Heat dissipation member, vapor chamber, and functional module

Abstract

This heat dissipation member is provided with: an insulating plate having a first surface and a second surface positioned on the opposite side from the first surface; a first component joined to the first surface; a second component joined to the second surface; and a wick. The heat dissipation member has a hollow section in the first component or between the first component and the insulating plate, and the wick is positioned in the hollow section.

Description

Heat dissipation member, vapor chamber and functional module

[0001] The present disclosure relates to a heat dissipation member, a vapor chamber, and a functional module.

[0002] Japanese Patent Application Laid-Open No. 2021-131214 discloses a vapor chamber in which a wick is located in a hollow portion of a substrate.

[0003] The heat dissipation member according to the present disclosure comprises an insulating plate having a first surface and a second surface located opposite the first surface, a first component bonded to the first surface, a second component bonded to the second surface, and a wick, wherein the first component has a hollow portion within it or between the first component and the insulating plate, and the wick is located in the hollow portion.

[0004] The vapor chamber according to the present disclosure comprises the heat dissipation member described above and a refrigerant located in the hollow portion.

[0005] The functional module according to the present disclosure comprises: a heat-generating functional component; and the vapor chamber described above in which the functional component is mounted.

[0006] 9A is a perspective view showing a heat dissipation member and a vapor chamber according to a first embodiment of the present disclosure. FIG. 9B is a plan view showing a heat dissipation member and a vapor chamber according to a first embodiment of the present disclosure. FIG. 9C is a diagram illustrating the overall structure of a wick. FIG. 9D is a cross-sectional view illustrating the details of a wick. FIG. 9E is a cross-sectional view showing a heat dissipation member and a vapor chamber according to a second embodiment of the present disclosure. FIG. 9F is an exploded cross-sectional view showing a heat dissipation member and a vapor chamber according to a second embodiment of the present disclosure. FIG. 9G is a graph showing an example of the relationship between the thickness of a second component and the amount of warpage in the second embodiment. FIG. 9H is a cross-sectional view showing a heat dissipation member and a vapor chamber according to a third embodiment of the present disclosure. FIG. 9H is an exploded cross-sectional view showing a heat dissipation member and a vapor chamber according to a third embodiment of the present disclosure. FIG. 9I is a graph showing an example of the relationship between the thickness of a second component and the amount of warpage in the third embodiment. FIG. 9I is a diagram illustrating the heat dissipation effect of a vapor chamber according to a third embodiment. FIG. 9I is a diagram of a comparative example illustrating the heat dissipation effect of a vapor chamber according to a third embodiment. FIG. 9I is a rear view of a first component mainly including an upper structure, illustrating an example of a detailed structure of a first component and a hollow portion according to a fourth embodiment. FIG. 9I is a longitudinal cross-sectional view taken along line B1-B1 of FIG. 9A . 10B 。 FIG. 10C is a plan view of a second component mainly including the structure of the lower wall of the first component, illustrating a detailed structural example of the first component and the hollow portion of the fourth embodiment. FIG. 10D is a longitudinal cross-sectional view taken along line B2-B2 of FIG. 10A illustrating a detailed structural example of the first component and the hollow portion of the fourth embodiment. FIG. 10E is an enlarged view of a portion C1 of FIG. 10B illustrating a detailed structural example of the first component and the hollow portion of the fourth embodiment. FIG. 10F is a plan view of a heat dissipation member and a vapor chamber of a fifth embodiment of the present disclosure. FIG. 10G is a longitudinal cross-sectional view of a heat dissipation member and a vapor chamber of the fifth embodiment of the present disclosure. FIG. 10H is a bottom view of a heat dissipation member and a vapor chamber of the fifth embodiment of the present disclosure. FIG. 10I is a cross-sectional view of a heat dissipation member and a vapor chamber according to a sixth embodiment of the present disclosure. FIG. 10I is a cross-sectional view of a heat dissipation member and a vapor chamber according to a seventh embodiment of the present disclosure. FIG. 10I is a cross-sectional view of a heat dissipation member and a vapor chamber according to an eighth embodiment of the present disclosure. FIG. 10I is a view showing a functional module according to a ninth embodiment of the present disclosure. FIG. 10I is a view showing a functional module according to a tenth embodiment of the present disclosure. FIG. 10I is a view showing a functional module according to an eleventh embodiment of the present disclosure. FIG. 10I is a view showing a functional module according to a twelfth embodiment of the present disclosure.FIG. 22 is a diagram illustrating a functional module according to a thirteenth embodiment of the present disclosure.

[0007] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. Below, the up and down directions may be indicated when describing each part. However, these directions may be different from the directions when the heat dissipation member 10 and the vapor chamber 1 are in use.

[0008] (Embodiment 1) Figures 1A and 1B are a perspective view and a plan view showing a heat dissipation member and a vapor chamber according to embodiment 1 of the present disclosure. Figure 2 is a diagram illustrating the overall structure of the wick 13. Figure 2 is a cross-sectional view taken along line A-A in Figure 1B. The wick 13 is indicated by shading in Figures 1B and 2. Figure 3 is a cross-sectional view showing the details of the wick 13. Hatching indicating a cross section has been omitted in Figure 3.

[0009] The heat dissipation member 10 according to the first embodiment of the present disclosure includes a base 11 having a hollow portion 111 and a wick 13 located in the hollow portion 111. The wick 13 is omitted from FIG. 1A . The vapor chamber 1 according to the first embodiment of the present disclosure includes the heat dissipation member 10 and a refrigerant located in the hollow portion 111. The hollow portion 111 may be sealed and decompressed. The refrigerant is a fluid that undergoes a phase transition between a gas phase and a liquid phase, and examples of the refrigerant that may be used include water, acetone, methanol, and ammonia.

[0010] The base 11 may have a first inner surface 112 exposed to the hollow portion 111 and a second inner surface 113 exposed to the hollow portion 111 and facing the first inner surface 112. The first inner surface 112 is an inner top surface, and a mounting portion 118 on which a heat source is mounted may be located in a part of the upper portion of the base 11. The second inner surface 113 is an inner bottom surface, and the lower portion of the base 11 may be configured to be cooled. The base 11 may be flat, and in this configuration, the heat dissipation member 10 may be called a heat dissipation plate.

[0011] 2, the base 11 may have an upper wall 11a covering the upper side of the hollow portion 111, a side wall 11b covering the sides of the hollow portion 111, a lower wall 11c covering the lower side of the hollow portion 111, and a first outer surface 114 which is the outer surface of the upper wall 11a. The surface of the upper wall 11a facing the hollow portion 111 may be a first inner surface 112. A mounting portion 118 for a heat source (see FIG. 1A) may be located on the first outer surface 114.

[0012] The material of the substrate 11 may be a material with high thermal conductivity, for example, a metal such as copper or aluminum, or silicon nitride (Si ３ N ４ ), silicon carbide (SiC), aluminum nitride (AlN), aluminum oxide (Al ２ O ３ The base 11 may be made of a single material, or may be made of a combination of multiple materials, such as a bottom plate portion made of ceramic and a side wall portion and a top plate portion made of metal.

[0013] The base 11 may include a plurality of support columns 115 that support the hollow portion 111. The support columns 115 may be located across the hollow portion 111 from the first inner surface 112 to the second inner surface 113.

[0014] The wick 13 may have a plurality of minute voids G and gaps g (see FIG. 3 ) and may be configured to transport the liquid phase refrigerant by capillary force generated in the minute voids G and gaps g. The wick 13 may be positioned so as to be in contact with the first inner surface 112. The wick 13 may be positioned so as to be spaced apart from the second inner surface 113.

