. 11A is a sectional view of still another display panel according to an embodiment of the present application;

[0034] FIG. 11B is a sectional view of still another display panel according to an embodiment of the present application;

[0035] FIG. 12 is a sectional view of another display panel according to an embodiment of the present application;

[0036] FIG. 13 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;

[0037] FIG. 14 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0038] FIG. 15 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0039] FIG. 16 is a schematic diagram of a manufacturing process of a display panel according to an embodiment of the present application;

[0040] FIG. 17A is a schematic diagram of another manufacturing process of a display panel according to an embodiment of the present application;

[0041] FIG. 17B is a schematic diagram of another manufacturing process of a display panel according to an embodiment of the present application;

[0042] FIG. 18 is a schematic diagram of yet another manufacturing process of a display panel according to an embodiment of the present application;

[0043] FIG. 19 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application;

[0044] FIG. 20 is a schematic diagram of yet another manufacturing process of a display panel according to an embodiment of the present application. DETAILED DESCRIPTION

[0045] The present application will be described in detail below with reference to the drawings and embodiments. The embodiments described herein are merely intended to explain the present application, but not to limit the present application. For the purpose of description, only parts related to the present application are shown in the drawings rather than all parts.

[0046] The terms "first", "second", and the like, as used in the specification and claims of this application and the preceding drawings, are used for distinguishing between similar objects and are not necessarily used to describe a particular sequential or chronological order. The use of such terms in the specification and claims of this application is not meant to exclude from the scope of the application other embodiments that can be drawn within the scope of the application as defined by the claims and equivalents thereof. Furthermore, the terms "comprise", "comprising", "include", "including", and the like, as used in the specification and claims of this application, are used in their open-ended, non-limiting sense, and do not exclude additional steps, elements, features, or components. The use of the negative term "not" in the claims, such as "not comprising" or "not including", is used in its open-ended, non-limiting sense, and does not exclude additional steps, elements, features, or components. The use of the indefinite article "a" or "an" in the claims, such as "a step" or "an element", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element. The use of the definite article "the" in the claims, such as "the step" or "the element", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element. The use of the indefinite article "a" or "an" in the specification, such as "a step" or "an element", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element. The use of the definite article "the" in the specification, such as "the step" or "the element", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element. The use of the term "plurality" in the specification, such as "plurality of steps" or "plurality of elements", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element. The use of the term "comprising", "including", "containing", or "having" in the specification, such as "comprising steps" or "comprising elements", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element. The use of the term "consisting essentially of in the specification, such as "consisting essentially of steps" or "consisting essentially of elements", is used in its open-ended, non-limiting sense, and does not exclude the presence of more than one of the referenced step or element.

[0047] The display device has a poor flexibility, which affects the yield and reliability of the product. The reason for the above problem is that the signal lines are arranged in the area where the flexible display device can be deformed. When deformation occurs, the upper or lower film layer of the signal line is prone to crack, which causes the signal line to be prone to breakage, thereby reducing the yield and reliability of the product.

[0048] Based on the above reasons, the embodiments of the present application provide a display panel, FIG. 1 is a partial top view of a display panel provided by an embodiment of the present application, and FIG. 2 is a cross-sectional view of a display panel provided by an embodiment of the present application. FIG. 2 can be obtained by cutting along AA' in FIG. 1. Referring to FIGS. 1 and 2, the display panel comprises a first organic layer 110, a plurality of signal lines 120, and a second organic layer 130.

[0049] The plurality of signal lines 120 is located on one side of the first organic layer 110 and in contact with the first organic layer 110. For example, at least part of the signal lines 120 extend along a first direction y and are arranged at intervals along a second direction x. The first direction y and the second direction x intersect, for example, can be perpendicular. The plurality of signal lines 120 is located between the first organic layer 110 and the second organic layer 130.

[0050] The first organic layer 110 and the second organic layer 130 respectively comprise an organic material, which can be at least one of acrylic, polyimide (PI), or benzocyclobutene (BCB), etc. The flexibility of the organic material is better than that of inorganic material, and is not prone to crack when deformation occurs. The plurality of signal lines 120 can be part of the signal lines on the display panel.

[0051] The display panel further includes a plurality of signal lines 120, which can serve as carriers for signal transmission. For example, the plurality of signal lines 120 extend along the first direction y and are arranged at intervals along the second direction x, so that short circuiting between different signal lines 120 is less likely to occur, ensuring the reliability and accuracy of signal transmission by the signal lines 120. The signal lines 120 can be any signal lines 120 in the display panel for transmitting any signal, for example, data lines for transmitting data signals, power lines for transmitting power signals, etc., which are not limited in the embodiments of the present application. The signal lines 120 include a conductive material, which can be a metal, a metal oxide, etc. The plurality of signal lines 120 are located between the first organic layer 110 and the second organic layer 130, with the first organic layer 110 below the signal lines 120 and the second organic layer 130 above the signal lines 120, i.e., both the upper layer and the lower layer of the signal lines 120 are organic film layers, so that the upper layer and the lower layer of the signal lines 120 have good flexibility, which in turn reduces the probability of cracks in the upper layer and the lower layer of the signal lines 120 when the display panel deforms, and accordingly, the breaking of the signal lines 120 can be reduced, improving the yield and reliability of the display panel. The signal lines 120 can extend in a straight line, a curve, a broken line, or a combination of one or more thereof along the extension direction thereof, which is not limited in the embodiments of the present application.

[0052] The display panel of the embodiments has the signal lines located between the first organic layer and the second organic layer, so that both the upper layer and the lower layer of the signal lines are organic film layers, which have good flexibility, and thus the probability of cracks in the upper layer and the lower layer of the signal lines is reduced when the display panel deforms, and the breaking of the signal lines can be reduced, improving the yield and reliability of the display panel.

[0053] With reference back to FIGS. 1 and 2, the first surface of the first organic layer 110 includes a first region 111 and a second region 112, the first region 111 is in contact with the signal lines 120, and the second region 112 is located in the gap between adjacent signal lines 120 and is in contact with the second organic layer 130. The first surface is the surface of the first organic layer 110 close to the second organic layer 130.

[0054] For example, the first organic layer 110 can include a first organic portion 113 and a second organic portion 114, which can be an integral structure. The first surface of the first organic portion 113 is the first region 111, and the first surface of the second organic portion 114 is the second region 112. The first organic portion 113 is in contact with the signal lines 120, and the second organic portion 114 is in contact with the second organic layer 130.

[0055] The inorganic layer corresponding to the gap position between the signal lines and the signal lines on the first organic layer 110 is etched before the conductive layer required to form the signal lines 120, which results in insufficient etching of the conductive material between the signal lines 120 formed on the first organic layer 110, and the residual conductive material causes short circuit. The inorganic layer arranged between the first organic layer 110 and the signal lines 120 can reduce the etching residue of the signal lines 120. However, since the inorganic layer has poor flexibility and brittleness, the arrangement of the inorganic layer between the first organic layer 110 and the signal lines 120 makes the display panel have poor flexibility, and the display panel is prone to cracking when deformed. In the embodiment of the present application, the first region 111 of the first organic layer 110 is in direct contact with the signal lines 120, that is, no other film layer is included between the first organic layer 110 and the signal lines 120, which can improve the flexibility of the display panel. In addition, in the embodiment, the second region 112 of the first organic layer 110 is in contact with the second organic layer 130, and the gap between the adjacent signal lines 120 is filled with the second organic layer 130, so that the bottom surface of the signal lines 120 (the side of the signal lines 120 close to the first organic layer 110) is in contact with the first organic layer 110, and the side surface of the signal lines 120 is in contact with the second organic layer 130, so that when the display panel is deformed, the signal lines 120 are deformed under the stress of the first organic layer 110 and the second organic layer 130. Since the first organic layer 110 and the second organic layer 130 have good flexibility, the display panel is not prone to cracking when deformed, and the signal lines 120 are not prone to breaking, which can further improve the flexibility of the display panel. In some optional embodiments of the present application, the side of the signal lines 120 away from the first organic layer 110 is in contact with the second organic layer 130, which is more conducive to improving the flexibility of the display panel.

[0056] FIG. 3 is a partial top view of another display panel according to embodiments of the present application, FIG. 4A is a cross-sectional view of another display panel according to embodiments of the present application, FIG. 4B is a cross-sectional view of another display panel according to embodiments of the present application, FIG. 4C is a cross-sectional view of another display panel according to embodiments of the present application, and FIGS. 4A, 4B and 4C can be obtained by cutting along BB' of FIG. 3. Referring to FIGS. 1-4C, on the basis of the above technical solutions, optionally, the width P1 of the first region 111 along the second direction x is greater than or equal to the width P3 of the signal line 120 along the second direction x; and the width P2 of the second region 112 along the second direction x is less than or equal to the spacing P4 between adjacent signal lines 120 along the second direction x. In this way, the orthogonal projection of the signal line 120 on the first organic layer 110 is located in the first region 111, ensuring that the bottom surface of the signal line 120 can be in contact with the first region 111, and ensuring good flexibility of the display panel. The signal line 120 is not in contact with the second region 112. The first region 111 and the second region 112 can not overlap. Optionally, the sum (i.e., P1+P2) of the widths of adjacent first region 111 and second region 112 along the second direction x is equal to the sum (i.e., P3+P4) of the width of the signal line 120 along the second direction x and the spacing between adjacent signal lines 120 along the second direction x.

[0057] In the preparation process of the display panel, the first inorganic layer needs to be prepared above the first organic layer 110, and then the first inorganic layer is patterned to remove the first inorganic layer in the first region 111. Then, the conductive layer in which the signal line 120 is located is prepared above the first region 111 and the first inorganic layer away from the first organic layer 110, and then the conductive layer is patterned to obtain the signal line 120. Due to the etching error in the process of patterning the conductive layer, such as the alignment error of the mask and the conductive layer, in the present embodiment, by setting the width of the first region 111 along the second direction x to be greater than or equal to the width of the signal line 120 along the second direction x, even if there is an error in the process of patterning the conductive layer, the width of the signal line 120 obtained by patterning the conductive layer can still meet the line width requirement of the signal line 120, ensuring the reliability of the signal transmission of the signal line 120. In the present embodiment, the first region 111 and the second region 112 are arranged alternately, when the width P1 of the first region 111 along the second direction x is greater than the width P3 of the signal line 120 along the second direction x, the width P2 of the second region 112 along the second direction x is less than the spacing P4 between adjacent signal lines 120 along the second direction x; and when the width P1 of the first region 111 along the second direction x is equal to the width P3 of the signal line 120 along the second direction x, the width P2 of the second region 112 along the second direction x is equal to the spacing P4 between adjacent signal lines 120 along the second direction x. Referring to FIG. 4A, in some optional embodiments of the present application, the second region 112 is flush with the surface of the first region 111.

