Power bank

Abstract

The present application discloses a power bank. The power bank comprises a circuit board, a battery cell assembly, and a fan assembly. The battery cell assembly and the circuit board are spaced apart in a first direction, and an interlayer space is formed between the battery cell assembly and the circuit board. The fan assembly is arranged in the interlayer space. On a reference plane perpendicular to the first direction, at least part of the projection of the fan assembly is located in the projections of the circuit board and the battery cell assembly; and the fan assembly is used for dissipating heat from the circuit board and the battery cell assembly at the same time. In this way, the heat dissipation and cooling effects of the power bank can be improved.

Description

A mobile power supply

[0001] The application relates to the technical field of charging, in particular to a mobile power supply.

[0002] In life, people often need to use various electronic products, many of which need to be charged frequently, and mobile power supplies are thus developed. The mobile power supply is convenient to carry, thereby facilitating charging of the electronic products.

[0003] The mobile power supply generates heat during operation, and heat accumulation is not conducive to maintaining the normal working state of the mobile power supply. In the prior art, there is a lack of structural functional design for cooling the mobile power supply.

[0004] The application mainly solves the technical problem of providing a mobile power supply capable of improving the heat dissipation and cooling effect of the mobile power supply.

[0005] To solve the above technical problem, the application adopts the technical scheme of providing a mobile power supply, which comprises a circuit board, a battery cell assembly and a fan assembly. The battery cell assembly and the circuit board are arranged in a spaced manner along a first direction and a sandwiched space is formed between the two. The fan assembly is arranged in the sandwiched space. In a reference plane perpendicular to the first direction, at least part of the projection of the fan assembly is located in the projection of the circuit board and the battery cell assembly; and the fan assembly is used for simultaneously dissipating heat from the circuit board and the battery cell assembly.

[0006] The application has the beneficial effects that, unlike the prior art, the battery cell assembly and the circuit board are arranged in a spaced manner along a first direction and a sandwiched space is formed between the two, the fan assembly is arranged in the sandwiched space, in a reference plane perpendicular to the first direction, at least part of the projection of the fan assembly is located in the projection of the circuit board and the battery cell assembly, and the fan assembly is used for simultaneously dissipating heat from the circuit board and the battery cell assembly. In this way, the air flow speed in the sandwiched space can be improved, the air exchange efficiency between the mobile power supply and the outside can be improved, the heat dissipation and cooling effect of the mobile power supply can be improved, and the structure of the mobile power supply can be more compact, thereby being conducive to improving the volume energy density of the mobile power supply.

[0007] Fig. 1 is an exploded structural schematic view of the mobile power supply embodiment of the application;

[0008] Fig. 2 is a sectional structural schematic view of the mobile power supply embodiment of the application;

[0009] Fig. 3 is a structural schematic view of the mobile power supply embodiment of the application with hidden parts removed;

[0010] ​​​​Fig. 4 is a structural schematic diagram of another hidden part of the mobile power supply embodiment of the present application;

[0011] Fig. 5 is a connection structural schematic diagram of the circuit board and the electric connection plate assembly;

[0012] Fig. 6 is a right view of the structure shown in Fig. 5.

CONCRETE EMBODIMENT

[0013] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0014] The present inventor has found through long-term research that heat is generated when the mobile power supply works, and the heat accumulation is not conducive to maintaining the normal working state of the mobile power supply. In the current technology, there is a lack of structural functional design for cooling the mobile power supply. In order to solve this technical problem, the present application provides the following embodiments.

