Processor system and server

Abstract

The embodiments of the present application belong to the technical field of servers. Provided are a processor system and a server. The processor system comprises: a processor, a power supply module, a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are arranged in parallel and are electrically connected to each other; the processor is arranged on the side of the first circuit board away from the second circuit board; and the power supply module is arranged on the side of the second circuit board away from the first circuit board and is opposite the processor, and the power supply module is used for supplying power to the processor. By means of providing a first circuit board and a second circuit board which are arranged in parallel and electrically connected to each other, and respectively arranging a processor and a power supply module on the sides of the first circuit board and the second circuit board facing away from each other, vertical power supply can be realized, and thus the power supply path is shortened to the maximum extent, and the impedance is reduced, thereby facilitating an improvement in the power supply efficiency of the processor.

Description

A processor system and a server

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 2024106749440, filed on May 28, 2024, entitled "A Processor System and a Server", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of server technology, specifically relating to a processor system and a server. Background Technology

[0004] Processors are indispensable in information processing devices such as computers. Commonly used processors such as CPUs, GPUs, BMCs, and CPLDs are widely used in computing devices like servers. With the development of electronic technology and the increasing demands on computer computing power, the power consumption of processors such as CPUs and GPUs has also increased. However, this increased power consumption due to improved computing power leads to a continuous increase in the current supplied to the processor.

[0005] In existing technologies, the processor and power supply are mounted on the same circuit board, with the power supply positioned around the processor. However, since the processor is typically housed within a package, the power supply cannot be placed close to the processor. This results in a longer power path and higher impedance between the processor and the power supply, leading to lower power supply efficiency for the processor. Summary of the Invention

[0006] This application aims to provide a processor system and server to solve the problem that the existing processor has a long power supply path and high impedance, resulting in low power supply efficiency.

[0007] To solve the above-mentioned technical problems, this application is implemented as follows:

[0008] In a first aspect, this application discloses a processor system, which includes: a processor, a power supply module, a first circuit board, and a second circuit board;

[0009] The first circuit board and the second circuit board are arranged in parallel and electrically connected to each other.

[0010] The processor is located on the side of the first circuit board opposite to the second circuit board;

[0011] The power supply module is located on the side of the second circuit board away from the first circuit board and opposite to the position of the processor. The power supply module is used to supply power to the processor.

[0012] In some embodiments of this application, the first circuit board is provided with a conductive via, and the end of the conductive via near the processor is electrically connected to the processor;

[0013] The second circuit board is provided with conductive blind vias. The end of the conductive blind via near the first circuit board is electrically connected to the conductive through-hole, and the end of the conductive blind via near the power supply module is electrically connected to the power supply module.

[0014] In some embodiments of this application, the thickness direction of the second circuit board is the first direction, and the second circuit board includes a top layer, an intermediate layer and a bottom layer disposed sequentially along the first direction, with the bottom layer close to the first circuit board;

[0015] The conductive blind via includes a first conductive blind via and a second conductive blind via. The first conductive blind via is disposed on the top layer and extends to the middle layer, and the second conductive blind via is disposed on the bottom layer and extends to the middle layer, so that the first conductive blind via and the second conductive blind via are connected.

[0016] In some embodiments of this application, the number of first conductive blind vias is greater than or equal to twice the number of second conductive blind vias.

[0017] In some embodiments of this application, the number of second conductive blind holes is the same as that of conductive through holes and their positions are opposite.

[0018] In some embodiments of this application, the depth of the first conductive blind via along the first direction is greater than or equal to the depth of the second conductive blind via along the first direction.

[0019] In some embodiments of this application, the power supply module includes a plurality of output capacitors;

[0020] The second circuit board has a capacitor area, which is used to centrally house multiple output capacitors. The second conductive blind via is located within the projection range of the capacitor area in the first direction.

[0021] In some embodiments of this application, a first terminal is provided on the side of the first circuit board away from the second circuit board, and a conductive via is positioned opposite to at least a portion of the first terminal and electrically connected to the first terminal. The first terminal is electrically connected to the processor.

[0022] The second circuit board has a second terminal on the side closest to the first circuit board. The conductive blind via is positioned opposite to at least part of the second terminal, and the second terminal is electrically connected to the conductive through hole and the conductive blind via, respectively.

[0023] In some embodiments of this application, the number of first terminals and second terminals are the same and their positions are opposite.

[0024] In some embodiments of this application, a first power supply connector is provided on the side of the first circuit board near the second circuit board, and the first power supply connector is electrically connected to the processor;

[0025] A second power supply connector is provided on the side of the second circuit board close to the first circuit board, and the second power supply connector is electrically connected to the power supply module.

[0026] The first power supply connector is connected to the second power supply connector so that the current from the power supply module can be transmitted to the processor.

[0027] In some embodiments of this application, the power supply module includes a first power supply component and a second power supply component, wherein the first power supply component is used to transmit current and the second power supply component is used to transmit signals.

[0028] The first power supply component is located in the middle area of ​​the second circuit board, and the second power supply component is located in the edge area of ​​the second circuit board.

[0029] In some embodiments of this application, the second circuit board includes: a body and an extension disposed at at least a portion of the edge of the body;

[0030] The first power supply component is located on the main body, and the second power supply component is located on the extension.

