Clamping and overturning device and method for reducing wafer transmission contamination

Abstract

The present invention relates to the technical field of wafer transmission, and in particular to a clamping and overturning device and method for reducing wafer transmission contamination. The device comprises: a plurality of wafer clamping teeth, which are arranged on the opposite surfaces of two left-right symmetrical clamping tooth fixing plates, and include first wafer clamping teeth used for clamping a wafer before cleaning and second wafer clamping teeth used for clamping a cleaned wafer; a clamping device, which is connected to the clamping tooth fixing plates and is used for driving the wafer clamping teeth to move close to or away from each other in an axis direction of a rotating shaft; and an overturning device, which is connected to the clamping tooth fixing plates and is used for driving the wafer clamping teeth to rotate along the rotating shaft. According to the present invention, the wafer before cleaning and the cleaned wafer are separately clamped and overturned, thereby preventing contaminants left on the clamping teeth of the dirty wafer before cleaning from contaminating the cleaned wafer.

Description

Clamping and flipping device and method for reducing wafer transfer pollution TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer transfer, in particular to a clamping and flipping device and method for reducing wafer transfer pollution. BACKGROUND

[0002] Cleaning is an important link in semiconductor process and an important link in wafer processing and manufacturing process, and is one of the most important factors affecting the yield of semiconductor devices. At present, the mainstream semiconductor cleaning equipment is mainly divided into two categories: single piece equipment and tank type equipment. With the continuous growth of domestic 12-inch wafer production capacity, the demand for 12-inch wafer cleaning equipment in wafer factory is also increasing. At present, for the process above 40nm, tank type cleaning equipment is generally used. The tank type cleaning equipment for 12-inch wafers and the tank type cleaning equipment for 8-inch and below size wafers have certain differences, especially the cassetteless tank type cleaning equipment needs to be matched with the equipment front end module (EFEM) equipment to realize the feeding and discharging of wafers. The wafer clamping and flipping mechanism in the EFEM equipment is the key mechanism to change the position of the wafer. Although there are many technologies about wafer flipping mechanism at present, for cleaning equipment, how to ensure the cleaning effect of the wafer is a more key problem.

[0003] The prior art Chinese invention patent: a wafer flipping mechanism (publication number CN114999995B), its characteristics are a rack and two groups of clamping mechanisms for clamping multiple wafers on both sides in the radial direction. The rack includes a bottom plate and side plates connected perpendicularly to the opposite sides of the bottom plate. The two groups of clamping mechanisms respectively pass through the two side plates and are connected to the first driving device for controlling the two groups of clamping mechanisms to approach each other and clamp the two sides of the wafer. The side plates are connected to the driving assembly for controlling the two groups of clamping mechanisms to pivot synchronously in the plane parallel to the side plates. The technical effect of realizing wafer flipping without overall flipping of the wafer flipping mechanism is achieved, thereby prolonging the working life of the flipping mechanism and reducing the occupied working space. However, this technology does not distinguish between dirty wafers before cleaning and clean wafers after cleaning, so it is not suitable for the current EFEM equipment. SUMMARY

[0004] The purpose of the present application is to provide a clamping and flipping device for reducing wafer transfer pollution, which solves the above technical problems.

[0005] The purpose of the present application is also to provide a clamping and flipping method for reducing wafer transfer pollution, which solves the above technical problems.

[0006] The technical problems solved by the present application can be realized by the following technical solutions:

[0007] A clamping and turnover device for reducing wafer transportation pollution, comprising,

[0008] a plurality of wafer clamping teeth arranged on opposite surfaces of two symmetrical clamping tooth fixing plates, including first wafer clamping teeth for clamping wafers before cleaning and second wafer clamping teeth for clamping wafers after cleaning;

[0009] a clamping device connected to the clamping tooth fixing plates for driving the wafer clamping teeth to move towards or away from each other along the axis of a rotation axis;

[0010] a turnover device connected to the clamping tooth fixing plates for driving the wafer clamping teeth to rotate along the rotation axis.

[0011] Preferably, it further comprises a fixed frame, the wafer clamping teeth are located between the frame bodies of the fixed frame, the clamping tooth fixing plates include left and right symmetrical left and right clamping tooth fixing plates, the first wafer clamping teeth are longitudinally arranged on the back side of the left and right clamping tooth fixing plates, and the second wafer clamping teeth are longitudinally arranged on the front side of the left and right clamping tooth fixing plates.

[0012] Preferably, the first wafer clamping teeth and the second wafer clamping teeth are both made of resin material, the openings of the first wafer clamping teeth and the second wafer clamping teeth are arranged in a "V" shape, and the first wafer clamping teeth and the second wafer clamping teeth have a set height difference in the height direction.

[0013] Preferably, the clamping device comprises,

[0014] a left driving mechanism arranged on the left side of the fixed frame, connected to the left clamping tooth fixing plate, for driving the left clamping tooth fixing plate to move;

[0015] a right driving mechanism arranged on the right side of the fixed frame, connected to the right clamping tooth fixing plate, for driving the right clamping tooth fixing plate to move.

[0016] Preferably, the turnover device comprises,

[0017] a left turnover plate and a right turnover plate rotatably arranged between the frame bodies of the fixed frame along the rotation axis, the left turnover plate and the right turnover plate are connected through a connecting rod, the left clamping tooth fixing plate is connected to the left turnover plate, and the right clamping tooth fixing plate is connected to the right turnover plate;

[0018] a rotating mechanism arranged on the right side of the fixed frame, an output end of the rotating mechanism extends into the frame body of the fixed frame and is connected to the right turnover plate, and the rotating mechanism is used for driving the right turnover plate to rotate.

[0019] Preferably, it further comprises,

[0020] a photoelectric sensor arranged on the fixed frame for sensing the rotating position of the turnover device;

[0021] a first sensor sensing sheet and a second sensor sensing sheet arranged on the turnover device, the photoelectric sensor determining the rotating angle of the turnover device based on the positions of the first sensor sensing sheet and the second sensor sensing sheet.

[0022] Preferably, further comprising,

[0023] an upper sensor arranged on the upper side of the fixed frame through an upper sensor support;

[0024] a side sensor arranged on the front side of the fixed frame through a side sensor support;

[0025] a plurality of reflecting plates, including a first reflecting plate arranged on the lower rear side of the right turnover plate, a second reflecting plate arranged on the upper front side of the right turnover plate, a third reflecting plate arranged on the upper rear side of the right turnover plate, and a fourth reflecting plate arranged on the lower front side of the right turnover plate;

[0026] wherein the first reflecting plate and the second reflecting plate are symmetrically arranged about the rotating shaft, the third reflecting plate and the fourth reflecting plate are symmetrically arranged about the rotating shaft, after the turnover device rotates by a certain angle, the light emitted by the emitting end of the side sensor is incident on the first reflecting plate and the second reflecting plate, and the first reflecting plate and the second reflecting plate reflect the light back to the receiving end of the side sensor; the light emitted by the emitting end of the upper sensor is incident on the third reflecting plate and the fourth reflecting plate, and the third reflecting plate and the fourth reflecting plate reflect the light back to the receiving end of the upper sensor.

