Display substrate having light-emitting bottom

Abstract

A display substrate having a light-emitting bottom, comprising a first transparent base layer (401), a driving circuit layer (402), a light-emitting structure layer (403), a packaging layer (404), and a light-shielding layer (405); the driving circuit layer (402) is provided on one side of the first transparent base layer (401); the light-emitting structure layer (403) is provided on the side of the driving circuit layer (402) away from the first transparent base layer (401); the packaging layer (404) is provided on the side of the light-emitting structure layer (403) away from the first transparent base layer (401); the light-shielding layer (405) is provided between the first transparent base layer (401) and the light-emitting structure layer (403); the light-emitting structure layer (403) comprises a plurality of pixel structures; the light-shielding layer (405) comprises a light-shielding structure; at least part of the light-shielding structure extends in a row direction, and the projection of the light-shielding structure on the first transparent base layer (401) is located between the projections of two pixel rows; and / or at least part of the light-shielding structure extends in a column direction, and the projection of the light-shielding structure on the first transparent base layer (401) is located between the projections of two pixel columns.

Description

A bottom-emitting display substrate

[0001] The present application claims priority from the Chinese patent application No. 202410683152.X filed on May 29, 2024 and entitled "A bottom-emitting display substrate", the contents of which should be understood as incorporated by reference into the present application. TECHNICAL FIELD

[0002] Embodiments of the present disclosure relate to, but are not limited to, the technical field of display, and in particular, to a bottom-emitting display substrate. BACKGROUND

[0003] In recent years, OLED (Organic Light-Emitting Diode) display devices have developed rapidly, and flagship models of major mobile phone brands have adopted OLED display screens, and have begun to penetrate into vehicle display applications. Compared with traditional LCD (Liquid Crystal Display) displays, OLED display devices have many advantages such as wide color gamut, bright colors, and the ability to be curved or full-screen, and therefore have been recognized by the majority of consumers.

[0004] In some cases, it is necessary for the display device to have the performance of narrow viewing angle display. Taking a vehicle display as an example, as shown in (a) of FIG. 1, a display is provided on the vehicle console. In the case of driving at night, the display will form a reflection on the windshield, which poses a safety hazard. Therefore, the display needs to have the function of narrow up-down viewing angle to achieve the effect of no reflection as shown in (b) of FIG. 1.

[0005] As shown in FIG. 2, for a display that realizes the entertainment function on the co-pilot, it is hoped that the display will not interfere with the main driver during use. Therefore, it is also necessary to realize the narrow viewing angle of the display.

[0006] SUMMARY

[0007] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0008] Embodiments of the present disclosure provide a bottom-emitting display substrate, comprising: a first transparent substrate layer, a driving circuit layer, a light-emitting structure layer, an encapsulation layer, and a light-shielding layer.

[0009] The driving circuit layer is arranged on one side of the first transparent substrate layer; the light-emitting structure layer is arranged on a side of the driving circuit layer away from the first transparent substrate layer, the encapsulation layer is arranged on a side of the light-emitting structure layer away from the first transparent substrate layer; and the light-shielding layer is arranged between the first transparent substrate layer and the light-emitting structure layer.

[0010] The light-emitting structure layer comprises a plurality of pixel structures arranged along a row direction and a column direction, forming a plurality of pixel rows and a plurality of pixel columns.

[0011] The light-blocking layer comprises a plurality of light-blocking structures, at least part of the light-blocking structures extend along the row direction, and the projection of the light-blocking structures on the first transparent substrate layer is located between the projections of two pixel rows; and / or, at least part of the light-blocking layer comprises a plurality of light-blocking structures, the light-blocking structures extend along the column direction, and the projection of the light-blocking structures on the first transparent substrate layer is located between the projections of two pixel columns.

[0012] In an exemplary embodiment, the light-emitting structure layer comprises: a transparent electrode layer, an electroluminescent layer, a reflective electrode layer, a pixel defining layer.

[0013] The transparent electrode layer is arranged on the side of the driving circuit layer away from the first transparent substrate layer, the electroluminescent layer is arranged on the side of the transparent electrode layer away from the first transparent substrate layer, and the reflective electrode layer is arranged on the side of the electroluminescent layer away from the first transparent substrate layer; the pixel defining layer is arranged between the transparent electrode layer and the electroluminescent layer, and the pixel defining layer defines the transparent electrode layer, the electroluminescent layer, and the reflective electrode layer as the plurality of pixel structures.

[0014] In an exemplary embodiment, a planarization layer is further arranged between the driving circuit layer and the light-emitting structure layer, and the light-blocking structures are arranged between the driving circuit layer and the planarization layer.

[0015] In an exemplary embodiment, a second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and the light-blocking structures are arranged between the first transparent substrate layer and the second transparent substrate layer.

[0016] In an exemplary embodiment, the light-blocking layer comprises a first light-blocking layer and a second light-blocking layer.

[0017] A planarization layer is further arranged between the driving circuit layer and the light-emitting structure layer, and the light-blocking structures of the first light-blocking layer are arranged between the driving circuit layer and the planarization layer; a second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and the light-blocking structures of the second light-blocking layer are arranged between the first transparent substrate layer and the second transparent substrate layer.

[0018] In an exemplary embodiment, a second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and a through hole penetrating through the second transparent substrate layer in thickness is arranged on the second transparent substrate layer, and the light-blocking structures are located in the through hole.

[0019] In an exemplary embodiment, a first transparent isolation layer is further arranged between the first transparent substrate layer and the second transparent substrate layer.

[0020] In an exemplary embodiment, a second transparent isolation layer is further arranged between the second transparent substrate layer and the driving circuit layer, and the through hole further penetrates the second transparent isolation layer.

[0021] In an exemplary embodiment, a projection of the light-shielding structure on the first transparent substrate layer is within a projection range of the pixel defining layer on the first transparent substrate layer.

[0022] In an exemplary embodiment, the pixel defining layer is a black pixel defining layer.

[0023] In an exemplary embodiment, the light-shielding structure is made by exposing and developing a black photosensitive material.

[0024] In an exemplary embodiment, the second transparent isolation layer is made by exposing and developing, and the second transparent substrate layer is made by etching with the second transparent isolation layer as a hard mask.

[0025] In an exemplary embodiment, the thickness of the light-shielding layer is between 1.5um and 2.5um.

[0026] In an exemplary embodiment, the thickness of the second transparent substrate layer is between 3um and 20um.

