Circuit board, display panel and display apparatus

Abstract

The present application relates to the technical field of display. Provided are a circuit board, a display panel and a display apparatus. The circuit board comprises an opening and a flexible board area provided on at least two sides of the opening, wherein a driving chip is provided in the opening, the opening provides clearance for the driving chip, the flexible board area comprises a first sub-area located on a first side of the opening, a gold finger structure is provided in the first sub-area, and the gold finger structure is used for being bound and connected to a display substrate.

Description

A circuit board, a display panel, and a display device.

[0001] Cross-reference of related applications

[0002] This disclosure claims priority to Chinese Patent Application No. 202410693419.3, filed on May 30, 2024, entitled "A Circuit Board, Display Panel and Display Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of display technology, and more specifically, to a circuit board, a display panel, and a display device. Background Technology

[0004] Circuit boards are used to connect the electronic components of a display panel. For example, circuit boards can be flexible printed circuits (FPCs) or rigid-flex PCBs (RFPCBs). In flexible OLED (Flexible Organic Light Emitting Diode) screen applications, circuit boards use flexible materials such as polyester film or polyimide as substrates, on which conductive lines are etched to transmit electrical signals.

[0005] However, currently, only the gold finger structure of the circuit board extends to the Panel Pad (the contact area of ​​the display panel driver chip) to achieve bonding with the display panel. The rest of the circuit board is located outside the Panel Pad. This results in the overall structure of the circuit board occupying more internal space, thus limiting the effective utilization of the space on the backlight side of the display panel. This is a significant obstacle for flexible OLED devices that pursue thinness and high integration, leading to a decrease in the space utilization efficiency of flexible OLED devices and making it difficult to further reduce the device thickness or add other components. Therefore, how to improve the space utilization efficiency of the circuit board has become an urgent problem to be solved in this field.

[0006] Overview

[0007] This application provides a circuit board, a display panel, and a display device, aiming to solve the problem of how to improve the space utilization efficiency of the circuit board.

[0008] A first aspect of this application provides a circuit board, the circuit board comprising:

[0009] An opening, and flexible circuit board areas disposed on at least two sides of the opening, wherein a driver chip is disposed within the opening to avoid obstructing the driver chip;

[0010] The flexible circuit board area includes a first sub-area located on the first side of the opening, and a gold finger structure is provided in the first sub-area for bonding and connecting with the display substrate.

[0011] In one alternative implementation, the flexible board area is a closed structure surrounding the opening.

[0012] In one alternative implementation, the circuit board includes:

[0013] A first conductive layer is formed within the first sub-region, wherein the gold finger structure is formed on the first conductive layer;

[0014] A second conductive layer is disposed on one side of the first conductive layer. The second conductive layer includes a first solid metal located within the first sub-region. The orthographic projection of the first solid metal onto the first conductive layer at least partially overlaps with the gold finger structure.

[0015] In one optional embodiment, the second conductive layer further includes a hollowed-out metal, which is disposed adjacent to the first solid metal along a first direction. The orthographic projection of the hollowed-out metal on the first conductive layer does not overlap with the gold finger structure. The first direction is the extension direction of the circuit board.

[0016] In one alternative embodiment, the perforated metal includes a first sub-part and a second sub-part, the first sub-part being disposed on the side of the first solid metal away from the opening, and the second sub-part being disposed between the first solid metal and the opening.

[0017] In one alternative embodiment, the shape of the perforated metal includes at least one of the following: fin-like or mesh-like.

[0018] In one optional embodiment, the flexible board area further includes a second sub-area located on the second side, the third side, and the fourth side of the opening, wherein the second side is disposed opposite to the first side, and the third side is disposed opposite to the fourth side on both sides of the first side;

[0019] Both the first conductive layer and the second conductive layer have a second solid metal disposed within the second sub-region.

[0020] In one alternative implementation, within the first sub-region, the first conductive layer and the second conductive layer are electrically connected through conductive vias.

[0021] In one alternative implementation, the circuit board further includes a rigid board area located on the side of the first sub-region away from the opening;

[0022] The rigid board area includes multiple conductive layers stacked together. The first conductive layer and the second conductive layer are the middle conductive layers among the multiple conductive layers, and the first conductive layer and the second conductive layer extend from the rigid board area to the flexible board area.

