System and method for monitoring structure changes

Abstract

A device for monitoring a structure may include a body having a first portion coupled to a second portion via a flexible body, a first mounting element configured to operatively mount the first portion to a structure, a second mounting element configured to mount the second portion to the structure; and a measurement assembly configured to transmit signals indicative of displacement of the first portion relative to the second portion in three dimensions.

Description

SYSTEM AND METHOD FOR MONITORING STRUCTURE CHANGESTECHNICAL FIELD

[0001] The present disclosure is in the technical field of engineering and / or construction equipment. More particularly, the present disclosure relates to a system for remotely monitoring changes to a defect in a structure such as a gap, crack or break.BACKGROUND

[0002] Engineers have developed tools that help them monitor the condition of a structure over time. This can be useful in a variety of contexts in which it is important to monitor damage to a building or other structure over time or during a particular event or series of events. For example, people performing construction, repair or demolition work on or near a wall or other structure that has a crack in it may need to monitor the condition of that crack while performing work on or near that wall or structure to detect if the crack is getting any worse while they are working. Similarly, if they are trying to repair the crack in the wall, they will need to monitor the condition of the crack while they are working. Likewise, a number of structures need to be monitored over long periods of time, such as bridges. Currently, divers need to be sent underwater to assess and measure ongoing damage to bridges to monitor their safety and to plan repairs and maintenance. As a result, the field needs a device or system that can be used to monitor the condition of a bridge remotely over time.

[0003] A deformation gauge is a tool that is typically used to measure or monitor changes in cracks in the foundation, walls or masonry of a structure. For example, devices sometimes referred to as “string-pot” gauges, use a wire rope attached to a moveable object, like a portion of a wall on one side of a crack. The rest of the device is placed on the other side of the crack and is able to measure the amount of tension or slack in the wire rope. Movement in the wire rope can be detected by a number of conventional devices based upon the movement of the wire rope relative to the rest of the device. However, this type of device does not break the movement of the wall into x, y and z vectors, but rather produces one total measurement of movement in all three directions. As a result, the measurements produced by this device are rather imprecise.

[0004] Another type of deformation gauge involves attaching two pieces of overlapping Plexiglas or a similar translucent material to either side of a crack in a wall. The plexiglass is printed with a scale or other means to detect movement between the two pieces of plexiglass. When the crack moves, the plexiglass pieces move relative to one another and produce a reading that can be manually taken. This type of gauge can detect movement in two planes, but not three and requires a technician to manually examine the gauge in order to take readings from it. These readings are subject to human error and the two pieces of plexiglass can produce a parallax effect that interferes with accurate measurements.

[0005] There are other devices on the market that do not make up for the shortcomings listed above. For example, hydraulic strain gauges are designed much like a typical syringe. A larger piston is connected to the object that may produce movement, that movement causes fluid to move from a larger tube into a smaller tube where the pressure exerted can be measured, perhaps by a Bourdon tube. These devices work well to detect very small movements, but do not serve to detect movement between two different structures.

[0006] There is a strong need in the engineering field for an apparatus and method of using same that will allow someone to measure the movement of a structure near a defect in a wall or other structure in three dimensions and that can communicate data to a remote user or device.SUMMARY OF THE INVENTION.

[0007] The present invention is a method of monitoring changes or movement in a structure. More specifically, the present disclosure details equipment and a method of using that equipment to monitor changes in position between multiple structures or parts of the same structure in three dimensions. More specifically, the inventor has developed a novel deformation gauge to monitor changes in a physical structure over time. The deformation gauge used in this method is capable of resolving movement in a structure in three dimensions rather than just one or two. In addition, it does not require a technician to physically view the deformation gauge in order to take readings from it. Furthermore, the deformation gauge is able to upload readings to a separate device or store the readings on an internal storage device to preserve them even if the gauge itself fails orloses power. The method can optionally involve the use of a tilt gauge to augment the readings taken with the deformation gauge.

[0008] Substantially - Substantially in this disclosure means within 10 degrees or 10 percent of the stated measurement or orientation.

[0009] Features means the stated structure includes, is attached to integrated into, on or physically in contact with another structure.

[0010] Preferred embodiments and the inventor’s anticipated best mode of the deformation gauge described herein has two discrete parts - a target and a sensor array. The target includes a magnet, preferably contained in a housing, made of a material that does not interfere with the magnet’ s magnetic field. The sensor array includes a circuit board featuring a plurality of magnetic field sensors (e.g., Hall effect sensors) capable of sensing changes in a magnetic field, also preferably contained within a housing or body. The sensor array is used to sample the magnet’s magnetic field from multiple positions to accurately determine the position of the sensor array with respect to the target magnet in three dimensions.

[0011] The Hall Effect is the production of a potential difference or voltage in a conductor having current applied to it at the same time the conductor is exposed to a magnetic field. Generally, the effect is greatest when the magnetic field is perpendicular to the flow of charge or current in the conductor. As current moves through the conductor, generally a semiconductor, it is exposed to a magnetic field which deflects the charge carriers enough to create a potential difference. The change in voltage is a direct function of and can be used to determine the strength and direction of the source of the magnetic field. When the strength of the magnetic field produced by the magnet is already known and the starting position of the magnet relative to the sensor(s) is already known, the measurements from a Halls Effect sensor can be used to measure the change in position between the sensor and the magnet. Repeated measurements of the change in voltage can be used to “map” or analyze a magnetic field at different points with respect to the magnet and the sensor. These data can be used to detect changes in the magnetic field which typically result if there is some change in position or movement between the magnet and the conductor. Thus, when the target moves in relation to the sensor, or vice versa, the change in voltage detected by the three Halls effect sensors can be used to calculate the distance and direction of that movement.This phenomenon can be used to monitor the physical location and thus condition of a physical structure such as a support beam, piling or wall over time. It can also be used to measure vibrations or subtle movements in naturally occurring structures and formations. These field sensors use the Hall effect to detect the change in stimulated current though a coil operably connected to silicon. Different orientation of the coils in the sensor provide different axes of measurement. Multiple magnetic sensors oriented in different planes, can be used to detect and calculate movement between the sensor and the target magnet in multiple dimensions.

[0012] The Halls Effect or “magnetic field” sensors are each able to detect changes in the position of the sensor array and thus the deformation gauge, in three dimensions and relay that data to a microprocessor that processes and filters the data to produce positional data that describes the location of the target magnet and any change in position between the target magnet and the sensor array.

[0013] The accuracy of the Hall-effect sensor measurements can be affected by their positioning. Preferred embodiments of the device include a sensor array that includes three Halleffect sensors positioned on a programmed circuit board so that all three sensors are positioned in a single plane. More accurate measurements can be made by the sensors if that plane is positioned perpendicularly or substantially perpendicularly to the polar axis of the magnet featured by the target, i.e. the target magnet. Accuracy can be further improved when the polar axis of the magnet also intersects the plane at the center of the triangle the sensors form.

[0014] When the gauge is manufactured, the magnetic field is “mapped” or measured at various points in space around the magnet. The higher the resolution, i.e. the more points of the magnetic field that are mapped, the more accurate the measurements produced through the use of the device. Knowing the shape of the magnetic field allows for the creation of a table that displays the interpolated values between the measured points of the magnetic field.

