Heat dissipation apparatus and telecommunication device

Abstract

A heat dissipation apparatus and a telecommunication device, relating to the technical field of heat dissipation. The apparatus comprises a heat dissipation base plate, a mounting substrate, a heat dissipation pipe assembly, a first heat sink fin assembly, and a second heat sink fin assembly; the mounting substrate is provided with a mounting hole, and the mounting hole runs through the mounting substrate in a first direction; the mounting substrate has a first surface and a second surface which are opposite to each other in the first direction; the heat dissipation base plate protrudes out of the second surface, or the heat dissipation base plate is flush with the second surface, and the heat dissipation base plate is configured to dissipate heat from a part requiring cooling; the heat dissipation pipe assembly is connected to the heat dissipation base plate, and a heat dissipation medium is provided in the heat dissipation pipe assembly; and the first heat sink fin assembly is connected to the second heat sink fin assembly, the first heat sink fin assembly is fixed to the first surface, and a part of the heat dissipation pipe assembly is located between the first heat sink fin assembly and the second heat sink fin assembly.

Description

Heat dissipation device and telecommunication equipment

[0001] Cross-reference to Related Applications

[0002] The present application claims priority to the Chinese patent application No. 2024106769919, filed on May 29, 2024, and entitled "Heat dissipation device and telecommunication equipment", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device and a telecommunication equipment. BACKGROUND

[0004] With the development of technology, telecommunication equipment such as servers and switches are increasingly widely used. Generally, a chip is arranged in the telecommunication equipment, and the chip generates heat during operation, which causes the temperature of the chip to rise, and in turn causes the operation speed of the chip to decrease. In order to improve the operation speed of the chip, the chip usually needs to be cooled. In the related art, a heat dissipation device is usually used to contact the chip to cool the chip. However, in the related art, the heat dissipation efficiency of the heat dissipation device is low. SUMMARY

[0005] The purpose of the embodiments of the present application is to provide a heat dissipation device and a telecommunication equipment, which at least solve the problem of low heat dissipation efficiency of the heat dissipation device.

[0006] In some embodiments of the present application, a heat dissipation device is provided, the heat dissipation device has a first direction, and the heat dissipation device comprises a heat dissipation bottom plate, a mounting substrate, a heat dissipation pipe assembly, a first heat dissipation fin assembly, and a second heat dissipation fin assembly.

[0007] The mounting substrate is provided with a mounting hole, and the mounting hole penetrates the mounting substrate along the first direction. The mounting substrate has opposite first and second surfaces along the first direction. The heat dissipation bottom plate is arranged in the mounting hole and protrudes from the second surface or is flush with the second surface. The heat dissipation bottom plate is used to cool a component to be cooled.

[0008] The heat dissipation pipe assembly is connected to the heat dissipation bottom plate and is provided with a heat dissipation medium. The first and second heat dissipation fin assemblies are connected, and the first heat dissipation fin assembly is fixed to the first surface. Part of the heat dissipation pipe assembly is located between the first and second heat dissipation fin assemblies.

[0009] In the case that the heat dissipation bottom plate cools the component to be cooled, the heat dissipation bottom plate transmits the heat of the component to be cooled to the heat dissipation pipe assembly. The heat dissipation medium flows in the heat dissipation pipe assembly and flows through the first and second heat dissipation fin assemblies. The first and second heat dissipation fin assemblies cool the heat dissipation pipe assembly.

[0010] In some embodiments of the present application, the heat dissipation base is provided with heat dissipation channels, and two ends of the heat dissipation pipe assembly are connected to the heat dissipation channels, and the heat dissipation channels are in communication with the interiors of the heat dissipation pipe assembly.

[0011] In some embodiments of the present application, the heat dissipation pipe assembly comprises a plurality of first heat dissipation pipes, a plurality of second heat dissipation pipes, a third heat dissipation pipe, a fourth heat dissipation pipe and a connecting pipe, the number of heat dissipation channels is plural, the plurality of heat dissipation channels are arranged at intervals, the heat dissipation channel has opposite first and second openings, and the first and second openings are in communication with the interior of the heat dissipation channel.

[0012] The first ends of the plurality of first heat dissipation pipes are connected to the first opening, the first end of the third heat dissipation pipe is connected to the first opening, the third heat dissipation pipe is located on one side of the plurality of first heat dissipation pipes, the first ends of the plurality of second heat dissipation pipes are connected to the second opening, the first end of the fourth heat dissipation pipe is connected to the second opening, the fourth heat dissipation pipe is located on one side of the plurality of second heat dissipation pipes, the third heat dissipation pipe and the fourth heat dissipation pipe are staggered, the second ends of the first heat dissipation pipes and the second ends of the second heat dissipation pipes are connected, one end of the connecting pipe is connected to the second end of the third heat dissipation pipe, and the other end of the connecting pipe is connected to the second end of the fourth heat dissipation pipe.

[0013] The connection between the first heat dissipation pipe and the second heat dissipation pipe is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly, and the connecting pipe is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

[0014] In some embodiments of the present application, the first heat dissipation pipe is inclined to the heat dissipation base along the second direction at the connection with the second heat dissipation pipe, and the second heat dissipation pipe is inclined to the heat dissipation base along the second direction at the connection with the first heat dissipation pipe.

[0015] The second direction intersects the first direction.

[0016] In some embodiments of the present application, the first heat dissipation pipe, the second heat dissipation pipe, the third heat dissipation pipe and the fourth heat dissipation pipe each comprise a first pipe segment, a second pipe segment and a third pipe segment.

[0017] The opposite ends of the second pipe segment are connected to the first pipe segment and the third pipe segment, respectively, and the diameter of the second pipe segment decreases along the direction from the first pipe segment to the third pipe segment.

[0018] The first pipe segment of the first heat dissipation pipe is connected to the first opening, the first pipe segment of the second heat dissipation pipe is connected to the second opening, the third pipe segment of the first heat dissipation pipe is connected to the third pipe segment of the second heat dissipation pipe, the first pipe segment of the third heat dissipation pipe is connected to the first opening, the first pipe segment of the fourth heat dissipation pipe is connected to the second opening, the third pipe segment of the third heat dissipation pipe is connected to one end of the connecting pipe, and the third pipe segment of the fourth heat dissipation pipe is connected to the other end of the connecting pipe.

[0019] The third pipe segment part is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

[0020] In some embodiments of the present application, the cross section of the first pipe segment in a direction perpendicular to the axis of the first pipe segment is quadrangular.

[0021] In some embodiments of the present application, the heat dissipation base plate has opposite heat absorbing surface and heat dissipating surface in the first direction;

[0022] The heat absorbing surface is protruded from the second surface, or the heat absorbing surface is flush with the second surface.

[0023] The heat dissipation pipe assembly is fixed to the heat dissipating surface.

[0024] In some embodiments of the present application, the heat dissipation pipe assembly comprises a plurality of fifth heat dissipation pipes and a plurality of sixth heat dissipation pipes.

[0025] The first ends of the plurality of fifth heat dissipation pipes are respectively connected to the first ends of the plurality of sixth heat dissipation pipes, and the second ends of the plurality of fifth heat dissipation pipes are respectively connected to the second ends of the plurality of sixth heat dissipation pipes.

[0026] The first ends of the plurality of fifth heat dissipation pipes are fixed to the heat dissipating surface, the first ends of the plurality of sixth heat dissipation pipes are fixed to the heat dissipating surface, and the second ends of the fifth heat dissipation pipes and the second ends of the sixth heat dissipation pipes are located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

[0027] In some embodiments of the present application, the fifth heat dissipation pipe and the sixth heat dissipation pipe each comprise a fourth pipe segment, a fifth pipe segment and a sixth pipe segment.

[0028] The opposite two ends of the fifth pipe segment are respectively connected to the fourth pipe segment and the sixth pipe segment, and the diameter of the fifth pipe segment decreases in the direction from the fourth pipe segment to the sixth pipe segment.

[0029] The fourth pipe segment of the fifth heat dissipation pipe is connected to the fourth pipe segment of the sixth heat dissipation pipe, the fourth pipe segment of the fifth heat dissipation pipe and the fourth pipe segment of the sixth heat dissipation pipe are fixed to the heat dissipating surface, and the sixth pipe segment of the fifth heat dissipation pipe is connected to the sixth pipe segment of the sixth heat dissipation pipe.