[0027] The present disclosure further provides a manufacturing method of a bottom-emitting display substrate, comprising:

[0028] forming a first transparent substrate layer;

[0029] forming a driving circuit layer, the driving circuit layer being arranged on one side of the first transparent substrate layer;

[0030] forming a light-emitting structure layer, the light-emitting structure layer being arranged on a side of the driving circuit layer away from the first transparent substrate layer, the light-emitting structure layer comprising a plurality of pixel structures arranged along a row direction and a column direction to form a plurality of pixel rows and a plurality of pixel columns;

[0031] forming an encapsulation layer, the encapsulation layer being arranged on a side of the light-emitting structure layer away from the first transparent substrate layer;

[0032] forming a light-shielding layer disposed between the first transparent substrate layer and the light-emitting structure layer, the light-shielding layer comprising a plurality of light-shielding structures, at least part of the light-shielding structures extending in a row direction, and a projection of the light-shielding structures on the first transparent substrate layer being located between projections of two pixel rows; and / or, at least part of the light-shielding layer comprising a plurality of light-shielding structures, the light-shielding structures extending in a column direction, and a projection of the light-shielding structures on the first transparent substrate layer being located between projections of two pixel columns.

[0033] In an exemplary embodiment, forming the light-emitting structure layer comprises forming a transparent electrode layer, an electroluminescent layer, a reflective electrode layer, and a pixel defining layer of the light-emitting structure layer;

[0034] The transparent electrode layer is disposed on a side of the driving circuit layer distal to the first transparent substrate layer, the electroluminescent layer is disposed on a side of the transparent electrode layer distal to the first transparent substrate layer, the reflective electrode layer is disposed on a side of the electroluminescent layer distal to the first transparent substrate layer; the pixel defining layer is disposed between the transparent electrode layer and the electroluminescent layer, and the pixel defining layer defines the transparent electrode layer, the electroluminescent layer, and the reflective electrode layer as the plurality of pixel structures.

[0035] In an exemplary embodiment, the method further comprises:

[0036] forming a planarization layer between the driving circuit layer and the light-emitting structure layer, the light-shielding structures being disposed between the driving circuit layer and the planarization layer.

[0037] In an exemplary embodiment, the method further comprises:

[0038] forming a second transparent substrate layer between the driving circuit layer and the first transparent substrate layer, the light-shielding structures being disposed between the first transparent substrate layer and the second transparent substrate layer.

[0039] In an exemplary embodiment,

[0040] forming the light-shielding layer comprises forming a first light-shielding layer and a second light-shielding layer of the light-shielding layer;

[0041] The manufacturing method further comprises forming a planarization layer between the driving circuit layer and the light-emitting structure layer, wherein the light-shielding structures of the first light-shielding layer are disposed between the driving circuit layer and the planarization layer;

[0042] The manufacturing method further comprises forming a second transparent substrate layer between the driving circuit layer and the first transparent substrate layer, wherein the light-shielding structures of the second light-shielding layer are disposed between the first transparent substrate layer and the second transparent substrate layer.

[0043] The display device provided by the embodiments of the present disclosure comprises the bottom emission display substrate provided by the embodiments of the present disclosure.

[0044] Other aspects can become apparent after consideration of the drawing and detailed description.

[0045] SUMMARY

[0046] FIG. 1 is a schematic diagram of a scenario in which a vehicle display forms a reflection on a windshield;

[0047] FIG. 2 is a schematic diagram of a viewing angle of a vehicle display;

[0048] FIG. 3(a) is a cross-sectional view of a narrow viewing angle display substrate in the related art;

[0049] FIG. 3(b) is a cross-sectional view of another narrow viewing angle display substrate in the related art;

[0050] FIG. 4 is a cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0051] FIG. 5 is a schematic diagram of a viewing angle of the bottom emission display substrate in FIG. 4 provided by the embodiments of the present disclosure;

[0052] FIG. 6(a) is a top view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0053] FIG. 6(b) is another top view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0054] FIG. 6(c) is a third top view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0055] FIG. 7 is a second cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0056] FIG. 8 is a third cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0057] FIG. 9 is a fourth cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0058] FIG. 10 is a fifth cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0059] FIG. 11 is a sixth cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0060] FIG. 12 is a seventh cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0061] FIG. 13 is an eighth cross-sectional view of a bottom emission display substrate provided by the embodiments of the present disclosure;

[0062] FIG. 14 is a ninth cross-sectional view of a bottom-emitting display substrate according to embodiments of the present disclosure.

[0063] DETAILED DESCRIPTION

[0064] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art based on the present disclosure shall fall within the scope of the present disclosure.

[0065] The embodiments in the present disclosure and the features in the embodiments can be combined with each other as long as there is no conflict.

[0066] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall be understood as the general meaning understood by those skilled in the art in the field of the present disclosure. The terms "first", "second", and similar terms used in the present disclosure do not represent any order, number, or importance, but are only used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects before the terms cover the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "up", "down", "left", "right", and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects change, the relative positional relationships may also change accordingly.

[0067] In order to realize narrow viewing angle display of display devices, it is usually necessary to purchase expensive LCF (Light Control Film) films.

[0068] In addition, some display panel manufacturers have developed a technical solution that adds 4 to 6 masks (mask plates) in OLED displays to replace the purchased LCF films with 4 to 6 layers of organic films. The following will illustrate this related art technical solution with reference to FIGS. 3(a) and 3(b).

[0069] FIGS. 3(a) and 3(b) respectively show two different structures of OLED displays realized by the related art technical solution. Such OLED displays are generally prepared by the following process:

[0070] A1: A conventional TFT (Thin Film Transistor) layer 302 is prepared on a base layer 301, then a planarization layer 303 is prepared on the TFT layer 302, an electrode layer 304 and a pixel defining layer 305 are prepared on the planarization layer 303, and evaporation of an electroluminescent layer 306 and encapsulation of an encapsulation layer 307 are performed.

[0071] The electrode layer 304 is generally an ITO / Ag / ITO (Indium Tin Oxide / Silver / Indium Tin Oxide) layer.

[0072] A2: A black light shielding layer 308 is prepared on the encapsulation layer 307, then an organic planarization layer 309 as thick as possible is prepared, and the thickness of the organic planarization layer 309 is preferably 3-10 um.

[0073] The thickness of the organic planarization layer 309 directly determines the distance between the black light shielding layer 310 and the black light shielding layer 308, and directly affects the viewing angle of the display. The maximum thickness of a single layer of the currently mass-produced material can reach 4 um.

