Coil component and electronic device including same

Abstract

The present disclosure provides a coil component having a structure in which a manufacturing defect does not occur, and an electronic device including the coil component. A coil component (1) according to the present disclosure comprises: a housing (4) having a pair of main surfaces (40A, 40B) facing each other and four side surfaces (41, 42, 43, 44); and coil conductors (2, 3) disposed inside the housing (4). The coil conductor (2) includes a coil (2a) disposed inside the housing (4), and a lead wire (2b) and a lead wire (2d) connected to the coil (2a). The coil conductor (3) includes a coil (3a) disposed inside the housing (4), and a lead wire (3b) and a lead wire (3d) connected to the coil (3a). The height (H2) from the position at which the lead wires (2b, 2d) are drawn out from the housing (4) to the main surface (40B) is the same as the height (H3) from the position at which the lead wires (3b, 3d) are drawn out from the housing (4) to the main surface (40B).

Description

Coil components and electronic devices containing them

[0001] The present disclosure relates to a coil component and an electronic device including the same.

[0002] In electronic devices, noise suppression is often achieved by using a filter circuit, which may include a coil component. A known example of a coil component used in a filter circuit is one having a structure in which two coils formed by bending a metal plate are stacked vertically (see, for example, Japanese Patent Laid-Open Publication No. 2004-296630).

[0003] Japanese Patent Application Laid-Open No. 2004-296630

[0004] However, in the structure of the coil component described in JP 2004-296630 A (Patent Document 1), because multiple coils parallel to the main surface are stacked, the height at which the lead wire of one coil is drawn out from the side surface differs from the height at which the lead wire of another coil is drawn out from the side surface. Because the lead wires drawn out from the side surface differ in height for each coil, it is not possible to make the joints of the resin molding die parallel to the main surface, and manufacturing problems such as resin burrs occurring due to molding resin leaking from slight steps in the die are caused.

[0005] Therefore, an object of the present disclosure is to provide a coil component having a structure that does not cause manufacturing defects, and an electronic device that includes the coil component.

[0006] A coil component according to one embodiment of the present disclosure includes a housing having a pair of opposing first and second main surfaces and four side surfaces connecting the first and second main surfaces, and first and second coil conductors disposed within the housing. The first coil conductor includes a first coil disposed within the housing and first and second lead wires connected to the first coil. The second coil conductor includes a second coil disposed within the housing and third and fourth lead wires connected to the second coil. The height from the positions where the first and second lead wires are extended from the housing to the second main surface is the same as the height from the positions where the third and fourth lead wires are extended from the housing to the second main surface. At least one of the first and second coils has a height from the second main surface on the first side surface side that is different from a height from the second main surface on the second side surface opposite the first side surface. An opening of the first coil at least partially overlaps an opening of the second coil when viewed in plan from the first main surface side.

[0007] An electronic device according to an embodiment of the present disclosure includes the coil component described above.

[0008] According to one embodiment of the present disclosure, the height from the position where the first and second lead wires are pulled out from the housing to the second main surface is the same as the height from the position where the third and fourth lead wires are pulled out from the housing to the second main surface, so no manufacturing defects occur.

[0009] Fig. 1 is a perspective view of a coil component according to a first embodiment; Fig. 2 is a side view of the coil component according to the first embodiment; Fig. 3 is a diagram for explaining a coil component of a comparative example; Fig. 4 is a diagram for explaining an angle formed between a side surface and an opening surface of the coil; Fig. 5 is a diagram for explaining a bending point of the coil; Fig. 6 is a side view of a coil component according to a second embodiment; Fig. 7 is a side view of a coil component according to a third embodiment; Fig. 8 is a side view of a coil component according to a modified example;

[0010] Hereinafter, a coil component according to the present disclosure and an electronic device including the coil component will be described with reference to the drawings.

