Acoustic processing device

Abstract

This acoustic processing device comprises: a housing including an outer casing section formed as a front acoustic space in which part of an acoustic space that is an interior space is located on an output side of sound, a sound conduit section connected to the outer casing section, and a board mounting section located on the inside of the outer casing section; a circuit board mounted onto the board mounting section; a speaker that has a first sound hole for outputting sound toward the sound conduit section and a second sound hole positioned on the side opposite the first sound hole, and that is arranged on the circuit board; and a feedback noise canceling microphone. A speaker hole serving as an acoustic passage pertaining to the speaker and a through hole communicated with spaces on both sides of the circuit board are formed in the circuit board. The acoustic space is divided by the circuit board into at least the front acoustic space and a back acoustic space.

Description

Sound Processing Device

[0001] The present technology relates to a technical field of a sound processing device that includes a speaker that outputs sound and a microphone for feedback noise cancellation.

[0002] 2. Description of the Related Art Some sound processing devices that are worn on the ears and used as headphones or earphones are provided with a microphone for feedback noise cancellation in addition to a speaker (see, for example, Patent Document 1).

[0003] By providing a microphone in the sound processing device, noise components are extracted from the external noise picked up by the microphone and the sound signal output from the speaker, and the external noise is canceled out or reduced by an anti-phase signal generated in response to the extracted noise component, thereby enabling the generation of high-quality sound.

[0004] In particular, the use of a feedback noise canceling microphone makes it possible to cancel external noise in the area close to the ear, providing more accurate noise canceling performance than the feedforward method and producing higher quality sound.

[0005] Furthermore, some sound processing devices use a hybrid system that combines the advantages of both the feedforward system and the feedback system in order to achieve high-performance noise canceling performance.

[0006] Japanese Patent Application Laid-Open No. 2023-178938

[0007] However, in sound processing devices with noise canceling functions such as those described above, in addition to a speaker, a microphone is required to input sound containing noise, which increases the number of parts and makes the device larger, which may reduce portability and fit to the ear.

[0008] On the other hand, in a sound processing device, various components such as a circuit board are arranged in addition to a speaker and a microphone, so it is desirable to ensure good assembly of these components.

[0009] Therefore, an object of the sound processing device of the present technology is to ensure miniaturization and good assembly ease.

[0010] The sound processing device according to the present technology comprises a housing having an outer casing in which a portion of an acoustic space, which is an internal space, is formed as a front acoustic space located on the sound output side, a sound guide tube portion continuous with the outer casing, and a board mounting portion located inside the outer casing; a circuit board mounted on the board mounting portion; a speaker arranged on the circuit board, the speaker having a first sound hole that outputs sound toward the sound guide tube portion and a second sound hole located on the opposite side of the first sound hole; and a microphone for feedback noise cancellation, wherein the circuit board is formed with a speaker hole that serves as a sound passage for the speaker and through holes that communicate with spaces on both sides of the circuit board, and the acoustic space is divided by the circuit board into at least the front acoustic space and the rear acoustic space.

[0011] As a result, the speaker is placed on a circuit board attached to the board mounting portion of the housing, and the circuit board divides the acoustic space into at least a front acoustic space and a rear acoustic space, so there is no need to attach the circuit board to the housing via other components such as an inner housing, and there is no need to divide the acoustic space into multiple spaces using other components.

[0012] 2 to 19 show an embodiment of the sound processing device according to the present technology, and this figure is a cross-sectional view of the sound processing device. FIG. 19 is a front view showing a circuit board and each component arranged on the circuit board. FIG. 20 is a rear view showing a circuit board and each component arranged on the circuit board. FIG. 21 is an enlarged side view of a speaker. FIG. 22 is a cross-sectional view showing a first modified example of the sound processing device. FIG. 23 is a cross-sectional view showing a second modified example of the sound processing device. FIG. 24 is a cross-sectional view showing a third modified example of the sound processing device. FIG. 25 is a cross-sectional view showing a fourth modified example of the sound processing device. FIG. 26 is a cross-sectional view showing a fifth modified example of the sound processing device. FIG. 27 is a cross-sectional view showing a sixth modified example of the sound processing device. FIG. 28 is a cross-sectional view showing a seventh modified example of the sound processing device. FIG. 29 is a cross-sectional view showing an eighth modified example of the sound processing device. FIG. 29 is a cross-sectional view showing a ninth modified example of the sound processing device. FIG. 21 is a cross-sectional view showing a tenth modified example of the sound processing device. FIG. 22 is a cross-sectional view showing an eleventh modified example of the sound processing device. FIG. 23 is a diagram showing a system configuration in an example in which one microphone for feedback noise canceling and one microphone for feedforward noise canceling are provided. FIG. 24 is a diagram showing a system configuration in an example in which two microphones for feedback noise canceling and one microphone for feedforward noise canceling are provided. 10A and 10B are front views showing an example in which other devices are arranged on a circuit board in addition to a speaker and a microphone, and FIG. 10C are front views showing an example in which a circuit board is formed in an irregular shape.

[0013] Hereinafter, an embodiment of the sound processing device of the present technology will be described with reference to the accompanying drawings.

[0014] In addition, in the sound processing device described below, a housing is formed by joining two cases, and the circuit board placed inside the housing is formed, for example, in a rectangular shape.When indicating directions in the following explanation, the joining direction of the two cases is the front-to-back direction, and the longitudinal direction of the circuit board is the left-to-right direction, and the directions indicated are up-down, front-to-back, left-to-right.

[0015] However, the directions of up, down, front, back, left and right shown below are for the convenience of explanation, and the implementation of the present technology is not limited to these directions.

[0016] <Configuration of the Sound Processing Device> First, the configuration of the sound processing device 1 will be described (see Figs. 1 to 4). Note that in the sound processing device 1, each section (each component) is joined and sealed at a predetermined position by adhesive or the like, and in the drawings referred to below, these sealed locations are indicated by a circle and the letter S.

[0017] The sound processing device 1 has a housing 2 in which the required components are arranged, and the internal space of the housing 2 forms an acoustic space 50 (see FIG. 1 ). The housing 2 is configured by joining a first case 3 and a second case 4 at the front and rear. The first case 3 is provided as a front case, and the second case 4 is provided as a rear case. Both the first case 3 and the second case 4 are formed from, for example, a resin material.

[0018] The first case 3 is integrally formed with a first outer casing 5 that is concave and opens to the rear, a cylindrical sound conduit 6 that protrudes substantially forward from one of the left and right sides of the first outer casing 5, and a board attachment portion 7 that protrudes from the inner surface of the first outer casing 5. The board attachment portion 7 is formed, for example, in an annular shape. An earpiece (not shown) is attached to the sound conduit 6, for example. The earpiece is made of, for example, silicone rubber or urethane resin, and is worn in the ear of the listener (user).

[0019] The second case 4 is integrally formed with a concave second outer casing 8 that opens forward and a microphone mounting portion 9 that protrudes substantially forward from the second outer casing 8. A communication hole 8a and an external sound input hole 8b are formed in the second outer casing 8. The communication hole 8a and the external sound input hole 8b are formed, for example, at positions spaced apart on the left and right, and the external sound input hole 8b is formed at the position where the microphone mounting portion 9 is provided. The communication hole 8a allows air to flow from the acoustic space 50 to an external space, thereby ensuring smooth and good operation of a diaphragm provided in a speaker, which will be described later.

