Display panel and display apparatus

Abstract

A display panel and a display apparatus, which belong to the technical field of display. The display panel comprises a through hole (AAH), an isolation area (BB) surrounding the through hole (AAH), and a display area (AA) surrounding the isolation area (BB). The display panel is provided with a display substrate (DBP), a black matrix layer (BM) and an organic reinforcement structure (ORS), which are sequentially stacked, wherein the black matrix layer (BM) extends from the display area (AA) to an edge of the through hole (AAH); and the organic reinforcement structure (ORS) is disposed in the isolation area (BB), so as to improve the strength of the display panel at a position adjacent to the through hole (AAH).

Description

Display panel and display device

[0001] Cross-referencing

[0002] This disclosure claims priority to Chinese Patent Application No. 202410704306.9, filed on May 31, 2024, entitled “Display Panel and Display Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and more specifically, to a display panel and a display device. Background Technology

[0004] Organic light-emitting diodes (OLEDs) have advantages such as self-illumination, low power consumption, wide viewing angle, and fast response, and are considered to be one of the most promising technologies in the display and lighting fields.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a display panel and display device.

[0007] According to one aspect of this disclosure, a display panel is provided, including a through-hole, an isolation region surrounding the through-hole, and a display region surrounding the isolation region;

[0008] The display panel has a display substrate, a black matrix layer and an organic reinforcement structure stacked in sequence;

[0009] The black matrix layer extends from the display area to the edge of the through hole;

[0010] The organic reinforcement structure is disposed in the isolation area to improve the strength of the display panel near the through hole.

[0011] According to one embodiment of this disclosure, the black matrix layer has a partition gap surrounding the through-hole, the partition gap being located in the isolation area.

[0012] According to one embodiment of the present disclosure, the organic reinforcement structure includes an annular retaining wall surrounding the through hole and corresponding one-to-one with at least a portion of the partition gap;

[0013] The orthographic projection of the annular barrier on the plane where the display substrate is located at least partially coincides with the orthographic projection of the corresponding partition gap on the plane where the display substrate is located.

[0014] According to one embodiment of the present disclosure, the black matrix layer has a plurality of partition gaps, and the plurality of partition gaps are arranged sequentially around the through hole;

[0015] The organic reinforcement structure includes a plurality of annular baffles corresponding one-to-one with the plurality of partition gaps. According to one embodiment of this disclosure, the display substrate is provided with a plurality of crack-resistant baffles surrounding the through-holes in the isolation area;

[0016] The orthographic projection of the annular barrier on the plane where the display substrate is located is within the range of the orthographic projection of the anti-crack barrier on the plane where the display substrate is located.

[0017] According to one embodiment of this disclosure, the number of the annular retaining walls is multiple;

[0018] At least one of the crack-prevention barriers is provided between the orthographic projections of two adjacent annular barriers onto the plane where the display substrate is located.

[0019] According to one embodiment of this disclosure, the annular barrier wall and the anti-crack barrier wall are correspondingly arranged; the annular barrier wall and the anti-crack barrier wall are arranged in a one-to-one correspondence; the orthographic projection of the annular barrier wall on the plane where the display substrate is located is located within the range of the orthographic projection of the corresponding anti-crack barrier wall on the plane where the display substrate is located.

[0020] According to one embodiment of the present disclosure, the display panel has a color filter layer located on the side of the black matrix layer away from the display substrate;

[0021] The color filter layer forms the organic enhancement structure in the isolation region.

[0022] According to one embodiment of the present disclosure, the color filter layer includes a first sub-color filter layer, a second sub-color filter layer, and a third sub-color filter layer;

[0023] The organic reinforced structure includes at least one annular retaining wall surrounding the through hole;

[0024] Any one of the aforementioned annular barriers is formed by one of the first sub-color filter layer, the second sub-color filter layer, and the third sub-color filter layer, or by multiple of the first sub-color filter layer, the second sub-color filter layer, and the third sub-color filter layer stacked together.

[0025] According to one embodiment of the present disclosure, the annular barrier includes a first annular barrier, which is formed by stacking a first sub-color filter layer, a second sub-color filter layer and a third sub-color filter layer.

[0026] The annular barrier wall adjacent to the first annular barrier wall is formed by one of the first sub-color filter layer, the second sub-color filter layer and the third sub-color filter layer, or by two of the first sub-color filter layer, the second sub-color filter layer and the third sub-color filter layer stacked together.

[0027] According to one embodiment of the present disclosure, the annular barrier is formed by stacking multiple of the first sub-color filter layer, the second sub-color filter layer, and the second sub-color filter layer; wherein, in two adjacent sub-color filter layers of the same annular barrier, the orthographic projection of the surface of the sub-color filter layer closest to the color filter layer on the plane where the display substrate is located is within the orthographic projection of the surface of the sub-color filter layer closest to the display substrate on the plane where the display substrate is located.

[0028] According to one embodiment of this disclosure, the annular barrier includes a third annular barrier, a second annular barrier, and a first annular barrier arranged sequentially around the cutting area; wherein, the third annular barrier includes a first sub-annular barrier; the second annular barrier includes a first sub-annular barrier and a second sub-annular barrier located on the side of the first sub-annular barrier away from the display substrate; the first annular barrier includes a first annular sub-barrier, a second annular sub-barrier, and a third annular barrier arranged sequentially on one side of the display substrate.

[0029] According to one embodiment of this disclosure, the annular barrier includes a third annular barrier, a second annular barrier, and a first annular barrier arranged sequentially around the cutting area; wherein, the third annular barrier includes a first annular sub-barrier, a second annular sub-barrier, and a third annular sub-barrier arranged sequentially on one side of the display substrate; the second annular barrier includes a first sub-annular barrier and a second sub-annular barrier located on the side of the first sub-annular barrier away from the display substrate; the first annular barrier includes a first annular sub-barrier.

[0030] According to one embodiment of the present disclosure, the first sub-annular barrier is located in the first sub-color filter layer;

[0031] The second sub-annular barrier is located in the second sub-color filter layer;

[0032] The third sub-annular retaining wall is located in the third sub-color film layer.

[0033] According to one embodiment of this disclosure, the width of the first annular sub-barrier near the surface of the display substrate is smaller than the width of the first annular sub-barrier away from the surface of the display substrate;

[0034] The width of the second annular sub-barrier near the surface of the display substrate is smaller than the width of the second annular sub-barrier away from the surface of the display substrate;

[0035] The width of the third annular sub-barrier near the surface of the display substrate is smaller than the width of the third annular sub-barrier away from the surface of the display substrate.

[0036] According to one embodiment of this disclosure, the organic reinforcement structure includes a plurality of annular retaining walls that surround the through hole respectively; at least two of the annular retaining walls have different heights.

[0037] According to one embodiment of this disclosure, the material of the organic reinforcement structure is a negative photoresist.

[0038] According to one embodiment of this disclosure, the maximum thickness of the organic reinforcement structure is in the range of 5 to 10 micrometers.

[0039] According to one embodiment of the present disclosure, the display panel further includes a thin-film encapsulation layer having an organic layer;

[0040] The display panel also has a barrier dam surrounding the isolation area, and the edge of the organic layer does not extend beyond the barrier dam in the direction from the display area toward the through-hole. According to another aspect of this disclosure, a display device is provided, including the aforementioned display panel.

[0041] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0042] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0043] Figure 1 is a schematic diagram of the film layer structure of the display panel in one embodiment of this disclosure.

[0044] Figure 2 is a schematic diagram of the film layer structure of the display panel in one embodiment of this disclosure.

[0045] Figure 3 is a schematic diagram of the film structure of a display panel in one embodiment of the present disclosure; wherein, during the manufacturing process of the display panel, the black matrix layer extends from the display area to the edge of the through hole.

[0046] Figure 4 is a schematic diagram of the film structure of the display panel in one embodiment of the present disclosure; wherein, in the process of manufacturing the display panel, the black matrix layer is prepared on the entire surface and covers the through holes.

[0047] Figure 5 is a top view of the relationship between the through hole and the isolation area in one embodiment of this disclosure.

[0048] Figure 6 is a schematic diagram of the film structure of a display panel in one embodiment of the present disclosure, wherein, during the manufacturing process of the display panel, the black matrix layer extends from the display area to the edge of the through hole.

[0049] Figure 7 is a schematic diagram of the film structure of a display panel in one embodiment of the present disclosure; wherein, during the manufacturing process of the display panel, the black matrix layer is prepared on the entire surface and covers the through holes.

