Loudspeaker module

Abstract

Provided in the present invention is a loudspeaker module, comprising a mounting bracket, a shock-absorbing structure arranged on the mounting bracket, and a loudspeaker assembly, wherein the loudspeaker assembly comprises a vibration system and a magnetic circuit system for driving the vibration system; the magnetic circuit system comprises an upper clamping plate arranged at the top of the shock-absorbing structure and an anti-overflow layer arranged on the upper clamping plate; the upper clamping plate comprises a first main body, a first hole structure arranged at the center of the first main body, and an upward-protruding first platform arranged along an edge area of the first hole structure; and the anti-overflow layer is arranged in the circumferential direction of the first platform on the surface of the first main body, the anti-overflow layer being used for preventing internal overflow of raw materials from the shock-absorbing structure during molding. The loudspeaker module of the present invention comprises an anti-overflow layer, such that during molding of the shock-absorbing structure, the anti-overflow layer prevents overflow of the raw materials from the shock-absorbing structure; in addition, to arrange the anti-overflow layer, there is no need to add extra parts, achieving simple implementation, high efficiency, and low production costs.

Description

A loudspeaker module TECHNICAL FIELD

[0001] The present application relates to the field of electroacoustics, in particular to a loudspeaker module. BACKGROUND

[0002] With the popularity of mobile electronic devices, mobile electronic devices gradually develop towards multi-functionality. Among them, high-quality music function has become one of the commonly used functions of mobile electronic devices, and the loudspeaker used for playing sound is widely used in mobile electronic devices. In the prior art, a damping structure is provided in the loudspeaker to improve the anti-shock effect of the loudspeaker, avoid damage to the loudspeaker when it is subjected to strong impact, and improve the reliability of the loudspeaker and the mobile electronic device. However, in the prior art, due to the multiple height tolerance accumulations of the magnetic circuit structure in the loudspeaker during the molding process, there is a gap between the magnetic circuit structure and the molding fixture that cannot be highly matched, thereby causing the damping material to overflow, reducing the vibration space of the voice coil, and ultimately affecting the performance of the loudspeaker.

[0003] Therefore, it is necessary to obtain a loudspeaker module that can prevent the damping raw material from overflowing during the molding process. TECHNICAL PROBLEM

[0004] The purpose of the present application is to provide a loudspeaker module that can prevent the damping raw material from overflowing during the molding process of the damping structure. TECHNICAL SOLUTION

[0005] The technical solution of the present application is as follows:

[0006] A loudspeaker module includes a mounting bracket, a damping structure provided on the mounting bracket, and a loudspeaker assembly; the loudspeaker assembly includes a vibration system and a magnetic circuit system for driving the vibration system to vibrate, the magnetic circuit system includes an upper clamping plate provided at the top of the damping structure and a anti-overflow layer provided on the upper clamping plate; the upper clamping plate includes a first main body, a first hole structure provided in the middle of the first main body, and a first platform protruding upward along the edge area of the first hole structure; the anti-overflow layer is provided on the surface of the first main body along the circumference of the first platform, and the anti-overflow layer is used to prevent the raw material of the damping structure from overflowing during the molding process.

[0007] Preferably, the damping structure is provided on the inner side of the mounting bracket; the mounting bracket includes a second main body and a first side plate provided vertically on the second main body along a first direction; the damping structure includes a third main body and a second side plate and a third side plate provided vertically on the edge area of the third main body along a first direction, respectively, the third main body is provided on the second main body, the second side plate is connected to the first side plate, and the third side plate is provided between the second side plate.

[0008] Preferably, the third side plate is arranged protruding from the first body plane, and the anti-overflow layer fills the region corresponding to the third side plate between the outer wall of the first platform and the inner wall of the third side plate.

[0009] Preferably, the second side plate is provided with a connecting structure connected with the first side plate, and the first side plate is provided with a matching structure matched with the connecting structure; the second body is in a ring structure, the middle part of the second body is provided with a second hole structure, the second hole structure is provided with a mounting groove, and the third body is connected to the mounting groove.

[0010] Preferably, the magnetic circuit system further comprises a lower clamping plate arranged on the third body, an inner magnetic steel arranged on the region corresponding to the first hole structure of the lower clamping plate, an edge magnetic steel arranged between the first body and the lower clamping plate, an outer magnetic steel arranged above the inner magnetic steel, and a pole core clamped between the outer magnetic steel and the inner magnetic steel; the outer magnetic steel is arranged protruding from the first hole structure; the edge magnetic steel is arranged along the circumference of the inner magnetic steel, and a gap is arranged between the inner magnetic steel and the first hole structure.

