Electronic device comprising frame having cladding portion, and manufacturing method therefor

Abstract

Disclosed is an electronic device comprising a frame and a support portion positioned on the inside of the frame. The frame can include: a corner portion that defines a first part of the side surface of the electronic device; and a side portion that defines a second part of the side surface. The corner portion can include a first metal. The side portion can include a clad structure in which an outer portion and an inner portion are bonded to each other. The outer portion can include the first metal and the inner portion can include a second metal that is different from the first metal. The support portion can be connected to the corner portion and the side portion by welding. Other various embodiments identified through the specification are possible.

Description

Electronic device including a frame having a cladding portion and a method for manufacturing the same

[0001] Embodiments disclosed in this document relate to an electronic device including a frame having a cladding portion and a method of manufacturing the same.

[0002] An electronic device may include a front portion where a display is positioned, a rear portion where a rear cover is positioned, and a side frame between the front and rear portions. The side frame may be formed, for example, of a metal material having a certain level of durability and / or strength. However, as interest in the aesthetics of the appearance of electronic devices increases, attempts are being made to form at least a portion of the side frame using various alloys. The side frame may be physically and / or electrically connected to a support member within the electronic device. Various processes may be required to join the side frame formed of metal to the support member.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device according to one embodiment disclosed in the present document includes a frame forming at least a portion of a side surface of the electronic device, a support portion disposed on an inner side of the frame, the frame including a side portion including a clad structure in which a corner portion forming a portion of the side surface and including a first metal and an outer portion forming another portion of the side surface and including the first metal and an inner portion including a second metal are joined, and the support portion can be connected to the corner portion and the side surface by welding.

[0005] An electronic device according to one embodiment disclosed in the present document includes a display, a rear cover, and a frame structure at least partially disposed between the display and the rear cover, wherein the frame structure includes a first side portion forming a portion of a first side of the electronic device and at least partially formed of a clad structure formed from a first metal and a second metal, a second side portion forming a portion of a second side of the electronic device and at least partially formed of the clad structure, a corner portion forming another portion of the first side and another portion of the second side between the first side portion and the second side portion and formed from the first metal, and a support portion supporting the display and coupled to the first side portion and the corner portion and formed from the second metal, wherein in the clad structure, the first metal is disposed toward the outside of the electronic device, the second metal is disposed toward the inside of the electronic device, and the corner portion may include a first antenna feed formed from the first metal.

[0006] According to an embodiment disclosed in the present document, a foldable electronic device including a hinge module, a first housing and a second housing that are foldably coupled about the hinge module, and a hinge cover coupled to the hinge module, the foldable electronic device includes a frame of the foldable electronic device, at least a portion of which is included in the first housing, the second housing, and the hinge cover, and a support portion disposed on the inside of the frame, the frame including a hinge side frame portion that is coupled to the hinge cover and at least a portion of which forms a part of a side surface of the foldable electronic device when the first housing and the second housing are folded, an edge frame portion that forms another part opposite to the hinge side frame portion of the side surface, and a corner frame portion that is disposed on one side of the edge frame portion and forms a corner portion of the side surface, wherein the hinge side frame portion and the corner frame portion are formed from a first metal, the edge frame portion has a clad structure formed from the first metal and a second metal, and the support portion is formed from the corner. The frame portion and the corner frame portion can be connected by welding.

[0007] An electronic device according to an embodiment disclosed in the present document may include a frame and a support portion located on an inner side of the frame. The frame may include a corner portion defining a first portion of a side of the electronic device and a side portion defining a second portion of the side. The corner portion may include a first metal. The side portion may include a clad structure in which an outer portion and an inner portion are joined to each other. The outer portion may include the first metal, and the inner portion may include a second metal different from the first metal. The support portion may be connected to the corner portion and the side portion by welding.

[0008] An electronic device according to an embodiment disclosed in the present document may include a display, a rear cover, and a frame structure having at least a portion between the display and the rear cover. The frame structure may include a first side portion defining a first portion of a first side of the electronic device, a second side portion defining a first portion of a second side of the electronic device, a corner portion defining a second portion of the first side and a second portion of the second side between the first side portion and the second side portion, and a support portion supporting the display. The first side portion may include a first clad structure including a first metal and a second metal. The first metal of the first clad structure may be further away from the outside of the electronic device than the second metal of the first clad structure. The second side portion may include a second clad structure including the first metal and the second metal. The first metal of the second clad structure may be further away from the outside of the electronic device than the second metal of the second clad structure. The corner portion may include a first antenna feed including the first metal. The support portion may be connected to the first side portion and the corner portion and may include the second metal.

[0009] A foldable electronic device according to an embodiment disclosed in the present document may include a hinge module, a first housing connected to the hinge module and configured to fold with respect to the hinge module, a second housing connected to the hinge module and configured to fold with respect to the hinge module, and a hinge cover connected to the hinge module. At least a portion of the first housing, the second housing, and the hinge cover may comprise a frame of the foldable electronic device. The foldable electronic device may further include a support portion located on an inner side of the frame. The frame may include a hinge side frame portion connected to the hinge cover and including at least a portion defining a first portion of a side surface of the foldable electronic device when the first housing and the second housing are folded, an edge frame portion facing the hinge side frame portion and defining a second portion of the side surface, and a corner frame portion located at one side of the edge frame portion and defining a corner portion of the side surface. The hinge side frame portion and the corner frame portion may include a first metal. The edge frame portion may include a clad structure including the first metal and a second metal different from the first metal. The support portion may be connected to the corner frame portion and the edge frame portion by welding.

[0010] FIG. 1A is a perspective view of the front of an electronic device according to one embodiment.

[0011] FIG. 1b is a perspective view of the rear surface of an electronic device according to one embodiment.

[0012] FIG. 1c is an exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment.

[0014] FIG. 2b is a plan view of the rear side of an electronic device according to one embodiment.

[0015] FIG. 2c is an exploded perspective view of a portion of the electronic device of FIGS. 2a and 2b including a hinge device according to one embodiment.

[0016] FIG. 3A is a perspective view of the front of an electronic device according to one embodiment.

[0017] FIG. 3b is a plan view of the rear side of an electronic device according to one embodiment.

[0018] FIG. 3c is an exploded perspective view of a portion of the electronic device of FIGS. 3a and 3b including a hinge device according to one embodiment.

[0019] FIG. 4 is a schematic drawing showing the shape of a frame of an electronic device according to one embodiment.

[0020] FIG. 5 is a schematic drawing showing a form of an electronic device frame according to one embodiment, excluding an injection molded product.

[0021] FIG. 6 is a drawing for explaining a manufacturing and bonding process of a frame of an electronic device according to one embodiment.

[0022] FIGS. 7A to 7J are schematic drawings illustrating a manufacturing and bonding process of a frame of an electronic device according to one embodiment.

[0023] FIG. 8 is a drawing showing a structure in which a side portion of a frame and a first support member and a second support member are combined according to one embodiment.

[0024] FIG. 9 is a drawing showing a structure in which a corner portion of a frame and a first support member and a second support member are combined according to one embodiment.

[0025] Figure 10 is a drawing showing the form of a frame before mounting a printed circuit board according to one embodiment.

[0026] FIGS. 11A and 11B are drawings showing a contact portion of a frame according to one embodiment.

[0027] Figure 12 is a drawing showing the form of a frame after mounting a printed circuit board according to one embodiment.

[0028] FIG. 13a and FIG. 13b are drawings showing a form in which a frame and a printed circuit board are electrically connected according to one embodiment.

[0029] FIG. 14 is a drawing showing a form in which a frame of an electronic device according to one embodiment is formed using stainless steel.

[0030] FIG. 15 is a schematic drawing of a portion of a frame of an electronic device according to one embodiment.

[0031] FIG. 16 is a schematic drawing of a portion of a frame of an electronic device according to one embodiment.

[0032] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0033] Hereinafter, various embodiments of the present invention will be described with reference to the attached drawings. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the present invention encompasses various modifications, equivalents, and / or alternatives of the embodiments.

[0034] Embodiments of the present disclosure relate to an electronic device including a frame joined by cladding and thermal bonding, and a method for manufacturing the same. According to one embodiment, a portion of the frame of the electronic device is formed of a clad metal, and the frame can be joined to an inner support member of the frame by welding or insert injection. Through this, for example, the frame and the support member can be stably joined, and deformation or breakage of the frame can be prevented or reduced, thereby improving problems that may arise with respect to antenna performance. Furthermore, for example, a corner portion of the frame of the electronic device can be formed from a single metal, thereby allowing for various implementations of the curvature formed by the corner portion.

[0035] FIG. 1A is a perspective view of the front of an electronic device according to one embodiment.

[0036] FIG. 1b is a perspective view of the rear surface of an electronic device according to one embodiment.

[0037] FIG. 1c is an exploded perspective view of an electronic device according to one embodiment.

[0038] Referring to FIGS. 1A and 1B , in one embodiment, an electronic device (100) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment, the housing may also refer to a structure that forms a portion of the first side (110A), the second side (110B), and the side surface (110C) of FIG. 1A . According to one embodiment, the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The rear plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (110C) may be formed by a side bezel structure (or “side member”) (150) that is joined to the front plate (102) and the rear plate (111) and comprises a metal and / or polymer. In one embodiment, the rear plate (111) and the side bezel structure (150) (e.g., the frame (120) of FIG. 4) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0039] In the illustrated embodiment, the front plate (102) may include two first regions (110D) that extend seamlessly from the first side (110A) toward the rear plate (111). The two first regions (110D) may be positioned at both ends of a long edge of the front plate (102). In the illustrated embodiment (see FIG. 1B), the rear plate (111) may include two second regions (110E) that extend seamlessly from the second side (110B) toward the front plate (102). The two second regions (110E) may be positioned at both ends of a long edge of the rear plate (111). In one embodiment, the front plate (102) (or the rear plate (111)) may include only one of the first regions (110D) (or the second regions (110E)). In one embodiment, the front plate (102) (or the rear plate (111)) may not include some of the first regions (110D) or the second regions (110E). In the above embodiments, when viewed from the side surface (110C) of the electronic device (100), the frame (120) may have a first thickness (or width) on the side surface (110C) that does not include the first regions (110D) or the second regions (110E), and may have a second thickness that is thinner than the first thickness on the side surface (110C) that includes the first regions (110D) or the second regions (110E).

[0040] According to one embodiment, the electronic device (100) may include at least one of a display (101), an audio hole (e.g., a microphone hole (103), a speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a fourth sensor module (116), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.

[0041] The display (101) may be visually exposed, for example, through at least a portion of the front plate (102). In one embodiment, at least a portion of the display (101) may be visually exposed through the front plate (102) forming the first surface (110A) and the first areas (110D) of the side surfaces (110C). In one embodiment, the corners of the display (101) may be formed to correspond to adjacent outer shapes of the front plate (102). In one embodiment, in order to expand the area in which the display (101) is visually exposed, the gap between the outer edges of the display (101) and the outer edges of the front plate (102) may be formed to be substantially the same.

[0042] In one embodiment, a recess or opening may be formed in a portion of a screen display area of ​​the display (101), and at least one of an audio hole (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening. In one embodiment, at least one of an audio hole (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (e.g., a fourth sensor module (116)), and a light-emitting element (106) may be included on a back surface of the screen display area of ​​the display (101). In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (e.g., pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, at least a portion of the sensor modules (e.g., the first sensor module (104), the fourth sensor module (116), the third sensor module (119)) and / or at least a portion of the key input device (117) may be disposed in the first areas (110D) and / or the second areas (110E).

[0043] The above audio hole may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone placed inside to acquire external sounds, and in one embodiment, multiple microphones may be placed to detect the direction of the sounds. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole and the microphone hole (103) may be implemented as a single hole, or a speaker may be implemented without the speaker hole (e.g., a piezo speaker).

[0044] The sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (116) (e.g., a fingerprint sensor) disposed on a second surface (110B) of the housing (110). The fingerprint sensor may be disposed on the first surface (110A) of the housing (110) (e.g., the display (101) as well as the second surface (110B). The electronic device (100) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (e.g., the first sensor module (104)).

[0045] The camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (100), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera lenses, wide-angle lenses, and telephoto lenses) and image sensors may be disposed on one side of the electronic device (100).

[0046] The key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (100) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101). In one embodiment, the key input device (117) may include a sensor module (e.g., a fourth sensor module (116)) disposed on a second surface (110B) of the housing (110).

[0047] The light emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light emitting element (106) may provide, for example, status information of the electronic device (100) in the form of light. In one embodiment, the light emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light emitting element (106) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and a xenon lamp.

[0048] The connector holes (108, 109) may include a first connector hole (108) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device. In one example, the second connector hole (109) may be omitted from the electronic device (100).