[0027] A clamping and turnover method for reducing wafer transmission pollution, applied to the clamping and turnover device for reducing wafer transmission pollution, comprising,

[0028] Step S1, the turnover device is in a wafer receiving position before cleaning, and an external wafer transmission device sends the wafer before cleaning into the middle of the first wafer clamping tooth;

[0029] Step S2, the clamping device drives the left clamping tooth fixed plate and the right clamping tooth fixed plate to move synchronously and close along the axis direction of the rotating shaft, and the first wafer clamping tooth clamps the wafer before cleaning;

[0030] Step S3, the turnover device drives the wafer before cleaning to rotate to a wafer before cleaning transmission position, and sends the wafer before cleaning to a first wafer transfer mechanism, and the first wafer transfer mechanism carries the wafer before cleaning to cleaning;

[0031] Step S4, the flipping device rotates clockwise to the pre-washing wafer receiving position, the post-washing wafer is obtained after the pre-washing wafer is cleaned, and the second wafer transfer mechanism externally clamps the post-washing wafer;

[0032] Step S5, the flipping device rotates counterclockwise to the post-washing wafer receiving position, and the second wafer transfer mechanism sends the post-washing wafer into the middle of the second wafer clamp tooth;

[0033] Step S6, the clamping device drives the left clamp tooth fixed plate and the right clamp tooth fixed plate to synchronously move close along the axis direction of the rotating shaft, and the second wafer clamp tooth clamps the post-washing wafer;

[0034] Step S7, the flipping device rotates clockwise to the post-washing wafer transmission position, and the wafer transmission device protrudes to grab the post-washing wafer and put the post-washing wafer into a wafer carrier;

[0035] Step S8, the flipping device continues to rotate clockwise to the pre-washing wafer receiving position.

[0036] Preferably, step S3 comprises,

[0037] Step S31, the first wafer transfer mechanism clamps the pre-washing wafer;

[0038] Step S32, the left and right symmetric two clamp tooth fixed plates synchronously move away along the axis direction of the rotating shaft, and the first wafer clamp tooth loosens the pre-washing wafer;

[0039] Step S33, the first wafer transfer mechanism clamps the pre-washing wafer and sends the pre-washing wafer into a cleaning area for cleaning.

[0040] Preferably, step S7 comprises,

[0041] Step S71, the flipping device rotates clockwise to the post-washing wafer transmission position, and the wafer transmission device protrudes to clamp the post-washing wafer;

[0042] Step S72, the left and right symmetric two clamp tooth fixed plates synchronously move away along the axis direction of the rotating shaft, and the second wafer clamp tooth loosens the pre-washing wafer;

[0043] Step S73, the wafer transmission device clamps the post-washing wafer and puts the post-washing wafer into a wafer carrier.

[0044] The beneficial effects of the present application: due to the above technical scheme, the present application separates the wafer before cleaning and the wafer after cleaning by setting two pairs of clamping teeth on the clamping and overturning mechanism, realizes the separate clamping and overturning of the wafer before cleaning and the wafer after cleaning, can avoid the influence of the pollutants left on the clamping teeth on the wafer before cleaning on the wafer after cleaning, and ensures the cleaning effect of the machine on the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0045] Fig. 1 is a schematic diagram of the structure of the clamping and overturning equipment in the embodiment of the present application;

[0046] Fig. 2 is a schematic diagram of the structure of the fixed frame in the embodiment of the present application;

[0047] Fig. 3 is a schematic diagram of the structure of the clamping device in the embodiment of the present application;

[0048] Fig. 4 is a partial enlarged view of the right side roller bearing in the embodiment of the present application;

[0049] Fig. 5 is a schematic diagram of the structure of the overturning device in the embodiment of the present application;

[0050] Fig. 6 is a partial enlarged view of the transmission rotating block in the embodiment of the present application;

[0051] Fig. 7 is a partial enlarged view of the right side rotating shaft in the embodiment of the present application;

[0052] Fig. 8 is a partial enlarged view of the left side rotating shaft in the embodiment of the present application;

[0053] Fig. 9 is a schematic diagram of the movement of the clamping and overturning equipment in the embodiment of the present application;

[0054] Fig. 10 is a schematic diagram of the height difference between the first wafer clamping teeth and the second wafer clamping teeth in the embodiment of the present application;

[0055] Fig. 11 is a partial enlarged schematic diagram of the height difference between the first wafer clamping teeth and the second wafer clamping teeth in the embodiment of the present application;

[0056] Fig. 12 is a schematic diagram of the wafer after cleaning passing through the clamping teeth gap of the first wafer clamping teeth in the embodiment of the present application;

[0057] Fig. 13 is a partial enlarged schematic diagram of the wafer after cleaning passing through the clamping teeth gap of the first wafer clamping teeth in the embodiment of the present application;

[0058] Fig. 14 is a schematic diagram of the setting position of the photoelectric sensor in the embodiment of the present application;

[0059] Fig. 15 is a schematic diagram of the steps of the clamping and overturning method in the embodiment of the present application;

[0060] Fig. 16 is a schematic diagram of the steps of step S3 in the embodiment of the present application;

[0061] Figure 17 is a schematic diagram of the step S4 in the embodiment of the present application;

[0062] Figure 18 is a schematic diagram of the layout of the clamping and flipping device in the embodiment of the present application;

[0063] Figure 19 is a schematic diagram of the clamping and flipping device in standby position in the embodiment of the present application;

[0064] Figure 20 is a side view of the clamping and flipping device in standby position in the embodiment of the present application;

[0065] Figure 21 is a schematic diagram of the clamping and flipping device clamping the wafer before cleaning in the embodiment of the present application;

[0066] Figure 22 is a side view of the clamping and flipping device clamping the wafer before cleaning in the embodiment of the present application;

[0067] Figure 23 is a schematic diagram of the clamping and flipping device in the wafer transmission position before cleaning in the embodiment of the present application;

[0068] Figure 24 is a side view of the clamping and flipping device in the wafer transmission position before cleaning in the embodiment of the present application;

[0069] Figure 25 is a schematic diagram of the first wafer clamping tooth loosening downward in the embodiment of the present application;

[0070] Figure 26 is a side view of the first wafer clamping tooth loosening downward in the embodiment of the present application;

[0071] Figure 27 is a schematic diagram of the clamping and flipping device returning to standby position in the embodiment of the present application;

[0072] Figure 28 is a side view of the clamping and flipping device returning to standby position in the embodiment of the present application;

[0073] Figure 29 is a schematic diagram of the clamping and flipping device rotating 270 degrees counterclockwise in the embodiment of the present application;

[0074] Figure 30 is a side view of the clamping and flipping device rotating 270 degrees counterclockwise in the embodiment of the present application;

[0075] Figure 31 is a schematic diagram of the clamping and flipping device clamping the wafer after cleaning in the embodiment of the present application;

[0076] Figure 32 is a side view of the clamping and flipping device clamping the wafer after cleaning in the embodiment of the present application;

[0077] Figure 33 is a schematic diagram of the clamping and flipping device in the wafer transmission position after cleaning in the embodiment of the present application;

[0078] Figure 34 is a side view of the clamping and flipping device in the wafer transmission position after cleaning in the embodiment of the present application;

[0079] Figure 35 is a schematic view of the wafer released from the holding and flipping apparatus after cleaning in accordance with an embodiment of the present application;

[0080] Figure 36 is a side view of the wafer released from the holding and flipping apparatus after cleaning in accordance with an embodiment of the present application;