[0030] The sixth pipe segment part is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

[0031] In some embodiments of the present application, the cross section of the fourth pipe segment in a direction perpendicular to the axis of the fourth pipe segment is quadrangular.

[0032] In some embodiments of the present application, the heat dissipation base plate has a heat absorbing surface, the heat absorbing surface is protruded from the second surface or the heat absorbing surface is flush with the second surface, and an interface material is arranged on the heat absorbing surface, the interface material is used for heat conduction.

[0033] In some embodiments of the present application, an interface sleeve is fixed on the second surface, the interface sleeve surrounds the mounting hole in the projection of the second surface, and the interface material is located inside the interface sleeve.

[0034] In some embodiments of the present application, a first recess is arranged on the first surface, and the heat pipe assembly part is located in the first recess and flush with the first surface.

[0035] In some embodiments of the present application, the surface of the first heat dissipation fin assembly facing the second heat dissipation fin assembly is provided with a receiving groove, and / or the surface of the second heat dissipation fin assembly facing the first heat dissipation fin assembly is provided with a receiving groove, and part of the heat pipe assembly is located in the receiving groove, so that part of the heat pipe assembly is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

[0036] In some embodiments of the present application, part of the heat pipe assembly is in interference contact with the receiving groove.

[0037] In some embodiments of the present application, a plurality of fixing holes are arranged on the mounting base plate, and a fixing member is arranged in each fixing hole.

[0038] In some embodiments of the present application, a telecommunications device is provided, and the telecommunications device comprises the heat dissipation device of any one of the above first aspect.

[0039] In some embodiments of the present application, the telecommunications device comprises a housing, a circuit board, and a chip, and a plurality of fixing holes are arranged on the mounting base plate, and a fixing member is arranged in each fixing hole.

[0040] The chip is arranged on the circuit board, and the fixing member is connected with the circuit board to make the heat dissipation bottom plate contact with the chip.

[0041] In the embodiment of the present application, since the mounting hole is arranged on the mounting substrate and penetrates the mounting substrate along the first direction, the heat dissipation base plate can be arranged in the mounting hole and protrude from the second surface or be flush with the second surface, and then the heat dissipation component can be contacted with the heat dissipation base plate when heat dissipation is needed. Since the heat dissipation pipe assembly is connected to the heat dissipation base plate, the heat dissipation medium is arranged in the heat dissipation pipe assembly, the first heat dissipation fin assembly and the second heat dissipation fin assembly are connected and the first heat dissipation fin assembly is fixed to the first surface, and part of the heat dissipation pipe assembly is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly, therefore, when the heat dissipation device is needed to dissipate heat of the heat dissipation component, the heat dissipation component can be contacted with the heat dissipation base plate or the heat dissipation component is opposite to the heat dissipation base plate, so that the heat of the heat dissipation component can be transferred to the heat dissipation base plate, the heat dissipation base plate can transfer the heat of the heat dissipation component to the heat dissipation pipe assembly, so that the heat dissipation medium in the heat dissipation pipe assembly can be heated by absorbing the heat, the heat dissipation medium can flow in the heat dissipation pipe assembly, the heat dissipation medium can flow through the first heat dissipation fin assembly and the second heat dissipation fin assembly, so that the first heat dissipation fin assembly and the second heat dissipation fin assembly can dissipate heat of the heat dissipation pipe assembly, and the heat transferred by the heat dissipation medium can be quickly dissipated at the first heat dissipation fin assembly and the second heat dissipation fin assembly. That is, in the embodiment of the present application, by arranging the heat dissipation base plate, the heat dissipation pipe assembly, the first heat dissipation fin assembly and the second heat dissipation fin assembly, when the heat of the heat dissipation component is transferred to the heat dissipation base plate, the heat dissipation pipe assembly can quickly transfer the heat to the first heat dissipation fin assembly and the second heat dissipation fin assembly, so that the heat can be quickly dissipated, the heat dissipation component can be quickly cooled, and the efficiency of heat dissipation of the heat dissipation component can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0042] FIG. 1 shows a schematic diagram of a heat dissipation device according to an embodiment of the present application;

[0043] FIG. 2 shows a front view of a heat dissipation device according to an embodiment of the present application;

[0044] FIG. 3 shows an exploded view of a heat dissipation device according to an embodiment of the present application;

[0045] FIG. 4 shows a schematic diagram of a heat dissipation base plate provided with a heat dissipation channel according to an embodiment of the present application;

[0046] FIG. 5 shows a schematic diagram of a heat dissipation base plate connected to a heat dissipation pipe assembly according to an embodiment of the present application;

[0047] FIG. 6 shows another schematic diagram of a heat dissipation base plate connected to a heat dissipation pipe assembly according to an embodiment of the present application;

[0048] FIG. 7 shows an exploded view of a heat dissipation base plate connected to a heat dissipation pipe assembly according to an embodiment of the present application;

[0049] Fig. 8 shows a schematic view of a first heat dissipation pipe according to an embodiment of the present application;

[0050] Fig. 9 shows a schematic view of a connecting pipe according to an embodiment of the present application;

[0051] Fig. 10 shows a schematic view of a heat dissipation base plate according to an embodiment of the present application;

[0052] Fig. 11 shows a schematic view of a first heat dissipation pipe divided into different sections according to an embodiment of the present application;

[0053] Fig. 12 shows a schematic view of a first heat dissipation fin assembly and a second heat dissipation fin assembly according to an embodiment of the present application;

[0054] Fig. 13 shows a schematic view of a first heat dissipation fin assembly according to an embodiment of the present application;

[0055] Fig. 14 shows an exploded view of a part of a heat dissipation device according to an embodiment of the present application;

[0056] Fig. 15 shows a schematic view of an interface sleeve according to an embodiment of the present application;

[0057] Fig. 16 shows a schematic view of a heat dissipation pipe assembly connected to the surface of a heat dissipation base plate according to an embodiment of the present application.

[0058] Fig. 16 shows a schematic view of a heat dissipation pipe assembly connected to the surface of a heat dissipation base plate according to an embodiment of the present application. DETAILED DESCRIPTION

[0059] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0060] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0061] In the description of the present application, it needs to be understood that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0062] As shown in FIGS. 1-16, the heat dissipation device has a first direction, and the heat dissipation device comprises a heat dissipation bottom plate 10, a mounting base plate 20, a heat dissipation pipe assembly 30, a first heat dissipation fin assembly 40 and a second heat dissipation fin assembly 50.

[0063] The mounting base plate 20 is provided with a mounting hole 201, and the mounting hole 201 penetrates the mounting base plate 20 along the first direction. The mounting base plate 20 has opposite first and second surfaces along the first direction. The heat dissipation bottom plate 10 is arranged in the mounting hole 201, and the heat dissipation bottom plate 10 protrudes from the second surface or is flush with the second surface. The heat dissipation bottom plate 10 is used for dissipating heat from a component 100 to be cooled. The heat dissipation pipe assembly 30 is connected to the heat dissipation bottom plate 10, and the heat dissipation pipe assembly 30 is provided with a heat dissipation medium. The first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 are connected, and the first heat dissipation fin assembly 40 is fixed to the first surface. Part of the heat dissipation pipe assembly 30 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50. In the case that the heat dissipation bottom plate 10 dissipates heat from the component 100 to be cooled, the heat dissipation bottom plate 10 transmits heat from the component 100 to be cooled to the heat dissipation pipe assembly 30. The heat dissipation medium flows in the heat dissipation pipe assembly 30 and passes through the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50. The first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 dissipate heat from the heat dissipation pipe assembly 30.