[0050] Explanation of reference numerals: AA, display area; BB, isolation area; CC, intermediate area; DD, recessed area; CA, dicing area; CL, dicing line; DBP, display substrate; SBT, substrate; PIXL, pixel layer; DRL, driving layer; LSCL, low-temperature polysilicon semiconductor layer; Buff1, first buffer layer; Buff2, second buffer layer; GI1, first gate insulating layer; GI2, second gate insulating layer; GT1, first gate layer; GT2, second gate layer; GT3, third gate layer; ILD, interlayer dielectric. Material layer; SD1, first source / drain metal layer; SD2, second source / drain metal layer; SD3, third source / drain metal layer; PLN1, first planarization layer; PLN2, second planarization layer; OSCL, metal-oxide-semiconductor layer; PLN3, third planarization layer; PDL, pixel definition layer; PEL, pixel electrode layer; COML, common electrode layer; EL, light-emitting functional layer; PIX, sub-pixel; TFE, thin film encapsulation layer; CVD1, first inorganic encapsulation layer; IJP, organic encapsulation layer; CVD2, second inorganic encapsulation layer; T SL, Touch Functional Layer; TBL, First Touch Metal Layer; TLD, Touch Insulating Layer; CLD, Second Touch Metal Layer; BM, Black Matrix Layer; BM1, First Black Matrix Section; BM2, Second Black Matrix Section; RTW, Annular Barrier; RTW1, First Annular Barrier; RTW11, First Annular Sub-Barrier; RTW2, Second Annular Barrier; RTW21, Second Annular Sub-Barrier; RTW3, Third Annular Barrier; RTW31, Third Annular Sub-Barrier; PG, Partition Gap; CD, Crack-Resistant Barrier; CD1 1. First crack-resistant barrier; CD2. Second crack-resistant barrier; CD3. Third crack-resistant barrier; CD4. Fourth crack-resistant barrier; CD5. Fifth crack-resistant barrier; CD6. Sixth crack-resistant barrier; CD7. Seventh crack-resistant barrier; CFL, color filter layer; CFL1, first sub-color filter layer; CFL2, second sub-color filter layer; CFL3, third sub-color filter layer; RD, barrier dam; ORS, organic reinforcement structure; AAH, through-hole; COC, encapsulation structure; SP, separation column; SP1, first separation column; SP2, second separation column. Detailed Implementation

[0051] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0052] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0053] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0054] In related technologies, to ensure the imaging quality of the camera (e.g., a front-facing camera) in a display product, a hole is drilled at the location of the camera on the display panel to form a through-hole. Figure 1 illustrates a schematic diagram of the film layer structure of a display panel in related technologies (based on a color filter layer set on a display substrate). Referring to Figure 1, the display panel includes a through-hole AAH, an isolation region BB surrounding the through-hole AAH, and a display region AA surrounding the isolation region BB; the display panel has a display substrate DBP and a black matrix layer BM stacked sequentially; the black matrix layer BM includes a first black matrix portion BM1 and a second black matrix portion BM2; the second black matrix portion BM2 is located in the isolation region BB; the first black matrix portion BM1 is at least partially disposed in the display region AA. The first black matrix portion BM1 and the second black matrix portion BM2 are disconnected, which can prevent stress concentration in the black matrix layer BM, release stress in the black matrix layer BM to a certain extent, and reduce the phenomenon of the black matrix layer BM detaching from the through-hole.

[0055] The inventors discovered that the vias in the aforementioned display panels have low strength, making them prone to GDSH (Growing Dark Spot (AA Hole)). This demonstrates that the strength of the vias significantly impacts the quality of the display panel. The cause of GDSH is insufficient edge strength of the vias. When the display product is squeezed or bumped, gaps form at the edges of the vias, allowing water / oxygen from the air to penetrate and erode the organic materials of the display product, leading to the formation of continuously enlarging growth dark spots and negatively affecting the quality of the display product. Furthermore, with the increasing prevalence of foldable display devices and the reduction in power consumption requirements, the COE+Cover-Film (a combination of a color filter layer and an organic protective layer on the display substrate) process is gradually replacing the Pol+CG (a combination of a polarizer and a glass cover on the display substrate) process. This necessitates further improvements in the strength of the vias.

[0056] Based on this, referring to Figures 3, 4, 5, 6, and 7, this disclosure provides a display panel, which includes a through-hole AAH (the through-hole AAH is located in the cutting area CA; specifically, the through-hole AAH is formed by cutting the cutting area CA after the display panel is manufactured, wherein the cutting line CL indicates the cutting position of the through-hole AAH), an isolation area BB surrounding the through-hole AAH, and a display area AA surrounding the isolation area BB; the display panel has a display substrate DBP, a black matrix layer BM, and an organic reinforcement structure ORS stacked sequentially; the black matrix layer BM extends from the display area AA to the edge of the through-hole AAH; the organic reinforcement structure ORS is disposed in the isolation area BB to improve the strength of the display panel near the through-hole.

[0057] In this embodiment, the black matrix layer BM extends from the display area AA to the edge of the via AAH. Meanwhile, an organic reinforcement structure ORS is provided on the black matrix layer BM located in the isolation area BB. The provided organic reinforcement structure ORS cooperates with the black matrix layer BM, which can improve the edge strength of the via AAH, reduce the occurrence of GDSH, and help improve the display quality of the display panel.

[0058] Figure 2 illustrates a schematic diagram of the film layer structure of a display panel. Referring to Figure 2, in some embodiments of this disclosure, the display substrate DBP includes a substrate SBT, a driving layer DRL, a pixel layer PIXL, and a thin film encapsulation layer TFE, which are stacked sequentially.

[0059] Optionally, the substrate SBT can be an inorganic material substrate SBT or an organic material substrate SBT; of course, it can also be a composite substrate formed by stacking inorganic and organic material substrate SBTs. For example, in some embodiments of this disclosure, the material of the substrate SBT can be glass materials such as soda-lime glass, quartz glass, and sapphire glass.

[0060] In other embodiments of this disclosure, the substrate SBT may be made of polymethyl methacrylate, polyvinyl alcohol, polyvinylphenol, polyethersulfone, polyimide, polyamide, polyacetal, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, or combinations thereof. In other embodiments of this disclosure, the substrate SBT may also be a flexible substrate SBT, for example, the material of the substrate SBT may include polyimide.

[0061] Optionally, referring to Figure 2, in the driving layer DRL, any pixel driving circuit may include a thin-film transistor and a storage capacitor (not shown in the figures of this application). Further, the thin-film transistor may be selected from top-gate thin-film transistors, bottom-gate thin-film transistors, or dual-gate thin-film transistors; the material of the active layer of the thin-film transistor may be amorphous silicon semiconductor material, low-temperature polycrystalline silicon semiconductor material, metal oxide semiconductor material, organic semiconductor material, carbon nanotube semiconductor material, or other types of semiconductor material; the thin-film transistor may be an N-type thin-film transistor or a P-type thin-film transistor.

[0062] It is understood that any two transistors in a pixel driving circuit can be of the same or different types. Exemplarily, in some embodiments, some transistors in a pixel driving circuit can be N-type transistors and some transistors can be P-type transistors. Further exemplarily, in other embodiments, in a pixel driving circuit, the active layer material of some transistors can be low-temperature polycrystalline silicon (LTPS) semiconductor material, and the active layer material of some transistors can be metal-oxide-semiconductor (MODS) semiconductor material. In some embodiments of this disclosure, the thin-film transistor is a LPS transistor. In other embodiments of this disclosure, some thin-film transistors are LPS transistors, and some thin-film transistors are MODS transistors.

[0063] Optionally, referring to Figure 2, the driving layer DRL may include a semiconductor layer (e.g., a polysilicon semiconductor layer PSCL and a metal oxide semiconductor layer OSCL), a buffer layer (e.g., a first buffer layer Buff1 and a second buffer layer Buff2), a gate insulating layer (e.g., a first gate insulating layer GI1, a second gate insulating layer GI2, and a third gate insulating layer GI3), a gate layer (e.g., a first gate layer GT1, a second gate layer GT2, and a third gate layer GT3), an interlayer dielectric layer ILD, source / drain metal layers (e.g., a first source / drain metal layer SD1, a second source / drain metal layer SD2, and a third source / drain metal layer SD3), and a planarization layer (e.g., a first planarization layer PLN1, a second planarization layer PLN2, and a third planarization layer PLN3), etc., stacked between the substrate SBT and the pixel layer PIXL. Each thin-film transistor and storage capacitor can be formed from semiconductor layers, gate insulating layers, gate layers, interlayer dielectric layers ILD, source / drain metal layers, etc.; of course, other film layers can also be used. The positional relationship of each film layer can be determined according to the film layer structure of the thin-film transistor. Furthermore, the semiconductor layer can be used to form the active layer of a transistor (including the first electrode, second electrode, and channel region of the transistor), and can also be conductively formed to create partial traces or conductive structures when necessary. The first source / drain metal layer SD1 can be used to form scan signal traces; the gate layer can be used to form one or more gate layer traces such as reset control traces and light emission control traces, or it can be used to form the gate of a transistor, or it can be used to form part or all of the electrode plates of the storage capacitor CST. The source / drain metal layer can be used to form source / drain metal layer traces such as data traces and drive power supply voltage traces, or it can be used to form part of the electrode plates of the storage capacitor.

[0064] Of course, in other embodiments of this disclosure, the driving layer DRL may also include other film layers as needed, such as a metal light-shielding layer BSM located between the semiconductor layer and the substrate SBT. As needed, any one of the aforementioned semiconductor layer, gate layer, source / drain metal layers, etc., may be multiple layers. For example, the driving layer DRL may include two different semiconductor layers, or two or three source / drain metal layers, or two or three gate layers. Correspondingly, the insulating film layers in the driving layer DRL (e.g., gate insulating layer, interlayer dielectric layer ILD, planarization layer, etc.) may be adaptively increased or decreased, or new insulating film layers may be added as needed.

[0065] Optionally, the pixel layer PIXL may include a pixel electrode layer PEL, a light-emitting functional layer EL, and a common electrode layer COML stacked sequentially. The pixel electrode layer PEL has multiple pixel electrodes PE in the display area AA of the display panel. The pixel definition layer PDL has multiple through-holes corresponding to the multiple pixel electrodes PE, with each pixel opening exposing at least a portion of the corresponding pixel electrode PE. For example, the pixel definition layer PDL covers the edge of the pixel electrode PE and exposes at least a portion of the internal area of ​​the pixel electrode PE, so that the pixel definition layer PDL can effectively define the actual effective area of ​​the pixel electrode (the area directly connected to the light-emitting functional layer EL), thereby defining the light-emitting area and light-emitting region of the sub-pixel PIX. The common electrode layer COML covers the light-emitting functional layer EL as a common electrode. The pixel electrodes PE and the common electrode layer COML provide electrons, holes, and other charge carriers to the light-emitting functional layer EL, causing the light-emitting functional layer EL to emit light. The portion of the light-emitting functional layer EL located between the pixel electrodes and the common electrode layer COML can serve as the light-emitting functional unit of the sub-pixel PIX. A pixel electrode PE, a common electrode layer COML, and a light-emitting functional unit form a light-emitting element that serves as a sub-pixel PIX. One of the pixel electrode PE and the common electrode layer COML serves as the anode of the sub-pixel PIX, and the other serves as the cathode of the sub-pixel PIX.