[0015] As shown in FIG. 1B , the hollow portion 111 may include, in a planar perspective, a region 111A where the wick 13 is located and a region 111B where the wick 13 is not located. In FIG. 1B , the regions 111A and 111B are indicated by dashed lines. The absence of the wick 13 in a planar perspective means that the wick 13 is not located between the first inner surface 112 and the second inner surface 113. As shown in FIG. 2 , in the region 111A where the wick 13 is located, a space 111c may be located between the wick 13 and the second inner surface 113. The region 111B and the space 111c may function as a passage through which the gas-phase refrigerant flows. The region 111B may not be a region where the wick 13 is not located, but may be a region where the wick 13 occupies a smaller proportion than the region 111A. For example, a configuration may be adopted in which the wick 13 is located within a range of 1 / 3 of the height of the hollow portion 111 from the first inner surface 112, and the space portion where the wick 13 is not located is larger than the region 111A. Even with this configuration, the region 111B can function as a flow path through which more gas-phase refrigerant flows than the region 111A. Alternatively, there may be no difference in the arrangement of the wick 13 between the regions 111A and 111B. In other words, the wick 13 may be located in the region 111B as well as in the region 111A. In this case, the space portion 111c functions as a flow path through which the gas-phase refrigerant easily flows.

[0016] The second inner surface 113 of the base 11 may have convex portions 113a protruding upward and concave portions 113b deepening downward. The concave portions 113b may be lattice-shaped grooves in a plan view, or stripe-shaped or radial grooves in a plan view.

[0017] As shown in FIG. 3, the wick 13 may be configured such that a plurality of particles 50 are bonded together via a portion of each particle 50. The components of each particle 50 may be a metal such as copper. Bonding between adjacent particles 50 may be achieved by a sintering process to the extent that the plurality of particles 50 do not become densified. The particle diameter of the particles 50 may be 1 μm to 1000 μm, 10 μm to 700 μm, or 20 μm to 500 μm. The particle diameter D50 of the particles 50 may be 20 μm, 100 μm, or 200 μm. The particle diameter refers to the average of the major axis and the minor axis. The particle diameter D50 refers to the median particle diameter of the particle size distribution.

[0018] Each of the plurality of particles 50 may have a first structure. The first structure is a structure in which a plurality of protrusions protrude obliquely radially from an imaginary central axis and are arranged in multiple stages along the imaginary central axis. The first structure can be formed by growing the particles 50 according to a crystal orientation in electroplating. The plurality of protrusions may include a protrusion having a maximum thickness partway from the base to the tip of the protrusion.

[0019] Alternatively, each of the multiple particles 50 may have a second structure. The second structure may have a structure in which multiple protrusions, each having a maximum thickness midway from the base to the tip, protrude in at least four different directions. The four directions may include components of three-dimensional directions. That is, when the four directions are referred to as the first to fourth directions, the four directions may be directions in which the third or fourth direction intersects with a plane along the first and second directions. The second structure can be produced, for example, by first forming multiple fine powder particles by atomization, and then sintering the multiple fine powder particles to a degree that does not cause densification of the fine powder particles. By forming nearly spherical fine powder particles by atomization, and then sintering the multiple fine powder particles together, the surrounding fine powder particles become protrusions having a maximum thickness midway from the base to the tip.

[0020] Alternatively, each of the plurality of particles 50 may be a particle 50 having a third structure. The third structure is a spherical structure. The spherical shape is not limited to a strict sphere or an oblate sphere, but includes a sphere that includes distortions or small jagged edges. The particles 50 having the third structure can be formed, for example, by an atomization method.

[0021] The wick 13 may have a structure in which the entire plurality of particles 50 is fixed by bonding portions of adjacent particles 50 together. Bonding of portions of the particles 50 together may be achieved by spreading the plurality of particles 50 in a space so that portions of the particles 50 are in contact with each other, and then performing a sintering process in this state to an extent that does not promote densification of the plurality of particles 50. When spreading the plurality of particles 50 in a space, a medium such as a resin may not be present around the plurality of particles 50, and the plurality of particles 50 may be spread in the air or a vacuum as powder.

[0022] When particles 50 having the first or second structure are used, a wick 13 can be realized in which a large number of voids G of various sizes are located between the particles 50, and small gaps g are located within each particle 50, as shown in Figure 3. This wick 13 can achieve the function of transporting a liquid-phase refrigerant by the capillary force generated in the voids G and the gaps g. When particles 50 having the third structure are used, the degree of variation in the size of the voids G, the proportion of the voids G, and the amount of the gaps g will differ, but the function of transporting a liquid-phase refrigerant by the capillary force can be similarly achieved.

[0023] The wick 13 may be fixed in the hollow portion 111 so as to contact the first inner surface 112 (see FIG. 2 ). This fixation may be achieved by bonding the first inner surface 112 to a portion of the particles 50. The bonding of the particles 50 to each other in the wick 13 and the bonding of the particles 50 to the first inner surface 112 may be achieved by the same sintering process. That is, by placing a plurality of particles 50 in the hollow portion 111 with the first inner surface 112 facing downward and performing a sintering process to an extent that does not cause the plurality of particles 50 to become densified, the bonding of the plurality of particles 50 and the bonding of the wick 13 to the first inner surface 112 can be achieved.

[0024] In the vapor chamber 1 configured as described above, for example, a heat source is located on the mounting portion 118 on the upper surface of the base 11, and a cooling portion is located on the bottom surface of the base 11. The liquid-phase refrigerant transported near the heat source on the first inner surface 112 by the capillary force of the wick 13 receives heat from the heat source via the first inner surface 112, undergoing a phase transition to a gaseous refrigerant. This phase transition absorbs a large amount of heat from the heat source. The gaseous refrigerant then flows through the void G within the wick 13, the region 111B where the wick 13 is not located, and the layer on the second inner surface 113 side of the region 111A where the wick 13 is located, using these as passages, releasing heat via the second inner surface 113, thereby transitioning to a liquid-phase refrigerant. This phase transition releases a large amount of heat to the cooling portion. By repeating the above cycle, the vapor chamber 1 can transport a large amount of heat from the heat source to the cooling portion.

[0025] 4A and 4B are a cross-sectional view and an exploded cross-sectional view showing a heat dissipation member 10A and a vapor chamber 1A according to a second embodiment of the present disclosure. Fig. 5 is a graph showing an example of the relationship between the thickness of the second component and the amount of warpage in the second embodiment. The heat dissipation member 10A and the vapor chamber 1A according to the second embodiment differ in the structure of the outside of the hollow portion 111, but the structure inside the hollow portion 111 may be the same as that according to the first embodiment.

[0026] The heat dissipation member 10A and vapor chamber 1A according to the second embodiment may include an insulating plate 16 having a first surface 161 and a second surface 162 facing opposite to each other, a first component 14 bonded to the first surface 161, and a second component 15 bonded to the second surface 162. The first component 14 may have a structure in which the lower side of a hollow portion 111 is open, and the lower side of the hollow portion 111 may be covered by the first surface 161 of the insulating plate 16. The lower end surface of the first component 14 and the insulating plate 16 may be bonded via a bonding material 171 such as a brazing material so as to seal the hollow portion 111. In the second embodiment, the first component 14 and the insulating plate 16 correspond to a base having the hollow portion 111. A mounting portion 118 on which a heat source is mounted may be located on the upper surface of the first component 14.

[0027] The insulating plate 16 is an insulating member made of silicon nitride (Si３ N ４ ), silicon carbide (SiC), aluminum nitride (AlN), aluminum oxide (Al ２ O ３ ) or other ceramics.

[0028] The material of the first component 14 may be a material with high thermal conductivity, such as a metal such as copper or aluminum, or a conductor with low electrical resistance, such as a metal such as copper or aluminum.

[0029] The second component 15 has a solid structure such as a plate or block shape, and may be made of a metal such as copper or aluminum. The upper surface of the second component 15 and the second surface 162 of the insulating plate 16 may be joined via a joining material 172 such as a brazing material. The entire upper surface of the second component 15 may be joined to the second surface 162 of the insulating plate 16.

