Fingerprint recognition apparatus, fingerprint recognition assembly and electronic device

Abstract

The present disclosure relates to a fingerprint recognition apparatus, a fingerprint recognition assembly and an electronic device. In one aspect, the fingerprint recognition apparatus comprises: a circuit board, which comprises a first surface and a second surface that are opposite to each other; an ultrasonic sensor, which comprises a substrate and a transducer, wherein the transducer is disposed on a third surface of the substrate, and a side edge portion of the third surface is attached to the first surface; and a bracket, which supports an attachment region of the first surface by abutting against the second surface, wherein the first surface is attached to the third surface at the attachment region. Thus, the adverse effect of the bending of a circuit board on the attachment of a substrate and the circuit board can be reduced.

Description

Fingerprint recognition device, fingerprint recognition assembly and electronic device

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 652,744, filed May 29, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to the field of fingerprint recognition technology, and more specifically, to fingerprint recognition devices, fingerprint recognition assemblies, and electronic devices including the fingerprint recognition device or the fingerprint recognition assembly. Background Technology

[0003] Fingerprint recognition technology is a technology that uses the uniqueness of an individual's fingerprint to verify identity. It has been widely used in many fields involving identity verification, such as granting access to electronic devices like mobile phones and tablets, and identifying individuals for consumer payments.

[0004] As one of the main fingerprint recognition technologies, ultrasonic fingerprint recognition technology uses ultrasonic waves to detect the texture of fingerprints, and has the advantages of high recognition accuracy and is not easily affected by dirt on the fingers.

[0005] Technical content

[0006] This section provides a general overview of this disclosure, rather than a full disclosure of the entire scope or all features of this disclosure.

[0007] The purpose of this disclosure is to provide a fingerprint recognition device, fingerprint recognition assembly, and electronic device that can enhance the stability of the attachment between the ultrasonic sensor and the circuit board.

[0008] To achieve the above objectives, according to one aspect of this disclosure, a fingerprint recognition device is provided, comprising:

[0009] A circuit board, comprising a first surface and a second surface that are opposite to each other;

[0010] An ultrasonic sensor includes a substrate and a transducer, the transducer being disposed on a third surface of the substrate, and one side of the third surface being attached to a first surface; and

[0011] The bracket supports the attachment area of ​​the first surface by abutting against the second surface, wherein the first surface is attached to the third surface at the attachment area.

[0012] In some embodiments, the abutment area of ​​the bracket may overlap with a first area of ​​the second surface, wherein the bracket abuts against the second surface at the abutment area, and the first area and the attachment area are mirror-symmetrical about the circuit board.

[0013] In some implementations, the abutting area may include a first portion that overlaps with a first region, and the first portion is planar.

[0014] In some implementations, the first portion may cover one long side of the first region, wherein the long side is farther away from the transducer than another long side of the first region.

[0015] In some implementations, the contact area may further include a second part, which is adjacent to the first part, and the second part is an arc-shaped surface.

[0016] In some embodiments, the abutment area of ​​the bracket may not overlap with the first area of ​​the second surface, wherein the bracket abuts against the second surface at the abutment area, and the first area and the attachment area are mirror-symmetrical about the circuit board.

[0017] In some embodiments, the support may include a first recess that is disposed between the transducer and the support when the support abuts against the second surface to form a gap between the transducer and the support.

[0018] In some embodiments, the opening of the first recess can cover the transducer when viewed along a first direction, wherein the first direction is perpendicular to the plane containing the third surface.

[0019] In some embodiments, the fingerprint recognition device may further include a functional component for receiving signals from an ultrasonic sensor, the functional component being disposed on a second surface.

[0020] In some embodiments, the support may include a second recess disposed on the side of the support away from the ultrasonic sensor, and the second recess allows functional components to be disposed therein.

[0021] In some embodiments, the fingerprint recognition device may further include a reinforcement disposed on the first surface, and the position of the reinforcement corresponds to the position of the functional component to support the functional component.

[0022] In some embodiments, the support may extend beyond two opposite sides of the substrate, wherein each of the two sides extends along the shorter side of the attachment region.

[0023] In some implementations, the support can be integrally molded.

[0024] In some implementations, the support may be attached to a second surface.

[0025] In some embodiments, the side portion may be the side portion where the long side of the substrate is located.

[0026] In some embodiments, the substrate can be electrically connected to the circuit board at the attachment area by bonding with anisotropic conductive adhesive film, or the substrate can be electrically connected to the circuit board on a third surface by wire bonding.

