Manipulator control method and semiconductor process device

Abstract

A manipulator control method, comprising: acquiring a motion path of a manipulator moving from a preset start point to a preset end point in a semiconductor process device, wherein the motion path comprises a plurality of sections sequentially connected from the preset start point to the preset end point, and the semiconductor process device is provided with bearing portions or sensors on some sections among the plurality of sections; and controlling the manipulator to sequentially pass through the sections, and controlling the rate of the manipulator passing through a section not provided with the bearing portion or the sensor to be greater than the rate of the manipulator passing through a section provided with the bearing portion or the sensor. Therefore, the manipulator can be controlled to move at a high rate at the position distant from the bearing portion or the sensor, thereby improving the moving efficiency of a target component such as a wafer, and the manipulator can be controlled to move at a low rate at the position close to the bearing portion or the sensor, thereby ensuring normal detection of the sensor while reducing the position offset of the wafer. Also provided is a semiconductor process device.

Description

A manipulator control method and semiconductor process equipment Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a manipulator control method and semiconductor process equipment. Background Art

[0002] Robots are widely used in semiconductor process equipment. For example, a vacuum robot can be used to move a wafer from outside the process chamber to inside the process chamber and place it on support pins at corresponding positions inside the process chamber, so that the wafer can be supported by the support pins for processing such as etching or deposition. After completing the processing such as etching or deposition, the vacuum robot can also be used to grab the wafer on the support pins and move the wafer from inside the process chamber to outside the process chamber. However, current semiconductor process equipment often has problems with low wafer movement efficiency or large wafer position offset, which affects the processing effect of the semiconductor process equipment. Summary of the Invention

[0003] The present application discloses a robot control method and semiconductor process equipment to solve the problems of low wafer movement efficiency and large wafer position deviation.

[0004] In a first aspect, the present application discloses a robot control method, comprising: obtaining a motion path of the robot from a preset starting point to a preset end point in a semiconductor process equipment; wherein the motion path includes a plurality of sections sequentially connected in a direction from the preset starting point to the preset end point, and the semiconductor process equipment is provided with a bearing portion or a sensor on some of the plurality of sections;

[0005] The manipulator is controlled to pass through each of the sections in sequence, and the speed at which the manipulator passes through the section without the carrying part or the sensor is controlled to be greater than the speed at which the manipulator passes through the section with the carrying part or the sensor.

[0006] In some embodiments, the plurality of sections include a first section, a second section, and a third section; the semiconductor process equipment is provided with the carrier or the sensor in the second section; and controlling the speed at which the robot passes through each of the sections includes:

[0007] The manipulator is controlled to pass through the first section at a first set rate, the second section at a second set rate, and the third section at a third set rate in sequence; wherein the first set rate and the third set rate are both greater than the second set rate.

[0008] In some embodiments, the first road section includes a first sub-section and a second sub-section connected in sequence, and controlling the manipulator to pass through the first road section at a first set rate includes: controlling the manipulator to pass through the first sub-section and the second sub-section in sequence, and controlling the manipulator to accelerate to the first set rate with a first acceleration and then move at a constant speed at the first set rate in the process of passing through the first sub-section, and controlling the manipulator to decelerate to the second set rate with a first deceleration in the process of passing through the second sub-section; wherein the intersection position of the first sub-section and the second sub-section can be determined according to the first set rate, the second set rate and the first deceleration.

[0009] In some embodiments, the third section includes a third sub-section and a fourth sub-section connected in sequence, and controlling the manipulator to pass through the third section at a third set rate includes: controlling the manipulator to pass through the third sub-section and the fourth sub-section in sequence, and controlling the manipulator to accelerate to the third set rate with a second acceleration and then move at a constant speed at the third set rate in the process of passing through the third sub-section; controlling the manipulator to decelerate at a second deceleration in the process of passing through the fourth sub-section; wherein the intersection position of the third sub-section and the fourth sub-section can be determined according to the third set rate, the preset rate of the manipulator at the end position of the fourth sub-section and the second deceleration.

[0010] In some embodiments, if the second section is provided with a carrying portion, and the robot grabs the target component on the carrying portion in the second section, the third set rate is less than the first set rate; the target component includes a wafer; if the second section is provided with a carrying portion, and the robot places the target component it carries on the carrying portion in the second section, the third set rate is greater than the first set rate; if the second section is provided with a sensor, the third set rate is less than the first set rate.

[0011] In some embodiments, the motion path also includes a fourth section, a fifth section and a sixth section connected in sequence to the third section, and the manipulator control method also includes: controlling the manipulator to pass through the fourth section at a fourth set rate, the fifth section at a fifth set rate and the sixth section at a sixth set rate in sequence; the fourth set rate and the sixth set rate are both greater than the fifth set rate; wherein, if the second section is a section with a load-bearing part, the fifth section is a section with a sensor, and if the second section is a section with a sensor, the fifth section is a section with a load-bearing part.

[0012] In some embodiments, the fourth section includes a fifth sub-section and a sixth sub-section connected in sequence, and controlling the manipulator to pass through the fourth section at a fourth set rate includes: controlling the manipulator to pass through the fifth sub-section and the sixth sub-section in sequence, and controlling the manipulator to accelerate to the fourth set rate with a third acceleration and then move at a constant speed at the fourth set rate in the process of passing through the fifth sub-section; controlling the manipulator to decelerate to the fifth set rate with a third deceleration in the process of passing through the sixth sub-section; wherein the intersection position of the fifth sub-section and the sixth sub-section can be determined according to the fourth set rate, the fifth set rate and the third deceleration.

[0013] In some embodiments, the sixth section includes a seventh sub-section and an eighth sub-section connected in sequence, and controlling the manipulator to pass through the sixth section at a sixth set rate includes: controlling the manipulator to pass through the seventh sub-section and the eighth sub-section in sequence, and controlling the manipulator to accelerate to the sixth set rate with a fourth acceleration and then move at a constant speed at the sixth set rate in the process of passing through the seventh sub-section, and controlling the manipulator to decelerate at a fourth deceleration in the process of passing through the eighth sub-section; wherein the intersection position of the seventh sub-section and the eighth sub-section can be determined according to the sixth set rate, the preset rate of the manipulator at the end position of the eighth sub-section and the fourth deceleration.

[0014] In some embodiments, if the fifth section is provided with a carrying portion, and the robot places the target component it carries on the carrying portion in the fifth section, the sixth set rate is greater than the fourth set rate; if the fifth section is provided with a sensor, the sixth set rate is less than the fourth set rate.

[0015] In some embodiments, the bearing portion or the sensor is arranged in the middle of the second section, or the bearing portion or the sensor is arranged in the middle of the fifth section, and the range of the second section or the fifth section is 3mm to 5mm.