[0020] A microphone hole 9a is formed at the inner end of the microphone attachment portion 9.

[0021] A first acoustic resistor 10 and a second acoustic resistor 11, which respectively cover the communication hole 8a and the external sound input hole 8b, are attached to the second outer casing 8. As the first acoustic resistor 10 and the second acoustic resistor 11, for example, a mesh sheet or nonwoven fabric called a resistor is used.

[0022] In addition, since the communication hole 8a can function as an acoustic resistor by forming it into one or more micropores, in this case the first acoustic resistor 10 may not be provided. Furthermore, since the external acoustic input hole 8b can function as an acoustic resistor by forming it into one or more micropores, in this case the second acoustic resistor 11 may not be provided.

[0023] The first case 3 and the second case 4 are joined by bonding or the like, with the opening edges of the first outer casing 5 and the second outer casing 8 butted against each other at the front and rear. The housing 2 is formed by joining the first case 3 and the second case 4 together.

[0024] A rectangular circuit board 12, for example, with its longitudinal direction extending left and right, is attached by adhesive or the like to the tip of the board attachment portion 7 of the first case 3. By attaching the circuit board 12 to the board attachment portion 7, the acoustic space 50 is divided by the circuit board 12 into two spaces: a front acoustic space 51 and a rear acoustic space 52. The front acoustic space 51 is the space on the sound conduit 6 side, and the rear acoustic space 52 is the space on the second case 4 side.

[0025] The front acoustic space 51 is formed, for example, as a space surrounded by a part of the first outer casing 5 in the first case 3, the board mounting portion 7, the sound guide tube portion 6, and the circuit board 12, and the rear acoustic space 52 is formed, for example, as a space surrounded by the second outer casing 8 in the second case 4, a part of the first outer casing 5, the board mounting portion 7, and the circuit board 12.

[0026] The circuit board 12 is, for example, a double-sided board, with the surface facing the front acoustic space 51 formed as a first arrangement surface 13 and the surface facing the rear acoustic space 52 formed as a second arrangement surface 14 (see FIGS. 1 to 3). An antenna circuit capable of wirelessly communicating acoustic signals and the like is formed on the circuit board 12. Note that a multilayer board may also be used as the circuit board 12.

[0027] A speaker 15 is arranged on the first placement surface 13 of the circuit board 12 (see FIGS. 1 and 2). The speaker 15 is, for example, a MEMS (Micro Electrical Mechanical Systems) speaker, which is a device formed by microfabrication technology (MEMS process) that applies the manufacturing process of semiconductor elements.

[0028] Dynamic speakers are manufactured by assembling individual components, making it difficult to miniaturize the components and requiring many assembly steps, limiting miniaturization. On the other hand, MEMS speakers can be produced using only the MEMS process, making them easy to miniaturize and enabling automated mass production. Furthermore, MEMS speakers can be attached to a substrate by reflow soldering, ensuring good assembly. These advantages of MEMS speakers are also common to MEMS microphones, which will be described later.

[0029] The speaker 15 is configured by arranging predetermined parts inside a housing 15a (see FIG. 4). A diaphragm 15b is arranged inside the speaker 15, and the speaker 15 is formed with a first sound hole 15c that outputs sound toward the inside of the sound conduit 6, and a second sound hole 15d located on the opposite side of the first sound hole 15c.

[0030] In the speaker 15, an acoustic signal (sound) corresponding to the input signal is generated by vibrating the diaphragm 15b based on the input signal, and the generated sound is output from the first sound hole 15c. The sound output from the first sound hole 15c is input into the listener's ear from the inside of the sound conduit section 6 (sound conduit space). At this time, the sound output from the second sound hole 15d is an acoustic signal (sound) of opposite phase (opposite amplitude) to the sound output from the first sound hole 15c.

[0031] In this way, out-of-phase sounds are output from the speaker 15 at the first sound hole 15c and the second sound hole 15d, but because the circuit board 12 divides the acoustic space 50 into a front acoustic space 51 on the first sound hole 15c side and a rear acoustic space 52 on the second sound hole 15d side, mixing of out-of-phase sounds is suppressed, ensuring high noise canceling performance and enabling high-quality sound to be output to the listener.

[0032] In the sound processing device 1, instead of the MEMS speaker, another speaker such as a piezoelectric speaker using a piezoelectric element may be used as the speaker 15.

[0033] A microphone 16 is disposed on the second mounting surface 14 of the circuit board 12 (see FIGS. 1 and 3). The microphone 16 is provided as a feedback noise canceling microphone for performing a noise canceling function, and is, for example, a bottom sound hole type. A bottom sound hole type microphone is a microphone that has a sound hole on the mounting surface. The microphone 16 is, for example, a MEMS microphone, which is a device formed by microfabrication technology that applies the manufacturing process of semiconductor elements.

[0034] In the sound processing device 1, instead of the MEMS microphone, other microphones such as a piezoelectric microphone using a piezoelectric element may be used as the microphone 16.

[0035] The microphone 16 has a function of collecting the sound output from the speaker 15. The sound collected by the microphone 16 also includes noise.

[0036] When sound is collected by the microphone 16, a signal having an opposite phase to the signal generated based on the collected sound is generated as a noise cancellation signal. By performing noise cancellation processing based on the generated noise cancellation signal, noise contained in the sound reproduced from the speaker 15 is removed or reduced, and the listener hears high-quality sound from which noise has been removed or reduced.

[0037] As described above, the microphone 16 is a device formed by microfabrication technology (MEMS process) similar to the speaker 15, and is a device that can be easily miniaturized and mass-produced automatically. Furthermore, the microphone 16, which is a MEMS microphone, can be attached to the circuit board 12 by reflow soldering, ensuring good assembly of the sound processing device 1.

[0038] In particular, by using a MEMS speaker as the speaker 15 and a MEMS microphone as the microphone 16, it becomes possible to assemble both the speaker 15 and the microphone 16 to the circuit board 12 by reflow, thereby ensuring even better assembly ease of the sound processing device 1.

[0039] On the second placement surface 14 of the circuit board 12, for example, a connection terminal 17 is placed at one end in the longitudinal direction.

[0040] The circuit board 12 is formed with a speaker hole 12a, a microphone hole 12b, and a through-hole 12c that penetrate the circuit board 12 in the thickness direction (see FIGS. 1 to 3). The speaker hole 12a is formed at a position overlapping the second sound hole 15d of the speaker 15, the microphone hole 12b is formed at a position overlapping the microphone 16, and the through-hole 12c is formed at a position where the speaker 15 and the microphone 16 are not located.

[0041] In this way, the speaker 15 is placed on the first placement surface 13 of the circuit board 12, and the second sound hole 15d is positioned so that it overlaps with the speaker hole 12a. Therefore, the speaker 15 is placed on the circuit board 12 with the second sound hole 15d and the speaker hole 12a overlapping, making it possible to output high-quality sound from the speaker 15 and ensuring good acoustic characteristics of the speaker 15.

[0042] The speaker hole 12a functions as a passage for sound output from the speaker 15, and the microphone hole 12b functions as a passage for sound input to the microphone 16. The through-hole 12c has the function of suppressing the sound pressure when sound is output from the speaker 15, thereby reducing the impact on the eardrum of the listener.

