Portable electronic device with heat dissipation unit, and heat dissipation unit thereof

Abstract

A heat dissipation unit including a multi-level enclosure having a vapor chamber level and a liquid cooling level. The liquid cooling level includes a liquid chamber having at least one inlet port and at least one outlet port. The at least one inlet port has an inlet valve openable when the at least one inlet port is connected to an external liquid inflow for liquid to flow into the liquid chamber. The at least one outlet port has an outlet valve openable when the at least one outlet port is connected to the external liquid outflow for the liquid to flow out of the liquid chamber. The inlet valve and the outlet valve being closeable to hold the liquid in the liquid chamber. A sealed chamber of the vapor chamber level and the liquid chamber of the liquid cooling level being capable of thermal transfer therebetween.

Description

PORTABLE ELECTRONIC DEVICE WITH HEAT DISSIPATION UNIT, AND HEAT DISSIPATION UNIT THEREOFTechnical Field

[0001] Embodiments generally relate to a portable electronic device having a heat dissipation unit. Embodiments generally also relate to the heat dissipation unit for the portable electronic device.Background

[0002] Heat dissipation is one of tire main issues affecting the performance of portable electronic devices, such as laptop, notebook, tablet, or smartphone. Currently, internal air- cooling measures, such as active generation of air flow and / or passive air vent, have been implemented in portable electronic device to help cool down the portable electronic device. However, performance of the portable electronic device is still limited by the air-cooling measures. With increasing demand for high power processing by the user, there is a need to enhance the cooling for portable electronic devices.Summary

[0003] According to various embodiments, there is provided a heat dissipation unit including a multi-level enclosure. The multi-level enclosure including a vapor chamber level and a liquid cooling level. The vapor chamber level includes a sealed chamber, a wick structure disposed in the sealed chamber, and a working fluid sealed in the sealed chamber. The liquid cooling level includes a liquid chamber having at least one inlet port and at least one outlet port. The at least one inlet port has an inlet valve, the at least one inlet port being connectable to an external liquid inflow and the inlet valve being openable when the at least one inlet port is connected to the external liquid inflow for liquid to flow into the liquid chamber. The at least one outlet port has an outlet valve, the at least one outlet port being connectable to an external liquid outflow and the outlet valve being openable when the at least one outlet port is connected to the external liquid outflow for the liquid to flow out of the liquid chamber. The inlet valve is closeable, when the at least one inlet port is disconnected, and the outlet valve is closeable, when the at least one outlet port is disconnected, in a manner so as to hold the liquid in theliquid chamber of the liquid cooling level. The vapor chamber level and the liquid cooling level are arranged for thermal transfer between the sealed chamber of the vapor chamber level and the liquid chamber of the liquid cooling level.

[0004] According to various embodiments, there is provided a portable electronic device including a heat dissipation arrangement. The heat dissipation arrangement including the heat dissipation unit as described herein, and at least one fan unit associated with the heat dissipation unit. The vapor chamber level of the multi-level enclosure of the heat dissipation unit includes a main portion and at least one auxiliary portion. The sealed chamber of the vapor chamber level extends through-out the main portion and the at least one auxiliary portion. The liquid cooling level extends within a boundary of the main portion of the vapor chamber level. The at least one fan unit is aligned alongside the at least one auxiliary portion of the vapor chamber level to generate an air flow across the at least one auxiliary portion of the vapor chamber level.Brief description of the drawings

[0005] In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various embodiments are described with reference to the following drawings, in which:FIG. 1 A shows a schematic cross-sectional view of a heat dissipation unit according to various embodiments;FIG. IB shows a schematic plan view of the heat dissipation unit of FIG. 1 A according to various embodiments;FIG. 2A shows a heat dissipation unit according to various embodiments;FIG. 2B shows a A-A sectional view of the heat dissipation unit of FIG. 2A according to various embodiments;FIG. 2C shows a B-B sectional view of the heat dissipation unit of FIG. 2A according to various embodiments;FIG. 3 shows an interior of a portable electronic device according to various embodiments; andFIG. 4 shows a heat dissipation unit according to various embodiments.Detailed description

[0006] Embodiments described below in the context of the apparatus are analogously valid for the respective methods, and vice versa. Furthermore, it will be understood that the embodiments described below may be combined, for example, a part of one embodiment may be combined with a part of another embodiment.

[0007] It should be understood that the terms “on”, “over”, “top”, “bottom”, “down”, “side”, “back”, “left”, “right”, “front”, “lateral”, “side”, “up”, “down” etc., when used in the following description are used for convenience and to aid understanding of relative positions or directions, and not intended to limit the orientation of any device, or structure or any part of any device or structure. In addition, the singular terms “a”, “an”, and “the” include plural references unless context clearly indicates otherwise. Similarly, the word “or” is intended to include “and” unless the context clearly indicates otherwise.

[0008] Various embodiments generally relate to a portable electronic device (PED) having a heat dissipation unit. Various embodiments also relate to a heat dissipation arrangement having the heat dissipation unit and / or the heat dissipation unit itself. According to various embodiments, the PED may include a laptop, a notebook, a tablet, or a smartphone. According to various embodiments, the heat dissipation unit may be configured to dissipate heat generated from one or more hcat-gcncrating components of the PED. The heat-generating component of the PED may include, but not limited to, the processing units (such as the central processing unit, CPU, or the graphics processing unit, GPU) and / or the drives (such as the solid state drive, SSD, or the hard disk drives, HDD).

[0009] According to various embodiments, the heat dissipation unit may be configured to enhance cooling for the PED so as to increase the performance of the PED. According to various embodiments, the heat dissipation unit may be configured to provide more than one cooling types or more than one mode of cooling. For example, in the various embodiments, the head dissipation unit may be configured to provide cooling to the PED via air cooling and / or liquid cooling. Accordingly, the heat dissipation unit may be operated to provide cooling mainly via air cooling, or mainly via liquid cooling, or via a combination of air cooling and liquid cooling. Accordingly, the heat dissipation unit may be configured to be operated to provide cooling via a first mode of cooling (or first cooling type), c.g. air cooling, when the PED is required to operate with a lower performance. Further, the heat dissipation unit may be configured to be operated to provide cooling via a second mode of cooling (or second cooling type), e.g. liquid cooling, when the PED is required to operate with a higher performance. In addition, the heat dissipation unit may also be configured to be operated to provide cooling viaa combination of more than one mode of cooling (or more than one cooling type), e.g. the combination of air cooling and liquid cooling, when the PED is required to operate with the higher performance. Hence, the heat dissipation unit may be configured to be switchable or interchangeable between different modes of cooling or different combination of the modes of cooling depending on the performance of the PED required by the user. Thus, the heat dissipation unit may be user selectable or user operable to change the mode of cooling or the combination of the modes of cooling. For instance, when the demand for the performance of the PED is low, the user may choose or select or configure the heat dissipation unit to operate in the first mode of cooling, e.g. air cooling. On the other hand, when the demand for the performance of the PED is high, the user may choose or select or configure the heat dissipation unit to operate in the second mode of cooling, e.g. liquid cooling, or to operate with a combination of two modes of cooling, e.g. air cooling and liquid cooling. The heat dissipation unit may also be automatically switchable or changeable between the different mode of cooling of the different combination of modes of cooling in response to a detection of the performance of the PED required.