[0015] When the device is in use, the magnetic sensors take multiple measurements of the magnetic field in three dimensions - the x, y and z axes1. Individual measurement readings from1Either multiple sensors capable of sensing a magnetic field in a single axis or dimension are used in combination and / or individual sensors each capable of measuring in three axes / dimensions are used in tandem.the sensors are subject to a certain level of error. The sensor itself has an inherent level of error / noise. Additional noise may come from transient environmental factors. As a result, instead of taking a single measurement, the magnetic field sensors take hundreds of measurements in a fraction of a second and then average these measurements - thereby reducing the error or noise that may be present in a single or a small number of measurements. The measurements are sampled by an analog to digital converter, then communicated digitally to a microprocessor. The values generated are then compared to the information produced when the magnet’s magnetic field was originally mapped to produce a position of the magnet in a coordinate system shared by the magnetic field sensors. This measurement is then compared to initial measurements to reveal a change in the position of the magnet in the target relative to the magnetic field sensors indicating some sort of movement has taken place between the target and the sensor housing. The measurements can then be transmitted to a separate processor or receiver that is capable of storing and / or displaying the data. In this manner, the data that is collected and calculated by the deformation gauge is safely stored in another location if the deformation gauge loses power or is damaged. Other versions of the device include internal memory storage to store the same data in case of a power failure or other problem that prevents the data from being transmitted.

[0016] Before the device is put into use, the optimal range between the target magnet and the sensor array is calculated. If the sensor array is positioned too close to the target magnet, the Hall effect sensors become saturated with the magnetic field from the target magnet, rendering them unable to detect changes in that magnetic field. If the target magnet is too far away from the sensor array, then the readings produced by the magnetic field sensors will not be accurate. Using a process similar to the original mapping procedure, the optimal distance between the target magnet and the magnetic field sensor array is calculated. The magnetic field sensors are positioned and the distance from each sensor to the magnet is estimated using the formula below. The measurements are repeated over a range of temperature and time to characterize the change in magnetic field due to those factors. Then a mathematical model is created representing the field over physical location, time, and temperature. Using the known spatial relationship between the sensors and an initial estimate of the position of the target magnet, a gradient descent algorithm is used to find the magnet position that best satisfies the distance estimates.

[0017] Distance = (f * r) / 2.0where: m = sqrt(mx2 + my2 + mz2) k = m * 3.0 / 2000.0 r = m0.25 / k f = 8.0 - (0.93 * sqrt(r))

[0018] As a result, in use, the sensor housing is placed at a calculated distance away from the target.

[0019] The effective distance of the system can be increased or decreased by using magnets with varying field strength. The size of the MEMS element, the better the characterization of the performance over temperature, the sensitivity of the capacitive measurement, the better the temperature correction curve - the better the resolution and precision of the measurement.

[0020] In use, the brackets for each component of the deformation gauge are installed on a surface being monitored before the actual components are attached to the brackets. First, the desired mounting distance for the installation is determined. The user identifies a crack or gap in a structure that needs to be monitored. The user determines the spacing of the components by measuring the width of the crack or gap and adding a preset distance to that measurement based upon the optimal position for the target magnet as detailed above.

[0021] The sensor bracket includes a sliding structure or tongue that is attached to both the sensor bracket as well as the target bracket. Once the distance between the target bracket and the sensor bracket is determined, the tongue that is slidably engaged with the sensor bracket and is attached to the target bracket at one end, can be extended to the desired length, thereby setting the position of the sensor and target relative to one another. The tongue is then temporarily clamped in place via two small screws that tighten a floating plastic tab against the tongue on the sensor bracket. Once the adhesive is cured or the brackets are otherwise firmly mounted, the tongue can be released and retracted back into the sensor bracket’s body. The user will then attach the brackets to the structure featuring the crack / deformation using conventional adhesives. The sensor housing and target housings are then mounted on their respective brackets, perhaps by conventional fasteners such as screws. Once the sensor housing and target housing are firmly attached to their respective brackets, the gauge is ready to use to monitor movement of the wall on either side of the crack.

[0022] This method can be augmented through the use of a tilt gauge. A tilt gauge uses one or more MEMS accelerometers to measure the acceleration due to gravity in three directions allowing the device to detect any changes in “tilt” or the orientation of a structure in relation to a source of gravity - the Earth. Whereas the deformation gauge measures movement of the target magnet with respect to the sensor array, the tilt gauge measures movement of the accelerometer(s) relative to gravity. These two data sets can be combined to make very precise and very accurate measurements of the movement of an object or objects to which they are attached. The process for sampling and filtering / processing the data from the accelerometers is roughly the same as that described above for the magnetic field sensors. The accelerometer(s) take hundreds of measurements in a fraction of a second and then average these measurements - thereby reducing the error or noise that may be present in a single or a small number of measurements. The measurements are sampled by an analog to digital converter, then communicated digitally to a microprocessor. The processor is software enabled and configured to interpret the data from the accelerometers, magnetic field sensors and any other components to (a) account for and subtract out error and (b) calculate the position of the relevant sensors with respect to either the target magnet or the Earth’s gravitational field, i.e. the ground.

[0023] The Tilt gauge can use more than one accelerometer, a combination of accelerometers and gyroscopes and / or a combination of low and high-precision accelerometers. One or more lower-precision accelerometers can be used to sample in tandem with the high-precision accelerometer(s) to detect and thereby filter superfluous higher frequency vibrations from the Halleffect sensors and the high-precision accelerometer(s) and / or any other system components.

[0024] Initial embodiments of the system used a deformation gauge that was physically separate from the tilt gauge. Newer versions of the system include a single device or housing that includes both the sensor array and target of the deformation gauge as well as the accelerometer(s) of the tilt gauge.

[0025] MEMS accelerometers and hall-effect sensors typically use components the performance of which is affected by temperature changes. When the external temperature changes, the characteristic frequency and scale factor of the sensing elements shift and cause measurementerror. This system has applications that involve the system components being placed in extreme conditions.

[0026] In addition, temperature has an effect on the strength of a magnetic field. When a magnet’s temperature is decreased the magnetic field that it creates becomes stronger and when its temperature is increased, its field becomes weaker up until the point where the magnet is heated enough that it loses its magnetic properties. The degree to which a change in temperature affects the magnetic field strength of a magnet of known composition can be calculated.

[0027] As a result, some versions of the system will include one or more temperature sensors operably connected to the hall-effect sensors, the MEMS accelerometers and / or other components of the system. The “noise” or change in magnetic field strength as a result of temperature can thus be calculated and subtracted out of the measurements made by the magnetic field sensors.

[0028] Other variations of the system are specifically configured to detect vibrations and can be used to monitor seismic activity. In some of these applications, the target magnet is suspended from or supported by a spring and / or other damping mechanism in three-dimensions, allowing for more delicate movements to be detected. Still other applications will include a low-frequency microphone that detects additional reference data of frequencies generated in the appropriate bandpass range. The system can be used on or in the ground to detect seismic vibrations or on a structure such as a building to detect how the vibrations from the seismic activity cause the building to vibrate. Since one or more of the system components (magnetic sensors, accelerometer(s), target magnet, ...) are suspended from a mounting spring and / or other dampening element and vibrate independently of the housing, they are effectively a low mass weight that detects vibrations of the overall unit. These frequencies can be used to then filter the seismic vibrations as noise in the displacement measurement, and as a separate frequency band of motion of the entire reference frame that the sensor and target are attached to. The data from the accelerometer and magnetic sensor array can be bandpass filtered to remove lower frequency changes in position in favor of data from higher frequency movements to detect and analyze short-frequency seismographic vibrations resulting from changes in position with respect to the accelerometer(s) and / or magnetic sensor array. If the microphone is coupled with the enclosure through a pressure vent, it can also detect air pressure variations that would occur during a seismic event.

