Substrate holder and method for producing a substrate holder

Abstract

The invention relates to a substrate holder (14) having a fixing region (F), in or on which a product substrate (20) to be handled by the substrate holder (14) is arranged in a populated state of the substrate holder (14), wherein the fixing region (F) comprises a multiplicity of actuator means which are designed and intended to selectively act locally on the product substrate (20) in the populated state, in particular in order to be able to bring about a height offset of a partial region of the product substrate (20) in the populated state, wherein the substrate holder (14) has a layer system (30), wherein the layer system (30) has microtechnical, in particular microelectromechanical, component parts for forming the actuator means.

Description

[0001] SUBSTANCE HOLDER AND METHOD FOR MAKING A SUBSTANCE HOLDER

[0002] The present invention relates to a substrate holder and a method for manufacturing a substrate holder, as well as a device for handling a product substrate and a method for handling a product substrate with the substrate holder.

[0003] It is well known from the prior art to fix product substrates, i.e. substrates to be handled, in particular processed, such as wafers, to substrate holders in order to be able to handle the product substrate.

[0004] In the prior art, substrate holders are predominantly used that have a very precisely manufactured, and in particular hard, substrate surface. Most substrate holders are passive components, meaning that, apart from a means of fixing the product substrate, they have no other active components. The flatness of the substrate holder surface very often determines the bonding result. Adjusting, and in particular improving, the bonding result with such substrate holders is only possible through machining the substrate holder surface, especially by subtraction or abrasion, which is associated with immense costs.

[0005] Because of these disadvantages, substrate holders were developed that allow a fixed substrate to be spatially resolved and actively influenced.

[0006] EP 2 656 378 B1 discloses a substrate holder that, with the aid of distributed heating, piezoelectric, pin, or fluid actuator elements, can achieve a local, relatively coarse displacement or distortion of product substrate components. These actuator elements are relatively large and therefore do not allow for delicate, fine distortion or displacement changes of product substrate components.

[0007] Document US 2023 0 234 188 A1 describes a similar substrate holder that locally deforms the substrate via controllable vacuum channels, which can be interpreted as actuator elements. Document WO 2019 057 286 A1 describes a substrate holder with a plate on which the surface of the substrate holder can be indirectly influenced by selectively switching vacuum fixations on and off. However, these fixations affect the plate fixed to the substrate holder more than the product substrate fixed to the plate.

[0008] Document WO 2018 028 801 A1 describes a substrate holder in which the deformation or distortion of a product substrate can occur along a line by simultaneously switching off several adjacent vacuum fixing elements. In this document, the vacuum fixing elements are also used as actuator elements.

[0009] The publication WO 2022 002 345 A1 describes a so-called zone substrate holder. This substrate holder also features vacuum fixing elements. These elements allow for the evacuation of an entire area, designated as a zone and separated from other zones by sealing elements, thus enabling localized vacuum fixing. The zones are designed so that the vacuum fixing can be controlled during a bonding process by switching it on and off. Switching the vacuum fixing allows substrate components to either relax freely or remain fixed. This changes the state of distortion and strain in the substrate components. The zones are also relatively large and do not permit precise, fine-tuning of the distortion or displacement of individual substrate components.The prior art shows that vacuum fixations are very often repurposed as actuator elements. They serve, on the one hand, for fixing, especially locally, and on the other hand, for distortion and displacement control of the product substrate components.

[0010] The greatest challenge lies in the ever-shrinking structures on the product substrates, which require further processing in various steps. Particularly during bonding, it is crucial to correctly align at least some of the opposing structures on the two substrates to be bonded and to bond them correctly during the bonding process. The smaller the structures, the more precise the alignment must be before and / or during the bonding process. However, the bonding process itself regularly leads to distortion of the substrates relative to each other. Although these distortions, which occur especially during the propagation of the bond wave, only affect areas on the micrometer or even nanometer scale, they can distort the structures so severely that the bonding result is defective. Overlay accuracies of less than 30 nm are now targeted and required in the industry.These levels of accuracy are no longer achievable, or at least not reproducible, with state-of-the-art substrate holders. Furthermore, downstream processing steps, such as lithography, must be taken into account. For this purpose, any deformations applied to the product substrate must be designed / dimensions that allow them to be processed using lithography.

[0011] One of the reasons why such accuracies are no longer achievable with prior art substrate holders is that the actuator elements of these holders are not sufficiently delicate. Consequently, the substrate areas that are distorted when such an actuator element is activated are also quite large. If one wants to reduce the effective area of ​​an actuator element on the substrate in order to increase the resolution, the actuator elements themselves must also be made smaller and more delicate. However, the construction of such delicate actuator elements is associated with enormous costs. The term "microtechnical" is understood by those skilled in the art to mean, in particular, that at least one structuring method known from semiconductor technology has been used. To reduce costs, the actuator elements must be manufactured using known methods from semiconductor technology and micro- and nanotechnology.

[0012] Nonlinear overlay errors cannot be corrected, or can only be corrected with great difficulty, using current substrate holders, as they are unable to compensate for local deformation effects. Substrate holders with different zones are primarily used, which can be switched, particularly via vacuum technology. By switching the vacuum on or off within a vacuum zone, the substrate can be locally fixed more or less firmly, thus influencing the propagation of the bond wave. Although this control mechanism has improved bond wave control, it is too imprecise.

[0013] It is therefore an object of the present invention to provide substrate holders that can enable deformations of the product substrate with a comparatively very high local resolution. These substrate holders should be manufactured as economically and simply as possible. The present invention solves this object with a substrate holder according to claim 1, a method for manufacturing a substrate holder according to claim 12, a device for handling a product substrate according to claim 14, and a method for handling a product substrate with a substrate holder according to claim 15. The scope of the invention also includes all combinations of at least two features specified in the description, the claims, and / or the drawings. Where specified value ranges are given, values ​​lying within the stated limits are also considered limit values ​​and may be claimed in any combination.

[0014] According to a first aspect of the present invention, a substrate holder is provided with a fixing area in or on which, in a loaded state of the substrate holder, a product substrate to be handled by the substrate holder is arranged, wherein the fixing area comprises a plurality of actuator means which are designed and intended to act selectively locally on the product substrate in the loaded state, preferably in a deforming manner, in particular to be able to effect a local height offset of a partial area of ​​the product substrate in the loaded state, wherein the substrate holder has a layer system, and wherein the layer system comprises microtechnical, in particular micro-electromechanical, components for forming the actuator means.

