Electronic device including heat dissipation member

Abstract

The present invention relates to an electronic device. An electronic device according to one embodiment of the present invention comprises: a housing; a heating source disposed inside the housing; and a heat dissipation member including a first portion facing the heat source and a second portion spaced apart from the first portion in a direction away from the heat source. The heat dissipation member includes: a case having a space formed therein; and a mesh disposed in the case and including a first mesh portion located in the first portion and a second mesh portion located in the second portion, wherein a first thickness of the first portion is greater than a second thickness of the second portion, and the thickness of the first mesh portion and the thickness of the second mesh portion may be different from each other.

Description

Electronic devices including heat dissipation members

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including a heat dissipation member.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure includes a housing, a heat source disposed inside the housing, and a heat dissipation member including a first portion facing the heat source and a second portion spaced apart from the first portion in a direction away from the heat source, wherein the heat dissipation member includes a case having a space formed therein, and a mesh disposed in the case and including a first mesh portion located in the first portion and a second mesh portion located in the second portion, wherein a first thickness of the first portion is greater than a second thickness of the second portion, and a thickness of the first mesh portion and a thickness of the second mesh portion may be different from each other.

[0006] An electronic device according to one embodiment of the present disclosure includes a housing, a heat source disposed inside the housing, a sensor disposed inside the housing and spaced apart from the heat source, and a heat dissipation member including a first part corresponding to the heat source, a second part corresponding to the sensor, and a third part connecting the first part and the second part, wherein the heat dissipation member may include a case extending from the first part toward the second part, and a mesh including a first mesh part positioned corresponding to the heat source in the first part, and a second mesh part positioned corresponding to the sensor in the second part.

[0007] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0009] FIG. 2 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 6 is a part of an electronic device according to one embodiment of the present disclosure.

[0014] Figure 7 is a drawing showing the structure illustrated in Figure 6 at an angle.

[0015] FIG. 8 is a part of an electronic device according to one embodiment of the present disclosure.

[0016] Figure 9 is an exploded view of a heat dissipation member according to one embodiment of the present disclosure.

[0017] FIG. 10 is a side view of a heat dissipation member according to one embodiment of the present disclosure.

[0018] FIG. 11 is a side view of a heat dissipation member according to one embodiment of the present disclosure.

[0019] Fig. 12 is a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0020] FIG. 13 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0021] Fig. 14 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0022] Fig. 15 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0023] FIG. 16 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0024] FIG. 17 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0025] Fig. 18 is a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0026] FIG. 19 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0027] FIG. 20 is a part of a cross-sectional view of a heat dissipation member according to one embodiment of the present disclosure.

[0028] FIG. 21 is a drawing of a heat dissipation member according to one embodiment of the present disclosure.

[0029] Fig. 22 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0030] Fig. 23 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0031] Fig. 24 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0032] Fig. 25 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0033] Fig. 26 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0034] Fig. 27 is a part of a heat dissipation member according to one embodiment of the present disclosure.

[0035] Fig. 28 is a drawing explaining the effect of a heat dissipation member according to one embodiment of the present disclosure.

[0036] Fig. 29 is a drawing explaining the effect of a heat dissipation member according to one embodiment of the present disclosure.

[0037] FIG. 30 is a drawing illustrating the effect of a heat dissipation member according to one embodiment of the present disclosure.

[0038] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0039] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described in this disclosure may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0040] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0041] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0042] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0043] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0044] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0045] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0046] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0047] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0048] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0049] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0050] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0051] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0052] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0054] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0056] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0057] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0058] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0060] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0061] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0062] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0063] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0064] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0065] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0066] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0067] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0068] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0069] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0070] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0071] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0072] FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0073] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 30.

[0074] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The back plate (211) may form the second side (210B). The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises a metal and / or a polymer. In one embodiment, the back plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0075] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat. For example, the curved extending region may not be included. When the curved extending region is included, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of other portions.

[0076] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0077] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0078] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0079] The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0080] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0081] The camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and / or a flash (213). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101). In one embodiment, the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219). The electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).

[0082] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0083] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0084] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0085] FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0086] FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0087] The embodiments of FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 30.

[0088] Referring to FIGS. 3 and 4, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or 2) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 1), a display (330) (e.g., the display (220) of FIG. 1), at least one printed circuit board (or board assembly) (340a, 340b), a battery (350), a second support member (360) (e.g., a rear case), an antenna, a camera assembly (307), and a rear plate (380) (e.g., the rear plate (211) of FIG. 2). When including a plurality of printed circuit boards (340a, 340b), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible printed circuit board (340c). For example, the printed circuit boards (340a, 340b) can include a first circuit board (340a) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (340b) positioned below (e.g., in the -Y-axis direction), and the flexible printed circuit board (340c) can electrically connect the first circuit board (340a) and the second circuit board (340b).

[0089] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any redundant description will be omitted below.

[0090] The first support member (311) may be provided in a flat shape at least in part. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is formed at least partially of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a, 340b) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a, 340b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0091] In one embodiment, the housing (301) may include a first support member (311) and a side structure (310). In one embodiment, the housing (301) may be understood as a structure for accommodating, protecting, or arranging a printed circuit board (340a, 340b) or a battery (350). In one embodiment, the housing (301) may be understood as including structures that can be visually or tactilely recognized by a user in the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and / or the rear plate (380). For example, the housing (301) may include structures forming the appearance of the electronic device (101), for example, the side structure (310), the front plate (320), and the rear plate (380). The housing (301) may be the same as the housing (210) described with reference to FIGS. 2 and 3 . In one embodiment, the 'front or rear side of the housing (301)' may refer to the first side (210A) of FIG. 1 or the second side (210B) of FIG. 2. In one embodiment, the first support member (311) is disposed between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the rear plate (380) (e.g., the second side (210B) of FIG. 3), and may function as a structure for arranging electrical / electronic components such as printed circuit boards (340a, 340b) or camera assemblies (307).

[0092] The memory may include, for example, volatile memory or non-volatile memory.

[0093] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0094] The second support member (360) may include, for example, an upper support member (360a) or a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (340a, 340b) (e.g., the first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. In one embodiment, the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (340b) interposed therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be placed on printed circuit boards (340a, 340b), and according to an embodiment, the printed circuit boards (340a, 340b) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) may be utilized as a structure on which electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed. In one embodiment, electrical / electronic components such as a speaker module or an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) may be arranged to surround an additional printed circuit board (e.g., a second printed circuit board (340b)) together with another portion of the first support member (311). An additional printed circuit board not shown or a speaker module or interface arranged on the lower support member (360b) may be arranged corresponding to the audio module (207) or connector holes (208, 209) of FIG. 2.

[0095] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit boards (340a, 340b). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0096] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (310) and / or a portion or combination of the first support member (311).

[0097] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window. In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a, 340b). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0098] According to one embodiment, the electronic device (101) may include camera holes (312, 313, 319). A plurality of camera holes (312, 313, 319) may be arranged spaced apart from each other. The camera assembly (307) may receive light passing through the camera holes (312, 313, 319).

[0099] In one embodiment, the first support member (311) may include a receiving portion (3111). A battery (350) may be disposed within the receiving portion (3111). The battery (350) may include a terrace (353). The terrace (353) may protrude toward the printed circuit board (340). The battery (350) may include a battery connection member (3501) connecting the terrace (353) and the printed circuit board (340).

[0100] According to one embodiment, the electronic device (101) may include a port insertion opening (308). The port insertion opening (308) may be opened in a portion of the housing (301). The port insertion opening (308) may be in communication with an external space of the housing (301). The electronic device (101) may be connected to an external device (e.g., a USB port, a charging cable, etc.), and the external device may be inserted into the port insertion opening (308).