[0064] In some embodiments of the present application, since the mounting hole 201 is arranged on the mounting substrate 20 and penetrates the mounting substrate 20 along the first direction, the heat dissipation base plate 10 can be arranged in the mounting hole 201 and protrude from the second surface or be flush with the second surface, and then the to-be-cooled component 100 can be in contact with the heat dissipation base plate 10 when it is necessary to cool the to-be-cooled component 100. Since the heat dissipation pipe assembly 30 is connected to the heat dissipation base plate 10, the heat dissipation pipe assembly 30 is provided with the heat dissipation medium, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 are connected, and the first heat dissipation fin assembly 40 is fixed to the first surface, and part of the heat dissipation pipe assembly 30 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, therefore, once the to-be-cooled component 100 needs to be cooled by the heat dissipation device, the to-be-cooled component 100 can be in contact with the heat dissipation base plate 10 or the to-be-cooled component 100 is opposite to the heat dissipation base plate 10, so that the heat of the to-be-cooled component 100 can be transferred to the heat dissipation base plate 10, the heat dissipation base plate 10 can transfer the heat of the to-be-cooled component 100 to the heat dissipation pipe assembly 30, so that the heat dissipation medium in the heat dissipation pipe assembly 30 can be heated by absorbing the heat, the heat dissipation medium can flow in the heat dissipation pipe assembly 30, the heat dissipation medium can flow through the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can cool the heat dissipation pipe assembly 30, and the heat transferred by the heat dissipation medium can be quickly dissipated at the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50. That is, in the embodiments of the present application, by arranging the heat dissipation base plate 10, the heat dissipation pipe assembly 30, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, once the heat of the to-be-cooled component 100 is transferred to the heat dissipation base plate 10, the heat dissipation pipe assembly 30 can quickly transfer the heat to the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so as to quickly dissipate the heat, so that the to-be-cooled component 100 can be quickly cooled, thereby improving the efficiency of cooling the to-be-cooled component.

[0065] It should be noted that in the embodiments of the present application, the to-be-cooled component 100 can be a chip, of course, the to-be-cooled component 100 can also be other components, for example, the to-be-cooled component 100 is a circuit board. For this, the embodiments of the present application are not limited herein.

[0066] In addition, in the embodiments of the present application, the first direction is a direction parallel to the thickness direction of the mounting substrate 20.

[0067] In addition, in the embodiment of the present application, the heat dissipation medium can include water, toluene, ethanol, ammonia, ethane, acetone, methanol, etc. Among them, the working temperature range of water is 0-100℃; the working temperature range of toluene is 0-110℃; the working temperature range of ethanol is 0-80℃; the working temperature range of ammonia is 0-120℃; the working temperature range of ethane and acetone is 0-75℃; the working temperature range of methanol is 0-65℃. In addition, in the embodiment of the present application, the heat dissipation medium can provide good heat dissipation effect within a certain working temperature range.

[0068] In addition, in the embodiment of the present application, the heat dissipation pipe assembly 30 can be formed by a pulsating heat pipe.

[0069] In addition, in the embodiment of the present application, the heat dissipation pipe assembly 30 can be divided into an evaporation section, an adiabatic section and a condensation section, which are connected in sequence, and the evaporation section is connected with the heat dissipation bottom plate 10, and the condensation section is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that when the heat dissipation device provided by the embodiment of the present application is used, once the heat of the component to be cooled 100 is transferred to the heat dissipation bottom plate 10, the heat dissipation bottom plate 10 can transfer the heat to the evaporation section, so that the heat dissipation medium in the heat dissipation pipe assembly 30 is heated and boiled to generate bubbles and expand rapidly in the evaporation section, so that the pressure in the heat dissipation pipe assembly 30 rises; in the condensation section, the heat dissipation pipe assembly 30 transfers heat to the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the bubbles of the heat dissipation medium in the condensation section condense and shrink, break, and the internal pressure decreases. The driving force of the flow of the heat dissipation medium is the pressure difference between the evaporation section and the condensation section caused by the temperature gradient, and under the action of the pressure difference and the pressure imbalance in the adjacent pipe section, the heat dissipation medium in the heat dissipation pipe assembly 30 flows back and forth between the evaporation section and the condensation section, achieving efficient heat transfer.

[0070] In addition, in some embodiments of the present application, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can each include a plurality of heat dissipation fins, and in actual application, that is, when the heat dissipation device provided by the embodiment of the present application is installed in a telecommunications device, the telecommunications device usually has a fan, and the fan is directed towards the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that once the heat dissipation pipe assembly 30 transfers the heat of the component to be cooled 100 to the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, due to the action of the fan, that is, the fan causes the airflow to flow, so that the heat at the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 is quickly dissipated, and finally the heat of the component to be cooled 100 is quickly dissipated, efficiently cooling the component to be cooled 100. Among them, the telecommunications device can include but is not limited to servers, switches, etc.

[0071] In addition, in some embodiments of the present application, when the heat dissipation medium is arranged in the heat dissipation pipe assembly 30, a hole can be first formed on the heat dissipation pipe assembly 30, the heat dissipation medium is injected through the hole, and then the hole is sealed. The filling rate of the heat dissipation medium in the heat dissipation pipe assembly 30 can be 65%-85%. That is, the heat dissipation medium occupies 65%-85% of the internal volume of the heat dissipation pipe assembly 30. For example, the filling rate of the heat dissipation medium in the heat dissipation pipe assembly 30 is 65%, for another example, the filling rate of the heat dissipation medium in the heat dissipation pipe assembly 30 is 70%, for another example, the filling rate of the heat dissipation medium in the heat dissipation pipe assembly 30 is 75%, and for another example, the filling rate of the heat dissipation medium in the heat dissipation pipe assembly 30 is 80%. For another example, the filling rate of the heat dissipation medium in the heat dissipation pipe assembly 30 is 80%.

[0072] In addition, in some embodiments of the present application, the materials of the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can be metal, for example, aluminum alloy, and for another example, copper. The material of the mounting substrate 20 can be metal, for example, the material of the mounting substrate 20 is aluminum alloy, and for another example, the material of the mounting substrate 20 is copper. The material of the heat dissipation pipe assembly 30 can be metal, for example, the material of the heat dissipation pipe assembly 30 can be aluminum alloy, and for another example, the material of the heat dissipation pipe assembly 30 can be copper.

[0073] In addition, in some embodiments, the heat dissipation bottom plate 10 is provided with a heat dissipation channel 101, and the two ends of the heat dissipation pipe assembly 30 are respectively connected to the heat dissipation channel 101, and the heat dissipation channel 101 communicates with the inside of the heat dissipation pipe assembly 30.

[0074] Because the heat dissipation channel 101 is arranged in the heat dissipation bottom plate 10, when the heat dissipation pipe assembly 30 is connected to the heat dissipation bottom plate 10, the two ends of the heat dissipation pipe assembly 30 can be respectively connected to the heat dissipation channel 101, so that the heat dissipation channel 101 communicates with the inside of the heat dissipation pipe assembly 30, and the heat dissipation medium in the heat dissipation pipe assembly 30 can flow into the heat dissipation channel 101 in the heat dissipation bottom plate 10, so that the thermal resistance between the heat dissipation bottom plate 10 and the heat dissipation pipe assembly 30 is reduced, and the heat transfer efficiency between the heat dissipation bottom plate 10 and the heat dissipation pipe assembly 30 is improved. That is, by arranging the heat dissipation channel 101 in the heat dissipation bottom plate 10, the heat dissipation medium in the heat dissipation pipe assembly 30 can flow in the heat dissipation channel 101, so that once the heat of the component to be cooled 100 is transferred to the heat dissipation bottom plate 10, the heat dissipation medium in the heat dissipation channel 101 can first receive the heat and start to flow, so that the heat transfer efficiency between the heat dissipation bottom plate 10 and the heat dissipation pipe assembly 30 is improved, which is beneficial to quickly reduce the temperature of the component to be cooled 100 and improve the heat dissipation efficiency of the component to be cooled 100.

