Electrical and / or electronic assembly

Abstract

For an electrical and / or electronic assembly comprising at least one magnetic core (10), at least one electrical conductor (20), at least one printed circuit board (30) and at least one heat sink (40), the printed circuit board (30) being arranged between the heat sink (40) and the magnetic core (10), wherein a contact face (11) of the magnetic core (10) bears indirectly and / or directly against a first side (31) of the printed circuit board (30), while a surface (41) of the heat sink (40) bears indirectly and / or directly against a second side (32) of the printed circuit board (30) opposite the first side (31), wherein the electrical conductor (20) comprises at least one U-shaped conductor segment (21), the conductor segment (21) running around the magnetic core (10) in a U shape, the conductor segment (21) having a first end (22) and a second end (23), the first end (22) being arranged in a first opening (33) in the printed circuit board (20) and the second end (23) being arranged in a second opening (34) in the printed circuit board (20), it is proposed that the first end (22) of the conductor segment (21) and / or the second end (23) of the conductor segment (21) protrude / s into the heat sink (40).

Description

[0001] Description

[0002] title

[0003] Electrical and / or electronic assembly

[0004] The present invention relates to an electrical and / or electronic assembly.

[0005] State of the art

[0006] In power electronic control units, in addition to the output stages, bulky components such as coils, transformers, and capacitors must also be cooled. These components comprise a magnetic core and at least one electrical conductor surrounding the magnetic core. Heat is generated within the components, particularly in the magnetic core and the electrical conductor, and this heat must be dissipated. For this purpose, the components are often connected to cooling surfaces via potting compound or gap pads.

[0007] Disclosure of the invention

[0008] According to the invention, an electrical and / or electronic assembly comprising at least one magnetic core, at least one electrical conductor, at least one printed circuit board, and at least one heat sink is proposed. The printed circuit board is arranged between the heat sink and the magnetic core, wherein a contact surface of the magnetic core indirectly and / or directly abuts a first side of the printed circuit board, wherein a surface of the heat sink indirectly and / or directly abuts a second side of the printed circuit board facing away from the first side, wherein the electrical conductor comprises at least one U-shaped conductor segment, wherein the conductor segment surrounds the magnetic core in a U-shape, and wherein the conductor segment has a first end and a second end, wherein the first end is arranged in a first opening of the printed circuit board and the second end is arranged in a second opening of the printed circuit board.According to the invention, the first end of the conductor segment and / or the second end of the conductor segment protrude into the heat sink.

[0009] Advantages of the invention

[0010] Compared to the prior art, the electrical and / or electronic assembly according to the invention has the advantage that the heat generated in the magnetic core and the electrical conductor is directly dissipated to the heat sink via the electrical conductor projecting into the heat sink. The heat is dissipated to the heat sink through the circuit board, which would otherwise form a barrier to heat conduction. For this purpose, openings for the electrical conductor are provided in the circuit board. Thus, the magnetic component, which is essentially located on the side of the circuit board facing away from the heat sink, is advantageously well thermally connected to the heat sink.

[0011] Further advantageous embodiments and developments of the invention are made possible by the features specified in the dependent claims.

[0012] According to an advantageous embodiment, a first insulating element is arranged at the first end of the conductor segment, electrically isolating the first end of the conductor segment from the heat sink, and / or a second insulating element is arranged at the second end of the conductor segment, electrically isolating the second end of the conductor segment from the heat sink. The first insulating element and / or the second insulating element can advantageously be in direct, thermally conductive contact with the heat sink, so that heat can be dissipated from the ends of the conductor segment to the heat sink. Simultaneously, the heat sink can be electrically insulated from the conductor segment by the insulating elements.

[0013] According to an advantageous embodiment, a first recess is formed in the surface of the heat sink, into which the first end of the conductor segment projects, and / or a second recess is formed, into which the second end of the conductor segment projects. This allows for a large-area thermally conductive contact between the conductor segment and the heat sink.

[0014] According to an advantageous embodiment, it is provided that the first recess is covered by the circuit board and / or the second recess is covered by the circuit board.