[0101] According to one embodiment, the electronic device (101) may include an antenna (309). The antenna (309) may be positioned adjacent to the port insertion opening (308).

[0102] Fig. 6 is a drawing showing a part of the housing (301) of the electronic device (101) and the heat dissipation member (400). Fig. 7 is a drawing showing the structure shown in Fig. 6 obliquely. Fig. 8 is a part of the structure of Fig. 6 with the heat dissipation member (400) removed. The components described with reference to Figs. 6 to 8 may be partly or entirely the same as the components described with reference to Figs. 1 to 5. The components described with reference to Figs. 6 to 8 may be partly or entirely the same as the components described with reference to Figs. 7 to 30.

[0103] According to one embodiment, the electronic device (101) may include a housing (301). The housing (301) may include a support member (311). The description of the housing (301) may be identical to the description of the housing (301) described with reference to FIGS. 1 to 5. For example, the housing (301) may include a support member (311). The description of the support member (311) may be identical to the description of the first support member (311) described with reference to FIGS. 1 to 5.

[0104] According to one embodiment, the electronic device (101) may include a heat dissipation member (400). The heat dissipation member (400) may be disposed in the housing (301). The heat dissipation member (400) may be disposed in the support member (311). The heat dissipation member (400) may dissipate heat inside the housing (301) to the outside.

[0105] According to one embodiment, the electronic device (101) may include a heat source (340). The heat source (340) may be disposed inside the housing (301). The heat source (340) may include a printed circuit board (e.g., the printed circuit board (340a) of FIG. 5). The description of the heat source (340) may be identical to the description of the printed circuit board (340a) described with reference to FIGS. 1 to 5. The electronic device (101) may include a sensor (390). The sensor (390) may be disposed inside the housing (301). The sensor (390) may detect a signal transmitted from outside the housing (301). For example, the sensor (390) may include a fingerprint sensor. The sensor (390) may detect a user's fingerprint in contact with a display (e.g., the display (330) of FIG. 2).

[0106] According to one embodiment, the heat dissipation member (400) may be arranged to exchange heat with the heat source (340). The heat dissipation member (400) may be arranged to overlap the heat source (340). The heat dissipation member (400) may be arranged at a position corresponding to the heat source (340). The heat dissipation member (400) may release heat generated from the heat source (340). For example, the heat dissipation member (400) may release heat generated from a processor (e.g., processor (120) of FIG. 1) arranged at the heat source (340). The heat dissipation member (400) may be arranged to overlap the sensor (390). The heat dissipation member (400) may be arranged at a position corresponding to the sensor (390). The heat dissipation member (400) may be arranged to cover the sensor (390).

[0107] According to one embodiment, the housing (301) may include a frame (319). A heat dissipation member (400) may be disposed on the frame (319). The frame (319) may support at least a portion of the heat dissipation member (400). A heat source (340) may be disposed on the frame (319). The frame (319) may support at least a portion of the heat source (340). The heat dissipation member (400) and the heat source (340) may exchange heat with each other at positions corresponding to the frame (319). The frame (319) may be a portion of the support member (311).

[0108] In one embodiment, the frame (319) may include openings (3191, 3192). At least a portion of the heat dissipation member (400) may pass through the openings (3191, 3192). The heat dissipation member (400) may contact the heat source (340) by passing through the openings (3191, 3192). The openings (3191, 3192) may include a first opening (3191) and a second opening (3192) that are distinct from each other. The frame (319) may include a partition (3193) that divides the first opening (3191) and the second opening (3192). The frame (319) according to one embodiment of the present disclosure may include one opening (3191, 3192).

[0109] Fig. 9 is an exploded view of a heat dissipation member (400). Fig. 10 is a side view of the heat dissipation member (400) facing the sensor (390). Fig. 11 is a side view of the heat dissipation member (400) facing the heat source (340). The components described with reference to Figs. 9 and 11 may be partially or entirely the same as the components described with reference to Figs. 1 and 8. The components described with reference to Figs. 9 and 11 may be partially or entirely the same as the components described with reference to Figs. 12 and 30.

[0110] According to one embodiment, the heat dissipation member (400) may include a case (410). A space may be formed inside the case (410). The case (410) may include a first plate (411) and a second plate (412). A space may be formed between the first plate (411) and the second plate (412). A fluid may flow inside the case (410). The fluid may be a liquid or a gaseous state. For example, the fluid may be water. For example, the fluid may be water that vaporizes into vapor inside the case (410). For example, the fluid may be water that liquefies into water inside the case (410). For example, the fluid may be a refrigerant that undergoes a phase change (for example, nitrogen). The water or vapor inside the case (410) may flow inside the case (410).

[0111] According to one embodiment, the heat dissipation member (400) may include a mesh (430). The mesh (430) may be placed inside the case (410). The mesh (430) may be placed between the first plate (411) and the second plate (412). Water inside the case (410) may flow along the mesh (430).

[0112] According to one embodiment, the heat dissipation member (400) may include a first portion (401). The heat dissipation member (400) may include a second portion (402). The first portion (401) and the second portion (402) may be spaced apart from each other. The heat dissipation member (400) may include a third portion (403). The third portion (403) may connect the first portion (401) and the second portion (402). The third portion (403) may be a portion of the heat dissipation member (400) positioned between the first portion (401) and the second portion (402). The third portion (403) may extend from the first portion (401) to the second portion (402).

[0113] According to one embodiment, a heat source (e.g., a heat source (340) of FIG. 6) may be positioned corresponding to a first portion (401) of a heat dissipation member (400). The heat source (340) may exchange heat with the first portion (401) of the heat dissipation member (400). The heat source (340) may be in contact with the first portion (401) of the heat dissipation member (400). Heat generated from the heat source (340) may be transferred from the first portion (401) toward the second portion (402). The heat dissipation member (400) may include a heat exchange portion (4015) formed to protrude toward the heat source (340). The heat exchange portion (4015) may be a part of the first portion (401). The heat exchange portion (4015) may be positioned corresponding to the heat source (340).

[0114] According to one embodiment, a sensor (e.g., sensor (390) of FIG. 7) may be positioned corresponding to a second portion (402) of a heat dissipation member (400). The sensor (390) may be positioned to overlap the second portion (402) of the heat dissipation member (400). The second portion (402) of the heat dissipation member (400) may cover the sensor (390). The heat dissipation member (400) may include a heat transfer portion (4025) positioned corresponding to the sensor (390). The heat transfer portion (4025) may be a portion of the second portion (402). The heat transfer portion (4025) may be positioned corresponding to the sensor (390). The heat transfer portion (4025) may be a portion of the heat dissipation member (400) with a reduced thickness to accommodate a portion of the sensor (390).

[0115] In one embodiment, heat generated from the heat source (340) can be transferred from the first portion (401) to the second portion (402). For example, the heat generated from the heat source (340) can evaporate water flowing along the mesh (430). The water flowing along the mesh (430) can absorb the heat generated from the heat source (340) and change into vapor. The phase-changed vapor can flow inside the case (410). The vapor can flow from the first portion (401) toward the second portion (402). The vapor can exchange heat with air outside the case (410). The vapor can release heat to the outside of the case (410). The vapor can be liquefied through heat generation outside the case (410). The vapor can change into water through heat exchange with air outside the case (410). The phase-changed water can flow along the mesh (430) to the first portion (401). The water can flow along the mesh (430) by capillary action. The water flowing along the mesh (430) can exchange heat with the heat source (340). The heat dissipation member (400) can release heat generated from the heat source (340) through the phase change between water and steam described above.

