Steam generating device and semiconductor process apparatus

Abstract

The present application relates to the technical field of semiconductor processing. Disclosed are a steam generating device and a semiconductor process apparatus. The steam generating device is configured to provide a dry gas to a drying chamber of a cleaning apparatus and comprises an evaporation cavity, a heating member and a negative pressure device, wherein the evaporation cavity is provided with a liquid inlet pipe and a steam outlet, the liquid inlet pipe being in communication with the evaporation cavity and being used for a solution to enter the evaporation cavity, and the steam outlet being in communication with the drying chamber and being used for steam to be discharged from the evaporation cavity; the heating member is arranged outside the evaporation cavity and is configured to heat the solution in the evaporation cavity to evaporate the solution into steam; and the negative pressure device is in communication with the evaporation cavity and is configured to create a negative pressure environment in the evaporation cavity. In the solution, the amount of volatilization of the solution can be effectively increased by combining the heating member with the negative pressure device.

Description

Steam generating device and semiconductor process equipment TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing, and particularly relates to a steam generating device and semiconductor process equipment. BACKGROUND

[0002] In the process of semiconductor processing, steam is often used. For example, wafer drying process is a key process of wet cleaning. After wafer cleaning, the water remaining on the wafer surface, especially the water in the deep hole of the wafer after etching, needs to be removed. With the increase of the number of stacked layers of the wafer storage chip, the aspect ratio of the wafer after deep silicon wet etching increases, and therefore, higher requirements are put forward for the drying of the deep hole of the wafer. If the water in the deep hole is not completely dried, water marks will be formed at the bottom of the deep hole, which will affect the film coating process after wafer deep hole etching, and ultimately affect the yield of the entire process production line.

[0003] The existing wafer drying process utilizes the Malengoni principle to generate steam. However, in the existing steam generating device, the desiccant is volatilized at room temperature, and the volatilization amount of the desiccant is low at room temperature.

[0004] Therefore, the existing steam generating device has the defect that the volatilization amount of the desiccant is low. SUMMARY

[0005] The purpose of the embodiments of the present application is to provide a steam generating device and semiconductor process equipment, which can solve the problem of low volatilization amount of the desiccant in the existing steam generating device in the related art.

[0006] In a first aspect, the embodiments of the present application provide a steam generating device for providing dry gas to a drying chamber of a cleaning device, comprising:

[0007] An evaporation cavity is provided with a liquid inlet pipe and a steam outlet. The liquid inlet pipe is in communication with the evaporation cavity and is used for supplying a solution into the evaporation cavity. The steam outlet is in communication with the drying chamber and is used for discharging steam in the evaporation cavity.

[0008] A heating element is arranged outside the evaporation cavity. The heating element is used for heating the solution in the evaporation cavity to evaporate the solution into steam.

[0009] A negative pressure device is in communication with the evaporation cavity and is used for forming a negative pressure environment in the evaporation cavity.

[0010] In a second aspect, the embodiments of the present application also provide a semiconductor process equipment, comprising a drying chamber and the steam generating device as described above, wherein the drying chamber is provided with a gas inlet, and the gas inlet is communicated with the steam outlet of the steam generating device.

[0011] In the embodiments of the present application, the heating member can heat the solution in the evaporation cavity, so that the solution is more easily evaporated, thereby increasing the volatilization amount of the solution, and the negative pressure device can form a negative pressure environment in the evaporation cavity, so that the boiling point of the solution is reduced, and the solution is more easily evaporated, thereby effectively increasing the volatilization amount of the solution. In this way, the volatilization amount of the solution can be effectively increased by combining the heating member and the negative pressure device. BRIEF DESCRIPTION OF DRAWINGS

[0012] FIG. 1 is a structural schematic diagram of a steam generating device disclosed by the embodiments of the present application;

[0013] FIG. 2 is a structural schematic diagram of a semiconductor process equipment disclosed by the embodiments of the present application;

[0014] FIG. 3 is a perspective view of an evaporation cavity disclosed by the embodiments of the present application;

[0015] FIG. 4 is an exploded view of the evaporation cavity disclosed by the embodiments of the present application;

[0016] FIG. 5 is a sectional view of the evaporation cavity disclosed by the embodiments of the present application;

[0017] FIG. 6 is a perspective view of the evaporation cavity disclosed by the embodiments of the present application (hidden cavity body);

[0018] FIG. 7 is a schematic diagram of the positional relationship between the cavity body and the heating member disclosed by the embodiments of the present application;

[0019] FIG. 8 is a perspective view of an evaporation assembly disclosed by the embodiments of the present application;

[0020] FIG. 9 is a schematic diagram of the positional relationship between the evaporation plate and the liquid nozzle disclosed by the embodiments of the present application;

[0021] FIG. 10 is a perspective view of the evaporation plate disclosed by the embodiments of the present application;

[0022] FIG. 11 is a partial enlarged view of the evaporation plate and the liquid nozzle disclosed by the embodiments of the present application;

[0023] FIG. 12 is a structural schematic diagram of the liquid nozzle disclosed by the embodiments of the present application;

[0024] FIG. 13 is a perspective view of the liquid nozzle disclosed by the embodiments of the present application;

[0025] FIG. 14 is a partial schematic view of the evaporation assembly disclosed by the embodiments of the present application.