[0015] In contrast to substrate holders known from the prior art, this substrate holder utilizes a layered system comprising microtechnical components. Therefore, the manufacturing of the substrate holders employs processes used in the production of microtechnical components, particularly microelectromechanical devices (MEMS). This not only makes it possible to create actuator elements that allow for exceptionally high spatial resolution during local deformation, but also enables the use of established manufacturing processes known from semiconductor technology. The actuator resolution thus also determines the deformation resolution. Specifically, at least one layer of the layered system is structured for this purpose, for example, using an etching process and / or a lithography process.It is also conceivable that these methods are used in the formation of a portion of the layer system. The separately manufactured part is then reassembled with other components to form the layer system. This makes it possible to design actuator elements that have a lateral extent, i.e., an extent perpendicular to the stacking direction, which is as small as possible, in particular less than 1 pm, more preferably less than 800 nm, and more preferably less than 600 nm. This also allows for very high densities of actuator elements to be achieved. In particular, the actuator elements can be individually controlled. Preferably, the substrate holder has more than 100 actuator elements, more preferably more than 1000 actuator elements, even more preferably more than 10,000, and most preferably more than 12,000 actuator elements. A substrate holder constructed in this way is comparable to deformable mirrors in which individual segments of the mirror can be displaced or...They can be reoriented to correct the wavefronts of light or to adapt them to a specific application. Such deformable mirrors with reorientable segments are known, for example, from telescopes and lithography machines.

[0016] One advantage is that the substrate holder can be manufactured using well-known and established methods from the semiconductor industry. This allows for reproducible, rapid, and economical production of the substrate holder. It is also conceivable to manufacture the actuator elements separately from the other substrate holder components and use a chip-to-wafer (C2W) assembly process. This results in a further economic and technical improvement in substrate holder production.

[0017] A further advantage of the present invention is to provide a substrate holder that can be brought into a defined target state by its actuator elements before or at the latest during the fixation of a product substrate to it. This guarantees identical initial and boundary conditions between identical substrate holders. In particular, the target state can be measured with a measuring system during, but preferably before, the fixation of the product substrate. Preferred measuring systems are optical measuring systems, especially measuring systems based on interferometric measurement. Interferometric measurement is particularly suitable because height differences or surface topography can be detected by a simple change in an interference pattern. For example, light reflected from the surface is superimposed with reference light.Differences in the path length of reflected light at different positions result in varying interference patterns in the superimposed light, which in turn allow conclusions to be drawn about the relative surface topography on the order of the wavelength of the light used. This measurement method is particularly suitable when the topographic differences are in the micrometer or even nanometer range. However, all other types of measurements are also conceivable.

[0018] The term "loaded state" advantageously refers to the state in which the product substrate is held by the substrate holder, i.e., when the substrate holder is in use or loaded with the product substrate. This can be the case in a C2W or W2W (wafer-to-wafer) process.

[0019] A layered system with micromechanical components is characterized in particular by the fact that individual layers or layers of the system are shared by functional units, especially actuator elements, thereby increasing the density of these functional units. The layered system is further distinguished by the fact that it comprises at least one wafer layer and several actuator elements, which can preferably be individually controlled.

[0020] Several actuator elements could, for example, be interconnected to form an actuator unit. It is also conceivable that an actuator unit could consist of only a single actuator element.

[0021] Most state-of-the-art substrate holders are only capable of controlling a few fixing elements, particularly vacuum fixations, or of warping the substrate as a whole. They therefore lack the technical capabilities to generate controlled local distortions. Even if the bonding process is understood and correctly modeled for the corresponding substrate holder, only relatively large areas of the substrate can be distorted. A better bonding result can only be achieved with a greater number of degrees of freedom, i.e., actuator elements.

[0022] The underlying idea is primarily to utilize established semiconductor manufacturing processes, particularly CMOS technology, for the substrate holder, thereby enabling the creation of actuator elements that are smaller than those of the prior art. Furthermore, a key objective is to optimize the electronic control of each actuator element, preferably individually, and to implement an efficient power supply for the actuator elements.

[0023] The substrate holder is preferably used for aligning substrates with nanometer accuracy and for bonding, especially fusion bonding, and most preferably hybrid bonding. However, it can also be used in lithography, particularly photolithography or imprint lithography. In general, the substrate holder can always be used to selectively and locally deform a fixed substrate.

[0024] A displacement is understood as the local deformation at a material point of a body, whereas a strain, simply put, describes the change in deformation. Both quantities are generally second-rank tensors. In the remainder of this text, no further distinction will be made between strains and displacements. Those skilled in the field understand that this concerns the local influence of actuator elements on substrate parts and how to measure and calculate displacements and strains, if necessary. Furthermore, displacements and strains are preferably described in vector notation rather than tensor notation to illustrate the concept more clearly and simply.

[0025] The substrate holders are primarily capable of compensating for planar distortion (in-plane distortion). This refers to distortions whose distortion vector lies parallel to the substrate surface. However, the substrate holder is also capable of distorting the substrate perpendicular to its surface. This is used, among other things, to compensate for local variations in height.

[0026] By designing a new substrate holder capable of efficiently compensating planar distortions, errors from preceding process steps, such as lithography, can also be corrected. Analogous to deformable mirrors that optimize the wavefront of optical systems, the deformable substrate holder would alter the imaging plane of the lithography system. This allows for the local compensation of both optical and substrate errors.

[0027] The substrate holder could also be used in imprint lithography to distort a substrate before, during, and / or after imprinting. This would allow for the correction of the embossed pattern in the embossing compound on the distorted substrate.

[0028] This is therefore preferably a heterogeneously integrated, micromechanical (MEMS) substrate holder operating at the wafer level, which can generate local deformations of the substrate and preferably also measure the actual deformation by means of integrated or integrated sensor elements. This allows the overlay accuracy to be increased. Furthermore, deformations generated, in particular by the propagation of a bond wave, can be compensated.

[0029] In an alternative embodiment, the substrate holder is manufactured from several layers of actuator elements. Each layer of actuator elements is preferably separated from the layer below by a substrate, predominantly a wafer. This makes it possible to create a serial assembly of actuator elements. For example, it would be conceivable that the actuator elements of the lowest layer could generate a very large displacement, while the actuator elements in the uppermost layer, near the fixed product substrate, could generate very fine, delicate displacements. It would also be conceivable, for example, that the actuator elements of a first layer could cause a displacement normal to, and the actuator elements of a second layer parallel to, the substrate holder surface. If the actuator elements are manufactured from piezoelectric elements, this is particularly easy to achieve due to the correct crystallographic orientation of the piezoelectric.

[0030] An actuator is defined as any unit or section of the substrate holder that, independently of other units or sections, can exert an effect on the product substrate when the substrate holder is loaded with the product substrate. The actuators may share individual layers with one another, for example, a common control layer, i.e., a power and / or control layer.

