Heat dissipation apparatus and computing device

Abstract

Embodiments of the present application relate to the technical field of computing devices, and provide a heat dissipation apparatus and a computing device. The heat dissipation apparatus comprises: a support assembly and a heat dissipation assembly. The support assembly is disposed on a surface of a circuit board, and the heat dissipation assembly is disposed on a surface of the support assembly distant from the circuit board. The heat dissipation assembly, the support assembly and the circuit board enclosingly form a first accommodating cavity, the first accommodating cavity being used to accommodate a device on the circuit board to undergo heat dissipation. The heat dissipation assembly is provided with a liquid inlet channel and a liquid outlet channel in communication with the first accommodating cavity, the liquid inlet channel being used to allow a cooling working medium to enter the first accommodating cavity, and the liquid outlet channel being used to allow the cooling working medium to flow out of the first accommodating cavity. The heat dissipation apparatus is used to ensure the reliability of a computing device in a heat dissipation process.

Description

Heat dissipation devices and computing equipment

[0001] This application claims priority to Chinese Patent Application No. 202410686639.3, filed with the State Intellectual Property Office of China on May 29, 2024, entitled "Heat Dissipation Device and Computing Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of computing device technology, and more particularly to a heat dissipation device and a computing device. Background Technology

[0003] With the development of fields such as artificial intelligence and big data analytics, the performance requirements for computing devices are becoming increasingly demanding. High-performance computing devices generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, it can lead to overheating of the hardware and even damage. However, conventional air cooling is no longer sufficient for timely and effective heat dissipation, thus liquid cooling technology has emerged as a solution.

[0004] Currently, full immersion liquid cooling is the most commonly used liquid cooling technology. However, full immersion liquid cooling can easily affect the reliability of components inside computing devices. Therefore, how to ensure the reliable operation of computing devices during heat dissipation is a technical problem that engineers urgently need to solve. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a heat dissipation device and a computing device to solve the technical problem that the heat dissipation device affects the reliability of the computing device during the heat dissipation process.

[0006] The embodiments of this application provide the following technical solutions:

[0007] On one hand, a heat dissipation device is provided. The heat dissipation device includes a support assembly and a heat dissipation assembly. The support assembly is disposed on the surface of a circuit board. The heat dissipation assembly is disposed on the surface of the support assembly away from the circuit board. The heat dissipation assembly, the support assembly, and the circuit board form a first accommodating cavity, which is used to accommodate a device on the circuit board to be cooled. The heat dissipation assembly has an inlet channel and an outlet channel communicating with the first accommodating cavity. The inlet channel allows a cooling medium to enter the first accommodating cavity, and the outlet channel allows the cooling medium to flow out of the first accommodating cavity.

[0008] In the aforementioned heat dissipation device, the device to be cooled is immersed in a cooling medium filled in the first accommodating cavity. The circulating flow of the cooling medium carries away the heat generated by the device, thus completing the heat dissipation process. Since the device is in direct contact with the cooling medium, it can more directly transfer the generated heat to the cooling medium, thereby improving the heat dissipation efficiency.

[0009] Furthermore, the heat dissipation component, the support component, and the circuit board form a first accommodating cavity. The heat dissipation component can partially enclose the first accommodating cavity, thereby isolating the device to be cooled on the circuit board from other devices. This prevents the cooling medium in the first accommodating cavity from flowing out and affecting other devices on the circuit board, and facilitates the replacement and repair of other devices outside the first accommodating cavity. This simplifies the later maintenance process, reduces production costs, and improves the reliability of devices outside the first accommodating cavity, thereby improving the reliability of the circuit board and even the entire computing device.

[0010] In addition, the first accommodating cavity allows for immersion liquid cooling of some of the multiple heat-dissipating components on the circuit board, thereby reducing the volume of the heat dissipation device, which in turn reduces the amount of cooling medium required for heat dissipation and lowers production costs.

[0011] In some implementations, the heat dissipation device further includes a heat-conducting plate. The heat-conducting plate is disposed on the surface of the heat dissipation assembly facing the first accommodating cavity, and is used to at least partially contact the device to be cooled.

[0012] This configuration allows the heat generated by the device to be cooled to be directly transferred to the heat dissipation component using a heat-conducting plate. The heat is then dissipated through the heat dissipation component while the cooling medium dissipates the heat, thereby improving the heat dissipation efficiency.

[0013] In some implementations, the heat-conducting plate is used to at least partially cover the device to be cooled.

[0014] In this way, the heat-conducting plate can be at least partially placed on the main heat-generating parts of the device to be cooled, thereby improving heat dissipation efficiency while reducing production costs.

[0015] In some implementations, the heat dissipation component includes a body. The body has a second accommodating cavity, a first inlet and a first outlet on the surface of the body away from the supporting component, and a second inlet and a second outlet on the surface of the body close to the supporting component. The first inlet and the second inlet form a liquid inlet channel, and the first outlet and the second outlet form a liquid outlet channel. The first inlet and the second inlet are in communication with both the first accommodating cavity and the second accommodating cavity, and the first outlet and the second outlet are in communication with both the first accommodating cavity and the second accommodating cavity.

[0016] This configuration allows the cooling medium to flow in and out of the second accommodating cavity via the first inlet and first outlet, thereby dissipating heat through the circulation of the cooling medium. Furthermore, the cooling medium entering the second accommodating cavity can also fill and exit the first accommodating cavity via the second inlet and second outlet, thus immersing the device to be cooled within the first accommodating cavity.

[0017] In some implementations, the second inlet is positioned close to the first inlet, and the second outlet is positioned close to the first outlet.

[0018] By arranging the relative positions of the second inlet and the first inlet, as well as the second outlet and the first outlet, the flow direction of the cooling medium can be controlled. For example, the straight-line distance between the second inlet and the first inlet can be reduced. For instance, the second inlet can be positioned directly below the first inlet. This increases the filling rate of the first accommodating cavity by the cooling medium, allowing the device to be cooled to contact the cooling medium promptly, thus achieving timely cooling. Furthermore, the straight-line distance between the second outlet and the first outlet can also be reduced. For example, the second outlet can be positioned directly below the first outlet. This allows for the timely removal of the heat-carrying cooling medium, thereby improving the efficiency of heat dissipation for the device.

[0019] In some implementations, the heat dissipation assembly also includes an isolation structure disposed within the second accommodating cavity. The isolation structure is used to divide the second accommodating cavity into multiple flow channels, with the first inlet and the first outlet both connected to each flow channel.

[0020] This configuration allows for control of the flow path and direction of the cooling medium through the flow channels, and increases the surface area of ​​contact between the cooling medium and the heat dissipation components, thereby increasing the heat exchange efficiency of the cooling medium and improving heat dissipation capacity.

[0021] In some implementations, the isolation structure includes multiple heat dissipation fins. These fins are spaced apart within the second accommodating cavity, forming multiple flow channels.