[0058] Referring to FIG. 4B, in another optional embodiment of the present application, the second region 112 is recessed relative to the first region 111 away from the second organic layer 130. That is, the first surface of the second organic portion 114 is recessed relative to the first surface of the first organic portion 113 away from the second organic layer 130. The first surface of the second organic portion 114 is provided with a recess portion toward the second organic layer 130. The first surface of the first organic portion 113 is provided with a convex portion toward the second organic layer 130.

[0059] For the display panel structure in which the second organic layer 130 is in contact with the second region 112 of the first organic layer 110, after the above-mentioned patterning of the film layer in which the signal line 120 is located, the first inorganic layer needs to be patterned again to remove the first inorganic layer at the position corresponding to the second region 112. Therefore, in the manufacturing process of the display panel, the first inorganic layer needs to be etched twice, and there may be etching errors in the two etching processes. When the first inorganic layer at the position corresponding to the second region 112 is etched, the first organic layer 110 may be partially etched in depth, so that the second region 112 of the first organic layer 110 is recessed relative to the first region 111. Therefore, the first surface of the first organic layer 110 is a concave-convex structure, which is more prone to deformation than the flat surface of the first organic layer 110, and is more conducive to improving the flexibility of the display panel. Referring to FIG. 4C, in another optional embodiment of the present application, the first region 111 is recessed relative to the second region 112, for example, the first region 111 is recessed relative to the second region 112 away from the second organic layer 130, for example, the first surface of the second organic portion 114 is provided with a convex portion toward the first surface of the second organic layer 130, and the first surface of the first organic portion 113 is provided with a recess portion toward the first surface of the second organic layer 130, which is also conducive to improving the flexibility of the display panel. In other optional embodiments of the present application, in the case where there is no etching error in the two etching processes of the first inorganic layer, the surfaces of the first region 111 and the second region 112 are flush, that is, the surface of the first organic layer 110 close to the signal line 120 can also be a flat surface, as shown in FIG. 4A.

[0060] The recess of the second region 112 relative to the first region 111, or the recess of the first region 111 relative to the second region 112, can increase the contact area between the second organic layer 130 and the second region 112 of the first organic layer 110, which is conducive to improving the bonding strength between the second organic layer 130 and the first organic layer 110 and reducing the risk of separation between the second organic layer 130 and the first organic layer 110.

[0061] With reference to FIGS. 3, 4A, 4B and 4C, optionally, the first region 111 includes a first sub-region 1111 and a second sub-region 1112 located at least one side of the first sub-region 1111; the first sub-region 1111 is in contact with the signal line 120; the second sub-region 1112 is located in the gap between adjacent signal lines 120; the second sub-region 1112 has a discontinuous or continuous conductive layer 140, and the thickness of the conductive layer 140 is less than the thickness of the signal line 120 along the thickness direction z of the first organic layer 110. In the same first region 111, the extension direction of the second sub-region 1112 and the first sub-region 1111 is the same or parallel. The extension direction of the contacted first sub-region 1111 and the signal line 120 is the same or parallel. The width of the first sub-region 1111 and the signal line 120 is equal.

[0062] With reference to FIGS. 3, 4A, 4B and 4C, the first organic part 113 includes a first sub-organic part 1131 and a second sub-organic part 1132 located at least one side of the first sub-organic part 1131, the first surface of the first sub-organic part 1131 is the first sub-region 1111, and the first surface of the second sub-organic part 1132 is the second sub-region 1112.

[0063] The first region corresponding to different signal lines can be different. The shape of the first sub-region of the first region corresponding to the same signal line can be the same or consistent, and the width is the same. The second sub-region of the first region corresponding to the same signal line can be located at the opposite sides of the width direction of the signal line.

[0064] For example, in the first region 111, the first sub-region 1111 is the forming position of the signal line 120, and the first sub-region 1111 is in contact with the signal line 120. As described above, since there is an inevitable etching error when the conductive layer 140 where the signal line 120 is located is patterned, the width of the first region 111 along the second direction x can be greater than the width of the signal line 120 along the second direction x, for example, the width of the first sub-region 1111 along the second direction x can be equal to the width of the signal line 120 along the second direction x. When the conductive layer 140 is patterned, the mask pattern can be aligned with the first region 111, and the width of the first region 111 along the second direction x is greater than the width of the mask pattern along the second direction x, the signal line 120 is formed at the corresponding position of the mask pattern, and the corresponding position of the mask pattern is the first sub-region 1111 of the first organic layer 110. According to the alignment error of the mask and the conductive layer 140, the second sub-region 1112 is located at least one side of the first sub-region 1111. Therefore, after the conductive layer 140 is formed, the conductive layer 140 is in contact with the first organic layer 110 in the first region 111, and the conductive layer 140 is in contact with the first inorganic layer in the second region 112. When the conductive layer 140 is patterned, due to the difference in properties between organic materials and inorganic materials, the material of the conductive layer 140 on the first inorganic layer is removed, and the material of the conductive layer 140 in the second sub-region 1112 can remain, so that the second sub-region 1112 has continuous or discontinuous conductive parts 141. Since the conductive layer 140 in the second sub-region 1112 is also patterned, the thickness of the conductive layer 140 is less than the thickness of the signal line 120. The second sub-region 1112 has discontinuous conductive parts 141, for example, the second sub-region 1112 has a plurality of spaced conductive blocks, which are similar to rough surfaces. Optionally, the signal line 120 and the conductive part 141 are arranged in the same layer and have the same material.

[0065] On the basis of the above technical solutions, optionally, the width of the second sub-region 1112 along the width direction of the second sub-region 1112 is less than or equal to the width of the signal line 120 along the width direction of the signal line 120. The width of the second sub-region 1112 along the second direction x is less than or equal to the width of the signal line 120 along the second direction x.

[0066] Exemplarily, since the second sub-region 1112 is configured to overcome the error in patterning the conductive layer 140, the width of the second sub-region 1112 can be relatively small, and the width of the second sub-region 1112 along the second direction x is less than or equal to the width of the signal line 120 along the second direction x, so that the size of the first region 111 along the second direction x is relatively small, and the spacing between the signal lines 120 is relatively small on the basis of ensuring that the formed signal line 120 meets the line width requirement, which is beneficial to reducing the size of the display panel, and when the signal line 120 is located in the non-display area of the display panel, it is beneficial to realize the display panel with narrow frame.

[0067] In some embodiments, the width of the second sub-region 1112 can be greater than or equal to 1.5 microns and less than or equal to 2.5 microns, for example, the width of the second sub-region 1112 along the second direction x can be greater than or equal to 1.5 microns and less than or equal to 2.5 microns, which is beneficial to ensure that there is no inorganic layer between the signal line 120 and the first organic layer 110 in the deformable region.

[0068] In the same first region 111, the first sub-region 1111 is provided with the second sub-region 1112 on both sides. Optionally, in the same first region 111, the first sub-region 1111 is provided with the second sub-region 1112 on the opposite sides along the second direction x, which is beneficial to ensure that there is no inorganic layer between the signal line 120 and the first organic layer 110 in the deformable region. For example, along the second direction x, the first sub-region 1111 where the signal line 120 is located is located at the relatively middle position of the first region 111, so that the formed signal line 120 can meet the line width requirement. In addition, along the second direction x, the first sub-region 1111 where the signal line 120 is located is located at the relatively middle position of the first region 111, so that when the conductive layer 140 where the signal line 120 is located is patterned, even if there is a deviation in the alignment between the mask and the conductive layer 140 to the left or right, the formed signal line 120 can still meet the line width requirement. In some embodiments, the widths of the two second sub-regions 1112 along the second direction x in the same first region 111 can be equal or approximately equal.

[0069] FIG. 5A is a cross-sectional view of another display panel according to an embodiment of the present application, FIG. 5B is a cross-sectional view of another display panel according to an embodiment of the present application, FIG. 5A can still correspond to another cross-sectional view obtained by cutting along BB' of FIG. 3, FIG. 5B can still correspond to another cross-sectional view obtained by cutting along BB' of FIG. 3, FIG. 6A is a cross-sectional view of another display panel according to an embodiment of the present application, FIG. 6B is a cross-sectional view of another display panel according to an embodiment of the present application, FIG. 6A and FIG. 6B can still correspond to cross-sectional views obtained by cutting along BB' of FIG. 3, with reference to FIG. 5A to FIG. 6B, optionally, the first area 111 includes a first sub-area 1111 and a second sub-area 1112 located at least one side of the first sub-area 1111; the first sub-area 1111 is in contact with the signal line 120; the second sub-area 1112 is located in the gap between adjacent signal lines 120; the second sub-area 1112 is recessed relative to the first sub-area 1111.

[0070] With reference to FIG. 5A to FIG. 6B, the first organic part 113 includes a first sub-organic part 1131 and a second sub-organic part 1132 located at least one side of the first sub-organic part 1131, the first surface of the first sub-organic part 1131 is the first sub-area 1111, and the first surface of the second sub-organic part 1132 is the second sub-area 1112. The first surface of the second sub-organic part 1132 is recessed relative to the first surface of the first sub-organic part 1131 in a direction away from the second organic layer 130.

[0071] As described above, when the conductive layer 140 where the signal line 120 is located is patterned, the conductive layer 140 of the second area 112 and the second sub-area 1112 needs to be etched, and then the first inorganic layer of the second area 112 is removed. In the process of removing the first inorganic layer of the second area 112, the organic material at the second sub-area 1112 of the first organic layer 110 can also be partially etched, so that the second sub-area 1112 is recessed relative to the first sub-area 1111. In the process of removing the first inorganic layer of the second area 112, the conductive layer 140 at the second sub-area 1112 can also be partially etched, so that the conductive layer 140 at the second sub-area 1112 has no residue. Such a structure is also conducive to improving the flexibility of the display panel.