[0066] In this example, the display panel is an OLED (Organic Light Emitting Diode) display panel. The light-emitting functional layer EL may include an organic light-emitting layer, and may include one or more of the following: a hole injection layer, a hole transport layer, an electron blocking layer, an electron transport layer, and an electron injection layer. Furthermore, the organic light-emitting layer may include a host material and a guest material, wherein the guest material may be a fluorescent dopant or a phosphorescent dopant, and particularly may be a thermally activated delayed fluorescence material.

[0067] It is understandable that the display panel can also be other types of display panels, such as QLED display panels, QD-OLED display panels, or other types of display panels.

[0068] Referring to Figure 2, the thin-film encapsulation layer TFE may include alternating layers of inorganic encapsulation layers and organic encapsulation layers IJP. The inorganic encapsulation layer effectively blocks external moisture and oxygen, preventing water and oxygen from invading the pixel layer PIXL and causing material aging within the PIXL. Optionally, the edge of the inorganic encapsulation layer may be located in the peripheral region. The organic encapsulation layer IJP is located between two adjacent inorganic encapsulation layers to achieve planarization and reduce stress between the inorganic encapsulation layers. Specifically, the edge of the organic encapsulation layer IJP may be located between the edge of the display area AA and the edge of the inorganic encapsulation layer.

[0069] Exemplarily, the thin-film encapsulation layer TFE includes a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP, and a second inorganic encapsulation layer CVD2, sequentially stacked on the side of the pixel layer PIXL away from the substrate SBT. The first inorganic encapsulation layer CVD1 covers the display area AA and extends to the outside of the barrier; the organic encapsulation layer IJP covers the display area AA and extends to the inside of the barrier; the second inorganic encapsulation layer CVD2 covers the organic encapsulation layer IJP and extends to the outside of the barrier. On the outside of the barrier, the second inorganic encapsulation layer CVD2 is in contact with the first inorganic encapsulation layer CVD1. In this way, the organic encapsulation layer IJP is sealed by the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2, balancing the stress of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2. The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 seal the organic encapsulation layer IJP, isolating the organic encapsulation layer IJP from contact with water and oxygen. Of course, in other embodiments of this disclosure, the display panel may not have a thin-film encapsulation layer TFE, but may use other methods to encapsulate and protect the pixel layer PIXL. As an example, the first inorganic encapsulation layer CVD1 can extend from the display area AA to the isolation area BB; at least a portion of the organic encapsulation layer IJP is disposed in the display area AA; and the second inorganic encapsulation layer CVD2 can extend from the display area AA to the isolation area BB.

[0070] In some embodiments of this disclosure, referring to Figures 3, 4, 6, and 7, the display panel may further include a touch function layer TSL. The touch function layer TSL may be disposed on the side of the thin film encapsulation layer TFE away from the pixel layer PIXL, so that the display substrate DBP has touch functionality.

[0071] As an example, the touch functional layer TSL includes a first touch metal layer TBL, a first touch insulating layer TLD, and a second touch metal layer CLD, which are sequentially stacked on the surface of the thin-film encapsulation layer TFE. It is understood that in other examples, the touch functional layer TSL may also include an insulating layer or an organic layer covering the second touch metal layer CLD. Of course, the touch functional layer can also be an external touch panel.

[0072] In some embodiments of this disclosure, the display panel may further include a packaging structure COC disposed on the side of the black matrix layer BM away from the substrate SBT.

[0073] In some embodiments of this disclosure, the black matrix layer BM has a gap PG surrounding the via AAH, and the gap PG is located in the isolation region BB. As an example, the gap PG can be fabricated as follows: the black matrix layer BM is fabricated on the side of the second touch metal layer CLD away from the substrate SBT. After the black matrix layer BM is fabricated, a mask is used to pattern the black matrix layer BM located in the isolation region BB to fabricate the gap PG surrounding the via AAH. In embodiments of this disclosure, the gap PG on the black matrix layer BM keeps the black matrix layer BM in an open state, which has a certain stress-relieving and buffering effect on the black matrix layer BM, helping to reduce stress concentration in the black matrix layer BM and thus reducing the occurrence of black matrix layer BM detachment. It should be noted that in embodiments of this disclosure, the number of gaps PG is not specifically limited; for example, the number of gaps PG can be one; the number of gaps PG can be two; or the number of gaps PG can be three, etc.

[0074] In some embodiments of this disclosure, the organic reinforcement structure (ORS) includes an annular barrier wall (RTW) surrounding the through-hole AAH and corresponding one-to-one with at least a partial partition gap PG; the orthographic projection of the annular barrier wall (RTW) onto the plane of the display substrate DBP at least partially coincides with the orthographic projection of the corresponding partition gap PG onto the plane of the display substrate DBP. Thus, the combination of the black matrix layer BM and the annular barrier wall (RTW) can further improve the strength of the through-hole AAH.

[0075] In other embodiments, the black matrix layer BM has a plurality of partition gaps PG, which are arranged sequentially around the through hole AAH; the organic reinforcement structure ORS includes a plurality of annular retaining walls RTW corresponding one-to-one with the plurality of partition gaps PG.

[0076] In one embodiment of this disclosure, the orthographic projection of a specific structure onto the plane of the display substrate DBP refers to the orthographic projection of that characteristic structure onto the substrate SBT of the display substrate DBP. For example, the orthographic projection of the annular barrier wall RTW onto the plane of the display substrate DBP refers to the orthographic projection of the annular barrier wall RTW onto the substrate SBT; the orthographic projection of the partition gap PG onto the plane of the display substrate DBP refers to the orthographic projection of the partition gap PG onto the substrate SBT.

[0077] As an example, the annular barrier wall RTW can be fabricated as follows: A black matrix layer BM is patterned using a photomask, creating a gap PG on the black matrix layer BM. An annular barrier material layer (not specifically labeled in the accompanying drawings) is coated on the side of the black matrix layer BM furthest from the substrate SBT. The annular barrier material layer is then patterned to form the annular barrier wall RTW. The annular barrier wall RTW, combined with the black matrix layer BM, can improve the strength of the via AAH (Analog-Aperture Hole), and also prevent water and oxygen from the air from entering the display area AA, reducing the occurrence of GDSH (Gas-Damping Hydrogen Sedimentation). Furthermore, it can disperse stress from potential cracks, enhancing the ability to prevent cracking.

[0078] In some embodiments of this disclosure, the display substrate DBP has multiple anti-crack barriers CDs surrounding the through-holes AAH in the isolation area BB; the orthographic projection of the annular barrier RTW on the plane of the display substrate DBP is within the range of the orthographic projection of the anti-crack barrier CD on the plane of the display substrate DBP. Thus, on the one hand, the anti-crack barrier CDs ensure the flatness of the upper annular barrier RTW; on the other hand, the lower anti-crack barrier CDs make the annular barrier RTW higher, which is more effective in blocking lateral light leakage, thereby improving the display quality of the display panel.

[0079] As an example, the crack-resistant barrier CD may include a first crack-resistant barrier CD1, a second crack-resistant barrier CD2, and a third crack-resistant barrier CD3 (not specifically shown in the accompanying drawings). The first crack-resistant barrier CD1 is disposed around the through-hole AAH and may be configured as a closed loop around the through-hole AAH. The second crack-resistant barrier CD2 surrounds the side of the first crack-resistant barrier CD1 away from the through-hole AAH, and the second crack-resistant barrier CD2 may also be configured as a closed loop around the first crack-resistant barrier CD1. The third crack-resistant barrier CD3 surrounds the side of the second crack-resistant barrier CD2 away from the first crack-resistant barrier CD1, and the third crack-resistant barrier CD3 may also be configured as a closed loop around the second crack-resistant barrier CD2. In this example, along the radial direction of the through-hole AAH, the orthographic projection of the annular barrier RTW onto the substrate SBT lies within the orthographic projection range of the first crack-resistant barrier CD1 and the third crack-resistant barrier CD3 onto the substrate SBT.

[0080] As another example, the crack-resistant barrier CD may include a first crack-resistant barrier CD1, a second crack-resistant barrier CD2, a third crack-resistant barrier CD3, a fourth crack-resistant barrier CD4, and a fifth crack-resistant barrier CD5 (not specifically shown in the accompanying drawings). The first crack-resistant barrier CD1 is disposed around the through hole AAH and may be configured as a closed loop around the through hole AAH; the second crack-resistant barrier CD2 surrounds the side of the first crack-resistant barrier CD1 away from the through hole AAH, and the second crack-resistant barrier CD2 may also be configured as a closed loop around the first crack-resistant barrier CD1; the third crack-resistant barrier CD3 surrounds the side of the second crack-resistant barrier CD2 away from the first crack-resistant barrier CD1, and the third crack-resistant barrier CD3 may also be configured as a closed loop around the second crack-resistant barrier CD2. The fourth crack-resistant barrier CD4 surrounds the third crack-resistant barrier CD3 on the side away from the second crack-resistant barrier CD2. The fourth crack-resistant barrier CD4 can also be configured as a closed loop surrounding the third crack-resistant barrier CD3. The fifth crack-resistant barrier CD5 surrounds the fourth crack-resistant barrier CD4 on the side away from the third crack-resistant barrier CD3. The fifth crack-resistant barrier CD5 can also be configured as a closed loop surrounding the fourth crack-resistant barrier CD4. It is understood that in this example, along the radial direction of the through-hole AAH, the orthogonal projection of the annular barrier RTW onto the substrate SBT lies within the orthogonal projection range of the first crack-resistant barrier CD1 and the fifth crack-resistant barrier CD5 onto the substrate SBT.