[0023] In one alternative embodiment, the rigid board area includes a first side surface for disposing of electronic devices, wherein the first conductive layer is disposed adjacent to the second conductive layer, and the first conductive layer is disposed on the side of the second conductive layer away from the first side surface of the rigid board area.

[0024] In one optional embodiment, the second conductive layer further includes a third metal trace, which is disposed on opposite sides of the first solid metal in the first sub-region along a second direction, the second direction being a direction perpendicular to the extension direction of the circuit board.

[0025] The third metal trace extends from the first sub-region to the rigid board region and the second sub-region, respectively, and connects the rigid board region and the second sub-region.

[0026] In one optional implementation, the gold finger structure includes a first metal trace and a second metal trace, the first metal trace extending from the first sub-region to the rigid board region, and the second metal trace extending from the first sub-region to the second sub-region.

[0027] In one alternative embodiment, the first conductive layer is the third conductive layer among the plurality of conductive layers, counting from the first side surface of the rigid plate region.

[0028] A second aspect of this application provides a display panel, the display panel comprising:

[0029] The display substrate includes a display section and a fan-out section. The fan-out section is bent to the backlight side of the display section. A bonding structure and the driving chip are provided on the side of the fan-out section away from the display section.

[0030] The circuit board according to any one of the first aspects of the embodiments of this application is disposed on the backlight side of the display unit, the gold finger structure of the circuit board is bonded to the bonding structure, and the driving chip is disposed in the opening of the circuit board.

[0031] A third aspect of this application provides a display device, which includes the display panel described in the second aspect of this application. Beneficial effects:

[0032] This application provides a circuit board, a display panel, and a display device. The circuit board includes an opening and flexible circuit board areas disposed on at least two sides of the opening. The opening is used to avoid a driver chip. The flexible circuit board areas include a first sub-area located on a first side of the opening, and a gold finger structure is disposed in the first sub-area for bonding and connecting with a display substrate. By providing an opening in the flexible circuit board area of ​​the circuit board, this application extends the flexible circuit board area of ​​the circuit board to the vicinity of the driver chip, and extends the layout of the circuit board to the display panel bonding structure where the driver chip is disposed. This frees up the space occupied by the circuit board, effectively improving space utilization efficiency, and thus providing more space for the display panel to accommodate other electronic components.

[0033] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below.

[0034] Brief description of the attached diagram

[0035] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 is a top view of a circuit board structure according to an embodiment of this application;

[0037] Figure 2 is a schematic diagram of the hierarchical structure of a circuit board along the A-A' section according to an embodiment of this application;

[0038] Figure 3 is a top view of a second conductive layer in a circuit board according to an embodiment of this application.

[0039] Figure 4 is a top view of the first conductive layer in a circuit board according to an embodiment of this application;

[0040] Figure 5 is an enlarged schematic diagram of the regional structure of the rigid board area and the first sub-region of a circuit board according to an embodiment of this application.

[0041] Explanation of reference numerals in the attached drawings: 1. Display panel; 11. Display section; 12. Fan-out section; 121. Driver chip; 122. Electronic device; 2. Circuit board; 211. First conductive layer; 212. Second conductive layer; 213. Third conductive layer; 214. Fourth conductive layer; 215. Fifth conductive layer; 216. Sixth conductive layer; 221. First insulating layer; 222. Second insulating layer; 223. Third insulating layer; 231. Gold finger structure; 232. First solid metal; 233. First sub-section; 234. Second sub-section; 241. First metal trace; 242. Second metal trace; 243. Third metal trace; 251. Opening; 261. Bonding through hole; A0. Rigid board area; A1. First sub-section; A2. Second sub-section; X. First direction; Y. Second direction.

[0042] Detailed description

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In the accompanying drawings, the size of constituent elements, the thickness of layers, or areas may sometimes be exaggerated for clarity. Therefore, any implementation of this disclosure is not necessarily limited to the dimensions shown in the drawings, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and any implementation of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0045] Circuit boards are used to connect the electronic components of a display panel. For example, circuit boards can be flexible printed circuits (FPCs) or rigid-flex PCBs (RFPCBs). In flexible OLED (Flexible Organic Light Emitting Diode) screen applications, circuit boards use flexible materials such as polyester film or polyimide as substrates, on which conductive lines are etched to transmit electrical signals.