[0049] Referring to FIG. 1C, in one embodiment, the electronic device (100) may include a frame (120), a first support member (110F) (e.g., a bracket), a front plate (102) (e.g., a cover window or a cover plate), a display (101), a first printed circuit board (110H), a battery (110J), a second printed circuit board (110L), an antenna structure (110K), and a rear plate (111) (e.g., a rear case). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., the first support member (110F) or the second printed circuit board (110L)) or may additionally include other components. At least one of the components of the electronic device (100) may be identical or similar to at least one of the components of the electronic device (100) of FIG. 1A or FIG. 1B, and any redundant description thereof will be omitted below.

[0050] The first support member (110F) may be disposed inside the electronic device (100) and connected to the frame (120), or may be formed integrally with the frame (120). The first support member (110F) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. A display (101) may be coupled to one surface of the first support member (110F), and a first printed circuit board (110H) may be coupled to the other surface of the first support member (110F). A processor, a memory, and / or an interface may be mounted on the first printed circuit board (110H). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a USB interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0051] The battery (110J) is a device for supplying power to at least one component of the electronic device (100), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (110J) may be disposed substantially on the same plane as, for example, the first printed circuit board (110H). The battery (110J) may be integrally disposed within the electronic device (100), or may be disposed so as to be detachably attached to the electronic device (100).

[0052] An antenna structure (110K) may be disposed between the rear plate (111) and the battery (110J). The antenna structure (110K) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna structure (110K) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part of the frame (120) and / or the first support member (110F), or a combination thereof.

[0053] In one embodiment, the configurations of FIGS. 1A to 1C and the descriptions provided for the configurations may be equally referenced to the same configurations of FIGS. 4 to 14.

[0054] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment.

[0055] FIG. 2b is a plan view of the rear side of an electronic device according to one embodiment.

[0056] Referring to FIGS. 2A and 2B , in one embodiment, an electronic device (e.g., a foldable electronic device) (300) may include a first housing (310) (e.g., a first housing structure) including a first side member (313) (e.g., a side bezel) and a second housing (320) (e.g., a second housing structure) including a second side member (323) (e.g., a side bezel) that are foldably coupled with each other about a folding axis (F) through at least one hinge device (340, 340-1) (e.g., a hinge module or a hinge structure). For example, the first housing (310) and the second housing (320) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (300) may include a first display (330) (e.g., a flexible display, a foldable display, or a main display) arranged to be supported by a first housing (310) and a second housing (320). For example, the first housing (310) may include a first side (311) and a second side (312) facing in an opposite direction (e.g., a -z-axis direction) of the first side (311). For example, the second housing (320) may include a third side (321) and a fourth side (322) facing in an opposite direction (e.g., a -z-axis direction) of the third side (321). For example, the first housing (310) may include a first rear cover (314) coupled with a first side member (313). For example, the second housing (320) may include a second rear cover (324) coupled with a second side member (323). For example, when the electronic device (300) is in a first state in which it is fully unfolded (e.g., an unfolded state or an unfolded state), the first side (311) and the third side (321) may face substantially the same direction (e.g., a z-axis direction). For example, when the electronic device (300) is in a second state in which it is fully folded (e.g., a folded state or a folded state), the first side (311) and the third side (321) may face each other or face opposite directions.For example, the electronic device (300) may be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0057] According to one embodiment, the electronic device (300) may include a first receiver (301), at least one first sensor module (304) (e.g., an ambient light sensor) and / or at least one first camera module (305) (e.g., a UDC, under display camera) disposed on a first side (311) of the first housing (310). For example, the electronic device (300) may include at least one key (306) disposed on a first side member (313). For example, the electronic device (300) may include at least one second camera module (308) and / or a flash (309) disposed on a second side (312) of the first housing (310) (e.g., a first rear cover (314)). For example, the electronic device (300) may include a second display (331) disposed on a fourth side (322) of a second housing (320), at least one third camera module (325) (e.g., UDC, under display camera), at least one second sensor module (326), and / or a second receiver (327). For example, the second display (331) may be disposed to be visible from the outside through at least a portion of the second rear cover (324). For example, the electronic device (300) may include a speaker hole (302) disposed on a second side member (323), a microphone hole (303) disposed on a first side member (313), and / or a connector port (307). At least some of the aforementioned components may be disposed in the first housing (310) and / or the second housing (320).

[0058] According to one embodiment, the first display (330) (e.g., a flexible display) may include a first area (330a) (e.g., a first planar portion) corresponding to at least a portion of the first surface (311), a second area (330b) (e.g., a second planar portion) corresponding to at least a portion of the third surface (321), and a third area (330c) (e.g., a flexible portion) connecting the first area (330a) and the second area (330b) and allowing the electronic device (300) to be deformed in a second state (e.g., a folded state) and / or a third state. For example, the third area (330c) may be positioned to at least partially overlap at least one hinge device (340, 340-1) when the first display (330) is viewed from above (e.g., in the z-axis direction). For example, the first display (330) may be arranged so that it is not visible from the outside in the second state by having the first side (311) and the third side (321) face each other (e.g., inward-fold type). For example, the first display (330) may be arranged so that it is visible from the outside in the second state by having the first side (311) and the third side (321) face each other in opposite directions (e.g., outward-fold type).

[0059] FIG. 2c is an exploded perspective view of a portion of the electronic device of FIGS. 2a and 2b including a hinge device according to one embodiment.

[0060] Referring to FIG. 2C, in one embodiment, the electronic device (300) may include at least one hinge device (340, 340-1) (e.g., a hinge module or a hinge structure) connecting the first housing (310) and the second housing (320) under the first display (330) (e.g., in the -z-axis direction). For example, the at least one hinge device (340, 340-1) may include a first hinge device (340) and a second hinge device (340-1) spaced apart from the first hinge device (340) along a direction parallel to the folding axis (F) (e.g., in the ±y-axis direction). For example, at least one hinge device (340, 340-1) may be supported by a first support member (3131) extending from the first side member (313) to the first space (3101) of the first housing (310) and a second support member (3231) extending from the second side member (323) to the second space (3201) of the second housing (320). For example, at least one hinge device (340, 340-1) may be arranged between the first housing (310) and the second housing (320) so as to be invisible from the outside through a hinge housing (350) (e.g., a hinge cover).

[0061] According to one embodiment, the first hinge device (340) may include a first rotation member (341) (e.g., a first arm or a first rotator) disposed on a first support member (3131) of the first housing (310), a second rotation member (342) (e.g., a second arm or a second rotator) disposed on a second support member (3231) of the second housing (320), and a gear assembly (343) connected to the first rotation member (341) and the second rotation member (342) such that the first housing (310) and the second housing (320) rotate symmetrically with respect to each other. For example, the gear assembly (343) may include a plurality of gears (e.g., spur gears and / or worm gears) gear-coupled with respect to one another. For example, the gear assembly (343) may include a cam coupling structure for urging the first housing (310) and the second housing (320) in a direction in which they are to transition from a first state (e.g., an unfolded state or an unfolded state) to a second state (e.g., a folded state or a folded state) or in a direction in which they are to transition from the second state to the first state, based on a predetermined angle, and for providing a free stop at various folding angles. For example, the second hinge device (340-1) may have substantially the same configuration as the first hinge device (340).

[0062] According to one embodiment, the electronic device (300) may include a first hinge plate (361) connected to a first support member (3131) and / or a first rotation member (341). The electronic device (300) may include a second hinge plate (362) connected to a second support member (3231) and / or a second rotation member (342). For example, at least one hinge device (340, 340-1), the first rotation member (341), the second rotation member (342), the first hinge plate (361), and the second hinge plate (362) may form substantially the same plane as the first support member (3131) and the second support member (3231) when the electronic device (300) is in a first state. For example, the second hinge device (340-1) may be substantially symmetrical with the first hinge device (340) or may have a substantially identical configuration.

[0063] In one embodiment, the configurations of FIGS. 2A to 2C and the descriptions provided for the configurations may be equally referenced to the same configurations of FIG. 15.

[0064] FIG. 3A is a perspective view of the front of an electronic device according to one embodiment.

[0065] FIG. 3b is a plan view of the rear side of an electronic device according to one embodiment.

[0066] Referring to FIGS. 3A and 3B , in one embodiment, an electronic device (e.g., a foldable electronic device) (400) may include a first housing (410) (e.g., a first housing structure) including a first side member (413) (e.g., a side bezel) and a second housing (420) (e.g., a second housing structure) including a second side member (423) (e.g., a side bezel) that are foldably coupled to each other with respect to a folding axis (F) through at least one hinge device (440, 440-1) (e.g., a hinge module or a hinge structure). For example, the first housing (410) and the second housing (420) may be configured as a foldable housing (e.g., a housing structure). For example, the electronic device (400) may include a first display (430) (e.g., a flexible display, a foldable display, or a main display) arranged to be supported by a first housing (410) and a second housing (420). For example, the first housing (410) may include a first side (411) and a second side (412) facing in an opposite direction (e.g., a -z-axis direction) of the first side (411). For example, the second housing (420) may include a third side (421) and a fourth side (422) facing in an opposite direction (e.g., a -z-axis direction) of the third side (421). For example, the first housing (410) may include a first rear cover (414) coupled with a first side member (413). For example, the second housing (420) may include a second rear cover (424) coupled with a second side member (423). For example, when the electronic device (400) is in a fully unfolded first state (e.g., an unfolded state or a spread state), the first side (411) and the third side (421) may be arranged to face substantially the same direction (e.g., the z-axis direction).For example, when the electronic device (400) is in a fully folded second state (e.g., a folded state or a collapsed state), the first side (411) and the third side (421) may be arranged to face each other or face in opposite directions. For example, the electronic device (400) may also be operated to maintain a third state (e.g., an intermediate state) between the first state and the second state.

[0067] According to one embodiment, the electronic device (400) may include a receiver hole (401) disposed on a first side (411) of a first housing (410), at least one sensor module (404) (e.g., an ambient light sensor), and / or at least one first camera module (405) (e.g., a UDC, under display camera). For example, the electronic device (400) may include at least one key (406) disposed on a first side member (413). For example, the electronic device (400) may include a second display (431) (e.g., a sub-display), at least one second camera module (408), and / or a flash (409) disposed on a second side (412) of the first housing (410) (e.g., a first rear cover (414)). For example, the second display (431) may be disposed to be visible from the outside through at least a portion of the first rear cover (414). For example, the electronic device (400) may include a speaker hole (402), a microphone hole (403), or a connector port (407) arranged in the second side member (423). At least some of the aforementioned plurality of components may be arranged in the first housing (410) and / or the second housing (420).

[0068] According to one embodiment, the first display (430) (e.g., a flexible display) may include a first region (430a) (e.g., a first planar portion) corresponding to at least a portion of the first surface (411), a second region (430b) (e.g., a second planar portion) corresponding to at least a portion of the third surface (421), and a third region (430c) (e.g., a flexible portion) connecting the first region (430a) and the second region (430b) and allowing the electronic device (400) to be deformed in a second state (e.g., a folded state) and / or a third state (e.g., an intermediate state). For example, the third region (430c) may be positioned at a position at least partially overlapping at least one hinge device (440, 440-1) when the first display (430) is viewed from above (e.g., in the z-axis direction). For example, the first display (430) may be arranged so that it is not visible from the outside in the second state by having the first side (411) and the third side (421) face each other (e.g., inward-fold type). For example, the first display (430) may be arranged so that it is visible from the outside in the second state by having the first side (411) and the third side (421) face each other in opposite directions (e.g., outward-fold type).

[0069] FIG. 3c is an exploded perspective view of a portion of the electronic device of FIGS. 3a and 3b including a hinge device according to one embodiment.

[0070] Referring to FIG. 3C, in one embodiment, the electronic device (400) may include at least one hinge device (440, 440-1) (e.g., a hinge module or a hinge structure) connecting the first housing (410) and the second housing (420) under the first display (430) (e.g., in the -z-axis direction). For example, the at least one hinge device (440, 440-1) may include a first hinge device (440) and a second hinge device (440-1) spaced apart from the first hinge device (440) along a direction parallel to the folding axis (F) (e.g., in the y-axis direction). For example, at least one hinge device (440, 440-1) may be supported by a first support member (4131) extending from the first side member (413) to the first space (4101) of the first housing (410) and a second support member (4231) extending from the second side member (423) to the second space (4201) of the second housing (420). For example, at least one hinge device (440, 440-1) may be arranged between the first housing (410) and the second housing (420) so as to be invisible from the outside through a hinge housing (450) (e.g., a hinge cover).

