Machining device and method for wafer-level arrayed optical element and mold

Abstract

A machining device for a wafer-level arrayed optical element and mold, the device comprising a machine-tool base (100), a workpiece fixing module (20) and a tool fixing module (300), wherein the workpiece fixing module (200) comprises a moving assembly connected to the machine-tool base (100) and a workpiece spindle (210) connected to the moving assembly; the moving assembly and the workpiece spindle (210) respectively drive a workpiece (400) to be machined to move along an X-axis and a Y-axis and to rotate about the axis of the workpiece spindle (210); a moving rotary assembly (350) drives a machining tool (330) to rotate in the horizontal plane, to move along a Z-axis, and to rotate about a B-axis turntable (351); and a tool spindle (310) and a sliding assembly (320) respectively drive the machining tool (330) to rotate about the axis of the tool spindle (310) and to move radially within the plane of rotation. The device improves machining efficiency, has improved machining precision and improves the stability of surface machining quality. Further provided is a machining method for a wafer-level arrayed optical element and mold.

Description

A processing equipment and method for wafer-level arrayed optical elements and molds TECHNICAL FIELD

[0001] The present application relates to the field of arrayed optical element ultra-precision machining technology, in particular to a processing equipment and method for wafer-level arrayed optical elements and molds. BACKGROUND

[0002] Ultra-precision machining technology is an important field in mechanical manufacturing, and has an important influence on the development of cutting-edge technology and national defense technology. Optical element ultra-precision machining technology is a very important branch of it.

[0003] With the development and application of ultra-precision machining technology, the traditional optical processing method has been broken through, and the optical surface can be directly machined to sub-micron level surface shape precision and nanometer level surface roughness. The existing ultra-precision machining technology is mainly based on ultra-precision single-point diamond lathe in the application of optical element machining industry.

[0004] With the rapid development of the optical industry, the optical surface design is becoming more and more complex, which can be randomly combined by asymmetric, irregular and complex free-form surfaces, thereby putting forward higher requirements for machining. However, the existing technology has the problems of low efficiency, unstable machining precision and surface quality.

[0005] SUMMARY

[0006] Therefore, the technical problem to be solved by the present application is to overcome the above-mentioned problems existing in the prior art.

[0007] To solve the above technical problems, on the one hand, the present application provides a processing equipment for wafer-level arrayed optical elements and molds, comprising:

[0008] Machine tool base;

[0009] Workpiece fixing module, comprising a moving assembly connected to the machine tool base and a workpiece spindle connected to the moving assembly; the axis of the workpiece spindle is parallel to the Z axis; the moving assembly and the workpiece spindle are respectively configured to drive the workpiece to move along the X axis and the Y axis and rotate along the axis of the workpiece spindle, so as to change the different units of the workpiece array of the workpiece; the X axis, the Y axis and the Z axis constitute a three-dimensional coordinate system;

[0010] The tool fixing module comprises a moving and rotating assembly connected to a machine tool base, a tool spindle connected to the moving and rotating assembly, and a sliding assembly and a machining tool connected to an end of the tool spindle; the machining tool is connected to the sliding assembly; the moving and rotating assembly is configured to drive the machining tool to rotate in a B-axis horizontal plane and move along a Z-axis; the tool spindle and the sliding assembly are respectively configured to drive the machining tool to rotate along an axis of the tool spindle and move along a radial direction of a plane in which the machining tool rotates, so as to realize a variable-diameter rotating motion of the machining tool.

[0011] In an embodiment of the present application, the tool fixing module further comprises a rotating disc, the rotating disc is coaxially connected to the tool spindle, and the machining tool is connected to the rotating disc through the sliding assembly.

[0012] In an embodiment of the present application, the sliding assembly comprises a driving part, a sliding block, and a guide rail; the driving part and the guide rail are connected to the end of the tool spindle; an output end of the driving part is connected to the sliding block, the sliding block is slidingly connected to the guide rail; the machining tool is connected to the sliding block; and the driving part is configured to drive the sliding block and the machining tool to slide.

[0013] In an embodiment of the present application, the tool fixing module further comprises a centrifugal force balancing mechanism connected to the rotating disc; along a radial direction of the rotating disc, the centrifugal force balancing mechanism and the sliding assembly are respectively located on two sides of an axis of the tool spindle, and the centrifugal force balancing mechanism is used to offset centrifugal force generated by eccentric rotation of the sliding assembly and the machining tool.

[0014] In an embodiment of the present application, the tool fixing module further comprises a dynamic balancing mechanism connected to the rotating disc; on the rotating disc, the dynamic balancing mechanism moves synchronously and in an opposite direction with the sliding block.

[0015] In an embodiment of the present application, the tool fixing module further comprises a grating ruler, a ruler body of the grating ruler is connected to one side of the sliding block, and a reading head of the grating ruler is connected to the rotating disc.