[0016] On the second aspect, the present application also discloses a semiconductor process equipment, including a manipulator and a control system, the control system including at least one memory and at least one processor, the memory storing a computer program, the processor executing the computer program to implement the above-mentioned manipulator control method disclosed in the present application.

[0017] The robot control method and the semiconductor processing equipment disclosed in the present application first acquire a movement path of a robot from a preset starting point to a preset ending point in a semiconductor processing equipment, wherein the movement path comprises a plurality of segments connected in sequence from the preset starting point to the preset ending point, and the semiconductor processing equipment is provided with a bearing part or a sensor in some of the plurality of segments, and then controls the speed of the robot through each segment. The speed of the robot through the segment without the bearing part or the sensor is greater than the speed of the robot through the segment with the bearing part or the sensor, so that the robot carrying a target component such as a wafer can not only move at a faster speed away from the bearing part (such as a support needle) or the sensor to improve the moving efficiency of the target component and the processing efficiency of the semiconductor processing equipment, but also move at a slower speed close to the bearing part (such as a support needle) or the sensor to ensure normal detection of the sensor while reducing the position deviation of the target component. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the drawings needed to be used in the embodiments of the present application or the background art will be described below.

[0019] FIG. 1 is a structural schematic diagram of a semiconductor processing equipment.

[0020] FIG. 2a is a flowchart of a robot control method disclosed in an embodiment of the present application.

[0021] FIG. 2b is a flowchart of a robot control method disclosed in another embodiment of the present application.

[0022] FIG. 3 is a schematic diagram of each position on a movement path of a robot disclosed in some embodiments of the present application.

[0023] FIG. 4 is a schematic diagram of each position on a movement path of a robot disclosed in some other embodiments of the present application.

[0024] FIG. 5 is a schematic diagram of each position on a movement path of a robot disclosed in some other embodiments of the present application.

[0025] FIG. 6 is a schematic diagram of each position on a movement path of a robot disclosed in some other embodiments of the present application.

[0026] FIG. 7 is a schematic diagram of each position on a movement path of a robot disclosed in some other embodiments of the present application.

[0027] FIG. 8 is a variation curve diagram of a movement speed of a robot disclosed in some embodiments of the present application.

[0028] FIG. 9 is a schematic diagram of each position on a movement path of a robot disclosed in some other embodiments of the present application.

[0029] FIG. 10 is a schematic diagram of positions on a movement path of a robot according to some embodiments of the present application.

[0030] FIG. 11 is a graph of a change curve of a movement speed of a robot according to some embodiments of the present application.

[0031] FIG. 12 is a schematic diagram of positions on a movement path of a robot according to some embodiments of the present application.

[0032] FIG. 13 is a graph of a change curve of a movement speed of a robot according to some embodiments of the present application.

[0033] FIG. 14 is a schematic diagram of positions on a movement path of a robot according to some embodiments of the present application.

[0034] FIG. 15 is a schematic diagram of positions on a movement path of a robot according to some embodiments of the present application.

[0035] FIG. 16 is a schematic diagram of positions on a movement path of a robot according to some embodiments of the present application.

[0036] FIG. 17 is a graph of a change curve of a movement speed of a robot according to some embodiments of the present application.

[0037] FIG. 18 is a schematic diagram of positions on a movement path of a robot according to some embodiments of the present application.

[0038] FIG. 19 is a graph of a change curve of a movement speed of a robot according to some embodiments of the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0040] In the process of working of a semiconductor process equipment, as shown in FIG. 1, first, a vacuum robot 10 is controlled to move from a position M1 outside a process chamber 12 to a position M2 inside the process chamber 12, so as to move a wafer 11 carried thereby from outside the process chamber 12 to inside the process chamber 12, and then the vacuum robot 10 is controlled to move from the position M2 inside the process chamber 12 to a position M4, so as to place the wafer 11 carried thereby on a support needle 13 at a position M3 between the positions M2 and M4, to support the wafer 11 by the support needle 13 for a processing process such as etching or deposition.

[0041] After the etching or deposition process is completed, the vacuum manipulator 10 can also be controlled to move from the M4 position inside the process chamber 12 to the M2 position to pick up the wafer 11 placed on the support needle 13 at the M3 position when passing through the M3 position between the M2 position and the M4 position, and then the vacuum manipulator 10 is controlled to move from the M2 position inside the process chamber 12 to the M1 position outside the process chamber 12 to move the wafer 11 carried thereby from inside the process chamber 12 to outside the process chamber 12.

[0042] However, the applicant found that because the current vacuum manipulator 10 moves at a constant speed, in the case where the moving speed of the vacuum manipulator 10 is slow, the moving efficiency of the wafer 11 is low, thereby reducing the processing efficiency of the semiconductor process equipment; in the case where the moving speed of the vacuum manipulator 10 is fast, the wafer 11 will vibrate, thereby causing a large positional deviation of the wafer 11, and the vacuum manipulator 10 cannot accurately place or pick up the wafer 11, affecting the processing effect of the semiconductor process equipment.

[0043] Although the positioning sensor 14 can be used to calibrate the position of the wafer 11 placed or picked up by the vacuum manipulator 10, which can be an active wafer centering (AWC) sensor, it can only calibrate the case where the positional deviation is small, and cannot calibrate the case where the positional deviation is large. Moreover, if the moving speed of the vacuum manipulator 10 is too fast, the positioning sensor will abnormally detect, and cannot calibrate the case where the positional deviation is small.

[0044] Therefore, the present application discloses a control scheme of a manipulator, which controls the vacuum manipulator 10 to carry the wafer 11 to move at a faster speed away from the support needle or the positioning sensor, to improve the moving efficiency of the wafer 11, and controls the vacuum manipulator 10 to carry the wafer 11 to move at a slower speed close to the support needle or the positioning sensor, to reduce the positional deviation of the wafer 11 while ensuring normal detection of the positioning sensor. Specifically, referring to FIG. 2a, the manipulator control method disclosed by the present application embodiment comprises:

[0045] S10: obtaining a moving path of the manipulator moving from a preset starting point to a preset ending point in the semiconductor process equipment; wherein the moving path comprises a plurality of segments connected in sequence from the preset starting point to the preset ending point, and the semiconductor process equipment is provided with a carrier or a sensor in some of the plurality of segments;

[0046] S20: controlling the manipulator to pass through each segment in sequence, and the speed of the manipulator passing through the segment not provided with the carrier or the sensor is greater than the speed of the manipulator passing through the segment provided with the carrier or the sensor.

[0047] The robot control method of the embodiments of the present application can not only control the robot to carry the target component such as a wafer to move at a faster speed away from the bearing part (such as a support pin) or the sensor, thereby improving the moving efficiency of the target component such as a wafer and the processing efficiency of the semiconductor processing equipment, but also control the robot to carry the target component such as a wafer to move at a slower speed close to the bearing part (such as a support pin) or the sensor, thereby reducing the position deviation of the target component such as a wafer while ensuring the normal detection of the sensor.