[0081] Figure 37 is a schematic view of the holding and flipping apparatus returning to the standby position in accordance with an embodiment of the present application;

[0082] Figure 38 is a side view of the holding and flipping apparatus returning to the standby position in accordance with an embodiment of the present application;

[0083] In the drawings: 1, fixed frame; 11, wafer clamping tooth; 12, clamping tooth fixing plate; 101, left side fixed bottom plate; 102, left side support plate; 103, left side plate; 104, right side fixed bottom plate; 105, right side support plate; 106, right side plate; 107, crossbeam; 108, fixed plate; 109, speed reducer fixing plate; 110, upper side sensor; 111, upper side sensor support; 112, side edge sensor; 113, side edge sensor support; 2, clamping device; 201, left side clamping tooth fixing plate; 202, right side clamping tooth fixing plate; 203, first wafer clamping tooth; 204, second wafer clamping tooth; 205, left side driving mechanism; 206, right side driving mechanism; 207, left side telescopic rod; 208, left side linear bearing; 209, left side air cylinder; 210, left side air cylinder connecting plate; 211, left side jackscrew; 212, left side central shaft; 213, left side positioning telescopic rod; 214, left side positioning linear bearing; 215, right side telescopic rod; 216, right side linear bearing; 217, right side air cylinder; 218, right side air cylinder connecting plate; 219, right side jackscrew; 220, right side central shaft; 221, right side roller bearing; 222, right side locking nut; 223, right side gland; 224, right side positioning telescopic rod; 225, right side positioning linear bearing; 226, left side linear bearing mounting hole; 227, right side linear bearing mounting hole; 3, turnover device; 301, left side turnover plate; 302, right side turnover plate; 303, connecting rod; 304, rotating mechanism; 305, speed reducer; 306, servo motor; 307, transmission rotating block; 308, expansion sleeve ring; 309, expansion sleeve; 310, transmission connecting plate; 311, driven rotating block; 312, first roller bearing support block; 313, first roller bearing; 314, right side rotating shaft; 315, first locking nut; 316, second roller bearing support block; 317, second roller bearing; 318, left side rotating shaft; 319, second locking nut; 320, photoelectric sensor; 321, first sensor sensing sheet; 322, second sensor sensing sheet; 323, first reflector plate; 324, second reflector plate; 325, third reflector plate; 326, fourth reflector plate; 41, wafer receiving position sensor before cleaning; 42, wafer transmission position sensor before cleaning; 43, wafer receiving position sensor after cleaning; 44, wafer transmission position sensor after cleaning; 45, first limit position sensor; 46, second limit position sensor; 47, origin position sensor; 51, wafer before cleaning; 52, wafer after cleaning; 61, clamping and turnover equipment; 62, wafer transmission device; 63, wafer storage station; 64, wafer carrier; 65, first wafer transfer mechanism; 66, second wafer transfer mechanism; 67, slot type cleaning area robot. DETAILED DESCRIPTION

[0084] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of the present application.

[0085] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0086] The present application will be further described below in combination with the drawings and specific embodiments, but is not limited to the present application.

[0087] A clamping and turnover device for reducing wafer transmission pollution, as shown in FIGS. 1 to 13, comprising,

[0088] A plurality of wafer clamping teeth 11 are arranged on the opposite surfaces of two left-right symmetrical clamping tooth fixing plates 12, including a first wafer clamping tooth 203 for clamping a wafer before cleaning and a second wafer clamping tooth 204 for clamping a wafer after cleaning;

[0089] A clamping device 2 is connected to the clamping tooth fixing plate 12, for driving the wafer clamping teeth 11 to move towards or away from each other along the axis direction of the rotation axis;

[0090] A turnover device 3 is connected to the clamping tooth fixing plate 12, for driving the wafer clamping teeth 11 to rotate along the rotation axis.

[0091] Specifically, the existing wafer turnover mechanism does not mention distinguishing the wafer before cleaning and the wafer after cleaning, so it cannot meet the current demand of 12-inch cassetteless slot type cleaning equipment. In order to solve the problem that the wafer after cleaning is polluted by the wafer before cleaning, the present application provides a clamping and turnover device for reducing wafer transmission pollution, which can realize this function.

[0092] The present application is applied to an equipment front end module (EFEM) device. Two pairs of clamping teeth are arranged on the clamping and turnover mechanism, one pair of which is used for clamping and turning over the wafer before cleaning, and the other pair of which is used for clamping and turning over the wafer after cleaning, so as to realize separate clamping and turnover of the wafer before cleaning and the wafer after cleaning. This structure can avoid the influence of the pollutants left on the clamping teeth by the wafer before cleaning on the wafer after cleaning, and ensure the cleaning effect of the machine on the wafer.

[0093] In a preferred embodiment, the fixed frame 1 is further provided, the wafer clamping teeth 11 are located between the frame bodies of the fixed frame 1, the clamping teeth fixing plate 12 comprises a left clamping teeth fixing plate 201 and a right clamping teeth fixing plate 202 which are symmetrical to each other, the first wafer clamping teeth 203 are longitudinally arranged at the rear side of the left clamping teeth fixing plate 201 and the right clamping teeth fixing plate 202, and the second wafer clamping teeth 204 are longitudinally arranged at the front side of the left clamping teeth fixing plate 201 and the right clamping teeth fixing plate 202.

[0094] Specifically, the fixed frame 1 comprises,

[0095] a left fixed bottom plate 101;

[0096] a left support plate 102 arranged on the left fixed bottom plate 101;

[0097] a left plate 103 arranged on the left fixed bottom plate 101 and connected to the right side of the left support plate 102, a left driving mechanism 205 connected to the left side of the left plate 103, and an output end of the left driving mechanism 205 penetrating through the left plate 103 and connected to the left clamping teeth fixing plate 201;

[0098] a right fixed bottom plate 104 arranged corresponding to the left fixed bottom plate 101;

[0099] a right support plate 105 arranged on the right fixed bottom plate 104;

[0100] a right plate 106 arranged on the right fixed bottom plate 104 and connected to the left side of the right support plate 105, a right driving mechanism 206 connected to the right side of the right plate 106, and an output end of the right driving mechanism 206 penetrating through the right plate 106 and connected to the right clamping teeth fixing plate 202;

[0101] a cross beam 107 connected to the upper end of the left plate 103 and the upper end of the right plate 106;

[0102] a fixing plate 108 arranged on the right fixed bottom plate 104 and connected to the right side of the right support plate 105;

[0103] a speed reducer fixing plate 109 arranged on the right side of the fixing plate 108, and a rotating mechanism 304 arranged on the speed reducer fixing plate 109.

[0104] Specifically, the fixed frame 1 comprises the left plate 103, the left fixed bottom plate 101, the left support plate 102, a side sensor support 113, a side sensor 112, the right fixed bottom plate 104, the speed reducer fixing plate 109, the fixing plate 108, the right support plate 105, the right plate 106, the cross beam 107, an upper sensor support 111, and an upper sensor 110. The structure and assembly relationship are shown in FIG. 2.

[0105] In a preferred embodiment, the first wafer clamping teeth 203 and the second wafer clamping teeth 204 are both made of resin material, and the openings of the first wafer clamping teeth 203 and the second wafer clamping teeth 204 are arranged in a "V" shape, and the first wafer clamping teeth 203 and the second wafer clamping teeth 204 have a set height difference in the height direction.