[0081] As another example, the crack-resistant barrier CD may include a first crack-resistant barrier CD1, a second crack-resistant barrier CD2, a third crack-resistant barrier CD3, a fourth crack-resistant barrier CD4, a fifth crack-resistant barrier CD5, a sixth crack-resistant barrier CD6, and a seventh crack-resistant barrier CD7. In this example, the first crack-resistant barrier CD1 may be arranged around the through hole AAH, and may be configured as a closed loop shape around the through hole AAH; the second crack-resistant barrier CD2 surrounds the side of the first crack-resistant barrier CD1 away from the through hole AAH, wherein the second crack-resistant barrier CD2 may also be configured as a closed loop shape around the first crack-resistant barrier CD1; the third crack-resistant barrier CD3 surrounds the side of the second crack-resistant barrier CD2 away from the first crack-resistant barrier CD1, wherein the third crack-resistant barrier CD3 may also be configured as a closed loop shape around the second crack-resistant barrier CD2. The fourth crack-resistant retaining wall CD4 surrounds the third crack-resistant retaining wall CD3 on the side away from the second crack-resistant retaining wall CD2. The fourth crack-resistant retaining wall CD4 can also be configured as a closed loop surrounding the third crack-resistant retaining wall CD3. The fifth crack-resistant retaining wall CD5 surrounds the fourth crack-resistant retaining wall CD4 on the side away from the third crack-resistant retaining wall CD3. The fifth crack-resistant retaining wall CD5 can also be configured as a closed loop surrounding the fourth crack-resistant retaining wall CD4. The sixth crack-resistant retaining wall CD6 surrounds the fifth crack-resistant retaining wall CD5 on the side away from the fourth crack-resistant retaining wall CD4. The sixth crack-resistant retaining wall CD6 can also be configured as a closed loop surrounding the fifth crack-resistant retaining wall CD5. The seventh crack-resistant retaining wall CD7 surrounds the sixth crack-resistant retaining wall CD6 on the side away from the fifth crack-resistant retaining wall CD5. The seventh crack-resistant retaining wall CD7 can also be configured as a closed loop surrounding the sixth crack-resistant retaining wall CD6. Understandably, in this example, along the radial direction of the through-hole AAH, the orthographic projection of the annular barrier RTW onto the substrate SBT lies within the orthographic projection range of the first anti-crack barrier CD1 and the seventh anti-crack barrier CD7 onto the substrate SBT.

[0082] It should be noted that in this embodiment, the number of anti-crack retaining walls CD is not specifically limited and can be adjusted according to different needs or processes.

[0083] In some embodiments of this disclosure, there are multiple annular barrier walls (RTWs); at least one crack-prevention barrier wall (CD) is provided between two adjacent annular barrier walls (RTWs) in the orthographic projection of the substrate SBT.

[0084] As an example, three crack-resistant barriers CD can be provided (i.e., a first crack-resistant barrier CD1, a second crack-resistant barrier CD2, and a third crack-resistant barrier CD3). In this example, two annular barrier RTWs can be provided. In this example, a crack-resistant barrier CD is provided between adjacent annular barrier RTWs and their orthogonal projection onto the substrate SBT. In other words, the first annular barrier RTW is positioned directly above the first crack-resistant barrier CD1; the third annular barrier RTW is positioned directly above the third crack-resistant barrier CD3.

[0085] As an example, five crack-resistant barriers CD can be set (i.e., first crack-resistant barrier CD1, second crack-resistant barrier CD2, third crack-resistant barrier CD3, fourth crack-resistant barrier CD4, and fifth crack-resistant barrier CD5). In this example, three annular barrier RTWs can be set, with one crack-resistant barrier CD positioned between the orthographic projections of adjacent annular barrier RTWs onto the substrate SBT. In other words, the first annular barrier RTW1 is positioned directly above the first crack-resistant barrier CD1; the second annular barrier RTW2 is positioned directly above the third crack-resistant barrier; and the third annular barrier RTW3 is positioned directly above the fifth crack-resistant barrier CD5. This allows the annular barrier RTWs to be evenly distributed on the isolation area BB, thereby reducing the fabrication of the annular barrier RTWs while achieving the same water and oxygen isolation conditions, thus helping to reduce the processing cost of the display product.

[0086] As another example, seven crack-resistant barriers CD can be set (i.e., first crack-resistant barrier CD1, second crack-resistant barrier CD2, third crack-resistant barrier CD3, fourth crack-resistant barrier CD4, fifth crack-resistant barrier CD5, sixth crack-resistant barrier CD6, and seventh crack-resistant barrier CD7). In this example, three annular barrier RTWs can be set, with two crack-resistant barriers CDs positioned between the orthographic projections of adjacent annular barrier RTWs onto the substrate SBT. In other words, the first annular barrier RTW is positioned directly above the first crack-resistant barrier; the second annular barrier RTW is positioned directly above the fourth crack-resistant barrier; and the third annular barrier RTW is positioned directly above the seventh crack-resistant barrier. This allows the annular barrier RTWs to be evenly distributed on the isolation area BB, thereby reducing the amount of annular barrier RTWs needed to achieve the same water and oxygen isolation conditions, and thus helping to reduce the processing cost of the display product.

[0087] In some embodiments of this disclosure, the annular barrier wall RTW and the crack-resistant barrier wall CD are arranged in a one-to-one correspondence; the orthographic projection of the annular barrier wall RTW on the plane where the display substrate DBP is located is within the range of the orthographic projection of the corresponding crack-resistant barrier wall CD on the plane where the display substrate DBP is located. Thus, on the one hand, the anti-crack barrier wall CD ensures the flatness of the upper annular barrier wall RTW; on the other hand, the lower anti-crack barrier wall CD makes the annular barrier wall RTW higher, which is more conducive to blocking lateral light leakage, thereby improving the display quality of the display panel.

[0088] As an example, three crack-resistant retaining walls (CDs) are provided (CDs include a first crack-resistant retaining wall CD1, a second crack-resistant retaining wall CD2, and a third crack-resistant retaining wall CD3). Three annular retaining walls (RTWs) are also provided opposite to the crack-resistant retaining walls (CDs), with each annular retaining wall (RTW) corresponding to one of the crack-resistant retaining walls (CDs). This ensures the flatness of the annular retaining walls. It should be noted that this embodiment does not impose a specific limitation on the number of annular retaining walls (RTWs) and crack-resistant retaining walls (CDs). For example, two crack-resistant retaining walls (CDs) can be provided, and two annular retaining walls (RTWs) corresponding to the crack-resistant retaining walls (CDs) can also be provided.

[0089] In some embodiments, an intermediate region CC can be provided between the isolation region BB and the display region AA, and a barrier dam RD surrounding the isolation region BB is provided within the intermediate region CC. The barrier dam RD serves two purposes: firstly, it prevents cracks in the inorganic material layer during the fabrication of the through-hole AAH from extending into the display region AA and affecting its display quality; secondly, it helps reduce the overflow of the organic encapsulation layer IJP within the thin-film encapsulation layer TFE, providing a certain degree of obstruction to the organic encapsulation layer IJP. It should be noted that when the film layer is fabricated on the barrier dam RD in the intermediate region CC, the presence of a certain height of the barrier dam RD may cause a groove region DD to form at the junction of the intermediate region CC and the isolation region BB.

[0090] As an example, the central area CC can be equipped with a first blocking dam RD, which reduces the bezel of the display panel and helps to achieve a narrow bezel effect. In the plan view, the first blocking dam RD can be set around the isolation area BB, and the first blocking dam RD is set as a closed loop shape around the isolation area BB.

[0091] As another example, the intermediate zone CC can be provided with a first barrier dam RD and a second barrier dam RD (not specifically shown in the accompanying drawings of this application). For example, in a plan view, the first barrier dam RD and the second barrier dam RD can be arranged around the isolation zone BB. Each of the first barrier dam RD and the second barrier dam RD is configured as a closed loop shape around the isolation zone BB, and the first barrier dam RD and the second barrier dam RD can be arranged to be spaced apart from each other. It should be noted that in the embodiments of this disclosure, there is no specific limitation on the number of barrier dam RDs, which can be adjusted according to different needs or processes.

[0092] In some embodiments of this disclosure, the display area AA may be provided with separation columns SP. For example, in a plan view, the separation columns SP may be arranged around the isolation area BB. The provided separation columns SP can isolate moisture in the display area AA, and also enhance the ability to prevent cracks.

[0093] As an example, the display area AA can be provided with a first separation column SP1 and a second separation column SP2. Both the first separation column SP1 and the second separation column SP2 can be arranged around the isolation area BB, which can also isolate moisture entering the display area AA and improve the quality of the display panel. It should be noted that in this embodiment, the number of separation columns SP is not specifically limited and can be adjusted according to different needs or processes. Furthermore, the separation columns SP and the crack-resistant retaining wall CD can be arranged on the same layer.

[0094] In some embodiments of this disclosure, the display panel has a color filter layer CFL located on the side of the black matrix layer BM away from the display substrate DBP; the color filter layer CFL forms an organic reinforcement structure ORS in the isolation region BB. Thus, by fabricating the color filter layer CFL on the side of the black matrix layer BM away from the substrate SBT, and by forming the organic reinforcement structure ORS in the isolation region BB, the provided organic reinforcement structure ORS layer can, on the one hand, enhance the strength of the via AAH, thereby reducing the occurrence of GDSH phenomenon; on the other hand, the organic reinforcement structure ORS formed by the color filter layer CFL in the isolation region BB can block light leakage from the display area AA, optimizing the light leakage problem from the display area AA to the via AAH, and contributing to improving the display quality of the display panel.