[0011] First Embodiment First, a coil component according to the first embodiment will be described with reference to the drawings. Fig. 1 is a perspective view of the coil component 1 according to the first embodiment. Fig. 2 is a side view of the coil component 1 according to the first embodiment. Note that with respect to the X-axis, Y-axis, and Z-axis defined in Fig. 1, the X-axis direction represents the front-rear direction of the coil component 1, the Y-axis direction represents the left-right direction of the coil component 1, and the Z-axis direction represents the up-down direction of the coil component 1, respectively. Also, with respect to the X-axis, Y-axis, and Z-axis defined in Fig. 2, the X-axis direction represents the depth direction of the coil component 1, the Y-axis direction represents the left-right direction of the coil component 1, and the Z-axis direction represents the up-down direction of the coil component 1, respectively.

[0012] The coil component 1 is, for example, a transformer coil mounted in a filter circuit used to reduce noise in a power line, and is used in electronic devices such as power supply devices. The coil component 1 is not limited to power supply devices, and may be used in electronic devices other than power supply devices.

[0013] The coil component 1 includes a housing 4, a coil conductor 2 (first coil conductor), and a coil conductor 3 (second coil conductor). The coil conductor 2 includes a coil 2a (first coil) disposed inside the housing 4, and a lead wire 2b (first lead wire) and a lead wire 2d (second lead wire) connected to the coil 2a. Specifically, the coil 2a has one end connected to the lead wire 2b and the other end connected to the lead wire 2d. The coil 2a and the lead wires 2b and 2d are formed from a single coil conductor 2, which is formed from a metal plate or metal wire made of, for example, copper or an alloy of copper and another metal. Furthermore, the coil conductor 2 may be subjected to a surface treatment such as Ni-Sn plating or gold plating. When the coil conductor 2 is formed from a metal plate, the thickness of the metal plate is, for example, 0.08 mm to 0.6 mm.

[0014] The coil conductor 3 includes a coil 3a (second coil) disposed inside the housing 4, and a lead wire 3b (third lead wire) and a lead wire 3d (fourth lead wire) connected to the coil 3a. Specifically, the coil 3a has the lead wire 3b connected to one end and the lead wire 3d connected to the other end. The coil 3a and the lead wires 3b and 3d are formed from a single coil conductor 3, which is formed from a metal plate or metal wire made of, for example, copper or an alloy of copper and other metals. Furthermore, the coil conductor 3 may be subjected to a surface treatment such as Ni-Sn plating or gold plating. When the coil conductor 3 is formed from a metal plate, the thickness of the metal plate is, for example, 0.08 mm to 0.6 mm.

[0015] When coil 2a and coil 3a are configured as a transformer coil, simply placing coil 3a above coil 2a results in a coil component similar to that of the comparative example. Figure 3 is a diagram illustrating coil component 1Z of the comparative example. In coil component 1Z, as shown in Figure 3(a), coil 2a is placed inside housing 4 substantially parallel to main surface 40A (first main surface), and coil 3a is placed inside housing 4 above coil 2a substantially parallel to main surface 40A. Therefore, height H2 from the position where lead wires 2b and 2d are drawn out from side surface 41 of housing 4 to main surface 40B (second main surface) is different from height H3 from the position where lead wires 3b and 3d are drawn out from side surface 42 of housing 4 to main surface 40B.

[0016] Because the height H2 of the coil 2a is different from the height H3 of the coil 3a, the resin molding die has a shape like the dies 401 and 402 shown in FIG. 3(b), and the joint between the dies 401 and 402 cannot be parallel to the main surface 40A of the housing 4. Therefore, when the dies 401 and 402 are filled with molding resin, manufacturing defects occur, such as the molding resin leaking from the slight step at the joint between the dies 401 and 402 and the generation of resin burrs. Furthermore, manufacturing the dies 401 and 402 having the shape shown in FIG. 3(b) is more difficult than a die whose joint is parallel to the main surface 40A of the housing 4, and manufacturing costs are higher.

[0017] Therefore, in the coil component 1 according to this embodiment, the height H2 of the coil 2a and the height H3 of the coil 3a are made the same, and at least one of the coils 2a and 3a is arranged at an angle inside the housing 4 so that the coils 2a and 3a do not interfere with each other inside the housing 4.