[0011] Preferably, the vibration system comprises an inner diaphragm arranged above the outer magnetic steel, a skeleton arranged at the outer periphery of the inner diaphragm, an upper diaphragm arranged at the outer periphery of the skeleton, a voice coil suspended in the gap, and a lower diaphragm arranged outside the third side plate.

[0012] Preferably, the loudspeaker module further comprises a flexible circuit board arranged on the lower diaphragm and in communication with the voice coil; the skeleton is connected to the flexible circuit board to support the vibration system on the flexible circuit board, and the lower diaphragm is recessed from top to bottom.

[0013] Preferably, the skeleton comprises a fourth body connected between the inner diaphragm and the upper diaphragm, and a fourth side plate arranged perpendicularly on the side corresponding to the fourth body and the flexible circuit board, and the fourth side plate is connected to the inner side of the flexible circuit board; the upper diaphragm comprises a fifth body connected with the skeleton, and a fifth side plate arranged perpendicularly on the side corresponding to the fifth body and the flexible circuit board, and the fifth side plate is connected to the outer side of the flexible circuit board.

[0014] Preferably, a connecting lug is arranged on the side corresponding to the second side plate of the first body, and a groove matched with the connecting lug is arranged on the top of the second side plate.

[0015] Preferably, the shock-absorbing structure is a flexible shock-absorbing structure, and the anti-overflow layer is a flexible glue layer. Advantages

[0016] The advantages of the present application are that:

[0017] The loudspeaker module provided by the application sets the anti-overflow layer on the first body, and the anti-overflow layer fills the gap between the forming jig and the upper clamping plate during the forming process of the damping structure, thereby preventing the overflow of the damping structure raw material, ensuring the vibration space of the voice coil in the loudspeaker module, and ensuring the use performance of the loudspeaker. In addition, the setting of the anti-overflow layer does not need to increase additional parts, and the implementation method is simple, efficient and low in production cost. BRIEF DESCRIPTION OF DRAWINGS

[0018] Fig. 1 is a structural schematic diagram of the loudspeaker module of the application;

[0019] Fig. 2 is a sectional schematic diagram of the loudspeaker module of the application along the A-A direction;

[0020] Fig. 3 is a sectional schematic diagram of the loudspeaker module of the application along the B-B direction;

[0021] Fig. 4 is an exploded view of the loudspeaker module of the application;

[0022] Fig. 5 is an assembly schematic diagram of the upper clamping plate, the anti-overflow layer and the damping structure;

[0023] Fig. 6 is a sectional schematic diagram of the assembly schematic diagram of Fig. 5 along the C-C direction;

[0024] Fig. 7 is a sectional schematic diagram of the assembly schematic diagram of Fig. 5 along the D-D direction. Embodiment of the application

[0025] The application will be further described below in combination with the drawings and embodiments.

[0026] Embodiment 1: The application provides a loudspeaker module, as shown in Figs. 1 to 4, which comprises a mounting bracket 1, a damping structure 2 arranged on the mounting bracket 1, and a loudspeaker assembly; the loudspeaker assembly comprises a vibration system 31 and a magnetic circuit system 32 for driving the vibration of the vibration system 31, the magnetic circuit system 32 comprises an upper clamping plate 321 arranged on the top of the damping structure 2 and an anti-overflow layer 322 arranged on the upper clamping plate 321; the upper clamping plate 321 comprises a first body 3211, a first hole structure 3212 arranged in the middle of the first body 3211, and a first platform 3214 protruding upward along the edge area of the first hole structure 3212; the anti-overflow layer 322 is arranged on the surface of the first body 3211 along the circumference of the first platform 3214, and the anti-overflow layer 322 is used to prevent the overflow of the damping structure 2 raw material during the forming process.

[0027] The upper surface of the first body 3211 of the application is provided with an anti-overflow layer 322, which fills the gap between the forming jig and the upper clamping plate 321 during the forming process of the damping structure 2, blocks the overflow of the damping structure 2 material during the forming process, ensures the vibration space of the loudspeaker assembly, and ensures the use performance of the loudspeaker. In addition, the setting of the anti-overflow layer 322 does not need to increase additional parts, and the method is simple, efficient and low in production cost. In the application, the first direction z is a direction parallel to the vibration direction.

