Cooling duct for humidity control
The cooling duct with a sensible heat exchanger addresses the size and flexibility issues of conventional EFEM cooling equipment by internally cooling dehumidified air, ensuring efficient humidity control and stable process conditions.
Patent Information
- Application Number
- PCT/KR2024/096581
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-05-23
- Filing Date
- 2024-11-15
- Publication Date
- 2025-11-27
AI Technical Summary
Conventional cooling equipment for EFEMs in semiconductor and display processes is large in size, restricting installation flexibility and efficiency due to the need for external fans, leading to increased humidity-related particle formation and decreased yield.
A cooling duct equipped with a sensible heat exchanger that cools dehumidified air internally, reducing equipment size and using air flow to power fans, eliminating installation restrictions and maintaining cooling efficiency.
The solution achieves efficient humidity control without installation constraints, reducing equipment size and power consumption while ensuring positive pressure in the return room, thereby enhancing process stability and yield.
Smart Images

Figure KR2024096581_27112025_PF_FP_ABST
Abstract
Description
Cooling duct for humidity control
[0001] The present invention relates to a cooling duct for humidity control of semiconductor and display process equipment, and more specifically, to a cooling duct for humidity control that cools air flowing through a dehumidification path by heat exchange with a cooling medium, and eliminates restrictions on the installation environment through simplification of the configuration.
[0002] Typically, cluster equipment for semiconductor and display processes uses various chemical gases during the process, and at this time, gases and vapors remain on the substrates and wafers where the process has been completed inside the chamber.
[0003] Therefore, when unloading, if the gas or fume remaining in the FOUP (Front Opening Unified Pod: semiconductor process storage container) reacts with moisture, particles or defects may occur on the substrate and wafer.
[0004] The environmental conditions inside the existing EFEM (Equipment Front End Module) are such that the air inside the FAB is supplied through the FFU (Fan Filter Unit) without humidity control, so the humidity in the air and the residual gas on the wafer can easily react, easily creating particles or defects. In addition, since the process time usually takes about an hour in certain processes, the wafers wait inside the FFU for a long time, so the residual gas on the wafer reacts with the non-humidified air inside the EFEM, creating particles and chemical compounds, which can lead to problems such as a decrease in yield.
[0005] Considering these points, recently, dehumidifying equipment equipped with a desiccant rotor has been used to dehumidify air and then supply the dehumidified air to the return room of the EFEM (see Korean Patent Application No. 10-2022-0040397).
[0006] Additionally, before supplying the dehumidified air to the return room, the dehumidified air is cooled through cooling equipment and then sent to the return room.
[0007] However, conventional cooling equipment cools the dehumidified air by bringing in outside air through a large-sized fan, which increases the size of the cooling equipment and places great restrictions on the installation environment, resulting in low freedom of installation and poor cooling efficiency due to the difficulty in forming a flow path due to the large internal module space.
[0008] To solve these problems, there is a growing need for a cooling duct for EFEM humidity control that has high cooling efficiency without any installation environment restrictions, while maintaining the cooling performance of the dehumidified air and reducing the size of the cooling equipment.
[0009] The problem to be solved by the present invention is to provide a cooling duct for humidity control that maintains the cooling performance of dehumidified air through a cooling duct equipped with a sensible heat exchanger that cools the dehumidified air inside, while reducing the size of the cooling equipment, thereby not causing restrictions on the installation environment.
[0010] The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.
[0011] A cooling duct for humidity control according to one embodiment of the present invention for solving the above problem is a cooling duct that is applied to an air path of air supplied to an EFEM having a return room, and constitutes an EFEM humidity control device, and the cooling duct includes a sensible heat exchanger that cools the introduced air.
[0012] According to the present invention, a cooling duct for humidity control can be provided that maintains the cooling performance of dehumidified air while reducing the size of the cooling equipment and does not cause restrictions on the installation environment through a cooling duct equipped with a sensible heat exchanger that cools the dehumidified air inside.
[0013] In addition, the wind power of the incoming air can be used as a driving source for the fan that introduces the cooling medium into the cooling duct, thereby achieving energy savings.
[0014] Figures 1 and 2 are drawings showing a state in which a cooling duct for humidity control according to one embodiment of the present invention is installed in an EFEM.
[0015] Figure 3 is a perspective view of a cooling duct for humidity control according to one embodiment of the present invention.
[0016] Figure 4 is a drawing showing how dehumidified air and cooling medium are introduced into a cooling duct equipped with a heat exchanger.