[0026] Explanation of reference signs: 100-evaporation cavity; 110-cavity body; 111-liquid outlet; 112-first mounting port; 113-second mounting port; 114-connection flange; 115-sealing ring mounting groove; 120-cavity cover; 121-liquid inlet pipe; 122-vapor outlet; 123-pressure relief port; 124-pressure detection port; 125-back pressure inlet; 130-evaporation assembly; 131-evaporation plate; 132-liquid nozzle; 1321-injection hole; 1322-main flow channel; 133-bracket; 134-flow guide plate; 135-connection pipe; 136-enclosure plate; 1361-overflow protrusion; 137-first sealing ring; 138-connection plate; 139-nozzle plug; 140-circulation pipe; 150-liquid level pipe; 160-liquid level observation pipe; 170-main air outlet pipe; 171-vapor air outlet pipe; 172-exhaust pipe; 180-back pressure pipe; 190-pressure relief pipe; 101-second sealing ring; 200-drying chamber; 210-vapor nozzle; 300-wafer; 400-negative pressure device; 500-circulation pump; 600-heating element; 700-pressure detection element; 800-liquid level detection element; 900-safety pressure relief valve; 1000-negative pressure control valve; 1100-back pressure control valve; 1200-vapor control valve; 1300-exhaust control valve; 1400-exhaust device. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0028] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", and the like are generally of a kind and are not limited in number, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the objects before and after are in an "or" relationship.

[0029] The vapor generating device and the semiconductor process equipment provided by the embodiments of the present application will be described in detail below with reference to the drawings and specific embodiments and application scenarios.

[0030] Referring to FIGS. 1-14, the steam generating device provided by the embodiments of the present application, which is used to provide dry gas to the drying chamber 200 of the cleaning equipment, can include an evaporation cavity 100 and a heating member 600.

[0031] The evaporation cavity 100 is provided with a liquid inlet pipe 121 and a steam outlet 122. The liquid inlet pipe 121 can be in communication with the evaporation cavity 100 and is used to supply solution into the evaporation cavity 100. The steam outlet 122 can be used to discharge steam in the evaporation cavity 100, and the steam outlet 122 can be in communication with the drying chamber 200, so that the steam discharged through the steam outlet 122 can enter the drying chamber 200 to process the wafer 300. The heating member 600 can be arranged outside the evaporation cavity 100. The heating member 600 is used to heat the solution in the evaporation cavity 100 to evaporate the solution into steam. By heating the solution through the heating member 600, the solution can be more easily evaporated, thereby effectively increasing the evaporation amount of the solution.

[0032] Here, the steam can enter the drying chamber 200 through the air extraction device of the drying chamber 200 itself. The steam is the dry gas described above, which is used to dry the wafer 300 in the drying chamber 200.

[0033] It should be noted that the heating member 600 is arranged outside the evaporation cavity 100, which can avoid directly heating the solution to avoid combustion or explosion of the solution or steam during the heating process. In the present embodiment, the heating member 600 can be arranged at the bottom or side of the evaporation cavity 100.

[0034] In addition, the steam generating device can further include a negative pressure device 400. The negative pressure device 400 can be in communication with the evaporation cavity 100 and can be used to form a negative pressure environment in the evaporation cavity 100. In this way, the negative pressure environment formed in the evaporation cavity 100 can lower the boiling point of the solution in the evaporation cavity 100, so that the solution is more easily evaporated, thereby effectively increasing the evaporation amount of the solution and the diffusion amount of the steam.

[0035] The steam generating device provided by the embodiments of the present application uses the combination of the heating member 600 and the negative pressure device 400 to increase the evaporation amount of the solution, which can effectively solve the problem of low evaporation amount of the drying agent of the existing steam generating device, and does not need to use nitrogen as a carrier. Instead, the steam can be directly extracted into the drying chamber 200 by relying on the air extraction device of the drying chamber 200 itself, which can ensure the concentration of the steam entering the drying chamber 200, and is beneficial to shorten the time required for the processing technology of the wafer 300.

[0036] The solution can be a desiccant solution, and the desiccant can be isopropyl alcohol (IPA). Isopropyl alcohol has the characteristics of small surface tension and easy evaporation. After isopropyl alcohol vapor enters the drying chamber 200, the Marangoni effect in the drying chamber 200 can be significantly improved. The drying gas (i.e., the vapor obtained after isopropyl alcohol evaporates) can diffuse to the bottom of the deep hole of the wafer 300, quickly displacing the residual moisture, which is conducive to shortening the time required for the wafer 300 to perform the drying process. However, isopropyl alcohol is a flammable and explosive organic substance, and the heating device for isopropyl alcohol in a semiconductor device is extremely strict. Therefore, as described above, the heating element 600 is arranged outside the evaporation cavity 100 to avoid direct heating of isopropyl alcohol.

[0037] It should be noted that the principle of the Marangoni effect mentioned above is that there is a tension difference between the interface of two substances with different surface tensions. The substance with high tension will move to the side where the substance with low tension is located, so that the substance with high tension is replaced by the substance with low tension. In the process of drying the wafer 300, the desiccant used has the characteristics of small surface tension and easy evaporation, that is, the surface tension of the desiccant is much smaller than that of water. Through the Marangoni effect, the water on the surface of the wafer 300 can be replaced by the desiccant, achieving the purpose of drying the wafer 300.

[0038] In some embodiments of the present application, the steam generating device further comprises a steam outlet pipe 171. The inlet of the steam outlet pipe 171 can be in communication with the steam outlet 122, and the outlet of the steam outlet pipe 171 can be used to communicate with the drying chamber 200, so as to input the steam in the evaporation cavity 100 into the drying chamber 200, so that the steam processes the wafer 300 in the drying chamber 200.