[0046] In related technologies, circuit boards are typically designed with the gold finger structure extending to the Panel Pad (the contact area of ​​the driver chip in the display panel) to achieve bonding and connection with the display panel. The rest of the circuit board structure is located outside the Panel Pad. This circuit board layout leads to several problems: First, having most of the circuit board structure located outside the Panel Pad results in the overall structure of the circuit board occupying more space outside the Panel Pad, thus limiting the effective use of the space originally used for electronic components on the backlight side of the display panel. This is a significant obstacle for flexible OLED devices that pursue thinness and high integration, causing a decrease in the space utilization efficiency of flexible OLED devices and making it difficult to further reduce the thickness of the device or add other components.

[0047] On the other hand, when flexible OLED devices are folded or bent, the circuit board located on the outside of the panel pad is prone to greater mechanical stress. When the area of ​​the circuit board located on the outside of the panel pad is large, the risk of deformation caused by mechanical stress is further increased, which may lead to breakage or connection failure of the circuit in the circuit board, and adversely affect the service life and reliability of the display product.

[0048] Furthermore, since most of the circuit board's structure is located on the outside of the Panel Pad, the circuit board occupies a large area, which leads to longer wiring paths, causing problems such as signal attenuation, increased latency, and increased electromagnetic interference, thus affecting the product's display effect and user experience.

[0049] In view of this, this application proposes a circuit board, wherein the circuit board described in this application includes, but is not limited to, flexible printed circuit (FPC), rigid-flex PCB (RFPCB), etc., as long as it conforms to the inventive concept of the circuit board proposed in this application. Figure 1 shows a top view of a circuit board according to an embodiment of this application, and Figure 2 shows a layer structure diagram of a circuit board along section A-A' according to an embodiment of this application. As shown in Figures 1 and 2, the circuit board 2 includes: an opening 251, in which a driving chip 121 is disposed to avoid obstruction; a flexible board area, which is disposed on at least two sides of the opening 251, the flexible board area including a first sub-area A1 located on the first side of the opening 251, in which a gold finger structure 231 is disposed, the gold finger structure 231 being used for bonding and connecting with a display substrate.

[0050] In this embodiment, the driver chip 121 is disposed on the bonding structure (Panel Pad) on the backlight side of the display substrate. The flexible circuit board area of ​​the circuit board 2 includes the gold finger structure 231 located within the first sub-area A1. The gold finger structure 231 and the bonding structure form an electrical connection within the first sub-area A1 of the flexible circuit board area. Simultaneously, in addition to the first sub-area A1 with the gold finger structure 231, the flexible circuit board area of ​​the circuit board 2 also covers other areas of the bonding structure to form the opening 251. The driver chip 121 is disposed within the opening 251. That is, in this embodiment, the flexible circuit board area of ​​the circuit board 2 includes not only the first sub-area A1 but also areas disposed on the bonding structures on at least two sides of the driver chip 121. This embodiment of the application effectively increases the available wiring area of ​​the circuit board 2 by setting the flexible board area, so that the circuit board part that was originally limited to being arranged outside the bonding structure can be extended to the vicinity of the driver chip 121 on the bonding structure, thereby alleviating the space occupied by the circuit board part arranged outside the bonding structure and increasing the available space for electronic devices arranged outside the bonding structure.

[0051] In some optional embodiments, to maximize the wiring area of ​​the circuit board 2, the flexible circuit board area further includes a second sub-region A2 located on the second, third, and fourth sides of the opening 251, with the second side opposite to the first side and the third and fourth sides opposite to each other on both sides of the first side. In this case, the flexible circuit board area (or the second sub-region A2 in the flexible circuit board area) is a closed structure surrounding the opening 251. It is readily understood that the flexible circuit board area may also include one or both of the second sub-regions A2 located on the second, third, and fourth sides that are connected to the region located on the first side. In this case, the opening 251 formed by the flexible circuit board area (or the second sub-region A2 in the flexible circuit board area) is an open structure. For example, the flexible board area can be located on the first side and the third side of the opening 251, with the flexible board area on the first side and the flexible board area on the third side being integrally connected; the flexible board area can also be located on the first side, the second side and the third side of the opening 251, with the flexible board area on the first side, the flexible board area on the second side and the flexible board area on the third side forming an integral connection.