[0071] According to one embodiment, the first hinge device (440) may include a first rotation member (441) (e.g., a first arm or a first rotator) disposed on a first support member (4131) of the first housing (410), a second rotation member (442) (e.g., a second arm or a second rotator) disposed on a second support member (4231) of the second housing (420), and a gear assembly (443) connected to the first rotation member (441) and the second rotation member (442) such that the first housing (410) and the second housing (420) rotate symmetrically with respect to each other. For example, the gear assembly (443) may include a plurality of gears (e.g., spur gears and / or worm gears) gear-coupled with respect to one another. For example, the gear assembly (443) may include a cam coupling structure for urging the first housing (410) and the second housing (420) in a direction in which they are to transition from a first state (e.g., an unfolded state or an unfolded state) to a second state (e.g., a folded state or a folded state) or in a direction in which they are to transition from the second state to the first state, based on a predetermined angle, and for providing a free stop at various folding angles. For example, the second hinge device (440-1) may be substantially symmetrical with respect to the first hinge device (440), or may have a configuration that is substantially the same.

[0072] According to one embodiment, the electronic device (400) may be coupled with at least one hinge device (440, 440-1) and may include at least one detent module (444) for providing a stopping sensation at various angles. For example, at least one hinge device (440, 440-1) and / or the detent module (444) may form substantially the same plane as the first support member (4131) and the second support member (4231) when the electronic device (400) is in the first state. For example, the second hinge device (440-1) may be substantially symmetrical with the first hinge device (440) or may have a substantially identical configuration.

[0073] In one embodiment, the configurations of FIGS. 3A to 3C and the descriptions provided for the configurations may be equally referenced to the same configurations of FIG. 16.

[0074] FIG. 4 is a schematic drawing showing the shape of a frame of an electronic device according to one embodiment.

[0075] FIG. 5 is a schematic drawing showing a form of an electronic device frame according to one embodiment, excluding an injection molded product.

[0076] Fig. 4 is a drawing showing the form of a frame (120) in which both the first support member (110F) and the second support member (110G) are coupled to the frame (120). Fig. 5 is a drawing showing the form in which only the first support member (110F) is coupled to the frame (120).

[0077] Referring to FIGS. 1A to 1C, 4, and 5, in one embodiment, an electronic device (100) may include a housing (110). The housing (110) may include a first surface (110A) (e.g., a front surface), a second surface (110B) (e.g., a rear surface), a side surface (110C) surrounding a space between the first surface (110A) and the second surface (110B), a first support member (110F) and a printed circuit board (e.g., the first printed circuit board (110H) of FIG. 12) disposed in the space, and a second support member (110G) joining the side surface (110C) and the first support member (110F).

[0078] The side surface (110C) may include a frame (120) (e.g., the side bezel structure (150) of FIG. 1C). In one embodiment, the frame (120) may include a corner portion (120a), a first side portion (120b), and a second side portion (120c) forming at least a portion of the side surface (110C). The corner portion (120a) may be formed in a portion of an area where two corners of the side surface (110C) meet. The first side portion (120b) may be formed to be spaced apart from the corner portion (120a) in a first direction (e.g., the -y-axis direction), and the second side portion (120c) may be formed to be spaced apart from the corner portion (120a) in a second direction (e.g., the +x-axis direction) perpendicular to the first direction.

[0079] In one embodiment, when the frame (120) is formed in a rectangular shape (or has four corners), the frame (120) may include four different corner parts. For example, a plurality of corner parts (120a) may be provided, and the plurality of corner parts (120a) may include four different corner parts including a portion extending in the x-axis direction and a portion extending in the y-axis direction. For example, when the frame (120) is viewed from above (e.g., when viewed in the +z-axis direction), the frame (120) may include a corner part (120a_4) formed in the upper left, a corner part (120a_1) formed in the upper right, a corner part (120a_2) formed in the lower left, and a corner part (120a_3) formed in the lower right.

[0080] In one embodiment, when the frame (120) is formed in a rectangular shape (or has four corners), the frame (120) may include a first side portion (120b), a second side portion (120c), a third side portion (120b') formed to face the first side portion (120b), and a fourth side portion (120c') formed to face the second side portion (120c). For example, when the frame (120) is viewed from above (e.g., when viewed in the +z-axis direction), the first side portion (120b) may form at least a portion of a left area of ​​the frame (120), and the second side portion (120c) may form at least a portion of an upper area of ​​the frame (120). Additionally, as an example, the third side portion (120b') may form at least a portion of the right area of ​​the frame (120), and the fourth side portion (120c') may form at least a portion of the lower area of ​​the frame (120). In one embodiment, the corner portions may include a folded portion formed to have at least one specified curvature. The folded portion may be formed to have a curvature within a range of several mm (e.g., 0.5 mm to 8 mm).

[0081] The frame (120) may be formed from a metal material. In one embodiment, the frame (120) may be formed from a first metal (e.g., titanium) and a second metal (e.g., aluminum). In one embodiment, the corner portion (120a) may be formed from the first metal. For example, the corner portion (120a) may be formed only from the first metal. For example, the corner portion (120a) may not include a clad metal bonded to a dissimilar metal (e.g., a second metal) to the first metal. For example, the corner portion (120a) may be formed without including a clad structure. In one embodiment, the first side portion (120b) may include a first outer portion (121b) formed from the first metal and a first inner portion (122b) formed from the second metal. For example, the first side portion (120b) may be formed by combining a first outer portion (121b) formed of a first metal and a first inner portion (122b) formed of a second metal. The first outer portion (121b) may be arranged on a surface facing the outside of the housing (110) (e.g., a surface facing the -x-axis direction) to form a part of the side portion (110C). The first inner portion (122b) may be arranged on a surface facing the inside of the housing (110) (e.g., a surface facing the +x-axis direction) (or an inner surface of the first outer portion (121b)). In one embodiment, the first side portion (120b) may include a clad metal to which the first outer portion (121b) and the first inner portion (122b) are combined. For example, the first side portion (120b) may include a clad metal in which a first metal (e.g., titanium) and a second metal (e.g., aluminum) are combined. In one embodiment, the second side portion (120c) may be formed with a structure (e.g., a clad structure) substantially identical to the first side portion (120b).For example, the second side portion (120c) may include a clad metal in which a second outer portion (e.g., the second outer portion (121c) of FIG. 7a) is disposed on an exterior surface of the housing (110) (e.g., a surface facing the +y axis) and a second inner portion (e.g., the second inner portion (122c) of FIG. 7a) is disposed on an interior surface of the housing (110) (e.g., a surface facing the -y axis) (or an inner surface of the second outer portion (121c)) are combined. In one embodiment, the third side portion (120b') and / or the fourth side portion (120c') may be formed with a structure substantially the same as the first side portion (120b) (e.g., a clad structure). The clad metal (or clad structure) will be described in detail later with reference to FIGS. 7a and 7b.

[0082] In one embodiment, gaps (120d) may be formed in an area other than the area formed by the frame (120) of the side surface (110C). For example, a gap (120d) may be formed between the corner portion (120a) and the first side surface (120b), and a gap (120d) may be formed between the corner portion (120a) and the second side surface (120c). For example, the frame (120) may be formed in a form in which the first side surface (120b), the corner portion (120a), and the second side surface (120c) are separated at a constant interval (e.g., the gap (120d)). Alternatively, for example, the frame (120) may include a structure in which a first side portion (120b), an upper left corner portion (120a_4), a second side portion (120c), an upper right corner portion (120a_1), a third side portion (120b'), a lower right corner portion (120a_3), a fourth side portion (120c'), and a lower left corner portion (120a_2) are spaced apart at a constant interval (e.g., a gap (120d)). Accordingly, when the frame (120) is formed of metal, at least one of the corner portions (120a_1, 120a_2, 120a_3, 120a_4), the first side portion (120b), the second side portion (120c), the third side portion (120b'), or the fourth side portion (120c') may be a conductive segment that can be used as an antenna radiator. In one embodiment, the gaps (120d) may be filled with an injection-molded material (or a non-conductive member) (e.g., the second support member (110G)). This will be described in detail later with reference to FIGS. 7h, 8, and 9. For example, the gaps (120d) may be referred to as an insulating member. In one embodiment, the third side portion (120b') may be formed of substantially the same process and metal as the first side portion (120b), and the fourth side portion (120c') may be formed of substantially the same process and metal as the second side portion (120c). Therefore, for convenience of explanation, the following description will focus on the first side portion (120b) and the second side portion (120c).However, the shape and / or material of the third side portion (120b') and the fourth side portion (120c') are not necessarily limited to the shape and / or material of the first side portion (120b) and the second side portion (120c), and the shape and / or material of the third side portion (120b') and the fourth side portion (120c') may be formed differently from the first side portion (120b) and the second side portion (120c).

[0083] The first support member (110F) can be placed in the internal space of the housing (110) (e.g., the internal space of the frame (120)). The first support member (110F) may be formed to support various components of the electronic device (100) (e.g., the display (101) or the printed circuit board (e.g., the first printed circuit board (110H) of FIG. 12). In one embodiment, the first support member (110F) may be formed to be physically and / or electrically connected to the frame (120). Through this, at least a portion of the frame (120) (e.g., the corner portion (120a), the first side portion (120b), or the second side portion (120c)) may be electrically connected to the first printed circuit board (110H). In one embodiment, the first support member (110F) may be formed from a second metal. For example, the second metal may be aluminum or an aluminum alloy. Alternatively, in one embodiment, the first support member (110F) may be formed from a third metal. For example, the first support member The member (110F) may be formed of a metal different from the first metal and the second metal forming part of the frame (120). For example, the first support member (110F) may include a metal different from the second metal forming the first inner portion (122b).

[0084] The second support member (110G) may be coupled with the first support member (110F) and the frame (120). In one embodiment, the second support member (110G) may include a second-first support member (e.g., the second-first support member (120G) of FIG. 7f) coupled with the first support member (110F) and the first inner portion (122b), and a second-second support member (e.g., the second-second support member (121G) of FIG. 7h) coupled with the first support member (110F) and the corner portion (120a). In one embodiment, the second support member (110G) may be an injection-molded product formed by insert injection molding. In one embodiment, the second support member (110G) may be formed of a non-conductive material. This will be described in detail later with reference to FIGS. 7f and 7h.

[0085] FIG. 6 is a drawing for explaining a manufacturing and bonding process of a frame of an electronic device according to one embodiment.

[0086] FIGS. 7A to 7J are schematic drawings illustrating a manufacturing and bonding process of a frame of an electronic device according to one embodiment.

[0087] FIG. 7a is a drawing showing the shape of a frame (e.g., frame (120) of FIG. 4) before cutting processing (e.g., computer numerical control (CNC) processing). FIG. 7b is a drawing showing the shape of a frame (e.g., frame (120) of FIG. 4) after cutting processing. FIG. 7c is a drawing schematically showing a clad structure of the frame (120). FIG. 7c is a drawing showing the shape of area C of FIG. 7b as viewed in the +y-axis direction. FIG. 7d is a drawing showing the shape of a first support member (e.g., first support member (110F) of FIG. 4) after cutting processing.

[0088] With reference to FIGS. 1A to 1C, FIGS. 4 to 6, FIGS. 7A, 7B, 7C, and 7D, in one embodiment, in operation 601 of FIG. 6, at least a portion of the frame (120) (e.g., a corner portion (120a), a first side portion (120b), a second side portion (120c), a third side portion (120b'), or a fourth side portion (120c')) may be formed. Alternatively, in one embodiment, in operation 601 of FIG. 6, the corner portion (120a), the first side portion (120b), the second side portion (120c), the third side portion (120b'), and the fourth side portion (120c') may be formed. In one example, the first side portion (120b) may be formed from a first metal (e.g., titanium) and a second metal (e.g., aluminum). The first outer portion (121b) may be formed of a first metal, and the first inner portion (122b) may be formed of a second metal. The first outer portion (121b) and the first inner portion (122b) may be combined to form a first side portion (120b) as a single body. For example, the first outer portion (121b) and the first inner portion (122b) may be formed of a clad metal. For example, the first metal forming the first outer portion (121b) and the second metal forming the first inner portion (122b) may be mechanically combined through rolling. In this process, the joining surface (1211) formed between the first outer portion (121b) and the first inner portion (122b) can be formed flat compared to a case where the first outer portion (121b) and the first inner portion (122b) are joined through another process (e.g., laser hatching followed by die casting). For example, when the first side portion (120b) formed of clad metal is observed with the naked eye, the joining surface (1211) can be observed as a flat surface, not an undulating surface.In one embodiment, the first metal forming the first outer portion (121b) may include a titanium alloy of a high strength grade (e.g., Grade 4 or Grade 5). In one embodiment, the second metal forming the first inner portion (122b) may include a 6000 series aluminum alloy (e.g., aluminum-magnesium-silicon alloy) that is easy to form a clad metal with the first metal (e.g., titanium).

