Temperature equalizing heat dissipation apparatus and manufacturing method and design method therefor, storage medium, and electronic device

Abstract

The present invention relates to the technical field of temperature equalizing heat dissipation, and in particular to a temperature equalizing heat dissipation apparatus and a manufacturing method and design method therefor, a storage medium, and an electronic device. The temperature equalizing heat dissipation apparatus comprises a heat dissipation substrate; the upper surface and the lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively; a phase change cavity is formed in the heat dissipation substrate by means of drilling; and the phase change cavity is parallel to the heat source surface and the heat dissipation surface.

Description

Temperature equalization heat dissipation devices and their manufacturing, design methods, storage media and electronic equipment

[0001] This application claims priority to Chinese patent application CN202410663196.6, filed on May 27, 2024, entitled “Equalizing Heat Dissipation Device and its Fabrication, Design Method, Storage Medium and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of uniform temperature heat dissipation technology, and particularly to a uniform temperature heat dissipation device, its manufacturing and design methods, storage medium, and electronic equipment. Background Technology

[0003] The core component used in power electronic converters is the Insulated Gate Bipolar Transistor (IGBT). The trends of high output performance and high power, high integration with multiple functions and components, and miniaturization for weight reduction and cost reduction are popular development directions for converters. However, the resulting non-uniformity, high heat flux density, and heat dissipation challenges from multi-component integration pose significant challenges to related thermal management. Conventional heat dissipation devices have poor temperature uniformity, leading to a bottleneck effect in converter applications.

[0004] For large-scale industrial applications, performance, reliability, and cost are all important considerations. There is a technical problem in this field of how to develop a heat dissipation product that is simple to manufacture, low in cost, highly reliable, and high in performance.

[0005] Summary of the Invention

[0006] This invention provides a uniform temperature heat dissipation device, its manufacturing and design methods, storage medium, and electronic equipment, solving the technical problem of how to develop a uniform temperature heat dissipation product that is simple to manufacture, low in cost, highly reliable, and high in performance.

[0007] In a first aspect, the present invention provides a uniform temperature heat dissipation device, which includes a heat dissipation substrate, the upper surface and the lower surface of the heat dissipation substrate being a heat source surface and a heat dissipation surface, respectively, and a phase change cavity is formed inside the heat dissipation substrate by drilling, wherein the phase change cavity is parallel to the heat source surface and the heat dissipation surface.

[0008] In some embodiments, the phase change cavity includes a row phase change cavity distributed along the row direction of the heat source and a column phase change cavity distributed along the column direction of the heat source, and the row phase change cavity and the column phase change cavity are interconnected.

[0009] In some embodiments, the heat source surface of the heat dissipation device is provided with multiple heat source regions, each heat source region covers at least one phase change cavity connection region, and the heat source region is provided with a thermally conductive material layer.

[0010] Secondly, the present invention provides a method for manufacturing a uniform temperature heat dissipation device, comprising: drilling a heat dissipation substrate to obtain a phase change hole; filling the phase change hole with a phase change working medium; and sealing both sides of the phase change hole to obtain a sealed phase change cavity.

[0011] Thirdly, the present invention provides a design method for a uniform temperature heat dissipation device, the method comprising the following steps: arranging all heat sources on a heat dissipation substrate; detecting the maximum temperature rise of each heat source and averaging the maximum temperature rise of all heat sources to obtain an average temperature rise; determining the difference between the maximum temperature rise and the average temperature rise of each heat source to obtain a temperature rise difference of each heat source; determining whether the temperature rise difference of each heat source is greater than a preset uniform temperature target value; if the temperature rise difference of at least one heat source is greater than the preset uniform temperature target value, then determining the number and location of phase change cavities to be set on the heat dissipation substrate based on the ratio of the heat generation power to the heat transfer area of ​​the heat source.

[0012] In some embodiments, determining the number and location of phase change cavities to be installed on the heat dissipation substrate based on the ratio of the heating power of the heat source to the heat transfer area includes: obtaining a reference heating power and a reference heat transfer area; using the ratio of the reference heating power to the reference heat transfer area as a reference ratio; obtaining a sequence of ratios of the number of phase change cavities in each row / column based on the reference ratio and the ratio of the sum of the heating power of each row / column heat source to the sum of the heat transfer areas of that row / column heat source; amplifying the value of the sequence of ratios of the number of phase change cavities in each row / column according to the ratio of the maximum number of phase change cavities corresponding to the heat source to the maximum value in the sequence of ratios of the number of phase change cavities in each row / column to obtain the number of phase change cavities to be installed in each row / column; and equidistantly distributing the phase change cavities to be installed in each row / column; wherein the maximum number of phase change cavities corresponding to the heat source is the ratio of the size of the heat source to the thickness of the corresponding position on the heat dissipation substrate.

[0013] In some embodiments, the method further includes the following steps: determining whether the temperature rise difference of each heat source on the heat dissipation substrate with the phase change cavity is greater than a preset average temperature target value; if the temperature rise difference of at least one heat source is greater than the preset average temperature target value, adjusting the preset average temperature target value, and redetermining the number and position of the phase change cavities to be set on the heat dissipation substrate based on the adjusted preset average temperature target value, until the temperature rise difference of all heat sources is less than or equal to the preset average temperature target value.

[0014] Fourthly, the present invention provides a design method for a uniform temperature heat dissipation device, the method comprising: arranging all heat sources on a heat dissipation substrate; detecting the maximum temperature rise of each heat source and averaging the maximum temperature rise of all heat sources to obtain an average temperature rise; obtaining the heating power and heat transfer area of ​​each heat source, as well as the thermal conductivity and thickness of the thermally conductive material; determining the maximum contact temperature rise generated by each heat source in contact with the heat dissipation substrate using a contact temperature rise calculation formula based on the heating power and heat transfer area of ​​each heat source, as well as the thermal conductivity and thickness of the thermally conductive material, wherein the thickness of the thermally conductive material between each heat source and the heat dissipation substrate is the same; determining the difference between the sum of the maximum temperature rise and the maximum contact temperature rise of each heat source and the average temperature rise to obtain the contact temperature rise difference of each heat source; if the contact temperature rise difference of at least one heat source is greater than a preset uniform temperature target value, then matching a thermally conductive material with a thermal conductivity corresponding to the uniform temperature back-calculation target requirement, until the contact temperature rise difference of all heat sources is less than or equal to the preset uniform temperature target value.

[0015] In some embodiments, the formula for calculating the contact temperature rise includes: △T nm_ch =Q nm b / (λ nm A nm )

[0016] Among them, △T nm_ch λ represents the maximum contact temperature rise between the heat source and the heat dissipation device at the position in the nth row and mth column. nm The position in the nth row and mth column corresponds to the thermal conductivity of the heat-conducting material in contact with the heat source and the heat dissipation device; b is the thickness of the heat-conducting material.

[0017] Fifthly, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the method of any of the above aspects.

[0018] In a sixth aspect, the present invention provides an electronic device including a processor and a memory, wherein a computer program is stored in the memory, and the processor executes the computer program to implement the method of any of the above aspects.