[0116] Fig. 12 is a cross-sectional view taken along the A-A' reference line illustrated in Fig. 11. The components described with reference to Fig. 12 may be partially or entirely identical to the components described with reference to Figs. 1 to 11. The components described with reference to Fig. 12 may be partially or entirely identical to the components described with reference to Figs. 13 to 30.

[0117] According to one embodiment, the heat dissipation member (400) may include a first portion (401), a second portion (402), and a third portion (403).

[0118] In one embodiment, at least a portion of the heat dissipation member (400) may be surrounded by the support member (311). For example, a first portion (401) of the heat dissipation member (400) may be surrounded by a frame of the support member (311) (e.g., frame (319) of FIG. 8). The first portion (401) may protrude toward the support member (311). The first portion (401) may penetrate the frame (319) of the support member (311). The first portion (401) may pass through the frame (319) and come into contact with the heat source (340).

[0119] According to one embodiment, the first thickness (t1) of the first portion (401) and the second thickness (t2) of the second portion (402) may be different. The first thickness (t1) of the first portion (401) may be greater than the second thickness (t2) of the second portion (402).

[0120] According to one embodiment, the heat dissipation member (400) may include a chamber (420). The chamber (420) may refer to a space formed inside the case (410). The chamber (420) may refer to a portion of the case (410) that forms a space inside. The chamber (420) may refer to a wall of the case (410) that forms a flow path for vapor. The chamber (420) may be laminated with a mesh (430). The chamber (420) may form a flow path for vapor to move, and the mesh (430) may form a flow path for water to move.

[0121] According to one embodiment, the chamber (420) may include a first chamber portion (421). The first chamber portion (421) may be positioned in the first portion (401). The first chamber portion (421) may include a plurality of chamber layers (4211, 4212, 4213). The plurality of chamber layers (4211, 4212, 4213) may be stacked on each other. The plurality of chamber layers (4211, 4212, 4213) may include a first chamber layer (4211) and a second chamber layer (4212). The first chamber layer (4211) and the second chamber layer (4212) may be spaced apart from each other. At least a portion of the mesh (430) may be positioned between the first chamber layer (4211) and the second chamber layer (4212). The plurality of chamber layers (4211, 4212, 4213) may include a third chamber layer (4213). The third chamber layer (4213) may be formed between the first chamber layer (4211) and the second chamber layer (4212). The third chamber layer (4213) may be formed between the first mesh portion (431) and the third mesh portion (433). The first chamber layer (4211), the second chamber layer (4212), and the third chamber layer (4213) may be in communication with each other. The first chamber layer (4211), the second chamber layer (4212), and the third chamber layer (4213) may be connected to each other to form a single space.

[0122] In one embodiment, the chamber (420) may include a second chamber portion (422). The second chamber portion (422) may be positioned in the second portion (402). The second chamber portion (422) may be arranged to surround the sensor (390).

[0123] In one embodiment, the chamber (420) may include a third chamber portion (423). The third chamber portion (423) may be located in the third portion (403). The third chamber portion (423) may connect the first chamber portion (421) and the second chamber portion (422).

[0124] In one embodiment, the mesh (430) may include a first mesh portion (431). The first mesh portion (431) may be positioned in the first portion (401). The first mesh portion (431) may include a plurality of mesh layers (4313). The plurality of mesh layers (4313) may be stacked on each other. The plurality of mesh layers (4313) may include a first mesh layer (4311) and a second mesh layer (4312). The first mesh layer (4311) and the second mesh layer (4312) may be spaced apart from each other. At least a portion of the chamber (420) may be positioned between the first mesh layer (4311) and the second mesh layer (4312).

[0125] In one embodiment, the first mesh portion (431) may include a connecting portion (4314). The connecting portion (4314) may connect the first mesh layer (4311) and the second mesh layer (4312). The mesh (430) may be formed by at least a portion being bent. The connecting portion (4314) may be at least a portion of the bent mesh (430). The connecting portion (4314) may be surrounded by the case (410).

[0126] According to one embodiment, the first mesh portion (431) may include an inclined portion (4315). The inclined portion (4315) may connect the first mesh layer (4311) and the third mesh portion (433). The inclined portion (4315) may be inclined in a direction from the first portion (401) toward the second portion (402). The inclined portion (4315) may be surrounded by a case (410).

[0127] In one embodiment, the mesh (430) may include a second mesh portion (432). The second mesh portion (432) may be positioned in the second portion (402). The second mesh portion (432) may be laminated with the second chamber portion (422). The second mesh portion (432) may be positioned to correspond to the sensor (390). The second mesh portion (432) may cover the sensor (390).

[0128] In one embodiment, the mesh (430) may include a third mesh portion (433). The third mesh portion (433) may be positioned in the third portion (403). The third mesh portion (433) may connect the first mesh portion (431) and the second mesh portion (432). The third mesh portion (433) may be laminated with the third chamber portion (423).

[0129] Fig. 13 is an enlarged view of the first portion (401) illustrated in Fig. 12. The components described with reference to Fig. 13 may be partially or entirely identical to the components described with reference to Figs. 1 to 12. The components described with reference to Fig. 13 may be partially or entirely identical to the components described with reference to Figs. 14 to 30.

[0130] According to one embodiment, the first portion (401) may protrude toward the heat source (340). The first portion (401) may be in contact with the heat source (340). The heat dissipation member (400) may include a second surface (400a) that is in contact with the first surface (340a) of the heat source (340). The heat dissipation member (400) may be in surface contact with the heat source (340). Heat conduction may occur between the heat source (340) and the heat dissipation member (400).

[0131] According to one embodiment, a plurality of chamber layers (4211, 4212, 4213) and a plurality of mesh layers (4311, 4312) may be stacked on top of each other. For example, the plurality of chamber layers (4211, 4212, 4213) and the plurality of mesh layers (4311, 4312) may be arranged alternately.

[0132] According to one embodiment, the first mesh layer (4311) and the second mesh layer (4312) may be spaced apart from each other. The heat dissipation member (400) may include a channel (4316) formed between the first mesh layer (4311) and the second mesh layer (4312). The channel (4316) may refer to a space formed between the first mesh layer (4311) and the second mesh layer (4312). The channel (4316) may refer to a passage through which a fluid inside the case (410) flows. The channel (4316) may be a part of the chamber (420). The first chamber layer (4211) may be disposed between the first mesh layer (4311) and the second mesh layer (4312). The channel (4316) may be formed inside the first chamber layer (4211). The second chamber layer (4212) may be spaced apart from the first chamber layer (4211). The second mesh layer (4312) may be positioned between the first chamber layer (4211) and the second chamber layer (4212). The second chamber layer (4212) may be connected to the third chamber portion (423).

[0133] According to one embodiment, the first mesh layer (4311) may be arranged to exchange heat with the heat source (340). Water flowing within the first mesh layer (4311) may exchange heat with the heat source (340). The first mesh layer (4311) may be arranged closer to the heat source (340) than the first chamber layer (4211).

[0134] In one embodiment, water flowing within the mesh layers (4311, 4312) can absorb heat from the heat source (340) and evaporate. The phase-changed vapor from the mesh layers (4311, 4312) can flow toward the second portion (e.g., the second portion (402) of FIG. 12) through the chamber layers (4211, 4212, 4213).

[0135] Fig. 14 is a drawing showing the state before folding the mesh (430) of the heat dissipation member (400). Fig. 15 is a drawing of the mesh (430) in a folded state. The components described with reference to Figs. 14 and 15 may be partially or entirely the same as the components described with reference to Figs. 1 to 13. The components described with reference to Figs. 14 and 15 may be partially or entirely the same as the components described with reference to Figs. 16 to 30.