[0095] In some embodiments of this disclosure, the color filter layer CFL includes a first sub-color filter layer CFL1, a second sub-color filter layer CFL2, and a third sub-color filter layer CFL3; the organic reinforcement structure ORS includes at least one annular barrier wall RTW surrounding the through hole AAH; any one of the annular barrier walls RTW is formed by one of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3, or is formed by stacking multiple of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3.

[0096] It is understood that in this embodiment, the organic reinforcement structure (ORS) may include one annular barrier wall (RTW) surrounding the through-hole AAH, two annular barrier walls (RTWs) surrounding the through-hole AAH, or even three display barrier walls surrounding the through-hole AAH. In this embodiment, the specific number of annular barrier walls (RTWs) is not specified; anything that can reduce the GDSH phenomenon on the display panel and optimize light leakage from the display area AA to the through-hole AAH is acceptable.

[0097] As an example, an organic enhancement structure (ORS) may include an annular barrier wall (RTW). This annular barrier wall (RTW) may be formed from any one of the first sub-color filter layer (CFL1), the second color filter layer (CFL), and the third sub-color filter layer (CFL3).

[0098] For example, when the annular barrier RTW is formed by the first sub-color filter layer CFL1, the annular barrier RTW can be prepared as follows: After patterning the black matrix layer BM, the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, forming a first color resist in the display area AA, and forming the annular barrier RTW in the isolation area BB. A second sub-color filter layer CFL2 is prepared on the black matrix layer BM, and the second sub-color filter layer CFL2 is patterned, forming a second color resist in the display area AA, and being removed from the isolation area BB. A third sub-color filter layer CFL3 is prepared on the black matrix layer BM, and the third sub-color filter layer CFL3 is patterned, forming a third color resist in the display area AA, and being removed from the isolation area BB. In this way, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form the first color resist, the second color resist, and the third color resist, respectively, in the display area AA; the first sub-color filter layer CFL1 forms the annular barrier wall RTW in the isolation area BB. The annular barrier wall RTW formed in this way can not only improve the intensity of the through hole AAH, but also block light leakage from the side of the display area AA by virtue of the light filtering properties of the color filter layer CFL.

[0099] In some embodiments, the cross-sectional area of ​​the first sub-color filter layer CFL1 located in the isolation region BB near the black matrix layer BM is smaller than the cross-sectional area of ​​the other side of the first sub-color filter layer CFL1 located in the isolation region BB, thus making the first sub-color filter layer CFL1 appear narrower at the bottom than at the top. Of course, in some embodiments, the first sub-color filter layer CFL1 may not appear narrower at the bottom than at the top.

[0100] It should be noted that, in this embodiment, there are no specific limitations on the first color resist, the second color resist, and the third color resist. As an example, the first color resist can be a red color resist; the second color resist can be a green color resist; and the third color resist can be a blue color resist.

[0101] When the annular barrier RTW is formed by the second sub-color filter layer CFL2, the annular barrier RTW can be prepared in the following manner: After patterning the black matrix layer BM, a first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and a first color resist is formed in the display area AA. The first sub-color filter layer CFL1 is removed in the isolation area BB. A second sub-color filter layer CFL2 is prepared on the black matrix layer BM. The second sub-color filter layer CFL2 is patterned, and a second color resist is formed in the display area AA. The second sub-color filter layer CFL2 forms the annular barrier RTW in the isolation area BB. A third sub-color filter layer CFL3 is prepared on the black matrix layer BM. The third sub-color filter layer CFL3 is patterned, and a third color resist is formed in the display area AA. The third sub-color filter layer CFL3 is removed in the isolation area BB. In this way, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form the first color resist, the second color resist, and the third color resist in the display area AA, respectively. The second sub-color filter layer CFL2 forms the annular barrier wall RTW in the isolation area BB. The annular barrier wall RTW formed in this way not only improves the intensity of the through-hole AAH, but also blocks light leakage from the side of the display area AA by virtue of the light filtering properties of the color filter layers CFL.

[0102] In some embodiments, the cross-sectional area of ​​the second sub-color filter layer CFL2 located in the isolation region BB on the side closest to the black matrix layer BM is smaller than the cross-sectional area of ​​the second sub-color filter layer CFL2 located on the other side of the isolation region BB, thus making the second sub-color filter layer CFL2 appear narrower at the bottom than at the top. Of course, in some embodiments, the second sub-color filter layer CFL2 may not appear narrower at the bottom than at the top.

[0103] It should be noted that, in this embodiment, there are no specific limitations on the first color resist, the second color resist, and the third color resist. As an example, the first color resist can be a red color resist; the second color resist can be a green color resist; and the third color resist can be a blue color resist.

[0104] When the annular barrier RTW is formed by the third sub-color filter layer CFL3, the annular barrier RTW can be prepared in the following manner: After patterning the black matrix layer BM, a first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and the first sub-color filter layer CFL1 forms a first color resist in the display area AA. The first sub-color filter layer CFL1 is removed in the isolation area BB. A second sub-color filter layer CFL2 is prepared on the black matrix layer BM. The second sub-color filter layer CFL2 is patterned, and the second sub-color filter layer CFL2 forms a second color resist in the display area AA. The second sub-color filter layer CFL2 is removed in the isolation area BB. A third sub-color filter layer CFL3 is prepared on the black matrix layer BM. The third sub-color filter layer CFL3 is patterned, and the third sub-color filter layer CFL3 forms a third color resist in the display area AA. The third sub-color filter layer CFL3 forms the annular barrier RTW in the isolation area BB. In this way, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form the first color resist, the second color resist, and the third color resist in the display area AA, respectively. The second sub-color filter layer CFL2 forms the annular barrier wall RTW in the isolation area BB. The annular barrier wall RTW formed in this way not only improves the intensity of the through-hole AAH, but also blocks light leakage from the side of the display area AA by virtue of the light filtering properties of the color filter layers CFL.

[0105] In some embodiments, the cross-sectional area of ​​the third sub-color filter layer CFL3 located in the isolation region BB on the side closest to the black matrix layer BM is smaller than the cross-sectional area of ​​the third sub-color filter layer CFL3 located in the isolation region BB on the other side, thus making the third sub-color filter layer CFL3 appear narrower at the bottom than at the top. Of course, in some embodiments, the third sub-color filter layer CFL3 may not appear narrower at the bottom than at the top.

[0106] It should be noted that, in this embodiment, there are no specific limitations on the first color resist, the second color resist, and the third color resist. As an example, the first color resist can be a red color resist; the second color resist can be a green color resist; and the third color resist can be a blue color resist.

[0107] As another example, an organic enhancement structure (ORS) may include an annular barrier wall (RTW) formed by stacking multiple of a first sub-color filter layer (CFL1), a second sub-color filter layer (CFL2), and a third sub-color filter layer (CFL3).

[0108] It is understandable that when an annular barrier wall RTW is set in the organic enhancement structure ORS of the isolation zone BB, the annular barrier wall RTW can be formed by stacking the first sub-color filter layer CFL1 and the second sub-color filter layer CFL2; the annular barrier wall RTW can be formed by stacking the first sub-color filter layer CFL1 and the third sub-color filter layer CFL3; the annular barrier wall RTW can be formed by stacking the second sub-color filter layer CFL2 and the third sub-color filter layer CFL3; the annular barrier wall RTW can be formed by stacking the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3.

[0109] For example, when the annular barrier RTW is formed by stacking a first sub-color filter layer CFL1 and a second sub-color filter layer CFL2, the annular barrier RTW can be prepared in the following manner: After patterning the black matrix layer BM, the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and the first sub-color filter layer CFL1 forms a first color resist in the display area AA. The first sub-color filter layer CFL1 forms a first annular barrier RTW11 in the isolation area BB. The second sub-color filter layer CFL2 is prepared on the black matrix layer BM. The second sub-color filter layer CFL2 is patterned, and the second sub-color filter layer CFL2 forms a second color resist in the display area AA. The second sub-color filter layer CFL2 forms a second annular barrier RTW21 in the isolation area BB, above the first annular barrier RTW11. The first annular sub-barrier RTW11 and the second annular sub-barrier RTW21 form an annular barrier RTW. A third sub-color filter layer CFL3 is fabricated on the black matrix layer BM and patterned. The third sub-color filter layer CFL3 forms a third color resist in the display area AA and is removed in the isolation area BB. In this way, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form a first color resist, a second color resist, and a third color resist in the display area AA, respectively. The first sub-color filter layer CFL1 and the second sub-color filter layer CFL2 form an annular barrier RTW in the isolation area BB. The annular barrier RTW formed in this way can not only improve the intensity of the through-hole AAH, but also block light leakage from the side of the display area AA by virtue of the light filtering characteristics of the color filter layer CFL.

[0110] In some embodiments of this disclosure, the annular barrier wall RTW is formed by stacking multiple of a first sub-color filter layer CF1, a second sub-color filter layer CF2, and a third sub-color filter layer CF3; wherein, in two adjacent sub-color filter layers of the same annular barrier wall RTW, the surface of the sub-color filter layer away from the display substrate DBP that is close to the color filter layer CFL is orthogonally projected onto the plane where the display substrate is located, and the surface of the sub-color filter layer that is close to the display substrate DBP that is away from the color filter layer CFL is orthogonally projected onto the plane where the display substrate is located.

[0111] As an example, the annular barrier wall RTW can also be formed by a first sub-color filter layer CF1 and a second sub-color filter layer CF2. It is understood that the orthographic projection of the side of the second sub-color filter layer CF2 closest to the black matrix layer BM onto the plane where the display substrate DBP is located lies within the orthographic projection of the first sub-color filter layer CF1 onto the plane where the display substrate DBP is located. This facilitates the formation of the stacked morphology of the second sub-color filter layer CF2 on the first sub-color filter layer CF1.

