Connecting terminal and charging device

Abstract

Provided are a connecting terminal (100) and a charging device (400). The connecting terminal comprises a main body structure (110) and conductive contacts (120) exposed to an external environment. Each base layer (121) is provided on the main body structure (110); a phosphorus copper layer (123) is provided on the base layer (121); a first gold layer (125) is provided on the phosphorus copper layer (123); and at least one anti-electrolysis layer (137) is provided on the first gold layer (125), thereby improving the anti-electrolysis performance and the anti-oxidation performance of the conductive contacts (120).

Description

Connection terminals and charging device Technical Field

[0001] This application relates to the field of charging connections, and in particular to connection terminals and charging devices. Background Technology

[0002] Connecting cables, including data cables and charging cables, typically use plug-in terminals for connection. The connectors of these cables usually use conductive contacts, also known as pins, to achieve electrical connection. These conductive contacts come in two designs: one where they are internal, and the other where they are exposed. Taking the Lightning connector as an example, the pins are exposed. When the connector has been used for more than two years or has been plugged in and out more than 300 times, the surface of the connector is prone to oxidation and blackening, thus affecting the electrical contact effect. This effect is particularly noticeable on the pins of the Lightning connector.

[0003] Summary of the Invention

[0004] Therefore, it is necessary to provide a connection terminal and a charging device.

[0005] In one embodiment, a connection terminal includes a main structure and conductive contacts. The conductive contacts include a base layer and a conductive layer and an anti-electrolysis layer disposed on the base layer. The conductive layer includes a phosphor bronze layer and a first gold layer. The base layer is disposed on the main structure, the phosphor bronze layer is disposed on the base layer, the first gold layer is disposed on the phosphor bronze layer, and at least one anti-electrolysis layer is disposed on the first gold layer. This connection terminal, by protecting the base layer and conductive layer with the anti-electrolysis layer, provides a more stable and reliable conductive contact and conductive layer design compared to traditional connectors. Furthermore, the phosphor bronze layer design enhances the adhesion of the conductive layer to the base layer. It also reliably improves the anti-electrolysis properties of the conductive layer and the oxidation resistance of the base layer made of copper or copper alloy materials, preventing the conductive contacts from blackening and ensuring effective electrical contact. This is particularly suitable for traditional Lightning connectors, especially solving the problem that the fourth pin from the left in traditional Lightning connectors is relatively prone to oxidation and blackening due to the relatively large current.

[0006] In one embodiment, the phosphor bronze layer is attached to the substrate by dip plating, the first gold layer is attached to the phosphor bronze layer by dip plating, and the anti-electrolysis layer is attached to the first gold layer by brush plating.

[0007] In one embodiment, at least one anti-electrolysis layer is disposed between the phosphor bronze layer and the first gold layer.

[0008] In one embodiment, the anti-electrolysis layer includes a nickel-tungsten layer and a platinum layer, wherein the nickel-tungsten layer is disposed on the phosphor bronze layer, the first gold layer is disposed on the nickel-tungsten layer, and the platinum layer is disposed on the first gold layer.

[0009] In one embodiment, the nickel-tungsten layer is attached to the phosphor bronze layer by dip plating, the first gold layer is attached to the nickel-tungsten layer by dip plating, and the platinum layer is attached to the first gold layer by brush plating.

[0010] In one embodiment, the conductive layer further includes a second gold layer disposed on the first gold layer, and at least one anti-electrolysis layer disposed between the first gold layer and the second gold layer, and at least one anti-electrolysis layer disposed on the second gold layer.

[0011] In one embodiment, the anti-electrolysis layer includes a palladium layer and a platinum layer, wherein the palladium layer is disposed on the first gold layer, the second gold layer is disposed on the palladium layer, and the platinum layer is disposed on the second gold layer.

[0012] In one embodiment, the palladium layer is attached to the first gold layer by brush plating, the second gold layer is attached to the palladium layer by immersion plating, and the platinum layer is attached to the second gold layer by brush plating.

[0013] In one embodiment, the conductive layer further includes a second gold layer disposed on the first gold layer, at least one anti-electrolysis layer disposed between the phosphor bronze layer and the first gold layer, at least one anti-electrolysis layer disposed between the first gold layer and the second gold layer, and at least one anti-electrolysis layer disposed on the second gold layer.

[0014] In one embodiment, the anti-electrolysis layer includes a nickel-tungsten layer, a palladium layer, and a platinum layer, wherein the nickel-tungsten layer is disposed on a phosphor bronze layer, a first gold layer is disposed on the nickel-tungsten layer, a palladium layer is disposed on the first gold layer, a second gold layer is disposed on the palladium layer, and a platinum layer is disposed on the second gold layer.

[0015] In one embodiment, a nickel-tungsten layer is attached to a phosphor bronze layer by dip-plating, a first gold layer is attached to the nickel-tungsten layer by dip-plating, a palladium layer is attached to the first gold layer by brush plating, a second gold layer is attached to the palladium layer by dip-plating, and a platinum layer is attached to the second gold layer by brush plating.

[0016] In one embodiment, the outermost layer of the anti-electrolysis layer protrudes from the main structure; or...

[0017] The outer surface of the anti-electrolysis layer is exposed to the external environment.

[0018] In one embodiment, the main structure has two opposite contact surfaces, each contact surface being provided with a conductive contact piece; preferably, the conductive contact pieces are arranged regularly on each contact surface.

[0019] In one embodiment, the main structure has two opposite contact surfaces, and each contact surface is provided with a conductive contact piece; preferably, the conductive contact pieces are arranged regularly on each contact surface; the base layer has two opposite conductive connection surfaces, and the conductive contact piece is provided with a conductive layer on each conductive connection surface, wherein the first gold layer of one conductive layer is provided on the main structure, and the first gold layer of the other conductive layer is provided with at least one anti-electrolysis layer.

[0020] In one embodiment, any conductive connection surface is parallel to any contact surface.

[0021] In one embodiment, the two conductive connection surfaces are a first conductive connection surface and a second conductive connection surface, respectively.

[0022] The conductive layer disposed on the first conductive connection surface is the first conductive layer, and the first conductive layer further includes a second gold layer. The anti-electrolysis layer includes a nickel-tungsten layer, a palladium layer, and a platinum layer. The nickel-tungsten layer is disposed on a phosphor bronze layer, the first gold layer is disposed on the nickel-tungsten layer, the palladium layer is disposed on the first gold layer, the second gold layer is disposed on the palladium layer, and the platinum layer is disposed on the second gold layer. The conductive layer disposed on the second conductive connection surface is the second conductive layer, and the first gold layer on the second conductive layer is welded to the main structure. Alternatively, the second conductive layer may also include a second gold layer disposed on the first gold layer, and the second gold layer is welded to the main structure. Or, the anti-electrolysis layer may include a nickel-tungsten layer disposed between the phosphor bronze layer and the first gold layer.

[0023] In one embodiment, for the first conductive layer and the anti-electrolysis layer disposed on the first conductive connection surface, the phosphor bronze layer is attached to the base layer by dip-plating, the nickel tungsten layer is attached to the phosphor bronze layer by dip-plating, the first gold layer is attached to the nickel tungsten layer by dip-plating, the palladium layer is attached to the first gold layer by brush plating, the second gold layer is attached to the palladium layer by dip-plating, and the platinum layer is attached to the second gold layer by brush plating; or...

[0024] For the second conductive layer and the anti-electrolysis layer disposed on the second conductive connection surface, the phosphor bronze layer is attached to the base layer by dip-plating, the nickel tungsten layer is attached to the phosphor bronze layer by dip-plating, the first gold layer is attached to the nickel tungsten layer by dip-plating, and the second gold layer is attached to the first gold layer by dip-plating; or,

[0025] The base layer has a groove at the second conductive connection surface, and the second conductive layer has an opening corresponding to the groove.

[0026] In one embodiment, the thickness of the phosphor bronze layer is 30 micrometers ± 4.5 micrometers, the thickness of the nickel tungsten layer is 50 micrometers ± 7.5 micrometers, the thickness of the first gold layer is 1 micrometer ± 0.15 micrometers, the thickness of the palladium layer is greater than or equal to 3 micrometers ± 0.45 micrometers, the thickness of the second gold layer is 1 micrometer ± 0.15 micrometers, and the thickness of the platinum layer is 20 micrometers ± 3 micrometers.

[0027] In one embodiment, the thickness of the phosphor bronze layer is about 30 micrometers, the thickness of the nickel tungsten layer is about 50 micrometers, the thickness of the first gold layer is about 1 micrometer, the thickness of the palladium layer is about 3 micrometers, the thickness of the second gold layer is about 1 micrometer, and the thickness of the platinum layer is about 20 micrometers.

[0028] In one embodiment, the connection terminal is a Lightning connector.

[0029] In one embodiment, the connection terminal also includes a control board, which is connected to the conductive contact via the main structure.

[0030] In one embodiment, a charging device includes a power supply terminal, a wire, and a connection terminal; the connection terminal includes a main body structure and a conductive contact; the conductive contact includes a base layer and a conductive layer and an anti-electrolysis layer disposed on the base layer, the conductive layer including a phosphor bronze layer and a first gold layer; wherein the base layer is disposed on the main body structure, the phosphor bronze layer is disposed on the base layer, the first gold layer is disposed on the phosphor bronze layer, and at least one anti-electrolysis layer is disposed on the first gold layer; the wire is connected to the main body structure, and the power supply terminal is sequentially connected to the conductive contact through the wire, the main body structure, and the conductive contact.

[0031] In one embodiment, in the charging device, the phosphor bronze layer is attached to the base layer by dip plating, the first gold layer is attached to the phosphor bronze layer by dip plating, and the anti-electrolysis layer is attached to the first gold layer by brush plating.