[0010] According to various embodiments, the heat dissipation unit may be configured to provide internal ah' cooling to the PED. Further, the heat dissipation unit may be configured to provide liquid cooling to the PED via connecting the heat dissipation to an external liquid cooling module. Accordingly, the user may configure the heat dissipation unit to provide liquid cooling by connecting the heat dissipation unit to the external liquid cooling module. When the external liquid cooling module is connected to the heat dissipation unit, the heat dissipation unit may concurrently provide the internal air cooling and the liquid cooling to the PED so as to maximize the cooling provided to the PED for optimal performance.

[0011] FIG. 1A shows a schematic cross-sectional view of a heat dissipation unit 110 according to various embodiments. FIG. IB shows a schematic plan view of the heat dissipation unit 1 10 of FIG. 1 A according to various embodiments. According to various embodiments, a PED (e.g. see portable electronic device 300 of FIG. 3) may include the heat dissipation unit 1 10 or the heat dissipation unit 1 10 may be part of a heat dissipation arrangement of the PED. The heat dissipation unit 110 may be configured to provide more than one mode of cooling to the PED.

[0012] According to various embodiments, the heat dissipation unit 110 may include a multi-level enclosure 112. The multi-level enclosure 112 may include an enclosure or a casing that is partitioned or divided into multiple levels. Each level may be a horizontal section of the multi-level enclosure 112. Adjacent levels may be separated or partitioned or divided by aninter-level separation 116 of the multi-level enclosure 112. Accordingly, the multiple levels may be arranged one over another along a height axis 114 of the multi-level enclosure 112. Further, each level may include a floor and a ceiling, whereby the floor and the ceiling of each level may be spaced apart along the height axis 114 of the multi-level enclosure 112. According to some embodiments, the multi-level enclosure 112 may be integrally formed whereby adjacent levels may share a common partition serving as the inter-level separation 116 between the adjacent levels. According to some embodiments, the multi-level enclosure 112 may be formed by stacking or assembling individual level modules one by one. For example, a second level (or a subsequent level) module may be stacked or assembled on top of a first level (or a previous level) module. When each level module is a complete structure with its own floor, ceiling and side walls, stacking or assembling the individual level module on top of one another may include placing or joining the floor of the subsequent level module on the ceiling of the previous level module such that the floor of the subsequent level module and the ceiling of the previous level module together serve as the inter-level separation 1 16 between the adjacent levels. When each level module is a partial structure having only the floor and side walls, stacking or assembling the individual level module on top of one another may include placing or joining the floor of the subsequent level module to the side walls of the previous level module such that the floor of the subsequent level module may serve as the inter-level separation 116 between the adjacent levels. Similarly, when each level module is a partial structure having only the ceiling and side walls, stacking or assembling the individual level module on top of one another may include placing or joining the side walls of the subsequent level module to the ceiling of the previous level module such that the ceiling of the previous level module may serve as the inter-level separation 116 between the adjacent levels.

[0013] According to various embodiments, the multi-level enclosure 112 of the heat dissipation unit 110 may include a vapor chamber level 120 and a liquid cooling level 130 along the height axis 1 14 of the multi-level enclosure 1 12. The vapor chamber level 120 and the liquid cooling level 130 may be different levels of the multi-level enclosure 112. Accordingly, the vapor chamber level 120 and the liquid cooling level 130 may be different horizontal sections of the multi-level enclosure 112 along the height axis 114 of the multi-level enclosure 112. According to various embodiments, the vapor chamber level 120 of the heat dissipation unit 110 may be configured to transfer or spread the heat produced by a heatgenerating component of the PED away (c.g. from one location of the vapor chamber level 120 to another location of the vapor chamber level 120) so as to subsequently dissipate the heat via air cooling. Accordingly, the vapor chamber level 120 of the heat dissipation unit 110 mayprovide cooling to the PED via air cooling. According to various embodiments, the liquid cooling level 130 of the heat dissipation unit 110 may be configured to utilize liquid flow for carrying away heat to provide liquid cooling to the PED. Therefore, the heat dissipation unit 110 having the vapor chamber level 120 and the Equid cooling level 130 in a single multi-level enclosure 112 may be capable of heat dissipation via air cooling (i.e. a first mode of cooling) and / or liquid cooling (i.e. a second mode of cooling) to cool the PED. According to various embodiments, the heat dissipation unit 110 may be operable to choose or select between air cooling (i.e. a first mode of cooling) and / or liquid cooling (i.e. a second mode of cooling) to cool the PED.

[0014] According to various embodiments, the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 may be configured to function as a vapor chamber or a planar heat pipe or a heat spreader. Hence, the vapor chamber level 120 may be configured to transfer heat from one location of the vapor chamber level 120 to another location of the vapor chamber level 120 based on the working principle of cyclic evaporation and condensation of a working fluid (or two-phase flow principle) in a closed environment.

[0015] According to various embodiments, the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 may include a sealed chamber 122. As an example, the scaled chamber 122 may be a fully closed platc-likc chamber. According to various embodiments, the sealed chamber 122 may be defined by two parallel opposing planar surfaces 124 (e.g. a floor surface and a ceiling surface) and side-wall surfaces 126. Accordingly, the structures of the vapor chamber level 120 of the multi-level enclosure 112 may include vertical extending formations 126a and horizontal extending formations 124a to surround and / or enclose the sealed chamber 122, wherein inner facing surfaces of the vertical extending formations 126a may provide the side-wall surfaces 126 and inner facing surfaces of the horizontal extending formations 124a may provide the two parallel opposing planar surfaces 124 for defining the sealed chamber 122. The sealed chamber may be fully closed or airtight or leak-proof.

[0016] According to various embodiments, the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 may include may include a wick structure 128. The wick structure 128 may be disposed in the scaled chamber 122. The wick structure may include, but not limited to, sintered metal-containing powder, one or more layers of a metalcontaining mesh, one or more layers of a metal-containing foam, a metal-containing fibre structure, or a combination thereof. According to various embodiments, the wick structure 128 may be lined along, one or more or a combination of, the two parallel opposing planar surfaces124 (e.g. a floor surface and a ceiling surface) and side-wall surfaces 126 defining the sealed chamber 122.

