Photoelectric conversion module

Abstract

A photoelectric conversion module according to the present disclosure comprises a substrate, an optical waveguide, a photoelectric conversion element, and a support member. The substrate has a conductive first interconnect. The optical waveguide is located on the substrate and transmits an optical signal. The photoelectric conversion element has an optical interface and an electrode. The optical interface is located on the optical waveguide and inputs or outputs an optical signal to or from the optical waveguide. The electrode is electrically connected to the first interconnect. The support member is formed containing the same material as the optical waveguide and is located between the photoelectric conversion element and the substrate.

Description

Photoelectric conversion module

[0001] The present disclosure relates to a photovoltaic conversion module.

[0002] 2. Description of the Related Art Conventionally, there is known a module in which a photoelectric conversion element that converts an electrical signal into an optical signal or an optical signal into an electrical signal is mounted on a substrate.

[0003] Japanese Patent Application Laid-Open No. 2022-115723

[0004] A photoelectric conversion module according to one aspect of the present disclosure includes a substrate, an optical waveguide, a photoelectric conversion element, and a support member. The substrate has a conductive first wiring. The optical waveguide is located on the substrate and transmits an optical signal. The photoelectric conversion element has an optical interface and an electrode. The optical interface is located on the optical waveguide and inputs or outputs an optical signal to or from the optical waveguide. The electrode is electrically connected to the first wiring. The support member is formed of the same material as the optical waveguide and is located between the photoelectric conversion element and the substrate.

[0005] FIG. 1 is a schematic plan view showing the configuration of a photovoltaic conversion module according to a first embodiment. FIG. 2 is a schematic side view showing the configuration of a photovoltaic conversion module according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module according to a second embodiment. FIG. 4 is a schematic plan view showing the configuration of a photovoltaic conversion module according to a third embodiment. FIG. 5 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module according to a fourth embodiment. FIG. 6 is a schematic plan view showing the positional relationship between a support member and a via according to the fourth embodiment. FIG. 7 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module according to a fifth embodiment. FIG. 8 is a schematic plan view showing the configuration of a photovoltaic conversion module according to a sixth embodiment.

[0006] Hereinafter, a mode for carrying out a photoelectric conversion module according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the embodiment. Furthermore, each embodiment can be appropriately combined within the scope of not causing any contradiction in the processing content. Furthermore, the same components in each of the following embodiments will be assigned the same reference numerals, and duplicated explanations will be omitted.

[0007] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision or installation precision.

[0008] In the drawings referred to below, for ease of understanding, the X-axis, Y-axis, and Z-axis directions are defined as being orthogonal to each other, and an orthogonal coordinate system is shown in which the positive Z-axis direction is the vertically upward direction. The rotation direction around the vertical axis is also referred to as the θ direction.

[0009] Patent Document 1 discloses an opto-electrical module (hereinafter also referred to as an opto-electrical conversion module) in which an opto-electrical hybrid device (hereinafter also referred to as an opto-electrical conversion element) having an electronic circuit and an optical circuit driven by the electronic circuit is mounted on an interface substrate (hereinafter also referred to as a substrate).

[0010] Also known is an optoelectronic module in which an optical waveguide for transmitting an optical signal to a photoelectric conversion element is formed on a substrate. In the manufacturing process of such an optoelectronic conversion module, for example, a connection electrode for electrically connecting the substrate and the photoelectric conversion element and an optical waveguide are each formed in separate processes on a substrate having electrical wiring, and then the photoelectric conversion element is mounted on them.

[0011] However, in the photoelectric conversion module configured as described above, the optical waveguide is higher than the connection electrode, and the height position of the photoelectric conversion element and the substrate is determined by the connection on the optical waveguide side. In this case, there is a risk that the optical waveguide will be damaged if the optical waveguide comes into contact with the photoelectric conversion element, resulting in optical coupling loss between the optical waveguide and the photoelectric conversion element.