[0029] These devices are capable of communicating wirelessly with a third device or set of devices that include the means to process the information from the gauges and present it to an end user as well as store the information for later retrieval. Some applications may use a wireless modulation technique such as LoRa to transmit data. As a result, the inventor has created a system or method of using a novel deformation gauge, optionally in conjunction with a tilt gauge - either separate or integrated therein, to monitor a change in the position of a structure over time. The system produces more accurate data than prior devices and methods and does so with a minimum of human intervention.

[0030] In broad embodiment, the present invention is a system for monitoring the condition of a structure remotely. The advantages of the present invention include, without limitation, the ability to remotely monitor changes in a crack or gap in a structure over time or in response to specific events without having to have line of sight to the gauge or having a technician available to physically examine the gauge. Moreover, the present method allows a user to monitor the changes in a crack or gap or the movement of structures in three dimensions rather than just one or two. Furthermore, the inventive method also incorporates a tilt meter to allow the user to measure not only changes in a gap in a structure, but the orientation of the structure relative to the ground. Engineers and technicians working on a building, wall or bridge can remotely monitor the effects their work has on a gap or crack in a structure and / or the tilt or movement of the structure in three dimensions. In addition, versions of this system can be used to detect vibrations and thus can serve as a seismograph, calculating the changes in position of the sensors due to the vibrations caused by seismic events and then relaying the data to another component / location.BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a perspective view of a deformation gauge as used in a first embodiment of the system;

[0032] Figure 2A is a perspective view thereof with half of the cover or housing removed;

[0033] Figure 2B is a perspective view of the target housing with the magnet removed;

[0034] Figure 2C is a cross sectional view of the target;

[0035] Figure 3 is a top plan view of the circuit board featuring the hall effect sensors;

[0036] Figure 4A is a side cross-sectional view of the target housing and the sensor housing cut along the line B-B shown in Figure 4B;

[0037] Figure 4B is a top plan view thereof;

[0038] Figure 4C is top cross-sectional view thereof;

[0039] Figure 4D is a side plan view thereof;

[0040] Figure 5A shows a perspective view of a tilt gauge that can be integrated into the other embodiments described herein;

[0041] Figure 5B shows the same tilt gauge with the cover removed to expose the inner components;

[0042] Figure 6A is a perspective view of the gauge used in a second embodiment of the system configured to detect temperature variations;

[0043] Figure 6B is a top perspective view of the internal components thereof;

[0044] Figure 7A is a perspective view of the gauge used in another embodiment of the system configured to detect seismic activity;

[0045] Figure 7B is a top perspective view of the internal components thereof;

[0046] Figure 8 is a rear perspective view of the deformation gauge as used in the first embodiment of the system; and

[0047] Figure 9 is a perspective view of the deformation gauge installed near a structural in a wall.

[0048] FIG. 10A is perspective view of a structure monitor according to another embodiment.

[0049] FIG. 1 OB is a cross-sectional, top view of the structure monitor of FIG. 10A.

[0050] FIG. 10C is a perspective side view of a pressure device according to an embodiment.

[0051] FIGS. 10D-10F are perspective views of the measurement components of the structure monitor of FIG. 10 A.

[0052] FIG. 11 illustrates a hardware block diagram of a computing device according to an embodiment.DESCRIPTION OF EMBODIMENTS

[0053] Figure 1 shows the deformation gauge, generally 10. As discussed above, the deformation gauge 10 has two basic components - the target 11 and the sensor 16. The target 11 is a housing or casing 12 that encloses a target magnet. The sensor housing 17 contains the rest of the components of the gauge 10.

[0054] Figure 2A shows the sensor 16 with the upper half of the housing 17 removed. Figure 2A also shows the alignment tongue 22 that connects both the sensor bracket and the target bracket described below. The sensor housing 17 contains a first circuit board 24 featuring components such as a microprocessor 33, wireless module, charge controller and other components, including an antenna 28 and an internal storage device 29. The antenna 28 allows the deformation gauge 10 to transmit data to other devices and the internal storage device 29 allows the gauge 10 to store data. This is especially useful in the event of a power failure in which the data collected by the gauge 10 cannot be transmitted to another device for safekeeping - the internal storage device 29 can store that same data locally until it can be safely retrieved. There is also a second circuit board 25 that includes or features the magnetic sensor array 35 which in preferred embodiments and the anticipated best mode are three 3D Hall effect sensors 26 (see Figure 3).

[0055] Figure 2B shows the target housing 12 with the magnet 14 removed. The target housing 12 is made of a material that does not interfere, change or interact with the magnetic field created by the internal magnet 14. Figure 2C shows a cross sectional view of the same target 11 showing the magnet 14 installed therein.

[0056] Figure 3 shows the second circuit board 25 of this embodiment in more detail. In preferred embodiments and the inventor’s anticipated best mode of the system, the magnetic sensors, i.e. the Hall effects sensors 26 are organized in a triangle on the second circuit board 25. That is, the sensors 26 are arranged on the second circuit board 25 at vertices of a projected triangle. In some implementations, the projected triangle is an equilateral triangle.

[0057] Figures 4A through 4D show the optimal positioning of the target magnet 14 with respect to the circuit board 25 that contains the magnetic field sensors 26. These figures show a cylindrical target magnet 14 with a longitudinal axis that is perpendicular or substantially perpendicular to the plane formed by the flat surface of the printed circuit board 25. This orientation maximizes the Hall effect experienced by the magnetic sensors 26.

[0058] Figures 5 A and 5B shows a tilt gauge 27 with the cover removed to expose its internal workings. The tilt gauge 27 includes at least one accelerometer 34 operably connected to a microprocessor 33. The inventor anticipates using the same sensor bracket 18 to mount a tilt gauge 27. A tilt gauge 27 contains one or more three dimensional MEMS accelerometers 34. A MEMS accelerometer 34 is able to measure the acceleration due to gravity in three dimensions to allow the meter to indicate the position of the tilt gauge. The tilt gauge 27 can be placed on the same structure the deformation gauge 10 is attached to in order to detect changes in the attitude or orientation of a structure in relation to the ground. The tilt gauge 27 can be used in conjunction with (or separately from) the deformation gauge to determine the movement of the entire structure rather than the movement around a defect in the structure. As shown in Figures 4C and 4D, the same housing can contain circuit boards 24, 25 that include (1) the magnetic field sensor array 35 and (2) the accelerometers that are integral to the tilt gauge 27.

[0059] As discussed above, the tilt gauge 27 uses an accelerometer 34 to detect changes in the orientation of the tilt gauge with respect to Earth’ s gravity. Preferred embodiments of the tilt gauge 27 include at least one high-precision accelerometer and may also include at least one low- precision accelerometer 34. The accelerometers 34 can be moved or vibrated by outside forces such as vehicles passing near the sensors. The measurements from the accelerometer(s) are sampled repeatedly over the course of small time increments - hundreds of times in less than asecond as discussed above to average the measurements and “filter” the data to remove error or “noise.”