[0039] The steam control valve 1200 can be arranged in the fluid passage of the steam outlet pipe 171. The steam control valve 1200 can be used to control the on-off of the steam outlet pipe 171. When the steam control valve 1200 is in an open state, the steam outlet pipe 171 is turned on, and the steam in the evaporation cavity 100 can enter the drying chamber 200 through the steam outlet pipe 171. When the steam control valve 1200 is in a closed state, the steam outlet pipe 171 is cut off, and at this time the steam in the evaporation cavity 100 cannot enter the drying chamber 200.

[0040] In some embodiments, the negative pressure device 400 is configured to switch between a closed state and an open state, and the state of the negative pressure device 400 is associated with the state of the steam control valve 1200. The state of the negative pressure device 400 includes a closed state and an open state; the state of the steam control valve 1200 includes an open state and a closed state. When the steam control valve 1200 is in the open state, the negative pressure device 400 is in the closed state, and the steam outlet pipe 171 is open. Specifically, when the negative pressure device 400 forms a negative pressure environment in the evaporation cavity 100, dry gas can be formed in the evaporation cavity 100. When it is necessary to provide dry gas to the drying chamber 200, the negative pressure device 400 can be closed, and the steam control valve 1200 can be opened at the same time to open the steam outlet pipe 171, so that steam can enter the drying chamber 200. In this way, the suction device connected to the drying chamber 200 does not act on the negative pressure device 400, thereby protecting the negative pressure device 400. Furthermore, when the steam control valve 1200 is in the closed state, the negative pressure device 400 is in the open state. In this way, before the negative pressure environment is formed in the evaporation cavity 100, that is, when the negative pressure device 400 is working, the steam outlet pipe 171 is cut off, which can prevent low-concentration steam from entering the drying chamber 200 and can prevent the formation of a negative pressure environment in the evaporation cavity 100.

[0041] In other embodiments, the steam generator can not include the steam outlet pipe 171 and the steam control valve 1200, and the steam outlet 122 can be directly connected to the drying chamber 200.

[0042] In some embodiments of the present application, the steam generator can further include an evaporation assembly 130, which can be located in the evaporation cavity 100 to accelerate the evaporation of the solution.

[0043] The evaporation assembly 130 can include an evaporation plate 131 and a liquid nozzle 132. The evaporation plate 131 can be arranged in the evaporation cavity 100, the liquid nozzle 132 can be connected to the liquid inlet pipe 121, and the liquid nozzle 132 can be located above the evaporation plate 131 and used to spray the solution onto the evaporation plate 131. By spraying the solution onto the evaporation plate 131 through the liquid nozzle 132, the contact area between the solution and the evaporation plate 131 can be effectively increased, which is beneficial to the rapid evaporation of the solution, thereby effectively improving the evaporation effect of the solution. Further, in some embodiments, the liquid nozzle 132 is configured to atomize the solution to form liquid mist and spray it onto the evaporation plate 131. That is, the liquid nozzle 132 is provided with an atomizing structure, so that the solution can be atomized through the liquid nozzle 132 to form liquid mist with a very small diameter, and the liquid mist falls on the evaporation plate 131, which can effectively increase the contact area between the solution and the evaporation plate 131, which is beneficial to the rapid evaporation of the solution, thereby effectively improving the evaporation effect of the solution.

[0044] In other embodiments, the steam generating device can not include the evaporation assembly 130, or only the liquid nozzle 132 is arranged in the steam generating device.

[0045] In some embodiments, the evaporation assembly 130 can include at least two evaporation plates 131 and at least two liquid nozzles 132, each evaporation plate 131 is spaced from top to bottom, and each liquid nozzle 132 is arranged above each evaporation plate 131 in one-to-one correspondence, and each liquid nozzle 132 is sequentially communicated. In this way, the evaporation amount of the solution can be effectively increased, and the evaporation effect of the solution is further improved.

[0046] Of course, the evaporation assembly 130 can include only one evaporation plate 131 and one liquid nozzle 132.

[0047] In the present embodiment, as shown in FIG. 5, the evaporation assembly 130 can include three evaporation plates 131 and three liquid nozzles 132.

[0048] In some embodiments, as shown in FIG. 11, each liquid nozzle 132 can be provided with a main flow channel 1322 and a plurality of spray holes 1321, the main flow channel 1322 can pass through the liquid nozzle 132 along the vertical direction, the plurality of spray holes 1321 can be distributed along the circumferential direction of the liquid nozzle 132, and each spray hole 1321 can be inclinedly arranged towards the corresponding evaporation plate 131 of the liquid nozzle 132, and each spray hole 1321 is communicated with the main flow channel 1322. Each spray hole 1321 is used to spray the solution onto the corresponding evaporation plate 131 through the spray hole 1321.

[0049] In the present embodiment, the liquid nozzle 132 can be processed by using stainless steel material, and each liquid nozzle 132 can be provided with six spray holes 1321.

[0050] Any two adjacent evaporation plates 131 can be provided with a connecting pipe 135, each evaporation plate 131 can be provided with a communication hole, and each connecting pipe 135 extends downward through the communication hole on the upper evaporation plate of the two adjacent evaporation plates 131, and is respectively communicated with the main flow channel 1322 of the two liquid nozzles 132 above the two adjacent evaporation plates, so as to realize the sequential communication of the main flow channels 1322 of the plurality of liquid nozzles 132 and the communication with the liquid inlet pipe 121. Among them, the communication hole can be located at the middle position of the evaporation plate 131.

