Differential line structure, printed circuit board, and electronic device

Abstract

Disclosed are a differential line structure (100), a printed circuit board, and an electronic device, relating to the field of circuit design. The differential line structure (100) comprises a differential signal line and a capacitor structure. The differential signal line comprises a first signal line (11) and a second signal line (12), a differential gap being formed between the first signal line (11) and the second signal line (12), the differential gap comprising a first gap section (1a) and a second gap section (1b), and a width of the second gap section (1b) being greater than that of the first gap section (1a). The capacitor structure is disposed in the second gap section (1b), and the capacitor structure is used to increase the capacitance of the first signal line (11) and the second signal line (12) at the second gap section (1b).

Description

Differential line structures, printed circuit boards, and electronic devices

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202410690280.7, filed on May 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of circuit design technology, and more particularly to a differential line structure, a printed circuit board, and electronic equipment. Background Technology

[0004] With the rapid development of the electronic communications industry, communication equipment has become more complex and integrated, and signal rates are gradually increasing. Currently, the industry tends to use differential signals to propagate signals. In differential transmission, if the differential signals are of unequal length, it will cause the differential signals to be converted into common-mode noise, affecting the propagation quality of the differential signals.

[0005] In existing technologies, when differential signals in a channel become unequal in length due to bends or windings, a method of wrapping around a bulge is commonly used for compensation. However, the traditional method of wrapping around a bulge introduces impedance abrupt changes at the bulge, affecting the impedance consistency of the channel. As a result, the impedance at the bulge becomes an important factor affecting the impedance continuity of the entire channel. Summary of the Invention

[0006] To achieve the above objectives, this application provides a differential line structure, comprising:

[0007] A differential signal line includes a first signal line and a second signal line, with a differential gap formed between the first signal line and the second signal line. The differential gap includes a first gap segment and a second gap segment, wherein the width of the second gap segment is greater than the width of the first gap segment; and,

[0008] A capacitor structure is disposed within the two gap sections, and the capacitor structure is used to increase the capacitance of the first signal line and the second signal line at the second gap section.

[0009] This application also provides a printed circuit board, comprising:

[0010] The circuit board itself; and,

[0011] The differential line structure is a differential line structure according to any one of the above, wherein the differential signal lines and the capacitor structure are laid on the circuit board body.

[0012] This application also provides an electronic device including a printed circuit board according to any one of the foregoing claims. Attached Figure Description

[0013] Figure 1 is a schematic diagram of the differential signal line provided in the embodiment of this application;

[0014] Figure 2 is a schematic diagram of the differential line structure provided in the embodiment of this application;

[0015] Figure 3 is a schematic diagram of another embodiment of the differential line structure in Figure 2;

[0016] Figure 4 is an impedance comparison diagram between the embodiment of this application and the conventional solution;

[0017] Figure 5 is a comparison chart of return loss between the embodiment of this application and the conventional solution.

[0018] Explanation of reference numerals in the attached diagram: 100, differential line structure; 11, first signal line; 12, second signal line; 1a, first gap segment; 1b, second gap segment; 21, first convex part; 22, second convex part.

[0019] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0023] With the rapid development of the electronic communications industry, communication equipment has become more complex and integrated, and signal rates are gradually increasing. Currently, the industry tends to use differential signals to propagate signals. In differential transmission, if the differential signals are of unequal length, it will cause the differential signals to be converted into common-mode noise, affecting the propagation quality of the differential signals.

[0024] In existing technologies, when differential signals in a channel become unequal in length due to bends or windings, a method of wrapping around a bulge is commonly used for compensation. However, the traditional method of wrapping around a bulge introduces impedance abrupt changes at the bulge, affecting the impedance consistency of the channel. As a result, the impedance at the bulge becomes an important factor affecting the impedance continuity of the entire channel.

[0025] Referring to Figure 1, this application provides a differential line structure 100, including differential signal lines and a capacitor structure. The differential signal lines include a first signal line 11 and a second signal line 12, with a differential gap formed between the first signal line 11 and the second signal line 12. The differential gap includes a first gap segment 1a and a second gap segment 1b, with the width of the second gap segment 1b being greater than the width of the first gap segment 1a. The capacitor structure is disposed within the two gap segments 1b, and the capacitor structure is used to increase the capacitance of the first signal line 11 and the second signal line 12 at the second gap segment 1b.