[0031] In some embodiments of this application, the processor system further includes a first package portion and a second package portion connected to each other, the first package portion and the second package portion being disposed on both sides of the first circuit board, and the second package portion being close to the second circuit board.

[0032] The first package has a first receiving cavity in which the processor is embedded; the second package has a second receiving cavity in which at least a portion of the second circuit board is embedded.

[0033] In some embodiments of this application, the second circuit board includes: a body and an extension disposed at at least a portion of the edge of the body;

[0034] The second encapsulation part has a notch at the corresponding position of the extension part, and the notch communicates with the second receiving cavity;

[0035] The main body is embedded in the second receiving cavity, and the extension is embedded in the notch.

[0036] In some embodiments of this application, the extension direction of the second circuit board is a second direction;

[0037] There are two extensions, which are arranged opposite to each other along the second direction;

[0038] There are two notches, which are positioned opposite each other along the second direction, and an extension is embedded in one of the notches.

[0039] Secondly, this application also discloses a server, which includes the processor system described above.

[0040] In some embodiments of this application, the server includes a base plate;

[0041] The processor system also includes a support component disposed between the first circuit board and the base plate to allow for a gap between the power supply module and the base plate.

[0042] In some embodiments of this application, the first circuit board is provided with support positioning holes at corresponding positions of the support member;

[0043] Along the extension direction of the support member, the support member has two opposing ends. The end of the support member that is away from the base plate is fixedly connected to the support positioning hole, and the end of the support member that is close to the base plate abuts against the base plate.

[0044] In some embodiments of this application, the support member includes: a support screw and a locking screw;

[0045] The support screw is located between the first circuit board and the base plate and abuts against the first circuit board and the base plate respectively. The end of the support screw near the first circuit board is provided with a locking groove.

[0046] At least a portion of the locking screw passes through the support positioning hole and is locked in place by the locking groove.

[0047] In some embodiments of this application, the thickness direction of the second circuit board is the first direction, and the server further includes: a base plate and a third circuit board;

[0048] The third circuit board is spaced apart from the first circuit board along the first direction and is electrically connected to each other. The third circuit board is located close to the base plate and is fixedly connected to the base plate.

[0049] The third circuit board is equipped with a heat sink, which is located close to the first circuit board. The heat sink is used to dissipate heat from the inside of the server.

[0050] In this embodiment, since a first circuit board and a second circuit board are arranged in parallel and electrically connected to each other, vertical power supply can be achieved by placing the processor and the power supply module on opposite sides of the first circuit board and the second circuit board, which minimizes the power supply path, reduces impedance, and improves the power supply efficiency of the processor.

[0051] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0052] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0053] Figure 1 is a schematic diagram of the structure of a processor system provided in an embodiment of this application;

[0054] Figure 2 is a second schematic diagram of the structure of a processor system provided in an embodiment of this application;

[0055] Figure 3 is a schematic diagram of another processor system provided in an embodiment of this application;

[0056] Figure 4 is a second schematic diagram of another processor system provided in an embodiment of this application;

[0057] Figure 5 is a third schematic diagram of another processor system provided in an embodiment of this application;

[0058] Figure 6 is a fourth schematic diagram of another processor system provided in an embodiment of this application;

[0059] Figure 7 is a schematic diagram of the structure of a second circuit board of another processor system provided in an embodiment of this application;

[0060] Figure 8 is a second schematic diagram of the structure of a second circuit board of another processor system provided in an embodiment of this application;

[0061] Figure 9 is a schematic diagram of the structure of the second package of another processor system provided in an embodiment of this application;

[0062] Figure 10 is a partial structural diagram of another server provided in an embodiment of this application;

[0063] Figure 11 is a second partial structural diagram of another server provided in an embodiment of this application;

[0064] Figure 12 is a schematic diagram of the structure of another server support component provided in an embodiment of this application.

[0065] Reference numerals: 1. Processor, 2. Power supply module, 21. Output capacitor, 22. Output inductor, 23. Power module, 24. Control chip, 25. Power supply path, 26. Power supply capacitor, 3. First circuit board, 31. Conductive via, 32. First terminal, 33. Support positioning hole, 34. Memory, 4. Second circuit board, 41. Conductive blind via, 411. First conductive blind via, 412. Second conductive blind via, 42. Second terminal, 43. Body, 44. Extension, 5. First package, 6. Second package, 61. Second receiving cavity, 62. Notch, 7. Support member, 71. Support screw, 711. Locking slot, 72. Locking screw, 8. Third circuit board, 81. Heat sink, 82. Hard disk, 9. Fourth circuit board, 91. Power supply unit, 92. Expansion card, 10. Connector, X. First direction, Y. Second direction. Detailed Implementation

[0066] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0067] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0068] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0069] In this application, the term "parallel" includes not only absolute parallelism but also approximate parallelism as commonly understood in engineering. For example, "parallel" refers to the angle between two lines, a line and a surface, or a surface, where the angle is between -1° and 1°. Similarly, "perpendicular" also includes not only absolute perpendicularity but also approximate perpendicularity as commonly understood in engineering. For example, "perpendicular" refers to the angle between two lines, a line and a surface, or a surface, where the angle is between 89° and 91°. Equal distances or equal angles include not only absolute equality but also approximate equality as commonly understood in engineering, meaning there may be a certain degree of error, such as a tolerance range of -1% to 1%.