[0048] As another embodiment of the present application, the robot includes but is not limited to the vacuum robot 10 of the semiconductor processing equipment shown in FIG. 1. As shown in FIG. 2b, the robot control method includes:

[0049] S101: Obtain a movement path of the robot moving from a preset starting point to a preset ending point in the semiconductor processing equipment.

[0050] The movement path includes a first section, a second section and a third section connected in sequence from the preset starting point to the preset ending point. The semiconductor processing equipment is provided with a bearing part or a sensor in the second section. For example, the bearing part is used to bear the target component carried by the robot, and the sensor is used to detect the target component on the robot.

[0051] S102: Control the robot to pass through the first section at a first set speed, pass through the second section at a second set speed, and pass through the third section at a third set speed in sequence. The first set speed and the third set speed are both greater than the second set speed.

[0052] In some embodiments of the present application, as shown in FIG. 3, the bearing part includes a support pin 13, which is specifically a Pin pin, and the sensor includes a positioning sensor 14. It should be noted that, as shown in FIG. 3, at least two positioning sensors 14 are generally provided in the semiconductor processing equipment, and the at least two positioning sensors 14 are arranged on both sides of the inlet of the process chamber 12 to detect the position of the target component such as a wafer 11 carried by the vacuum robot 10 passing through the inlet of the process chamber 12.

[0053] In some embodiments of the present application, as shown in FIG. 3, the third position P3 can be the position of the positioning sensor 14. In some embodiments, as shown in FIG. 3, the first position P1 is a position outside the process chamber 12, the fifth position P5 is a position inside the process chamber 12, the second position P2 is located between the first position P1 and the third position P3, and the fourth position P4 is located between the third position P3 and the fifth position P5, i.e., the first position P1 to the fifth position P5 are arranged in sequence in the first direction (i.e., the direction opposite to the X direction).

[0054] The first position P1 and the fifth position P5 can be respectively a preset starting position and a preset ending position of the vacuum manipulator 10 moving in the first direction (i.e., a direction opposite to the X direction). The first section is a section between the first position P1 (i.e., a position outside the process chamber 12) and the second position P2, the second section is a section between the second position P2 and the fourth position P4, and the third section is a section between the fourth position P4 and the fifth position P5 (i.e., a position inside the process chamber 12).

[0055] Of course, the present application is not limited thereto. In another embodiment, as shown in FIG. 4, the first position P1 can also be a position inside the process chamber 12, and the fifth position P5 can also be a position outside the process chamber 12, and the first position P1 to the fifth position P5 are arranged in the second direction (i.e., a direction same as the X direction) in sequence, in the case that the third position P3 is a position of the positioning sensor 14.

[0056] The first position P1 and the fifth position P5 can be respectively a preset starting position and a preset ending position of the vacuum manipulator 10 moving in the second direction (i.e., a direction same as the X direction). The first section is a section between the first position P1 (i.e., a position inside the process chamber 12) and the second position P2, the second section is a section between the second position P2 and the fourth position P4, and the third section is a section between the fourth position P4 and the fifth position P5 (i.e., a position outside the process chamber 12).

[0057] Taking the vacuum manipulator 10 as the manipulator, the wafer 11 as the target component, and the support pin 13 as the bearing part as an example, in some embodiments, as shown in FIG. 3, in the process of controlling the vacuum manipulator 10 to move the wafer 11 inside the process chamber 12, first, the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the first section (i.e., from the first position P1 such as a position outside the process chamber 12 to the second position P2) at a first set speed, then the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the second section (i.e., from the second position P2 to the third position P3 such as a position of the positioning sensor 14 at a constant speed) at a second set speed, and from the third position P3 (such as a position of the positioning sensor 14) to the fourth position P4 at a constant speed, then the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the third section (i.e., from the fourth position P4 to the fifth position P5 such as a position inside the process chamber 12) at a third set speed.

[0058] In some embodiments, as shown in FIG. 4, during the process of controlling the vacuum robot 10 to move the wafer 11 outside the process chamber 12, first, the vacuum robot 10 carries the wafer 11 to move through a first path segment (i.e., from a first position P1, such as a position inside the process chamber 12, to a second position P2) at a first set speed, then the vacuum robot 10 carries the wafer 11 to move through a second path segment (i.e., from the second position P2 to a third position P3, such as a position of the positioning sensor 14, at a constant speed) and from the third position P3 (such as a position of the positioning sensor 14) to a fourth position P4 at a constant speed, then the vacuum robot 10 carries the wafer 11 to move through a third path segment (i.e., from the fourth position P4 to a fifth position P5, such as a position outside the process chamber 12) at a third set speed.

[0059] Because the first set speed and the third set speed are both greater than the second set speed, and the second position P2 is closer to the third position P3 than the first position P1, and the fourth position P4 is closer to the third position P3 than the fifth position P5, not only can the vacuum robot 10 be controlled to carry the wafer 11 to move at the third set speed or the first set speed away from the position of the positioning sensor 14 to improve the moving efficiency of the wafer 11 and the processing efficiency of the semiconductor processing equipment, but also can the vacuum robot 10 be controlled to carry the wafer 11 to move at the second set speed close to the position of the positioning sensor 14 to reduce the position deviation of the wafer 11 while ensuring the normal detection of the positioning sensor 14.

[0060] In some embodiments of the present application, the third position P3 can also be a position of a carrying part, such as the support needle 13. In some embodiments, as shown in FIG. 5, the first position P1 is a position below the carrying part, such as the support needle 13, and the fifth position P5 is a position above the carrying part, such as the support needle 13, and the first position P1 to the fifth position P5 are arranged in sequence in the third direction (i.e., the same direction as the Y direction).

[0061] In some embodiments, as shown in FIG. 5, the first position P1 and the fifth position P5 can be respectively a position of a preset starting point and a position of a preset ending point of the movement of the vacuum robot 10 in the third direction (i.e., the same direction as the Y direction). The first path segment is a path segment between the first position P1 (i.e., the position below the carrying part, such as the support needle 13) and the second position P2, the second path segment is a path segment between the second position P2 and the fourth position P4, and the third path segment is a path segment between the fourth position P4 and the fifth position P5 (i.e., the position above the carrying part, such as the support needle 13).

[0062] Of course, the present application is not limited thereto, and in the case where the third position P3 is a position above the carrier such as the support needle 13, in other embodiments, as shown in FIG. 6, the first position P1 can also be a position above the carrier such as the support needle 13, and the fifth position P5 can also be a position below the carrier such as the support needle 13, and the first position P1 to the fifth position P5 are arranged in the fourth direction (i.e., the direction opposite to the Y direction) in sequence.