[0074] A3: A black light shielding layer 310 is prepared on the organic planarization layer 309, and an organic planarization layer 311 is prepared on the black light shielding layer 310.

[0075] For the structure shown in FIG. 3(a), the purpose of the organic planarization layer 311 is to planarize the black light shielding layer 310, so as to have a complete surface when performing a module bonding process, and the thickness can be 2 um.

[0076] According to different requirements for the viewing angle, a black light shielding layer 312 and a corresponding organic planarization layer 313 can be further added to the structure shown in FIG. 3(a), to obtain the structure shown in FIG. 3(b).

[0077] It can be seen that this technical solution is only applicable to a top-emitting display device, and the structure shown in FIG. 3(a) increases 4 masks on the basis of a conventional product, and the structure shown in FIG. 3(b) increases 6 masks on the basis of a conventional product. The number of masks to be increased is too large, the structure is complex, and the preparation cost is high.

[0078] The bottom-emitting display substrate provided in the embodiments of the present disclosure can realize narrow viewing angle display, and has the advantages of simple structure, low preparation cost, etc.

[0079] FIG. 4 is a cross-sectional view of a bottom-emitting display substrate provided in the embodiments of the present disclosure, referring to FIG. 4, the bottom-emitting display substrate comprises a first transparent base layer 401, a driving circuit layer 402, a light-emitting structure layer 403, an encapsulation layer 404, and a light shielding layer 405.

[0080] The driving circuit layer 402 is arranged on one side of the first transparent substrate layer 401; the light-emitting structure layer 403 is arranged on the side of the driving circuit layer 402 away from the first transparent substrate layer 401; the encapsulation layer 404 is arranged on the side of the light-emitting structure layer away from the first transparent substrate layer 401; and the light-shielding layer 405 is arranged between the first transparent substrate layer 401 and the light-emitting structure layer 403.

[0081] The driving circuit layer 402 can be understood as a TFT layer.

[0082] In addition, the film layer is transparent in the embodiments of the present disclosure, which means that the light transmittance of the film layer exceeds a preset value. The preset value can be determined according to actual needs, for example, can be set to 80%, 85% or 90%.

[0083] In an exemplary embodiment, the bottom-emitting display substrate provided by the illustrative embodiments of the present disclosure adopts a bottom-emitting design, that is, the light emitted by the light-emitting structure layer 403 will sequentially pass through the driving circuit layer 402 and the first transparent substrate layer 401, and finally be emitted from the bottom of the first transparent substrate layer 401.

[0084] In order to realize the bottom-emitting function of the display substrate, in a possible implementation manner, the light-emitting structure layer 403 can include a transparent electrode layer 4031, an electroluminescent layer 4032, a reflective electrode layer 4033 and a pixel definition layer 4034.

[0085] The transparent electrode layer 4031 is arranged on the side of the driving circuit layer 402 away from the first transparent substrate layer 401; the electroluminescent layer 4032 is arranged on the side of the transparent electrode layer 4031 away from the first transparent substrate layer 401; the reflective electrode layer 4033 is arranged on the side of the electroluminescent layer 4032 away from the first transparent substrate layer 401; and the pixel definition layer 4034 is arranged between the transparent electrode layer 4031 and the electroluminescent layer 4032.

[0086] In an exemplary embodiment, the pixel definition layer 4034 is provided with a plurality of pixel openings, and the transparent electrode layer 4031 and the electroluminescent layer 4032 are both arranged in the pixel openings. Based on this, the pixel definition layer 4034 defines the transparent electrode layer 4031, the electroluminescent layer 4032 and the reflective electrode layer 4033 into a plurality of pixel structures. According to the color of the electroluminescent layer 4032, these pixel structures can be pixel structures of different colors, as shown in FIG. 4, in which red pixel structures R, green pixel structures G and blue pixel structures B are shown.

[0087] In an exemplary embodiment, the light emitted by the electroluminescent layer 4032 is reflected by the reflective electrode layer 4033, and then emitted from the light-emitting structure layer 403 on the side of the transparent electrode layer 4031, and finally emitted from the first transparent substrate layer 401, thereby realizing the bottom light-emitting function.

[0088] In an exemplary implementation, a planarization layer 406 is usually arranged between the driving circuit layer 402 and the light-emitting structure layer 403.

[0089] In order to control the viewing angle of the bottom light-emitting display substrate, the present embodiment further provides a light-blocking layer 405 between the first transparent substrate layer 401 and the light-emitting structure layer 403, and a plurality of light-blocking structures contained in the light-blocking layer 405 block part of the light emitted by the light-emitting structure layer 403, so as to limit the angle of the light emitted from the first transparent substrate layer 401, thereby realizing the narrow viewing angle display of the display substrate.

[0090] Referring to FIG. 4, taking the pixel structure R as an example, part of the light emitted by the pixel structure R is blocked by the light-blocking structure and cannot be emitted outside the display substrate, and the same applies to the light emitted by the pixel structures G and B. As can be seen from FIG. 5, the human eye at a small viewing angle a can receive the light emitted by the display substrate, while the human eye at a large viewing angle b cannot receive the light emitted by the display substrate, so that the viewing angle of the display substrate is limited, thereby realizing the narrow viewing angle display.

[0091] The arrangement of the light-blocking structure will be described in detail below in combination with exemplary examples:

[0092] In an exemplary embodiment, the pixel structures in the light-emitting structure layer 403 are arranged along the row direction and the column direction, thereby forming a plurality of pixel rows and a plurality of pixel columns. Referring to FIGS. 6(a), 6(b) and 6(c), which show several different top views of the display substrate provided by the present embodiment, and show the distribution of the light-blocking structure (black area in the figure) and the pixel structures R, G and B, it can be seen that the pixel structures form three pixel rows and three pixel columns. In actual application, the light-blocking structure can be arranged in the manner of FIGS. 6(a), 6(b) or 6(c) according to actual needs, thereby realizing the directional control of the viewing angle.