[0015] According to an advantageous embodiment, a thermally conductive material is arranged in the first recess and / or the second recess in the surface of the heat sink. The thermally conductive material can establish good thermal contact between the conductor segment and the heat sink.

[0016] According to an advantageous embodiment, a cooling channel is formed in the heat sink, wherein the first end and / or the second end of the conductor segment are surrounded by the cooling medium in the cooling channel. This allows the heat from the conductor segment to be efficiently dissipated to the cooling medium in the cooling channel.

[0017] According to an advantageous embodiment, the heat sink has an opening extending from its top surface to the cooling channel, with the opening being closed by the printed circuit board and an insulating element surrounding the end of the conductor segment. Thus, the insulating element is located directly within the cooling channel. The cooling medium flows directly around the insulating element in the cooling channel. The insulating element forms part of the wall of the cooling channel. This allows heat to be efficiently dissipated from the ends of the conductor segment to the cooling medium. According to another advantageous embodiment, the conductor segment is designed as a wire, preferably bent in a U-shape. Such a conductor segment can be advantageously manufactured simply by bending. Its U-shape makes it easy to insert the conductor segment through the openings in the printed circuit board and into the heat sink.

[0018] According to an advantageous embodiment, the U-shaped conductor segment is electrically connected to a conductor track of the printed circuit board, with the U-shaped conductor segment and the conductor track forming a winding around the magnetic core. The printed circuit board thus forms part of the windings.

[0019] According to an advantageous embodiment, a further U-shaped conductor segment is provided that surrounds the magnetic core in a U-shape, wherein the further conductor segment is electrically connected to the conductor track of the circuit board.

[0020] Brief description of the drawings

[0021] An embodiment of the invention is illustrated in the drawings and is explained in more detail in the following description. It shows

[0022] Fig. 1 shows a cross-section through an embodiment of the assembly according to the invention.

[0023] Embodiments of the invention

[0024] Fig. 1 shows a cross-section through an embodiment of the electrical and / or electronic assembly 1 according to the invention. The electrical and / or electronic assembly 1 is shown in section along a plane E that runs perpendicular to the circuit board 30.

[0025] The electrical and / or electronic assembly 1 can be used, for example, as an inductor, such as a common-mode or differential-mode inductor, or as a transformer in a variety of power electronic components, such as inverters or DC / DC converters. The electrical and / or electronic assembly 1 can be used, for example, in filters with common-mode inductors. The electrical and / or electronic assembly 1 can be used, for example, in passive electrical filters to suppress unwanted high-frequency interference.

[0026] The electrical and / or electronic assembly 1 comprises a printed circuit board 30 with an inductive component consisting of a magnetic core 10 and at least one electrical conductor 20. Furthermore, the electrical and / or electronic assembly 1 comprises a heat sink 40.

[0027] The electrical conductor 20 surrounds the magnetic core 10, for example, in a coil-like fashion. The electrical and / or electronic assembly 1 can, for example, comprise only one electrical conductor 20, but it can also comprise several electrical conductors 20. Thus, the electrical conductor 20 together with the magnetic core 10 forms a toroidal coil, which is also referred to, for example, as a ring coil or ring coil.