[0018] 2, when the coil component 1 is mounted on a substrate 10 as shown in Fig. 2, the lengths of the lead wires 2b, 2d, 3b, and 3d that form the legs of the coil component 1 are the same. By making the lengths of the lead wires 2b, 2d, 3b, and 3d that form the legs of the coil component 1 the same, the moments of force applied to the lead wires 2b, 2d, 3b, and 3d are also uniform, and the fixing strength of the coil component 1 to the substrate 10 is improved.

[0019] The coil 2a has a rectangular opening and is disposed inside the housing 4 at an angle with respect to the main surface 40A (first main surface). The lead wires 2b and 2d are drawn out from the side surface 41 of the housing 4 and extend along the side surface 41 toward the main surface 40B. The lead wire 2b shown in FIG. 1 is extended to the main surface 40B, and the portion that contacts the main surface 40B constitutes the end 2c. The lead wire 2d is also extended to the main surface 40B, and the portion that contacts the main surface 40B constitutes the end 2e. When the coil component 1 is mounted on the substrate 10 as shown in FIG. 2, the ends 2c and 2e are electrically connected to wiring on the substrate by, for example, solder 11.

[0020] The coil 2a has a height H2 from the main surface 40B on the side surface 41 side different from a height H4 from the main surface 40B on the side surface 42 side opposite the side surface 41, the height H4 being lower than the height H2. In other words, the coil 2a is inclined in a direction approaching the main surface 40B from the side surface 41 side toward the side surface 42 side.

[0021] Coil 3a has a rectangular opening and is disposed above coil 2a inside housing 4, inclined relative to main surface 40A. Lead wires 3b and 3d are drawn out from side surface 42 of housing 4 and extend along side surface 42 toward main surface 40B. Lead wire 3b shown in FIG. 1 extends to main surface 40B, with the portion that contacts main surface 40B constituting end 3c. Lead wire 3d also extends to main surface 40B, with the portion that contacts main surface 40B constituting end 3e. When coil component 1 is mounted on a substrate as shown in FIG. 2, ends 3c and 3e are electrically connected to wiring on the substrate, for example, by solder 11.

[0022] The coil 3a has a height H3 from the main surface 40B on the side surface 42 side different from a height H5 from the main surface 40B on the side surface 41 side, with the height H5 being higher than the height H3. In other words, the coil 3a is inclined in a direction approaching the main surface 40A from the side surface 42 side toward the side surface 41 side.

[0023] The inclination of the coil can also be defined by the angle formed between the side surface and the opening surface of the coil. FIG. 4 is a diagram illustrating the angle formed between the side surface and the opening surface of the coil. As shown in FIG. 4, the opening surface S2 of the coil 2a is bent relative to the side surface 41 so that the angle R1 formed between the side surface 41 and the opening surface S2 of the coil 2a is an acute angle. Similarly, the opening surface S3 of the coil 3a is bent relative to the side surface 42 so that the angle R2 formed between the side surface 42 and the opening surface S3 of the coil 3a is an obtuse angle. Note that the lead wires 2b and 2d are drawn from the position where the plane S1 parallel to the main surface 40A intersects with the side surface 41, and the lead wires 3b and 3d are drawn from the position where the plane S1 intersects with the side surface 42. Therefore, the height from the position where lead wires 2b and 2d are drawn out from the housing 4 to the main surface 40B is the same as the height from the position where lead wires 3b and 3d are drawn out from the housing 4 to the main surface 40B.

[0024] By making the angle R3 between the opening surface S2 of the coil 2a and the surface S1 the same as the angle R4 between the opening surface S3 of the coil 3a and the surface S1, the openings of the coil 2a and the openings of the coil 3a become parallel to each other. Note that in the coil component 1 shown in FIG. 4, for example, angle R3 = angle R4 = approximately 8 degrees.