[0015] As shown in Figs. 1 and 2, the mobile power supply 1 described in the mobile power supply embodiment of the present application includes a circuit board 100, a battery cell assembly 200, and a fan assembly 300. The battery cell assembly 200 and the circuit board 100 are arranged at intervals along a first direction D1 and a sandwiched space 201 is formed between them. The fan assembly 300 is arranged in the sandwiched space 201. Among them, at least part of the projection of the fan assembly 300 on a reference plane perpendicular to the first direction D1 is located within the projection of the circuit board 100 and the battery cell assembly 200. That is, at least part of the projection of the fan assembly 300 on a reference plane perpendicular to the first direction D1 is located within the projection of the circuit board 100 and also within the projection of the battery cell assembly 200. The fan assembly 300 is used to cool the circuit board 100 and the battery cell assembly 200 at the same time. That is, at least part of the projection of the fan assembly 300 on a reference plane perpendicular to the first direction D1 is located within the projection of the circuit board 100 and the battery cell assembly 200 on the reference plane. The fan assembly 300 is used to form an air flow through the sandwiched space 201 for cooling the circuit board 100 and the battery cell assembly 200 at the same time.

[0016] The mobile power supply 1 can be a power bank in particular. The side of the circuit board 100 facing the battery cell assembly 200 can be provided with circuits and various devices 101 to realize functions such as current conversion, circuit control, and circuit protection. The battery cell assembly 200 can be used to store energy. Both the battery cell assembly 200 and the circuit board 100 generate heat when working, and the heat accumulation is not conducive to the normal working of the battery cell assembly 200 and the circuit board 100.

[0017] The fan assembly 300 can be used to promote heat dissipation of the battery cell assembly 200 and the circuit board 100. By arranging the fan assembly 300 such that at least part of the projection of the fan assembly 300 on a reference plane perpendicular to the first direction D1 is located within the projection of the circuit board 100 and the battery cell assembly 200 on the reference plane, the air flow speed in the interlayer space 201 is improved, the air exchange efficiency between the power bank 1 and the outside is improved, the heat dissipation and cooling effect is improved, and the structure of the power bank 1 is more compact, which is beneficial to improve the volume energy density of the power bank 1. By improving the heat dissipation and cooling effect, the power bank 1 can realize full-time non-reduction or prolong the high-power output time, reduce the internal heat accumulation speed of the power bank 1, and thus reduce the probability of local hot spot and high temperature reduction.

[0018] Optionally, as shown in FIGS. 1 and 2, the two main surfaces of the fan assembly 300 are arranged to be opposite to the circuit board 100 and the battery cell assembly 200, respectively. In this way, the size of the fan assembly 300 along the first direction D1 can be reduced, thereby facilitating the reduction of the size of the power bank 1 along the first direction D1.

[0019] By arranging the battery cell assembly 200 and the circuit board 100 to be spaced apart along the first direction D1 and forming the interlayer space 201 therebetween, and arranging the fan assembly 300 in the interlayer space 201, at least part of the projection of the fan assembly 300 on a reference plane perpendicular to the first direction D1 is located within the projection of the circuit board 100 and the battery cell assembly 200. The fan assembly 300 is used to form air flow through the interlayer space 201 for cooling the circuit board 100 and the battery cell assembly 200 at the same time, thereby improving the air flow speed in the interlayer space 201, improving the air exchange efficiency between the power bank 1 and the outside, improving the heat dissipation and cooling effect of the power bank 1, and making the structure of the power bank 1 more compact, which is beneficial to improve the volume energy density of the power bank 1.

[0020] Optionally, as shown in FIGS. 1 to 3, the circuit board 100 extends along the second direction D2. The first direction D1 intersects the second direction D2. The side of the battery cell assembly 200 facing the circuit board 100 has a first region 211 and a second region 221 exposed relative to the interlayer space 201, and the first region 211 and the second region 221 are arranged along the second direction D2. The interlayer space 201 includes a first subspace 202 and a second subspace 203 connected in communication, the first subspace 202 is formed between the first region 211 and the circuit board 100, and the second subspace 203 is formed between the second region 221 and the circuit board 100. The fan assembly 300 is arranged in the first subspace 202 or the second subspace 203, and the fan assembly 300 is used to form air flow through the first subspace 202 and the second subspace 203 for cooling the circuit board 100, the first region 211 and the second region 221 at the same time.

[0021] In this way, the heat dissipation of the battery assembly 200 is more uniform, and the heat dissipation cooling effect is improved.