[0019] This invention provides a uniform temperature heat dissipation device, its manufacturing and design method, storage medium, and electronic device. The device includes a heat dissipation substrate with an upper and lower surface, respectively, serving as a heat source and a heat dissipation surface. A phase change cavity is formed inside the substrate through drilling, and the phase change cavity is parallel to the heat source and heat dissipation surfaces. This invention provides a simple, low-cost, highly reliable, and high-performance uniform temperature heat dissipation product. Attached Figure Description

[0020] The invention will now be described in more detail with reference to embodiments and the accompanying drawings:

[0021] Figure 1 is a three-dimensional structural schematic view of a uniform temperature heat dissipation device provided in an embodiment of this application;

[0022] Figure 2 is a front view of a uniform heat dissipation device provided in an embodiment of this application;

[0023] Figure 3 is a left view of a uniform heat dissipation device provided in an embodiment of this application;

[0024] Figure 4 is a top view of a uniform heat dissipation device provided in an embodiment of this application;

[0025] Figure 5 is a schematic diagram of the manufacturing process of another heat dissipation device provided in an embodiment of this application;

[0026] Figure 6 is a schematic flowchart of a design method for a uniform heat dissipation device provided in an embodiment of this application.

[0027] In the accompanying drawings, the same parts are referred to by the same reference numerals, and the drawings are not drawn to scale. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention and to fully understand and implement the process of how the present invention uses technical means to solve technical problems and achieve corresponding technical effects, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. The embodiments of the present invention and the various features therein can be combined with each other without conflict, and the resulting technical solutions are all within the protection scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0030] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0031] The core component used in power electronic converters is the Insulated Gate Bipolar Transistor (IGBT). The trends of high output performance and high power, high integration of multiple functions and components, and miniaturization for weight reduction and cost reduction are popular development directions for converters. However, the resulting non-uniformity, high heat flux density, and multi-component integrated heat dissipation technologies pose significant challenges to related thermal management. Conventional heat dissipation devices have poor temperature uniformity, leading to a bottleneck effect in converter applications. For large-scale industrial applications, performance, reliability, and cost are all important considerations. Therefore, there is a technical challenge in this field to develop a simple, low-cost, highly reliable, and high-performance uniform temperature dissipation product.

[0032] The technical solution of this application will be described below with reference to specific embodiments.

[0033] Example 1

[0034] Figure 1 is a structural schematic diagram of a uniform temperature heat dissipation device provided in an embodiment of this application; Figure 2 is a front view of a uniform temperature heat dissipation device provided in an embodiment of this application; Figure 3 is a left view of a uniform temperature heat dissipation device provided in an embodiment of this application; and Figure 4 is a top view of a uniform temperature heat dissipation device provided in an embodiment of this application. As shown in Figures 1 to 4, in the technical solution of this embodiment, a uniform temperature heat dissipation device is provided, wherein the uniform temperature heat dissipation device includes a heat dissipation substrate, the upper surface and the lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively, and a phase change cavity is formed inside the heat dissipation substrate through drilling, wherein the phase change cavity is parallel to the heat source surface and the heat dissipation surface.

[0035] The technical problem solved by the technical solution in this embodiment is how to achieve efficient thermal management and temperature uniformity in power electronic devices with high power density and multiple heat sources.

[0036] The phase change cavity, formed by drilling holes inside the heat dissipation substrate, is integrated with the substrate, reducing thermal resistance. The phase change cavity can be filled with phase change material, which helps maintain temperature stability around the heat source. The use of phase change material enhances the substrate's thermal energy storage capacity, significantly improving its effectiveness in handling instantaneous high heat flux or heat pulses. The parallel design of the phase change cavity, heat source surface, and heat dissipation surface means that heat can be rapidly and uniformly transferred from the heat source surface to the heat dissipation surface through the phase change material. This embodiment's technical solution, by forming a phase change cavity through drilling holes inside the heat dissipation substrate and ensuring the parallel structure of the phase change cavity, heat source surface, and heat dissipation surface, not only increases the heat storage and release capacity of the heat dissipation system but also significantly improves the temperature uniformity performance of the heat dissipation device by optimizing heat flow distribution. This effectively addresses the thermal management challenges faced by high-power-density electronic devices, improving the system's operational stability and reliability.

[0037] Example 2

[0038] Based on the above embodiments, the phase change cavity includes a row phase change cavity distributed along the row direction of the heat source and a column phase change cavity distributed along the column direction of the heat source, and the row phase change cavity and the column phase change cavity are interconnected.

[0039] The technical problem solved by the solution in this embodiment is to further optimize the heat distribution and transfer efficiency inside the heat dissipation substrate, especially in the face of complex heat source layouts and non-uniform heat flux densities. A more refined phase change cavity design enhances heat dissipation uniformity, ensuring a more consistent temperature across all heat source areas, thereby improving overall heat dissipation performance and system stability. This embodiment introduces row and column phase change cavities with an angle of, for example, 90 degrees. These cavities not only store and release heat, balancing temperature fluctuations caused by heat sources through the properties of the phase change material, but also further improve heat dissipation efficiency through their unique layout. The connection between the row and column phase change cavities allows for smoother flow and distribution between them. The preset angle can also be other angles, such as 30 degrees, to ensure more uniform heat transfer in different directions. Compared to heat transfer only on a one-dimensional plane, this design, through the connection and angle setting between the phase change cavities, forms a more three-dimensional heat exchange channel, achieving two-dimensional heat management.

[0040] This not only enhances the flexibility of the heat dissipation system, enabling it to adapt to a wider range of heat source layouts, but also optimizes the heat flow path and enhances the heat dissipation substrate's ability to uniformly distribute heat in two-dimensional space through an innovative phase change cavity structure design, particularly the specific angle connection between the row and column phase change cavities. This effectively solves the problem of heat dissipation uniformity in complex thermal management scenarios and improves the overall performance of the heat dissipation device.

[0041] Example 3

[0042] Based on the above embodiments, the heat source surface of the uniform temperature heat dissipation device is provided with multiple heat source areas, each heat source area covers at least one phase change cavity connection area, and the heat source area is provided with a thermally conductive material layer.

[0043] The technical problem solved by the solution in this embodiment is how to efficiently and quickly transfer the heat generated by the heat source to the phase change cavity, ensuring heat dissipation efficiency and reducing the temperature gradient within the heat source area. By setting multiple heat source areas on the heat source surface, each area corresponding to at least one phase change cavity connection area, this design allows for more precise configuration of the phase change cavity based on the specific heating characteristics and location of different heat sources. This ensures that each heat source receives effective and targeted heat dissipation, avoiding waste or uneven distribution of heat dissipation resources. A thermally conductive material layer is placed in each heat source area, improving heat transfer efficiency. The technical solution in this embodiment, by precisely defining heat source areas on the heat source surface and laying thermally conductive material layers, combined with the efficient thermal energy management mechanism of the phase change cavity, achieves rapid heat conduction and uniform distribution, effectively solving the technical problems of uneven heat dissipation and localized overheating in high-power-density equipment, and improving the performance and reliability of the entire uniform temperature heat dissipation device.

[0044] Example 4

[0045] Figure 5 is a flowchart illustrating a method for manufacturing a uniform heat dissipation device according to an embodiment of this application. As shown in Figure 5, in the technical solution of this embodiment, a method for manufacturing any of the uniform heat dissipation devices described in the above embodiments is provided, including: drilling holes in a heat dissipation substrate to obtain phase change holes; filling the phase change holes with a phase change working medium; and sealing both sides of the phase change holes to obtain a sealed phase change cavity.