[0030] The first component 14 and the second component 15 may be made of the same material. The bonding material 171 that bonds the first component 14 and the bonding material 172 that bonds the second component 15 may be made of the same material. The first component 14 and the second component 15 may be approximately the same size in a planar perspective view. Approximately the same size means that the area of ​​one component is 120% or less of the area of ​​the other component, and one component overlaps with an area of ​​80% or more of the other component.

[0031] According to the heat dissipation member 10A and vapor chamber 1A of the second embodiment, since the insulating plate 16 is provided, the first component 14 on which the heat source is mounted can be electrically insulated from the insulating plate 16 or the second component 15. Therefore, in a higher-level device in which the vapor chamber 1A and the heat source are incorporated, the vapor chamber 1A is supported via the second component 15 or the insulating plate 16, and the part that supports the vapor chamber 1A can be electrically insulated from the first component 14 on which the heat source is mounted.

[0032] Furthermore, because the first component 14 and the insulating plate 16 are made of different materials, residual stress that causes warping may be applied between the first component 14 and the insulating plate 16 due to the difference in thermal expansion coefficients. However, with the heat dissipation member 10A and vapor chamber 1A of embodiment 2, the second component 15 is bonded to the second surface 162 of the insulating plate 16, so residual stress that causes warping on the opposite side is applied between the insulating plate 16 and the second component 15, resulting in a reduced overall amount of warping. The reduced amount of warping ensures stable contact between the mounting portion 118 and the heat source, maintaining efficient heat dissipation from the heat source. The term "contact" is not limited to direct contact, but also encompasses indirect contact, such as a highly thermally conductive connection via thermally conductive grease or the like.

[0033] Furthermore, the first component 14 has a structure with an opening at the bottom. Therefore, the bonding area between the first component 14 and the insulating plate 16 can be reduced by the opening, and therefore the residual stress generated between the first component 14 and the insulating plate 16 can be reduced. Therefore, the residual stress on the opposite side required for the second component 15 can be reduced in order to reduce the overall amount of warpage. Therefore, the thickness of the second component 15 can be reduced, and the overall thickness of the heat dissipation member 10A and the vapor chamber 1A can be reduced.

[0034] The first component 14 may have a top wall 11a and a side wall 11b. The second component 15 may be a plate extending along the second surface 162 of the insulating plate 16. The vertical dimension L14 of the first component 14 may be greater than the thickness L15 of the second component 15. L15 < L14 (1)

[0035] The relationship of the above formula (1) can further reduce the amount of warpage of the heat dissipation member 10A and the vapor chamber 1A due to thermal expansion. As shown in FIG. 5 , in a configuration in which the thickness L15 of the second component 15 is equal to the dimension L14, negative warpage occurs. However, as the thickness L15 of the second component 15 is gradually reduced, the amount of warpage transitions toward a positive direction. A positive amount of warpage refers to the amount of warpage deformation caused by increased residual stress on the second surface 162 of the insulating plate 16, resulting in a concave upper center. A negative amount of warpage refers to the opposite amount of warpage deformation. Therefore, the relationship of formula (1) can reduce the amount of negative warpage (i.e., reduce the absolute value of the negative amount of warpage).

[0036] The relationship between the dimension L14 and the thickness L15 may further include the condition of the following formula (2). This condition makes it possible to reduce the amount of warpage in both the positive and negative directions: L14 / 1.2≦L15≦L14 / 1.08 (2)

[0037] 5 was obtained by a test in which the amount of warpage was measured under the same temperature conditions for multiple vapor chambers 1A that had the same configuration except for the second component 15 and that each had multiple second components 15 of different thicknesses. In the test, the insulating plate 16 was made of silicon nitride ceramic with a thickness of 0.32 mm, the first component 14 was made of copper with a vertical dimension L14 of 1.2 mm (specifically, an upper wall 11a with a thickness of 0.8 mm plus a hollow portion 111 with a vertical dimension of 0.4 mm), the second component 15 was a copper plate, and the bonding materials 171 and 172 were brazing filler metals.

[0038] 6A and 6B are a cross-sectional view and an exploded cross-sectional view showing a heat dissipation member and a vapor chamber according to a third embodiment of the present disclosure. Fig. 7 is a graph showing an example of the relationship between the thickness of the second component and the amount of warpage in the sixth embodiment. A heat dissipation member 10B and a vapor chamber 1B according to the third embodiment may have the same configuration as the second embodiment, except for the structure of the first component 14B.

[0039] The heat dissipation member 10B and vapor chamber 1B according to the third embodiment may include an insulating plate 16 having a first surface 161 and a second surface 162 facing opposite to each other, a first component 14B bonded to the first surface 161, and a second component 15 bonded to the second surface 162. The first component 14B may have a hollow portion 111 and a structure covering the hollow portion 111 from above, below, and sides. The lower surface of the first component 14B and the first surface 161 of the insulating plate 16 may be bonded via a bonding material 171 such as a brazing material. The entire lower surface of the first component 14B may be bonded to the first surface 161 of the insulating plate 16. In the third embodiment, the first component 14B or the first component 14B and the insulating plate 16 correspond to a base having the hollow portion 111. A mounting portion 118 on which a heat source is mounted may be located on the upper surface of the first component 14B.

[0040] The material of the first component 14B may be a material with high thermal conductivity, such as a metal such as copper or aluminum, or a conductor with low electrical resistance, such as a metal such as copper or aluminum.

[0041] The first component 14B may have a configuration including an upper wall 11a, a side wall 11b, and a lower wall 11c that seal the hollow portion 111.

[0042] The first part 14B and the second part 15 may be substantially the same size in a planar perspective view, meaning that the area of ​​one part is 120% or less of the area of ​​the other part and one part overlaps with an area of ​​80% or more of the other part.

[0043] According to the heat dissipation member 10B and vapor chamber 1B of the third embodiment, the insulating plate 16 is provided, so that the first component 14B on which the heat source is mounted can be electrically insulated from the insulating plate 16 or the second component 15. Therefore, in a higher-level device in which the vapor chamber 1B and the heat source are incorporated, the vapor chamber 1B is supported via the second component 15 or the insulating plate 16, so that the portion supporting the vapor chamber 1B can be electrically insulated from the first component 14B on which the heat source is mounted.

[0044] Furthermore, because the first component 14B and the insulating plate 16 are made of different materials, the difference in thermal expansion coefficients may cause residual stress to be applied between the first component 14B and the insulating plate 16, which may cause warping. However, with the heat dissipation member 10B and vapor chamber 1B of embodiment 3, the second component 15 is bonded to the second surface 162 of the insulating plate 16, which causes residual stress to be applied between the insulating plate 16 and the second component 15, which may cause warping on the opposite side, thereby reducing the overall amount of warping. The reduced amount of warping ensures stable contact between the mounting portion 118 and the heat source, thereby maintaining efficient heat dissipation from the heat source.

[0045] The vertical dimension L14B of the first component 14B may be greater than the thickness L15 of the second component 15. L15 < L14B (3)

[0046] The relationship of the above formula (3) can further reduce the amount of warpage of the heat dissipation member 10B and the vapor chamber 1B due to thermal expansion. As shown in FIG. 7 , in a configuration in which the thickness L15 of the second component 15 is equal to the dimension L14B, negative warpage occurs. However, as the thickness L15 of the second component 15 is gradually reduced, the amount of warpage shifts toward the positive side. Therefore, the relationship of formula (3) can reduce the amount of negative warpage.

[0047] The relationship between the dimension L14B and the thickness L15 may further include the condition of the following formula (4), which makes it possible to reduce the amount of warpage in both the positive and negative directions: L14B / 1.33 ≦ L15 ≦ L14B / 1.05 (4)

[0048] 7 was obtained by a test in which the amount of warpage was measured under the same temperature conditions for multiple vapor chambers 1B each using multiple second components 15 of different thicknesses, with the same configuration except for the second component 15. In the test, the insulating plate 16 was made of silicon nitride ceramic with a thickness of 0.32 mm, the first component 14B was made of copper with a vertical dimension L14B of 2.0 mm (specifically, an upper wall 11a with a thickness of 0.8 mm, a lower wall 11c with a thickness of 0.8 mm, and a hollow portion 111 with a thickness of 0.4 mm), the second component 15 was a copper plate, and the joining materials 171 and 172 were brazing filler metals.

