Fluid supply device, substrate processing device, and substrate processing method

Abstract

A fluid supply device according to one aspect of the present disclosure supplies a processing fluid to a processing space of a processing unit having the processing space capable of accommodating a substrate having a surface wetted with a liquid, the fluid supply device comprising: a supply line connected to the processing unit; a pressurization unit that is provided to the supply line and increases the pressure of the processing fluid flowing through the supply line; a supply flow rate measurement unit that is provided on the secondary side of the pressurization unit in the supply line; and a supply flow rate adjustment unit that is provided on the secondary side of the supply flow rate measurement unit in the supply line.

Description

Fluid supply device, substrate processing apparatus, and substrate processing method

[0001] The present disclosure relates to a fluid supply apparatus, a substrate processing apparatus, and a substrate processing method.

[0002] A technique for drying a substrate using a processing fluid in a supercritical state is known. Patent Document 1 discloses a configuration in which a flow rate of the processing fluid supplied into a processing vessel is adjusted by controlling a back pressure valve provided in a circulation line.

[0003] Japanese Patent Application Laid-Open No. 2022-101053

[0004] The present disclosure provides a technique that can improve the accuracy of flow rate control of a processing fluid.

[0005] A fluid supply device according to one aspect of the present disclosure is a fluid supply device that supplies a processing fluid to a processing space of a processing unit having a processing space capable of accommodating a substrate whose surface is wetted with a liquid, and includes a supply line connected to the processing unit, a pressure unit provided in the supply line to increase the pressure of the processing fluid flowing through the supply line, a supply flow rate measuring unit provided on the secondary side of the pressure unit in the supply line, and a supply flow rate adjusting unit provided on the secondary side of the supply flow rate measuring unit in the supply line.

[0006] According to the present disclosure, the accuracy of flow rate control of the processing fluid can be improved.

[0007] FIG. 1 is a block diagram showing a substrate processing apparatus according to an embodiment. FIG. 2 is a diagram showing a substrate processing apparatus having a piping configuration according to a first example. FIG. 3 is a diagram (1) showing the operation of the substrate processing apparatus of FIG. 2. FIG. 4 is a diagram (2) showing the operation of the substrate processing apparatus of FIG. 2. FIG. 5 is a diagram (3) showing the operation of the substrate processing apparatus of FIG. 2. FIG. 6 is a diagram (4) showing the operation of the substrate processing apparatus of FIG. 2. FIG. 7 is a diagram (5) showing the operation of the substrate processing apparatus of FIG. 2. FIG. 8 is a diagram (6) showing the operation of the substrate processing apparatus of FIG. 2. FIG. 9 is a diagram showing a substrate processing apparatus having a piping configuration according to a second example. FIG. 10 is a diagram showing a substrate processing apparatus having a piping configuration according to a third example. FIG. 11 is a diagram (1) showing the operation of the substrate processing apparatus of FIG. 10. FIG. 12 is a diagram (2) showing the operation of the substrate processing apparatus of FIG. 10. FIG. 13 is a diagram (3) showing the operation of the substrate processing apparatus of FIG. 10. FIG. 14 is a diagram (4) showing the operation of the substrate processing apparatus of FIG. 10. Fig. 15 is a diagram (5) showing the operation of the substrate processing apparatus of Fig. 10. Fig. 16 is a diagram (6) showing the operation of the substrate processing apparatus of Fig. 10. Fig. 17 is a diagram (7) showing the operation of the substrate processing apparatus of Fig. 10. Fig. 18 is a diagram showing a substrate processing apparatus having a piping configuration according to a fourth example.

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding reference numerals are used to designate the same or corresponding members or components, and redundant descriptions will be omitted.

[0009] [Substrate Processing Apparatus] A substrate processing apparatus 100 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a block diagram showing the substrate processing apparatus 100 according to an embodiment.

[0010] The substrate processing apparatus 100 includes a processing unit 110 , a fluid supply unit 120 , a discharge unit 130 , and a control unit 140 .

[0011] The processing section 110 has a processing space capable of accommodating a substrate whose surface is wetted with a liquid. The processing section 110 is connected to a fluid supply device 120 and a discharge section 130.

[0012] The fluid supply device 120 supplies a processing fluid from a processing fluid supply source S11 to the processing unit 110. The fluid supply device 120 includes a supply line 121, a pressurizing unit 122, a supply flow rate measuring unit 123, a supply flow rate adjusting unit 124, a heating unit 125, an opening / closing unit 126, a first circulation unit 127, a pressure adjusting unit 128, and a second circulation unit 129.

[0013] The supply line 121 connects the processing fluid supply source S11 and the processing section 110. The supply line 121 supplies the processing fluid from the processing fluid supply source S11 to the processing section 110.

[0014] The pressurizing unit 122 is provided in the supply line 121. The pressurizing unit 122 increases the pressure of the processing fluid flowing through the supply line 121. The pressurizing unit 122 is, for example, a pump. The pressurizing unit 122 may also be a pressure tank.

[0015] The supply flow rate measuring unit 123 is provided on the secondary side of the pressurizing unit 122 in the supply line 121. The supply flow rate measuring unit 123 measures the supply flow rate of the processing fluid flowing through the supply line 121. The supply flow rate measuring unit 123 is, for example, a pressure-controlled flow meter. The supply flow rate measuring unit 123 may also be a mass flow meter.

[0016] The supply flow rate adjusting unit 124 is provided on the secondary side of the supply flow rate measuring unit 123 in the supply line 121. The supply flow rate adjusting unit 124 adjusts the supply flow rate of the treatment fluid flowing through the supply line 121 based on the supply flow rate of the treatment fluid measured by the supply flow rate measuring unit 123. The supply flow rate adjusting unit 124 includes, for example, a back pressure valve.

[0017] The heating unit 125 is provided on the secondary side of the supply flow rate adjusting unit 124 in the supply line 121. The heating unit 125 heats the processing fluid flowing through the supply line 121. The heating unit 125 is, for example, a heater including a heater.

[0018] The opening / closing unit 126 is provided on the secondary side of the heating unit 125 in the supply line 121. The opening / closing unit 126 may be provided on the primary side of the heating unit 125 in the supply line 121. The opening / closing unit 126 switches the flow of the treatment fluid on and off. When the opening / closing unit 126 is open, the treatment fluid flows to the secondary side, and when the opening / closing unit 126 is closed, the treatment fluid does not flow to the secondary side. The opening / closing unit 126 includes, for example, an opening / closing valve.

[0019] The first circulation unit 127 branches off from the supply line 121 at a position between the pressurizing unit 122 and the supply flow rate measuring unit 123, and merges with the supply line 121 at a position on the primary side of the pressurizing unit 122. The first circulation unit 127 circulates the treatment fluid from the secondary side of the pressurizing unit 122 to the primary side of the pressurizing unit 122.

[0020] The pressure adjusting unit 128 is provided in the first circulation unit 127. The pressure adjusting unit 128 maintains the pressure on the primary side of the supply flow rate measuring unit 123 at a set pressure. The pressure adjusting unit 128 includes, for example, a back pressure valve.