[0043] In this way, the speaker hole 12a, the microphone hole 12b, and the through hole 12c are all holes related to acoustics, and by forming holes with multiple different acoustic functions in the circuit board 12, it is possible to simplify the structure of the sound processing device 1, reduce the number of parts in the sound processing device 1, and improve its functionality.

[0044] In addition, a bottom sound hole type MEMS microphone is used as the microphone 16, and the microphone 16 is placed on the second placement surface 14 of the circuit board 12, and a microphone hole 12b is formed in the circuit board 12 as a passage for sound input to the microphone 16.

[0045] Therefore, noise cancellation is performed by processing the sound near the listener's ears, ensuring high noise cancellation performance.

[0046] The sound processing device 1 may be configured to have a plurality of through holes 12c formed therein, or may be configured to have no through holes 12c formed therein.

[0047] A third acoustic resistor 18 and a fourth acoustic resistor 19, which respectively cover the speaker hole 12a and the through-hole 12c, are attached to the second arrangement surface 14 of the circuit board 12. For example, a mesh sheet or nonwoven fabric called a resistor is used as the third acoustic resistor 18 and the fourth acoustic resistor 19. The fourth acoustic resistor 19 may be attached to the first arrangement surface 13.

[0048] Attaching the fourth acoustic resistor 19 to the second placement surface 14 improves the sound insulation of the front acoustic space 51, ensuring high noise canceling performance. In addition, it becomes possible to adjust the airtightness of the front acoustic space 51 according to the performance of the fourth acoustic resistor 19, improving comfort when wearing the sound processing device 1.

[0049] Note that by forming the speaker hole 12a into one or more microholes, the speaker hole 12a can function as an acoustic resistor, and in this case, the third acoustic resistor 18 may not be provided. Also, by forming the through hole 12c into one or more microholes, the through hole 12c can function as an acoustic resistor, and in this case, the fourth acoustic resistor 19 may not be provided. When multiple through holes 12c are formed, it is possible to reduce the diameter of at least one of the through holes 12c or to form them into multiple microholes, thereby reducing the number of fourth acoustic resistors 19.

[0050] In a rear acoustic space 52, which is part of the interior space of the housing 2, for example, a battery 20 that functions as a battery and a control board 21 electrically connected to the circuit board 12 are arranged (see FIG. 1).

[0051] The battery 20 is, for example, a so-called button-type battery formed in a flat shape, and is arranged, for example, with its thickness direction coinciding with the thickness direction of the circuit board 12. The battery 20 is electrically connected to the control board 21.

[0052] The control board 21 is connected to the connection terminals 17 arranged on the circuit board 12 via connection lines 22. For example, a flexible printed wiring board is used as the connection lines 22. The control board 21 has the function of controlling each unit provided in the sound processing device 1, and also generates a noise cancellation signal and performs noise cancellation processing.

[0053] The control board 21 is disposed, for example, with its thickness direction coinciding with the thickness direction of the circuit board 12, and is positioned on the opposite side of the circuit board 12 with the battery 20 sandwiched between them.

[0054] As described above, by aligning the thickness directions of the circuit board 12, the battery 20, and the control board 21, the space of the acoustic space 50 can be effectively utilized, and the sound processing device 1 can be made thinner in the front-to-back direction.

[0055] The microphone 23 is disposed in the rear acoustic space 52. The microphone 23 is, for example, a MEMS microphone, which is a device formed by microfabrication technology that applies the manufacturing process of semiconductor elements.

[0056] The microphone 23 is mounted on a microphone substrate (not shown) and attached to the microphone mounting portion 9. The microphone 23 may be mounted to the microphone mounting portion 9 via an acoustic resistor (not shown) and a microphone substrate, in which case the acoustic resistor is attached to the microphone mounting portion 9 in a state covering the microphone hole 9a, and the microphone substrate and microphone 23 are arranged overlapping the acoustic resistor.

[0057] The microphone 23 is provided as a feedforward noise canceling microphone for executing the noise canceling function. The microphone 23 has a function of picking up sound (external noise) outside the sound processing device 1, and the external sound is input to the microphone 23 via the external sound input hole 8b and the microphone hole 9a. The microphone 23 is electrically connected to the control board 21.

[0058] When sound is collected by the microphone 23, a signal that is opposite in phase to a signal generated based on the collected sound (noise) is generated as a noise cancellation signal. By performing noise cancellation processing based on the generated noise cancellation signal, noise contained in the sound reproduced from the speaker 15 is removed or reduced, and the listener hears high-quality sound from which noise has been removed or reduced.

[0059] As described above, the microphone 23 is a device formed by microfabrication technology (MEMS process) like the speaker 15 and the microphone 16, and is a device that is easy to miniaturize and can be mass-produced automatically. Therefore, by using a MEMS microphone as the microphone 23, the sound processing device 1 can be miniaturized.

[0060] The sound processing device 1 may be configured without the microphone 23. In this case, the microphone 16 for feedback noise canceling is used, and only the feedback noise canceling process is performed.

[0061] <Modifications of Sound Processing Device> Next, modifications of the sound processing device will be described (see FIGS. 5 to 16).

[0062] In each of the modified examples shown below, only the parts that differ from the above-mentioned sound processing device 1 will be described in detail, and other parts will be given the same symbols as those used for similar parts in the sound processing device 1 and will not be described again.

[0063] (First Modification) A sound processing device 1A according to a first modification is different from the sound processing device 1 in that the microphone 16 is disposed at a different position (see FIG. 5).

[0064] A microphone 16 is disposed on the first mounting surface 13 of the circuit board 12. The microphone 16 is a top sound hole type. A top sound hole type microphone is a microphone that has a sound hole on the side opposite the mounting surface. Therefore, no microphone hole is formed in the circuit board 12.

[0065] As described above, in the sound processing device 1A, a top sound hole type MEMS microphone is used as the microphone 16, and the microphone 16 is disposed on the first mounting surface 13 of the circuit board 12.

[0066] Therefore, since there is no need to form a microphone hole in the circuit board 12, the layout area for other components on the second layout surface 14 of the circuit board 12 is increased, and the second layout surface 14 can be used more effectively.

[0067] Furthermore, since the area of ​​the second placement surface 14 is increased, when unnecessary placement area is generated, it is possible to reduce the size of the circuit board 12 by that amount, thereby enabling the sound processing device 1A to be miniaturized.

[0068] Furthermore, since the microphone 16 and the speaker 15 are arranged on the first arrangement surface 13 of the circuit board 12, the microphone 16 and the speaker 15 can be assembled simultaneously by reflow soldering, thereby improving assembly efficiency.

[0069] (Second Modification) A sound processing device 1B according to a second modification is different from the sound processing device 1 in that the speaker 15 is arranged at a different position (see FIG. 6).

[0070] A speaker 15 is disposed on the second mounting surface 14 of the circuit board 12. The speaker 15 is positioned with the first sound hole 15c overlapping the speaker hole 12a, and a third acoustic resistor 18 is attached to the speaker 15 so as to cover the second sound hole 15d.

[0071] In this way, in the sound processing device 1B, the speaker 15 is arranged on the second arrangement surface 14 of the circuit board 12, and the speaker 15 is positioned with the first sound hole 15c overlapping the speaker hole 12a.