[0032] In one embodiment, in the charging device, at least one anti-electrolysis layer is disposed between the phosphor bronze layer and the first gold layer.

[0033] In one embodiment, the anti-electrolysis layer in the charging device includes a nickel-tungsten layer and a platinum layer, wherein the nickel-tungsten layer is disposed on a phosphor bronze layer, a first gold layer is disposed on the nickel-tungsten layer, and a platinum layer is disposed on the first gold layer.

[0034] In one embodiment, in the charging device, the nickel-tungsten layer is attached to the phosphor bronze layer by immersion plating, the first gold layer is attached to the nickel-tungsten layer by immersion plating, and the platinum layer is attached to the first gold layer by brush plating.

[0035] In one embodiment, the conductive layer in the charging device further includes a second gold layer disposed on the first gold layer, and at least one anti-electrolysis layer is disposed between the first gold layer and the second gold layer, and at least one anti-electrolysis layer is disposed on the second gold layer.

[0036] In one embodiment, the anti-electrolysis layer in the charging device includes a palladium layer and a platinum layer, wherein the palladium layer is disposed on the first gold layer, the second gold layer is disposed on the palladium layer, and the platinum layer is disposed on the second gold layer.

[0037] In one embodiment, in the charging device, a palladium layer is attached to a first gold layer by brush plating, a second gold layer is attached to the palladium layer by immersion plating, and a platinum layer is attached to the second gold layer by brush plating.

[0038] In one embodiment, the conductive layer in the charging device further includes a second gold layer disposed on the first gold layer, at least one anti-electrolysis layer disposed between the phosphor bronze layer and the first gold layer, at least one anti-electrolysis layer disposed between the first gold layer and the second gold layer, and at least one anti-electrolysis layer disposed on the second gold layer.

[0039] In one embodiment, the anti-electrolysis layer in the charging device includes a nickel-tungsten layer, a palladium layer, and a platinum layer, wherein the nickel-tungsten layer is disposed on a phosphor bronze layer, a first gold layer is disposed on the nickel-tungsten layer, a palladium layer is disposed on the first gold layer, a second gold layer is disposed on the palladium layer, and a platinum layer is disposed on the second gold layer.

[0040] In one embodiment, in the charging device, a nickel-tungsten layer is attached to a phosphor bronze layer by immersion plating, a first gold layer is attached to the nickel-tungsten layer by immersion plating, a palladium layer is attached to the first gold layer by brush plating, a second gold layer is attached to the palladium layer by immersion plating, and a platinum layer is attached to the second gold layer by brush plating.

[0041] In one embodiment, in the charging device, the outermost layer of the anti-electrolysis layer protrudes from the main structure; or...

[0042] The outer surface of the anti-electrolysis layer is exposed to the external environment.

[0043] In one embodiment, the main structure has two opposite contact surfaces, each contact surface being provided with a conductive contact piece; preferably, the conductive contact pieces are arranged regularly on each contact surface.

[0044] In one embodiment, the charging device has two opposing contact surfaces, and each contact surface is provided with a conductive contact piece; preferably, the conductive contact pieces are arranged regularly on each contact surface; the base layer has two opposing conductive connection surfaces, and the conductive contact piece is provided with a conductive layer on each conductive connection surface, wherein the first gold layer of one conductive layer is provided on the main structure, and the first gold layer of the other conductive layer is provided with at least one anti-electrolysis layer.

[0045] In one embodiment, in the charging device, any conductive connection surface is parallel to any contact surface.

[0046] In one embodiment, the charging device has two conductive connection surfaces, namely a first conductive connection surface and a second conductive connection surface; a conductive layer disposed on the first conductive connection surface is a first conductive layer, which further includes a second gold layer; the anti-electrolysis layer includes a nickel-tungsten layer, a palladium layer, and a platinum layer; wherein the nickel-tungsten layer is disposed on a phosphor bronze layer, the first gold layer is disposed on the nickel-tungsten layer, the palladium layer is disposed on the first gold layer, the second gold layer is disposed on the palladium layer, and the platinum layer is disposed on the second gold layer; the conductive layer disposed on the second conductive connection surface is a second conductive layer, and the first gold layer on the second conductive layer is welded to the main structure, or the second conductive layer further includes a second gold layer disposed on the first gold layer and the second gold layer is welded to the main structure, or the anti-electrolysis layer includes a nickel-tungsten layer disposed between the phosphor bronze layer and the first gold layer.

[0047] In one embodiment, in the charging device, for the first conductive layer and the anti-electrolysis layer disposed on the first conductive connection surface, the phosphor bronze layer is attached to the base layer by dip-plating, the nickel tungsten layer is attached to the phosphor bronze layer by dip-plating, the first gold layer is attached to the nickel tungsten layer by dip-plating, the palladium layer is attached to the first gold layer by brush plating, the second gold layer is attached to the palladium layer by dip-plating, and the platinum layer is attached to the second gold layer by brush plating; or...

[0048] For the second conductive layer and the anti-electrolysis layer disposed on the second conductive connection surface, the phosphor bronze layer is attached to the base layer by dip-plating, the nickel tungsten layer is attached to the phosphor bronze layer by dip-plating, the first gold layer is attached to the nickel tungsten layer by dip-plating, and the second gold layer is attached to the first gold layer by dip-plating; or,

[0049] The base layer has a groove at the second conductive connection surface, and the second conductive layer has an opening corresponding to the groove.

[0050] In one embodiment, the charging device has a phosphor bronze layer with a thickness of 30 micrometers ± 4.5 micrometers, a nickel tungsten layer with a thickness of 50 micrometers ± 7.5 micrometers, a first gold layer with a thickness of 1 micrometer ± 0.15 micrometers, a palladium layer with a thickness greater than or equal to 3 micrometers ± 0.45 micrometers, a second gold layer with a thickness of 1 micrometer ± 0.15 micrometers, and a platinum layer with a thickness of 20 micrometers ± 3 micrometers.

[0051] In one embodiment, the charging device has a phosphor bronze layer with a thickness of about 30 micrometers, a nickel tungsten layer with a thickness of about 50 micrometers, a first gold layer with a thickness of about 1 micrometer, a palladium layer with a thickness of about 3 micrometers, a second gold layer with a thickness of about 1 micrometer, and a platinum layer with a thickness of about 20 micrometers.

[0052] In one embodiment, the charging device uses a Lightning connector as the connection terminal.

[0053] In one embodiment, the charging device further includes a control board in the connection terminal, which is connected to the conductive contact via the main body structure. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.

[0055] Figure 1 is a structural schematic diagram of an embodiment of the charging device described in this application.

[0056] Figure 2 is a schematic diagram of another direction of the embodiment shown in Figure 1.

[0057] Figure 3 is a structural schematic diagram of an embodiment of the connection terminal described in this application.

[0058] Figure 4 is a schematic diagram of another direction of the embodiment shown in Figure 3.

[0059] Figure 5 is a schematic diagram of another direction of the embodiment shown in Figure 3.

[0060] Figure 6 is a structural schematic diagram of the first embodiment of the conductive contact described in this application.

[0061] Figure 7 is a structural schematic diagram of the second embodiment of the conductive contact described in this application.

[0062] Figure 8 is a structural exploded view of the embodiment shown in Figure 7.

[0063] Figure 9 is a schematic diagram of another direction of the embodiment shown in Figure 8.

[0064] Figure 10 is a structural schematic diagram of the third embodiment of the conductive contact described in this application.

[0065] Figure 11 is a structural exploded view of the embodiment shown in Figure 10.

[0066] Figure 12 is a schematic diagram of another direction of the embodiment shown in Figure 11.

[0067] Figure 13 is an exploded view of the structure of the fourth embodiment of the conductive contact described in this application.

[0068] Figure 14 is a schematic diagram of another direction of the embodiment shown in Figure 13.

[0069] Figure 15 is a schematic diagram of another direction of the embodiment shown in Figure 13.

[0070] Reference numerals: 100, connecting terminal; 110, main structure; 111, contact surface; 120, conductive contact piece; 121, base layer; 122, protective layer; 123, phosphor bronze layer; 124, nickel tungsten layer; 125, first gold layer; 126, second gold layer; 127, palladium layer; 128, platinum layer; 129, conductive connection surface; 131, first conductive connection surface; 132, second conductive connection surface; 133, first conductive layer; 134, second conductive layer; 135, slot; 136, opening; 137, anti-electrolysis layer; 140, control board; 150, support component; 160, protective component; 200, power supply end; 300, wire; 400, charging device. Detailed Implementation

[0071] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0072] It should be noted that when a component is referred to as being "set on" another component, it can be directly on the other component or there may be an intervening component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "upper," "lower," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0073] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0074] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0075] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0076] This application discloses a connection terminal and a charging device, which includes some or all of the technical features of the following embodiments; that is, the connection terminal and the charging device include some or all of the following structures. In one embodiment of this application, a connection terminal includes a main structure and a conductive contact; the conductive contact includes a base layer and a conductive layer and an anti-electrolysis layer disposed on the base layer, the conductive layer including a phosphor bronze layer and a first gold layer; wherein, the base layer is disposed on the main structure, the phosphor bronze layer is disposed on the base layer, the first gold layer is disposed on the phosphor bronze layer, and at least one anti-electrolysis layer is disposed on the first gold layer. The above-mentioned connection terminal, by protecting the base layer and the conductive layer through the anti-electrolysis layer, provides a more stable and reliable conductive contact and conductive layer design compared with traditional connectors. On the other hand, the design of the phosphor bronze layer enhances the adhesion of the conductive layer to the base layer. Furthermore, it reliably improves the anti-electrolysis of the conductive layer and the oxidation resistance of the base layer made of copper or copper alloy materials, preventing the conductive contact from turning black and ensuring the electrical contact effect. It is especially suitable for traditional Lightning connectors, and in particular solves the problem that the fourth pin from the left in traditional Lightning connectors is relatively easy to oxidize and turn black due to the relatively large current. The connection terminals and charging device will be described in detail below with reference to Figures 1 to 15.