[0106] The first wafer clamping teeth 203 and the second wafer clamping teeth 204 are both made of resin material, which can provide a certain buffer when clamping the wafer, so as to avoid deforming or crushing the wafer clamp. The present application has 25 first wafer clamping teeth 203 and 25 second wafer clamping teeth 204, which can clamp and flip 25 wafers at a time. The prior art can only clamp and flip 4 wafers at a time. Compared with the prior art, 7 consecutive actions are required to clamp and flip 25 wafers. Therefore, the efficiency of the present application is obviously higher than that of the prior art.

[0107] The 25 clamping teeth on the first wafer clamping teeth 203 and the second wafer clamping teeth 204 are all in the shape of V-shaped opening, which has a self-positioning function, so as to ensure that the distance between each wafer on the device is basically consistent.

[0108] The first wafer clamping teeth 203 and the second wafer clamping teeth 204 have a set height difference in the height direction. In the present application, the height difference is 5mm. By setting the height difference, when the first wafer clamping teeth 203 or the second wafer clamping teeth 204 clamp the wafer, the wafer just passes through the two clamping tooth gaps of the adjacent wafer clamping teeth 11, so as to avoid interference between the wafer and the adjacent wafer clamping teeth 11.

[0109] For example, as shown in FIGS. 10-13, when the second wafer clamping teeth 204 clamp the cleaned wafer 52, the cleaned wafer 52 will pass through the clamping tooth gap of the first wafer clamping teeth 203 on the other side, so as to avoid interference.

[0110] In a preferred embodiment, the clamping device 2 comprises,

[0111] The left driving mechanism 205 is arranged on the left side of the fixed frame 1, is connected with the left clamping tooth fixed plate 201, and is used for driving the left clamping tooth fixed plate 201 to move.

[0112] The right driving mechanism 206 is arranged on the right side of the fixed frame 1, is connected with the right clamping tooth fixed plate 202, and is used for driving the right clamping tooth fixed plate 202 to move.

[0113] In a preferred embodiment, the left driving mechanism 205 comprises,

[0114] The left telescopic rod 207 has a first end connected with the left side of the left clamping tooth fixed plate 201 and a second end connected with the right side surface of the left plate 103.

[0115] The left linear bearing 208 is sleeved on the outer side of the left telescopic rod 207 and arranged in the left linear bearing mounting hole 226 of the left overturning plate 301.

[0116] The left cylinder 209 is arranged on the left side of the left plate 103, and a left magnetic sensor is arranged on the left cylinder 209 and used for sensing that the left cylinder 209 is in place to the left clamping position and the left releasing position.

[0117] The left cylinder connecting plate 210 is connected to the piston rod of the left cylinder 209.

[0118] The left jack 211 is connected to the first end of the left cylinder connecting plate 210.

[0119] The left center shaft 212 is connected to the second end of the left jack 211.

[0120] The left roller bearing is arranged at the second end of the left center shaft 212.

[0121] The left locking nut is arranged on the left side of the left roller bearing.

[0122] The left gland is arranged on the left clamping tooth fixing plate 201 and located on the left side of the left roller bearing.

[0123] The left positioning telescopic rod 213 is connected to the first end of the left cylinder connecting plate 210.

[0124] The left positioning linear bearing 214 is sleeved on the second end of the left positioning telescopic rod 213 and arranged on the left overturning plate 301.

[0125] Specifically, the clamping device 2 is composed of the first wafer clamping tooth 203, the second wafer clamping tooth 204, the right clamping tooth fixing plate 202, the left clamping tooth fixing plate 201, the left linear bearing 208, the left telescopic rod 207, the left center shaft 212, the left jack 211, the left cylinder 209, the left cylinder connecting plate 210, the left positioning telescopic rod 213, the left positioning linear bearing 214, the left gland, the left locking nut, the left roller bearing, the right linear bearing 216, the right telescopic rod 215, the right center shaft 220, the right jack 219, the right cylinder 217, the right cylinder connecting plate 218, the right positioning telescopic rod 224, the right positioning linear bearing 225, the right gland 223, the right locking nut 222, the right roller bearing 221, and the structure of the clamping device 2 is shown in FIG. 3.

[0126] Specifically, the first wafer clamping tooth 203 on the left side and the second wafer clamping tooth 204 on the left side are fixed on the left clamping tooth fixing plate 201, four left telescopic rods 207 are provided on the left side, the four left telescopic rods 207 are fixed in four mounting holes on the left clamping tooth fixing plate 201, four left linear bearings 208 are sleeved on the four left telescopic rods 207, the four left linear bearings 208 are fixed on the left overturning plate 301, the left top pin 211 is screwed into the threaded hole at one end of the left central shaft 212, the piston rod of the left cylinder 209, two left positioning telescopic rods 213 fixed on the left cylinder connecting plate 210, two left positioning linear bearings 214 sleeved on the two left positioning telescopic rods 213 and fixed on the left overturning plate 301, and the left roller bearing is installed on the left central shaft 212 and locked by the left locking nut, installed in the mounting hole on the left clamping tooth fixing plate 201 and fixed on the left clamping tooth fixing plate 201 by the left gland.

[0127] Specifically, the left cylinder 209 drives the left cylinder connecting plate 210 to perform telescopic motion together with the left central shaft 212, the left clamping tooth fixing plate 201, the first wafer clamping tooth 203 on the left side, the second wafer clamping tooth 204 on the left side, the left telescopic rod 207, the left gland, the left roller bearing and the left locking nut. At the same time, the left cylinder connecting plate 210 performs telescopic motion together with the left positioning telescopic rod 213 in the left positioning linear bearing 214.

[0128] In a more preferred embodiment, the right drive mechanism 206 comprises,

[0129] The right telescopic rod 215 is connected to the right side of the right clamping tooth fixing plate 202 at the first end, and connected to the left side of the right plate 106 at the second end;

[0130] The right linear bearing 216 is sleeved on the outside of the right telescopic rod 215 and arranged in the right linear bearing mounting hole 227 of the right overturning plate 302;

[0131] The right cylinder 217 is arranged on the right side of the right plate 106, and a right magnetic sensor is arranged on the right cylinder 217 for sensing the right cylinder 217 to the clamping position and the loosening position on the right side;

[0132] The right cylinder connecting plate 218 is connected to the piston rod of the right cylinder 217;

[0133] The right top pin 219 is connected to the right cylinder connecting plate 218 at the first end;

[0134] The right central shaft 220 is connected to the second end of the right top pin 219 at the first end;

[0135] Right side roller bearing 221, provided on the second end of right side central shaft 220;

[0136] Right side locking nut 222, right side roller bearing 221 is locked by right side locking nut 222 in the roller bearing mounting hole of right side clamping tooth fixed plate 202;

[0137] Right side gland 223, provided on right side clamping tooth fixed plate 202, located on the right side of right side roller bearing 221;

[0138] Right side positioning telescopic rod 224, the first end of right side positioning telescopic rod 224 is connected with right side cylinder connecting plate 218;

[0139] Right side positioning linear bearing 225, sleeved on the second end of right side positioning telescopic rod 224, right side positioning linear bearing 225 is provided on right side turnover plate 302.

