Bending reliability test fixture, system and method

Abstract

A bending reliability test fixture, system and method. The bending reliability test fixture comprises a first force-bearing component (1) and a second force-bearing component (2) which are structurally identical and symmetrically spaced apart; the first force-bearing assembly (1) comprises a force-bearing plate (11), a clamping part (12) formed by protruding and extending from the middle area of one side of the force-bearing plate (11), a fixing slot (13) formed by recessing inwards from the end of the clamping part (12) away from the force-bearing plate (11), a fixed rotating shaft (14) fixed to the middle area of the side of the force-bearing plate (11) away from the clamping part (12), and a first transverse force-bearing beam (15) and a second transverse force-bearing beam (16), which are respectively fixed to the side of the force-bearing plate (11) away from the clamping part (12) and spaced apart on the upper and lower opposite sides of the fixed rotating shaft (14), and the fixing slot (13) is used for clamping a circuit board sample (3); the clamping part (12) of the first force-bearing component (1) and a clamping part of the second force-bearing component (2) are arranged directly facing each other. By adopting the bending reliability test fixture of the present invention, a bending reliability test can be simply and efficiently carried out on a circuit board sample, and meanwhile, the accuracy of a test result is improved.

Description

Bend reliability test fixture, system and method TECHNICAL FIELD

[0001] The present application relates to the technical field of reliability test tools, in particular to a bend reliability test fixture, system and method for testing the bend reliability of a circuit board sample. BACKGROUND

[0002] The surface mount components on a printed circuit board (circuit board, PCB) are susceptible to mechanical and thermal stresses, which can cause cracks in the end electrodes of the surface mount components, thereby affecting the reliability of their applications. Such failure is mainly caused by bend cracking, which often occurs when the printed circuit board transmits force to the end electrodes of the surface mount components, which can come from the deformation caused by bending or vibration of the substrate and the difference in the thermal expansion coefficient between the ceramic body and the organic resin board during thermal cycling. Therefore, during use such as assembly and soldering, excessive contact stress and thermal stress should be avoided to ensure the reliability of the surface mount components.

[0003] In practical applications, the bending strength of a printed circuit board sample is affected by multiple factors related to the test procedure, including sample size, sample preparation, test fixture, loading rate and test environment. In order to meet the requirements of test evaluation, a bend test of the circuit board sample is usually required, that is, the transverse shear force of the solder ball and the surface mount component solder joint in the circuit board needs to be tested.

[0004] In related art, the bend reliability test fixture for bend testing of a circuit board sample needs to provide deformation to the circuit board sample by a deformation pressure head, that is, the deformation pressure head is pressed against the circuit board sample to cause deformation, and the amount of deformation depends on the head diameter of the deformation pressure head and the driving mechanism driving the deformation pressure head. This requires different head diameters of the deformation pressure head for circuit board samples of different chip sizes. This method of providing deformation to the circuit board sample by the deformation pressure head is relatively complex, and only a single surface mount component solder joint can be tested at a time, resulting in low test efficiency. In addition, since the deformation pressure head can only measure by applying pressure, it cannot provide tensile testing, resulting in the transverse stress of each surface mount component solder joint of the circuit board sample being tested only in a single direction. In addition, the deformation pressure head is prone to lateral drift during operation, resulting in uneven stress on the circuit board sample and low accuracy of the reliability test results. SUMMARY

[0005] To overcome the deficiencies of the prior art, the present application provides a new bend reliability test fixture, system and method to solve the problems of the bend reliability test fixture in related art, which is relatively complex and has low test efficiency and accuracy when testing the reliability of a circuit board sample.

[0006] In a first aspect, the present application provides a bending reliability test fixture for testing a circuit board sample, comprising a first force receiving assembly and a second force receiving assembly which are structurally identical and symmetrically arranged.

