Temperature adjusting device of vehicle-mounted parking apron, vehicle-mounted parking apron, and vehicle

Abstract

A temperature adjusting device of a vehicle-mounted parking apron, comprising: a first housing provided with an inner air duct configured to be communicated with a parking apron compartment; a second housing provided with an outer air duct configured to be communicated with an external environment; inner air duct cooling fins; outer air duct cooling fins fixedly connected to the inner air duct cooling fins; and a thermoelectric cooler sandwiched between the inner air duct cooling fins and the outer air duct cooling fins and configured in such a manner that when a forward current is introduced to the thermoelectric cooler, heat is conducted from the inner air duct cooling fins to the outer air duct cooling fins through the thermoelectric cooler, and when a reverse current is introduced to the thermoelectric cooler, heat is conducted from the outer air duct cooling fins to the inner air duct cooling fins through the thermoelectric cooler. The present invention also provides a vehicle-mounted parking apron and a vehicle. In the temperature adjusting device provided by the present invention, heat can be "transported" between the inner air duct cooling fins and the outer air duct cooling fins by means of the thermoelectric cooler, so as to adjust the temperature in the parking apron compartment, so that the parking apron compartment conforms to the working environment temperature of an unmanned aerial vehicle, and the temperature adjusting device has smoke prevention and dust prevention effects.

Description

Temperature control device for vehicle-mounted helipads, vehicle-mounted helipads and vehicles Technical Field

[0001] This invention relates to the field of unmanned aerial vehicles, and in particular to a temperature regulation device for a vehicle-mounted helipad, as well as the vehicle-mounted helipad and the vehicle. Background Technology

[0002] Currently, vehicles are becoming increasingly networked and intelligent, and more and more vehicles are integrating drone landing pads, aiming to deeply integrate vehicles and drones and enable users to obtain a richer driving and entertainment experience.

[0003] Vehicle-mounted helipads are typically designed according to vehicle manufacturing standards, with automotive-grade components requiring high reliability and operating within a temperature range of -40℃ to 125℃. However, the typical operating environment for consumer drones is only -10℃ to 40℃ (5℃ to 40℃ for charging). Therefore, the temperature inside a vehicle-mounted helipad may exceed or fall below the operating temperature of the consumer drone. For example, if a vehicle (and its helipad) is exposed to direct summer sunlight, the temperature inside the helipad can easily reach over 60℃, exceeding the operating and charging temperatures of the consumer drone, causing it to malfunction or fail to charge, and potentially damaging its internal circuitry. Similarly, if a vehicle (and its helipad) is driven outdoors in winter or at high altitudes, the temperature inside the helipad can easily fall below the operating and charging temperatures of the consumer drone, also preventing it from functioning or charging. Summary of the Invention

[0004] In view of the problems existing in the background art, a first aspect of the present invention provides a temperature regulation device for a vehicle-mounted helipad, comprising:

[0005] A first housing having an internal air duct for connecting to the apron compartment;

[0006] A second housing having an external air duct for communicating with the external environment;

[0007] The heat sink of the internal air duct is fixedly installed in the internal air duct;

[0008] An external air duct heat sink is fixedly installed in the external air duct, and the external air duct heat sink is fixedly connected to the internal air duct heat sink;

[0009] A thermoelectric cooler is sandwiched between the inner air duct heat sink and the outer air duct heat sink, with one side of the thermoelectric cooler attached to the inner air duct heat sink and the other side attached to the outer air duct heat sink, and configured as follows:

[0010] When a forward current is applied to the thermoelectric cooler, heat is conducted from the inner air duct heat sink to the outer air duct heat sink via the thermoelectric cooler. When a reverse current is applied to the thermoelectric cooler, heat is conducted from the outer air duct heat sink to the inner air duct heat sink via the thermoelectric cooler.

[0011] In some embodiments of the present invention, an external air duct fan for accelerating airflow is provided in the external air duct; a temperature sensor is provided on the external air duct heat sink, and the external air duct fan is turned on / off according to the temperature value of the external air duct heat sink obtained by the temperature sensor; and / or, the speed of the external air duct fan is adjusted according to the temperature value of the external air duct heat sink obtained by the temperature sensor.