[0112] Of course, the annular barrier wall RTW can be formed by a first sub-color filter layer CF1, a second sub-color filter layer CF2, and a third sub-color filter layer CF3. It is understood that the orthographic projection of the side of the second sub-color filter layer CF2 closest to the black matrix layer BM onto the plane of the display substrate DBP lies within the orthographic projection of the first sub-color filter layer CF1 onto the plane of the display substrate DBP. This facilitates the formation of the stacked morphology of the second sub-color filter layer CF2 on the first sub-color filter layer CF1. Similarly, the orthographic projection of the side of the third sub-color filter layer CF3 closest to the black matrix layer BM onto the plane of the display substrate DBP lies within the orthographic projection of the side of the second sub-color filter layer CF2 furthest from the black matrix layer BM onto the plane of the display substrate DBP. This also facilitates the formation of the stacked morphology of the third sub-color filter layer CF3 on the second sub-color filter layer CF2. In some embodiments, the cross-sectional area of ​​the first sub-color filter layer CFL1 located in the isolation region BB closest to the black matrix layer BM is smaller than the cross-sectional area of ​​the other side of the first sub-color filter layer CFL1 located in the isolation region BB, thus making the first sub-color filter layer CFL1 narrower at the bottom than at the top. Of course, in some implementations, the first sub-color filter layer CFL1 may not be narrower at the bottom than at the top.

[0113] When the annular barrier RTW is formed by stacking a first sub-color filter layer CFL1 and a third sub-color filter layer CFL3, the annular barrier RTW can be fabricated as follows: After patterning the black matrix layer BM, the first sub-color filter layer CFL1 is fabricated on the black matrix layer BM. The first sub-color filter layer CFL1 is then patterned, forming a first color resist in the display area AA, and forming a first annular barrier RTW11 in the isolation area BB. A second sub-color filter layer is then fabricated on the black matrix layer BM. CFL2 is patterned, forming a second color filter in the display area AA, and is removed in the isolation area BB. A third sub-color filter layer CFL3 is fabricated on the black matrix layer BM, and patterned, forming a third color filter in the display area AA. A second annular sub-barrier RTW21 is formed in the isolation area BB, above the first annular sub-barrier RTW11. The first annular sub-barrier RTW11 and the second annular sub-barrier RTW21 form an annular barrier RTW. Thus, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form a first color filter, a second color filter, and a third color filter in the display area AA, and the first sub-color filter layer CFL1 and the third sub-color filter layer CFL3 form an annular barrier RTW in the isolation area BB. The annular barrier wall RTW formed in this way can not only improve the strength of the through hole AAH, but also block light leakage from the side of the display area AA by means of the light filtering properties of the color filter layer CFL.

[0114] In some embodiments, the cross-sectional area of ​​the first sub-color filter layer CFL1 located in the isolation region BB near the black matrix layer BM is smaller than the cross-sectional area of ​​the other side of the first sub-color filter layer CFL1 located in the isolation region BB, thus making the first sub-color filter layer CFL1 appear narrower at the bottom than at the top. Of course, in some embodiments, the first sub-color filter layer CFL1 may not appear narrower at the bottom than at the top.

[0115] When the annular barrier RTW is formed by stacking a second sub-color filter layer CFL2 and a third sub-color filter layer CFL3, the annular barrier RTW can be fabricated as follows: After patterning the black matrix layer BM, a first sub-color filter layer CFL1 is fabricated on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and a first color resist is formed in the display area AA of the first sub-color filter layer CFL1. The first sub-color filter layer CFL1 is removed in the isolation area BB. The second sub-color filter layer CFL2 is fabricated on the black matrix layer BM. The first sub-color filter layer CFL2 is patterned. A second color filter layer CFL2 forms a second color resist in the display area AA, and a first annular sub-barrier RTW11 is formed in the isolation area BB. A third sub-color filter layer CFL3 is fabricated on the black matrix layer BM. The third sub-color filter layer CFL3 is patterned, forming a third color resist in the display area AA. A second annular sub-barrier RTW21 is formed in the isolation area BB, above the first annular sub-barrier RTW11. The first annular sub-barrier RTW11 and the second annular sub-barrier RTW21 form an annular barrier RTW. Thus, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form the first, second, and third color resists in the display area AA, and the second and third sub-color filter layers CFL2 and CFL3 form the annular barrier RTW in the isolation area BB. The annular barrier wall RTW formed in this way can not only improve the strength of the through hole AAH, but also block light leakage from the side of the display area AA by means of the light filtering properties of the color filter layer CFL.

[0116] In some embodiments, the cross-sectional area of ​​the second sub-color filter layer CFL2 located in the isolation region BB on the side closest to the black matrix layer BM is smaller than the cross-sectional area of ​​the other side of the second sub-color filter layer CFL2 located in the isolation region BB, thus making the second sub-color filter layer CFL2 appear narrower at the bottom than at the top. Of course, in some embodiments, the first sub-color filter layer CFL1 may not appear narrower at the bottom than at the top.

[0117] When the annular barrier RTW is formed by stacking a first sub-color filter layer CFL1, a second sub-color filter layer CFL2, and a third sub-color filter layer CFL3, the annular barrier RTW can be prepared in the following manner: After patterning the black matrix layer BM, the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and the first sub-color filter layer CFL1 forms a first color resist in the display area AA. The first sub-color filter layer CFL1 forms a first annular barrier RTW11 in the isolation area BB. The second sub-color filter layer CFL2 is patterned, and the second sub-color filter layer CFL2 forms a second color resist in the display area AA. The second sub-color filter layer CFL2 forms a second annular barrier RTW21 in the isolation area BB, located above the first annular barrier RTW11. The first annular sub-barrier RTW11 and the second annular sub-barrier RTW21 are used. The third sub-color filter layer CFL3 is patterned, forming a third color resist in the display area AA. The third sub-color filter layer CFL3 forms a third annular sub-barrier RTW31 in the isolation area BB, located above the second annular sub-barrier RTW21. The first annular sub-barrier RTW11, the second annular sub-barrier RTW21, and the third annular sub-barrier RTW31 form the annular barrier RTW. Thus, the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form a first color resist, a second color resist, and a third color resist in the display area AA, and the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 form the annular barrier RTW in the isolation area BB. The annular barrier wall RTW formed in this way can not only improve the strength of the through hole AAH, but also block light leakage from the side of the display area AA by means of the light filtering properties of the color filter layer CFL.

[0118] In some embodiments, the cross-sectional area of ​​the first sub-color filter layer CFL1 located in the isolation region BB near the black matrix layer BM is smaller than the cross-sectional area of ​​the other side of the first sub-color filter layer CFL1 located in the isolation region BB, thus making the first sub-color filter layer CFL1 narrower at the bottom than at the top; the cross-sectional area of ​​the second sub-color filter layer CFL2 located in the isolation region BB near the black matrix layer BM is smaller than the cross-sectional area of ​​the second sub-color filter layer CFL2 located in the isolation region BB, thus also making the second sub-color filter layer CFL2 narrower at the bottom than at the top. Of course, in some embodiments, the first sub-color filter layer CFL1 may not exhibit a narrower-than-top configuration.

[0119] It should be noted that, in the embodiments disclosed herein, the organic reinforcement structure ORS may include one annular barrier wall RTW surrounding the through hole AAH; it may include two annular barrier walls RTW surrounding the through hole AAH; and of course, it may also include three or more display barriers surrounding the through hole AAH, which will not be elaborated here.

[0120] In some embodiments of this disclosure, referring to Figures 3 and 4, the annular barrier wall RTW includes a first annular barrier wall RTW1, which is formed by stacking a first sub-color filter layer CFL1, a second sub-color filter layer CFL2, and a third sub-color filter layer CFL3; the annular barrier wall RTW adjacent to the first annular barrier wall RTW1 is formed by one of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3, or by stacking two of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3.

[0121] As an example, the annular barrier RTW adjacent to the first annular barrier RTW1 can be formed by one of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3.

[0122] For example, the first annular barrier RTW1 can be formed by the first sub-color filter layer CFL1. Specifically, the black matrix layer BM is patterned, and the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and within the display area AA, the first sub-color filter layer CFL1 forms a first color resist. Within the isolation area BB, the first color filter forms the first annular sub-barrier RTW11 of the first annular barrier RTW1, and forms an annular barrier RTW adjacent to the first annular barrier RTW1. A second sub-color filter layer CFL2 is prepared on the first sub-color filter layer CFL1, and the second sub-color filter layer CFL2 is patterned. In the patterning process, within the display area AA, the second sub-color filter layer CFL2 forms a second color resist, and within the isolation area BB, the second sub-color filter layer CFL2 forms a second annular sub-barrier RTW21 of the first annular barrier RTW1; a third sub-color filter layer CFL3 is prepared on the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 is patterned. Within the display area AA, the third sub-color filter layer CFL3 forms a third color resist, and within the isolation area BB, the third sub-color filter layer CFL3 forms a third annular sub-barrier RTW31 of the first annular barrier RTW1.

[0123] The annular barrier RTW adjacent to the first annular barrier RTW1 can be formed by the second sub-color filter layer CFL2. Specifically, the black matrix layer BM is patterned, and the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and within the display area AA, the first sub-color filter layer CFL1 forms the first color resist. Within the isolation area BB, the first color filter forms the first annular sub-barrier RTW11 of the first annular barrier RTW1. The second sub-color filter layer CFL2 is prepared on the first sub-color filter layer CFL1, and the second sub-color filter layer CFL2 is patterned. Within the display area AA, the second sub-color filter layer CFL2 forms... A second color filter layer (CFL2) is formed within the isolation zone BB. Within this isolation zone BB, the second sub-color filter layer (CFL2) forms the second annular sub-barrier RTW21 of the first annular barrier RTW1, and an annular barrier RTW adjacent to the first annular barrier RTW1. A third sub-color filter layer (CFL3) is then prepared on the second sub-color filter layer (CFL2). The third sub-color filter layer (CFL3) is patterned. Within the display zone AA, the third sub-color filter layer (CFL3) forms the third color filter. Within the isolation zone BB, the third sub-color filter layer (CFL3) forms the third annular sub-barrier RTW31 of the first annular barrier RTW1.