[0007] The clamping portions of the first force receiving assembly and the second force receiving assembly are oppositely arranged. When the first lateral force receiving beams of the first force receiving assembly and the second force receiving assembly are simultaneously subjected to two equal and opposite pushing forces, or when the second lateral force receiving beams of the first force receiving assembly and the second force receiving assembly are simultaneously subjected to two equal and opposite pushing forces, the circuit board sample clamped on both sides of the fixing slots of the first force receiving assembly and the second force receiving assembly is subjected to bending deformation.

[0008] Preferably, the first lateral force receiving beam and the second lateral force receiving beam are fixed to the edge regions of the force receiving plate away from the clamping portion.

[0009] Preferably, the first force receiving assembly further comprises a first fixing plate and a second fixing plate fixed to the force receiving plate away from the clamping portion. The first lateral force receiving beam is fixed to the middle region of the first fixing plate away from the force receiving plate, and the second lateral force receiving beam is fixed to the middle region of the second fixing plate away from the force receiving plate.

[0010] Preferably, the first lateral force receiving beam and the second lateral force receiving beam are parallel to the horizontal plane and perpendicular to the force receiving plate.

[0011] Preferably, the longitudinal cross-sectional area of the clamping portion gradually decreases from one end close to the force receiving plate to the other end.

[0012] In a second aspect, the present application provides a bending reliability test system, comprising a bending reliability test fixture as described above, a driving mechanism for driving the first lateral force receiving beam or the second lateral force receiving beam of the first force receiving assembly and the second force receiving assembly, and a test device for reading and calculating parameters of the circuit board sample under bending deformation.

[0013] Preferably, the parameters include the step displacement X and the force F measured by the strain gauge when the force plates of the first force assembly and the force plates of the second force assembly are subjected to force.

[0014] In a third aspect, the present application provides a bending reliability test method, which comprises the bending reliability test system as described above, and the bending reliability test method comprises the following steps:

[0015] S1, clamping the opposite sides of the circuit board sample in the fixing grooves of the first force assembly and the second force assembly respectively, and pasting strain gauges on the chip soldering points of the circuit board sample;

[0016] S2, driving the first transverse force beams in the first force assembly and the first transverse force beams in the second force assembly to produce relative movement by the driving mechanism through forces of equal size and opposite directions, so as to make the circuit board sample produce downward bending deformation, and recording the first driving displacement amount Xu driven by the driving mechanism and the inward transverse shear force Fu measured by the strain gauge;

[0017] S3, adjusting the first driving displacement amount Xu of the driving mechanism multiple times, recording the corresponding inward transverse shear force Fu, and fitting the relationship between the first driving displacement amount Xu and the inward transverse shear force Fu by curve fitting method, to obtain the first relationship Fu(Xu) between the first driving displacement amount and the inward transverse shear force when the circuit board sample produces downward bending deformation;

[0018] S4, driving the second transverse force beams in the first force assembly and the second transverse force beams in the second force assembly to produce relative movement by the driving mechanism through forces of equal size and opposite directions, so as to make the circuit board sample produce upward bending deformation, and recording the second driving displacement amount Xd driven by the driving mechanism and the outward transverse shear force Fd measured by the strain gauge;

[0019] S5, adjusting the second driving displacement amount Xd of the driving mechanism multiple times, recording the corresponding outward transverse shear force Fd, and fitting the relationship between the second driving displacement amount Xd and the outward transverse shear force Fd by curve fitting method, to obtain the second relationship Fd(Xd) between the second driving displacement amount and the outward transverse shear force when the circuit board sample produces upward bending deformation;

[0020] S6, deriving the transverse shear force suffered by the solder balls and the chip soldering points in the circuit board sample according to the driving displacement amount in actual test, and combining the first relationship and the second relationship.

[0021] Preferably, the driving mechanism is a stepper motor.