[0060] Figures 6A and 6B show another embodiment of the monitoring system. One or more temperature sensors 36 can be integrated into the deformation gauge 10 or the combined deformation 10 and tilt gauge 27 so that changes in temperature of the magnet, the hall-effect sensors and / or the accelerometer(s) can be monitored. As discussed previously, changes in temperature can affect the strength of the magnetic field produced by the target magnet 12 in known, calculable amounts. Prior to the system being placed into use, the magnetic field of the target magnet 12 is analyzed and mapped under different temperatures so that when readings are taken in real time, the measurements of the magnetic field sensors 26 can be used to accurately and precisely calculate the location of the target magnet 12 with respect to those sensors 26. Temperature sensor(s) can be used to monitor any of the individual components of the system and / or the temperature in the housing 17 itself to more accurately determine the position of the target magnet 12 to the sensor array 35.

[0061] Figures 7A and 7B show yet another embodiment of the monitoring system that can be used to detect seismic activity. In this version of the deformation gauge 10 the target magnet 14 is suspended in three dimensions from a mounting spring 37 or set of mounting springs 37 or other dampening device. Seismic activity could easily cause the entire system to move all at once and in the same directions thereby preventing the system from detecting movement of an entire structure to which the gauge(s) are attached. However, suspending the target magnet 14 from one or more mounting springs 37 allows the magnetic field sensor array 35 to detect the movement of the target magnet 14 while it is suspended thereby allowing the system to capture changes in movement that would move the entire system, such as seismic activity. Figure 7 also shows an optional microphone 38 that can be integrated into this version of the system. In addition to detecting vibrations due to seismic activity, this microphone detects additional reference data from a predetermined range of frequencies generated by the other components of the system. The data from the accelerometer 34 and magnetic sensor array 35 can be measured and then filtered to remove or filter lower frequency changes in position from higher frequency or short-frequency vibrations caused by seismographic vibrations.

[0062] Figure 8 shows the target bracket 13, sensor bracket 18 and the alignment tongue 22. The brackets 13, 18 and alignment tongue 22 are used to position the components of the gauge 10 in relation to the crack or other defect being measured. More specifically, the user first determines the mounting positions of each bracket 13, 18. Since the magnet 14 used in preferred embodiments is strong enough to saturate the hall effect sensors 26 if they are placed too close to the magnet 14, the user has to determine the placement of the target 11 relative to the sensor 16. This involves measuring the size or at least the width of a crack at the point at which the deformation gauge 10 will be placed. The user will need to space the target 11 apart from the sensor 16 so that if the structure to which the system is attached changes configuration brining the magnetic sensors 26 closer to the target magnet 12, the sensors 26 will not be saturated by the magnetic field nor will they be so far away from the target magnet 12 that they will not be effective detectors. In preferred embodiments and the inventor’s anticipated best mode a cylindrical neodymium magnet 14 is placed in the target housing 12 and is placed a precalculated distance away from the Hall effect sensors 26 when in use. Preferred embodiments and the inventor’s anticipated best mode of the device include a scale 23 on the alignment tongue 22 to allow the user to easily measure the distance between the sensor bracket 18 and target bracket 13 during installation.

[0063] The alignment tongue 22 is positioned in a groove 19 located on the sensor bracket 18. The alignment tongue 22 slides in and out of this groove 19. There is also a tab 20 that is positioned such that it overlaps a portion of the groove 19 and is thereby positioned above the alignment tongue 22. When the alignment tongue is extended away from the sensor bracket to position the target bracket 13, the tab 20 can be tightened using screws or other conventional fasteners such that the tab 20 is tightened against the alignment tongue 22 thereby locking it in to place.

[0064] Once the user has determined the desired distance between the target 11 and the sensor 16, the user mounts the target bracket 13 and the sensor bracket 18 to the surface featuring (including) the crack, gap, space, break or similar defect. The target bracket 13 logically goes on one side of the crack while the sensor bracket 18 is placed on the other side of the crack. First, the user determines the position of the sensor in relation to the crack and measures the crack or defect itself to determine where the target bracket will be placed. The target bracket 13 and the sensor bracket 18 are attached via an alignment tongue 22, an elongated structure that is attached to both the target bracket 13 and the sensor bracket 18. Once the position of both brackets is determined,the alignment tongue 22, which is slidably engaged with the sensor bracket 18, is extended away from the sensor bracket 18 the desired, calculated distance. The alignment tongue 22 is attached to the target bracket 13 at the end opposite the end attached to the sensor bracket 18. By extending the tongue, the user moves the target bracket 13 away from the sensor bracket 18. Next, the user, locks the alignment tongue 22 in place on the brackets. In preferred embodiments, the user tightens screws 21 that are positioned adjacent to the alignment tongue 22 such that tightening the screws 21 tightens the alignment tongue 22 in place. The brackets are physically attached to the wall via conventional fasteners or adhesives and the alignment tongue 22 is then retracted back into the sensor bracket 18. Next, the target 11 and the sensor 16 are mounted onto their respective brackets 13, 18 and the gauge 10 is ready for use.

[0065] Figure 9 shows one anticipated application of the system the gauges in place on a structure. The structure, a wall 30, features a crack 31 in it. The deformation gauge 10 has been placed such that the sensor 16 is on one side of the crack and the target 11 is on the other side of the crack. In addition, the same structure also has a tilt gauge 27 attached thereto. This configuration allows the user to monitor any change in the crack 31 or the tilt of the wall 30 remotely. Each gauge 10, 27 is operably connected to or includes a transmitter that is capable of transmitting the data collected by the gauge to an external storage device. Each gauge is also equipped with an electronic storage device that allows it to store measurements on or in the gauge itself. This allows the user to store the data collected over time and / or to retrieve data after the gauge has lost power or otherwise stopped functioning.

[0066] In broad embodiment, the present invention is a system for monitoring the condition of a structure remotely. The advantages of the present invention include, without limitation, the ability to remotely monitor changes in a crack or gap in a structure over time or in response to specific events without having to have line of sight to the gauge or having a technician available to physically examine the gauge. Moreover, the present method allows a user to monitor the changes in a crack or gap or the movement of structures in three dimensions rather than just one or two. Moreover, the inventive method also incorporates a tilt meter to allow the user to measure not only changes in a gap in a structure, but the orientation of the structure relative to the ground. Engineers and technicians working on a building, wall or bridge can remotely monitor the effectstheir work has on a gap or crack in a structure and / or the tilt or movement of the structure in three dimensions.

[0067] Now referring to FIG. 10 A, a structure monitor 100 for measuring deformation of a structure, according to another embodiment is illustrated. The structure monitor 100 includes a cylindrical body 102 having a first portion 110, a second portion 120, a flexible portion 130, first mounting element 140 and a second mounting element 150. The first portion 110 includes a first end cap 112 and the second portion 120 includes a second end cap 122. The cylindrical body 102 includes a sealed cavity for receiving components for measuring relative position and / or displacement between the first mounting element 140 and the second mounting element 150. For example, the first mounting element 140 may be mounted to a structure on one side of a crack to be monitored, and the second mounting element 150 may be mounted to the structure on an opposite side of the crack from the first mounting element 140. The structure monitor 100 measures the any relative motion in the X, Y, and Z coordinates between the first mounting element 140 and the 150. Measurements from the structure monitor 100 may be transmitted to another device (e.g., deformation gauge 10) via a signal cable 104. The sealed cavity separates the measurement components from the ambient environment. For example, the structure monitor 100 may be used under water (or other liquid), in a construction environment with particulates (e.g., pollution, dust, debris, etc.) in the air. The sealed cavity prevents the exterior contaminants from entering the structure monitor 100 and affecting the measurement components. Accordingly, a robust structure monitor 100 for measuring deformations of a structure may be used in various locations without being effected by the conditions of the environment.