[0051] In other embodiments, each spray hole 1321 is perpendicular to the main flow channel.

[0052] Here, in order to ensure that the solution is sprayed from the spray hole 1321 of each liquid nozzle 132, the connection between each connecting pipe 135 and the main flow channel 1322 of the liquid nozzle 132 connected thereto can be provided with a first sealing ring 137 to improve the sealing of the connection between the connecting pipe 135 and the liquid nozzle 132. Specifically, the first sealing ring 137 can be an O-ring. It should be noted that in order to more clearly show the structure of the first sealing ring 137 installed in the main flow channel 1322, the connecting pipe 135 above the main flow channel 1322 in FIG. 11 and the uppermost connecting pipe 135 in FIG. 14 are in an exploded state with the main flow channel 1322. In fact, as shown in the two connecting pipes 135 other than the uppermost connecting pipe 135 in FIG. 14, a part of the connecting pipe 135 above the main flow channel 1322 is inserted into the main flow channel 1322, and an installation groove for accommodating the first sealing ring 137 is provided on the inner wall of the main flow channel 1322, and the first sealing ring 137 is sleeved on the outer periphery of the part of the connecting pipe 135 inserted into the main flow channel 1322, thereby achieving sealing between the connecting pipe 135 and the liquid nozzle 132.

[0053] In addition, as shown in FIGS. 5 and 14, in order to avoid the solution flowing directly to the bottom of the evaporation cavity 100, a nozzle blocking plate 139 can be provided on the bottommost evaporation plate 131, and the nozzle blocking plate 139 can be used to block the communication hole of the bottommost evaporation plate 131. Specifically, the nozzle blocking plate 139 can be provided at the bottom end of the communication hole of the bottommost evaporation plate 131 to block the bottom end of the communication hole.

[0054] In some embodiments, the evaporation assembly 130 can further include a support 133, and the evaporation plate 131 can be connected with the support 133, and the top of the support 133 can be connected with the top of the evaporation cavity 100, so that the evaporation plate 131 can be fixed in the evaporation cavity 100 by the support 133. In addition, the bottom of the support 133 can be provided with a downwardly extending flow guide plate 134, and the flow guide plate 134 can be bent towards the evaporation plate 131. In this way, the flow guide plate 134 can guide the solution flowing out of the evaporation plate 131 to the bottom of the evaporation cavity 100, so as to facilitate the solution flowing to the liquid outlet 111 described below, and then facilitate the circulation pump 500 described below to guide the solution flowing out of the liquid outlet 111 into the liquid nozzle 132 again through the liquid inlet pipe 121.

[0055] Of course, the bottom of the support 133 can not be provided with the flow guide plate 134. Alternatively, the evaporation assembly 130 can not include the support 133, and the evaporation plate 131 can be directly connected with the side wall of the evaporation cavity 100.

[0056] In the embodiment, the evaporation assembly 130 can include two brackets 133, and each evaporation plate 131 is connected with the two brackets 133 respectively at two opposite edges, so that the stability of the evaporation plate 131 can be improved. Here, the top end of the bracket 133 can be connected with the cavity cover 120 described below by a screw.

[0057] In some embodiments, the evaporation plate 131 can be provided with a connecting plate 138 at each of the two opposite edges, the two connecting plates 138 are connected with the two brackets 133 respectively and in a fit manner, and the two connecting plates 138 can be connected with the two brackets 133 respectively by a screw. Here, the two connecting plates 138 can be in an integral structure with the evaporation plate 131, so as to reduce the connecting structure and improve the connecting strength between the evaporation plate 131 and the bracket 133.

[0058] In the embodiment, the evaporation plate 131 and the bracket 133 can be both bent from a stainless steel plate, specifically, the evaporation plate 131 and the bracket 133 can be both bent from a 316 stainless steel plate.

[0059] In some embodiments, the edge of the evaporation plate 131 can be provided with a surrounding plate 136, and the surrounding plate 136 can be connected with the evaporation plate 131 to form an evaporation groove for carrying the solution, so that the evaporation plate 131 can carry a certain amount of solution, which is conducive to increasing the volatilization amount of the solution. Of course, the edge of the evaporation plate 131 can not be provided with the surrounding plate 136.

[0060] Here, the surrounding plate 136 can be welded on the upper surface of the evaporation plate 131, and the surrounding plate 136 can be processed from a stainless steel plate. The height of the surrounding plate 136 can be 5 mm.

[0061] Further, in some embodiments, as shown in FIG. 11, at least part of the top of the surrounding plate 136 is provided with a sawtooth-shaped overflow protrusion 1361, so that the sawtooth-shaped overflow protrusion 1361 can break the surface tension of the solution, and when the solution fills the evaporation groove, it is easier to flow out over the surrounding plate of the evaporation groove, so that the solution falls to the bottom of the evaporation cavity 100 and is pumped to the liquid inlet pipe 121 by the circulating pump 500 described below and is introduced into the liquid nozzle 132 through the liquid inlet pipe 121, so that the liquid nozzle 132 sprays the solution onto the corresponding evaporation plate 131 for evaporation. Of course, the top of the surrounding plate 136 can not be provided with the sawtooth-shaped overflow protrusion 1361.

[0062] In the embodiment, the surrounding plate 136 can include two first parts perpendicular to the bracket 133 and two second parts parallel to the bracket 133, the top of each of the two first parts can be provided with a sawtooth-shaped overflow protrusion 1361, and here, a gap can be provided between the two second parts and the two brackets 133, and the top end of each of the two second parts can also be provided with a sawtooth-shaped overflow protrusion 1361.