[0136] According to one embodiment, the mesh (430) may include a first mesh portion (431) located in the first portion (401), a second mesh portion (432) located in the second portion (402), and a third mesh portion (433) located in the third portion (403).

[0137] According to one embodiment, the first mesh portion (431) may include a first mesh layer (4311), a second mesh layer (4312) spaced apart from the first mesh layer (4311), and a connecting portion (4314) connecting the first mesh layer (4311) and the second mesh layer (4312).

[0138] In one embodiment, the connecting portion (4314) is foldable. The second mesh layer (4312) can be folded with respect to the first mesh layer (4311). The second mesh layer (4312) can be folded based on the connecting portion (4314). The first mesh layer (4311) and the second mesh layer (4312) can be laminated with each other. A channel (4316) can be formed between the first mesh layer (4311) and the second mesh layer (4312).

[0139] According to one embodiment, the heat dissipation member (400) may include a support frame (440). The support frame (440) may be positioned between the first mesh layer (4311) and the second mesh layer (4312). The support frame (440) may space the first mesh layer (4311) and the second mesh layer (4312). The support frame (440) may be referred to as a “spacer.”

[0140] According to one embodiment, the support frame (440) may include a head (441). The head (441) may be positioned between the first mesh layer (4311) and the second mesh layer (4312). The head (441) may be positioned corresponding to the connecting portion (4314).

[0141] In one embodiment, the support frame (440) may include a plurality of legs (442). The plurality of legs (442) may include a first leg (4421) and a second leg (4422) that are spaced apart from each other. A channel (4316) may be formed between the first leg (4421) and the second leg (4422). The first leg (4421) and the second leg (4422) may extend parallel to the direction of flow of the steam. For example, the legs (4421, 4422) may extend parallel to a chamber (e.g., chamber (420) of FIG. 12). The legs (4421, 4422) may guide the flow of the steam. The legs (4421, 4422) may be referred to as “guides.”

[0142] Fig. 16 is a cross-sectional view taken along the P-P' reference line illustrated in Fig. 15. Fig. 17 is a cross-sectional view taken along the Q-Q' reference line illustrated in Fig. 15. The components described with reference to Figs. 16 and 17 may be partially or entirely identical to the components described with reference to Figs. 1 to 15. The components described with reference to Figs. 16 and 17 may be partially or entirely identical to the components described with reference to Figs. 18 to 30.

[0143] In one embodiment, a channel (4316) may be formed between a first mesh layer (4311) and a second mesh layer (4312). A connecting portion (4314) may connect the first mesh layer (4311) and the second mesh layer (4312). A leg (442) may be positioned between the first mesh layer (4311) and the second mesh layer (4312) and may extend along the channel (4316).

[0144] In one embodiment, the leg (442) may include a first leg (4421) and a second leg (4422). A channel (4316) may be formed between each of the plurality of legs (4421, 4422).

[0145] Fig. 18 is a cross-sectional view taken along the A-A' reference line illustrated in Fig. 11, according to one embodiment. Fig. 19 is an enlarged view of the first portion (501) illustrated in Fig. 18. The components described with reference to Figs. 18 and 19 may be partially or entirely identical to the components described with reference to Figs. 1 to 17. The components described with reference to Figs. 18 and 19 may be partially or entirely identical to the components described with reference to Figs. 20 to 30.

[0146] According to one embodiment, the electronic device (101) may include a heat dissipation member (500). The description of the heat dissipation member (500) may be partially applied to the description of the heat dissipation member (400) described with reference to FIGS. 6 to 17. For example, the heat dissipation member (500) may include a first portion (501) corresponding to a heat source (340) and a second portion (502) corresponding to a sensor (390).

[0147] According to one embodiment, the heat dissipation member (500) may include a case (510). The description of the case (510) may be identical to the description of the case (410) described with reference to FIGS. 6 to 17.

[0148] According to one embodiment, the heat dissipation member (500) may include a chamber (520). The description of the chamber (520) may be identical to the description of the chamber (520) described with reference to FIGS. 6 to 17. For example, the chamber (520) may include a first chamber portion (521) located in the first portion (501), a second chamber portion (522) located in the second portion (502), and a third chamber portion (523) connecting the first chamber portion (521) and the second chamber portion (522).

[0149] According to one embodiment, the heat dissipation member (500) may include a mesh (530). The description of the mesh (530) may be identical to the description of the mesh (530) described with reference to FIGS. 6 to 17. For example, the mesh (530) may include a first mesh portion (531) located in the first portion (501), a second mesh portion (532) located in the second portion (502), and a third mesh portion (533) connecting the first mesh portion (531) and the second mesh portion (532).

[0150] According to one embodiment, the chamber (520) may include a first chamber layer (5211) and a second chamber layer (5212). The first chamber layer (5211) and the second chamber layer (5212) may be laminated to each other.

[0151] According to one embodiment, the mesh (530) may include a plurality of mesh layers (5313). The plurality of mesh layers (5313) may include a first mesh layer (5311) and a second mesh layer (5312) that are stacked on top of each other. The mesh (530) may include a connecting portion (5314) that connects the first mesh layer (5311) and the second mesh layer (5312). The mesh (530) may include an inclined portion (5315) that connects the first mesh layer (5311) and the third mesh portion (533).

[0152] According to one embodiment, the first mesh layer (5311) and the second mesh layer (5312) may be in contact with each other. The first mesh surface (5311a) of the first mesh layer (5311) and the second mesh surface (5312a) of the second mesh layer (5312) may be in contact with each other.

[0153] According to one embodiment, the plurality of mesh layers (5311, 5312) and the plurality of chamber layers (5211, 5212) may be stacked in the order of the plurality of mesh layers (5311, 5312) and the plurality of chamber layers (5211, 5212). The plurality of mesh layers (5311, 5312) may be arranged between the heat source (340) and the plurality of chamber layers (5211, 5212). The plurality of layers inside the first portion (501) may be stacked in the order of the first mesh layer (5311), the second mesh layer (5312), the first chamber layer (5211), and the second chamber layer (5212) with respect to the heat source (340).

[0154] According to an embodiment of the present invention, a heat dissipation member (400, 500) may have a first portion (401, 501) and a second portion (402, 502) formed to have different thicknesses, and the first portion (401, 501) may protrude toward a heat source (340). The first portion (401, 501) of the heat dissipation member (400, 500) may be in surface contact with the heat source (340) and may receive heat from the heat source (340) by conduction. The heat dissipation member (400, 500) may have a first portion (401, 501) thicker than the second portion (402, 502) and may have a plurality of mesh layers (4311, 4312, 5311, 5312) and a plurality of chamber layers (4211, 4212, 4213, 5211, 5212) laminated thereon. The heat dissipation member (400, 500) according to the embodiment of the present invention may improve heat transfer efficiency with the heat source (340) due to the above-described structure. The heat dissipation member (400, 500) according to the embodiment of the present invention can form the thickness of the first part (401, 501) to be greater than the thickness of the second part (402, 502) while maintaining the thickness of the chamber (420, 520) and the mesh (430, 530) to be substantially the same due to the structure described above, thereby improving the heat transfer efficiency of the entire heat dissipation member (400, 500).

[0155] Fig. 20 is an enlarged view of the second part (402) of the heat dissipation member (400). Fig. 21 is a drawing explaining the flow of water or steam through the heat dissipation member (400). The components described with reference to Figs. 20 and 21 may be partially or entirely the same as the components described with reference to Figs. 1 to 19. The components described with reference to Figs. 20 and 21 may be partially or entirely the same as the components described with reference to Figs. 22 to 30.