[0028] The damping structure 2 is arranged on the inner side of the mounting bracket 1; the mounting bracket 1 comprises a second body 11 and a first side plate 12 vertically arranged on the second body 11 along the first direction z; the damping structure 2 comprises a third body 21 and a second side plate 22 and a third side plate 23 vertically arranged on the edge region of the third body 21 along the first direction z, respectively, the third body 21 is arranged on the second body 11, the second side plate 22 is connected to the first side plate 12, and the third side plate 23 is arranged between the second side plate 22. The top surface of the second side plate 22 is flush with the plane of the first body 3211. The damping structure 2 buffers the impact force when the loudspeaker module is impacted, so as to prevent the loudspeaker assembly from being affected by the impact to affect the sound quality or damage the components.

[0029] Referring to FIGS. 2 and 5, the third side plate 23 is arranged protruding from the plane of the first body 3211, and the anti-overflow layer 322 is filled between the outer wall of the first platform 3214 and the inner wall of the third side plate 23. In this embodiment, there is a height difference between the second side plate 22 and the third side plate 23 and the shape structure of the first body 3211, and the setting of the anti-overflow layer 322 prevents the material of the damping structure 2 from overflowing to the loudspeaker assembly during the forming process of the loudspeaker, ensuring the forming quality of the loudspeaker, and ensuring the damping effect of the damping structure 2 and the use performance of the loudspeaker.

[0030] Further, the second side plate 22 is provided with a connecting structure 221 connected with the first side plate 12, and the first side plate 12 is provided with a matching structure 121 matched with the connecting structure 221. Specifically, in some embodiments, the connecting structure 221 is a protruding structure provided on the outer wall of the second side plate 22, and the matching structure 121 is a groove provided on the first side plate 12 and matched with the protruding structure, and the protruding structure is embedded in the groove. Through the matched connection between the connecting structure 221 and the matching structure 121, the connection strength between the second side plate 22 and the first side plate 12 is improved. The second main body 11 is in a ring structure, and the middle part of the second main body 11 is provided with a second hole structure 111, the second hole structure 111 is provided with a first mounting groove 112, and the third main body 21 is connected to the first mounting groove 112.

[0031] Referring to FIGS. 2-7, the magnetic circuit system 32 further includes a lower clamping plate 323 provided on the third main body 21, an inner magnetic steel 324 provided on the corresponding area of the lower clamping plate 323 and the first hole structure 3212, an edge magnetic steel 325 provided between the first main body 3211 and the lower clamping plate 323, an outer magnetic steel 326 provided above the inner magnetic steel 324, and a pole core 327 clamped between the outer magnetic steel 326 and the inner magnetic steel 324; the outer magnetic steel 326 is provided protruding from the first hole structure 3212; the edge magnetic steel 325 is provided along the circumference of the inner magnetic steel 324, and a gap is provided between the inner magnetic steel 324 and the first hole structure 3212.

[0032] The vibration system 31 includes an inner diaphragm 311 provided above the outer magnetic steel 326, a skeleton 312 provided on the outer periphery of the inner diaphragm 311, an upper diaphragm 313 provided on the outer periphery of the skeleton 312, a voice coil 314 suspended in the gap, and a lower diaphragm 315 provided on the outer side of the third side plate 23.

[0033] The loudspeaker module further includes a flexible circuit board 4 provided on the lower diaphragm 315 and in conductive communication with the voice coil 314; the skeleton 312 is connected to the flexible circuit board 4 to support the vibration system 31 on the flexible circuit board 4, and the lower diaphragm 315 is recessed from top to bottom. The lower means the direction close to the lower clamping plate 323 along the first direction z, and the upper means the direction away from the lower clamping plate 323 along the first direction z.

[0034] The skeleton 312 comprises a fourth main body 3121 connected between the inner vibrating diaphragm 311 and the upper vibrating diaphragm 313, and a fourth side plate 3122 vertically arranged on the side corresponding to the flexible circuit board 4 of the fourth main body 3121, and the fourth side plate 3122 is connected to the inner side of the flexible circuit board 4; the upper vibrating diaphragm 313 comprises a fifth main body 3131 connected with the skeleton 312, and a fifth side plate 3132 vertically arranged on the side corresponding to the flexible circuit board 4 of the fifth main body 3131, and the fifth side plate 3132 is connected to the outer side of the flexible circuit board 4. It should be noted that the inner refers to the direction close to the central axis of the first hole structure 3212, and the outer refers to the direction away from the central axis of the first hole structure 3212.