[0072] The second region 112 is flush with the second sub-region 1112 (as shown in the display panel structures of FIG. 5A and FIG. 5B) or is recessed relative to the second sub-region 1112 (as shown in the display panel structures of FIG. 6A and FIG. 6B). That is, the first surface of the second organic portion 114 is flush with the first surface of the second sub-organic portion 1132 or is recessed relative to the first surface of the second sub-organic portion 1132 in a direction away from the second organic layer 130. The second sub-region 1112 can be a stepped surface or an inclined surface or a curved surface. In a direction of the second sub-region 1112 pointing to the second region 112, the thickness of the first organic layer corresponding to the second sub-region 1112 can gradually decrease.

[0073] For example, the height relationship between the second region 112 and the second sub-region 1112 can be controlled by controlling the etching time of etching the first inorganic layer of the second region 112 to form a structure in which the second region 112 is flush with the second sub-region 1112 or the second region 112 is recessed relative to the second sub-region 1112. In the structure in which the second region 112 is flush with the second sub-region 1112, the second region 112 and the second sub-region 1112 are both recessed relative to the first sub-region 1111, so that the area of the recessed structure is relatively large and the surface of the recessed structure is flat, so that when the display panel is deformed, the second sub-region 1112 and the second region 112 more evenly bear stress and are less likely to crack. In the structure in which the second region 112 is recessed relative to the second sub-region 1112, the surface of the first organic layer 110 can form a more uneven structure, which is more conducive to improving the flexibility of the display panel.

[0074] Referring to FIG. 5A and FIG. 6A, in the case that the conductive layer of the second sub-region 1112 is etched completely, there is no conductive layer 140 on the second sub-region 1112. Referring to FIG. 5B and FIG. 6B, in the case that the conductive layer of the second sub-region 1112 is not etched completely, there is a conductive layer 140 on the second sub-region 1112.

[0075] FIG. 7 is a cross-sectional view of another display panel provided by an embodiment of the present application. FIG. 7 can also correspond to another cross-sectional view of the display panel of FIG. 1 along AA'. Optionally, the display panel further includes a first inorganic layer 150, and the first inorganic layer 150 includes at least one inorganic portion 151 located at least in the gap between adjacent signal lines 120. For example, the inorganic portion 151 can be in contact with the second region 112.

[0076] The conductive layer is not easy to remain on the surface of the inorganic material. In this embodiment, the first inorganic layer 150 can be formed on one side of the first organic layer 110, then the first inorganic layer 150 at positions corresponding to the signal lines 120 is removed, the first inorganic layer 150 at positions between the positions corresponding to the signal lines 120 is reserved as the inorganic part 151, then the conductive layer is formed on the side away from the first inorganic layer 150 of the positions corresponding to the signal lines 120 and the inorganic part 151, then the conductive layer is patterned to obtain the signal lines 120 and reserve the inorganic part 151. Optionally, the inorganic part 151 is arranged away from the signal lines 120. In this display panel structure, on the one hand, the conductive layer 140 does not remain etched at the position of the inorganic part 151, and the inorganic part 151 is at least located between adjacent signal lines 120, so that the signal lines 120 are prevented from being short-circuited. On the other hand, the inorganic part 151 is reserved without being removed, so that the process steps of the display panel preparation are reduced and the preparation process of the display panel is simplified. The inorganic part 151 can be in contact with the second region 112. Before the signal lines 120 are formed, the second region 112 forms the first inorganic layer 150, the first inorganic layer 150 of the first region 111 is etched, the first inorganic layer 150 forms a through hole on the first region 111 to expose the second inorganic layer, and the inorganic part 151 is formed. After the signal lines 120 are formed, the inorganic part 151 is not etched and is reserved, and the second inorganic layer is further formed. The technical solution in FIG. 7 is different from the technical solutions in FIG. 2, FIG. 4A to FIG. 6B, and the like. In the technical solutions in FIG. 2, FIG. 4A to FIG. 6A, and the like, the inorganic part 151 of the second region 112 is etched after the signal lines 120 are formed.

[0077] On the basis of the above technical solutions, optionally, the inorganic part 151 is located between the first organic layer 110 and the second organic layer 130, the inorganic part 151 is in contact with the first organic layer 110, and the inorganic part 151 is in contact with the second organic layer 130. In this way, an organic-inorganic-organic laminated structure can be formed, which can effectively block the erosion of water and oxygen and avoid the influence of the erosion of water and oxygen on the signal lines 120 to affect the reliability of the signal transmission of the signal lines 120.

[0078] Optionally, the thickness of the inorganic part 151 is greater than or equal to 100 nanometers and less than or equal to 150 nanometers. In this way, the setting of the inorganic part 151 has little influence on the flexibility of the display panel, so that the display panel still has good flexibility. For example, the thickness of the inorganic part 151 can be 100 nanometers, 120 nanometers, 130 nanometers, or 150 nanometers.

[0079] On the basis of the technical scheme, optionally, the display panel further comprises a substrate, the substrate comprises a first organic layer and an inorganic barrier layer; the inorganic barrier layer is located on the side of the first organic layer close to the second organic layer. Optionally, the display panel further comprises a driving circuit layer, the inorganic buffer layer is located between the substrate and the driving circuit layer, the driving circuit layer comprises an active layer and a plurality of conductive layers which are stacked; optionally, the signal line is located in at least one conductive layer in the driving circuit layer. In an optional embodiment of the present application, in the thickness direction of the display panel, the at least one conductive layer is located on the same side of the active layer; in another optional embodiment of the present application, the plurality of conductive layers can comprise conductive layers located on different sides of the active layer. For the structure of the substrate, the driving circuit layer and the inorganic buffer layer, reference can be made to FIG. 12 in the following embodiments.

[0080] FIG. 8A is a structural schematic diagram of another display panel provided by an embodiment of the present application, FIG. 8B is a structural schematic diagram of another display panel provided by an embodiment of the present application, and FIG. 9 is a structural schematic diagram of another display panel provided by an embodiment of the present application. Referring to FIGS. 8A-9, optionally, the display panel comprises a light-emitting area AA and a non-light-emitting area NAA0 (which can comprise a deformable area, for example). The light-emitting area AA can comprise a sub-pixel. At least part of the signal line 120 is located in the non-light-emitting area NAA0. The first area 111 can overlap the non-light-emitting area NAA0. The second area 112 can overlap the non-light-emitting area NAA0.

[0081] The first region 111 and the second region 112 can be located in the bending region. Optionally, the thickness d2 of the first organic layer 110 corresponding to the first region 111 is less than the thickness d1 of the first organic layer 110 of the light-emitting region AA. The thickness d2 of the first organic layer 110 corresponding to the second region 112 is less than the thickness d1 of the first organic layer 110 of the light-emitting region AA. The thickness d2 of the first organic layer 110 (for example, at least part of the first organic layer 110) of the non-light-emitting region NAA0 is less than the thickness d1 of the first organic layer 110 of the light-emitting region AA; thus, the non-light-emitting region NAA0 can be more easily deformed, which is more conducive to improving the flexibility of the display panel. The surface of the first organic layer 110 close to the second organic layer 130 is recessed relative to the light-emitting region AA in the non-light-emitting region NAA0, which is equivalent to locally thinning the first organic layer 110, thinning the first organic layer 110 of the non-light-emitting region NAA0, and is conducive to making the signal line 120 close to or located in the neutral layer, improving the bending performance. Compared with directly thinning the first organic layer 110 of the non-light-emitting region NAA0 and the light-emitting region AA as a whole, by etching the surface of the first organic layer 110 close to the second organic layer 130, locally thinning the first organic layer 110, and thinning the first organic layer 110 of the non-light-emitting region NAA0, the influence of thinning the first organic layer 110 of the light-emitting region AA on the transistor characteristics can be reduced. The non-light-emitting region NAA0 includes a bending region NAA1 (the display panel structure shown in FIG. 8A) or a stretchable region NAA2 (the display panel structure shown in FIG. 8B).

[0082] In the formula, the non-light-emitting region NAA0 includes a region in which the display panel can be deformed, and the non-light-emitting region NAA0 can be the bending region NAA1 shown in FIG. 8A, which can be bent and deformed. The non-light-emitting region NAA0 can also be the stretchable region NAA2 shown in FIG. 8B, which can be stretched or shortened. In this embodiment, the signal line 120 is at least partially located in the non-light-emitting region NAA0, and the signal line 120 is located between the first organic layer 110 and the second organic layer 130, which can make the flexibility of the non-light-emitting region NAA0 good, and thus the non-light-emitting region NAA0 is less likely to crack when deformed, and the signal line 120 is less likely to break.

[0083] With reference to FIG. 8A, optionally, the display panel further includes a binding region NAA3, and the bending region NAA1 is located between the light-emitting region AA and the binding region NAA3. Thus, the bending region NAA1 can be bent, and the binding region NAA3 can be bent to the back side of the display panel, which is conducive to realizing a narrow frame.

[0084] The binding area NAA3 is an area where the signal line 120 is connected with the circuit structure 200 providing the signal. The binding area NAA3 can include a binding terminal, and the signal line 120 is electrically connected with the circuit structure 200 providing the signal at the binding terminal. The circuit structure 200 providing the signal can be a driving chip, a power supply chip, etc.

[0085] The cross-sectional view of FIG. 8B obtained by cutting along EE' can be FIG. 2, FIG. 4A, FIG. 4B, FIG. 4C, FIG. 5A, FIG. 5B, FIG. 6A, FIG. 6B or FIG. 7. The cross-sectional view of FIG. 8B obtained by cutting along FF' can be FIG. 2, FIG. 4A, FIG. 4B, FIG. 4C, FIG. 5A, FIG. 5B, FIG. 6A, FIG. 6B or FIG. 7.

[0086] Optionally, in the light-emitting area AA, the first inorganic layer 150 is located between the first organic layer 110 and the film layer where the signal line 120 is located.