[0077] In one embodiment, a charging device 400, as shown in FIG1, includes a power supply terminal 200, a wire 300, and a connection terminal 100; the power supply terminal 200 is connected to the connection terminal 100 via the wire 300. Exemplarily, the power supply terminal 200 is electrically connected to the connection terminal 100 via the wire 300, and the connection terminal 100 can serve as the charging terminal of the charging device 400. In one embodiment, the connection terminal 100 can be any of the connection terminal 100 described herein. It is understood that the charging device 400 employs the connection terminal 100 and therefore also possesses the beneficial technical effects added by the connection terminal 100, which will not be elaborated upon here.

[0078] Traditional connectors use copper or copper alloys as the base layer for the pins, with only a layer of gold on the surface. This can lead to the gold layer easily detaching from the base layer over time and with repeated use, exposing the underlying copper layer to the air and causing it to oxidize and turn black. For example, after more than two years of use or more than 300 insertions and removals, the connector surface is prone to oxidation and blackening, affecting electrical contact performance, especially noticeable with Lightning connector pins. In contrast, referring to Figures 2 and 6, in one embodiment, the connector terminal 100 includes a main structure 110 and a conductive contact 120. The conductive contact 120 includes a base layer 121 and a conductive layer 122 and an anti-electrolysis layer 137 disposed on the base layer 121. The base layer 121 is disposed on the main structure 110. The wire 300 is connected to the main structure 110, and the power supply terminal 200 is sequentially connected to the conductive contact 120 via the wire 300, the main structure 110, and the conductive contact 120. In this embodiment, the outermost layer of the anti-electrolysis layer 137 protrudes from the main structure 110. Those skilled in the art will understand that the conductive contacts 120 on the connection terminal 100 can be interconnected through the base layer 121 of the conductive contacts 120, or they can be isolated from each other through the main structure 110 instead of being connected. The design of the anti-electrolysis layer 137 provides protection for the conductive layer 122 and the base layer 121. The base layer 121 is typically made of copper or a copper alloy, and the conductive layer 122 is typically made of gold with a purity of less than 100%, i.e., a gold alloy. Therefore, the addition of the anti-electrolysis layer 137 improves the resistance to electrolysis and oxidation, thereby greatly improving the problem of traditional conductive contacts easily turning black, and ensuring the electrical contact effect of the conductive contacts 120 in each embodiment.

[0079] Exemplarily, the power supply terminal 200 is sequentially electrically connected to the conductive contact 120 via the wire 300, the main body structure 110, and the conductive contact 120 and the anti-electrolysis layer 137 via the wire 300, the main body structure 110, and the main body structure 110. Exemplarily, the power supply terminal 200 is sequentially connected to the conductive layer 122 and the anti-electrolysis layer 137 via the wire 300, the main body structure 110, and the base layer 121, and the power supply terminal 200 is sequentially electrically connected to the conductive layer 122 and the anti-electrolysis layer 137 via the wire 300, the lines in the main body structure 110, and the base layer 121. Other embodiments follow the same principle and will not be described in detail. This structural design helps to ensure the power transmission performance of the connection terminal 100.

[0080] In one embodiment, a connection terminal 100, as shown in FIG. 3, includes a main structure 110 and conductive contacts 120. The conductive contacts 120 are disposed on the main structure 110 and exposed to the external environment. In this embodiment, the conductive contacts 120 are regularly arranged on the main structure 110 and exposed to the external environment. The conductive contacts 120 being exposed to the external environment means that the connection terminal 100 can contact external ports or connectors through the conductive contacts 120; that is, the conductive contacts 120 can be contacted relative to the outside world to achieve a conductive connection. In specific applications, the conductive contacts 120 can be fully exposed to the external environment, partially exposed, or only the outermost layer exposed. For example, as shown in FIG. 3, in this embodiment, eight conductive contacts 120 are regularly arranged in a row; in one embodiment, the connection terminal 100 is a Lightning connector. In other embodiments, the number of conductive contacts 120 can vary, and the arrangement can also be different. This structural design allows for flexible design of the connection terminal 100 according to product requirements.

[0081] In one embodiment, a conductive contact 120 at a predetermined position of the connection terminal 100 is 3% to 11% wider than the other conductive contacts 120. In another embodiment, the fourth conductive contact 120 from the left of the connection terminal 100 is 3% to 11% wider than the other conductive contacts 120. This structural design is particularly suitable for Lightning connectors. In conventional Lightning connectors, the fourth PIN from the left, i.e., the fourth conductive contact 120 from the left, is relatively prone to oxidation and blackening due to the relatively large current. The embodiment with the aforementioned relatively widened design helps to improve the load-bearing capacity of the conductive contact 120 at this predetermined position and has better heat dissipation. While improving oxidation resistance, it further enhances the effect of preventing blackening.

[0082] Referring to Figures 4 and 5, in this embodiment, the main structure 110 has two opposing contact surfaces 111, and each contact surface 111 is provided with a conductive contact piece 120. In this embodiment, the conductive contact pieces 120 are arranged regularly on each contact surface 111, that is, each contact surface 111 is provided with at least two regularly arranged conductive contact pieces 120. In one embodiment, the main structure 110 has two opposing contact surfaces 111, and each contact surface 111 is provided with a conductive contact piece 120. In this embodiment, the conductive contact pieces 120 are arranged regularly on each contact surface 111, that is, the conductive contact pieces 120 are exposed to the external environment on both contact surfaces 111. In one embodiment, the outer surface of the anti-electrolysis layer 137 of the conductive contact piece 120 is exposed to the external environment. In one embodiment, the base layer 121 of the conductive contact piece 120 is welded to the main structure 110, or referring to Figure 7, the conductive contact piece 120 has two second gold layers 126, one of which is welded to the main structure 110. In other embodiments, the main structure 110 may also have only one contact surface 111, which can be flexibly set according to actual needs.

[0083] Referring again to Figures 4 and 5, in one embodiment, the connection terminal 100 further includes a control board 140, which is connected to the conductive contact 120 via the main structure 110. Exemplarily, in this embodiment, the connection terminal 100 also includes the control board 140 and a protective member 160. The protective member 160 partially surrounds the main structure 110 and exposes the connection terminal 100, or may expose a portion of the main structure 110. The control board 140 is connected to the main structure 110 and is connected to the connection terminal 100 via the main structure 110. It is understood that when the number of connection terminals 100 exceeds one, the control board 140 is connected to each connection terminal 100 respectively, including but not limited to direct and indirect conductive connections. In this embodiment, the connection terminal 100 also includes a support member 150, on which the control board 140 is disposed. The support member 150 provides support and also protects the control board 140. This structural design facilitates the provision of connection terminals 100 with various structural designs.

[0084] In one embodiment, the conductive contact 120, as shown in FIG. 6, includes a base layer 121, a conductive layer 122, and an anti-electrolysis layer 137. Both the conductive layer 122 and the anti-electrolysis layer 137 are disposed on the base layer 121. In this embodiment, the conductive layer 122 includes a phosphor bronze layer 123 and a first gold layer 125. The base layer 121 is disposed on the main structure 110, the phosphor bronze layer 123 is disposed on the base layer 121, the first gold layer 125 is disposed on the phosphor bronze layer 123, and at least one anti-electrolysis layer 137 is disposed on the first gold layer 125. Alternatively, the base layer 121, the phosphor bronze layer 123, and the first gold layer 137 can be understood as... A gold layer 125 and an anti-electrolysis layer 137 may be fully or partially exposed outside the main structure 110, but at least one surface of the anti-electrolysis layer 137 facing away from the first gold layer 125 must be exposed outside the main structure 110, i.e., exposed to the external environment. In this embodiment, the anti-electrolysis layer 137 serves as the outermost layer of the conductive layer 122. The outer surface of the anti-electrolysis layer 137 is exposed to the external environment, allowing the connection terminal 100 to make conductive contact with other structural components through the anti-electrolysis layer 137. These other structural components include, but are not limited to, external ports or connectors. The design of the phosphor bronze layer 123 enhances the structural adhesion strength between the conductive layer and the base layer made of copper or copper alloy, thus strengthening the adhesion of the conductive layer to the base layer.

[0085] In one embodiment, at least one anti-electrolysis layer 137 is disposed between the phosphor bronze layer 123 and the first gold layer 125. In one embodiment, the conductive contact 120 is as shown in FIG. 7 or FIG. 10, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124 and a platinum layer 128. The nickel-tungsten layer 124 is disposed on the phosphor bronze layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, and the platinum layer 128 is disposed on the first gold layer 125.

[0086] In one embodiment, the conductive contact 120 is shown in FIG7. The conductive contact 120 or its conductive layer 122 further includes a second gold layer 126, which is disposed on the first gold layer 125. In this embodiment, the conductive layer 122 further includes a second gold layer 126, which is disposed on the first gold layer 125. At least one anti-electrolysis layer 137 is disposed between the first gold layer 125 and the second gold layer 126, and at least one anti-electrolysis layer 137 is disposed on the second gold layer 126. In one embodiment, as shown in FIG7, the conductive layer 122 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium layer 127, and a platinum layer 128, wherein the nickel-tungsten layer 124 is disposed on the phosphor bronze layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium layer 127, and the platinum layer 128 is disposed on the second gold layer 126; in other embodiments, the conductive layer 122 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a palladium layer 127 and a platinum layer 128, wherein the palladium layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium layer 127, and the platinum layer 128 is disposed on the second gold layer 126. In this embodiment, the outer surface of the platinum layer 128, i.e., the side facing away from the second gold layer 126, is exposed to the external environment. In one embodiment, the platinum layer 128 protrudes from the main structure 110.