[0022] In this implementation, the increase in the surface area of ​​the heat dissipation component due to the isolation structure can be achieved through the structural features of the heat dissipation fins. The heat dissipation fins can be made of materials with high thermal conductivity, such as copper, steel, or alloys. By setting multiple heat dissipation fins, the heat exchange capacity of the cooling medium can be increased, thereby improving the heat dissipation capacity.

[0023] In some implementations, the body includes a top wall and a bottom wall, each heat dissipation fin is connected to the top wall and bottom wall of the body on both sides in the height direction of the body, and multiple heat dissipation fins are arranged in an array on a plane perpendicular to the height direction, with the intervals between the multiple heat dissipation fins forming flow channels.

[0024] In some implementations, the heat dissipation device also includes a sealing ring. The surface of the support assembly facing the heat dissipation assembly and / or the surface of the heat dissipation assembly facing the support assembly has a groove, the groove surrounding the first receiving cavity, and the sealing ring is disposed within the groove.

[0025] In this implementation, the sealing ring improves the tightness of contact between the support component and the heat dissipation component, thereby enhancing the airtightness of the first accommodating cavity and preventing leakage of the cooling medium within the cavity, which could affect the stable operation of devices outside the cavity. By improving the airtightness of the first accommodating cavity, reliable operation of devices outside the cavity can be guaranteed, thus improving the reliability of the circuit board and even the computing device.

[0026] In some implementations, the heat dissipation device also includes a solder preform. The solder preform is disposed on the surface of the support assembly opposite to the heat dissipation assembly, and is used to form solder that secures the support assembly to the circuit board.

[0027] In this implementation, the solder obtained by welding preforms can improve the tightness of the welding between the support component and the circuit board, thereby improving the stability of the welding between the support component and the circuit board.

[0028] In addition, the tight soldering between the support components and the circuit board can improve the airtightness of the first accommodating cavity, thereby preventing the cooling working fluid in the first accommodating cavity from flowing out, thus ensuring the reliable operation of other devices on the circuit board.

[0029] In some implementations, the support component has multiple spaced receiving grooves on its surface away from the heat dissipation component, the receiving grooves being used to receive portions of solder.

[0030] In this implementation, by setting up receiving grooves, the solder during welding can extend into the receiving grooves, thereby wrapping the protruding tooth-like structure between two adjacent receiving grooves, thus increasing the tightness of the weld. In addition, the setting of receiving grooves helps to bear the lateral force from the cooling medium in the first receiving cavity, thereby improving the strength of the weld between the support component and the circuit board.

[0031] In some implementations, the heat dissipation device also includes fasteners for securing the support assembly and the heat dissipation assembly.

[0032] In some implementations, the fasteners include bolts and nuts. The support assembly has a first through hole, the heat dissipation assembly has a second through hole, and the bolt passes through the first and second through holes and engages with the nut.

[0033] In this implementation, the support component and heat dissipation component can be assembled with the circuit board using bolts and nuts. For example, the bolts pass through the heat dissipation component, the support component, and the circuit board before being fixedly connected with nuts. This arrangement simplifies the device structure and reduces production costs. Furthermore, this connection method results in less stress on the three components, improving the overall structural robustness.

[0034] In addition, this fixing method can reduce the area occupied by the heat dissipation device on the circuit board, and the layout is flexible, making it easy to install, maintain and replace the heat dissipation device.

[0035] In some implementations, the heat dissipation device also includes a support plate. The support plate is positioned on the side of the circuit board away from the support assembly, and has a third through hole through which bolts pass and engage with nuts.

[0036] In this implementation, by setting a support plate, the circuit board can be supported from the side of the circuit board away from the support component during actual assembly, thereby improving the structural strength of the circuit board and avoiding deformation of the circuit board caused by the tensile force generated during the installation of the support component and heat dissipation component on the circuit board, or even tearing the solder between the support component and the circuit board, or even affecting the sealing of the first accommodating cavity.

[0037] On the other hand, a circuit board assembly is provided. The circuit board assembly includes a circuit board, a heat dissipation device as described in any of the above implementations, and a device to be heat-dissipated disposed on the circuit board, the device to be heat-dissipated being disposed within a first receiving cavity of the heat dissipation device.

[0038] In some implementations, the device to be cooled includes a packaging substrate, a packaging flange disposed on the packaging substrate, and a chip, with the packaging flange surrounding the chip. The chip is in at least partial contact with the heat-conducting plate, and there is a gap between the packaging flange and the heat dissipation component.

[0039] In some implementations, the circuit board is the motherboard, and the device to be cooled is the CPU or GPU.

[0040] In some implementations, the circuit board is a single board, and the device to be cooled is a BMC.

[0041] In another aspect, a computing device is provided. The computing device includes a circuit board, a device to be cooled, and a heat dissipation device as described in any of the above implementations. The device to be cooled is disposed on the circuit board and is located in a first receiving cavity of the heat dissipation device.

[0042] In another aspect, a computing device is provided. The computing device includes a circuit board, a device to be cooled, a support assembly, a heat dissipation assembly, an inlet pipe, and an outlet pipe. The device to be cooled is disposed on the circuit board, the support assembly is disposed on the circuit board, and the heat dissipation assembly is disposed on the surface of the support assembly away from the circuit board. The support assembly, the heat dissipation assembly, and the circuit board form a first accommodating cavity, and the device to be cooled is disposed within the first accommodating cavity. The heat dissipation assembly includes a body, which is disposed within a second accommodating cavity. The surface of the body away from the support assembly has a first inlet and a first outlet, and the surface of the body near the support assembly has a second inlet and a second outlet. The first inlet and the second inlet are both connected to the first accommodating cavity and the second accommodating cavity, and the first outlet and the second outlet are both connected to the first accommodating cavity and the second accommodating cavity. The inlet pipe is connected to the first inlet and is used to introduce a cooling medium into the first accommodating cavity and the second accommodating cavity. The outlet pipe is connected to the first outlet and is used to discharge the cooling medium out of the first accommodating cavity and the second accommodating cavity.

[0043] In this implementation, the cooling medium can enter the second accommodating cavity through the inlet pipe and the first inlet, and flow out through the first outlet and the outlet pipe. Furthermore, the cooling medium can also further enter the first accommodating cavity through the inlet pipe, the first inlet, and the second inlet, and flow out through the second outlet, the first outlet, and the outlet pipe. Thus, the device to be cooled can undergo immersion cooling through the cooling medium in the first accommodating cavity, and the circulating flow of the cooling medium within the first accommodating cavity can remove heat from the device. The device to be cooled can also undergo heat exchange cooling through the cooling medium in the second accommodating cavity.

[0044] In some implementations, the computing device further includes a heat-conducting plate. The heat-conducting plate is disposed on the surface of the heat dissipation assembly facing the first accommodating cavity, and the heat-conducting plate is in at least partial contact with the device to be cooled; the heat dissipation assembly also includes an isolation structure disposed within a second accommodating cavity, the isolation structure being used to divide the second accommodating cavity into multiple flow channels, and a first inlet and a first outlet communicating with each flow channel.