[0075] In addition, in some embodiments, the heat dissipation pipe assembly 30 comprises a plurality of first heat dissipation pipes 31, a plurality of second heat dissipation pipes 32, a third heat dissipation pipe 33, a fourth heat dissipation pipe 34, and a connecting pipe 35, the number of heat dissipation channels 101 is multiple, the plurality of heat dissipation channels 101 are arranged at intervals, the heat dissipation channel 101 has opposite first and second openings, both the first and second openings communicate with the interior of the heat dissipation channel 101; the first ends of the plurality of first heat dissipation pipes 31 are connected to the first opening, the first end of the third heat dissipation pipe 33 is connected to the first opening, the third heat dissipation pipe 33 is located on one side of the plurality of first heat dissipation pipes 31, the first ends of the plurality of second heat dissipation pipes 32 are connected to the second opening, the first end of the fourth heat dissipation pipe 34 is connected to the second opening, the fourth heat dissipation pipe 34 is located on one side of the plurality of second heat dissipation pipes 32, and the third heat dissipation pipe 33 and the fourth heat dissipation pipe 34 are staggered, the second ends of the first heat dissipation pipes 31 and the second heat dissipation pipes 32 are connected, one end of the connecting pipe 35 is connected to the second end of the third heat dissipation pipe 33, and the other end of the connecting pipe 35 is connected to the second end of the fourth heat dissipation pipe 34; wherein the connection between the first heat dissipation pipe 31 and the second heat dissipation pipe 32 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, and the connecting pipe 35 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0076] Since the first ends of the plurality of first heat pipes 31 are connected to the first opening, the first end of the third heat pipe 33 is connected to the first opening, the third heat pipe 33 is located at one side of the plurality of first heat pipes 31, the first ends of the plurality of second heat pipes 32 are connected to the second opening, the first end of the fourth heat pipe 34 is connected to the second opening, and the fourth heat pipe 34 is located at one side of the plurality of second heat pipes 32, the third heat pipe 33 and the fourth heat pipe 34 are staggered, the second ends of the first heat pipes 31 and the second ends of the second heat pipes 32 are connected, one end of the connecting pipe 35 is connected to the second end of the third heat pipe 33, and the other end of the connecting pipe 35 is connected to the second end of the fourth heat pipe 34, so that once the heat dissipation medium starts to flow, the heat dissipation medium can circulate in the heat dissipation pipe assembly 30. For example, the heat dissipation medium first flows from the third heat pipe 33, and then flows through the heat dissipation channels 101 of the heat dissipation base plate 10, flows into a second heat pipe 32, and then flows out of the second heat pipe 32 and flows through the heat dissipation channels 101, flows into a first heat pipe 31, and then flows out of the first heat pipe 31 and flows through the heat dissipation channels 101 of the heat dissipation base plate 10, flows into a second heat pipe 32, and then flows out of the fourth heat pipe 34, flows into the connecting pipe 35, and then flows out of the connecting pipe 35 and flows into the third heat pipe 33, so that the heat dissipation medium circulates in the heat dissipation pipe assembly 30. Since the connection between the first heat pipes 31 and the second heat pipes 32 is located between the first heat fin assembly 40 and the second heat fin assembly 50, and the connecting pipe 35 is located between the first heat fin assembly 40 and the second heat fin assembly 50, once the heat dissipation medium flows in the first heat pipes 31, the connecting pipe 35 and the second heat pipes 32, the temperature carried by the heat dissipation medium can be quickly dissipated when the heat dissipation medium flows through the first heat fin assembly 40 and the second heat fin assembly 50. That is, by arranging the first heat pipes 31, the second heat pipes 32, the third heat pipe 33, the fourth heat pipe 34 and the connecting pipe 35, the circulation of the heat dissipation medium can be effectively realized.

[0077] In addition, in some embodiments of the present application, when the heat dissipation pipe assembly 30 is divided into an evaporation section, an adiabatic section and a condensation section, the first heat pipes 31, the second heat pipes 32, the third heat pipe 33 and the fourth heat pipe 34 can be divided into an evaporation section, an adiabatic section and a condensation section, and the first heat pipes 31, the second heat pipes 32, the third heat pipe 33 and the fourth heat pipe 34 can be formed by pulsating heat pipes.

[0078] wherein the pulsating heat pipe is a capillary tube, and the inner diameters of the first heat pipes 31, the second heat pipes 32, the third heat pipe 33 and the fourth heat pipe 34 satisfy the following formula:

[0079] where D represents the inner diameter, s represents the surface tension of the heat dissipation medium, p l represents the density of the heat dissipation medium in the liquid phase, p g represents the density of the heat dissipation medium in the gas phase, and g represents the acceleration of gravity.

[0080] In addition, the density and surface tension of the heat dissipation medium have a great influence on the design of the pipe diameter of the heat dissipation pipe assembly 30. According to formula (1), when the heat dissipation pipe assembly 30 is designed, there is a critical value of the pipe diameter. When the pipe diameter exceeds the critical value, the designed pipe diameter makes it difficult for the heat dissipation pipe assembly 30 to operate successfully, that is, the heat dissipation medium is difficult to flow. When the pipe diameter of the heat dissipation pipe assembly 30 is very small, the friction in the pipe is extremely large. In general, if the pipe diameter is too large, the capillary force is too small, and it is difficult to operate; and if the pipe diameter is too small, the flow resistance is increased, the start-up time is increased, and the heat transfer effect is poor. Therefore, the pipe diameter of the first heat dissipation pipe 31, the second heat dissipation pipe 32, the third heat dissipation pipe 33, and the fourth heat dissipation pipe 34 should meet the following formula:

[0081] In addition, in some embodiments of the present application, after the evaporation section of the heat dissipation pipe assembly 30 is heated, the temperature of the fluid in the pipe begins to rise. When the heat dissipation medium reaches the required superheat state, the evaporation section begins to undergo nucleate boiling, a large amount of heat dissipation medium vapor is generated, and the pressure of the evaporation section is increased until the fluid in the pipe is driven to flow. In general, the heat dissipation medium vaporization generates bubbles to start the heat dissipation pipe assembly 30. According to the Young-Laplace equation, the pressure difference of the gas-liquid interface of a spherical bubble can be represented as:

[0082] where r globe represents the radius of the spherical bubble, p v represents the gas phase pressure, and p l represents the liquid phase pressure. When a certain superheat degree is reached, new bubbles are generated. When the bubbles are in the shape of a nearly spherical body, the pressure difference of the gas-liquid interface at this time can be approximately represented as:

[0083] where r n is the radius of the new bubble.

[0084] According to the ideal gas state equation and the Clausius-Clayperon equation, the superheat degree required for bubble growth can be obtained as:

[0085] where T n is the temperature at which the new bubble is generated, T V is the temperature of the gaseous working medium, h fg is the latent heat of vaporization, and R is the gas constant, R = 8.314510 J·mol-1·K-1.

[0086] The overheat degree of the pulsating heat pipe start-up can be estimated by multiplying the coefficient K, 0.8≤K≤1, to the formula ΔT globe to make the heat pipe assembly 30 start up, i.e., the heat pipe assembly 30 can transfer heat.

[0087] In addition, in some embodiments of the present application, the first heat pipe 31 can be welded with the heat dissipation base plate 10, the second heat pipe 32 can be welded with the heat dissipation base plate 10, the third heat pipe 33 can be welded with the heat dissipation base plate 10, and the fourth heat pipe 34 can be welded with the heat dissipation base plate 10.

[0088] In addition, in some embodiments, the first heat pipe 31 is inclined to the heat dissipation base plate 10 along a second direction at a connection with the second heat pipe 32, and the second heat pipe 32 is inclined to the heat dissipation base plate 10 along the second direction at a connection with the first heat pipe 31; wherein the second direction intersects the first direction.

[0089] Since the first heat pipe 31 is inclined to the heat dissipation base plate 10 along a second direction at a connection with the second heat pipe 32, and the second heat pipe 32 is inclined to the heat dissipation base plate 10 along the second direction at a connection with the first heat pipe 31, the plurality of first heat pipes 31 and the plurality of second heat pipes 32 are connected behind the heat dissipation base plate 10, and the plurality of first heat pipes 31 are connected with the first opening and the plurality of second heat pipes 32 are connected with the second opening, which can make the plurality of first heat pipes 31, the plurality of second heat pipes 32, and the plurality of heat dissipation channels 101 form a spiral shape, and the third heat pipe 33 and the fourth heat pipe 34 are connected through the connecting pipe 35, thereby ensuring that the heat dissipation medium can circulate in the heat pipe assembly 30. That is, by inclining the first heat pipe 31 and the second heat pipe 32, the heat pipe assembly 30 together with the heat dissipation channel 101 can form a spiral structure, thereby ensuring that the heat dissipation medium can circulate.

[0090] It should be noted that the first heat pipe 31, the second heat pipe 32, the third heat pipe 33, and the fourth heat pipe 34 can all be provided with heat dissipation medium.

[0091] In addition, in some embodiments of the present application, the number of first heat pipes 31 and the number of second heat pipes 32 can be set according to actual needs. For example, the number of first heat pipes 31 and the number of second heat pipes 32 are both 8. For another example, the number of first heat pipes 31 and the number of second heat pipes 32 are both 10. For this, the embodiments of the present application are not limited here.