[0072] Therefore, the speaker 15 is placed on the circuit board 12 with the first sound hole 15c and the speaker hole 12a overlapping, making it possible to output high-quality sound from the speaker 15 and ensuring good acoustic characteristics of the speaker 15.

[0073] Furthermore, since the microphone 16 and the speaker 15 are arranged on the second arrangement surface 14 of the circuit board 12, the microphone 16 and the speaker 15 can be assembled simultaneously by reflow soldering, thereby improving assembly efficiency.

[0074] In the sound processing device 1B, the second sound hole 15d may be one or more microholes, and the third acoustic resistor 18 may be omitted.

[0075] (Third Modification) A sound processing device 1C according to a third modification differs from the sound processing device 1 in that a cylindrical acoustic resistor is attached to the circuit board 12 (see FIG. 7).

[0076] A cylindrical fifth acoustic resistor 24 is attached to the first placement surface 13 of the circuit board 12, and the internal space of the fifth acoustic resistor 24 is in communication with the through-hole 12c. The cylindrical fifth acoustic resistor 24 may be molded integrally with the circuit board 12.

[0077] In this manner, in the sound processing device 1C, the fifth acoustic resistor 24 having a cylindrical shape and an internal space communicating with the through-hole 12c is attached to the circuit board 12.

[0078] Therefore, the fifth acoustic resistor 24 improves the sound insulation of the front acoustic space 51, thereby ensuring high noise canceling performance. In particular, since the fifth acoustic resistor 24 is formed in a cylindrical shape, it is possible to adjust the frequency characteristics of the sound output from the speaker 15 to the listener.

[0079] (Fourth Modification) A sound processing device 1D according to a fourth modification differs from the sound processing device 1 in that a connection board is connected to the circuit board 12 (see FIG. 8).

[0080] A connection board 25 is connected to the circuit board 12, and at least a portion of the connection board 25 is made flexible. For example, a flexible printed wiring board is used as the connection board 25. Alternatively, the circuit board 12 and the connection board 25 may be, for example, a single rigid-flexible printed circuit board, a portion of which is made flexible.

[0081] For example, the middle section 26 of the connection board 25 is bent at approximately 90 degrees, and the end section 27 opposite the side connected to the circuit board 12 is positioned inside the sound conduit section 6. A microphone hole 27a is formed in the end section 27, and for example, a bottom sound hole type microphone 16 is disposed on one surface of the end section 27. Therefore, the microphone 16 is not disposed on the circuit board 12.

[0082] In this way, in the sound processing device 1D, a connection board 25 having at least a portion that is bendable is connected to the circuit board 12, the microphone 16 is arranged on the connection board 25, and the microphone 16 is positioned inside the sound guide tube portion 6.

[0083] Therefore, since the microphone 16 collects sound at a position close to the ear canal of the listener, high noise canceling performance can be ensured.

[0084] In the sound processing device 1D, the top sound hole type microphone 16 may be disposed at the end 27 of the connection board 25. In this case, it is not necessary to form a microphone hole at the end 27.

[0085] (Fifth Modification) A sound processing device 1E according to a fifth modification differs from the sound processing device 1 in that the rear acoustic space 52 is divided into two spaces by a partition plate (see FIG. 9).

[0086] A partition plate 28 facing the front-rear direction is attached to the inner surface of the housing 2, and the rear acoustic space 52 is divided by the partition plate 28 into a first space 52a and a second space 52b. The first space 52a is the space on the side where the circuit board 12 is located, and the second space 52b is the space on the side where the control board 21 is located. Therefore, the battery 20, the control board 21, and the microphone 23 are arranged in the second space 52b.

[0087] The partition plate 28 has an insertion hole 28a through which a connection wire 22 for electrically connecting the circuit board 12 to the control board 21 is inserted.

[0088] In the housing 2, for example, a communication hole 5a is formed in the first outer casing 5 instead of the communication hole 8a, and the communication hole 5a is in communication with the first space 52a. A first acoustic resistor 10 is attached to the first outer casing 5 to cover the communication hole 5a.

[0089] In this way, in the sound processing device 1E, a partition plate 28 is provided that divides the rear acoustic space 52 into a first space 52a and a second space 52b, the first space 52a is formed on the circuit board 12 side, at least the control board 21 is arranged in the second space 52b, and the first space 52a is connected to the external space by a communication hole 5a.

[0090] Therefore, since the rear acoustic space 52 is divided into a first space 52a that is connected to the external space by the communication hole 5a and a second space 52b that is not connected to the external space, high waterproof performance can be achieved for each part such as the control board 21 that is placed in the second space 52b.

[0091] (Sixth Modification) The sound processing device 1F according to the sixth modification differs from the sound processing device 1 in that it is provided with a partition plate and also has a partition wall portion in the first outer casing 5 (see FIG. 10).

[0092] A partition plate 28 facing the front-rear direction is attached to the inner surface of the housing 2, and the rear acoustic space 52 is divided by the partition plate 28 into a first space 52a and a second space 52b.

[0093] The first outer casing 5 is provided with a partition wall 29 that protrudes from the inner surface toward the circuit board 12, and the middle portion of the circuit board 12 in the longitudinal direction is attached to the tip of the partition wall 29 by adhesive or the like. The partition wall 29 is located inside the board mounting portion 7 provided on the first case 3. A portion of the acoustic space 50 is formed as a third space 52c that is surrounded by a portion of the board mounting portion 7, the partition wall 29, a portion of the circuit board 12, and a portion of the first outer casing 5. The third space 52c is located on the opposite side of the partition wall 29 from the front acoustic space 51.

[0094] In addition to the through hole 12c, a through hole 12d is formed in the circuit board 12, and the through hole 12c connects the front acoustic space 51 to the first space 52a, and the through hole 12d connects the third space 52c to the first space 52a.

[0095] In the housing 2, for example, a communication hole 5a is formed in the first outer casing 5 instead of the communication hole 8a, and the communication hole 5a communicates with the third space 52c.

[0096] In this way, in the acoustic processing device 1F, a partition plate 28 is provided to divide the rear acoustic space 52 into a first space 52a and a second space 52b, the first space 52a is formed on the circuit board 12 side, and at least the control board 21 is arranged in the second space 52b.

[0097] Therefore, the partition plate 28 forms the second space 52b that is not connected to the external space, thereby achieving high waterproof performance for each part such as the control board 21 arranged in the second space 52b.

[0098] In addition, the housing 2 is provided with a partition portion 29 that protrudes from the first outer casing portion 5 toward the circuit board 12, and a part of the acoustic space 50 is formed as a third space 52c that is separated from the front acoustic space 51 by the partition portion 29, and the third space 52c is connected to the first space 52a by the through hole 12d, and the third space 52c is connected to the external space by the communication hole 5a.

[0099] Therefore, since the sound from the external space is input to the microphone 16 through the communication hole 5a and the through hole 12d, it is possible to attenuate the sound from the external space twice, thereby ensuring high noise canceling performance.

[0100] (Seventh Modification) A sound processing device 1G according to a seventh modification is different from the sound processing device 1 in that a shielding cover is provided (see FIG. 11).