[0140] Specifically, the first wafer clamping tooth 203 on the right side, the second wafer clamping tooth 204 on the right side is fixed on the right side clamping tooth fixed plate 202, 4 right side telescopic rods 215 are fixed in the 4 mounting holes on the right side clamping tooth fixed plate 202, and 4 right side linear bearings 216 are sleeved on the 4 right side telescopic rods 215, the 4 right side linear bearings 216 are fixed on the right side turnover plate 302, the right side jack 219 is screwed into the threaded hole of the right side central shaft 220, and the piston rod of the right side cylinder 217, the two right side positioning telescopic rods 224 are fixed on the right side cylinder connecting plate 218, the two right side positioning linear bearings 225 are sleeved on the two right side positioning telescopic rods 224 and fixed on the right side turnover plate 302, the right side roller bearing 221 is installed on the right side central shaft 220 and locked by the right side locking nut 222, installed in the mounting hole on the right side clamping tooth fixed plate 202, and fixed on the right side clamping tooth fixed plate 202 by the right side gland 223.

[0141] Specifically, the right side cylinder 217 drives the right side cylinder connecting plate 218 to bring the right side central shaft 220, the right side clamping tooth fixed plate 202, the first wafer clamping tooth 203 on the right side, the second wafer clamping tooth 204 on the right side, the right side telescopic rod 215, the right side gland 223, the right side roller bearing 221, the right side locking nut 222 to perform telescopic motion. At the same time, the right side cylinder connecting plate 218 brings the right side positioning telescopic rod 224 to perform telescopic motion in the right side positioning linear bearing 225.

[0142] In the present application, the left side cylinder 209 and the right side cylinder 217 are double-acting cylinders, and the air inlet and air outlet of the left side cylinder 209 and the right side cylinder 217 are the same air pipe, so the telescopic action of the left side and the telescopic action of the right side are synchronous, that is, when the left side is stretched out, the right side is also stretched out, and when the left side is retracted, the right side is also retracted, so that the clamping and loosening action of the left and right clamping teeth on the wafer can be realized.

[0143] Specifically, two left magnetic sensors are arranged on the left cylinder 209, and two right magnetic sensors are arranged on the right cylinder 217, which are used to detect whether the clamping position and the loosening position of the left cylinder 209 and the right cylinder 217 are in place, so as to ensure that the wafer is clamped and does not fall off.

[0144] In a preferred embodiment, the turnover device 3 comprises,

[0145] The left turnover plate 301 and the right turnover plate 302 are rotatably arranged between the frame bodies of the fixed frame 1, and the left turnover plate 301 and the right turnover plate 302 are connected through the connecting rod 303. The left clamping tooth fixed plate 201 is connected to the left turnover plate 301, and the right clamping tooth fixed plate 202 is connected to the right turnover plate 302.

[0146] The rotating mechanism 304 is arranged on the right side of the fixed frame 1, and the output end of the rotating mechanism 304 extends into the frame body of the fixed frame 1 and is connected to the right turnover plate 302, which is used to drive the right turnover plate 302 to rotate.

[0147] In a preferred embodiment, the rotating mechanism 304 comprises,

[0148] The speed reducer 305 is arranged on the speed reducer fixed plate 109.

[0149] The servo motor 306 is connected to the output shaft of the speed reducer 305.

[0150] The transmission rotating block 307 is connected to the output shaft of the speed reducer 305.

[0151] The expansion sleeve ring 308 is arranged in the inner hole of the transmission rotating block 307.

[0152] The expansion sleeve 309 is wedged in the expansion sleeve ring 308, and the expansion sleeve 309 is expanded and tightened with the transmission rotating block 307 through the expansion sleeve ring 308.

[0153] The transmission connecting plate 310 is connected to the first end of the transmission rotating block 307.

[0154] The driven rotating block 311 is connected to the second end of the transmission connecting plate 310.

[0155] The first roller bearing support block 312 is arranged on the right side surface of the right side plate 106.

[0156] The first roller bearing 313 is arranged in the bearing hole of the first roller bearing support block 312.

[0157] The right rotating shaft 314 has a first end penetrating the inner hole of the first roller bearing 313 and being arranged in the first roller bearing support block 312 to connect the driven rotating block 311, and a second end connecting the right overturning plate 302.

[0158] The first locking nut 315 is arranged on the first roller bearing support block 312 to limit the first roller bearing 313.

[0159] Specifically, the overturning device 3 is composed of the left overturning plate 301, the photoelectric sensor 320, the connecting rod 303, the first reflecting plate 323, the second reflecting plate 324, the third reflecting plate 325, the fourth reflecting plate 326, the right overturning plate 302, the transmission connecting plate 310, the speed reducer 305, the servo motor 306, the expansion sleeve 309, the expansion sleeve ring 308, the transmission rotating block 307, the first roller bearing 313, the driven rotating block 311, the first locking nut 315, the first roller bearing support block 312, the right rotating shaft 314, the left rotating shaft 318, the second roller bearing 317, the second roller bearing support block 316, the second locking nut 319, the first sensor sensing sheet 321 and the second sensor sensing sheet 322.

[0160] Specifically, the two connecting rods 303 are respectively fixed between the left overturning plate 301 and the right overturning plate 302, the servo motor 306 is installed on the speed reducer 305, the speed reducer 305 is fixed on the speed reducer fixing plate 109, the expansion sleeve ring 308 is arranged in the inner hole of the transmission rotating block 307, the expansion sleeve 309 is wedged in the expansion sleeve ring 308, the expansion sleeve ring 308 simultaneously expands the expansion sleeve 309 and the transmission rotating block 307 through the wedging mode, the two ends of the transmission connecting plate 310 are respectively fixed on the transmission rotating block 307 and the driven rotating block 311, the two first roller bearings 313 are respectively installed in the bearing holes on the two sides of the first roller bearing support block 312, the first roller bearing support block 312 is fixed on the right plate 106, the right rotating shaft 314 penetrates the inner holes of the two first roller bearings 313, is arranged in the first roller bearing support block 312 and is fixed on the right overturning plate 302, and the first locking nut 315 limits the first roller bearing 313.

[0161] In a more preferable embodiment, the rotating mechanism 304 further comprises,

[0162] The second roller bearing support block 316 is arranged on the left side surface of the left plate 103.

[0163] The second roller bearing 317 is arranged in the bearing hole of the second roller bearing support block 316.

[0164] The left rotating shaft 318 is arranged in the second roller bearing support block 316 through the inner hole of the second roller bearing 317, and the second end of the left rotating shaft 318 is connected to the left turnover plate 301.

[0165] The second locking nut 319 is arranged on the second roller bearing support block 316 to limit the second roller bearing 317.

[0166] Specifically, the two second roller bearings 317 are respectively arranged in the bearing holes on the two sides of the second roller bearing support block 316, the second roller bearing support block 316 is fixed on the left plate 103, the left rotating shaft 318 is arranged in the second roller bearing support block through the inner holes of the two second roller bearings 317 and is fixed on the left turnover plate 301, and the second locking nut 319 limits the second roller bearing 317.