[0093] Referring to FIG. 6(a), the light shielding structure extends along the row direction, and the projection of the light shielding structure on the first transparent substrate layer 401 is located between the projections of two pixel rows. It can be understood in combination with the illustrations of FIG. 4 and FIG. 5 that, in the case where the light shielding structure adopts the arrangement of FIG. 6(a), compared with the display substrate without the light shielding structure, the visual angle of the display substrate in the row direction is unchanged, and the visual angle in the column direction is limited, which is suitable for application scenarios where the visual angle of the display in the up-down direction needs to be controlled. For example, the display substrate provided in FIG. 4 can be applied to the display illustrated in (a) of FIG. 1, and the light shielding structure is designed to be arranged in the manner of FIG. 6(a), so that the visual angle of the display in the up-down direction is limited, and in the case of night driving, no reflection is formed on the windshield, which can achieve the effect shown in (b) of FIG. 1.

[0094] Referring to FIG. 6(b), the light shielding structure extends along the column direction, and the projection of the light shielding structure on the first transparent substrate layer 401 is located between the projections of two pixel rows. It can be understood in combination with the illustrations of FIG. 4 and FIG. 5 that, in the case where the light shielding structure adopts the arrangement of FIG. 6(b), compared with the display substrate without the light shielding structure, the visual angle of the display substrate in the column direction is unchanged, and the visual angle in the row direction is limited, which is suitable for application scenarios where the visual angle of the display in the horizontal direction needs to be controlled. For example, the display substrate provided in FIG. 4 can be applied to the display illustrated in FIG. 2, and the light shielding structure is designed to be arranged in the manner of FIG. 6(b), so that the visual angle of the display in the horizontal direction is limited, and the content displayed by the display does not interfere with the main driver.

[0095] Referring to FIG. 6(c), the light shielding structure extends along the row direction and the column direction, and the projection of the light shielding structure on the first transparent substrate layer 401 is located between the projections of two pixel rows in the row direction and between the projections of two pixel columns in the column direction. It can be understood in combination with the illustrations of FIG. 4 and FIG. 5 that, in the case where the light shielding structure adopts the arrangement of FIG. 6(c), compared with the display substrate without the light shielding structure, the visual angle of the display substrate in the row direction and the visual angle in the column direction are both limited, which is suitable for application scenarios where the visual angle of the display in the horizontal direction and the up-down direction needs to be controlled. For example, when neither the display used to realize the entertainment function of the co-driver nor the display forms a reflection on the windshield in the case of night driving, the display substrate provided in FIG. 4 can be applied to the display, and the light shielding structure is designed to be arranged in the manner of FIG. 6(c).

[0096] The above describes how to control the orientation of the viewing angle of the display substrate, and the size of the viewing angle can be controlled by adjusting the distance between the light shielding layer 405 and the electroluminescent layer 4032, and the relative position relationship between the light shielding structure in the light shielding layer 405 and the boundary of the pixel opening region in the pixel defining layer 4034. In a possible implementation, when a plurality of light shielding layers are further arranged between the first transparent bottom substrate layer 401 and the driving circuit layer 402, the distance between each light shielding layer and the electroluminescent layer 4032 will affect the size of the viewing angle.

[0097] In a possible implementation, the projection of the light shielding structure on the first transparent substrate layer 401 is located within the projection range of the pixel defining layer 4034 on the first transparent substrate layer 401. In an exemplary embodiment, the projection of the pixel defining layer 4034 on the first transparent substrate layer 401 can be the projection of the non-pixel opening region in the pixel defining layer 4034. Therefore, by setting the projection of the light shielding structure on the first transparent substrate layer 401 to be located within the projection range of the pixel defining layer 4034 on the first transparent substrate layer 401, it can be ensured that the light shielding structure does not block the light emitted by the pixel structure along the direction perpendicular to the surface of the first transparent substrate layer 401, and the light shielding structure does not affect the normal display of the display substrate.

[0098] According to different requirements for the viewing angle, the light shielding layer can be arranged on the side of the driving circuit layer 402 away from the first transparent substrate layer 401, or between the driving circuit layer 402 and the first transparent substrate layer 401, or both. The following exemplary embodiments will be described in detail.

[0099] In an exemplary embodiment, the light shielding layer 405 needs to be separated from the light emitting structure layer 403 by a certain distance to ensure that the light shielding layer 405 can achieve a better effect of limiting the viewing angle and facilitate the control of the size of the viewing angle, which is the purpose of arranging the organic planarization layer 309 in the structure shown in FIG. 3(a). Moreover, since the structure shown in FIG. 3(a) is a top-emitting device, after the black light shielding layer 310 is arranged on the light-emitting side of the device, it is necessary to further prepare the organic planarization layer 311 on the black light shielding layer 310 as the outermost layer of the display substrate, which results in too many additional film layers in the conventional display substrate structure.

[0100] The bottom-emitting display substrate provided by the embodiments of the present disclosure adopts a bottom-emitting design, and the light emitted by the light-emitting structure layer 403 will sequentially pass through the driving circuit layer 402 and the first transparent substrate layer 401 and finally be emitted from the first transparent substrate layer 401. Therefore, the light-shielding layer 405 is arranged between the light-emitting structure layer 403 and the first transparent substrate layer 401, so that the viewing angle of the bottom-emitting display substrate can be narrowed. Moreover, when the distance between the light-shielding layer 405 and the light-emitting structure layer 403 is controlled or the light-shielding layer 405 is planarized, the film layer structure originally arranged on the light-emitting side of the light-emitting structure layer 403 can be reused, the number of film layers that need to be additionally arranged in the conventional display substrate structure is small, the structure is simple, and the preparation cost is low.

[0101] The film layer structure of the bottom-emitting display substrate provided by the embodiments of the present disclosure will be described below in combination with exemplary embodiments.

[0102] As shown in FIG. 4, the light-shielding structure of the light-shielding layer 405 is arranged between the driving circuit layer 402 and the planarization layer 406.

[0103] As can be seen, for the display substrate shown in FIG. 4, the light emitted by the electroluminescent layer 4032 will be transmitted to the planarization layer 406 through the transparent electrode layer 4031, a part of the light entering the planarization layer 406 will be shielded by the light-shielding layer 405, the remaining light will further enter the driving circuit layer 402 and finally be emitted from the first transparent substrate layer 401, so that the narrow-viewing-angle display of bottom emission is realized.

[0104] The preparation process of the display substrate shown in FIG. 4 will be described below, including the following steps.

[0105] B1: preparing the driving circuit layer 402 on the first transparent substrate layer 401 and preparing the light-shielding layer 405 above the driving circuit layer 402.

[0106] The first transparent substrate layer 401 can be a conventional glass substrate or a transparent flexible substrate, which is selected according to actual needs.