[0063] wherein the first position P1 and the fifth position P5 can be respectively a position of a preset starting point and a position of a preset ending point of the movement of the vacuum manipulator 10 in the fourth direction (i.e., the direction opposite to the Y direction). The first section is a section between the first position P1 (i.e., the position above the carrier such as the support needle 13) and the second position P2, the second section is a section between the second position P2 and the fourth position P4, and the third section is a section between the fourth position P4 and the fifth position P5 (i.e., the position below the carrier such as the support needle 13).

[0064] For example, taking the manipulator as the vacuum manipulator 10, the target component as the wafer 11, and the carrier as the support needle 13, in some embodiments, as shown in FIG. 5, in the process of controlling the vacuum manipulator 10 to place the wafer 11 on the support needle 13, first, the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the first section at a first set speed (i.e., to move from the first position P1 (e.g., the position below the support needle 13) to the second position P2), then the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the second section at a second set speed (i.e., to move from the second position P2 to the third position P3 (e.g., the position of the support needle 13) at a constant speed), and place the wafer 11 carried thereby on the support needle 13, then the vacuum manipulator 10 is controlled to move from the third position P3 (e.g., the position of the support needle 13) to the fourth position P4 at a constant speed, and then the vacuum manipulator 10 is controlled to pass through the third section at a third set speed (i.e., to move from the fourth position P4 to the fifth position P5 (e.g., the position above the support needle 13)).

[0065] For example, taking the manipulator as the vacuum manipulator 10, the target component as the wafer 11, and the carrier as the support needle 13, in some embodiments, as shown in FIG. 5, in the process of controlling the vacuum manipulator 10 to place the wafer 11 on the support needle 13, first, the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the first section at a first set speed (i.e., to move from the first position P1 (e.g., the position below the support needle 13) to the second position P2), then the vacuum manipulator 10 is controlled to carry the wafer 11 to pass through the second section at a second set speed (i.e., to move from the second position P2 to the third position P3 (e.g., the position of the support needle 13) at a constant speed), and place the wafer 11 carried thereby on the support needle 13, then the vacuum manipulator 10 is controlled to move from the third position P3 (e.g., the position of the support needle 13) to the fourth position P4 at a constant speed, and then the vacuum manipulator 10 is controlled to pass through the third section at a third set speed (i.e., to move from the fourth position P4 to the fifth position P5 (e.g., the position above the support needle 13)).

[0066] Because the first set speed and the third set speed are both greater than the second set speed, and the second position P2 is closer to the third position P3 than the first position P1, and the fourth position P4 is closer to the third position P3 than the fifth position P5, not only can the vacuum manipulator 10 be controlled to carry the wafer 11 to move at the third set speed or the first set speed away from the support needle 13 to improve the moving efficiency of the wafer 11 and the processing efficiency of the semiconductor processing equipment, but also can the vacuum manipulator 10 be controlled to carry the wafer 11 to move at the second set speed close to the support needle 13 to ensure the normal detection of the positioning sensor 14 while reducing the position deviation of the wafer 11.

[0067] In some embodiments of the present application, as shown in FIG. 7, the first path segment includes a first sub-path segment and a second sub-path segment connected in sequence, the first sub-path segment is a path segment between the first position P1 and the sixth position P6, and the second sub-path segment is a path segment between the sixth position P6 and the second position P2. The sixth position P6 is located between the first position P1 and the second position P2.

[0068] In the process of controlling the manipulator to pass through the first path segment (i.e., moving from the first position P1 to the second position P2) at the first set speed, the manipulator can be first controlled to pass through the first sub-path segment (i.e., moving from the first position P1 to the sixth position P6), and the manipulator is controlled to accelerate to the first set speed at the first acceleration and then move at the first set speed in the process of passing through the first sub-path segment, then the manipulator is controlled to pass through the second sub-path segment (i.e., moving from the sixth position P6 to the second position P2), and the manipulator is controlled to decelerate to the second set speed at the first deceleration in the process of passing through the second sub-path segment.

[0069] On this basis, in some embodiments of the present application, as shown in FIG. 7, the third path segment includes a third sub-path segment and a fourth sub-path segment connected in sequence, the first sub-path segment is a path segment between the fourth position P4 and the seventh position P7, and the second sub-path segment is a path segment between the seventh position P7 and the fifth position P5. The seventh position P7 is located between the fourth position P4 and the fifth position P5.

[0070] In the process of controlling the robot to pass through the third section (i.e., from the fourth position P4 to the fifth position P5) at the third set speed, the robot can be first controlled to pass through a third sub-section (i.e., from the fourth position P4 to the seventh position P7), and the robot is controlled to accelerate to the third set speed at a second acceleration and then move at a constant speed at the third set speed in the process of passing through the third sub-section, and then the robot is controlled to pass through a fourth sub-section (i.e., from the seventh position P7 to the fifth position P5), and the robot is controlled to decelerate in the process of passing through the fourth sub-section. It should be noted that in the process of acceleration and deceleration, the movement of the robot does not stop, that is, the robot changes speed in movement.

[0071] In some embodiments, as shown in FIGS. 7 and 8, in the process of controlling the vacuum robot 10 to pass through the first section (i.e., from the first position P1 to the second position P2) at the first set speed, first, the vacuum robot 10 is controlled to carry the wafer 11 to pass through a first sub-section (i.e., from the first position P1, such as a position outside the process chamber 12, to the sixth position P6), and the vacuum robot 10 is controlled to accelerate to the first set speed V1 at a first acceleration and then move at a constant speed at the first set speed V1 in the process of passing through the first sub-section, and then the vacuum robot 10 is controlled to carry the wafer 11 to pass through a second sub-section (i.e., from the sixth position P6 to the second position P2), and the vacuum robot 10 is controlled to decelerate to the second set speed V2 at a first deceleration in the process of passing through the second sub-section.

[0072] In the process of controlling the vacuum robot 10 to pass through the third section (i.e., from the fourth position P4 to the fifth position P5) at the third set speed, first, the vacuum robot 10 is controlled to carry the wafer 11 to pass through a third sub-section (i.e., from the fourth position P4 to the seventh position P7), and the vacuum robot 10 is controlled to accelerate to the third set speed V3 at a second acceleration and then move at a constant speed at the third set speed V3 in the process of passing through the third sub-section, and then the vacuum robot 10 is controlled to carry the wafer 11 to pass through a fourth sub-section (i.e., from the seventh position P7 to the fifth position P5, such as a position inside the process chamber 12), and the vacuum robot 10 is controlled to decelerate in the process of passing through the fourth sub-section.

[0073] It should be noted that because the vacuum robot 10 carries the wafer 11 in the process of moving from the fourth position P4 to the fifth position P5, in order to avoid problems such as vibration of the wafer 11, in the embodiments shown in FIGS. 7 and 8, the second acceleration is less than the first acceleration, and the second deceleration is less than the first deceleration.