[0045] In this implementation, the device to be cooled is in contact with the heat dissipation assembly through a heat-conducting plate. The heat from the device can then be transferred to the isolation structure via the heat-conducting plate, and subsequently to the outside of the heat dissipation device via the isolation structure. Furthermore, the isolation structure divides the second accommodating cavity into multiple flow channels. The heat from the device to be cooled can be transferred to the cooling medium within the second accommodating cavity via the heat-conducting plate. The circulating flow of the cooling medium within these multiple flow channels further improves the heat dissipation efficiency.

[0046] The circuit board assembly and computing device described above have the same structure and beneficial technical effects as the heat dissipation device provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this application.

[0048] Figure 1 is a schematic diagram of the structure of a computing device according to some embodiments;

[0049] Figure 2 is a schematic diagram of a circuit board assembly according to some embodiments;

[0050] Figure 3 is a top view of the heat-dissipating device in a circuit board assembly according to some embodiments;

[0051] Figure 4 is a schematic diagram of a heat dissipation device and circuit board assembly according to some embodiments;

[0052] Figure 5 is a cross-sectional view of the heat dissipation component of a heat dissipation device provided in Figure 4, taken along A-A'.

[0053] Figure 6 is a cross-sectional view of the heat dissipation component of another heat dissipation device provided in Figure 4, taken along A-A'.

[0054] Figure 7 is a top view of the structure of the support component according to some embodiments;

[0055] Figure 8 is a side view of the structure of a support component according to some embodiments;

[0056] Figure 9 is a side view of the structure of the support assembly, welding preform and circuit board assembly according to some embodiments;

[0057] Figure 10 is a schematic diagram of another heat dissipation device and circuit board assembly according to some embodiments;

[0058] Figure 11 is a schematic diagram of another circuit board assembly according to some embodiments;

[0059] Figure 12 is a structural schematic diagram of a support plate according to some embodiments;

[0060] Figure 13 is a schematic diagram of another support plate according to some embodiments;

[0061] Figure 14 is a structural schematic diagram of another support plate according to some embodiments. Detailed Implementation

[0062] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0063] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0064] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0065] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0066] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0067] It should be understood that when a layer or component is referred to as being on another layer or motherboard, it can mean that the layer or component is directly on another layer or motherboard, or that there is an intermediate layer between the layer or component and another layer or motherboard.

[0068] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0069] Figure 1 is a schematic diagram of the structure of a computing device 1000 according to some embodiments.

[0070] Referring to Figure 1, some embodiments of this application provide a computing device 1000, which may include a chassis 1210 and circuit board assemblies and other electronic components disposed within the chassis 1210. Exemplarily, the computing device 1000 may be any device with computing capabilities, such as a portable computer, rack server, blade server, or GPU server.

[0071] For example, chassis 1210 may include a chassis body and a cover, which are connected to each other to enclose an accommodating space. The accommodating space can house, for example, circuit board assemblies, hard drives, and other electronic devices. The connection between the chassis body and the cover can be detachable, allowing the components inside the chassis body to be exposed by opening the cover. Alternatively, the connection between the chassis body and the cover can be a snap-fit ​​connection. In addition, the chassis body and the cover can also be detachably connected using screws, bolts, or pins.

[0072] For example, the chassis body may include a base plate and multiple side plates, wherein the multiple side plates may be arranged along the edge of the base plate and the multiple side plates may be perpendicular to the base plate, and the base plate and the cover are respectively arranged on opposite sides of the multiple side plates.

[0073] In other examples, the computing device may be a rack-mount server. A rack-mount server may include a rack and one or more servers housed within the rack. Exemplarily, the computing device may also include workstations, storage devices, switches, or repeaters, etc.

[0074] Figure 2 is a schematic diagram of the circuit board assembly 1220 according to some embodiments. Figure 3 is a top view of the heat dissipation device 300 of the circuit board assembly 1220 according to some embodiments.

[0075] Referring to Figure 2, in some implementations, the circuit board assembly 1220 may include a circuit board 200 and a heat dissipation device 100 disposed on the circuit board 200.

[0076] For example, the circuit board assembly 1220 may also include devices disposed on the circuit board 200, such as a central processing unit (CPU), dual inline memory modules (DIMM), graphics processing unit (GPU), network card, peripheral component interconnect express (PCIE) card, complex programmable logic device (CPLD), baseboard manager controller (BMC), etc., which will not be listed here.

[0077] In some implementations, the circuit board assembly 1220 may also include a heat-dissipating device 300 disposed within the first accommodating cavity of the heat dissipation device 100.

[0078] In some examples, circuit board 200 can be a motherboard, on which components such as a CPU and DIMMs can be mounted. In this case, the device to be cooled 300 can be any device that requires heat dissipation, such as a CPU or GPU.

[0079] In other examples, circuit board 200 may also be a single board, on which a BMC may be provided, for example. In this case, the device to be cooled 300 may be a BMC. This application does not limit the circuit board and the device to be cooled.

[0080] The following description uses the CPU as an example of the device to be cooled, 300.

[0081] Please refer to Figure 2. The heat dissipation device 300 includes a packaging substrate 310, a packaging flange 320 and a chip 330 disposed on the packaging substrate 310, with the packaging flange 320 surrounding the chip 330.

[0082] Please refer to Figures 2 and 3. In some examples, the CPU can be packaged as a lidless package. In a lidless package, in addition to the chip 330, the CPU packaging substrate 310 also includes a packaging flange 320 surrounding the chip 330. There may be a gap between the boundary of the packaging flange 320 near the chip 330 and the chip 330.

[0083] This packaging method, by removing the cover covering the upper surface of the chip 330, allows the cooling medium filled in the first accommodating cavity of the heat dissipation device 100 to enter the gap between the packaging flange 320 and the chip 330, thereby allowing the heat generated by the chip 330 to be directly dissipated to the cooling medium. A gap may exist between the packaging flange 320 and the heat dissipation device 100, providing a channel for the inflow and outflow of the cooling medium, achieving at least partial contact between the cooling medium and the chip 330, and further utilizing the cooling medium to increase the heat dissipation efficiency of the chip 330.

[0084] In other examples, the CPU may also be packaged with a lid. For instance, in a lid package, the heat generated by the chip 330 needs to be transferred to the top lid, and then the heat is transferred to the heat dissipation device 100 via the lid, thereby achieving heat dissipation for the chip 330. This application does not limit the specific packaging method of the CPU.

[0085] This application provides a heat dissipation device. The heat dissipation device has a first accommodating cavity for accommodating the device to be cooled, thereby achieving partial immersion of the device within the computing device. That is, the heat dissipation device of this application embodiment can perform partial immersion liquid cooling of the device to be cooled, thereby avoiding the cooling medium from affecting other devices and improving the overall reliability of the computing device.