[0087] This structural design allows for the use of relatively thin gold layers. Compared to a single gold layer, both gold layers can be made very thin while still achieving the design goal of protecting the surface of the connector terminal 100. At the microscopic level, by setting two gold layers, the surface of the connector terminal 100 can be fully and seamlessly covered, ensuring that the inert metal, i.e., gold, can protect the substrate and enhance its oxidation resistance. In contrast, if only one gold layer is set, even if its thickness is the same as the total thickness of the first gold layer 125 and the second gold layer 126, gaps may still be left on the surface of the connector terminal 100 at the microscopic level due to manufacturing processes. In this case, it is necessary to thicken this entire gold layer, i.e., the double-layer design of the first gold layer 125 and the second gold layer 126, which helps to reduce the amount of gold used.

[0088] Furthermore, compared to traditional PIN pins, this embodiment proposes a composite layer structure. A composite conductive layer 122 is provided on at least one or both sides of the base layer 121. Through the cooperation of the conductive layer 122 with the phosphor bronze layer 123, nickel-tungsten layer 124, first gold layer 125, palladium layer 127, second gold layer 126, and platinum layer 128 in the anti-electrolysis layer 137, a more stable and reliable conductive contact 120 and its conductive layer 122 design are provided compared to traditional connectors. The design of the phosphor bronze layer 123 enhances the adhesion of the conductive layer 122 to the base layer 121. The nickel-tungsten layer 124, palladium layer 127, and platinum layer 128 further enhance the adhesion. The design of 28 ensures conductivity while improving electrolytic resistance. Through the stacking of the first gold layer 125, palladium layer 127, second gold layer 126, and platinum layer 128, the protection capability of the anti-electrolysis layer 137 for the conductive layer 122 and the base layer 121 is reliably improved. This enhances the electrolytic resistance of the conductive layer 122 and the oxidation resistance of the base layer 121, preventing the conductive contact 120 from turning black and ensuring the electrical contact effect of the conductive contact 120. It is especially suitable for traditional Lightning connectors, and in particular solves the problem that the fourth pin from the left in traditional Lightning connectors is relatively easy to oxidize and turn black due to the relatively large current.

[0089] In one embodiment, in the conductive contact 120, the phosphor bronze layer 123 is dip-plated onto the base layer 121, the nickel tungsten layer 124 is dip-plated onto the phosphor bronze layer 123, and the first gold layer 125 is dip-plated onto the nickel tungsten layer 124; in another embodiment, the second gold layer 126 is dip-plated onto the first gold layer 125. This embodiment illustrates the bonding relationship of each layer structure of the conductive layer 122, which can also be understood as the connection relationship of each layer structure; each layer structure includes, but is not limited to, the phosphor bronze layer 123, the nickel tungsten layer 124, the first gold layer 125, and the second gold layer 126. In other embodiments, other bonding relationships can be used for each layer structure to achieve a stable connection. This design simplifies the manufacturing process, and the conductive contact 120 and its conductive layer 122 of the connecting terminal 100 are stable and reliable. Stability tests show that it can be plugged in and out 9,000 to 10,000 times without surface blackening, making it particularly suitable for Lightning connectors and also applicable to other application scenarios requiring frequent plugging and unplugging of the connecting terminal 100.

[0090] In the embodiment shown in Figure 6, the conductive contact 120 is only disposed on one conductive connection surface 129 of the base layer 121. In one embodiment, as shown in Figure 7, the conductive contact 120 differs from the embodiment shown in Figure 6 in that the base layer 121 has two opposing conductive connection surfaces 129, and the conductive contact 120 is provided with a conductive layer 122 on each conductive connection surface 129. The first gold layer 125 of one conductive layer 122 is disposed on the main structure 110, and the first gold layer 125 of the other conductive layer 122 is provided with at least one anti-electrolysis layer 137. This structural design facilitates the provision of suitable connection terminals 100 according to the requirements of different connection terminals 100.

[0091] In one embodiment with contact surface 111, any conductive connection surface 129 is parallel to any contact surface 111; that is, both contact surfaces 111 are parallel, both conductive connection surfaces 129 are parallel, and any one conductive connection surface 129 is also parallel to any one contact surface 111. As shown in Figure 7, the two conductive connection surfaces 129 are parallel. In other embodiments, either two non-parallel conductive connection surfaces 129 or two non-parallel contact surfaces 111 can be used, as long as the product design requirements are met.

[0092] In one embodiment, as shown in Figures 7 and 8, the two conductive connection surfaces 129 are a first conductive connection surface 131 and a second conductive connection surface 132, respectively; it can also be understood that the conductive connection surface 129 includes the first conductive connection surface 131 and the second conductive connection surface 132. Furthermore, the conductive layer 122 disposed on the first conductive connection surface 131 is the first conductive layer 133. Similarly, the conductive layer 122 disposed on the second conductive connection surface 132 is the second conductive layer 134. Referring to Figure 9, the base layer 121 is disposed between the phosphor bronze layer 123 on the first conductive layer 133 and the phosphor bronze layer 123 on the second conductive layer 134. The first gold layer 125 on the second conductive layer 134 is welded to the main structure 110. Alternatively, in embodiments with a second gold layer 126, i.e., the second conductive layer 134 further includes a second gold layer 126 directly or indirectly disposed on the first gold layer 125, then the second gold layer 126 is welded to the main structure 110. This structural design facilitates the use of the first gold layer 125 or the second gold layer 126 to provide fluxing performance and improve the welding strength between the conductive contact 120 and the main structure 110.

[0093] In one embodiment, as shown in FIG10, the first conductive layer 133 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium layer 127, and a platinum layer 128. The nickel-tungsten layer 124 is disposed on the phosphor bronze layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium layer 127, and the platinum layer 128 is disposed on the second gold layer 126. The platinum layer 128 is exposed to the external environment; that is, the second gold layer 126 is indirectly exposed to the external environment through the platinum layer 128. It can be understood that in embodiments with the platinum layer 128, since the platinum layer 128 is disposed on the second gold layer 126, the second gold layer 126 is covered, and therefore the conductive contact 120 in the connection terminal 100 is exposed to the external environment through the platinum layer 128. This design, through the combination of nickel-tungsten layer 124, palladium layer 127, and platinum layer 128, enhances the electrolytic resistance of the conductive contact 120. Furthermore, the sandwich structure of nickel-tungsten layer 124, two gold layers with palladium layer 127 sandwiched in between, and the superimposed platinum layer 128, provides sufficient antioxidant protection and electrolytic resistance for the base layer 121 and the two gold layers. This prevents the PIN pin from turning black over long-term use, thus ensuring the electrical contact effect of the conductive contact 120. In trial production and testing, the lifespan of the conductive contact 120 can be extended by more than 10 times compared to the theoretical lifespan of traditional Lightning connector products.

[0094] The above embodiment was tested using common testing methods for the connection terminal 100, and the test results are described below.

[0095] Visual inspection: 100% of the connecting terminals are free from deformation, misaligned pins, white spots, and charring or blackening.

[0096] Insertion and removal test: After 10,000 insertion and removal cycles, the conductive contact 120 remained firm and did not turn black. In contrast, the gold fingers of a traditional Lightning connector begin to turn black after approximately 300 insertion and removal cycles; noticeable black spots appear on the gold fingers after 500 cycles; and poor electrical contact performance occurs on the gold fingers after 1,000 cycles.

[0097] Solder adhesion test: The solder pot was set to 245℃ without flux. The product was placed vertically into the solder pot for 3 to 5 seconds. The result showed that 95% of the connection terminals were soldered, which reflects that the product has a good soldering and fixing effect.

[0098] Salt spray test: The salt solution concentration is 5% ± 0.5%, the pH value of the salt solution is 6.5 to 7.2, the spray volume is 1.0 ml to 2.0 ml / hour / 80 square centimeters, the ambient air temperature is 60℃ ± 2℃, the salt water temperature is 35℃ ± 2℃, and the connection terminal 100 shows no obvious oxidation or rust after 24 hours.

[0099] Sweat Test: The 5V output was immersed in artificial sweat for 3 minutes under no-load conditions. The conductive contact 120 of the connector terminal 100 remained unchanged. In contrast, the gold fingers on the surface of a traditional Lightning connector began to turn black after approximately 8 to 10 seconds. The sweat test, as an electrolysis test, is a key parameter for the electrolysis resistance of the conductive contact 120. During use, due to prolonged plugging, the pins, especially the positive terminal, are usually charged. If this state is followed by contact with sweaty skin, an electrolysis effect can easily occur. This embodiment uses a nickel-tungsten layer 124 combined with a palladium layer 127 and a platinum layer 128 to form a three-layer electrolysis-resistant layer 137. This ensures sufficient and complete surface coverage at the microscopic level, effectively improving the electrolysis resistance of the connector terminal 100. Furthermore, the two gold layers effectively cover the pin surface, enhancing the oxidation resistance of the base layer 121.

[0100] Bending test: Bend the connector 90 degrees back and forth twice with needle-nose pliers. No plating peels off the connector 100.

[0101] As can be seen, compared with the traditional Lightning connector, the above embodiments of this application reliably improve the oxidation resistance of the conductive contact 120 of the connection terminal 100, prevent the conductive contact 120 from turning black, and ensure the electrical contact effect of the conductive contact 120. Therefore, the beneficial technical effects of longer service life and more insertion and removal cycles can be achieved.

[0102] In the embodiment shown in Figure 10, conductive layers 122 are provided on both sides of the base layer 121. One side is provided with conductive layer 122 and anti-electrolysis layer 137 for connecting the main structure 110, while the other side is provided with conductive layer 122 and anti-electrolysis layer 137 for connecting external connectors. Referring to Figure 6, conductive layer 122 and anti-electrolysis layer 137 can also be provided on only one side of the base layer 121.