[0017] Figure 5 is a drawing showing how dehumidified air that has performed heat exchange with a cooling medium in a sensible heat exchanger rotates a power transmission fan, and the rotational force of the power transmission fan rotates a cooling medium introduction fan, causing the cooling medium to be introduced into the sensible heat exchanger.
[0018] FIG. 6 is a drawing showing a power transmission structure of a power transmission fan and a cooling medium transmission fan according to another embodiment of the present invention, in which one power transmission fan rotates three cooling medium transmission fans simultaneously.
[0019] Figure 7 is a drawing showing the first form in which the cooling duct introduces outside air according to the operating situation of the EFEM, in which the outside air introduction portion is opened, outside air is introduced, and then supplied to the return room.
[0020] Figure 8 is a drawing showing a second form in which a cooling duct introduces outside air according to the operating conditions of the EFEM, in which an opening ratio adjustment plate slides left and right to adjust the degree of opening of multiple openings formed in an outside air intake window.
[0021] Figure 9 is a drawing showing a third form in which a cooling duct introduces outside air according to the operating conditions of the EFEM, in which the opening ratio adjustment plate rotates to adjust the degree of opening of multiple openings formed in the outside air intake window.
[0022] A cooling duct for humidity control is applied to an air path of air supplied to an EFEM having a return room, and is a cooling duct that constitutes EFEM humidity control equipment, and the cooling duct includes a sensible heat exchanger that cools the introduced air.
[0023] The present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform a person having ordinary skill in the art to which the present invention pertains of the scope of the invention.
[0024] In this specification, the singular includes the plural unless the context specifically dictates otherwise. As used herein, the terms "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components, steps, or operations.
[0025] Referring to FIGS. 1 to 4 and 7, a cooling duct for humidity control according to one embodiment of the present invention is described.
[0026] Figures 1 and 2 are drawings showing a state in which a cooling duct for humidity control according to one embodiment of the present invention is installed in an EFEM. Figure 3 is a perspective view of a cooling duct for humidity control according to one embodiment of the present invention. Figure 4 is a drawing showing a state in which dehumidified air and a cooling medium are introduced into a cooling duct equipped with a sensible heat exchanger.
[0027] Figure 7 is a drawing showing the first form in which the cooling duct introduces outside air according to the operating situation of the EFEM, in which the outside air introduction portion is opened, outside air is introduced, and then supplied to the return room.
[0028] Referring to FIGS. 1 to 4 and 7, a cooling duct (30, 35) for humidity control according to one embodiment of the present invention relates to a cooling duct (30, 35) applied to an air path of air supplied to an EFEM (Equipment Front End Module) (10) having a return room, thereby forming an EFEM humidity control device (20).
[0029] First, EFEM is a standard interface module of process equipment that supplies workpieces, such as wafers or substrates, within a cassette in a semiconductor line to the process module.
[0030] Such an EFEM may include a transfer room, which is a space where objects to be processed, such as wafers or substrates, are transferred to a process module, a transfer unit (ATM Robot) equipped with a robot gripper to transfer objects to be processed, such as wafers or substrates, in a cassette to the process module, an aligner to align objects to be processed, such as wafers, in a certain direction when transferred to the process module, a fan filter unit (FFU) to purify the air in the transfer room to prevent contamination of the objects to be processed, a front-opening unified pod (FOUP) to accommodate objects to be transferred to the process module, and a load port (Load Port) disposed on the lower side of the FOUP to support the FOUP.
[0031] A cooling duct (30, 35) for humidity control can cool the air (P) introduced while forming the EFEM humidity control device (20). Here, the EFEM humidity control device (20) may be a concept including an EFEM humidity control device (20) including a desiccant rotor and a cooling duct (30, 35) for EFEM humidity control.
[0032] In one form, the cooling duct (30, 35) for humidity control can be installed at the rear of the EFEM humidity control equipment (20), and can be a duct that introduces dehumidified air dehumidified by the EFEM humidity control equipment (20), cools it, and provides the cooled dehumidified air to a return room.
[0033] In another form, the cooling duct (30, 35) for humidity control may be installed in front of the EFEM humidity control equipment (20), and may be a duct that allows air (any of the outside air, the inside of the return room, or the mixed air of the outside and inside air) to flow into the EFEM humidity control equipment (20), and then cools the air before dehumidification, and provides the cooled air before dehumidification to the EFEM humidity control equipment (20).