[0086] The specific structure of the heat dissipation device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings. Figure 4 is a schematic diagram of the structure of a heat dissipation device 100 assembled with a circuit board 200 according to some embodiments.

[0087] Referring to Figure 4, in some implementations, a heat dissipation device 100 is provided. The heat dissipation device 100 includes a support assembly 110 and a heat dissipation assembly 120. The support assembly 110 is disposed on the surface of the circuit board 200, and the heat dissipation assembly 120 is disposed on the surface of the support assembly 110 away from the circuit board 200. The heat dissipation assembly 120, the support assembly 110, and the circuit board 200 form a first receiving cavity 111, which is used to receive the device 300 to be cooled on the circuit board 200. The heat dissipation assembly 120 has an inlet channel 128 and an outlet channel 129 communicating with the first receiving cavity 111. The inlet channel 128 is used to allow cooling medium to enter the first receiving cavity 111, and the outlet channel 129 is used to allow cooling medium to flow out of the first receiving cavity 111.

[0088] In this embodiment, by housing the heat-dissipating device 300 on the circuit board 200 within the first accommodating cavity 111, isolation between the heat-dissipating device 300 and other devices on the circuit board 200 can be achieved. Furthermore, the heat dissipation assembly 120 is disposed on the support assembly 110. The heat dissipation assembly 120 can partially enclose the first accommodating cavity 111, thereby preventing the cooling medium filled in the first accommodating cavity 111 from flowing out through any part other than the liquid inlet channel 128 and the liquid outlet channel 129, thus avoiding impact on other devices on the circuit board 200. This arrangement enables localized immersion liquid cooling of the heat-dissipating device while preventing impact on other devices, improving the overall reliability and stability of the circuit board.

[0089] In some examples, the cooling medium may include any medium that meets the liquid cooling requirements, such as fluorinated liquid or liquid cooling oil; this embodiment does not impose specific limitations on this. For example, the cooling medium may include a single-phase cooling medium or a two-phase cooling medium. A single-phase cooling medium refers to a cooling medium that maintains a single liquid state during liquid cooling. A two-phase cooling medium refers to a cooling medium that undergoes a gas-liquid phase transition during heat absorption and release. The liquid cooling process refers to the process by which the cooling medium cools the device to be cooled.

[0090] In addition, the liquid inlet channel 128 and liquid outlet channel 129 on the heat dissipation assembly 120 can realize the inflow and outflow of the cooling medium in the first accommodating cavity 111. Thus, after the heat generated by the device to be cooled 300 is transferred to the cooling medium, the heat can be carried out by the circulation of the cooling medium, thereby realizing the heat dissipation of the device to be cooled 300.

[0091] In this application, since devices immersed in the cooling medium become contaminated with it, special materials are needed to treat the contaminated cooling medium when a problem occurs (e.g., device failure or need for upgrade) before the device can be maintained and repaired. In this embodiment, a heat dissipation device 100 isolates the device 300 from other devices, allowing other devices on the circuit board 200 to operate without contact with the cooling medium. This eliminates the need for cooling medium treatment, simplifying the repair process and improving efficiency.

[0092] Furthermore, the first accommodating cavity 111 in this embodiment enables immersion liquid cooling of some of the multiple heat-dissipating devices on the circuit board 200, thereby reducing the volume of the heat dissipation device, which in turn reduces the amount of cooling medium required for heat dissipation and lowers production costs. In addition, the reduced size of the heat dissipation device also reduces the area it occupies on the circuit board 200.

[0093] For example, circuit board 200 can be a printed circuit board (PCB).

[0094] Referring to Figure 4, in some implementations, the heat dissipation device 100 may further include a heat-conducting plate 130. The heat-conducting plate 130 is disposed on the surface of the heat dissipation assembly 120 facing the first receiving cavity 111. The heat-conducting plate 130 is used to make at least partial contact with the device to be cooled.

[0095] The heat-conducting plate 130 has a high thermal conductivity. For example, the thermal conductivity of the heat-conducting plate 130 may be greater than or equal to that of copper. In some examples, the heat-conducting plate 130 may include a flexible thermally conductive material, such as carbon fiber, graphite paper flexible conductive material, composite flexible conductive material, etc.

[0096] In other examples, the heat-conducting plate 130 may also include a phase change material (PCM) to absorb the heat generated by the device to be cooled during the phase change process, thereby achieving heat dissipation of the device.

[0097] In some other examples, the heat-conducting plate 130 may also include other heat-conducting materials that can implement any of the embodiments of this application, and this embodiment does not limit this.

[0098] In this implementation, the heat-conducting plate 130 can be located between the heat dissipation component 120 and the device to be cooled, thereby directly and quickly transferring the heat generated by the device to be cooled to the heat dissipation component 120, and then using the heat dissipation component 120 to dissipate the heat, thereby improving the efficiency of cooling the device to be cooled.

[0099] Referring to Figures 2 and 3, when the heat-dissipating device 300 uses a lidless package, the exposed chip 330, lacking reinforcement and protection from a cover, is at risk of breakage and warping. In this case, a gap exists between the package flange 320 and the heat dissipation assembly 120, allowing the heat-conducting plate 130 to contact the chip 330. This implementation utilizes the heat-conducting plate 130 to cover the chip 330, thereby reinforcing and protecting it. Furthermore, due to the excellent thermal conductivity of the heat-conducting plate 130, it not only reinforces and protects the chip 330 but also rapidly transfers the heat generated by the chip 330 to the heat dissipation assembly 120, thus improving the heat dissipation efficiency of the chip 330.

[0100] In some implementations, the heat-conducting plate 130 can be used to at least partially cover the device to be cooled. In this way, the coverage area of ​​the heat-conducting plate 130 can be at least partially set on the chip 330, and since the chip 330 is the main heat-generating part of the device to be cooled, the production cost is reduced while improving the heat dissipation efficiency.

[0101] Furthermore, since the heat-conducting plate 130 uses a flexible heat-conducting material, it can achieve good contact with the heat-dissipating device 300 and the heat dissipation assembly 120 located on both sides of it, avoiding incomplete contact caused by the heat-dissipating device 300 directly contacting the heat dissipation assembly 120. For example, the heat-dissipating device 300 and the heat dissipation assembly 120 may have incomplete contact, such as point-to-surface contact or line-to-surface contact.

[0102] Please refer to Figure 4. In some implementations, the heat dissipation assembly 120 includes a body 123. The body 123 has a second accommodating cavity 124. The surface of the body 123 away from the support assembly 110 has a first inlet 121 and a first outlet 122, and the surface of the body 123 closer to the support assembly 110 has a second inlet 125 and a second outlet 126. The first inlet 121 and the second inlet 125 form a liquid inlet channel 128, and the first outlet 122 and the second outlet 126 form a liquid outlet channel 129. The first inlet 121 and the second inlet 125 are connected to both the first accommodating cavity 111 and the second accommodating cavity 124, and the first outlet 122 and the second outlet 126 are also connected to both the first accommodating cavity 111 and the second accommodating cavity 124.