[0101] A shielding cover 30 made of, for example, a metal material is attached to the second placement surface 14 of the circuit board 12. However, the shielding cover 30 can also be made of a resin material or the like. The shielding cover 30 is formed in a box shape with an opening at the front, and shields the microphone 16, the third acoustic resistor 18, and the fourth acoustic resistor 19. A passage hole 30a is formed in the shielding cover 30.

[0102] The rear acoustic space 52 is partitioned by the shielding cover 30 into a first space 52 a which is the space inside the shielding cover 30 and a second space 52 b which is the space outside the shielding cover 30 .

[0103] In this way, in the acoustic processing device 1G, a shielding cover 30 that shields at least the microphone 16 is attached to the circuit board 12, a passage hole 30a is formed in the shielding cover 30, and the rear acoustic space 52 is divided into a first space 52a and a second space 52b by the shielding cover 30.

[0104] Therefore, the rear acoustic space 52 is divided into a first space 52a and a second space 52b by the shielding cover 30, and the sound from the external space is input to the microphone 16 through the communication hole 8a and the through hole 30a, so that the sound from the external space can be attenuated doubly, ensuring high noise canceling performance.

[0105] Furthermore, in the sound processing device 1G, an acoustic resistor covering the passage hole 30a may be attached to the shielding cover 30. In this case, the acoustic resistor increases the acoustic resistance, making it possible to adjust the frequency characteristics of the sound output from the speaker 15 to the listener.

[0106] In addition, the shielding cover 30 made of a metal material may be connected to the ground potential of the circuit board 12. In this case, the shielding cover 30 made of a metal material is grounded, thereby suppressing the application of electromagnetic noise to the microphone 16 and the speaker 15.

[0107] (Eighth Variant) The sound processing device 1H according to the eighth variant differs from the sound processing device 1 in that it is provided with a shielding cover and also has a partition wall portion on the first outer casing 5 (see FIG. 12).

[0108] A shielding cover 31 made of, for example, a metal material is attached to the second placement surface 14 of the circuit board 12. However, the shielding cover 31 can also be made of a resin material or the like. The shielding cover 31 is formed in a box shape with an opening at the front, and shields the microphone 16, the third acoustic resistor 18, and the fourth acoustic resistor 19.

[0109] The rear acoustic space 52 is partitioned by the shielding cover 31 into a first space 52 a which is the space inside the shielding cover 31 and a second space 52 b which is the space outside the shielding cover 31 .

[0110] The first outer casing 5 is provided with a partition wall 29 that protrudes from the inner surface toward the circuit board 12, and the middle portion of the circuit board 12 in the longitudinal direction is attached to the tip of the partition wall 29 by adhesive or the like. The partition wall 29 is located inside the board mounting portion 7 provided on the first case 3. A portion of the acoustic space 50 is formed as a third space 52c that is surrounded by a portion of the board mounting portion 7, the partition wall 29, a portion of the circuit board 12, and a portion of the first outer casing 5. The third space 52c is located on the opposite side of the partition wall 29 from the front acoustic space 51.

[0111] In addition to the through hole 12c, a through hole 12d is formed in the circuit board 12, and the through hole 12c connects the front acoustic space 51 to the first space 52a, and the through hole 12d connects the third space 52c to the first space 52a.

[0112] In the housing 2, for example, a communication hole 5a is formed in the first outer casing 5 instead of the communication hole 8a, and the communication hole 5a communicates with the third space 52c.

[0113] As described above, the sound processing device 1H is provided with a shielding cover 31 that divides the rear acoustic space 52 into a first space 52a and a second space 52b, with the first space 52a being formed on the circuit board 12 side and at least the control board 21 being disposed in the second space 52b. The housing 2 is also provided with a partition wall 29 that protrudes from the first outer casing 5 toward the circuit board 12 side, with a part of the acoustic space 50 being formed as a third space 52c that is separated from the front acoustic space 51 by the partition wall 29, with the third space 52c communicating with the first space 52a via the through-hole 12d and the third space 52c communicating with the external space via the communication hole 5a.

[0114] Therefore, the shielding cover 31 forms the second space 52b that is not connected to the external space, thereby achieving high waterproof performance for each part such as the control board 21 arranged in the second space 52b.

[0115] Furthermore, since the sound from the external space is input to the microphone 16 through the communication hole 5a and the through hole 12d, it is possible to attenuate the sound from the external space twice, thereby ensuring high noise canceling performance.

[0116] Furthermore, in the sound processing device 1H, an acoustic resistor may be provided that covers at least one of the communicating hole 5a and the through hole 12d.In this case, the acoustic resistor increases the acoustic resistance, making it possible to adjust the frequency characteristics of the sound output from the speaker 15 to the listener.

[0117] In addition, the shielding cover 31 made of a metal material may be connected to the ground potential of the circuit board 12. In this case, the shielding cover 31 made of a metal material is grounded, thereby suppressing the application of electromagnetic noise to the microphone 16 and the speaker 15.

[0118] (Ninth Variant) The sound processing device 1I according to the ninth variant differs from the sound processing device 1 in that the speaker 15 and the microphone 16 are positioned on opposite sides of the circuit board 12 (see FIG. 13).

[0119] A microphone 16 is disposed on the first mounting surface 13 of the circuit board 12, and a speaker 15 is disposed on the second mounting surface 14. The microphone 16 is a bottom sound hole type and is disposed on the opposite side (directly opposite position) of the speaker 15 on the first mounting surface 13 of the circuit board 12. The speaker 15 is positioned such that the first sound hole 15c overlaps the speaker hole 12a and the microphone hole 12b. The speaker 15 is disposed in a position that covers the microphone hole 12b, and a portion of the speaker 15 and the microphone 16 are positioned on both sides of the microphone hole 12b.

[0120] In this way, in the sound processing device 1I, the microphone 16 is arranged on the opposite side of the speaker 15 on the first arrangement surface 13 of the circuit board 12, a microphone hole 12b is formed in the circuit board 12 to serve as a passage for sound to the microphone 16, and the speaker 15 is positioned so that the first sound hole 15c overlaps the speaker hole 12a.

[0121] Therefore, since the speaker 15 and the microphone 16 are positioned on opposite sides of the circuit board 12, the space on the surface on which the circuit board 12 is placed can be effectively utilized, thereby making it possible to miniaturize the circuit board 12 and the sound processing device 1I.

[0122] Furthermore, since the distance between the microphone hole 12b and the speaker hole 12a is reduced, acoustic delay is reduced and high noise canceling performance can be ensured.

[0123] (Tenth variant) The sound processing device 1J of the tenth variant differs from the sound processing device 1 in that it has an acoustic resistor that divides the front acoustic space 51 into two spaces, a connection board is connected to the circuit board 12, and the speaker 15 is positioned differently (see Figure 14).

[0124] The speaker 15 is disposed on the second mounting surface 14 of the circuit board 12. The speaker 15 is positioned so that the first sound hole 15c overlaps the speaker hole 12a, and a third acoustic resistor 18 is attached to the speaker 15 so as to cover the second sound hole 15d. Note that the second sound hole 15d can be one or more microholes, and the third acoustic resistor 18 can be omitted.

[0125] A sixth acoustic resistor 32 is arranged in the front acoustic space 51, and the front acoustic space 51 is divided by the sixth acoustic resistor 32 into a board-side space 51a in which the circuit board 12 is located and a sound-guide-side space 51b, which is the space inside the sound-guide tube section 6.