[0089] In one embodiment, at least a portion of the frame (120) (e.g., the second side portion (120c), the third side portion (120b'), or the fourth side portion (120c')) may be formed with substantially the same structure as the first side portion (120b). For example, the second side portion (120c) may include a second outer portion (121c) formed of a first metal (e.g., titanium) and a second inner portion (122c) formed of a second metal (e.g., aluminum). The second outer portion (121c) and the second inner portion (122c) may be formed of a clad metal to form the second side portion (120c) as a single body.

[0090] In one embodiment, in operation 603 of FIG. 6, cutting processing of the frame (120) and the first support member (110F) may be performed. The cutting processing of each of the frame (120) and the first support member (110F) may be performed simultaneously or sequentially. After the cutting processing, the frame (120) and the first support member (110F) may be formed in a corresponding shape (e.g., capable of interlocking with each other) so as to be coupled to each other. In other words, cutting processing (e.g., computer numerical control (CNC) processing) may be performed to couple (or join) the frame (120) and the first support member (110F).

[0091] In one embodiment, a surface of the frame (120) facing the interior space of the housing (110) may be cut. For example, an inner side of a corner portion (120a) (e.g., a portion positioned opposite to a portion forming a part of a side surface (110C) of the corner portion (120a), a first inner side portion (122b) of a first side portion (120b), and a second inner side portion (122c) of a second side portion (120c) may be cut. For example, in the corner portion (120a), a portion formed of a first metal (e.g., titanium) may be cut, while in the first side portion (120b) and the second side portion (120c), portions formed of a second metal (e.g., aluminum) may be cut. In this case, portions formed of the first metal in the first side portion (120b) and the second side portion (120c) may not be cut. Accordingly, the time required for cutting the portion formed of the first metal can be reduced from the time required for the entire process (e.g., the time required to perform operations 601 to 619 of FIG. 6).

[0092] Fig. 7e <701> is a drawing showing a welded form of a frame (e.g., frame (120) of Fig. 4) and a first support member (e.g., first support member (110F) of Fig. 4) after cutting processing. Fig. 7e <702> Is <701> This is an enlarged drawing of area D.

[0093] With reference to FIGS. 1A to 1C, FIGS. 4 to 7D, and FIG. 7E, in one embodiment, in operation 605 of FIG. 6, the frame (120) and the first support member (110F) may be joined to each other by welding. The corner portion (120a), the first side portion (120b), and the second side portion (120c) may be welded to the first support member (110F), respectively. In one embodiment, the first inner portion (122b) of the first side portion (120b) and the first support member (110F) may be joined by a first weld portion (142b) (e.g., a first connecting portion). Additionally, the corner portion (120a) and the first support member (110F) may be joined by a second weld portion (142a) (e.g., a second connecting portion). Accordingly, the first weld (142b) may join the second metal (e.g., aluminum) forming the first inner portion (122b) and the second metal (e.g., aluminum) forming the first support member (110F). In addition, the second weld (142a) may join the first metal (e.g., titanium) forming the corner portion (120a) and the second metal (e.g., aluminum) forming the first support member (110F). In one embodiment, the first weld (142b) and the second weld (142a) may be formed by laser welding. For example, the first weld (142b) and the second weld (142a) may be formed by a CW laser (continuous wave laser) or a pulse laser. For example, since the second weld (142a) corresponds to a weld between dissimilar metals (e.g., a first metal and a second metal), it may be formed by a pulse laser. When the second weld (142a) is formed by a pulse laser, the heat-affected zone of the first support member (110F) or corner portion (120a) adjacent to the second weld (142a) can be reduced. The formation positions of the first weld (142b) and the second weld (142a) will be described in detail later in Fig. 8.

[0094] In one embodiment, the 'bonding' of the frame (120) and the first support member (110F) through the first weld portion (142b) and the second weld portion (142a) may mean a physical connection and / or an electrical connection between the frame (120) and the first support member (110F). For example, the frame (120) and the first support member (110F) may be electrically connected through the first weld portion (142b) and the second weld portion (142a), and then physically connected by forming the second support member (110G).

[0095] FIG. 7F is a drawing showing a form in which a frame (e.g., frame (120) of FIG. 4) and a first support member (e.g., first support member (110F) of FIG. 4) are welded, and then a second support member (e.g., second support member (110G) of FIG. 4) is injected into the space between the frame (120) and the first support member (110F).

[0096] Referring to FIGS. 1A to 1C, FIGS. 4 to 7E, and FIG. 7F, in one embodiment, a second-first support member (120G) may be formed in operation 607 of FIG. 6. The second-first support member (120G) may be filled in a space between the frame (120) and the first support member (110F). The second-first support member (120G) may be formed by insert injection molding (e.g., first insert injection molding). For example, the second-first support member (120G) may be formed by inserting a synthetic resin (or resin) into a mold while the frame (120) and the first support member (110F) are formed. In one embodiment, the second-first support member (120G) may be formed of a synthetic resin in which glass fibers are added to polybutylene terephthalate (PBT) resin. Alternatively, in one embodiment, the second-first support member (120G) may be formed of a thermoplastic resin. For example, the second-first support member (120G) may be formed of at least one of polycarbonate (PC), polyphenylene sulfide (PPS), polyamide (PA), polyphthalamide (PPA), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polyaryl ether ketone (PAEK), or polyphenyl sulfone (PPSU), or a combination of two or more thereof. In this case, an inorganic material (e.g., glass fiber, carbon fiber, or talc) may be added to the second-first support member (120G) to secure impact resistance. Regarding the formation position of the 2-1 support member (120G), details are described later in FIGS. 8 and 9.

[0097] In one embodiment, a film made of an organic material may be formed on the frame (120) and the first support member (110F). For example, the organic film may be formed on the frame (120) and the first support member (110F) so that the 2-1 support member (120G) may be easily bonded to the frame (120) and the first support member (110F) through the organic film. For example, the organic film may be formed before the injection molding of the 2-1 support member (120G). The 'bonding' of the frame (120) and the first support member (110F) and the 2-1 support member (120G) may mean a physical bond. For example, the frame (120) and the first support member (110F) can be electrically connected to each other through the first welding portion (142b) and the second welding portion (142a), and the frame (120) and the first support member (110F) can be physically connected by forming the second-first support member (120G).

[0098] FIG. 7g is a drawing showing the form of a frame (e.g., frame (120) of FIG. 4), a first support member (110F), and a second-first support member (120G) that have undergone cutting processing after the formation of the second-first support member (120G).

[0099] Referring to FIGS. 1A to 1C, FIGS. 4 to 7F, and FIG. 7G, in one embodiment, cutting processing of the second-first support member (120G) may be performed in operation 609 of FIG. 6. For example, at least a portion of an area (e.g., a portion protruding out of the frame (120)) excluding a portion formed between the frame (120) and the first support member (110F) of the second-first support member (120G) may be cut. For example, portions excluding a portion physically connecting (or joining) the frame (120) and the first support member (110F) of the second-first support member (120G) may be removed through cutting processing (e.g., computer numerical control (CNC) processing). In one embodiment, the cutting processing may be performed multiple times (or repeatedly).

[0100] Figure 7h is a drawing showing the injection-molded form of the 2-2 support member (121G).

[0101] Referring to FIGS. 1A to 1C, FIGS. 4 to 7G, and FIG. 7H, in one embodiment, a second-second support member (121G) may be formed in operation 611 of FIG. 6. The second-second support member (121G) may fill an internal space (or interspace) formed by the frame (120), the first support member (110F), and the second-first support member (120G). As an example, the second-second support member (121G) may fill a gap (120d) of the frame (120). Accordingly, the second-second support member (121G) may form a part of a side surface (110C) of the electronic device (100) together with the corner portion (120a), the first side surface (120b), and the second side surface (120c). In one embodiment, the second-second support member (121G) may be formed by insert injection (e.g., second insert injection). For example, at least a portion of the injection-molded product (e.g., the second-second support member (121G)) formed by the second insert injection (e.g., a portion excluding a portion of the second-second support member (121G) that protrudes outside the frame (120)) may be filled into the gap (120d) of the frame (120). For example, the second-second support member (121G) may be formed by inserting a synthetic resin (or resin) into a mold while the frame (120), the first support member (110F), and the second-first support member (120G) are formed. In one embodiment, the second-second support member (121G) may be formed by a synthetic resin in which glass fiber is added to a polybutylene terephthalate (PBT) resin. Alternatively, in one embodiment, the second-second support member (121G) may be formed of a thermoplastic resin. For example, the second-second support member (121G) may be formed of any one of polycarbonate (PC), polyphenylene sulfide (PPS), polyamide (PA), polyphthalamide (PPA), polyethylene terephthalate (PET), polyether ether ketone (PEEK), polyaryl ether ketone (PAEK), or polyphenyl sulfone (PPSU).At this time, inorganic materials (e.g., glass fiber, carbon fiber, or talc) may be added to the 2-2 support member (121G) to ensure impact resistance. The formation location of the 2-2 support member (121G) will be described in detail later in FIGS. 8 and 9.

[0102] In one embodiment, a film made of an organic material may be formed on the frame (120), the first support member (110F), and the second-first support member (120G). For example, an organic film may be formed on the frame (120), the first support member (110F), and the second-first support member (120G), so that the second-second support member (121G) may be easily bonded to the frame (120), the first support member (110F), and the second-first support member (120G) through the organic film. For example, the organic film may be formed before injection molding of the second-second support member (121G). The term "bonding" between the frame (120), the first support member (110F), and the second-first support member (120G) and the second-second support member (121G) may mean a physical bond. For example, the bonding force between the frame (120), the first support member (110F), and the second-first support member (120G) can be supplemented by the second-second support member (121G).

[0103] FIG. 7i is a drawing showing the form of a frame (e.g., frame (120) of FIG. 4), a first support member (110F), a second-first support member (e.g., the second-first support member (120G) of FIG. 7g), and a second-second support member (121G) that have undergone cutting processing after the formation of the second-second support member (121G).

[0104] Referring to FIGS. 1A to 1C, FIGS. 4 to 7H, and FIG. 7I, in one embodiment, cutting processing of the 2-2 support member (121G) may be performed in operation 613 of FIG. 6. For example, at least a portion of an area (e.g., a portion protruding out of the frame (120)) of the 2-2 support member (121G) excluding a portion formed between the frame (120), the first support member (110F), and the 2-1 support member (120G) may be cut. For example, portions excluding a portion that physically connects (or joins) the frame (120), the first support member (110F), and the 2-1 support member (120G) of the 2-2 support member (121G) may be removed through cutting processing (e.g., computer numerical control (CNC) processing). In one embodiment, the cutting processing may be performed multiple times (or repeatedly).

[0105] In one embodiment, an anodizing and polishing process may be performed in operation 615 of FIG. 6. For example, in the anodizing process, an oxide film may be formed on the surface of the first support member (110F). Thereafter, in the polishing process, the oxide film formed on a portion formed of the first metal (e.g., titanium) of the frame (120) (e.g., a corner portion (120a) or a first outer portion (121b) of the first side portion (120b)) may be removed.

[0106] FIG. 7j is a drawing showing a form in which cutting processing and particle blasting are performed on a frame (e.g., frame (120) of FIG. 4), a first support member (110F), a second-first support member (e.g., the second-first support member (120G) of FIG. 7g), and a second-second support member (121G) that have undergone anodizing and polishing.

[0107] With reference to FIGS. 1A to 1C, FIGS. 4 to 7I, and FIG. 7J, in one embodiment, in operation 617 of FIG. 6, cutting processing of the frame (120), the first support member (110F), the second-first support member (120G), and the second-second support member (121G) may be performed. At this time, the cutting processing may be performed substantially the same as or similar to the cutting processing of the previous step (e.g., operation 609 or operation 613 of FIG. 6). In operation 619 of FIG. 6, particle blasting of the frame (120), the first support member (110F), the second-first support member (120G), and the second-second support member (121G) may be performed. In one embodiment, particle blasting may be a step for completing the shapes of the frame (120), the first support member (110F), the second-first support member (120G), and the second-second support member (121G) into a final form. For example, the shapes of the side surface (110C) of the electronic device (100) and the internal space of the electronic device (100) may be completed through particle blasting. In one embodiment, the particles used in particle blasting may be sand or steel balls (or shot).

[0108] In one embodiment, a physical vapor deposition (PVD) process or an anti-fingerprint (AF) process may be performed after the particle blasting process. For example, the exterior of the frame (120) polished through particle blasting (e.g., the first outer portion (121b) and the corner portion (120a) formed of the first metal (titanium)) may be subjected to PVD or AF processing, thereby allowing various colors to be implemented on the exterior of the frame (120).

[0109] FIG. 8 is a drawing showing a structure in which a side portion of a frame and a first support member and a second support member are combined according to one embodiment.