[0021] The second circulation unit 129 branches off from the supply line 121 at a position between the heating unit 125 and the opening / closing unit 126 and joins the supply line 121 at a position on the primary side of the pressurizing unit 122. The second circulation unit 129 circulates the treatment fluid from the secondary side of the heating unit 125 to the primary side of the pressurizing unit 122. When the opening / closing unit 126 is provided on the primary side of the heating unit 125, the second circulation unit 129 may branch off from the supply line 121 at a position between the supply flow rate adjustment unit 124 and the opening / closing unit 126 and joins the supply line 121 at a position on the primary side of the pressurizing unit 122.

[0022] The discharge unit 130 discharges the processing fluid from the processing unit 110 .

[0023] The control unit 140 is an electronic circuit such as a central processing unit (CPU), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc. The control unit 140 executes various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0024] As described above, according to the substrate processing apparatus 100, the supply flow rate measuring unit 123 and the supply flow rate adjusting unit 124 are provided in series in this order on the supply line 121. This improves the accuracy of flow rate control of the processing fluid supplied to the processing unit 11.

[0025] [Substrate Processing Apparatus Having a Piping Configuration According to a First Example] With reference to Fig. 2, a substrate processing apparatus 10 having a piping configuration according to a first example will be described as an example of the substrate processing apparatus 100. Fig. 2 is a diagram showing the substrate processing apparatus 10 having the piping configuration according to the first example.

[0026] The substrate processing apparatus 10 includes a processing section 11, a fluid supply device 12, a discharge section 13, and a control section 14. The processing section 11, the fluid supply device 12, the discharge section 13, and the control section 14 correspond to the processing section 110, the fluid supply device 120, the discharge section 130, and the control section 140 in FIG. 1 , respectively.

[0027] The processing unit 11 has a processing vessel 11a and a holding unit 11b. The processing vessel 11a is a vessel having a processing space formed therein that can accommodate a substrate W. In the processing space, a substrate having, for example, a liquid film formed thereon is processed. The substrate W is, for example, a semiconductor wafer. The holding unit 11b is provided inside the processing vessel 11a. The holding unit 11b holds the substrate W horizontally. The holding unit 11b is, for example, configured integrally with the processing vessel 11a. The holding unit 11b may be a holding plate configured separately from the processing vessel 11a. The processing unit 11 may have a temperature sensor and a pressure sensor.

[0028] The fluid supply device 12 has a supply line L11, a branch line L12, a first circulation line L13, a second circulation line L14, and a depressurization line L15.

[0029] The supply line L11 connects the processing fluid supply source S11 and the processing vessel 11a. The supply line L11 supplies the processing fluid from the processing fluid supply source S11 into the processing vessel 11a. The processing fluid may be, for example, carbon dioxide (CO ) in a gaseous or liquid state. ２) The supply line L11 corresponds to the supply line 121 in FIG. 1. The supply line L11 is provided with, in order from the upstream side, a pump P11, a supply flow rate measuring unit M11, a back pressure valve BV11, a pressure sensor PS11c, a heater HE11, and an on-off valve V11. The supply line L11 may be provided with a line heater that heats the supply line L11. On-off valves, orifices, filters, temperature sensors, and pressure sensors may also be provided at various positions on the supply line L11.

[0030] The pump P11 sends the processing fluid to the secondary side of the supply line L11. The pump P11 corresponds to the pressurizing unit 122 in FIG.

[0031] The supply flow rate measuring unit M11 includes a pressure sensor PS11a, an orifice OR11, and a pressure sensor PS11b.

[0032] The pressure sensor PS11a is provided on the primary side of the orifice OR11. The pressure sensor PS11a is provided in the supply line L11 between the pump P11 and the orifice OR11. The pressure sensor PS11a measures the pressure on the primary side of the orifice OR11. The pressure sensor PS11a is an example of a first pressure sensor.

[0033] The orifice OR11 serves to reduce the flow rate of the processing fluid flowing through the supply line L11 and adjust the pressure. The orifice OR11 causes the processing fluid with adjusted pressure to flow to the secondary side. The orifice OR11 is an example of a first throttle.

[0034] The pressure sensor PS11b is provided on the secondary side of the orifice OR11. The pressure sensor PS11b is provided in the supply line L11 between the orifice OR11 and the back pressure valve BV11. The pressure sensor PS11b measures the pressure on the secondary side of the orifice OR11. The pressure sensor PS11b is an example of a second pressure sensor.

[0035] The supply flow rate measurement unit M11 calculates the supply flow rate of the process fluid based on the difference between the first pressure P1 measured by the pressure sensor PS11a and the second pressure P2 measured by the pressure sensor PS11b. The process fluid flowing through the supply flow rate measurement unit M11 is, for example, liquid carbon dioxide. In this case, the orifice OR11 is located in the portion where the liquid process fluid flows. Therefore, the relationship between the flow rate and the differential pressure is a quadratic function, allowing the supply flow rate of the process fluid to be measured with high accuracy. In addition, changes in the temperature of the process fluid due to adiabatic expansion can be prevented. The supply flow rate measurement unit M11 corresponds to the supply flow rate measurement unit 123 in FIG. 1.

[0036] The supply flow rate measurement unit M11 calculates the supply flow rate Q of the processing fluid flowing through the supply line L11 using, for example, equation (1).

[0037] Q = Cd (ΔP) １／２ In equation (1), ΔP is the value obtained by subtracting the second pressure P2 from the first pressure P1 (ΔP=P1−P2), and Cd is a flow coefficient.

[0038] The flow coefficient Cd can be calculated using equation (2), for example, when the processing fluid is circulated through the processing vessel 11a under predetermined conditions and the first pressure P1, the second pressure P2, and the discharge flow rate of the processing fluid measured by the flow meter F16 become stable.

[0039] Qs=Cd・(ΔPs) １／２ ... (2) In equation (2), Qs is the discharge flow rate of the process fluid measured by the flow meter F16 at the time when the first pressure P1, the second pressure P2, and the discharge flow rate of the process fluid measured by the flow meter F16 become stable. In equation (2), ΔPs is the differential pressure between the first pressure P1 and the second pressure P2 (ΔPs = P1 - P2) at the time when the first pressure P1, the second pressure P2, and the discharge flow rate of the process fluid measured by the flow meter F16 become stable.

[0040] The back pressure valve BV11 adjusts the valve opening to allow the process fluid to flow to the secondary side when the pressure on the primary side of the supply line L11 exceeds the set pressure, thereby maintaining the pressure on the primary side at the set pressure. The set pressure of the back pressure valve BV11 is adjusted based on the supply flow rate of the process fluid measured by the supply flow rate measurement unit M11, for example. The set pressure of the back pressure valve BV11 is adjusted by, for example, the control unit 14. The back pressure valve BV11 corresponds to the supply flow rate adjustment unit 124 in FIG. 1.

[0041] The pressure sensor PS11c is provided on the secondary side of the back pressure valve BV11. The pressure sensor PS11c is provided in the supply line L11 between the back pressure valve BV11 and the heater HE11. The pressure sensor PS11c measures the pressure on the secondary side of the back pressure valve BV11.