[0087] FIG. 10A is a cross-sectional view of another display panel provided by an embodiment of the present application, and FIG. 11A is a cross-sectional view of still another display panel provided by an embodiment of the present application. FIG. 10A can correspond to the cross-sectional view obtained by cutting along CC' of FIG. 3 and FIG. 9, and FIG. 11A can correspond to the cross-sectional view obtained by cutting along DD' of FIG. 3 and FIG. 9. Referring to FIG. 3, FIG. 9, FIG. 10A and FIG. 11A, optionally, in the direction away from the non-light-emitting area NAA0, for example, in the first direction y and in the direction away from the non-light-emitting area NAA0, the first inorganic layer 150 is in the shape of an ascending step, the first inorganic layer 150 includes a first step area 152 and a second step area 153, and the thickness of the first inorganic layer 150 in the first step area 152 is less than the thickness of the first inorganic layer 150 in the second step area 153. For example, the thickness of the first step area 152 is greater than or equal to 100 nanometers and less than or equal to 150 nanometers.

[0088] Optionally, the first step area 152 is located in the non-light-emitting area NAA0, and the second step area 153 is located in the non-light-emitting area NAA0.

[0089] Optionally, the first step area 152 is located between the bending area NAA1 and the second step area 153. Alternatively, the first step area 152 is located in the bending area NAA1, and the second step area 153 is located between the bending area NAA1 and the light-emitting area AA. Alternatively, the second step area 153 is located between the bending area NAA1 and the binding area NAA3.

[0090] Optionally, the first step area 152 is located between the stretchable area NAA2 and the second step area 153. Alternatively, the first step area 152 is located in the stretchable area NAA2, and the second step area 153 is located between the stretchable area NAA2 and the light-emitting area AA. Alternatively, the second step area 153 is located between the stretchable area NAA2 and the binding area NAA3.

[0091] The direction away from the non-light-emitting area NAA0 can include a direction in which the non-light-emitting area NAA0 points to the light-emitting area AA. In this embodiment, along the first direction y and along the direction away from the non-light-emitting area NAA0, for example, along the direction in which the non-light-emitting area NAA0 points to the light-emitting area AA or the binding area, the first inorganic layer 150 is in the shape of an upward step, the first inorganic layer 150 includes a first step area 152 and a second step area 153, and the thickness of the first inorganic layer 150 in the first step area 152 is less than the thickness of the first inorganic layer 150 in the second step area 153. For example, during the manufacturing process of the display panel, after the first inorganic layer 150 is formed, the portion of the bending area NAA1 and the portion of the bending area NAA1 periphery can be subjected to a thinning treatment (or the portion of the stretchable area NAA2 and the portion of the stretchable area NAA2 periphery can be subjected to a thinning treatment), and the thickness of the first inorganic layer 150 after the thinning treatment is the thickness of the first inorganic layer 150 in the first step area 152. Then, the first inorganic layer 150 is patterned to remove the first inorganic layer of the first area 111, for example, the first inorganic layer 150 is etched, which can improve the etching capacity and improve the manufacturing efficiency of the display panel. For example, the first inorganic layer 150 of the first area 111 is etched, and then the signal line 120 is formed, which can form the structures shown in FIGS. 10A, 10B, 11A and 11B. There is no first inorganic layer 150 between the signal line 120 and the first organic layer 110 in the bending area NAA1, the first inorganic layer 150 in the first step area 152 is thinned, and the first inorganic layer 150 in the second step area 153 is not thinned. Because the signal line 120 is in contact with the first area 111 of the first organic layer 110, there is no first inorganic layer 150 between the signal line 120 and the first organic layer 110. The first area 111 can be located on one side of the first step area 152 away from the second step area 153. The second area 112 can be located on one side of the first step area 152 away from the second step area 153. The first area 111 has no first inorganic layer 150. The first inorganic layer 150 of the first step area 152 and the second step area 153 is located between the signal line 120 and the first organic layer 110.

[0092] FIG. 10B is a cross-sectional view of another display panel provided by an embodiment of the present application, and FIG. 11B is a cross-sectional view of still another display panel provided by an embodiment of the present application. FIG. 10B can correspond to the cross-sectional view obtained by cutting FIG. 9 along GG’, and FIG. 11B can correspond to the cross-sectional view obtained by cutting FIG. 9 along FF’. The cross-sectional view obtained by cutting FIG. 9 along CC’ is the same as or similar to the cross-sectional view obtained by cutting FIG. 9 along GG’, and thus will not be described herein again. The cross-sectional view obtained by cutting FIG. 9 along DD’ is the same as or similar to the cross-sectional view obtained by cutting FIG. 9 along FF’, and thus will not be described herein again.

[0093] In some embodiments, the thickness of the inorganic portion 151 can be equal to the thickness of the first inorganic layer 150 of the first step region 152. The first inorganic layer 150 is thinned, and the inorganic portion 151 and the first inorganic layer 150 of the first step region 152 have a relatively small thickness. The film layer of the inorganic portion 151 can be the same as the film layer of the first inorganic layer 150 of the first step region 152.

[0094] FIG. 12 is a cross-sectional view of another display panel according to embodiments of the present application. As shown in FIGS. 9-12, the display panel can further include a first conductive layer 140 and a first insulating layer 170. In the light-emitting region AA, the first insulating layer 170 is located between the first conductive layer 140 and the second organic layer 130. In the non-light-emitting region NAA0, the first insulating layer 170 is provided with an opening 171, and the signal line 120 is located in the first conductive layer 140.

[0095] Optionally, the first region 111 and the normal projection of the opening 171 on the first organic layer 110 can overlap. The second region 112 and the normal projection of the opening 171 on the first organic layer 110 can overlap. The inorganic layer can include silicon nitride or silicon oxide, etc. Optionally, the second region 112 is located in the normal projection of the opening 171 on the first organic layer 110. Optionally, the first region 111 is located in the normal projection of the opening 171 on the first organic layer 110.

[0096] Optionally, the normal projection of the first step region 152 on the first organic layer 110 is located in the normal projection of the opening 171 on the first organic layer 110; and the normal projection of the second step region 153 on the first organic layer 110 overlaps the normal projection of the opening 171 on the first organic layer 110.

[0097] Optionally, the display panel further includes a first insulating layer 170. In the non-light-emitting region NAA0, the first insulating layer 170 is provided with an opening 171, which can be obtained by patterning the first insulating layer 170. When the first insulating layer 170 is patterned, the first inorganic layer 150 of the second region 112 can be removed at the same time, so that the first inorganic layer 150 of the second region 112 does not need to be prepared separately, thereby simplifying the preparation process of the display panel. The first insulating layer 170 can be an inorganic layer. The first insulating layer 170 can be a wiring connection protection layer, which can improve the packaging effect and improve the Growing Dark Spot (GDS) display defect of the display panel. The bending region NAA1 or the stretchable region NAA2 can be located in the opening 171.

[0098] Optionally, the display panel further includes a driving circuit layer, and the driving circuit layer includes a plurality of layers of conductive layers and an active layer stacked therebetween. The first conductive layer is at least one of the plurality of layers of conductive layers in the driving circuit layer.

[0099] Optionally, the first inorganic layer 150 of the first step region 152 comprises the inorganic barrier layer 154 and the inorganic buffer layer 155; the first inorganic layer 150 of the second step region 153 comprises the inorganic barrier layer 154, the inorganic buffer layer 155, and at least one of the gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158. The first inorganic layer 150 of the first step region 152 can not comprise the gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158. Optionally, the inorganic barrier layer 154, the inorganic buffer layer 155, the gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158 are sequentially stacked on one side of the first organic layer 110 towards the second organic layer 130; the driving circuit layer comprises the thin film transistor 20 and the capacitor 30, the gate insulating layer 156 is located between the active layer and the conductive layer where the gate of the thin film transistor 20 is located; the capacitor dielectric layer 157 is located between the first plate and the second plate of the capacitor 30; the interlayer insulating layer 158 is located between the conductive layer where the first plate of the capacitor 30 is located and the conductive layer where the source / drain of the thin film transistor 20 is located. The capacitor 30 can be a storage capacitor.

[0100] In the embodiment, the inorganic barrier layer 154 is located on the side of the first organic layer 110 close to the second organic layer 130, and the inorganic barrier layer 154 can play a role of blocking water and oxygen, preventing water and oxygen from invading the display panel, and prolonging the service life of the display panel. The inorganic buffer layer 155 is located on the side of the inorganic barrier layer 154 away from the first organic layer 110, and the inorganic buffer layer 155 can play a role of buffering. The display panel further comprises the thin film transistor 20 and the capacitor 30, the gate insulating layer 156 is a film layer between the active layer and the gate of the thin film transistor 20, thereby insulating the active layer and the gate. The capacitor dielectric layer 157 is a dielectric layer between the two plates of the capacitor 30. The interlayer insulating layer 158 can be an insulating layer between two adjacent conductive layers in the display panel. FIG. 12 exemplarily shows that the interlayer insulating layer 158 is located between the conductive layer where the first plate of the capacitor 30 is located and the conductive layer where the source / drain of the thin film transistor 20 is located. Exemplarily, the gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158 are sequentially stacked on the side of the inorganic buffer layer 155 away from the first organic layer 110. The gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158 can all be inorganic layers. In combination with FIG. 12, in the light-emitting region AA, the first inorganic layer 150 comprises at least one of the inorganic barrier layer 154, the inorganic buffer layer 155, the gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158. When the first inorganic layer 150 is patterned, a plurality of connection vias 154a are formed in the light-emitting region AA. For example, the source and / or the drain of the thin film transistor 20 can be connected to the source region and / or the drain region of the active layer through the connection vias 154a.

[0101] Optionally, the inorganic portion 151 can include a partial inorganic barrier layer 154; or, the inorganic portion 151 includes a partial inorganic barrier layer 154 and a partial inorganic buffer layer 155. The inorganic portion 151 can not include a gate insulating layer 156, a capacitor dielectric layer 157, and an interlayer insulating layer 158.

[0102] The inorganic barrier layer 154 and the inorganic buffer layer 155 can be provided with a first via hole, and the first area 111 can be located within the orthographic projection of the second via hole on the first organic layer 110. The gate insulating layer 156, the capacitor dielectric layer 157, and the interlayer insulating layer 158 can be provided with a second via hole. The first area 111 can be located within the orthographic projection of the second via hole on the first organic layer 110. The second area 112 can be located within the orthographic projection of the second via hole on the first organic layer 110. The orthographic projection of the first step area 152 on the first organic layer 110 can be located within the second via hole. The boundary of the second via hole can correspond to the first boundary 11 and the second boundary 12. The boundary of the first via hole can correspond to the third boundary 21 and the fourth boundary 22. The boundary of the opening 171 can correspond to the fifth boundary 31 and the sixth boundary 32.