[0022] Optionally, as shown in FIGS. 1-3, the battery assembly 200 includes a first battery group 210 and a second battery group 220 arranged along a second direction D2. The first battery group 210 and the second battery group 220 are respectively arranged along a first direction D1 and spaced apart from the circuit board 100. A first region 211 is located on the first battery group 210, and a second region 221 is located on the second battery group 220.

[0023] Specifically, the circuit board 100 extends along the second direction D2. The first direction D1 intersects the second direction D2. The battery assembly 200 includes a first battery group 210 and a second battery group 220 arranged along the second direction D2. The first battery group 210 and the second battery group 220 are respectively arranged along the first direction D1 and spaced apart from the circuit board 100. The interlayer space 201 includes a first subspace 202 and a second subspace 203 connected in communication. The first subspace 202 is formed between the first battery group 210 and the circuit board 100, and the second subspace 203 is formed between the second battery group 220 and the circuit board 100. The fan assembly 300 is arranged in the first subspace 202 or the second subspace 203. The fan assembly 300 is configured to form an airflow flowing through the first subspace 202 and the second subspace 203, so as to simultaneously cool the circuit board 100, the first battery group 210, and the second battery group 220.

[0024] The first battery group 210 and the second battery group 220 can each include at least one battery cell. The battery cell is the smallest energy storage unit inside the battery assembly 200.

[0025] By arranging the first battery group 210 and the second battery group 220 respectively, the structure of the battery assembly 200 is more flexible, and the shape of the battery assembly 200 and the circuit board 100 is more matched. By arranging the first subspace 202 and the second subspace 203, when the airflow flows through the first subspace 202, the first battery group 210 and the part of the circuit board 100 opposite to the first battery group 210 are promoted to dissipate heat. When the airflow flows through the second subspace 203, the second battery group 220 and the part of the circuit board 100 opposite to the second battery group 220 are promoted to dissipate heat. Thus, the airflow flow path can fully cover the first battery group 210 and the second battery group 220, and the heat dissipation cooling effect is improved.

[0026] Optionally, as shown in FIGS. 1-3, the power bank 1 further comprises an electric connection plate assembly 400, the circuit board 100 is connected with a first end of the electric connection plate assembly 400, and a second end of the electric connection plate assembly 400 is electrically connected with the first battery pack 210 and the second battery pack 220. The first sub-space 202 and the second sub-space 203 are respectively formed on two sides of the electric connection plate assembly 400, and the electric connection plate assembly 400 is provided with a flow passage 411 between the first end and the second end, and the first sub-space 202 and the second sub-space 203 are communicated through the flow passage 411 in the second direction D2.

[0027] Specifically, the electric connection plate assembly 400 can function as a conduction circuit, and the circuit board 100 is electrically connected with the battery cells in the first battery pack 210 and the second battery pack 220 through the electric connection plate assembly 400. Further, the electric connection plate assembly 400 can be provided with a protection circuit, a balancing circuit, etc. to adjust the working state of the first battery pack 210 and the second battery pack 220.

[0028] The flow passage 411 can be between the first sub-space 202 and the second sub-space 203, and the first sub-space 202 and the second sub-space 203 can be opposite through the flow passage 411. By providing the flow passage 411, the air flow exchange efficiency between the power bank 1 and the outside can be improved. The flow passage 411 is easy to process and form on the electric connection plate assembly 400, which is conducive to improving the assembly efficiency.

[0029] Optionally, as shown in FIGS. 1-3, the first battery pack 210 and the second battery pack 220 are arranged in a spaced manner, and the electric connection plate assembly 400 is between the first battery pack 210 and the second battery pack 220. The electric connection plate assembly 400 comprises a first electric connection plate 410 and a second electric connection plate 420 which are electrically connected. The first electric connection plate 410 is arranged opposite to and electrically connected with the first battery pack 210, and the first electric connection plate 410 further extends into the interlayer space 201 and is electrically connected with the circuit board 100. The second electric connection plate 420 is arranged opposite to and electrically connected with the second battery pack 220. The first sub-space 202 and the second sub-space 203 are respectively formed on two sides of the first electric connection plate 410, and the flow passage 411 is provided on the first electric connection plate 410.