[0046] The technical problem solved by this embodiment is how to manufacture a heat dissipation device with efficient and uniform temperature dissipation function, specifically how to integrate a phase change cavity with high heat transfer performance into a heat dissipation substrate to improve thermal management capabilities and temperature uniformity, while ensuring the sealing and stable filling of the phase change material to prevent leakage and maintain long-term performance. First, precise drilling is performed on the heat dissipation substrate to form phase change holes, thereby creating a phase change cavity with high heat transfer performance. A pre-selected phase change working fluid, such as a phase change material, is then filled into these phase change holes. Finally, the two sides of the phase change holes are sealed using processes such as welding to form a sealed phase change cavity. In summary, this technical solution not only achieves the integration of the phase change cavity but also ensures the stable filling and sealing of the phase change material, thereby manufacturing a heat dissipation device with efficient and uniform temperature dissipation capabilities.

[0047] Example 5

[0048] Figure 6 is a schematic diagram of the design process of a uniform temperature heat dissipation method provided in an embodiment of this application. As shown in Figure 6, in the technical solution of this embodiment, a design method for a uniform temperature heat dissipation device is provided. The uniform temperature heat dissipation device includes a heat dissipation substrate. The method includes the following steps: arranging all heat sources on the heat dissipation substrate; detecting the maximum temperature rise of each heat source and averaging the maximum temperature rise of all heat sources to obtain an average temperature rise; determining the difference between the maximum temperature rise and the average temperature rise of each heat source to obtain a temperature rise difference of each heat source; determining whether the temperature rise difference of each heat source is greater than a preset uniform temperature target value; if the temperature rise difference of at least one heat source is greater than the preset uniform temperature target value, then determining the number and position of the phase change cavities to be set on the heat dissipation substrate based on the ratio of the heat generation power to the heat transfer area of ​​the heat source.

[0049] The technical problem solved by the technical solution of this embodiment is the uneven heat dissipation and temperature difference caused by non-uniform heat flux density in the converter heat dissipation device. This is especially true for systems that integrate multiple heat source devices (such as IGBTs). These devices generate heat of varying degrees during operation. If the heat is not evenly distributed on the heat dissipation substrate, it will cause some areas to overheat, affecting the reliability and lifespan of the devices, and even causing system failure.

[0050] In this embodiment, all heat sources are first arranged on a heat dissipation substrate, and the maximum temperature rise of each heat source under operating conditions is recorded. This is the basis for understanding the heat generation characteristics and heat dissipation requirements of the heat sources. By averaging the maximum temperature rise of all heat sources, a representative average temperature rise level is obtained. Next, the difference between the maximum temperature rise and the average temperature rise of each heat source is calculated to identify which heat sources deviate significantly from the average, i.e., have large temperature rise differences. A preset uniform temperature target value is set as a standard for measuring the uniformity of heat dissipation. If the temperature rise difference of any heat source exceeds this target value, it indicates that the heat dissipation conditions of these heat sources have not met the ideal uniformity requirements. This embodiment further utilizes the ratio of the heat generation power to the heat transfer area of ​​the heat source to guide the optimized layout of the phase change cavity on the heat dissipation substrate. Therefore, in areas with high heat flux density (i.e., where the heat source power is large and the heat transfer area is relatively small), the design of the phase change cavity is increased or optimized to more effectively absorb and transfer heat and reduce local overheating. The use of phase change materials can store and release heat. When the temperature of the heat source rises, it absorbs heat and undergoes a phase change to help maintain temperature stability, while releasing heat when the temperature drops, thereby achieving better temperature uniformity.

[0051] The technical solution in this embodiment effectively improves the temperature uniformity of the heat dissipation system through precise heat source temperature rise analysis, differentiated demand identification, and targeted phase change cavity layout optimization. This ensures that the heat source devices can operate in a more stable temperature environment, thereby improving the reliability and efficiency of the entire system.

[0052] Example 6

[0053] Based on the above embodiments, the number and location of phase change cavities to be installed on the heat dissipation substrate are determined based on the ratio of the heating power of the heat source to the heat transfer area. This includes: obtaining a reference heating power and a reference heat transfer area; using the ratio of the reference heating power to the reference heat transfer area as a reference ratio; obtaining a sequence of phase change cavity number ratios based on the reference ratio and the ratio of the sum of the heating power of each row / column of heat sources to the sum of the heat transfer areas of that row / column of heat sources. In some embodiments, the reference ratio may not be obtained, and the sequence of phase change cavity number ratios may be obtained directly based on the ratio of the sum of the heating power of each row / column of heat sources to the sum of the heat transfer areas of that row / column of heat sources; increasing the value of the sequence of phase change cavity number ratios based on the ratio of the maximum number of phase change cavities corresponding to the heat source to the maximum value in the sequence of phase change cavity number ratios to obtain the number of phase change cavities to be installed in each row / column; and ensuring that the phase change cavities to be installed in each row / column are equidistantly distributed. The maximum number of phase change cavities corresponding to the heat source is the ratio of the size of the heat source to the thickness of the corresponding position on the heat dissipation substrate.

[0054] The technical problem addressed by this embodiment is how to precisely arrange phase change cavities on a heat dissipation substrate to optimize heat dissipation, ensure more uniform temperature among heat source devices (such as IGBTs), and thus improve the efficiency and reliability of the entire heat dissipation system. First, a reference heating power and a reference heat transfer area are obtained, and their ratio is calculated as a reference ratio. This step provides a reference standard for subsequent comparisons and adjustments. Next, based on the total heating power and heat transfer area of ​​each row or column of heat sources, their respective ratios are calculated and compared with the reference ratio. In this way, a sequence of phase change cavity quantity ratios for each row / column can be obtained, reflecting the relative intensity of the demand for phase change cavities in different areas.

[0055] This embodiment calculates the theoretical maximum heat-carrying capacity based on the actual size of the heat source and the thickness of the heat dissipation substrate at that location. By combining this constraint with the previously obtained sequence of row / column phase change cavity ratios, and through a scaling-up operation, it ensures that the final designed number of phase change cavities meets the heat dissipation requirements of the heat source without exceeding the limitations of the physical structure. Through the above steps, the final number of rows / columns of phase change cavities can better adapt to the actual heat generation of the heat source. Especially for heat sources with high power density or limited size, it can provide more heat dissipation resources, thereby forming a more reasonable phase change cavity layout on the heat dissipation substrate, achieving effective heat dispersion and transfer, and improving the overall heat dissipation performance.

[0056] Example 7

[0057] Based on the above embodiments, the method further includes the following steps: determining whether the temperature rise difference of each heat source on the heat dissipation substrate with the phase change cavity is greater than the preset average temperature target value; if the temperature rise difference of at least one heat source is greater than the preset average temperature target value, then adjusting the preset average temperature target value, and redetermining the number and position of the phase change cavity to be set on the heat dissipation substrate based on the adjusted preset average temperature target value, until the temperature rise difference of all heat sources is less than or equal to the preset average temperature target value.

[0058] The technical solution of this embodiment dynamically adjusts the position distribution of the phase change cavity through an iterative optimization process until the temperature rise difference of all heat sources meets the preset uniformity requirements. First, the maximum temperature rise of each heat source on the heat dissipation substrate under the existing phase change cavity layout is detected, and the average of these maximum temperature rises is calculated as a reference average temperature rise level. The difference between the maximum temperature rise and the average temperature rise of each heat source is determined, i.e., the temperature rise difference. The temperature rise difference of each heat source is compared with the preset uniform temperature target value to determine whether all heat sources have achieved the standard of uniform heat dissipation. If the temperature rise difference of at least one heat source exceeds the preset value, it indicates that the current phase change cavity layout has not achieved the ideal uniform temperature effect. At this time, the position distribution of the phase change cavity is adjusted again based on the ratio of heat generation power to heat transfer area to improve heat dissipation efficiency. This process is repeated until the temperature rise difference of all heat sources is controlled within the preset uniform temperature target value.