[0016] In an embodiment of the present application, the sliding assembly further comprises a sliding ring connected to the rotating disc.

[0017] In an embodiment of the present application, the moving and rotating assembly comprises a B-axis rotary table and a Z-axis moving part sliding along a Z-axis; the B-axis rotary table is connected to the Z-axis moving part, and the Z-axis moving part is connected to the machine tool base through a guide rail.

[0018] In an embodiment of the present application, the workpiece fixing module further comprises a connecting assembly connected to an end of the workpiece spindle, and the connecting assembly is configured to connect the workpiece to be machined to an end surface of the workpiece spindle.

[0019] In one embodiment of the present application, the moving assembly comprises an X-axis moving part and a Y-axis moving part, the X-axis moving part is connected to the machine tool base through a guide rail, and the Y-axis moving part is connected to the table top of the X-axis moving part through a guide rail.

[0020] In another aspect, the present application provides a processing method for wafer-level array optical elements and molds, which is processed by the processing equipment for wafer-level array optical elements and molds in any of the above embodiments, and the steps include:

[0021] The workpiece is installed on the vacuum chuck at the end of the workpiece spindle, and is adjusted to the preliminary alignment of the workpiece spindle and the tool spindle by the moving assembly;

[0022] The processing tool is installed on the sliding assembly;

[0023] The moving and rotating assembly is adjusted to correct the initial relative angle between the processing tool and the processing plane of the workpiece, and the processing tool is moved to the processing plane of the workpiece;

[0024] The center of rotation of the workpiece is adjusted to coincide with the center of rotation of the tool spindle by the moving assembly;

[0025] The workpiece rotates with the workpiece spindle and feeds under the drive of the X-axis moving part, and the processing tool moves in the Z-axis direction under the drive of the moving and rotating assembly, so as to complete the turning processing of the wafer surface plane;

[0026] The moving assembly moves the center of the first array unit of the workpiece to a position coinciding with the center of rotation of the tool spindle;

[0027] The rotation speed of the tool spindle and the feed speed of the sliding assembly are set;

[0028] The tool spindle, the sliding assembly and the Z-axis moving part work to complete the processing of a single optical unit on the wafer.

[0029] The above technical solutions of the present application have the following advantages compared with the prior art:

[0030] The processing equipment and method for wafer-level array optical elements and molds can process the workpiece by high-speed rotation of the processing tool, which can improve the processing efficiency of wafer-level and array optical elements and molds and reduce the manufacturing cost; during the processing, the workpiece rotation and the linkage of X and Y axes are avoided, so as to avoid inertial impact, ensure the processing precision and improve the stability of the processing surface quality; in addition, the equipment and method can also be used for efficient and low-cost ultra-precision processing of curved surface array optical elements and molds. BRIEF DESCRIPTION OF DRAWINGS

[0031] For the purpose of making the content of the present application more easily understood, the present application will be further described in detail below according to the specific embodiments of the present application and in conjunction with the accompanying drawings, in which

[0032] Fig. 1 is a three-dimensional schematic view of a processing equipment for wafer-level arrayed optical elements and molds in a preferred embodiment of the present application;

[0033] Fig. 2 is a front view of Fig. 1;

[0034] Fig. 3 is a schematic view of the structure of a tool fixing module in Fig. 1;

[0035] Fig. 4 is a schematic view of the structure of wafer-level arrayed optical elements and molds of the processed piece in Fig. 1;

[0036] Fig. 5 is a schematic view of the overall turning processing of wafer-level arrayed optical elements and molds of the processed piece in Fig. 1;

[0037] Fig. 6 is a schematic view of the processing of a single optical unit of wafer-level arrayed optical elements and molds of the processed piece in Fig. 1;

[0038] Fig. 7 is a schematic view of the array unit switching positioning of wafer-level arrayed optical elements and molds of the processed piece in Fig. 1;

[0039] Fig. 8 is a schematic view of the structure of a curved surface arrayed optical element and mold of an example of the processed piece in Fig. 1;

[0040] Fig. 9 is a schematic view of the overall curved surface turning processing of a curved surface arrayed optical element and mold of an example of the processed piece in Fig. 1;

[0041] Fig. 10 is a schematic view of the first unit processing of a curved surface arrayed optical element and mold of an example of the processed piece in Fig. 1;

[0042] Fig. 11 is a schematic view of the second unit processing of a curved surface arrayed optical element and mold of an example of the processed piece in Fig. 1;

[0043] Fig. 12 is a schematic view of the array unit switching positioning of a curved surface arrayed optical element and mold of an example of the processed piece in Fig. 1.