[0074] In other embodiments, as shown in FIG. 9 and FIG. 8, during the process of controlling the vacuum robot 10 to pass through the first path segment (i.e. from the first position P1 to the second position P2) at the first set speed, first, the vacuum robot 10 is controlled to carry the wafer 11 to pass through a first sub-path segment (i.e. from the first position P1 such as a position inside the process chamber 12 to the sixth position P6), and the vacuum robot 10 is controlled to accelerate to the first set speed V1 at a first acceleration and then move at the first set speed V1 at a constant speed during the process of passing through the first sub-path segment, then the vacuum robot 10 is controlled to carry the wafer 11 to pass through a second sub-path segment (i.e. from the sixth position P6 to the second position P2), and the vacuum robot 10 is controlled to decelerate to the second set speed V2 at a first deceleration during the process of passing through the second sub-path segment.

[0075] During the process of controlling the vacuum robot 10 to pass through the third path segment (i.e. from the fourth position P4 to the fifth position P5) at the third set speed, first, the vacuum robot 10 is controlled to carry the wafer 11 to pass through a third sub-path segment (i.e. from the fourth position P4 to the seventh position P7), and the vacuum robot 10 is controlled to accelerate to the third set speed V3 at a second acceleration and then move at the third set speed V3 at a constant speed during the process of passing through the third sub-path segment, then the vacuum robot 10 is controlled to carry the wafer 11 to pass through a fourth sub-path segment (i.e. from the seventh position P7 to the fifth position P5 such as a position outside the process chamber 12), and the vacuum robot 10 is controlled to decelerate at a second deceleration during the process of passing through the fourth sub-path segment.

[0076] In other embodiments, as shown in FIG. 10 and FIG. 11, during the process of controlling the vacuum robot 10 to pass through the first path segment (i.e. from the first position P1 to the second position P2) at the first set speed, first, the vacuum robot 10 is controlled to carry the wafer 11 to pass through a first sub-path segment (i.e. from the first position P1 such as a position below the support needle 13 to the sixth position P6), and the vacuum robot 10 is controlled to accelerate to the first set speed V1 at a first acceleration and then move at the first set speed V1 at a constant speed during the process of passing through the first sub-path segment, then the vacuum robot 10 is controlled to carry the wafer 11 to pass through a second sub-path segment (i.e. from the sixth position P6 to the second position P2), and the vacuum robot 10 is controlled to decelerate to the second set speed V2 at a first deceleration during the process of passing through the second sub-path segment.

[0077] In the process of controlling the vacuum manipulator 10 to pass through the third path segment (i.e. from the fourth position P4 to the fifth position P5) at the third set speed, first, the vacuum manipulator 10 is controlled to pass through the third sub-path segment (i.e. from the fourth position P4 to the seventh position P7) and the vacuum manipulator 10 is controlled to accelerate to the third set speed V3 at the second acceleration and then move at the third set speed V3 at a constant speed in the process of passing through the third sub-path segment, and then the vacuum manipulator 10 is controlled to pass through the fourth sub-path segment (i.e. from the seventh position P7 to the fifth position P5, such as a position above the support needle 13) and the vacuum manipulator 10 is controlled to decelerate at the second deceleration in the process of passing through the fourth sub-path segment.

[0078] It should be noted that, because the vacuum manipulator 10 carries the wafer 11 in the process of moving from the first position P1 to the second position P2, in order to avoid problems such as shaking of the wafer 11, in the embodiments shown in FIGS. 10 and 11, the first acceleration is less than the second acceleration, and the first deceleration is less than the second deceleration.

[0079] In other embodiments, as shown in FIGS. 12 and 13, in the process of controlling the vacuum manipulator 10 to pass through the first path segment (i.e. from the first position P1 to the second position P2) at the first set speed, first, the vacuum manipulator 10 is controlled to pass through the first sub-path segment (i.e. from the first position P1, such as a position above the support needle 13, to the sixth position P6), and the vacuum manipulator 10 is controlled to accelerate to the first set speed V1 at the first acceleration and then move at the first set speed V1 at a constant speed in the process of passing through the first sub-path segment, and then the vacuum manipulator 10 is controlled to pass through the second sub-path segment (i.e. from the sixth position P6 to the second position P2), and the vacuum manipulator 10 is controlled to decelerate to the second set speed V2 at the first deceleration in the process of passing through the second sub-path segment.

[0080] In the process of controlling the vacuum manipulator 10 to pass through the third path segment (i.e. from the fourth position P4 to the fifth position P5) at the third set speed, first, the vacuum manipulator 10 is controlled to pass through the third sub-path segment (i.e. from the fourth position P4 to the seventh position P7) and the vacuum manipulator 10 is controlled to accelerate to the third set speed V3 at the second acceleration and then move at the third set speed V3 at a constant speed in the process of passing through the third sub-path segment, and then the vacuum manipulator 10 is controlled to pass through the fourth sub-path segment (i.e. from the seventh position P7 to the fifth position P5, such as a position above the support needle 13) and the vacuum manipulator 10 is controlled to decelerate at the second deceleration in the process of passing through the fourth sub-path segment.

[0081] It should be noted that, because the wafer 11 is carried by the vacuum manipulator 10 during the movement of the vacuum manipulator 10 from the fourth position P4 to the fifth position P5, in order to avoid the wafer 11 from being shaken and the like, in the embodiment shown in FIGS. 12 and 13, the second acceleration is less than the first acceleration, and the second deceleration is less than the first deceleration.

[0082] It should also be noted that the sixth position P6 can be determined according to the first set speed V1, the second set speed V2 and the first deceleration a1', and the seventh position P7, which is the junction position of the third sub-path segment and the fourth sub-path segment, can be determined according to the third set speed V3, the first preset speed V1' of the manipulator at the end position of the fourth sub-path segment, i.e., the fifth position P5, and the second deceleration a2'.

[0083] In some embodiments, the bearing portion or the sensor is arranged at a middle position of the second path segment, and the range of the second path segment is 3mm-5mm. That is, the distance between the second position P2 and the third position P3 is equal to the distance between the fourth position P4 and the third position P3, and the range of the distance is 1500μm-2500μm. In some embodiments, the distance is equal to 2000μm.

[0084] On this basis, as shown in FIG. 8, the sixth position P6 can be calculated according to the formula V1 2 -V2 2 =2×a1'×(P3-P6-2000), and the seventh position P7 can be calculated according to the formula V1' 2 -V3 2 =2×a2'×(P5-P7).

[0085] It should also be noted that the third position P3 (e.g., the position of the support needle 13 or the position of the positioning sensor 14) is fixed and known data, the moving speed of the manipulator at the first position P1 and the second position P2 is pre-set known data, and the moving speed, acceleration and deceleration and the like of the manipulator at other positions can be obtained through multiple tests. Moreover, the type of the manipulator, the type of the target component, the chamber environment and the type of the process can be different, and the moving speed, acceleration and deceleration and the like of the manipulator at other positions can also be different.