[0059] Through dynamic feedback and step-by-step optimization, the technical solution of this embodiment can ensure that the heat dissipation device can provide balanced and efficient heat dissipation performance when facing heat sources with different heat flux densities and layouts, avoid performance degradation or system failure caused by local overheating, and ultimately achieve stable and reliable operation of the overall heat dissipation system.

[0060] Example 8

[0061] In this embodiment, a method for designing a uniform temperature heat dissipation device is provided. The method includes: arranging all heat sources on a heat dissipation substrate; detecting the maximum temperature rise of each heat source and averaging the maximum temperature rise of all heat sources to obtain an average temperature rise; acquiring the heating power and heat transfer area of ​​each heat source, as well as the thermal conductivity and thickness of the thermally conductive material; determining the maximum contact temperature rise generated by each heat source contacting the heat dissipation substrate using a contact temperature rise calculation formula based on the heating power and heat transfer area of ​​each heat source, as well as the thermal conductivity and thickness of the thermally conductive material, wherein the thickness of the thermally conductive material between each heat source and the heat dissipation substrate is the same; determining the difference between the sum of the maximum temperature rise and the maximum contact temperature rise of each heat source and the average temperature rise to obtain the contact temperature rise difference of each heat source; if the contact temperature rise difference of at least one heat source is greater than a preset uniform temperature target value, adjusting the thickness or thermal conductivity of the thermally conductive material, for example, matching a thermally conductive material with a thermal conductivity corresponding to the uniform temperature back-calculation target requirement, until the contact temperature rise difference of all heat sources is less than or equal to the preset uniform temperature target value.

[0062] The formula for calculating contact temperature rise includes: △T nm_ch =Q nm b / (λ nm A nm )

[0063] Among them, △T nm_ch λ represents the maximum contact temperature rise between the heat source and the heat dissipation device at the position in the nth row and mth column. nm The position in the nth row and mth column corresponds to the thermal conductivity of the heat-conducting material in contact with the heat source and the heat dissipation device; b is the thickness of the heat-conducting material.

[0064] The technical problem solved by the technical solution in this embodiment is how to achieve temperature uniformity among all heat sources in the design of a heat dissipation device.

[0065] First, all heat sources are arranged on the heat dissipation substrate, and detailed thermal property data for each heat source are obtained, including heating power, thermal conductivity of the heat-conducting material, initial thickness of the heat-conducting material, and heat transfer area. Using the basic principles of heat conduction, the maximum contact temperature rise between each heat source and the heat dissipation device is calculated using a contact temperature rise calculation formula. This calculation process considers factors such as the heating intensity of the heat source, the thermal conductivity of the heat-conducting material, and its geometric dimensions to evaluate the heat dissipation status of the heat sources. By comparing the difference between the maximum contact temperature rise and the initial average temperature rise of each heat source, it is determined whether the preset uniform temperature target value is met. If the temperature rise deviation of any heat source exceeds the allowable range, it indicates uneven heat dissipation. In this case, the corresponding heat-conducting materials under these heat sources are adjusted to precisely match the appropriate thermal conductivity, thereby changing the thermal resistance and controlling their heat dissipation performance. The goal of the adjustment is to control the temperature rise deviation of all heat sources within the preset uniform temperature target value, thus achieving uniform heat dissipation throughout the system. Through this step-by-step optimization, it is ensured that regardless of changes in the power of the heat sources, overall temperature balance can be achieved by adjusting the thermal resistance of the heat dissipation path, improving the stability and efficiency of the heat dissipation system.

[0066] The technical solution of this embodiment can be customized for the characteristics of different heat sources, optimize the structure of the heat dissipation device, and ensure good heat dissipation performance and temperature consistency between heat sources under complex heat flow conditions, thereby improving the reliability and service life of the entire system.

[0067] Example 9

[0068] In the technical solution of this embodiment, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, it implements the method of any of the above embodiments.

[0069] The aforementioned storage media can be flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, disk, optical disk, server, APP application store, etc. Other details are provided in the foregoing embodiments and will not be repeated in this embodiment.

[0070] Example 10

[0071] In the technical solution of this embodiment, an electronic device is provided, including a processor and a memory. The memory stores a computer program, and the processor executes the computer program to implement the method of any of the above embodiments.

[0072] The processor can be implemented as an Application Specific Integrated Circuit (ASIC), Digital Signal Processor (DSP), Digital Signal Processing Device (DSPD), Programmable Logic Device (PLD), Field Programmable Gate Array (FPGA), controller, microcontroller, microprocessor, or other electronic components, and is used to execute the methods in the above embodiments. The memory can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. For other details, please refer to the foregoing embodiments; they will not be repeated in this embodiment.

[0073] Example 11

[0074] Based on the above embodiments, this embodiment provides an application example.

[0075] This invention belongs to the field of converter thermal management technology. The temperature equalization design method can be applied to string, industrial and rail transit fields.

[0076] The core component used in power electronic converters is the Insulated Gate Bipolar Transistor (IGBT). With the continuous advancement of technology, IGBTs are developing rapidly and iterating quickly. Their application fields, such as the rapidly developing rail transportation industry, as well as dual-carbon industries such as wind power, solar power, and energy storage, are also responding to rapid iterations and updates in the application of power electronic devices.

[0077] The trends of high-power output performance, high integration of multiple functions and components, and miniaturization for weight and cost reduction are popular development directions for converters. However, the resulting non-uniformity, high heat flux density, and multi-component integrated heat dissipation issues pose significant challenges to related thermal management. For existing conventional heat dissipation devices, these challenges primarily manifest as poor temperature uniformity, which can directly lead to a bottleneck effect in converter operation.

[0078] To address the aforementioned technical challenges, researchers have conducted a series of explorations and studies on the application of heat dissipation technology from multiple perspectives. The main approach is to employ uniform temperature heat dissipation technology, with common methods as follows:

[0079] One method is to optimize the structure of the heat dissipation device based on the heat generation characteristics of the heat dissipation object, strengthen heat transfer in areas with high heat flux density and weaken heat transfer in areas with low heat flux density, thereby reducing the heat transfer in one area and increasing the heat transfer in the other, thus achieving the goal of improving temperature uniformity.

[0080] Method 2 involves using a heat-conducting unit with characteristics such as superconductivity and high isothermal properties, such as a heat-conducting plate or heat pipe, on the basis of the existing conventional heat dissipation device. By processing and embedding it into the surface of the heat dissipation device substrate, the entire plane of the substrate can have higher thermal conductivity under the action of the heat pipe, thereby enhancing heat transfer and improving temperature uniformity.

[0081] Method three involves designing the heat dissipation device as an integrated homogeneous phase change unit, thereby enabling the entire heat dissipation device to have higher thermal conductivity under the action of homogeneous phase change. This includes not only the substrate plane but also the heat dissipation fins on the substrate, which have higher thermal conductivity, thus improving the temperature uniformity.