[0124] The annular barrier RTW adjacent to the first annular barrier RTW1 can be formed by the third sub-color filter layer CFL3. Specifically, the black matrix layer BM is patterned, and the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and within the display area AA, the first sub-color filter layer CFL1 forms the first color resist. Within the isolation area BB, the first color filter forms the first annular sub-barrier RTW11 of the first annular barrier RTW1. A second sub-color filter layer CFL2 is prepared on the first sub-color filter layer CFL1, and the second sub-color filter layer CFL2 is patterned. Within the display area AA, the second sub-color filter layer CFL2... A second color resist is formed. Within the isolation area BB, the second sub-color filter layer CFL2 forms the second annular sub-barrier RTW21 of the first annular barrier RTW1. A third sub-color filter layer CFL3 is prepared on the second sub-color filter layer CFL2. The third sub-color filter layer CFL3 is patterned. Within the display area AA, the third sub-color filter layer CFL3 forms the third color resist. Within the isolation area BB, the third sub-color filter layer CFL3 forms the third annular sub-barrier RTW31 of the first annular barrier RTW1 and the annular barrier RTW adjacent to the first annular barrier RTW1.

[0125] As another example, the annular barrier RTW adjacent to the first annular barrier RTW1 is formed by one of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2 and the third sub-color filter layer CFL3, or by two of the first sub-color filter layer CFL1, the second sub-color filter layer CFL2 and the third sub-color filter layer CFL3 stacked together.

[0126] For example, the annular barrier RTW adjacent to the first annular barrier RTW1 is formed by a first sub-color filter layer CFL1 and a second sub-color filter layer CFL2. Specifically, the black matrix layer BM is patterned, and the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and within the display area AA, the first sub-color filter layer CFL1 forms a first color stop. Within the isolation area BB, the first sub-color filter layer CFL1 forms the first annular sub-barrier RTW11 of the first annular barrier RTW1, and the first annular sub-barrier RTW11 of the annular barrier RTW1 adjacent to the first annular barrier RTW1. The second sub-color filter layer CFL2 is prepared on the first sub-color filter layer CFL1, and the second sub-color filter layer CFL2 is patterned. Within the display area AA, the second sub-color filter layer CFL2 forms a first color stop. L2 forms a second color resist. Within the isolation area BB, the second sub-color filter layer CFL2 forms a second annular sub-block RTW21 of the first annular barrier RTW1, and a second annular sub-block RTW21 that forms an annular barrier RTW adjacent to the first annular barrier RTW1. A third sub-color filter layer CFL3 is prepared on the second sub-color filter layer CFL2. The third sub-color filter layer CFL3 is patterned. Within the display area AA, the third sub-color filter layer CFL3 forms a third color resist. Within the isolation area BB, the third sub-color filter layer CFL3 forms a third annular sub-block RTW31 of the first annular barrier RTW1 and an annular barrier RTW adjacent to the first annular barrier RTW1.

[0127] The annular barrier RTW adjacent to the first annular barrier RTW1 is formed by a first sub-color filter layer CFL1 and a third sub-color filter layer CFL3. Specifically, the black matrix layer BM is patterned, and the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, and within the display area AA, the first sub-color filter layer CFL1 forms a first color stop. Within the isolation area BB, the first sub-color filter layer CFL1 forms the first annular sub-barrier RTW11 of the first annular barrier RTW1, and the first annular sub-barrier RTW11 of the annular barrier RTW1 adjacent to the first annular barrier RTW1. A second sub-color filter layer CFL2 is prepared on the first sub-color filter layer CFL1, and the second sub-color filter layer CFL2 is patterned. Within the AA region, the second sub-color filter layer CFL2 forms a second color resist. Within the isolation region BB, the second sub-color filter layer CFL2 forms a second annular sub-block RTW21 of the first annular barrier RTW1. A third sub-color filter layer CFL3 is prepared on the second sub-color filter layer CFL2. The third sub-color filter layer CFL3 is patterned. Within the display region AA, the third sub-color filter layer CFL3 forms a third color resist. Within the isolation region BB, the third sub-color filter layer CFL3 forms a third annular sub-block RTW31 of the first annular barrier RTW1, and a second annular sub-block RTW21 of the annular barrier RTW adjacent to the first annular barrier RTW1.

[0128] The first annular barrier RTW1 is adjacent to an annular barrier RTW formed by a second sub-color filter layer CFL2 and a third sub-color filter layer CFL3. Specifically, the black matrix layer BM is patterned, and the first sub-color filter layer CFL1 is prepared on the black matrix layer BM. The first sub-color filter layer CFL1 is patterned, forming a first color resist within the display area AA, and forming the first annular sub-barrier RTW11 of the first annular barrier RTW1 within the isolation area BB. The second sub-color filter layer CFL2 is prepared on the first sub-color filter layer CFL1, and patterned, forming a second color resist within the display area AA, and forming the second sub-color filter layer CFL2 within the isolation area BB. Layer CFL2 forms the second annular sub-block RTW21 of the first annular block RTW1, and the first annular sub-block RTW11 of the annular block RTW adjacent to the first annular block RTW1; a third sub-color filter layer CFL3 is prepared on the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3 is patterned. In the display area AA, the third sub-color filter layer CFL3 forms the third color resist. In the isolation area BB, the third sub-color filter layer CFL3 forms the third annular sub-block RTW31 of the first annular block RTW1, and the second annular sub-block RTW21 of the annular block RTW adjacent to the first annular block RTW1.

[0129] In some implementations, three anti-crack barriers (CD) can be provided, and correspondingly, three annular barrier walls (RTW) can also be provided. This arrangement ensures the flatness of the upper annular barrier wall (RTW, formed by the color filter sublayer) by the anti-crack barrier CD; on the other hand, it allows the annular barrier wall (RTW) to be taller in shape, which is beneficial for blocking lateral light leakage, thereby improving the quality of the display panel.

[0130] In some embodiments of this disclosure, referring to FIG3, the annular barrier wall RTW includes a third annular barrier wall RTW3, a second annular barrier wall RTW2, and a first annular barrier wall RTW1 arranged sequentially around the cutting area CA; wherein, the third annular barrier wall RTW3 includes a first sub-annular barrier wall RTW11; the second annular barrier wall RTW2 includes the first sub-annular barrier wall RTW11 and a second sub-annular barrier wall RTW21 located on the side of the first sub-annular barrier wall RTW11 away from the display substrate DBP; the first annular barrier wall RTW1 includes a first annular sub-barrier wall RTW11, a second annular barrier wall RTW21, and a third annular barrier wall RTW31 arranged sequentially on one side of the display substrate DBP.

[0131] In other embodiments of this disclosure, referring to FIG6, the annular barrier RTW includes a third annular barrier RTW3, a second annular barrier RTW2, and a first annular barrier RTW1 arranged sequentially around the cutting area CA; wherein, the third annular barrier RTW3 includes a first annular sub-barrier RTW11, a second annular sub-barrier RTW21, and a third annular sub-barrier RTW31 arranged sequentially on one side of the display substrate DBP; the second annular barrier RTW2 includes a first sub-annular barrier RTW11 and a second sub-annular barrier RTW21 located on the side of the first sub-annular barrier RTW11 away from the display substrate DBP; the first annular barrier RTW1 includes a first annular sub-barrier RTW11.

[0132] In some other embodiments of this disclosure, the width of the first annular sub-barrier RTW11 near the surface of the display substrate DBP is smaller than the width of the first annular sub-barrier RTW11 away from the surface of the display substrate DBP; this makes the first annular sub-barrier RTW11 appear narrower at the bottom than at the top.

[0133] In other embodiments of this disclosure, the width of the second annular sub-barrier RTW21 near the surface of the display substrate DBP is smaller than the width of the second annular sub-barrier RTW21 away from the surface of the display substrate DBP. This allows the second annular sub-barrier RTW21 to be narrower at the bottom than at the top.

[0134] In some other embodiments of this disclosure, the width of the third annular sub-barrier RTW31 near the surface of the display substrate DBP is smaller than the width of the third annular sub-barrier RTW31 away from the surface of the display substrate DBP. This allows the first annular sub-barrier RTW11 to be narrower at the bottom than at the top. This also allows the third annular sub-barrier RTW31 to be narrower at the bottom than at the top.

[0135] As an example, the width of the first annular sub-barrier RTW11 near the surface of the display substrate DBP is smaller than the width of the first annular sub-barrier RTW11 away from the surface of the display substrate DBP; the width of the second annular sub-barrier RTW21 near the surface of the display substrate DBP is smaller than the width of the second annular sub-barrier RTW21 away from the surface of the display substrate DBP; and the width of the third annular sub-barrier RTW31 near the surface of the display substrate DBP is smaller than the width of the third annular sub-barrier RTW31 away from the surface of the display substrate DBP. In some embodiments of this disclosure, the organic reinforcement structure ORS includes a plurality of annular barrier RTWs respectively surrounding the via AAH; at least two annular barrier RTWs have different heights. As an example, the organic reinforcement structure ORS may include two annular barrier RTWs surrounding the via AAH, wherein the two annular barrier RTWs have different heights. In this way, the morphology of the via AAH can be guaranteed so that the morphology of the via AAH does not have excessively high step differences, which facilitates the subsequent fabrication of the encapsulation structure COC.