[0070] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0071] This application provides a processor system, which will be described in detail below with reference to the accompanying drawings.

[0072] Referring to Figures 1 and 2, a schematic diagram of the structure of a processor system provided in an embodiment of this application is shown. Referring to Figures 3 to 6, a schematic diagram of the structure of another processor system provided in an embodiment of this application is shown. Referring to Figures 7 and 8, a schematic diagram of the structure of the second circuit board of another processor system provided in an embodiment of this application is shown. Referring to Figure 9, a schematic diagram of the structure of the second package of another processor system provided in an embodiment of this application is shown.

[0073] As shown in Figures 1 and 2, this application provides a processor system, which includes a first circuit board 3, a processor 1, and a power supply module 2 disposed on the first circuit board 3. Since the processor 1 requires a high current, the power supply module 2 is typically placed as close as possible to the processor 1 to reduce power loss. However, the processor 1 is usually housed within a package structure, which includes a first package portion 5 and a second package portion 6. The first package portion 5 and the second package portion 6 are interconnected and respectively disposed on both sides of the first circuit board 3. The first package portion 5 has a first receiving cavity in which the processor 1 is disposed. The second package portion 6 has a second receiving cavity 61 for accommodating a power supply capacitor 26.

[0074] In some embodiments of this application, due to the presence of the packaging structure, the power supply module 2 cannot be placed close to the processor 1, resulting in a longer power supply path 25 and higher impedance. This necessitates increasing the power supply plane to reduce conduction losses, which increases costs. Furthermore, the current of the processor 1 changes dynamically during normal operation. Because the power supply path 25 is long, a large number of power supply capacitors 26 are required to ensure that the power supply voltage meets the normal operating range of the processor 1 under dynamic loads. As shown in Figure 2, a large number of power supply capacitors 26 are placed in the second receiving cavity 61. Due to the limited space in the second receiving cavity 61, small, high-capacity capacitors are typically required, leading to a significant increase in cost.

[0075] As shown in Figures 3 to 6, this application provides another processor system, which includes: a processor 1, a power supply module 2, a first circuit board 3, and a second circuit board 4; the first circuit board 3 and the second circuit board 4 are arranged in parallel and electrically connected to each other; the processor 1 is disposed on the side of the first circuit board 3 away from the second circuit board 4; the power supply module 2 is disposed on the side of the second circuit board 4 away from the first circuit board 3 and opposite to the position of the processor 1, and the power supply module 2 is used to supply power to the processor 1.

[0076] In some embodiments of this application, by setting up a first circuit board 3 and a second circuit board 4 arranged in parallel and electrically connected to each other, and by placing the processor 1 and the power supply module 2 on opposite sides of the first circuit board 3 and the second circuit board 4 respectively, vertical power supply can be achieved, minimizing the power supply path 25, reducing impedance, and improving the power supply efficiency of the processor 1. Furthermore, because the power supply path 25 is shortened, on the one hand, it is not necessary to add a power supply plane on the first circuit board 3, which reduces both conduction losses and the cost of the first circuit board 3. On the other hand, when the load on the processor 1 changes, the power supply module 2 can quickly respond and provide energy, keeping the supply voltage within the normal operating range, eliminating the need for an additional power supply capacitor 26, which further reduces the cost of the first circuit board 3.

[0077] In practical applications, the first circuit board 3 is typically the motherboard, which simultaneously handles a large amount of current and signal transmission. This embodiment of the application provides a second circuit board 4, with the power supply module 2 positioned on the side of the second circuit board 4 away from the first circuit board 3. This allows the ground plane of the second circuit board 4 to effectively shield the power supply module 2 from interference with signal transmission on the motherboard. It should be noted that the first circuit board 3 and the second circuit board 4 can be printed circuit boards. Additionally, the first circuit board 3 also houses a memory module 34, which is positioned around the processor 1 to temporarily store the processor 1's processing data. Furthermore, since the processor 1 generates heat during operation, as shown in Figure 6, a finned heatsink is typically installed on the side of the processor 1 away from the first circuit board 3 to dissipate the heat and improve the processor 1's performance.

[0078] In some optional embodiments of this application, the first circuit board 3 is provided with a conductive via 31, and the end of the conductive via 31 near the processor 1 is electrically connected to the processor 1; the second circuit board 4 is provided with a conductive blind via 41, the end of the conductive blind via 41 near the first circuit board 3 is electrically connected to the conductive via 31, and the end of the conductive blind via 41 near the power supply module 2 is electrically connected to the power supply module 2.

[0079] In some embodiments of this application, since the first circuit board 3 is provided with conductive vias 31 and the second circuit board 4 is provided with conductive buried vias 41, the electrical connection between the processor 1 and the power supply module 2 can be achieved through the electrical connection between the conductive vias 31 and the conductive buried vias 41, so that the power supply module 2 can supply power to the processor 1. Furthermore, typically, the side of the first circuit board 3 closest to the second circuit board 4 is provided with high-speed lines responsible for data transmission and vias for these high-speed lines. Since high-speed lines have high signal quality requirements, the conductive buried vias 41 can prevent noise interference from the power supply module 2 from being transmitted to the high-speed lines of the first circuit board 3.