[0063] In some embodiments of the present application, the evaporation cavity 100 can be further provided with a liquid outlet 111, which can be arranged at the bottom of the evaporation cavity 100. The steam generating device can further include a circulating pump 500, an inlet of the circulating pump 500 can be in communication with the liquid outlet 111, and an outlet of the circulating pump 500 can be in communication with the liquid inlet pipe 121. The circulating pump 500 can extract the solution at the bottom of the evaporation cavity 100 through the liquid outlet 111, and make the solution enter the liquid nozzle 132 through the liquid inlet pipe 121, and spray the solution onto the evaporation plate 131 through the liquid nozzle 132. In this way, the solution can be continuously sprayed on the evaporation plate 131, effectively improving the evaporation effect of the solution.

[0064] In other embodiments, the steam generating device can not include the circulating pump 500.

[0065] In the present embodiment, the steam generating device can further include a circulating pipe 140, an inlet of the circulating pipe 140 is in communication with the liquid outlet 111, and an outlet of the circulating pipe 140 is in communication with the liquid inlet pipe 121. The circulating pump 500 can be arranged in the fluid passage of the circulating pipe 140.

[0066] In some embodiments of the present application, the evaporation cavity 100 can be a metal piece, which can not only transfer the heat of the heating piece 600, but also conduct static electricity, so that the static electricity can be conducted away in time, avoiding sparks caused by the presence of static electricity and causing the solution or steam to burn. Here, the evaporation cavity 100 can be made of stainless steel material, specifically, the evaporation cavity 100 can be made of 316 stainless steel.

[0067] Further, in some embodiments, the surface of the evaporation cavity 100 is subjected to electrolytic polishing treatment.

[0068] Of course, the evaporation cavity 100 can also be a non-metal piece.

[0069] In some embodiments of the present application, the evaporation cavity 100 can further be provided with a back pressure inlet 125, a back pressure pipe 180 and a back pressure control valve 1100. The two ends of the back pressure pipe 180 can be in communication with the back pressure inlet 125 and a back pressure gas storage tank respectively. The back pressure gas in the back pressure gas storage tank enters the evaporation cavity 100 through the back pressure inlet 125 via the back pressure pipe 180. The back pressure control valve 1100 is arranged on the fluid passage of the back pressure pipe 180 and can be used to control the opening and closing of the back pressure pipe 180. After the process is completed, the steam generator stops supplying steam. At this time, the evaporation cavity 100 is still in a negative pressure environment. The back pressure control valve 1100 is turned on to make the back pressure gas enter the evaporation cavity 100, so that the evaporation cavity 100 returns to a normal pressure state. In this way, the steam can be prevented from diffusing in a negative pressure environment, and the steam can be diluted, so that the steam explosion or combustion can be avoided, thereby playing a protective role.

[0070] Here, the back pressure gas can be an inert gas, and specifically can be nitrogen.

[0071] In other embodiments, the evaporation cavity 100 can not be provided with the back pressure inlet 125, the back pressure pipe 180 and the back pressure control valve 1100.

[0072] In some embodiments, the steam generator can further include a pressure detection element 700. The evaporation cavity 100 can be provided with a pressure detection port 124. The pressure detection element 700 is arranged at the pressure detection port 124 and is used to detect the pressure in the evaporation cavity 100. In this way, the pressure in the evaporation cavity 100 can be monitored, so that the evaporation cavity 100 is prevented from exploding due to excessive pressure in the evaporation cavity 100.

[0073] In addition, the pressure detection element 700 can be in communication connection with the back pressure control valve 1100. When the pressure detection element 700 detects that the pressure in the evaporation cavity 100 reaches a preset pressure value, the back pressure control valve 1100 closes the back pressure inlet 125, so that the back pressure gas cannot enter the evaporation cavity 100 any more, thereby ensuring that the pressure in the evaporation cavity 100 reaches a required state. Here, the pressure detection element 700 can be a pressure sensor.

[0074] Here, the preset pressure value can be a normal pressure value.

[0075] In the present embodiment, the pressure detecting element 700 can also be used to detect whether a negative pressure environment is formed in the evaporation cavity 100, and in the case that the pressure detecting element 700 detects that the pressure in the evaporation cavity 100 reaches a negative pressure, the negative pressure device 400 is controlled to be closed. Specifically, before the process starts, the negative pressure device 400 is opened, the negative pressure device 400 draws the gas in the evaporation cavity 100 out, which is discharged to the exhaust pipe 172 described below, and the negative pressure device 400 can form a negative pressure environment in the evaporation cavity 100, and in the case that the pressure detecting element 700 detects that the pressure in the evaporation cavity 100 reaches a negative pressure, the negative pressure device 400 is controlled to be closed and the exhaust control valve 1300 described below is controlled to be closed, while the steam control valve 1200 is controlled to be opened, so that the steam in the evaporation cavity 100 can enter the drying chamber 200 through the steam outlet pipe 171.

[0076] In other embodiments, the steam generating device can not include the pressure detecting element 700, or the pressure detecting element 700 is not in communication with the back pressure control valve 1100, and the pressure detecting element 700 is only used to detect the pressure in the evaporation cavity 100, where the pressure detecting element 700 can be a pressure gauge.