[0103] Optionally, as shown in FIG. 9, the orthographic projection of the bending area NAA1 on the first organic layer 110 is located within the orthographic projection of the opening 171 on the first organic layer 110. The non-light-emitting area NAA0 includes the bending area NAA1. As shown in FIG. 9, the seventh boundary 33 and the eighth boundary 34 can be the boundaries of the bending area NAA1 or the stretchable area NAA2. The distance D1 between the seventh boundary 33 and the fifth boundary 31 can be greater than 0, for example, D1 can be greater than or equal to 0.5 um and less than or equal to 5 um. D1 can be 1 um, 2 um, 3 um, 4 um, etc. The distance D2 between the eighth boundary 34 and the sixth boundary 32 can be greater than 0, for example, D2 can be greater than or equal to 0.5 um and less than or equal to 5 um. D2 can be 1 um, 2 um, 3 um, 4 um, etc. The fifth boundary 31 and the sixth boundary 32 of the opening 171 can be located outside the seventh boundary 33 and the eighth boundary 34 of the bending area NAA1, so that the bending area NAA1 is free of the first insulating layer 170, to improve the bending performance.

[0104] Optionally, the seventh boundary 33 can coincide with the first boundary 11. The eighth boundary 34 can coincide with the second boundary 12.

[0105] Optionally, the seventh boundary 33 can coincide with the third boundary 21. The eighth boundary 34 can coincide with the fourth boundary 22.

[0106] The first boundary 11 can be the demarcation line of the first step area 152 and the second step area 153 close to the light-emitting area AA (i.e., the display area). The second boundary 12 can be the demarcation line of the first step area 152 and the second step area 153 close to the bonding area NAA3.

[0107] The distance D3 between the fifth boundary 31 and the first boundary 11 can be greater than 0, for example, D3 can be greater than or equal to 0.5 um and less than or equal to 5 um. D3 can be 1 um, 2 um, 3 um, 4 um, etc. The distance D4 between the sixth boundary 32 and the second boundary 12 can be greater than 0, for example, D4 can be greater than or equal to 0.5 um and less than or equal to 5 um. D4 can be 1 um, 2 um, 3 um, 4 um, etc. The fifth boundary 31 and the sixth boundary 32 of the opening 171 can be located outside the first boundary 11 and the second boundary 12, so that the bending area NAA1 is free of the first insulating layer 170, to improve the bending performance.

[0108] With reference back to FIG. 12, in some optional embodiments of the present application, the display panel further includes a substrate 100, and the substrate 100 includes the first organic layer 110.

[0109] In some optional embodiments of the present application, the display panel further includes a third organic layer 180 located on the side of the second organic layer 130 away from the signal line 120, so that the thickness of the organic film layer on the side of the signal line 120 away from the first organic layer 110 is thicker, which is more conducive to improving the flexibility of the display panel.

[0110] On the basis of the above-mentioned embodiments, optionally, the substrate 100 further includes a second inorganic layer 101 and a fourth organic layer 102 located on the side of the first organic layer 110 away from the signal line 120, and the second inorganic layer 101 is located between the first organic layer 110 and the fourth organic layer 102. In this way, the thickness of the substrate 100 can be increased, so that the substrate 100 can play a better buffering role. In addition, the substrate 100 is arranged in an alternating structure of organic film layers and inorganic film layers, which can prevent water and oxygen from invading the inside of the display panel from the side of the substrate 100, to ensure good performance of the display panel. Optionally, the substrate 100 can further include an inorganic barrier layer 154.

[0111] Optionally, the second organic layer 130 is a planarization layer 131, and the third organic layer 180 includes a pixel definition layer 181 and / or a support column 182.

[0112] Exemplarily, the display panel can include multiple conductive layers, and the planarization layer 131 can be located between at least one of the conductive layers and the substrate 100. By taking the planarization layer 131 as the second organic layer 130, an organic film layer as the second organic layer 130 can be added in the display panel, so that the thickness of the display panel can be relatively thin. The display panel further includes a pixel definition layer 181, and optionally, the display panel further includes a light emitting device. In the light emitting region AA of the display panel, the pixel definition layer 181 is provided with a pixel opening, and the light emitting device is at least partially located in the pixel opening, thereby defining multiple sub-pixels of the display panel. The display panel further includes a support column 182, which can support a mask plate when the light emitting layer of the light emitting device is evaporated. The materials of the pixel definition layer 181 and the support column 182 are both organic materials. In this embodiment, the third organic layer 180 includes the pixel definition layer 181 and / or the support column 182, so that an organic film layer as the third organic layer 180 can be added in the display panel, further making the thickness of the display panel relatively thin. The conductive layer can include metal, metal oxide and other conductive materials.

[0113] Optionally, the film layer where the signal line 120 is located is between the film layer where the light emitting device 300 is located and the substrate 100.

[0114] Optionally, the display panel further includes a driving circuit layer 400, and the driving circuit layer 400 is located between the substrate 100 and the film layer where the light emitting device 300 is located.

[0115] Optionally, the driving circuit layer 400 includes a stacked active layer 401 and multiple conductive layers, and the signal line 120 is located in at least one of the conductive layers in the driving circuit layer 400.

[0116] Optionally, the multiple conductive layers include a gate layer 402, a capacitor plate layer 403 and a source-drain layer 404, and the gate layer 402, the capacitor plate layer 403 and the source-drain layer 404 are sequentially stacked from one side of the substrate 100. The first plate of the capacitor 30 can be located in the gate layer 402, and the second plate of the capacitor 30 can be located in the capacitor plate layer 403.

[0117] Optionally, the signal line 120 is located in the source-drain layer 404 (i.e., the first conductive layer).

[0118] Optionally, three conductive layers are provided between the film layer where the light emitting device 300 is located and the substrate 100, and an insulating layer is provided between adjacent conductive layers.

[0119] Optionally, the light emitting device 300 includes a first electrode 301, a light emitting layer 302 and a second electrode 303 which are sequentially stacked away from the substrate 100. Exemplarily, the first electrode 301 can be an anode of the light emitting device 300, and the second electrode 303 can be a cathode of the light emitting device 300.

[0120] The embodiment of the present application further provides a manufacturing method of a display panel, which is used for manufacturing the display panel of any of the above-mentioned embodiments of the present application. FIG. 13 is a flow chart of a manufacturing method of a display panel according to an embodiment of the present application. Referring to FIG. 13, the manufacturing method of the display panel comprises the following steps.

[0121] Step 210, providing a first organic layer.

[0122] Step 220, forming a first inorganic layer on one side of the first organic layer.

[0123] Step 230, patterning the first inorganic layer, removing the first inorganic layer in a preset region to form a plurality of recessed structures, and the recessed structures expose the first organic layer; wherein the preset region comprises a region in which a signal line is to be formed.

[0124] For example, the first inorganic layer can be patterned by using an etching process to remove the first inorganic layer in the preset region in which the signal line is to be formed, so that the first inorganic layer in the preset region forms a recessed structure, and the recessed structure exposes the first organic layer, so that in the subsequent step of forming the signal line, the first organic layer is below the signal line.

[0125] Step 240, forming a plurality of signal lines in the plurality of recessed structures.

[0126] For example, at least part of the signal lines extend along a first direction and are arranged at intervals along a second direction, and the first direction and the second direction intersect.

[0127] For example, in this step, a whole layer of conductive layer can be first formed, and the conductive layer is located on the recessed structure and on the side of the first inorganic layer away from the first organic layer, and then the conductive layer is patterned to retain at least part of the conductive layer in the recessed structure and remove the conductive layer on the side of the first inorganic layer away from the first organic layer, thereby forming the plurality of signal lines.

[0128] Step 250, forming a second organic layer on the side of the signal line away from the first organic layer.

[0129] The second organic layer is formed on the side of the signal line away from the first organic layer, so that the signal line is located between the first organic layer and the second organic layer, thereby improving the flexibility of the display panel.

[0130] The manufacturing method of the display panel provided in the embodiments of the present application removes the first inorganic layer in the preset area to form a plurality of recessed structures that expose the first organic layer, so that the signal lines are in contact with the first organic layer after the signal lines are formed. After the signal lines are formed, the second organic layer is formed on the side of the signal lines away from the first organic layer, so that the upper layer and the lower layer of the signal lines are both organic film layers, and the flexibility of the upper layer and the lower layer of the signal lines is good, thereby reducing the probability of cracks in the upper layer and the lower layer of the signal lines when the display panel deforms, reducing the breakage of the signal lines, and improving the yield and reliability of the display panel.

[0131] On the basis of the above technical solutions, in combination with FIGS. 1-4C, optionally, the surface of the first organic layer 110 includes a first area 111 and a second area 112; the orthographic projection of the first area 111 on the first inorganic layer is located in the preset area. FIG. 14 is a flowchart of another manufacturing method of a display panel provided in the embodiments of the present application, referring to FIG. 14, the manufacturing method of the display panel includes the following steps.

[0132] Step 310: providing a first organic layer.

[0133] Step 320: forming a first inorganic layer on one side of the first organic layer.

[0134] Step 330: patterning the first inorganic layer to remove the first inorganic layer in the preset area to form a plurality of recessed structures that expose the first area.

[0135] In some optional embodiments of the present application, the preset area completely corresponds to the first area, that is, the orthographic projection of the preset area on the first organic layer coincides with the first area. In this step, when the first inorganic layer is patterned, the first inorganic layer in the first area is removed, that is, the first inorganic layer at the position corresponding to the first area is removed, and a plurality of recessed structures that expose the first area are formed.

[0136] Step 340: forming a plurality of signal lines in the plurality of recessed structures.

[0137] Step 350: patterning the first inorganic layer again to remove the first inorganic layer at the position corresponding to the second area.

[0138] After the signal lines are formed, in this step, the first inorganic layer is patterned again to remove the first inorganic layer at the second area, so that there is no inorganic layer in the gap between the adjacent signal lines 120, and the second area of the first organic layer is exposed.