[0031] The actuator can be controlled electrically, magnetically, pneumatically, and / or mechanically. Preferably, the actuator causes a change in volume, which is then preferably transferred to the product substrate. For this purpose, the actuator, for example, causes a locally, i.e., laterally, limited surface curvature in the area of ​​the fixation zone where part of the product substrate rests.

[0032] According to a preferred embodiment, the layer system comprises an actuator layer in which several, in particular separate, actuator elements are arranged, preferably essentially within a single plane. The actuator elements are characterized by their ability to effect a local deformation of the substrate holder surface. They are, for example, designed to bring about a change in volume. The separation of the individual actuator elements advantageously allows for the application of force to different parts of the product substrate as needed. The substrate holder thus has actuator elements that enable local, controllable deformation of the substrate holder surface. An actuator assembly comprises, for example, an actuator element and a logic module.In specific embodiments, the logic is separate from the actuator element; in such cases, the actuator means essentially comprises only the actuator element. The actuator elements can be piezoelectric, thermal, pneumatic, electrostatic, or magnetostatic actuators. Piezoelectric actuators are always used as an example because their manufacture and application are well understood and known. In the simplest case, the actuator element is a piezoelectric layer, preferably arranged between electrodes. Preferably, at least one of the following piezoelectric materials is used.

[0033] • Minerals, especially apatite and quartz (SiO2)

[0034] • Nitrides, especially aluminium nitride (AlN)

[0035] • Phosphates, especially o gallium phosphate (GaPO4)

[0036] • Silicates, especially o lanthanum gallium silicate

[0037] • Oxide, especially o Titanates, especially

[0038] ■ Barium titanate (BaTiOs)

[0039] ■ Belizirconate Titanate (PZT)

[0040] ■ Bismuth titanate (Bii2Ti02o, Bi4Ti30i2)

[0041] ■ Sodium bismuth titanate (Nao.5 Bio.sTiOs, Bio.sNao.sTiOs) o Tantalates, especially

[0042] ■ Lead scandium tantalate (Pb(ScxTalx)Os)

[0043] ■ Lithium tantalate (LiTaOs) o Niobiates, in particular

[0044] ■ Lithium niobiate (LiNbOs)

[0045] • Polymers, especially polyvinylidene fluoride

[0046] • Salts, in particular potassium sodium tartrate tetrahydrate (KNaC4H4Oe*4H2O). If the actuator elements are thermal actuator elements, then they can locally generate temperatures that deviate from room temperature by 10°C, preferably more than 20°C, even more preferably more than 30°C, most preferably more than 40°C, and most preferably more than 50°C. The thermal actuator elements are then preferably also designed to be able to cool and / or heat.

[0047] Actuator elements can generally possess multiple degrees of freedom, allowing, for example, displacements in three linearly independent directions. However, most actuator elements primarily generate a displacement in one direction, the so-called z-direction, i.e., normal to the substrate holder surface. Actuator elements with a single degree of freedom are preferred because they are less complex and can generate higher forces over shorter distances, resulting in correspondingly more controllable deformations. Actuator elements can generally produce compressive, tensile, and shear deformations.

[0048] Integrating actuator and sensor elements into the substrate holder using microfabrication techniques is technically and economically more efficient than using macroscopic actuator and sensor elements, as it eliminates the need for cables and other bulky components. This significantly simplifies the installation and replacement of such substrate holders.

[0049] Preferably, the layer system includes a fixing element for fixing the product substrate, wherein the layer system particularly comprises a channel extending through at least one actuator element to form part of a vacuum channel. This advantageously allows the product substrate to be fixed precisely in the area where deformation is to act upon it. It is preferably provided that the vacuum channel extends through the layer system, preferably through the entire layer system. Furthermore, it is preferably provided that the number of actuator elements with a channel for a vacuum channel is smaller than the total number of actuator elements. Preferably, several actuator elements form a group around the at least one actuator element with a channel. Alternatively, it is also conceivable that each actuator element has a channel to form part of a vacuum channel.Preferably, the layer system includes a power and / or signal layer, which is particularly associated with several actuator elements. The integration of a conduction and / or signal layer proves especially advantageous because it also allows the individual actuator elements to be placed as close together as possible, particularly when they share a common power and / or signal layer. This also simplifies control and makes the control device for the substrate holder less complex.

[0050] Preferably, the actuator layer is arranged between a first electrode layer and a second electrode layer.

[0051] Furthermore, it is preferred that the actuator element be a piezoelectric element. This makes it particularly easy to initiate a change in volume by means of an electrical signal.

[0052] It is particularly preferred that the layer system has a deformable second substrate on its side facing the product substrate in the assembled state, wherein, in the assembled state, the second substrate is in contact with the product substrate at one side and a second side opposite the first side can be deformed by the actuator means. Advantageously, the second substrate layer forms a closed substrate holder surface against which the product substrate rests. The actuator means preferably press on the second side of the second substrate opposite the product substrate and cause a bulge on this side, which is then transferred to the product substrate.

[0053] In a further embodiment of the present invention, the layer system comprises a control layer with several control elements, each of which is preferably assigned to an actuator element. The control layer is preferably arranged between the actuator element and the power and / or signal layer. Preferably, the control layer comprises a CMOS layer or CMOS elements. In a particular embodiment, the control elements, and preferably only a single control element, can be manufactured and / or mounted outside the substrate holder. Particularly when using a single control element for all actuators, multiplexers or other electronic circuits must be used for control. In particular, a dielectric layer is provided in the layer system, preferably arranged between the actuator element and the control layer.This dielectric layer serves as insulation between the actuator element and the control layer.

[0054] Furthermore, it is preferably provided that the layer system has at least one via. This advantageously makes it possible to transmit electrical signals through the dielectric layer, which also has a positive effect on the compactness of the actuator elements.

[0055] In particular, the layer system is designed to include a sensor element. This allows the layer system not only to deform the product substrate, but also to obtain information about the deformation state of the second substrate and / or the product substrate.

[0056] The device preferably also includes sensor elements with which at least the relative displacement, preferably the absolute position, of a local part of the substrate holder can be determined. The sensor elements are based, for example, on a capacitive, optical, inductive, and / or ultrasonic principle. Capacitive sensor elements are described as an example because these are commercially available and inexpensive.

[0057] In an alternative embodiment, strain gauges are located as close as possible to the substrate holder surface to be deformed. The change in electrical resistance during strain of the strain gauges is preferably read and / or processed via CMOS logic in a control layer. In a particularly preferred embodiment, several, in particular three, strain gauges are arranged around an actuator element. Using three strain gauges arranged at 120° angles to each other, the deformation state near the substrate can be measured particularly easily and effectively. The strain gauges are preferably also manufactured directly in the substrate holder using microsystems technology and semiconductor industry processes.