[0025] Next, we will explain the bending locations where the openings of the coils are bent to tilt the coils. FIG. 5 is a diagram illustrating the bending locations of the coils. As shown in FIG. 5, the coil 2a is bent toward the main surface 40B at bending location M2 at the connection between the coil 2a and the lead wires 2b and 2d. The coil 3a is bent toward the main surface 40A at bending location M3 at the connection between the coil 3a and the lead wires 3b and 3d. The coil component 1 is easy to manufacture because the coils 2a and 3a each have a single bending location. It is particularly difficult to increase the number of bending locations when the metal plate is thick. Furthermore, the coils 2a and 3a of the coil component 1 are inclined so that the openings S2 and S3 of the coils 2a and 3a are parallel to each other. When the openings S2 and S3 of the coils 2a and 3a are parallel to each other, the mutual inductance between the coils 2a and 3a is maximized.

[0026] 1 and 2, coil 3a is disposed above coil 2a. That is, coil 2a is disposed closer to main surface 40B than coil 3a. However, the arrangement of coil 3a and coil 2a is not limited to this arrangement, and coil 3a may be disposed below coil 2a. In such an arrangement, height H4 is higher than height H2, and coil 2a is inclined in a direction approaching main surface 40A from side surface 41 toward side surface 42, while height H5 is lower than height H3, and coil 3a is inclined in a direction approaching main surface 40B from side surface 42 toward side surface 41.

[0027] 5 , when the coils 2a and 3a are tilted so that the opening plane S2 of the coil 2a and the opening plane S3 of the coil 3a are parallel, the opening of the coil 2a overlaps with the opening of the coil 3a when viewed in a plan view from the main surface 40A. Therefore, the coils 2a and 3a are magnetically coupled. Note that the opening plane S2 of the coil 2a and the opening plane S3 of the coil 3a do not need to be parallel in the coil component 1; it is sufficient that the opening of the coil 2a at least partially overlaps with the opening of the coil 3a when viewed in a plan view from the main surface 40A.

[0028] As described above, the coil component 1 includes a housing 4 having a pair of opposing main surfaces 40A and 40B and four side surfaces 41, 42, 43, and 44 connecting the main surfaces 40A and 40B, and a coil conductor 2 and a coil conductor 3 disposed inside the housing 4. The coil conductor 2 includes a coil 2a disposed inside the housing 4 and lead wires 2b and 2d connected to the coil 2a. The coil conductor 3 includes a coil 3a disposed inside the housing 4 and lead wires 3b and 3d connected to the coil 3a. A height H2 from the position where the lead wires 2b and 2d are drawn out of the housing 4 to the main surface 40B is the same as a height H3 from the position where the lead wires 3b and 3d are drawn out of the housing 4 to the main surface 40B. At least one of the coils 2a and 3a has a height from the main surface 40B on the side surface 41 side that is opposite the side surface 41 and a height from the main surface 40B on the side surface 42 side that faces the side surface 41 that is different from the height from the main surface 40B. The opening of coil 2a at least partially overlaps with the opening of coil 3a when viewed in plan from the main surface 40A side.

[0029] In the coil component 1, the height H2 from the position where the lead wires 2b and 2d are drawn out of the housing 4 to the main surface 40B is the same as the height H3 from the position where the lead wires 3b and 3d are drawn out of the housing 4 to the main surface 40B, so manufacturing defects such as the leakage of molding resin from a slight step at the joint of the resin molding die and the generation of resin burrs do not occur.

[0030] <Embodiment 2> In the coil component 1 according to embodiment 1, the coil has been described as having one bent portion, but the coil may have multiple bent portions. Fig. 6 is a side view of a coil component 1A according to embodiment 2. Note that in the coil component 1A shown in Fig. 6, the same components as those in the coil component 1 shown in Figs. 1 and 2 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0031] Coil 3a has a rectangular opening and is disposed inside housing 4 parallel to main surface 40A. In coil component 1A, height H2 from the position where lead wires 2b and 2d are drawn out from side surface 41 of housing 4 to main surface 40B is the same as height H3 from the position where lead wires 3b and 3d are drawn out from side surface 42 of housing 4 to main surface 40B. Therefore, coil 2a needs to be disposed inside housing 4 parallel to main surface 40A, avoiding coil 3a, so as not to interfere with coil 3a inside housing 4.