[0139] Step 360: forming a second organic layer on the side of the signal lines away from the first organic layer.

[0140] Due to the exposure of the second region of the first organic layer, after the second organic layer is formed on the side of the signal line away from the first organic layer, the second organic layer can be in contact with the second region, which is more conducive to improving the flexibility of the display panel.

[0141] On the basis of the above technical solutions, to ensure that the formed signal line meets the line width requirement, the width of the first region along the second direction is greater than or equal to the width of the signal line along the second direction. In combination with FIGS. 4A-4C, optionally, the first region 111 includes a first sub-region 1111 and a second sub-region 1112 located on at least one side of the first sub-region 1111. The width of the first sub-region along the second direction can be equal to the width of the signal line along the second direction.

[0142] Optionally, in the above embodiment, the step 340 includes: forming a first conductive layer on the side of the first inorganic layer away from the first organic layer and in the recess structure; and performing patterning on the first conductive layer, etching the first conductive layer on the side of the first inorganic layer away from the second region and etching the first conductive layer in the second sub-region, so that the signal line is formed on one side of the first sub-region.

[0143] Optionally, one side of the second sub-region forms a discontinuous or continuous conductive part.

[0144] When the patterning is performed on the first conductive layer, there can be etching errors, such as alignment errors between the mask and the first conductive layer, and thus the position of the formed signal line can deviate. When the width of the first region along the second direction is greater than the width of the signal line along the second direction, a smaller deviation can still ensure that the signal line is formed in the recess structure and meets the line width requirement. For example, the target position of the signal line is the center position of the first region. When there is an etching deviation, the signal line can deviate from the center position of the first region, but is still located in the first region, so that even if there is an etching error, the formed signal line still meets the line width requirement. When the patterning is performed on the first conductive layer, the conductive layer corresponding to the signal line is retained, and the conductive layer corresponding to the gap between the signal lines is removed. The conductive layer on the side of the first inorganic layer away from the first organic layer is easily removed completely, and the conductive layer in the second sub-region is in contact with the first organic layer and is not easily removed completely, which can cause residual conductive material. One side of the second sub-region forms a discontinuous or continuous conductive part, and one side of the first sub-region forms a signal line. Relative to the organic material, the conductive layer on the inorganic material is not easy to have etching residues, so the formed signal line is not easy to have a short circuit, and the conductive layer on the organic material is easy to have etching residues, so that after the etching is performed on the first conductive layer, the second sub-region still has a discontinuous or continuous conductive part.

[0145] Optionally, in the above embodiment, the step 230 of patterning the first inorganic layer to remove the first inorganic layer in the preset region to form the plurality of recessed structures exposing the first organic layer comprises: patterning the first inorganic layer to remove the first inorganic layer in the preset region to form the plurality of recessed structures exposing the first organic layer, and leaving an inorganic part between the recessed structures. In this way, on the one hand, the conductive layer can be free of etching residues at the position of the inorganic part, and the inorganic part is located at least in the gap between adjacent signal lines, so as to ensure that the signal lines are not short-circuited. On the other hand, the inorganic part is left without being removed, which can reduce the process steps of the display panel and simplify the preparation process of the display panel.

[0146] In another optional embodiment of the present application, the step 230 of patterning the first inorganic layer to remove the first inorganic layer in the preset region to form the plurality of recessed structures exposing the first organic layer comprises: patterning the first inorganic layer to remove the first inorganic layer in the preset region to form the plurality of recessed structures extending into the first organic layer. For example, when the first inorganic layer in the preset region is removed, the surface of the first organic layer close to the first inorganic layer can be etched. In this way, the thickness of the first organic layer at the recessed structures can be less than the thickness of the first organic layer between the recessed structures, that is, the first organic layer under the signal lines is thinned, so that the display panel has better flexibility, and the signal lines are less likely to crack and break.

[0147] On the basis of the above technical solution, the display panel comprises a light-emitting area and a non-light-emitting area, and at least part of the signal lines is located in the non-light-emitting area. In the above embodiment, the step 230 can comprise: patterning the first inorganic layer in the light-emitting area to form a plurality of connection vias; and patterning the first inorganic layer in the non-light-emitting area to remove the first inorganic layer in the preset region to form a recessed structure exposing the first organic layer.

[0148] For example, in the light-emitting area, the film layers above and below the first inorganic layer can both comprise a conductive layer, and the connection via formed by patterning the first inorganic layer in the light-emitting area can serve as a connection channel of the conductive layer above and below the first inorganic layer. At least part of the signal lines is located in the non-light-emitting area, and the first inorganic layer in the non-light-emitting area is patterned to remove the first inorganic layer in the preset region to form a recessed structure exposing the first organic layer, so that the signal lines can be formed in the non-light-emitting area in subsequent steps.

[0149] FIG. 15 is a flowchart of another display panel manufacturing method provided by an embodiment of the present application, and FIG. 16 is a schematic diagram of a display panel manufacturing process provided by an embodiment of the present application. In combination with FIG. 12, and with reference to FIGS. 15 and 16, the display panel manufacturing method comprises the following steps.

[0150] Step 410, providing a first organic layer 110.

[0151] Step 420, forming a first inorganic layer 150 on one side of the first organic layer.

[0152] Step 430, patterning the first inorganic layer 150 of the light-emitting region AA to form a plurality of connection vias 154a.

[0153] In combination with FIG. 9, FIG. 15 and FIG. 16, wherein the first boundary 11 and the second boundary 12 are boundaries for patterning the first inorganic layer 150 in the light-emitting region AA, when patterning the first inorganic layer 150 of the light-emitting region AA, the first inorganic layer 150 in part of the non-light-emitting region NAA0 can also be patterned, wherein in this step, the first boundary 11 is patterned away from the side of the non-light-emitting region NAA0, and the second boundary 12 is patterned away from the side of the non-light-emitting region NAA0.

[0154] Step 440, thinning the first inorganic layer 150 of the non-light-emitting region NAA0 to a set thickness.

[0155] In combination with FIG. 9, FIG. 15 and FIG. 16, the boundaries of the first inorganic layer 150 of the non-light-emitting region NAA0 thinned to the set thickness are the third boundary 21 and the fourth boundary 22, and the region between the third boundary 21 and the fourth boundary 22 is thinned.

[0156] Optionally, the set thickness is greater than or equal to 100 nanometers and less than or equal to 150 nanometers. By thinning the first inorganic layer of the non-light-emitting region before patterning the first inorganic layer of the non-light-emitting region, the speed of patterning the first inorganic layer can be improved, which is conducive to improving the etching capacity.

[0157] Step 450, patterning the thinned first inorganic layer 150 to remove the first inorganic layer 150 in the pre-set region to form a recessed structure, and the recessed structure exposes the first organic layer 110.

[0158] Step 460, forming a plurality of signal lines 120 in the plurality of recessed structures.

[0159] Step 470, patterning the first inorganic layer 150 again to remove the first inorganic layer at the position corresponding to the second region.

[0160] Step 480, forming a second organic layer 130 on the side of the signal line away from the first organic layer 110.

[0161] In combination with FIG. 12, on the basis of the technical solution described above, optionally, the display panel further comprises a non-light-emitting area NAA0, the non-light-emitting area comprises a connecting area NAA4, the connecting area NAA4 is located between the deformable area (the deformable area can be the bending area NAA1 shown in FIG. 12, or can be the stretchable area in the above embodiment) and the light-emitting area AA; optionally, the non-light-emitting area comprises a bending area and a connecting area, or the non-light-emitting area comprises a stretchable area and a connecting area; the connecting area is located between the bending area and the light-emitting area, or the connecting area is located between the stretchable area and the light-emitting area; at the same time of the step 440 described above, further comprising: thinning the first inorganic layer close to at least part of the bending area or the stretchable area to a set thickness, so that in the direction along the non-light-emitting area pointing to the light-emitting area, the first inorganic layer is in the form of an upward stepped shape, the first inorganic layer comprises a first stepped area 152 and a second stepped area 153, the thickness of the first inorganic layer of the first stepped area 152 is less than the thickness of the first inorganic layer of the second stepped area 153. Optionally, the first stepped area 152 is located in the non-light-emitting area NAA0, and the second stepped area 153 is located in the non-light-emitting area NAA0. Optionally, the first stepped area 152 is located between the bending area NAA1 and the second stepped area 153, or the first stepped area 152 is located between the stretchable area NAA2 and the second stepped area 153. Optionally, the first stepped area 152 is located in the bending area NAA1, and the second stepped area 153 is located between the bending area NAA1 and the light-emitting area AA. Optionally, the first stepped area 152 is located in the stretchable area NAA2, and the second stepped area 153 is located between the stretchable area NAA2 and the light-emitting area AA.

[0162] In combination with FIG. 8, optionally, the non-light-emitting area NAA0 further comprises a binding area NAA3, and the manufacturing method further comprises: patterning the first inorganic layer, and reserving at least part of the first inorganic layer of the binding area NAA3, so that when etching the conductive layer of the binding area NAA3, etching residues are not easily present, and it is ensured that the binding area NAA3 is not easily short-circuited.

[0163] The first inorganic layer is patterned, and at least part of the first inorganic layer of the binding area NAA3 is reserved, in the direction along the bending area or the stretchable area pointing to the binding area, the first inorganic layer is in the form of an upward stepped shape, the first inorganic layer comprises a first stepped area and a second stepped area, the thickness of the first inorganic layer of the first stepped area is less than the thickness of the first inorganic layer of the second stepped area. Optionally, the first stepped area 152 is located in the non-light-emitting area NAA0, and the second stepped area 153 is located in the non-light-emitting area NAA0. Optionally, the first stepped area 152 is located between the bending area NAA1 and the second stepped area 153, or the first stepped area 152 is located between the stretchable area NAA2 and the second stepped area 153.

[0164] FIG. 17A is a schematic diagram of another display panel preparation process according to an embodiment of the present application, and FIG. 17B is a schematic diagram of another display panel preparation process according to an embodiment of the present application. In combination with FIG. 12, and with reference to FIGS. 17A and 17B, the display panel manufacturing method includes the following steps.

[0165] Step 510, providing a first organic layer 110.

[0166] Step 520, forming a first inorganic layer 150 on one side of the first organic layer.