[0017] According to various embodiments, the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 may include the working fluid. The working fluid may be sealed in the sealed chamber 122. The working fluid may include, but not limited to, water or ethanol or methanol or any suitable fluid to undergo cyclic evaporation and condensation within the sealed chamber 122. In the various embodiments, the working fluid in the sealed chamber 122 may be in the liquid state and may saturate the wick structure 128. When the vapor chamber level 120 of the heat dissipation unit 110 is exposed to a heat, the working fluid in the wick structure 128 may evaporate into vaporized working fluid (i.e. gaseous state) and circulate via convection to move freely through the sealed chamber 122. Accordingly, heat may be distributed or spread or transferred from one location of the sealed chamber 122 to another location of the sealed chamber 122. When the vaporized working fluid reaches cooler regions of the sealed chamber 122, the vaporized working fluid may condense back into liquid and seeps into the wick structure 128. The wick structure 128 may then return the working fluid in the liquid form to the warmer regions via capillary actions. This operation cycles (as represented by the arrows in the sealed chamber 122 of FIG. 1A) may repeat continuously for the vapor chamber level 120 of the heat dissipation unit 110 to transfer or spread the heat produced by the heat-generating component of the PED away so as to generate a cooling effect for cooling the heat-generating component of the PED.

[0018] According to various embodiments, the liquid cooling level 130 of the multi-level enclosure 112 of the heat dissipation unit 110 may include a liquid chamber 132. The liquid chamber 132 may be configured to contain or receive liquid. Accordingly, the liquid cooling level 130 of the multi-level enclosure 112 may include structures to define the liquid chamber 132 such that liquid may be contained or received inside the liquid chamber 132. According to various embodiments, the liquid chamber 132 may have at least one inlet port 134 and at least one outlet port 136. Accordingly, the liquid chamber 132 may have one or two or three or more or a plurality of inlet ports 134 and / or one or two or three or more or a plurality of outlet ports 136. The at least one inlet port 134 may be configured for liquid to enter the liquid chamber 132 and the at least one outlet port 136 may be configured for liquid to exit the liquid chamber 132.

[0019] According to various embodiments, the at least one inlet port 134 (or each inlet port 134) may be connectable to an external liquid inflow. The external liquid inflow may include, but not limited to, a liquid source, a liquid supply, a liquid reservoir, a liquid cooling system, aliquid cooling device, a liquid cooling loop, etc. Accordingly, the at least one inlet port 134 may include a connection element 233 (for example see FIG. 2A) for engagement with external liquid inflow so as to be connected thereto. According to various embodiments, the at least one inlet port 134 (or each inlet port 134) may have an inlet valve 144. The inlet valve 144 may be configured to control the flow of liquid through the at least one inlet port 134 into the liquid chamber 132. According to various embodiments, when the at least one inlet port 134 is connected to the external liquid inflow, the inlet valve 144 of the at least one inlet port 134 may be openable (or controlled to be opened) for the liquid to flow into the liquid chamber 132. According to some embodiments, the inlet valve 144 may include a manual valve whereby the user may manually open the valve after connecting the at least one inlet port 134 to the external liquid inflow. According to some embodiments, the inlet valve 144 may be a check valve or a non-retum valve or a one-way valve allowing liquid to from in only one direction into the liquid chamber 132. Accordingly, after the at least one inlet port 134 is connected to the external liquid inflow, the liquid may flow into the liquid chamber 132 without requiring the user to operate the valve. According to some embodiments, the inlet valve 144 may be an electronic flow control valve that may be controlled to be opened upon detection of the at least one inlet port 134 being connected to the external liquid inflow or remotely controlled by the user to open.

[0020] According to various embodiments, the at least one outlet port 136 (or each outlet port 136) may be connectable to an external liquid outflow. The external hquid outflow may include, but not limited to, a liquid discharge, a hquid reservoir, a liquid cooling system, a liquid cooling device, a liquid cooling loop, etc. Accordingly, the at least one outlet port 136 may include a connection element 235 (for example see FIG. 2 A) for engagement with external liquid outflow so as to be connected thereto. Further, the at least one outlet port 136 (or each outlet port 136) may have an outlet valve 146. The outlet valve 146 may be configured to control the flow of liquid through the at least one outlet port 136 and out of the liquid chamber 132. According to various embodiments, when the at least one outlet port 136 is connected to the external liquid outflow, the outlet valve 146 of the at least one outlet port 136 may be openable (or controlled to be opened) for the liquid to flow out of the liquid chamber 132. According to some embodiments, the outlet valve 146 may include a manual valve whereby the user may manually open the valve after connecting the at least one outlet port 136 to the external liquid outflow. According to some embodiments, the outlet valve 146 may be an electronic flow control valve that may be controlled to be opened upon detection of the at leastone outlet port 136 being connected to the external liquid outflow or remotely controlled by the user to open.

[0021] With the at least one inlet port 134 connected to the external liquid inflow and the at least one outlet port 136 connected to the external liquid outflow, the liquid may flow in and out of the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 110. Accordingly, the liquid through the liquid chamber 132 may carry heat away and out of the heat dissipation unit 110 so as to provide cooling (or result in a cooling effect). Therefore, the flowing of liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 110 may serve as a means for providing liquid cooling to enhance the cooling provided by the heat dissipation unit 110 to the PED.

[0022] According to various embodiments, the inlet valve 144 of the at least one inlet port 134 may be closeable, when the at least one inlet port 134 is disconnected from the external liquid inflow. According to some embodiments, when the inlet valve 144 is the manual valve, the user may manually close the valve after disconnecting the external liquid inflow from the at least one inlet port 134. According to some embodiments, when the inlet valve 144 is the check valve or the non-return valve or the one-way valve allowing liquid to from in only one direction into the liquid chamber 132, the check valve or the non-retum valve or the one-way valve may automatically block or close to stop the liquid from flowing out of the liquid chamber 132 via the at least one inlet port 134 after the external liquid inflow is disconnected from the at least one inlet port 134. According to some embodiments, when the inlet valve 144 is the electronic flow control valve, the inlet valve 144 may be controlled to be closed upon detection of the external liquid inflow being disconnected from the at least one inlet port 134 or be remotely controlled by the user to close. According to various embodiments, the outlet valve 146 of the at least one outlet port 136 may be closeable, when the at least one outlet port 136 is disconnected from the external liquid outflow. According to some embodiments, when the outlet valve 146 is the manual valve, the user may manually close the valve after disconnecting the external liquid outflow from the at least one outlet port 136. According to some embodiments, when the outlet valve 146 is the electronic flow control valve, the outlet valve 146 may be controlled to be closed upon detection of the external liquid outflow being disconnected from the at least one outlet port 136 or be remotely controlled by the user to close. With both the inlet valve 144 of the at least one inlet port 134 and the outlet valve 146 of the at least one outlet port 136 closed after the external liquid inflow is disconnected from the at least one inlet port 134 and the external liquid outflow is disconnected from the at least one outlet port 136, the liquid chamber 132 may hold or retain the liquid in the liquid chamber 132of the liquid cooling level 130 of the heat dissipation unit 110. Accordingly, the liquid chamber 132 of the liquid cooling level 130 may be filled with the liquid and disconnected with the external liquid inflow and external liquid outflow. The liquid chamber 132 being filled with liquid without any liquid flow may serve as a thermal storage tank. The thermal storage tank may reduce the rate of temperature increase of the PED and may also act as a layer for heat insulation.