[0027] In some implementations, the substrate can be electrically connected to the second surface of the circuit board on the third surface via wire bonding.

[0028] In some embodiments, the abutment area of ​​the support may be spaced apart from the bonding area on the second surface, wherein the support abuts against the second surface at the abutment area and the lead is bonded to the second surface at the bonding area.

[0029] In some embodiments, the fingerprint recognition device is used to be mounted to a button of an electronic device and mounted such that a fourth surface of the substrate is located below the button, wherein the fourth surface is opposite to the third surface.

[0030] In some implementations, the fingerprint recognition device is mounted on the side of the electronic device.

[0031] According to another aspect of this disclosure, a fingerprint recognition assembly is provided, comprising:

[0032] Side bezels for electronic devices; and

[0033] The fingerprint recognition device according to any of the above embodiments

[0034] The side frame is connected to the bracket.

[0035] In some implementations, the side frame can be integrally formed with the bracket.

[0036] According to another aspect of this disclosure, an electronic device is provided that includes a fingerprint recognition device according to any of the above embodiments, or includes a fingerprint recognition assembly according to any of the above embodiments.

[0037] According to the above technical solution, by setting a bracket and having the bracket support the attachment area of ​​the first surface of the circuit board by abutting the second surface of the circuit board, the bending of the circuit board can resist the pulling of the attachment area. This reduces the possibility of attachment loosening or damage due to bending, thereby reducing the possibility of electrical connection failure between the ultrasonic sensor and the circuit board. As a result, the adverse effects of bending on the function and lifespan of the fingerprint recognition device can be reduced. Brief description of the attached figures

[0038] The features and advantages of embodiments of the present disclosure will become more readily understood from the following description with reference to the accompanying drawings. The drawings are not drawn to scale and some features may be enlarged or reduced to show details of specific components. In the drawings:

[0039] Figure 1 is a schematic perspective view of a fingerprint recognition device according to an embodiment of the present disclosure, viewed from side A.

[0040] Figure 2 is a schematic perspective view of the fingerprint recognition device shown in Figure 1 as viewed from the A' side.

[0041] Figure 3 is a schematic exploded view of the fingerprint recognition device shown in Figure 1 from the B side.

[0042] Figure 4 is a schematic exploded view of the fingerprint recognition device shown in Figure 1 from side A.

[0043] Figure 5 is a schematic cross-sectional view of the fingerprint recognition device shown in Figure 1 along line A-A'.

[0044] Figure 6 is a schematic cross-sectional view of the fingerprint recognition device shown in Figure 1 along line B-B'.

[0045] Figure 7 is a schematic side view of the bracket of the fingerprint recognition device shown in Figure 1.

[0046] Figure 8 schematically illustrates the electrical connection of the substrate to the circuit board via anisotropic conductive adhesive film.

[0047] Figure 9 shows a schematic diagram of the substrate being electrically connected to the circuit board via leads.

[0048] Figure 10 is a schematic perspective view of an electronic device.

[0049] Figure 11 shows a partial schematic perspective view of the fingerprint recognition device positioned on the side frame of the electronic device shown in Figure 10.

[0050] Figure 12 is a schematic side view of a bracket according to another embodiment of the present disclosure.

[0051] Figure 13 is a schematic cross-sectional view of a fingerprint recognition device including the bracket shown in Figure 12, similar to that in Figure 5.

[0052] Figure 14 is a schematic perspective view of a fingerprint recognition device according to another embodiment of the present disclosure.

[0053] Figure 15 is a schematic exploded view of the fingerprint recognition device shown in Figure 14 from a C-angle perspective.

[0054] Figure 16 is a schematic cross-sectional view along line C-C' of the fingerprint recognition device shown in Figure 14.

[0055] Figure 17 is a schematic cross-sectional view along line D-D' of the fingerprint recognition device shown in Figure 14.

[0056] Figure 18 is a partial schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0057] Figure 19 is a partial schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0058] Figure 20 is a partial schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0059] In the accompanying drawings, the same or corresponding technical features or components are represented by the same or corresponding reference numerals. Detailed Implementation

[0060] The present disclosure will now be described in detail with reference to the accompanying drawings and exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is not intended to limit the scope of the disclosure.

[0061] It should be noted that, for clarity, not all features of a particular embodiment are described or shown in the specification and drawings. Furthermore, to avoid unnecessary details obscuring the technical solutions of interest in this disclosure, only the device structure closely related to the technical solutions of this disclosure is described and shown in the specification and drawings, while other details that are not closely related to the technical content of this disclosure and are known to those skilled in the art are omitted.