[0107] For example, the light-shielding layer 405 can be prepared by coating a photoresist on a black photosensitive material and through an exposure and development process. For example, the black photosensitive material can adopt PSPI (Photosensitive Polyimide, photosensitive polyimide). Alternatively, the light-shielding layer 405 can be prepared by patterning a black metal.

[0108] In an exemplary embodiment, the driving circuit layer 402 can include various structures constituting a TFT (Thin Film Transistor), for example, can include a gate, a source-drain 4021 (shown in FIG. 7), an active region (Source), and the like, in one example, the wires associated with the TFT can be arranged in the driving circuit layer 402, and the arrangement manner can refer to the related art, which is not specifically limited in the present disclosure. Generally, the source-drain 4021 is an opaque metal structure, and therefore in the display substrate shown in FIG. 7, in order to prevent the source-drain 4021 from blocking light, the position of the source-drain 4021 can coincide with the position of the light shielding structure in the direction perpendicular to the display substrate, that is, the first projection (the projection of the source-drain 4021 on the first transparent base layer 401) is inside the second projection (the projection of the light shielding structure on the first transparent base layer 401).

[0109] In a possible implementation, the thickness of the light shielding layer 405 is between 1.5 um and 2.5 um.

[0110] B2: Prepare a planarization layer 406.

[0111] In an exemplary embodiment, the preparation of the planarization layer 406 is related to the arrangement of the source-drain 4021 in the driving circuit layer 402. The example of FIG. 4 is a single SD (source-drain) 4021 structure, and therefore only one layer of planarization layer is arranged, and exemplarily, the thickness of the planarization layer 406 can be between 1.5 um and 3 um. According to the different thicknesses of products, the thickness of the planarization layer to be prepared is different, for example, for a 3SD device, three layers of planarization layers are needed to be stacked at this step, and the thickness of each layer is between 1.5 um and 3 um, and the total thickness will reach 4.5 um to 9 um.

[0112] It can be seen that in the embodiment of the present disclosure, the planarization layer 406 plays a basic role of planarizing the SD, and additionally plays a role of planarizing the light shielding layer 405.

[0113] B3: Prepare a pixel defining layer 4034 and a transparent electrode layer 4031 on the planarization layer 406.

[0114] Exemplarily, the transparent electrode layer can adopt ITO (indium tin oxide) material.

[0115] B4: Evaporate an electroluminescent layer 4032, a reflective electrode layer 4033, and encapsulate with an encapsulation layer 404, and the preparation of the display substrate is completed.

[0116] Exemplarily, the reflective electrode layer 4033 can adopt Ag (silver) material.

[0117] Based on the description of B1 to B4, it can be seen that the scheme provided in FIG. 4 only needs to add one mask to the traditional product structure, and different application scenarios of flexibility and rigidity can be achieved according to the selection of the substrate layer material.

[0118] In a possible implementation, to further guarantee the narrowing effect on the viewing angle of the display substrate, on the basis of the bottom-emitting display substrate shown in FIG. 4, the pixel defining layer 4034 can be further prepared by using black material, so that the pixel defining layer 4034 is specifically a black pixel defining layer. The structure of the obtained bottom-emitting display substrate is specifically shown in FIG. 8. The display substrate shown in FIG. 8 is different from the display substrate shown in FIG. 4 only in the color of the pixel defining layer 4034, and therefore specific reference can be made to the foregoing description with reference to FIG. 4.

[0119] FIG. 9 is another cross-sectional view of a bottom-emitting display substrate provided by an embodiment of the present disclosure. Referring to FIG. 9, the bottom-emitting display substrate includes a first transparent substrate layer 901, a driving circuit layer 902, a light-emitting structure layer 903, an encapsulation layer 904, and a planarization layer 906, where the light-emitting structure layer 903 includes a transparent electrode layer 9031, an electroluminescent layer 9032, a reflective electrode layer 9033, and a pixel defining layer 9034. The above-mentioned film layer structure corresponds to the film layer structure shown in FIG. 4, and specific reference can be made to the foregoing description.

[0120] Further, the bottom-emitting display substrate further includes a light-blocking layer 905 arranged between the driving circuit layer 902 and the first transparent substrate layer 901. In an exemplary embodiment, in the bottom-emitting display substrate shown in FIG. 9, a second transparent substrate layer 907 is further arranged between the first transparent substrate layer 901 and the driving circuit layer 902, and the light-blocking structure of the light-blocking layer 905 is specifically arranged between the first transparent substrate layer 901 and the second transparent substrate layer 907.

[0121] In a possible implementation, a first transparent isolation layer 908 can be arranged between the first transparent substrate layer 901 and the second transparent substrate layer 907.

[0122] For the display substrate shown in FIG. 9, the light emitted by the electroluminescent layer 9032 will reach the second transparent substrate layer 907 after sequentially passing through the transparent electrode layer 9031, the planarization layer 906, and the driving circuit layer 902. The light-blocking layer 905 blocks part of the light entering the second transparent substrate layer 907, and the remaining light further enters the first transparent substrate layer 901 and is finally emitted from the bottom of the first transparent substrate layer 901, thereby realizing narrow-viewing-angle bottom-emitting display.

[0123] The preparation process of the display substrate shown in FIG. 9 is described below, including the following steps:

[0124] C1: Prepare the first transparent substrate layer 901, and prepare the inorganic first transparent isolation layer 908 on the first transparent substrate layer 901.

[0125] In this step, whether to prepare the first transparent isolation layer 908 can be selected according to actual needs.

[0126] The first transparent substrate layer 901 can be a conventional glass substrate or a flexible substrate, which can be selected according to actual needs. For example, the first transparent substrate layer 901 can adopt a CPI (Polyimide, polyimide) material.

[0127] C2: Prepare the light shielding layer 905 on the first transparent isolation layer 908, and prepare the second transparent substrate layer 907 thereon for planarization.

[0128] The preparation of the light shielding layer 905 is similar to the preparation of the light shielding layer 405, which can be directly patterned by an exposure and development process on a black photosensitive material, or can be patterned and prepared using a black metal material.

[0129] For example, since the light shielding layer 905 needs to be planarized by the second transparent substrate layer 907, in order to facilitate the preparation of the second transparent substrate layer 907, the second transparent substrate layer 907 can specifically adopt a CPI material, and in this step, the preparation of the second transparent substrate layer 907 can be achieved by coating the CPI material on the light shielding layer 905 and curing.