[0126] A connection board 25 is connected to the circuit board 12, and at least a portion of the connection board 25 is bendable. For example, a flexible printed circuit board is used as the connection board 25. The connection board 25 is inserted through the sixth acoustic resistor 32, and each portion of the connection board 25 is positioned in the board-side space 51 a and the sound-guide-side space 51 b.

[0127] For example, the middle portion 26 of the connection board 25 is bent at approximately 90 degrees, and the end portion 27 opposite the side connected to the circuit board 12 is positioned in the sound guide side space 51b. A microphone hole 27a is formed in the end portion 27, and for example, a bottom sound hole type microphone 33 is disposed on one surface of the end portion 27. Therefore, the microphone 16 disposed on the second arrangement surface 14 of the circuit board 12 is provided as a first microphone, and the microphone 33 disposed on the connection board 25 is provided as a second microphone.

[0128] In this way, in the acoustic processing device 1J, a sixth acoustic resistor 32 is provided to divide the front acoustic space 51 into a board-side space 51a and a sound-guide-side space 51b, and a microphone 16 that functions as a first microphone and a microphone 33 that functions as a second microphone are provided, with the microphone 16 being arranged on the second arrangement surface 14 of the circuit board 12 and the microphone 33 being arranged on the connection board 25 in the sound-guide-side space 51b.

[0129] Therefore, it becomes easier for the microphones 16 and 33 to pick up the out-of-phase sound output from the speaker 15, and the sound is picked up at a position close to the listener's ear canal, thereby improving noise canceling performance.

[0130] Furthermore, by dividing the front acoustic space 51 into the substrate-side space 51a and the sound-guide-side space 51b by the sixth acoustic resistor 32, the sound insulation of the sound-guide-side space 51b is improved, ensuring even higher noise-canceling performance.

[0131] In the sound processing device 1J, the top sound hole type microphone 33 may be disposed at the end 27 of the connection board 25. In this case, it is not necessary to form a microphone hole at the end 27.

[0132] (Eleventh Variant) The sound processing device 1K of the eleventh variant differs from the sound processing device 1 in that the speaker 15 and the microphone 16 are positioned on opposite sides of the circuit board 12, a connection board 25 is connected to the circuit board 12, and an acoustic resistor is provided to divide the front acoustic space 51 into two spaces (see Figure 15).

[0133] A microphone 16 is disposed on the first mounting surface 13 of the circuit board 12, and a speaker 15 is disposed on the second mounting surface 14. The microphone 16 is a bottom sound hole type and is disposed on the opposite side of the speaker 15 on the first mounting surface 13 of the circuit board 12. The speaker 15 is positioned so that the first sound hole 15c overlaps the speaker hole 12a. The speaker 15 is disposed in a position that covers the microphone hole 12b, and a portion of the speaker 15 and the microphone 16 are positioned on both sides of the microphone hole 12b.

[0134] A seventh acoustic resistor 34 covering the speaker hole 12a is attached to the first placement surface 13 of the circuit board 12. The front acoustic space 51 is divided into a board-side space 51a and a sound-guide-side space 51b by the seventh acoustic resistor 34. The board-side space 51a is a space formed by the speaker hole 12a, the space in front of the diaphragm 15b in the internal space of the speaker 15, and the microphone hole 12b. The sound-guide-side space 51b is a space surrounded by a part of the first outer casing 5, the board mounting portion 7, the sound guide tube portion 6, the circuit board 12, and the seventh acoustic resistor 34.

[0135] A connection board 25 is connected to the circuit board 12, and at least a portion of the connection board 25 is bendable. For example, a flexible printed wiring board is used as the connection board 25. The connection board 25 is inserted through the circuit board 12, and is positioned substantially entirely in the sound guide side space 51b.

[0136] For example, the middle portion 26 of the connection board 25 is bent at approximately 90 degrees, and the end portion 27 opposite the side connected to the circuit board 12 is positioned inside the sound conduit portion 6. A microphone hole 27a is formed in the end portion 27, and for example, a bottom sound hole type microphone 33 is disposed on one surface of the end portion 27. Therefore, the microphone 16 disposed on the first mounting surface 13 of the circuit board 12 is provided as a first microphone, and the microphone 33 disposed on the connection board 25 is provided as a second microphone.

[0137] In this way, in the sound processing device 1K, the microphone 16 is arranged on the opposite side of the speaker 15 on the first arrangement surface 13 of the circuit board 12, a microphone hole 12b is formed in the circuit board 12 to serve as a passage for sound to the microphone 16, and the speaker 15 is positioned so that the first sound hole 15c overlaps the speaker hole 12a.

[0138] Therefore, since the speaker 15 and the microphone 16 are positioned on opposite sides of the circuit board 12, the space on the surface on which the circuit board 12 is arranged can be effectively utilized, thereby making it possible to miniaturize the circuit board 12 and the sound processing device 1K.

[0139] Furthermore, since the microphones 16 and 33 can easily pick up the out-of-phase sound output from the speaker 15 and pick up the sound at a position close to the listener's ear canal, noise canceling performance can be improved.

[0140] Furthermore, by dividing the front acoustic space 51 into the substrate-side space 51a and the sound-guide-side space 51b by the seventh acoustic resistor 34, the sound insulation of the sound-guide-side space 51b is improved, ensuring even higher noise-canceling performance.

[0141] <System Configuration> The system configuration of the sound processing devices 1 to 1K will be described below (see FIGS. 16 and 17).

[0142] First, the system configuration of the sound processing devices 1 to 1I will be described (see FIG. 16 ). The sound processing devices 1 to 1I each have a microphone 16 for feedback noise canceling and a microphone 23 for feedforward noise canceling, and are configured without a microphone 33 that functions as a second microphone.

[0143] External noise is picked up by the microphone 16, and the acoustic signal of the picked up noise is converted into a digital signal by the microphone 16 or a noise canceling processor (not shown). The converted digital signal is processed by the filter 40, and a noise canceling signal that is acoustically inverse phase to the noise is generated.

[0144] The generated noise canceling signal is output as an analog signal from a D / A converter 41 that converts a digital signal into an analog signal to the speaker 15. The converted analog signal is then output as an acoustic signal from the speaker 15 to the listener via an amplifier 42.

[0145] In this way, a noise canceling signal that is acoustically opposite in phase to the noise is generated, thereby acoustically canceling out the external noise and providing the listener with noise-free or noise-reduced sound.

[0146] In addition, the acoustic signal of the noise output from the microphone 23 is converted into a digital signal by the microphone 23 or a noise canceling processor, and the converted digital signal is processed in a filter 43 to generate a noise canceling signal that is acoustically inverse phase to the noise.

[0147] The generated noise canceling signal is added to the noise canceling signal output via the filter 40, and is output to the listener from the speaker 15 via the D / A converter 41, thereby providing the listener with an acoustic signal that does not contain noise or has reduced noise.

[0148] The acoustic signal output to the listener in the above process may be synthesized with an acoustic signal that is the original listening purpose, such as music, and output from the speaker 15 to the listener.