[0068] In the depicted embodiment, the first mounting element 140 includes a first mounting plate 142 and a first support 144. The second mounting element 150 includes a second mounting plate 152, and a second support 154. The second support 154 further includes a ball joint 146. The first mounting plate 142 and the second mounting plate 152 are configured couple the 100 to the structure to be monitored. For example, the structure may have a crack therein be monitored. The first mounting element 140 may be disposed on one side of the crack and the second mounting element 150 may be disposed on another side of the crack. For example, the first mounting plate 142 and the second mounting plate 152 may be screwed, bolted, adhered, or otherwise mounted to the structure. The first support 144 extends from the first mounting plate 142 and pivotably androtationally couples to the first portion 110. Accordingly, the first portion 110 is operatively coupled to the structure via the first mounting element 140. Meanwhile, the second support 154 extends from the second mounting plate 152 and rigidly couples to the second portion 120. Accordingly, the second portion 120 is rigidly coupled to the structure via the second mounting element 150. Further, the flexible portion 130 flexibly couples the first portion 110 to the second portion 120. Accordingly, the first mounting element 140 and the second mounting element 150 secures the cylindrical body 102, and thus the structure monitor 100, to the structure.

[0069] When mounted to the structure, the structure monitor 100 can measure any change in relative position between the first mounting element 140 and the second mounting element 150. For example, if a crack, or defect, in the structure grows and causes the structure to deform, the deformation of the structure due to the defect may be measured by the structure monitor 100. In particular, the ball joint 146 and the flexible portion 130 allows the first portion 110 to move relative to the second portion 120. That is, the first portion 110 may move in an X, Y, and Z axis with respect to the second portion 120. Additionally, the first portion 110 may roll (e.g., rotation about the x-axis), pitch (e.g., rotation about the y-axis) and / or yaw (e.g., rotation about the z-axis) with respect to the second portion 120. Further, the flexible portion 130 provides an airtight and watertight seal between the first portion 110 and the second portion 120. Thus, the flexible portion 130 provides a waterproof connection between the first portion 110 and the second portion 120.

[0070] Referring to FIGS. 10B-10E, a cross-sectional view of the structure monitor 100 taken along line A-A of FIG. 10A is illustrated. In the depicted embodiment; the structure monitor 100 includes a measurement assembly 200 extending from the first portion 110 through the flexible portion 130 to the second portion 120. The measurement assembly 200 measures relative positions of the first portion 110 with respect to the second portion 120 (e.g., along the X-, Y- and Z-axes including angular position, e.g., roll, pitch, and yaw) and changes thereto (e.g., displacement, translation, rotation, etc.).

[0071] The measurement assembly 200 includes a thumb stick 210 connected to a linear potentiometer 220 via a connecting shaft 230. The thumb stick 210 is rigidly coupled to the second portion 120 while the linear potentiometer 220 is operatively coupled to the first portion 110. Meanwhile, connectors 240, 242 on each end of the connecting shaft 230 rigidly couple one endof the connecting shaft 230 to the thumb stick 210 and another end of the connecting shaft 230 to the linear potentiometer 220.

[0072] The thumb stick 210 comprises a base member 212 and a joystick 214. The joystick 214 is pivotably mounted to the base member 212. That is, a free end of the joystick 214 can move, while the attached end of the joystick 214 can pivot about two axes. The thumb stick 210 senses and measures angular positions / displacements 0 and 4> of the attached end of the joystick 214 about the two axes (see FIG. 10B). That is, the thumb stick 210 measures angular displacement of the joystick 214. Accordingly, angular displacement of the connecting shaft 230 is transferred to the joystick 214. That is, because the joystick 214 is rigidly attached to the connecting shaft 230, angular position / displacement of the connecting shaft 230 is the same as an angular position / displacement of the joystick 214. An opposite end of the connecting shaft 230 is connected to the linear potentiometer 220 via another connector 242. Meanwhile, the free end of the joystick 214 is rigidly connected to the connecting shaft 230 via a connector 240. In some implementations, the joystick 214 may also rotate about a third axis y and this rotation may also be measured by the thumb stick 210.

[0073] Still referring to FIGS. 10B-10E, the linear potentiometer 220 includes a slider 222 attached to a receiving element 111 (e.g., a groove) at an interior surface of the first portion 110 of the cylindrical body 102, a substrate 224 having a pair of opposing end stops 228. The stops prevent the substrate 224 from sliding beyond a desired range. The slider 222 includes a contact for contacting a circuit disposed on a substrate 224 (e.g., circuit board) of the linear potentiometer 220. A position of the substrate 224 with respect to the slider 222 determines the resistance, voltage, and / or current of the circuit. Thus, a position of the substrate 224, or an amount the substrate 224 has moved, along a longitudinal axis of the linear potentiometer 220 with respect to the slider 222 may be determined by monitoring parameters of the circuit. That is, a magnitude R of the linear displacement between the substrate 224 and the slider 222 may be determined based on the change of the parameters of the circuit (e.g., change of resistance).

[0074] For example, the first portion 110 may be displaced with respect to the second portion 120. In response, the second portion 120 may apply a force to the thumb stick 210 which may in turn transmit the force through the connecting shaft 230 to the substrate 224 of the linearpotentiometer 220. The force may also displace an angular position of the joystick 214, the connecting shaft 230 and / or the substrate 224. The force transmitted to the substrate 224 may also push or pull the substrate 224 to a new position with respect to the slider 222. That is, the circuit may move with respect to the slider 222, thereby changing a parameter of the circuit (e.g., resistance). Meanwhile, the slider 222 remains in the same position with respect to the first portion 110. Due to the change in the parameter of the circuit, a distance along a longitudinal axis by which the substrate 224 has moved with respect to the slider 222 may be determined by the linear potentiometer 220.

[0075] Further, because the second portion 120, the thumb stick 210, the connecting shaft 230 and the substrate 224 are rigidly coupled to each other, a change in position of any one of those components represents a change of position of all other rigidly connected components including the second portion 120. Therefore, relative movement between the slider 222 and the substrate 224 corresponds to relative displacement (e.g., magnitude R) between the slider 222 and the second portion 120. Moreover, because the slider 222 and the first portion 110 are rigidly coupled to each other, relative movement between the slider 222 and the second portion 120 corresponds to relative movement between the first portion 110 and the second portion 120. Moreover, the ball joint 146 of the first mounting element 140 may help align the linear potentiometer 220 with the free end of the joystick 214. Thus, the joystick 214 and the linear potentiometer 220 are always aligned along a common axis.

[0076] As a further example, the static positions of the joystick 214 and the substrate 224 may be monitored, thereby providing relative positions of the first portion 110 and the second portion 120, even if no relative movement has occurred between the first portion 110 and the second portion 120. That is, the position of the first portion 110 relative to the second portion 120 in three dimensions may be monitored and determined at any desired time.