[0080] It should be noted that, in the embodiments of this application, conductive materials can be coated inside the walls of the conductive through-hole 31 and the conductive blind buried hole 41, or conductive materials can be filled inside the conductive through-hole 31 and the conductive blind buried hole 41, so that the conductive through-hole 31 and the conductive blind buried hole 41 have conductive properties.

[0081] In some optional embodiments of this application, as shown in FIG5, a first terminal 32 is provided on the side of the first circuit board 3 away from the second circuit board 4, and a conductive via 31 is positioned opposite to at least a portion of the first terminal 32 and electrically connected to the first terminal 32. The first terminal 32 is electrically connected to the processor 1. A second terminal 42 is provided on the side of the second circuit board 4 close to the first circuit board 3, and a conductive blind via 41 is positioned opposite to at least a portion of the second terminal 42. The second terminal 42 is electrically connected to the conductive via 31 and the conductive blind via 41, respectively.

[0082] In some embodiments of this application, since a first terminal 32 is provided and the conductive via 31 is positioned opposite to at least a portion of the first terminal 32, the conductive via 31 and the first terminal 32 opposite to it can be directly electrically connected, thereby shortening the power supply path and reducing impedance. Since a second terminal 42 is provided and the conductive buried via 41 is positioned opposite to at least a portion of the second terminal 42, the conductive buried via 41 and the second terminal 42 opposite to it can be electrically connected, thereby shortening the power supply path and reducing impedance. Furthermore, through the electrical connection between the first terminal 32 and the conductive via 31, and the electrical connection between the second terminal 42 and the conductive buried via 41 and the conductive via 31, the current output by the power supply module 2 can be transmitted to the processor 1 sequentially through the conductive buried via 41, the second terminal 42, the conductive via 31, and the first terminal 32, thereby achieving reliable power supply to the processor 1.

[0083] It should be noted that the specific number of the first terminal 32 and the second terminal 42 is not limited in the embodiments of this application, and those skilled in the art can adjust them according to actual needs. In specific applications, the first terminal 32 includes terminals for transmitting current and terminals for transmitting signals, and the conductive via 31 is only electrically connected to the terminals in the first terminal 32 used for transmitting current. However, for different processors 1, the positions of the terminals in the first terminal 32 used for transmitting current are usually not the same. Based on this, the number of the first terminal 32 and the second terminal 42 in the embodiments of this application are the same and their positions are opposite. In this way, even if the position of the terminals in the first terminal 32 used for transmitting current changes, they can be directly electrically connected to the corresponding second terminal 42 through the conductive via 31. This not only shortens the power supply path and reduces impedance, but also improves the versatility of the second circuit board 4. In one embodiment, the second terminal 42 is formed using BGA ball-mounting technology, and the second terminal 42 is electrically connected to the conductive via 31 and the conductive blind via 41 by soldering.

[0084] In some optional embodiments of this application, the thickness direction of the second circuit board 4 is a first direction X. The second circuit board 4 includes a top layer, an intermediate layer, and a bottom layer sequentially disposed along the first direction X, with the bottom layer close to the first circuit board 3. The conductive blind via 41 includes a first conductive blind via 411 and a second conductive blind via 412. The first conductive blind via 411 is disposed on the top layer and extends to the intermediate layer, and the second conductive blind via 412 is disposed on the bottom layer and extends to the intermediate layer, so that the first conductive blind via 411 and the second conductive blind via 412 are connected. In this way, by electrically connecting the end of the second conductive blind via 412 close to the first circuit board 3 to the conductive via 31, the current output by the power supply module 2 can be transmitted sequentially from the side of the second circuit board 4 away from the first circuit board 3 to the other side through the first conductive blind via 411, the intermediate layer, and the second conductive blind via 412, which is beneficial to improving the reliability of current transmission.

[0085] It should be noted that, in this embodiment, the first direction X refers to the thickness direction of the second circuit board 4, which is also the thickness direction of the first circuit board 3, and the second direction Y refers to the length or width direction of the second circuit board 4, which is also the length or width direction of the first circuit board 3. The first direction X is perpendicular to the second direction Y. Furthermore, in this embodiment, the top layer, middle layer, and bottom layer only refer to different positions in the thickness direction of the second circuit board 4, and are not a limitation on the number of layers in the second circuit board 4.

[0086] In some optional embodiments of this application, the number of second conductive blind holes 412 is the same as the number of conductive through holes 31, and their positions are opposite. The number of first conductive blind holes 411 is greater than or equal to twice the number of second conductive blind holes 412.

[0087] In this embodiment, since the conductive via 31 is electrically connected to the second conductive blind via 412, when the number of second conductive blind vias 412 and the number of conductive vias 31 are the same and their positions are opposite, a one-to-one electrical connection between the conductive vias 31 and the second conductive blind vias 412 can be achieved, which is beneficial to further reduce the power supply path. Since the number of first conductive blind vias 411 is greater than or equal to twice the number of second conductive blind vias 412, that is, each first conductive blind via 411 can be electrically connected to at least two second conductive blind vias 412, wherein at least two second conductive blind vias 412 are connected in parallel, this can further reduce the impedance and is beneficial to further improve the power supply efficiency of the processor 1.