[0026] In the differential line structure 100 provided in this application, the first signal line 11 and the second signal line 12 are of unequal length, which requires the longer signal line to be wound around a bulge. This changes the differential gap between the first signal line 11 and the second signal line 12, resulting in a second gap segment 1b with a larger differential gap at the bulge. The impedance at this point is higher. Therefore, a capacitor structure is provided in the second gap segment 1b to reduce the effective gap of the second gap 1b, increase the capacitive coupling between the first signal line 11 and the second signal line 12, and thereby reduce the differential impedance at the second gap 1b.

[0027] The capacitor structure can be implemented in various ways, as long as it can reduce the width of the second gap 1b. For example, a copper plate structure can be provided between the second gaps to reduce the width of the second gap 1b.

[0028] The capacitor structure is set in the second gap segment 1b, which increases the area of ​​the equivalent capacitance of the differential lines 221 and 222. According to the parallel plate capacitance calculation formula, when other parameters remain unchanged, the increase of the equivalent area can increase the capacitance of the winding area. As a result, due to the increase of capacitance, the differential line impedance is inversely proportional to the capacitance, which makes the differential impedance smaller.

[0029] In addition, in this embodiment, although the first signal line 11 and the second signal line 12 are of different lengths, in order to ensure the transmission effect, the first signal line 11 and the second signal line 12 are set to the same width.

[0030] Referring to Figure 2, in this embodiment, the capacitor structure includes a first protrusion 21 and a second protrusion 22. Both the first protrusion 21 and the second protrusion 22 extend along the width direction of the differential gap. The first protrusion 21 is connected to the first signal line 11, and the second protrusion 22 is connected to the second signal line 12. In this embodiment, the first protrusion 21 and the second protrusion 22 are electrically connected to the first signal line 11 and the second signal line 12, respectively. This increases the contact area of ​​the capacitor structure and the capacitance of the bulge area, thereby reducing impedance. Secondly, the reduced spacing between differential pairs caused by the protrusion structure further reduces inductive coupling and increases capacitive coupling, thus reducing impedance.

[0031] Meanwhile, referring to Figure 3, since protrusions are introduced on both the first signal line 11 and the second signal line 12, the differential gap can be reduced more uniformly, increasing the capacitive coupling between the first signal line 11 and the second signal line 12, thereby reducing the differential impedance of the bulge region.

[0032] The first protrusion 21 and the second protrusion 22 can be arranged in various ways, such as facing each other, and the differential gap can be reduced by the first protrusion 21 and the second protrusion 22.

[0033] In this embodiment, the first protrusion 21 and the second protrusion 22 are staggered along the extension direction of the differential gap. This staggered arrangement not only reduces the gap between the first signal line 11 and the second signal line 12, further reducing inductive coupling and increasing capacitive coupling, thereby reducing impedance; it also allows the first protrusion 21 to be closer to the second signal line 12 and the second protrusion to be closer to the first signal line 11, effectively utilizing all the space within the second gap segment 1b, minimizing the gap width, increasing the contact area of ​​the capacitor structure, and increasing the capacitance of the bulge region, thus reducing impedance.

[0034] In one embodiment, multiple first protrusions 21 are provided, and the multiple first protrusions 21 are spaced apart along the length direction of the differential gap. In this embodiment, multiple first protrusions 21 are provided to further fill the second gap segment 1b and reduce the gap size of the second gap segment 1b.

[0035] Similarly, multiple second protrusions 22 are provided, and the multiple second protrusions 22 are spaced apart along the length direction of the differential gap. Similarly, the second gap segment 1b is further filled to reduce the gap size and enhance the capacitance effect.