[0035] Further, the first main body 3211 is provided with a connecting lug 3213 on the side corresponding to the second side plate 22, and the top of the second side plate 22 is provided with a second mounting groove 222 for arranging the connecting lug 3213. The connecting lug 3213 is embedded in the second mounting groove 222.

[0036] As a preferred, the damping structure 2 is a flexible damping structure; the anti-overflow layer 322 is a flexible glue layer. Specifically, the damping structure 2 is made of rubber material.

[0037] The above only describes the embodiments of the present application, and it should be pointed out that for those skilled in the art, without departing from the inventive concept, improvements can be made, but these all belong to the protection scope of the present application.

Claims

1. A speaker module, characterized by The loudspeaker module comprises a mounting bracket, a damping structure arranged on the mounting bracket, and a loudspeaker assembly; the loudspeaker assembly comprises a vibration system and a magnetic circuit system for driving the vibration system to vibrate; the magnetic circuit system comprises an upper clamping plate arranged on the top of the damping structure and an anti-overflow layer arranged on the upper clamping plate; the upper clamping plate comprises a first main body, a first hole structure arranged in the middle of the first main body, and a first platform protruding upward along the edge area of the first hole structure; the anti-overflow layer is arranged on the surface of the first main body along the circumference of the first platform, and is used to prevent the overflow of raw materials of the damping structure during the molding process.

2. The speaker module of claim 1, wherein: The damping structure is arranged on the inner side of the mounting bracket; the mounting bracket comprises a second main body and a first side plate arranged vertically on the second main body along a first direction; the damping structure comprises a third main body and a second side plate and a third side plate arranged vertically on the edge area of the third main body along a first direction respectively, the third main body is arranged on the second main body, the second side plate is connected to the first side plate, and the third side plate is arranged between the second side plate.

3. The speaker module of claim 2, wherein: The third side plate protrudes from the plane of the first main body, and the area corresponding to the third side plate of the anti-overflow layer is filled between the outer wall of the first platform and the inner wall of the third side plate.

4. The speaker module of claim 2, wherein: The second side plate is provided with a connecting structure connected to the first side plate, and the first side plate is provided with a matching structure matched with the connecting structure; the second main body is in a ring structure, the middle of the second main body is provided with a second hole structure, the second hole structure is provided with a mounting groove, and the third main body is connected to the mounting groove.

5. The speaker module of claim 2, wherein: The magnetic circuit system further comprises a lower clamping plate arranged on the third main body, an inner magnetic steel arranged on the corresponding area of the lower clamping plate and the first hole structure, an edge magnetic steel arranged between the first main body and the lower clamping plate, an outer magnetic steel arranged above the inner magnetic steel, and a pole core arranged between the outer magnetic steel and the inner magnetic steel; the outer magnetic steel protrudes from the first hole structure; the edge magnetic steel is arranged along the circumference of the inner magnetic steel, and a gap is arranged between the inner magnetic steel and the first hole structure.

6. The speaker module of claim 5, wherein: The vibration system comprises an inner diaphragm arranged above the outer magnetic steel, a skeleton arranged on the outer circumference of the inner diaphragm, an upper diaphragm arranged on the outer circumference of the skeleton, a voice coil suspended in the gap, and a lower diaphragm arranged outside the third side plate.

7. The speaker module of claim 6, wherein: The loudspeaker module further comprises a flexible circuit board arranged on the lower diaphragm and in communication with the voice coil; the skeleton is connected to the flexible circuit board to support the vibration system on the flexible circuit board, and the lower diaphragm is recessed from top to bottom.

8. The speaker module of claim 7, wherein: The skeleton comprises a fourth main body connected between the inner diaphragm and the upper diaphragm, and a fourth side plate arranged vertically on the corresponding side of the fourth main body and the flexible circuit board, and the fourth side plate is connected to the inner side of the flexible circuit board; the upper diaphragm comprises a fifth main body connected with the skeleton, and a fifth side plate arranged vertically on the corresponding side of the fifth main body and the flexible circuit board, and the fifth side plate is connected to the outer side of the flexible circuit board.

9. The speaker module of claim 2, wherein: The first body is provided with a connecting lug on the side corresponding to the second side plate, and the top of the second side plate is provided with a groove matched with the connecting lug.

10. The speaker module of claim 1, wherein: The shock-absorbing structure is a flexible shock-absorbing structure, and the anti-overflow layer is a flexible glue layer.

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