[0012] In some embodiments of the present invention, the external air duct has an air inlet facing the vehicle's driving direction and an air outlet facing away from the vehicle's driving direction on the second housing. When the vehicle's driving speed exceeds a preset speed, the external air duct fan remains closed.

[0013] In some embodiments of the present invention, an internal air duct fan is provided in the internal air duct to accelerate the airflow inside the apron cabin.

[0014] In some embodiments of the present invention, the inner air duct has an inner air duct inlet on the side of the vehicle driving direction and an inner air duct outlet on the side opposite to the vehicle driving direction on the first housing, and both the inner air duct inlet and the inner air duct outlet are connected to the apron compartment.

[0015] In some embodiments of the present invention, a heat insulation layer is filled between the inner air duct heat sink and the outer air duct heat sink, a first receiving cavity is formed on the heat insulation layer, the semiconductor cooling chip is disposed in the first receiving cavity, and thermally conductive silicone grease is coated on the contact surfaces of the semiconductor cooling chip with the inner air duct heat sink and the outer air duct heat sink.

[0016] In some embodiments of the present invention, a second receiving cavity is formed on the heat insulation layer, and the temperature sensor is disposed in the second receiving cavity.

[0017] In some embodiments of the present invention, there are two second housings, which are symmetrically distributed on both sides of the first housing.

[0018] A second aspect of the present invention provides a vehicle-mounted helipad, comprising:

[0019] The tarmac cabin; and

[0020] Temperature control devices for vehicle-mounted helipads, as described above, are installed on the helipad compartment.

[0021] A third aspect of the invention provides a vehicle including the vehicle-mounted helipad as described above.

[0022] The vehicle-mounted helipad temperature regulation device provided by this invention can "transfer" heat between the inner and outer air duct heat sinks using a semiconductor cooling chip, thereby regulating the temperature inside the inner air duct and consequently the temperature inside the helipad cabin connected to the inner air duct. This ensures the temperature inside the helipad cabin matches the operating environment temperature of the UAV (especially the charging environment temperature), expanding the UAV's application range. Furthermore, by lowering the temperature inside the helipad cabin, the waiting time for cooling between flights can be reduced, thus increasing the number of flights within the same timeframe. Additionally, although the outer air duct is connected to the external environment, air from the external environment cannot directly enter the inner air duct (or, conversely, air from the external environment cannot directly enter the helipad cabin). Instead, it is blocked by the heat conduction system composed of the outer air duct heat sink, the semiconductor cooling chip, and the inner air duct heat sink. Therefore, the vehicle-mounted helipad temperature regulation device also provides anti-salt spray and anti-dust effects. Attached Figure Description

[0023] Figure 1 is a schematic diagram of the structure and working principle of a semiconductor cooling chip;

[0024] Figure 2 is a schematic diagram of the structure of a temperature regulation device for a vehicle-mounted helipad provided in an embodiment of the present invention;

[0025] Figure 3 is an exploded view of the temperature control device for the vehicle-mounted helipad shown in Figure 2;

[0026] Figure 4 is a schematic diagram showing the connection relationship between the internal air duct heat sink, the external air duct heat sink, and the semiconductor cooling chip.

[0027] Figure 5 is a structural schematic diagram of the vehicle-mounted helipad (with markings indicating the airflow direction of the external ventilation duct);

[0028] Figure 6 is a structural schematic diagram of the vehicle-mounted helipad (with markings indicating the airflow direction of the internal air duct).

[0029] Explanation of reference numerals in the attached drawings: Temperature control device for vehicle-mounted helipad 100; Vehicle-mounted helipad 200; First housing 10; Inner air duct 11; Inner air duct inlet 11a; Inner air duct outlet 11b; Inner air duct heat sink 12; Inner air duct fan 13; Second housing 20; Outer air duct 21; Outer air duct inlet 21a; Outer air duct outlet 21b; Outer air duct heat sink 22; Outer air duct fan 23; Temperature sensor 24; Semiconductor cooling chip 30; Heat insulation layer 40; First receiving cavity 41; Second receiving cavity 42; Helipad compartment 50. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] As shown in Figures 1-6, one embodiment of the present invention provides a temperature regulation device 100 for a vehicle-mounted helipad 200, mainly comprising a first housing 10 having an inner air duct 11 for connecting to the helipad compartment 50; a second housing 20 having an outer air duct 21 for connecting to the external environment; an inner air duct heat sink 12 fixedly disposed in the inner air duct 11; and an outer air duct heat sink 22 fixedly disposed in the outer air duct 21, the outer air duct heat sink 22 being fixedly connected to the inner air duct heat sink 12. A thermoelectric cooler (TEC) 30 is sandwiched between the inner heat sink 12 and the outer heat sink 22. One side of the thermoelectric cooler 30 is attached to the inner heat sink 12, and the other side is attached to the outer heat sink 22. The thermoelectric cooler 30 is configured such that when a forward current is applied to the thermoelectric cooler 30, heat is conducted from the inner heat sink 12 to the outer heat sink 22 via the thermoelectric cooler 30. When a reverse current is applied to the thermoelectric cooler 30, heat is conducted from the outer heat sink 22 to the inner heat sink 12 via the thermoelectric cooler 30.