[0032] 6, coil 2a is provided with two bending points M1 and M2 at the connection portions between coil 2a and lead wires 2b and 2d, and is disposed below coil 3a inside housing 4. Coil 2a has a rectangular opening and is disposed inside housing 4 parallel to main surface 40A, so that the opening plane of coil 2a and the opening plane of coil 3a are disposed parallel to each other.

[0033] In coil component 1A, coil 2a is arranged to avoid coil 3a so as not to interfere with coil 3a inside housing 4, but coil 3a may be bent at two locations so that coil 3a can be arranged inside housing 4 to avoid coil 2a. Also, both coil 2a and coil 3a may be bent at two locations. Furthermore, the number of bent locations provided in coil 2a and coil 3a is not limited to two, and may be three or more.

[0034] <Embodiment 3> In the coil component 1 according to embodiment 1, it has been described that one bending portion is provided in the coil to tilt the coil. In embodiment 3, a configuration for adjusting the position of the bending portion will be described. Fig. 7 is a side view of a coil component 1B according to embodiment 3. Note that in the coil component 1B shown in Fig. 7, the same components as those in the coil component 1 shown in Figs. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0035] The upper coil component 1B shown in Fig. 7 has a configuration in which the bending point M2 of the coil 2a is located on the coil 2a side, and the bending point M3 of the coil 3a is located on the coil 3a side. On the other hand, the lower coil component 1B shown in Fig. 7 has a configuration in which the bending point M2 of the coil 2a is located on the lead-out wire 2b side, and the bending point M3 of the coil 3a is located on the lead-out wire 3b side. The bending points M2 and M3 of the upper and lower coil components 1B shown in Fig. 7 are shifted outward by a distance N1. This changes the distance between the opening of the coil 2a and the opening of the coil 3a from distance G1 to distance G2, thereby adjusting the mutual inductance between the coils 2a and 3a.

[0036] (Modification) The method of adjusting the mutual inductance between coil 2a and coil 3a is not limited to changing the positions of bent portions M2 and M3, but may also be changing the inclination angle of the coil. Fig. 8 is a side view of a coil component according to a modification. In coil component 1C shown in Fig. 8, the same components as those in coil component 1 shown in Figs. 1 and 2 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0037] 8, the inclination angle of the coil 2a is increased by further bending the coil 2a in a direction t that brings the coil 2a closer to the main surface 40B. When the inclination angle of the coil 2a is increased, the distance between the opening of the coil 2a and the opening of the coil 3a increases, thereby reducing the mutual inductance between the coils 2a and 3a. Conversely, when the coil 2a is bent in a direction that brings the coil 2a closer to the main surface 40A, the inclination angle of the coil 2a decreases, the distance between the opening of the coil 2a and the opening of the coil 3a decreases, and the mutual inductance between the coils 2a and 3a increases.

[0038] 8 shows an example in which the tilt angle of the coil 2a is changed, but the tilt angle of the coil 3a may also be changed.Furthermore, the tilt angles of the coils 2a and 3a may also be changed separately.

[0039] <Aspects> (1) A coil component according to the present disclosure includes: a housing having a pair of first and second main surfaces opposing each other and four side surfaces connecting the first and second main surfaces; and a first coil conductor and a second coil conductor arranged inside the housing, wherein the first coil conductor has a first coil arranged inside the housing and a first lead wire and a second lead wire connected to the first coil, and the second coil conductor has a second coil arranged inside the housing and a third lead wire and a fourth lead wire connected to the second coil, the height from the position where the first lead wire and the second lead wire are led out of the housing to the second main surface is the same as the height from the position where the third lead wire and the fourth lead wire are led out of the housing to the second main surface, and at least one of the first coil and the second coil has a height from the second main surface on the first side surface side that is different from a height from the second main surface on the second side surface opposite the first side surface, The opening of the first coil at least partially overlaps with the opening of the second coil when viewed in plan from the first main surface side.