[0049] FIG. 8A is a diagram illustrating the heat dissipation effect of the vapor chamber 1B of embodiment 3. FIG. 8B is a diagram illustrating a comparative example. The comparative example of FIG. 8B employs a copper plate 81 instead of the first component 14. In FIGS. 8A and 8B, the heat transfer path 31 is represented by dotted shading. In the comparative example of FIG. 8B, the heat spread in the copper plate 81 is narrower than that in the hollow portion 111 of the vapor chamber 1B. Therefore, unless the copper plate 81 is thickened, the area through which heat is transferred on the underside of the copper plate 81 becomes narrower. Therefore, the thickness of the copper plate 81 cannot be reduced. Furthermore, since the thickness of the copper plate 81 cannot be reduced, the lower copper plate 82 is also thickened to reduce the amount of warping. Furthermore, the thermal conductivity of the copper plate 81 is lower than that of the hollow portion 111 of the vapor chamber 1B. Therefore, in the configuration of the comparative example, the overall thickness in the vertical direction increases, and thermal resistance increases. On the other hand, with the vapor chamber 1B of embodiment 3, heat is transported over a wide area due to the phase transition and movement of the refrigerant in the hollow portion 111 of the first component 14B, allowing the heat from the heat source 3 to be dissipated across the entire underside of the first component 14B with low thermal resistance. Furthermore, the presence of the hollow portion 111 in the first component 14B allows the thickness of the second component 15 to be smaller than the thickness of the first component 14B to reduce the amount of warping. This reduces the thickness of the second component 15, thereby lowering the thermal resistance of the second component 15. This achieves high cooling performance for the heat source 3 overall. Furthermore, while achieving the desired cooling performance, the thicknesses of the first component 14B and the second component 15 can be reduced, allowing for a smaller and thinner overall configuration. This contributes to the miniaturization and lower height of functional modules incorporating the vapor chamber 1B.

[0050] (Embodiment 4) Figures 9A to 10C are diagrams showing a detailed structural example of the first component 14C and the hollow portion 111 of embodiment 4. Figure 9A is a back view of a first member 11p1 that mainly includes the structure above the bottom wall 11c of the first component 14C. Figure 9B is a vertical cross-sectional view taken along line B1-B1 in Figure 9A. Figure 10A is a plan view of a second member 11p2 that mainly includes the structure of the bottom wall 11c of the first component 14C. Figure 10B is a vertical cross-sectional view taken along line B2-B2 in Figure 10A. Figure 10C is an enlarged view of a portion C1 in Figure 10B. In Figure 9A, reference numerals have been omitted from some of the multiple support columns 115 to avoid complication. The heat dissipation member 10C and vapor chamber 1C (see Figure 6A) of embodiment 4 have different structures within the first part 14C and hollow portion 111, but may have the same other configuration as embodiment 3, such as having the same insulating plate 16 and second part 15.

[0051] The first part 14C of embodiment 4 may be configured such that the first member 11p1 of Figures 9A and 9B and the second member 11p2 of Figures 10A and 10B are joined together, and a hollow portion 111 is formed between the first member 11p1 and the second member 11p2.

[0052] A plurality of support columns 115 may be positioned in the hollow portion 111. The plurality of support columns 115 may be joined to the lower wall 11c with brazing material or the like. The plurality of support columns 115 may include a first support column 115A that overlaps with the mounting portion 118 in a planar perspective view. The first support column 115A quickly absorbs heat from the heat source even when there is a time lag between the temperature of the heat source mounted on the mounting portion 118 rising and the refrigerant in the region close to the mounting portion 118 reaching a phase transition cycle corresponding to the high temperature. This makes it easier to achieve heat dissipation in response to the temperature rise of the heat source.

[0053] Furthermore, even if the temperature of the heat source rises and the internal pressure of the hollow portion 111 increases, the presence of the first support 115A can reduce deformation around the mounting portion 118 on the first outer surface 114. This stabilizes the contact state between the heat source and the heat dissipation member 10A, thereby achieving stable heat dissipation from the heat source.

[0054] Furthermore, the first support column 115A may have a larger cross-sectional area along the first outer surface 114 than the support columns 115 other than the first support column 115A. This configuration allows the first support column 115A to absorb a larger amount of heat from the heat source when the temperature of the heat source rises suddenly. This makes it easier to achieve heat dissipation in response to a sudden rise in the temperature of the heat source. Furthermore, deformation of the first outer surface 114 around the mounting portion 118 can be further reduced, allowing for more stable heat dissipation from the heat source.

[0055] The multiple support columns 115 may be evenly positioned in the hollow portion 111. In the example of Fig. 9A, the multiple support columns 115 are arranged in a lattice pattern, but the multiple support columns 115 may also be arranged radially from the first support column 115A. Even if the internal pressure of the hollow portion 111 increases due to the high temperature of the heat source, the multiple support columns 115 can reduce deformation of the heat dissipation member 10A and the first outer surface 114. Furthermore, because deformation of the first outer surface 114 is reduced, the contact state between the heat source and the heat dissipation member 10A is stabilized, and stable heat dissipation from the heat source can be achieved.

[0056] The first member 11p1 and the second member 11p2 may be made of a metal such as copper. Alternatively, the first member 11p1 may be made of a metal such as copper, and the second member 11p2 may be made of silicon nitride (Si ３ N ４ ), silicon carbide (SiC), aluminum nitride (AlN), aluminum oxide (Al ２ O ３ ) or other ceramics.

[0057] As shown in Fig. 9B , the first member 11p1 may be a portion including the top wall 11a, side wall 11b, and multiple support columns 115 of the first component 14C. As shown in Fig. 10B , the second member 11p2 may be a portion including the bottom wall 11c of the first component 14C. Note that a portion of the side wall 11b and a portion of the support columns 115 may be included on the second component 11p2 side, not on the first component 11p1 side. Furthermore, the first component 14C may include three or more parts including the first component 11p1 and the second component 11p2, and may be configured by joining three or more parts.

[0058] 9A, the first member 11p1 has a bonding surface S11p1 that is bonded to the second member 11p2 around the hollow portion 111 on the back surface, and the bonding surface S11p1 may have, in a planar perspective, a plurality of sides j1 to j4 and a plurality of corners k1 to k4 that surround the hollow portion 111. The bonding surface S11p1 may also have, in a planar perspective, first bulging portions k1a to k4a that bulge inward toward the hollow portion 111 at at least one of the plurality of corners k1 to k4. In the example of FIG. 9A, all of the four corners k1 to k4 have first bulging portions k1a to k4a.

[0059] The first bulging portions k1a to k4a increase the bonding area of ​​the corners k1 to k4, which are prone to large stress when the internal pressure of the hollow portion 111 increases, and reduce deformation of the heat dissipation member 10A due to the internal pressure. Furthermore, reducing deformation of the first outer surface stabilizes the contact state between the heat source and the heat dissipation member 10A, allowing for stable heat dissipation from the heat source.

[0060] Furthermore, the joining surface S11p1 may have a second bulge portion j1a, j3a that bulges inward toward the hollow portion 111 in the middle of at least one of the multiple side portions j1 to j4. The multiple side portions j1 to j4 may include short side portions j2, j4 and long side portions j1, j3. The second bulge portion j1a, j3a may be located on the long side portions j1, j3. The second bulge portion j1a, j3a may be located on the short side portions j2, j4. The second bulge portion j1a, j3a may be located at the center of the side portions j1, j3 in the longitudinal direction. Although not shown, the second bulge portion may be located at the center of the side portions j2, j4 in the longitudinal direction.