[0034] These humidity control cooling ducts (30, 35) can be detachably installed in the EFEM humidity control equipment (20), and can also be detachably installed on the air flow path related to dehumidification.
[0035] Additionally, multiple cooling ducts (30, 35) for humidity control may be applied to the EFEM humidity control.
[0036] Meanwhile, the EFEM humidity control equipment (20) may include a desiccant rotor, a regenerative heater, a fan, etc., and may be integral or may be made of multiple blocks that can be combined and separated.
[0037] In detail, a cooling duct (30, 35) for humidity control according to one embodiment of the present invention may include a duct body (40), a heat exchanger (80), an outside air inlet (130, 135, 140), and a filter unit (70).
[0038] The duct body (40) is a housing of a cooling duct (30, 35), and can accommodate a heat exchanger (80) inside. An inlet (50) for introducing air to be cooled and an outlet for discharging cooled air can be formed around the periphery, and a suction fan for sucking in a cooling medium can also be installed.
[0039] As described above, this duct body (40) is detachable and can be miniaturized due to its simple configuration, so that it can be detachably installed on the EFEM humidity control equipment (20) and the air flow path related to dehumidification.
[0040] The heat exchanger (80) is a heat exchanger that cools the introduced air (P) by exchanging heat between the introduced air (P) and the introduced cooling medium (C).
[0041] Air to be cooled can be introduced through the inlet (50) and pass through the heat exchanger (80), and at the same time, a cooling medium (C) can be sucked in by the suction fan and pass through the heat exchanger (80).
[0042] During the passage through this heat exchanger (80), the introduced air (P) and the introduced cooling medium (C) can exchange heat with each other, and accordingly, the introduced air (P) can be cooled.
[0043] If the inflowing air (P) is dehumidified air, the cooled dehumidified air coming out of the cooling duct (30, 35) can move to the return room, and if the inflowing air (P) is pre-dehumidified air, the pre-dehumidified air coming out of the cooling duct (30, 35) can move to the EFEM humidity control equipment (20).
[0044] Additionally, in some cases, the sensible heat exchanger (80) may be composed of a thermoelectric element, and the sensible heat exchanger (80) made of a thermoelectric element material may further increase the cooling effect of the introduced air (P).
[0045] Meanwhile, the cooling medium (C) may include natural ventilation (or outside air), CDA (Clean Dry Air), nitrogen gas, cooling water, etc.
[0046] The present invention does not require a large fan to introduce outside air by cooling the air (e.g., dehumidified air) (P) introduced through the sensible heat exchanger (80), and accordingly, the restrictions on the installation environment of the cooling duct (30, 35) are eliminated, so that the cooling duct (30, 35) can be installed in various locations of the EFEM (10), and the number of installations can also be multiple.
[0047] The outside air inlet (130, 135, 140, 150) is a bypass structure that forms positive pressure in the return room by inducing outside air and supplying it to the return room according to the operating conditions of the EFEM (10).
[0048] If the aforementioned EFEM humidity control equipment (20) operates normally, the dehumidified air provided by the EFEM humidity control equipment (20) is supplied to the return room, so that the return room can maintain positive pressure.
[0049] However, depending on the operating conditions of EFEM (10), dehumidified air may not be supplied to the return room or may be supplied insufficiently to the standard, making it impossible for the return room to maintain positive pressure, and as a result, various processes may not be able to proceed.
[0050] In this case, it is necessary to maintain positive pressure in the return room by introducing outside air instead of dehumidified air into the return room.
[0051] Here, the outside air may refer to the air inside a clean room where various semiconductor process-related equipment such as EFEM (10) are installed.
[0052] The present invention can supply outside air to the return room by introducing outside air into the cooling duct (30, 35) through the outside air inlet (130, 135, 140, 150) according to the operating conditions of the EFEM (10), thereby making the return room have a positive pressure.
[0053] That is, the process can continue by ensuring that the return room is under positive pressure even if some degree of humidity control is sacrificed.
[0054] The operating situation of this EFEM (10) may be a situation where the operation of the EFEM humidity control equipment (20) is stopped due to a power outage or breakdown.
[0055] In this case, dehumidified air cannot flow into the return room, and therefore the return room cannot maintain positive pressure.
[0056] Alternatively, it may be a situation where the speed of the introduced air (P) measured by the wind speed sensor installed in the EFEM humidity control equipment (20) or in the cooling duct (30, 35) is less than a reference value (e.g., less than 1 m / s).