[0032] Referring specifically to Figure 1, the structure and working principle of the thermoelectric cooler 30 are illustrated. The smallest unit of the thermoelectric cooler 30 consists of a pair (or group of pairs) of N-type and P-type semiconductors connected by electrodes (sintering point), forming a heat-absorbing end (cold end) and a heat-releasing end (hot end). Under the action of an applied electric field, the current can conduct the heat generated within the semiconductor from the heat-absorbing end (cold end) to the heat-releasing end (hot end). As the direction of the current changes, the heat-absorbing end (cold end) and the heat-releasing end (hot end) exchange heat with each other.

[0033] In this embodiment, the inner air duct heat sink 12 is fastened to the inner air duct 11 with screws, and the outer air duct heat sink 22 is fastened to the outer air duct 21 with screws. The outer air duct heat sink 22 and the inner air duct heat sink 12 are then fixed to each other with screws. In other embodiments, methods such as welding or gluing can also be used for fixing and connecting.

[0034] In this embodiment, a temperature sensor is installed inside the helipad compartment 50. The thermoelectric cooler 30 can be connected to the control system and the power supply system. The control system and power supply system can be separate systems for the helipad itself (generally located inside the helipad compartment 50), or they can be a central control system and power supply system installed on the vehicle (generally located inside the vehicle cabin). When the temperature sensor inside the helipad compartment 50 detects a reading higher than the upper limit of the operating temperature of the drone (e.g., 45°C for consumer drones), the control system controls the power supply system to supply a positive current to the thermoelectric cooler 30. Heat is then conducted from the inner duct heat sink 12 through the thermoelectric cooler 30 to the outer duct heat sink 22, thus lowering the temperature inside the helipad compartment 50. When the temperature sensor inside the helipad compartment 50 obtains a value lower than the lower limit of the operating temperature of the drone (e.g., 0°C for the operating temperature of a consumer drone), the control system controls the power supply system to supply a reverse current to the semiconductor cooling chip 30. Heat is conducted from the external air duct heat sink 22 to the internal air duct heat sink 12 via the semiconductor cooling chip 30, and the temperature inside the helipad compartment 50 rises.

[0035] In other embodiments, when the temperature sensor inside the helipad compartment 50 detects a value higher than the upper limit of the UAV's operating environment temperature, the control system controls the power supply system to supply a positive current to the thermoelectric cooler 30. Heat is conducted from the inner air duct heat sink 12 through the thermoelectric cooler 30 to the outer air duct heat sink 22 until the temperature inside the helipad compartment 50 drops to a first preset temperature (e.g., 35°C or 30°C), at which point the thermoelectric cooler 30 stops working. When the temperature sensor inside the helipad compartment 50 detects a value lower than the lower limit of the UAV's operating environment temperature, the control system controls the power supply system to supply a reverse current to the thermoelectric cooler 30. Heat is conducted from the outer air duct heat sink 22 through the thermoelectric cooler 30 to the inner air duct heat sink 12 until the temperature inside the helipad compartment 50 rises to a second preset temperature (e.g., 10°C or 15°C), at which point the thermoelectric cooler 30 stops working.