[0023] According to various embodiments, the vapor chamber level 120 and the liquid cooling level 130 of the of the multi-level enclosure 112 of the heat dissipation unit 110 may be arranged for thermal transfer between the sealed chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130. Accordingly, when providing the heat dissipation unit 110 to dissipate heat generated from one or more heat-generating components of the PED, the heat dissipation unit 110 may be disposed such that the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 may be in thermal contact or thermal communication with the one or more heat-generating components of the PED. As the vapor chamber level 120 and the liquid cooling level 130 of the of the multilevel enclosure 112 of the heat dissipation unit 110 are capable of thermal transfer therebetween, heat generated by the one or more heat-generating components of the PED may be transferred to the vapor chamber level 120 of the multi-level enclosure 112 for dissipation by the vapor chamber level 120, or to the liquid cooling level 130 of the of the multi-level enclosure 112 for dissipation by the liquid cooling level 130, or to both the vapor chamber level 120 and the liquid cooling level 130 of the of the multi-level enclosure 112 for dissipation.

[0024] According to various embodiments, the liquid cooling level 130 may be a level of the multi-level enclosure 112 immediately after the vapor chamber level 120. Accordingly, the vapor chamber level 120 and the liquid cooling level 130 may be adjacent levels along the height axis 114 of the multi-level enclosure 112. In other words, when the multi-level enclosure 1 12 is in the upright orientation, the liquid cooling level 130 may be directly on top or above the vapor chamber level 120. In this configuration or arrangement, thermal transfer between the sealed chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130 may be achieved. Accordingly, when the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 is in thermal contact or thermal communication with the one or more heat-generating components of the PED, the heat from the one or more heat-generating components of the PED may be transferred to the scaled chamber 122 of the vapor chamber level 120 of the heat dissipation unit 110 and / or the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 110 for heat dissipation.

[0025] According to various embodiments, the inter-level separation 116 of the multi-level enclosure 112 may separate the sealed chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130. Accordingly, the sealed chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130 may be separate and independent from each other as the sealed chamber 122 and the liquid chamber 132 may be on different sides of the inter-level separation 116. According to various embodiments, one of the two parallel opposing planar surfaces 124 (e.g. the ceiling surface) of the sealed chamber 122 of the vapor chamber level 120 may be on a first side of the inter-level separation 116 of the multi-level enclosure 112 and a floor surface 138 of the liquid chamber 132 of the liquid cooling level 130 may be on a second side of the inter-level separation 116 of the multi-level enclosure 112. The first side and the second side of the inter-level separation 116 of the multi-level enclosure 112 may be opposite sides of the inter-level separation 116 of the multi-level enclosure 112. Accordingly, the one of the two parallel opposing planar surfaces 124 (e.g. the ceiling surface) of the sealed chamber 122 of the vapor chamber level 120 and the floor surface 138 of the liquid chamber 132 of the liquid cooling level 130 may be opposite sides of the inter-level separation 116 of the multi-level enclosure 112.

[0026] According to various embodiments, the inter-level separation 116 may be capable of thermal transfer thcrc-across between the scaled chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130. Accordingly, the inter-level separation 116 between the sealed chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130 may serve as a thermal interface for transferring of heat between the sealed chamber 122 of the vapor chamber level 120 and the liquid chamber 132 of the liquid cooling level 130. Hence, heat may be transferred from the one of the two parallel opposing planar surfaces 124 (e.g. the ceiling surface) of the sealed chamber 122 of the vapor chamber level 120, through the inter-level separation 116, and to the floor surface 138 of the liquid chamber 132 of the liquid cooling level 130. For example, when the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 is in thermal contact or thermal communication with the one or more heat-generating components of the PED, the heat from the one or more heat-generating components of the PED may be transferred to the scaled chamber 122 of the vapor chamber level 120, which may then be transferred to the one of the two parallel opposing planar surfaces 124 (e.g. the ceiling surface) of the sealed chamber 122 of the vapor chamber level 120, through the inter-level separation 116, and to the floor surface 138 of the liquid chamber 132 of the liquid cooling level 130, such that the heat may be eventually transferred to the liquid chamber 132 of the liquid cooling level 130.

[0027] Referring to FIG. IB, interior of the liquid cooling level 130 is illustrated with dashed lines to show the liquid chamber 132, the at least one inlet port 134, the inlet valve 144, the at least one outlet port 136, and the outlet valve 146. As shown, according to various embodiments, the at least one inlet port 134 and the at least one outlet port 136 of the liquid chamber 132 of the liquid cooling level 130 may be disposed at a same lateral side 137 of the liquid chamber 132. The lateral side 137 of the liquid chamber 132 may be a peripheral side of the liquid chamber 132 with respect to the height axis 114 of the multi-level enclosure 112. Accordingly, the at least one inlet port 134 and the at least one outlet port 136 may be along a same side wall surface of the liquid chamber 132. The side wall surface of the liquid chamber 132 may be extending between the floor surface 138 of the liquid chamber 132 of the liquid cooling level 130 and the ceiling surface 139 of the liquid chamber 132 of the liquid cooling level 130. With both the at least one inlet port 134 and the at least one outlet port 136 of the liquid chamber 132 being at the same lateral side 137 of the liquid chamber 132, the liquid flowing through the liquid chamber 132 may flow along a flow path to circulate through the liquid chamber 132 from the at least one inlet port 134 to the at least one outlet port 136 along a plane perpendicular to the height axis 114 of the multi-level enclosure 112 (or to a height of the liquid chamber 132) when the at least one inlet port 134 is connected to the external liquid inflow and the at least one outlet port 136 is connected to the external liquid outflow. Accordingly, the flow path may start from the at least one inlet port 134, extend along the plane perpendicular to the height axis 114 of the multi-level enclosure 112 to go through the liquid chamber 132 and turn towards the at least one outlet port 136 so as to terminate at the at least one outlet port 136. Thus, the flow of the liquid through the liquid chamber 132 may be in directions substantially perpendicular to the height of the liquid chamber 132. According to various embodiments, the flow path may be a curve path from the at least one inlet port 134 to the at least one outlet port 136 along the plane perpendicular to the height axis 114 of the multilevel enclosure 1 12.

[0028] According to various embodiments, a hole-axis (or centerline) of the at least one inlet port 134 may be substantially perpendicular to the height of the liquid chamber 132, and a hole-axis (or centerline) of the at least one outlet port 136 may be substantially perpendicular' to the height of the liquid chamber 132. Accordingly, the hole-axis of the at least one inlet port 134 and the hole-axis of the at least one outlet port 136 may lie in the plane perpendicular' to the height axis 114 of the multi-level enclosure 112. In this configuration, the flow of liquid into the liquid chamber 132 and the flow of liquid out of the liquid chamber 132 may be substantially perpendicular to the height of the liquid chamber 132.