[0044] Description of the Drawings: 100, machine tool base;

[0045] 200, workpiece fixing module; 210, workpiece spindle; 220, connecting assembly; 230, X-axis moving element; 240, Y-axis moving element;

[0046] 300, tool fixing module; 310, tool spindle; 320, sliding assembly; 321, driving part; 322, sliding block; 323, guide rail; 324, guide rail fixing seat; 325, sliding ring; 330, machining tool; 340, rotary table; 350, moving and rotating assembly; 351, B-axis rotary table; 352, Z-axis moving part; 360, tool fine adjustment unit; 370, centrifugal force balancing mechanism; 380, dynamic balancing mechanism; 390, grating ruler;

[0047] 400, workpiece to be machined. DETAILED DESCRIPTION

[0048] The application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the application and implement it. The embodiments are not intended to limit the application.

[0049] In some comparative embodiments, fly cutting based on a single-point diamond lathe, slow tool servo, fast tool servo and other processes are often used to meet the processing needs of various optical elements. Fly cutting is to fix a single-point diamond tool on a lathe spindle (C-axis), and the tool rotates with the spindle while moving linearly along the feed direction (X&Y-axis). The workpiece is installed on the worktable (Z-axis), and the worktable moves linearly along the Z-axis towards the spindle. The rotating fly cutter contacts the workpiece once per revolution of the spindle, completing single-point milling. After one tool path is completed, the fly cutter moves a certain distance along the cutting pitch direction to process another tool path. The fly cutting process is discontinuous, low in efficiency, and the frequent impact of the tool on the workpiece causes unstable processing quality. At the same time, it is impossible to directly process arrayed elements.

[0050] Slow tool servo uses linkage control of the linear motion axes (X&Y&Z) of the lathe to synchronize with the rotation of the spindle, and interpolates to realize free-form surface machining motion trajectories. The speed of each axis in the multi-axis linkage interpolation mode is relatively slow, the spindle speed needs to be synchronized with the linear axes, so the spindle speed is also relatively low, generally in the range of tens of rpm. When processing arrayed optical elements, the aperture is small, the cutting speed is far below the reasonable range, resulting in low processing efficiency. At the same time, the X, Y and Z axes themselves have certain loads, and are prone to generate large inertial impact, thereby causing additional vibration of the entire system, ultimately affecting the processing precision. Slow tool servo has poor dynamic characteristics, low efficiency and unguaranteed precision in batch production processing.

[0051] The fast tool servo refers to that in the turning process, the tool is driven to make high-frequency, small-amplitude axial rapid feed motion by means of the fast tool servo micro-feeding mechanism installed on the Z-axis, and the turning process is completed in cooperation with the high-precision spindle and radial feed. Compared with the general tens of hertz of the feed rate of the Z-axis, the feed rate of the fast tool servo micro-feeding mechanism can reach thousands of hertz or even higher, so that the machining efficiency is greatly improved. The stroke of the piezoelectric ceramic of the fast tool servo is generally only a few microns to a few hundred microns, and is mainly used for the machining of microstructure optical units, and is not suitable for the efficient machining of wafer-level arrayed curved surface units.

[0052] It can be seen that the comparative example has the following problems: low efficiency, high cost, unstable machining surface quality, etc. In addition, when the traditional method is used for machining large-size wafer-level and arrayed optical elements and molds, the workpiece is rotated by the spindle and cooperates with the linkage of X and Y, the movement process is clumsy and inertia impact is easy to occur, thereby causing additional deformation or vibration of the machine tool, and finally reducing the machining precision.

[0053] Referring to FIGS. 1-3, the embodiment of the present application provides a machining equipment for wafer-level arrayed optical elements and molds, comprising:

[0054] A machine tool base 100 is horizontally arranged;

[0055] A workpiece fixing module 200 comprises a moving assembly connected to the machine tool base 100 and a workpiece spindle 210 connected to the moving assembly; the axis of the workpiece spindle 210 is parallel to the Z-axis; the workpiece to be machined 400 is installed at the end of the workpiece spindle 210; the workpiece spindle 210 rotates around the C-axis, and the C-axis is parallel to the Z-axis. The moving assembly and the workpiece spindle 210 are respectively configured to drive the workpiece to be machined 400 to move along the X-axis and the Y-axis and rotate along the axis of the workpiece spindle 210, so as to switch different units of the workpiece array of the workpiece to be machined 400; the X-axis, the Y-axis and the Z-axis constitute a three-dimensional rectangular coordinate system;

[0056] A tool fixing module 300 comprises a moving and rotating assembly 350 connected to the machine tool base 100, a tool spindle 310 connected to the moving and rotating assembly 350, and a sliding assembly 320 and a machining tool 330 connected to the end of the tool spindle 310; the tool spindle 310 rotates around the A-axis, and the A-axis is parallel to the Z-axis. The sliding assembly 320 moves along the U-axis, and the U-axis is the radial direction of the tool spindle 310. The machining tool 330 is connected to the sliding assembly 320; the moving and rotating assembly 350 is configured to drive the machining tool 330 to rotate in the B-axis horizontal plane and move along the Z-axis; the tool spindle 310 and the sliding assembly 320 are respectively configured to drive the machining tool 330 to rotate along the axis of the tool spindle 310 and move along the radial direction of the plane on which it rotates, so as to realize the variable-diameter rotational motion of the machining tool 330.