[0030] Specifically, the first electric connection plate 410 can be arranged opposite to and electrically connected with one end of the electrode of the battery cell of the first battery pack 210, and the second electric connection plate 420 can be arranged opposite to and electrically connected with one end of the electrode of the battery cell of the second battery pack 220, and the first electric connection plate 410 and the second electric connection plate 420 are opposite and electrically connected.

[0031] By setting the first and second electric connection plates 410 and 420, the electric cells in the first and second battery groups 210 and 220 can be directly electrically connected with the electric connection plate assembly 400, which is conducive to improving the stability of the circuit structure. The overcurrent channel 411 is arranged on the first electric connection plate 410, which is easy to process and form, and is conducive to improving the assembly efficiency.

[0032] Further, as shown in FIGS. 1-3, in the first direction D1, the size of the first electric connection plate 410 is greater than that of the second electric connection plate 420, and the second electric connection plate 420 can avoid the interlayer space 201.

[0033] Optionally, as shown in FIGS. 3-5, the first electric connection plate 410 includes a plate main body portion 414, an extension portion 412, and a foot portion 413 connected in sequence, the plate main body portion 414 is opposite and electrically connected with the second electric connection plate 420, the extension portion 412 is provided with the overcurrent channel 411, and the foot portion 413 is inserted into the circuit board 100 to be electrically connected with the circuit board 100. Further, the first electric connection plate 410 supports the circuit board 100.

[0034] Optionally, as shown in FIGS. 5 and 6, in the first direction D1, the size L1 of the overcurrent channel 411 ranges from 2-10 mm. For example, in the first direction D1, the size L1 of the overcurrent channel 411 is 3 mm, 4 mm, 5 mm, 6 mm, or 8 mm.

[0035] In this way, sufficient airflow between the first and second subspaces 202 and 203 can be ensured, and the mobile power supply 1 can maintain a small size.

[0036] Optionally, as shown in FIGS. 2-5, the mobile power supply 1 includes a support member 600, the support member 600 is provided with a receiving groove 610, the electric cell assembly 200, the second electric connection plate 420, and the plate main body portion 414 are arranged in the receiving groove 610, a bottom wall of the receiving groove 610 is arranged between the plate main body portion 414 and the circuit board 100, the bottom wall of the receiving groove 610 is provided with an avoiding hole 613, and the extension portion 412 is arranged in the avoiding hole 613.

[0037] Optionally, as shown in FIGS. 2-4, the mobile power supply further includes a support member 600, the support member 600 covers the first and second battery groups 210 and 220. In the first direction D1, the part of the support member 600 covering the second battery group 220 is sunken compared to the part of the support member 600 covering the first battery group 210, so as to form a recessed portion 221, and the fan assembly 300 is arranged in the recessed portion 221.

[0038] Correspondingly, the side of the second battery group 220 facing the circuit board 100 is sunken compared to the side of the first battery group 210 facing the circuit board 100. Correspondingly, the side of the second battery group 220 facing the circuit board 100 is sunken compared to the side of the first battery group 210 facing the circuit board 100.

[0039] In this way, the fan assembly 300 can overlap the first battery pack 210 in the first direction D1, which is conducive to reducing the size of the power bank 1 in the first direction D1, so that the power bank 1 remains small in size.

[0040] Further, the fan assembly 300 can be arranged on the side of the second battery pack 220 facing the circuit board 100.

[0041] Optionally, as shown in FIG. 3, the number of devices 101 on the portion of the circuit board 100 opposite the first battery pack 210 is less than the number of devices 101 on the portion opposite the second battery pack 220.

[0042] The heat generated by the devices 101 is concentrated, and in this way, the fan assembly 300 can be arranged closer to the portion of the circuit board 100 with more devices 101, improving the cooling effect.

[0043] Optionally, as shown in FIG. 2, the size L2 of the first sub-space 202 in the first direction D1 ranges from 2-15mm. For example, the size L2 of the first sub-space 202 in the first direction D1 is 3mm, 4mm, 5mm, 6mm, 8mm, 10mm, 12mm, or 14mm.