[0103] In this implementation, by setting a first inlet 121, a first outlet 122, a second inlet 125, and a second outlet 126 on the main body 123, a liquid inlet channel 128 and a liquid outlet channel 129 can be formed, thereby realizing the inflow and outflow of the cooling working fluid in the second accommodating cavity 124 and the first accommodating cavity 111.

[0104] Since the first accommodating cavity 111 contains the device 300 to be cooled, the cooling medium within the first accommodating cavity 111 can achieve immersion liquid cooling of the device 300, thereby cooling the device 300. Furthermore, by providing an inlet channel 128 and an outlet channel 129, the cooling medium flows within the first accommodating cavity 111, transferring and dissipating the heat it carries, thereby improving the reliability and stability of the device 300 immersed in the cooling medium.

[0105] In addition, the second accommodating cavity 124 is also filled with a cooling medium, and the cooling medium in the second accommodating cavity 124 can flow in and out of the second accommodating cavity 124 through the first inlet 121 and the first outlet 122. As a feasible implementation, the device 300 to be cooled in the first accommodating cavity 111 can indirectly contact the cooling medium in the second accommodating cavity 124 through the heat-conducting plate 130. The heat of the device 300 to be cooled can be transferred to the cooling medium in the second accommodating cavity 124 through the heat-conducting plate 130. Through the flow of the cooling medium in the second accommodating cavity 124, the heat generated by the device 300 to be cooled by the heat-conducting plate 130 can be quickly transferred and dissipated, thereby improving the heat dissipation performance of the device 300 to be cooled.

[0106] For example, the body 123 can be generally rectangular in shape, and the body 123 is arranged generally parallel to the circuit board 200. "Generally parallel" means that the body 123 and the circuit board 200 are not completely parallel, that is, there can be a certain deviation. The first inlet 121 and the first outlet 122 can be arranged alternately on the surface of the body 123 facing away from the support assembly 110, and the second inlet 125 and the second outlet 126 can be arranged alternately on the surface of the body 123 facing the circuit board 200. The arrangement of the second inlet 125 and the second outlet 126 allows the cooling medium to flow from the second accommodating cavity 124 to the first accommodating cavity 111, thereby realizing the flow of the cooling medium within the first accommodating cavity 111.

[0107] Furthermore, by arranging the second inlet 125 and the second outlet 126 on the same surface, the flow direction of the cooling medium can be controlled, thereby ensuring uniform flow of the cooling medium. In some examples, the second inlet 125 is positioned close to the first inlet 121, and the second outlet 126 is positioned close to the first outlet 122. Specifically, the straight-line distance between the second inlet 125 and the first inlet 121 can be reduced. For example, the second inlet 125 can be positioned directly below the first inlet 121. In this case, the rate at which the external cooling medium fills the first accommodating cavity 111 and the second accommodating cavity 124 can be increased, thereby allowing the device to be cooled 300 to come into contact with the cooling medium in a timely manner, thus enabling timely cooling of the device to be cooled 300.

[0108] Furthermore, the straight-line distance between the second outlet 126 and the first outlet 122 can be reduced. For example, the second outlet 126 can be located directly below the first outlet 122. In this case, the rate at which the cooling medium flows out from the first receiving cavity 111 and the second receiving cavity 124 can be increased, thereby timely removing the heat-carrying cooling medium and improving heat dissipation efficiency.

[0109] In some examples, the shape of the body 123 of the heat dissipation component 120 can include any three-dimensional shape that meets the heat dissipation requirements of the circuit board, such as a cylinder, cuboid, or cube. For example, when the body 123 is a cuboid, the surface of the body 123 near the support component 110 is rectangular. In this case, the second inlet 125 and the second outlet 126 can be positioned near any two non-adjacent interior corners of this rectangular surface. For instance, the second inlet 125 and the second outlet 126 can be positioned on the diagonal of the rectangular surface. This arrangement allows for the control of a uniform and unidirectional flow of the cooling medium within the first receiving cavity 111, thereby accelerating the outward flow of the cooling medium and achieving timely and effective heat dissipation.

[0110] In some examples, the first inlet 121, the first outlet 122, the second inlet 125, and the second outlet 126 can be cylindrical holes, polygonal holes, or other irregularly shaped holes, etc., and this embodiment does not impose specific restrictions on them.

[0111] In another example, the number of the second inlet 125 and the second outlet 126 can be one or more, which is not limited in this embodiment of the application.

[0112] Please refer to Figure 4. In some implementations, the heat dissipation assembly 120 may also include an isolation structure 1241. The isolation structure 1241 is disposed within the second accommodating cavity 124 and is used to divide the second accommodating cavity 124 into multiple flow channels. The first inlet 121 and the first outlet 122 are both connected to each flow channel.

[0113] For example, the following description uses the rectangular parallelepiped shape of body 123 as an example.

[0114] When the body 123 is in the shape of a cuboid, the isolation structure 1241 can be connected to at least a portion of the inner surface of the body 123 in the height direction Z.

[0115] As one possible implementation, the isolation structure 1241 can be connected to the inner surface of the body 123 on the side close to the support component 110. Alternatively, in another possible implementation, the isolation structure 1241 can be connected to the inner surface of the body 123 on the side away from the support component 110. Or, in other possible implementations, the isolation structure 1241 can be connected to both inner surfaces of the body 123 in the height direction, thereby forming multiple flow channels for the flow of cooling working fluid.

[0116] The connection between the isolation structure 1241 and the body 123 can be any feasible connection method, such as detachable connection or integral connection, and this application embodiment does not limit this.

[0117] In this implementation, the device 300 to be cooled within the first accommodating cavity 111 can contact the heat dissipation assembly 120 via the heat-conducting plate 130, thereby rapidly transferring the heat generated by the device 300 to the heat dissipation assembly 120, whereby the heat is dissipated by the cooling medium within the heat dissipation assembly 120. The heat dissipation assembly 120 includes an isolation structure 1241, which divides the second accommodating cavity into multiple flow channels, thereby controlling the path and direction of the cooling medium flow. For example, the isolation structure 1241 can make the heat dissipation assembly 120 honeycomb-shaped, which increases the surface area of ​​the heat dissipation assembly 120 in contact with the cooling medium, thereby increasing the heat exchange capacity of the cooling medium and improving heat dissipation efficiency.

[0118] In some examples, the material of the isolation structure 1241 can be any thermally conductive material with good thermal conductivity, such as copper, steel, or alloy.

[0119] The heat-dissipating device 300 in the first accommodating cavity 111 can indirectly contact the isolation structure 1241 through the heat-conducting plate 130. In this way, the heat of the heat-dissipating device 300 can also be transferred to the isolation structure 1241 through the heat-conducting plate 130, and then transferred to the outside of the heat dissipation assembly 120 through the isolation structure 1241.