[0061] The provision of the second bulges j1a and j3a increases the bonding area of ​​the sides j1 and j3, which are prone to large stress when the internal pressure of the hollow portion 111 increases, thereby reducing deformation of the heat dissipation member 10A due to the internal pressure. Furthermore, reducing deformation of the first outer surface stabilizes the contact state between the heat source and the heat dissipation member 10A, thereby achieving stable heat dissipation from the heat source.

[0062] 9A , the first member 11p1 may have a sealing hole 119 that leads from the outside to the hollow portion 111 or blocks the passage between the outside and the hollow portion 111. The sealing hole 119 may be a through-hole that joins the first member 11p1 and the second member 11p2 and seals the hollow portion 111 in a state where the hollow portion 111 is decompressed after injecting a refrigerant into the hollow portion 111.

[0063] In a planar perspective view, the sealing hole 119 may overlap the first bulging portions k1a to k4a or the second bulging portions j1a and j3a. Furthermore, the sealing hole 119 may communicate with the first bulging portions k1a to k4a or the second bulging portions j1a and j3a.

[0064] In the process of sealing the sealing hole 119, the periphery of the sealing hole 119 is fixed, and a relatively large force is applied to the sealing hole 119. Therefore, by positioning the sealing hole 119 as described above, it is possible to reduce deformation of the periphery of the sealing hole 119 during sealing. This stabilizes the shape of the heat dissipation member 10A after sealing the sealing hole 119. This stabilizes the contact state between the heat source and the heat dissipation member 10A, allowing for stable heat dissipation from the heat source.

[0065] The first member 11p1 may have a plurality of sealing holes 119, and the plurality of sealing holes 119 may be located at a plurality of mutually opposing locations among the plurality of first bulge portions k1a to k4a and the plurality of second bulge portions j1a and j3a. FIG. 9A shows an example in which two sealing holes 119 are located at two opposing first bulge portions k1a and k3a. However, two sealing holes 119 may also be located at two opposing first bulge portions k2a and k4a, or two sealing holes 119 may also be located at the second bulge portions j1a and j3a. With this configuration, in the step of sealing the sealing holes 119, the periphery of the sealing holes 119 can be stably fixed by symmetrically fixing them to the base 11, and the step of sealing the sealing holes 119 can be stably performed. Of the first bulging portions k1a to k4a and the second bulging portions j1a and j3a described above, bulging portions where the sealing hole 119 is not located may be omitted.

[0066] The sealing hole 119 extends in a direction intersecting the first outer surface 114, while the first member 11p1 may have a horizontal hole 120 (see FIG. 9A ) connecting the sealing hole 119 and the hollow portion 111. The horizontal hole 120 may extend in a direction along the long sides j1 and j3, or may extend in a direction along the short sides j2 and j4.

[0067] 10A and 10B, the second member 11p2 has a joining surface S11p2 whose shape matches the joining surface S11p1 of the first member 11p1, and a joining surface 113c that joins to the lower end surfaces of the multiple pillars 115. The joining of the joining surface S11p1 to the joining surface S11p2, and the joining of the lower end surfaces of the pillars 115 to the joining surface 113c may be performed by brazing.

[0068] 10C , convex portions 113a and concave portions 113b may be located on the second inner surface (specifically, the bottom surface) 113 of the hollow portion 111 in the second member 11p2 at a location that is not joined to the support 115. The concave portions 113b may have a shape that is connected in a lattice pattern.

[0069] Although not shown, a plurality of needle-shaped bodies may be located on the second inner surface (specifically, the bottom surface) 113 of the hollow portion 111 at a location not joined to the support 115, and the plurality of needle-shaped bodies may function as a wick. The needle-shaped bodies may be configured to protrude in a needle-like shape obliquely upward from the second inner surface 113. In a plan view, the plurality of needle-shaped bodies may extend in various directions and intersect with each other. The needle-shaped bodies may be needle-shaped crystals that form on the surface of the ceramic, and may be configured to be generated during the ceramic firing process.

[0070] <Relationship 1 between the structure of each part of the first part 14C and the thickness of the second part 15> The total area of ​​the cross sections of the multiple pillars 115 included in the hollow portion 111 may be 0.2 times or less, 0.15 times or less, or 0.075 times or less of the area of ​​the cross section of the hollow portion 111 (specifically, including the cross sections of the pillars 115).

[0071] When the amount of warpage of multiple vapor chambers 1C with different cross-sectional shapes, arrangements, and total areas of the support posts 115 was measured, the results showed that the cross-sectional shape and arrangement of each support post 115 had little effect on the amount of warpage, while the total area had a large effect on the amount of warpage, as shown in Relationship Table 1. Therefore, as described above, by reducing the total area of ​​the cross sections of the multiple support posts 115, the residual stress that causes warpage in the first component 14C can be reduced, and the overall amount of warpage can be reduced even if the thickness of the second component 15 is reduced. This allows the heat dissipation member 10C and vapor chamber 1C to be made thinner.

[0072] In Relationship Table 1, the shape and arrangement refer to the cross-sectional shape of each support pillar 115 and the arrangement of multiple support pillars 115. Xmmsq means a square with a side length of Xmm (where X is a number). The total area refers to the total cross-sectional area of ​​all support pillars 115 included in the hollow portion 111. The amount of warping refers to the magnitude of warping of the vapor chamber 1C that occurs under the same temperature conditions with the same configuration except for the shape and arrangement. The total area when the support pillars 115 are 2mmsq corresponds to 0.3 times the area of ​​the cross-section of the hollow portion 111 (specifically, including the cross-sections of the support pillars 115).

[0073] <Relationship 2 between the structure of each part of the first component 14C and the thickness of the second component 15> The concentration degree of the cross-sectional area of ​​the first support pillar 115A located in the center may be 0.6 or less, 0.3 or less, or 0.05 or less. The concentration degree means "the cross-sectional area of ​​the first support pillar 115A" / "the total cross-sectional area of ​​all the support pillars 115."

[0074] When the amount of warpage of multiple vapor chambers 1C with different degrees of concentration was measured, the results showed that a smaller degree of concentration had a smaller effect on the amount of warpage, as shown in Relationship Table 2. Therefore, as described above, by reducing the degree of concentration, the residual stress that causes warpage in the first component 14C can be reduced, and the overall amount of warpage can be reduced even if the thickness of the second component 15 is reduced. This allows the heat dissipation member 10C and vapor chamber 1C to be made thinner.

[0075] In Relationship Table 2, "shape" refers to the cross-sectional shape of each support 115. "Xmmsq" means a square with a side length of Xmm (where X is a number). "Total area" refers to the total cross-sectional area of ​​all the support 115 included in the hollow portion 111. "Warp amount" refers to the amount of warp of a vapor chamber 1C that occurs under the same temperature conditions when multiple support 115 are arranged in a lattice pattern and the configuration is identical except for the size of each support 115 and the first support 115A. The concentration degree when using 17.6mmsq first support 115A and 1mmsq support 115 is equivalent to 0.8.

[0076] <Relationship 3 between the structure of each part of the first part 14C and the thickness of the second part 15> The thickness L11b (see FIG. 9A ) of the side wall 11b of the first part 14C may be 0.05 times or less, 0.03 times or less, or 0.01 times or less the length L14C (see FIG. 9A ) of the diagonal line of the first part 14C in a planar view.

[0077] When the amount of warpage of multiple vapor chambers 1C with different thicknesses L11b of the sidewall 11b was measured, the results showed that thinner sidewalls 11b have a smaller effect on the amount of warpage, as shown in Relationship Table 3. Note that the amount of warpage shown in Relationship Table 3 is the amount of warpage when the thickness of the second component 15 is constant, and therefore changes relatively if the thickness of the second component 15 is changed. Because the amount of warpage caused by the first component 14C is a positive amount of warpage, a smaller amount of warpage, including negative values, indicates a smaller effect of the second component 15 on the amount of warpage.