[0086] In some embodiments, as shown in FIG. 8, if the second path segment is provided with a sensor, i.e., the third position P3 is the position of the positioning sensor 14, the third set speed V3 is less than the first set speed V1, so as to avoid the wafer 11 from being shaken and the like due to the too large speed of the vacuum manipulator 10 in the deceleration stage.

[0087] In some embodiments, as shown in FIG. 11, if the second section is provided with a bearing part, i.e., the third position P3 is a position of a bearing part such as a support needle 13, and the robot such as the vacuum robot 10 places the target component such as the wafer 11 carried thereby on the bearing part such as the support needle 13 at the second section (i.e., at the third position P3), the third set speed V3 is greater than the first set speed V1, so as to prevent the speed of the vacuum robot 10 carrying the wafer 11 from being too large, which may cause the wafer 11 to shake or the like.

[0088] In some other embodiments, as shown in FIG. 13, if the second section is provided with a bearing part, i.e., the third position P3 is a position of a bearing part such as a support needle 13, and the robot such as the vacuum robot 10 picks up the target component such as the wafer 11 on the bearing part such as the support needle 13 at the second section (i.e., at the third position P3), the third set speed V3 is less than the first set speed V1, so as to prevent the speed of the vacuum robot 10 carrying the wafer 11 from being too large, which may cause the wafer 11 to shake or the like.

[0089] In some embodiments of the present application, as shown in FIG. 14, the motion path further comprises a fourth section, a fifth section and a sixth section connected to the third section in sequence, and the robot can be controlled to pass through the fourth section at a fourth set speed, pass through the fifth section at a fifth set speed and pass through the sixth section at a sixth set speed in sequence. The fourth section is a section between an eighth position P8 and a ninth position P9, the fifth section is a section between the ninth position P9 and an eleventh position P11, and the sixth section is a section between the eleventh position P11 and a twelfth position P12. A tenth position P10 is located between the ninth position P9 and the eleventh position P11, and the tenth position P10 is provided with a bearing part or a sensor.

[0090] In some embodiments of the present application, as shown in FIG. 14, the motion path further comprises a fourth section, a fifth section and a sixth section connected to the third section in sequence, and the robot can be controlled to pass through the fourth section at a fourth set speed, pass through the fifth section at a fifth set speed and pass through the sixth section at a sixth set speed in sequence. The fourth section is a section between an eighth position P8 and a ninth position P9, the fifth section is a section between the ninth position P9 and an eleventh position P11, and the sixth section is a section between the eleventh position P11 and a twelfth position P12. A tenth position P10 is located between the ninth position P9 and the eleventh position P11, and the tenth position P10 is provided with a bearing part or a sensor.

[0091] With the robot as the vacuum robot 10, the target component as the wafer 11, and the bearing part as the support needle 13 as examples, in some embodiments, as shown in FIG. 14, first, the vacuum robot 10 is controlled to carry the wafer 11 at a first set speed through a first path segment (i.e., from a first position P1 such as a position outside the process chamber 12 to a second position P2), then the vacuum robot 10 is controlled to carry the wafer 11 at a second set speed through a second path segment (i.e., uniformly from the second position P2 to a third position P3 such as a position of the positioning sensor 14), and uniformly from the third position P3 (such as a position of the positioning sensor 14) to a fourth position P4, then the vacuum robot 10 is controlled to carry the wafer 11 at a third set speed through a third path segment (i.e., from the fourth position P4 to a fifth position P5 such as a position inside the process chamber 12).

[0092] Then, the vacuum robot 10 is controlled to carry the wafer 11 at a fourth set speed through a fourth path segment (i.e., from an eighth position P8 such as a position inside the process chamber 12 or a position below the bearing part such as the support needle 13 to a ninth position P9), then the robot (such as the vacuum robot 10) is controlled to carry the wafer 11 at a fifth set speed through a fifth path segment (i.e., uniformly from the ninth position P9 to a tenth position P10 such as a position of the support needle 13), places the wafer 11 it carries on the support needle 13, and uniformly from the tenth position P10 (such as a position of the support needle 13) to an eleventh position P11, then the vacuum robot 10 is controlled to carry the wafer 11 at a sixth set speed through a sixth path segment (i.e., from the eleventh position P11 to a twelfth position P12 such as a position above the support needle 13).

[0093] In other embodiments, as shown in FIG. 15, first, the vacuum robot 10 is controlled to move at a first set speed through a first path segment (i.e., from a first position P1 such as a position above the support needle 13 to a second position P2), then the vacuum robot 10 is controlled to move at a second set speed through a second path segment (i.e., uniformly from the second position P2 to a third position P3 such as a position of the support needle 13), to grab the wafer 11 placed on the support needle 13, and uniformly from the third position P3 (such as a position of the support needle 13) to a fourth position P4, then the vacuum robot 10 is controlled to move at a third set speed through a third path segment (i.e., from the fourth position P4 to a fifth position P5 such as a position below the support needle 13).

[0094] Then, the vacuum robot 10 is controlled to move through a fourth path segment (i.e., from an eighth position P8, such as a position inside the process chamber 12 or a position below the support needle 13, to a ninth position P9) at a fourth set speed, to move through a fifth path segment (i.e., uniformly from the ninth position P9 to a tenth position P10, such as a position of the positioning sensor 14, and uniformly from the tenth position P10, such as a position of the positioning sensor 14, to an eleventh position P11) at a fifth set speed, and to move through a sixth path segment (i.e., from the eleventh position P11 to a twelfth position P12, such as a position outside the process chamber 12) at a sixth set speed.

[0095] Based on this, not only can the vacuum robot 10 be controlled to carry the wafer 11 to move at a faster third set speed or a first set speed away from the position of the positioning sensor 14 and the position of the support needle 13 to improve the movement efficiency of the wafer 11 and the processing efficiency of the semiconductor processing equipment, but also can be controlled to carry the wafer 11 to move at a slower second set speed close to the position of the positioning sensor 14 and the position of the support needle 13 to reduce the positional deviation of the wafer 11 while ensuring normal detection of the positioning sensor 14.

[0096] In some embodiments of the present application, the fourth path segment includes a fifth sub-path segment and a sixth sub-path segment connected in sequence, the fifth sub-path segment is a path between the eighth position P8 and a thirteenth position P13, and the sixth sub-path segment is a path between the thirteenth position P13 and the ninth position P9. The thirteenth position P13 is located between the eighth position P8 and the ninth position P9.

[0097] In the process of controlling the robot to move through the fourth path segment (i.e., from the eighth position P8 to the ninth position P9) at the fourth set speed, first, the robot is controlled to move through the fifth sub-path segment (i.e., from the eighth position P8 to the thirteenth position P13), and the robot is controlled to accelerate to the fourth set speed at a third acceleration and then move at the fourth set speed uniformly in the process of moving through the fifth sub-path segment. Then, the robot is controlled to move through the sixth sub-path segment (i.e., from the thirteenth position P13 to the ninth position P9), and the robot is controlled to decelerate to the fifth set speed at a third deceleration in the process of moving through the sixth sub-path segment.