[0057] Specifically, the embodiment can improve the processing efficiency of wafer-level and array optical elements and molds, and reduce the manufacturing cost by processing the workpiece 400 through high-speed rotation of the processing tool 330; the processing process avoids the rotation of the workpiece 400 and the linkage of the X and Y axes, thereby avoiding inertia impact, ensuring processing precision and improving the stability of the processing surface quality. In addition, the equipment and method can also be used for efficient and low-cost ultra-precision machining of curved surface array optical elements and molds.

[0058] The application has wider applicability. When the processing tool 330 is fixed, conventional single-point diamond cutting processing can be realized; when the processing tool 330 rotates, wafer-level or array surface processing can be realized with higher efficiency.

[0059] Further, the tool fixing module 300 further comprises a turntable 340 coaxially connected with the tool spindle 310, and the processing tool 330 is connected to the turntable 340 through the sliding assembly 320. In some embodiments, the turntable 340 is coaxially connected with the tool spindle 310 through a connecting flange. The sliding assembly 320 comprises a driving part 321, a sliding block 322, and a guide rail 323; the driving part 321 and the guide rail 323 are connected to the turntable 340 at the end of the tool spindle 310; the guide rail 323 is connected to the turntable 340 through a guide rail fixing seat 324; the output end of the driving part 321 is connected with the sliding block 322, and the sliding block 322 is slidingly connected with the guide rail 323; the processing tool 330 is connected to the sliding block 322 through a tool fine adjustment unit 360; the driving part 321 is configured to drive the sliding block 322 and the processing tool 330 to slide along the radial direction of the turntable 340, that is, the processing tool 330 rotates while moving radially, so that the processing tool 330 changes its rotation diameter while rotating. In some embodiments, the driving part 321 can be a piezoelectric ceramic motor or a linear motor with good motion performance. The guide rail 323 is a super-high-precision cross-roller guide rail.

[0060] In some embodiments, the tool spindle 310 can be a high-precision, high-rigidity, and large-load air-floating spindle, which can be equipped with a high-resolution optical angle encoder, has a high-precision angular positioning function, a rotation speed of 0-10000 rpm, a radial load of >1800 N, an axial load of >2200 N, and a motion error of <12 nm. The tool spindle 310 can realize high-precision angular positioning with a rotation angle error of less than 5″.

[0061] When the slider 322 drives the machining tool 330 to move linearly away from the rotation center of the tool spindle 310, the slider 322, the tool fine adjustment unit 360 and the machining tool 330 will generate a large centrifugal force under high-speed rotation. If the centrifugal force is entirely overcome by the driving motor, a motor with high output power is needed to match the high positioning accuracy and high motion characteristics, which will inevitably make the entire mechanism relatively large. Therefore, the tool fixing module 300 of the embodiment further includes a centrifugal force balancing mechanism 370 connected to the rotating disc 340. Along the radial direction of the rotating disc 340, the centrifugal force balancing mechanism 370 and the sliding assembly 320 are located on both sides of the axis of the tool spindle 310, and the centrifugal force balancing mechanism 370 is used to offset the centrifugal force generated by the eccentric rotation of the sliding assembly 320 and the machining tool 330. Since the centrifugal force is linearly related to the moving distance, in some embodiments, the centrifugal force balancing mechanism 370 includes high-quality rectangular spiral compression springs, mechanical springs, electromagnetic springs or gas springs, which are used to offset the centrifugal force generated by the eccentric rotation, reduce the output power demand of the driving motor, and thus realize the compact and light structure of the device. At the same time, it can meet the demand of high-speed rotation cutting.

[0062] Further, the tool fixing module 300 further includes a dynamic balancing mechanism 380 connected to the rotating disc 340. On the rotating disc 340, the dynamic balancing mechanism 380 moves in the opposite direction synchronously with the slider 322. This can ensure that the center of gravity of the entire tool fixing module 300 is on the axis of the tool spindle 310, so as not to affect the dynamic balance of the tool spindle 310 in high-speed rotation. It can avoid the influence of the movement of the machining tool 330 on the dynamic balance of the rotation of the tool spindle 310, and ensure that the selected high-precision air-floating spindle can play its original precision level, thereby ensuring the machining precision.