[0110] FIG. 8 is a cross-sectional view taken along line AA' of the shape of FIG. 4. Referring to FIGS. 1A to 1C, 4 to 7J, and 8, in one embodiment, the first inner portion (122b) may include a first surface (130b) and a second surface (131b). The first surface (130b) and the second surface (131b) may be formed perpendicular to each other. For example, the first surface (130b) may be a surface (e.g., a surface facing the +x-axis direction) that is joined to the second-first support member (120G) of the first inner portion (122b), and the second surface (131b) may be a surface (e.g., a surface facing the +z-axis direction) that is joined to the first support member (110F) of the first inner portion (122b). In one example, when the frame (120), the first support member (110F), and the second support member (110G) are viewed from the +z axis, at least a portion of the second surface (131b) may overlap with the first support member (110F).

[0111] The first side portion (120b) and the first support member (110F) may be electrically connected through a first weld portion (142b). In one embodiment, the first weld portion (142b) may be formed on the second surface (131b). For example, the first weld portion (142b) may be formed by melting the second surface (131b) and the first support member (110F), and at least a portion thereof may be formed to protrude above the second surface (131b) (e.g., in the +z-axis direction). In one embodiment, at least a portion of the first weld portion (142b) may be formed to protrude below the second surface (131b) (e.g., in the -z-axis direction). In one example, one end of the first welded portion (142b) (e.g., the end protruding in the +z-axis direction from the second surface (131b)) may be covered by the first support member (110F), and the other end (e.g., the end protruding in the -z-axis direction from the second surface (131b)) may be covered by the second-second support member (121G) (e.g., the second part (130g) of the second-second support member (121G)).

[0112] The first side portion (120b) and the first support member (110F) can be coupled (e.g., physically coupled) via a second support member (110G). In one embodiment, the second support member (110G) can include a second-first support member (120G) and a second-second support member (121G). For example, the second-first support member (120G) can be formed (e.g., injection molded) between the first inner portion (122b) and the first support member (110F), and can be integrally coupled with the frame (120) and the first support member (110F). In one example, the final shape of the 2-1 support member (120G) (e.g., the shape after all steps 601 to 619 of FIG. 6 are completed) may be a shape formed parallel to the first inner portion (122b) and the first support member (110F) in one direction (e.g., the x-axis direction). At this time, one surface of the 2-1 support member (120G) (e.g., the surface facing the -x-axis) may be joined to the first inner portion (122b), and the other surface (e.g., the surface facing the +x-axis) may be joined to the first support member (110F). In one embodiment, the 2-1 support member (120G) may be covered by the 2-2 support member (121G). For example, the upper portion (e.g., the upper portion in the z-axis direction) of the 2-1 support member (120G) may be covered by the 2-2 support member (121G) (e.g., the first portion (131g) of the 2-2 support member (121G)).

[0113] In one embodiment, the second-second support member (121G) may be formed (e.g., injection molded) between at least a portion of the first outer portion (121b) and the first support member (110F). For example, the second-second support member (121G) may be integrally joined with the frame (120), the first support member (110F), and the second-first support member (120G). In one example, the final form of the 2-2 support member (121G) (e.g., the form after all of steps 601 to 619 of FIG. 6 are completed) may include a first portion (131g) covering at least a portion of the first inner portion (122b), the 2-1 support member (120G), and the first support member (110F), and a second portion (130g) supporting the first inner portion (122b), the 2-1 support member (120G), and at least a portion of the first support member (110F). Due to the formation of the 2-2 support member (121G), the bond between the first side portion (120b) and the first support member (110F) can be more firmly maintained.

[0114] FIG. 9 is a drawing showing a structure in which a corner portion of a frame and a first support member and a second support member are combined according to one embodiment.

[0115] FIG. 9 is a cross-sectional view taken along line BB' of the shape of FIG. 4. Referring to FIGS. 1A to 1C, FIGS. 4 to 8, and FIG. 9, in one embodiment, the corner portion (120a) may include a third surface (130a) and a fourth surface (131a). The third surface (130a) and the fourth surface (131a) may be formed perpendicular to each other. For example, the third surface (130a) may be a surface (e.g., a surface facing the +x-axis direction) that is joined to the 2-1 support member (120G) of the corner portion (120a), and the fourth surface (131a) may be a surface (e.g., a surface facing the +z-axis direction) that is joined to the 1st support member (110F) of the corner portion (120a). In one example, when the frame (120), the first support member (110F), and the second support member (110G) are viewed from the +z axis, at least a portion of the fourth surface (131a) may overlap with the first support member (110F).

[0116] The corner portion (120a) and the first support member (110F) may be electrically connected through a second weld portion (142a). In one embodiment, the second weld portion (142a) may be formed on the fourth surface (131a). For example, the second weld portion (142a) may be formed by melting the fourth surface (131a) and the first support member (110F), and at least a portion thereof may be formed to protrude above the fourth surface (131a) (e.g., in the +z-axis direction). In one embodiment, at least a portion of the second weld portion (142a) may be formed to protrude below the fourth surface (131a) (e.g., in the -z-axis direction). In one example, one end of the second welded portion (142a) (e.g., the end protruding in the +z-axis direction from the fourth surface (131a)) may be covered by the first support member (110F), and the other end (e.g., the end protruding in the -z-axis direction from the fourth surface (131a)) may be covered by the second-second support member (121G) (e.g., 130g).

[0117] The corner portion (120a) and the first support member (110F) may be coupled (e.g., physically coupled) via the second support member (110G). In one embodiment, the second support member (110G) may include a second-first support member (120G) and a second-second support member (121G). For example, the second-first support member (120G) may be formed (e.g., injection molded) between the corner portion (120a) and the first support member (110F), and may be integrally coupled with the frame (120) and the first support member (110F). In one example, the final shape of the second-first support member (120G) (e.g., the shape after all steps 601 to 619 of FIG. 6 are completed) may be a shape formed between the core portion (120a) and the first support member (110F). For example, one side (e.g., a side facing the outside of the electronic device (100)) of the 2-1 support member (120G) may be joined to the corner portion (120a), and the other side (e.g., a side facing the inside of the electronic device (100)) may be joined to the 1st support member (110F). In one embodiment, the 2-1 support member (120G) may be covered by the 2-2 support member (121G). For example, the upper portion (e.g., an upper portion in the z-axis direction) of the 2-1 support member (120G) may be covered by the 2-2 support member (121G) (e.g., 131g).

[0118] The second-second support member (121G) can be formed (e.g., injection molded) between at least a portion of the corner portion (120a) and the first support member (110F), and can be integrally joined with the frame (120), the first support member (110F), and the second-first support member (120G). In one example, the final form of the second-second support member (121G) (e.g., the form after all of steps 601 to 619 of FIG. 6 are completed) can include a first portion (131g) covering at least a portion of the core portion (120a), the second-first support member (120G), and at least a portion of the first support member (110F), and a second portion (130g) supporting at least a portion of the core portion (120a) and at least a portion of the first support member (110F). Due to the formation of the 2nd-2 support member (121G), the connection between the corner portion (120a) and the 1st support member (110F) can be maintained more firmly.

[0119] Figure 10 is a drawing showing the form of a frame before mounting a printed circuit board according to one embodiment.

[0120] FIGS. 11A and 11B are drawings showing a contact portion of a frame according to one embodiment.

[0121] Fig. 10 is a drawing showing a state in which a frame (120) is coupled with a first support member (110F) and a second support member (110G). Fig. 11a is an enlarged view of area E of Fig. 10, and Fig. 11b is an enlarged view of area F of Fig. 10. Area E of Fig. 10 may correspond to an area in which a main printed circuit board (e.g., a main printed circuit board (111H) of Fig. 12) (e.g., a first printed circuit board) is placed, and area F of Fig. 10 may correspond to an area in which a sub printed circuit board (e.g., a sub printed circuit board (112H) of Fig. 12) (e.g., a second printed circuit board) is placed.

[0122] Referring to FIGS. 1A to 1C, 4 to 9, 10, 11A, and 11B, in one embodiment, the second side portion (120c) may include a first contact portion (140b) and a second contact portion (141b). For example, at least one of the first contact portion (140b) or the second contact portion (141b) may be formed on a surface facing the inside of the electronic device (100) of the second inner portion (e.g., the second inner portion (122c) of FIG. 7A). For example, the first contact portion (140b) may be configured to attach (e.g., electrically connect) a component for electrical connection to the second inner portion (122c). For example, the configuration may include a conductive pad (e.g., a metal sheet). In one embodiment, the first contact portion (140b) and the second contact portion (141b) may be formed on mutually perpendicular surfaces of the second side portion (120c). Alternatively, as an example, at least one of the first contact portion (140b) or the second contact portion (141b) may be formed to protrude from the second side portion (120c). For example, the second contact portion (141b) may be formed to protrude from the second side portion (120c) in a direction toward the inside of the electronic device (100). For example, a connection point (e.g., a grounding point and / or a feeding point) (e.g., a metal sheet) for electrical connection may be arranged at one end of a flange (e.g., the second contact portion (141b)) formed to protrude from a point of the second side portion (120c). In one embodiment, the first contact portion (140b) and the second contact portion (141b) may protrude in a mutually perpendicular direction from the second side portion (120c). In one embodiment, the first contact portion (140b) and the second contact portion (141b) may be in contact with a printed circuit board (e.g., the first printed circuit board (110H) of FIG. 12). This will be described in detail later with reference to FIGS. 12 to 13b.In one embodiment, the structure of the first side portion (120b) may be formed substantially identically to that of the second side portion (120c). For example, the first side portion (120b) may include a first contact portion (e.g., a first contact portion (140b)) and a second contact portion (e.g., a second contact portion (141b)). The first contact portion (e.g., the first contact portion (140b)) may be disposed, for example, on a surface parallel to the first surface (130b) of the first inner portion (122b), or may protrude from the surface parallel to the first surface (130b). The second contact portion (e.g., the second contact portion (141b)) may be disposed, for example, on a surface parallel to the second surface (131b) of the first inner portion (122b), or may protrude from the surface parallel to the second surface (131b).

[0123] In one embodiment, the corner portion (120a) may include a third contact portion (140a) and a fourth contact portion (141a). For example, at least one of the third contact portion (140a) or the fourth contact portion (141a) may be formed on a surface of the corner portion (120a) facing the inside of the electronic device (100). For example, the third contact portion (140a) may be configured to attach a component for electrical connection (e.g., electrical connection) to the corner portion (120a). For example, the configuration may include a conductive pad (e.g., a metal sheet). In one embodiment, the third contact portion (140a) and the fourth contact portion (141a) may be formed on mutually perpendicular surfaces of the corner portion (120a). Alternatively, for example, at least one of the third contact portion (140a) or the fourth contact portion (141a) may be formed to protrude from the corner portion (120a). For example, the corner portion (120a) may have a fourth contact portion (141a) formed to protrude from the corner portion (120a) in a direction toward the inside of the electronic device (100). For example, a connection point (e.g., a grounding point and / or a feeding point) (e.g., a metal sheet) for electrical connection may be arranged at one end of a flange (e.g., the fourth contact portion (141a)) formed to protrude from a point of the corner portion (120a). In one embodiment, the third contact portion (140a) and the fourth contact portion (141a) may protrude from the corner portion (120a) in a direction perpendicular to each other. In one embodiment, the third contact portion (140a) and the fourth contact portion (141a) may be in contact with a printed circuit board (e.g., the first printed circuit board (110H) of FIG. 12). This will be described in detail later with reference to FIGS. 12 to 13b.

[0124] In one embodiment, the shapes of the first contact portion (140b) and the second contact portion (141b) formed on the second side portion (120c) and the third contact portion (140a) and the fourth contact portion (141a) formed on the corner portion (120a) may be substantially the same in regions E and F of FIG. 10. However, the shapes of the contact portions (the first contact portion (140b), the second contact portion (141b), the third contact portion (140a), and the fourth contact portion (141a)) are not limited to the above-described contents and may be formed in different shapes. In addition, in one embodiment, the shapes of the contact portions (the first contact portion (140b), the second contact portion (141b), the third contact portion (140a), and the fourth contact portion (141a)) in regions E and F of FIG. 10 may be formed differently. In one embodiment, the first contact portion (140b) and the second contact portion (141b) may be formed of a second metal (e.g., aluminum), and the third contact portion (140a) and the fourth contact portion (141a) may be formed of a first metal (e.g., titanium).

[0125] Figure 12 is a drawing showing the form of a frame after mounting a printed circuit board according to one embodiment.

[0126] FIG. 13a and FIG. 13b are drawings showing a form in which a frame and a printed circuit board are electrically connected according to one embodiment.

[0127] FIG. 12 is a drawing showing a form in which a first printed circuit board (110H) is arranged in a state in which the frame (120), the first support member (110F), and the second support member (110G) of FIG. 10 are combined. FIG. 13a is an enlarged drawing of area G of FIG. 12, and FIG. 13b is an enlarged drawing of area H of FIG. 12. Area G of FIG. 12 may correspond to an area in area E of FIG. 10 in which a main printed circuit board (111H) is arranged, and area H of FIG. 12 may correspond to an area in area F of FIG. 10 in which a sub printed circuit board (112H) is arranged.