[0088] It should be noted that the embodiments of this application do not limit the number of conductive vias 31, first conductive blind vias 411, and second conductive blind vias 412, and those skilled in the art can adjust them according to actual needs. In one embodiment, as shown in Figures 7 and 8, the second circuit board 4 has four second conductive blind vias 412 on the side close to the first circuit board 3, that is, on the bottom layer of the second circuit board 4, and twelve first conductive blind vias 411 on the side of the second circuit board 4 away from the first circuit board 3, that is, on the top layer of the second circuit board 4.

[0089] In some optional embodiments of this application, the depth of the first conductive blind via 411 along the first direction X is greater than or equal to the depth of the second conductive blind via 412 along the first direction X. This facilitates the fabrication of the second circuit board 4 and reduces its manufacturing difficulty. When the depth of the first conductive blind via 411 along the first direction X is greater than the depth of the second conductive blind via 412 along the first direction X, and the number of first conductive blind vias 411 is greater than the number of first conductive blind vias 412, the overall impedance of the second circuit board 4 can be further reduced, which helps to further improve the power supply efficiency of the processor 1.

[0090] It should be noted that the embodiments of this application do not limit the depth values ​​of the first conductive blind hole 411 and the second conductive blind hole 412 along the first direction X. Those skilled in the art can adjust them according to the actual thickness of the selected second circuit board 4.

[0091] In practical applications, the power supply module 2 typically includes components such as a control chip 24, a power module 23, an output inductor 22, and an output capacitor 21. The control chip 24 is primarily used for signal transmission to control the power supply voltage output by the power supply module 2. The power module 23, output inductor 22, and output capacitor 21 are primarily used for current transmission. The power module 23 and output inductor 22 are sources of high-frequency interference. Therefore, in some optional embodiments of this application, the power supply module 2 includes multiple output capacitors 21; the second circuit board 4 has a capacitor area for centrally arranging multiple output capacitors 21, and a first conductive blind via 411 is located within the projection range of the capacitor area in the first direction X. Thus, by placing the first conductive blind via 411 within the projection range of the capacitor area in the first direction X, on the one hand, it can be placed as far away from the control chip 24 as possible, thereby reducing the interference of the current transmission of the first conductive blind via 411 on the signal transmission of the control chip 24; on the other hand, it can be placed as far away as possible from high-frequency interference sources such as the power module 23 and output inductor 22, thereby effectively reducing the transmission of noise interference.

[0092] In some optional embodiments of this application, a first power supply connector is provided on the side of the first circuit board 3 near the second circuit board 4, and the first power supply connector is electrically connected to the processor 1; a second power supply connector is provided on the side of the second circuit board 4 near the first circuit board 3, and the second power supply connector is electrically connected to the power supply module 2; wherein, the first power supply connector and the second power supply connector are connected to enable the current of the power supply module 2 to be transmitted to the processor 1.

[0093] In some embodiments of this application, by providing a first power supply connector and a second power supply connector that can be interconnected, an electrical connection can be achieved between the processor 1 and the power supply module 2, so that current from the power supply module 2 can be transmitted to the processor 1. Compared with the method of welding the second terminal 42 to the conductive via 31 and the conductive blind via 41 described above, this electrical connection method is simpler, but has a higher impedance.

[0094] It should be noted that the first power supply connector and the second power supply connector can be board-to-board high-density connectors. The first power supply connector and the second power supply connector can be connected to the first circuit board 3 and the second circuit board 4 via wave soldering. One of the first power supply connectors and the other is a male connector, and the other is a female connector compatible with the male connector. The accompanying drawings of this embodiment do not show the case where the first circuit board 3 has the first power supply connector and the second circuit board 4 has the second power supply connector. However, in practical applications, those skilled in the art can also configure interconnectable first and second power supply connectors to achieve electrical connection between the processor 1 and the power supply module 2, so that current from the power supply module 2 can be transmitted to the processor 1.

[0095] In some optional embodiments of this application, the power supply module 2 includes a first power supply component and a second power supply component. The first power supply component is used to transmit current, and the second power supply component is used to transmit signals. The first power supply component is disposed in the middle region of the second circuit board 4, and the second power supply component is disposed in the edge region of the second circuit board 4. Thus, by placing the first power supply component in the middle region of the second circuit board 4 and the second power supply component in the edge region of the second circuit board 4, the first power supply component used for transmitting current and the second power supply component used for transmitting signals can be separated as much as possible, reducing mutual interference. Furthermore, since the conductive via 41 is usually disposed in the middle region of the second circuit board 4, placing the first power supply component in the middle region of the second circuit board 4 allows for close proximity of the first power supply component and the conductive via 41, which helps to shorten the power supply path and reduce impedance.

[0096] It should be noted that in this embodiment, the central region refers to the area near the center of the second circuit board 4, and the edge region refers to the area away from the center of the second circuit board 4. Furthermore, the power supply module 2 typically includes components such as a control chip 24, a power module 23, an output inductor 22, and an output capacitor 21. Based on this, in this embodiment, the first power supply components include the power module 23, the output inductor 22, and the output capacitor 21, and the second power supply components include the control chip 24.

[0097] In some optional embodiments of this application, the second circuit board 4 includes a body 43 and an extension 44 disposed at at least part of the edge of the body 43; a first power supply component is disposed on the body 43, and a second power supply component is disposed on the extension 44. Thus, by providing the extension 44 and placing the second power supply component thereon, on the one hand, the distance between the second power supply component and the first power supply component can be increased, further reducing mutual interference between them. On the other hand, it facilitates the connection of the signal line of the second power supply component to the first circuit board 3 on the side of the second circuit board 4 closest to the first circuit board 3.