[0012] Therefore, there is a need to provide a photoelectric conversion module that reduces the optical coupling loss between the optical waveguide and the photoelectric conversion element.

[0013] First Embodiment First, the configuration of a photovoltaic conversion module 1 according to a first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a schematic plan view showing the configuration of a photovoltaic conversion module 1 according to the first embodiment. Fig. 2 is a schematic side view showing the configuration of a photovoltaic conversion module 1 according to the first embodiment.

[0014] As shown in FIGS. 1 and 2, the photoelectric conversion module 1 includes a substrate 10, a plurality of optical waveguides 20, a mirror 25, a support member 30, and a photoelectric conversion element 40.

[0015] The substrate 10 has, for example, a rectangular plate shape in a plan view. The substrate 10 has a mounting surface 101 on which the plurality of optical waveguides 20 and the mirror 25 are mounted. The substrate 10 may be, for example, an organic substrate. Alternatively, the substrate 10 may be a semiconductor substrate.

[0016] The substrate 10 has conductive first wiring 11. The first wiring 11 is a single-layer or multi-layer wiring and is electrically connected to an external electrical interface (not shown). At least a portion of the first wiring 11 is exposed on the mounting surface 101 of the substrate 10, and the exposed portion can be electrically connected to a photoelectric conversion element 40, which will be described later. In the example of FIG. 2 , the first wiring 11 is located on the positive side of the substrate 10 in the X-axis direction.

[0017] The optical waveguides 20 transmit optical signals. The optical waveguides 20 are located on the substrate 10. In the example of FIGS. 1 and 2 , the optical waveguides 20 are located on the negative X-axis side of the mounting surface 101 of the substrate 10. That is, the optical waveguides 20 may be formed in an area of ​​the substrate 10 other than the area where the first wiring 11 is located. The optical waveguides 20 extend along a fixed direction (here, the X-axis direction). The optical waveguides 20 are arranged in a direction (here, the Y-axis direction) perpendicular to the extension direction of the optical waveguides 20. One end of the optical waveguide 20 is connected to the connector 60, and the other end faces the mirror surface of the mirror 25.

[0018] 2 , the optical waveguide 20 has a core 21 and clads 22 and 23. The clads 22 and 23 cover at least a portion of the core 21. Specifically, the optical waveguide 20 has an upper clad 22 and a lower clad 23. The upper clad 22 covers the upper surface of the core 21. The lower clad 23 covers the lower surface of the core 21. That is, the optical waveguide 20 is formed by laminating the lower clad 23, the core 21, and the upper clad 22 on the substrate 10 in this order.

[0019] The mirror 25 reflects an optical signal output from the photoelectric conversion element 40 (described later) or the core 21. As shown in FIG. 1 , the mirror 25 has a mirror surface facing the other end of the optical waveguide 20. The mirror 25 is formed by vapor-depositing a mirror surface on one surface of a prismatic base made of silicon, glass, resin, metal, or the like. The mirror surface may be made of aluminum, silver, or gold. The mirror surface is inclined with respect to the surface of the substrate 10.

[0020] The mirror 25 reflects an optical signal incident from the thickness direction of the substrate 10 (here, the Z-axis direction) and introduces it into the core 21. Specifically, the mirror 25 reflects an optical signal output from the photoelectric conversion element 40 in the negative direction of the Z-axis and introduces it into the core 21 of the optical waveguide 20. The mirror 25 also reflects an optical signal incident from the core 21 in the thickness direction of the substrate 10. Specifically, the mirror 25 reflects an optical signal irradiated from the core 21 of the optical waveguide 20 in the positive direction of the Z-axis and inputs it to the photoelectric conversion element 40.

[0021] As another means for reflecting the optical signal irradiated from the core 21 of the optical waveguide 20 in the positive direction of the Z axis and inputting it to the photoelectric conversion element 40, a configuration may be adopted in which, without disposing a mirror 25, the optical waveguide 20 is cut into a mirror shape (inclined shape), and the cut surface is in contact with an air layer, so that reflection occurs due to the difference in refractive index between the optical waveguide 20 and the air (not shown).