[0029] According to various embodiments, the liquid cooling level 130 may include a flow guide arrangement associated with the liquid chamber 132 to define the flow path along the plane perpendicular to the height axis 114 of the multi-level enclosure 112 for circulating the liquid through the liquid chamber 132. The flow guide arrangement may be configured to direct the flow of the liquid to follow a desired flow path through the liquid chamber 132 so as to circulate the liquid through different locations of the liquid chamber 132. According to various embodiments, the flow guide arrangement may be configured to define the flow path to pass through heated areas of the liquid chamber 132 such that the liquid flowing along the flow path may carry or remove the heat as the liquid flow pass the heated areas so as to cool the heated areas.

[0030] According to various embodiments, the flow guide arrangement may include a disposition of the at least one inlet port 134 and the at least one outlet port 136 of the liquid chamber 132 of the liquid cooling level 130 with respect to a planar shape of the liquid chamber 132. The planar shape of the liquid chamber 132 may be a cross-sectional shape of the liquid chamber 132 transverse to the height of the liquid chamber 132. The planar- shape of the liquid chamber 132 may also be a shape of a cross-sectional profile of the liquid chamber 132 along the plane perpendicular- to the height axis 114 of the multi-level enclosure 112. According to various embodiments, the liquid chamber 132 may be of a flat shape and the planar shape of the liquid chamber 132 may be a planar outline of said flat shape. Depending on the planar shape of the liquid chamber 132, positioning and orientation of the at least one inlet port 134 and the at least one outlet port 136 at the lateral side 137 of the liquid chamber 132 may change or affect the flow path of the liquid through the liquid chamber 132. Therefore, the disposition of the at least one inlet port 134 and the at least one outlet port 136 of the liquid chamber 132 of the liquid cooling level 130 and the planar shape of the liquid chamber 132 may form the flow guide arrangement for configuring the flow path of the liquid through the liquid chamber 132. Accordingly, by changing the disposition of the at least one inlet port 134 and the at least one outlet port 136 of the liquid chamber 132 of the liquid cooling level 130 and / or the planar shape of the liquid chamber 132, the flow path may be defined for the liquid to flow through the liquid chamber 132.

[0031] According to various embodiments, the flow guide arrangement may include at least an internal wall, a baffle, or a deflector disposed within the liquid chamber 132 to direct the flow of the liquid and, hence, define the flow path for the liquid in the liquid chamber 132. The internal wall, the baffle or the deflector may change the direction of flow of the liquid or to guide the liquid to flow in a particular direction or to turn the flow. Accordingly, by disposingthe internal wall, the baffle or the deflector in the liquid chamber 132, the flow path of the liquid may be defined accordingly. According to various embodiments, the flow guide arrangement may include one or more protrusions or indentations in one or more side wall surfaces of the liquid chamber 132. Since the liquid is flowing in directions substantially perpendicular to the height of the liquid chamber 132, by incorporating protrusions or indentations in one or more side wall surfaces of the liquid chamber 132, these protrusions or indentations may guide or deflect or change the flow directions as the liquid flow into or pass these protrusions or indentations. Thus, the flow path of the liquid through the liquid chamber 132 may also be defined using such protrusions or indentations in one or more side wall surfaces of the liquid chamber 132.

[0032] According to various embodiments, the vapor chamber level 120 of the heat dissipation unit 110 may include a predefined region 152 for aligning to a heat source (i.e. the heat-generating component of the PED). Accordingly, when disposing the heat dissipation unit 1 10 may for the vapor chamber level 120 of the multi-level enclosure 1 12 of the heat dissipation unit 110 to be in thermal contact or thermal communication with the one or more heatgenerating components of the PED, the predefined region 152 of the vapor chamber level 120 may be aligned to the one or more heat-generating components of the PED for establishing thermal contact or thermal communication thereto. According to various embodiments, the at least one input port 134 of the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 110 may be disposed to direct the liquid flowing into the liquid chamber 132 towards a region 154 of the liquid cooling level 130 corresponding to the predefined region 152 of the vapor chamber level 120. The region 154 of the liquid cooling level 130 may be aligned to (or may coincide with) the predefined region 152 of the vapor chamber level 120 along a direction parallel to the height axis 114 of the heat dissipation unit 110. With tire at least one input port 134 of the liquid chamber 132 of the liquid cooling level 130 directed towards the region 154 of the liquid cooling level 130 corresponding to the predefined region 152 of the vapor chamber level 120, fresh cool liquid entering the liquid chamber 132 of the liquid cooling level 130 may flow directly towards the region 154 of the liquid cooling level 130 receiving the heat from the one or more heat-generating components of the PED. Accordingly, cooling for the one or more heat-generating components of the PED may be optimized.

[0033] Referring back to FIG. 1A, according to various embodiments, the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 110 may include a main portion 120a and at least one auxiliary portion 120b. The at least one auxiliary portion 120bmay be extending from the main portion 120a. Accordingly, the at least one auxiliary portion 120b may be an extension of the main portion 120a. Further, the sealed chamber 122 of the vapor chamber level 120 may extend through-out the main portion 120a and the at least one auxiliary portion 120b of the vapor chamber level 120. Accordingly, the scaled chamber 122 may be a single chamber that occupies the entire vapor chamber level 120, and may be spread across the main portion 120a and the auxiliary portion 120b of the vapor chamber level 120.

[0034] According to various embodiments, the liquid cooling level 130 of the multi-level enclosure 112 of the heat dissipation unit 110 may extend within a boundary of the main portion 120a of the vapor chamber level 120. Accordingly, the liquid cooling level 130 of the multilevel enclosure 112 may extend across the main portion 120a of the vapor chamber level 120 of the multi-level enclosure 112 and may be bounded within the boundary of the main portion 120a of the vapor chamber level 120. Hence, the liquid cooling level 130 of the multi-level enclosure 112 may be confined within an area of the main portion 120a of the vapor chamber level 120 of the multi-level enclosure 1 12 without extending into an area of the auxiliary' portion 120b of the vapor chamber level 120 of the multi-level enclosure 112. When the liquid cooling level 130 of the multi-level enclosure 112 is directly on top or above the vapor chamber level 120 of the multi-level enclosure 112 in the upright orientation of the multi-level enclosure 112, the liquid cooling level 130 of the multi-level enclosure 112 may cover across the main portion 120a of the vapor chamber level 120 of the multi-level enclosure 112 without extending over the auxiliary portion 120b of the vapor chamber level 120 of the multi-level enclosure 112. Thus, a footprint of the liquid cooling level 130 of the multi-level enclosure 112 may be within the area of the main portion 120a of the vapor chamber level 120 of the multi-level enclosure 112. Accordingly, the auxiliary portion 120b of the vapor chamber level 120 of the multi-level enclosure 112 may serve to extend the vapor chamber level 120 outwards (or outside) of the footprint of the liquid cooling level 130 of the multi-level enclosure 112. In other words, in the upright orientation of the multi-level enclosure 1 12, the liquid cooling level 130 of the multi-level enclosure 112 does not extend over the auxiliary portion 120b of the vapor chamber level 120 of the multi-level enclosure 1 12, or a topside of the auxiliary portion 120b of the vapor chamber level 120 of the multi-level enclosure 112 may be free of the liquid cooling level 130 of the multi-level enclosure 112.