[0082] Of the methods described above, Method 1 has the lowest implementation cost and relatively simple process threshold, but its effect on improving temperature uniformity is very limited. Method 2 has a low implementation cost and a good effect on improving temperature uniformity, but it requires high reliability of the heat pipe and other temperature uniformity units themselves, as well as the reliability of the heat pipe and heat dissipation device integration process. There may be reliability risks such as heat pipe leakage failure or deformation of the integration process affecting thermal resistance. Method 3 is technically mature but has a high technical threshold and the best temperature uniformity effect, but it is also costly. For large-scale industrial applications, performance, reliability, and cost are all important considerations. Therefore, there is an urgent need in this field to develop a temperature uniformity heat dissipation product that is simple to manufacture, low-cost, highly reliable, and high-performance.

[0083] For heat dissipation devices used in large-scale applications of power electronic converters in the industrial sector, there is an urgent need to develop and design a simple, low-cost, highly reliable, and high-performance uniform-temperature heat dissipation product. Addressing the heat dissipation conditions of non-uniform heat flux density and integrated heat source devices in the thermophysical field, and to overcome the bottleneck effect caused by poor temperature uniformity leading to reduced reliability or even premature failure of high-temperature heat-generating devices, this application designs a uniform-temperature heat dissipation device for converters and describes its design method. This application mainly utilizes deep-hole drilling technology to form a cavity with heat pipe effect inside the substrate of a traditional heat dissipation device.

[0084] On the one hand, the substrate is equivalent to the heat pipe shell. The substrate and heat pipe of this application are integrated, which reduces the contact thermal resistance by one layer compared to the related technology of embedding the heat pipe into the heat dissipation device substrate. On the other hand, the solution of this application is internally interconnected, and can achieve uniform temperature heat transfer in the X and Y directions by relying on the high isothermal properties of the heat pipe effect, which further enhances the heat transfer effect of the heat dissipation device, greatly improves the heat transfer coefficient, can effectively reduce the thermal resistance of the thermal conduction term in the heat transfer thermal resistance, and effectively improves the heat dissipation capacity.

[0085] Furthermore, this application allows for flexible drilling design based on actual application layout, is simple to manufacture, has a low barrier to entry, significantly improves temperature uniformity, and is economically viable.

[0086] Furthermore, considering that the phase change temperature uniformity enhancement effect is limited due to the difference in power density, and that the greater the difference in power density, the worse the temperature uniformity will be, this invention starts from the contact thermal resistance and adds a temperature uniformity compensation design for the differential distribution of thermal grease, further balancing the temperature uniformity of all heat source contact surfaces. The combination of the two achieves the goal of meeting the high temperature uniformity performance requirements of the converter.

[0087] Related technologies that embed heat pipes into the substrate of a heat dissipation device have a relatively large contact thermal resistance. However, the substrate of this application forms a longitudinally and laterally interconnected phase change cavity through deep hole drilling or other methods, with an integrated structural design. This avoids the risk that thermal stress caused by the alternating hot and cold temperatures during long-term use of the heat pipe and substrate embedding process may cause deformation, affecting the heat dissipation reliability of the heat dissipation device.

[0088] Existing heat pipe technologies can only achieve one-dimensional ultra-strong heat conduction. However, this application designs a deep hole drilling distribution design method based on uniform temperature back calculation, which can achieve highly isothermal uniform temperature heat transfer in the X and Y directions by relying on the phase change effect in the cavity. This further enhances the heat transfer effect of the heat dissipation device and greatly improves the heat transfer coefficient. This method can effectively improve the heat diffusion effect, thereby improving the uniform temperature performance of the heat dissipation device.

[0089] Under high heat flux density, there is room for optimization of contact thermal resistance and temperature uniformity. To address this, this application designs a temperature uniformity compensation method based on the differential distribution of thermally conductive silicone grease. It employs contact cross-sectional materials with various thermal conductivity coefficients to further balance the temperature distribution of all heat sources and the contact surface of the heat dissipation device, thereby improving temperature uniformity.

[0090] The technical problem to be solved by the present invention is to provide a design method for a heat dissipation device that can effectively improve the uniform temperature performance and enhance the heat dissipation performance under the heat dissipation conditions of non-uniform heat flux density and integrated thermophysical field of multiple heat source devices, and to design a high-efficiency uniform temperature heat dissipation device based on the method.

[0091] This invention designs a uniform temperature heat dissipation device. By employing deep hole drilling, a longitudinally and transversely interconnected cavity is formed within the substrate of a traditional heat dissipation device. This cavity is filled with a phase change working fluid, and after vacuum sealing, it achieves high thermal conductivity and high isothermal heat transfer effects equivalent to a heat pipe. Furthermore, a deep hole drilling distribution design method based on uniform temperature calculation is designed to optimize the temperature distribution on the heat dissipation device's surface, improving temperature uniformity and heat dissipation performance. Considering that the temperature uniformity enhancement effect of the deep hole drilling distribution design method based on uniform temperature calculation has certain limits, a temperature uniformity compensation design based on the differential distribution of thermal conductive grease is further added to optimize contact thermal resistance and achieve further temperature uniformity enhancement of the heat dissipation device. Moreover, relying solely on the deep hole drilling distribution design method based on uniform temperature calculation inevitably leads to more complex processing and higher costs for higher temperature uniformity requirements. By adding thermal conductive grease as a compensation design, the cost of deep hole temperature uniformity can be reduced, thereby achieving a better uniform temperature heat dissipation effect at a lower cost.

[0092] On the one hand, the substrate is drilled with deep hole drilling to form a vertically and horizontally interconnected phase change cavity, which is an integral structure. Compared with the existing technology of embedding heat pipes into the heat dissipation device substrate, this reduces one layer of contact thermal resistance. At the same time, the cavity, as an internal structure of the substrate, avoids the risk of heat transfer deterioration, such as the risk of deformation caused by thermal stress due to alternating hot and cold during long-term use of the heat pipe and substrate embedding process, which affects the heat dissipation reliability of the heat dissipation object.

[0093] On the other hand, based on ordinary heat dissipation devices, the internal deep-hole drilling process forms interconnected cavities. This allows for highly isothermal heat transfer in the X and Y directions through phase change effects within the cavities, further enhancing the heat transfer effect and significantly improving the heat transfer coefficient. This effectively reduces the thermal resistance of the conduction term in the heat transfer resistance, thus significantly improving heat dissipation capacity. Simultaneously, the drilling process is flexible and simple to implement. It can be tailored to the distribution of the heat dissipation objects and differences in heat flux density in actual applications, aiming to achieve optimal temperature uniformity. The drilling diameter and spacing can be flexibly set, achieving optimal temperature uniformity at a relatively low cost. While deep-hole drilling is a flexible and optimized processing method in the initial design phase, this invention is not limited to this process. Other similar processing methods that achieve the same effect are also within the scope of this patent protection, such as mold making and casting.

[0094] Furthermore, considering that the phase change temperature uniformity enhancement effect is limited due to the difference in power density, and that the greater the difference in power density, the worse the temperature uniformity will be, this invention starts from the contact thermal resistance. That is, after the phase change temperature uniformity heat sink is optimized and finalized, there is still a certain temperature difference on the entire heat sink platform due to the difference in power density of different devices. Various thermal conductivity contact section materials are used to further balance the temperature uniformity of the contact surface between all heat sources and heat dissipation devices.

[0095] The heat dissipation object is illustrated using a certain rail transit converter module as an example, and the heat dissipation device is illustrated using a certain forced air cooling method as an example. This method is still applicable to other cases that use the same design method to achieve the same uniform temperature heat dissipation effect.