[0042] The heater HE11 is provided on the primary side of the on-off valve V11 in the supply line L11. The heater HE11 heats and vaporizes the processing fluid flowing through the supply line L11, and supplies gas at a predetermined temperature to the secondary side. The predetermined temperature is, for example, 40°C to 120°C. The heater HE11 corresponds to the heating unit 125 in FIG. 1.

[0043] The on-off valve V11 is provided on the supply line L11 on the secondary side of the heater HE11. The on-off valve V11 is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V11 is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side. The on-off valve V11 corresponds to the on-off unit 126 in FIG. 1.

[0044] The branch line L12 branches off from the supply line L11 between the heater HE11 and the on-off valve V11 and joins the supply line L11 on the secondary side of the on-off valve V11. The branch line L12 supplies the processing fluid vaporized in the heater HE11 into the processing vessel 11a. The branch line L12 is provided with an on-off valve V12 and an orifice OR12, in this order from the upstream side.

[0045] The on-off valve V12 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V12 is open, the processing fluid flows to the secondary side, and when it is closed, the processing fluid does not flow to the secondary side.

[0046] The orifice OR12 serves to reduce the flow velocity of the process fluid flowing through the branch line L12 and adjust the pressure of the process fluid. The orifice OR12 causes the process fluid with adjusted pressure to flow to the secondary side.

[0047] The first circulation line L13 branches off from the supply line L11 at a position between the pump P11 and the supply flow rate measurement unit M11 and merges with the supply line L11 at the primary side of the pump P11. The first circulation line L13 circulates the treatment fluid from the secondary side of the pump P11 to the primary side of the pump P11. The first circulation line L13 corresponds to the first circulation unit 127 in FIG. 1. A back pressure valve BV13 is provided in the first circulation line L13. An on-off valve, an orifice, a temperature sensor, and a pressure sensor may also be provided at various positions on the first circulation line L13.

[0048] When the pressure on the secondary side of the pump P11 exceeds the set pressure, the back pressure valve BV13 adjusts the valve opening to allow the process fluid to flow to the primary side of the pump P11, thereby maintaining the pressure on the secondary side of the pump P11 at the set pressure. The set pressure of the back pressure valve BV13 is adjusted, for example, by the control unit 14. The back pressure valve BV13 corresponds to the pressure adjustment unit 128 in FIG. 1.

[0049] The second circulation line L14 branches off from the supply line L11 at a position between the heater HE11 and the on-off valve V11 and joins the supply line L11 at a position on the primary side of the pump P11. The second circulation line L14 corresponds to the second circulation section 129 in FIG. 1. The second circulation line L14 is provided with an on-off valve V14. On-off valves, orifices, temperature sensors, and pressure sensors may be further provided at various positions on the second circulation line L14.

[0050] The on-off valve V14 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V14 is open, the processing fluid flows to the secondary side, and when it is closed, the processing fluid does not flow to the secondary side.

[0051] The depressurization line L15 branches off from the supply line L11 at a position between the heater HE11 and the on-off valve V11. The depressurization line L15 discharges the treated fluid from the supply line L11. The depressurization line L15 is provided with, in order from the upstream side, an on-off valve V15 and an orifice OR15.

[0052] The on-off valve V15 is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V15 is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0053] The orifice OR15 serves to adjust the pressure by reducing the flow rate of the process fluid flowing through the depressurization line L15. The orifice OR15 causes the process fluid with adjusted pressure to flow to the secondary side.

[0054] The exhaust unit 13 has an exhaust line L16. The exhaust line L16 is connected to the processing vessel 11a. The exhaust line L16 is provided with, in order from the upstream side, a pressure sensor PS16, a flow meter F16, a back pressure valve BV16, and an on-off valve V16. The exhaust line L16 may be provided with a line heater for heating the exhaust line L16. On-off valves, orifices, temperature sensors, and pressure sensors may also be provided at various positions on the exhaust line L16.

[0055] The pressure sensor PS16 measures the pressure of the processing fluid flowing through the discharge line L16 immediately after the processing vessel 11a, thereby enabling the pressure inside the processing vessel 11a to be measured.

[0056] The flow meter F16 measures the discharge flow rate of the processing fluid flowing through the discharge line L16. The output of the flow meter F16 is sent to the control unit 14. The flow meter F16 is, for example, a mass flow meter.

[0057] When the pressure on the primary side of the discharge line L16 exceeds a set pressure, the back pressure valve BV16 adjusts the valve opening to allow the processing fluid to flow to the secondary side, thereby maintaining the pressure on the primary side at the set pressure. For example, the set pressure of the back pressure valve BV16 is adjusted by the control unit 14 based on the output of the pressure sensor PS16.

[0058] The on-off valve V16 is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V16 is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0059] The control unit 14 is, for example, a computer. The control unit 14 includes an arithmetic unit 14a and a storage unit 14b. The storage unit 14b stores programs for controlling various processes executed in the substrate processing apparatus 10. The arithmetic unit 14a controls the operation of the substrate processing apparatus 10 by reading and executing the programs stored in the storage unit 14b. The programs may be recorded on a computer-readable storage medium and installed from the storage medium into the storage unit 14b of the control unit 14. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

[0060] The control unit 14 receives measurement signals from various sensors (pressure sensor PS11a, pressure sensor PS11b, pressure sensor PS11c, pressure sensor PS16, flow meter F16, etc.) and transmits control signals to various functional elements. The control signals include, for example, open / close signals for on-off valves V11, V12, V14, V15, and V16, set pressure signals for back pressure valves BV11, BV13, and BV16, and set temperature signals for heater HE11.

[0061] A substrate processing method executed using the substrate processing apparatus 10 will be described with reference to Figures 3 to 8. Figures 3 to 8 are diagrams showing the operation of the substrate processing apparatus 10 of Figure 2. The substrate processing method described below is automatically executed under the control of the control unit 14 based on the processing recipe and control program stored in the storage unit 14b.

[0062] In the following description, it is assumed that the substrate W is accommodated in the processing container 11 a in advance. The substrate W is subjected to a cleaning process, and is held by the holder 11 b in a state where recesses of the pattern on the surface are filled with isopropyl alcohol (IPA).

[0063] <Standby Step> As shown in Figure 3, during the standby step, the set temperature of the heater HE11 is set to a first temperature, for example, 120°C, the on-off valve V14 is opened, and the on-off valves V11, V12, V15, and V16 are closed. As a result, the treatment fluid from the treatment fluid supply source S11 circulates through the supply line L11, the second circulation line L14, and the supply line L11 in this order. The treatment fluid is heated in the heater HE11 in the supply line L11. As the treatment fluid circulates through the supply line L11, the second circulation line L14, and the supply line L11 in this order, the temperatures of the supply line L11 and the second circulation line L14 approach the first temperature. When a predetermined time has elapsed since the start of the standby step, the standby step is terminated and the supply preparation step is initiated.