[0036] Those skilled in the art should understand that the temperature regulation device 100 of the vehicle-mounted helipad 200 can "transfer" heat between the inner air duct heat sink 12 and the outer air duct heat sink 22 through the semiconductor cooling chip 30, thereby regulating the temperature inside the inner air duct 11 and thus regulating the temperature inside the helipad compartment 50 connected to the inner air duct 11. This ensures that the temperature inside the helipad compartment 50 matches the operating environment temperature of the UAV (especially the charging environment temperature), expanding the application environment of the UAV. Furthermore, by lowering the temperature inside the helipad compartment 50, the waiting time for cooling between flights can be reduced, thereby increasing the number of flights within the same time frame. In addition, although the outer air duct 21 is connected to the external environment, air from the external environment cannot directly enter the inner air duct 11 (or can be considered as air from the external environment not directly entering the helipad compartment 50). Instead, it is blocked by the heat conduction system composed of the outer air duct heat sink 22, the semiconductor cooling chip 30, and the inner air duct heat sink 12. That is, the temperature regulation device 100 of the vehicle-mounted helipad 200 also has the effect of preventing salt spray and dust.

[0037] Furthermore, an external air duct fan 23 for accelerating airflow is provided in the external air duct 21, and a temperature sensor 24 is provided on the external air duct heat sink 22. The external air duct fan 23 is turned on / off according to the temperature value of the external air duct heat sink 22 obtained by the temperature sensor 24; and / or the speed of the external air duct fan 23 is adjusted according to the temperature value of the external air duct heat sink 22 obtained by the temperature sensor 24.

[0038] Furthermore, the external air duct 21 has an external air duct inlet 21a facing the vehicle's driving direction and an external air duct outlet 21b facing away from the vehicle's driving direction on the second housing 20. When the vehicle's driving speed exceeds a preset speed, the external air duct fan 23 remains closed.

[0039] In this embodiment, the frame of the external air duct fan 23 has a through hole, and the inner wall of the external air duct 21 may have a threaded hole; the two can be fixed together by screws. The external air duct fan 23 is located near the external air duct outlet 21b.

[0040] For example, the vehicle control system is electrically connected to the external air duct fan 23, controlling its on / off state and speed adjustment. When the vehicle speed exceeds 80 km / h, the external air duct fan 23 remains off, relying on the air flowing through the external air duct 21 to improve the heat dissipation efficiency of the external air duct heat sink 22. When the vehicle speed is below 80 km / h, and the temperature sensor in the helipad compartment 50 detects a value of 45°C (exceeding the operating temperature of consumer-grade drones), the vehicle control system controls the external air duct fan 23 to turn on at a speed of 1000 rpm. When the temperature sensor in the helipad compartment 50 detects a value above 50°C, the speed of the external air duct fan 23 increases to 2000 rpm.

[0041] Those skilled in the art should understand that the external air duct fan 23 can accelerate the airflow in the external air duct 21 and improve the heat transfer efficiency of the external air duct heat sink 22, but it does not need to be on all the time. It can be turned on / off according to the vehicle speed, and its speed can be adjusted according to the temperature in the apron compartment 50, thereby achieving energy saving and consumption reduction.

[0042] Furthermore, an internal air duct fan 13 is installed in the internal air duct 11 to accelerate the airflow within the apron compartment 50.

[0043] Furthermore, the inner air duct 11 has an inner air duct inlet 11a on the side of the vehicle's driving direction and an inner air duct outlet 11b on the side opposite to the vehicle's driving direction on the first housing 10. Both the inner air duct inlet 11a and the inner air duct outlet 11b are connected to the apron compartment 50.

[0044] In this embodiment, the frame of the internal air duct fan 13 has through holes, and the inner wall of the internal air duct 11 may have threaded holes; the two can be fixed together with screws. The internal air duct fan 13 is located near the air outlet 11b of the internal air duct. The internal air duct fan 13 accelerates the airflow within the apron compartment 50 (which can also be considered as the airflow within the internal air duct 11), thereby improving the heat transfer efficiency of the internal air duct heat sink 12. The heat absorbed by the internal air duct heat sink 12 is conducted to the internal air duct heat sink 12 via the semiconductor cooling chip 30.

[0045] Furthermore, a heat insulation layer 40 is filled between the inner air duct heat sink 12 and the outer air duct heat sink 22. A first receiving cavity 41 is formed on the heat insulation layer 40. A semiconductor cooling chip 30 is disposed in the first receiving cavity 41. Thermally conductive silicone grease is coated on the contact surfaces of the semiconductor cooling chip 30 with the inner air duct heat sink 12 and the outer air duct heat sink 22.