[0120] Please refer to Figure 4. In some implementations, the isolation structure 1241 includes multiple heat dissipation fins 1242. The multiple heat dissipation fins 1242 are spaced apart within the second accommodating cavity 124, and the multiple heat dissipation fins 1242 form multiple flow channels 1243.

[0121] In this embodiment, by setting multiple heat dissipation fins 1242 in the second accommodating cavity 124, the surface area of ​​the cooling working medium in contact with the heat dissipation component 120 can be increased when the cooling working medium in the second accommodating cavity 124 flows through the flow channel, thereby improving the heat exchange capacity of the cooling working medium and improving the heat dissipation efficiency.

[0122] Figure 5 is a cross-sectional view of the heat dissipation component 120 of a heat dissipation device 100 provided in Figure 4, taken along A-A'.

[0123] In some examples, the body 123 includes a top wall and a bottom wall, each heat dissipation fin 1242 is connected to the top wall and bottom wall of the body on both sides in the height direction Z of the body, and multiple heat dissipation fins 1242 are arranged at intervals in a plane perpendicular to the height direction Z, and the intervals between the multiple heat dissipation fins 1242 form a flow channel 1243.

[0124] For example, as shown in FIG5, the heat dissipation fins 1242 can be configured as plates. For example, when the body 123 is in the shape of a cuboid, the body 123 includes a top wall, a bottom wall, and a side wall connecting the top wall and the bottom wall. In this case, the heat dissipation fins 1242 can extend along a first direction X perpendicular to either side wall, and the two ends of the heat dissipation fins 1242 in the height direction Z of the body can be connected to the top wall and the bottom wall of the body, respectively. A plurality of heat dissipation fins 1242 can be arranged sequentially at intervals along a second direction Y, wherein the second direction Y is perpendicular to both the first direction X and the height direction Z. There is a gap between each heat dissipation fin 1242 and the side wall of the body, and there is also a gap between the plurality of heat dissipation fins 1242. The above gaps can form flow channels 1243 for the cooling working fluid to flow within the second accommodating cavity 124.

[0125] In other examples, multiple heat dissipation fins 1242 may also be spaced apart on the top wall of the body 123, with a gap between the multiple heat dissipation fins 1242 and the bottom wall of the body 123, so that the cooling medium can flow through the gap within the second receiving cavity 124. Alternatively, multiple heat dissipation fins 1242 may also be spaced apart on the bottom wall of the body 123, with a gap between the multiple heat dissipation fins 1242 and the top wall of the body 123, so that the cooling medium can flow through the gap within the second receiving cavity 124.

[0126] Alternatively, in other examples, multiple heat dissipation fins 1242 may be disposed on the inner surface of the body 123 (i.e., within the second accommodating cavity 124) in other suitable ways, which is not limited in this embodiment.

[0127] Figure 6 is a cross-sectional view of the heat dissipation component 120 of another heat dissipation device 100 provided in Figure 4, taken along A-A'.

[0128] Referring to Figure 6, in some examples, the heat dissipation fins 1242 can be configured as columns, and the two ends of the columnar heat dissipation fins 1242 can be respectively connected to the top wall and side wall of the body 123, which are disposed opposite to each other in the height direction Z. Multiple heat dissipation fins 1242 are arranged in an array on a plane perpendicular to the height direction Z. Multiple heat dissipation fins 1242 can be arranged in an array within the second accommodating cavity, with gaps between any adjacent heat dissipation fins 1242, thereby allowing the cooling medium within the second accommodating cavity 124 to flow through the gaps.

[0129] For example, the material of the heat dissipation fin 1242 may include copper, steel, alloy, etc., and this embodiment does not limit it.

[0130] Figure 7 is a top view of the structure of the support component 110 according to some embodiments, and Figure 8 is a side view of the structure of the support component 110 according to some embodiments.

[0131] Referring to Figures 4, 7, and 8, in some implementations, the heat dissipation device 100 may further include a sealing ring 140. The surface of the support assembly 110 facing the heat dissipation assembly 120 and / or the surface of the heat dissipation assembly 120 facing the support assembly 110 may have a groove 141, which is disposed around the first receiving cavity 111, and the sealing ring 140 is disposed within the groove 141.

[0132] In this implementation, by setting a sealing ring 140 around the first accommodating cavity 111, the contact between the support component 110 and the heat dissipation component 120 can be made tighter, improving the airtightness of the first accommodating cavity 111 and preventing the leakage of the cooling medium in the first accommodating cavity 111, which could cause other devices on the circuit board to come into contact with the cooling medium, thereby ensuring that other devices on the circuit board can operate stably and reliably.

[0133] In some examples, the sealing ring 140 may be made of rubber. Rubber is a highly elastic, wear-resistant, and inexpensive material.

[0134] In other examples, the material of the sealing ring 140 may also include other organic materials, which are not specifically limited in this embodiment.

[0135] Figure 9 is a side view of the structure assembled with support component 110, welding preform 150 and circuit board 200 according to some embodiments.

[0136] Referring to Figure 9, in some implementations, the heat dissipation device 100 may also include a solder preform 150. The solder preform 150 is disposed on the surface of the support assembly 110 opposite to the heat dissipation assembly 120, and the solder preform 150 is used to form solder to fix the support assembly 110 to the circuit board 200.

[0137] In some examples, a solder preform 150 is used to be disposed between the support assembly 110 and the circuit board 200, and the solder preform 150 is used to form solder connecting the support assembly 110 and the circuit board 200.

[0138] For example, in practical applications, the assembly of the heat dissipation device 100 and the circuit board 200 can be achieved by soldering the preform 150. For instance, the preform 150 can be soldered around the heat dissipation device 300 onto the circuit board 200 to form the solder required for subsequent soldering of the circuit board 200 and the support assembly 110. The solder is used to fix the support assembly 110 onto the circuit board 200, and the support assembly 110 can be arranged around the heat dissipation device 300. After the heat dissipation assembly 120 is assembled, the heat dissipation assembly 120, the support assembly 110, and the circuit board 200 can be used to form a first receiving cavity 111 to accommodate the heat dissipation device 300.

[0139] Since the amount of solder in the welding preform 150 can be well controlled during the welding process, the welding of the support component 110 using the solder formed by the welding preform 150 can compensate for the assembly tolerance between the support component 110 and the circuit board 200, thereby improving the sealing between the welded support component 110 and the circuit board 200 and improving the welding stability between the support component 110 and the circuit board 200.

[0140] In addition, this configuration can improve the airtightness of the first accommodating cavity 111 in the support component 110, prevent the cooling medium in the first accommodating cavity 111 from leaking and causing other components on the circuit board to become contaminated with the cooling medium, thereby ensuring the stable and reliable operation of other components on the circuit board.