[0052] In some optional embodiments, the circuit board 2 further includes a rigid board area A0, which is located on the side of the first sub-area A1 away from the opening 251. The orthographic projection of the rigid board area A0 onto the display substrate does not overlap with the bonding structure on the display substrate. The rigid board area A0 is used to meet wiring requirements through multiple conductive layers. In this embodiment, to increase the wiring area in the non-bonding structure region of the display substrate, the thickness of the rigid board area A0 along a third direction is greater than the thickness of the flexible board area along the third direction, where the third direction is perpendicular to the backlight side surface of the display substrate.

[0053] Specifically, the rigid board area A0 includes a plurality of conductive layers stacked together, including a first conductive layer 211 and a second conductive layer 212. The first conductive layer 211 and the second conductive layer 212 are the middle conductive layers among the plurality of conductive layers. The first conductive layer 211 and the second conductive layer 212 extend from the rigid board area A0 toward the bonding structure to form the flexible board area.

[0054] In some optional embodiments, the flexible circuit board area (including the first sub-area A1 and the second sub-area A2) includes a first conductive layer 211 and a second conductive layer 212 stacked together. The second conductive layer 212 is disposed on one side of the first conductive layer 211. The first conductive layer 211 forms the gold finger structure 231 within the first sub-area A1. The gold finger structure 231 of the first conductive layer 211 and the portion of the second conductive layer 212 within the first sub-area A1 form an electrical connection. In this embodiment, by providing a flexible circuit board area composed of multiple conductive layers, an electrical connection can be formed between the first conductive layer 211 and the second conductive layer 212 within the first sub-area A1, which is connected to external electronic components. This eliminates the need for frequent interlayer vias in other areas to achieve circuit continuity between the rigid circuit board area A0 and the flexible circuit board area, effectively improving the integrity and strength of the circuit board 2, saving space occupied by vias, and effectively improving space utilization efficiency.

[0055] In related technologies, when the flexible circuit board area is composed of a single-layer first conductive layer, and the target conductive layer line located in the second sub-area A2, which is on a different layer from the gold finger structure, needs to be connected to the rigid circuit board area, it is necessary to first pass through the target conductive layer in the second sub-area A2 to the first conductive layer, then arrange it to the rigid circuit board area through the gold finger structure in the first sub-area A1, and finally pass through the first conductive layer in the rigid circuit board area to the target conductive layer. Based on the circuit board with a flexible circuit board area having a first conductive layer 211 and a second conductive layer 212 proposed in this application embodiment, the line of the second conductive layer 212 located in the second sub-area A2 can directly extend from the first sub-area A1 to the first conductive layer 211 and be arranged to the rigid circuit board area through the gold finger structure 231, or, the connection can be directly achieved by connecting the rigid circuit board area A0 and the second sub-area A2 through metal traces on the second conductive layer 212. It should be noted that the above example is only a specific instance given to enable those skilled in the art to better understand the solution of this application. The specific method of realizing the conduction between the flexible board area and the rigid board area A0 based on the flexible board area with multiple conductive layers in this application can be determined according to the actual situation, and this application does not impose any restrictions here.

[0056] In some alternative embodiments, within the first sub-region A1, the first conductive layer 211 and the second conductive layer 212 are electrically connected through conductive vias.

[0057] In this embodiment, the circuit board 2 further includes an electronic device 122, and the rigid board area A0 includes a first side surface for disposing the electronic device 122. In some optional embodiments, the first conductive layer 211 and the second conductive layer 212 are disposed adjacent to each other, wherein the first conductive layer 211 is disposed on the side of the second conductive layer 212 away from the first side surface of the rigid board area.

[0058] Optionally, the first conductive layer 211 is the third conductive layer among the plurality of conductive layers of the rigid board region A0, counted from the first side surface of the rigid board region A0, and the second conductive layer 212 is the second conductive layer counted from the first side surface of the rigid board region A0. For example, as shown in FIG2, the rigid board region A0 is a circuit board including six conductive layers. These six conductive layers, in addition to the first conductive layer 211 and the second conductive layer 212, also include a third conductive layer 213, a fourth conductive layer 214, a fifth conductive layer 215, and a sixth conductive layer 216 disposed only within the rigid board region A0. In this embodiment, the third conductive layer 213 is disposed on the side of the second conductive layer 212 opposite to the first conductive layer 211, and the surface of the third conductive layer 213 opposite to the second conductive layer 212 is reused as the first side surface of the rigid board region A0; the fourth conductive layer 214, the fifth conductive layer 215, and the sixth conductive layer 216 are sequentially stacked on the side of the first conductive layer 211 opposite to the second conductive layer 212, with the fourth conductive layer 214 disposed close to the first conductive layer 211. It should be noted that the above example is merely an optional scenario provided to enable those skilled in the art to better understand the solution of this application; the specific conductive layers within the rigid board region A0 can be configured according to actual conditions, and this application does not impose any limitations.