[0058] A further object of the present invention is a method for manufacturing a substrate holder, in particular a substrate holder according to the invention, with a fixing area in or on which, in a loaded state of the substrate holder, a product substrate to be handled by the substrate holder is arranged, wherein the fixing area comprises a plurality of actuator means which are designed and intended to selectively act locally on the product substrate in the loaded state, in particular to be able to effect a height offset of a partial area of ​​the product substrate in the loaded state, wherein a layer system is provided for forming the fixing area, and wherein the layer system or a part of the layer system provided for forming the layer system is realized, in particular structured, by forming microtechnical, in particular micro-electromechanical, components of the actuator means.All the properties and advantages described for the substrate holder can be applied analogously to the process.

[0059] Preferably, a second substrate is provided, preferably with a second electrode layer, to be connected to the actuator element, in particular by means of a metal bonding process.

[0060] In particular, it is planned that a first substrate will be connected to the actuator element via a hybrid bonding process.

[0061] The following describes two exemplary processes, whose individual steps can be combined if technically feasible. Not all process steps are necessarily required. These are merely exemplary processes with exemplary process steps.

[0062] In a first process, the substrate holder is assembled primarily from at least two separately manufactured components. This process is characterized as a W2W (wafer-to-wafer) process, since only wafers are handled, processed, and bonded together. Individual chips, chiplets, or dies are never used.

[0063] In a first process step, a first substrate is provided. This first substrate is preferably a wafer. In particular, the first substrate is designed such that the relevant, well-known process steps from the semiconductor industry can be optimally applied to it. Preferably, the first substrate is already fixed to a passive substrate holder, a base, which is preferably made of titanium, silicon carbide, and / or silicon nitride. This passive substrate holder serves as a stabilizing and fixing component group for the active substrate holder mounted on it. In a second process step, a power and signal layer is created. The power and / or signal layer is generally itself produced by several process steps, which are not described in detail here. The power and / or signal layer supplies current and signals to logic in the control layer.The power and / or signal layer therefore comprises at least current and signal lines. The power and / or signal layer also preferably includes a dielectric material and / or a semiconductor material in which the electrically conductive current and signal lines are generated. Furthermore, a first electrode can be set to a desired potential via the power and / or signal layer to generate the necessary voltage to a second electrode, wherein the first electrode and the second electrode are, for example, designed to control an actuator element arranged between the first electrode and the second electrode.

[0064] The power and signal lines must be fabricated at the wafer level on a micrometer and / or nanometer scale. In contrast to the state of the art, comparatively low resolutions are required for their fabrication. The fabrication of the power and signal lines can therefore be carried out, for example, using a maskless laser exposure (MLE) device. This eliminates the need for costly photolithography equipment, which can, however, also be used to achieve the desired resolutions.

[0065] In a third process step, the control layer is created. The control layer itself is produced through several process steps, which are not described in detail here. The control layer preferably contains the logic circuits of the substrate holder, which are used to control the actuator elements and read sensor elements. In subsequent process steps, the control layer is etched to create control layer regions, preferably one control layer region per control element.

[0066] In a fourth process step, a dielectric layer is produced. This dielectric layer is preferably a polycrystalline layer produced by appropriate deposition processes. Its main function is to separate the logic portion of the control layer from the mechanical area of ​​the actuator, which is implemented in the actuator layer. However, it is also conceivable that the dielectric layer is a medium substrate, particularly a single-crystal one, which is bonded to the control layer using a bonding process. Advantageously, in this case, the surface of the dielectric layer and the substrate surface of the medium substrate would be hybrid bond surfaces, i.e., they would be composed of a dielectric, particularly an oxide, with corresponding electrical regions responsible for the through-hole plating.Such hybrid bonded surfaces are also well known in the semiconductor industry and will not be described in detail here. It is also conceivable that the dielectric layer is an epitaxially grown, preferably single-crystal, layer. The fabrication process and the additional necessary steps will also not be discussed, as these are also state of the art.

[0067] In a fifth process step, vias are embedded in the dielectric layer, extending down to the CMOS level.

[0068] In a sixth process step, the vias are filled. During filling, preferably simultaneously, an electrical layer is also created, which later serves as one of the electrodes for controlling the actuator built from the actuator layer. This electrical layer is called the first electrode layer. Optionally, the first electrode layer can be thinned to reduce its thickness and roughness. Thinning can either reduce the first electrode layer to a desired thickness or remove it completely.

[0069] If the first electrode layer is thinned back to a desired thickness and remains fully intact, it comprises the same material as the vias.

[0070] If the first electrode layer is removed after the vias have been filled, it must be recreated afterwards, especially from a material that differs from the material of the vias.

[0071] In a seventh process step, the actuator element is produced. The actuator element is preferably a piezoelectric layer. Since the term "actuator element" is used generally, the layer containing multiple actuator elements is referred to as the actuator layer. The actuator layer is preferably single-crystal and oriented such that applying a voltage between the first electrode layer and the second electrode layer (see below), which border the surfaces of the actuator layer, results in strain. The fabrication of such a single-crystal actuator layer on the surface of a preceding layer, particularly a polycrystalline one, is only possible to a limited extent. One possibility would be fabrication via several epitaxial growth processes, which will not be described in detail here.Preferably, a single-crystal piezoelectric substrate is bonded to the first electrode layer and optionally thinned. Those skilled in the art understand that it is also possible to coat a piezoelectric substrate with a first electrode layer and, after filling the vias and, in particular, completely removing the first electrode layer, bond it to the dielectric layer in the sixth process step. If the first electrode layer has not been removed or thinned in the sixth process step, a first electrode layer on the piezoelectric substrate can still be bonded to the first electrode layer on the dielectric layer. In this case, it is then a metal, eutectic, or TLP bond.

[0072] In an eighth process step, the layers produced up to this point are structured. Those skilled in the art are well aware of the necessary masking, exposure, development, and etching processes. Furthermore, they are familiar with the use of etch stop layers, the production of which was not explicitly mentioned in the preceding process steps. In this process, the first substrate, with all its layers built upon it, is now referred to as the first component.

[0073] In a ninth process step, an upper, second substrate is provided. This second substrate is preferably produced with raised areas and the resulting depressions. These raised areas, referred to as knobs or pins, are used in the semiconductor industry for various reasons, which will not be discussed in detail here. The second substrate preferably also has fixing elements with which a product substrate to be fixed to the finished substrate holder can be secured. The types of fixing elements are also not discussed in detail, but preferably, vacuum fixation is used.

[0074] In a tenth process step, the second substrate is coated with an electrical layer. This electrical layer later serves as the electrical ground and is referred to as the second electrode layer. Alternatively, the second electrode layer could also be called the GND layer. However, to maintain consistency with the first electrode layer, it is referred to as the second electrode layer. In this process, the second substrate with all its layers is now referred to as the second component. The second component can also include a power and / or signal layer and / or a control layer, particularly in conjunction with sensor logic, for example, to determine the temperature near the substrate to be fixed later. Preferably, the substrate of the second component is as thin as possible to avoid excessive bending resistance.