[0098] It should be noted that the embodiments of this application do not limit the location or number of the extension portions 44, and those skilled in the art can adjust them according to actual needs. In one embodiment, the extension direction of the second circuit board 4 is the second direction Y, and two extension portions 44 are provided, which are arranged opposite to each other along the second direction Y. This structure is simple and easy to process. It should be noted that the extension direction of the second circuit board 4, that is, the second direction Y, can be the length direction of the second circuit board 4 or the width direction of the second circuit board 4.

[0099] In some optional embodiments of this application, the processor system further includes a first package 5 and a second package 6 connected to each other. The first package 5 and the second package 6 are respectively disposed on both sides of the first circuit board 3, and the second package 6 is close to the second circuit board 4. The first package 5 has a first receiving cavity (not shown), and the processor 1 is embedded in the first receiving cavity. The second package 6 has a second receiving cavity 61, and at least a portion of the second circuit board 4 is embedded in the second receiving cavity 61.

[0100] In some embodiments of this application, a first encapsulation portion 5 is provided, which has a first receiving cavity. By embedding the processor 1 in the first receiving cavity, the processor 1 can be protected. A second encapsulation portion 6 is provided, which has a second receiving cavity 61. By embedding at least a portion of the second circuit board 4 in the receiving cavity, the second circuit board 4 can be protected.

[0101] In practical applications, the first encapsulation part 5 and the second encapsulation part 6 can adopt existing encapsulation structures. Typically, the second encapsulation part 6 has a stud on the side close to the first circuit board 3, the first circuit board 3 has a mounting hole at the corresponding position of the stud, the first encapsulation part 5 has a nut, and the stud of the second encapsulation part 6 passes through the mounting hole and is fastened with the nut of the first encapsulation part 5, thereby realizing the fixed connection between the first encapsulation part 5 and the second encapsulation part 6.

[0102] In some optional embodiments of this application, the second circuit board 4 includes: a body 43 and an extension 44 disposed at at least part of the edge of the body 43; the second encapsulation portion 6 is provided with a notch 62 at a corresponding position of the extension 44, the notch 62 communicating with the second receiving cavity 61; the body 43 is embedded in the second receiving cavity 61, and the extension 44 is embedded in the notch 62. In this way, by providing the notch 62, the extension 44 of the second circuit board 4 can be avoided, preventing interference when the second circuit board 4 is assembled with the first circuit board 3.

[0103] It should be noted that the embodiments of this application do not limit the location and number of notches 62. Those skilled in the art can adjust them according to actual needs. It is understood that the number of notches 62 and extensions 44 are the same and their positions are opposite. In one embodiment, there are two extensions 44, which are arranged opposite to each other along the second direction Y; there are two notches 62, which are arranged opposite to each other along the second direction Y, and one extension 44 is embedded in one notch 62.

[0104] In summary, the processor system provided in some embodiments of this application has at least the following advantages:

[0105] In some embodiments of this application, by providing a first circuit board and a second circuit board arranged in parallel and electrically connected to each other, and by placing the processor and the power supply module on opposite sides of the first and second circuit boards, vertical power supply can be achieved. This minimizes the power supply path, reduces impedance, and improves the processor's power supply efficiency. Furthermore, due to the shortened power supply path, on the one hand, it is unnecessary to add a power supply plane to the first circuit board, reducing both conduction losses and the cost of the first circuit board. On the other hand, when the processor load changes, the power supply module can quickly respond and provide energy, keeping the supply voltage within the normal operating range. This eliminates the need for an additional power supply capacitor, further reducing the cost of the first circuit board.

[0106] Referring to Figures 10 and 11, a partial structural diagram of a server provided in an embodiment of this application is shown. Referring to Figure 12, a structural diagram of a support component of another server provided in an embodiment of this application is shown.

[0107] As shown in Figures 10 and 11, this application embodiment also provides a server, which includes the processor system of any of the above embodiments. It should be noted that the structure of the processor system in this application embodiment is the same as that of the processor system in any of the above embodiments, and its beneficial effects are similar, so further details will not be provided here.

[0108] In some alternative embodiments of this application, the server includes a base plate (not shown); the processor system also includes a support 7 disposed between the first circuit board 3 and the base plate to create a gap between the power supply module 2 and the base plate.

[0109] In some embodiments of this application, a support member 7 is provided between the first circuit board 3 and the base plate, allowing a gap between the power supply module 2 and the base plate. This serves two purposes: firstly, it prevents interference between the power supply module 2, located below the first circuit board 3 (i.e., on the side of the first circuit board 3 closest to the base plate), and the base plate during assembly, thus protecting the power supply module 2 from damage. Secondly, it provides sufficient space for heat dissipation, facilitating heat exchange between the power supply module 2 and the surrounding air, thereby achieving heat dissipation for the power supply module 2.

[0110] In some optional embodiments of this application, as shown in Figures 3 and 12, the first circuit board 3 is provided with a support positioning hole 33 at a corresponding position on the support member 7; along the extending direction of the support member 7, the support member 7 has two opposing ends, one end of the support member 7 away from the base plate is fixedly connected to the support positioning hole 33, and the other end of the support member 7 near the base plate abuts against the base plate. By fixing the support member 7 to the support positioning hole 33 and abutting against the base plate respectively, the first circuit board 3 can be supported, so that a certain distance is maintained between the power supply module 2 and the base plate.