[0096] In this process, the IGBT converter module, which is the object of heat dissipation, is mounted on the substrate and tightened by bolts. There must be a certain air gap in this process. Since the thermal conductivity of air is very small, it is necessary to coat the space between the IGBT device substrate and the heat sink substrate of the heat dissipation device with thermal grease, or thermally conductive cross-section materials such as graphene or thermally conductive substrate. This helps to reduce contact thermal resistance and improve heat dissipation performance.

[0097] Among them, the heat dissipation converter module integrates multiple IGBTs of different sizes and power density levels;

[0098] Among them, on the substrate of the heat sink of the heat sink, multiple crisscrossing cavities of a specific size are processed by deep hole drilling process, which are used to fill a certain amount of phase change working fluid. After welding and sealing, it is equivalent to a high isothermal homogeneous phase change heat sink with ultra-high thermal conductivity in the X and Y directions.

[0099] A specific embodiment of a heat dissipation device for converters: As shown in Figures 1 to 4, the heat dissipation device for converters of the present invention mainly includes a heat sink substrate 1, heat sink fins 2, phase change cavity 3, heat source 4, and contact interface material layer 5.

[0100] The heat sink substrate 1 and heat sink fins 2 are the main body of the heat sink device. In this embodiment, they are manufactured by using aluminum ingots of a specific size through die casting and processing with a tooth-shaving process, or by using profile die casting, or by using blown plates and conventional fin welding to the substrate. The phase change cavity 3 can be processed by deep hole drilling to obtain a crisscrossing phase change cavity of a certain diameter on the entire heat sink substrate. The cavity is filled with a preset amount of phase change working fluid. To enhance the heat dissipation phase change temperature uniformity and anti-gravity capability, a liquid-absorbing core can be sintered inside the cavity. The cavity is then vacuumed and sealed by welding, so that the heat sink forms an equivalent heat pipe with ultra-high thermal conductivity in the X / Y direction to uniformly heat multiple heat sources. The heat source 4 includes IGBTs or experimental heat simulated heat sources. The contact interface material layer 5 can be filled with thermally conductive silicone grease, thermally conductive pads, graphene, or other interface materials to ensure tight contact between the IGBT and the heat sink substrate after bolt installation, reducing the thermal resistance caused by air gaps.

[0101] In this case, as shown in the front view of Figure 2, the heat sink fins 2 are assumed to be the optimal combination of fin height, fin thickness and spacing for heat dissipation efficiency, and remain unchanged during the design process.

[0102] As shown in the top view of Figure 4, the dashed lines represent the internal drilled cavities. The cavities are interconnected in a crisscross pattern, enabling the phase change working fluid to cover a large area in the X / Y directions throughout the entire heat sink substrate.

[0103] A deep hole drilling distribution design method based on isothermal back calculation:

[0104] For the heat dissipation of converter modules with multiple rows of non-uniform heat flux density devices, on the one hand, as the convective heat exchange air exchanges heat with the rows of IGBTs along the air intake direction, heat will continue to accumulate and the air temperature will rise, which can cause the temperature difference between the first and last rows of IGBT devices to reach, for example, 10K or even higher, and the higher the IGBT power density, the greater the temperature difference; on the other hand, the difference in the heat dissipation conditions of the devices themselves will also produce a certain temperature difference. These two are the main reasons for the poor temperature uniformity of the entire heat dissipation device.

[0105] To effectively eliminate uneven heat dissipation in the heat dissipation device, the IGBT distribution is as shown in Figure 4, as expressed in expression 1-1, where: Q nm =k nm *A nm *△T nm 1-1

[0106] △T nm This indicates the maximum temperature rise of the IGBT corresponding to the position in the nth row and mth column, in K.

[0107] Q nm This represents the heating power of the IGBT at the nth row and mth column, in W.

[0108] k nm This represents the heat transfer coefficient at the location of the highest temperature point of the IGBT in the nth row and mth column, expressed in W / (m²). 2 ·K) is a simplified variable of multiple parameters, which is related to multiple factors such as the thermal conductivity corresponding to the heat dissipation device material and the convective heat transfer coefficient corresponding to the heat dissipation structure;

[0109] A nm This represents the relative heat transfer area corresponding to the IGBT at the nth row and mth column position, in meters. 2 .

[0110] Assume the sum of the power of the devices in the first row is Q. h1 Contact heat transfer area and A h1 Then the sum of the power of the nth row is Q. hn Contact heat transfer area and A hn Each row contains m devices; correspondingly, the sum of the power of the devices in the first column is Q. z1 Contact heat transfer area and A z1 Then the sum of the power in the m-th column is Q. zm Contact heat transfer area and A zm Each column contains n devices. For standard profile or spade-shaped heat sinks, A nm It can be considered as the area of ​​the contact surface between the IGBT substrate and the heat dissipation device. For heat dissipation devices with internal phase change temperature equalization chambers, due to the equivalent heat pipe effect of the internal deep hole drilling, the heat of the IGBT heat source of the converter module can be extended to a larger heat transfer surface. After phase change temperature equalization, the heat transfer coefficient can be balanced.

[0111] The goal of this solution is to improve the temperature uniformity of the heat dissipation device, that is, to ensure that the temperature distribution of each IGBT is consistent. According to Expression 1-1, heat transfer is enhanced by increasing the heat transfer area and balancing the relative heat transfer coefficients of each heat source, thereby achieving the goal of enhancing the overall heat transfer efficiency. When the temperature rise of a certain IGBT is large, the number of horizontal and vertical holes is increased to increase the heat transfer area. At the same time, the influence of position distribution is considered. There should be relatively fewer holes drilled under IGBTs near the air inlet, while more holes should be drilled under IGBTs far from the air inlet. This ensures that IGBTs in areas with poor heat dissipation conditions have more phase change cavity extension coverage, which can be extended to a larger heat transfer area for enhanced heat transfer, reduce temperature rise, and thus achieve the goal of uniform temperature of the entire heat dissipation device.

[0112] Based on the above principles, the specific implementation steps are as follows:

[0113] Step 1: Based on the actual power requirements of the IGBT in the converter module and the overall structural dimensions allowed by the heat dissipation design, determine the optimal matching structural features of the heat sink fin size according to design experience, and keep them unchanged.

[0114] Step 2: As shown in Figure 4, based on the actual power distribution of the IGBT, the initial solution is a conventional heat sink without drilling.

[0115] Step 3: Obtain the temperature distribution of each IGBT through simulation or experimentation, and calculate the maximum temperature rise ΔT for each IGBT. nm Summing and averaging yields the initial average temperature rise ΔT for all IGBTs. nm_avg .

[0116] Step 4: Determine the target temperature uniformity value x based on project requirements. In this embodiment, x = 3K. The x value should not be set too small. If x is too small, the phase change uniformity effect becomes increasingly difficult, leading to excessively high requirements. This necessitates adjustments to the uniform temperature phase change working fluid, cavity design, etc., significantly increasing R&D investment while gradually reducing the effectiveness, resulting in high costs and hindering engineering application and commercialization. Furthermore, it is impossible to achieve ideal superconducting uniform temperature uniformity in actual engineering applications. If x is too large, the uniform temperature application target cannot be met. For example, if it exceeds 5K, considering positive and negative fluctuations, the amplitude reaches 10K. Considering the bottleneck effect in heat dissipation design, the temperature rise margin for the heat sink design is reduced by 10K, which is detrimental to lean design. Therefore, this embodiment assumes x is set to 3K.