[0044] In this way, the heat interference between the circuit board 100 and the battery assembly 200 can be reduced, promoting cooling, and the power bank 1 can remain small in size.

[0045] Further, the size L2 of the first sub-space 202 in the first direction D1 is less than the size of the second sub-space 203.

[0046] Optionally, as shown in FIGS. 2-4, the power bank 1 further includes a housing 500 and a support 600, the housing 500 is provided with a receiving cavity 501, the circuit board 100, the battery assembly 200, the fan assembly 300, and the support 600 are received in the receiving cavity 501. The housing 500 includes a bottom wall portion 510, and the support 600 abuts between the circuit board 100 and the bottom wall portion 510. The support 600 is provided with a receiving groove 610 having an opening facing the bottom wall portion 510, and the first battery pack 210 and the second battery pack 220 are received in the receiving groove 610. The bottom wall of the receiving groove 610 is provided with a first opening 611 and a second opening 612, the first battery pack 210 is exposed to the first sub-space 202 through the first opening 611, and the second battery pack 220 is exposed to the second sub-space 203 through the second opening 612.

[0047] By setting the support member 600, the first battery pack 210 and the second battery pack 220 can be positioned, and the circuit board 100 can also be positioned, so that the structural stability inside the mobile power supply 1 can be improved. Specifically, the support member 600 can play a cladding role on the first battery pack 210 and the second battery pack 220, so that the first battery pack 210 and the second battery pack 220 are limited in the accommodation groove 610.

[0048] The circuit board 100 is limited on the side of the support member 600 away from the accommodation groove 610. Alternatively, the side of the support member 600 away from the accommodation groove 610 is provided with a support portion 601 and a buckle portion 602, and the circuit board 100 is fixed between the support portion 601 and the buckle portion 602 along the first direction D1. Further, the circuit board 100 can be fixed on the support portion 601 by a threaded fastener.

[0049] By setting the first opening 611 exposed to the first sub-space 202 and the second opening 612 exposed to the second sub-space 203, the first battery pack 210 and the second battery pack 220 can be facilitated to dissipate heat.

[0050] Alternatively, as shown in FIG. 2, the fan assembly 300 is mounted on the support member 600.

[0051] Alternatively, as shown in FIG. 2, the housing 500 includes a bottom wall portion 510 and a side wall portion 520 integrally connected.

[0052] Alternatively, as shown in FIG. 1 and FIG. 2, the mobile power supply 1 further includes a face cover 530 and an upper shell 540, the housing 500 has an opening communicating with the accommodation cavity 501, the upper shell 540 is arranged on the opening to close the accommodation cavity 501, and the face cover 530 is arranged on the side of the upper shell 540 away from the housing 500 to make the surface of the mobile power supply 1 smooth. The circuit board 100 is limited between the upper shell 540 and the support member 600.

[0053] Alternatively, as shown in FIG. 2 and FIG. 4, the mobile power supply 1 further includes a housing 500, the housing 500 is provided with an accommodation cavity 501, the circuit board 100, the cell assembly 200 and the fan assembly 300 are accommodated in the accommodation cavity 501, and the housing 500 is provided with an air inlet 502 and an air outlet 503 communicating with the interlayer space 201. The air inlet 502 and the air outlet 503 are respectively arranged on opposite sides of the housing 500 and are arranged in a staggered manner, or the air inlet 502 and the air outlet 503 are arranged on the same side of the housing 500.

[0054] Further, the air inlet 502 and the air outlet 503 are respectively arranged close to the two ends of the housing 500 to increase the spacing distance of the air inlet 502 and the air outlet 503.

[0055] The interlayer space 201 can exchange air flow with the outside through the air inlet 502 and the air outlet 503, so as to realize heat dissipation and cooling of the circuit board 100 and the battery cell assembly 200. By arranging the air inlet 502 and the air outlet 503 at the two ends of the shell 500 respectively and staggered, it is beneficial to cover more areas in the interlayer space 201 by the air flow path, and improve the heat dissipation and cooling effect.