[0092] In addition, in some embodiments, the first heat dissipation pipe 31, the second heat dissipation pipe 32, the third heat dissipation pipe 33 and the fourth heat dissipation pipe 34 each include a first pipe section 311, a second pipe section 312 and a third pipe section 313; the opposite ends of the second pipe section 312 are connected to the first pipe section 311 and the third pipe section 313 respectively, and the diameter of the second pipe section 312 decreases along the direction from the first pipe section 311 to the third pipe section 313; the first pipe section 311 of the first heat dissipation pipe 31 is connected to the first opening, the first pipe section 311 of the second heat dissipation pipe 32 is connected to the second opening, the third pipe section 313 of the first heat dissipation pipe 31 is connected to the third pipe section 313 of the second heat dissipation pipe 32, the first pipe section 311 of the third heat dissipation pipe 33 is connected to the first opening, the first pipe section 311 of the fourth heat dissipation pipe 34 is connected to the second opening, the third pipe section 313 of the third heat dissipation pipe 33 is connected to one end of the connecting pipe 35, and the third pipe section 313 of the fourth heat dissipation pipe 34 is connected to the other end of the connecting pipe 35; the third pipe section 313 is partially located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0093] Since the first heat dissipation pipe 31, the second heat dissipation pipe 32, the third heat dissipation pipe 33 and the fourth heat dissipation pipe 34 each include a first pipe section 311, a second pipe section 312 and a third pipe section 313; the opposite ends of the second pipe section 312 are connected to the first pipe section 311 and the third pipe section 313 respectively, and the diameter of the second pipe section 312 decreases along the direction from the first pipe section 311 to the third pipe section 313, once the heat of the heat dissipation component 100 is transferred to the heat dissipation base plate 10, the heat dissipation medium first flows into the first pipe section 311, then flows into the second pipe section 312, and then flows into the third pipe section 313, and the diameter of the second pipe section 312 decreases, which is equivalent to the cross section of the second pipe section 312 changing, so that the flow channel of the heat dissipation medium changes, so that the second pipe section 312 can provide additional pressure difference for the flowing medium when the heat dissipation medium flows in the second pipe section 312, which can effectively reduce the influence of gravity on the heat dissipation medium when the heat dissipation medium flows in the second pipe section 312, that is, reduce the sensitivity of the second pipe section 312 to gravity. In addition, the diameter of the second pipe section 312 decreases, so that the cross section of the second pipe section 312 changes, which can also make the time for the heat dissipation medium to start to oscillate stably shorter when the heat dissipation medium is in the second pipe section 312, and as the heating power increases, there is no obvious pause in the stable oscillation process of the heat dissipation medium, which can effectively improve the uniformity of the heat dissipation pipe assembly 30, and when the heat dissipation medium flows in the heat dissipation pipe assembly 30, the main flow pattern of the heat dissipation medium is bubble flow, plug flow and ring / half-ring flow, and the second pipe section 312 is equivalent to changing the cross section of the flow channel of the heat dissipation medium, and the variable cross section channel can make the evaporation pipe section of the heat dissipation pipe assembly 30 more prone to nucleation, which is beneficial to the flow of the heat dissipation medium. The second pipe section 312 is within the range of the evaporation pipe section.

[0094] In addition, the first pipe section 311 of the first heat dissipation pipe 31 is connected to the first opening, the first pipe section 311 of the second heat dissipation pipe 32 is connected to the second opening, the third pipe section 313 of the first heat dissipation pipe 31 is connected to the third pipe section 313 of the second heat dissipation pipe 32, the first pipe section 311 of the third heat dissipation pipe 33 is connected to the first opening, the first pipe section 311 of the fourth heat dissipation pipe 34 is connected to the second opening, the third pipe section 313 of the third heat dissipation pipe 33 is connected to one end of the connecting pipe 35, and the third pipe section 313 of the fourth heat dissipation pipe 34 is connected to the other end of the connecting pipe 35; the third pipe section 313 is partially located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that once the heat dissipation medium flows into the first pipe section 311, the heat dissipation medium then flows to the second pipe section 312 and then flows into the third pipe section 313, so that the heat carried by the heat dissipation medium can be quickly dissipated by the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0095] In addition, in the embodiment of the present application, the first pipe section 311 and the second pipe section 312 can be in the range of the evaporation section, part of the third pipe section 313 can be in the range of the heat insulation section, and part of the third pipe section 313 can be in the range of the condensation section. The third pipe section 313 can be a circular pipe, and the third pipe section 313 can be in a bent shape, for example, the third pipe section 313 can be in an L shape.

[0096] In addition, in some embodiments, the cross section of the first pipe section 311 in the direction perpendicular to the axis of the first pipe section 311 is a quadrilateral.

[0097] Through such a setting, the first pipe section 311 is equivalent to a square pipe, that is, the cross section of the first pipe section 311 is a quadrilateral, and the first pipe section 311 is in the range of the evaporation section, that is, the inside of the first pipe section 311 has four right angles, so that the first pipe section 311 is equivalent to a right-angle evaporation section. The design of the right-angle evaporation section can effectively reduce the starting power of the heat dissipation pipe assembly 30, the starting power is the minimum heating power of the heat dissipation pipe assembly 30 to start the pulsation effect, and the low-temperature performance is improved. At the same time, the existence of the right-angle evaporation section can quickly form a driving pressure difference inside the heat dissipation pipe assembly 30, thereby significantly shortening the starting time of the heat dissipation pipe assembly 30 formed by the pulsation heat pipe, and the starting of the heat dissipation pipe assembly 30 is more rapid. In addition, the right-angle evaporation section is also provided with a rectangular sharp corner, and the capillary adsorption force generated thereby can enable the heat dissipation pipe assembly 30 to normally operate at a lower liquid filling rate, thereby effectively expanding the interval of the allowable liquid filling rate. That is, by setting the cross section of the first pipe section 311 in the direction perpendicular to the axis of the first pipe section 311 to be a quadrilateral, the heat transfer efficiency of the heat dissipation pipe assembly 30 can be effectively improved, and the heat dissipation efficiency of the to-be-cooled assembly is further improved.

[0098] It should be noted that the quadrilateral can be a rectangle, and of course, the quadrilateral can also be a square. In this regard, the embodiments of the present application do not limit the same.

[0099] In addition, in some embodiments, the heat dissipation base plate 10 has opposite heat absorption surfaces and heat dissipation surfaces along the first direction; the heat absorption surfaces are protruded from the second surfaces, or the heat absorption surfaces are flush with the second surfaces; the heat dissipation pipe assembly 30 is fixed to the heat dissipation surfaces.

[0100] Since the heat dissipation pipe assembly 30 is fixed to the heat dissipation surfaces, once the heat of the component to be cooled is transferred to the heat dissipation base plate 10, that is, the heat absorption surfaces of the heat dissipation base plate 10 absorb the heat, the heat is then transferred to the heat dissipation surfaces, and the heat dissipation surfaces can then transfer the heat to the heat dissipation pipe assembly 30, so that the heat dissipation pipe assembly 30 can quickly dissipate heat through the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0101] In addition, in some embodiments, the heat dissipation pipe assembly 30 includes a plurality of fifth heat dissipation pipes 36 and a plurality of sixth heat dissipation pipes 37; the first ends of the plurality of fifth heat dissipation pipes 36 are respectively connected to the first ends of the plurality of sixth heat dissipation pipes 37, and the second ends of the plurality of fifth heat dissipation pipes 36 are respectively connected to the second ends of the plurality of sixth heat dissipation pipes 37; wherein the first ends of the plurality of fifth heat dissipation pipes 36 are fixed to the heat dissipation surfaces, the first ends of the plurality of sixth heat dissipation pipes 37 are fixed to the heat dissipation surfaces, and the second ends of the fifth heat dissipation pipes 36 and the second ends of the sixth heat dissipation pipes 37 are located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0102] Through such a setting, the first ends of the plurality of fifth heat dissipation pipes 36 are respectively connected to the first ends of the plurality of sixth heat dissipation pipes 37, and the second ends of the plurality of fifth heat dissipation pipes 36 are respectively connected to the second ends of the plurality of sixth heat dissipation pipes 37, so that when the heat dissipation medium flows in the fifth heat dissipation pipes 36, the heat dissipation medium can flow to the sixth heat dissipation pipes 37, and the heat dissipation medium can flow between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can quickly dissipate heat.

[0103] It should be noted that when the first ends of the plurality of fifth heat dissipation pipes 36 are respectively connected to the first ends of the plurality of sixth heat dissipation pipes 37, and the second ends of the plurality of fifth heat dissipation pipes 36 are respectively connected to the second ends of the plurality of sixth heat dissipation pipes 37, at this time, the fifth heat dissipation pipes 36 and / or the sixth heat dissipation pipes 37 are provided with the heat dissipation medium.