[0028] The electrical conductor 20 comprises at least one U-shaped conductor segment 21. The U-shaped conductor segment 21 can, for example, be designed as a bent wire. Furthermore, the electrical conductor 20 can comprise a conductor track 35 of the circuit board 30. The U-shaped conductor segment 21, together with a conductor track 35, forms a winding 25 around the magnetic core 10. However, as in the embodiment shown in the figure, the electrical conductor 20 can also comprise several U-shaped conductor segments 21 and several conductor tracks 35. In this case, each U-shaped conductor segment 21, together with each conductor track 35, can form a winding 25 around the magnetic core 10. Thus, the electrical conductor 20 can comprise a plurality of windings 25. One or more additional U-shaped conductor segments 24 can be provided. The additional U-shaped conductor segment 24 surrounds the magnetic core 10 in a U-shape.The further conductor segment 24 can be electrically connected to the conductor track 35 of the circuit board 30, to which the U-shaped conductor segment 21 is also connected. The magnetic core 10 is, for example, in the form of a ring or toroid. The magnetic core 10 has an axial direction A. The magnetic core 10 has a central annular opening. For example, a first annular surface and a second annular surface are formed on the magnetic core 10. The first annular surface faces away from the second annular surface. The annular surfaces extend in a ring shape around the central annular opening. The annular surfaces are spaced apart from each other in the axial direction A by the extent of the magnetic core 10. In this embodiment, the annular surfaces are planar and, for example, parallel to each other.The ring-shaped surfaces are, for example, congruent with each other. The ring-shaped surfaces bound the toroidal magnetic core in the axial direction A. One of the ring-shaped surfaces faces the circuit board 30 and serves as a bearing surface 11 for the magnetic core 10, with which the magnetic core 10 rests indirectly and / or directly on the circuit board 30.

[0029] The magnetic core 10 is made of a soft magnetic material. Soft magnetic materials are classified according to the IEC 60404-1 standard. For example, the magnetic core 10 can be a ferrite or powder magnet core, or it can consist of crystalline or amorphous metal strips. The magnetic core 10 forms a closed magnetic circuit, with the magnetic flux propagating almost exclusively within the ring-shaped magnetic core 10.

[0030] Furthermore, the electrical and / or electronic assembly 1 includes a heat sink 40, which is provided for cooling the magnetic core 10, the electrical conductor 20, and the circuit board 30. The heat sink 40 is made of a thermally conductive material, for example, aluminum. The heat sink 40 is, for example, formed in one piece and entirely from the same material. However, the heat sink 40 can also be composed of several parts, in particular parts attached to one another. A cooling channel 45 can be formed in the heat sink 40, as in the embodiment shown in the figure.

[0031] The circuit board 30 is arranged between the heat sink 40 and the magnetic core 10. A contact surface 11 of the magnetic core 10, which is particularly flat, rests directly and / or indirectly, in particular over a surface, against a first side 31 of the circuit board 30, which is also particularly flat.

[0032] Simultaneously, a surface 41 of the heat sink 40, which is particularly flat, is in direct and / or indirect contact with a second side 32 of the printed circuit board 30, which is also flat and faces away from the first side 31. A first opening 33 and a second opening 34 are formed in the printed circuit board 30. The first opening 33 and / or the second opening 34 extend from the first side 31 of the printed circuit board 30 to the second side 32 of the printed circuit board 30 through the printed circuit board 30. A first end 22 of the U-shaped conductor segment 21 projects through the first opening 33. A second end 23 of the U-shaped conductor segment 21 projects through the second opening 34. The first end 22 of the U-shaped conductor segment 21 can be electrically connected to the conductor track 35, particularly at the first opening 33.The second end 22 of the U-shaped conductor segment 21 can be electrically connected to the lyre track 35, particularly at the second opening 34.

[0033] The first end 22 of the conductor segment 21 projects into the heat sink. The second end 23 of the conductor segment 21 projects into the heat sink 40. A first insulating element 51 is arranged at the first end 22 of the conductor segment 21, which electrically insulates the first end 22 of the conductor segment 21 from the heat sink 40. A second insulating element 52 is arranged at the second end 23 of the conductor segment 21, which electrically insulates the second end 23 of the conductor segment 21 from the heat sink 40. For this purpose, a first recess 42 can be formed in the surface 41 of the heat sink 40, into which the first end 22 of the conductor segment 21 projects. Furthermore, a second recess 43 can be formed in the surface 41 of the heat sink 40, into which the second end 23 of the conductor segment 21 projects. The indentations 42, 42 can be formed, for example, as embossings in the surface 41 of the heat sink 40 or by deep drawing the surface 41 of the heat sink 40.The recesses 42, 43 can, for example, be covered by the circuit board 30. The circuit board 30 rests, for example, around the recesses 42, 43, directly and / or indirectly on the surface 41 of the heat sink 40. A thermally conductive material 55 can be arranged in the first recess 42 and / or the second recess 43. The thermally conductive material 55 surrounds, for example, the first end 22 of the electrical conductor 20 and / or the second end 23 of the electrical conductor 20.