[0022] The support member 30 supports the photoelectric conversion element 40, which will be described later. The support member 30 is formed from the same material as the optical waveguide 20. The support member 30 has, for example, a rectangular shape in a plan view. The support member 30 is located between the substrate 10 and the photoelectric conversion element 40, and may be located in a region of the mounting surface 101 of the substrate 10 where the first wiring 11 is located. The support member 30 may be located in a region of the mounting surface 101 of the substrate 10 where the first wiring 11 is not located.

[0023] The support member 30 has second wiring 34. The second wiring 34 electrically connects the connection portion 35 and the first wiring 11. The connection portion 35 electrically connects the second wiring 34 and vias 46 of the photoelectric conversion elements 40, which will be described later. Details of the support member 30 will be described later. The shape of the support member 30 is not limited to a rectangular shape in a plan view. The support member 30 may be formed, for example, so as to face the entire area in which the vias 46 of the photoelectric conversion elements 40 are formed. As another example, the support member 30 may be formed so as to face the area surrounding the vias 46, rather than facing the area in which the vias 46 of the photoelectric conversion elements 40 are formed.

[0024] The photoelectric conversion element 40 is an element including a photoelectric conversion circuit. For example, the photoelectric conversion element 40 converts an optical signal transmitted through the optical waveguide 20 into an electrical signal. The photoelectric conversion element 40 also converts an electrical signal transmitted through the first wiring 11 into an optical signal. The photoelectric conversion element 40 is located on the optical waveguide 20 and the support member 30. The photoelectric conversion element 40 includes an optical semiconductor element 41, a first optical waveguide 42, a second optical waveguide 43, a driver IC 44, electrical wiring 45, and a plurality of vias 46.

[0025] The optical semiconductor element 41 is, for example, a light emitting element and is disposed on one end side of the first optical waveguide 42 .

[0026] The first optical waveguide 42 is located inside the photoelectric conversion element 40 and extends in a direction parallel to the mounting surface 101 of the substrate 10 (here, the X-axis direction). The other end of the first optical waveguide 42 is optically connected to one end of the second optical waveguide 43 via a grating coupler (not shown). The second optical waveguide 43 is located inside the photoelectric conversion element 40 and extends in a direction perpendicular to or oblique to the mounting surface 101 of the substrate 10 (here, the Z-axis direction). The other end of the second optical waveguide 43 is located on the main surface of the photoelectric conversion element 40 that faces the mounting surface 101 of the substrate 10. The second optical waveguide 43 is an example of an output interface from which an optical signal is output.

[0027] The driver IC 44 is connected to the optical semiconductor element 41 and the via 46 via electrical wiring 45. The driver IC 44 drives the optical semiconductor element 41 based on an electrical signal input from the via 46. The electrical wiring 45 is located inside the photoelectric conversion element 40 and extends in a direction parallel to the mounting surface 101 of the substrate 10 (here, the X-axis direction). One end of the electrical wiring 45 is electrically connected to the optical semiconductor element 41, and the other end of the electrical wiring 45 is connected to the via 46. The via 46 is an example of an electrode electrically connected to the first wiring 11.

[0028] In the photoelectric conversion module 1 configured as described above, an electrical signal is input from an external electrical interface (not shown) through the first wiring 11, the second wiring 34, and the connection portion 35 to the via 46, and then through the electrical wiring 45 to the driver IC 44. The driver IC 44 drives the optical semiconductor element 41 serving as a light-emitting element based on this electrical signal. The optical signal emitted from the optical semiconductor element 41 serving as a light-emitting element passes through the first optical waveguide 42, is diffracted by a grating coupler (not shown), and its optical path is changed, and then the optical signal is output to the outside of the photoelectric conversion element 40 through the second optical waveguide 43 serving as an output interface. The optical path of the optical signal is then changed by the mirror surface of the mirror 25, and the optical signal is output to the outside through the optical waveguide 20.