[0062] According to an embodiment of this disclosure, a fingerprint recognition device is provided. The fingerprint recognition device includes a circuit board, an ultrasonic sensor, and a bracket. The circuit board includes a first surface and a second surface opposite to each other. The ultrasonic sensor includes a substrate and a transducer, the transducer being disposed on a third surface of the substrate, with one side of the third surface disposed and attached to the first surface. The bracket supports an attachment area of ​​the first surface by abutting against the second surface, wherein the first surface and the third surface are attached at the attachment area.

[0063] In embodiments of this disclosure, by having the bracket support the attachment area of ​​the first surface by abutting against the second surface, the stability of the attachment between the ultrasonic sensor and the circuit board can be enhanced, thereby reducing the possibility of electrical connection failure between the ultrasonic sensor and the circuit board.

[0064] The fingerprint recognition device according to embodiments of the present disclosure will now be described in detail with reference to Figures 1 to 17.

[0065] First, referring to Figures 1 to 7, the fingerprint recognition device 1 includes an ultrasonic sensor 10, a circuit board 20, a functional component 30, and a bracket 40.

[0066] The ultrasonic sensor 10 includes a substrate 101 and a transducer 102. The substrate 101 may be rectangular, for example, as shown in FIG1, and may be made of glass, silicon, or other materials. The transducer 102 is disposed on a surface (referred to as the third surface) 1011 of the substrate 101 and is used to emit ultrasonic signals and receive ultrasonic signals reflected back by the fingerprint of a detected finger.

[0067] The circuit board 20 can be a flexible printed circuit board (FPCB) or other types of bendable circuit boards. The circuit board 20 includes a first surface 201 and a second surface 202 that are opposite to each other. The ultrasonic sensor 10 and the functional component 30 are respectively arranged on the first surface 201 and the second surface 202 of the circuit board 20 (i.e., the ultrasonic sensor 10 is arranged on the first surface 201, and the functional component 30 is arranged on the second surface 202) to achieve electrical connection and signal transmission between the ultrasonic sensor 10 and the functional component 30 via the circuit board 20.

[0068] Functional component 30 is used to receive signals from ultrasonic sensor 10 via circuit board 20. Functional component 30 may be, for example, an application-specific integrated circuit (ASIC) used to receive, via circuit board 20, the fingerprint electrical signal generated by ultrasonic sensor 10 when it receives a reflected ultrasonic signal, and to process the received fingerprint electrical signal to obtain fingerprint information. It is conceivable that functional component 30 may also be a component performing other functions.

[0069] In the connection between the ultrasonic sensor 10 and the circuit board 20, as shown more clearly in Figures 3 and 5, one side of the third surface 1011 of the substrate 101 of the ultrasonic sensor 10 is attached to the first surface 201 of the circuit board 20, and the ultrasonic sensor 10 is electrically connected to the circuit board 20 on the third surface 1011.

[0070] The fact that the side portion of the third surface 1011 is attached to the first surface 201 means that the side portion is attached to and connected to the first surface 201, or that the side portion is arranged and connected to the first surface 201. For example, referring to FIG8, the third surface 1011 of the substrate 101 can be attached to the first surface 201 of the circuit board 20 via anisotropic conductive film (ACF) 110 through ACF bonding, and the substrate 101 is electrically connected to the circuit board 20 via ACF 110. Alternatively, referring to FIG9, the third surface 1011 of the substrate 101 can be attached to the first surface 201 of the circuit board 20, for example, via adhesive 111, and the substrate 101 is electrically connected to the circuit board 20 via wire bonding on the third surface 1011 using wires 120.

[0071] It should be noted that, for clarity, the bracket 40 is omitted in Figures 8 and 9. Furthermore, for ease of understanding, in the other figures besides Figures 8 and 9, only the case where the ultrasonic sensor 10 is attached and electrically connected to the circuit board 20 via ACF bonding is shown as an example, and the ACF is omitted for clarity.

[0072] Next, we will continue to explain the bracket 40.

[0073] Referring to Figures 3 to 7, the bracket 40 supports the attachment area 2011 of the first surface 201 by abutting against the second surface 202, wherein the first surface 201 is attached to the third surface 1011 at the attachment area 2011.