[0034] The recesses 42, 43 project into the cooling channel 45 of the cooling body 40 on the side facing away from the surface 41 of the cooling body 40. This allows the first end 22 and / or the second end 23 of the conductor segment 21 to be surrounded by a cooling medium flowing in the cooling channel 45. The recesses 42, 43 form cooling-structure-like protrusions in the cooling channel 45 of the cooling body 40.

[0035] Of course, further embodiments and hybrid forms of the illustrated embodiments are possible.

Claims

Claims 1. Electrical and / or electronic assembly comprising at least one magnetic core (10), at least one electrical conductor (20), at least one printed circuit board (30) and at least one heat sink (40), wherein the printed circuit board (30) is arranged between the heat sink (40) and the magnetic core (10), wherein a contact surface (11) of the magnetic core (10) bears indirectly and / or directly against a first side (31) of the printed circuit board (30), wherein a surface (41) of the heat sink (40) bears indirectly and / or directly against a second side (32) of the printed circuit board (30) facing away from the first side (31), wherein the electrical conductor (20) comprises at least one U-shaped conductor segment (21), wherein the conductor segment (21) surrounds the magnetic core (10) in a U-shape, and wherein the conductor segment (21) has a first end (22) and a second end (23).wherein the first end (22) is arranged in a first opening (33) of the circuit board (20) and the second end (23) is arranged in a second opening (34) of the circuit board (20), characterized in that the first end (22) of the conductor segment (21) and / or the second end (23) of the conductor segment (21) project into the heat sink (40).

2. Electrical and / or electronic assembly according to claim 1, characterized in that a first insulating element (51) is arranged at the first end (22) of the conductor segment (21), which electrically insulates the first end (22) of the conductor segment (21) from the heat sink (40), and / or a second insulating element (52) is arranged at the second end (23) of the conductor segment (21), which electrically insulates the second end (23) of the conductor segment (21) from the heat sink (40).

3. Electrical and / or electronic assembly according to one of the preceding claims, characterized in that a first recess (42) is formed in the surface (41) of the heat sink (40) into which the first end (22) of the conductor segment (21) projects, and / or a second recess (43) is formed into which the second end (23) of the conductor segment (21) projects.

4. Electrical and / or electronic assembly according to claim 3, characterized in that the first recess (42) is covered by the circuit board (30) and / or the second recess (43) is covered by the circuit board (30).

5. Electrical and / or electronic assembly according to one of claims 3 or 4, characterized in that a thermally conductive mass (55) is arranged in the first recess (42) and / or the second recess (43) in the surface (41) of the heat sink (40).

6. Electrical and / or electronic assembly according to one of the preceding claims, characterized in that a cooling channel (45) is formed in the heat sink (40), wherein the first end (22) and / or the second end (23) of the conductor segment (21) are surrounded by the cooling medium in the cooling channel (45).

7. Electrical and / or electronic assembly according to one of the preceding claims, characterized in that an opening (44) extending from the top (41) of the heat sink (40) to the cooling channel (45) is formed in the heat sink (40), wherein the opening (44) is closed by the circuit board (30) and an insulating element (51, 52) surrounding the end (22, 23) of the conductor segment (21).

8. Electrical and / or electronic assembly according to one of the preceding claims, characterized in that the conductor segment (21) is designed as a wire, in particular a U-shaped bent wire.

9. Electrical and / or electronic assembly according to one of the preceding claims, characterized in that the U-shaped conductor segment (21) is electrically connected to a conductor track (35) of the circuit board (30), wherein the U-shaped conductor segment (21) together with the conductor track (35) forms a winding (25) around the magnetic core (10).

10. Electrical and / or electronic assembly according to claim 9, characterized in that a further U-shaped conductor segment (24) surrounds the magnetic core (10) in a U-shape, wherein the further conductor segment (24) is electrically conductively connected to the conductor track (35) of the circuit board (30).

Images