[0035] According to various embodiments, the heat dissipation unit 110 may include a plurality of fins 160. The plurality of fins 160 may be disposed at an exterior of the at least one auxiliary portion 120b of the vapor chamber level 120. The plurality of fins 160 may increase the surface area for heat dissipation from the vapor chamber level 120 to the air. According tovarious embodiments, the plurality of fins 160 may be disposed at the exterior of the at least one auxiliary portion 120b of the vapor chamber level 120 in a manner so as be at a same level as the liquid cooling level 130 of the multi-level enclosure 112. Accordingly, the plurality of fins 160 may be disposed at the area of the exterior of the at last one auxiliary portion 120b of the vapor chamber level 120 which the liquid cooling level 130 did not extend into. Hence, instead of the liquid cooling level 130 extending beyond the main portion 120a of the vapor chamber level 120 into the area of the exterior of the at last one auxiliary portion 120b of the vapor chamber level 120, the plurality of fins 160 may be disposed thereto.

[0036] FIG. 2A shows a heat dissipation unit 210 according to various embodiments. FIG. 2B shows a A- A sectional view of the heat dissipation unit 210 of FIG. 2 A according to various embodiments. FIG. 2C shows a B-B sectional view of the heat dissipation unit 210 of FIG. 2A according to various embodiments. According to various embodiments, the heat dissipation unit 210 of FIG. 2A to FIG. 2C includes all the features of the heat dissipation unit 110 of FIG. 1 A and FIG. IB. Accordingly, all features, changes, modifications, and variations that are applicable to the heat dissipation unit 110 of FIG. 1A and FIG. IB are also applicable to the heat dissipation unit 210 of FIG. 2A to FIG. 2C. Therefore, elements which are the same as those described earlier are assigned the same reference numerals, and repetition of their explanations is omitted for brevity. According to various embodiments, the heat dissipation unit 210 may, similar to the heat dissipation unit 110 of FIG. 1A and FIG. IB, include the multi-level enclosure 112 having the vapor chamber level 120 and the liquid cooling level 130.

[0037] According to various embodiments, the vapor chamber level 120 of the multi-level enclosure 112 of the heat dissipation unit 210 may, similar' to that of the heat dissipation unit 110 of FIG. 1A and FIG. IB, include the main portion 120a and the at least one auxiliary portion 120b. The sealed chamber 122 of the vapor chamber level 120 of the heat dissipation unit 210 may similarly extend through-out the main portion 120a and the at least one auxiliary' portion 120b. Further, the liquid cooling level 130 of the multi-level enclosure 1 12 of the heat dissipation unit 210 may similarly extend within the boundary of the main portion 120a of the vapor chamber level 120 of the multi-level enclosure 1 12 of the heat dissipation unit 210.

[0038] As shown in FIG. 2A, according to various embodiments, the at least one auxiliary portion 120b of the vapor chamber level 120 of the multi-level enclosure 112 may be in the form of a duct portion 221 extending from the main portion 120a of the vapor chamber level 120. The duct portion 221 may be a flat tube or a flat pipe extending from the main portion 120a of the vapor chamber level 120. As also shown, according to some embodiments, the vapor chamber level 120 of the multi-level enclosure 112 may include two auxiliary portion120b (in the form of the duct portion 221) extending from two opposite edge of the main portion 120a of the vapor chamber level 120 and in opposite directions away from the main portion 120a of the vapor chamber level 120. Accordingly, the vapor chamber level 120 may have a T- shape profile when viewed from a direction parallel to the height axis 114 of the multi-level enclosure 112.

[0039] According to various embodiments, the at least one inlet port 134 may include the connection element 233 for engagement with external liquid inflow, and the at least one outlet port 136 may include a connection element 235 for engagement with external liquid outflow. The connection elements 233, 235 may include, but not limited to, elements for tight-fitting connections, threaded connections, socket connections, or flange connections.

[0040] Referring to FIG. 2A and FIG. 2B, according to various embodiments, the main portion 120a of the vapor chamber level 120 may be of a plate shape. Similarly, according to various embodiments, the liquid cooling level 130 may also be of a plate shape. Accordingly, the liquid chamber 132 of the liquid cooling level 130 may also be of a plate-like chamber defined by opposing planar surfaces 138, 139 and side wall surfaces. According to various embodiments, the multi-level enclosure 112 of the heat dissipation unit 210 may be of a flat structure, wherein each of the vapor chamber level 120 and the liquid cooling level 130 are also flat.

[0041] FIG. 3 shows an interior of the portable electronic device (PED) 300 according to various embodiments. According to various embodiments, the PED 300 may include a housing 302. Further, the PED 300 may include a heat dissipation arrangement 304. The heat dissipation arrangement 304 may be contained or enclosed inside the housing 302.

[0042] According to various embodiments, the PED 300 may include the heat dissipation unit 210 of FIG. 2A to FIG. 2C. Hie heat dissipation unit 210 includes all the features of the heat dissipation unit 110 of FIG. 1 A and FIG. IB as well as the features as additional described above with reference to FIG. 2A to FIG. 2C. Accordingly, repetition of their explanations is omitted for brevity. According to various embodiments, the PED 300 may also include at least one fan unit 306 associated with the heat dissipation unit 210. The at least one fan unit 306 may include, but not limited to a, laptop fan, a computer processing unit (CPU) fan, a cooler, cooling fan, a blower, or any suitable device for generating an air flow. According to various embodiments, the heat dissipation unit 210 and the fan unit 306 may form the heat dissipation arrangement 304 of the PED 300.

[0043] According to various embodiments, the at least one fan unit 306 may be aligned alongside the at least one auxiliary portion 120b of the vapor chamber level 120 of the heatdissipation unit 210. The at least one fan unit 306 may be operable to generate an air flow across the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210. Accordingly, the at least one fan unit 306 may be positioned and oriented in a manner such that a direction 307 of the output air flow from the at least one fan unit 306 may be directed across the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210. When the at least one auxiliary portion 120b of the vapor chamber level 120 is in the form of the duct portion 221 as shown, the at least one fan unit 306 may be positioned and oriented such that the direction 307 of the output air flow from the at least one fan unit 306 may be perpendicular to a longitudinal direction of the duct portion 221. As shown in FIG. 3, the vapor chamber level 120 of the heat dissipation unit 210 may include two auxiliary portion 120b. Accordingly, the PED may include two fan unit 306 respectively disposed to align with the two auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210 so as to generate the air flow across the two auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210 respectively. According to various embodiments, depending on the number of auxiliary portions 120b of the vapor chamber level 120, a corresponding number of fan units 306 may be provided in the PED 300.