[0063] Further, the tool fixing module 300 further includes a grating ruler 390, the ruler body of which is connected to one side of the slider 322, and the reading head of which is connected to the rotating disc 340. In some embodiments, the grating ruler 390 is an ultra-precision picometer grating ruler, which can realize picometer minimum resolution and nanometer step distance through closed-loop control of the piezoelectric ceramic motor (driving part 321).

[0064] Further, the sliding assembly 320 further comprises a slip ring 325 connected to the rotary table 340. The electrical part of the driving part 321 and other components are in communication connection with the machine tool control system through the slip ring 325, which is used for power supply and signal transmission of the driving part 321 and the high-precision grating ruler 390, and can solve the wiring and control problems of the electrical elements in the tool fixing module 300. In some embodiments, the slip ring 325 can be selected as a multi-channel conductive slip ring scheme. The conductive slip ring realizes power input to the driving part 321 and the grating ruler 390 on the rotary table 340, and realizes signal transmission between the grating ruler 390 and the control system, meeting the requirement of stable high-speed transmission of the grating ruler 390 signal under the condition of high-speed rotation of the tool spindle 310 above 3000 rpm.

[0065] Further, the moving and rotating assembly 350 comprises a B-axis rotary table 351 and a Z-axis moving part 352 sliding along the Z-axis. The B-axis rotary table 351 rotates around the B-axis, which is parallel to the Y-axis. The B-axis rotary table 351 is connected to the Z-axis moving part 352, and the Z-axis moving part 352 is connected to the machine tool base 100 through a guide rail. In some embodiments, the Z-axis moving part 352 is a linear sliding module. The B-axis rotary table 351 rotates in the B-axis horizontal plane, so as to adjust the initial relative angle between the machining tool 330 and the machining plane of the workpiece 400. The Z-axis moving part 352 drives the machining tool 330 to feed in the depth direction of the curved surface of the workpiece.

[0066] Further, the workpiece fixing module 200 further comprises a connecting assembly 220 connected to the end of the workpiece spindle 210, and the connecting assembly 220 is configured to connect the workpiece 400 to the end face of the workpiece spindle 210. In some embodiments, the workpiece spindle 210 is a vacuum chuck, which facilitates the quick connection and disassembly of the workpiece 400 to / from the workpiece spindle 210, and realizes the stable connection between the workpiece 400 and the workpiece spindle 210 during machining.

[0067] Further, the moving assembly comprises an X-axis moving part 230 and a Y-axis moving part 240. The X-axis moving part 230 is connected to the machine tool base 100 through a guide rail, and the Y-axis moving part 240 is connected to the table surface of the X-axis moving part 230 through a guide rail. In some embodiments, the X-axis moving part 230 and the Y-axis moving part 240 are linear sliding modules. The X-axis moving part 230 and the Y-axis moving part 240 can realize the coincidence of the axes of the workpiece spindle 210 and the tool spindle.

[0068] The application rotates the tool spindle 310, rotates the B-axis rotary table 351, moves the sliding assembly 320, and moves the Z-axis moving part 352 through linkage control, to realize high-speed and high-quality processing of a single optical unit. By controlling the movement of the X-axis moving part 230, the movement of the Y-axis moving part 240, and the rotation of the workpiece spindle 210, the rapid positioning switching and processing of different units of the workpiece array are realized, and finally the efficient and accurate processing of wafer-level array optical elements and molds is realized.

[0069] The application can greatly improve the processing efficiency when processing wafer-level array optical elements and molds, and can ensure high processing quality and consistency, while also meeting the conventional turning process application based on a single-point diamond lathe.

[0070] The application has the function of conventional turning process application based on a single-point diamond lathe, and through driving control of the high-precision sliding assembly 320, the rotation diameter of the processing tool 330 can be continuously and stably changed, which is matched with the high-speed rotating tool spindle 310, the high-precision indexing positioning B-axis rotary table 351, and the Z-axis moving part 352, to realize efficient processing of wafer-level array optical units and molds, while effectively ensuring the processing quality of a single optical unit and the consistency of array units, which has a broad application prospect.

[0071] The processing method for processing the workpiece 400 by using the processing equipment is as follows:

[0072] S1: as shown in FIG. 1 and FIG. 4, the workpiece 400 is installed on the vacuum chuck at the end of the workpiece spindle 210, and the workpiece spindle 210 and the tool spindle 310 are preliminarily aligned through repeated adjustment and measurement of the moving assembly, that is, the axis of the workpiece spindle 210 coincides with the axis of the tool spindle 310;

[0073] S2: according to the processing drawing, a suitable single-point diamond processing tool 330 is selected, the processing tool 330 is installed on the tool fine adjustment unit 360 of the sliding assembly 320, and the center initial position of the tool tip of the processing tool 330 is adjusted to coincide with the rotation center of the tool spindle 310 through the tool fine adjustment unit 360;