[0064] During this series of operations, the control unit 14 receives an output from the supply flow rate measurement unit M11 and adjusts the set pressure of the back pressure valve BV11 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV11 becomes a preset flow rate. The output from the supply flow rate measurement unit M11 is the supply flow rate of the process fluid calculated based on, for example, the difference between the first pressure P1 measured by the pressure sensor PS11a and the second pressure P2 measured by the pressure sensor PS11b.

[0065] 4, in the supply preparation process, the on-off valve V14 is switched from an open state to a closed state, and the on-off valve V15 is switched from a closed state to an open state. This stops the circulation of the processing fluid through the second circulation line L14, and the processing fluid in the supply line L11 is discharged through the depressurization line L15. This reduces the pressure in the supply line L11. This prevents high-pressure processing fluid from being supplied into the processing vessel 11a immediately after the on-off valve V12 is opened. This prevents the processing fluid from being supplied to the substrate W at high speed, thereby preventing pattern collapse. When a predetermined time has elapsed since the start of the supply preparation process, the supply preparation process is terminated, and the first pressurization process is initiated.

[0066] During this series of operations, the control unit 14 receives an output from the supply flow rate measurement unit M11 and adjusts the set pressure of the back pressure valve BV11 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV11 becomes a preset flow rate. The output from the supply flow rate measurement unit M11 is the supply flow rate of the process fluid calculated based on, for example, the difference between the first pressure P1 measured by the pressure sensor PS11a and the second pressure P2 measured by the pressure sensor PS11b.

[0067] <First Pressurization Step> As shown in FIG. 5 , in the first pressurization step, the on-off valve V12 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S11 is heated to a first temperature by the heater HE11 and supplied into the processing vessel 11a via the branch line L12, to which the on-off valve V12 is attached. Therefore, the processing fluid at the first temperature is supplied into the processing vessel 11a. During the first pressurization step, the on-off valve V15 is open, so a portion of the processing fluid from the processing fluid supply source S11 is discharged through the depressurization line L15. During the first pressurization step, the on-off valve V16 is closed, so the processing fluid does not flow out of the processing vessel 11a. Therefore, the pressure in the processing vessel 11a gradually increases. As a result, pattern collapse can be suppressed. After a predetermined time has elapsed since the start of the first pressurization step, the first pressurization step is terminated and the second pressurization step is initiated.

[0068] During this series of operations, the control unit 14 receives an output from the supply flow rate measurement unit M11 and adjusts the set pressure of the back pressure valve BV11 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV11 becomes a preset flow rate. The output from the supply flow rate measurement unit M11 is the supply flow rate of the process fluid calculated based on, for example, the difference between the first pressure P1 measured by the pressure sensor PS11a and the second pressure P2 measured by the pressure sensor PS11b.

[0069] <Second Pressurization Step> As shown in FIG. 6 , in the second pressurization step, the on-off valve V15 is switched from an open state to a closed state, and the on-off valve V11 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S11 is heated to a first temperature by the heater HE11 and supplied into the processing vessel 11a via the supply line L11, which is provided with the on-off valve V11, and the branch line L12, which is provided with the on-off valve V12. Therefore, the processing fluid at the first temperature is supplied into the processing vessel 11a at a flow rate greater than that in the first pressurization step. In the second pressurization step, the on-off valve V16 is closed, so the processing fluid does not flow out of the processing vessel 11a. Therefore, the pressure in the processing vessel 11a gradually increases. In the second pressurization step, the processing fluid is pressurized at a flow rate greater than that in the first pressurization step, and therefore the pressurization rate is faster than that in the first pressurization step. This reduces the time required for pressurization.

[0070] In the second pressurization step, the pressure of the processing fluid supplied into the processing vessel 11a is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing vessel 11a in a gaseous state. Thereafter, as the processing vessel 11a is filled with the processing fluid, the pressure inside the processing vessel 11a increases. When the pressure inside the processing vessel 11a exceeds the critical pressure, the processing fluid present in the processing vessel 11a enters a supercritical state. When the pressure inside the processing vessel 11a reaches the processing pressure, the second pressurization step is terminated and the flow step is initiated.

[0071] During this series of operations, the control unit 14 receives an output from the pressure sensor PS16 and adjusts the set pressure of the back pressure valve BV11 so that the pressure inside the processing chamber 11a gradually increases at a predetermined rate.

[0072] 7 , in the circulation process, the on-off valve V16 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S11 is supplied into the processing vessel 11a via a supply line L11 provided with the on-off valve V11 and a branch line L12 provided with the on-off valve V12, and is discharged from the processing vessel 11a via a discharge line L16. In the circulation process, IPA is replaced with the processing fluid in the recesses of the pattern on the substrate W in the processing vessel 11a. When the replacement of IPA with the processing fluid in the recesses of the pattern is completed, the circulation process is terminated and the depressurization process is initiated.

[0073] During this series of operations, the control unit 14 receives an output from the supply flow rate measurement unit M11 and adjusts the set pressure of the back pressure valve BV11 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV11 becomes a preset flow rate. The output from the supply flow rate measurement unit M11 is the supply flow rate of the process fluid calculated based on, for example, the difference between the first pressure P1 measured by the pressure sensor PS11a and the second pressure P2 measured by the pressure sensor PS11b.

[0074] The control unit 14 also receives an output from the pressure sensor PS16 and adjusts the set pressure of the back pressure valve BV16 so that the pressure inside the processing chamber 11a is maintained at the processing pressure.

[0075] 8, in the depressurization step, the on-off valves V11 and V12 are switched from an open state to a closed state. As a result, the processing fluid remaining in the processing vessel 11a is discharged through the discharge line L16. When the pressure in the processing vessel 11a becomes lower than the critical pressure of the processing fluid, the processing fluid in a supercritical state vaporizes and desorbs from the surface of the substrate W. This completes the drying process for one substrate W. In the depressurization step, the on-off valve V14 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S11 circulates through the supply line L11, the second circulation line L14, and the supply line L11 in this order.

[0076] During this series of operations, the control unit 14 receives an output from the supply flow rate measurement unit M11 and adjusts the set pressure of the back pressure valve BV11 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV11 becomes a preset flow rate. The output from the supply flow rate measurement unit M11 is the supply flow rate of the process fluid calculated based on, for example, the difference between the first pressure P1 measured by the pressure sensor PS11a and the second pressure P2 measured by the pressure sensor PS11b.

[0077] The control unit 14 also receives an output from the pressure sensor PS16 and adjusts the set pressure of the back pressure valve BV16 so that the pressure inside the processing chamber 11a gradually changes at a predetermined rate.

[0078] As described above, according to the substrate processing apparatus 10, the supply flow rate measuring unit M11 and the back pressure valve BV11 are provided in series in this order on the supply line L11, thereby improving the accuracy of flow rate control of the processing fluid supplied to the processing unit 11.

[0079] Furthermore, in the substrate processing apparatus 10, the primary and secondary sides of the back pressure valve BV11 are always filled with the processing fluid in a liquid state. Therefore, a pressure difference is unlikely to occur inside the back pressure valve BV11. As a result, particle generation can be reduced.