[0057] In this case, even if dehumidified air is supplied to the return room, a small amount is supplied to the return room, making it difficult for the return room to maintain positive pressure.
[0058] The specific embodiment of these external air inlets (130, 135, 140, 150) will be described later.
[0059] The filter unit (70) is a filter configuration installed in the duct body (40) to filter the introduced air (P) and generate filtered air.
[0060] This filter unit (70) may include at least one of a pre-filter installed at the front or inlet (50) of the duct body (40) to filter the incoming air, and a chemical filter installed at the rear or outlet to perform heat exchange and filter the air discharged through the outlet.
[0061] The present invention can supply air filtered through the filter unit (70) to the EFEM humidity control equipment (20) or the return room, thereby allowing semiconductor processes to be performed in a clean state.
[0062] That is, the filter unit (70) can be easily attached to the front or rear of the duct body (40) to purify the air flowing into the EFEM (10).
[0063] Above, a cooling duct for humidity control according to one embodiment of the present invention has been described. Hereinafter, with reference to FIGS. 5 and 6, the driving method of a suction fan that sucks a cooling medium that performs heat exchange with the introduced air into the interior of the duct body will be described.
[0064] Fig. 5 is a drawing showing a state in which dehumidified air that has exchanged heat with a cooling medium in a sensible heat exchanger rotates a power transmission fan, and the rotational force of the power transmission fan rotates a cooling medium introduction fan, thereby introducing a cooling medium into the sensible heat exchanger. Fig. 6 is a drawing showing a power transmission structure of a power transmission fan and a cooling medium delivery fan according to another embodiment of the present invention, in which one power transmission fan rotates three cooling medium delivery fans simultaneously.
[0065] First, a dedicated motor is installed in the suction fan to drive the suction fan, so that the cooling medium can be sucked in while the suction fan rotates by the motor.
[0066] Alternatively, as shown in FIGS. 5 and 6, the cooling duct (30, 35) may further include a power transmission fan (90), a cooling medium inlet fan (60, 61, 63), and a power transmission mechanism. Here, the cooling medium inlet fan (60, 61, 63) may be the aforementioned suction fan.
[0067] The power transmission fan (90) may be a fan that rotates by the inflowing air (P) that has undergone heat exchange in the heat exchanger (80).
[0068] The air (P) introduced into the duct body (40) passes through the heat exchanger (80) and performs heat exchange with the cooling medium (C) to be cooled, and then is discharged through the outlet, thereby rotating the power transmission fan (90) located at the rear of the heat exchanger (80).
[0069] The cooling medium inlet fan (60, 61, 63) is a fan that receives rotational power from the power transmission fan (90) and rotates to introduce cooling medium (C) into the heat exchanger (80).
[0070] The power transmission fan (90) can be rotated by the introduced air (P), and this rotational power is transmitted to the rotational shaft of the cooling medium introduction fan (60, 61, 63) by the power transmission mechanism described later, so that the cooling medium introduction fan (60, 61, 63) can introduce the cooling medium (C) while rotating.
[0071] The power transmission mechanism is a mechanism that transmits the rotational power of the power transmission fan (90) to the cooling medium inlet fan (60, 61, 63) to cause the cooling medium inlet fan (60, 61, 63) to rotate.
[0072] As shown in FIG. 5, as one type of power transmission mechanism, the power transmission mechanism may include a first pulley (100) formed on the rotational axis of the power transmission fan (90), a second pulley (120) formed on the rotational axis of the cooling medium inlet fan (60), and a rotating body (110) including a belt or chain that is wound around the first pulley (100) and the second pulley (120) and rotates.
[0073] When the power transmission fan (90) rotates due to the exhausted inflow air (P), the first pulley (100) coupled or formed on the rotation axis of the power transmission fan (90) can also rotate, and the rotating body (110) wound around the first pulley (100) can also rotate.
[0074] At this time, the rotating body (110) can also be wound around the second pulley (120) that is coupled or formed on the rotation axis of the cooling medium introduction fan (60), so that the rotating body (110) can also rotate the second pulley (120), and as a result, the cooling medium introduction fan (60) can be rotated to introduce the cooling medium (C).
[0075] Alternatively, by extension, as illustrated in FIG. 6, a single power transmission fan (90) may rotate multiple cooling medium inlet fans (60, 61, 63). Three cooling medium inlet fans (60, 61, 63) are illustrated in FIG. 6.