[0029] As described above, the optoelectronic conversion module 1 according to the first embodiment includes a support member 30 that supports the optical semiconductor element 41. The support member 30 may be made of the same material as the optical waveguide 20. Specifically, as shown in FIG. 2 , the support member 30 has a core layer 31 and clad layers 32 and 33. The core layer 31 may be made of the same material as the core 21. The clad layer 32 may be made of the same material as the upper clad 22. The clad layer 33 may be made of the same material as the lower clad 23. The clad layers 32 and 33 cover at least a portion of the core layer 31. Specifically, the support member 30 has an upper clad layer 32 and a lower clad layer 33. The upper clad layer 32 covers the upper surface of the core layer 31. The lower clad layer 33 covers the lower surface of the core layer 31. That is, the support member 30 is formed by stacking the lower clad layer 33, the core layer 31, and the upper clad layer 32 in this order on the substrate 10. The support member 30 may be formed by the same process as the process for forming the optical waveguide 20. This makes it easier to match the heights of the support member 30 and the optical waveguide 20, and makes it possible to reduce the gap between the optical waveguide 20 and the photoelectric conversion element 40.

[0030] By supporting the optical semiconductor element 41, the optical waveguide 20 and the photoelectric conversion element 40 are less likely to come into direct contact with each other, making it less likely that the optical waveguide 20 will be damaged. Furthermore, by reducing the gap between the optical waveguide 20 and the photoelectric conversion element 40, it is possible to reduce the optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40. Furthermore, by forming the support member 30 from the same material as the optical waveguide 20, the thermal expansion coefficients of the support member 30 and the optical waveguide 20 tend to be the same.

[0031] The height position of the support member 30 may be the same as the height position of the optical waveguide 20. With this configuration, a gap equal to the height of the connection portion 35 can be secured between the optical waveguide 20 and the photoelectric conversion element 40, making the optical waveguide 20 less susceptible to damage. As a result, optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40 can be reduced.

[0032] Furthermore, the height position of the support member 30 may be higher than the height position of the optical waveguide 20. With this configuration, the gap between the optical waveguide 20 and the photoelectric conversion element 40 can be further widened, making the optical waveguide 20 less susceptible to damage.

[0033] <Method for Manufacturing Photoelectric Conversion Module> Next, an example of a method for manufacturing the photoelectric conversion module 1 according to the first embodiment will be described with reference to FIG.

[0034] First, the mirror 25 is placed on the mounting surface 101 of the substrate 10 .

[0035] Next, the lower clad 23 of the optical waveguide 20 and the lower clad layer 33 of the support member 30 are formed on the mounting surface 101 of the substrate 10. Specifically, the lower clad 23 is formed at a position where the mirror surface of the mirror 25 arranged on the mounting surface 101 of the substrate 10 comes into contact with the end of the lower clad 23 of the optical waveguide 20. The lower clad 23 and the lower clad layer 33 are formed, for example, by applying a resin having a predetermined refractive index to a predetermined film thickness on the mounting surface 101 of the substrate 10 and curing the resin with heat, light, or the like.

[0036] Next, the core 21 is formed on the surface of the lower clad 23 of the optical waveguide 20. Similarly, the core layer 31 is formed on the surface of the lower clad layer 33 of the support member 30. The core 21 and the core layer 31 are formed, for example, by applying a resin having a predetermined refractive index to a predetermined film thickness on the surfaces of the lower clad 23 and the lower clad layer 33, curing the resin with heat or light, and then patterning the cured resin into a predetermined planar shape by a known method.

[0037] Next, the upper cladding 22 is formed on the surface of the core 21 of the optical waveguide 20. Similarly, the upper cladding layer 32 is formed on the surface of the core layer 31 of the support member 30. The upper cladding 22 and the upper cladding layer 32 are formed, for example, by applying a resin having a predetermined refractive index to a predetermined film thickness on the surfaces of the core 21 and the core layer 31, and then curing the resin with heat, light, or the like.