[0074] Here, the attachment region 2011 should be understood as the region where the attachment occurs. Alternatively, from another perspective, since one side of the third surface 1011 is attached to the first surface 201, the attachment region 2011 is the region of the first surface 201 that completely overlaps with the side of the third surface 1011.

[0075] By using the bracket 40 to support the attachment area 2011 of the first surface 201, the stability of the attachment between the ultrasonic sensor 10 and the circuit board 20 can be enhanced, thereby reducing the possibility of electrical connection failure between the ultrasonic sensor 10 and the circuit board 20. This is particularly advantageous when the fingerprint recognition device 1 is mounted on the side of an electronic device.

[0076] The following is a detailed explanation based on Figures 3 to 7, and in conjunction with Figures 10 and 11.

[0077] It should be noted that, for ease of description and clarity, in Figure 10, the electronic device 100 is exemplarily shown as a mobile phone, and Figure 10 shows only the side frame of the electronic device in a perspective view. Furthermore, in Figure 11, the bracket 40 is omitted for clarity.

[0078] As shown in Figures 10 and 11, when the fingerprint recognition device 1 is located on the side frame 2 of the mobile phone 100, the ultrasonic sensor 10 is arranged close to the side frame 2, such that the short side direction X1 of the substrate 101 (see Figures 1 and 11) is parallel to the direction H (see Figures 10 and 11), where the direction H is perpendicular to the front of the mobile phone 100. In this case, due to the space (i.e., the thickness of the mobile phone) of the mobile phone 100 in the direction H, the circuit board 20 near the attachment area 2011 needs to be bent inwards towards the inside of the mobile phone 100, that is, bent to the right as shown in Figure 11, so that the functional component 30 is arranged further inside the mobile phone 100 away from the side frame 2. For example, as shown in Figure 11, the bent circuit board 20 extends in one direction, so that the functional component 30 is located further inside in that direction, or, as shown in Figure 5, the bent circuit board 20 is bent again, so that the functional component 30 is arranged behind the ultrasonic sensor 10, that is, facing the third surface 1011.

[0079] As electronic devices are designed to be increasingly thinner, their sides become narrower, requiring fingerprint recognition devices to be correspondingly smaller. Specifically, for example, as shown in Figure 11, the length of the short side of the substrate 101 is correspondingly reduced. This results in only a very small area on the third surface 1011 of the substrate 101 for attachment and electrical connection to the circuit board 20. In this case, bending of the circuit board 20 near the attachment area 2011 is particularly detrimental to the stability of the attachment and electrical connection. This bending can stretch the attachment area 2011, potentially causing cracks in the attachment between the substrate 101 and the circuit board 20, leading to loosening or damage. This loosening or damage can then affect the electrical connection between the ultrasonic sensor 10 and the circuit board 20, potentially causing the electrical connection to malfunction.

[0080] As shown more clearly in Figure 5, the support of the bracket 40 to the attachment area 2011 of the first surface 201 can resist the pulling of the circuit board 20 on the attachment area 2011 due to bending. This reduces the possibility of attachment loosening or damage caused by bending, thereby enhancing attachment stability. Furthermore, the enhanced attachment stability also enhances the stability of the electrical connection between the ultrasonic sensor 10 and the circuit board 20, reducing the possibility of electrical connection failure. For example, in the case of ACF bonding shown in Figure 8, the enhanced attachment stability directly enhances the stability of the electrical connection between the ultrasonic sensor 10 and the circuit board 20. In the case of wire bonding shown in Figure 9, the enhanced attachment stability enhances the stability of the connection between the lead 120 and the substrate 101 and the circuit board 20, thereby enhancing the stability of the electrical connection between the ultrasonic sensor 10 and the circuit board 20. Finally, through the enhancement of attachment stability and electrical connection stability, the adverse effects of bending on the function and lifespan of the fingerprint recognition device 1 can be reduced.

[0081] In some embodiments, as shown in FIG5, the abutment region 401 of the bracket 40 may overlap with the first region 2021 of the second surface 202, wherein the bracket 40 abuts against the second surface 202 at the abutment region 401, and the first region 2021 and the attachment region 2011 are mirror-symmetrical about the circuit board 20.

[0082] Here, the abutment area 401 should be understood as the area where the abutment occurs. In Figure 5, the attachment area 2011 and the first area 2021 are shown as portions of the first surface 201 and the second surface 202, respectively, between the two dashed lines m and n. When the abutment area 401 of the bracket 40 overlaps with the first area 2021 of the second surface 202, it means that the bracket 40 abuts against the first area 2021 to support the attachment area 2011 by supporting the first area 2021.