[0098] On this basis, in some embodiments of the present application, the sixth path segment includes a seventh sub-path segment and an eighth sub-path segment connected in sequence, the seventh sub-path segment is a path segment between the eleventh position P11 and a fourteenth position P14, and the eighth sub-path segment is a path segment between the fourteenth position P14 and the twelfth position P12. The fourteenth position P14 is located between the eleventh position P11 and the twelfth position P12.

[0099] In the process of controlling the robot to pass through the sixth path segment (i.e., from the eleventh position P11 to the twelfth position P12) at the sixth set speed, first, the robot is controlled to pass through the seventh sub-path segment (i.e., from the eleventh position P11 to the fourteenth position P14), and the robot is controlled to accelerate to the sixth set speed at the fourth acceleration and then move at the sixth set speed at a constant speed in the process of passing through the seventh sub-path segment, and then the robot is controlled to pass through the eighth sub-path segment (i.e., from the fourteenth position P14 to the twelfth position P12), and the robot is controlled to decelerate in the process of passing through the seventh sub-path segment at the fourth deceleration.

[0100] In the process of controlling the robot to pass through the sixth path segment (i.e., from the eleventh position P11 to the twelfth position P12) at the sixth set speed, first, the robot is controlled to pass through the seventh sub-path segment (i.e., from the eleventh position P11 to the fourteenth position P14), and the robot is controlled to accelerate to the sixth set speed at the fourth acceleration and then move at the sixth set speed at a constant speed in the process of passing through the seventh sub-path segment, and then the robot is controlled to pass through the eighth sub-path segment (i.e., from the fourteenth position P14 to the twelfth position P12), and the robot is controlled to decelerate in the process of passing through the seventh sub-path segment at the fourth deceleration.

[0101] In the process of controlling the robot to pass through the sixth path segment (i.e., from the eleventh position P11 to the twelfth position P12) at the sixth set speed, first, the robot is controlled to pass through the seventh sub-path segment (i.e., from the eleventh position P11 to the fourteenth position P14), and the robot is controlled to accelerate to the sixth set speed at the fourth acceleration and then move at the sixth set speed at a constant speed in the process of passing through the seventh sub-path segment, and then the robot is controlled to pass through the eighth sub-path segment (i.e., from the fourteenth position P14 to the twelfth position P12), and the robot is controlled to decelerate in the process of passing through the seventh sub-path segment at the fourth deceleration.

[0102] In some embodiments, as shown in FIGS. 18 and 19, during the process of controlling the vacuum robot 10 to pass through the fourth path segment (i.e. from the eighth position P8 to the ninth position P9) at the fourth set speed, first, the vacuum robot 10 is controlled to pass through a fifth sub-path segment (i.e. from the eighth position P8, such as a position inside the process chamber 12 or a position under a supporting needle 13 of a carrier) to a thirteenth position P13, and the robot is controlled to accelerate to the fourth set speed V4 at a third acceleration and then move at the fourth set speed V4 at a constant speed during the process of passing through the fifth sub-path segment, then the vacuum robot 10 is controlled to pass through a sixth sub-path segment (i.e. from the thirteenth position P13 to the ninth position P9), and the robot is controlled to decelerate to a fifth set speed V5 at a third deceleration during the process of passing through the sixth sub-path segment.

[0103] During the process of controlling the robot to pass through the sixth path segment (i.e. from the eleventh position P11 to the twelfth position P12) at the sixth set speed, first, the vacuum robot 10 is controlled to pass through a seventh sub-path segment (i.e. from the eleventh position P11 to a fourteenth position P14), and the vacuum robot 10 is controlled to accelerate to the sixth set speed V6 at a fourth acceleration and then move at the sixth set speed V6 at a constant speed during the process of passing through the seventh sub-path segment, then the vacuum robot 10 is controlled to pass through an eighth sub-path segment (i.e. from the fourteenth position P14 to the twelfth position P12, such as a position outside the process chamber 12), and the vacuum robot 10 is controlled to decelerate at a fourth deceleration during the process of passing through the eighth sub-path segment.

[0104] It should be noted that in the embodiment shown in FIG. 16, because the vacuum robot 10 carries the wafer 11 during the process of moving from the eighth position P8 to the ninth position P9, in order to avoid problems such as shaking of the wafer 11, the fourth acceleration is smaller than the third acceleration, and the fourth deceleration is smaller than the third deceleration.

[0105] It should be further noted that the thirteenth position P13 can be determined according to the fourth set speed V4, the fifth set speed V5 and the third deceleration a3', and the junction position of the seventh sub-path segment and the eighth sub-path segment (i.e. the fourteenth position P14) can be determined according to the sixth set speed V6, the second preset speed V2' of the robot at the end position of the eighth sub-path segment (i.e. the twelfth position P12) and the fourth deceleration a4'.

[0106] In some embodiments, the carrier or the sensor is arranged at a middle position of the fifth path segment, and the range of the fifth path segment is 3mm-5mm. That is, the distance from the ninth position P9 to the tenth position P10 is equal to the distance from the eleventh position P11 to the tenth position P10, and the range of the distance is 1500μm-2500μm. In some embodiments, the distance is equal to 2000μm.

[0107] On this basis, as shown in Figure 17, according to formula V4 2 -V5 2 =2×a3′×(P10-P13-2000) to calculate the thirteenth position P13, as shown in FIG19, which can be calculated according to the formula V2′ 2 -V6 2 =2×a4′×(P12-P14) to calculate the fourteenth position P14.

[0108] It should also be noted that the tenth position P10 (e.g., the position of the support pin 13 or the position of the positioning sensor 14) is fixed and known data, and the movement speed of the manipulator at the eighth position P8 and the twelfth position P12 is pre-set and known data. The manipulator movement speed, acceleration, and deceleration parameters at other positions can be obtained through multiple tests. Furthermore, the manipulator movement speed, acceleration, and deceleration parameters at other positions may also vary depending on the manipulator type, target part type, chamber environment, and process type.

[0109] In some embodiments, as shown in Figure 17, if the fifth section is provided with a carrying part (i.e., the tenth position P10 is the position of the carrying part such as the support needle 13), and the robot places the target component (such as the wafer 11) it carries on the carrying part (such as the support needle 13) at the fifth section (i.e., the tenth position P10), then the sixth set rate V6 is greater than the fourth set rate V4.

[0110] In other embodiments, as shown in Figure 19, if a sensor is provided in the fifth section (i.e., the tenth position P10 is the position of the positioning sensor 14), the sixth set rate V6 is less than the fourth set rate V4 to prevent the vacuum robot 10 from vibrating the wafer 11 due to excessive speed during the deceleration stage.