[0128] With reference to FIGS. 1A to 1C, 4 to 11B, 12, 13A, and 13B, in one embodiment, a first printed circuit board (110H) (or circuit board) may include a main printed circuit board (111H) and a sub-printed circuit board (112H) disposed on a first support member (110F). In one embodiment, the first printed circuit board (110H) may include a plurality of communication circuits. For example, the main printed circuit board (111H) may include a first communication circuit supporting a first frequency band, and a second communication circuit supporting a second frequency band. In addition, in one embodiment, the sub-printed circuit board (112H) may include a third communication circuit supporting a third frequency band. The first frequency band, the second frequency band, and the third frequency band may not overlap with each other.

[0129] In one embodiment, the main printed circuit board (111H) may include two or more printed circuit boards. For example, the main printed circuit board (111H) may be formed by combining two or more separate printed circuit boards. For example, the main printed circuit board (111H) may include a third printed circuit board and a fourth printed circuit board that are formed separately from each other. For example, the third printed circuit board may include an area that is in contact with the second side portion (120c) and the corner portion (120a) of the main printed circuit board (111H) (e.g., an area where the third terminal (131h) and the fourth terminal (141h) of the main printed circuit board (111H) of FIG. 13A are arranged). For example, the fourth printed circuit board may include an area where various components of the main printed circuit board (111H) (e.g., a processor, a memory, a wireless communication module, etc.) are arranged. The third printed circuit board and the fourth printed circuit board may be physically connected and / or electrically connected to each other.

[0130] In one embodiment, the first printed circuit board (110H) can be electrically connected to the frame (120) via at least one grounding point and / or a feeding point. At least a portion of the frame (120) (e.g., the corner portion (120a), the first side portion (120b), and the second side portion (120c)) can be used as an antenna radiator. As an example, the corner portion (120a) can be connected to the first communication circuit of the main printed circuit board (111H) and used as an antenna of the first communication circuit, and the first side portion (120b) can be connected to the second communication circuit of the main printed circuit board (111H) and used as an antenna of the second communication circuit. In this case, in one embodiment, the corner portion (120a) can be operated for a low frequency band of a cellular band, and the first side portion (120b) can be operated for a Wi-Fi band. Below, the electrical connection method between the first printed circuit board (110H) and the frame (120) will be described.

[0131] The sub-printed circuit board (112H) may include contact terminals that are in contact with the frame (120). For example, the sub-printed circuit board (112H) may include a first terminal (130h) and a second terminal (140h) that are connected to the ground of the sub-printed circuit board (112H), and a third terminal (131h) and a fourth terminal (141h) that are connected to a third communication circuit of the sub-printed circuit board (112H). In one embodiment, the first terminal (130h) and the second terminal (140h) may be in contact with a ground point of the frame (120) (e.g., the first contact portion (140b) or the third contact portion (140a) of FIG. 11B). For example, the first terminal (130h) may be in contact with the third contact portion (140a) of the corner portion (120a), and the second terminal (140h) may be in contact with the first contact portion (140b) of the second side portion (120c). In one embodiment, the third terminal (131h) and the fourth terminal (141h) may be in contact with an antenna feed (or, power supply portion) of the frame (120) (e.g., the second contact portion (141b) or the fourth contact portion (141a) of FIG. 11a). For example, the third terminal (131h) may be in contact with the fourth contact portion (141a) of the corner portion (120a), and the fourth terminal (141h) may be in contact with the second contact portion (141b) of the first side portion (120b). In one embodiment, the terminals (e.g., the first terminal (130h), the second terminal (140h), the third terminal (131h), and the fourth terminal (141h)) may be in contact (e.g., electrically connected) with the contact portions (e.g., the first contact portion (140b), the second contact portion (141b), the third contact portion (140a), and the fourth contact portion (141a)) via a connector (e.g., a coaxial connector, a C-Clip connector), a pogo pin, or any other connecting member).In one embodiment, at least one of the contact portions (e.g., the first contact portion (140b), the second contact portion (141b), the third contact portion (140a), and the fourth contact portion (141a)) may be attached with a conductive material (e.g., a metal sheet) so as to be able to stably contact (e.g., electrically connect) with the terminals (e.g., the first terminal (130h), the second terminal (140h), the third terminal (131h), and the fourth terminal (141h)).

[0132] The main printed circuit board (111H) may include contact terminals that are in contact with the frame (120). For example, the main printed circuit board (111H) may include a first terminal (e.g., a first terminal (130h) of FIG. 13B) and a second terminal (e.g., a second terminal (140h) of FIG. 13B) that are connected to the ground of the main printed circuit board (111H), and a third terminal (131h) and a fourth terminal (141h) that are connected to the first communication circuit of the main printed circuit board (111H). With respect to the main printed circuit board (111H), the description provided with respect to the sub-printed circuit board (112H) may be referred to substantially the same. However, in one embodiment, the contact forms of the main printed circuit board (111H) and the sub-printed circuit board (112H) with the frame (120) may be formed differently.

[0133] FIG. 14 is a drawing showing a form in which a frame of an electronic device according to one embodiment is formed using stainless steel.

[0134] Fig. 14 <1401> is a drawing showing a structure in which a first side portion (220b) of a frame (220), a first support member (210F), and a second support member (210G) are combined according to an embodiment of the present invention. FIG. 14 <1402> This is a drawing showing a structure in which a frame (220), a first support member (210F), and a second support member (210G) are combined, as viewed from the +z-axis direction, according to one embodiment.

[0135] Referring to FIGS. 1A to 1C, 4 to 13B, and 14, in one embodiment, the frame (220) may include a corner portion (220a), a first side portion (220b) including a first outer portion (221b) and a first inner portion (222b), and a second side portion (220c). The frame (220) may include a second metal (e.g., aluminum) and a third metal (e.g., stainless steel). As an example, the first side portion (220b) and the second side portion (220c) may be formed of a clad metal in which the second metal and the third metal are combined. For example, the first outer portion (221b) and the corner portion (220a) may be formed of the third metal, and the first inner portion (222b) may be formed of the second metal. In this case, a third metal (e.g., stainless steel) may form the exterior of the electronic device (e.g., the electronic device (100) of FIG. 1A). The description provided for the frame (220) of FIG. 4 may be used for the frame (120). The description provided for the corner portion (220a) of FIG. 4 may be used for the corner portion (120a). The description provided for the first side portion (220b) of FIG. 4 may be used for the first side portion (120b). The description provided for the first outer portion (221b) of FIG. 5 may be used for the first inner portion (222b). The description provided for the first inner portion (122b) of FIG. 5 may be used for the first surface (230b). The description provided for the second surface (131b) of FIG. 8 may be used for the second surface (231b). The description provided for the first weld portion (142b) of FIG. 8 may be used for the first weld portion (242b). The description provided for the second side portion (120c) of FIG. 4 may be used for the second side portion (220c). The description provided for the first support member (110F) of FIG. 4 may be used for the first support member (210F).The description provided for the second support member (110G) of FIG. 4 may be used for the second support member (210G). The description provided for the second-first support member (120G) of FIG. 8 may be used for the second-first support member (220G). The description provided for the second-second support member (121G) of FIG. 8 may be used for the second-second support member (221G). The description provided for the first part (231g) of the second-second support member (221G) of FIG. 8 may be used for the first part (131g) of the second-second support member (121G) of FIG. 8 may be used for the second part (230g) of the second-second support member (221G).

[0136] FIG. 15 is a schematic drawing of a portion of a frame of an electronic device according to one embodiment.

[0137] FIG. 15 is a drawing showing a portion of the first housing (310) and a portion of the hinge housing (350) with reference to FIGS. 2a to 2c.

[0138] Referring to FIGS. 2A to 2C and FIG. 15 , in one embodiment, the first housing (310) may include a first side member (313) forming a part of a frame of the electronic device (300) and a support member (328) disposed on the inside of the frame. The first side member (313) may include a hinge-side frame portion (313a), a corner frame portion (313b), and a corner frame portion (313c). The hinge-side frame portion (313a) may be defined as a portion (e.g., a left portion of FIG. 15 ) that is coupled to the hinge housing (350) of the first side member (313). The corner frame portion (313b) may be defined as a portion (e.g., a right portion of FIG. 15 ) that is formed in an opposite direction (e.g., facing) to the hinge-side frame portion (313a) of the first side member (313). The corner frame portion (313c) may be defined as a portion formed on both sides of the corner frame portion (313b) (e.g., in the +y-axis direction and the -y-axis direction). In one example, the hinge-side frame portion (313a) may include an extension portion (3132) extending in the y-axis direction and a protruding portion (3133) extending in the +x-axis direction from the extension portion (3132). Accordingly, the hinge-side frame portion (313a) may constitute at least a portion of a corner (e.g., a point where two corners meet) of the first housing (310). At least one gap (313d) may be formed between the hinge-side frame portion (313a) and the corner frame portion (313c). In addition, a gap (313d) may also be formed between the corner frame portion (313c) and the corner frame portion (313b). Through the above gap (313d), the hinge-side frame portion (313a), the edge frame portion (313b), and the corner frame portion (313c) can each be used as segments and as antenna radiators. The support portion (328) can be completely joined through insert injection after being welded (e.g., electrically connected) to the hinge-side frame portion (313a), the edge frame portion (313b), and the corner frame portion (313c).

[0139] In one embodiment, the hinge-side frame portion (313a) and the corner frame portion (313c) may be formed from a first metal (e.g., titanium). Furthermore, in one embodiment, the corner frame portion (313b) may include an outer frame portion (333b) formed from a first metal (e.g., titanium) and an inner frame portion (343b) formed from a second metal (e.g., aluminum). In one embodiment, the support portion (328) may be formed from a second metal (e.g., aluminum). In various embodiments, the support portion (328) may also be formed from a fourth metal (e.g., magnesium). In this case, the support portion (328) may be formed to be lighter than when formed from a second metal.

[0140] In one embodiment, a first antenna feed may be formed in the corner frame portion (313c). Additionally, a second antenna feed may be formed in the corner frame portion (313b). For example, the first antenna feed may be formed as a contact point that electrically connects a printed circuit board (e.g., the first printed circuit board (110H) of FIG. 12) disposed inside the electronic device (300) (e.g., disposed in the support portion (328)) and the corner frame portion (313c).

[0141] The description provided in relation to the frame (120) in FIGS. 1A to 1C and 4 to 14 may be used for the first side member (313) of FIG. 15. The description provided in relation to the corner portion (120a) in FIGS. 4 to 14 may be used for the hinge-side frame portion (313a) of FIG. 15. The description provided in relation to the first side portion (120b) in FIGS. 4 to 14 may be used for the corner frame portion (313b) of FIG. 15. The description provided in relation to the corner portion (120a) in FIGS. 4 to 14 may be used for the corner frame portion (313c) of FIG. 15. The description provided in relation to the first inner portion (122b) in FIGS. 5 to 14 may be used for the inner frame portion (343b) of FIG. 15. The description provided in relation to the first outer portion (121b) in FIGS. 5 to 14 may be used for the outer frame portion (333b) of FIG. 15. The description provided in relation to the first support member (110F) and the second support member (110G) in FIGS. 4 to 14 may be used for the support portion (328) of FIG. 15.

[0142] FIG. 16 is a schematic drawing of a portion of a frame of an electronic device according to one embodiment.

[0143] FIG. 16 is a drawing showing a portion of the first housing (410) and a portion of the hinge housing (450) with reference to FIGS. 3a to 3c.

[0144] Referring to FIGS. 3A to 3C and FIG. 16 , in one embodiment, the first housing (410) may include a first side member (413) forming a part of a frame of the electronic device (400) and a support member (428) disposed on the inside of the frame. The first side member (413) may include a hinge-side frame portion (413a), a corner frame portion (413b), and a corner frame portion (413c). The hinge-side frame portion (413a) may be defined as a portion (e.g., a lower portion of FIG. 16 ) that is coupled to the hinge housing (450) of the first side member (413). The corner frame portion (413b) may be defined as a portion (e.g., an upper portion of FIG. 16 ) that is formed in an opposite direction (e.g., facing) to the hinge-side frame portion (413a) of the first side member (413). The corner frame portion (413c) may be defined as a portion formed on both sides of the corner frame portion (413b) (e.g., in the +x-axis direction and the -x-axis direction). At least one gap (413d) may be formed between the hinge-side frame portion (413a) and the corner frame portion (413c). In addition, a gap (413d) may also be formed between the corner frame portion (413c) and the corner frame portion (413b). Through the gap (413d), the hinge-side frame portion (413a), the corner frame portion (413b), and the corner frame portion (413c) may each be used as a segment and as an antenna radiator. The support member (428) can be completely joined through insert injection after being welded (e.g., electrically connected) to the hinge-side frame member (413a), the corner frame member (413b), and the corner frame member (413c).