[0083] In this way, the support provided by the bracket 40 can act directly on the attachment area 2011, thereby directly and more effectively resisting the bending of the circuit board 20 on the attachment area 2011, and thus more effectively reducing the adverse effects of the bending on the attachment of the substrate 101 and the circuit board 20.

[0084] It is conceivable that, as shown in Figures 5 and 7, the contact area 401 may include a first part 4011 (the part of the contact area 401 located to the left of the dashed line n in Figure 5), the first part 4011 overlaps with the first area 2021, and the first part 4011 is planar.

[0085] In this configuration, the bracket 40 directly abuts against and supports the first region 2021, and the surface of the bracket 40 supporting the first region 2021 is planar. In this way, the support provided by the bracket 40 to the first region 2021 is continuous across the entire first region 2021, resulting in more uniform and stable support for the first region 2021 and thus for the attachment region 2011. This more effectively mitigates the adverse effects of the bending of the circuit board 20 on the attachment between the substrate 101 and the circuit board 20.

[0086] It should be noted that, here, overlap refers to the complete or partial overlap of two objects in space. For example, the overlap between the contact area 401 and the first area 2021 includes: a part of the contact area 401 covering a part of the first area 2021 (as shown in Figure 5), the contact area 401 being larger than and covering the first area 2021, the contact area 401 being smaller than the first area 2021 and being covered by the first area 2021, and the contact area 401 being equal to and covering the first area 2021.

[0087] However, in some embodiments, the abutment region 401 and the first region 2021 may not overlap, for example, see Figures 12 and 13.

[0088] In this configuration, the support 40 does not abut against the first region 2021, but rather indirectly supports the attachment region 2011 by abutting against other regions of the second surface 202. For example, as shown in FIG12, the abutting region 401 includes a portion 4010. Accordingly, in the case shown in FIG13, the portion 4010 is closest to the first region 2021, but does not overlap with it. The support 40 abuts against the second region 2022 of the second surface 2022 via the portion 4010, wherein the second region 2022 is adjacent to the first region 2021.

[0089] By supporting the second region 2022, the bending of the circuit board 20 can also resist the pulling of the attachment region 2011, thus achieving indirect support for the attachment region 2011. This also reduces the adverse effects of the bending on the attachment between the substrate 101 and the circuit board 20.

[0090] The fingerprint recognition device 1, in which the contact area 401 overlaps with the first area 2021, will now be described.

[0091] It can be envisioned that, as shown more clearly in Figures 3 and 4, the side portion of the third surface 101 attached to the first surface 201 is the side portion where the long side of the substrate 101 is located. That is, the longer side portion of the third surface 1011 is attached to the first surface 201.

[0092] However, it is also conceivable that the side portion of the third surface 101 attached to the first surface 201 is the side portion where the short side of the substrate 101 is located. That is, the shorter side portion of the third surface 1011 is arranged and attached to the first surface 201.

[0093] In some embodiments, referring to Figures 3 and 5, the first portion 4011 may cover one long side 2021a of the first region 2021, wherein the long side 2021a is farther away from the transducer 102 than the other long side 2021b of the first region 2021.

[0094] By covering the long side 2021a of the first region 2021 with the first portion 4011 of the abutment region 401, the bracket 40 can directly support the long side 2011a of the attachment region 2011 by supporting the long side 2021a. This prevents the attachment region 2011 from cracking at its long side 2011a when the circuit board 20 is bent, and thus more effectively prevents the attachment of the substrate 101 to the circuit board 20 from loosening and being damaged, thereby more effectively reducing the adverse effects of the bending of the circuit board 20 on the attachment.

[0095] It is conceivable that the edge of the first part 4011 can be flush with the long side 2021a of the first region 2021, so as to just cover the long side 2021a.

[0096] It is also conceivable that the first portion 4011 may extend beyond the long side 2021a to cover the long side 2021a more internally. In this way, stress concentration caused by the bending of the circuit board 20 at the long side 2011a of the attachment region 2011 can be reduced, and thus the possibility of the attachment region 2011 cracking from the long side 2011a due to stress concentration can be reduced.

[0097] In some embodiments, as shown in Figures 5 and 7, the abutment area 401 may further include a second portion 4012, which is adjacent to the first portion 4011, and the second portion 4012 is an arc-shaped surface.