[0136] As another example, referring to Figures 3, 4, 6, and 7, the organic reinforcement structure (ORS) may include three annular barrier walls (RTWs) surrounding the via AAH (e.g., a first annular barrier wall RTW1, a second annular barrier wall RTW2, and a third annular barrier wall RTW3). In this example, the first annular barrier wall RTW1, the second annular barrier wall RTW2, and the third annular barrier wall RTW3 are arranged in a stepped manner. In other words, the first annular barrier wall RTW1 may be formed by a first sub-color filter layer (CFL1); the second annular barrier wall RTW2 may be formed by stacking the first sub-color filter layer (CFL1) and the second sub-color filter layer (CFL2); and the third annular barrier wall RTW3 may be formed by stacking the first sub-color filter layer (CFL1), the second sub-color filter layer (CFL2), and the third sub-color filter layer (CFL3). This configuration of the organic reinforcement structure (ORS) can ensure the morphology of the via AAH so that the morphology of the via AAH does not exhibit excessively high step differences. Of course, the first annular barrier RTW1 can be formed by stacking the first sub-color filter layer CFL1, the second sub-color filter layer CFL2, and the third sub-color filter layer CFL3; the second annular barrier RTW2 can be formed by stacking the first sub-color filter layer CFL1 and the second sub-color filter layer CFL2; and the third annular barrier RTW3 can be formed by the first sub-color filter layer CFL1. Similarly, this can also ensure the morphology of the through hole AAH so that the morphology of the through hole AAH does not have excessively high step differences.

[0137] It should be noted that, in this embodiment, the number of annular retaining walls RTW can also be set to multiple according to the needs of the process. For example, the number of annular retaining walls RTW can be set to four, five, six, etc. This embodiment does not impose specific limitations on this.

[0138] In some embodiments of this disclosure, the material of the organic reinforcement structure (ORS) is a negative photoresist. Thus, the negative photoresist is an organic material, and the double-layer organic configuration can significantly enhance the strength of the via-hole (AAH), thereby reducing the occurrence of GDSH and contributing to improved display panel quality.

[0139] In some embodiments of this disclosure, the maximum thickness of the organic reinforcement structure (ORS) is in the range of 5 to 10 micrometers. For example, the maximum thickness of the ORS can be 5 micrometers. In this case, within the isolation region BB, the combination of the ORS and the black matrix layer BM can improve the strength of the via apertures (AAH), helping to reduce the occurrence of GDSH in the display panel. The maximum thickness of the ORS can also be 8 micrometers. Similarly, within the isolation region BB, the combination of the ORS and the black matrix layer BM can improve the strength of the via apertures (AAH), helping to reduce the occurrence of GDSH. The maximum thickness of the ORS can also be 9 micrometers. In this case, within the isolation region BB, the combination of the ORS and the black matrix layer BM can improve the strength of the via apertures (AAH), helping to reduce the occurrence of GDSH. Of course, the maximum thickness of the ORS can also be 10 micrometers. In this case, within the isolation region BB, the combination of the ORS and the black matrix layer BM can improve the strength of the via apertures (AAH), reducing the occurrence of GDSH. It should be noted that in this embodiment, there is no specific limitation on the maximum thickness of the organic reinforcement structure ORS, as long as it can be combined with the black matrix layer BM to improve the strength of the through-hole AAH.

[0140] In some embodiments, the display panel further includes a thin-film encapsulation layer TFE having an organic layer IJP; the display panel also has a barrier dam RD surrounding the isolation area BB, and the edge of the organic layer IJP does not extend beyond the barrier dam RD in the direction from the display area AA toward the via AAH.

[0141] This disclosure also provides a display device including the aforementioned display panel. The display device can be used to display moving or still images and can be used in mobile phones, smartphones, tablet computers, mobile communication terminals, electronic laptops, etc. The display device can also be used for displaying various products such as televisions, monitors, billboards, and the Internet of Things. Of course, the display device can also be installed on wearable devices such as smartwatches, watch phones, glasses-type displays, and head-mounted displays, or it can include a dashboard display installed in a car, replacing the side mirrors of the car, used for entertainment in the rear seats of a car, or used as a display placed on the back of the front seats, etc.

[0142] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display panel, characterized in that, It includes a through-hole, an isolation area surrounding the through-hole, and a display area surrounding the isolation area; The display panel has a display substrate, a black matrix layer and an organic reinforcement structure stacked in sequence; The black matrix layer extends from the display area to the edge of the through hole; The organic reinforcement structure is disposed in the isolation area to improve the strength of the display panel near the through hole.

2. The display panel according to claim 1, characterized in that, The black matrix layer has a partition gap surrounding the through-hole, the partition gap being located in the isolation area.

3. The display panel according to claim 2, characterized in that, The organic reinforcement structure includes an annular retaining wall surrounding the through-hole and corresponding one-to-one with at least a portion of the partition gap; The orthographic projection of the annular barrier on the plane of the display substrate at least partially coincides with the orthographic projection of the corresponding partition gap on the plane of the display substrate.

4. The display panel according to claim 2, characterized in that, The black matrix layer has multiple partition gaps, which are arranged sequentially around the through hole; The organic reinforcement structure includes a plurality of annular retaining walls that correspond one-to-one with the plurality of partition gaps.

5. The display panel according to claim 3, characterized in that, The display substrate is provided with multiple crack-resistant baffles surrounding the through holes in the isolation area; The orthographic projection of the annular barrier on the plane where the display substrate is located is within the range of the orthographic projection of the anti-crack barrier on the plane where the display substrate is located.

6. The display panel according to claim 5, characterized in that, The number of the annular retaining walls is multiple; At least one of the crack-prevention barriers is provided between the orthographic projections of two adjacent annular barriers onto the plane where the display substrate is located.

7. The display panel according to claim 5, characterized in that, The annular barrier and the anti-crack barrier are arranged in a one-to-one correspondence; the orthographic projection of the annular barrier on the plane where the display substrate is located is within the range of the orthographic projection of the corresponding anti-crack barrier on the plane where the display substrate is located.

8. The display panel according to claim 1, characterized in that, The display panel has a color filter layer located on the side of the black matrix layer away from the display substrate; The color filter layer forms the organic enhancement structure in the isolation region.

9. The display panel according to claim 8, characterized in that, The color filter layer includes a first sub-color filter layer, a second sub-color filter layer, and a third sub-color filter layer; The organic reinforced structure includes at least one annular retaining wall surrounding the through hole; Any one of the aforementioned annular barriers is formed by one of the first sub-color filter layer, the second sub-color filter layer, and the third sub-color filter layer, or by multiple of the first sub-color filter layer, the second sub-color filter layer, and the third sub-color filter layer stacked together.

10. The display panel according to claim 9, characterized in that, The annular barrier wall includes a first annular barrier wall, which is formed by stacking a first sub-color filter layer, a second sub-color filter layer and a third sub-color filter layer. The annular barrier wall adjacent to the first annular barrier wall is formed by one of the first sub-color filter layer, the second sub-color filter layer and the third sub-color filter layer, or by two of the first sub-color filter layer, the second sub-color filter layer and the third sub-color filter layer stacked together.

11. The display panel according to claim 9, characterized in that, The annular barrier is formed by stacking multiple of the first sub-color filter layer, the second sub-color filter layer, and the second sub-color filter layer; wherein, in two adjacent sub-color filter layers of the same annular barrier, the orthographic projection of the surface of the sub-color filter layer closest to the color filter layer on the plane where the display substrate is located is within the orthographic projection of the surface of the sub-color filter layer closest to the display substrate on the plane where the display substrate is located.

12. The display panel according to claim 9, characterized in that, The annular barrier includes a third annular barrier, a second annular barrier, and a first annular barrier arranged sequentially around the cutting area; wherein, the third annular barrier includes a first sub-annular barrier; the second annular barrier includes a first sub-annular barrier and a second sub-annular barrier located on the side of the first sub-annular barrier away from the display substrate; the first annular barrier includes a first annular sub-barrier, a second annular sub-barrier, and a third annular barrier arranged sequentially on one side of the display substrate.

13. The display panel according to claim 9, characterized in that, The annular barrier includes a third annular barrier, a second annular barrier, and a first annular barrier arranged sequentially around the cutting area; wherein, the third annular barrier includes a first annular sub-barrier, a second annular sub-barrier, and a third annular sub-barrier arranged sequentially on one side of the display substrate; the second annular barrier includes a first sub-annular barrier and a second sub-annular barrier located on the side of the first sub-annular barrier away from the display substrate; the first annular barrier includes a first annular sub-barrier.

14. The display panel according to claim 12 or 13, characterized in that, The first sub-annular barrier is located in the first sub-color filter layer; The second sub-annular barrier is located in the second sub-color filter layer; The third sub-annular retaining wall is located in the third sub-color film layer.

15. The display panel according to claim 12 or 13, characterized in that, The width of the first annular sub-barrier near the surface of the display substrate is smaller than the width of the first annular sub-barrier away from the surface of the display substrate; The width of the second annular sub-barrier near the surface of the display substrate is smaller than the width of the second annular sub-barrier away from the surface of the display substrate; The width of the third annular sub-barrier near the surface of the display substrate is smaller than the width of the third annular sub-barrier away from the surface of the display substrate.

16. The display panel according to claim 1, characterized in that, The organic reinforcement structure includes a plurality of annular retaining walls that surround the through hole; at least two of the annular retaining walls have different heights.

17. The display panel according to claim 1, characterized in that, The material used for the organic reinforcement structure is a negative photoresist.

18. The display panel according to claim 17, characterized in that, The maximum thickness of the organic reinforcement structure is in the range of 5 to 10 micrometers.

19. The display panel according to claim 1, characterized in that, The display panel further includes a thin-film encapsulation layer, the thin-film encapsulation layer having an organic layer; The display panel also has a barrier dam surrounding the isolation area, and the edge of the organic layer does not extend beyond the barrier dam in the direction from the display area toward the through hole.

20. A display device, characterized in that, The display panel includes the configuration as described in any one of claims 1 to 19.

Images