[0080] Furthermore, the substrate processing apparatus 10 is configured such that pressure is always applied to the primary side of the back pressure valve BV11 and the processing fluid can be supplied to the secondary side during the standby process, supply preparation process, first pressurization process, second pressurization process, circulation process, and depressurization process. This prevents the seal portion of the back pressure valve BV11 from being jammed. As a result, the initial operation of the back pressure valve BV11 is improved.

[0081] [Substrate Processing Apparatus Having Piping Configuration According to Second Example] With reference to Fig. 9, a substrate processing apparatus 20 having a piping configuration according to a second example will be described as an example of the substrate processing apparatus 100. Fig. 9 is a diagram showing the substrate processing apparatus 20 having the piping configuration according to the second example.

[0082] The substrate processing apparatus 20 differs from the substrate processing apparatus 10 in that it includes a fluid supply device 22 instead of the fluid supply device 12. Other configurations may be similar to those of the substrate processing apparatus 10. The following description will focus on the configurations that differ from the substrate processing apparatus 10.

[0083] The fluid supply device 22 has a supply line L11, a branch line L12, a first circulation line L13, a second circulation line L14, and a depressurization line L15.

[0084] The supply line L11 is provided with a pump P11, a supply flow rate measuring unit M21, a back pressure valve BV11, a pressure sensor PS11c, a heater HE11, and an on-off valve V11 in this order from the upstream side.

[0085] The supply flow rate measuring unit M21 includes a first supply line L21a and a second supply line L21b.

[0086] The first supply line L21a is a part of the supply line L11. The first supply line L21a is provided with, in order from the upstream side, a pressure sensor PS21a, an on-off valve V21a, an orifice OR21a, and a pressure sensor PS21b.

[0087] The pressure sensors PS21a and PS21b may have the same configuration as the pressure sensors PS11a and PS11b, respectively.

[0088] The on-off valve V21a is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V21a is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0089] The orifice OR21a serves to reduce the flow rate of the processing fluid flowing through the first supply line L21a and adjust the pressure. The orifice OR21a causes the processing fluid with adjusted pressure to flow to the secondary side. The orifice OR21a is an example of a first throttle.

[0090] The second supply line L21b is provided in parallel with the first supply line L21a. The second supply line L21b branches off from the first supply line L21a between the pump P11 and the pressure sensor PS21a and merges with the first supply line L21a between the pressure sensor PS21b and the back pressure valve BV11. The second supply line L21b is provided with, in order from the upstream side, an on-off valve V21b and an orifice OR21b.

[0091] The on-off valve V21b is provided in parallel with the on-off valve V21a. The on-off valve V21b is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V21b is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0092] The orifice OR21b is provided in parallel with the orifice OR21a. The orifice OR21b serves to reduce the flow velocity of the processing fluid flowing through the second supply line L21b and adjust the pressure. The orifice OR21b causes the processing fluid with adjusted pressure to flow to the secondary side. The orifice OR21b is an example of a second throttle.

[0093] As described above, the substrate processing apparatus 20 provides the same effects as the substrate processing apparatus 10 .

[0094] Furthermore, in the substrate processing apparatus 20, a second supply line L21b is provided in parallel to the first supply line L21a. The first supply line L21a is provided with an on-off valve V21a and an orifice OR21a, and the second supply line L21b is provided with an on-off valve V21b and an orifice OR21b. In this case, the supply flow rate of the processing fluid can be adjusted over a wide range.

[0095] [Substrate Processing Apparatus Having Piping Configuration According to Third Example] With reference to Fig. 10 , a substrate processing apparatus 30 having a piping configuration according to a third example will be described as an example of the substrate processing apparatus 100. Fig. 10 is a diagram showing the substrate processing apparatus 30 having the piping configuration according to the third example.

[0096] The substrate processing apparatus 30 includes a processing section 31, a fluid supply device 32, a discharge section 33, and a control section 34. The processing section 31, the fluid supply device 32, the discharge section 33, and the control section 34 correspond to the processing section 110, the fluid supply device 120, the discharge section 130, and the control section 140 in FIG. 1, respectively.

[0097] The processing section 31 may have the same configuration as the processing section 11. The processing section 31 includes a processing container 31a and a holding section 31b.

[0098] The fluid supply device 32 has a supply line L31, a branch line L32, a first circulation line L33, and a second circulation line L34.

[0099] The supply line L31 connects the processing fluid supply source S31 and the processing vessel 31a. The supply line L31 supplies the processing fluid from the processing fluid supply source S31 into the processing vessel 31a. The processing fluid is, for example, carbon dioxide in a gaseous or liquid state. The supply line L31 corresponds to the supply line 121 in FIG. 1. The supply line L31 is provided with, in order from the upstream side, a pump P31, a supply flow rate measurement unit M31, a back pressure valve BV31, a pressure sensor PS31c, an on-off valve V31a, an orifice OR31b, a heater HE31, and an on-off valve V31b. The supply line L31 may be provided with a line heater for heating the supply line L31. On-off valves, orifices, filters, temperature sensors, and pressure sensors may also be provided at various positions on the supply line L31.

[0100] The pump P31 may have the same configuration as the pump P11. The pump P31 corresponds to the pressurizing unit 122 in FIG.

[0101] The supply flow rate measuring unit M31 may have the same configuration as the supply flow rate measuring unit M11. The supply flow rate measuring unit M31 includes a pressure sensor PS31a, an orifice OR31a, and a pressure sensor PS31b. The pressure sensor PS31a is an example of a first pressure sensor. The orifice OR31a is an example of a first restriction. The pressure sensor PS31b is an example of a second pressure sensor. The supply flow rate measuring unit M31 corresponds to the supply flow rate measuring unit 123 in FIG. 1.

[0102] The back pressure valve BV31 may have the same configuration as the back pressure valve BV11. The back pressure valve BV31 corresponds to the supply flow rate adjusting unit 124 in FIG.

[0103] The pressure sensor PS31c is provided on the secondary side of the back pressure valve BV31. The pressure sensor PS31c is provided in the supply line L31 between the back pressure valve BV31 and the on-off valve V31a. The pressure sensor PS31c measures the pressure on the secondary side of the back pressure valve BV31.

[0104] The on-off valve V31a is provided on the primary side of the heater HE31 in the supply line L31. The on-off valve V31a is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V31a is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side. The on-off valve V31a corresponds to the on-off unit 126 in FIG. 1.

[0105] The orifice OR31b serves to reduce the flow rate of the processing fluid flowing through the supply line L31 and adjust the pressure of the processing fluid. The orifice OR31b causes the processing fluid, the pressure of which has been adjusted, to flow to the secondary side.

[0106] The heater HE31 is provided on the secondary side of the on-off valve V31a in the supply line L31. The heater HE31 heats and vaporizes the treatment fluid flowing through the supply line L31, and supplies gas at a first temperature to the secondary side. The first temperature may be 40°C to 90°C. The first temperature is, for example, 80°C. The heater HE31 corresponds to the heating unit 125 in FIG. 1.