[0044] As further shown in FIG. 3, the heat dissipation unit 210 may, similar' to the heat dissipation unit 110 of FIG. 1A and FIG. IB, include the plurality of fins 160. The plurality of fins 160 may be disposed at the exterior of the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210. Further, the at least one fan unit 306 may be positioned and oriented to generate the air flow across the plurality of fins 160. According to various embodiments, the plurality of fins 160 may be oriented to align with the direction 307 of the air flow generated by the at least one fan unit 306. Accordingly, the plurality of fins 160 may be oriented parallel to the direction 307 of the air flow such that the air flow may flow between the plurality of fins 160.

[0045] According to various embodiments, in the PED 300, the heat dissipation unit 210 may be operated to provide cooling to the heat-generating components 308 (such as CPU and / or GPU) mainly via the vapor chamber level 120 of the heat dissipation unit 210, or mainly via the liquid cooling level 130 of the heat dissipation unit 210, or by both the vapor chamber level 120 and the liquid cooling level 130 of the heat dissipation unit 210.

[0046] When the heat dissipation unit 210 is providing cooling mainly via the vapor chamber level 120 of the heat dissipation unit 210, the liquid cooling level 130 of the heat dissipation unit 210 may be disconnected from the external liquid inflow and the external liquid outflow. The liquid cooling level 130 of the heat dissipation unit 210 may be filled or storedwith liquid, and the inlet valve 144 of the at least one inlet port 134 as well as the outlet valve 146 of the at least one outlet port 136 may be closed. Further, the at least one fan unit 306 may be in operation to generate the air flow across the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210. In this manner, the heat from the heatgenerating components 308 may be dissipated via the cyclic evaporation and condensation of the working fluid in the sealed chamber 122 of the vapor chamber level 120 of the heat dissipation unit 210, whereby the air flow generated by the at least one fan unit 306 may optimize said cyclic evaporation and condensation of the working fluid and the liquid in the liquid cooling level 130 of the heat dissipation unit 210 may serve as heat storage tank to reduce the rate of temperature increase.

[0047] When the heat dissipation unit 210 is providing cooling mainly via the liquid cooling level 130 of the heat dissipation unit 210, the liquid cooling level 130 of the heat dissipation unit 210 may be connected to the external liquid inflow and the external liquid outflow and the inlet valve 144 of the at least one inlet port 134 as well as the outlet valve 146 of the at least one outlet port 136 may be opened such that the liquid is continuously flow through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210. Further, the at least one fan unit 306 may not be in operation and, hence, may not be generating the air flow across the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210. In this manner, most of the heat from the heat-generating components 308 is transferred through the vapor chamber level 120 of the heat dissipation unit 210 to the liquid cooling level 130 of the heat dissipation unit 210 so as to be cooled by the continuous flow of liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210, while some of the heat is still dissipated by the vapor chamber level 120 of the heat dissipation unit 210 via natural ventilation at the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210.

[0048] When the heat dissipation unit 210 is providing cooling by both the vapor chamber level 120 and the liquid cooling level 130 of the heat dissipation unit 210, the liquid cooling level 130 of the heat dissipation unit 210 may be connected to the external liquid inflow and the external liquid outflow and the inlet valve 144 of the at least one inlet port 134 as well as the outlet valve 146 of the at least one outlet port 136 may be opened such that the liquid is continuously flow through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210. Further, the at least one fan unit 306 may be in operation to generate the air flow across the at least one auxiliary portion 120b of the vapor chamber level 120 of the heat dissipation unit 210. In this manner, the heat dissipation capability of the heat dissipationunit 210 may be maximized, whereby the heat from the heat-generating components 308 may be dissipated by both the cyclic evaporation and condensation of the working fluid in the sealed chamber 122 of the vapor chamber level 120 of the heat dissipation unit 210 with forced ventilation (i.c. air flow) from the at least one fan unit 306 and the continuous flow of liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210 for cooling.

[0049] According to various embodiments, the user may control the operation of the heat dissipation unit 210 by connecting and / or disconnecting the external liquid inflow and / or the external liquid outflow, and / or controlling the at least one fan unit 306. According to various embodiments, the PED 300 may include one or more sensors for detecting whether the external liquid inflow and / or the external liquid outflow are connected. According to various embodiments, the PED 300 may include a controller for controlling the operations of the heat dissipation unit 210.

[0050] According to some embodiments, the controller may be configured to receive inputs from the user for controlling the operations of the heat dissipation unit 210. When the external liquid inflow and / or the external liquid outflow are connected, the controller may then control the opening or closing of the inlet valve 144 and the outlet valve 145 of the liquid chamber 132 of the liquid cooling level 130 as well as control the operation of at least one fan unit 306 based on the inputs from the user.

[0051] According to some embodiments, the controller may be configured to switch the heat dissipation unit 210 between the different modes of operation in response to a detection of a change in performance requirement by the PED when the external liquid inflow and / or the external liquid outflow are connected for liquid cooling. For example, when low performance (or a performance for general usage) is detected to be required by the PED, the controller may close the inlet valve 144 and the outlet valve 145 to cease the flow liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210 and only operate the at least one fan unit 306 for optimizing heat dissipation via the vapor chamber level 120 of the heat dissipation unit 210. As another example, when a very high performance is detected to be required by the PED, the controller may open the inlet valve 144 and the outlet valve 145 to commence liquid cooling via flowing the liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210 and also operate the at least one fan unit 306 to optimizing heat dissipation via the vapor chamber level 120 of the heat dissipation unit 210. As yet another example, when a high performance without requiring maximum cooling is detected to be required by the PED, the controller may open the inlet valve 144 and the outletvalve 145 to commence liquid cooling via flowing the liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 210 while ceasing operation of the fan unit 306.

[0052] Therefore, in the various embodiments, the combination of the heat dissipation unit 210 with the at least one fan unit 306 as the heat dissipation arrangement 304 for the PED 300 may provide the user with various options and / or different modes for providing cooling to the PED.

[0053] FIG. 4 shows a heat dissipation unit 410 according to various embodiments. According to various embodiments, the heat dissipation unit 410 of FIG. 4 includes all the features of the heat dissipation unit 110 of FIG. 1 A and FIG. IB as well as the heat dissipation unit 210 of FIG. 2A to FIG. 2C. Accordingly, all features, changes, modifications, and variations that are applicable to the heat dissipation unit 110 of FIG. 1A and FIG. IB and the heat dissipation unit 210 of FIG. 2A to FIG. 2C are also applicable to the heat dissipation unit 410 of FIG. 4. Therefore, elements which are the same as those described earlier are assigned the same reference numerals, and repetition of their explanations is omitted for brevity.