[0022] Compared with the related art, the bending reliability test fixture in the application has the first force receiving component and the second force receiving component which are designed to have the same structure and are symmetrically arranged, and the first force receiving component comprises a force receiving plate, a clamping portion which is formed by protruding extension from the middle area of one side of the force receiving plate, a fixing groove which is formed by inward recessing from one end of the clamping portion away from the force receiving plate, a fixing rotating shaft which is fixed to the middle area of one side of the force receiving plate away from the clamping portion, and a first transverse force receiving beam and a second transverse force receiving beam which are respectively fixed to the one side of the force receiving plate away from the clamping portion and are symmetrically arranged on the upper and lower opposite sides of the fixing rotating shaft, the fixing groove is used for clamping the circuit board sample, and the clamping portion of the first force receiving component and the clamping portion of the second force receiving component are arranged in a face-to-face manner, when the first transverse force receiving beam of the first force receiving component and the first transverse force receiving beam of the second force receiving component are simultaneously subjected to two thrust forces which are equal in size and opposite in direction, or when the second transverse force receiving beam of the first force receiving component and the second transverse force receiving beam of the second force receiving component are simultaneously subjected to two thrust forces which are equal in size and opposite in direction, the circuit board sample clamped in the fixing groove of the first force receiving component and the fixing groove of the second force receiving component on the two sides is subjected to bending deformation, so that, when the bending reliability of the circuit board sample is tested, the circuit board sample can be deformed without contacting the circuit board sample, and each soldering point of the circuit board sample can be subjected to uniform extrusion and stretching, so that the accuracy of the bending reliability test result of the circuit board sample is higher, in addition, the bending reliability test fixture can test multiple chip soldering points on the circuit board sample at one time, so that the test efficiency is greatly improved, and the bending reliability test of the circuit board sample can be more simply performed by using the bending reliability test fixture. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.

[0024] Fig. 1 is a perspective structural schematic view of a bending reliability test fixture provided by an embodiment of the present application;

[0025] Fig. 2 is a sectional schematic view of a bending reliability test fixture provided by an embodiment of the present application;

[0026] Fig. 3 is a sectional schematic view of a bending reliability test fixture when it is tested;

[0027] Fig. 4 is a step flow schematic view of a bending reliability test method provided by an embodiment of the present application.

[0028] 1, first stress component; 11, stress plate; 12, clamping part; 13, fixing groove; 14, fixed pivot; 15, first transverse stress beam; 16, second transverse stress beam; 17, first fixed plate; 18, second fixed plate; 2, second stress component; 3, circuit board sample; 31, chip welding point; 4, strain gauge. DETAILED DESCRIPTION

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application; the present application will be described with reference to the drawings in which is shown by way of illustration the application in accordance with embodiments described herein in which: the terminology includes the words specifically mentioned herein and all grammatical variations thereof.

[0030] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. It is expressly understood that the embodiments described herein are merely examples from a multitude of possible embodiments that can be claimed.

[0031] It should be noted that the terms "upper", "lower", "left", "right", and the like in the embodiments of the application are described with reference to the placement state in the drawings, and should not be interpreted as limiting embodiments of the application. In addition, it should also be understood that in the text, when referring to an element "above" or "below" another element, it is possible that the element is directly "above" or "below" the other element, or the element is "above" or "below" the other element through an intermediate element.

[0032] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the application.

[0033] Embodiment one

[0034] The embodiment of the present application provides a bending reliability test clamp, which is used for bending reliability test of a circuit board sample 3 and comprises a first stress component 1 and a second stress component 2 which are symmetrically arranged at intervals and have the same structure.

[0035] The first stress component 1 comprises a stress plate 11, a clamping part 12 which is formed by protruding extension of the middle area of one side of the stress plate 11, a fixing groove 13 which is formed by inward recess of one end of the clamping part 12 away from the stress plate 11, a fixing rotating shaft 14 which is fixed to the middle area of one side of the stress plate 11 away from the clamping part 12, and a first horizontal stress beam 15 and a second horizontal stress beam 16 which are respectively fixed to the upper and lower sides of the fixing rotating shaft 14 and are symmetrically arranged at intervals on one side of the stress plate 11 away from the clamping part 12.

[0036] The fixing rotating shaft 14 is used for strengthening the structural strength of the stress plate 11 and plays a supporting role, so that the second horizontal stress beam 16 is not stressed when the first horizontal stress beam 15 is stressed, thereby avoiding uneven stress of the circuit board sample 3 clamped in the fixing groove 13.