[0056] Optionally, the air inlet 502 is in a grid shape.

[0057] Further, the air inlet 502 and the air outlet 503 are arranged at the two ends of the shell 500 along the second direction D2 respectively.

[0058] Further, the air inlet 502 is communicated with the first sub-space 202, the air outlet 503 is communicated with the second sub-space 203, and the fan assembly 300 is arranged in the second sub-space 203. When the fan assembly 300 works, the air flow can enter the first sub-space 202 from the air inlet 502, then enter the second sub-space 203 from the flow passage 411, and then flow out to the outside from the air outlet 503.

[0059] Optionally, as shown in FIG. 2 and FIG. 4, the fan assembly 300 has an air inlet 301 and an air outlet 302, and the air inlet 301 is arranged towards the circuit board 100 or the battery cell assembly 200. The shell 500 includes a side wall part 520, which is used to surround the circuit board 100 and the battery cell assembly 200 to form the interlayer space 201. The air inlet 502 and the air outlet 503 are arranged at opposite sides of the side wall part 520 respectively, and the air inlet 502 and the air outlet 503 are arranged staggered, or the air inlet 502 and the air outlet 503 are arranged at the same side of the side wall part 520 with a spacing. The air inlet 502 and the air outlet 503 are arranged opposite to the interlayer space 201 respectively, and the air outlet 302 is arranged opposite to the air outlet 503.

[0060] Further, the air inlet 502 and the air outlet 503 are arranged close to the two ends of the side wall part 520 respectively, so as to increase the spacing distance of the air inlet 502 and the air outlet 503.

[0061] By arranging the air inlet 301 towards the circuit board 100 or the battery cell assembly 200, it is beneficial to improve the heat dissipation effect. By arranging the air inlet 502 and the air outlet 503 opposite to the interlayer space 201 respectively, and arranging the air outlet 302 opposite to the air outlet 503, it is beneficial to increase the air flow in the interlayer space 201, and promote heat dissipation.

[0062] Optionally, as shown in FIG. 2 and FIG. 4, the side wall part 520 has two first side walls 521 and two second side walls 522, the first side walls 521 and the second side walls 522 are connected alternately to form a cylindrical shape, the two first side walls 521 are oppositely arranged and extend along the second direction D2, the air inlet 502 and the air outlet 503 are arranged on the two first side walls 521 respectively, or the air inlet 502 and the air outlet 503 are arranged on one first side wall 521 at intervals.

[0063] Optionally, the air inlet 301 is arranged on the main surface of the fan assembly 300 to obtain a larger air inlet area.

[0064] In some embodiments, the fan assembly 300 has two air inlets 301, and the two air inlets 301 are arranged to face the circuit board 100 and the cell assembly 200 respectively.

[0065] Further, the air inlet 502 communicates with the first sub-space 202, the air outlet 503 communicates with the second sub-space 203, and the fan assembly 300 is arranged in the second sub-space 203. When the fan assembly 300 works, the airflow can enter the first sub-space 202 from the air inlet 502, then enter the second sub-space 203 from the airflow passage 411, then enter the air inlet 301, flow out from the air outlet 302, and finally flow out to the outside from the air outlet 503.

[0066] In summary, the embodiment can improve the airflow flow speed in the interlayer space 201, improve the airflow exchange efficiency between the power bank 1 and the outside, improve the cooling effect, and make the structure of the power bank 1 more compact, which is conducive to improving the volume energy density of the power bank 1.

[0067] The above description is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which is based on the content of the specification and drawings, is also included in the patent protection scope of the present application.

Claims

1. A mobile power supply, characterized by, The mobile power supply comprises: a circuit board; a battery assembly, which is spaced apart from the circuit board along a first direction and a sandwich space is formed between the circuit board and the battery assembly; a fan assembly arranged in the sandwich space; wherein, in a reference plane perpendicular to the first direction, at least part of the projection of the fan assembly is located in the projection of the circuit board and the battery assembly; the fan assembly is used to cool the circuit board and the battery assembly at the same time.