[0075] In an eleventh process step, the second component is aligned with the first component and bonded. Since the second electrode layer is a metal layer, it can be advantageous to also deposit an electrical layer on the actuator layer of the first component. However, this deposition must take place before the structuring according to process step eight.

[0076] In a twelfth process step, the fixing elements are produced. Preferably, these are simple vias that serve as vacuum fixations. The vias could also have been produced stepwise in individual steps, but this would have been technically disadvantageous because each additional coating process would have resulted in the closure of a previously produced via. The additional process steps for producing the vias would then have had to be selected in such a way that the vias would have had to be maintained or newly produced at every stage.

[0077] In a second process, the substrate holder is assembled from at least three separately manufactured components. This process is characterized as a C2W (chip-to-wafer) process, since at least at one point a wafer is populated with a chip, chiplet, or die. In this case, "wafer" is to be interpreted as a general substrate.

[0078] The terminology for the individual layers can be adopted from the first process. Therefore, the description of the second process is more concise. In the second process, the substrate holder is assembled from at least three components. The first component is a first substrate. The second components are several separately manufactured chips that are aligned to the first substrate using the C2W process and then bonded to it. The third component is again a second substrate that is bonded to the second components. In a first process step, a first substrate is provided. In a second process step, a power and / or signal layer is created on the first substrate. In the subsequent process, the first substrate serves as an interposer. The power and / or signal layers provide the current and signals to the substrate holder being created.The power and signal lines must be fabricated at the wafer level on a micrometer and / or nanometer scale. In contrast to the state of the art, comparatively low resolutions are required for their fabrication. The fabrication of the power and signal lines can therefore be carried out, for example, using a maskless laser exposure (MLE) device. This eliminates the need for costly photolithography equipment, which would also be suitable for achieving the desired resolution.

[0079] In a third process step, a dielectric layer with a hybrid bond surface is produced. The hybrid bond surface consists of a dielectric, preferably silicon oxide, and corresponding metallic vias. The hybrid bond surface allows for assembly by hybrid bonds and heterogeneous integration in subsequent process steps. Hybrid bonds and hybrid bond surfaces are known in the art and are not described in detail here. In a fourth process step, part of the fixation element, preferably a channel for vacuum fixation, is produced. If the fixation is electrostatic, it is not produced at this stage. The fixation is then produced above the control layer to conduct the current from the power and / or signal layer to the top surface of the future substrate holder.In the remainder of the disclosure, only vacuum fixation processes are discussed. The component produced in this way is referred to as the first component.

[0080] In a fifth process step, a second substrate is provided, from which several second components, chips, chiplets, or dies are produced by singulation. The fabrication of a second component is only superficially described here, as the layer sequence and process steps are either known from the prior art or have already been described in detail in the first process. Starting with a base substrate, preferably a wafer, a control layer is produced on one side, which is also coated with a dielectric and partially opened. The dielectric layer again has a hybrid bonded surface. The base substrate corresponds to the dielectric layer from the first process. Then, the first electrode layer and the vias between the control layer and the first electrode layer are produced.An actuator layer is then created on the first electrode layer, either by deposition or, preferably, by a bonding process. This is followed by structuring and the fabrication of fixation elements, preferably channels for subsequent vacuum fixation. Finally, the base substrate with its layers must be separated by a dicing process. Several corresponding second components are then obtained from the base substrate. The surface of the actuator layer can be metallically coated before structuring and separation to support the subsequent metallic or eutectic bond. The process steps described here can be carried out in any sequence necessary and technically feasible to produce the corresponding second component.

[0081] The component produced in this way is referred to as the second component. In a sixth process step, the second substrate is prepared. The second substrate is preferably structured on the substrate surface where the product substrate will later be fixed. This structuring results in raised areas that support the product substrate only at certain locations. Fixing is achieved using fixing elements, preferably vacuum fixing.

[0082] In a seventh process step, an electrical layer, a second electrode layer, is deposited on the substrate surface, which is opposite the substrate surface for fixation.

[0083] In an eighth process step, a portion of the fixing elements, preferably a channel for vacuum fixation, is produced. If the fixing element is not a vacuum channel but an electrostatic fixing element, this step might need to be performed before the seventh process step, before the second electrode layer is deposited. Accordingly, the power supply to the electrostatic fixing element would have to be electrically isolated from the second electrode layer, which would require several additional process steps that will not be discussed in detail here. For the production of a vacuum fixation element, only a single pass of etching is required. The component produced in this way is referred to as the third component.The third component can also include a power and / or signal layer and / or a control layer, particularly in conjunction with sensor logic, to determine, for example, the temperature and / or strain state near the substrate to be fixed later. Preferably, the second substrate of the third component is made as thin as possible to avoid acting as an excessive bending resistance.

[0084] In a ninth process step, several secondary components are aligned with the first component and bonded. Alignment and bonding are preferably performed using a C2W ("chip to wafer") bonder. Advantageously, it is possible to verify the functionality of at least the secondary component to be bonded before each bonding operation. This is a significant advantage over the first process, where a failure in the W2W ("wafer-to-wafer") process leads to at least a localized failure of the substrate holder's functionality. With the second process, however, the CMOS capability and the actuator element can be tested before they are bonded and become part of the substrate holder. A collective transfer of several secondary components to the first component is also conceivable. This process is sometimes referred to as collective C2W bonding. Self-alignment of the secondary components relative to the first component is also particularly advantageous.The corresponding procedure for collective C2W bonding and self-alignment is described in WO 2018 157 937 A1.

[0085] In a tenth process step, the third component is bonded to the several second components. In this case, a metal, eutectic, or TLP bond is used. This type of bond also allows the slight deformability necessary to locally shift the second component.

[0086] In a specific embodiment of the second method, the fabrication and bonding of the third component to the numerous second components are completely omitted. The product substrate, to be fixed later, is placed directly onto the numerous second components, the chiplets, and fixed in place. Thus, the second components themselves become the protrusions that would otherwise have had to be created on the third component. A disadvantage of this specific embodiment is the absence of the common second electrode layer, which serves as the ground potential. The second electrode layer must be present on every second component, but it must also be able to be brought to potential via a current conductor through the second component. Analogous considerations apply to a specific embodiment of the first method. The versatility of these process steps enables the utilization of the entire microfabrication ecosystem.Each functioning second component, i.e., each chip, can be placed at any position on the first component.

[0087] Another object of the present invention is a device for handling a product substrate with a substrate holder according to the invention. All advantages and properties described for the method can be transferred analogously to the device and vice versa.