[0111] It should also be noted that the manipulator in the embodiments of the present application refers to an arm that can be extended or raised, and the main body connected to the arm can be fixed. When the manipulator moves in the direction that is the same as or opposite to the X direction, only the arm performs an extension and retraction movement. When the manipulator moves in the direction that is the same as or opposite to the Y direction, only the arm performs an elevation movement. Among them, the direction that is the same as or opposite to the X direction can be the R-axis direction of the manipulator, and the direction that is the same as or opposite to the Y direction can be the Z-axis direction of the manipulator.

[0112] It is understandable that, in the process of controlling the movement of the robot, if the movement speed or acceleration / deceleration of the robot does not meet the pre-set conditions, the robot's instruction is determined to be abnormal, the instruction may not be executed, and a fault alarm may be issued.

[0113] As another optional implementation of the disclosure, the embodiment of the present application further discloses a semiconductor process equipment, which comprises a robot and a control system, the control system comprises at least one memory and at least one processor, the memory stores a computer program, and the processor executes the computer program to realize the above-mentioned robot control method disclosed by the embodiment of the present application. The semiconductor process equipment includes but is not limited to the semiconductor process equipment shown in FIG. 1, and the robot includes but is not limited to the vacuum robot 10 shown in FIG. 1.

[0114] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present disclosure.

[0115] The above embodiments only express several implementation manners of the present specification, which are described in detail and specifically, but should not be understood as the limitation of the patent scope. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present specification, several modifications and improvements can be made, which belong to the protection scope of the present specification. Therefore, the patent protection scope of the present specification should be subject to the appended claims.

Claims

1. A robot control method, characterized by, The method comprises: acquiring a movement path of a robot from a preset starting point to a preset ending point in a semiconductor process equipment; wherein the movement path comprises a plurality of segments connected in sequence from the preset starting point to the preset ending point, and the semiconductor process equipment is provided with a carrier or a sensor in some of the plurality of segments; controlling the robot to pass through each segment in sequence, and controlling the speed of the robot passing through a segment without the carrier or the sensor to be greater than the speed of the robot passing through a segment provided with the carrier or the sensor.

2. The robot control method according to claim 1, characterized by, The plurality of segments comprises a first segment, a second segment and a third segment; the semiconductor process equipment is provided with the carrier or the sensor in the second segment; the control of the speed of the robot passing through each segment comprises: controlling the robot to pass through the first segment at a first set speed, the second segment at a second set speed and the third segment at a third set speed in sequence; wherein the first set speed and the third set speed are both greater than the second set speed.

3. The robot control method according to claim 2, characterized by, The first segment comprises a first sub-segment and a second sub-segment connected in sequence, and the control of the robot passing through the first segment at the first set speed comprises: controlling the robot to pass through the first sub-segment and the second sub-segment in sequence, and controlling the robot to accelerate to the first set speed at a first acceleration and then move at a constant speed at the first set speed in the process of passing through the first sub-segment, and controlling the robot to decelerate to the second set speed at a first deceleration in the process of passing through the second sub-segment; wherein the junction position of the first sub-segment and the second sub-segment can be determined according to the first set speed, the second set speed and the first deceleration.

4. The robot control method according to claim 2 or 3, characterized by, The third segment comprises a third sub-segment and a fourth sub-segment connected in sequence, and the control of the robot passing through the third segment at the third set speed comprises: controlling the robot to pass through the third sub-segment and the fourth sub-segment in sequence, and controlling the robot to accelerate to the third set speed at a second acceleration and then move at a constant speed at the third set speed in the process of passing through the third sub-segment, and controlling the robot to decelerate in the process of passing through the fourth sub-segment; wherein the junction position of the third sub-segment and the fourth sub-segment can be determined according to the third set speed, the first preset speed of the robot at the ending position of the fourth sub-segment and the second deceleration.

5. The robot control method according to claim 2, wherein If the second segment is provided with a carrier and the robot grasps a target component on the carrier in the second segment, the third set speed is less than the first set speed; the target component comprises a wafer; If the second segment is provided with a carrier and the robot places a target component carried by the robot on the carrier in the second segment, the third set speed is greater than the first set speed; If the second segment is provided with a sensor, the third set speed is less than the first set speed.

6. The robot control method according to claim 2, characterized by, The motion path further comprises a fourth section, a fifth section and a sixth section connected to the third section in sequence, and the robot control method further comprises: controlling the robot to pass through the fourth section at a fourth set speed, the fifth section at a fifth set speed and the sixth section at a sixth set speed in sequence; the fourth set speed and the sixth set speed are both greater than the fifth set speed; wherein, if the second section is a section provided with a bearing part, the fifth section is a section provided with a sensor, and if the second section is a section provided with a sensor, the fifth section is a section provided with a bearing part.

7. The robot control method according to claim 6, wherein The fourth section comprises a fifth sub-section and a sixth sub-section connected in sequence, and the controlling the robot to pass through the fourth section at a fourth set speed comprises: controlling the robot to pass through the fifth sub-section and the sixth sub-section in sequence, and controlling the robot to accelerate to the fourth set speed at a third acceleration and then move at the fourth set speed uniformly during the process of passing through the fifth sub-section, and controlling the robot to decelerate to the fifth set speed at a third deceleration during the process of passing through the sixth sub-section; wherein, the junction position of the fifth sub-section and the sixth sub-section can be determined according to the fourth set speed, the fifth set speed and the third deceleration.

8. The robot control method according to claim 6 or 7, characterized by, The sixth section comprises a seventh sub-section and an eighth sub-section connected in sequence, and the controlling the robot to pass through the sixth section at a sixth set speed comprises: controlling the robot to pass through the seventh sub-section and the eighth sub-section in sequence, and controlling the robot to accelerate to the sixth set speed at a fourth acceleration and then move at the sixth set speed uniformly during the process of passing through the seventh sub-section, and controlling the robot to decelerate at a fourth deceleration during the process of passing through the eighth sub-section; wherein, the junction position of the seventh sub-section and the eighth sub-section can be determined according to the sixth set speed, a second preset speed of the robot at the end position of the eighth sub-section and the fourth deceleration.

9. The robot control method according to claim 6, wherein If the fifth section is provided with a bearing part and the robot places a target part carried by the robot on the bearing part in the fifth section, the sixth set speed is greater than the fourth set speed; If the fifth section is provided with a sensor, the sixth set speed is less than the fourth set speed.

10. The robot control method according to claim 6, wherein The bearing part or the sensor is arranged at a middle position of the second section or a middle position of the fifth section, and the range of the second section or the fifth section is 3mm-5mm.

11. A semiconductor process apparatus comprising a robot and a control system, characterized in that The control system comprises at least one memory and at least one processor, the memory stores a computer program, and the processor executes the computer program to realize the robot control method of any one of claims 1-10.

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