[0167] Step 530, patterning the first inorganic layer 150 of the light-emitting region AA to form a plurality of connection vias 154a.

[0168] Step 540, thinning the first inorganic layer 150 of the non-light-emitting region NAA0 to a set thickness.

[0169] Step 550, patterning the thinned first inorganic layer 150 to remove the first inorganic layer 150 in the preset region to form a recess structure, and the recess structure extends into the first organic layer.

[0170] The recess structure 150a (corresponding to the first region 111) extends into the first organic layer 150, so as to thin the first organic layer 150 of the non-light-emitting region, so that the thickness d2 of the first organic layer 110 of the non-light-emitting region NAA0 or the first region 150 is less than the thickness d1 of the first organic layer 110 of the light-emitting region AA, so that the signal line 120 is closer to or located at the neutral layer. FIG. 17A can correspond to thinning the first organic layer corresponding to the first region, and the first organic layer corresponding to the second region 112 can not be thinned. FIG. 17B can correspond to thinning the first organic layer corresponding to the first region and the second region.

[0171] Step 560, forming a plurality of signal lines 120 in the plurality of recess structures.

[0172] Step 570, patterning the first inorganic layer 150 again to remove the first inorganic layer at the position corresponding to the second region.

[0173] Step 580, forming a second organic layer 130 on the side of the signal line away from the first organic layer 110.

[0174] FIG. 18 is a schematic diagram of another display panel preparation process according to an embodiment of the present application. In combination with FIG. 12, and with reference to FIG. 18, the display panel manufacturing method includes the following steps.

[0175] Step 610, providing a first organic layer 110.

[0176] Step 620, forming a first inorganic layer 150 on one side of the first organic layer.

[0177] Step 630, the first inorganic layer 150 of the light-emitting area AA is patterned to form a plurality of connection vias 154a.

[0178] Step 640, the first inorganic layer 150 of the non-light-emitting area NAA0 is thinned to a set thickness.

[0179] Step 650, the thinned first inorganic layer 150 is patterned to remove the first inorganic layer 150 in the preset area to form a recess structure, the recess structure exposes the first organic layer 110, and the inorganic part between the recess structures is reserved.

[0180] Step 660, a plurality of signal lines 120 are formed in the plurality of recess structures.

[0181] After step 660, the first inorganic layer 150 of the second area 112 between adjacent signal lines 120 is no longer etched, and the inorganic part 151 between the second area 112 between adjacent signal lines 120 is reserved.

[0182] Step 670, a second organic layer 130 is formed on the side of the signal line away from the first organic layer 110.

[0183] FIG. 19 is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application, and FIG. 20 is a schematic diagram of another method for manufacturing a display panel according to an embodiment of the present application. As shown in FIGS. 19 and 20, the method for manufacturing a display panel can include the following steps.

[0184] Step 710, a first organic layer is provided.

[0185] Step 720, a first inorganic layer is formed on one side of the first organic layer.

[0186] Step 730, the first inorganic layer is patterned to remove the first inorganic layer in a preset area to form a plurality of recess structures, the recess structures expose the first organic layer; wherein the preset area includes an area where a signal line is to be formed.

[0187] Step 740, a first conductive layer is formed on the side of the first inorganic layer away from the first organic layer and in the recess structures.

[0188] Step 750, the first conductive layer is patterned to obtain a plurality of signal lines.

[0189] The first conductive layer 140 is patterned to form a signal line in a first sub-area in the same first area 111, and conductive material can be left in a second sub-area, the structure of the residual conductive material is denoted as a conductive part 141, which can be seen from FIGS. 4A, 4B, 4C, 5B, and 6B. In the same second sub-area, the conductive part 141 can be continuous or discontinuous.

[0190] Step 760, forming a first insulating layer on a side of the first conductive layer away from the first organic layer.

[0191] Step 770, patterning the first insulating layer to form an opening in the non-light-emitting area while patterning the first inorganic layer to remove the first inorganic layer at the position corresponding to the second area.

[0192] The patterning of the first inorganic layer to remove the first inorganic layer at the position corresponding to the second area can be prepared simultaneously in the process of patterning the first insulating layer to form the opening in the non-light-emitting area. The orthographic projection of the first step area on the first organic layer is located within the orthographic projection of the opening on the first organic layer, and the orthographic projection of the second step area on the first organic layer overlaps with the orthographic projection of the opening on the first organic layer.

[0193] In this way, when the first insulating layer 170 is patterned, the first inorganic layer of the second area can be removed at the same time, so that the first inorganic layer of the second area does not need to be prepared separately, and the preparation process of the display panel is simplified. In combination with FIG. 9, after the first insulating layer 170 is patterned, the boundary of the first insulating layer 170 is the fifth boundary 31 and the sixth boundary 32, and the first insulating layer 170 exists in the area away from the deformable area (for example, it can be a bending area or a stretchable area) of the fifth boundary 31, and the area away from the deformable area of the sixth boundary 32.

[0194] Step 780, forming a second organic layer on a side of the signal line away from the first organic layer.

[0195] Optionally, after the second organic layer is formed on the side of the signal line away from the first organic layer in the above step 250 or step 360 or step 480 or step 580 or step 670 or step 780, etc., the method further includes: forming a third organic layer on a side of the second organic layer to further improve the flexibility of the display panel.

[0196] In the above embodiments, FIG. 16, FIG. 17A, FIG. 17B, FIG. 18 and FIG. 20 take the non-light-emitting area including the connection area NAA4 and the bending area NAA1 as an example. The manufacturing method of the stretchable area NAA2 can be the same as or similar to the manufacturing method of the bending area NAA1.

[0197] Note that the above merely describes preferred embodiments of the present application and the principles of the technology applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, modifications, combinations and substitutions can be made by those skilled in the art without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the claims.

Claims

1. A display panel, comprising: a first organic layer, a plurality of signal lines located on one side of the first organic layer and in contact with the first organic layer; a second organic layer, the plurality of signal lines being located between the first organic layer and the second organic layer.

2. The display panel of claim 1, wherein, a first surface of the first organic layer comprises a first region and a second region, the first region being in contact with the signal lines; the second region being located in a gap between adjacent signal lines; the second region is in contact with the second organic layer.

3. The display panel of claim 2, wherein, at least part of the signal lines extend in a first direction and are arranged at intervals in a second direction, the first direction and the second direction intersecting; a width of the first region along the second direction is greater than or equal to a width of the signal lines along the second direction; a width of the second region along the second direction is less than or equal to a spacing between adjacent signal lines along the second direction; wherein a sum of widths of the first region and the second region along the second direction is equal to a sum of the width of the signal lines along the second direction and the spacing between adjacent signal lines along the second direction.

4. The display panel of claim 2, wherein, the second region is recessed relative to the first region in a direction away from the second organic layer.

5. The display panel of claim 2, wherein, the first region comprises a first sub-region and a second sub-region located on at least one side of the first sub-region; the first sub-region is in contact with the signal lines; the second sub-region is located in a gap between adjacent signal lines; the second sub-region has a discontinuous or continuous conductive part, a thickness of the conductive part along a thickness direction of the first organic layer being less than a thickness of the signal lines.

6. The display panel of claim 5, wherein, at least part of the signal lines extend in a first direction and are arranged at intervals in a second direction, the first direction and the second direction intersecting; a width of the second sub-region along the second direction is less than or equal to a width of the signal lines along the second direction; wherein both sides of the first sub-region in a same first region are provided with the second sub-region; wherein the signal lines and the conductive part are provided in a same layer and are of a same material.

7. The display panel of claim 2, wherein, the first region comprises a first sub-region and a second sub-region located on at least one side of the first sub-region; the first sub-region is in contact with the signal lines; the second sub-region is located in a gap between adjacent signal lines; the second sub-region is recessed relative to the first sub-region; the second region is flush with the second sub-region, or the second region is recessed relative to the second sub-region.

8. The display panel of claim 1, wherein, the display panel further comprises a first inorganic layer, the first inorganic layer comprising at least one inorganic part, the inorganic part being located at least in a gap between adjacent signal lines.

9. The display panel of claim 8, wherein, the inorganic part is located between the first organic layer and the second organic layer, the inorganic part being in contact with the first organic layer; the inorganic part being in contact with the second organic layer; wherein the inorganic part is arranged at intervals from the signal lines; wherein the inorganic part comprises a partial inorganic barrier layer; or the inorganic part comprises a partial inorganic barrier layer and a partial inorganic buffer layer; wherein a thickness of the inorganic part is greater than or equal to 100 nanometers and less than or equal to 150 nanometers; The display panel further comprises a substrate, the substrate comprises the first organic layer and an inorganic barrier layer; The display panel further comprises a driving circuit layer, the inorganic buffer layer is located between the substrate and the driving circuit layer, and the driving circuit layer comprises an active layer and a plurality of conductive layers which are stacked; The signal line is located in at least one of the conductive layers in the driving circuit layer; The first surface of the first organic layer comprises a first region and a second region, the first region is in contact with the signal line, and the second region is located in a gap between adjacent signal lines; the inorganic part is in contact with the second region.

10. The display panel of claim 1, wherein, The display panel comprises a light-emitting region and a non-light-emitting region, at least part of the signal line is located in the non-light-emitting region, and the thickness of at least part of the first organic layer in the non-light-emitting region is less than the thickness of the first organic layer in the light-emitting region; The non-light-emitting region comprises a bending region or a stretchable region.

11. The display panel of claim 10, wherein, The display panel further comprises a binding region, and the bending region is located between the light-emitting region and the binding region; The first surface of the first organic layer comprises a first region and a second region, the first region is in contact with the signal line, and the second region is located in a gap between adjacent signal lines; the first region and the second region are located in the bending region; the thickness of the first region corresponding to the first organic layer is less than the thickness of the first organic layer in the light-emitting region; The thickness of the second region corresponding to the first organic layer is less than the thickness of the first organic layer in the light-emitting region.