[0167] Specifically, the servo motor 306 drives the output shaft of the speed reducer 305 to rotate, the rotation is transmitted to the right rotating shaft 314 through the transmission rotating block 307, the transmission connecting plate 310 and the driven rotating block 311, and the right rotating shaft 314 drives the right turnover plate 302, the connecting rod 303, the left turnover plate 301, the left rotating shaft 318, the first sensor sensing sheet 321 and the second sensor sensing sheet 322 to rotate together.

[0168] Since the four left linear bearings 208 and the four right linear bearings 216 are respectively arranged in the four positioning holes of the left turnover plate 301 and the right turnover plate 302, when the left turnover plate 301 and the right turnover plate 302 rotate, the left first wafer clamping teeth 203, the second wafer clamping teeth 204, the left clamping teeth fixed plate 201, the left linear bearing 208 and the left telescopic rod 207 on the left side and the first wafer clamping teeth 203, the second wafer clamping teeth 204, the right clamping teeth fixed plate 202, the right linear bearing 216 and the right telescopic rod 215 on the right side rotate together, so that the change of the left and right tooth angle can be realized.

[0169] In a more preferred embodiment, it further comprises,

[0170] The photoelectric sensor 320 is arranged on the fixed frame 1 to sense the rotation position of the turnover device 3; the photoelectric sensor 320 comprises a wafer receiving position sensor before cleaning 41, a wafer transmission position sensor before cleaning 42, a wafer receiving position sensor after cleaning 43, a wafer transmission position sensor after cleaning 44, a first limit position sensor 45, a second limit position sensor 46 and an origin position sensor 47.

[0171] The first sensor sensing sheet 321 and the second sensor sensing sheet 322 are arranged on the turnover device 3, and the photoelectric sensor 320 determines the rotation angle of the turnover device 3 based on the positions of the first sensor sensing sheet 321 and the second sensor sensing sheet 322.

[0172] Specifically, the photoelectric sensor 320 is fixed on the left side plate 103 through a support, and the photoelectric sensor 320 has a total of 7, which are four position sensors, i.e., a wafer before cleaning receiving position sensor 41, a wafer before cleaning transmission position sensor 42, a wafer after cleaning receiving position sensor 43 and a wafer after cleaning transmission position sensor 44; two limit position sensors, i.e., a first limit position sensor 45 and a second limit position sensor 46, and an origin position sensor 47.

[0173] The wafer before cleaning receiving position is an initial standby position, at this time, the first wafer clamping tooth 203 corresponds to the forward direction of the external wafer transmission device;

[0174] The wafer before cleaning transmission position is a position reached after the turnover device 3 rotates 90 degrees clockwise, at this time, the first wafer clamping tooth 203 faces the first wafer transfer mechanism 65 downward, and the wafer before cleaning is taken by the first wafer transfer mechanism 65 to the cleaning area for cleaning;

[0175] The wafer after cleaning receiving position is a position reached after the turnover mechanism rotates 270 degrees counterclockwise from the initial position, at this time, the second wafer clamping tooth 204 faces the second wafer transfer mechanism 66 downward, and receives the wafer after cleaning sent by the second wafer transfer mechanism 66;

[0176] The wafer after cleaning transmission position is a position reached after the turnover mechanism rotates 90 degrees clockwise from the wafer after cleaning receiving position, at this time, the second wafer clamping tooth 204 corresponds to the forward direction of the external wafer transmission device, and the wafer after cleaning is received by the wafer transmission device and placed in the wafer carrier 64 for storage;

[0177] The first limit position is a limit position that the turnover device 3 can rotate to from the standby position along the clockwise direction, which is 180 degrees;

[0178] The second limit position is a limit position that the turnover device 3 can rotate to from the standby position along the counterclockwise direction, which is 270 degrees.

[0179] The origin position is the standby position of the turnover device 3, which is the same as the wafer before cleaning receiving position.

[0180] In addition, in order to separate the wafer before cleaning and the wafer after cleaning, according to the process, the clockwise direction 0-90 degrees is used for the wafer before cleaning, and the counterclockwise direction 180-270 degrees is used for the wafer after cleaning.

[0181] Specifically, the first reflective plate 323, the second reflective plate 324, the third reflective plate 325, and the fourth reflective plate 326 are fixed on the four sides of the right flip plate 302 respectively, wherein the first reflective plate 323 and the second reflective plate 324 are asymmetric about the rotation axis, the third reflective plate 325 and the fourth reflective plate 326 are asymmetric about the rotation axis, when the flip device 3 rotates 180 degrees, the emitting end of the upper sensor 110 emits light onto the third reflective plate 325 and the fourth reflective plate 326, the third reflective plate 325 and the fourth reflective plate 326 reflect the received light to the receiving end of the upper sensor 110, the emitting end of the side sensor 112 emits light onto the first reflective plate 323 and the second reflective plate 324, the first reflective plate 323 and the second reflective plate 324 reflect the received light to the receiving end of the side sensor 112.

[0182] In a preferred embodiment, further comprising,

[0183] an upper sensor 110 is arranged on the upper side of the fixed frame 1 through an upper sensor support 111;

[0184] a side sensor 112 is arranged on the front side of the fixed frame 1 through a side sensor support 113;

[0185] a plurality of reflective plates, including a first reflective plate 323 arranged on the rear lower side of the right flip plate 302, a second reflective plate 324 arranged on the front upper side of the right flip plate 302, a third reflective plate 325 arranged on the rear upper side of the right flip plate 302, and a fourth reflective plate 326 arranged on the front lower side of the right flip plate 302;

[0186] wherein the first reflective plate 323 and the second reflective plate 324 are symmetrically arranged about the rotation axis, the third reflective plate 325 and the fourth reflective plate 326 are symmetrically arranged about the rotation axis, based on the flip device 3 rotating a certain angle, the light emitted by the emitting end of the side sensor 112 is incident on the first reflective plate 323 and the second reflective plate 324, the first reflective plate 323 and the second reflective plate 324 reflect the light back to the receiving end of the side sensor 112; the light emitted by the emitting end of the upper sensor 110 is incident on the third reflective plate 325 and the fourth reflective plate 326, the third reflective plate 325 and the fourth reflective plate 326 reflect the light back to the receiving end of the upper sensor 110.

[0187] A clamping and flipping method for reducing wafer transmission pollution, applied to the clamping and flipping device for reducing wafer transmission pollution in any one of the embodiments, as shown in FIGS. 14-36, comprising,

[0188] Step S1, the flip device 3 is in the wafer receiving position before cleaning, and the external wafer transmission device 62 sends the wafer 51 before cleaning into the middle of the first wafer clamping tooth 203;

[0189] Step S2, the clamping device 2 drives the left side clamping tooth fixed plate 201 and the right side clamping tooth fixed plate 202 to move synchronously along the axis direction of the rotation axis, and the first wafer clamping tooth 203 clamps the wafer 51 before cleaning;

[0190] Step S3, the turnover device 3 drives the wafer 51 before cleaning to rotate to the wafer before cleaning transmission position, and the wafer 51 before cleaning is sent to the first wafer transfer mechanism 65, and the first wafer transfer mechanism 65 carries the wafer 51 before cleaning to the cleaning area;

[0191] Step S4, the turnover device 3 rotates clockwise to the wafer before cleaning receiving position, and the wafer 51 before cleaning is cleaned to obtain the wafer 52 after cleaning, and the second wafer transfer mechanism 66 outside clamps the wafer 52 after cleaning;

[0192] Step S5, the turnover device 3 rotates counterclockwise to the wafer after cleaning receiving position, and the second wafer transfer mechanism 66 sends the wafer 52 after cleaning into the middle of the second wafer clamping tooth 204;

[0193] Step S6, the clamping device 2 drives the left side clamping tooth fixed plate 201 and the right side clamping tooth fixed plate 202 to move synchronously along the axis direction of the rotation axis, and the second wafer clamping tooth 204 clamps the wafer 52 after cleaning;

[0194] Step S7, the turnover device 3 rotates clockwise to the wafer after cleaning transmission position, and the wafer transmission device 62 stretches forward to grab the wafer 52 after cleaning, and the wafer 52 after cleaning is placed into the wafer carrier 64;

[0195] Step S8, the turnover device 3 continues to rotate clockwise, and returns to the wafer before cleaning receiving position.