[0156] According to one embodiment, the heat dissipation member (400) may include a second portion (402) corresponding to the sensor (390). The second portion (402) may cover at least a portion of the sensor (390).

[0157] In one embodiment, the mesh (430) may include a second mesh portion (432) corresponding to the sensor (390). The second mesh portion (432) may cover at least a portion of the sensor (390).

[0158] In one embodiment, the chamber (420) may include a second chamber portion (422) and a third chamber portion (423). The sensor (390) may be positioned between the second chamber portion (422) and the third chamber portion (423). The chamber (420) may be positioned offset from the sensor (390).

[0159] According to one embodiment, the heat dissipation member (400) may include a groove (424). The groove (424) may be formed between the second chamber portion (422) and the third chamber portion (423). The sensor (390) may be located inside the groove (424). The groove (424) may be surrounded by the second mesh portion (432), the second chamber portion (422), and the third chamber portion (423).

[0160] According to one embodiment, heat generated from the heat source (340) can spread to the first part (401), the second part (402), and the third part (403). Heat generated from the heat source (340) can spread to the second part (402) corresponding to the sensor (390). Steam inside the heat dissipation member (400) can absorb heat generated from the heat source (340) and spread from the first part (401) to the second part (402). Water inside the heat dissipation member (400) can flow from the second part (402) to the first part (401) while releasing heat to the outside of the heat dissipation member (400).

[0161] Fig. 22 is an enlarged view of the area near the sensor (390) in the heat dissipation member (400) illustrated in Fig. 21. The components described with reference to Fig. 22 may be partially or entirely identical to the components described with reference to Figs. 1 to 21. The components described with reference to Fig. 22 may be partially or entirely identical to the components described with reference to Figs. 23 to 30.

[0162] In one embodiment, steam can flow from the third portion (403) toward the second portion (402). Water can flow from the second portion (402) toward the third portion (403). Water can flow from the second mesh portion (432) toward the third mesh portion (433).

[0163] In one embodiment, the heat dissipation member (400) may include an edge (4021). The edge (4021) may form an end portion of the second portion (402). Steam and water may flow in the vicinity of the edge (4021).

[0164] According to one embodiment, the second chamber portion (422) may be laminated with the second mesh portion (432). The second chamber portion (422) may include a 2-1 chamber portion (4221) and a 2-2 chamber portion (4222) that are spaced apart from each other. A groove (424) may be formed between the 2-1 chamber portion (4221) and the 2-2 chamber portion (4222). The 2-1 chamber portion (4221) may be laminated with the second mesh portion (432). The 2-2 chamber portion (4222) may be laminated with the second mesh portion (432). The sensor (390) may be disposed between the 2-1 chamber portion (4221) and the 2-2 chamber portion (4222). Steam flowing within the second chamber portion (422) can flow along the second-first chamber portion (4221) and the second-second chamber portion (4222) located on one side of the sensor (390). Water flowing along the second mesh portion (432) can flow at a position facing the sensor (390).

[0165] According to one embodiment, the third mesh portion (433) and the third chamber portion (423) can be laminated to each other. The third chamber portion (423) can be laminated to cover the entire area of ​​the third mesh portion (433).

[0166] FIG. 23 is an enlarged view of a region near a sensor (390) in a heat dissipation member (600) according to one embodiment of the present disclosure. The components described with reference to FIG. 23 may be partially or entirely identical to the components described with reference to FIGS. 1 to 22. The components described with reference to FIG. 23 may be partially or entirely identical to the components described with reference to FIGS. 24 to 30.

[0167] In one embodiment, steam can flow from the third portion (603) toward the second portion (602). Water can flow from the second portion (602) toward the third portion (603). Water can flow from the second mesh portion (632) toward the third mesh portion (633).

[0168] In one embodiment, the heat dissipation member (600) may include an edge (6021). The edge (6021) may form an end portion of the second portion (602). Steam and water may flow in the vicinity of the edge (6021).

[0169] According to one embodiment, the second chamber portion (622) may be laminated with the second mesh portion (632). The second chamber portion (622) may include a second-first chamber portion (6221) and a second-second chamber portion (6222) that are spaced apart from each other. A groove (624) may be formed between the second-first chamber portion (6221) and the second-second chamber portion (6222). The second-first chamber portion (6221) may be laminated with the second mesh portion (632). The second-second chamber portion (6222) may be laminated with the second mesh portion (632). The sensor (390) may be disposed between the second-first chamber portion (6221) and the second-second chamber portion (6222). Steam flowing within the second chamber portion (622) can flow along the second-first chamber portion (6221) and the second-second chamber portion (6222) located on one side of the sensor (390). Water flowing along the second mesh portion (632) can flow at a position facing the sensor (390).

[0170] According to one embodiment, the third mesh portion (633) and the third chamber portion (623) can be laminated to each other. The third chamber portion (623) can be laminated to cover the entire area of ​​the third mesh portion (633).

[0171] According to one embodiment, the heat dissipation member (600) may include a slit (640). The slit (640) may be formed by opening a portion of the mesh (630). The slit (640) may be positioned between the sensor (390) and the mesh (630). The slit (640) may include a first slit (641) and a second slit (642). At least a portion of the sensor (390) may be positioned between the first slit (641) and the second slit (642).

[0172] According to one embodiment, the second mesh portion (632) may include a second-first mesh portion (6321). The second-first mesh portion (6321) may be positioned to correspond to the sensor (390). The second-first mesh portion (6321) may face the groove (624). The second mesh portion (632) may include a second-second mesh portion (6322) and a second-third mesh portion (6323). The second-second mesh portion (6322) may be spaced apart from the second-first mesh portion (6321). A first slit (641) may be formed between the second-first mesh portion (6321) and the second-second mesh portion (6322). The second-third mesh portion (6323) may be spaced apart from the second-first mesh portion (6321). The second slit (642) may be formed between the 2-1 mesh portion (6321) and the 2-3 mesh portion (6323). The 2-1 mesh portion (6321) may be positioned between the 2-2 mesh portion (6322) and the 2-3 mesh portion (6323).

[0173] In one embodiment, the sensor (390) may be positioned corresponding to the edge (6021) of the heat dissipation member (600). The slit (640) may be spaced apart from the edge (6021). A portion of the water flowing along the second mesh portion (632) may flow between the slit (640) and the edge (6021). A water flow path may be formed between the slit (640) and the edge (6021).

[0174] FIG. 24 is an enlarged view of a region near a sensor (390) in a heat dissipation member (6000) according to one embodiment of the present disclosure. The components described with reference to FIG. 24 may be partially or entirely identical to the components described with reference to FIGS. 1 to 23. The components described with reference to FIG. 24 may be partially or entirely identical to the components described with reference to FIGS. 25 to 30.

[0175] According to one embodiment, the heat dissipation member (6000) may include a partition wall (641). The partition wall (641) may be positioned between the sensor (390) and the mesh (630). The partition wall (641) may include a first partition wall (6411) and a second partition wall (6412). At least a portion of the sensor (390) may be positioned between the first partition wall (6411) and the second partition wall (6412).