12. The display panel of claim 11, wherein, The display panel further comprises a first inorganic layer, and in the light-emitting region, the first inorganic layer is located between the first organic layer and the film layer where the signal line is located; In the direction from the non-light-emitting region to the light-emitting region or the binding region, the first inorganic layer is in the shape of an ascending step, the first inorganic layer comprises a first step region and a second step region, the thickness of the first inorganic layer in the first step region is less than the thickness of the first inorganic layer in the second step region, The thickness of the first step region is greater than or equal to 100 nanometers and less than or equal to 150 nanometers; The first step region is located in the non-light-emitting region, and the second step region is located in the non-light-emitting region; The first step region is located between the bending region and the second step region, or the first step region is located in the bending region, and the second step region is located between the bending region and the light-emitting region; Or, the first step region is located between the stretchable region and the second step region, or the first step region is located in the stretchable region, and the second step region is located between the stretchable region and the light-emitting region.

13. The display panel of claim 12, wherein, The display panel further comprises a first conductive layer and a first insulating layer, In the light-emitting region, the first insulating layer is located between the first conductive layer and the second organic layer, in the non-light-emitting region, the first insulating layer is provided with an opening, and the signal line is located in the first conductive layer; The second region is located in the orthographic projection of the opening on the first organic layer, The first region is located in the orthographic projection of the opening on the first organic layer; The orthographic projection of the first step region on the first organic layer is located in the orthographic projection of the opening on the first organic layer; The orthographic projection of the second step region on the first organic layer overlaps with the orthographic projection of the opening on the first organic layer; The non-light-emitting region comprises a curved region, and the orthographic projection of the curved region on the first organic layer is located in the orthographic projection of the opening on the first organic layer; The first insulating layer is an inorganic layer; The display panel further comprises a driving circuit layer, the driving circuit layer comprises an active layer and a plurality of layers of conductive layers which are stacked, and the first conductive layer is at least one of the conductive layers in the driving circuit layer; The first inorganic layer of the first step region comprises an inorganic barrier layer and an inorganic buffer layer; the first inorganic layer of the second step region comprises an inorganic barrier layer and an inorganic buffer layer, and the first inorganic layer of the second step region further comprises at least one of a gate insulating layer, a capacitor dielectric layer and an interlayer insulating layer; The inorganic barrier layer, the inorganic buffer layer, the gate insulating layer, the capacitor dielectric layer and the interlayer insulating layer are sequentially stacked on one side of the first organic layer and the second organic layer; the driving circuit layer comprises a thin film transistor and a capacitor, the gate insulating layer is located between the active layer and the conductive layer where the gate of the thin film transistor is located; the capacitor dielectric layer is located between the first plate and the second plate of the capacitor; and the interlayer insulating layer is located between the conductive layer where the first plate of the capacitor is located and the conductive layer where the source and drain of the thin film transistor are located.

14. The display panel of claim 1, wherein, The signal line is in contact with the second organic layer on the side away from the first organic layer; The display panel further comprises a substrate, and the substrate comprises the first organic layer; The display panel further comprises a third organic layer, and the third organic layer is located on the side of the second organic layer away from the signal line; The substrate further comprises a second inorganic layer and a fourth organic layer located on the side of the first organic layer away from the signal line, and the second inorganic layer is located between the first organic layer and the fourth organic layer; The second organic layer is a planarization layer, and the third organic layer comprises a pixel definition layer and / or a support column; The display panel further comprises a light-emitting device, and the pixel definition layer is provided with a pixel opening in the light-emitting region of the display panel, and the light-emitting device is at least partially located in the pixel opening; The film layer where the signal line is located is located between the film layer where the light-emitting device is located and the substrate; The display panel further comprises a driving circuit layer, and the driving circuit layer is located between the substrate and the film layer where the light-emitting device is located; The driving circuit layer comprises an active layer and a plurality of layers of conductive layers which are stacked, and the signal line is located in at least one of the conductive layers in the driving circuit layer; The plurality of layers of conductive layers comprise a gate layer, a capacitor plate layer and a source and drain layer; The signal line is located in the source and drain layer. The three conductive layers are arranged between the film layer where the light-emitting device is located and the substrate, and insulating layers are arranged between adjacent conductive layers. The light-emitting device comprises a first electrode, a light-emitting layer and a second electrode which are sequentially arranged away from the substrate.

15. A manufacturing method of a display panel, comprising: providing a first organic layer; forming a first inorganic layer on one side of the first organic layer; performing patterning on the first inorganic layer to remove the first inorganic layer in a preset region to form a plurality of recess structures, the recess structures exposing the first organic layer; wherein the preset region comprises a region where a signal line is to be formed; forming a plurality of the signal lines in the recess structures; forming a second organic layer on a side of the signal lines away from the first organic layer.

16. The method of manufacturing a display panel according to claim 15, wherein, The surface of the first organic layer comprises a first region and a second region; the orthographic projection of the first region on the first inorganic layer is located in the preset region; The performing patterning on the first inorganic layer to remove the first inorganic layer in the preset region to form a plurality of recess structures, the recess structures exposing the first organic layer, comprises: The performing patterning on the first inorganic layer to remove the first inorganic layer in the preset region to form a plurality of recess structures, the recess structures exposing the first region; The method further comprises, before forming the second organic layer on a side of the signal lines away from the first organic layer: performing patterning on the first inorganic layer again to remove the first inorganic layer at a position corresponding to the second region, the second region being located between adjacent signal lines.

17. The method of manufacturing a display panel according to claim 16, wherein, The first region comprises a first sub-region and a second sub-region located on at least one side of the first sub-region; The forming a plurality of the signal lines in the recess structures comprises: forming a first conductive layer on a side of the first inorganic layer away from the first organic layer and in the recess structures; performing patterning on the first conductive layer to remove the first conductive layer on a side of the first inorganic layer away from the second region and etching the first conductive layer of the second sub-region, so that a side of the first sub-region forms the signal line; wherein a side of the second sub-region forms a discontinuous or continuous conductive part.

18. The method of manufacturing a display panel according to claim 15, wherein, The performing patterning on the first inorganic layer to remove the first inorganic layer in the preset region to form a plurality of recess structures, the recess structures exposing the first organic layer, comprises: The performing patterning on the first inorganic layer to remove the first inorganic layer in the preset region to form a plurality of recess structures, the recess structures exposing the first organic layer, comprises: and / or, the performing patterning on the first inorganic layer to remove the first inorganic layer in the preset region to form a plurality of recess structures, the recess structures extending to the inside of the first organic layer; and / or, the method further comprises, after forming the second organic layer on a side of the signal lines away from the first organic layer: forming a third organic layer on a side of the second organic layer away from the signal lines.

19. The method of manufacturing a display panel according to claim 15, wherein, The display panel comprises a light-emitting region and a non-light-emitting region, and at least part of the signal lines is located in the non-light-emitting region. The patterning of the first inorganic layer, removing the first inorganic layer in the preset region to form a plurality of recessed structures, the recessed structures exposing the first organic layer, comprises: Patterning the first inorganic layer of the light-emitting region to form a plurality of connection vias; Patterning the first inorganic layer of the non-light-emitting region, removing the first inorganic layer in the preset region to form the recessed structures, the recessed structures exposing the first organic layer; Wherein, before the patterning of the first inorganic layer of the non-light-emitting region, further comprising: Thinning the first inorganic layer of the non-light-emitting region to a set thickness; Wherein, the non-light-emitting region comprises a bending region and a connecting region, or the non-light-emitting region comprises a stretchable region and a connecting region; the connecting region is located between the bending region and the light-emitting region, or the connecting region is located between the stretchable region and the light-emitting region; while thinning the first inorganic layer of the non-light-emitting region to a set thickness, further comprising: thinning the first inorganic layer of at least part of the region close to the bending region or the stretchable region of the connecting region to the set thickness, so that in the direction of the non-light-emitting region pointing to the light-emitting region, the first inorganic layer is in the form of an upward step, the first inorganic layer comprises a first step region and a second step region, the thickness of the first inorganic layer in the first step region is less than the thickness of the first inorganic layer in the second step region; Wherein, the first step region is located in the non-light-emitting region, and the second step region is located in the non-light-emitting region; Wherein, the first step region is located between the bending region and the second step region, or the first step region is located in the bending region and the second step region is located between the bending region and the light-emitting region; Or, the first step region is located between the stretchable region and the second step region, or the first step region is located in the stretchable region and the second step region is located between the stretchable region and the light-emitting region; Wherein, the non-light-emitting region further comprises a binding region, and the manufacturing method further comprises: patterning the first inorganic layer to retain at least part of the first inorganic layer of the binding region; In the direction of the bending region or the stretchable region pointing to the binding region, the first inorganic layer is in the form of an upward step, the first inorganic layer comprises a first step region and a second step region, the thickness of the first inorganic layer in the first step region is less than the thickness of the first inorganic layer in the second step region; Wherein, the patterning of the first inorganic layer of the non-light-emitting region, removing the first inorganic layer in the preset region to form the recessed structures, the recessed structures exposing the first organic layer, comprises: Patterning the thinned first inorganic layer, removing the first inorganic layer in the preset region to form recessed structures, the recessed structures exposing the first organic layer; Wherein, the set thickness is greater than or equal to 100 nanometers and less than or equal to 150 nanometers; The first inorganic layer of the first step region comprises an inorganic barrier layer and an inorganic buffer layer; the first inorganic layer of the second step region comprises an inorganic barrier layer and an inorganic buffer layer, and further comprises at least one of a gate insulating layer, a capacitor dielectric layer and an interlayer insulating layer.

20. The method of manufacturing a display panel according to claim 19, wherein, The forming of the plurality of signal lines in the plurality of recessed structures comprises: forming a first conductive layer on a side of the first inorganic layer away from the first organic layer and in the recessed structure; performing patterning on the first conductive layer to obtain the plurality of signal lines; before forming a second organic layer on a side of the signal lines away from the first organic layer, further comprising: forming a first insulating layer on a side of the first conductive layer away from the first organic layer; performing patterning on the first insulating layer to form an opening in the first insulating layer in the non-light-emitting region; wherein a normal projection of the first step region on the first organic layer is located within a normal projection of the opening on the first organic layer, and a normal projection of the second step region on the first organic layer overlaps with the normal projection of the opening on the first organic layer; wherein the performing of the patterning on the first inorganic layer to remove the first inorganic layer at the corresponding position of the second region comprises: performing the patterning on the first inorganic layer to remove the first inorganic layer at the corresponding position of the second region at the same time as performing the patterning on the first insulating layer to form the opening in the first insulating layer in the non-light-emitting region.

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