[0196] In a preferred embodiment, further referring to Fig. 37, step S3 comprises,

[0197] Step S31, the first wafer transfer mechanism 65 receives the wafer 51 before cleaning;

[0198] Step S32, the left and right symmetrical two clamping tooth fixed plates 12 move synchronously along the axis direction of the rotation axis, and the first wafer clamping tooth 203 loosens the wafer 51 before cleaning;

[0199] Step S33, the first wafer transfer mechanism 65 receives the wafer 51 before cleaning, and the wafer 51 before cleaning is sent to the cleaning area for cleaning.

[0200] In a preferred embodiment, further referring to Fig. 38, step S7 comprises,

[0201] Step S71, the turnover device 3 rotates clockwise to the wafer after cleaning transmission position, and the wafer transmission device 62 stretches forward to receive the wafer 52 after cleaning;

[0202] Step S72, the two symmetrical clamping teeth fixing plates 12 move away along the axis direction of the rotation axis, and the second wafer clamping teeth 204 are loosened to release the wafer 51 before cleaning;

[0203] Step S73, the wafer conveying device takes the cleaned wafer 52 and puts it into the wafer carrier 64.

[0204] Specific embodiment one: the clamping and overturning device 61 of the present application is mainly used in the equipment front end module (B300 EFEM), and the mechanism layout of the B300 EFEM is shown in FIG. 18, which mainly includes a wafer conveying device 62 (WTU), a wafer storage station 63 (FIMS), a wafer carrier 64 (FOUP), a first wafer transfer mechanism 65 (in this embodiment, a Loader pusher), a second wafer transfer mechanism 66 (in this embodiment, an Unloader pusher), a slot cleaning area robot 67 (Robot), and the specific working process of the clamping and overturning device of the present application is as follows:

[0205] Step 1, the clamping and overturning device 61 is in standby position, the wafer clamping teeth are in loosened state, and the first sensor sensing sheet 321 is located at the wafer receiving position before cleaning (WTU Dirty position); as shown in FIGS. 19 and 20,

[0206] Step 2, the wafer conveying device 62 takes out 25 wafers 51 before cleaning from the wafer carrier 64 on the wafer storage station 63, rotates to the working position of the clamping and overturning device 61, and extends to the middle of the first wafer clamping teeth 203 on the clamping and overturning device 61;

[0207] Step 3, the first wafer clamping teeth 203 on the clamping and overturning device 61 clamp the 25 wafers 51 before cleaning on the wafer conveying device 62; as shown in FIGS. 21 and 22,

[0208] Step 4, the first wafer clamping teeth 203 on the clamping and overturning device 61 rotate the clamped 25 wafers 51 before cleaning counterclockwise by 90 degrees, and the first sensor sensing sheet 321 is located at the wafer conveying position before cleaning (Loader pusher Dirty position); as shown in FIGS. 23 and 24,

[0209] Step 5, the first wafer transfer mechanism 65 moves from the standby position to the lower side of the clamping and overturning device and rises to hold the 25 wafers 51 before cleaning on the first wafer clamping teeth 203, and the first wafer clamping teeth 203 are loosened; as shown in FIGS. 25 and 26,

[0210] Step 6, the first wafer transfer mechanism 65 with the 25 pieces of pre-cleaning wafers is moved back to the standby position, the slot cleaning zone robot 67 picks up the 25 pieces of pre-cleaning wafers 51 on the first wafer transfer mechanism 65 and sends them to the cleaning zone for cleaning;

[0211] Step 7, the first wafer clamping tooth 203 on the clamping and flipping device 61 rotates 90 degrees clockwise to return to the standby position, and the first sensor sensing piece 321 is located at the pre-cleaning wafer receiving position; as shown in FIGS. 27 and 28;

[0212] Step 8, the slot cleaning zone robot 67 places the 25 pieces of cleaned wafers 52 on the second wafer transfer mechanism 66;

[0213] Step 9, the second wafer clamping tooth 204 on the clamping and flipping device 61 rotates 270 degrees counterclockwise, and the wafer clamping tooth is in the released state, and the second sensor sensing piece 322 is located at the cleaned wafer receiving position (Unloader pusher Clean position); as shown in FIGS. 29 and 30;

[0214] Step 10, the second wafer transfer mechanism 66 with the 25 pieces of cleaned wafers 52 is moved from its standby position to below the clamping and flipping device 61 and is raised to the middle of the second wafer clamping tooth 204;

[0215] Step 11, the second wafer clamping tooth 204 on the clamping and flipping device 61 clamps the 25 pieces of cleaned wafers 52 on the wafer transfer mechanism; as shown in FIGS. 31 and 32;

[0216] Step 12, the second wafer clamping tooth 204 on the clamping and flipping device 61 rotates 90 degrees clockwise with the 25 pieces of cleaned wafers 52 clamped, and the first sensor sensing piece 321 is located at the cleaned wafer transmission position (WTU Clean position); as shown in FIGS. 33 and 34;

[0217] Step 13, the wafer transmission device 62 extends from its standby position to the middle of the second wafer clamping tooth 204 on the clamping and flipping device to clamp the 25 pieces of cleaned wafers 52 on the second wafer clamping tooth 204;

[0218] Step 14, the second wafer clamping tooth 204 is released, and the wafer transmission device 62 sends the 25 pieces of cleaned wafers 52 clamped to the wafer carrier 64; as shown in FIGS. 35 and 36;

[0219] Step 15, the wafer clamping tooth on the clamping and flipping device 61 rotates 180 degrees clockwise to return to the standby position, and the first sensor sensing piece 321 is located at the pre-cleaning wafer receiving position; as shown in FIGS. 37 and 38.

[0220] The above merely describes preferred embodiments of the present application, and is not intended to limit the implementation and protection scope of the present application. Those skilled in the art should be able to understand that any equivalent substitutions and obvious changes made according to the present application description and drawings should be included in the protection scope of the present application.

Claims

1. A clamping and flipping device for reducing wafer transmission contamination, characterized in that: The utility model relates to a wafer cleaning device, including, a plurality of wafer clamping teeth (11) are arranged on the opposite surfaces of two symmetrical clamping tooth fixed plates (12), including the first wafer clamping tooth (203) for clamping the wafer before cleaning and the second wafer clamping tooth (204) for clamping the wafer after cleaning; Clamping device (2) is connected clamping tooth fixed plate (12), is used for driving wafer clamping tooth (11) along the axis direction of a rotating shaft axis direction each other close or far away movement; Turnover device (3) is connected clamping tooth fixed plate (12), is used for driving wafer clamping tooth (11) along rotating shaft rotation.