[0037] The clamping part 12 of the first stress component 1 and the clamping part 12 of the second stress component 2 are oppositely arranged; when the first horizontal stress beam 15 of the first stress component 1 and the first horizontal stress beam 15 of the second stress component 2 are simultaneously subjected to two thrusts which are equal in size and opposite in direction, or when the second horizontal stress beam 16 of the first stress component 1 and the second horizontal stress beam 16 of the second stress component 2 are simultaneously subjected to two thrusts which are equal in size and opposite in direction, the circuit board sample 3 clamped in the fixing groove 13 of the first stress component 1 and the fixing groove 13 of the second stress component 2 respectively generates bending deformation.

[0038] In the embodiment, the first horizontal stress beam 15 and the second horizontal stress beam 16 are respectively fixed to the edge area of one side of the stress plate 11 away from the clamping part 12, so that the pressure applied to the circuit board sample 3 is better, and the bending degree of the circuit board sample 3 is larger, thereby better performing the bending reliability test on the circuit board sample 3.

[0039] In the embodiment, the first horizontal stress beam 15 and the second horizontal stress beam 16 are parallel to the horizontal plane and are respectively perpendicular to the stress plate 11, so that the uniform pressure applied to the circuit board sample 3 is better.

[0040] In the embodiment, the longitudinal sectional area of the clamping portion 12 gradually decreases from the end close to the force receiving plate 11 to the other end. This design can make the force uniform and concentrated on the fixing groove 13 when the clamping portion 12 is stressed. Specifically, when the first transverse force receiving beam 15 or the second transverse force receiving beam 16 is stressed, the force is transmitted to the clamping portion 12 through the force receiving plate 11, and the clamping portion 12 is designed to make the force uniform and concentrated on the circuit board sample 3 clamped in the fixing groove 13, so that the circuit board sample 3 is stressed uniformly and concentratedly.

[0041] In the embodiment, the width of the fixing groove 13 is the same as the thickness of the circuit board sample 3. This design can make the circuit board sample 3 better inserted into the fixing groove 13, and avoid the circuit board sample 3 moving when receiving pressure, so that the stress of the circuit board sample 3 is not uniform.

[0042] In the embodiment, the middle region of the force receiving plate 11 is provided with a recess inwardly recessed, and the fixing shaft 14 is fixed in the recess. This can improve the fixing effect of the fixing shaft 14.

[0043] In the embodiment, the first force receiving assembly 1 further comprises a first fixing plate 17 and a second fixing plate 18 fixed on the side of the force receiving plate 11 away from the clamping portion 12; the first transverse force receiving beam 15 is fixed on the middle region of the side of the first fixing plate 17 away from the force receiving plate 11, and the second transverse force receiving beam 16 is fixed on the middle region of the side of the second fixing plate 18 away from the force receiving plate 11. This design can uniformly transmit the pressure to the circuit board sample 3 when the first transverse force receiving beam 15 or the second transverse force receiving beam 16 is stressed, so that the stress of the circuit board sample 3 is uniform.