[0098] By making the second portion 4012 adjacent to the first portion 4011 and having an arc-shaped surface, the second portion 4012 can provide support to the second surface 202 in close proximity to the first portion 4011. This reduces stress concentration caused by the bending of the circuit board 20 at the long side 2011a of the attachment region 2011, and thus reduces the likelihood of the attachment region 2011 cracking from the long side 2011a due to this stress concentration. Furthermore, the arc-shaped second portion 4012 allows for a more uniform distribution of stress on the circuit board 20 as it bends, thereby reducing the risk of damage to the circuit board 20 due to excessive bending angles during bending.

[0099] It is conceivable that, as shown in Figures 5 and 7, the abutment area 401 may also include a third portion 4013, which is also an arc-shaped surface. Similarly, the arc-shaped third portion 4013 can make the stress distribution on the circuit board 20 that bends again more even, thereby reducing the risk of the circuit board 20 being damaged due to excessive bending angle when bending.

[0100] As mentioned earlier, substrate 101 can be electrically connected to circuit board 20 at attachment region 2011 via ACF bonding, or substrate 101 can also be electrically connected to circuit board 20 on third surface 1011 via wire bonding, for example, to second surface 202 of circuit board 20.

[0101] When the substrate 101 is electrically connected to the second surface 202 on the third surface 1011 by wire bonding, it is conceivable that the abutment region 401 is separated from the bonding region on the second surface 202, wherein the wire is bonded to the second surface 202 at the bonding region.

[0102] In this way, the support 40 will not come into contact with the bonding area and its leads, thus not affecting the electrical connection between the substrate 101 and the circuit board 20.

[0103] In some embodiments, as shown in Figures 3 to 6, the support 40 may include a first recess 402, which is arranged between the transducer 102 and the support 40 when the support 40 abuts against the second surface 202 to form a gap between the transducer 102 and the support 40.

[0104] As mentioned earlier, transducer 102 is used to emit ultrasonic signals and receive ultrasonic signals reflected back from the detected fingerprint. However, the ultrasonic signals are emitted simultaneously from opposite sides of transducer 102 (i.e., the upper and lower sides of transducer 102 in Figure 5). If the bracket 40 is in direct contact with transducer 102, in addition to potentially changing the original designed resonant frequency of transducer 102, it will also generate additional noise unrelated to the fingerprint signal due to contact with the bracket, thereby interfering with fingerprint recognition.

[0105] By creating a gap between the transducer 102 and the support 40, the designed resonant frequency of the transducer 102 remains unchanged, and the ultrasonic signal emitted downwards by the transducer 102 is not interfered with by the reflected signal from the support 40. This reduces noise unrelated to the fingerprint signal and thus minimizes interference with fingerprint recognition, thereby improving the accuracy of fingerprint recognition.

[0106] Furthermore, by positioning the bracket 40 on the aforementioned side of the transducer 102, the transducer 102 and thus the ultrasonic sensor 10 can be protected from damage by accidental contact.

[0107] It is conceivable that, as shown in Figure 5, the opening of the first recess 402 covers the transducer 102 when viewed along the first direction S, wherein the first direction S is perpendicular to the plane containing the third surface 1011.

[0108] In this case, the gap formed between the transducer 102 and the bracket 40 can cover the transducer 102 when viewed along the first direction S, so that the original system parameters of the transducer 102 will not be changed and thus will not cause interference, so as to further improve the accuracy of fingerprint recognition.

[0109] In some embodiments, as shown in Figures 3 to 6, the bracket 40 may include a second recess 403 disposed on the side of the bracket 40 away from the ultrasonic sensor 10, and the second recess 403 allows the functional component 30 to be disposed therein.

[0110] The second recess 403, shown in FIG. 5, is formed on the underside of the bracket 40. In this case, the circuit board 20, which has already been bent toward the interior of the electronic device near the attachment area 2011, can be bent again so that the functional component 30 disposed on the second surface 202 of the circuit board 20 can be disposed in the second recess 403. Thus, not only is space provided for the functional component 30, thereby saving limited space within the electronic device, but the functional component 30 is also protected from damage due to accidental contact.

[0111] In some embodiments, as shown in Figures 3 to 6, the fingerprint recognition device 1 may further include a reinforcing member 50, which is disposed on the first surface 201 and the position of the reinforcing member 50 corresponds to the position of the functional component 30 to support the functional component 30.

[0112] In other words, the reinforcing member 50 and the functional component 30 are respectively arranged on opposite sides of the circuit board 20, and the position of the reinforcing member 50 and the position of the functional component 30 are vertically corresponding as shown in Figure 5, or it can be said that they are directly opposite each other in the vertical direction in Figure 5.