[0141] In some examples, the material of the welding preform 150 can be a soldering preform or other soldering material. In practical applications, the thickness of the welding preform 150 can be selected as needed according to the assembly tolerance between the support assembly 110 and the circuit board 200, and this application does not impose any limitations on this. For example, the thickness of the welding preform 150 can be approximately 0.2 mm, 0.25 mm, 0.3 mm, etc.

[0142] In some examples, a seamless welding process can be used between the welding preform 150 and the support assembly 110, thereby improving the airtightness of the first accommodating cavity 111 formed after welding.

[0143] Please refer to Figure 9. In some implementations, the support component 110 has a plurality of spaced receiving grooves 112 on the side surface away from the heat dissipation component 120. The receiving grooves 112 are used to receive a portion of the solder.

[0144] In this implementation, since one side surface of the support component 110 has a receiving groove 112, a protruding tooth-like structure is formed between two adjacent receiving grooves 112. With this configuration, the tooth-like structure can extend into the welding preform 150 during welding, allowing the solder formed after the welding preform 150 melts to enter the receiving groove 112. Therefore, the solder can tightly surround each tooth-like structure, thereby increasing the tightness of the weld and preventing leakage of the cooling medium in the first receiving cavity 111.

[0145] In addition, the arrangement of the receiving groove 112 helps to bear the lateral force from the cooling working fluid in the first receiving cavity 111, thereby improving the strength of the weld.

[0146] In some examples, the height H of the toothed structure can be approximately 0.04 mm, 0.05 mm, or 0.06 mm. In practical applications, the height of the toothed structure can be selected as needed based on the thickness of the welding preform 150 or the assembly tolerance between the support assembly 110 and the circuit board 200; this embodiment does not impose specific limitations on this.

[0147] For example, the shape of the receiving groove 112 can be a rectangular groove, a trapezoidal groove, or the like. Correspondingly, the shape of the toothed structure can be a cuboid, a triangular pyramid, or the like. In practical applications, the specific shapes of the receiving groove 112 and the toothed structure can be set as needed.

[0148] Figure 10 is a schematic diagram of the assembly of another heat dissipation device 100 and circuit board 200 according to some embodiments.

[0149] Please refer to Figure 10. In some implementations, the heat dissipation device 100 may also include fasteners for securing the support assembly 110, the heat dissipation assembly 120, and the circuit board 200.

[0150] In some examples, the fasteners include a bolt 160 and a nut 170. The support assembly 110 has a first through hole 113, and the heat dissipation assembly 120 has a second through hole 127. The bolt 160 passes through the first through hole 113 and the second through hole 127, and the bolt 160 is engaged with the nut 170.

[0151] In other examples, the support assembly 110 has a first through hole 113, the heat dissipation assembly 120 has a second through hole 127, the circuit board 200 has a fourth through hole 210, and the bolt 160 passes through the first through hole 113, the second through hole 127 and the fourth through hole 210, and the bolt 160 is engaged with the nut 170.

[0152] For example, the bolt 160 passes sequentially through the heat dissipation assembly 120, the support assembly 110, and the circuit board 200, and is then fixedly connected to a nut 170 located on the side of the circuit board 200 opposite to the support assembly 110. The support assembly 110, the heat dissipation assembly 120, and the circuit board 200 all have through holes for the bolt 160 to pass through, and the boundaries of these through holes overlap. This prevents any component from shifting horizontally, thereby increasing the overall structural stability. For example, the fourth through hole 210 on the circuit board 200 can be an in-circuit test (ICT) via.

[0153] In other examples, the nut 170 may also be located on the side of the heat dissipation assembly 120 away from the support assembly 110. In this case, the bolt 160 passes through the circuit board 200, the support assembly 110 and the heat dissipation assembly 120 in sequence, and is then fixedly connected to the nut 170 located on the side of the heat dissipation assembly 120 away from the support assembly 110.

[0154] In addition, the method of fixing the heat dissipation component 120, the support component 110 and the circuit board 200 by bolts 160 can reduce the area occupied by the heat dissipation device 100 on the circuit board 200, and the operation is simple, which is conducive to the subsequent maintenance and replacement of the heat dissipation device 100.

[0155] For example, the number of bolts 160 and nuts 170 can be any number, such as 2, 3, 4, or 5, and is not listed here. In some embodiments of this application, the number of bolts 160 and nuts 170 is not limited. Furthermore, in practical applications, the position of the first through hole 113 on the support assembly 110, the position of the second through hole 127 on the heat dissipation assembly 120, and the position of the through holes on the circuit board 200 can be comprehensively considered based on factors such as the shape of the heat dissipation device 100 and the layout design of the circuit board 200. In this embodiment, no specific limitation is imposed on this.

[0156] Figure 11 is a schematic diagram of another circuit board assembly 1220 according to some embodiments, Figure 12 is a schematic diagram of a support plate 180 according to some embodiments, Figure 13 is a schematic diagram of another support plate 180 according to some embodiments, and Figure 14 is a schematic diagram of yet another support plate 180 according to some embodiments.

[0157] Referring to Figure 10, in some implementations, the heat dissipation device 100 also includes a support plate 180. The support plate 180 is disposed on the side of the circuit board 200 away from the support assembly 110. The support plate 180 has a third through hole 181, and a bolt 160 passes through the third through hole 181 and is connected with a nut 170.

[0158] Please refer to Figures 10 and 11. By way of example, by setting a support plate 180, and in practical applications, installing the support plate 180 on the side of the circuit board 200 away from the support assembly 110, the support plate 180 can provide support for the circuit board 200, thereby improving the structural strength of the circuit board 200. This avoids the situation where the circuit board 200 is deformed or even the solder between the support assembly 110 and the circuit board 200 is torn due to the stress generated during the installation of the support assembly 110 and the heat dissipation assembly 120 on the circuit board 200, thus avoiding any impact on the sealing performance of the first accommodating cavity 111.

[0159] In addition, the support plate 180 is fixed to other components of the heat dissipation device 100 using bolts 160 and nuts 170, thereby reducing the area occupied on the circuit board 200. This method is convenient, inexpensive, and facilitates the subsequent maintenance and replacement of the heat dissipation device 100.

[0160] Referring to Figures 12-14, in some examples, the shape of the support plate 180 can be designed according to the shape of the heat dissipation device on the circuit board 200, and this embodiment of the application does not limit this.

[0161] In some implementations, the heat dissipation device 100 can be used in conjunction with a circulation device to improve the heat dissipation effect of the heat dissipation device 100. For example, the inlet of the circulation device is connected to the first outlet through an outlet pipe, and the outlet of the circulation device is connected to the first inlet through an inlet pipe.