[0145] In one embodiment, the hinge-side frame portion (413a) and the corner frame portion (413c) may be formed from a first metal (e.g., titanium). Furthermore, in one embodiment, the corner frame portion (413b) may include an outer frame portion (433b) formed from a first metal (e.g., titanium) and an inner frame portion (443b) formed from a second metal (e.g., aluminum). In one embodiment, the support portion (428) may be formed from a second metal (e.g., aluminum). In various embodiments, the support portion (428) may also be formed from a fourth metal (e.g., magnesium). In this case, the support portion (428) may be formed to be lighter than when formed from a second metal.

[0146] In one embodiment, a first antenna feed may be formed in the corner frame portion (413c). Additionally, a second antenna feed may be formed in the corner frame portion (413b). For example, the first antenna feed may be formed as a contact point that electrically connects a printed circuit board (e.g., the first printed circuit board (110H) of FIG. 12) disposed inside the electronic device (400) (e.g., disposed in the support portion (428)) and the corner frame portion (413c).

[0147] The description provided in relation to the frame (120) in FIGS. 1A to 1C and 4 to 14 may be used for the first side member (413) of FIG. 16. The description provided in relation to the corner portion (120a) in FIGS. 4 to 14 may be used for the hinge-side frame portion (413a) of FIG. 16. The description provided in relation to the first side portion (120b) in FIGS. 4 to 14 may be used for the corner frame portion (413b) of FIG. 16. The description provided in relation to the corner portion (120a) in FIGS. 4 to 14 may be used for the corner frame portion (413c) of FIG. 16. The description provided in relation to the first inner portion (122b) in FIGS. 5 to 14 may be used for the inner frame portion (443b) of FIG. 16. The description provided in relation to the first outer portion (121b) in FIGS. 5 to 14 may be used for the outer frame portion (433b) of FIG. 16. The description provided in relation to the first support member (110F) and the second support member (110G) in FIGS. 4 to 14 may be used for the support portion (428) of FIG. 16.

[0148] In various embodiments, a frame (e.g., frame (120) of FIG. 4) of an electronic device (e.g., electronic device (100) of FIG. 1A) may include a support member (e.g., first support member (110F) of FIG. 4) and a second support member (110G) of FIG. 4). For example, a corner portion (e.g., corner portion (120a) of FIG. 4), a first side portion (e.g., first side portion (120b) of FIG. 4), a second side portion (e.g., second side portion (120c) of FIG. 4), a third side portion (e.g., third side portion (120b') of FIG. 4), a fourth side portion (e.g., fourth side portion (120c') of FIG. 4), the first support member (110F), and the second support member (110G) may be integrally formed to form a frame.

[0149] In various embodiments, a frame (e.g., the first side member (313) of FIG. 2A) of an electronic device (e.g., the electronic device (300) of FIG. 2A) may include a support member (e.g., the support member (328) of FIG. 15). For example, a hinge-side frame member (e.g., the hinge-side frame member (313a) of FIG. 15), a corner frame member (e.g., the corner frame member (313b) of FIG. 15), a corner frame member (e.g., the corner frame member (313c) of FIG. 15), and the support member (328) may be combined as a single body to form the frame (or the first side member (313)).

[0150] In various embodiments, a frame (e.g., the first side member (413) of FIG. 3A) of an electronic device (e.g., the electronic device (400) of FIG. 3A) may include a support member (e.g., the support member (428) of FIG. 16). For example, a hinge-side frame member (e.g., the hinge-side frame member (413a) of FIG. 16), a corner frame member (e.g., the corner frame member (413b) of FIG. 16), a corner frame member (e.g., the corner frame member (413c) of FIG. 16), and the support member (428) may be combined as a single body to form the frame (or the first side member (413)).

[0151] In various embodiments, the first outer portion (e.g., the first outer portion (121b) of FIG. 4) and the first inner portion (e.g., the first inner portion (122b) of FIG. 4) of the first side portion (e.g., the first side portion (120b) of FIG. 4) may be formed to have the same thickness in the second direction (e.g., in the +x-axis direction). Alternatively, in various embodiments, the second direction thicknesses of the first outer portion (121b) and the first inner portion (122b) may be formed differently. In addition, the second direction thicknesses of each of the first outer portion (121b) and the first inner portion (122b) may be formed differently within the first side portion (120b). For example, the second direction thickness of the first inner portion (122b) located at the upper portion (e.g., +y-axis portion) of the first side portion (120b) may be formed to be thicker than the second direction thickness of the first inner portion (122b) located at the lower portion (e.g., -y-axis portion). In addition, the thickness of the corner portion (e.g., corner portion (120a) of FIG. 4) and the thickness of the first outer portion (121b) may be formed to be the same or different from each other. For example, the second direction thickness of the corner portion (120a) may be formed to be thicker than the second direction thickness of the first side portion (120b).

[0152] In various embodiments, the outer frame portion (e.g., the outer frame portion (333b) of FIG. 15) and the inner frame portion (e.g., the inner frame portion (343b) of FIG. 15) of the corner frame portion (e.g., the corner frame portion (313b) of FIG. 15) may be formed to have the same thickness in the second direction (e.g., the +x-axis direction). Alternatively, in various embodiments, the second direction thicknesses of the outer frame portion (333b) and the inner frame portion (343b) may be formed to be different. In addition, the second direction thicknesses of each of the outer frame portion (333b) and the inner frame portion (343b) may be formed to be different within the corner frame portion (313b). For example, the second direction thickness of the inner frame portion (343b) located at the upper portion (e.g., +y-axis portion) of the corner frame portion (313b) may be formed to be thicker than the second direction thickness of the inner frame portion (343b) located at the lower portion (e.g., -y-axis portion). In addition, the thickness of the corner frame portion (e.g., the corner frame portion (313c) of FIG. 15) and the thickness of the outer frame portion (333b) may be formed to be the same or different. For example, the second direction thickness of the corner frame portion (313c) may be formed to be thicker than the second direction thickness of the corner frame portion (313b). The above-described content may also be equally applied to the first side member (413) of FIG. 16.

[0153] In various embodiments, the curvature of the corner portion (120a) and / or the corner frame portion (e.g., the corner frame portion (313c) of FIG. 15 or the corner frame portion (413c) of FIG. 16) may be formed to have a curvature of 10R or less (e.g., a radius of curvature of 10 mm or less). For example, the curvature radius of the corner portion (120a) and / or the corner frame portion (e.g., the corner frame portion (313c) of FIG. 15 or the corner frame portion (413c) of FIG. 16) may be formed to have a radius within a range of 0.5 mm to 10 mm.

[0154] In various embodiments, referring to FIG. 4, the combined structure of at least one or two of the frame (e.g., frame (120) or frame (220) of FIG. 14), the first support member (110F), or the second support member (110G) disclosed in the present document can be applied to various electronic devices. For example, the structure of the corner portion (120a) formed of a single metal (e.g., the first metal) and the first side portion (120b) including a clad metal can be applied to various electronic devices. Alternatively, for example, the structure in which the corner portion (120a) and the first side portion (120b) are joined to the first support member (110F) by welding and / or the structure in which the corner portion (120a), the first side portion (120b), and the first support member (110F) are joined by insert injection of the second support member (110G) can be applied to various electronic devices. The electronic device may include, for example, a multi-foldable electronic device, a rollable electronic device, a wearable electronic device (e.g., a smart watch, a smart ring, or a VR (Virtual Reality) electronic device, or a laptop.

[0155] In various embodiments, the combined structure of at least one or two of the first side member (e.g., the first side member (313) of FIG. 15 or the first side member (413) of FIG. 16) or the support member (e.g., the support member (328) of FIG. 15 or the support member (428) of FIG. 16) disclosed in this document can be applied to various electronic devices. For example, the structure of a hinge-side frame portion (e.g., a hinge-side frame portion (313a) of FIG. 15 or a hinge-side frame portion (413a) of FIG. 16) formed of a single metal (e.g., a first metal), a corner frame portion (e.g., a corner frame portion (313c) of FIG. 15 or a corner frame portion (413c) of FIG. 16), and a corner frame portion (e.g., a corner frame portion (313b) of FIG. 15 or a corner frame portion (413b) of FIG. 16) including a clad metal can be applied to various electronic devices. Alternatively, as an example, a structure in which a hinge-side frame portion (e.g., a hinge-side frame portion (313a) of FIG. 15 or a hinge-side frame portion (413a) of FIG. 16), a corner frame portion (e.g., a corner frame portion (313c) of FIG. 15 or a corner frame portion (413c) of FIG. 16), and a corner frame portion (e.g., a corner frame portion (313b) of FIG. 15 or a corner frame portion (413b) of FIG. 16) and a support portion (e.g., a support portion (328) of FIG. 15 or a support portion (428) of FIG. 16) are joined by welding and insert injection may be applied to various electronic devices. The electronic devices may include, for example, a multi-foldable electronic device, a rollable electronic device, a wearable electronic device (e.g., a smart watch, a smart ring, a VR (Virtual Reality) electronic device, etc.), or a laptop.

[0156] According to one embodiment disclosed in the present document, an electronic device includes a frame forming at least a portion of a side surface of the electronic device; a support portion disposed on an inner side of the frame, wherein the frame includes a corner portion forming a portion of the side surface and including a first metal; and a side portion forming another portion of the side surface and including a clad structure in which an outer portion including the first metal and an inner portion including a second metal are joined, wherein the support portion can be connected to the corner portion and the side portion by welding.

[0157] According to one embodiment disclosed in the present document, the device further comprises a non-conductive member that joins the inner portion, the corner portion, and the support portion, wherein the non-conductive member can be arranged to fill a space spaced between the corner portion and the side portion.

[0158] According to one embodiment disclosed in this document, a first connecting portion may be formed on the inner portion to electrically connect the inner portion and the support portion, and a second connecting portion may be formed on the corner portion to electrically connect the corner portion and the support portion.

[0159] According to one embodiment disclosed in the present document, the inner portion may include a first surface coupled with the non-conductive member and a second surface adjacent to the first surface and on which the first connection portion is formed, and the corner portion may include a third surface coupled with the non-conductive member and a fourth surface adjacent to the third surface and on which the second connection portion is formed.

[0160] According to one embodiment disclosed in the present document, a first contact portion extending from the first surface and a second contact portion extending from the second surface are formed on the inner side, a third contact portion extending from the third surface and a fourth contact portion extending from the fourth surface are formed on the corner, and the first contact portion and the second contact portion may include the second metal, and the third contact portion and the fourth contact portion may include the first metal.

[0161] According to one embodiment disclosed in the present document, the electronic device further includes a printed circuit board disposed inside the electronic device, wherein at least one of the first contact portion, the second contact portion, the third contact portion, and the fourth contact portion is configured to be connected to the printed circuit board and function as an antenna, and another one of the first contact portion, the second contact portion, the third contact portion, and the fourth contact portion can be connected to a ground of the printed circuit board.

[0162] According to one embodiment disclosed in this document, the first metal may be a titanium alloy and the second metal may be an aluminum alloy.

[0163] According to one embodiment disclosed in this document, the first metal may be stainless steel and the second metal may be an aluminum alloy.

[0164] According to one embodiment disclosed in the present document, an electronic device may include a display; a rear cover; and a frame structure at least partially disposed between the display and the rear cover, wherein the frame structure may include: a first side portion forming a portion of a first side of the electronic device and at least partially formed of a clad structure formed from a first metal and a second metal, wherein the first metal in the clad structure is disposed toward an outside of the electronic device and the second metal is disposed toward an inside of the electronic device; a second side portion forming a portion of a second side of the electronic device and at least partially formed of the clad structure; a corner portion forming another portion of the first side and another portion of the second side between the first side portion and the second side portion, the corner portion being formed from the first metal, the corner portion including a first antenna feed formed from the first metal; and a support portion supporting the display and coupled to the first side portion and the corner portion, the support portion being formed from the second metal.

[0165] According to one embodiment disclosed in the present document, an electronic device, wherein the second side portion includes a second antenna feed formed from the second metal.

[0166] According to one embodiment disclosed in the present document, the electronic device further includes a printed circuit board supported by the support, wherein the corner portion includes a ground point formed from the first metal, and the ground point can be electrically connected to a ground surface of the printed circuit board.

[0167] According to one embodiment disclosed in the present document, the first antenna feed and the ground point may protrude in different directions toward the interior of the electronic device.

[0168] According to one embodiment disclosed in the present document, the printed circuit board includes a first communication circuit supporting a first frequency band and a second communication circuit supporting a second frequency band, wherein the first antenna feed is electrically connected to a first terminal formed on the printed circuit board and connected to the first communication circuit, and the second antenna feed is electrically connected to a second terminal formed on the printed circuit board and connected to the second communication circuit.