[0103] Referring to Figures 11 and 12, in this embodiment, the base layer 121 has two opposing conductive connection surfaces 129. A conductive layer 122 is disposed on each conductive connection surface 129 by the conductive contact 120. The conductive layer 122 disposed on the first conductive connection surface 131 is the first conductive layer 133, which also includes a second gold layer 126. The anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium layer 127, and a platinum layer 128. Specifically, the first conductive connection surface 131 is sequentially provided with a phosphor bronze layer 123, a nickel-tungsten layer 124, a first gold layer 125, a palladium layer 127, a second gold layer 126, and a platinum layer 128. The conductive layer 122 disposed on the second conductive connection surface 132 is the second conductive layer 134. The first gold layer 125 on the second conductive layer 134 is welded to the main structure 1. 10, or the second conductive layer 134 further includes a second gold layer 126 disposed on the first gold layer 125, and the second gold layer 126 is welded to the main structure 110, or the anti-electrolysis layer 137 includes a nickel-tungsten layer 124 disposed between the phosphor bronze layer 123 and the first gold layer 125; in this embodiment, the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, which is disposed between the phosphor bronze layer 123 and the first gold layer 125. This positional relationship can also be understood as the nickel-tungsten layer 124 being disposed on the first gold layer 125, that is, the second conductive connection surface 132 is sequentially provided with a phosphor bronze layer 123, a nickel-tungsten layer 124, a first gold layer 125 and a second gold layer 126, and the base layer 121 is disposed between the phosphor bronze layer 123 on the first conductive layer 133 and the phosphor bronze layer 123 on the second conductive layer 134. Other embodiments are similar and will not be described in detail. In this structural design, the phosphor bronze layer 123 is firmly attached to the base layer 121, and the nickel-tungsten layer 124 has good ductility and conductivity. Combined with two relatively thin gold layers, this not only reduces the amount of gold material used but also reliably improves the oxidation resistance of the conductive contact 120 of the connecting terminal 100, preventing blackening and thus ensuring effective electrical contact. The second gold layer 126 of the second conductive layer 134 is connected to the main structure 110, for example, by welding it to the main structure 110, thus eliminating the need for an external anti-electrolysis layer 137 for protection.

[0104] In one embodiment, for the layers disposed on the first conductive connection surface 131, the phosphor bronze layer 123 is dip-plated onto the base layer 121, the nickel tungsten layer 124 is dip-plated onto the phosphor bronze layer 123, the first gold layer 125 is dip-plated onto the nickel tungsten layer 124, the palladium layer 127 is brush-plated onto the first gold layer 125, the second gold layer 126 is dip-plated onto the palladium layer 127, and the platinum layer 128 is brush-plated onto the second gold layer 126. In another embodiment, for the layers disposed on the second conductive connection surface 132, the phosphor bronze layer 123 is dip-plated onto the base layer 121, the nickel tungsten layer 124 is dip-plated onto the phosphor bronze layer 123, the first gold layer 125 is dip-plated onto the nickel tungsten layer 124, and the second gold layer 126 is dip-plated onto the first gold layer 125. Those skilled in the art will understand that specific immersion plating or brush plating processes can be implemented using traditional techniques or with simple adjustments, and this application and its embodiments do not impose any limitations on this.

[0105] In one embodiment, the thickness of the phosphor bronze layer 123 is greater than or equal to 25.50 micrometers, the thickness of the nickel tungsten layer 124 is greater than or equal to 42.50 micrometers, and the thickness of the first gold layer 125 is greater than or equal to 0.85 micrometers; for an embodiment having a second gold layer 126, the thickness of the second gold layer 126 is, for example, greater than or equal to 0.85 micrometers; for an embodiment having a palladium layer 127 and a platinum layer 128, the thickness of the palladium layer 127 is, for example, greater than or equal to 2.55 micrometers, and the thickness of the platinum layer 128 is greater than or equal to 17.00 micrometers. In one embodiment, the thickness of the phosphor bronze layer 123 is less than or equal to 34.50 micrometers, the thickness of the nickel-tungsten layer 124 is less than or equal to 57.50 micrometers, and the thickness of the first gold layer 125 is less than or equal to 1.15 micrometers. For an embodiment with a second gold layer 126, the thickness of the second gold layer 126 is, exemplarily, less than or equal to 1.15 micrometers. For an embodiment with a palladium layer 127 and a platinum layer 128, exemplarily, the thickness of the palladium layer 127 is less than or equal to 3.45 micrometers, and the thickness of the platinum layer 128 is less than or equal to 23.00 micrometers. In one embodiment, the thickness of the phosphor bronze layer 123 is 30 micrometers ± 4.5 micrometers, that is, the thickness of the phosphor bronze layer 123 is greater than or equal to 25.50 micrometers and less than or equal to 34.50 micrometers, i.e., the thickness of the phosphor bronze layer 123 is between 25.50 micrometers and 34.50 micrometers, and so on. Furthermore, the thickness of the nickel-tungsten layer 124 is 50 micrometers ± 7.5 micrometers, the thickness of the first gold layer 125 is 1 micrometer ± 0.15 micrometers, the thickness of the palladium layer 127 is greater than or equal to 3 micrometers ± 0.45 micrometers, the thickness of the second gold layer 126 is 1 micrometer ± 0.15 micrometers, and the thickness of the platinum layer 128 is 20 micrometers ± 3 micrometers. Other embodiments follow the same principle and will not be elaborated further. Exemplarily, in this embodiment, the connecting terminal 100 is a Lightning connector. Compared to traditional gold-plated PIN pins, this embodiment uses less gold material, and the conductive contact 120 has better stability and oxidation resistance.

[0106] In one embodiment, the thickness of the phosphor bronze layer 123 is approximately 30 micrometers, the thickness of the nickel-tungsten layer 124 is approximately 50 micrometers, and the thickness of the first gold layer 125 is approximately 1 micrometer. For an embodiment with a second gold layer 126, the thickness of the second gold layer 126 is, exemplarily, approximately 1 micrometer. For an embodiment with a palladium layer 127 and a platinum layer 128, exemplarily, the thickness of the palladium layer 127 is approximately 3 micrometers, and the thickness of the platinum layer 128 is approximately 20 micrometers. Exemplarily, in one embodiment, the thickness of the phosphor bronze layer 123 is 30 micrometers ± 3 micrometers, that is, the thickness of the phosphor bronze layer 123 is 27 micrometers to 33 micrometers, and so on. The thickness of the nickel-tungsten layer 124 is 50 micrometers ± 5 micrometers, the thickness of the first gold layer 125 is 1 micrometer ± 0.1 micrometers, the thickness of the palladium layer 127 is 3 micrometers ± 0.3 micrometers, the thickness of the second gold layer 126 is 1 micrometer ± 0.1 micrometers, and the thickness of the platinum layer 128 is 20 micrometers ± 2 micrometers. Alternatively, in one embodiment, the thickness of the phosphor bronze layer 123 is 30 μm ± 1.2 μm, the thickness of the nickel-tungsten layer 124 is 50 μm ± 2 μm, the thickness of the first gold layer 125 is 1 μm ± 0.04 μm, the thickness of the palladium layer 127 is 3 μm ± 0.12 μm, the thickness of the second gold layer 126 is 1 μm ± 0.04 μm, and the thickness of the platinum layer 128 is 20 μm ± 0.8 μm. In another embodiment, the thickness of the phosphor bronze layer 123 is 30 μm, the thickness of the nickel-tungsten layer 124 is 50 μm, the thickness of the first gold layer 125 is 1 μm, the thickness of the palladium layer 127 is 3 μm, the thickness of the second gold layer 126 is 1 μm, and the thickness of the platinum layer 128 is 20 μm. Other embodiments follow the same principle and will not be described in detail. In each embodiment, micrometer is the unit of length. Other preset length units can be used instead of micrometers if necessary. For example, the thickness of the first gold layer 125 and the second gold layer 126 is 1 preset length unit, while the thickness of the phosphor bronze layer 123 is 30 preset length units, the thickness of the nickel-tungsten layer 124 is 50 preset length units, the thickness of the palladium layer 127 is 3 preset length units, and the thickness of the platinum layer 128 is 20 preset length units. As an example, the preset length unit is micrometer, meaning 1 preset length unit equals 1 micrometer. In other embodiments, the preset length unit can be 2 micrometers, meaning 1 preset length unit equals 2 micrometers; or the preset length unit can be 0.5 micrometers, corresponding to 0.5 micrometers.

[0107] In one embodiment, for example, the upper surface of the base layer 121 is first dip-plated with a phosphor bronze layer 123 with a thickness of 30 micrometers or more; a nickel tungsten layer 124 with a thickness of 50 micrometers or more is dip-plated on the upper surface of the phosphor bronze layer 123; a first gold layer 125 with a thickness of 1 micrometer or more is dip-plated on the upper surface of the nickel tungsten layer 124; a palladium layer 127 with a thickness of 3 micrometers or more is brush-plated on the upper surface of the first gold layer 125; a second gold layer 126 with a thickness of 1 micrometer or more is dip-plated on the upper surface of the palladium layer 127; and a platinum layer 128 with a thickness of 20 micrometers or more is brush-plated on the upper surface of the second gold layer 126. Similarly, the lower surface of the base layer 121 is first dip-plated with a phosphor bronze layer 123, with a thickness of 30 micrometers or greater; a nickel tungsten layer 124, with a thickness of 50 micrometers or greater, is dip-plated on the lower surface of the phosphor bronze layer 123; a first gold layer 125, with a thickness of 1 micrometer or greater, is dip-plated on the lower surface of the nickel tungsten layer 124; and a second gold layer 126, with a thickness of 1 micrometer or greater, is dip-plated on the lower surface of the first gold layer 125. In one embodiment, the base layer 121 is made of copper or a copper alloy. Exemplarily, the material of the base layer 121 is pure copper or C2680, where C2680 is a ternary or higher copper alloy containing approximately 65% ​​to 68% copper and 30% to 33% zinc, and also contains small amounts of aluminum, manganese, iron, and other elements.