[0162] In practical applications, the circulation of the cooling medium within the first accommodating cavity 111 and the second accommodating cavity 124 of the heat dissipation device 100 can be achieved by installing a circulation device. For example, referring to Figure 11, the outlet of the circulation device introduces the cooling medium into the second accommodating cavity 124 of the heat dissipation device 100 via the inlet pipe and the first inlet 121. A portion of the cooling medium then flows through the flow channels formed by the heat dissipation fins 1242 within the second accommodating cavity 124 and exits via the first outlet 122. The heat dissipation fins 1242 within the second accommodating cavity 124 can increase their surface area in contact with the cooling medium, thereby increasing the heat exchange capacity of the cooling medium within the second accommodating cavity 124. This allows the heat transferred from the heat-conducting plate 130 to be dissipated using the heat dissipation fins 1242 and the cooling medium.

[0163] During the above process, another portion of the cooling medium flows into the first accommodating cavity 111 through the second inlet 125, immersing the device 300 to be cooled within the first accommodating cavity 111. The cooling medium entering the first accommodating cavity 111 can directly contact the device 300 to be cooled, thereby transferring the heat generated by the device 300 to the cooling medium. The cooling medium carrying the heat then flows out through the outlet channel 129 formed by the second outlet 126 and the first outlet 122, thus achieving heat dissipation for the device 300.

[0164] After the cooling medium flows out of the first accommodating cavity 111 and the second accommodating cavity 124, it returns to the circulation device through the liquid outlet pipe and the inlet of the circulation device, and continues to circulate between the two devices along the aforementioned path, thereby achieving continuous heat dissipation of the heat dissipation device.

[0165] In some examples, the circulation device may include a cooling device. For example, after the cooling medium carrying heat is discharged into the circulation device, it can be cooled by the cooling device, and the cooled medium is circulated into the first receiving cavity 111 and the second receiving cavity 124, and so on, to achieve heat dissipation of the device to be cooled.

[0166] This setup allows for the recycling of the cooling medium through a circulation system, thereby saving energy, reducing emissions, minimizing environmental impact, and meeting current environmental protection requirements.

[0167] In some examples, the assembly process of the heat dissipation device 100 may include: preparing a soldering preform 150 around the device 300 to be cooled on the circuit board 200, and soldering a support assembly 110 using solder formed from the soldering preform 150. Then, a sealing ring 140 is placed in a groove 141 provided on the support assembly 110, and a heat-conducting plate 130 is placed on the main heat-generating part of the device 300 (e.g., chip 330). Subsequently, a heat dissipation assembly 120 is fixed to the side of the support assembly 110 away from the circuit board 200 using bolts 160 and nuts 170, and a support plate 180 is fixed to the side of the circuit board 200 away from the support assembly 110. After completing the aforementioned assembly process of the heat dissipation device 100, the inlet of the circulation device is connected to the first outlet 122, and the outlet is connected to the first inlet 121, thereby completing the assembly of the circulation device, and the circulation device is used to fill the first accommodating cavity 111 and the second accommodating cavity 124 with the cooling medium.

[0168] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises: a support assembly arranged on a surface of a circuit board; and a heat dissipation assembly arranged on a surface of the support assembly away from the surface of the circuit board, the heat dissipation assembly, the support assembly and the circuit board enclosing a first accommodating cavity for accommodating a device to be cooled on the circuit board, the heat dissipation assembly having a liquid inlet channel and a liquid outlet channel in communication with the first accommodating cavity, the liquid inlet channel being used for allowing a cooling medium to enter the first accommodating cavity, and the liquid outlet channel being used for allowing the cooling medium to flow out of the first accommodating cavity.

2. The heat dissipating device according to claim 1, wherein The heat dissipation device further comprises a heat-conducting plate; the heat-conducting plate is arranged on a surface of the heat dissipation assembly facing the first accommodating cavity, and is used for contacting at least part of the device to be cooled.

3. The heat dissipating device according to claim 1 or 2, characterized in that, The heat dissipation assembly comprises a body having a second accommodating cavity; the body has a first inlet and a first outlet on a surface thereof away from the support assembly, and has a second inlet and a second outlet on a surface thereof close to the support assembly, the first inlet and the second inlet forming the liquid inlet channel, and the first outlet and the second outlet forming the liquid outlet channel; the first inlet and the second inlet are in communication with the first accommodating cavity and the second accommodating cavity, and the first outlet and the second outlet are in communication with the first accommodating cavity and the second accommodating cavity.

4. The heat dissipating device according to claim 3, wherein The heat dissipation assembly further comprises a separation structure arranged in the second accommodating cavity, the separation structure being used for separating the second accommodating cavity into a plurality of flow channels, and the first inlet and the first outlet being in communication with each of the flow channels.

5. The heat dissipating device according to any one of claims 1 to 4, wherein The heat dissipation device further comprises a sealing ring, and a groove is arranged on a surface of the support assembly facing the heat dissipation assembly or a surface of the heat dissipation assembly facing the support assembly, the groove being arranged around the first accommodating cavity, and the sealing ring being arranged in the groove.

6. The heat dissipating device according to any one of claims 1 to 5, wherein The heat dissipation device further comprises a solder preform arranged on a surface of the support assembly away from the heat dissipation assembly, the solder preform being used for forming solder for fixing the support assembly to the circuit board.

7. The heat dissipating device according to claim 6, wherein The support assembly has a plurality of spaced accommodating grooves on the surface thereof away from the heat dissipation assembly, the accommodating grooves being used for accommodating part of the solder.

8. A computing device, comprising: The heat dissipation device comprises: a circuit board; a device to be cooled arranged on the circuit board; and the heat dissipation device as claimed in any one of claims 1 to 7, the device to be cooled being arranged in the first accommodating cavity of the heat dissipation device.

9. A computing device, comprising: The heat dissipation device comprises: a circuit board; a device to be cooled arranged on the circuit board; a support assembly arranged on the circuit board; A heat dissipation assembly is arranged on a surface of the support assembly away from the circuit board; the support assembly, the heat dissipation assembly and the circuit board enclose a first accommodating cavity, and the device to be cooled is arranged in the first accommodating cavity; the heat dissipation assembly comprises a body, and the body specifically comprises a second accommodating cavity; the body has a first inlet and a first outlet on a surface thereof away from the support assembly, and has a second inlet and a second outlet on a surface thereof close to the support assembly, wherein the first inlet and the second inlet are in communication with the first accommodating cavity and the second accommodating cavity, and the first outlet and the second outlet are in communication with the first accommodating cavity and the second accommodating cavity; a liquid inlet pipeline in communication with the first inlet and used for guiding the cooling working medium into the first accommodating cavity and the second accommodating cavity; and a liquid outlet pipeline in communication with the first outlet and used for guiding the cooling working medium out of the first accommodating cavity and the second accommodating cavity.

10. The computing device of claim 9, wherein, The computing device further comprises a heat conduction plate arranged on a surface of the heat dissipation assembly facing the first accommodating cavity, and the heat conduction plate is in contact with at least part of the device to be cooled; The heat dissipation assembly further comprises a separation structure arranged in the second accommodating cavity, and the separation structure is used for separating the second accommodating cavity into a plurality of flow channels, and the first inlet and the first outlet are in communication with each of the flow channels.

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