2. The mobile power supply according to claim 1, wherein: the circuit board extends along a second direction; wherein the first direction intersects the second direction; a side of the battery assembly facing the circuit board has a first region and a second region exposed relative to the sandwich space, the first region and the second region are arranged along the second direction; the sandwich space comprises a first subspace and a second subspace connected in communication, the first subspace is formed between the first region and the circuit board, and the second subspace is formed between the second region and the circuit board; the fan assembly is arranged in the first subspace or the second subspace, and the fan assembly is used to form an airflow flowing through the first subspace and the second subspace for cooling the circuit board, the first region and the second region at the same time.

3. The mobile power supply according to claim 2, wherein: the battery assembly comprises a first battery group and a second battery group arranged along the second direction; the first battery group and the second battery group are respectively spaced apart from the circuit board along the first direction; the first region is located on the first battery group, and the second region is located on the second battery group; the mobile power supply further comprises an electric connection plate assembly, the circuit board is connected with a first end of the electric connection plate assembly, a second end of the electric connection plate assembly is electrically connected with the first battery group and the second battery group; the first subspace and the second subspace are respectively formed on both sides of the electric connection plate assembly, and the electric connection plate assembly is provided with a flow-through channel between the first end and the second end, and the first subspace and the second subspace are communicated through the flow-through channel in the second direction.

4. The mobile power supply according to claim 3, wherein: the first battery group and the second battery group are spaced apart, and the electric connection plate assembly is between the first battery group and the second battery group; the electric connection plate assembly comprises a first electric connection plate and a second electric connection plate electrically connected; the first electric connection plate is arranged opposite to the first battery group and electrically connected, and the first electric connection plate further extends into the sandwich space and is electrically connected with the circuit board; the second electric connection plate is arranged opposite to the second battery group and electrically connected; the first subspace and the second subspace are respectively formed on both sides of the first electric connection plate, and the flow-through channel is arranged in the first electric connection plate.

5. The mobile power supply according to claim 3, wherein: the size of the flow-through channel in the first direction ranges from 2mm to 10mm.

6. The mobile power supply of claim 3, wherein: the mobile power supply further comprises a support member covering the first battery pack and the second battery pack; in the first direction, a portion of the support member covering the second battery pack is sunken compared to a portion of the support member covering the first battery pack to form a recess, and the fan assembly is disposed in the recess.

7. The mobile power supply of claim 6, wherein: the mobile power supply further comprises a housing provided with a receiving cavity, and the circuit board, the cell assembly, the fan assembly and the support member are received in the receiving cavity; the housing comprises a bottom wall portion, and the support member abuts between the circuit board and the bottom wall portion; the support member is provided with a receiving slot having an opening facing the bottom wall portion, and the first battery pack and the second battery pack are received in the receiving slot; a bottom wall of the receiving slot is provided with a first opening and a second opening, and the first battery pack is exposed to the first sub-space through the first opening, and the second battery pack is exposed to the second sub-space through the second opening.

8. The mobile power supply of claim 2, wherein: in the first direction, the size of the first sub-space ranges from 2 mm to 15 mm.

9. The mobile power supply of claim 1, wherein: the mobile power supply further comprises a housing provided with a receiving cavity, and the circuit board, the cell assembly and the fan assembly are received in the receiving cavity; the housing is provided with an air inlet and an air outlet communicating with the interlayer space; the air inlet and the air outlet are respectively provided on opposite sides of the housing and are misaligned, or are respectively provided on the same side of the housing and are spaced apart.

10. The mobile power supply of claim 9, wherein: the fan assembly has an air inlet and an air outlet, and the air inlet is disposed towards the circuit board or the cell assembly; the housing comprises a side wall portion for surrounding the circuit board and the cell assembly to form the interlayer space; the air inlet and the air outlet are respectively provided on opposite sides of the side wall portion and are misaligned, or are respectively provided on the same side of the side wall portion and are spaced apart; and the air inlet and the air outlet are respectively disposed opposite the interlayer space, and the air outlet is disposed opposite the air outlet.

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