[0108] In one embodiment, as shown in Figures 13 and 14, the base layer 121 has a slot 135 at the second conductive connection surface 132. The conductive layer 122 disposed on the second conductive connection surface 132 is the second conductive layer 134, and the second conductive layer 134 has an opening 136 corresponding to the slot 135. Referring to Figure 15, the phosphor bronze layer 123, nickel tungsten layer 124, first gold layer 125, and second gold layer 126 on the second conductive layer 134 have openings 136 corresponding to the slot 135. This design is beneficial for saving materials while ensuring electrical contact effect, and it also helps to reduce the weight of the connection terminal 100 and its conductive contact 120, which is especially suitable for connection terminals 100 that use a large number of conductive contact 120.

[0109] In other embodiments, the charging device employs the connection terminal 100 of any embodiment. In one embodiment, a charging device 400 includes a power supply terminal 200, a wire 300, and a connection terminal 100 of any embodiment. The power supply terminal 200 is sequentially connected to the conductive contact 120 of the connection terminal 100 via the wire 300, the main body structure 110 of the connection terminal 100, and the connection terminal 100.

[0110] In one embodiment, a charging device 400 includes a power supply terminal 200, a wire 300, and a connection terminal 100. The connection terminal 100 includes a main structure 110 and a conductive contact 120. The conductive contact 120 includes a base layer 121 and a conductive layer 122 and an anti-electrolysis layer 137 disposed on the base layer 121. The conductive layer 122 includes a phosphor bronze layer 123 and a first gold layer 125. The base layer 121 is disposed on the main structure 110, the phosphor bronze layer 123 is disposed on the base layer 121, the first gold layer 125 is disposed on the phosphor bronze layer 123, and at least one anti-electrolysis layer 137 is disposed on the first gold layer 125. The wire 300 is connected to the main structure 110, and the power supply terminal 200 is sequentially connected to the conductive contact 120 via the wire 300, the main structure 110, and the connection terminal 120. In this embodiment, the base layer 121 is regularly arranged on the main structure 110.

[0111] For example, in one embodiment, in the charging device 400, the phosphor bronze layer 123 is attached to the base layer 121 by dip plating, the first gold layer 125 is attached to the phosphor bronze layer 123 by dip plating, and the anti-electrolysis layer 137 is attached to the first gold layer 125 by brush plating.

[0112] For example, in one embodiment, in the charging device 400, at least one anti-electrolysis layer 137 is disposed between the phosphor bronze layer 123 and the first gold layer 125.

[0113] For example, in one embodiment, the anti-electrolysis layer 137 in the charging device 400 includes a nickel-tungsten layer 124 and a platinum layer 128. The nickel-tungsten layer 124 is disposed on the phosphor bronze layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, and the platinum layer 128 is disposed on the first gold layer 125.

[0114] For example, in one embodiment, in the charging device 400, the nickel-tungsten layer 124 is attached to the phosphor bronze layer 123 by immersion plating, the first gold layer 125 is attached to the nickel-tungsten layer 124 by immersion plating, and the platinum layer 128 is attached to the first gold layer 125 by brush plating.

[0115] For example, in one embodiment, the conductive contact 120 in the charging device 400 further includes a second gold layer 126 disposed on the first gold layer 125, and at least one anti-electrolysis layer 137 disposed between the first gold layer 125 and the second gold layer 126, and at least one anti-electrolysis layer 137 disposed on the second gold layer 126.

[0116] For example, in one embodiment, the anti-electrolysis layer 137 in the charging device 400 includes a palladium layer 127 and a platinum layer 128, wherein the palladium layer 127 is disposed on a first gold layer 125, a second gold layer 126 is disposed on the palladium layer 127, and the platinum layer 128 is disposed on the second gold layer 126.

[0117] For example, in one embodiment, the palladium layer 127 is brush-plated onto the first gold layer 125, the second gold layer 126 is dip-plated onto the palladium layer 127, and the platinum layer 128 is brush-plated onto the second gold layer 126.

[0118] For example, in one embodiment, the conductive layer 122 of the charging device 400 further includes a second gold layer 126 disposed on the first gold layer 125, at least one anti-electrolysis layer 137 disposed between the phosphor bronze layer 123 and the first gold layer 125, at least one anti-electrolysis layer 137 disposed between the first gold layer 125 and the second gold layer 126, and at least one anti-electrolysis layer 137 disposed on the second gold layer 126.

[0119] For example, in one embodiment, the anti-electrolysis layer 137 in the charging device 400 includes a nickel-tungsten layer 124, a palladium layer 127, and a platinum layer 128, wherein the nickel-tungsten layer 124 is disposed on the phosphor bronze layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium layer 127, and the platinum layer 128 is disposed on the second gold layer 126.

[0120] In one embodiment, for example, in the charging device 400, a nickel-tungsten layer 124 is attached to a phosphor bronze layer 123 by immersion plating, a first gold layer 125 is attached to the nickel-tungsten layer 124 by immersion plating, a palladium layer 127 is attached to the first gold layer 125 by brush plating, a second gold layer 126 is attached to the palladium layer 127 by immersion plating, and a platinum layer 128 is attached to the second gold layer 126 by brush plating.

[0121] For example, in one embodiment, the outermost layer of the anti-electrolysis layer 137 in the charging device 400 protrudes from the main body structure 110.

[0122] For example, in one embodiment, the outer surface of the anti-electrolysis layer 137 in the charging device 400 is exposed to the external environment.

[0123] For example, in one embodiment, the main structure 110 of the charging device 400 has two opposite contact surfaces 111, each contact surface 111 being provided with a conductive contact 120.

[0124] For example, in one embodiment, the main structure 110 of the charging device 400 has two opposite contact surfaces 111, and each contact surface 111 is provided with conductive contacts 120 arranged in a regular manner.

[0125] For example, in one embodiment, in the charging device 400, the main structure 110 has two opposite contact surfaces 111, and each contact surface 111 is provided with a conductive contact 120; the base layer 121 has two opposite conductive connection surfaces 129, and the conductive contact 120 is provided with a conductive layer 122 on each conductive connection surface 129, wherein a first gold layer 125 of one conductive layer 122 is provided on the main structure 110, and at least one anti-electrolysis layer 137 is provided on the first gold layer 125 of the other conductive layer 122.

[0126] For example, in one embodiment, in the charging device 400, the main structure 110 has two opposite contact surfaces 111, and conductive contacts 120 are regularly arranged on each contact surface 111; the base layer 121 has two opposite conductive connection surfaces 129, and a conductive layer 122 is provided on each conductive connection surface 129 of the conductive contacts 120, wherein a first gold layer 125 of one conductive layer 122 is provided on the main structure 110, and at least one anti-electrolysis layer 137 is provided on the first gold layer 125 of the other conductive layer 122.

[0127] For example, in one embodiment, in the charging device 400, any conductive connection surface 129 is parallel to any contact surface 111.

[0128] For example, in one embodiment, in the charging device 400, the two conductive connection surfaces 129 are a first conductive connection surface 131 and a second conductive connection surface 132, respectively; the conductive layer 122 disposed on the first conductive connection surface 131 is a first conductive layer 133, the first conductive layer 133 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium layer 127, and a platinum layer 128; wherein, the nickel-tungsten layer 124 is disposed on the phosphor bronze layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, and the palladium layer 127 is disposed on the first gold layer 125. The second gold layer 126 is disposed on the palladium layer 127, and the platinum layer 128 is disposed on the second gold layer 126; the conductive layer 122 disposed on the second conductive connection surface 132 is the second conductive layer 134, and the first gold layer 125 on the second conductive layer 134 is welded to the main structure 110, or the second conductive layer 134 further includes the second gold layer 126 disposed on the first gold layer 125, and the second gold layer 126 is welded to the main structure 110, or the anti-electrolysis layer 137 includes the nickel-tungsten layer 124 disposed between the phosphor bronze layer 123 and the first gold layer 125.

[0129] For example, in one embodiment, in the charging device 400, for the first conductive layer 133 and the anti-electrolysis layer 137 disposed on the first conductive connection surface 131, the phosphor bronze layer 123 is connected to the base layer 121 by dip plating, the nickel tungsten layer 124 is connected to the phosphor bronze layer 123 by dip plating, the first gold layer 125 is connected to the nickel tungsten layer 124 by dip plating, the palladium layer 127 is connected to the first gold layer 125 by brush plating, the second gold layer 126 is connected to the palladium layer 127 by dip plating, and the platinum layer 128 is connected to the second gold layer 126 by brush plating.

[0130] For example, in one embodiment, in the charging device 400, for the second conductive layer 134 and the anti-electrolysis layer 137 disposed on the second conductive connection surface 132, the phosphor bronze layer 123 is connected to the base layer 121 by dip-plating, the nickel tungsten layer 124 is connected to the phosphor bronze layer 123 by dip-plating, the first gold layer 125 is connected to the nickel tungsten layer 124 by dip-plating, and the second gold layer 126 is connected to the first gold layer 125 by dip-plating.