[0038] Next, through holes are formed in the support member 30 using a laser processing machine, and the formed through holes are filled with a conductive paste to form the second wiring 34 .

[0039] Next, a conductive paste or the like is placed on the second wiring 34 to form the connection portion 35. Finally, the photoelectric conversion element 40 is placed on the optical waveguide 20 and the support member 30. Specifically, the photoelectric conversion element 40 is placed at a position where the connection portion 35 and the via 46 of the photoelectric conversion element 40 are connected.

[0040] In this manner, the photoelectric conversion module 1 according to the first embodiment is fabricated.

[0041] As described above, the photoelectric conversion module 1 according to this embodiment includes the support member 30 that supports the optical semiconductor element 41, as compared with the photoelectric conversion module 1 according to the first embodiment. This creates a gap between the optical waveguide 20 and the photoelectric conversion element 40, making the optical waveguide 20 less susceptible to damage, thereby reducing optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40.

[0042] 2 illustrates one each of the optical semiconductor element 41, the first optical waveguide 42, the second optical waveguide 43, and the electrical wiring 45, the photoelectric conversion element 40 may include a plurality of each of the optical semiconductor element 41, the first optical waveguide 42, the second optical waveguide 43, and the electrical wiring 45. The plurality of optical semiconductor elements 41, the plurality of first optical waveguides 42, the plurality of second optical waveguides 43, and the plurality of electrical wirings 45 may be arranged, for example, along a direction (here, the Y-axis direction) perpendicular to the extension direction of the optical waveguide 20 (here, the X-axis direction).

[0043] The photoelectric conversion element 40 may further include an optical modulator (not shown) that modulates an optical signal emitted from the optical semiconductor element 41 as a light emitting element.

[0044] Although the example in which the support member 30 is composed of the core layer 31 and the clad layers 32 and 33 has been described here, the material of the support member 30 is not limited to this. For example, the support member 30 may be composed of only the clad or only the core. Furthermore, the support member 30 may be composed of a material that is not included in the optical waveguide 20.

[0045] Furthermore, the support member 30 does not necessarily have to have the second wiring 34. In other words, the support member 30 and the wiring electrically connecting the first wiring 11 and the photoelectric conversion element 40 may be located at different positions on the substrate 10. This point will be described later in the fourth embodiment.

[0046] Second Embodiment Fig. 3 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module 1 according to a second embodiment. As shown in Fig. 3, the support member 30 and the optical waveguide 20 may be connected on the mounting surface 101 of the substrate 10.

[0047] With this configuration, the heights of the optical waveguide 20 and the support member 30 are more likely to be aligned compared to when the optical waveguide 20 and the support member 30 are formed on the mounting surface 101 of the substrate 10. This improves the flatness of the photoelectric conversion element 40 disposed on the optical waveguide 20 and the support member 30. Furthermore, since the mirror 25 can be surrounded by the optical waveguide 20 and the support member 30, the mirror 25 is stabilized and less likely to shift.

[0048] Third Embodiment Fig. 4 is a schematic plan view showing the configuration of a photoelectric conversion module 1 according to a third embodiment. As shown in Fig. 4, the photoelectric conversion module 1 may include a plurality of photoelectric conversion elements 40. The plurality of photoelectric conversion elements 40 may be arranged in a row, for example, along a direction (here, the Y-axis direction) perpendicular to the extension direction of the optical waveguide 20. In this way, by mounting a plurality of photoelectric conversion elements 40 on the substrate 10, the transmission band can be expanded.

[0049] In this case, one support member 30 may support multiple photoelectric conversion elements 40. In other words, one support member 30 may be formed so as to face the region where the vias 46 of the multiple photoelectric conversion elements 40 are formed or the region surrounding the vias 46. With this configuration, the flatness of the multiple photoelectric conversion elements 40 can be improved compared to when the photoelectric conversion elements 40 are each supported by a separate support member 30.