[0076] In addition to the configuration of the power transmission mechanism described above (Fig. 5), the power transmission mechanism may include two additional pulleys formed on the rotational axis (65) of the cooling medium inlet fan (90), two rotational axis pulleys formed on the rotational axis of each of the two additional cooling medium inlet fans (61, 63), and two additional rotors (115, 117) wound around one of the two additional pulleys and one of the two rotational axis pulleys.
[0077] When the power transmission fan (90) rotates due to the exhausted inflow air (P), the first pulley (100) coupled or formed on the rotation axis (95) of the power transmission fan (90) can also rotate, and the rotating body (110) wound around the first pulley (100) can also rotate.
[0078] At this time, the second pulley (120) wound around the rotating body (110) can rotate, and two additional pulleys formed on the same rotating shaft can also rotate. In addition, two additional rotating bodies (115, 117) wound around each of the two additional pulleys can rotate, and as the two rotating shaft pulleys rotate, three cooling medium inlet fans (60, 61, 63) can rotate to introduce cooling medium (C).
[0079] As another form of the power transmission mechanism, the power transmission mechanism may include a first gear formed on the rotational axis of the power transmission fan (90), and a second gear formed on the rotational axis of the cooling medium introduction fan (60) and receiving rotational power from the first gear.
[0080] When the power transmission fan (90) rotates, the first gear coupled or formed on the rotational axis (95) of the power transmission fan (90) can also rotate, and the second gear that directly engages the first gear or engages with the third gear that engages the first gear can also rotate.
[0081] In addition, as the second gear coupled or formed on the rotation axis of the cooling medium introduction fan (60) rotates, the cooling medium introduction fan (60) also rotates and can introduce cooling medium (C).
[0082] Meanwhile, the first gear, second gear and third gear may be spur gears, but are not limited thereto.
[0083] That is, the present invention does not use a separate power source to rotate the cooling medium inlet fan (60, 61, 63) to improve cooling performance, and can use ventilation and mechanical means for the introduced air (P).
[0084] Therefore, it is possible to reduce the power consumption required to operate the cooling duct (30, 35), thereby generating an energy saving effect.
[0085] Above, we have examined the driving method of the suction fan that draws the cooling medium, which performs heat exchange with the inflowing air, into the interior of the duct body. Below, with reference to FIGS. 7 to 9, we will examine specific embodiments of the outside air inlet section that, depending on the operating conditions of the EFEM, draws outside air into the cooling duct and supplies it to the return chamber, thereby creating a positive pressure in the return chamber.
[0086] Fig. 7 is a drawing showing a first form in which a cooling duct introduces outside air, depending on the operating conditions of the EFEM, in which the outside air inlet port is opened to introduce outside air and then supplied to the return room. Fig. 8 is a drawing showing a second form in which a cooling duct introduces outside air, depending on the operating conditions of the EFEM, in which an opening ratio adjustment plate slides left and right to adjust the degree of opening for a plurality of openings formed in an outside air inlet window. Fig. 9 is a drawing showing a third form in which a cooling duct introduces outside air, depending on the operating conditions of the EFEM, in which an opening ratio adjustment plate rotates to adjust the degree of opening for a plurality of openings formed in an outside air inlet window.
[0087] As shown in Fig. 7, looking at the form of the external air inlet (130, 135), the external air inlet (130, 135) may be plate-shaped, and one side of the external air inlet (130, 135) may be hinge-joined with the duct body (40).
[0088] Under this combined structure, when the operating situation of the aforementioned EFEM (10) occurs, the outside air inlet (130) can open the inside of the duct body (40) by rotating outward around one hinged side, thereby allowing outside air to flow into the inside of the duct body (40).
[0089] Alternatively, looking at another form of the external air inlet, the external air inlet may be plate-shaped, and the external air inlet may close or open the interior of the duct body (40) by sliding up and down or left and right.
[0090] Under this combined structure, when the operating situation of the aforementioned EFEM (10) occurs, the outside air inlet portion can slide to open the inside of the duct body (40) so that outside air can be introduced into the inside of the duct body (40).
[0091] Alternatively, looking at another form of the outside air inlet (140, 150), the outside air inlet (140, 150) may include an outside air inlet window (145, 160), a plurality of openings (147, 165) formed in the outside air inlet window (145, 160) to introduce outside air, and an opening ratio adjustment plate (149, 170) positioned in front or behind the outside air inlet window (145, 160) to adjust the number of openings (147, 165) to be opened among the plurality of openings (147, 165) or the opening area of the openings (147, 165) to be opened.