[0107] The on-off valve V31b is provided on the supply line L31 on the secondary side of the heater HE31. The on-off valve V31b is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V31b is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0108] The branch line L32 branches off from the supply line L31 between the orifice OR31b and the heater HE31 and joins the supply line L31 on the secondary side of the on-off valve V31b. The branch line L32 is provided with the heater HE32 and the on-off valve V32 in this order from the upstream side.

[0109] The heater HE32 is provided in parallel with the heater HE31. The heater HE32 heats and vaporizes the treatment fluid flowing through the branch line L32, and supplies gas at a second temperature to the secondary side. The second temperature is higher than the first temperature. The second temperature may be 100°C to 120°C. The second temperature is, for example, 120°C. The heater HE32 corresponds to the heating unit 125 in FIG. 1.

[0110] The on-off valve V32 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V32 is open, the processing fluid flows to the secondary side, and when it is closed, the processing fluid does not flow to the secondary side.

[0111] The first circulation line L33 may have a configuration similar to that of the first circulation line L13. The first circulation line L33 corresponds to the first circulation section 127 in FIG. 1. A back pressure valve BV33 is provided in the first circulation line L33. An on-off valve, an orifice, a temperature sensor, and a pressure sensor may also be provided at various positions in the first circulation line L33.

[0112] The back pressure valve BV33 may have the same configuration as the back pressure valve BV13. The back pressure valve BV33 corresponds to the pressure adjusting unit 128 in FIG.

[0113] The second circulation line L34 branches off from the supply line L31 between the back pressure valve BV31 and the on-off valve V31a and joins the supply line L31 at a position on the primary side of the pump P31. The second circulation line L34 corresponds to the second circulation section 129 in FIG. 1. The second circulation line L34 is provided with, in order from the upstream side, an orifice OR34 and an on-off valve V34. On-off valves, orifices, temperature sensors, and pressure sensors may also be provided at various positions on the second circulation line L34.

[0114] The orifice OR34 serves to reduce the flow velocity of the processing fluid flowing through the second circulation line L34 and adjust the pressure of the processing fluid. The orifice OR34 causes the processing fluid, the pressure of which has been adjusted, to flow to the secondary side.

[0115] The on-off valve V34 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V34 is open, the processing fluid flows to the secondary side, and when it is closed, the processing fluid does not flow to the secondary side.

[0116] The discharge unit 33 may have the same configuration as the discharge unit 13. The discharge unit 33 has a discharge line L36. The discharge line L36 is provided with, in order from the upstream side, a pressure sensor PS36, a flow meter F36, a back pressure valve BV36, and an on-off valve V36.

[0117] The control unit 34 may have the same configuration as the control unit 14. The control unit 34 includes a calculation unit 34a and a storage unit 34b.

[0118] The control unit 34 receives measurement signals from various sensors (pressure sensor PS31a, pressure sensor PS31b, pressure sensor PS31c, pressure sensor PS36, flow meter F36, etc.) and transmits control signals to various functional elements. The control signals include, for example, open / close signals for on-off valves V31a, V31b, V32, V34, and V36, set pressure signals for back pressure valves BV31, BV33, and BV36, and set temperature signals for heaters HE31 and HE32.

[0119] 11 to 17, a substrate processing method executed using the substrate processing apparatus 30 will be described. Figures 11 to 17 are diagrams showing the operation of the substrate processing apparatus 30 of Figure 10. The substrate processing method described below is automatically executed under the control of the control unit 34, based on the processing recipe and control program stored in the storage unit 34b.

[0120] In the following description, it is assumed that the substrate W is accommodated in the processing container 31 a in advance. The substrate W is subjected to a cleaning process, and is held by the holder 31 b in a state in which the recesses of the pattern on the surface are filled with IPA.

[0121] 11 , in the standby process, the set temperature of the heater HE31 is set to a first temperature, for example, 80° C., and the set temperature of the heater HE32 is set to a second temperature, for example, 120° C. Furthermore, the on-off valve V34 is opened, and the on-off valves V31 a, V31 b, V32, and V36 are closed. This causes the processing fluid from the processing fluid supply source S31 to circulate through the supply line L31, the second circulation line L34, and the supply line L31, in that order. When a predetermined time has elapsed since the start of the standby process, the standby process is terminated, and the supply preparation process is started.

[0122] During this series of operations, the control unit 34 receives an output from the supply flow rate measurement unit M31 and adjusts the set pressure of the back pressure valve BV31 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV31 becomes a preset flow rate. The output from the supply flow rate measurement unit M31 is the supply flow rate of the process fluid calculated based on, for example, the difference between a first pressure P1 measured by the pressure sensor PS31a and a second pressure P2 measured by the pressure sensor PS31b.

[0123] 12, in the supply preparation step, the on-off valve V34 is maintained in an open state, and the on-off valves V31a, V31b, V32, and V36 are maintained in a closed state. When a predetermined time has elapsed since the start of the supply preparation step, the supply preparation step is ended, and the first pressurization step is started.

[0124] During this series of operations, the control unit 34 receives the output from the pressure sensor PS31c and adjusts the set pressure of the back pressure valve BV31 so that the pressure on the secondary side of the back pressure valve BV31 becomes a preset pressure.

[0125] <First Pressurization Step> As shown in FIG. 13 , in the first pressurization step, the on-off valves V31a and V31b are switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S31 is heated to a first temperature by the heater HE31 and supplied into the processing vessel 31a. In the first pressurization step, the on-off valve V34 is open, and a portion of the processing fluid from the processing fluid supply source S31 is returned to the primary side of the pump P31 in the supply line L31 via the second circulation line L34. In the first pressurization step, the on-off valve V36 is closed, and no processing fluid flows out of the processing vessel 31a. Therefore, the pressure in the processing vessel 31a gradually increases. As a result, pattern collapse can be suppressed. After a predetermined time has elapsed since the start of the first pressurization step, the first pressurization step is terminated and the second pressurization step is initiated.

[0126] During this series of operations, the control unit 34 receives the output from the pressure sensor PS31c and adjusts the set pressure of the back pressure valve BV31 so that the pressure on the secondary side of the back pressure valve BV31 becomes a preset pressure.

[0127] <Second Pressurization Step> As shown in FIG. 14 , in the second pressurization step, the on-off valve V34 is switched from an open state to a closed state. As a result, the processing fluid from the processing fluid supply source S31 is heated to a first temperature by the heater HE31 and supplied into the processing vessel 31a. In the second pressurization step, the on-off valve V36 is closed, so the processing fluid does not flow out of the processing vessel 31a. Therefore, the pressure inside the processing vessel 31a gradually increases. In the second pressurization step, the on-off valve V34 is closed, so the processing fluid from the processing fluid supply source S31 does not flow into the second circulation line L34. Therefore, the processing fluid is pressurized at a larger flow rate than in the first pressurization step, allowing for a faster pressurization rate. After a predetermined time has elapsed since the start of the second pressurization step, the third pressurization step is initiated.

[0128] During this series of operations, the control unit 34 receives an output from the pressure sensor PS36 and adjusts the set pressure of the back pressure valve BV31 so that the pressure inside the processing vessel 31a gradually increases at a predetermined rate.