[0117] Step 5: Define the average temperature baseline value and find the source that satisfies -x≤△T nm -△T nm_avg One or more IGBTs with a value ≤ x can achieve the ΔT value that satisfies the uniform temperature target. nm The corresponding IGBT power Q nm and contact heat transfer area A nm As a benchmark, when multiple IGBTs meet the requirement, the one closest to ΔT is selected. nm_avg △T nm __a、A nm _a、Q nm Using _a as the reference, according to expression 1-2, it can be transformed into △T. nm =Q nm / (A nm *k nm ).

[0118] Step 6: Deep hole drilling distribution design for each row of IGBTs. First, calculate the ratio Q between the sum of power and the sum of contact areas for each row. h1 / A h1Q h2 / A h2 :...:Q hn / A hn Assuming there are 4 rows with a ratio of 0.5:1:1:1.35, based on the IGBT area and the thickness of the drilling substrate, and assuming that a maximum of 5 rows of holes can be drilled equidistantly under each IGBT, the distribution of the 4 rows of holes can be calculated as 1:2:2:3, i.e., 1 hole in the 1st row, 2 holes in the 2nd row, 2 holes in the 3rd row, and 3 holes in the 4th row. In reality, the ratio of the above 4 rows is not an integer ratio, but 1:2:2:2.7. The number of holes must be rounded to the nearest integer. Therefore, the corresponding conversion is made according to the cross-sectional area ratio of the holes or other shapes. For example, for round holes, the diameters of the 1st, 2nd, and 3rd rows are the same for integer ratios. If conditions permit, let's assume the diameter is 10mm. Then, based on the proportional conversion of the cross-sectional area, the diameter of the 4th row is 9mm. And the holes under each IGBT are equidistantly distributed according to the size of the IGBT. For example, if the longitudinal length of the smallest IGBT in the 3rd row is 120mm, then the equidistant spacing of the 3 holes is 30mm.

[0119] Step 7: Deep hole drilling distribution design for each row of IGBTs. Similarly, calculate the ratio Q between the sum of power and the sum of contact areas for each row. s1 / A s1 Q s2 / A s2 :...:Q sm / A sm Assuming there are 5 columns with a ratio of 1.33:2:1:1:0.67, based on the IGBT area and the thickness of the drilling substrate, and assuming that a maximum of 6 rows of holes can be drilled at equal intervals under each IGBT, the equivalent calculation using rounded ratios yields a hole distribution of 4:6:3:3:2 for the 5 columns. That is, 4 holes in the first column, 6 holes in the second, 3 holes in the third, 3 holes in the fourth, and 2 holes in the fifth. In reality, the ratio of the above 5 columns is not an integer, but rather 3.6:6:3:3:2. 4. The number of openings must be determined. The corresponding conversion is made according to the cross-sectional area ratio of the opening or other shapes. For example, for round holes, the diameters of the 2nd, 3rd and 4th columns are the same if the integer ratio is met. If conditions permit, we assume that the diameter is 8mm. Then the diameter of the 1st column is 9mm and the diameter of the 5th column is 12mm. The holes under each IGBT are equally distributed according to the size of the IGBT. For example, if the longitudinal length of the smallest IGBT in the 3rd column is 120mm, then the equal spacing between the 3 holes is 30mm.

[0120] Step 8: Based on steps 5, 6, and 7, re-establish the adjustment plan for the number and distribution of deep hole drilling, then execute steps 3 through 4. If any △T nm All satisfy -x≤△T nm -△T nm_avgIf the target temperature is ≤x, the output is a deep hole drilling distribution scheme that meets the condition; otherwise, continue the loop of step 5 → step 6 → step 7 until the judgment requirement of step 4 is met, then stop the loop and obtain a deep hole drilling distribution scheme that meets the requirements.

[0121] Furthermore, considering that the temperature uniformity efficiency of deep hole drilling has a certain limit, the greater the difficulty and cost to achieve excellent temperature uniformity, the more difficult it is to achieve. Moreover, for a given temperature uniformity distribution scheme, the temperature uniformity deteriorates linearly with increasing losses. Therefore, this design adds a temperature uniformity compensation design method based on the differential distribution of thermal grease to compensate for the temperature uniformity.

[0122] Based on the one-dimensional thermal conductivity network model, thermal grease can effectively avoid the large thermal resistance caused by air gaps between the IGBT and the heat dissipation device substrate, as shown in Equation 1-2 for contact temperature rise calculation, where ΔT nm_ch The maximum contact temperature rise between the IGBT and the heat sink at the position of the nth row and mth column is expressed in Kelvin (K). nm The position in the nth row and mth column corresponds to the thermal conductivity of the thermal grease at the contact point between the IGBT and the heat sink, in K / Wm; b is the thickness of the thermal grease, in meters. Assuming a uniform tooling is used for applying the thermal grease, the thickness is consistent and constant. △T nm_ch =Q nm b / (λ nm A nm ) 1-2

[0123] During testing or simulation, temperature probes are placed in slots on the heating block, or temperature probes are designed to simulate the thermal contact surface of the heat source. This allows for the equivalent acquisition of the maximum temperature rise ΔT between the thermal grease on the heat dissipation device and the heat source contact surface relative to the environment. nm_c This serves as the final indicator for evaluating the temperature uniformity of the entire heat dissipation device. △T nm_c =△T nm +△T nm_ch 1-3

[0124] Temperature compensation design method based on differential distribution of thermal grease:

[0125] Step 1: Based on the deep hole drilling distribution design method based on uniform temperature back calculation, determine the uniform temperature target x of the heat dissipation device. Assuming x = 3K, and considering the positive and negative fluctuation range, the surface temperature difference of the temperature measuring point after removing the thermal grease is 6K.

[0126] Step 2: The final ΔT is determined using the deep hole drilling distribution design method based on isothermal back calculation. nm_avg Using this as a benchmark, a commonly used 1K / Wm thermal grease is selected. Meanwhile, based on 1-2 and 1-3, the ΔT is calculated for all IGBT devices.nm_c The consistent performance was used as the criterion for back-calculating the thermal conductivity of the thermal grease.

[0127] Calculation example: According to the method above, assume △T nm_avg =50K, the corresponding average IGBT loss is Q nm_avg =1000W, the corresponding device contact area is A nm_avg =0.1*0.1m2, b=0.0001m, then the corresponding thermal grease contact temperature rise is ΔT nm_ch_avg =1000*0.0001 / (0.1*0.1*1)=10K; Additionally, assume △T 12 =47K, the corresponding IGBT loss is Q 12 =1500W, the corresponding device contact area is A 12 =0.1*0.2m 2 If b = 0.0001m, then the corresponding thermal grease contact temperature rise ΔT 12_ch =△T nm_avg +△T nm_ch_avg -△T 12 =50 + 10 - 47 = 13K, then the thermal conductivity λ of the thermal grease applied under the IGBT in the first row and second column is . 12 =13*0.1*0.2 / (1500*0.0001)=1.73K / Wm, then the temperature rise ΔT relative to the ambient temperature is measured at the measuring point on the lower surface (contact surface of the heat sink installation) of the IGBT in the first row and second column of the corresponding heat sink. 12_c =△T nm_c_avg =60K, by adjusting the distribution of thermal grease to achieve the goal of uniform temperature throughout the heat dissipation device.

[0128] Besides air cooling, the deep-hole drilling phase change uniform temperature heat dissipation design scheme of this invention is also applicable to other water-cooled and composite heat dissipation devices. The design method of this invention is also applicable to other locomotives, EMUs, and industrial converters.