[0176] According to one embodiment, the second mesh portion (632) may include a second-first mesh portion (6321). The second-first mesh portion (6321) may be positioned to correspond to the sensor (390). The second-first mesh portion (6321) may face the groove (624). The second mesh portion (632) may include a second-second mesh portion (6322) and a second-third mesh portion (6323). The second-second mesh portion (6322) may be spaced apart from the second-first mesh portion (6321). A first partition wall (6411) may be formed between the second-first mesh portion (6321) and the second-second mesh portion (6322). The second-third mesh portion (6323) may be spaced apart from the second-first mesh portion (6321). The second bulkhead (642) may be formed between the 2-1 mesh portion (6321) and the 2-3 mesh portion (6323). The 2-1 mesh portion (6321) may be positioned between the 2-2 mesh portion (6322) and the 2-3 mesh portion (6323).

[0177] In one embodiment, the sensor (390) may be positioned corresponding to the edge (6021) of the heat dissipation member (6000). The partition wall (641) may be spaced apart from the edge (6021). A portion of the water flowing along the second mesh portion (632) may flow between the partition wall (641) and the edge (6021). A water flow path may be formed between the partition wall (641) and the edge (6021).

[0178] According to one embodiment, the bulkhead (641) can be formed by welding a first plate (e.g., the first plate (411) of FIG. 9) and a second plate (e.g., the second plate (412) of FIG. 9). The bulkhead (641) can partition at least a portion of the interior space of the case (e.g., the case (410) of FIG. 9).

[0179] FIG. 25 is an enlarged view of a region near a sensor (390) in a heat dissipation member (700) according to one embodiment of the present disclosure. The components described with reference to FIG. 25 may be partially or entirely identical to the components described with reference to FIGS. 1 to 24. The components described with reference to FIG. 25 may be partially or entirely identical to the components described with reference to FIGS. 26 to 30.

[0180] In one embodiment, steam can flow from the third portion (703) toward the second portion (702). Water can flow from the second portion (702) toward the third portion (703). Water can flow from the second mesh portion (732) toward the third mesh portion (733).

[0181] In one embodiment, the heat dissipation member (700) may include an edge (7021). The edge (7021) may form an end portion of the second portion (702). Steam and water may flow in the vicinity of the edge (7021).

[0182] According to one embodiment, the second chamber portion (722) may be laminated with the second mesh portion (732). The second chamber portion (722) may include a second-first chamber portion (7221) and a second-second chamber portion (7222) that are spaced apart from each other. A groove (724) may be formed between the second-first chamber portion (7221) and the second-second chamber portion (7222). The second-first chamber portion (7221) may be laminated with the second mesh portion (732). The second-second chamber portion (7222) may be laminated with the second mesh portion (732). The sensor (390) may be disposed between the second-first chamber portion (7221) and the second-second chamber portion (7222). Steam flowing within the second chamber portion (722) can flow along the second-first chamber portion (7221) and the second-second chamber portion (7222) located on one side of the sensor (390). Water flowing along the second mesh portion (732) can flow at a position facing the sensor (390).

[0183] According to one embodiment, the third mesh portion (733) and the third chamber portion (723) can be laminated to each other. The third chamber portion (723) can be laminated to cover the entire area of ​​the third mesh portion (733).

[0184] According to one embodiment, the sensor (390) may be spaced apart from an edge (7021) of the heat dissipation member (700). A gap (G) may be formed between the sensor (390) and the edge (7021). The second mesh portion (732) may include a first flow passage (7321) and a second flow passage (7322). The first flow passage (7321) may be connected to a third mesh portion (733). The first flow passage (7321) may be arranged to cover the sensor (390). The second flow passage (7322) may be located between the sensor (390) and the edge (7021). A portion of the water flowing along the second mesh portion (732) may flow at a corresponding location between the sensor (390) and the edge (7021). According to one embodiment of the present disclosure, the edge (7021) of the heat dissipation member (700) may be spaced apart from the sensor (390), so that a second flow passage (7322) may be formed between the edge (7021) and a position corresponding to the sensor (390).

[0185] FIG. 26 is an enlarged view of a region near a sensor (390) in a heat dissipation member (7000) according to one embodiment of the present disclosure. The components described with reference to FIG. 26 may be partially or entirely identical to the components described with reference to FIGS. 1 to 25. The components described with reference to FIG. 26 may be partially or entirely identical to the components described with reference to FIGS. 27 to 30.

[0186] According to one embodiment, the heat dissipation member (7000) may include a slit (740). The slit (740) may be formed by opening a portion of the mesh (730). The slit (740) may be positioned between the sensor (390) and the mesh (730). The slit (740) may include a first slit (741) and a second slit (742). At least a portion of the sensor (390) may be positioned between the first slit (741) and the second slit (742).

[0187] According to one embodiment, the second mesh portion (732) may include a second-first mesh portion (7323). The second-first mesh portion (7323) may be positioned to correspond to the sensor (390). The second-first mesh portion (7323) may face the groove (724). The second mesh portion (732) may include a second-second mesh portion (7324) and a second-third mesh portion (7325). The second-second mesh portion (7324) may be spaced apart from the second-first mesh portion (7323). A first slit (741) may be formed between the second-first mesh portion (7323) and the second-second mesh portion (7324). The second-third mesh portion (7325) may be spaced apart from the second-first mesh portion (7323). The second slit (742) may be formed between the 2-1 mesh portion (7323) and the 2-3 mesh portion (7325). The 2-1 mesh portion (7323) may be positioned between the 2-2 mesh portion (7324) and the 2-3 mesh portion (7325).

[0188] In one embodiment, the sensor (390) may be spaced apart from the edge (7021) of the heat dissipation member (7000). The slit (740) may be spaced apart from the edge (7021). A portion of the water flowing along the second mesh portion (732) may flow between the slit (740) and the edge (7021). A water flow path may be formed between the slit (740) and the edge (7021). The slit (740) may extend to correspond to the entire side of the sensor (390).

[0189] FIG. 27 is an enlarged view of a region near a sensor (390) in a heat dissipation member (7001) according to one embodiment of the present disclosure. The components described with reference to FIG. 27 may be partially or entirely identical to the components described with reference to FIGS. 1 to 26. The components described with reference to FIG. 27 may be partially or entirely identical to the components described with reference to FIGS. 28 to 30.

[0190] In one embodiment, the heat dissipation member (7001) may include a partition wall (741). The partition wall (741) may be positioned between the sensor (390) and the mesh (730). The partition wall (741) may include a first partition wall (7411) and a second partition wall (7412). At least a portion of the sensor (390) may be positioned between the first partition wall (7411) and the second partition wall (7412).

[0191] According to one embodiment, the second mesh portion (732) may include a second-first mesh portion (7323). The second-first mesh portion (7323) may be positioned to correspond to the sensor (390). The second-first mesh portion (7323) may face the groove (724). The second mesh portion (732) may include a second-second mesh portion (7324) and a second-third mesh portion (7325). The second-second mesh portion (7324) may be spaced apart from the second-first mesh portion (7323). A first partition wall (7411) may be formed between the second-first mesh portion (7323) and the second-second mesh portion (7324). The second-third mesh portion (7325) may be spaced apart from the second-first mesh portion (7323). The second bulkhead (742) may be formed between the 2-1 mesh portion (7323) and the 2-3 mesh portion (7325). The 2-1 mesh portion (7323) may be positioned between the 2-2 mesh portion (7324) and the 2-3 mesh portion (7325).

[0192] In one embodiment, the sensor (390) may be spaced apart from the edge (7021) of the heat dissipation member (7001). The partition wall (741) may be spaced apart from the edge (7021). A portion of the water flowing along the second mesh portion (732) may flow between the partition wall (741) and the edge (7021). A water flow path may be formed between the partition wall (741) and the edge (7021). The partition wall (741) may extend to correspond to the entire side of the sensor (390).