[0111] It should be noted that the embodiments of this application do not limit the location and number of the support members 7. Those skilled in the art can adjust them according to the actual situation such as the distribution of components on the first circuit board 3. It is understood that the number of support members 7 and the support positioning holes 33 are the same and their positions are opposite, and the support positioning holes 33 should avoid the wiring and components of the first circuit board 3.

[0112] Specifically, the support member 7 includes a support screw 71 and a locking screw 72; the support screw 71 is disposed between the first circuit board 3 and the base plate and abuts against the first circuit board 3 and the base plate respectively, and a locking groove 711 is provided at one end of the support screw 71 near the first circuit board 3; at least part of the locking screw 72 passes through the support positioning hole 33 and is locked with the locking groove 711.

[0113] In this embodiment, a support screw 71 and a locking screw 72 are provided, wherein the end of the support screw 71 near the first circuit board 3 is provided with a locking groove 711. Thus, the support screw 71 can be placed on the side of the first circuit board 3 near the base plate, and the locking groove 711 can correspond to the support positioning hole 33. By passing the locking screw 72 through the support positioning hole 33 and locking it with the locking groove 711, a reliable connection between the support member 7 and the first circuit board 3 can be achieved.

[0114] In some optional embodiments of this application, the thickness direction of the second circuit board 4 is the first direction X. The server further includes a base plate and a third circuit board 8. The third circuit board 8 and the first circuit board 3 are spaced apart along the first direction X and electrically connected to each other. The third circuit board 8 is located close to the base plate and fixedly connected to the base plate. The third circuit board 8 is provided with a heat sink 81, which is located close to the first circuit board 3 and is used to dissipate heat from the inside of the server. In this way, by placing the heat sink 81 close to the first circuit board 3, not only can other heat-generating components inside the server be dissipated, thereby reducing the overall temperature of the server, but it can also provide auxiliary heat dissipation for the power supply module 2 located on the side of the first circuit board 3 near the base plate, which is beneficial to further improve the heat dissipation effect of the power supply module 2.

[0115] In practical applications, as shown in Figure 10, the server also includes a fourth circuit board 9, which, along with the third circuit board 8, is located at both ends of the first circuit board 3 along the second direction Y. The third circuit board 8 is a storage node, equipped with components such as a heatsink 81 and a hard disk 82. The heatsink 81, like a fan, dissipates heat from the server's internal components. The hard disk 82 stores the operating system, applications, and data, such as a rotating disk drive (HDD) based on magnetic storage technology or a solid state drive (SSD) based on flash memory. The fourth circuit board 9 is a computing node, equipped with components such as a power supply unit (PSU) 91 and expansion cards 92. The power supply unit (PSU) provides the necessary power to the server, converting the input alternating current (AC) into direct current (DC) usable by the server's internal components and ensuring power stability and distribution. The PSU power supply is connected to the fourth circuit board 9 via a CRPS (Common Redundant Power Supplies) connector 10 to provide power to the system. In this embodiment, the power supply 91 supplies power to the power supply module 2. Specifically, power supply vias can be provided at corresponding positions on the first circuit board 3 and the second circuit board 4. The current transmitted by the power supply 91 is sequentially transmitted to the power supply module 2 via the lines of the first circuit board 3, the power supply vias on the first circuit board 3, the power supply vias on the second circuit board 4, and the lines of the second circuit board 4. The expansion card 92 is connected to the server motherboard via a PCI Express (PCIe) interface. It can provide additional functions or enhance the server's performance, such as a network interface card (NIC) providing network connectivity, a graphics processing unit (GPU) accelerating graphics processing, or a memory card expanding storage capacity. The expansion card 92 is connected to the fourth circuit board 9 via a PCIe Slot. In this embodiment, since the power supply module 2 is located on the back of the first circuit board 3, i.e., the side of the first circuit board 3 closest to the base plate, interference with the component traces located on the front of the first circuit board 3, i.e., the side of the first circuit board 3 away from the base plate, can be avoided.

[0116] In practical applications, the fourth circuit board 9, the first circuit board 3, and the third circuit board 8 are electrically connected to each other via connector 10 to achieve current and signal transmission. In one embodiment, the third circuit board 8 is electrically connected to the first circuit board 3 via 5 pairs of high-density connectors to enable high-speed and low-speed signal interaction with the first circuit board 3, and is electrically connected to the first circuit board 3 via 2 pairs of Radsok power connectors to enable the first circuit board 3 to supply power to the third circuit board 8. The fourth circuit board 9 is electrically connected to the first circuit board 3 via 7 pairs of high-density connectors to enable high-speed and low-speed signal interaction with the first circuit board 3, and is electrically connected to the first circuit board 3 via 4 pairs of Radsok power connectors to enable the fourth circuit board 9 to supply power to both the first circuit board 3 and the third circuit board 8.