[0104] In some embodiments, the fifth heat dissipation pipe 36 and the sixth heat dissipation pipe 37 each include a fourth pipe segment 361, a fifth pipe segment 362 and a sixth pipe segment 363. The fifth pipe segment 362 is connected to the fourth pipe segment 361 and the sixth pipe segment 363 at opposite ends thereof, and the diameter of the fifth pipe segment 362 decreases from the fourth pipe segment 361 to the sixth pipe segment 363. The fourth pipe segment 361 of the fifth heat dissipation pipe 36 is connected to the fourth pipe segment 361 of the sixth heat dissipation pipe 37, and the fourth pipe segment 361 of the fifth heat dissipation pipe 36 and the fourth pipe segment 361 of the sixth heat dissipation pipe 37 are fixed to the heat dissipation surface. The sixth pipe segment 363 of the fifth heat dissipation pipe 36 is connected to the sixth pipe segment 363 of the sixth heat dissipation pipe 37. The sixth pipe segment 363 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0105] Since the fifth heat dissipation pipe 36 and the sixth heat dissipation pipe 37 each include a fourth pipe segment 361, a fifth pipe segment 362 and a sixth pipe segment 363, the fifth pipe segment 362 is connected to the fourth pipe segment 361 and the sixth pipe segment 363 at opposite ends thereof, and the diameter of the fifth pipe segment 362 decreases from the fourth pipe segment 361 to the sixth pipe segment 363, once the heat of the heat dissipation component 100 is transferred to the heat dissipation base plate 10, the heat dissipation medium first flows into the fourth pipe segment 361, then flows into the fifth pipe segment 362, and finally flows into the sixth pipe segment 363. The decrease of the diameter of the fifth pipe segment 362 is equivalent to the change of the cross section of the fifth pipe segment 362, which changes the flow path of the heat dissipation medium, so that the fifth pipe segment 362 can provide additional pressure difference for the flow of the heat dissipation medium, which can effectively reduce the influence of gravity on the heat dissipation medium when the heat dissipation medium flows in the fifth pipe segment 362, i.e. reduce the sensitivity of the fifth pipe segment 362 to gravity. In addition, the decrease of the diameter of the fifth pipe segment 362 changes the cross section of the fifth pipe segment 362, which can also make the heat dissipation medium start to oscillate more stably in the fifth pipe segment 362, and as the heating power increases, the heat dissipation medium does not have obvious intermittent oscillation in the stable oscillation process, which can effectively improve the uniformity of the heat dissipation pipe assembly 30. When the heat dissipation medium flows in the heat dissipation pipe assembly 30, the main flow pattern of the heat dissipation medium is bubble flow, plug flow and ring / half-ring flow. The fifth pipe segment 362 changes the cross section of the flow path of the heat dissipation medium, and the variable cross section channel can make the evaporation pipe segment of the heat dissipation pipe assembly 30 more prone to nucleation, which is beneficial to the flow of the heat dissipation medium. The fifth pipe segment 362 is located in the range of the evaporation pipe segment.

[0106] In addition, in the embodiment of the present application, the fourth pipe segment 361 and the fifth pipe segment 362 can be in the range of the evaporation section, part of the sixth pipe segment 363 can be in the range of the adiabatic section, and the other part of the sixth pipe segment 363 can be in the range of the condensation section. The sixth pipe segment 363 can be a circular pipe, and the sixth pipe segment 363 can be in a bent shape, for example, the sixth pipe segment 363 can be in an L shape.

[0107] In addition, in some embodiments, the cross section of the fourth pipe segment 361 in the direction perpendicular to the axis of the fourth pipe segment 361 is in a quadrilateral shape.

[0108] Through such a design, the fourth pipe segment 361 is equivalent to a quadrangular pipe, that is, the cross section of the fourth pipe segment 361 is in a quadrilateral shape, and the fourth pipe segment 361 is in the range of the evaporation section, that is, the inside of the fourth pipe segment 361 has four right angles, so that the fourth pipe segment 361 is equivalent to a right-angle evaporation section. The design of the right-angle evaporation section can effectively reduce the startup power of the heat dissipation pipe assembly 30, the startup power is the minimum heating power of the heat dissipation pipe assembly 30 to start the pulsation effect, and the low-temperature performance is improved. At the same time, the existence of the right-angle evaporation section can quickly form a driving pressure difference inside the heat dissipation pipe assembly 30, thereby significantly shortening the startup time of the heat dissipation pipe assembly 30 formed by the pulsating heat pipe, and the startup of the heat dissipation pipe assembly 30 is more rapid. In addition, the right-angle evaporation section is also provided with a rectangular sharp corner, and the capillary adsorption force generated thereby can enable the heat dissipation pipe assembly 30 to normally operate at a lower liquid filling rate, thereby effectively expanding the interval of the allowable liquid filling rate. That is, by designing the cross section of the fourth pipe segment 361 in the direction perpendicular to the axis of the fourth pipe segment 361 to be in a quadrilateral shape, the heat transfer efficiency of the heat dissipation pipe assembly 30 can be effectively improved, and the heat dissipation efficiency of the component to be cooled can be improved.

[0109] It should be noted that the quadrilateral can be a rectangle, and of course, the quadrilateral can also be a square. The embodiment of the present application does not limit this.

[0110] In addition, in some embodiments, the heat dissipation base plate 10 has a heat absorption surface, the heat absorption surface is protruded from the second surface, or the heat absorption surface is flush with the second surface, and the interface material 60 is arranged on the heat absorption surface, and the interface material 60 is used for heat conduction.

[0111] Since the interface material 60 is arranged on the heat absorption surface, when the heat dissipation device provided by the embodiment of the present application is used, the interface material 60 can be in contact with the component to be cooled 100, that is, the interface material 60 is equivalent to being arranged between the component to be cooled 100 and the heat dissipation base plate 10, so that the interface material 60 can effectively conduct heat, and the interface material 60 can reduce the contact thermal resistance between the heat dissipation base plate 10 and the component to be cooled 100, thereby improving the heat dissipation performance. That is, by arranging the interface material 60, the heat of the component to be cooled 100 can be quickly transferred to the heat dissipation base plate 10, thereby quickly reducing the temperature of the component to be cooled 100.

[0112] It should be noted that in the embodiments of the present application, the interface material 60 can include but is not limited to silicone grease, silica gel, thermal conductive glue, etc.

[0113] In addition, in some embodiments, the second surface is fixed with an interface sleeve 70, the projection of the interface sleeve 70 on the second surface surrounds the mounting hole 201, and the interface material 60 is located inside the interface sleeve 70.

[0114] In the embodiments of the present application, the interface sleeve 70 is fixed on the second surface, the projection of the interface sleeve 70 on the second surface surrounds the mounting hole 201, and the interface material 60 is located inside the interface sleeve 70. When the interface material 60 is in contact with the component to be cooled 100, the interface material 60 is extruded after installation, resulting in a decrease in thickness. At this time, the interface material 60 only flows in the horizontal direction, and the interface material 60 may flow to the outside of the mounting substrate 20, affecting the heat dissipation performance of the heat dissipation device. In addition, when the heat dissipation device is working, the temperature of the interface material 60 is higher, and high temperature and high pressure will cause the interface material 60 to further expand and overflow. Even if it returns to room temperature, the interface material 60 after shrinking is difficult to suck the pumped part into the interface, which will cause a gap between the interface material 60 and the heat dissipation base plate 10, and the uneven thickness of the interface material 60 will also cause the surface of the component to be cooled 100 to be poor in temperature uniformity, and there is a risk of local overheating. In the embodiments of the present application, the interface sleeve 70 is fixed on the second surface, the projection of the interface sleeve 70 on the second surface surrounds the mounting hole 201, and the interface material 60 is located inside the interface sleeve 70. When the interface material 60 flows, the interface material 60 will only flow inside the interface sleeve 70, that is, the inner wall of the interface sleeve 70 blocks the interface material 60, avoiding the interface material 60 flowing to the outside of the mounting substrate 20, and ensuring that a gap appears between the interface material 60 and the heat dissipation base plate 10, thereby ensuring that the component to be cooled 100 can be effectively cooled.

[0115] In addition, in some embodiments, a first recess 202 is arranged on the first surface, and part of the heat pipe assembly 30 is located in the first recess 202 and flush with the first surface.