[0077] In some embodiments of the present application, the steam generating device can also include an exhaust pipe 172 and an exhaust control valve 1300, the inlet of the exhaust pipe 172 can be in communication with the outlet of the negative pressure device 400, the outlet of the exhaust pipe 172 can be used to communicate with the exhaust device 1400, and the exhaust control valve 1300 can be used to control the on-off of the exhaust pipe 172. Before the process starts, i.e. before the steam is input into the drying chamber 200, the exhaust control valve 1300 can be controlled to turn on the exhaust pipe 172, so that the steam mixed with back pressure gas is discharged through the negative pressure device 400 into the exhaust pipe 172 and then into the exhaust device 1400 through the exhaust pipe 172, so that the steam mixed with back pressure gas can be prevented from being input into the drying chamber 200. In order to prevent the steam from leaking from the exhaust pipe 172, the exhaust control valve 1300 is controlled to cut off the exhaust pipe 172 after the process starts, so that the steam cannot pass through the exhaust pipe 172.

[0078] Here, the exhaust device 1400 can be a factory exhaust system.

[0079] Of course, the steam generating device can not include the exhaust pipe 172 and the exhaust control valve 1300.

[0080] In some embodiments, the steam generating device can further comprise at least one of a concentration detecting element and a conduction time detecting element. The concentration detecting element can be arranged at the outlet of the exhaust pipe 172 and used to detect the steam concentration of the gas exhausted by the exhaust pipe 172. The concentration detecting element can be in communication with the exhaust control valve 1300. When the concentration detecting element detects that the steam concentration reaches a preset concentration value, the exhaust control valve 1300 is controlled to cut off the exhaust pipe 172. The conduction time detecting element can be used to detect the conduction time of the exhaust pipe 172, specifically, the conduction time detecting element can be used to detect the opening time of the exhaust control valve 1300. When the conduction time detecting element detects that the conduction time of the exhaust pipe 172 reaches a preset time, the exhaust control valve 1300 is controlled to cut off the exhaust pipe 172. In this way, steam leakage can be effectively avoided, and the safety of the steam generating device can be improved.

[0081] Here, the concentration detecting element can be a concentration detector, and specifically, an isopropyl alcohol detector. The conduction time detecting element can be a time sensor.

[0082] In other embodiments, the steam generating device can not comprise the concentration detecting element and the conduction time detecting element, and the exhaust control valve can be manually closed and opened.

[0083] Further, in some embodiments, the steam generating device can further comprise an air outlet pipe, which can comprise the main air outlet pipe 170, the steam air outlet pipe 171, and the exhaust pipe 172. The inlet of the main air outlet pipe 170 is in communication with the steam outlet 122. The inlets of the steam air outlet pipe 171 and the exhaust pipe 172 are in communication with the outlet of the main air outlet pipe 170. The outlet of the steam air outlet pipe 171 is in communication with the drying chamber 200, and the outlet of the exhaust pipe 172 is in communication with the exhaust device 1400. Here, the negative pressure device 400 can be a negative pressure pump, and the negative pressure pump can be arranged in the fluid passage of the main air outlet pipe 170.

[0084] Further, the main air outlet pipe 170 can be provided with a negative pressure control valve 1000 for controlling the on-off of the main air outlet pipe 170.

[0085] In some embodiments, the steam generating device can further comprise a liquid level detecting element 800 for detecting the liquid level of the solution in the evaporation cavity 100. In this way, the liquid level in the evaporation cavity 100 can be monitored, and the solution in the evaporation cavity 100 can be prevented from being too little to circulate.

[0086] Further, in some embodiments, the steam generating device can further include a liquid level tube 150, a bottom end of the liquid level tube 150 being in communication with a bottom end of the evaporation cavity 100, specifically, the evaporation cavity 100 is provided with a first mounting port 112, the bottom end of the liquid level tube 150 is connected with the first mounting port 112, a top end of the liquid level tube 150 is connected with a top end of the evaporation cavity 100, and the liquid level tube 150 is in communication with the evaporation cavity 100, a liquid level in the liquid level tube 150 is consistent with a liquid level in the evaporation cavity 100, and a liquid level detection element 800 is arranged on the liquid level tube 150 and used for detecting the liquid level in the liquid level tube 150, so that the liquid level detection element 800 can indirectly detect the liquid level height in the evaporation cavity 100, without the need to arrange the liquid level detection element 800 in the evaporation cavity 100, which is conducive to improving the safety of the steam generating device. Here, the liquid level detection element 800 can be an optical fiber liquid level sensor to play a role in explosion prevention.

[0087] In the present embodiment, the liquid level detection element 800 can include a plurality of liquid level detection elements 800, which are arranged at intervals on the liquid level tube 150 and are respectively used for detecting high liquid level, normal liquid level, low liquid level and empty liquid level.

[0088] Further, the steam generating device can further include a liquid level observation tube 160, a bottom end of the liquid level observation tube 160 can be connected with a bottom end of the evaporation cavity 100, a top end of the liquid level observation tube 160 can be connected with a middle portion of the evaporation cavity 100, and the liquid level observation tube 160 can be in communication with the evaporation cavity 100, a liquid level height in the liquid level observation tube 160 is consistent with a liquid level height in the evaporation cavity 100, and the liquid level observation tube 160 is of a transparent structure to facilitate an operator to observe the liquid level height in the evaporation cavity 100.

[0089] In addition, the evaporation cavity 100 can be further provided with a pressure relief port 123 and a safety pressure relief valve 900, the pressure relief port 123 can be used to communicate with the exhaust device 1400 through a pressure relief pipe 190, and the safety pressure relief valve 900 can be arranged on a fluid passage of the pressure relief pipe 190 and can be used to control the opening and closing of the pressure relief pipe 190. In this way, when the pressure in the evaporation cavity 100 is too large, the safety pressure relief valve 900 can conduct the pressure relief pipe 190 to make the gas in the evaporation cavity 100 exhaust into the exhaust device 1400, so as to reduce the pressure in the evaporation cavity 100.