[0044] The bending reliability test fixture in the embodiment comprises a first stress component 1 and a second stress component 2 which are arranged at intervals and have the same structure, wherein the first stress component 1 comprises a stress plate 11, a clamping portion 12 which is formed by protruding extension from the middle area of one side of the stress plate 11, a fixing groove 13 which is formed by inward recessing from one end of the clamping portion 12 away from the stress plate 11, a fixing rotating shaft 14 which is fixed to the middle area of one side of the stress plate 11 away from the clamping portion 12, and a first transverse stress beam 15 and a second transverse stress beam 16 which are respectively fixed to the one side of the stress plate 11 away from the clamping portion 12 and are arranged at intervals on the upper and lower opposite sides of the fixing rotating shaft 14, the fixing groove 13 is used for clamping the circuit board sample 3, and the clamping portion 12 of the first stress component 1 and the clamping portion 12 of the second stress component 2 are arranged in opposition, when the first transverse stress beam 15 of the first stress component 1 and the first transverse stress beam 15 of the second stress component 2 are simultaneously subjected to two thrusts which are equal in size and opposite in direction, or when the second transverse stress beam 16 of the first stress component 1 and the second transverse stress beam 16 of the second stress component 2 are simultaneously subjected to two thrusts which are equal in size and opposite in direction, the circuit board sample 3 which is clamped in the fixing groove 13 of the first stress component 1 and the fixing groove 13 of the second stress component 2 respectively on both sides is subjected to bending deformation, so that, when the bending reliability of the circuit board sample 3 is tested, the circuit board sample 3 can be deformed without contacting the circuit board sample 3, and each chip welding point 31 of the circuit board sample 3 can be subjected to uniform extrusion and stretching, so that the accuracy of the bending reliability test result of the circuit board sample 3 is higher, in addition, the bending reliability test fixture can test a plurality of chip welding points 31 on the circuit board sample 3 at one time, so that the test efficiency is greatly improved, and the bending reliability test of the circuit board sample 3 can be more simply performed by using the bending reliability test fixture, and since the circuit board sample 3 is fixed to the fixing groove 13 in a clamping manner, the circuit board sample 3 can be replaced more quickly, so that the test efficiency is further improved.

[0045] Embodiment two

[0046] The embodiment of the present application provides a bending reliability test system, which is shown in combination with FIG. 1 to FIG. 3, and comprises the bending reliability test fixture in the embodiment one, a driving mechanism which is used for driving the first transverse stress beam 15 or the second transverse stress beam 16 in the first stress component 1 and the second stress component 2 respectively, and a test device which is used for reading and calculating parameters of the circuit board sample 3 under bending deformation.

[0047] The driving mechanism can be a stepping motor or a cylinder.

[0048] In the embodiment, the parameters include the step displacement X and the force F measured by the strain gauge 4 when the force receiving plates 11 of the first force receiving assembly 1 and the second force receiving assembly 2 are subjected to force; that is, the test device includes the strain gauge 4 for measuring the force (deformation amount) of the circuit board sample 3 clamped in the fixed grooves 13 of the first force receiving assembly 1 and the fixed grooves 13 of the second force receiving assembly 2 under bending deformation and the computing device for performing result calculation on the step displacement X and the force F measured by the strain gauge 4; of course, the test device also includes the displacement sensor connected with the driving mechanism for recording the step displacement of the driving mechanism.

[0049] When the bending reliability test system in the embodiment tests the circuit board sample 3: only by driving the first transverse force receiving beam 15 or the second transverse force receiving beam 16 in the first force receiving assembly 1 and the second force receiving assembly 2 through the driving mechanism, the circuit board sample 3 can be subjected to bending deformation, and then the bending reliability test of the circuit board sample 3 can be completed through the test device, that is, the test of the transverse shear force of the solder ball and the chip solder joint 31 in the circuit board sample 3 can be completed.

[0050] Since the bending reliability test system in the embodiment adopts the bending reliability test fixture in the first embodiment, it can also achieve the technical effects achieved by the bending reliability test fixture in the first embodiment, which will not be repeated here.

[0051] Embodiment three

[0052] The embodiment of the present application provides a bending reliability test method, which combines the bending reliability test system in the second embodiment and includes the following steps:

[0053] S1, clamping the opposite sides of the circuit board sample in the fixed grooves of the first force receiving assembly and the fixed grooves in the second force receiving assembly, respectively, and pasting the strain gauge on the chip solder joint of the circuit board sample.

[0054] The strain gauge is pasted on the chip solder joint at the middle region of the circuit board sample, which measures the transverse shear force of the circuit board sample.

[0055] S2, using the driving mechanism to simultaneously drive the first transverse force receiving beam in the first force receiving assembly and the first transverse force receiving beam in the second force receiving assembly to produce relative movement through forces of equal size and opposite directions, so as to make the circuit board sample produce downward bending deformation, and record the first driving displacement Xu of the driving mechanism and the inward transverse shear force Fu measured by the strain gauge;

[0056] At this time, when the circuit board sample produces bending deformation, the solder balls of its chips will appear inward lateral shear force parallel to the circuit board sample and the same force direction of the driving mechanism.