[0054] As shown in FIG. 4, according to various embodiments, in the heat dissipation unit 410, the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 410 may include an inlet port 134 (or one inlet port 134) and two outlet ports 136. The inlet port 134 and the two outlet ports 136 may be disposed at the same lateral side 137 of the liquid chamber 132. Further, the inlet port 134 may be arranged between the two outlet ports 136. In such a configuration, the liquid flowing through the liquid chamber 132 may be directed to flow along a first flow path from the inlet port 134 to a first of the two outlet ports 136 and a second flow path from the inlet port 134 to a second of the two outlet ports 136 to circulate the liquid through the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 410 (see arrows in FIG. 4 for illustration). The initial part of the first flow path and the second flow path may coincide as the liquid enters the liquid chamber 132 of the liquid cooling level 130 of the heat dissipation unit 410 via the one inlet port 134. Subsequently, the first flow path and the second flow path may split or diverge such that the first flow path and the second flow path may respectively turn towards the two outlet ports 136. With two or more flow paths, the liquid may be more efficiently directed to multiple locations, which may correspond to multiple heatgenerating components, for more effective cooling. According to various embodiments, the liquid chamber 132 of the liquid cooling level 130 may include multiple inlet ports 134 and / or multiple outlet ports so as to define multiple flow paths for the liquid to circulate through the liquid chamber 132 of the liquid cooling level 130.

[0055] Various embodiments have provided a heat dissipation unit capable of providing more than one mode of cooling. The heat dissipation unit of the various embodiments may also enable switching or changing of the mode of cooling depending on the usage requirement. Various embodiments have also provided a PED including a heat dissipation arrangement having the heat dissipation unit, which allows the user to change the mode of cooling of the PED depending on usage.

[0056] While the invention has been particularly shown and described with reference to specific embodiments, it should be understood by those skilled in the art that various changes, modification, variation in form and detail may be made therein without departing from the scope of the invention as defined by the appended claims. Tire scope of the invention is thus indicated by the appended claims and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced.

Claims

Claims1. A heat dissipation unit comprising: a multi-level enclosure comprising a vapor chamber level and a liquid cooling level, wherein the vapor chamber level comprises a sealed chamber, a wick structure disposed in the sealed chamber, and a working fluid sealed in the sealed chamber, wherein the liquid cooling level comprises a liquid chamber having at least one inlet port and at least one outlet port, wherein the at least one inlet port has an inlet valve, the at least one inlet port being connectable to an external liquid inflow and the inlet valve being openable when the at least one inlet port is connected to the external liquid inflow for liquid to flow into the liquid chamber, and wherein the at least one outlet port has an outlet valve, the at least one outlet port being connectable to an external liquid outflow and the outlet valve being openable when the at least one outlet port is connected to the external liquid outflow for the liquid to flow out of the liquid chamber, wherein the inlet valve is closeable, when the at least one inlet port is disconnected, and the outlet valve is closeable, when the at least one outlet port is disconnected, in a manner so as to hold the liquid in the liquid chamber of the liquid cooling level, wherein the vapor chamber level and the liquid cooling level are arranged for thermal transfer between tire sealed chamber of the vapor chamber level and the liquid chamber of the liquid cooling level.

2. The heat dissipation unit as claimed in claim 1, wherein the liquid cooling level is a level immediately after the vapor chamber level.

3. The heat dissipation unit as claimed in claim 1 or 2, wherein an inter-level separation of the multi-level enclosure separates the sealed chamber of the vapor chamber level and the liquid chamber of the liquid cooling level, wherein the inter-level separation is capable of thermal transfer there-across between the sealed chamber of the vapor chamber level and the liquid chamber of the liquid cooling level.

4. The heat dissipation unit as claimed in any one of claims 1 to 3, wherein the at least one inlet port and the at least one outlet port of the liquid chamber of the liquid cooling level arc disposed at a same lateral side of the liquid chamber, wherein the liquid flows along a flow path to circulate through the liquid chamber from the at least one inlet port to the at least one outlet port along a plane perpendicular to a height axis of the multi-level enclosure when the at least one inlet port is connected to the external liquid inflow and the at least one outlet port is connected to the external liquid outflow.

5. The heat dissipation unit as claimed in claim 4, wherein the liquid cooling level comprises a flow guide arrangement associated with the liquid chamber to define the flow path along the plane perpendicular to the height axis of the multi-level enclosure for circulating the liquid through the liquid chamber.

6. The heat dissipation unit as claimed in claim 5, wherein the flow guide arrangement comprises a disposition of the at least one inlet port and the at least one outlet port of the liquid chamber of the liquid cooling level with respect to a planar shape of the liquid chamber.

7. The heat dissipation unit as claimed in claim 5 or 6, wherein the flow guide arrangement comprises at least an internal wall, a baffle, or a deflector disposed within the liquid chamber, and / or wherein the flow guide arrangement comprises one or more protrusions or indentations in one or more side wall surfaces of the liquid chamber.

8. The heat dissipation unit as claimed in any one of claims 4 to 7, wherein the liquid chamber comprises an inlet port and two outlet ports disposed at the same lateral side of the liquid chamber, wherein the inlet port is arranged between the two outlet ports.

9. The heat dissipation unit as claimed in any one of claims 1 to 8, wherein the vapor chamber level comprises a predefined region for aligning to a heat source, wherein the at least one input port of the liquid chamber of the liquid cooling level is disposed to direct the liquid flowing into the liquid chamber towards a region of the liquid cooling level corresponding to the predefined region of the vapor chamber level.

10. The heat dissipation unit as claimed in any one of claims 1 to 9, wherein the vapor chamber level of the multi-level enclosure comprises a main portion and at least one auxiliary portion, wherein the sealed chamber of the vapor chamber level extends through-out the main portion and the at least one auxiliary portion, wherein the liquid cooling level of the multi-level enclosure extends within a boundary of the main portion of the vapor chamber level of the multi-level enclosure.

11. The heat dissipation unit as claimed in claim 10, wherein the at least one auxiliary portion of the vapor chamber level is in the form of a duct portion extending from the main portion.

12. The heat dissipation unit as claimed in claim 10 or 1 1 , further comprising a plurality of fins disposed at an exterior of the at least one auxiliary portion of the vapor chamber level.

13. A portable electronic device comprising a heat dissipation arrangement comprising the heat dissipation unit according to any one of claims 1 to 9; and at least one fan unit associated with the heat dissipation unit, wherein the vapor chamber level of the multi-level enclosure of the heat dissipation unit comprises a main portion and at least one aux i 1 i ary portion, wherein the sealed chamber of the vapor chamber level extends through-out the main portion and the at least one auxiliary portion, wherein the liquid cooling level extends within a boundary of the main portion of the vapor chamber level, wherein the at least one fan unit is aligned alongside the at least one auxiliary portion of the vapor chamber level to generate an air flow across the at least one auxiliary portion of the vapor chamber level.

14. The portable electronic device as claimed in claim 13, wherein the at least one auxiliary portion of the vapor chamber level is in the form of a duct portion extending from the main portion.

15. The portable electronic device as claimed in claim 13 or 14, wherein a plurality of fins is disposed at the exterior of the at least one auxiliary portion of the vapor chamber level and oriented to align with a direction of the air flow generated by the at least one fan unit.

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