[0074] S3: the moving and rotating assembly 350 is adjusted, that is, the initial relative angle between the processing tool 330 and the processing plane of the workpiece 400 in the XZ plane is corrected through the B-axis rotary table 351, and the processing tool 330 is moved to the processing plane of the workpiece 400 through the Z-axis moving part 352;

[0075] S4: the rotating center of the workpiece 400 is adjusted to coincide with the rotating center of the tool spindle 310 through the moving assembly;

[0076] S5: According to the parameters of the workpiece 400, such as the material, wafer aperture, single-point diamond tool, etc., the appropriate rotating speed of the workpiece spindle 210 and the feeding speed of the moving assembly in the X-axis are selected; according to the planar shape requirements of the design drawing of the workpiece 400, the moving assembly in the X-axis, the moving rotating assembly 350 in the Z-axis, and the workpiece spindle 210 are controlled to rotate, and the moving assembly in the Y-axis, the tool spindle 310, the rotating and sliding assembly 350, and the sliding assembly 320 are locked; the workpiece 400 rotates with the workpiece spindle 210 and makes a feeding motion under the driving of the X-axis moving piece 230, and the machining tool 330 makes a cutting depth direction motion in the Z-axis under the driving of the moving rotating assembly 350, so as to complete the turning of the wafer surface plane, as shown in FIG. 5; S6: The moving assembly moves the center of the first array unit of the workpiece 400 to a position where the center coincides with the rotating center of the tool spindle 310;

[0077] S7: According to the parameters of the workpiece 400, such as the material, wafer aperture, single-point diamond tool, etc., the appropriate rotating speed of the tool spindle 310 and the feeding speed of the sliding assembly 320 are set;

[0078] S8: According to the design parameters of the optical unit, the linkage program of the tool spindle 310, the sliding assembly 320, and the Z-axis moving piece 352 is written, the three-axis linkage is driven, the positioning data and compensation are detected in real time, and the machining of the single optical unit on the wafer is completed; the workpiece 400 is fixed, the machining tool 330 rotates at high speed with the tool spindle 310, which can reach more than 3000 rpm, and the sliding assembly 320 makes a high-responding variable-diameter high-precision motion synchronously, so as to realize high-efficiency and high-precision machining of the optical unit, as shown in FIG. 6;

[0079] S9: The surface shape precision and surface roughness of the machined surface are detected by using an optical detection instrument, the measured value is compared with the theoretical value, the equipment program is compensated according to the deviation, the workpiece 400 is processed again by the compensation program, and finally the design requirements of the surface shape precision and surface roughness are achieved;

[0080] S10: As shown in FIG. 7, the position of the workpiece 400 relative to the machining tool 330 is changed by the movement of the moving assembly, the rapid positioning switching between array units is realized according to the path shown in the figure, the machining programs of S7 to S9 are cycled, and high-efficiency and high-precision machining of the wafer-level array optical element and mold is realized.

[0081] The machining method of another example of the workpiece 400 machined by the machining equipment is as follows:

[0082] S11: As shown in FIG. 1 and FIG. 8, the workpiece 400 is installed on the vacuum chuck at the end of the workpiece spindle 210, and the workpiece spindle 210 and the tool spindle 310 are preliminarily aligned by repeatedly adjusting and measuring the moving assembly until the axis of the workpiece spindle 210 coincides with the axis of the tool spindle 310;

[0083] S12: According to the processing drawing, a suitable single-point diamond machining tool 330 is selected, and the machining tool 330 is installed on the tool fine adjustment unit 360 of the sliding assembly 320. The center of the tip of the machining tool 330 is adjusted to coincide with the rotation center of the tool spindle 310 by adjusting the tool fine adjustment unit 360;

[0084] S13: The moving and rotating assembly 350 is adjusted, that is, the initial relative angle between the machining tool 330 and the machining plane of the workpiece 400 is corrected by the B-axis rotary table 351, and the machining tool 330 is moved to the machining curved surface of the workpiece 400 by the Z-axis moving part 352;

[0085] S14: The rotation center of the workpiece 400 is adjusted to coincide with the rotation center of the tool spindle 310 by the moving assembly;

[0086] S15: According to the parameters such as the material, caliber, and single-point diamond tool of the workpiece 400, the rotation speed of the workpiece spindle 210 and the feed speed of the moving assembly in the X-axis are selected. According to the design drawing of the curved surface of the workpiece 400, the movement of the moving assembly in the X-axis, the movement of the moving and rotating assembly 350 in the Z-axis, and the rotation of the workpiece spindle 210 are controlled, and the movement of the moving assembly in the Y-axis, the rotation of the tool spindle 310, the rotation of the moving and rotating assembly 350, and the sliding of the sliding assembly 320 are locked. The workpiece 400 rotates with the workpiece spindle 210 and moves in the X-axis under the drive of the X-axis moving part 230 to make a feed motion, and the machining tool 330 moves in the Z-axis in the cutting direction under the drive of the moving and rotating assembly 350 to complete the overall turning of the workpiece curved surface, as shown in FIG. 9;