[0088] Another object of the present invention is a method for handling a product substrate with a substrate holder according to the invention, preferably comprising:

[0089] - Capturing a situation parameter and / or

[0090] - Determination of a model, particularly preferably depending on the situation parameter, and

[0091] - Modifying the substrate holder, in particular by means of the actuator element, based on the model.

[0092] This makes it advantageously possible to coordinate the substrate holder in a process specific to the application. Material composition or geometry of the product substrates can be a situational parameter, as can the temperature during the bonding process. These are just examples of situational parameters and are not exhaustive. It is also conceivable that the model is adapted at regular intervals to react appropriately to changes in the environmental conditions, such as temperature fluctuations. The actuator elements then make it advantageously possible to adjust the substrate holder to obtain or provide a substrate holder optimized for the bonding process.

[0093] The substrate holder is preferably used in conjunction with models, particularly bond models. The measurement data from the sensor elements in the substrate holder and / or external sensor elements provide the output data to a hardware, software, or firmware component, which uses a mathematical model to calculate corresponding control signals. These control signals are then used to deform the substrate fixed to the substrate holder accordingly. In particular, the substrate holder is intended to be used in a feed-forward loop. In this case, the substrate holder is brought into a specific state by the results of a model calculation before, or at the latest during, the fixation of a product substrate.

[0094] In further embodiments, the substrate holder is then continuously adjusted in a feedback loop so that the process carried out on the product substrate is performed with minimal errors, in particular a minimal overlay error.

[0095] Further advantages, features, and details of the invention will become apparent from the following description of preferred embodiments and from the drawings. These show:

[0096] Fig. 1a - 11 schematically shows a method according to a first exemplary embodiment of the present invention,

[0097] Figs. 2a - 2j schematically show a method according to a second exemplary embodiment of the present invention,

[0098] Fig. 3 shows a schematic top view of several actuators,

[0099] Fig. 4 shows a schematic side view of part of a substrate holder.

[0100] Fig. 5 shows a schematic side view of part of a substrate holder.

[0101] Fig. 6 shows a schematic side view of part of a substrate holder in the activated state.

[0102] Fig. 7 shows a schematic side view of part of a substrate holder with sensor element and

[0103] Fig. 8 shows a schematic side view of part of a substrate holder of an alternative embodiment. In the figures, identical components or components with the same function are identified by the same reference numerals.

[0104] The words chip, chiplet, and plate are used synonymously. A plate is a small part directly separated from a substrate that has not yet been encapsulated. A chip can be visualized as a plate, usually encapsulated, with contacts. Chiplets are small, individual chips that were formerly contained within a very large, monolithically integrated IC. The distinction adds no value to the invention. They are all individual, small components.

[0105] Figures 1a-11 show a first method according to a first exemplary embodiment of the present invention and only a section of the substrate holder 14 to be produced with a single actuator element 8. Furthermore, the representation of the base 1, which has at least one base plate and on which the active substrate holder 14 is mounted, is omitted. The base 1 serves only for stabilization. It can also be considered a component or component group of the substrate holder 14 (see Figures 4-8).

[0106] Figure 1a shows a first process step of a first process for manufacturing a substrate holder 14, in which a first substrate 2 is provided. The first substrate 2 is preferably a wafer, in particular a silicon wafer. However, substrates made of other materials are also conceivable.

[0107] Figure 1b shows a second step of the first process, in which a power and signal layer 3 is applied. The power and / or signal layer 3 is represented in a simplified and abstract manner. The power and / or signal layer 3 actually contains countless conductor tracks, i.e., a multitude of conductor tracks, in particular isolated conductor track segments, for power and / or signal transmission.

[0108] Figure 1c shows a third step of the first process, in which a control layer 4 is applied. The control layer 4 is shown in a simplified and abstracted form. The control layer 4 actually contains functional units for controlling the actuator element 8 above it. Figure 1d shows a fourth step of the first process, in which a dielectric layer 5 is applied. It serves primarily as insulation and a base for the actuator element 8 produced above it in the actuator layer (see Figure 1g).

[0109] Figure 1e shows a fifth process step of the first process, in which vias 6 are created in the dielectric layer 5. The vias 6 serve as the electrical connection between the control layer 4 and the first electrode of the actuator element 8, which is created from the first electrode layer 7 (see Fig. 1f).

[0110] Figure 1f shows a sixth process step of the first process, in which a first electrode layer 7 is produced on the dielectric layer 5. The first electrode layer 7 becomes the first electrode of the actuator element 8.

[0111] Figure 1g shows a seventh step of the first process, in which a piezoelectric layer, the actuator element 8, on which the electrode layer 7 is produced, is fabricated. This actuator layer can be stretched or compressed by applying a voltage between a first electrode layer 7 and a second electrode layer 9 (see Figure 1k). It is thus the actuator, the mechanical-electrical part, of the actuator element 8.

[0112] Figure 1h shows an eighth step of the first process, in which the previously created layer system is structured. Structuring takes place in several steps, only some of which are listed here. These include coating, masking, exposure, development, stripping, and etching. Etch stop layers have been omitted from the series of figures for clarity. This results in a first component 13 being available.

[0113] Figure 1i shows a ninth process step of the first process, in which a second substrate 10 is provided. The second substrate 10 is again preferably a wafer, in particular a silicon wafer, but can also be made of other materials. Silicon nitride (SiL⁻¹) or silicon carbide (SiC) would be particularly suitable. The second substrate 10 preferably has projections 12 (pins) for contacting the product substrate. Figure 1j shows the tenth process step, in which the second electrode layer 9 is applied to the substrate surface opposite the fixing surface of the substrate 10. This provides a second component 13'.

[0114] Figure 1k shows an eleventh process step in which the first component 13 is bonded to the second component 13'. To improve the bonding process, further layers can be applied to the second electrode layer 9 and / or to the actuator element 8; these are not shown here.

[0115] Figure 11 shows a twelfth process step in which fixing elements 11, in this case vacuum channels 11, are preferably produced by etching. These vacuum channels 11 could also have been produced in previous process steps. During the bonding process between component 13 and the second component 13', the vacuum channels 11 produced separately in components 13 and 13' would have had to be correctly aligned with each other. Furthermore, it cannot be ruled out that the vacuum channels might become clogged during a process step. Therefore, producing the vacuum channels 11 at the end of the process is preferred.

[0116] In other embodiments, it is conceivable that the fixing elements 11 are different fixings than vacuum channels. For example, electrostatic fixing elements 11 would be conceivable. The wiring and control of such electrostatic fixing elements 11 are not described in detail here; however, control and power supply via the control layer 4 and the power and / or signal layer 3 are obvious. In this way, a substrate holder 14 is manufactured. The substrate holder 14 can also have a base 1 on its underside (see Fig. 4-8) and is then simply referred to as the substrate holder 14. The base 1 serves only for stabilization and does not represent an essential feature.