[0092] At this time, the opening ratio adjustment plate can adjust the number of openings to be opened among a plurality of openings or the opening area of the openings to be opened through any one of a sliding method, a detachable method, or a rotating method.
[0093] Specifically, in FIG. 8, in the external air inlet (140), the opening ratio adjustment plate (149) slides to adjust the number of openings (147) to be opened among a plurality of openings (147) or the open area of the openings (147) to be opened.
[0094] In Fig. 9, in the outside air inlet (150), the opening rate adjustment plate (170) located at the rear of the outside air inlet window (160) rotates to close a plurality of openings (165), thereby controlling the number of openings (165) to be opened among the plurality of openings (165) or the open area of the openings (165) to be opened.
[0095] Under this combined structure, when the operating situation of the aforementioned EFEM (10) occurs, the aperture ratio adjustment plate (149, 170) can open the opening (147, 165) by sliding or rotating, thereby allowing outside air to flow into the interior of the duct body (40).
[0096] Although the embodiments of the present invention have been described with reference to the attached drawings, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential features thereof. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.
[0097] The present invention relates to a cooling duct for humidity control in semiconductor and display process equipment, and more specifically, to a cooling duct for humidity control that cools air flowing through a dehumidification path by heat exchange with a cooling medium and eliminates restrictions on the installation environment through simplification of the configuration, and thus has industrial applicability.
Claims
1. A cooling duct that is applied to the air path of the air supplied to the EFEM (Equipment Front End Module) equipped with a return room and constitutes the EFEM humidity control equipment. The above cooling duct, A cooling duct for humidity control including a sensible heat exchanger that cools the incoming air.
2. In paragraph 1, The above-mentioned heat exchanger is a cooling duct for humidity control that cools the introduced air by exchanging heat between the introduced air and the introduced cooling medium.
3. In paragraph 2, A power transmission fan that rotates by the air that is introduced after performing the heat exchange in the above-mentioned sensible heat exchanger; A cooling medium introduction fan that rotates by receiving the rotational power of the power transmission fan and introduces the cooling medium into the heat exchanger; and A cooling duct for controlling humidity further comprising a power transmission mechanism that transmits the rotational power of the power transmission fan to the cooling medium inlet fan to rotate the cooling medium inlet fan.
4. In paragraph 3, The above power transmission mechanism is, A first pulley formed on the rotational axis of the power transmission fan; A second pulley formed on the rotation axis of the cooling medium inlet fan; and A cooling duct for humidity control, comprising a rotating body wound around the first pulley and the second pulley.
5. In paragraph 3, The above power transmission mechanism is, A first gear formed on the rotational axis of the power transmission fan; and A cooling duct for humidity control, which is formed on the rotational axis of the cooling medium inlet fan and includes a second gear that receives rotational force from the first gear.
6. In paragraph 1, A humidity control cooling duct further including an outside air inlet section that, depending on the operating conditions of the above EFEM, introduces outside air and supplies it to the return room, thereby forming a positive pressure in the return room.
7. In paragraph 6, The above external air inlet is, outside air intake window; A plurality of openings formed in the above external air inlet window to introduce the external air; and A cooling duct for controlling humidity, comprising an opening ratio adjusting plate that adjusts the number of openings to be opened among the above-mentioned plurality of openings or the opening area of the openings to be opened.
8. In paragraph 7, A cooling duct for humidity control, wherein the above aperture ratio adjustment plate adjusts the number of openings to be opened among the plurality of openings or the open area of the openings to be opened through any one of a sliding method, a detachable method, and a rotating method.
9. In paragraph 6, The above EFEM operating situation is a situation where the operation of the EFEM humidity control equipment is stopped due to a power outage or breakdown.
10. In paragraph 6, The operating condition of the above EFEM is a cooling duct for humidity control in which the speed of the introduced air is below the standard value.
11. In paragraph 1, A duct body accommodating the heat exchanger inside; and A cooling duct for humidity control further comprising a filter unit attached to the duct body to purify air flowing into the EFEM.
Citation Information
Patent Citations
Semiconductor refrigeration split type air conditioning device based on evaporative cooling and using method
CN113251523A
Apparatus of containing semiconductor wafer
KR1020000065515A
A photosensitive resin composition, a partition wall structure prepared using the composition, and a display device comprising the partition wall structure
KR1020240056083A
Method and apparatus for providing a loading advertisement service
KR1020250169774A
KR20210079632A