[0129] <Third Pressurization Step> As shown in Figure 15, in the third pressurization step, the on-off valve V31b is switched from an open state to a closed state, and the on-off valve V32 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S31 is heated to the second temperature by the heater HE32 and supplied into the processing vessel 31a. In the third pressurization step, the on-off valve V36 is closed, so the processing fluid does not flow out of the processing vessel 31a. Therefore, the pressure in the processing vessel 31a gradually increases. In the third pressurization step, the on-off valve V34 is closed, so the processing fluid from the processing fluid supply source S31 does not flow into the second circulation line L34. Therefore, the processing fluid is pressurized at a larger flow rate than in the first pressurization step, so the pressurization rate can be increased.

[0130] In the third pressurization step, the pressure of the processing fluid supplied into the processing vessel 31a is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing vessel 31a in a gaseous state. Thereafter, as the processing vessel 31a is filled with the processing fluid, the pressure inside the processing vessel 31a increases. When the pressure inside the processing vessel 31a exceeds the critical pressure, the processing fluid present in the processing vessel 31a enters a supercritical state. When the pressure inside the processing vessel 31a reaches the processing pressure, the third pressurization step is completed and the flow step is initiated.

[0131] During this series of operations, the control unit 34 receives an output from the pressure sensor PS36 and adjusts the set pressure of the back pressure valve BV31 so that the pressure inside the processing vessel 31a gradually increases at a predetermined rate.

[0132] 16 , in the circulation process, the on-off valve V36 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S31 is heated to a second temperature by the heater HE32, supplied into the processing vessel 31a, and then discharged from the processing vessel 31a via the discharge line L36. In the circulation process, IPA is replaced with the processing fluid in the recesses of the pattern on the substrate W in the processing vessel 31a. When the replacement of IPA with the processing fluid in the recesses of the pattern is completed, the circulation process is terminated and the depressurization process is initiated.

[0133] During this series of operations, the control unit 34 receives an output from the supply flow rate measurement unit M31 and adjusts the set pressure of the back pressure valve BV31 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV31 becomes a preset flow rate. The output from the supply flow rate measurement unit M31 is the supply flow rate of the process fluid calculated based on, for example, the difference between a first pressure P1 measured by the pressure sensor PS31a and a second pressure P2 measured by the pressure sensor PS31b.

[0134] The control unit 34 also receives an output from the pressure sensor PS36 and adjusts the set pressure of the back pressure valve BV36 so that the pressure inside the processing vessel 31a is maintained at the processing pressure.

[0135] 17 , in the depressurization step, the on-off valves V31a and V32 are switched from an open state to a closed state. As a result, the processing fluid remaining in the processing vessel 31a is discharged through the discharge line L36. When the pressure in the processing vessel 31a becomes lower than the critical pressure of the processing fluid, the processing fluid in a supercritical state vaporizes and desorbs from the surface of the substrate W. This completes the drying process for one substrate W. In the depressurization step, the on-off valve V34 is switched from a closed state to an open state. As a result, the processing fluid from the processing fluid supply source S31 circulates through the supply line L31, the second circulation line L34, and the supply line L31 in this order.

[0136] During this series of operations, the control unit 34 receives an output from the supply flow rate measurement unit M31 and adjusts the set pressure of the back pressure valve BV31 so that the supply flow rate of the process fluid flowing through the primary side of the back pressure valve BV31 becomes a preset flow rate. The output from the supply flow rate measurement unit M31 is the supply flow rate of the process fluid calculated based on, for example, the difference between a first pressure P1 measured by the pressure sensor PS31a and a second pressure P2 measured by the pressure sensor PS31b.

[0137] The control unit 34 also receives an output from the pressure sensor PS36 and adjusts the set pressure of the back pressure valve BV36 so that the pressure inside the processing vessel 31a gradually changes at a predetermined rate.

[0138] As described above, according to the substrate processing apparatus 30, the supply flow rate measuring unit M31 and the back pressure valve BV31 are provided in series in this order on the supply line L31, thereby improving the accuracy of flow rate control of the processing fluid supplied to the processing unit 31.

[0139] Furthermore, in the substrate processing apparatus 30, the primary and secondary sides of the back pressure valve BV31 are always filled with the processing fluid in a liquid state, which makes it difficult for a pressure difference to occur inside the back pressure valve BV31. As a result, particle generation can be reduced.

[0140] Furthermore, the substrate processing apparatus 30 is configured such that pressure is always applied to the primary side of the back pressure valve BV31 and the processing fluid can be supplied to the secondary side during the standby process, supply preparation process, first pressurization process, second pressurization process, third pressurization process, circulation process, and depressurization process. This prevents the seal portion of the back pressure valve BV31 from being jammed. As a result, the initial operation of the back pressure valve BV31 is improved.

[0141] [Substrate Processing Apparatus Having Piping Configuration According to Fourth Example] With reference to Fig. 18 , a substrate processing apparatus 40 having a piping configuration according to a fourth example will be described as an example of the substrate processing apparatus 100. Fig. 18 is a diagram showing the substrate processing apparatus 40 having the piping configuration according to the fourth example.

[0142] The substrate processing apparatus 40 differs from the substrate processing apparatus 30 in that it includes a fluid supply device 42 instead of the fluid supply device 32. Other configurations may be similar to those of the substrate processing apparatus 30. The following description will focus on the configurations that differ from the substrate processing apparatus 30.

[0143] The fluid supply device 42 has a supply line L31, a branch line L32, a first circulation line L33, and a second circulation line L34.

[0144] The supply line L31 is provided with, in order from the upstream side, a pump P31, a supply flow rate measuring unit M41, a back pressure valve BV31, a pressure sensor PS31c, an on-off valve V31a, an orifice OR31b, a heater HE31, and an on-off valve V31b.

[0145] The supply flow rate measuring unit M41 includes a first supply line L41a and a second supply line L41b.

[0146] The first supply line L41a is a part of the supply line L41. The first supply line L41a is provided with, in order from the upstream side, a pressure sensor PS41a, an on-off valve V41a, an orifice OR41a, and a pressure sensor PS41b.

[0147] The pressure sensors PS41a and PS41b may have the same configuration as the pressure sensors PS31a and PS31b, respectively.

[0148] The on-off valve V41a is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V41a is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0149] The orifice OR41a serves to reduce the flow velocity of the processing fluid flowing through the first supply line L41a and adjust the pressure. The orifice OR41a causes the processing fluid with adjusted pressure to flow to the secondary side. The orifice OR41a is an example of a first throttle.

[0150] The second supply line L41b is provided in parallel with the first supply line L41a. The second supply line L41b branches off from the first supply line L41a between the pump P31 and the pressure sensor PS41a and merges with the first supply line L41a between the pressure sensor PS41b and the back pressure valve BV31. The second supply line L41b is provided with, in order from the upstream side, an on-off valve V41b and an orifice OR41b.

[0151] The on-off valve V41b is provided in parallel with the on-off valve V41a. The on-off valve V41b is a valve that switches the flow of the treatment fluid on and off. When the on-off valve V41b is open, the treatment fluid flows to the secondary side, and when it is closed, the treatment fluid does not flow to the secondary side.