[0117] Figures 2a to 2I show a second method according to a second exemplary embodiment of the present invention.

[0118] Figure 2a shows a first process step of the second process for manufacturing a substrate holder 14, in which a first substrate 2 is provided. The first substrate 2 is preferably a wafer, in particular a silicon wafer. However, substrates made of other materials are also conceivable. Figure 2b shows a second process step of the second process, in which a power and signal layer 3 is applied. The power and / or signal layer 3 is shown in a simplified and abstracted form. The power and / or signal layer 3 actually contains countless conductive traces for current and signal transmission.

[0119] Figure 2c shows a third process step of the second process, in which a dielectric layer 5 with a hybrid bond surface 15 is produced. Current and signals can be conducted through the hybrid bond surface 15 via the vias 6.

[0120] Figure 2d shows a fourth process step of the second process, in which a fixing element 11, in particular a vacuum channel, is produced. The component thus created is referred to as the first component 13.

[0121] Figure 2e shows a fifth process step of the second process, in which a second component 13' is provided. The fabrication of the second component 13' is not described in detail. The second component 13' preferably has a hybrid bonded surface 15 on one side, as well as a control layer 4 in which the logic elements are located. The central part consists of a dielectric layer 5 with vias 6. The dielectric layer 5 is primarily intended to separate the control layer 4 from the first electrode layer 7, which was deposited on the dielectric layer 5. The actuator element 8 of the actuator layer is located on this. The entire second component 13' thus constitutes a chip 16. This chip 16 is also produced at the wafer level, i.e., by forming microtechnical components, but is subsequently separated by a dicing process.

[0122] Figure 2f shows a sixth step of the second process, in which a second substrate 10 is provided. The substrate 10 preferably has a structure. Preferably, it is a zone substrate and a stud substrate, i.e., the raised areas or studs separate a product substrate to be fixed later from the underlying layer. Such zone substrates or zone sample holders are known in the semiconductor industry and will not be discussed in more detail here. The second substrate 10 is preferably a wafer, in particular a silicon wafer, but can also be made of other materials. Silicon nitride (SisN⁻) or silicon carbide (SiC) would be particularly conceivable. Figure 2g shows a seventh step of the second process, in which a second electrode layer 9 is applied, which will later serve as a second electrode, in particular as an electrical ground.

[0123] Figure 2h shows an eighth process step of the second process, in which a fixing element 11, in particular a vacuum channel, is produced. The component thus created is referred to as the third component 13".

[0124] Figure 2i shows a ninth process step of the second process, in which several second components 13', i.e., chips 16, are bonded to the first component 13 using a C2W (chip-to-wafer) process. Since the figures only represent a section, only one component 13' is visible.

[0125] Figure 2j shows a tenth process step of the second process, in which the third component 13" is bonded to the multiple components 13' using a wafer-to-wafer (W2W) process. This allows the fabrication of a substrate holder 14. The substrate holder 14 can also have a base 1 on its underside (see Figures 4-8) and is then simply referred to as the substrate holder 14. The base 1 serves only for stabilization.

[0126] Figure 3 shows an abstracted top view of a set of actuator elements, represented by the actuator layer, as part of a substrate holder 14. All other components or component groups have been omitted. It can be seen that the actuator elements do not necessarily have to be rectangular. They can be manufactured in different sizes and shapes and, in particular, adapted to the zoned structure of a substrate holder. Preferably, the actuator elements are designed such that they can optimally control the behavior of a progressing bond wave during a bonding process. Preferably, the size and shape of the actuator elements are calculated by computer models. In addition, experimental measurements can be carried out to optimize the shape and size of the actuator elements.Experience has shown that, due to the circular shape of the substrates to be influenced and fixed to the substrate holder, Zernike polynomials and / or Bessel functions are suitable for optimally describing the physical behavior of the fixed substrates. In the computer model, corresponding actuator elements are preferably simulated, a simulation is started, and if the result is satisfactory, a corresponding substrate holder 14 is designed. Measurement on the actual substrate holder 14 then shows whether the simulation has adequately represented reality. Accordingly, the empirical measurement results are then used in a new simulation to optimize the substrate holder 14, in particular the shape and size of the actuator elements. The greater the number of actuator elements, the better the control over the physical process to be influenced, especially the behavior of the bond wave; however, the greater the control effort also becomes.The methods and processes of the half-liter industry allow the production of hundreds of actuator elements per substrate holder 14. The number of actuator elements shown is only small for the sake of clarity. It would also be conceivable for the actuator elements to be rectangular and produced in a rectangular pattern. Preferably, the actuator elements could also be hexagonally shaped and arranged in a hexagonal lattice.

[0127] Figure 4 shows a schematic side view of a substrate holder 14 with three visible chips 16. The chips 16 are connected via the second electrode layer 9 to the second substrate 10, which fixes a product substrate 20 via fixings 11. The product substrate 20 is to be deformed using the substrate holder 14. Sensors, in particular strain gauges (not shown), are preferably integrated into the substrate 10.

[0128] Figure 5 shows a schematic side view of an alternative substrate holder 14' with three visible chips 16 according to a further preferred embodiment of the present invention. The chips 16 each have electrode layers 9 but no substrate 10. In this case, the product substrate 20 rests directly on the chips 16. In this case, it is more complicated to bring the electrode layers 9 to a common potential, since they are not connected to each other. The electrically conductive connection must be made through the chip 16 (not shown). The advantage of this embodiment is that the chips 16 can directly serve as studs of a stud chuck. The production of a substrate 10 can be dispensed with. Furthermore, a product substrate 20 resting on the chips can be directly deformed without having to overcome the bending resistance of a substrate 10.

[0129] Figure 6 shows a schematic side view of a substrate holder 14 with three visible chips 16. The actuator element 8 of the middle chip 16 is stretched by applying a voltage U > 0 between the first electrode layer 7 and the second electrode layer 9, thereby lifting the second substrate 10, which is part of the substrate holder 14. A product substrate 20 is fixed to the substrate holder 14, in particular by means of a fixing element 11, for example, a vacuum fixation device, and is thus also deformed. The deformation is greatly exaggerated in Figure 6. In practice, the deformation will be in the millimeter, micrometer, or even nanometer range. The deformations are in particular less than 1 mm, preferably less than 100 pm, more preferably less than 1 pm, most preferably less than 100 nm, and most preferably less than 10 nm.In the product substrate 20, displacements and distortions are generated. According to the invention, these displacements and distortions can be used to compensate for externally acting effects. It is conceivable that the substrate holder 14 is used for bonding. In this case, the product substrate 20 could be stretched or distorted before and / or during the passage of a bonding wave so that the bonding wave optimally bonds the two product substrates 20 to be bonded together, i.e., overlay defects are reduced. A substrate holder 14 would also be suitable for locally variably stretching or distorting a product substrate 14 so that a lithographically generated, defective structure is corrected. It is also conceivable that an embossing compound is located on the product substrate 20.The imprinting process has left a faulty embossing, which can be corrected with the present substrate holder 14 before the product substrate 14 is further processed.