[0116] By arranging the first recess 202 on the first surface, when the heat pipe assembly 30 is connected with the heat dissipation base plate 10, part of the heat pipe assembly 30 can be located in the first recess 202 and flush with the first surface, so that the heat dissipation device can be improved in appearance.

[0117] It should be noted that the mounting hole 201 can be located on the groove bottom of the first recess 202.

[0118] In addition, in some embodiments, the surface of the first heat dissipation fin assembly 40 facing the second heat dissipation fin assembly 50 is provided with a receiving groove 401, and / or the surface of the second heat dissipation fin assembly 50 facing the first heat dissipation fin assembly 40 is provided with a receiving groove 401, and part of the heat dissipation pipe assembly 30 is located in the receiving groove 401, so that part of the heat dissipation pipe assembly 30 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0119] By providing the receiving groove 401, when the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 clamp the heat dissipation pipe assembly 30, that is, part of the heat dissipation pipe assembly 30 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, the receiving groove 401 can play a role of avoiding, thereby facilitating part of the heat dissipation pipe assembly 30 to be located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50.

[0120] It should be noted that the first heat dissipation fin assembly 40 can be welded with the second heat dissipation fin assembly 50, of course, the first heat dissipation fin assembly 40 can also be connected with the second heat dissipation fin assembly 50 by other ways, for example, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 are clamped. For this, the embodiments of the present application are not limited here.

[0121] In addition, in the embodiments of the present application, the surface of the first heat dissipation fin assembly 40 facing the second heat dissipation fin assembly 50 can be provided with a receiving groove 401 only, the surface of the second heat dissipation fin assembly 50 facing the first heat dissipation fin assembly 40 can be provided with a receiving groove 401 only, of course, the surface of the first heat dissipation fin assembly 40 facing the second heat dissipation fin assembly 50 can be provided with a receiving groove 401, and the surface of the second heat dissipation fin assembly 50 facing the first heat dissipation fin assembly 40 can be provided with a receiving groove 401. For this, the embodiments of the present application are not limited here.

[0122] In addition, in some embodiments, part of the heat dissipation pipe assembly 30 is in interference contact with the receiving groove 401. By such a setting, it can be ensured that the heat dissipation pipe assembly 30 is in close contact with the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the heat transfer efficiency between the heat dissipation pipe assembly 30 and the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can be effectively improved.

[0123] In addition, in some embodiments, a plurality of fixing holes are provided on the mounting substrate 20, and a fixing member 80 is arranged in each fixing hole. By such a setting, when the heat dissipation device needs to be used, the heat dissipation device can be connected with other components through the fixing member 80, so that the heat dissipation device is fixed, and the heat dissipation device can long-term heat dissipation for the heat dissipation component 100.

[0124] It should be noted that the fixing member 80 can be a bolt, and a spring can be sleeved on the bolt. Of course, the fixing member 80 can also be of other types, for example, the fixing member 80 is a pin. In this regard, the embodiments of the present application are not limited here.

[0125] In the embodiments of the present application, since the mounting hole 201 is arranged on the mounting substrate 20 and penetrates the mounting substrate 20 along the first direction, the heat dissipation base plate 10 can be arranged in the mounting hole 201, and the heat dissipation base plate 10 protrudes from the second surface or is flush with the second surface, and then when it is necessary to dissipate heat from the component to be cooled 100, the component to be cooled 100 can be in contact with the heat dissipation base plate 10. Since the heat dissipation pipe assembly 30 is connected to the heat dissipation base plate 10, the heat dissipation medium is arranged in the heat dissipation pipe assembly 30, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 are connected, and the first heat dissipation fin assembly 40 is fixed to the first surface, and part of the heat dissipation pipe assembly 30 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, therefore, once the heat dissipation device is needed to dissipate heat from the component to be cooled 100, the component to be cooled 100 can be in contact with the heat dissipation base plate 10 or the component to be cooled 100 is opposite to the heat dissipation base plate 10, so that the heat of the component to be cooled 100 can be transferred to the heat dissipation base plate 10, and the heat dissipation base plate 10 can transfer the heat of the component to be cooled 100 to the heat dissipation pipe assembly 30, so that the heat dissipation medium in the heat dissipation pipe assembly 30 can be heated by absorbing the heat, and the heat dissipation medium can flow in the heat dissipation pipe assembly 30, and the heat dissipation medium can flow through the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can dissipate heat from the heat dissipation pipe assembly 30, and the heat transferred by the heat dissipation medium can be quickly dissipated at the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50. That is, in the embodiments of the present application, by arranging the heat dissipation base plate 10, the heat dissipation pipe assembly 30, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, once the heat of the component to be cooled 100 is transferred to the heat dissipation base plate 10, the heat dissipation pipe assembly 30 can quickly transfer the heat to the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so as to quickly dissipate the heat, so that the component to be cooled 100 can be quickly cooled, thereby improving the efficiency of dissipating heat from the component.

[0126] Some embodiments of the present application provide a telecommunication device, which includes the heat dissipation device in any of the above embodiments.

[0127] In the embodiment of the present application, since the mounting base plate 20 is provided with the mounting hole 201, and the mounting hole 201 penetrates the mounting base plate 20 along the first direction, the heat dissipation base plate 10 can be arranged in the mounting hole 201, and the heat dissipation base plate 10 protrudes from the second surface or is flush with the second surface, and then when the heat dissipation of the component to be cooled 100 is needed, the component to be cooled 100 can be in contact with the heat dissipation base plate 10. Since the heat dissipation pipe assembly 30 is connected to the heat dissipation base plate 10, and the heat dissipation medium is arranged in the heat dissipation pipe assembly 30, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 are connected, and the first heat dissipation fin assembly 40 is fixed to the first surface, and part of the heat dissipation pipe assembly 30 is located between the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, therefore, once the heat dissipation device needs to cool the component to be cooled 100, the component to be cooled 100 can be in contact with the heat dissipation base plate 10, or the component to be cooled 100 is opposite to the heat dissipation base plate 10, so that the heat of the component to be cooled 100 can be transferred to the heat dissipation base plate 10, and the heat dissipation base plate 10 can transfer the heat of the component to be cooled 100 to the heat dissipation pipe assembly 30, so that the heat dissipation medium in the heat dissipation pipe assembly 30 can be heated by absorbing the heat, and the heat dissipation medium can flow in the heat dissipation pipe assembly 30, and the heat dissipation medium can flow through the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50 can dissipate the heat of the heat dissipation pipe assembly 30, and the heat transferred by the heat dissipation medium can be quickly dissipated at the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50. That is, in the embodiment of the present application, by arranging the heat dissipation base plate 10, the heat dissipation pipe assembly 30, the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, once the heat of the component to be cooled 100 is transferred to the heat dissipation base plate 10, the heat dissipation pipe assembly 30 can quickly transfer the heat to the first heat dissipation fin assembly 40 and the second heat dissipation fin assembly 50, so that the heat can be quickly dissipated, and the component to be cooled 100 can be quickly cooled, so that the efficiency of the heat dissipation of the component to be cooled can be improved, and the running speed of the telecommunication equipment can be improved.

[0128] In addition, in some embodiments, the telecommunication equipment can include a housing, a circuit board and a chip, the mounting base plate 20 is provided with a plurality of fixing holes, and each fixing hole is provided with a fixing member 80; the chip is arranged on the circuit board, and the fixing member 80 is connected with the circuit board, so that the heat dissipation base plate 10 is in contact with the chip.

[0129] By such an arrangement, the fixing member 80 can be directly connected to the circuit board, so that the heat dissipation base plate 10 is in contact with the chip, and the heat of the chip can be transferred to the heat dissipation base plate 10, so that the chip can be quickly cooled, and the running speed of the chip can be improved.