[0169] According to one embodiment disclosed in the present document, a first surface facing inwardly of the electronic device and a second surface perpendicular to the first surface and overlapping the support portion when viewed from the front surface of the electronic device are formed from the second metal of the first side portion, and the first surface and the support portion can be joined through a first insert injection, and the second surface and the support portion can be joined through a first welding portion.

[0170] According to one embodiment disclosed in the present document, a third surface facing inwardly of the electronic device from the first metal of the corner portion and a fourth surface perpendicular to the third surface and overlapping the support portion when viewed from the front portion are formed, and the third surface and the support portion can be joined through the first insert injection, and the fourth surface and the support portion can be joined through a second welding portion.

[0171] According to one embodiment disclosed in this document, the first weld portion and the second weld portion can be covered by a second insert injection.

[0172] According to one embodiment disclosed in this document, at least a portion of the first insert injection may be covered by the second insert injection.

[0173] According to one embodiment disclosed in the present document, the radius of curvature of the area where the other part of the first side and the other part of the second side meet in the corner portion may be greater than 0.5 mm and less than 8 mm.

[0174] According to one embodiment disclosed in the present document, a foldable electronic device including a hinge module, a first housing and a second housing foldably coupled about the hinge module, and a hinge cover coupled to the hinge module, the foldable electronic device including a frame of the foldable electronic device, at least a portion of which is included in the first housing, the second housing, and the hinge cover; and a support portion disposed on an inner side of the frame, wherein the frame includes: a hinge side frame portion coupled to the hinge cover and at least a portion of which forms a portion of a side surface of the foldable electronic device when the first housing and the second housing are folded; an edge frame portion forming another portion of the side surface opposite the hinge side frame portion; And a corner frame portion disposed on one side of the corner frame portion to form a corner portion of the side, wherein the hinge-side frame portion and the corner frame portion are formed from a first metal, the corner frame portion is formed of a clad structure formed from the first metal and a second metal, and the support portion can be connected to the corner frame portion and the corner frame portion by welding.

[0175] According to one embodiment disclosed in the present document, the corner frame portion may include a first antenna feed that protrudes toward the interior of the foldable electronic device and is formed from the first metal, and the corner frame portion may include a second antenna feed that protrudes toward the interior of the foldable electronic device and is formed from the second metal.

[0176] An electronic device according to one embodiment disclosed in the present document comprises: a frame; a support portion on an inner side of the frame, the frame comprising: a corner portion defining a first portion of a side surface of the electronic device, the corner portion including a first metal; and a side portion defining a second portion of the side surface, the side portion including a clad structure in which an outer portion and an inner portion are joined to each other, wherein the outer portion includes the first metal and the inner portion includes a second metal different from the first metal, and the support portion can be connected to the corner portion and the side portion by welding.

[0177] According to one embodiment disclosed in the present document, the device further includes a non-conductive member connecting the inner portion, the corner portion, and the support portion, wherein the non-conductive member can fill a space spaced between the corner portion and the side portion.

[0178] According to one embodiment disclosed in the present document, the first connecting portion is located at the inner portion and electrically connects the inner portion and the support portion, and the second connecting portion is located at the corner portion and electrically connects the corner portion and the support portion.

[0179] According to one embodiment disclosed in the present document, the inner portion may include a first surface connected to the non-conductive member and a second surface adjacent to the first surface, the first connection portion may be on the second surface, the corner portion may include a third surface connected to the non-conductive member and a fourth surface adjacent to the third surface, and the second connection portion may be on the fourth surface.

[0180] According to one embodiment disclosed in the present document, the first contact portion may extend from the first surface, the second contact portion may extend from the second surface, the third contact portion may extend from the third surface, and the fourth contact portion may extend from the fourth surface, and the first contact portion and the second contact portion may include the second metal, and the third contact portion and the fourth contact portion may include the first metal.

[0181] According to one embodiment disclosed in the present document, the printed circuit board further includes at least one of the first contact portion, the second contact portion, the third contact portion, or the fourth contact portion, configured to be connected to the printed circuit board and function as an antenna, and another of the first contact portion, the second contact portion, the third contact portion, or the fourth contact portion can be connected to a ground of the printed circuit board.

[0182] An electronic device according to one embodiment disclosed in the present document comprises: a display; a rear cover; and a frame structure having at least a portion between the display and the rear cover, wherein the frame structure comprises: a first side portion defining a first portion of a first side of the electronic device, the first side portion including a first clad structure comprising a first metal and a second metal, the first metal of the first clad structure being further away from the outside of the electronic device than the second metal of the first clad structure; a second side portion defining a first portion of a second side of the electronic device, the second side portion including a second clad structure comprising the first metal and the second metal, the first metal of the second clad structure being further away from the outside of the electronic device than the second metal of the second clad structure; a corner portion defining a second portion of the first side and a second portion of the second side between the first side portion and the second side portion, the corner portion including a first antenna feed including the first metal; And a support member supporting the display, the support member being connected to the first side portion and the corner portion, and including the second metal; may be included.

[0183] According to one embodiment disclosed in the present document, the second side portion may include a second antenna feed comprising the second metal.

[0184] According to one embodiment disclosed in the present document, the electronic device further includes a printed circuit board supported by the support, the corner portion including a ground point including the first metal, and the ground point can be electrically connected to a ground surface of the printed circuit board.

[0185] According to one embodiment disclosed in the present document, the first antenna feed and the ground point may each protrude in different directions toward the interior of the electronic device.

[0186] According to one embodiment disclosed in the present document, the printed circuit board includes a first communication circuit configured to support a first frequency band and a second communication circuit configured to support a second frequency band, wherein the first antenna feed is electrically connected to the first communication circuit via a first terminal on the printed circuit board, and the second antenna feed is electrically connected to the second communication circuit via a second terminal on the printed circuit board.

[0187] According to one embodiment disclosed in the present document, the second metal of the first side portion includes a first surface facing inwardly of the electronic device; and a second surface perpendicular to the first surface and overlapping the support portion in a direction toward the front of the electronic device, wherein the first surface and the support portion may be connected by a first insert injection, and the second surface and the support portion may be connected by a first weld portion.

[0188] According to one embodiment disclosed in the present document, the first metal of the corner portion includes a third surface facing inwardly of the electronic device; and a fourth surface perpendicular to the third surface and overlapping the support portion in a direction toward the front surface of the electronic device, wherein the third surface and the support portion may be connected by the first insert injection, and the fourth surface and the support portion may be connected by a second weld portion.

[0189] According to an embodiment disclosed in the present document, a foldable electronic device comprises: a hinge module; a first housing connected to the hinge module and configured to fold with respect to the hinge module; a second housing connected to the hinge module and configured to fold with respect to the hinge module; and a hinge cover connected to the hinge module, wherein at least a portion of the first housing, the second housing, and the hinge cover comprise a frame of the foldable electronic device, and the foldable electronic device further comprises a support portion on the inner side of the frame, the frame comprising: a hinge side frame portion connected to the hinge cover and including at least a portion defining a first portion of a side surface of the foldable electronic device when the first housing and the second housing are folded; an edge frame portion opposite the hinge side frame portion and defining a second portion of the side surface; And a corner frame portion on one side of the corner frame portion and defining a corner portion of the side, wherein the hinge-side frame portion and the corner frame portion include a first metal, and the corner frame portion includes a clad structure including the first metal and a second metal different from the first metal, and the support portion can be connected to the corner frame portion and the corner frame portion by welding.

[0190] According to one embodiment disclosed in the present document, the corner frame portion may include a first antenna feed that protrudes toward the interior of the foldable electronic device and includes the first metal, and the corner frame portion may include a second antenna feed that protrudes toward the interior of the foldable electronic device and includes the second metal.

Claims

1. In electronic devices, frame; and Including a support member on the inside of the above frame, The above frame is, a corner portion defining a first portion of a side surface of the electronic device, the corner portion including a first metal; and A side portion defining a second part of the side surface, the side portion including a clad structure in which an outer portion and an inner portion are joined to each other; The outer portion includes the first metal and the inner portion includes a second metal different from the first metal, An electronic device wherein the support portion is connected to the corner portion and the side portion by welding.

2. In claim 1, Further comprising a non-conductive member connecting the inner portion, the corner portion, and the support portion, An electronic device wherein the non-conductive member fills the space between the corner portion and the side portion.

3. In claim 2, The first connecting portion is located on the inner side and electrically connects the inner side and the support side, An electronic device wherein the second connecting portion is located at the corner portion and electrically connects the corner portion and the support portion.

4. In claim 3, The inner portion includes a first surface connected to the non-conductive member and a second surface adjacent to the first surface, The above first connecting portion is on the above second surface, The corner portion includes a third surface connected to the non-conductive member and a fourth surface adjacent to the third surface, The electronic device, wherein the second connecting portion is on the fourth surface.

5. In claim 4, The first contact portion extends from the first surface, and the second contact portion extends from the second surface, The third contact portion extends from the third surface, and the fourth contact portion extends from the fourth surface. The first contact portion and the second contact portion include the second metal, An electronic device wherein the third contact portion and the fourth contact portion include the first metal.

6. In claim 5, Including more printed circuit boards, At least one of the first contact portion, the second contact portion, the third contact portion, or the fourth contact portion is connected to the printed circuit board and is set to function as an antenna, An electronic device, wherein another one of the first contact portion, the second contact portion, the third contact portion, or the fourth contact portion is connected to the ground of the printed circuit board.

7. In electronic devices, display; back cover; and A frame structure having at least a portion between the display and the rear cover, The above frame structure is, A first side portion defining a first portion of a first side of the electronic device, the first side portion including a first clad structure comprising a first metal and a second metal, the first metal of the first clad structure being further away from the outside of the electronic device than the second metal of the first clad structure; A second side portion defining a first portion of a second side of the electronic device, the second side portion including a second clad structure comprising the first metal and the second metal, the first metal of the second clad structure being further away from the outside of the electronic device than the second metal of the second clad structure; A corner portion defining a second portion of the first side and a second portion of the second side between the first side portion and the second side portion, the corner portion including a first antenna feed including the first metal; and An electronic device comprising: a support member supporting the display, the support member being connected to the first side portion and the corner portion, and including the second metal; 8. In claim 7, An electronic device, wherein the second side portion includes a second antenna feed comprising the second metal.

9. In claim 8, The electronic device further comprises a printed circuit board supported by the support member, The above corner portion includes a ground point including the first metal, An electronic device wherein the ground point is electrically connected to the ground plane of the printed circuit board.

10. In claim 9, An electronic device wherein the first antenna feed and the ground point each protrude in different directions toward the interior of the electronic device.

11. In claim 9, The printed circuit board includes a first communication circuit configured to support a first frequency band and a second communication circuit configured to support a second frequency band, The first antenna feed is electrically connected to the first communication circuit via a first terminal on the printed circuit board, An electronic device wherein the second antenna feed is electrically connected to the second communication circuit via a second terminal on the printed circuit board.

12. In claim 7, The second metal of the first side surface is, a first side facing the inside of the electronic device; and A second surface is included that is perpendicular to the first surface and overlaps the support portion in a direction toward the front of the electronic device, The above first surface and the above support are connected by first insert injection, An electronic device wherein the second surface and the support portion are connected by a first welding portion.

13. In claim 12, The first metal of the above corner part is, a third side facing inwardly toward the electronic device; and A fourth surface is included that is perpendicular to the third surface and overlaps the support portion in a direction toward the front surface of the electronic device, The third surface and the support are connected by the first insert injection, An electronic device wherein the fourth surface and the support portion are connected by a second welding portion.

14. In foldable electronic devices, hinge module; A first housing connected to the hinge module and configured to fold with respect to the hinge module; a second housing connected to the hinge module and configured to fold relative to the hinge module; and A hinge cover connected to the above hinge module is included, At least a portion of the first housing, the second housing, and the hinge cover comprise a frame of the foldable electronic device, The above foldable electronic device further includes a support portion on the inner side of the frame, The above frame is, A hinge side frame portion connected to the hinge cover and defining a first portion of a side of the foldable electronic device when the first housing and the second housing are folded; An edge frame portion facing the hinge-side frame portion and defining a second portion of the side; and A corner frame portion is included on one side of the corner frame portion and defines a corner portion of the side surface, The above hinge-side frame portion and the above corner frame portion include a first metal, The above corner frame portion includes a clad structure including the first metal and a second metal different from the first metal, A foldable electronic device, wherein the support portion is connected to the corner frame portion and the edge frame portion by welding.

15. In claim 14, The corner frame portion includes a first antenna feed that protrudes toward the inside of the foldable electronic device and includes the first metal, A foldable electronic device, wherein the corner frame portion includes a second antenna feed that protrudes toward the inside of the foldable electronic device and includes the second metal.

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