[0078] Therefore, as described above, by reducing the thickness L11b of the side wall 11b, the residual stress that causes warpage due to the first component 14C can be reduced, and the overall amount of warpage can be reduced even if the thickness of the second component 15 is reduced. This makes it possible to reduce the heights of the heat dissipation member 10C and the vapor chamber 1C.

[0079] In Table 3, the amount of warpage indicates the magnitude of warpage of vapor chambers 1C that are identical in configuration except for the thickness L11b of the side wall 11b and that occur under the same temperature conditions. The side wall thickness L11b = 2 mm in the first column of Table 3 corresponds to 0.03 times the diagonal length L14C.

[0080] <Relationship 4 between the structure of each part of the first part 14C and the thickness of the second part 15> In the first part 14C, the thickness L11a of the upper wall 11a (see FIG. 9B) may be smaller than the thickness L11c of the lower wall 11c (see FIG. 10B).

[0081] When the amount of warpage of multiple vapor chambers 1C differing only in the distribution of the thicknesses L11a and L11c of the upper wall 11a and lower wall 11c was measured, the results showed that making the upper wall 11a thinner and the lower wall 11c thicker had a smaller effect on the amount of warpage, as shown in Relationship Table 4. Note that the amount of warpage shown in Relationship Table 4 is the amount of warpage when the thickness of the second component 15 is constant, and therefore changes relatively if the thickness of the second component 15 is changed. Because the amount of warpage caused by the first component 14C is a positive amount of warpage, a smaller amount of warpage, including negative values, indicates a smaller effect of the second component 15 on the amount of warpage.

[0082] Therefore, by adopting the relationship between the thickness L11a of the upper wall 11a and the thickness L11c of the lower wall 11c, the residual stress that causes warpage in the first component 14C can be reduced, and the overall amount of warpage can be reduced even if the thickness of the second component 15 is reduced. This makes it possible to reduce the height of the heat dissipation member 10C and the vapor chamber 1C. The above relationship between the thickness L11a of the upper wall 11a and the thickness L11c of the lower wall 11c has a large effect on the amount of warpage, and is therefore particularly effective in reducing the height of the heat dissipation member 10C and the vapor chamber 1C. In Relationship Table 4, the first component thickness is the thickness of the first component 14C in the vertical direction, and is equal to the thickness L11a of the upper wall 11a, the height L111 of the hollow portion 111, and the thickness L11c of the lower wall 11c (see FIGS. 9B and 10B). The upper wall thickness is the thickness L11a of the upper wall 11a, the hollow portion height is the height L111 of the hollow portion 111, and the lower wall thickness is the thickness L11c of the lower wall 11c. The amount of warpage indicates the magnitude of warpage of vapor chambers 1C that are identical in configuration except for the thickness and height described above and that occur under the same temperature conditions.

[0083] Furthermore, the above relationship between the thickness L11a of the upper wall 11a and the thickness L11c of the lower wall 11c allows the upper wall 11a to be made thin. A thin upper wall 11a allows heat to be quickly transferred from the heat source located on the upper surface of the upper wall 11a to the hollow portion 111. Therefore, even if the temperature of the heat source rises suddenly, heat can be dissipated with high responsiveness in response to the temperature rise.

[0084] Furthermore, the above relationship between the thickness L11a of the upper wall 11a and the thickness L11c of the lower wall 11c allows the lower wall 11c to be thicker. A thicker lower wall 11c reduces horizontal temperature variations on the upper surface of the lower wall 11c in response to changes in the amount of heat on the heat dissipation side. This stabilizes the heat transport cycle by the refrigerant in the hollow portion 111. Furthermore, a thicker lower wall 11c increases the strength of the first component 14C surrounding the hollow portion 111. Therefore, even if the internal pressure of the hollow portion 111 increases with increasing temperature, the amount of deformation between the insulating plate 16 and the first component 14C can be reduced, thereby reducing the increase in thermal resistance due to deformation such as peeling.

[0085] <Relationship 5 between the structure of each part of the first part 14C and the thickness of the second part 15> The height L111 of the hollow part 111 (see FIG. 9B ) may be 0.2 times or more, 0.25 times or more, or 0.3 times or more the vertical dimension of the first part 14C.

[0086] When the amount of warpage was measured for multiple vapor chambers 1C that differed only in the distribution between the thickness L11a of the upper wall 11a and the height L111 of the hollow portion 111, or the distribution between the thickness L11c of the lower wall 11c and the height L111 of the hollow portion 111, the results showed that a larger distribution of the height L111 of the hollow portion 111 had a smaller effect on the amount of warpage, as shown in Relationship Table 5. Note that the amount of warpage shown in Relationship Table 5 is the amount of warpage when the thickness of the second component 15 is constant, and therefore changes relatively if the thickness of the second component 15 is changed. Because the amount of warpage caused by the first component 14C is a positive amount of warpage, a smaller amount of warpage, including negative values, indicates a smaller effect of the second component 15 on the amount of warpage.

[0087] Therefore, by adopting the above-described distribution of the height L111 of the hollow portion 111, the residual stress that causes warpage in the first component 14C can be reduced, and the overall amount of warpage can be reduced even if the thickness of the second component 15 is reduced. This allows the heat dissipation member 10C and the vapor chamber 1C to be made low-profile. The above-described conditions for the distribution of the height L111 of the hollow portion 111 have a large effect on the amount of warpage, and are therefore particularly effective in reducing the height of the heat dissipation member 10C and the vapor chamber 1C.

[0088] In Relationship Table 5, the first component thickness is the thickness of the first component 14C in the vertical direction, and is equal to the thickness L11a of the upper wall 11a, the height L111 of the hollow portion 111, and the thickness L11c of the lower wall 11c. The upper wall thickness is the thickness L11a of the upper wall 11a, the hollow portion height is the height L111 of the hollow portion 111, and the lower wall thickness is the thickness L11c of the lower wall 11c. The amount of warpage indicates the magnitude of warpage of vapor chambers 1C that are identical in configuration except for the thickness and height described above and that occur under the same temperature conditions.

[0089] In the first component 14C of the fourth embodiment, the vapor chamber 1C can be made even lower in height, and therefore the functional module incorporating the vapor chamber 1C can be made even more compact.

[0090] In the fourth embodiment, the first component 14C has a configuration in which the first component 14C has a lower wall 11c of the hollow portion 111. However, the first component 14C may have a configuration in which the opening of the hollow portion 111 is provided at the bottom, as in the first component 14 of the first embodiment. A configuration in which the bottom end surface of the first component 14C is joined to the insulating plate 16, thereby covering the bottom of the hollow portion 111 with the insulating plate 16 and sealing the hollow portion 111 may be employed. The detailed structure of the interior of the hollow portion 111 shown in the fourth embodiment may also be applied to the second and third embodiments.

[0091] 11A, 11B, and 11C are a plan view, a longitudinal cross-sectional view, and a bottom view showing a heat dissipation member and a vapor chamber according to a fifth embodiment of the present disclosure. A heat dissipation member 10D and a vapor chamber 1D according to the fifth embodiment differ mainly in that a plurality of first components 14D are joined to a first surface 161 of an insulating plate 16, but other configurations may be similar to those of the second to fourth embodiments.

[0092] FIG. 11A shows an example in which the multiple first parts 14D are the same size and six first parts 14D are joined to one insulating plate 16 in an arrangement of three rows and two columns, but any one of the multiple first parts 14D may be a different size from the others, or various arrangements may be adopted.

[0093] 11C, the second part 15 may have a single configuration that overlaps with all of the first parts 14D in planar perspective. Although not shown, the second part 15 may have a configuration in which the configuration in FIG. 11C is divided into two or three parts, or may have a configuration in which a single second part 15 overlaps with some or a plurality of, for example, two or three, first parts 14D in planar perspective.