[0113] In this way, the reinforcement 50 can provide support for the corresponding area of ​​the circuit board 20 so that the area does not bend, and thereby provide support for the functional component 30 arranged in that area of ​​the circuit board 20 to avoid damage to the functional component 30 due to bending of that area of ​​the circuit board 20.

[0114] In some embodiments, as shown in FIG1, the support 40 may extend beyond two opposite sides 101b of the substrate 101, wherein each of the two sides 101b extends along the short side direction X2 of the attachment region 2011.

[0115] By extending the support 40 beyond the two opposite sides 101b of the substrate 101, the substrate 101 and thus the ultrasonic sensor 10 can be protected from the left and right sides of the substrate 101 shown in FIG. 1 from damage due to accidental contact.

[0116] In some implementations, the support 40 may be integrally formed.

[0117] Therefore, the bracket 40 can have better structural stability, thereby providing more stable support for the attachment area 2011, and further enhancing the stability of the attachment between the ultrasonic sensor 10 and the circuit board 20.

[0118] In some implementations, the support 40 may be connected to the second surface 202.

[0119] For example, the bracket 40 can be attached to the second surface 202 by means of adhesive bonding or other methods. Moreover, it is conceivable that the entire abutment area 401 of the bracket 40 is attached to the second surface 202. This would make the support of the bracket 40 on the attachment area 2011 more stable, thereby further enhancing the stability of the attachment between the ultrasonic sensor 10 and the circuit board 20.

[0120] However, it is conceivable that the bracket 40 may not be connected to the second surface 202, but only abut against the second surface 202.

[0121] In some embodiments, referring to Figures 14 to 17, the fingerprint recognition device 1 is used to be assembled to a button 60 of an electronic device, and is assembled such that the fourth surface 1012 of the substrate 101 is located below the button 60, wherein the fourth surface 1012 is opposite to the third surface 1011.

[0122] The button 60 can be located on the casing of the electronic device, for example, on the side frame of a mobile phone, flush with or slightly protruding from the outer surface of the side frame, for the user to press. In this way, the ultrasonic sensor 10 of the fingerprint recognition device 1 can receive the ultrasonic signal reflected back from the fingerprint of the finger pressed on the button 60, so as to realize the recognition of the fingerprint.

[0123] For example, button 60 may be the power button, volume button, etc. of an electronic device.

[0124] Referring to Figures 10, 18, and 19, an electronic device 100 is also provided according to an embodiment of the present disclosure.

[0125] The electronic device 100 includes a fingerprint recognition device 1. As shown in FIG18, the fingerprint recognition device 1 may be disposed, for example, at the mounting portion 21 of the side frame 2 of the electronic device 100. Alternatively, as shown in FIG19, the fingerprint recognition device 1 may be disposed at the button 60. In this case, the button 60 may be disposed, for example, at the side frame 2 of the electronic device 100, slightly protruding from the outer surface 22 of the side frame 2, or flush with the outer surface 22.

[0126] Referring to FIG20, according to an embodiment of the present disclosure, a fingerprint recognition assembly 3 is also provided.

[0127] The fingerprint recognition assembly 3 includes a side frame 2'' for the electronic device 100'' and a fingerprint recognition device 1, wherein the side frame 2'' is connected to the bracket 40 of the fingerprint recognition device 1.

[0128] It is conceivable that the side frame 2'' can be connected to the bracket 40 by fasteners, or, as shown in Figure 20, the side frame 2'' can be integrally formed with the bracket 40.

[0129] Furthermore, as shown in FIG20, according to an embodiment of the present disclosure, an electronic device 100'' is also provided, which includes a fingerprint recognition assembly 3.

[0130] As mentioned earlier, for clarity only, the electronic device is exemplarily shown as a mobile phone in Figure 10. However, by way of example and not limitation, the electronic device may also be a tablet, a laptop, an in-vehicle electronic device, or a smart wearable device such as a smartwatch, smart glasses, etc.

[0131] In this disclosure, the terms "first," "second," "upper," "lower," etc., are used merely for descriptive purposes and should not be considered restrictive. Furthermore, although this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the specific embodiments described and shown herein. Various changes to the exemplary embodiments can be made by those skilled in the art without departing from the scope defined by the claims of this disclosure.