2. The reduced wafer transport contamination gripper and flip apparatus of claim 1, wherein, Still including a fixed frame (1), wafer clamping tooth (11) is located the frame body between fixed frame (1), clamping tooth fixed plate (12) includes left side clamping tooth fixed plate (201) and right side clamping tooth fixed plate (202) of symmetrical left and right, the first wafer clamping tooth (203) is arranged in the back of left side clamping tooth fixed plate (201) and right side clamping tooth fixed plate (202) longitudinally, and the second wafer clamping tooth (204) is arranged in the front of left side clamping tooth fixed plate (201) and right side clamping tooth fixed plate (202) longitudinally.

3. The reduced wafer transfer contamination gripper and flip apparatus of claim 1, wherein, The first wafer clamping tooth (203) and the second wafer clamping tooth (204) are both resin materials, the opening of the first wafer clamping tooth (203) and the second wafer clamping tooth (204) is arranged in a "V" shape, and the first wafer clamping tooth (203) and the second wafer clamping tooth (204) have a set height difference in the height direction.

4. The reduced wafer transfer contamination gripping and flipping apparatus of claim 2, wherein, The clamping device (2) includes, Left side driving mechanism (205) is arranged on the left side of the fixed frame (1), is connected left side clamping tooth fixed plate (201), is used for driving left side clamping tooth fixed plate (201) moves; Right side driving mechanism (206) is arranged on the right side of the fixed frame (1), is connected right side clamping tooth fixed plate (202), is used for driving right side clamping tooth fixed plate (202) moves.

5. The reduced wafer transfer contamination gripping and flipping apparatus of claim 4, wherein, The turnover device (3) includes, Left side turnover plate (301) and right side turnover plate (302) are rotatably arranged between the frame bodies of the fixed frame (1), the left side turnover plate (301) and the right side turnover plate (302) are connected through a connecting rod (303), the left side clamping tooth fixed plate (201) is connected to the left side turnover plate (301), and the right side clamping tooth fixed plate (202) is connected to the right side turnover plate (302); Rotating mechanism (304) is arranged on the right side of the fixed frame (1), and the output end of the rotating mechanism (304) extends into the frame body of the fixed frame (1) and is connected to the right side turnover plate (302), for driving the right side turnover plate (302) to rotate.

6. The reduced wafer transfer contamination gripping and flipping apparatus of claim 2, wherein, Further including, Photoelectric sensor (320) is arranged on the fixed frame (1) and is used for sensing the rotating position of the turnover device (3). A first sensor sensing sheet (321) and a second sensor sensing sheet (322) are arranged on the turnover device (3), and the photoelectric sensor (320) determines the rotation angle of the turnover device (3) based on the positions of the first sensor sensing sheet (321) and the second sensor sensing sheet (322).

7. The reduced wafer transfer contamination gripping and flipping apparatus of claim 5, wherein, Further comprising, An upper sensor (110) is arranged on the upper side of the fixed frame (1) through an upper sensor support (111); A side sensor (112) is arranged on the front side of the fixed frame (1) through a side sensor support (113); A plurality of reflective plates, including a first reflective plate (323) arranged on the lower back side of the right turnover plate (302), a second reflective plate (324) arranged on the upper front side of the right turnover plate (302), a third reflective plate (325) arranged on the upper back side of the right turnover plate (302), and a fourth reflective plate (326) arranged on the lower front side of the right turnover plate (302); Wherein the first reflective plate (323) and the second reflective plate (324) are symmetrically arranged about the rotation axis, the third reflective plate (325) and the fourth reflective plate (326) are symmetrically arranged about the rotation axis, after the turnover device (3) rotates by a certain angle, the light emitted by the emitting end of the side sensor (112) is incident on the first reflective plate (323) and the second reflective plate (324), and the first reflective plate (323) and the second reflective plate (324) reflect the light back to the receiving end of the side sensor (112); the light emitted by the emitting end of the upper sensor (110) is incident on the third reflective plate (325) and the fourth reflective plate (326), and the third reflective plate (325) and the fourth reflective plate (326) reflect the light back to the receiving end of the upper sensor (110).

8. A method of clamping and flipping for reducing wafer transfer contamination applied to the clamping and flipping apparatus for reducing wafer transfer contamination according to any one of claims 1 to 7, characterized by, Further comprising, Step S1, the turnover device (3) is in a wafer receiving position before cleaning, and an external wafer transfer device (62) sends a wafer (51) before cleaning into the middle of the first wafer clamping tooth (203); Step S2, the clamping device (2) drives the left clamping tooth fixed plate (201) and the right clamping tooth fixed plate (202) to move synchronously in the axial direction of the rotation axis, and the first wafer clamping tooth (203) clamps the wafer (51) before cleaning; Step S3, the turnover device (3) drives the wafer (51) before cleaning to rotate to a wafer transfer position before cleaning, and sends the wafer (51) before cleaning into a first wafer transfer mechanism (65), and the first wafer transfer mechanism (65) carries the wafer (51) before cleaning to a cleaning position; Step S4, the turnover device (3) rotates clockwise to return to the wafer receiving position before cleaning, and after the wafer (51) before cleaning is cleaned, a wafer (52) after cleaning is obtained, and an external second wafer transfer mechanism (66) clamps the wafer (52) after cleaning; Step S5, the turnover device (3) rotates counterclockwise to the cleaned wafer receiving position, and the second wafer transfer mechanism (66) sends the cleaned wafer (52) into the middle of the second wafer clamping tooth (204); Step S6, the clamping device (2) drives the left clamping tooth fixed plate (201) and the right clamping tooth fixed plate (202) to move synchronously along the axis direction of the rotation shaft, and the second wafer clamping tooth (204) clamps the cleaned wafer (52); Step S7, the turnover device (3) rotates clockwise to the cleaned wafer transmission position, the wafer transmission device (62) extends forward to grab the cleaned wafer (52), and the cleaned wafer (52) is placed into the wafer carrier (64); Step S8, the turnover device (3) continues to rotate clockwise to return to the wafer receiving position before cleaning.

9. The method of claim 8, wherein the chucking and flipping method reduces wafer transfer contamination by, Step S3 includes, Step S31, the first wafer transfer mechanism (65) receives the wafer before cleaning (51); Step S32, the left and right symmetrical two clamping tooth fixed plates (12) move synchronously away along the axis direction of the rotation shaft, and the first wafer clamping tooth (203) releases the wafer before cleaning (51); Step S33, the first wafer transfer mechanism (65) receives the wafer before cleaning (51) and sends the wafer before cleaning (51) into the cleaning area for cleaning.

10. The method of claim 8, wherein the chucking and flipping method reduces wafer transport contamination by, Step S7 includes, Step S71, the turnover device (3) rotates clockwise to the cleaned wafer transmission position, and the wafer transmission device (62) extends forward to receive the cleaned wafer (52); Step S72, the left and right symmetrical two clamping tooth fixed plates (12) move synchronously away along the axis direction of the rotation shaft, and the second wafer clamping tooth (204) releases the wafer before cleaning (51); Step S73, the wafer transmission device receives the cleaned wafer (52) and places it into the wafer carrier (64).

Images