[0094] According to the heat dissipation member 10D and vapor chamber 1D of embodiment 5, by having a plurality of first components 14D, the plurality of first components 14D can be electrically insulated from each other. Furthermore, by connecting any one of the first components 14D to any other first component 14D via a conductor, any one of the plurality of first components 14D can be part of a circuit through which a current flows.

[0095] Furthermore, with the heat dissipation member 10D and vapor chamber 1D of embodiment 5, the horizontal size of the single second component 15 is larger than the horizontal size of each individual first component 14D. As the horizontal size increases, the effect of generating warpage increases. Therefore, in order to reduce the overall amount of warpage, the second component 15 can be made thinner relative to the vertical dimension of the first component 14D. This allows the vapor chamber 1D to be made even thinner.

[0096] Note that the configuration of the first component 14C of embodiment 4 may be adopted for each first component 14D of embodiment 5. Although not shown, multiple needle-shaped bodies may be located on the bottom surface of the hollow portion 111 of each first component 14D, and the multiple needle-shaped bodies may function as wicks. The needle-shaped bodies may be configured to protrude obliquely upward from the second inner surface (specifically, the bottom surface) 113 in a needle-like shape. In plan view, the multiple needle-shaped bodies may extend in various directions and intersect with each other. The needle-shaped bodies may be needle-shaped crystals that form on the surface of the ceramic and may be generated during the ceramic firing process.

[0097] Sixth to Eighth Embodiments FIGS. 12A to 12C are cross-sectional views showing heat dissipation members and vapor chambers according to sixth to eighth embodiments of the present disclosure.

[0098] The heat dissipation member 10E and vapor chamber 1E of embodiment 6 shown in FIG. 12A may have the same configuration as those of embodiments 3 to 5, except for the insulating plate 16E. The insulating plate 16E may be made of resin. The insulating plate 16E, which is resin, may be bonded to the first component 14 and the second component 15 at a high temperature of about 200°C. This bonding is performed at a lower temperature than the bonding using the brazing material shown in embodiments 3 to 5, but warping due to differences in thermal expansion coefficients still occurs even when bonding at the above temperature. Therefore, by similarly applying the configuration that reduces the amount of warping described above, the same effect of reducing the amount of warping can be achieved.

[0099] The heat dissipation member 10F and vapor chamber 1F of embodiment 7 shown in FIG. 12B may have multiple grooves 151 on the underside of the second component 15F. A heat pipe 5 may be fitted into each of the multiple grooves 151. The multiple grooves 151 may occupy 80% or more of the area of ​​the underside of the second component 15F. In this configuration, the thickness of the second component 15F may be the thickness L15F of the portion that is thinnest due to the grooves 151, and the thickness L15F of the second component 15F may be selected to satisfy the conditions of the above-mentioned formulas (1) to (4). By adopting the above thickness L15F, the overall amount of warpage can be reduced, as described in embodiments 2 and 3.

[0100] 12C of the eighth embodiment of the heat dissipation member 10G and vapor chamber 1G may have heat dissipation fins 152 on the underside of the second component 15G, and the heat dissipation fins 152 may be air-cooled or water-cooled. In this configuration, the thickness of the second component 15G may be the thickness L15G of the thinnest portion due to the unevenness of the heat dissipation fins 152, and the thickness L15G of the second component 15G may be selected to satisfy the conditions of the above-described formulas (1) to (4). By adopting the thickness L15G as described above, the overall amount of warpage can be reduced, as described in the second and third embodiments.

[0101] (Functional Module) FIGS. 13A to 14C are diagrams illustrating functional modules 400A to 400E according to Embodiments 9 to 13 of the present disclosure, respectively. Among these functional modules 400A to 400E, the functional module 400E according to Embodiment 13 is an example of a functional module incorporating the vapor chamber 1D of Embodiment 4. The functional modules 400A to 400D in FIGS. 13A to 14B incorporate a vapor chamber 1 that does not have an insulating plate 16. However, the vapor chambers 1A to 1C of Embodiments 2 to 4, which incorporate the insulating plate 16 instead of the vapor chamber 1, may also be incorporated. Specific examples of functional modules 400A to 400E are described below. However, the following structure is merely an example, and various modifications to the detailed structure are possible. Detailed illustrations of the internal structure of the vapor chambers 1 and 1D are omitted in FIGS. 13A to 14C.

[0102] (Functional Module of Embodiment 9) The functional module 400A of Embodiment 9 may be a light source module, and the functional component 410A may be a light emitting element such as an LED (Light Emitting Diode) or an LD (Laser Diode). The LD may be configured to output laser light for processing or laser light for illumination.

[0103] The functional component 410A may be mounted on the vapor chamber 1 via a submount 420. The submount 420 is a substrate smaller than the vapor chamber 1 and is made of silicon nitride (Si ３ N ４), silicon carbide (SiC), aluminum nitride (AlN), aluminum oxide (Al ２ O ３ The mounting portion 118 may be made of ceramics such as aluminum. A plurality of functional components 410A may be mounted on the mounting portion 118.

[0104] The vapor chamber 1 has a sidewall 430 that surrounds the mounting portion 118 of the base 11, and the mounting portion 118 may be located on the inner bottom surface of a recess 431 surrounded by the sidewall 430. The opening of the recess 431 may be covered by a light-transmitting member 432 such as a lens. The light-transmitting member 432 may be bonded to the sidewall 430 to seal the recess 431. The sidewall 430 has a horizontal through-hole 433, and a conductive member 434 that transmits operating power to the functional component 410A may be bonded to the through-hole 433. A cooling mechanism (not shown) may be located below the base 11.

[0105] According to the functional module 400A of the ninth embodiment, a large amount of heat can be dissipated from the functional component 410A, which is a light-emitting element, via the vapor chamber 1. Therefore, the functional component 410A, which is a light-emitting element, can stably emit light with high brightness. Furthermore, when the functional module 400A has a plurality of functional components 410A, which are light-emitting elements, the high heat dissipation properties of the vapor chamber 1 can achieve uniform heat distribution among the plurality of functional components 410A, thereby achieving uniform brightness among the plurality of functional components 410A.

[0106] (Functional Module of Embodiment 10) The functional module 400B of embodiment 10 may be a wireless module that transmits wireless signals via a wireless base station or the like. The functional component 410B may be a signal processing circuit such as a beam forming integrated circuit (BFIC) that transmits wireless signals with directionality via an array antenna. Multiple functional components 410B may be mounted on the mounting unit 118. The functional component 410B, which is a signal processing circuit, may be connected to an antenna substrate 441 such as a phased array antenna module (PAAM) substrate on which an array antenna is mounted. That is, multiple functional components 410B may be mounted on the mounting unit 118, an antenna substrate 441 may be located above the multiple functional components 410B, and multiple antennas 441a (e.g., patch antennas) may be located above the antenna substrate 441.

[0107] The vapor chamber 1 may be located between an antenna substrate 441 and another substrate 443 located below the antenna substrate 441 via a spacer 442. Furthermore, a shield case 444 may be located below the substrate 443. The substrate 443 may have an opening 443a, and a heat dissipation component 445 such as a heat pipe embedded in the shield case 444 may extend inside and outside the shield case 444. The heat dissipation component 445 may contact the vapor chamber 1 from below via the opening 443a, and may conduct heat from the vapor chamber 1 to the outside of the shield case 444.

[0108] According to the functional module 400B of the tenth embodiment, a large amount of heat can be dissipated from the functional component 410B, which is a signal processing circuit, via the vapor chamber 1. This allows for stable transmission of wireless signals, which contributes to increasing the power of the wireless signals, i.e., increasing the output of wireless radio waves, and reducing the module volume.

[0109] (Functional Module of Embodiment 11) The functional module 400C of Embodiment 11 may be a computer module in which a computing LSI (Large Scale Integration) is used as a functional component 410C. The functional component 410C may be an LSI for AI (Artificial Intelligence) processing, an LSI for cloud processing, an LSI for display calculation, an LSI for calculation mounted on a workstation, or any of a variety of other LSIs. In addition to the above LSI, the functional component 410C may also include a memory IC (Integrated Circuit) used by the LSI.