[0059] In some alternative implementations, FIG3 shows a top view of a second conductive layer in a circuit board according to an embodiment of the present application. As shown in FIG3, the second conductive layer 212 includes a first solid metal 232 located in the first sub-region A1. The first solid metal 232 is a heat-conducting structure when the first sub-region A1 is bonded to electronic components. Therefore, no wiring extending to the rigid board region A0 and the second sub-region A2 is provided in the first solid metal 232.

[0060] In this embodiment, the orthographic projection of the first solid metal 232 onto the first conductive layer 211 at least partially overlaps with the gold finger structure 231, thereby forming an electrical connection between the first solid metal 232 and the gold finger structure 231, thus improving the thermal conductivity of the first conductive layer 211 and the second conductive layer 212 along the third direction. In this embodiment, by providing the first solid metal 232 within the second conductive layer 212 in the first sub-region A1, the thermal conductivity of the bonding structure within the first sub-region A1 can be effectively improved. Furthermore, the first solid metal 232 has a flat surface, ensuring the stability and quality of the bonding process. Optionally, the width of the first solid metal along the first direction X is the same as the width of the first sub-region A1 along the first direction X, and smaller than the dimension of the second conductive layer 212 along the second direction Y. For example, the first solid metal 232 is centrally disposed within the first sub-region A1, where the first direction X is the extension direction of the circuit board 2, and the second direction Y is a direction perpendicular to the extension direction of the circuit board 2 (the first direction X).

[0061] Optionally, the second conductive layer 212 is provided with a second solid metal in the second sub-region A2. The second solid metal is made of the same metal as the first solid metal, which has good electrical and thermal conductivity. For example, the materials of the second solid metal and the first solid metal are solid copper.

[0062] In some optional embodiments, to further improve the heat dissipation capability of the gold finger structure 231 in the first sub-region A1 along the third direction and prevent heat from diffusing and being consumed to both sides of the first sub-region A1, thus affecting the bonding effect, the second conductive layer 212 further includes a hollowed-out metal. The hollowed-out metal is disposed adjacent to the first solid metal 232 along the first direction X, and the orthographic projection of the hollowed-out metal on the first conductive layer 211 does not overlap with the gold finger structure 231. Optionally, the hollowed-out metal can be disposed on the edge of the rigid plate region A0 near the first solid metal 232, and the hollowed-out metal can also be disposed on the edge of the second sub-region A2 near the first solid metal 232. The hollowed-out metal can also be disposed on both the edge of the rigid plate region A0 near the first solid metal 232 and the edge of the second sub-region A2 near the first solid metal 232. In this embodiment, a perforated metal is provided in the second conductive layer 212. This perforated metal is disposed on one or both sides of the first solid metal 232 located in the first sub-region A1 along the first direction X. Since the perforated metal has a weaker thermal conductivity than the adjacent first solid metal, it can limit the rapid diffusion and consumption of heat along the first direction X when the first sub-region A1 is heated during the bonding process with the bonding structure. This ensures that the heat generated in the second conductive layer 212 of the first sub-region A1 can be conducted more concentratedly and efficiently to the gold finger structure 231 of the first conductive layer 211 along the third direction, ensuring that the material of the gold finger structure 231 forms a stable and reliable electrical interconnection in the high-temperature molten state, effectively improving the bonding quality and reliability of the gold finger structure 231 of the first sub-region A1. In addition, the perforated metal in the second conductive layer 212 has a lighter weight than the first solid metal 232, which can effectively reduce stress and provide a certain degree of flexibility to the circuit board 2 to adapt to the complex three-dimensional shape changes and dynamic mechanical loads of the circuit board 2 during connection.