[0087] S16: The moving assembly moves the center of the first array unit of the workpiece 400 to a position coinciding with the rotation center of the tool spindle 310;

[0088] S17: According to the parameters such as the material, optical unit caliber, and single-point diamond tool of the workpiece 400, the rotation speed of the tool spindle 310 and the feed speed of the sliding assembly 320 are set;

[0089] S18: The design parameters of the root optical unit are programmed to drive the linkage of the tool spindle 310, the sliding assembly 320 and the Z-axis moving part 352, real-time detection of positioning data and compensation are performed, and the machining of a single optical unit on the curved surface is completed; the workpiece 400 is fixed, the machining tool 330 rotates at high speed with the tool spindle 310, which can reach more than 3000 rpm, and the sliding assembly 320 moves at high response with variable diameter and high precision, realizing high-efficiency and high-precision machining of the optical unit, as shown in FIG. 10;

[0090] S19: The surface shape precision and surface roughness of the machined surface are detected using an optical detection instrument, the measured value is compared with the theoretical value, the equipment program is compensated according to the deviation, the workpiece 400 is reprocessed through the compensation program, and finally the design requirements of the surface shape precision and surface roughness are achieved.

[0091] S20: As shown in FIG. 11, the rotating assembly 350 is moved, i.e. the rotating shaft 351 of the B-axis rotary table 351 is rotated to make the machining tool 330 parallel to the rotary axis of the second array unit of the workpiece 400; the position of the workpiece 400 relative to the machining tool 330 is changed by moving the moving assembly X-axis, so that the rotary axis of the second array unit coincides with the axis of the rotating disc 340 of the machining tool 330.

[0092] S21: The four-axis linkage program is programmed to drive the tool spindle 310, the sliding assembly 320, the Z-axis moving part 352 and the X-axis moving part 230, real-time detection of positioning data and compensation are performed, and high-efficiency and high-precision machining of the second array unit on the curved surface is completed.

[0093] S22: The surface shape precision and surface roughness of the machined surface are detected using an optical detection instrument, the measured value is compared with the theoretical value, the equipment program is compensated according to the deviation, the workpiece 400 is reprocessed through the compensation program, and finally the design requirements of the surface shape precision and surface roughness are achieved.

[0094] S23: As shown in FIG. 12, the third to ninth array units are rotated to the same Y value position as the second array unit by rotating the workpiece spindle 210 (C-axis); the position of the workpiece 400 relative to the machining tool 330 is changed by moving the moving assembly X-axis, and the rapid positioning switching between array units is realized according to the path shown in the figure, the machining programs S21-S22 are cycled, and high-efficiency and high-precision machining of the curved surface array optical element and mold shown in FIG. 8 is realized.

[0095] The method can be used not only for super-precision machining of planar array optical elements and molds, but also for super-precision machining of curved surface array optical elements and molds. The steps of the super-precision machining method for curved surface array optical elements and molds include:

[0096] The workpiece 400 is mounted on the vacuum chuck at the end of the workpiece spindle 210, and is adjusted to the preliminary alignment between the workpiece spindle 210 and the tool spindle 310 by the moving assembly;

[0097] The machining tool 330 is mounted on the sliding assembly 320;

[0098] The moving and rotating assembly 350 is adjusted to correct the initial relative angle between the machining tool 330 and the machining plane of the workpiece 400, and to move the machining tool 330 to the machining curved surface of the workpiece 400;

[0099] The moving assembly is adjusted to the coincidence between the center of rotation of the workpiece 400 and the center of rotation of the tool spindle 310;

[0100] The workpiece 400 rotates with the workpiece spindle 210 and makes the feeding motion under the driving of the X-axis moving member 230, and the machining tool 330 makes the cutting depth direction motion in the Z-axis under the driving of the moving and rotating assembly 350, thus completing the turning machining of the overall curved surface of the workpiece;

[0101] The moving assembly moves the center of the first array unit of the workpiece 400 to the position coinciding with the center of rotation of the tool spindle 310;

[0102] The rotating speed of the tool spindle 310 and the feeding speed of the sliding assembly 320 are set;

[0103] The tool spindle 310, the X-axis moving member 230, the sliding assembly 320 and the Z-axis moving member 352 work to complete the machining of the single optical unit on the curved surface of the workpiece.