[0110] One or more functional components 410C may be mounted on a module substrate 451 such as a PCB (Printed Circuit Board), and the vapor chamber 1 may be incorporated so that it contacts the functional components 410C from the opposite side of the module substrate 451. Here, contact is not limited to direct contact but also includes connection via a material 452 with high thermal conductivity (e.g., a heat transfer sheet, heat transfer grease, etc.). A heat dissipation component 453, such as a heat pipe 453a and a cooling fin 453b connected to the heat pipe 453a, may be connected below the base 11 of the vapor chamber 1. Furthermore, the functional module 400C may have a cooling device 454, such as a fan, that cools the heat dissipation component 453.

[0111] According to the functional module 400C of embodiment 11, a large amount of heat can be dissipated from the functional components 410C, such as the LSI and memory IC, via the vapor chamber 1. This allows stable computational processing by the functional components 410C. This allows the functional module 400C to accommodate the high computing power of the LSI, achieving a functional module 400C with high computing power. Furthermore, the vapor chamber 1 can dissipate heat from the functional components 410C, such as the LSI and memory IC, in response to increased heat generation due to miniaturization of wiring within the LSI, high-speed operation, and the like, as well as increased heat generation due to the three-dimensional mounting of the LSI and memory IC.

[0112] (Functional Module of Embodiment 12) The functional module 400D of Embodiment 12 may be a sensor module in which an image sensor is used as a functional component 410D. The vapor chamber 1 may have a convex portion 461 formed by a portion of the base 11 protruding, and the mounting portion 118 may be located on top of the convex portion 461.

[0113] The functional module 400D, which is a sensor module, may have a package 462 that seals the functional component 410D and a light-transmitting member 463 such as a lens. The package 462 may have an opening 464 in a portion thereof, and the vapor chamber 1 and the package 462 may be joined so that the convex portion 461 fits into the opening 464. The package 462 may have built-in wiring for transmitting electrical signals and power, and electrical signals and power may be transmitted between the functional component 410D and the outside of the package 462 via the wiring. A cooling mechanism (not shown) may be located below the vapor chamber 1.

[0114] According to the functional module 400D of the twelfth embodiment, a large amount of heat can be dissipated from the functional component 410D, which is an image sensor, via the vapor chamber 1. Therefore, a high-performance image sensor that generates a large amount of heat and performs high-speed information processing can be applied as the functional component 410D, which can contribute to improving the functionality of the functional module 400D.

[0115] (Functional Module of Embodiment 13) The functional module 400E of Embodiment 13 may be a power module in which a power semiconductor for power control is used as the functional component 410E. The power semiconductor may be a switching element or a diode. The functional module 400E may include a vapor chamber 1D having a plurality of first components 14D and a plurality of functional components 410E mounted on each of the first components 14D. A heat dissipation fin 475 may be attached to the underside of the vapor chamber 1D. The first component 14D of the vapor chamber 1D may be conductive, and a wiring member 476 may be electrically connected to the first component 14D, and the functional component 410E may be electrically connected so that current flows through the wiring member 476 and the first component 14D. The first component 14D, functional component 410E, insulating plate 16, and second component 15 of the vapor chamber 1D may be sealed with a molding material 473.

[0116] According to the functional module 400E of embodiment 13, a large amount of heat can be dissipated from the functional component 410E, which is a power semiconductor, via the vapor chamber 1D. Therefore, a high-output power semiconductor with a large amount of heat can be used as the functional component 410E, and the functional module 400E can be highly integrated and miniaturized. In embodiment 13, the first component 14D of the vapor chamber 1D may be replaced with the first component 14 of embodiment 2. Similarly, the insulating plate 16 of the vapor chamber 1D may be replaced with the insulating plate 16E of embodiment 6.

[0117] The above describes the embodiments of the present disclosure. However, the heat dissipation member, vapor chamber, and functional module of the present disclosure are not limited to the above embodiments. For example, the above embodiments show specific examples of wicks formed by bonding multiple particles, but wicks of various other structures may be used. Furthermore, the above embodiments show a configuration in which the support pillars have a circular cross section, but the support pillars may have various cross sections, such as a rectangular, elliptical, or oval cross section. Other details shown in the embodiments may be modified as appropriate without departing from the spirit of the invention.

[0118] An embodiment of the present disclosure is described below. In one embodiment, (1) a heat dissipation member includes an insulating plate having a first surface and a second surface located opposite to the first surface, a first component bonded to the first surface, a second component bonded to the second surface, and a wick, wherein a hollow portion is formed in the first component or between the first component and the insulating plate, and the wick is located in the hollow portion.

[0119] (2) In the heat dissipation member of (1) above, the first component has a structure in which the lower side of the hollow portion is open, and the first surface of the insulating plate covers the lower side of the hollow portion.

[0120] (3) In the heat dissipation member of (1) or (2) above, the first component has an upper wall and a side wall, the second component is plate-shaped and extends in a direction along the second surface, and the vertical dimension of the first component is greater than the thickness of the second component.

[0121] (4) The heat dissipation member according to any one of (1) to (3) above includes a plurality of the first components, and in planar perspective, the plurality of first components and one of the second components overlap with each other.

[0122] (5) In the heat dissipation member according to any one of (1) to (4) above, the insulating plate is made of ceramics, and the first component and the second component are made of copper.

[0123] (6) In the heat dissipation member of any one of (1) to (5) above, the first component has an upper wall and a lower wall, and the thickness of the upper wall is smaller than the thickness of the lower wall.

[0124] In one embodiment, (7) the vapor chamber includes: a heat dissipation member according to any one of (1) to (6); and a refrigerant located in the hollow portion.

[0125] In one embodiment, the functional module (8) includes a heat-generating functional component, and a vapor chamber (7) in which the functional component is mounted.

[0126] The present disclosure can be used for heat dissipation members, vapor chambers, and functional modules.

[0127] 1, 1A to 1G Vapor chamber 10, 10A to 10G Heat dissipation member 11 Base 11a Upper wall 11b Side wall 11c Lower wall 13 Wick 14, 14B to 14D First component 15, 15F, 15G Second component 16, 16E Insulating plate 50 Particle 111 Hollow portion 115 Support 115A First support 161 First surface 162 Second surface 400A to 400E Functional module 410A to 410E Functional component L11a Upper wall thickness L11b Side wall thickness L11c Lower wall thickness L14, L14B Vertical dimension of first component L14C Diagonal length L15 Thickness of second component

Claims

1. A heat dissipation component comprising: an insulating plate having a first surface and a second surface located opposite the first surface; a first component bonded to the first surface; a second component bonded to the second surface; and a wick, wherein a hollow portion is formed within the first component or between the first component and the insulating plate, and the wick is located in the hollow portion.

2. A heat dissipation member according to claim 1, wherein the first component has a structure in which the lower side of the hollow portion is open, and the first surface of the insulating plate covers the lower side of the hollow portion.

3. A heat dissipation member according to claim 1 or claim 2, wherein the first component has an upper wall and a side wall, the second component is plate-shaped and extends in a direction along the second surface, and the vertical dimension of the first component is greater than the thickness of the second component.

4. A heat dissipation member according to any one of claims 1 to 3, comprising a plurality of the first components, wherein the plurality of first components and one of the second components overlap in plan view.

5. A heat dissipation member according to any one of claims 1 to 4, wherein the insulating plate is made of ceramic, and the first component and the second component are made of copper.

6. A heat dissipation member according to any one of claims 1 to 5, wherein the first component has an upper wall and a lower wall, and the thickness of the upper wall is smaller than the thickness of the lower wall.

7. A vapor chamber comprising: a heat dissipation member according to any one of claims 1 to 6; and a refrigerant located in the hollow portion.

8. A functional module comprising: a heat-generating functional component; and the vapor chamber according to claim 7, in which the functional component is mounted.

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