[0152] The orifice OR41b is provided in parallel with the orifice OR41a. The orifice OR41b serves to reduce the flow velocity of the processing fluid flowing through the second supply line L41b and adjust the pressure. The orifice OR41b causes the processing fluid with adjusted pressure to flow to the secondary side. The orifice OR41b is an example of a second throttle.

[0153] As described above, the substrate processing apparatus 40 provides the same effects as the substrate processing apparatus 30 .

[0154] Furthermore, in the substrate processing apparatus 40, a second supply line L41b is provided in parallel to the first supply line L41a. The first supply line L41a is provided with an on-off valve V41a and an orifice OR41a, and the second supply line L41b is provided with an on-off valve V41b and an orifice OR41b. In this case, the supply flow rate of the processing fluid can be adjusted over a wide range.

[0155] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0156] This international application claims priority based on Japanese Patent Application No. 2024-066190, filed on April 16, 2024, the entire contents of which are incorporated herein by reference.

[0157] 110 Processing unit 120 Fluid supply device 121 Supply line 122 Pressurizing unit 123 Supply flow rate measuring unit 124 Supply flow rate adjusting unit

Claims

1. A fluid supply device that supplies a processing fluid to a processing space of a processing unit having a processing space capable of accommodating a substrate whose surface is wetted with a liquid, the fluid supply device comprising: a supply line connected to the processing unit; a pressurizing unit provided in the supply line to increase the pressure of the processing fluid flowing through the supply line; a supply flow rate measuring unit provided in the supply line on the secondary side of the pressurizing unit; and a supply flow rate adjusting unit provided in the supply line on the secondary side of the supply flow rate measuring unit.

2. A fluid supply device as described in claim 1, comprising: a first circulation line that branches off from the supply line at a position between the pressurizing unit and the supply flow rate measuring unit and joins the supply line at a position on the primary side of the pressurizing unit; and a back pressure valve that is provided in the first circulation line and maintains the pressure on the primary side of the supply flow rate measuring unit at a set pressure.

3. The fluid supply device according to claim 1, wherein the supply flow rate measuring unit has: a first restrictor that reduces the flow rate of the processing fluid; a first pressure sensor provided on the primary side of the first restrictor; and a second pressure sensor provided on the secondary side of the first restrictor; and the supply flow rate measuring unit calculates the supply flow rate of the processing fluid based on the difference between a first pressure measured by the first pressure sensor and a second pressure measured by the second pressure sensor.

4. The fluid supply device according to claim 3, wherein the supply flow rate adjusting section has a back pressure valve that adjusts the pressure on the primary side.

5. A fluid supply device as described in claim 1, comprising: an on-off valve provided on the secondary side of the supply flow rate adjustment unit in the supply line; and a second circulation line branching off from the supply line at a position between the supply flow rate adjustment unit and the on-off valve and joining the supply line at a position on the primary side of the pressurizing unit.

6. The fluid supply device according to claim 5, further comprising a heater for heating the processing fluid flowing through the supply line, the heater being provided on the secondary side of the on-off valve in the supply line.

7. The fluid supply device according to claim 5, further comprising a heater for heating the processing fluid flowing through the supply line, the heater being provided on the upstream side of the on-off valve in the supply line.

8. The fluid supply device according to claim 3, wherein the supply flow rate measuring unit has a second throttle provided in parallel with the first throttle and configured to reduce the flow velocity of the processing fluid.

9. The fluid supply device according to claim 1, wherein the processing fluid flowing through the supply flow rate measuring unit is carbon dioxide in a liquid state.

10. A fluid supply device according to any one of claims 1 to 9, wherein the supply flow rate adjusting unit adjusts the supply flow rate of the processing fluid flowing through the supply line based on the supply flow rate of the processing fluid measured by the supply flow rate measuring unit.

11. A substrate processing apparatus comprising: a processing section having a processing space capable of accommodating a substrate whose surface is wetted with a liquid; and a fluid supply device that supplies a processing fluid to the processing space, wherein the fluid supply device has: a supply line connected to the processing section; a pressurizing section provided in the supply line for increasing the pressure of the processing fluid flowing through the supply line; a supply flow rate measuring section provided in the supply line on the secondary side of the pressurizing section; and a supply flow rate adjusting section provided in the supply line on the secondary side of the supply flow rate measuring section.

12. The substrate processing apparatus according to claim 11, comprising: a first circulation line that branches off from the supply line at a position between the pressurizing unit and the supply flow rate measuring unit and joins the supply line at a position on the primary side of the pressurizing unit; and a back pressure valve that is provided on the first circulation line and maintains the pressure on the primary side of the supply flow rate measuring unit at a set pressure.

13. The substrate processing apparatus of claim 11, wherein the supply flow rate measuring unit has: a first restrictor that reduces the flow rate of the processing fluid; a first pressure sensor provided on the primary side of the first restrictor; and a second pressure sensor provided on the secondary side of the first restrictor; and the supply flow rate measuring unit calculates the supply flow rate of the processing fluid based on the difference between a first pressure measured by the first pressure sensor and a second pressure measured by the second pressure sensor.

14. The substrate processing apparatus according to claim 13, wherein the supply flow rate adjusting unit has a back pressure valve that adjusts the pressure on the primary side.

15. A substrate processing apparatus as described in claim 11, comprising: an on-off valve provided on the supply line at the secondary side of the supply flow rate adjustment unit; and a second circulation line branching off from the supply line at a position between the supply flow rate adjustment unit and the on-off valve and joining the supply line at a position on the primary side of the pressurizing unit.

16. The substrate processing apparatus according to claim 15, further comprising a heater for heating the processing fluid flowing through the supply line, the heater being provided on the supply line on the secondary side of the on-off valve.

17. The substrate processing apparatus according to claim 15, further comprising a heater for heating the processing fluid flowing through the supply line, the heater being provided on the supply line on the primary side of the on-off valve.

18. The substrate processing apparatus according to claim 13, wherein the supply flow rate measuring unit has a second throttle provided in parallel with the first throttle and configured to reduce the flow velocity of the processing fluid.

19. The substrate processing apparatus according to any one of claims 11 to 18, further comprising: a discharge unit that discharges the processing fluid from the processing space, the discharge unit having a pressure adjustment unit that adjusts the pressure in the processing space.

20. A substrate processing method using a substrate processing apparatus, the substrate processing apparatus comprising: a processing section having a processing space capable of accommodating a substrate whose surface is wetted with a liquid; and a fluid supply device that supplies a processing fluid to the processing space, the fluid supply device having: a supply line connected to the processing section; a pressurizing section provided in the supply line for increasing the pressure of the processing fluid flowing through the supply line; a supply flow rate measuring section provided in the supply line on the secondary side of the pressurizing section; and a supply flow rate adjusting section provided in the supply line on the secondary side of the supply flow rate measuring section, the substrate processing method including the supply flow rate adjusting section adjusting the supply flow rate of the processing fluid flowing through the supply line based on the supply flow rate of the processing fluid measured by the supply flow rate measuring section.

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