[0077] In some implementations, the substrate 224 may be rigidly coupled the first portion 110 and the slider 222 may be rigidly coupled to the connecting shaft 230 such that movement of the slider 222 corresponds to movement of the second portion 120 and movement of the substrate 224 corresponds to movement of the first portion 110.

[0078] In some implementations, the linear potentiometer 220 and the thumb stick 210 may communicate with a controller 262. That is, the linear potentiometer 220 may transmit signals indicative of a magnitude R and direction of displacement between the first portion 110 and the second portion 120. Meanwhile, the thumb stick 210 may transmit signals indicative of an angular displacements 9 and 4> about two axes planes between the first portion 110 and the second portion 120. A controller 262 of the measurement assembly 200 may receive the signals and determine angular 0 and <[> and linear R displacement between the first portion 110 and the second portion 120. Using R, 0, and <]>, the relative position of the first portion 110 with respect to the second portion 120 may be determined using spherical coordinates. Alternatively, or additionally, the spherical coordinates may be converted into Cartesian coordinates (e.g., X-Y-Z coordinates). Regardless of the coordinate system, the relative displacement between the first portion 110 and the second portion 120 may be monitored. Accordingly, the controller 262 may determine relative displacement of the first portion 110 with respect to the second portion 120. In some implementations, the controller 262 may transmit the measured displacement data to another device wirelessly or through a wired connection via the signal cable 104.

[0079] Moreover, when in use, the first portion 110 is operatively mounted to a first portion of a structure via the second mounting element 150, and the second portion 120 is rigidly mounted to a second portion of a structure via the first mounting element 140. Thus, the relative position of the first portion of the structure may be determined with respect to the second portion of the structure. This relative position may be monitored for a desired period of time. Furthermore, the controller 262 may send a signal to a user’s device when the relative displacement between the first portion of the structure and the second portion of the structure exceeds a desired threshold.

[0080] In the depicted embodiment the controller 262 is disposed in the second portion 120. However, the controller 262 may be disposed exteriorly from the structure monitor 100. For example, the signals may be transmitted to the deformation gauge 10 discussed above via wireless communication (e.g., Bluetooth, wifi, etc.) or via a wired connection via the signal cable 104 (e.g., an ethernet cable, coaxial cable, USB cable, etc.).

[0081] In some implementations the measurement assembly 200 may further include one or more accelerometers 264 for determining an angular position of the measurement assembly 200with respect to gravity (see FIG. 10B). In the depicted embodiment, the accelerometer 264 is disposed on a circuit board 260 of the measurement assembly 200 with the controller 262 In some implementations, the one or more accelerometers 264 may be disposed on an interior surface of both the second portion 120 and the first portion 110. Thus, angular displacement of the first portion 110 with respect to gravity and the second portion 120 may be determined. Similarly, the angular displacement of the second portion 120 with respect to gravity and the first portion 110 may be determined. Accordingly, an angular displacement of structures on which the first portion 110 and the second portion 120 are mounted may be determined.

[0082] In some implementations, the potentiometer may be replaced with one or more sensors capable of measuring a magnitude and linear direction of a displacement between the flexible portion 130 and the first portion 110. In some implementations, the thumb stick 210 may be replaced with one or more sensors capable of detecting angular displacements 9 and <[) of the connecting shaft 230 with respect to the second portion 120.

[0083] Referring to FIG. 10F and with continued reference to FIG. 10B, the cylindrical body 102 further includes a pressure valve 116. The pressure valvel 16 substantially equalizes pressures, or reduces a pressure difference, between the ambient environment and the interior cavities of the first portion 110, the second portion 120, and the flexible portion 130. In particular, an ambient fluid (e.g., water, air, etc.) may enter the cylindrical body 102 through as hole 1 14 and 124 in each end cap 112 and 122. The ambient pressure from the fluid entering the cylindrical body 102 causes the pressure valve 116 to extend towards the flexible portion 130, but the pressure valve 116 does not allow the fluid to pass into the entirety of the cylindrical body 102. As the pressure valve 116 translates towards the flexible portion 130, it pressurizes the air contained in the sealed cavity defined by a portion of the first portion 110, a portion of the second portion 120 and the flexible portion 130. The pressure valves 116 translates and compress / pressurizes the interior air until the cavity air pressure is substantially the same as the ambient fluid pressure, or a pressure difference is otherwise reduced. A catch 118 prevents the pressure valve 116 from translating and contacting the measurement assembly 200. The catch 118 includes a plurality of holes to allow the sealed air in the cavity to flow therethrough for pressurization.

[0084] Using the techniques described herein, a robust structure monitor 100 for monitoring structures in harsh conditions (e.g., underwater, a construction site, etc.) may be achieved. Displacement data relating to structure deformation may be monitored in real time and transmitted to a user’s device. Accordingly, a user may instantly receive a status of a structure (e.g., deformation from a structural defect) without diving underwater or donning protective gear to enter the harsh environment and retrieve the monitor and / or data. Further, using the techniques described herein, with only an angular sensor (e.g., thumb stick 210) and a linear sensor (e.g., linear potentiometer 220), relative positions of two objects may be determined in three dimensional space, which has not been previously achieved in the construction monitoring industry.

[0085] Reference throughout the specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present invention should be or are in any single embodiment of the invention. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, discussion of the features and advantages, and similar language, throughout the specification may, but do not necessarily, refer to the same embodiment.

[0086] Furthermore, the described features, advantages, and characteristics of the invention may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize that the invention can be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the invention.

[0087] It is understood that the above-described embodiments are only illustrative of the application of the principles of the present invention. The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiment, including the best mode, is to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims, if any, in conjunction with the foregoing description.

[0088] While the foregoing written description of the invention enables one of ordinary skill to make and use what is considered presently to be the best mode thereof, those of ordinary skill will understand and appreciate the existence of variations, combinations, and equivalents of the specific embodiment, method, and examples herein. The invention should therefore not be limited by the above described embodiment, method, and examples, but by all embodiments and methods within the scope and spirit of the invention.

[0089] Referring to FIG. 11, FIG. 11 illustrates a hardware block diagram of a computing device 600 that may perform functions associated with operations discussed herein in connection with the techniques depicted in FIGs. 1-10E. In various embodiments, a computing device or apparatus, such as computing device 600 or any combination of computing devices 600, may be configured as any entity / entities as discussed for the techniques depicted in connection with FIGs. 1-10E, such as the microprocessor 33, in order to perform operations of the various techniques discussed herein.

[0090] In at least one embodiment, the computing device 600 may be any apparatus that may include one or more processor(s) 602, one or more memory element(s) 604, storage 606, a bus 608, one or more network processor unit(s) 610 interconnected with one or more network input / output (VO) interface(s) 612, one or more VO interface(s) 614, and control logic 620. In various embodiments, instructions associated with logic for computing device 600 can overlap in any manner and are not limited to the specific allocation of instructions and / or operations described herein.

[0091] In at least one embodiment, processor(s) 602 is / are at least one hardware processor configured to execute various tasks, operations and / or functions for computing device 600 as described herein according to software and / or instructions configured for computing device 600. Processor(s) 602 (e.g., a hardware processor) can execute any type of instructions associated with data to achieve the operations detailed herein. In one example, processor(s) 602 can transform an element or an article (e.g., data, information) from one state or thing to another state or thing. Any of potential processing elements, microprocessors, digital signal processor, controllers, systems, managers, logic, and / or machines described herein can be construed as being encompassed within the broad term 'processor'.