[0090] In some embodiments, the evaporation cavity 100 can be provided with a temperature detection element for detecting the temperature of the evaporation cavity 100, and the evaporation cavity 100 can be provided with a second mounting port 113, and the temperature detection element is arranged at the second mounting port 113. Here, the temperature detection element can be a temperature sensor.

[0091] Further optionally, the temperature detecting element can be in communication connection with the steam control valve 1200, in the case that the temperature detecting element detects that the temperature of the evaporation cavity 100 reaches the preset temperature, the steam control valve 1200 can be opened, so that the steam outlet pipe 171 is conducted, so as to input the steam in the evaporation cavity 100 into the drying chamber 200, so that the steam control valve 1200 can be automatically controlled to be opened, which is beneficial to reduce manual operation.

[0092] In some embodiments, the evaporation cavity 100 can include a cavity body 110 and a cavity cover 120, the top end of the cavity body 110 is provided with a connecting flange 114, the connecting flange 114 is arranged around the cavity body 110, and the cavity cover 120 is arranged on the cavity body 110 by connecting with the connecting flange 114. In order to improve the sealing performance of the evaporation cavity 100, a second sealing ring 101 is arranged between the cavity cover 120 and the connecting flange 114. Here, in order to avoid the second sealing ring 101 from moving under force, a second sealing ring mounting groove 115 can be arranged on the top surface of the connecting flange 114, and part of the second sealing ring 101 is embedded in the sealing ring mounting groove 115.

[0093] In the embodiment, the heating element 600 can be a silicone rubber heater, which can be adhered to the bottom of the cavity body 110 by vulcanization.

[0094] The steam generating device provided by the embodiment of the present application injects the solution into the bottom of the evaporation cavity 100, and the heating element 600 heats the solution in the evaporation cavity 100 to a certain temperature by heat conduction. Then, the circulating pump 500 is started, and the circulating pump 500 inputs the solution at the bottom of the evaporation cavity 100 into the liquid nozzle 132. The liquid nozzle 132 sprays the solution on the evaporation plate 131, part of the solution is evaporated in the spraying process and on the evaporation plate 131 to form steam, and when the solution on the evaporation plate 131 fills the evaporation groove, it overflows back to the bottom of the evaporation cavity 100 and continues to be pumped into the liquid nozzle 132 by the circulating pump 500. When the drying chamber 200 needs to be supplied with steam, the negative pressure control valve 1000 and the steam control valve 1200 are opened, and the negative pressure device 400 is closed, so that the steam outlet pipe 171 is conducted, and the steam in the evaporation cavity 100 is input into the drying chamber 200 through the steam outlet pipe 171. The steam concentration of the steam input into the drying chamber 200 by the steam generating device provided by the present application can be more than 80%, while the steam concentration in the mixed gas input into the drying chamber 200 by the existing method of using nitrogen as a steam carrier is about 10%.

[0095] Based on the steam generation device provided in the embodiments of the present application, the embodiments of the present application further provide a semiconductor process equipment, which can include a drying chamber 200 and the steam generation device provided in any of the above embodiments. The drying chamber 200 can be provided with a gas inlet, which can be in communication with the steam outlet 122 of the steam generation device, in particular, the gas inlet can be in communication with the outlet of the steam outlet pipe 171.

[0096] The beneficial effects achieved by the semiconductor process equipment provided in the embodiments of the present application are consistent with the beneficial effects achieved by the steam generation device provided in the embodiments of the present application, and thus will not be described here.

[0097] In some embodiments, the drying chamber 200 can be provided with a wafer 300, and the drying chamber 200 can be further provided with at least two steam nozzles 210. Each steam nozzle 210 can be in communication with the gas inlet, and the spraying direction of each steam nozzle 210 can be towards the wafer 300. In this way, the processing effect of the steam on the wafer 300 can be improved.

[0098] In some embodiments, the drying chamber 200 can be provided with an air extraction device, which can be used to extract the steam in the evaporation cavity 100. Here, the air extraction device can be an air extraction pump.

[0099] The embodiments of the present application are described above in combination with the accompanying drawings, but the present application is not limited to the above specific embodiments, which are only illustrative rather than limiting. Those skilled in the art can make many forms under the guidance of the present application without departing from the scope of the present application and the protection scope of the claims, which all belong to the protection scope of the present application.

Claims

1. A steam generating device for providing drying gas to a drying chamber of a laundry appliance, characterized in that, The steam generating device comprises: an evaporation cavity provided with a liquid inlet pipe and a steam outlet, the liquid inlet pipe being in communication with the evaporation cavity and used for allowing a solution to enter the evaporation cavity, and the steam outlet being in communication with the drying chamber and used for allowing steam in the evaporation cavity to be discharged; a heating element arranged outside the evaporation cavity, the heating element being used for heating the solution in the evaporation cavity to evaporate the solution into the steam; a negative pressure device in communication with the evaporation cavity and used for forming a negative pressure environment in the evaporation cavity.

2. The steam generating device according to claim 1, characterized by The steam generating device further comprises a steam outlet pipe, an inlet of the steam outlet pipe being in communication with the steam outlet, an outlet of the steam outlet pipe being in communication with the drying chamber, and a steam control valve being arranged in a fluid passage of the steam outlet pipe and used for controlling opening and closing of the steam outlet pipe.