[0063] In some optional embodiments, the perforated metal disposed on both sides of the first solid metal 232 along the first direction X includes a first sub-part 233 and a second sub-part 234. The first sub-part 233 is disposed at the edge of the rigid plate area A0 on the side of the first solid metal 232 away from the opening 251, and the second sub-part 234 is disposed at the edge of the second sub-area A2 between the first solid metal 232 and the opening 251. Optionally, the first sub-part 233 and the second sub-part 234 are symmetrically disposed on both sides of the first solid metal 232 along the first direction X. The dimensions of the first sub-part 233 and the second sub-part 234 along the second direction Y are the same as the dimensions of the first solid metal 232 along the second direction Y, and both are smaller than the dimensions of the second conductive layer 212 along the second direction Y.

[0064] In some optional embodiments, the shape of the hollow metal includes at least one of the following: fin-shaped or mesh-shaped; the material of the hollow metal is the same as the material of the first solid metal 232, which has good electrical and thermal conductivity. For example, the hollow metal can be mesh copper or fin copper.

[0065] In some alternative embodiments, since the perforated metal and the first solid metal 232 are structures designed to ensure the heat conduction capability of the first sub-region A1 along the third side, no metal traces are provided in the first solid metal 232 and the perforated metal. In order to directly connect the rigid board region A0 and the flexible board region (including the first sub-region A1 and the second sub-region A2) through the second conductive layer 212 without the need for additional conductive interlayer vias, metal traces connecting the various regions of the circuit board 2 need to be provided in the second conductive layer 212. Specifically, a wiring space is provided between the first solid metal 232 and the hollowed-out metal on both sides along the second direction Y and the second conductive layer 212 on both sides along the second direction Y, respectively. A third metal trace 243 is provided in the wiring space of the second conductive layer 212. The third metal trace 243 is located on opposite sides of the first solid metal 232 along the second direction Y within the first sub-region A1. The third metal trace 243 extends from the first sub-region A1 towards the rigid plate region A0 and the second sub-region A2, respectively, to conduct electricity between the rigid plate region A0 and the second sub-region A2. This embodiment of the application, by providing the third metal trace 243 in the second conductive layer 212, reduces the need for through-holes between the first conductive layer 211 and the second conductive layer 212 without affecting the bonding effect, effectively improving space utilization.

[0066] In some optional embodiments, FIG4 shows a top view of a first conductive layer in a circuit board according to an embodiment of this application. As shown in FIG4, the first conductive layer 211 is provided with the gold finger structure 231. The gold finger structure 231 is a structure with excellent conductivity and oxidation resistance formed by etching and patterning conductive metal material and then performing a chemical nickel-gold process. The gold finger structure 231 is used to bond with the bonding structure. The gold finger structure 231 includes a first metal trace 241 and a second metal trace 242. The first metal trace 241 extends from the first sub-region A1 to the rigid board region A0, and the second metal trace 242 extends from the first sub-region A1 to the second sub-region A2. In this embodiment, by setting metal traces extending from the gold finger structure 231 in the first sub-region A1 to the second sub-region A2 and the rigid board region A0 respectively, the flexible display device can adapt to various morphological changes such as bending and folding. It can also ensure that the circuit board 2, the driver chip 121 and the electronic device 122 can achieve stable and efficient electrical contact under different forms, which greatly enhances the mechanical flexibility and electrical stability of the display panel.

[0067] Optionally, the first conductive layer 211 has a second solid metal disposed in the second sub-region A2. The second solid metal and the first solid metal are made of the same metal with good electrical and thermal conductivity. For example, the materials of the second solid metal and the first solid metal are solid copper.

[0068] In some optional embodiments, in order to further increase the wiring area of ​​the flexible circuit board area, the circuit board 2 may also include multiple layers of the second conductive layer 212, which are stacked between the first conductive layer 211 and the electronic device 122. The structure of each layer of the second conductive layer 212 is the same as the structure of the second conductive layer 212 described in the embodiments of this application.

[0069] In some optional embodiments, FIG5 shows an enlarged schematic diagram of the regional structure of a rigid board area and a first sub-area of ​​a circuit board according to an embodiment of the present application. As shown in FIG5, the rigid board area A0 further includes: a first insulating layer 221, a second insulating layer 222, and a third insulating layer 223. The first insulating layer 221 is disposed on one side or opposite sides of the first conductive layer 211 along the third direction. The first insulating layer 221 extends from the rigid board area A0 to the first sub-area A1 and the second sub-area A2, and the first insulating layer 221 is flush with the side surface of the first conductive layer 211. The second insulating layer 222 is disposed on one side or opposite sides of the second conductive layer 212 along the third direction. The second insulating layer 222 extends from the rigid board area A0 to the first sub-area A1 and the second sub-area A2, and the second insulating layer 222 covers the entire surface of the second conductive layer 212 so that the second insulating layer 222 is flush with the side surface of the second conductive layer 212. The third insulating layer 223 is disposed on one side or opposite sides of the other conductive layers in the rigid plate area A0, excluding the first conductive layer 211 and the second conductive layer 212, along the third direction. The width of the third insulating layer 223 along the first direction X is the same as the width of the rigid plate area A0 along the first direction X, so that the side of the third insulating layer 223 is flush with the boundary of the rigid plate area A0.