[0092] In at least one embodiment, memory element(s) 604 and / or storage 606 is / are configured to store data, information, software, and / or instructions associated with computing device 600, and / or logic configured for memory element(s) 604 and / or storage 606. For example, any logic described herein (e.g., control logic 620) can, in various embodiments, be stored for computing device 600 using any combination of memory element(s) 604 and / or storage 606. Note that in some embodiments, storage 606 can be consolidated with memory element(s) 604 (or vice versa), or can overlap / exist in any other suitable manner.

[0093] In at least one embodiment, bus 608 can be configured as an interface that enables one or more elements of computing device 600 and / or sensors to communicate in order to exchange information and / or data. Bus 608 can be implemented with any architecture designed for passing control, data and / or information between processors, memory elements / storage, peripheral devices, and / or any other hardware and / or software components that may be configured for computing device 600.

[0094] In various embodiments, network processor unit(s) 610 may enable communication between computing device 600 and other systems, entities, etc., via network I / O interface(s) 612 (wired and / or wireless) to facilitate operations discussed for various embodiments described herein. In various embodiments, network processor unit(s) 610 can be configured as a combination of hardware and / or software, such as one or more Ethernet driver(s) and / or controller(s), wireless receivers / transmitters / transceiverrts, baseband processor(s) / modem(s), and / or other similar network interface driver(s) and / or controller(s) now known or hereafter developed to enable communications between computing device 600 and other systems, entities, etc. to facilitate operations for various embodiments described herein. In various embodiments, network I / O interface(s) 612 can be configured as one or more Ethernet port(s), any other VO port(s), and / or antenna(s) / antenna array(s) now known or hereafter developed. Thus, the network processor unit(s) 610 and / or network VO interface(s) 612 may include suitable interfaces for receiving, transmitting, and / or otherwise wirelessly communicating data and / or information to another processor for monitoring data.

[0095] In various embodiments, control logic 620 can include instructions that, when executed, cause processor(s) 602 to perform operations, which can include, but not be limited to,providing overall control operations of computing device; interacting with other entities, systems, etc. described herein; maintaining and / or interacting with stored data, information, parameters, etc. (e.g., memory element(s), storage, data structures, databases, tables, etc.); combinations thereof; and / or the like to facilitate various operations for embodiments described herein.

[0096] The programs described herein (e.g., control logic 620) may be identified based upon application(s) for which they are implemented in a specific embodiment. However, it should be appreciated that any particular program nomenclature herein is used merely for convenience; thus, embodiments herein should not be limited to use(s) solely described in any specific application(s) identified and / or implied by such nomenclature.

[0097] In various embodiments, any entity or apparatus as described herein may store data / information in any suitable volatile and / or non-volatile memory item (e.g., magnetic hard disk drive, solid state hard drive, semiconductor storage device, random access memory (RAM), read only memory (ROM), erasable programmable read only memory (EPROM), application specific integrated circuit (ASIC), etc.), software, logic (fixed logic, hardware logic, programmable logic, analog logic, digital logic), hardware, and / or in any other suitable component, device, element, and / or object as may be appropriate. Any of the memory items discussed herein should be construed as being encompassed within the broad term 'memory element'. Data / information being tracked and / or sent to one or more entities as discussed herein could be provided in any database, table, register, list, cache, storage, and / or storage structure: all of which can be referenced at any suitable timeframe. Any such storage options may also be included within the broad term 'memory element' as used herein.

[0098] Note that in certain example implementations, operations as set forth herein may be implemented by logic encoded in one or more tangible media that is capable of storing instructions and / or digital information and may be inclusive of non-transitory tangible media and / or non- transitory computer readable storage media (e.g., embedded logic provided in: an ASIC, digital signal processing (DSP) instructions, software [potentially inclusive of object code and source code], etc.) for execution by one or more processor(s), and / or other similar machine, etc. Generally, memory element(s) 604 and / or storage 606 can store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations thereof, and / or the like used foroperations described herein. This includes memory element(s) 604 and / or storage 606 being able to store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations thereof, or the like that are executed to carry out operations in accordance with teachings of the present disclosure.

[0099] Example 1. A structure monitor comprising: a body having a first portion coupled to a second portion via a flexible body; a first mounting element configured to operatively mount the first portion to a structure, a second mounting element configured to mount the second portion to the structure; and a measurement assembly configured to transmit signals indicative of displacement of the first portion relative to the second portion in three dimensions.

[0100] Example 2. The structure monitor of example 1, wherein the measurement assembly comprises: a thumb stick sensor rigidly mounted to the second portion; a linear potentiometer operatively coupled to the first portion; and a connecting shaft rigidly coupling the thumb stick sensor to the linear potentiometer.

[0101] Example 3. The structure monitor of example 2, wherein the linear potentiometer comprises a substrate having a circuit and a slider rigidly coupled to the first portion.

[0102] Example 4. The structure monitor of example 3, wherein the substrates is configured to translate along a longitudinal axis of the first portion.

[0103] Example 5. The structure monitor of example 4, wherein the slider is configured to adjust a parameter of a circuit in response to the translation of the substrate.

[0104] Example 6. The structure monitor of example 2, wherein the thumb stick sensor is configured to detect angular displacement of the connecting shaft with respect to the second portion ; and the linear potentiometer is configured to detect linear displacement of the connecting shaft with respect to the first portion.

[0105] Example 7. The structure monitor of example 6, wherein the measurement assembly is configured to transmit a signal indicative of the detected angular displacement and the detected linear displacement.

[0106] Example 8. The structure monitor of example 7, further comprising a controller configured to determine displacement of the first portion relative to the second portion in three dimensions based on the transmitted signal.

[0107] Example 9. The structure monitor of example 1, wherein the first portion, the second portion and the flexible portion form a sealed cavity for receiving the measurement assembly.

[0108] Example 10. The structure monitor of example 9, further comprising a pressure valve disposed in the first portion, the pressure valve configured to substantially reduce a pressure difference between an ambient pressure and an interior pressure of the cavity.

[0109] Example 11. A system for detecting changes in a structure comprising: a structure monitor comprising: a body having a first portion coupled to a second portion via a flexible body; a first mounting element configured to operatively mount the first portion to a first structure, a second mounting element configured to mount the second portion to the first structure; and a measurement assembly configured to transmit signals indicative of a position of the first portion relative to the second portion in three dimensions; and a deformation gauge comprising: a target magnet for positioning at a predetermined location; and an array of magnetic sensors operably connected to a microprocessor, the microprocessor configured to determine a position of the target magnet based on one or more signals received from the array of magnetic sensors, wherein the structure monitor communicates with the deformation gauge.

[0110] Example 12. The system of example 11, wherein the deformation gauge is configured to determine a status of the first structure based on the signals received from the structure monitor and / or a status of a second structure based on the position of the target magnet.

[0111] Example 13. The system of example 12, wherein the deformation gauge transmits a reporting signal the determined status of the first structure and / or status in the second structure to an exterior device.

[0112] Example 14. The system of example 13, wherein the status of the first structure is based on one or more of a current position of the first portion relative to the second portion, a distancebetween the first portion and the second portion, or a change in position for the first portion relative to the second portion.

[0113] Example 15. The system of example 13, wherein the status of the second structure is based on one or more of a current position of the target magnet or a change in position of the target magnet over time.