[0131] For example, in one embodiment, in the charging device 400, the thickness of the phosphor bronze layer 123 is 30 micrometers ± 4.5 micrometers, the thickness of the nickel tungsten layer 124 is 50 micrometers ± 7.5 micrometers, the thickness of the first gold layer 125 is 1 micrometer ± 0.15 micrometers, the thickness of the palladium layer 127 is greater than or equal to 3 micrometers ± 0.45 micrometers, the thickness of the second gold layer 126 is 1 micrometer ± 0.15 micrometers, and the thickness of the platinum layer 128 is 20 micrometers ± 3 micrometers.

[0132] Exemplarily, in one embodiment, in the charging device 400, the thickness of the phosphor bronze layer 123 is approximately 30 micrometers, the thickness of the nickel tungsten layer 124 is approximately 50 micrometers, the thickness of the first gold layer 125 is approximately 1 micrometer, the thickness of the palladium layer 127 is approximately 3 micrometers, the thickness of the second gold layer 126 is approximately 1 micrometer, and the thickness of the platinum layer 128 is approximately 20 micrometers; or, the connection terminal is a Lightning connector. Exemplarily, in one embodiment, in the charging device 400, the thickness of the phosphor bronze layer 123 is 30 micrometers, the thickness of the nickel tungsten layer 124 is 50 micrometers, the thickness of the first gold layer 125 is 1 micrometer, the thickness of the palladium layer 127 is 3 micrometers, the thickness of the second gold layer 126 is 1 micrometer, the thickness of the platinum layer 128 is 20 micrometers, and the connection terminal 100 is a Lightning connector.

[0133] For example, in one embodiment, the base layer 121 has a slot 135 at the second conductive connection surface 132, and the second conductive layer 134 has an opening 136 corresponding to the slot 135.

[0134] For example, in one embodiment, the connection terminal 100 in the charging device 400 is a Lightning connector.

[0135] For example, in one embodiment, the connection terminal 100 of the charging device 400 further includes a control board 140, which is connected to the conductive contact 120 via the main body structure 110.

[0136] It should be noted that other embodiments of this application also include connection terminals and charging devices formed by combining the technical features of the above embodiments.

[0137] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. The embodiments described above only illustrate several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A connection terminal (100), wherein The main body structure (110) and the conductive contact patch (120) are provided. The conductive contact patch (120) comprises a base layer (121), a conductive layer (122) and an anti-electrolytic layer (137), wherein the conductive layer (122) comprises a phosphor copper layer (123) and a first gold layer (125). The base layer (121) is arranged on the main body structure (110), the phosphor copper layer (123) is arranged on the base layer (121), the first gold layer (125) is arranged on the phosphor copper layer (123), and at least one anti-electrolytic layer (137) is arranged on the first gold layer (125).

2. The connection terminal (100) according to claim 1, wherein The phosphor copper layer (123) is connected to the base layer (121) by immersion plating, the first gold layer (125) is connected to the phosphor copper layer (123) by immersion plating, and the anti-electrolytic layer (137) is connected to the first gold layer (125) by brush plating; or, At least one anti-electrolytic layer (137) is arranged between the phosphor copper layer (123) and the first gold layer (125); preferably, the anti-electrolytic layer (137) comprises a nickel tungsten layer (124) and a platinum gold layer (128), the nickel tungsten layer (124) is arranged on the phosphor copper layer (123), the first gold layer (125) is arranged on the nickel tungsten layer (124), and the platinum gold layer (128) is arranged on the first gold layer (125); preferably, the nickel tungsten layer (124) is connected to the phosphor copper layer (123) by immersion plating, the first gold layer (125) is connected to the nickel tungsten layer (124) by immersion plating, and the platinum gold layer (128) is connected to the first gold layer (125) by brush plating; or, The conductive layer (122) further comprises a second gold layer (126), the second gold layer (126) is arranged on the first gold layer (125), at least one anti-electrolytic layer (137) is arranged between the first gold layer (125) and the second gold layer (126), and at least one anti-electrolytic layer (137) is arranged on the second gold layer (126); preferably, the anti-electrolytic layer (137) comprises a palladium gold layer (127) and a platinum gold layer (128), wherein the palladium gold layer (127) is arranged on the first gold layer (125), the second gold layer (126) is arranged on the palladium gold layer (127), and the platinum gold layer (128) is arranged on the second gold layer (126); preferably, the palladium gold layer (127) is connected to the first gold layer (125) by brush plating, the second gold layer (126) is connected to the palladium gold layer (127) by immersion plating, and the platinum gold layer (128) is connected to the second gold layer (126) by brush plating; or, The conductive layer (122) further comprises a second gold layer (126) disposed on the first gold layer (125), at least one of the anti-electrolytic layers (137) is disposed between the phosphor copper layer (123) and the first gold layer (125), at least one of the anti-electrolytic layers (137) is disposed between the first gold layer (125) and the second gold layer (126), and at least one of the anti-electrolytic layers (137) is disposed on the second gold layer (126); preferably, the anti-electrolytic layer (137) comprises a nickel-tungsten layer (124), a palladium-gold layer (127) and a platinum-gold layer (128), wherein the nickel-tungsten layer (124) is disposed on the phosphor copper layer (123), the first gold layer (125) is disposed on the nickel-tungsten layer (124), the palladium-gold layer (127) is disposed on the first gold layer (125), the second gold layer (126) is disposed on the palladium-gold layer (127), and the platinum-gold layer (128) is disposed on the second gold layer (126); preferably, the nickel-tungsten layer (124) is connected to the phosphor copper layer (123) by immersion plating, the first gold layer (125) is connected to the nickel-tungsten layer (124) by immersion plating, the palladium-gold layer (127) is connected to the first gold layer (125) by brush plating, the second gold layer (126) is connected to the palladium-gold layer (127) by immersion plating, and the platinum-gold layer (128) is connected to the second gold layer (126) by brush plating; or, The outermost layer of the anti-electrolytic layer (137) protrudes from the main body structure (110); or, The outer surface of the anti-electrolytic layer (137) is exposed to the external environment; or, The main body structure (110) has two opposite contact surfaces (111), and each contact surface (111) is provided with the conductive contact piece (120); preferably, the conductive contact pieces (120) are regularly arranged on each contact surface (111).

3. The connection terminal (100) according to claim 1, wherein The main body structure (110) has two opposite contact surfaces (111), and each contact surface (111) is provided with the conductive contact piece (120); preferably, the conductive contact pieces (120) are regularly arranged on each contact surface (111), respectively; The base layer (121) has two opposite conductive connection surfaces (129), and each conductive connection surface (129) is provided with the conductive layer (122), wherein the first gold layer (125) of one of the conductive layers (122) is disposed on the main body structure (110), and the first gold layer (125) of the other conductive layer (122) is provided with at least one anti-electrolytic layer (137).

4. The connection terminal (100) according to claim 3, wherein Any of the conductive connection surfaces (129) is parallel to any of the contact surfaces (111).

5. The connection terminal (100) according to claim 4, wherein The two conductive connection surfaces (129) are a first conductive connection surface (131) and a second conductive connection surface (132), respectively; The conductive layer (122) arranged on the first conductive connecting surface (131) is a first conductive layer (133), the first conductive layer (133) further comprises a second gold layer (126), and the anti-electrolysis layer (137) comprises a nickel-tungsten layer (124), a palladium-gold layer (127) and a platinum-gold layer (128); The nickel-tungsten layer (124) is arranged on the phosphor copper layer (123), the first gold layer (125) is arranged on the nickel-tungsten layer (124), the palladium-gold layer (127) is arranged on the first gold layer (125), the second gold layer (126) is arranged on the palladium-gold layer (127), and the platinum-gold layer (128) is arranged on the second gold layer (126). The conductive layer (122) arranged on the second conductive connecting surface (132) is a second conductive layer (134), the first gold layer (125) on the second conductive layer (134) is welded on the main body structure (110), or the second conductive layer (134) further comprises a second gold layer (126) arranged on the first gold layer (125), and the second gold layer (126) is welded on the main body structure (110), or the anti-electrolysis layer (137) comprises a nickel-tungsten layer (124) arranged between the phosphor copper layer (123) and the first gold layer (125).

6. The connection terminal (100) according to claim 5, wherein For the first conductive layer (133) and the anti-electrolysis layer (137) arranged on the first conductive connecting surface (131), the phosphor copper layer (123) is connected to the base layer (121) in an immersion plating manner, the nickel-tungsten layer (124) is connected to the phosphor copper layer (123) in an immersion plating manner, the first gold layer (125) is connected to the nickel-tungsten layer (124) in an immersion plating manner, the palladium-gold layer (127) is connected to the first gold layer (125) in a brush plating manner, the second gold layer (126) is connected to the palladium-gold layer (127) in an immersion plating manner, and the platinum-gold layer (128) is connected to the second gold layer (126) in a brush plating manner; or, For the second conductive layer (134) and the anti-electrolysis layer (137) arranged on the second conductive connecting surface (132), the phosphor copper layer (123) is connected to the base layer (121) in an immersion plating manner, the nickel-tungsten layer (124) is connected to the phosphor copper layer (123) in an immersion plating manner, the first gold layer (125) is connected to the nickel-tungsten layer (124) in an immersion plating manner, and the second gold layer (126) is connected to the first gold layer (125) in an immersion plating manner; or, The base layer (121) is provided with a hollow groove (135) at the second conductive connecting surface (132), and the second conductive layer (134) has an opening (136) corresponding to the hollow groove (135).

7. The connection terminal (100) according to claim 5, wherein The thickness of the phosphor copper layer (123) is 30 microns ± 4.5 microns, the thickness of the nickel tungsten layer (124) is 50 microns ± 7.5 microns, the thickness of the first gold layer (125) is 1 micron ± 0.15 micron, the thickness of the palladium gold layer (127) is greater than or equal to 3 microns ± 0.45 microns, the thickness of the second gold layer (126) is 1 micron ± 0.15 micron, and the thickness of the platinum gold layer (128) is 20 microns ± 3 microns; Preferably, the thickness of the phosphor copper layer (123) is about 30 microns, the thickness of the nickel tungsten layer (124) is about 50 microns, the thickness of the first gold layer (125) is about 1 micron, the thickness of the palladium gold layer (127) is about 3 microns, the thickness of the second gold layer (126) is about 1 micron, and the thickness of the platinum gold layer (128) is about 20 microns.