[0129] The processing methods of the drilling cavity in the deep hole drilling distribution design method based on uniform temperature back calculation of the present invention include, but are not limited to, deep hole drilling. Deep hole drilling is only one implementation method based on the uniform temperature design distribution method. Other feasible processes include, for example, after designing the distribution, using a grooving machine for processing and then welding the whole structure.

[0130] The substrate is drilled with holes to form a vertically and horizontally interconnected phase change cavity, which is an integral structure. Compared with the existing technology of embedding heat pipes into the heat dissipation device substrate, this reduces one layer of contact thermal resistance and is beneficial to enhance heat transfer performance.

[0131] The drilled cavity serves as the internal structure of the heat dissipation device substrate, offering higher reliability and avoiding risks to the reliability of the heat dissipation device, such as deformation caused by thermal stress from long-term alternating hot and cold temperatures during the heat pipe and substrate bonding process, which can affect the contact thermal resistance of the heat dissipation components.

[0132] The interconnected cavity can achieve high isothermal heat transfer in the X and Y directions by relying on the phase change of the internal working fluid. Compared with conventional heat pipes that only enhance high thermal conductivity in the axial direction, the heat transfer effect of simultaneous enhancement in the two-dimensional X and Y directions is better.

[0133] Based on deep hole drilling technology, interconnected cavities are processed on the basis of ordinary heat dissipation devices. The process is simple, low-cost, and highly operable. It can achieve the optimal temperature uniformity of the heat dissipation device according to the distribution position of the device and the difference in heat flux density distribution. The drilling diameter and spacing can be flexibly set, achieving the optimal temperature uniformity target at a relatively low cost, and has good economic benefits.

[0134] Drilling holes inside the substrate can not only improve heat dissipation efficiency compared to the original ordinary heat dissipation device, but also help reduce weight.

[0135] This design provides a deep hole drilling distribution design method based on temperature uniformity calculation to optimize the drilling diameter and spacing. On this basis, a temperature uniformity compensation design method for the differential distribution of thermal grease is added to achieve a better temperature uniformity effect of the heat dissipation device.

[0136] In the embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0137] It should be noted that, in this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element limited by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0138] While the embodiments disclosed in this invention are as described above, the above content is merely for the purpose of facilitating understanding of this invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this invention; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

A temperature equalization and heat dissipation device, wherein, The temperature equalization and heat dissipation device includes a heat dissipation substrate, the upper surface of which is a heat source surface and the lower surface of which is a heat dissipation surface, respectively. A phase change cavity is formed inside the heat dissipation substrate by drilling, wherein the phase change cavity is parallel to the heat source surface and the heat dissipation surface. According to claim 1, the temperature equalization and heat dissipation device, wherein, The phase change cavity includes row phase change cavities distributed along the row direction of the heat source and column phase change cavities distributed along the column direction of the heat source, and the row phase change cavities and the column phase change cavities are interconnected. According to claim 2, the temperature equalization and heat dissipation device, wherein, The heat source surface of the uniform temperature heat dissipation device is provided with multiple heat source areas, each heat source area covers at least one phase change cavity connection area, and the heat source area is provided with a thermally conductive material layer. A method for manufacturing a temperature-regulating heat dissipation device according to any one of claims 1-3, wherein, Includes the following steps: Phase change holes are obtained by drilling holes in the heat dissipation substrate; A phase change working fluid is filled into the phase change orifice; A sealed phase change cavity is obtained by sealing both sides of the phase change hole. A design method for a temperature-regulating heat dissipation device according to any one of claims 1-3, wherein, The method includes the following steps: Arrange all heat sources on the heat dissipation substrate; The maximum temperature rise of each heat source is detected, and the average of the maximum temperature rise of all heat sources is calculated to obtain the average temperature rise. The difference between the maximum temperature rise of each heat source and the average temperature rise is determined to obtain the temperature rise difference of each heat source. Determine whether the temperature rise difference between each heat source is greater than the preset average temperature target value; If the temperature rise difference of at least one heat source is greater than the preset uniform temperature target value, the number and location of the phase change cavities to be set on the heat dissipation substrate are determined based on the ratio of the heat generation power to the heat transfer area of ​​the heat source. According to the design method of the temperature equalization and heat dissipation device according to claim 5, wherein, The method of determining the number and location of phase change cavities to be installed on the heat dissipation substrate based on the ratio of the heat source's heating power to the heat transfer area includes the following steps: Based on the ratio of the sum of the heating power of each row / column heat source to the sum of the heat transfer area of ​​that row / column heat source, a sequence of the ratio of the number of row / column phase change cavities is obtained. Based on the ratio of the maximum number of phase change cavities corresponding to the heat source to the maximum value in the sequence of ratios of the number of phase change cavities in rows / columns, the value of the sequence of ratios of the number of phase change cavities in rows / columns is amplified to obtain the number of phase change cavities to be set in each row / column. The phase change cavities to be installed in each row / column are distributed at equal intervals; The maximum number of phase change cavities corresponding to the heat source is the ratio of the size of the heat source to the thickness of the corresponding position of the heat dissipation substrate. According to the design method of the temperature equalization and heat dissipation device according to claim 6, wherein, The method further includes the following steps: Determine whether the temperature rise difference of each heat source on the heat dissipation substrate with the phase change cavity is greater than the preset uniform temperature target value. If the temperature rise difference of at least one heat source is greater than the preset average temperature target value, the preset average temperature target value is adjusted, and the number and position of the phase change cavities to be set on the heat dissipation substrate are re-determined based on the adjusted preset average temperature target value, until the temperature rise difference of all heat sources is less than or equal to the preset average temperature target value. A design method for a temperature-regulating heat dissipation device according to any one of claims 1-3, wherein, The method includes the following steps: Arrange all heat sources on the heat dissipation substrate; The maximum temperature rise of each heat source is detected, and the average of the maximum temperature rise of all heat sources is calculated to obtain the average temperature rise. Obtain the heating power and heat transfer area of ​​each heat source, as well as the thermal conductivity and thickness of the heat-conducting material; Based on the heating power and heat transfer area of ​​each heat source, as well as the thermal conductivity and thickness of the heat-conducting material, the maximum contact temperature rise generated when each heat source contacts the heat dissipation substrate is determined using the contact temperature rise calculation formula. The thickness of the heat-conducting material between each heat source and the heat dissipation substrate is the same. The difference between the sum of the maximum temperature rise and the maximum contact temperature rise of each heat source and the average temperature rise is determined to obtain the contact temperature rise difference of each heat source. If the contact temperature rise difference of at least one heat source is greater than the preset uniform temperature target value, the heat-conducting material is adjusted until the contact temperature rise difference of all heat sources is less than or equal to the preset uniform temperature target value. The design method of the temperature equalization and heat dissipation device according to claim 8, wherein, The formula for calculating the contact temperature rise includes: △T nm_ch =Q nm b / (λ nm A nm ) Among them, △T nm_ch λ represents the maximum contact temperature rise between the heat source and the heat dissipation device at the position in the nth row and mth column. nm The position in the nth row and mth column corresponds to the thermal conductivity of the heat-conducting material in contact with the heat source and the heat dissipation device; b is the thickness of the heat-conducting material. A computer-readable storage medium having a computer program stored thereon, wherein, When the computer program is executed by a processor, it implements the method of any one of claims 4-9. An electronic device includes a processor and a memory, wherein, The memory stores a computer program, and the processor executes the computer program to implement the method of any one of claims 4-9.

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