[0057] In this embodiment, the driving mechanism adopts a stepper motor, of course, according to actual needs, it can also adopt a cylinder or other types of motors, etc.

[0058] S3, the first driving displacement Xu of the driving mechanism is adjusted multiple times, and the corresponding inward lateral shear force Fu is recorded, and then the relationship between the first driving displacement Xu and the inward lateral shear force Fu is fitted through curve fitting to obtain the first relationship Fu(Xu) between the first driving displacement and the inward lateral shear force when the circuit board sample produces downward bending deformation.

[0059] S4, the second lateral force beam in the first stress component and the second lateral force beam in the second stress component are simultaneously driven by the driving mechanism through forces with equal size and opposite directions to produce relative movement, so that the circuit board sample produces upward bending deformation, and the second driving displacement Xd of the driving mechanism and the outward lateral shear force Fd measured by the strain gauge are recorded.

[0060] At this time, when the circuit board sample produces bending deformation, the solder balls of its chips will appear outward lateral shear force parallel to the circuit board sample and the same force direction of the driving mechanism.

[0061] S5, the second driving displacement Xd of the driving mechanism is adjusted multiple times, and the corresponding outward lateral shear force Fd is recorded, and then the relationship between the second driving displacement Xd and the outward lateral shear force Fd is fitted through curve fitting to obtain the second relationship Fd(Xd) between the second driving displacement and the outward lateral shear force when the circuit board sample produces upward bending deformation.

[0062] S6, according to the driving displacement in actual test, and combining the first relationship and the second relationship, the lateral shear force received by the solder balls and the chip welding points in the circuit board sample is derived.

[0063] In actual testing, after the first relationship is obtained, the inward transverse shearing force Fu of the solder ball and the chip soldering point in the circuit board sample can be directly obtained by only obtaining the first driving displacement amount Xu of the first transverse force beam in the first force assembly and the first transverse force beam in the second force assembly in each subsequent test; after the second relationship is obtained, the outward transverse shearing force Fd of the solder ball and the chip soldering point in the circuit board sample can be directly obtained by only obtaining the second driving displacement amount Xd of the second transverse force beam in the first force assembly and the second transverse force beam in the second force assembly in each subsequent test; and the inward transverse shearing force Fu and the outward transverse shearing force Fd are the bending reliability test results of the circuit board sample, i.e., the transverse shearing force of the circuit board sample.

[0064] Since the bending reliability test method in the embodiment adopts the bending reliability test fixture in Embodiment One, it can also achieve the technical effects achieved by the bending reliability test fixture in Embodiment One, which will not be described here.

[0065] It should be noted that the various embodiments described above with reference to the drawings are only used to illustrate the present application and not to limit the scope of the present application, and those of ordinary skill in the art should understand that the modifications or equivalent replacements made to the present application without departing from the spirit and scope of the present application should be covered within the scope of the present application. In addition, unless otherwise indicated by the context, the word in singular form includes the word in plural form, and vice versa. In addition, unless otherwise specified, all or part of any embodiment can be used in combination with all or part of any other embodiment.

Claims

1. A bending reliability testing fixture for performing bending reliability testing on circuit board samples, characterized in that, The bending reliability test fixture comprises a first force receiving component and a second force receiving component which are symmetrically arranged at intervals and have the same structure; the first force receiving component comprises a force receiving plate, a clamping portion protruding from a middle region of one side of the force receiving plate, a fixing groove recessed inward from one end of the clamping portion away from the force receiving plate, a fixing rotating shaft fixed to a middle region of one side of the force receiving plate away from the clamping portion, and a first transverse force receiving beam and a second transverse force receiving beam fixed to one side of the force receiving plate away from the clamping portion and located at upper and lower opposite sides of the fixing rotating shaft respectively, and the fixing groove is used for clamping a circuit board sample; The clamping portion of the first force receiving component and the clamping portion of the second force receiving component are arranged opposite to each other; when the first transverse force receiving beam of the first force receiving component and the first transverse force receiving beam of the second force receiving component are simultaneously subjected to two thrusts with equal size and opposite directions, or when the second transverse force receiving beam of the first force receiving component and the second transverse force receiving beam of the second force receiving component are simultaneously subjected to two thrusts with equal size and opposite directions, the circuit board sample clamped in the fixing groove of the first force receiving component and the fixing groove of the second force receiving component respectively on both sides is subjected to bending deformation.