[0117] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0118] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A processor system, characterized by The processor system includes: a processor, a power supply module, a first circuit board, and a second circuit board; The first circuit board and the second circuit board are arranged in parallel and electrically connected to each other. The processor is disposed on the side of the first circuit board opposite to the second circuit board; The power supply module is located on the side of the second circuit board away from the first circuit board and opposite to the position of the processor. The power supply module is used to supply power to the processor.

2. The processor system of claim 1, wherein, The first circuit board is provided with a conductive via, and the end of the conductive via near the processor is electrically connected to the processor; The second circuit board is provided with a conductive blind via. The end of the conductive blind via near the first circuit board is electrically connected to the conductive through hole, and the end of the conductive blind via near the power supply module is electrically connected to the power supply module.

3. The processor system of claim 2, wherein, The thickness direction of the second circuit board is the first direction, and the second circuit board includes a top layer, an intermediate layer and a bottom layer arranged sequentially along the first direction, with the bottom layer close to the first circuit board; The conductive blind via includes a first conductive blind via and a second conductive blind via. The first conductive blind via is disposed on the top layer and extends to the middle layer, and the second conductive blind via is disposed on the bottom layer and extends to the middle layer, so that the first conductive blind via and the second conductive blind via are connected.

4. The processor system of claim 3, wherein, The number of the first conductive blind vias is greater than or equal to twice the number of the second conductive blind vias.

5. The processor system of claim 3, wherein, The second conductive blind hole is the same number as the conductive through hole and their positions are opposite.

6. The processor system of claim 3, wherein, The depth of the first conductive blind via along the first direction is greater than or equal to the depth of the second conductive blind via along the first direction.

7. The processor system of claim 3, wherein The power supply module includes multiple output capacitors; The second circuit board has a capacitor area, which is used to centrally arrange multiple output capacitors, and the first conductive blind via is located within the projection range of the capacitor area in the first direction.

8. The processor system of claim 2, wherein, The first circuit board has a first terminal on the side opposite to the second circuit board. The conductive via is opposite to at least a portion of the first terminal and is electrically connected to the first terminal. The first terminal is electrically connected to the processor. The second circuit board has a second terminal on the side close to the first circuit board. The conductive blind via is opposite to at least part of the second terminal. The second terminal is electrically connected to the conductive through hole and the conductive blind via, respectively.

9. The processor system of claim 8, wherein, The number of the first terminal and the second terminal are the same and their positions are opposite.

10. The processor system of claim 1, wherein, A first power supply connector is provided on the side of the first circuit board near the second circuit board, and the first power supply connector is electrically connected to the processor; A second power supply connector is provided on the side of the second circuit board close to the first circuit board, and the second power supply connector is electrically connected to the power supply module; The first power connector is connected to the second power connector so that the current from the power supply module is transmitted to the processor.

11. The processor system of claim 1, wherein, The power supply module includes a first power supply component and a second power supply component. The first power supply component is used to transmit current, and the second power supply component is used to transmit signals. The first power supply component is located in the middle area of ​​the second circuit board, and the second power supply component is located in the edge area of ​​the second circuit board.

12. The processor system of claim 11, wherein, The second circuit board includes: a body and an extension disposed at least partially along the edge of the body; The first power supply component is disposed on the main body, and the second power supply component is disposed on the extension.

13. The processor system of claim 1, wherein, The processor system further includes a first package and a second package that are connected to each other. The first package and the second package are respectively disposed on both sides of the first circuit board, and the second package is close to the second circuit board. The first package has a first receiving cavity, in which the processor is embedded; the second package has a second receiving cavity, in which at least a portion of the second circuit board is embedded.

14. The processor system of claim 13, wherein, The second circuit board includes: a body and an extension disposed at least partially along the edge of the body; The second encapsulation portion has a notch at a corresponding position of the extension portion, and the notch communicates with the second receiving cavity; The main body is embedded in the second receiving cavity, and the extension is embedded in the notch.

15. The processor system of claim 14, wherein, The extension direction of the second circuit board is the second direction; Two extension portions are provided, and the two extension portions are arranged opposite to each other along the second direction; There are two notches, which are arranged opposite each other along the second direction, and an extension is embedded in one of the notches.

16. A server, characterized by The server includes the processor system according to any one of claims 1-15.

17. The server of claim 16, wherein, The server includes a base plate; The processor system also includes a support member disposed between the first circuit board and the base plate, so that there is a gap between the power supply module and the base plate.

18. The server according to claim 17, characterized in that, The first circuit board is provided with support positioning holes at corresponding positions of the support member; Along the extending direction of the support member, the support member has two opposing ends. The end of the support member opposite to the base plate is fixedly connected to the support positioning hole, and the end of the support member close to the base plate abuts against the base plate.

19. The server according to claim 18, characterized in that, The support component includes: a support screw and a locking screw; The support screw is disposed between the first circuit board and the base plate and abuts against the first circuit board and the base plate respectively. A locking groove is provided at the end of the support screw near the first circuit board. At least a portion of the locking screw passes through the support positioning hole and is locked in place by the locking groove.

20. A server according to claim 16, characterized in that, The thickness direction of the second circuit board is the first direction, and the server also includes: a base plate and a third circuit board; The third circuit board is spaced apart from the first circuit board along the first direction and electrically connected to each other. The third circuit board is located close to the base plate and is fixedly connected to the base plate. The third circuit board is equipped with a heat sink, which is located close to the first circuit board and is used to dissipate heat from the inside of the server.

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