[0193] The heat dissipation member according to an embodiment of the present invention can extend to a position corresponding to the sensor (390). The heat dissipation member can form a groove at a position corresponding to the sensor (390) and only arrange a mesh at a position corresponding to the sensor (390). The heat dissipation member according to an embodiment of the present invention can increase the heat exchange surface area of ​​the heat dissipation member by increasing the extension length of the heat dissipation member due to the above-described structure. The heat dissipation member according to an embodiment of the present invention can increase the heat release amount by increasing the surface area of ​​the heat dissipation member due to the above-described structure.

[0194] A heat dissipation member according to an embodiment of the present invention may have slits or partitions arranged in a mesh. Water flowing along the mesh may flow to the edge of the heat dissipation member through the slits or partitions. The slits or partitions may guide the flow of water. Due to the above-described structure, a heat dissipation member according to an embodiment of the present invention can transmit heat generated from a heat source to the edge of the heat dissipation member.

[0195] FIGS. 28, 29, and 30 are drawings illustrating the effects of a heat dissipation member according to an embodiment of the present invention. The components described with reference to FIGS. 28 to 30 may be partially or entirely identical to the components described with reference to FIGS. 1 to 27.

[0196] Referring to Fig. 28, compared to the heat dissipation member (A) according to the comparative example, it can be confirmed that the heat dissipation member (B) according to the embodiment of the present invention spreads heat from the first portion (401) to the entire area of ​​the heat dissipation member. For example, unlike the first portion (901) of the heat dissipation member (A) according to the comparative example, which does not come into direct contact with the heat source, the heat dissipation member (B) according to the embodiment of the present disclosure can spread heat to the entire area of ​​the heat dissipation member by having the first portion (401) come into direct contact with the heat source.

[0197] Referring to Fig. 29, it can be confirmed that the heat dissipation member (B) according to the embodiment of the present invention has a large heat dissipation amount for the entire area, compared to the heat dissipation member (A) according to the comparative example. It can be confirmed that the heat dissipation member (C) according to the embodiment of the present invention (e.g., the heat dissipation members (400, 600, 6000, 700, 7000) of Figs. 22 to 27) has a large heat dissipation amount for the entire area, compared to the heat dissipation member (A) according to the comparative example.

[0198] Referring to FIG. 30, it can be confirmed that the heat dissipation member (B) according to the embodiment of the present invention has a greater amount of heat dissipation in the second portion (402) compared to the heat dissipation member (A) according to the comparative example. For example, unlike the heat dissipation member (A) of the comparative example which does not extend to a position (902) corresponding to the sensor, the heat dissipation member (B) according to the embodiment of the present disclosure can evenly dissipate heat to the second portion (402) by extending the second portion (402) to a position corresponding to the sensor.

[0199] Electronic devices include a housing and a heat source that generates heat within the housing. If the heat generated by the heat source cannot be dissipated outside the housing, it can degrade the performance of the electronic device. Electronic devices include a heat dissipation member located within the housing. The heat dissipation member dissipates the heat generated from the heat source within the confined space within the housing to the outside of the housing.

[0200] The problem to be solved in the present disclosure may be to improve the heat dissipation efficiency of a heat dissipation member.

[0201] The problem to be solved in the present disclosure may be to increase the surface area of ​​a heat dissipation member.

[0202] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0203] An electronic device according to various embodiments of the present disclosure can improve the heat dissipation efficiency of a heat dissipation member by protruding a portion of the heat dissipation member toward a heat source and bringing the heat source and the heat dissipation member into direct contact.

[0204] An electronic device according to various embodiments of the present disclosure can increase the surface area of ​​a heat dissipation member by extending the heat dissipation member from a heat source to a position corresponding to a sensor.

[0205] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0206] An electronic device (e.g., 101 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a housing (e.g., 301 of FIGS. 1 to 30).

[0207] An electronic device (e.g., 101 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a heat source (e.g., 340 of FIGS. 1 to 30) disposed inside the housing (e.g., 301 of FIGS. 1 to 30).

[0208] An electronic device (e.g., 101 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a heat dissipation member (e.g., 400 of FIGS. 1 to 30) including a first portion (e.g., 401 of FIGS. 1 to 30) facing the heat source (e.g., 340 of FIGS. 1 to 30) and a second portion (e.g., 402 of FIGS. 1 to 30) spaced apart from the first portion (e.g., 401 of FIGS. 1 to 30) in a direction away from the heat source (e.g., 340 of FIGS. 1 to 30).

[0209] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a case (e.g., 410 of FIGS. 1 to 30) extending from the first portion (e.g., 401 of FIGS. 1 to 30) toward the second portion (e.g., 402 of FIGS. 1 to 30).

[0210] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a mesh (e.g., 430 of FIGS. 1 to 30) arranged inside the case (e.g., 410 of FIGS. 1 to 30).

[0211] According to one embodiment of the present disclosure, a first thickness (e.g., t1 of FIGS. 1 to 30) of the first portion (e.g., 401 of FIGS. 1 to 30) is greater than a second thickness (e.g., t2 of FIGS. 1 to 30) of the second portion (e.g., 402 of FIGS. 1 to 30), and the mesh (e.g., 430 of FIGS. 1 to 30) may include a plurality of mesh layers (e.g., 4313 of FIGS. 1 to 30) located in the first portion (e.g., 401 of FIGS. 1 to 30).

[0212] According to one embodiment of the present disclosure, the plurality of mesh layers (e.g., 4313 of FIGS. 1 to 30) may be stacked and arranged relative to the heat source (e.g., 430 of FIGS. 1 to 30).

[0213] The plurality of mesh layers (e.g., 4313 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a first mesh layer (e.g., 4311 of FIGS. 1 to 30).

[0214] The plurality of mesh layers (e.g., 4313 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a second mesh layer (e.g., 4312 of FIGS. 1 to 30) spaced apart from the first mesh layer (e.g., 4311 of FIGS. 1 to 30).

[0215] The plurality of mesh layers (e.g., 4313 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a connecting portion (e.g., 4314 of FIGS. 1 to 30) connecting the first mesh layer (e.g., 4311 of FIGS. 1 to 30) and the second mesh layer (e.g., 4312 of FIGS. 1 to 30).

[0216] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a channel (e.g., 4316 of FIGS. 1 to 30) formed between the first mesh layer (e.g., 4311 of FIGS. 1 to 30) and the second mesh layer (e.g., 4312 of FIGS. 1 to 30) through which steam flows.

[0217] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a support frame (e.g., 440 of FIGS. 1 to 30) disposed between the first mesh layer (e.g., 4311 of FIGS. 1 to 30) and the second mesh layer (e.g., 4312 of FIGS. 1 to 30).

[0218] The support frame (e.g., 440 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a plurality of legs (e.g., 442 of FIGS. 1 to 30) extending in a direction from the first portion (e.g., 401 of FIGS. 1 to 30) toward the second portion (e.g., 402 of FIGS. 1 to 30).

[0219] The plurality of legs (e.g., 442 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a first leg (e.g., 4421 of FIGS. 1 to 30).

[0220] The plurality of legs (e.g., 442 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a second leg (e.g., 4422 of FIGS. 1 to 30) spaced apart from the first leg (e.g., 4421 of FIGS. 1 to 30).

[0221] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a channel (e.g., 4316 of FIGS. 1 to 30) formed between the first leg (e.g., 4421 of FIGS. 1 to 30) and the second leg (e.g., 4422 of FIGS. 1 to 30) through which steam flows.

[0222] The plurality of mesh layers (e.g., 5313 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a second mesh layer (e.g., 5312 of FIGS. 1 to 30) that is in contact with the first mesh layer (e.g., 5311 of FIGS. 1 to 30) and is laminated with the first mesh layer (e.g., 5311 of FIGS. 1 to 30).