[0070] In some optional embodiments, in the first sub-region A1, the first insulating layer 221 disposed on the side of the first conductive layer 211 away from the second conductive layer 212 has a bonding through hole 261. The bonding through hole 261 penetrates the first insulating layer 221, and the gold finger structure 231 is bonded to the bonding structure of the display substrate through the bonding through hole 261.

[0071] In some alternative embodiments, within the rigid plate area A0, adjacent hierarchical structures are fixed to each other by providing an adhesive layer, wherein the width of the adhesive layer along the first direction is the same as the width of the rigid plate area A0 along the first direction, so that the side of the adhesive layer is flush with the boundary of the rigid plate area A0.

[0072] This application provides a circuit board comprising: an opening and flexible circuit board areas disposed on at least two sides of the opening, wherein a driver chip is disposed within the opening to avoid obstruction; the flexible circuit board areas include a first sub-area located on a first side of the opening, and a gold finger structure is disposed within the first sub-area for bonding and connecting with a display substrate. This application extends the flexible circuit board area of ​​the circuit board to the vicinity of the driver chip by providing an opening, thereby extending the layout of the circuit board towards the bonding structure of the display panel where the driver chip is disposed. This reduces the space occupied by the circuit board outside the bonding structure, effectively improving space utilization efficiency and providing more space for other electronic components on the display panel.

[0073] Based on the same inventive concept, this application discloses a display panel, as shown in FIG1. ​​The display panel 1 includes a display substrate, the display substrate including a display portion 11 and a fan-out portion 12, the fan-out portion 12 being bent to the backlight side of the display portion 11, and a bonding structure and the driving chip 121 being provided on the side of the fan-out portion 12 away from the display portion 11.

[0074] The circuit board 2 described in this embodiment is disposed on the backlight side of the display unit 11. The gold finger structure 231 of the circuit board 2 is bonded to the bonding structure. The driver chip 121 is disposed in the opening 251 of the circuit board 2.

[0075] In some optional embodiments, the display substrate can be an OLED (Organic Light Emitting Diode) display substrate, a Micro-OLED (Micro Organic Light-Emitting Diode) display substrate, etc., as long as it conforms to the inventive concept of this application, and this application does not make specific limitations in this regard.

[0076] In some optional embodiments, the display panel 1 further includes a cover plate and a polarizer. The cover plate is disposed on the light-emitting side of the display substrate to protect the display substrate. Optionally, the cover plate can be a 3D glass cover plate, a 2D glass cover plate, other non-glass-based transparent materials, flexible transparent materials (such as plastic, ultra-thin glass), etc. The polarizer is disposed between the cover plate and the display substrate to reduce reflected light in ambient light and improve the display effect of the display panel 1.

[0077] In some optional embodiments, the display panel 1 may further include other functional film layers located between the display substrate and the cover plate, such as a touch function layer, an anti-reflection layer, an anti-fingerprint layer, or a hardening layer, so that the display panel 1 can perform different functions.

[0078] In some optional embodiments, the display panel 1 further includes a heat dissipation component located on the backlight side of the display substrate; the circuit board 2 is disposed on one side of the heat dissipation component, one end of the circuit board 2 is bound to the bonding structure of the fan-out portion 12, and the other end is fixed to the surface of the heat dissipation component.

[0079] Based on the same inventive concept, this application proposes a display device, which includes the display panel 1 described in the embodiments of this application.

[0080] In this embodiment, the display device is a product with image display functionality. Optionally, the display device can be used to display static images, such as pictures and photographs; the display device can also be used to display dynamic images, such as videos and game screens.

[0081] In some alternative implementations, the display device includes, but is not limited to, laptops, mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, car displays, navigators, cockpit controllers and / or displays, displays of camera views, electronic photographs, electronic billboards or signs, projectors, packaging and aesthetic structures, etc.