3. The steam generating device according to claim 2, wherein The state of the negative pressure device is associated with the state of the steam control valve; when the steam control valve is in an open state, the negative pressure device is in a closed state; and when the steam control valve is in a closed state, the negative pressure device is in an open state.

4. The steam generating device of claim 1, wherein, The steam generating device further comprises an evaporation assembly arranged in the evaporation cavity, the evaporation assembly comprising: an evaporation plate arranged in the evaporation cavity; a liquid nozzle in communication with the liquid inlet pipe, the liquid nozzle being arranged above the evaporation plate and used for spraying the solution onto the evaporation plate.

5. The steam generating device according to claim 4, wherein The liquid nozzle is arranged to atomize the solution into liquid mist and spray the liquid mist onto the evaporation plate.

6. The steam generating device according to claim 4 or 5, characterized in that The evaporation assembly comprises at least two evaporation plates and at least two liquid nozzles, each of the evaporation plates is arranged in a spaced-apart manner from top to bottom, each of the liquid nozzles is arranged above a corresponding evaporation plate in a one-to-one correspondence, and each of the liquid nozzles is in communication with the next one in sequence.

7. The steam generating device of claim 6, wherein, Each of the liquid nozzles is provided with a main flow channel and a plurality of spray holes, the main flow channel penetrates the liquid nozzle in a vertical direction, the plurality of spray holes are arranged in a circumferential direction of the liquid nozzle, each of the spray holes is arranged in an inclined manner towards a corresponding evaporation plate and is in communication with the main flow channel; and the liquid nozzle is used for spraying the solution onto the corresponding evaporation plate through the spray holes. Each of the evaporation plates is provided with a communication hole, and each of the connecting pipes extends downward through the communication hole of the evaporation plate on the upper layer of the two adjacent evaporation plates and is in communication with the main flow channels of the two liquid nozzles arranged above the two adjacent evaporation plates, respectively.

8. The steam generating device according to claim 7, wherein a nozzle blocking plate is arranged on the evaporation plate on the bottom layer, and the nozzle blocking plate is used for blocking the communication hole of the evaporation plate on the bottom layer.

9. The steam generating device of claim 4, wherein, The evaporation assembly further comprises a support, the evaporation plate is connected with the support, a top of the support is connected with a top of the evaporation cavity, a bottom of the support is provided with a downwardly extending flow guide plate, and the flow guide plate is bent towards the evaporation plate.

10. The steam generating device according to claim 4, wherein The edge of the evaporation plate is provided with a surrounding plate connected with the evaporation plate to form an evaporation groove for carrying the solution, and the top of at least part of the surrounding plate is provided with a serrated overflow protrusion.

11. The steam generating device of claim 1, wherein, The evaporation cavity is further provided with a liquid outlet arranged at the bottom of the evaporation cavity. The steam generating device further comprises a circulating pump, an inlet of the circulating pump being in communication with the liquid outlet, and an outlet of the circulating pump being in communication with the liquid inlet pipe.

12. The steam generating device of claim 1, wherein, The evaporation cavity is a metal piece.

13. The steam generating device of claim 1, wherein, The evaporation cavity is further provided with a back pressure inlet, a back pressure pipe and a back pressure control valve, two ends of the back pressure pipe being in communication with the back pressure inlet and a back pressure gas storage tank respectively, the back pressure inlet being used for allowing back pressure gas to enter the evaporation cavity, and the back pressure control valve being arranged on a fluid passage of the back pressure pipe and being used for controlling the opening and closing of the back pressure pipe.

14. The steam generating device of claim 13, wherein, The steam generating device further comprises a pressure detection element, and the evaporation cavity is provided with a pressure detection port, the pressure detection element being arranged at the pressure detection port and being used for detecting the pressure in the evaporation cavity. The pressure detection element is in communication connection with the back pressure control valve, in the case that the pressure detection element detects that the pressure in the evaporation cavity reaches a preset pressure value, the back pressure control valve closes the back pressure inlet, and / or, The pressure detection element is further used for detecting whether a negative pressure environment is formed in the evaporation cavity, in the case that the pressure detection element detects that the pressure in the evaporation cavity reaches a negative pressure, the negative pressure device is controlled to be closed.

15. The steam generating device of claim 1, wherein, The steam generating device further comprises an exhaust pipe and an exhaust control valve, an inlet of the exhaust pipe being in communication with an outlet of the negative pressure device, an outlet of the exhaust pipe being used for being in communication with an exhaust device, and the exhaust control valve being used for controlling the opening and closing of the exhaust pipe.

16. The steam generating device of claim 15, wherein, The steam generating device further comprises at least one of a concentration detection element and a conduction time detection element, wherein: The concentration detection element is arranged at the outlet of the exhaust pipe and is used for detecting the steam concentration of the gas exhausted by the exhaust pipe, the concentration detection element is in communication connection with the exhaust control valve, in the case that the concentration detection element detects that the steam concentration reaches a preset concentration value, the exhaust control valve is cut off; The conduction time detection element is used for detecting the conduction time of the exhaust pipe, in the case that the conduction time detection element detects that the conduction time of the exhaust pipe reaches a preset time, the exhaust control valve is cut off.

17. A semiconductor process apparatus, characterized by, The steam generating device comprises a drying cavity and the steam generating device according to any one of claims 1-16, and the drying cavity is provided with a gas inlet in communication with a steam outlet of the steam generating device.

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