[0223] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a chamber (e.g., 420 of FIGS. 1 to 30) formed inside the case (e.g., 410 of FIGS. 1 to 30) and including a plurality of chamber layers (e.g., 4211 and 4212 of FIGS. 1 to 30) located in the first portion (e.g., 401 of FIGS. 1 to 30).

[0224] According to one embodiment of the present disclosure, the plurality of chamber layers (e.g., 4211 and 4212 of FIGS. 1 to 30) may be arranged alternately with the plurality of mesh layers (e.g., 4313 of FIGS. 1 to 30).

[0225] According to one embodiment of the present disclosure, the plurality of chamber layers (e.g., 5211 and 5212 of FIGS. 1 to 30) may be positioned further from the heat source (e.g., 430 of FIGS. 1 to 30) than the plurality of mesh layers (e.g., 5313 of FIGS. 1 to 30).

[0226] An electronic device (e.g., 101 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a sensor (e.g., 390 of FIGS. 1 to 30) disposed inside the housing (e.g., 301 of FIGS. 1 to 30) and spaced apart from the heat source (e.g., 340 of FIGS. 1 to 30).

[0227] According to one embodiment of the present disclosure, the second part (e.g., 402 of FIGS. 1 to 30) of the heat dissipating member (e.g., 400 of FIGS. 1 to 30) may be arranged to correspond to the sensor (e.g., 390 of FIGS. 1 to 30).

[0228] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a groove (e.g., 424 of FIGS. 1 to 30) surrounding at least a portion of the sensor (e.g., 390 of FIGS. 1 to 30).

[0229] The heat dissipation member (e.g., 600, 700 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a slit (e.g., 640, 740 of FIGS. 1 to 30) formed between the mesh (e.g., 630, 730 of FIGS. 1 to 30) and the sensor (e.g., 390 of FIGS. 1 to 30).

[0230] The heat dissipation member (e.g., 6000, 7000 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a partition (e.g., 641, 741 of FIGS. 1 to 30) disposed between the mesh (e.g., 630, 730 of FIGS. 1 to 30) and the sensor (e.g., 390 of FIGS. 1 to 30).

[0231] An electronic device (e.g., 101 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a sensor (e.g., 390 of FIGS. 1 to 30) disposed inside the housing (e.g., 301 of FIGS. 1 to 30) and spaced apart from the heat source (e.g., 340 of FIGS. 1 to 30).

[0232] An electronic device (e.g., 101 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a heat dissipation member (e.g., 400 of FIGS. 1 to 30) including a first part (e.g., 401 of FIGS. 1 to 30) corresponding to the heat source (e.g., 340 of FIGS. 1 to 30), a second part (e.g., 402 of FIGS. 1 to 30) corresponding to the sensor (e.g., 390 of FIGS. 1 to 30), and a third part (e.g., 403 of FIGS. 1 to 30) connecting the first part (e.g., 401 of FIGS. 1 to 30) and the second part (e.g., 402 of FIGS. 1 to 30).

[0233] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a case (e.g., 410 of FIGS. 1 to 30) extending from the first portion (e.g., 401 of FIGS. 1 to 30) toward the second portion (e.g., 402 of FIGS. 1 to 30).

[0234] The heat dissipation member (e.g., 400 of FIGS. 1 to 30) according to one embodiment of the present disclosure may include a mesh (e.g., 430 of FIGS. 1 to 30) including a first mesh portion (e.g., 431 of FIGS. 1 to 30) positioned to correspond to the heat source (e.g., 340 of FIGS. 1 to 30) in the first portion (e.g., 401 of FIGS. 1 to 30) and a second mesh portion (e.g., 432 of FIGS. 1 to 30) positioned to correspond to the sensor (e.g., 390 of FIGS. 1 to 30) in the second portion (e.g., 402 of FIGS. 1 to 30).

[0235] According to one embodiment of the present disclosure, the mesh (e.g., 430 of FIGS. 1 to 30) can cover one side of the sensor (e.g., 390 of FIGS. 1 to 30).

[0236] Although the detailed description of the present disclosure has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of the present disclosure.

[0237] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (101), Housing (301); A heat source (340) placed inside the housing (301); and It includes a heat dissipation member (400) including a first part (401) facing the heat source (340) and a second part (402) spaced apart from the first part (401) in a direction away from the heat source (340). The above heat dissipation member (400) is A case (410) having a space formed inside; and A mesh (430) is disposed in the case (410) and includes a first mesh portion (431) located in the first part (401) and a second mesh portion (432) located in the second part (402), An electronic device in which the first thickness (t1) of the first part (401) is greater than the second thickness (t2) of the second part (402), and the thickness of the first mesh part (431) and the thickness of the second mesh part (432) are different from each other.

2. In paragraph 1, The above mesh (430) is An electronic device comprising a plurality of mesh layers (4313) arranged in a stacked manner with respect to the above heat source (340), each of which is a part of the first mesh portion (431).

3. In paragraph 1 or 2, The above mesh (430) is First mesh layer (4311); A second mesh layer (4312) spaced apart from the first mesh layer (4311); and An electronic device including a connecting portion (4314) connecting the first mesh layer (4311) and the second mesh layer (4312).

4. In paragraph 3, The above heat dissipation member (400) is An electronic device including a channel (4316) formed between the first mesh layer (4311) and the second mesh layer (4312) and through which vapor flows.

5. In paragraph 3 or 4, The above heat dissipation member (400) is An electronic device including a support frame (440) disposed between the first mesh layer (4311) and the second mesh layer (4312).

6. In paragraph 5, The above support frame (440) is An electronic device comprising a plurality of legs (442) extending in a direction from the first portion (401) toward the second portion (402).

7. In paragraph 6, The above plurality of legs (442) are, First leg (4421); and Including a second leg (4422) spaced apart from the first leg (4421), The above heat dissipation member (400) is An electronic device comprising a channel (4316) formed between the first leg (4421) and the second leg (4422) and through which steam flows.

8. In any one of paragraphs 1 to 7, The above mesh (530) is First mesh layer (5311); and An electronic device comprising a second mesh layer (5312) in contact with the first mesh layer (5311) and laminated with the first mesh layer (5311).

9. In any one of paragraphs 1 to 8, The above heat dissipation member (400) is An electronic device comprising a chamber (420) formed inside the case (410) and including a plurality of chamber layers (4211, 4212) located in the first part (401).

10. In paragraph 9, The above mesh (430) includes a plurality of mesh layers (4313), An electronic device in which the above plurality of chamber layers (4211, 4212) are arranged alternately with the above plurality of mesh layers (4313).

11. In paragraph 9 or 10, An electronic device in which the above plurality of chamber layers (5211, 5212) are located further from the heat source (340) than the mesh (530).

12. In any one of paragraphs 1 to 11, It further includes a sensor (390) disposed inside the housing (301) and spaced apart from the heat source (340), The second part (402) of the above heat dissipation member (400) is an electronic device arranged to correspond to the sensor (390).

13. In paragraph 12, The above heat dissipation member (400) is An electronic device comprising a groove (424) surrounding at least a portion of the sensor (390).

14. In paragraph 12 or 13, The above heat dissipation member (600, 700) is An electronic device including a slit (640, 740) formed between the mesh (630, 730) and the sensor (390).

15. In any one of paragraphs 12 to 14, The above heat dissipation member (6000, 7000) is An electronic device including a partition wall (641, 741) disposed between the mesh (630, 730) and the sensor (390).

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