[0149] Next, the system configuration of the sound processing device 1J and the sound processing device 1K will be described (see FIG. 17 ). The sound processing device 1J and the sound processing device 1K each have a feedback noise canceling microphone 16 and a feedforward noise canceling microphone 23 that function as first microphones, as well as a feedback noise canceling microphone 33 that functions as a second microphone.

[0150] In the sound processing devices 1J and 1K, in addition to the processing performed in the sound processing devices 1 to 1I, processing related to external noise picked up by the microphone 33 is also performed, and the acoustic signal of the noise picked up by the microphone 33 is converted into a digital signal by the microphone 33 or a noise canceling processor. The converted digital signal is processed by the filter 44, and a noise canceling signal that is acoustically in the opposite phase to the noise is generated, and the generated noise canceling signal is added to the noise canceling signal output via the filters 40 and 43.

[0151] <Others> In the above, an example has been shown in which the speaker 15 and the microphone 16 are arranged on the circuit board 12, but other devices 45 may be arranged on the circuit board 12 in addition to the speaker 15 and the microphone 16 (see FIG. 18 ). Examples of other devices 45 that may be arranged include various detection devices such as an infrared sensor, a bone conduction sensor, a pulse wave sensor, a barometric pressure sensor, an acceleration sensor, and a geomagnetic sensor, as well as acoustic devices such as an amplifier for driving the speaker 15.

[0152] By arranging these devices 45 on the circuit board 12, it is possible to improve the functionality of the sound processing devices 1 to 1K.

[0153] Furthermore, although the above example shows the circuit board 12 formed in a rectangular shape, the shape of the circuit board 12 is not limited to a rectangular shape, and may be formed, for example, in a shape (irregular shape) that corresponds to the shape of the first case 3 in the portion that is placed in the acoustic space 50 (see Figure 19).

[0154] By forming the circuit board 12 in a shape that corresponds to the shape of the first case 3 in the portion that is placed in the acoustic space 50, assembly becomes possible that corresponds to the complex shape of the first case 3, thereby enabling the sound processing device 1 to the sound processing device 1K to be made smaller and improving sound insulation between the front acoustic space 51 and the rear acoustic space 52.

[0155] Conversely, in the sound processing devices 1 to 1K, the shape of the board mounting portion 7 of the first case 3 may be formed to correspond to the shape of the circuit board 12 .

[0156] <Summary> As described above, the sound processing devices 1 to 1K are equipped with a speaker 15 arranged on a circuit board 12 and a microphone 16 for feedback noise cancellation, and the circuit board 12 is formed with a speaker hole 12a which serves as a passage for sound related to the speaker 15 and a through hole 12c which communicates with the spaces on both sides of the circuit board 12, and the circuit board 12 divides the acoustic space 50 into at least a front acoustic space 51 and a rear acoustic space 52.

[0157] Therefore, the speaker 15 is disposed on the circuit board 12 attached to the board attachment portion 7 of the housing 2 , and the acoustic space 50 is divided into at least a front acoustic space 51 and a rear acoustic space 52 by the circuit board 12 .

[0158] This eliminates the need to attach the circuit board 12 to the housing 2 via other components such as an inner housing, and also eliminates the need to divide the acoustic space 50 into multiple spaces using other components, making it possible to reduce and simplify the number of parts in the internal structure, ensuring compactness and good assembly ease.

[0159] In particular, since the sound processing devices 1 to 1K are miniaturized, the portability of the sound processing devices 1 to 1K can be improved and good fit to the listener's ears can be ensured.

[0160] <Present Technology> The present technology can be configured as follows.

[0161] (1) An acoustic processing device comprising: a housing having an outer casing in which a portion of an acoustic space, which is an internal space, is formed as a front acoustic space located on the sound output side, a sound guide tube portion continuous with the outer casing, and a board mounting portion located inside the outer casing; a circuit board mounted on the board mounting portion; a speaker arranged on the circuit board, the speaker having a first sound hole that outputs sound toward the sound guide tube portion and a second sound hole located on the opposite side of the first sound hole; and a microphone for feedback noise cancellation, wherein the circuit board is formed with a speaker hole that serves as a sound passage for the speaker and a through hole that communicates with spaces on both sides of the circuit board, and the acoustic space is divided by the circuit board into at least the front acoustic space and the rear acoustic space.

[0162] (2) The sound processing device according to (1), wherein the speaker is arranged on an arrangement surface of the circuit board facing the front acoustic space, and the speaker is positioned such that the second sound hole overlaps the speaker hole.

[0163] (3) The sound processing device according to (1) or (2), wherein a microphone having a sound hole on a placement surface is used as the microphone, the microphone is placed on the placement surface of the circuit board facing the rear acoustic space, and a microphone hole is formed in the circuit board to serve as a passage for sound to the microphone.

[0164] (4) The sound processing device according to (1) or (2), wherein the microphone has a sound hole on the side opposite to the placement surface, and the microphone is placed on the placement surface of the circuit board on the front acoustic space side.

[0165] (5) The sound processing device according to (1), (3), or (4), wherein the speaker is arranged on a placement surface of the circuit board on the rear acoustic space side, and the speaker is positioned such that the first sound hole overlaps the speaker hole.

[0166] (6) The sound processing device according to any one of (1) to (5), wherein a cylindrical acoustic resistor whose internal space communicates with the through hole is attached to the circuit board.

[0167] (7) The sound processing device according to any one of (1) to (6), wherein a connection board, at least a portion of which is bendable, is provided integrally with the circuit board or as a separate board, the microphone is disposed on the connection board, and the microphone is positioned inside the sound guide tube portion.

[0168] (8) A sound processing device according to any one of (1) to (7), wherein a partition plate is attached to the housing to separate the rear acoustic space into a first space and a second space, the first space is formed on the circuit board side, at least a battery or a control board is arranged in the second space, and the first space is connected to an external space by a communication hole that connects the acoustic space to the external space.

[0169] (9) A sound processing device according to any one of (1) to (8), wherein a partition plate is attached to the housing to separate the rear acoustic space into a first space and a second space, the first space is formed on the circuit board side, at least a battery or a control board is arranged in the second space, the housing is provided with a partition portion that protrudes from the outer casing toward the circuit board, a part of the acoustic space is formed as a third space separated from the front acoustic space by the partition portion, and the third space is connected to the first space by the through hole and also to an external space by a communication hole that connects the acoustic space to the external space.

[0170] (10) A sound processing device according to any one of (1) to (9), wherein a shielding cover that shields at least the speaker hole is attached to the circuit board, the rear acoustic space is divided by the shielding cover, the space inside the shielding cover is formed as a first space, and the space outside the shielding cover is formed as a second space.

[0171] (11) The sound processing device according to (10), wherein a passage hole is formed in the shielding cover.

[0172] (12) The sound processing device according to (10) or (11), wherein the shielding cover is made of a metal material and is connected to the ground potential of the circuit board.

[0173] (13) The sound processing device according to any one of (10) to (12), wherein the shielding cover shields the through-hole.

[0174] (14) The sound processing device described in (13), wherein at least a battery or a control board is arranged in the second space, the housing is provided with a partition wall portion protruding from the outer casing toward the circuit board, a part of the acoustic space is formed as a third space separated from the front acoustic space by the partition wall portion, and the third space is connected to the first space by the through hole and also to the external space by a communication hole that connects the acoustic space to the external space.