[0104] Obviously, the above-mentioned embodiments are only examples for clearly illustrating, and are not intended to limit the embodiments. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, all the embodiments are not required to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A processing apparatus for wafer level arrayed optical elements and molds, comprising: a substrate; a plurality of optical elements formed on the substrate; a plurality of molds formed on the substrate; and a plurality of optical elements formed on the molds. The application relates to a processing equipment for wafer-level array optical elements and molds. The processing equipment comprises a machine base, a workpiece fixing module, a tool fixing module and a workpiece array. The workpiece fixing module comprises a moving assembly connected to the machine base and a workpiece spindle connected to the moving assembly. The spindle axis is parallel to the Z axis. The moving assembly and the workpiece spindle are respectively configured to drive the workpiece to move along the X axis and the Y axis and rotate along the spindle axis, so as to switch different units of the workpiece array.

2. The apparatus for processing wafer-level arrayed optical elements and molds according to claim 1, wherein: The X axis, the Y axis and the Z axis form a three-dimensional coordinate system.

3. The apparatus for processing wafer-level arrayed optical elements and molds according to claim 2, wherein: The tool fixing module comprises a moving and rotating assembly connected to the machine base, a tool spindle connected to the moving and rotating assembly and a sliding assembly and a processing tool connected to the end of the tool spindle.

4. The apparatus for processing wafer-level arrayed optical elements and molds according to claim 3, wherein: The processing tool is connected to the sliding assembly.

5. The apparatus for processing wafer-level arrayed optical elements and molds of claim 3, wherein: The moving and rotating assembly is configured to drive the processing tool to rotate in the B-axis horizontal plane and move along the Z axis.

6. The apparatus for processing wafer-level arrayed optical elements and molds of claim 3, wherein: The tool spindle and the sliding assembly are respectively configured to drive the processing tool to rotate along the spindle axis and move along the radial direction of the rotating plane, so as to realize the variable-diameter rotating motion of the processing tool.

7. The apparatus for processing wafer-level arrayed optical elements and molds of claim 3, wherein: The tool fixing module further comprises a rotating disc coaxially connected to the tool spindle.

8. The apparatus for processing wafer-level arrayed optical elements and molds of claim 1, wherein: The processing tool is connected to the rotating disc through the sliding assembly.

9. The apparatus for processing wafer-level arrayed optical elements and molds of claim 1, wherein: The sliding assembly comprises a driving part, a sliding block and a guide rail.

10. A method for processing wafer level arrayed optical elements and molds, the method comprising: providing a mold having a plurality of mold features; providing a wafer having a plurality of wafer features; and aligning the mold features with the wafer features. The driving part and the guide rail are connected to the end of the tool spindle. The output end of the driving part is connected to the sliding block. The sliding block is slidingly connected to the guide rail. The processing tool is connected to the sliding block. The driving part is configured to drive the sliding block and the processing tool to slide. The tool fixing module further comprises a centrifugal force balancing mechanism connected to the rotating disc. Along the radial direction of the rotating disc, the centrifugal force balancing mechanism and the sliding assembly are respectively located on the two sides of the spindle axis. The centrifugal force balancing mechanism is used for counteracting the centrifugal force generated by the eccentric rotation of the sliding assembly and the processing tool. The tool fixing module further comprises a dynamic balancing mechanism connected to the rotating disc. On the rotating disc, the dynamic balancing mechanism moves in the opposite direction synchronously with the sliding block. The tool fixing module further comprises a grating ruler. The ruler body of the grating ruler is connected to one side of the sliding block. The reading head of the grating ruler is connected to the rotating disc. The sliding assembly further comprises a sliding ring connected to the rotating disc. The moving and rotating assembly comprises a B-axis rotary table and a Z-axis moving part sliding along the Z axis. The B-axis rotary table is connected to the Z-axis moving part. The Z-axis moving part is connected to the machine base. The moving assembly comprises an X-axis moving part and a Y-axis moving part. The X-axis moving part is connected to the machine base. The Y-axis moving part is connected to the table surface of the X-axis moving part perpendicularly. The processing equipment is used for processing wafer-level array optical elements and molds. The workpiece is installed on the vacuum chuck at the end of the workpiece spindle. The moving assembly is adjusted to preliminarily align the workpiece spindle with the tool spindle. The machining tool is installed on the sliding assembly; The relative angle between the machining tool and the machining plane of the workpiece is adjusted, and the machining tool is moved to the machining plane of the workpiece; The center of rotation of the workpiece coincides with the center of rotation of the tool spindle through the movement of the movement assembly; The workpiece rotates with the workpiece spindle and feeds under the drive of the X-axis movement, and the machining tool moves in the cutting direction under the drive of the movement and rotation assembly, thereby completing the turning of the wafer surface plane; The movement assembly moves the center of the first array unit of the workpiece to a position coinciding with the center of rotation of the tool spindle; The rotation speed of the tool spindle and the feed speed of the sliding assembly are set; The tool spindle, the sliding assembly and the Z-axis movement complete the machining of a single optical unit on the wafer.

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