[0046] Furthermore, a second receiving cavity 42 is formed on the heat insulation layer 40, and the temperature sensor 24 is disposed in the second receiving cavity 42.

[0047] In this embodiment, the area occupied by the thermoelectric cooler 30 is much smaller than that of the inner air duct heat sink 12 and the outer air duct heat sink 22. To prevent heat from being directly conducted between the inner air duct heat sink 12 and the outer air duct heat sink 22, a heat insulation layer 40 can be filled between them. The first receiving cavity 41 and the second receiving cavity 42 provided on the heat insulation layer 40 provide space for the thermoelectric cooler 30 and the temperature sensor 24. Clearance holes are provided at the four corners of the heat insulation layer 40 to allow screws used to fix the inner air duct heat sink 12 and the outer air duct heat sink 22 to pass through. The heat insulation layer 40 can be made of a material with a low thermal coefficient, such as foam.

[0048] Those skilled in the art should understand that the thermal grease coating on the contact surfaces of the semiconductor cooling chip 30 with the inner air duct heat sink 12 and the outer air duct heat sink 22 can improve the heat conduction efficiency in the area where the semiconductor cooling chip 30 is located. The heat insulation layer 40 also blocks the direct conduction of heat between the inner air duct heat sink 12 and the outer air duct heat sink 22, which makes the temperature regulation device 100 of the vehicle-mounted parking apron 200 more efficient and reliable.

[0049] Furthermore, there are two second housings 20, which are symmetrically distributed on both sides of the first housing 10.

[0050] In this embodiment, openings are provided on the left and right sides of the first housing 10, and the inner air duct heat sink 12 is embedded in the opening. A sealant or sealant can be provided between the inner air duct heat sink 12 and the mounting surface of the first housing 10. Each second housing 20 also has an opening, and the outer air duct heat sink 22 is embedded in the opening. A sealant or sealant can be provided between the outer air duct heat sink 22 and the mounting surface of the second housing 20. A semiconductor cooling chip 30 is sandwiched between each pair of inner air duct heat sinks 12 and outer air duct heat sinks 22. The temperature regulation device 100 of the vehicle-mounted helipad 200 can regulate the temperature inside the inner air duct 11 through a heat "transfer" system composed of two sets of inner air duct heat sinks 12, semiconductor cooling chips 30 and outer air duct heat sinks 22, thereby regulating the temperature inside the helipad compartment 50 connected to the inner air duct 11, so that the temperature inside the helipad compartment 50 meets the working environment temperature of the UAV.

[0051] An embodiment of the present invention also provides a vehicle-mounted helipad 200, including a helipad compartment 50; and a temperature regulating device 100 of any of the vehicle-mounted helipad 200 described above, disposed on the helipad compartment 50.

[0052] In this embodiment, the temperature regulation device 100 of the vehicle-mounted helipad 200 is disposed at the bottom of the helipad compartment 50. The bottom of the helipad compartment 50 may have openings corresponding to the internal air duct inlet 11a and the internal air duct outlet 11b. The first housing 10 may be fixedly connected to the helipad compartment 50 at the internal air duct inlet 11a and the internal air duct outlet 11b by means of screws, welding, adhesive, etc., so that the internal air duct 11 is connected to the interior of the helipad compartment 50. The interior of the helipad compartment 50 may also be equipped with components such as the control system and temperature sensor as described above.

[0053] Those skilled in the art should understand that the vehicle-mounted helipad 200 has the same beneficial effects as the temperature regulation device 100 of the vehicle-mounted helipad 200. For example, heat can be "transferred" between the inner air duct heat sink 12 and the outer air duct heat sink 22 by the semiconductor cooling chip 30, thereby regulating the temperature inside the inner air duct 11, and thus regulating the temperature inside the helipad compartment 50 connected to the inner air duct 11, so that the temperature inside the helipad compartment 50 meets the operating environment temperature of the UAV (especially the charging environment temperature), expanding the application environment of the UAV. Furthermore, by lowering the temperature inside the helipad compartment 50, the waiting time for cooling between flights can be reduced, thereby increasing the number of flights within the same time frame. In addition, although the external air duct 21 is connected to the external environment, the air in the external environment cannot directly enter the internal air duct 11 (or can be regarded as entering the apron compartment 50). Instead, it is blocked by the heat conduction system composed of the external air duct heat sink 22, the semiconductor cooling chip 30 and the internal air duct heat sink 12. That is, the temperature regulation device 100 of the vehicle-mounted apron 200 also has the effect of preventing salt spray and dust.