[0130] The thickness of the second transparent substrate layer 907 can be adjusted according to the required optical viewing angle. For example, the thickness of the second transparent substrate layer 907 can be between 3um and 20um.

[0131] C3: Prepare the driving circuit layer 902, the planarization layer 906, and prepare the pixel defining layer 9034 and the transparent electrode layer 9031 on the planarization layer 906.

[0132] Step C3 can refer to the previous description of B2 and B3.

[0133] C4: Evaporate the electroluminescent layer 9032, the reflective electrode layer 9033, and encapsulate with the encapsulation layer 904, and the display substrate preparation is completed.

[0134] Based on C1 to C4, it can be seen that the scheme provided in FIG. 9 only needs to add one Mask to the traditional product structure, and different application scenarios of flexibility and rigidity can be achieved according to the selected substrate layer material.

[0135] In a possible implementation, to further guarantee the narrowing effect on the viewing angle of the display substrate, on the basis of the bottom-emitting display substrate shown in FIG. 8, the pixel defining layer 9034 can be further prepared by using black material, so that the pixel defining layer 9034 is specifically a black pixel defining layer. The structure of the obtained bottom-emitting display substrate is specifically as shown in FIG. 10. The display substrate shown in FIG. 10 is different from the display substrate shown in FIG. 9 only in the color of the pixel defining layer 9034, and thus specific reference can be made to the foregoing description with reference to FIG. 9.

[0136] FIG. 11 is another cross-sectional view of a bottom-emitting display substrate provided by an embodiment of the present disclosure. Referring to FIG. 10, the display substrate includes a first transparent substrate layer 1101, a driving circuit layer 1102, a light-emitting structure layer 1103, an encapsulation layer 1104, a planarization layer 1106, a second transparent substrate layer 1107, and a first transparent isolation layer 1108. The light-emitting structure layer 1103 includes a transparent electrode layer 11031, an electroluminescent layer 11032, a reflective electrode layer 11033, and a pixel defining layer 11034. The above-mentioned film layer structure corresponds to the film layer structure shown in FIG. 9, and thus specific reference can be made to the foregoing description.

[0137] In addition, in the display substrate shown in FIG. 11, an optical shielding layer is arranged on the side of the driving circuit layer 1102 away from the first transparent substrate layer 1101 and between the first transparent substrate layer 1101 and the driving circuit layer 1102. To distinguish the two optical shielding layers, the two optical shielding layers are respectively denoted as an optical shielding layer 11051 and an optical shielding layer 11052.

[0138] On this basis, the optical shielding structure of the optical shielding layer 11051 is arranged between the driving circuit layer 1102 and the planarization layer 1106, and the optical shielding structure of the optical shielding layer 11052 is arranged between the first transparent substrate layer 1101 and the second transparent substrate layer 1107.

[0139] For the display substrate shown in FIG. 11, the light emitted by the electroluminescent layer 11032 will enter the planarization layer 1106 after passing through the transparent electrode layer 11031. The optical shielding layer 11051 shields part of the light entering the planarization layer 1106, and the remaining light further enters the second transparent substrate layer 1107 through the driving circuit layer 1102. The optical shielding layer 11052 shields part of the light entering the second transparent substrate layer 1107 again, and the remaining light further enters the first transparent substrate layer 1101 and is emitted from the bottom of the first transparent substrate layer 1101, thereby achieving narrow-viewing-angle bottom-emitting display.

[0140] The preparation process of the display substrate shown in FIG. 11 is described below and includes the following steps.

[0141] D1: a first transparent substrate layer 1101 is prepared, and an inorganic first transparent isolation layer 1108 is prepared on the first transparent substrate layer 1101.

[0142] This step can refer to the foregoing description for C1.

[0143] D2: a light-blocking layer 11052 is prepared on the first transparent isolation layer 1108, and a second transparent substrate layer 1107 is prepared thereon and planarized.

[0144] This step can refer to the foregoing description for C2.

[0145] D3: a driving circuit layer 1102 is prepared, and a light-blocking layer 11051 is prepared on the driving circuit layer 1102.

[0146] The preparation of the light-blocking layer 11051 can refer to the foregoing description for B1.

[0147] D4: a planarization layer 1106 is prepared, and a pixel definition layer 11034 and a transparent electrode layer 11031 are prepared on the planarization layer 1106.

[0148] Step C3 can refer to the foregoing description for B2 and B3.

[0149] D5: an electroluminescent layer 11032 and a reflective electrode layer 11033 are evaporated, and an encapsulation layer 1104 is used for encapsulation, and the display substrate is prepared.

[0150] Based on the description of D1 to D5, it can be seen that the scheme of FIG. 11 only needs to add two masks to the traditional product structure, and different application scenarios of flexibility and rigidity can be realized according to the selection of the substrate layer material.

[0151] In a possible implementation, in order to further guarantee the narrowing effect of the viewing angle of the display substrate, on the basis of the bottom-emitting display substrate shown in FIG. 11, the pixel definition layer 11034 can be further prepared by using black material, so that the pixel definition layer 11034 is specifically a black pixel definition layer. The structure of the obtained bottom-emitting display substrate is specifically as shown in FIG. 12. The display substrate shown in FIG. 12 is only different from the display substrate shown in FIG. 11 in that the color of the pixel definition layer 11034, and therefore can refer to the foregoing description for FIG. 11.

[0152] FIG. 13 is another cross-sectional view of a bottom-emitting display substrate according to an embodiment of the present disclosure. Referring to FIG. 13, the display substrate includes a first transparent substrate layer 1301, a drive circuit layer 1302, a light-emitting structure layer 1303, an encapsulation layer 1304, a planarization layer 1306, a second transparent substrate layer 1307, and a first transparent isolation layer 1308. The light-emitting structure layer 1303 includes a transparent electrode layer 13031, an electroluminescent layer 13032, a reflective electrode layer 13033, and a pixel definition layer 13034. The above-mentioned film layer structure corresponds to the film layer structure shown in FIG. 8, and reference can be made to the foregoing description.

[0153] In the bottom-emitting display substrate shown in FIG. 13, the second transparent substrate layer 1307 is provided with a through hole penetrating the second transparent substrate layer 1307 in thickness, the light shielding layer 1305 is provided in the same layer as the second transparent substrate layer 1307, and the light shielding structure of the light shielding layer 1305 is located in the through hole. In an exemplary embodiment, the thickness of the second transparent substrate layer 1307 can be between 3 um and 20 um according to different optical viewing angles to be achieved, and thus it can be seen that there is a deep black light shielding layer sidewall in the display substrate shown in FIG. 13.