[0114] Example 16. A method of detecting changes a structure, the method comprising: disposing a structure monitor having a first portion and a second portion on to the structure; monitoring, via a controller, a position of the first portion relative to the second portion based on signals from a measurement assembly; and determining, via a controller, a position of the first portion relative to the second portion in three dimensions based on the monitoring.

[0115] Example 17. The method of example 16, further comprising measuring, via the measurement assembly, a magnitude and direction of a linear distance between the first portion and the second portion.

[0116] Example 18. The method of example 17, further comprising measuring, via the measurement assembly, an angular position of the first portion relative to the second portion.

[0117] Example 19. The method of example 17, wherein the disposing the structure monitor on the structure further comprises disposing a first mounting element of the structure monitor on one side of a crack in the structure, and disposing a second mounting element of the mounting structure on an opposite side of the crack.

[0118] Example 20. The method of example 19, further comprising determining a displacement between the first portion and the second portion based on determined position information of the first portion relative to the second portion over time.

[0119] As used herein, unless expressly stated to the contrary, use of the phrase 'at least one of, 'one or more of, 'and / or', variations thereof, or the like are open-ended expressions that are both conjunctive and disjunctive in operation for any and all possible combination of the associated listed items. For example, each of the expressions 'at least one of X, Y and Z', 'at least one of X, Y or Z', 'one or more of X, Y and Z', 'one or more of X, Y or Z' and 'X, Y and / or Z' can mean anyof the following: 1) X, but not Y and not Z; 2) Y, but not X and not Z; 3) Z, but not X and not Y; 4) X and Y, but not Z; 5) X and Z, but not Y; 6) Y and Z, but not X; or 7) X, Y, and Z.

[0120] Each example embodiment disclosed herein has been included to present one or more different features. However, all disclosed example embodiments are designed to work together as part of a single larger system or method. This disclosure explicitly envisions compound embodiments that combine multiple previously-discussed features in different example embodiments into a single system or method.

[0121] Additionally, unless expressly stated to the contrary, the terms 'first', 'second', 'third', etc., are intended to distinguish the particular nouns they modify (e.g., element, condition, node, module, activity, operation, etc.). Unless expressly stated to the contrary, the use of these terms is not intended to indicate any type of order, rank, importance, temporal sequence, or hierarchy of the modified noun. For example, 'first X' and 'second X' are intended to designate two 'X' elements that are not necessarily limited by any order, rank, importance, temporal sequence, or hierarchy of the two elements. Further as referred to herein, 'at least one of and 'one or more of can be represented using the '(s)' nomenclature (e.g., one or more element(s)).

[0122] Reference throughout the specification to features, advantages, or similar language does not imply that all of the features and advantages that may be realized with the present invention should be or are in any single embodiment of the invention. Rather, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, discussion of the features and advantages, and similar language, throughout the specification may, but do not necessarily, refer to the same embodiment.

[0123] Furthermore, the described features, advantages, and characteristics of the invention may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize that the invention can be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the invention.

[0124] It is understood that the above described embodiments are only illustrative of the application of the principles of the present invention. The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiment, including the best mode, is to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims, if any, in conjunction with the foregoing description.

[0125] While the foregoing written description of the invention enables one of ordinary skill to make and use what is considered presently to be the best mode thereof, those of ordinary skill will understand and appreciate the existence of variations, combinations, and equivalents of the specific embodiment, method, and examples herein. The invention should therefore not be limited by the above described embodiment, method, and examples, but by all embodiments and methods within the scope and spirit of the invention.

Claims

CLAIMS.We Claim:

1. A structure monitor comprising: a body having a first portion coupled to a second portion via a flexible body; a first mounting element configured to operatively mount the first portion to a structure, a second mounting element configured to mount the second portion to the structure; and a measurement assembly configured to transmit signals indicative of displacement of the first portion relative to the second portion in three dimensions.

2. The structure monitor of claim 1, wherein the measurement assembly comprises: a thumb stick sensor rigidly mounted to the second portion; a linear potentiometer operatively coupled to the first portion; and a connecting shaft rigidly coupling the thumb stick sensor to the linear potentiometer.

3. The structure monitor of claim 2, wherein the linear potentiometer comprises a substrate having a circuit and a slider rigidly coupled to the first portion.

4. The structure monitor of claim 3, wherein the substrates is configured to translate along a longitudinal axis of the first portion.

5. The structure monitor of claim 4, wherein the slider is configured to adjust a parameter of a circuit in response to the translation of the substrate.

6. The structure monitor of claim 2, wherein the thumb stick sensor is configured to detect angular displacement of the connecting shaft with respect to the second portion ; and the linear potentiometer is configured to detect linear displacement of the connecting shaft with respect to the first portion.

7. The structure monitor of claim 6, wherein the measurement assembly is configured to transmit a signal indicative of the detected angular displacement and the detected linear displacement.

8. The structure monitor of claim 7, further comprising a controller configured to determine displacement of the first portion relative to the second portion in three dimensions based on the transmitted signal.

9. The structure monitor of claim 1, wherein the first portion, the second portion and the flexible portion form a sealed cavity for receiving the measurement assembly.

10. The structure monitor of claim 9, further comprising a pressure valve disposed in the first portion, the pressure valve configured to substantially reduce a pressure difference between an ambient pressure and an interior pressure of the cavity.

11. A system for detecting changes in a structure comprising: a structure monitor comprising: a body having a first portion coupled to a second portion via a flexible body; a first mounting element configured to operatively mount the first portion to a first structure, a second mounting element configured to mount the second portion to the first structure; and a measurement assembly configured to transmit signals indicative of a position of the first portion relative to the second portion in three dimensions; and a deformation gauge comprising: a target magnet for positioning at a predetermined location; and an array of magnetic sensors operably connected to a microprocessor, the microprocessor configured to determine a position of the target magnet based on one or more signals received from the array of magnetic sensors, wherein the structure monitor communicates with the deformation gauge.

12. The system of claim 11, wherein the deformation gauge is configured to determine a status of the first structure based on the signals received from the structure monitor and / or a status of a second structure based on the position of the target magnet.

13. The system of claim 12, wherein the deformation gauge transmits a reporting signal the determined status of the first structure and / or status in the second structure to an exterior device.

14. The system of claim 13, wherein the status of the first structure is based on one or more of a current position of the first portion relative to the second portion, a distance between the first portion and the second portion, or a change in position for the first portion relative to the second portion.

15. The system of claim 13, wherein the status of the second structure is based on one or more of a current position of the target magnet or a change in position of the target magnet over time.

16. A method of detecting changes a structure, the method comprising: disposing a structure monitor having a first portion and a second portion on to the structure; monitoring, via a controller, a position of the first portion relative to the second portion based on signals from a measurement assembly; and determining, via a controller, a position of the first portion relative to the second portion in three dimensions based on the monitoring.

17. The method of claim 16, further comprising measuring, via the measurement assembly, a magnitude and direction of a linear distance between the first portion and the second portion.

18. The method of claim 17, further comprising measuring, via the measurement assembly, an angular position of the first portion relative to the second portion.

19. The method of claim 17, wherein the disposing the structure monitor on the structure further comprises disposing a first mounting element of the structure monitor on one side of a crack in the structure, and disposing a second mounting element of the mounting structure on an opposite side of the crack.

20. The method of claim 19, further comprising determining a displacement between the first portion and the second portion based on determined position information of the first portion relative to the second portion over time.

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