[0050] Furthermore, the support member 30 may be sized to protrude from the photoelectric conversion element 40 in a plan view.

[0051] (Fourth Embodiment) FIG. 5 is a schematic cross-sectional view showing the configuration of a photovoltaic conversion module 1 according to a fourth embodiment. FIG. 6 is a schematic plan view showing the positional relationship between a support member 30 and a via 46 according to the fourth embodiment. As shown in FIGS. 5 and 6 , the support member 30 may be formed, for example, in a frame shape (rectangular frame shape). The support member 30 may be formed, for example, so as to surround the via 46 in a planar perspective. The support member 30 may be formed, for example, in a rectangular shape with its long side in the Y-axis direction in a planar perspective, and may be formed adjacent to the via 46 in the X-axis direction. In other words, the support member 30 and the via 46 may be positioned so as not to overlap in a planar perspective.

[0052] In such a photovoltaic conversion module 1 , for example, when the via 46 and the first wiring 11 are connected using a solder ball 50 or the like, there is no need to form a through hole in the support member 30 for arranging the solder ball 50 .

[0053] Similarly, in this case, the photoelectric conversion element 40 can be supported by the support member 30, making the optical waveguide 20 less susceptible to damage and reducing optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40. Furthermore, compared to when a through hole is formed in the support member 30, the photoelectric conversion module 1 can be manufactured more easily.

[0054] Fifth Embodiment FIG. 7 is a schematic cross-sectional view showing the configuration of a photoelectric conversion module 1 according to a fifth embodiment. In the first embodiment, an example was shown in which the optical semiconductor element 41 was a light-emitting element, but the photoelectric conversion element 40 may also be a light-receiving element. As shown in FIG. 7 , the optical semiconductor element 41 as a light-receiving element is located on one end side of a second optical waveguide 43. The second optical waveguide 43 is located inside the photoelectric conversion element 40 and extends perpendicularly (here, in the Z-axis direction) or obliquely relative to the mounting surface 101 of the substrate 10. The other end of the second optical waveguide 43 is located on the surface of the main surface of the photoelectric conversion element 40 facing the mounting surface 101 of the substrate 10. The second optical waveguide 43 is an example of an input interface to which an optical signal is input.

[0055] In the optoelectronic conversion module 1 configured as described above, an optical signal input from the outside passes through the optical waveguide 20, has its optical path converted by the mirror surface of the mirror 25, and is input to the second optical waveguide 43 serving as an input interface. The optical semiconductor element 41 serving as a light-receiving element receives the optical signal that has passed through the second optical waveguide 43 serving as an input interface. The optical semiconductor element 41 serving as a light-receiving element performs photoelectric conversion of the optical signal to generate an electrical signal. The electrical signal passes through the electrical wiring 45 and is output from the via 46 to outside the optical semiconductor element 41. The electrical signal then passes through the connection portion 35, the second wiring 34, and the first wiring 11 and is output to the outside.

[0056] In this case as well, the photoelectric conversion element 40 can be supported by the support member 30, making the optical waveguide 20 less susceptible to damage and reducing the optical coupling loss between the optical waveguide 20 and the photoelectric conversion element 40.

[0057] Sixth Embodiment Fig. 8 is a schematic plan view showing the configuration of a photoelectric conversion module 1 according to a sixth embodiment. As shown in Fig. 8, the support member 30 may be disposed in a position that supports multiple sides of the photoelectric conversion element 40. Specifically, the support member 30 may have a concave shape in a plan view, for example. The support member 30 may be disposed in a position that supports three of the four sides of the photoelectric conversion element 40 in a plan view, except for the side that overlaps with the optical waveguide 20. In this case, the via 46 of the photoelectric conversion element 40 may be formed in a position that faces the support member 30.