[0154] In addition, a second transparent isolation layer 1309 is further provided between the second transparent substrate layer 1307 and the drive circuit layer 1302, which can be used to assist in the preparation of the light shielding layer 1305, and its purpose will be described later. In this case, the through hole penetrating the second transparent substrate layer 1307 mentioned in the foregoing penetrates the second transparent isolation layer 1309, and the light shielding structure of the light shielding layer 1305 is filled in the through hole.

[0155] For the display substrate shown in FIG. 13, the light emitted by the electroluminescent layer 13032 will reach the second transparent substrate layer 1307 after sequentially passing through the transparent electrode layer 13031, the planarization layer 1306, and the drive circuit layer 1302. The light shielding layer 1305 blocks part of the light irradiating the second transparent substrate layer 1307, and the remaining light further enters the first transparent substrate layer 1301 and is finally emitted from the bottom of the first transparent substrate layer 1301, realizing bottom-emitting narrow viewing angle display.

[0156] The preparation process of the display substrate shown in FIG. 13 is described below, including the following steps:

[0157] E1: An inorganic first transparent isolation layer 1308 is prepared on the first transparent substrate layer 1301.

[0158] In this step, whether to prepare the first transparent isolation layer 1308 can be selected according to actual needs.

[0159] The first transparent substrate layer 1301 can be a conventional glass substrate or a flexible substrate, for example, a CPI material can be used.

[0160] E2: A second transparent substrate layer 1307 is prepared on the first transparent isolation layer 1308, and a second transparent isolation layer 1309 is prepared on the second transparent substrate layer 1307.

[0161] For example, the second transparent substrate layer 1307 can be a CPI material, and as described above, the thickness of the second transparent substrate layer 1307 can be between 3um and 20um according to the optical viewing angle to be achieved.

[0162] For example, the second transparent isolation layer 1309 can be a transparent inorganic material such as SiO (silicon monoxide), SiNx (silicon nitride), etc.

[0163] E3: The second transparent isolation layer 1309 is patterned by exposure and development, and the second transparent isolation layer 1309 is used as a hard mask to etch the second transparent substrate layer 1307, forming a deep hole (i.e. the aforementioned through hole) that cannot be achieved by conventional processes, and filling the deep hole with a black light-shielding material to form the light-shielding structure included in the light-shielding layer 1305.

[0164] In an exemplary embodiment, the depth of the deep hole that can be achieved by the above process is above 3um, and can reach a maximum of 20um.

[0165] Furthermore, the above process does not require the black light-shielding material to be photosensitive, so many conventional black organic materials can be used to fill the deep hole.

[0166] In an exemplary embodiment, after filling the deep hole in the second transparent substrate layer 1307 and the second transparent isolation layer 1309 with the black light-shielding material, the surface of the light-shielding layer 1305 and the second transparent isolation layer 1309 on the light side can have microscopic unevenness. Thus, in a possible implementation, as shown in Figure 14, after the filling of the black light-shielding material is completed, an organic layer 1310 can be further prepared to achieve planarization processing of the light-shielding layer 1305 and the second transparent isolation layer 1309.

[0167] For example, a CPI material can be used to prepare the organic layer 1310, i.e. after the filling of the black light-shielding material is completed, the CPI material is coated on the light-shielding layer 1305 and the second transparent isolation layer 1309 to completely planarize the uneven microscopic morphology.

[0168] E4: prepare the driving circuit layer 1302, the planarization layer 1306, and the pixel definition layer 13034 and the transparent electrode layer 13031 on the planarization layer 1306.

[0169] E5: evaporate the electroluminescent layer 13032, the reflective electrode layer 13033, and encapsulate with the encapsulation layer 1304, and the display substrate is prepared.

[0170] Based on the description of E1 to E5, it can be seen that the scheme provided in FIG. 13 only needs one mask, one exposure and one etching on the traditional product structure, so as to realize a deeper black light shielding layer sidewall in the bottom light emitting display substrate.

[0171] Based on the above description of FIG. 4 and FIGS. 8 to 14, it can be seen that the bottom light emitting display substrate provided by the present disclosure only needs to add a few film layers in the conventional product structure when the light shielding layer for limiting the viewing angle of the display substrate is arranged between the light emitting structure layer and the first transparent substrate layer based on the bottom light emitting design, and has the advantages of simple structure and low preparation cost.

[0172] In summary:

[0173] The bottom light emitting display substrate provided by the embodiment of the present disclosure includes a first transparent substrate layer, a driving circuit layer, a light emitting structure layer, an encapsulation layer and a light shielding layer. The driving circuit layer is arranged on one side of the first transparent substrate layer. The light emitting structure layer is arranged on the side of the driving circuit layer away from the first transparent substrate layer. The encapsulation layer is arranged on the side of the light emitting structure layer away from the first transparent substrate layer. Therefore, the light emitted by the light emitting structure layer will penetrate the driving circuit layer and the first transparent substrate layer in turn, and finally be emitted from the first transparent substrate layer, realizing bottom light emission.

[0174] The bottom light emitting display substrate provided by the embodiment of the present disclosure is based on the bottom light emitting design. By arranging the light shielding layer between the first transparent substrate layer and the light emitting structure layer, and the light shielding layer includes light shielding structures extending in the row direction and / or the column direction, these light shielding structures can shield part of the light emitted by the light emitting structure layer, so as to limit the angle of the light emitted from the first transparent substrate layer, thereby realizing narrow viewing angle display in the row direction and / or the column direction.

[0175] In this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0176] The multiple embodiments in the specification are described in a related manner, and the same or similar parts among the multiple embodiments can be referred to each other. Each embodiment focuses on the difference from other embodiments.