[0036] In one embodiment, the sum of the extension lengths of the first protrusion 21 and the second protrusion 22 is greater than the width of the second gap segment. In this embodiment, the sum of the lengths of the first protrusion 21 and the second protrusion 22 is greater than the length of the second gap segment 1b, such that the projection structures of the first protrusion 21 and the second protrusion 22 in the width direction are intersecting each other, forming a protrusion gap between the first protrusion 21 and the second protrusion 22, thereby further reducing the spatial size of the second gap segment 1b, allowing the first protrusion 21 to be closer to the first signal line 11, and the second protrusion 22 to be closer to the first signal line 12, resulting in greater inductive coupling.

[0037] As long as the sum of the extension length of the first protrusion 21 and the extension length of the second protrusion 22 is greater than the width of the second gap segment, for example, the length of one of the first protrusion 21 and the second protrusion 22 is greater than the extension length of the other.

[0038] In this embodiment, the extension length of the first protrusion 21 and the extension length of the second protrusion 22 are the same, which facilitates the formation of the first protrusion 21 and the second protrusion 22, and at the same time, ensures that the transmission effect on the first signal line and the second signal line is the same.

[0039] In the embodiments provided in this application, please refer to FIG3. Both the first protrusion 21 and the second protrusion 22 are provided in multiples. The multiple first protrusions 21 are arranged at intervals, and the multiple second protrusions 22 are also arranged at intervals. The multiple first protrusions 21 and the multiple second protrusions 22 are arranged in an interlaced manner to form an interdigitated structure, which can more effectively fill the second gap segment 1b, minimize the gap size, and increase the capacitance area.

[0040] Since it is formed into an interdigitated structure, in order to facilitate a more reasonable layout of the first protrusion 21 and the second protrusion 22, the number of the first protrusion 21 is greater than the number of the second protrusion 22, or the number of the second protrusion 22 is greater than the number of the first protrusion 21, so that the protrusions at both ends can be formed by multiple first protrusions 21, or the protrusions at both ends can be formed by multiple second protrusions 22, thus forming a symmetrical structure.

[0041] In the above-mentioned first protrusion 21 and second protrusion 22, one of the two related technical features can be present, or both can be present. The selection is based on the gap size of the second gap segment 1b, and no specific restriction is made here.

[0042] Furthermore, the first protrusion 21 and the first signal line 11 are integrally formed. In this embodiment, the integral formation facilitates the formation of the first protrusion 21 on the first signal line 11, allowing the first signal line with the first protrusion 21 to be directly generated on the circuit board during the production process without the need for additional production steps, thus improving production efficiency. At the same time, it ensures that the first protrusion 21 and the first signal line 11 are formed with the same material and state, guaranteeing the signal transmission of the first signal line 11.

[0043] Similarly, the second protrusion 22 and the second signal line 12 are integrally formed. In this embodiment, by integrally forming the second protrusion 22 and the second signal line 12, it is ensured that the second protrusion 22 and the second signal line 12 are formed with the same material and state, which facilitates the formation of the second protrusion 22 and ensures the signal transmission of the second signal line 12.

[0044] Of the two related technical features that are integrally formed by the first protrusion 21 and the second protrusion 22 mentioned above, one may exist or both may exist simultaneously, and no specific restriction is made here.

[0045] Furthermore, the first protrusion 21 extends in a rectangular shape. In this embodiment, the first protrusion 21 extends in a rectangular shape to ensure the regularity of the first protrusion 21. Extending in a regular shape facilitates wiring planning and ensures that different differential line structures maintain the same state during the production line process.

[0046] The rectangular width of the first protrusion 21 is the same as the width of the first signal line 11, so as to ensure the uniformity of signal transmission on the first signal line 11.

[0047] Similarly, the second protrusion 22 extends in a rectangular shape, which facilitates the manufacturing of the second protrusion 22.

[0048] The rectangular width of the second protrusion 22 is the same as the width of the second signal line 12.

[0049] In the above-mentioned first protrusion 21 and second protrusion 22, one of the two related technical features can exist or both can exist simultaneously, and no specific restriction is made here.

[0050] On the other hand, in this application, multiple second gap segments 1b are formed, and the multiple second gap segments 1b are arranged at intervals; the capacitor structure is provided for the multiple second gap segments. During the routing of differential lines, due to the consideration of routing issues, the differential signal lines often have multiple second gap segments 1b. Therefore, multiple capacitor structures are provided for the multiple second gap segments 1b to ensure that the impedance of the differential signal lines can be effectively reduced.