[0130] Figure 7 shows a sensor element 17 located between two chips 16. The construction of such a sensor element 17 is analogous to one of the two methods mentioned. It can either be manufactured using a W2W process or, preferably, separately using a C2W process and then bonded to the lower substrate 2 by a C2W bonding process. In a C2W process, the advantage is again that each individual sensor element 17 can be tested for functionality before it is bonded. The functionality of a sensor element 17 again depends on its structure. A capacitive sensor element 17 is shown, with two sensor element electrodes 18 that are controlled and / or energized via a control layer 4 and a power and / or signal layer 3. If the distance between the sensor element electrodes 18 and the overlying second electrode layer 9 changes, the change affects the electric field 19.This change can be measured and converted into a distance. It is also conceivable that the sensor element 17 is manufactured directly with or on a chip 16. The use of sensor elements 17 is particularly advantageous if the actuator elements 8 of the chip 16 are piezoelectric elements, since piezoelectric elements exhibit hysteresis with respect to displacement. A control system between an actuator element 8 and a sensor element 17 allows for the compensation of this hysteresis. In the figure shown, the sensor element 17 is depicted next to chips 16 that were manufactured and bonded according to the second method. Analogous considerations apply if the sensor elements 17 are manufactured simultaneously with the actuator elements 8 as part of a first method.

[0131] Figure 8 shows an alternative embodiment of a substrate holder 14. A first substrate 2 is fixed to a base 1. A power and / or signal layer 3 for current and signal transmission is located on the first substrate 2. Preferably, a dielectric layer 5 with a hybrid bond surface 15 is located above this. Directly above this is the first electrode layer 7, followed by the actuator layer 8 of the actuator element. The first electrode layer 7 can also be provided with a dielectric layer 5 with a hybrid bond surface 15. In contrast to the other embodiments, the logic from the control layer 4 is located in a separate CMOS chip 16', which is bonded to the dielectric layer with hybrid bond surface 15 of the first substrate 2.This allows for the independent fabrication, testing, and bonding of an actuator chip 16, with layers 15, 7, and 8, from a CMOS chip 16', with components 15 and 4. Each of these two chips 16, 16' can be manufactured by a different company. This further optimizes industrial production. The two chips are then bonded to the first substrate 2 using a C2W process.

[0132] Reference symbol list:

[0133] 1 Base

[0134] 2 first substrate

[0135] 3 Power and / or signal layer

[0136] 4 Control layer

[0137] 5 Dielectric layer

[0138] 6 vias

[0139] 7 first electrode layer 8 actuator element

[0140] 9 second electrode layer

[0141] 10 second substrate

[0142] 11 fixing element 12 protrusions, pins

[0143] 13, 13' component

[0144] 14, 14' Substrate holder

[0145] 15 Dielectric layer with hybrid bond surface

[0146] 16, 16' chip, chiplet or plate 17 sensor element

[0147] 18 sensor element electrodes

[0148] 19 Electric field

[0149] 20 Product substrate

[0150] 30-layer system F fixing area

Claims

Claims 1. Substrate holder (14) with a fixing area (F) in or on which, in a loaded state of the substrate holder (14), a product substrate (20) to be handled by the substrate holder (14) is arranged, wherein the fixing area (F) comprises a plurality of actuator means which are designed and intended to act selectively locally on the product substrate (20) in the loaded state, preferably in a deforming manner, in particular to be able to cause a local height offset of a partial area of ​​the product substrate (20) in the loaded state, wherein the substrate holder (14) has a layer system (30), and wherein the layer system (30) comprises microtechnical, in particular micro-electromechanical, components for forming the actuator means.

2. Substrate holder (14) according to claim 1, wherein the layer system (30) comprises an actuator layer in which several actuator elements (8) are arranged, preferably substantially within one plane.

3. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) has a fixing element for fixing the product substrate (20), wherein the layer system (30) in particular comprises a channel extending through at least one actuator element (8) to form part of a vacuum channel.

4. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) comprises a power and / or signal layer (4) which is in particular associated with several actuator elements (8).

5. Substrate holder (14) according to one of the preceding claims, wherein the actuator layer is arranged between a first electrode layer (7) and a second electrode layer (9).

6. Substrate holder (14) according to one of the preceding claims, wherein the actuator element (8) comprises a piezoelectric element.

7. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) is attached to the product substrate (20) in the assembled state on the side facing the product substrate (20) a deformable second substrate (10) is in contact with the product substrate (20) in the assembled state and a second side opposite the first side can be deformed by the actuator elements (8).

8. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) has a control layer (4) which has several control elements, in particular each of which are assigned to an actuator element (8), wherein preferably the control layer (4) is arranged between the actuator element (8) and the power and / or signal layer (4).

9. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) has a dielectric layer (5) which is preferably arranged between the actuator element (8) and the control layer (4).

10. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) has at least one via (6).

11. Substrate holder (14) according to one of the preceding claims, wherein the layer system (30) comprises a sensor element (17).

12. Method for manufacturing a substrate holder (14), in particular a substrate holder according to one of the preceding claims, with a fixing area (F) in or on which, in a loaded state of the substrate holder (14), a product substrate (20) to be handled by the substrate holder (14) is arranged, wherein the fixing area (F) comprises a plurality of actuator means which are designed and intended to selectively act locally on the product substrate (20) in the loaded state, in particular to be able to effect a height offset of a partial area of ​​the product substrate (20) in the loaded state, wherein a layer system is provided for forming the fixing area (F), and wherein the layer system (30) or a part of the layer system provided for forming the layer system is realized, in particular structured, by forming microtechnical, in particular micro-electromechanical, components of the actuator means.

13. Method according to claim 12, wherein a second substrate (10), preferably with a second electrode layer (9), is connected to the actuator element (8), in particular by means of a metal bonding method, wherein in particular a first substrate (2) is connected to the actuator element (8) via a hybrid bonding method.

14. Device for handling a product substrate with a substrate holder according to any one of claims 1 to 14.

15. Method for handling a product substrate with a substrate holder (14) according to any one of claims 1 to 11, preferably comprising: - Capturing a situation parameter and / or - Determining a model, particularly preferably depending on the situation parameter, and - Modifying the substrate holder (14), in particular by means of the actuator element (8), based on the model.

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