[0177] The above only describes the preferred embodiments of the present disclosure, and is not intended to limit the protection scope of the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A bottom emission display substrate, comprising: The first transparent substrate layer, the driving circuit layer, the light-emitting structure layer, the encapsulation layer and the light-blocking layer; The driving circuit layer is arranged on one side of the first transparent substrate layer; The light-emitting structure layer is arranged on the side of the driving circuit layer away from the first transparent substrate layer, the encapsulation layer is arranged on the side of the light-emitting structure layer away from the first transparent substrate layer, and the light-blocking layer is arranged between the first transparent substrate layer and the light-emitting structure layer; The light-emitting structure layer comprises a plurality of pixel structures arranged along the row direction and the column direction to form a plurality of pixel rows and a plurality of pixel columns; The light-blocking layer comprises a plurality of light-blocking structures, at least part of the light-blocking structures extend along the row direction, and the projection of the light-blocking structure on the first transparent substrate layer is located between the projections of two pixel rows; and / or, at least part of the light-blocking layer comprises a plurality of light-blocking structures, the light-blocking structures extend along the column direction, and the projection of the light-blocking structure on the first transparent substrate layer is located between the projections of two pixel columns. 2.The bottom emission display substrate of claim 1, wherein, The light-emitting structure layer comprises a transparent electrode layer, an electroluminescent layer, a reflective electrode layer and a pixel definition layer; The transparent electrode layer is arranged on the side of the driving circuit layer away from the first transparent substrate layer, the electroluminescent layer is arranged on the side of the transparent electrode layer away from the first transparent substrate layer, the reflective electrode layer is arranged on the side of the electroluminescent layer away from the first transparent substrate layer, and the pixel definition layer is arranged between the transparent electrode layer and the electroluminescent layer, and the pixel definition layer defines the transparent electrode layer, the electroluminescent layer and the reflective electrode layer as the plurality of pixel structures.

3. The bottom emission display substrate of claim 2, wherein, A planarization layer is further arranged between the driving circuit layer and the light-emitting structure layer, and the light-blocking structure is arranged between the driving circuit layer and the planarization layer.

4. The bottom emission display substrate of claim 2, wherein, A second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and the light-blocking structure is arranged between the first transparent substrate layer and the second transparent substrate layer.

5. The bottom emission display substrate of claim 2, wherein, The light-blocking layer comprises a first light-blocking layer and a second light-blocking layer; A planarization layer is further arranged between the driving circuit layer and the light-emitting structure layer, and the light-blocking structure of the first light-blocking layer is arranged between the driving circuit layer and the planarization layer; a second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and the light-blocking structure of the second light-blocking layer is arranged between the first transparent substrate layer and the second transparent substrate layer.

6. The bottom emission display substrate of claim 2, wherein, A second transparent substrate layer is further arranged between the driving circuit layer and the first transparent substrate layer, and a through hole penetrating through the second transparent substrate layer in thickness is arranged on the second transparent substrate layer, and the light-blocking structure is located in the through hole.

7. The bottom emission display substrate according to any one of claims 4 to 6, wherein, A first transparent isolation layer is further arranged between the first transparent substrate layer and the second transparent substrate layer.

8. The bottom emission display substrate of claim 6, wherein, A second transparent isolation layer is further arranged between the second transparent substrate layer and the driving circuit layer, and the through hole further penetrates through the second transparent isolation layer. 9.The bottom emission display substrate of any one of claims 2 to 6, wherein, The projection of the light-blocking structure on the first transparent substrate layer is located within the projection range of the pixel definition layer on the first transparent substrate layer. 10.The bottom emission display substrate of any one of claims 2 to 6, wherein, The pixel defining layer is a black pixel defining layer. 11.The bottom emission display substrate of any one of claims 2 to 6, wherein, The light shielding structure is made by exposing and developing a black photosensitive material. 12.The bottom emission display substrate of claim 8, wherein, The second transparent isolation layer is made by exposure and development, and the second transparent base layer is made by etching the second transparent isolation layer as a hard mask.

13. The bottom emission display substrate according to any one of claims 1 to 5, wherein, The thickness of the light shielding layer is between 1.5um and 2.5um.

14. The bottom emission display substrate according to claim 5 or 6, wherein, The thickness of the second transparent base layer is between 3um and 20um.

15. A manufacturing method of a bottom emission display substrate, comprising: forming a first transparent base layer; forming a driving circuit layer, the driving circuit layer being disposed on one side of the first transparent base layer; forming a light emitting structure layer, the light emitting structure layer being disposed on a side of the driving circuit layer away from the first transparent base layer, the light emitting structure layer comprising a plurality of pixel structures arranged along a row direction and a column direction, forming a plurality of pixel rows and a plurality of pixel columns; forming an encapsulation layer, the encapsulation layer being disposed on a side of the light emitting structure layer away from the first transparent base layer; forming a light shielding layer, the light shielding layer being disposed between the first transparent base layer and the light emitting structure layer, the light shielding layer comprising a plurality of light shielding structures, at least part of the light shielding structures extending along the row direction, and a projection of the light shielding structures on the first transparent base layer being located between projections of two pixel rows; and / or, at least part of the light shielding layer comprising a plurality of light shielding structures, the light shielding structures extending along the column direction, and a projection of the light shielding structures on the first transparent base layer being located between projections of two pixel columns.

16. The manufacturing method according to claim 15, wherein forming the light emitting structure layer comprises forming a transparent electrode layer, an electroluminescent layer, a reflective electrode layer and a pixel defining layer of the light emitting structure layer; the transparent electrode layer is disposed on a side of the driving circuit layer away from the first transparent base layer, the electroluminescent layer is disposed on a side of the transparent electrode layer away from the first transparent base layer, the reflective electrode layer is disposed on a side of the electroluminescent layer away from the first transparent base layer; the pixel defining layer is disposed between the transparent electrode layer and the electroluminescent layer, and the pixel defining layer defines the transparent electrode layer, the electroluminescent layer and the reflective electrode layer as the plurality of pixel structures.

17. The manufacturing method of claim 15, further comprising: forming a planarization layer between the driving circuit layer and the light emitting structure layer, the light shielding structure being disposed between the driving circuit layer and the planarization layer.

18. The manufacturing method of claim 15, further comprising: forming a second transparent base layer between the driving circuit layer and the first transparent base layer, the light shielding structure being disposed between the first transparent base layer and the second transparent base layer.

19. The manufacturing method of claim 15, wherein forming the light shielding layer comprises forming a first light shielding layer and a second light shielding layer of the light shielding layer; the manufacturing method further comprises forming a planarization layer between the driving circuit layer and the light emitting structure layer, wherein the light shielding structure of the first light shielding layer is disposed between the driving circuit layer and the planarization layer. The manufacturing method further includes: forming a second transparent substrate layer between the driving circuit layer and the first transparent substrate layer, wherein the light-shielding structure of the second light-shielding layer is arranged between the first transparent substrate layer and the second transparent substrate layer.

20. A display device comprising the bottom-emission display substrate according to any one of claims 1 to 14. ​

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