[0082] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0083] In the description of this specification, it should be understood that the terms "center", "thickness", "upper", "lower", "front", "rear", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0084] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0085] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0086] The foregoing application provides many different implementations or examples for carrying out different structures of this application. To simplify this application, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0087] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0088] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0089] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0090] The circuit board, display panel, and display device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A circuit board, characterized in that, The circuit board includes: An opening, and flexible circuit board areas disposed on at least two sides of the opening, wherein a driver chip is disposed within the opening to avoid obstruction of the driver chip; The flexible circuit board area includes a first sub-area located on the first side of the opening, and a gold finger structure is provided in the first sub-area for bonding and connecting with the display substrate.

2. The circuit board according to claim 1, characterized in that, The flexible board area is a closed structure surrounding the opening.

3. The circuit board according to claim 1, characterized in that, The circuit board includes: A first conductive layer is formed within the first sub-region, wherein the gold finger structure is formed on the first conductive layer; A second conductive layer is disposed on one side of the first conductive layer. The second conductive layer includes a first solid metal located within the first sub-region. The orthographic projection of the first solid metal onto the first conductive layer at least partially overlaps with the gold finger structure.

4. The circuit board according to claim 3, characterized in that, The second conductive layer further includes a hollowed-out metal, which is disposed adjacent to the first solid metal along a first direction. The orthographic projection of the hollowed-out metal on the first conductive layer does not overlap with the gold finger structure. The first direction is the extension direction of the circuit board.

5. The circuit board according to claim 4, characterized in that, The hollowed-out metal includes a first sub-part and a second sub-part. The first sub-part is disposed on the side of the first solid metal away from the opening, and the second sub-part is disposed between the first solid metal and the opening.

6. The circuit board according to claim 4, characterized in that, The shape of the perforated metal includes at least one of the following: fin-like or mesh-like.

7. The circuit board according to claim 3, characterized in that, The flexible board area also includes a second sub-area located on the second, third, and fourth sides of the opening, with the second side being disposed opposite to the first side, and the third side being disposed opposite to the fourth side on both sides of the first side; Both the first conductive layer and the second conductive layer have a second solid metal disposed within the second sub-region.

8. The circuit board according to claim 3, characterized in that, Within the first sub-region, the first conductive layer and the second conductive layer are electrically connected through conductive vias.

9. The circuit board according to any one of claims 3 to 8, characterized in that, The circuit board also includes a rigid board area located on the side of the first sub-region away from the opening; The rigid board area includes multiple conductive layers stacked together. The first conductive layer and the second conductive layer are the middle conductive layers among the multiple conductive layers, and the first conductive layer and the second conductive layer extend from the rigid board area to the flexible board area.

10. The circuit board according to claim 9, characterized in that, The rigid board area includes a first side surface for mounting electronic devices, wherein the first conductive layer is disposed adjacent to the second conductive layer, and the first conductive layer is disposed on the side of the second conductive layer away from the first side surface of the rigid board area.

11. The circuit board according to claim 9, characterized in that, The second conductive layer further includes a third metal trace, which is disposed on opposite sides of the first solid metal along a second direction within the first sub-region, the second direction being a direction perpendicular to the extension direction of the circuit board; The third metal trace extends from the first sub-region to the rigid board region and the second sub-region respectively, so as to connect the rigid board region and the second sub-region.

12. The circuit board according to claim 9, characterized in that, The gold finger structure includes a first metal trace and a second metal trace, wherein the first metal trace extends from the first sub-region to the rigid board region, and the second metal trace extends from the first sub-region to the second sub-region.

13. The circuit board according to claim 10, characterized in that, The first conductive layer is the third conductive layer among the plurality of conductive layers, counting from the first side surface of the rigid plate region.

14. A display panel, characterized in that, The display panel includes: A display substrate, comprising a display portion and a fan-out portion, wherein the fan-out portion is bent to the backlight side of the display portion, and a bonding structure and the driving chip are disposed on the side of the fan-out portion opposite to the display portion; and The circuit board as described in any one of claims 1 to 13, wherein the circuit board is disposed on the backlight side of the display unit, the gold finger structure of the circuit board is bonded to the bonding structure, and the driving chip is disposed within the opening of the circuit board.

15. A display device, characterized in that, The display device includes the display panel as described in claim 14.

Images