[0132] The features mentioned and / or shown in the foregoing description of exemplary embodiments of this disclosure may be combined in the same or similar manner with one or more other embodiments, combined with features in other embodiments, or substituted for corresponding features in other embodiments. Such combinations or substitutions should also be considered as including within the scope of protection of this disclosure.

Claims

1. A fingerprint recognition device, characterized by, Comprising: a circuit board including a first surface and a second surface opposite to each other; an ultrasonic sensor including a substrate and a transducer arranged on a third surface of the substrate, a side edge portion of the third surface being attached on the first surface; and a bracket supporting an attachment area of the first surface against the second surface, wherein the first surface is attached to the third surface at the attachment area. The abutting area of the bracket overlaps a first area of the second surface, wherein the bracket abuts against the second surface at the abutting area, and the first area is mirror-symmetric to the attachment area with respect to the circuit board.

2. The fingerprint recognition apparatus according to claim 1, characterized in that, The abutting area includes a first portion overlapping the first area, and the first portion is a planar surface.

3. The fingerprint recognition apparatus according to claim 2, wherein The first portion covers a long side of the first area, wherein the long side is farther away from the transducer than another long side of the first area.

4. The fingerprint recognition apparatus according to claim 3, wherein The abutting area further includes a second portion adjacent to the first portion, and the second portion is an arc surface.

5. The fingerprint recognition apparatus according to claim 4, wherein The abutting area of the bracket does not overlap a first area of the second surface, wherein the bracket abuts against the second surface at the abutting area, and the first area is mirror-symmetric to the attachment area with respect to the circuit board.

6. The fingerprint recognition apparatus according to claim 1, wherein The bracket includes a first recess arranged between the transducer and the bracket when the bracket abuts against the second surface, to form a gap between the transducer and the bracket.

7. The fingerprint recognition apparatus according to claim 1, wherein An opening of the first recess covers the transducer when viewed in a first direction, wherein the first direction is perpendicular to a plane in which the third surface lies.

8. The fingerprint recognition apparatus according to claim 7, wherein Further comprising a functional component for receiving a signal from the ultrasonic sensor, the functional component being arranged on the second surface.

9. The fingerprint recognition apparatus according to claim 1, wherein The bracket includes a second recess arranged on a side of the bracket away from the ultrasonic sensor, and the second recess allows the functional component to be arranged therein.

10. The fingerprint recognition apparatus according to claim 9, wherein Further comprising a reinforcement arranged on the first surface, and a position of the reinforcement corresponds to a position of the functional component to support the functional component.

11. The fingerprint recognition apparatus according to claim 9, wherein The bracket extends beyond two edges of the substrate opposite to each other, wherein each of the two edges extends in a short side direction of the attachment area.

12. The fingerprint recognition apparatus according to claim 1, wherein The bracket is integrally formed.

13. The fingerprint recognition apparatus according to claim 1, wherein The bracket is connected to the second surface.

14. The fingerprint recognition apparatus according to claim 1, wherein The side edge portion is a side edge portion in which a long side of the substrate lies.

15. The device of claim 1, wherein, The substrate is electrically connected to the circuit board at the attachment area by anisotropic conductive film bonding, or the substrate is electrically connected to the circuit board on the third surface by wire bonding.

16. The fingerprint recognition apparatus according to claim 1, wherein The substrate is electrically connected to the second surface of the circuit board on the third surface by wire bonding.

17. The fingerprint recognition apparatus according to claim 1, wherein The abutting area of the bracket is spaced apart from a bonding region on the second surface, wherein the bracket abuts against the second surface at the abutting area, and a wire is bonded to the second surface at the bonding region.

18. The fingerprint recognition apparatus according to claim 17, wherein, ​ 19. The fingerprint recognition apparatus according to claim 1, wherein, The fingerprint identification apparatus is configured to be assembled to a key of an electronic device, and is assembled such that the fourth surface of the substrate is located below the key, wherein the fourth surface is opposite to the third surface.

20. The fingerprint recognition apparatus according to claim 1, wherein, The fingerprint identification apparatus is configured to be assembled to a side of an electronic device.

21. A fingerprint recognition assembly, comprising: Comprising: a side bezel for an electronic device; and a fingerprint identification apparatus according to any one of claims 1 to 20, wherein the side bezel is connected with the bracket. The side bezel is integrally formed with the bracket.

22. The fingerprint recognition assembly of claim 21, wherein, Comprising a fingerprint identification apparatus according to any one of claims 1 to 20, or a fingerprint identification assembly according to claim 21 or 22.

23. An electronic device, comprising: ​

Images