[0130] In the description of the application, reference has been made to descriptive terms such as "one embodiment", "some embodiments", "an embodiment", "example", "specific example" or "some examples" etc. It is emphasized that each of these terms refers to a specific feature, structure, material or characteristic described in connection with a particular embodiment or example. The descriptive terms are not necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0131] While embodiments of the application have been shown and described, it is to be understood that the application is not limited to the details of the embodiments described, since the scope of the application is defined with respect to the appended claims.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device has a first direction, and comprises a heat dissipation bottom plate, a mounting base plate, a heat dissipation pipe assembly, a first heat dissipation fin assembly and a second heat dissipation fin assembly. The mounting base plate is provided with a mounting hole penetrating through the mounting base plate along the first direction, and has opposite first and second surfaces along the first direction. The heat dissipation bottom plate is arranged in the mounting hole and protrudes from the second surface or is flush with the second surface. The heat dissipation bottom plate is used for dissipating heat of a component to be cooled. The heat dissipation pipe assembly is connected to the heat dissipation bottom plate and is provided with a heat dissipation medium. The first and second heat dissipation fin assemblies are connected and the first heat dissipation fin assembly is fixed to the first surface. Part of the heat dissipation pipe assembly is located between the first and second heat dissipation fin assemblies. In the case that the heat dissipation bottom plate dissipates heat of a component to be cooled, the heat dissipation bottom plate transmits heat of the component to be cooled to the heat dissipation pipe assembly. The heat dissipation medium flows in the heat dissipation pipe assembly and passes through the first and second heat dissipation fin assemblies. The first and second heat dissipation fin assemblies dissipate heat of the heat dissipation pipe assembly.

2. The heat dissipating device according to claim 1, wherein The heat dissipation bottom plate is provided with a heat dissipation channel. Two ends of the heat dissipation pipe assembly are connected to the heat dissipation channel, and the heat dissipation channel is in communication with the inside of the heat dissipation pipe assembly.

3. The heat dissipating device according to claim 2, wherein The heat dissipation pipe assembly comprises a plurality of first heat dissipation pipes, a plurality of second heat dissipation pipes, a third heat dissipation pipe, a fourth heat dissipation pipe and a connecting pipe. The number of the heat dissipation channels is plural. The plurality of heat dissipation channels are arranged at intervals. The heat dissipation channel has opposite first and second openings. The first and second openings are in communication with the inside of the heat dissipation channel. First ends of the plurality of first heat dissipation pipes are connected to the first opening. A first end of the third heat dissipation pipe is connected to the first opening. The third heat dissipation pipe is located on one side of the plurality of first heat dissipation pipes. First ends of the plurality of second heat dissipation pipes are connected to the second opening. A first end of the fourth heat dissipation pipe is connected to the second opening. The fourth heat dissipation pipe is located on one side of the plurality of second heat dissipation pipes. The third and fourth heat dissipation pipes are staggered. Second ends of the first and second heat dissipation pipes are connected. One end of the connecting pipe is connected to a second end of the third heat dissipation pipe. The other end of the connecting pipe is connected to a second end of the fourth heat dissipation pipe. The connection between the first and second heat dissipation pipes is located between the first and second heat dissipation fin assemblies. The connecting pipe is located between the first and second heat dissipation fin assemblies.

4. The heat dissipating device according to claim 3, wherein The first heat dissipation pipe is inclined to the heat dissipation bottom plate along a second direction at the connection with the second heat dissipation pipe. The second heat dissipation pipe is inclined to the heat dissipation bottom plate along the second direction at the connection with the first heat dissipation pipe. The second direction intersects the first direction.

5. The heat dissipating device of claim 3, wherein The first heat dissipation pipe, the second heat dissipation pipe, the third heat dissipation pipe and the fourth heat dissipation pipe each comprise a first pipe segment, a second pipe segment and a third pipe segment. The second pipe segment is connected to the first pipe segment and the third pipe segment at opposite ends, and the diameter of the second pipe segment decreases along the direction from the first pipe segment to the third pipe segment. The first pipe segment of the first heat dissipation pipe is connected to the first opening, the first pipe segment of the second heat dissipation pipe is connected to the second opening, the third pipe segment of the first heat dissipation pipe is connected to the third pipe segment of the second heat dissipation pipe, the first pipe segment of the third heat dissipation pipe is connected to the first opening, the first pipe segment of the fourth heat dissipation pipe is connected to the second opening, the third pipe segment of the third heat dissipation pipe is connected to one end of the connecting pipe, and the third pipe segment of the fourth heat dissipation pipe is connected to the other end of the connecting pipe. The third pipe segment is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

6. The heat dissipating device according to claim 5, wherein The cross section of the first pipe segment along the direction perpendicular to the axis of the first pipe segment is quadrangular.

7. The heat dissipating device of claim 1, wherein The heat dissipation base plate has opposite heat absorbing surface and heat dissipating surface along the first direction. The heat absorbing surface is convex to the second surface, or the heat absorbing surface is flush with the second surface. The heat dissipation pipe assembly is fixed to the heat dissipating surface.

8. The heat dissipating device according to claim 7, wherein The heat dissipation pipe assembly comprises a plurality of fifth heat dissipation pipes and a plurality of sixth heat dissipation pipes. The first ends of the plurality of fifth heat dissipation pipes are respectively connected to the first ends of the plurality of sixth heat dissipation pipes, and the second ends of the plurality of fifth heat dissipation pipes are respectively connected to the second ends of the plurality of sixth heat dissipation pipes. The first ends of the plurality of fifth heat dissipation pipes are fixed to the heat dissipating surface, the first ends of the plurality of sixth heat dissipation pipes are fixed to the heat dissipating surface, and the second ends of the fifth heat dissipation pipes and the second ends of the sixth heat dissipation pipes are located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

9. The heat dissipating device according to claim 8, wherein The fifth heat dissipation pipe and the sixth heat dissipation pipe each comprise a fourth pipe segment, a fifth pipe segment and a sixth pipe segment. The fifth pipe segment is connected to the fourth pipe segment and the sixth pipe segment at opposite ends, and the diameter of the fifth pipe segment decreases along the direction from the fourth pipe segment to the sixth pipe segment. The fourth pipe segment of the fifth heat dissipation pipe is connected to the fourth pipe segment of the sixth heat dissipation pipe, and the fourth pipe segment of the fifth heat dissipation pipe and the fourth pipe segment of the sixth heat dissipation pipe are fixed to the heat dissipating surface. The sixth pipe segment is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

10. The heat dissipating device according to claim 9, wherein The cross section of the fourth pipe segment along the direction perpendicular to the axis of the fourth pipe segment is quadrangular.

11. The heat dissipating device according to claim 1, wherein The heat dissipation base plate has a heat absorbing surface which is convex to the second surface or flush with the second surface, and an interface material is arranged on the heat absorbing surface for heat conduction.

12. The heat dissipating device of claim 11, wherein, The second surface is fixed with an interface sleeve, the interface sleeve surrounds the mounting hole in the projection of the second surface, and the interface material is located inside the interface sleeve.

13. The heat dissipating device of claim 1, wherein, The first surface is provided with a first groove, and the heat pipe assembly part is located in the first groove and flush with the first surface.

14. The heat dissipating device of claim 1, wherein, The surface of the first heat dissipation fin assembly towards the second heat dissipation fin assembly is provided with a receiving groove, and / or the surface of the second heat dissipation fin assembly towards the first heat dissipation fin assembly is provided with a receiving groove, and part of the heat pipe assembly is located in the receiving groove, so that part of the heat pipe assembly is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

15. The heat dissipating device of claim 14, wherein, Part of the heat pipe assembly is in interference contact with the receiving groove.

16. The heat dissipating device of claim 1, wherein, The mounting base is provided with a plurality of fixing holes, and each fixing hole is provided with a fixing member.

17. The heat dissipating device of claim 1, wherein, The heat pipe assembly is formed by a pulsating heat pipe.

18. The heat dissipating device of claim 1, wherein, The heat pipe assembly comprises an evaporation section, an adiabatic section and a condensation section connected in sequence; wherein the evaporation section is connected with the heat dissipation bottom plate, and the condensation section is located between the first heat dissipation fin assembly and the second heat dissipation fin assembly.

19. A telecommunications device, comprising: The telecommunications device comprises the heat dissipation device of any one of claims 1-18.

20. The telecommunications device of claim 19, wherein, The telecommunications device comprises a housing, a circuit board and a chip, the mounting base is provided with a plurality of fixing holes, and each fixing hole is provided with a fixing member; The chip is arranged on the circuit board, and the fixing member is connected with the circuit board, so that the heat dissipation bottom plate is in contact with the chip. The telecommunications device comprises a housing, a circuit board and a chip, the mounting base is provided with a plurality of fixing holes, and each fixing hole is provided with a fixing member; The chip is arranged on the circuit board, and the fixing member is connected with the circuit board, so that the heat dissipation bottom plate is in contact with the chip.

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