[0054] In addition, one embodiment of the present invention also provides a vehicle including the above-described vehicle-mounted helipad 200.

[0055] In this embodiment, the vehicle-mounted helipad 200 is fixedly installed on the top of the vehicle. For example, it can be indirectly fixed to the top of the vehicle by being connected to the roof rack with screws or other means. Alternatively, it can be directly and partially embedded in the roof, making the vehicle-mounted helipad 200 part of the roof. Another example is that it can be fixed to a location such as the trunk that does not obstruct the driver's view.

[0056] Those skilled in the art should understand that the vehicle has the same beneficial effects as the temperature regulation device 100 of the on-board parking apron 200.

[0057] In the description of this specification, the references to terms such as "certain embodiments," "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0058] In this invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A temperature control device for a vehicle-mounted helipad, characterized in that, include: A first housing having an internal air duct for connecting to the apron compartment; A second housing having an external air duct for communicating with the external environment; The heat sink of the internal air duct is fixedly installed in the internal air duct; An external air duct heat sink is fixedly installed in the external air duct, and the external air duct heat sink is fixedly connected to the internal air duct heat sink; A thermoelectric cooler is sandwiched between the inner air duct heat sink and the outer air duct heat sink, with one side of the thermoelectric cooler attached to the inner air duct heat sink and the other side attached to the outer air duct heat sink, and configured as follows: When a forward current is applied to the thermoelectric cooler, heat is conducted from the inner air duct heat sink to the outer air duct heat sink via the thermoelectric cooler. When a reverse current is applied to the thermoelectric cooler, heat is conducted from the outer air duct heat sink to the inner air duct heat sink via the thermoelectric cooler.

2. The temperature control device for a vehicle-mounted helipad according to claim 1, characterized in that: The external air duct is equipped with an external air duct fan to accelerate airflow; A temperature sensor is installed on the heat sink of the external air duct. Based on the temperature value of the heat sink obtained by the temperature sensor, the external air duct fan is turned on / off; and / or, The speed of the external air duct fan is adjusted based on the temperature value of the heat sink in the external air duct obtained by the temperature sensor.

3. The temperature regulation device for a vehicle-mounted helipad according to claim 2, characterized in that: The external air duct has an air inlet facing the vehicle's direction of travel and an air outlet facing away from the vehicle's direction of travel on the second housing. When the vehicle's speed exceeds a preset speed, the external air duct fan remains closed.

4. The temperature control device for a vehicle-mounted helipad according to claim 1, characterized in that: The internal air duct is equipped with an internal air duct fan to accelerate airflow within the apron cabin.

5. The temperature regulation device for a vehicle-mounted helipad according to claim 1, characterized in that: The internal air duct has an air inlet on the side of the vehicle's driving direction and an air outlet on the side opposite to the vehicle's driving direction on the first housing. Both the air inlet and the air outlet are connected to the apron compartment.

6. The temperature regulation device for a vehicle-mounted helipad according to claim 2, characterized in that: A heat insulation layer is filled between the inner air duct heat sink and the outer air duct heat sink. A first receiving cavity is formed on the heat insulation layer. The semiconductor cooling chip is disposed in the first receiving cavity. Thermally conductive silicone grease is coated on the contact surfaces of the semiconductor cooling chip with the inner air duct heat sink and the outer air duct heat sink.

7. The temperature regulation device for a vehicle-mounted helipad according to claim 6, characterized in that: A second receiving cavity is formed on the heat insulation layer, and the temperature sensor is disposed in the second receiving cavity.

8. The temperature control device for a vehicle-mounted helipad according to any one of claims 1 to 7, characterized in that: The second housing has two parts, and they are symmetrically distributed on both sides of the first housing.

9. A vehicle-mounted helipad, characterized in that, include: Apron cabin; as well as Temperature control device for vehicle-mounted helipad as described in any one of claims 1 to 8, installed on the helipad compartment.

10. A vehicle, characterized in that, Including the vehicle-mounted helipad as described in claim 9.

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