[0040] (2) In the coil component according to (1), the first coil is disposed on the second principal surface side relative to the second coil.

[0041] (3) In the coil component according to (1) or (2), the opening surface of the first coil and the opening surface of the second coil are arranged in parallel.

[0042] (4) In the coil component according to any one of (1) to (3), at least one of the opening surface of the first coil and the opening surface of the second coil is disposed at an angle with respect to the first main surface.

[0043] (5) In the coil component described in any one of (1) to (4), the first coil is bent such that the opening surface of the first coil is bent relative to the first side surface so that the angle formed between the first side surface and the opening surface of the first coil is an acute angle.

[0044] (6) In the coil component described in any one of (1) to (5), the second coil is bent such that the angle formed between the second side surface and the opening surface of the second coil is an obtuse angle.

[0045] (7) In the coil component according to any one of (1) to (6), each of the first coil conductor and the second coil conductor is made of a metal plate or a metal wire, and the housing is made of molded resin.

[0046] (8) In the coil component according to any one of (1) to (7), the first coil and the second coil are arranged closer to the first principal surface than a middle position between the first principal surface and the second principal surface.

[0047] (9) In the coil component according to any one of (1) to (8), the first to fourth lead wires are provided to the second main surface.

[0048] (10) An electronic device comprising the coil component according to any one of (1) to (9). The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims.

[0049] 1, 1A to 1C coil components, 2, 3 coil conductors, 2a, 3a coils, 2b, 2d, 3b, 3d lead wires, 2c, 2e, 3c, 3e end portions, 4 housing, 10 substrate, 11 solder, 40A, 40B main surfaces, 41, 42, 43, 44 side surfaces.

Claims

1. A housing having a pair of first and second main surfaces opposing each other and four side surfaces connecting the first and second main surfaces; and a first coil conductor and a second coil conductor arranged inside the housing, wherein the first coil conductor has a first coil arranged inside the housing and a first lead wire and a second lead wire connected to the first coil, and the second coil conductor has a second coil arranged inside the housing and a third lead wire and a fourth lead wire connected to the second coil, the height from the position where the first lead wire and the second lead wire are led out of the housing to the second main surface is the same as the height from the position where the third lead wire and the fourth lead wire are led out of the housing to the second main surface, and at least one of the first coil and the second coil has a height from the second main surface on a first side surface side that is different from a height from the second main surface on a second side surface opposite the first side surface, The opening of the first coil at least partially overlaps with the opening of the second coil when viewed in plan from the first main surface side.

2. The coil component according to claim 1, wherein the first coil is disposed on the second main surface side relative to the second coil.

3. A coil component according to claim 1 or 2, wherein the opening surface of the first coil and the opening surface of the second coil are arranged parallel to each other.

4. A coil component according to any one of claims 1 to 3, wherein at least one of the opening surface of the first coil and the opening surface of the second coil is arranged at an angle with respect to the first main surface.

5. A coil component according to any one of claims 1 to 4, wherein the opening surface of the first coil is bent relative to the first side surface so that the angle formed between the first side surface and the opening surface of the first coil is an acute angle.

6. A coil component according to any one of claims 1 to 5, wherein the opening surface of the second coil is bent relative to the second side surface so that the angle formed between the second side surface and the opening surface of the second coil is an obtuse angle.

7. A coil component according to any one of claims 1 to 6, wherein the first coil conductor and the second coil conductor are each made of a metal plate or a metal wire, and the housing is made of molded resin.

8. A coil component according to any one of claims 1 to 7, wherein the first coil and the second coil are positioned closer to the first main surface than an intermediate position between the first main surface and the second main surface.

9. A coil component according to any one of claims 1 to 8, wherein the first to fourth lead wires are provided to the second main surface.

10. An electronic device comprising the coil component according to any one of claims 1 to 9.

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