[0051] In the embodiments provided in this application, please refer to Figures 4 and 5. Compared with the conventional differential line structure, the differential line structure in this application has significantly improved impedance consistency. In particular, the impedance of the differential line in this application is less than that of the traditional structure, which improves impedance continuity and optimizes the return loss of the differential signal.

[0052] Based on the above differential line structure, this application also provides a printed circuit board, which includes the above differential line structure 100, that is, it has all the technical features of the above differential line structure 100, and therefore also has the technical effects brought about by all the above technical features, which will not be described in detail here.

[0053] The printed circuit board also includes a circuit board body, wherein the differential signal lines and the capacitor structure are laid on the circuit board body.

[0054] In the printed circuit board provided in this application, the first signal line 11 and the second signal line 12 are laid on the circuit board body. The longer signal line is wrapped with a bulge. A second gap segment 1b with a larger differential gap appears at the bulge. The impedance is higher at this point. A capacitor structure is laid on the circuit board body at the second gap segment 1b to reduce the effective gap of the second gap 1b, increase the capacitive coupling between the first signal line 11 and the second signal line 12, and thus reduce the differential impedance at the second gap 1b.

[0055] In one embodiment, multiple differential line structures 100 are provided to facilitate the simultaneous transmission of different signals.

[0056] Based on the printed circuit board described above, this application also provides an electronic device, which includes the printed circuit board described above, that is, includes the differential line structure described above, and has all the technical features of the differential line structure 100 described above. Therefore, it also has the technical effects brought about by all the technical features described above, which will not be described in detail here.

[0057] In the electronic device provided in this application, a printed circuit board is provided, and the printed circuit board performs circuit control. The printed circuit board includes a circuit board body, on which the first signal line 11 and the second signal line 12 are laid, and a capacitor structure is laid around the bulge to reduce the effective gap of the second gap 1b, increase the capacitive coupling between the first signal line 11 and the second signal line 12, and thereby reduce the differential impedance at the second gap 1b.

[0058] The above are merely some embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A differential line structure, wherein, The differential line structure comprises: a differential signal line comprising a first signal line and a second signal line, a differential gap being formed between the first signal line and the second signal line, the differential gap comprising a first gap segment and a second gap segment, the second gap segment having a width greater than that of the first gap segment; and a capacitance structure disposed in the two gap segments, the capacitance structure being configured to increase the capacitance of the first signal line and the second signal line at the second gap segment.

2. The differential line structure of claim 1, wherein, The capacitance structure comprises a first protrusion and a second protrusion, the first protrusion and the second protrusion being disposed along the width direction of the differential gap, the first protrusion being connected to the first signal line, and the second protrusion being connected to the second signal line.

3. The differential line structure of claim 2, wherein, The first protrusion and the second protrusion are staggered along the extension direction of the differential gap.

4. The differential line structure of claim 3, wherein, The sum of the extension length of the first protrusion and the extension length of the second protrusion is greater than the width of the second gap segment.

5. The differential line structure of claim 2, wherein, The first protrusion is provided in a plurality, and the plurality of first protrusions are spaced apart along the length direction of the differential gap; and / or The second protrusion is provided in a plurality, and the plurality of second protrusions are spaced apart along the length direction of the differential gap.

6. The differential line structure of claim 2, wherein, The first protrusion and the first signal line are integrally provided; and / or The second protrusion and the second signal line are integrally provided.

7. The differential line structure of claim 2, wherein, The first protrusion is provided in a rectangular extension; and / or The second protrusion is provided in a rectangular extension.

8. The differential line structure of claim 1, wherein, The second gap segment is provided in a plurality, and the plurality of second gap segments are spaced apart; The capacitance structure is provided in a plurality corresponding to the plurality of second gap segments.

9. A printed circuit board, wherein, The printed circuit board comprises: a circuit board body; and a differential line structure according to any one of claims 1 to 8, wherein the differential signal line and the capacitance structure are laid on the circuit board body.

10. An electronic device, comprising: The electronic device comprises the printed circuit board according to claim 9.

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