[0058] By arranging the support member 30 in such a position that it supports multiple sides of the photoelectric conversion element 40, the photoelectric conversion element 40 can be supported more stably.

[0059] In the example of Figure 8, an example is shown in which one support member 30 supports multiple sides of the photoelectric conversion element 40, but multiple support members 30 may support multiple sides of the photoelectric conversion element 40.

[0060] The present technology may also be configured as follows. (1) A photoelectric conversion module (for example, a photoelectric conversion module 1) includes a substrate (for example, a substrate 10), an optical waveguide (for example, an optical waveguide 20), one or more photoelectric conversion elements (for example, a photoelectric conversion element 40), and a support member (for example, a support member 30). The substrate has a conductive first wiring (for example, a first wiring 11). The optical waveguide is located on the substrate and transmits an optical signal. The photoelectric conversion element has an optical interface (for example, a second optical waveguide 43) and an electrode (for example, a via 46). The optical interface is located on the optical waveguide and inputs or outputs an optical signal to or from the optical waveguide. The electrode is electrically connected to the first wiring. The support member is formed of the same material as the optical waveguide and is located between the photoelectric conversion element and the substrate. (2) In the photoelectric conversion module described in (1) above, the support member may be located in a region of the substrate where the first wiring is formed. (3) In the photoelectric conversion module described in (1) or (2) above, the support member may be made of the same material as the optical waveguide. (4) In the photoelectric conversion module described in any one of (1) to (3) above, the height position of the support member may be the same as the height position of the optical waveguide. (5) In the photoelectric conversion module described in any one of (1) to (3) above, the height position of the support member may be higher than the height position of the optical waveguide. (6) The photoelectric conversion module described in any one of (1) to (5) above may include a second wiring (e.g., second wiring 34) located on the support member and electrically connected to the first wiring, and a connection portion (e.g., connection portion 35) located between the support member and the substrate and electrically connecting the second wiring to an electrode. (7) In the photoelectric conversion module according to any one of (1) to (6) above, the support member and the optical waveguide may be connected on the substrate. (8) The photoelectric conversion module according to any one of (1) to (7) above may include a plurality of photoelectric conversion elements, and the support member may support the plurality of photoelectric conversion elements.

[0061] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0062] REFERENCE SIGNS LIST 1 Photoelectric conversion module 10 Substrate 20 Optical waveguide 30 Support member 34 Second wiring 35 Connection portion 40 Photoelectric conversion element 41 Optical semiconductor element 42 First optical waveguide 43 Second optical waveguide 45 Electrical wiring 46 Via

Claims

1. A photoelectric conversion module comprising: a substrate having a conductive first wiring; an optical waveguide located on the substrate and transmitting an optical signal; one or more photoelectric conversion elements located on the optical waveguide and having an optical interface for inputting or outputting an optical signal to the optical waveguide and an electrode electrically connected to the first wiring; and a support member formed of the same material as the optical waveguide and located between the photoelectric conversion element and the substrate.

2. The photoelectric conversion module according to claim 1, wherein the support member is located in a region of the substrate where the first wiring is formed.

3. The photoelectric conversion module according to claim 1 or 2, wherein the support member is made of the same material as the optical waveguide.

4. The photoelectric conversion module according to any one of claims 1 to 3, wherein the height position of the support member is the same as the height position of the optical waveguide.

5. The photoelectric conversion module according to any one of claims 1 to 3, wherein the height position of the support member is higher than the height position of the optical waveguide.

6. A photovoltaic conversion module according to any one of claims 1 to 5, comprising: a second wiring located on the support member and electrically connected to the first wiring; and a connection portion located between the support member and the substrate and electrically connecting the second wiring and the electrode.

7. The photoelectric conversion module according to any one of claims 1 to 6, wherein the support member and the optical waveguide are connected on the substrate.

8. The photoelectric conversion module according to any one of claims 1 to 7, comprising a plurality of the photoelectric conversion elements, and the support member supports the plurality of the photoelectric conversion elements.

Images