2. The bend reliability test fixture of claim 1, wherein, The first transverse force receiving beam and the second transverse force receiving beam are fixed to edge regions of one side of the force receiving plate away from the clamping portion respectively.

3. The bend reliability test fixture of claim 2, wherein, The first force receiving component further comprises a first fixing plate and a second fixing plate fixed to one side of the force receiving plate away from the clamping portion respectively; the first transverse force receiving beam is fixed to a middle region of one side of the first fixing plate away from the force receiving plate, and the second transverse force receiving beam is fixed to a middle region of one side of the second fixing plate away from the force receiving plate.

4. The bend reliability test fixture of claim 1, wherein, The first transverse force receiving beam and the second transverse force receiving beam are parallel to a horizontal plane and perpendicular to the force receiving plate respectively.

5. The bend reliability test fixture of claim 1, wherein, A longitudinal cross-sectional area of the clamping portion gradually decreases from one end close to the force receiving plate to the other end.

6. A bend reliability test system characterized by, The bending reliability test system comprises the bending reliability test fixture according to any one of claims 1 to 5, a driving mechanism for driving the first transverse force receiving beam or the second transverse force receiving beam in the first force receiving component and the second force receiving component respectively, and a test device for reading and calculating parameters of the circuit board sample under bending deformation.

7. The bend reliability test system of claim 6, wherein, The parameters comprise a step displacement X of the force receiving plate of the first force receiving component and the force receiving plate of the second force receiving component under force and a force F measured by a strain gauge.

8. A bend reliability test method characterized by, The bending reliability test method comprises the following steps: S1, clamping opposite sides of a circuit board sample in the fixing groove of the first force receiving component and the fixing groove of the second force receiving component respectively, and pasting a strain gauge on a chip welding point of the circuit board sample; S2, simultaneously driving the first transverse force bearing beam in the first force bearing assembly and the first transverse force bearing beam in the second force bearing assembly by the driving mechanism through forces of equal size and opposite directions to generate relative movement, so as to make the circuit board sample produce downward bending deformation, record the first driving displacement Xu driven by the driving mechanism and the inward transverse shear force Fu measured by the strain gauge; S3, adjusting the first driving displacement Xu of the driving mechanism multiple times, recording the corresponding inward transverse shear force Fu, and fitting the relationship between the first driving displacement Xu and the inward transverse shear force Fu through curve fitting to obtain a first relationship Fu(Xu) between the first driving displacement and the inward transverse shear force when the circuit board sample produces downward bending deformation; S4, simultaneously driving the second transverse force bearing beam in the first force bearing assembly and the second transverse force bearing beam in the second force bearing assembly by the driving mechanism through forces of equal size and opposite directions to generate relative movement, so as to make the circuit board sample produce upward bending deformation, record the second driving displacement Xd driven by the driving mechanism and the outward transverse shear force Fd measured by the strain gauge; S5, adjusting the second driving displacement Xd of the driving mechanism multiple times, recording the corresponding outward transverse shear force Fd, and fitting the relationship between the second driving displacement Xd and the outward transverse shear force Fd through curve fitting to obtain a second relationship Fd(Xd) between the second driving displacement and the outward transverse shear force when the circuit board sample produces upward bending deformation; S6, deriving the transverse shear force of the solder ball and the chip solder joint in the circuit board sample according to the driving displacement in actual test and combining the first relationship and the second relationship.

9. The bend reliability test method of claim 8, wherein, The driving mechanism is a stepper motor.

Images