8. The connection terminal (100) according to claim 7, wherein The connection terminal (100) is a Lightning connector.

9. The connecting terminal (100) according to claim 1, wherein The connection terminal (100) is a Lightning connector.

10. The connection terminal (100) according to any one of claims 1 to 9, wherein The connection terminal (100) further comprises a control board (130) connected with the conductive contact piece (120) through the main body structure (110).

11. A charging device (400), wherein The connection terminal (100) further comprises a control board (130) connected with the conductive contact piece (120) through the main body structure (110). The connection terminal (100) comprises a main body structure (110) and a conductive contact piece (120). The conductive contact piece (120) comprises a base layer (121), a conductive layer (122) and an anti-electrolytic layer (137) arranged on the base layer (121), and the conductive layer (122) comprises a phosphor copper layer (123) and a first gold layer (125). The base layer (121) is arranged on the main body structure (110), the phosphor copper layer (123) is arranged on the base layer (121), the first gold layer (125) is arranged on the phosphor copper layer (123), and at least one anti-electrolytic layer (137) is arranged on the first gold layer (125). The wire (300) is connected with the main body structure (110), and the power supply end (200) sequentially passes through the wire (300), the main body structure (110) and the conductive contact piece (120). The main body structure (110) is connected with the conductive contact piece (120).

12. The charging device (400) according to claim 11, wherein The phosphor copper layer (123) is connected to the base layer (121) by immersion plating, the first gold layer (125) is connected to the phosphor copper layer (123) by immersion plating, and the anti-electrolytic layer (137) is connected to the first gold layer (125) by brush plating; or, The phosphor copper layer (123) is connected to the base layer (121) by immersion plating, the first gold layer (125) is connected to the phosphor copper layer (123) by immersion plating, and the anti-electrolytic layer (137) is connected to the first gold layer (125) by brush plating; or, At least one of the anti-electrolytic layers (137) is arranged between the phosphor copper layer (123) and the first gold layer (125); preferably, the anti-electrolytic layer (137) comprises a nickel tungsten layer (124) arranged on the phosphor copper layer (123), the first gold layer (125) arranged on the nickel tungsten layer (124), and a platinum gold layer (128) arranged on the first gold layer (125); preferably, the nickel tungsten layer (124) is connected to the phosphor copper layer (123) by immersion plating, the first gold layer (125) is connected to the nickel tungsten layer (124) by immersion plating, and the platinum gold layer (128) is connected to the first gold layer (125) by brush plating; or, The conductive layer (122) further comprises a second gold layer (126) arranged on the first gold layer (125), at least one of the anti-electrolytic layers (137) is arranged between the first gold layer (125) and the second gold layer (126), and at least one of the anti-electrolytic layers (137) is arranged on the second gold layer (126); preferably, the anti-electrolytic layer (137) comprises a palladium gold layer (127) arranged on the first gold layer (125), the second gold layer (126) arranged on the palladium gold layer (127), and a platinum gold layer (128) arranged on the second gold layer (126); preferably, the palladium gold layer (127) is connected to the first gold layer (125) by brush plating, the second gold layer (126) is connected to the palladium gold layer (127) by immersion plating, and the platinum gold layer (128) is connected to the second gold layer (126) by brush plating; or, The conductive layer (122) further comprises a second gold layer (126) disposed on the first gold layer (125), at least one of the anti-electrolytic layers (137) is disposed between the phosphor copper layer (123) and the first gold layer (125), at least one of the anti-electrolytic layers (137) is disposed between the first gold layer (125) and the second gold layer (126), and at least one of the anti-electrolytic layers (137) is disposed on the second gold layer (126); preferably, the anti-electrolytic layer (137) comprises a nickel-tungsten layer (124), a palladium-gold layer (127) and a platinum-gold layer (128), wherein the nickel-tungsten layer (124) is disposed on the phosphor copper layer (123), the first gold layer (125) is disposed on the nickel-tungsten layer (124), the palladium-gold layer (127) is disposed on the first gold layer (125), the second gold layer (126) is disposed on the palladium-gold layer (127), and the platinum-gold layer (128) is disposed on the second gold layer (126); preferably, the nickel-tungsten layer (124) is connected to the phosphor copper layer (123) by immersion plating, the first gold layer (125) is connected to the nickel-tungsten layer (124) by immersion plating, the palladium-gold layer (127) is connected to the first gold layer (125) by brush plating, the second gold layer (126) is connected to the palladium-gold layer (127) by immersion plating, and the platinum-gold layer (128) is connected to the second gold layer (126) by brush plating; or, The outermost layer of the anti-electrolytic layer (137) protrudes from the main body structure (110); or, The outer surface of the anti-electrolytic layer (137) is exposed to the external environment; or, The main body structure (110) has two opposite contact surfaces (111), and each contact surface (111) is provided with the conductive contact piece (120); preferably, the conductive contact pieces (120) are regularly arranged on each contact surface (111).

13. The charging device (400) according to claim 11, wherein The main body structure (110) has two opposite contact surfaces (111), and each contact surface (111) is provided with the conductive contact piece (120); preferably, the conductive contact pieces (120) are regularly arranged on each contact surface (111), respectively; The base layer (121) has two opposite conductive connection surfaces (129), and each conductive connection surface (129) is provided with the conductive layer (122), wherein the first gold layer (125) of one of the conductive layers (122) is disposed on the main body structure (110), and the first gold layer (125) of the other conductive layer (122) is provided with at least one anti-electrolytic layer (137).

14. The charging device (400) according to claim 13, wherein Any of the conductive connection surfaces (129) is parallel to any of the contact surfaces (111).

15. The charging device (400) according to claim 14, wherein The two conductive connection surfaces (129) are a first conductive connection surface (131) and a second conductive connection surface (132), respectively; The conductive layer (122) arranged on the first conductive connecting surface (131) is a first conductive layer (133), the first conductive layer (133) further comprises a second gold layer (126), and the anti-electrolysis layer (137) comprises a nickel-tungsten layer (124), a palladium-gold layer (127) and a platinum-gold layer (128); The nickel-tungsten layer (124) is arranged on the phosphor copper layer (123), the first gold layer (125) is arranged on the nickel-tungsten layer (124), the palladium-gold layer (127) is arranged on the first gold layer (125), the second gold layer (126) is arranged on the palladium-gold layer (127), and the platinum-gold layer (128) is arranged on the second gold layer (126). The conductive layer (122) arranged on the second conductive connecting surface (132) is a second conductive layer (134), the first gold layer (125) on the second conductive layer (134) is welded on the main body structure (110), or the second conductive layer (134) further comprises a second gold layer (126) arranged on the first gold layer (125), and the second gold layer (126) is welded on the main body structure (110), or the anti-electrolysis layer (137) comprises a nickel-tungsten layer (124) arranged between the phosphor copper layer (123) and the first gold layer (125).

16. The charging device (400) according to claim 15, wherein For the first conductive layer (133) and the anti-electrolysis layer (137) arranged on the first conductive connecting surface (131), the phosphor copper layer (123) is connected to the base layer (121) in an immersion plating manner, the nickel-tungsten layer (124) is connected to the phosphor copper layer (123) in an immersion plating manner, the first gold layer (125) is connected to the nickel-tungsten layer (124) in an immersion plating manner, the palladium-gold layer (127) is connected to the first gold layer (125) in a brush plating manner, the second gold layer (126) is connected to the palladium-gold layer (127) in an immersion plating manner, and the platinum-gold layer (128) is connected to the second gold layer (126) in a brush plating manner; or, For the second conductive layer (134) and the anti-electrolysis layer (137) arranged on the second conductive connecting surface (132), the phosphor copper layer (123) is connected to the base layer (121) in an immersion plating manner, the nickel-tungsten layer (124) is connected to the phosphor copper layer (123) in an immersion plating manner, the first gold layer (125) is connected to the nickel-tungsten layer (124) in an immersion plating manner, and the second gold layer (126) is connected to the first gold layer (125) in an immersion plating manner; or, The base layer (121) is provided with a hollow groove (135) at the second conductive connecting surface (132), and the second conductive layer (134) has an opening (136) corresponding to the hollow groove (135).

17. The charging device (400) according to claim 16, wherein the phosphor copper layer (123) has a thickness of 30 microns ± 4.5 microns, the nickel tungsten layer (124) has a thickness of 50 microns ± 7.5 microns, the first gold layer (125) has a thickness of 1 micron ± 0.15 microns, the palladium gold layer (127) has a thickness of 3 microns ± 0.45 microns, the second gold layer (126) has a thickness of 1 micron ± 0.15 microns, and the platinum gold layer (128) has a thickness of 20 microns ± 3 microns; Preferably, the phosphor copper layer (123) has a thickness of about 30 microns, the nickel tungsten layer (124) has a thickness of about 50 microns, the first gold layer (125) has a thickness of about 1 micron, the palladium gold layer (127) has a thickness of about 3 microns, the second gold layer (126) has a thickness of about 1 micron, and the platinum gold layer (128) has a thickness of about 20 microns.

18. The charging device (400) according to claim 17, wherein The connection terminal (100) is a Lightning connector.

19. The charging device (400) of claim 11, wherein, The connection terminal (100) is a Lightning connector.

20. The charging device (400) according to any one of claims 11 to 19, wherein, The connection terminal (100) further comprises a control board (130) connected with the conductive contact patch (120) through the main body structure (110).

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