[0175] (15) An audio processing device according to any one of (1), (4) to (13), wherein the speaker is arranged on the arrangement surface of the circuit board facing the rear acoustic space, the microphone is arranged on the opposite side of the speaker on the arrangement surface of the circuit board facing the front acoustic space, a microphone hole is formed in the circuit board to serve as a passage for sound to the microphone, and the speaker is positioned so that the first sound hole overlaps the speaker hole and the microphone hole.

[0176] (16) An acoustic processing device according to any one of (1) to (15), wherein an acoustic resistor is provided to separate the front acoustic space into a board-side space and a sound-guide-side space, a first microphone and a second microphone are provided as the microphones, a connection board having at least a portion that is bendable is provided integrally with the circuit board or as a separate board, the first microphone is positioned to pick up sound in the board-side space, and the second microphone is positioned in the sound-guide-side space and is disposed on the connection board.

[0177] (17) The sound processing device according to (15), wherein an acoustic resistor is provided to separate the front acoustic space into a board-side space and a sound guide-side space, a first microphone and a second microphone are provided as the microphones, a connection board having at least a portion that is bendable is provided integrally with the circuit board or as a separate board, the first microphone is positioned to pick up sound in the board-side space, and the second microphone is positioned inside the sound guide tube portion and is disposed on the connection board.

[0178] REFERENCE SIGNS LIST 1 Acoustic processing device 2 Housing 5 First outer housing 6 Sound guide tube section 7 Board mounting section 8 Second outer housing 8a Communication hole 10 First acoustic resistor 11 Second acoustic resistor 12 Circuit board 12a Speaker hole 12b Microphone hole 12c Through hole 13 First mounting surface 14 Second mounting surface 15 Speaker 15c First sound hole 15d Second sound hole 16 Microphone 18 Third acoustic resistor 19 Fourth acoustic resistor 21 Control board 50 Acoustic space 51 Front acoustic space 52 Rear acoustic space 1A Acoustic processing device 1B Acoustic processing device 1C Acoustic processing device 24 Fifth acoustic resistor 1D Acoustic processing device 25 Connection board 1E Acoustic processing device 28 Partition plate 5a Communication hole 1F Acoustic processing device 29 Partition section 52a First space 52b Second space 52c Third space 12d Through hole 1G Sound processing device 30 Shielding cover 1H Sound processing device 31 Shielding cover 52c Third space 1I Sound processing device 1J Sound processing device 32 Sixth acoustic resistor 33 Microphone 34 Seventh acoustic resistor 51a Substrate side space 51b Sound guide side space 1K Sound processing device

Claims

1. An acoustic processing device comprising: a housing having an outer casing in which a portion of the acoustic space, which is the internal space, is formed as a front acoustic space located on the sound output side, a sound conduit portion continuous with said outer casing, and a board mounting portion located inside said outer casing; a circuit board attached to said board mounting portion; a speaker arranged on said circuit board, said speaker having a first sound hole that outputs sound toward said sound conduit portion and a second sound hole located on the opposite side of said first sound hole; and a microphone for feedback noise cancellation, wherein said circuit board has a speaker hole that serves as a sound passage for said speaker and through holes that communicate with spaces on both sides of said circuit board, and said acoustic space is divided by said circuit board into at least said front acoustic space and rear acoustic space.

2. The sound processing device according to claim 1, wherein the speaker is arranged on the arrangement surface of the circuit board facing the front acoustic space, and the speaker is positioned such that the second sound hole overlaps the speaker hole.

3. The sound processing device according to claim 1, wherein the microphone is a microphone having a sound hole on its placement surface, the microphone is placed on the placement surface of the circuit board facing the rear acoustic space, and a microphone hole is formed in the circuit board to serve as a sound path to the microphone.

4. The sound processing device according to claim 1, wherein the microphone has a sound hole on the side opposite to the placement surface, and the microphone is placed on the placement surface of the circuit board that faces the front acoustic space.

5. The sound processing device according to claim 1, wherein the speaker is arranged on the arrangement surface of the circuit board facing the rear acoustic space, and the speaker is positioned so that the first sound hole overlaps the speaker hole.

6. The sound processing device according to claim 1, wherein a cylindrical acoustic resistor is attached to the circuit board, the internal space of which communicates with the through-hole.

7. The sound processing device according to claim 1, wherein a connection board, at least a portion of which is bendable, is provided integrally with the circuit board or as a separate board, the microphone is disposed on the connection board, and the microphone is positioned inside the sound guide tube portion.

8. The sound processing device according to claim 1, wherein a partition plate is attached to the housing to separate the rear acoustic space into a first space and a second space, the first space is formed on the circuit board side, at least a battery or a control board is disposed in the second space, and the first space is connected to an external space by a communication hole that connects the acoustic space to the external space.

9. The sound processing device according to claim 1, wherein a partition plate is attached to the housing to separate the rear acoustic space into a first space and a second space, the first space is formed on the circuit board side, at least a battery or a control board is arranged in the second space, the housing is provided with a partition portion that protrudes from the outer casing toward the circuit board, a part of the acoustic space is formed as a third space separated from the front acoustic space by the partition portion, and the third space is connected to the first space by the through hole and also to the external space by a communication hole that connects the acoustic space to the external space.

10. The sound processing device according to claim 1, wherein a shielding cover is attached to the circuit board to shield at least the speaker holes, and the rear acoustic space is divided by the shielding cover, with the space inside the shielding cover being formed as a first space and the space outside the shielding cover being formed as a second space.

11. The sound processing device according to claim 10, wherein a passage hole is formed in the shielding cover.

12. The sound processing device according to claim 10, wherein the shielding cover is made of a metal material and is connected to the ground potential of the circuit board.

13. The sound processing device according to claim 10, wherein the shielding cover shields the through-hole.

14. The sound processing device according to claim 13, wherein the housing is provided with a partition wall portion that protrudes from the outer casing toward the circuit board, a part of the acoustic space is formed as a third space separated from the front acoustic space by the partition wall portion, and the third space is connected to the first space by the through hole and also to the external space by a communication hole that connects the acoustic space to the external space.

15. The sound processing device according to claim 1, wherein the speaker is arranged on the arrangement surface of the circuit board facing the rear acoustic space, the microphone is arranged on the opposite side of the speaker on the arrangement surface of the circuit board facing the front acoustic space, a microphone hole is formed in the circuit board to serve as a passage for sound to the microphone, and the speaker is positioned so that the first sound hole overlaps the speaker hole and the microphone hole.

16. The sound processing device according to claim 1, wherein an acoustic resistor is provided to separate the front acoustic space into a board-side space and a sound-guiding-side space, a first microphone and a second microphone are provided as the microphones, a connection board having at least a portion that is flexible is provided as a substrate integral with the circuit board or as a separate board, the first microphone is positioned to pick up sound in the board-side space, and the second microphone is positioned on the connection board in the sound-guiding-side space.

17. An acoustic processing device as described in claim 15, wherein an acoustic resistor is provided to separate the front acoustic space into a board-side space and a sound guide-side space, a first microphone and a second microphone are provided as the microphones, a connection board having at least a portion that is flexible is provided as a substrate integral with the circuit board or as a separate substrate, the first microphone is positioned to pick up sound in the board-side space, and the second microphone is positioned on the connection board while being located inside the sound guide tube portion.

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