Laser processing device

Abstract

A laser processing device 100 comprises: a housing 2 in which a wafer holding unit 55 and a laser irradiation unit 51 are housed; a moving-image capturing unit 6 that is disposed in the housing 2 and captures a moving image of the inside of the housing 2; a storage unit 71 that stores the moving image captured by the moving-image capturing unit 6; and a control unit 7 for performing control such that, on the basis of the detection of the abnormality in the housing 2, an abnormality recording moving image Moa, which is a moving image in a range including an abnormality occurrence time when an abnormality is detected in the moving image captured by the moving-image capturing unit 6, is extracted and the abnormality recording moving image Moa is stored in the storage unit 71.

Description

Laser Processing Equipment

[0001] The present invention relates to a laser processing device.

[0002] 2. Description of the Related Art Conventionally, a processing apparatus for processing a wafer has been known, and is disclosed, for example, in Japanese Patent No. 6,558,948.

[0003] The above-mentioned Japanese Patent No. 6558948 discloses a processing apparatus for processing wafers, which includes a transfer unit, a chuck table, a cutting unit, a first camera, a second camera, a third camera, a fourth camera, and a controller. The transfer unit is configured to transfer a wafer removed from a cassette to the chuck table. The chuck table is configured to suck the wafer. The cutting unit is configured to cut the wafer sucked onto the chuck table while moving the chuck table using an X-axis movement mechanism.

[0004] The first camera of the processing apparatus disclosed in Japanese Patent No. 6558948 is configured to capture an image of the wafer after cutting by the cutting unit. The second camera captures an image of a test piece for detecting temperature changes associated with movement of the transport unit. The third camera captures an image of a test piece for detecting temperature changes associated with movement of the chuck table. The fourth camera captures an image of leakage of cutting water supplied during cutting by the cutting unit.

[0005] The controller in the above-mentioned Japanese Patent No. 6558948 performs control to determine whether wafer chips are scattered based on an image captured by a first camera. The controller performs control to determine whether the transport unit is overheating based on an image captured by a second camera. The controller performs control to determine whether the chuck table is overheating based on an image captured by a third camera. The controller performs control to determine whether cutting water is leaking based on an image captured by a fourth camera. If the controller determines that wafer chips are scattered, the transport unit is overheating, the chuck table is overheating, or cutting water is leaking, the controller performs control to notify the operator of the occurrence of an abnormality.

[0006] Patent No. 6558948

[0007] In the processing apparatus disclosed in Japanese Patent No. 6,558,948, an operator is notified of abnormalities, such as scattering of wafer chips, overheating of the transport unit, overheating of the chuck table, and cutting water leakage, based on images captured by each of the first, second, third, and fourth cameras. This allows the operator to recognize the occurrence of the abnormality. This allows the operator to check the status of the processing apparatus after the abnormality has occurred by inspecting the interior of the processing apparatus when performing recovery work for the abnormality. However, since the operator can only check the status of the apparatus after the abnormality has occurred, and not the status during the process of the abnormality, it is difficult to determine the cause of the abnormality. Therefore, it is desirable to realize a configuration that makes it easy to determine the cause of the abnormality.

[0008] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a laser processing device that makes it easy to investigate the cause of any abnormality that occurs.

[0009] A laser processing apparatus according to one aspect of the present invention includes a wafer holding unit that holds a wafer, a laser irradiation unit that processes the wafer held in the wafer holding unit by irradiating it with a laser, a housing that houses the wafer holding unit and the laser irradiation unit, a video image capturing unit that is disposed within the housing and captures video images within the housing, a memory unit that stores the video images captured by the video image capturing unit, and a control unit that, based on the detection of an abnormality within the housing, extracts an abnormality recording video image, which is a video image of a range that includes the time when the abnormality occurred from the video images captured by the video image capturing unit, and stores the extracted video image in the memory unit.

[0010] In one aspect of the present invention, a laser processing apparatus includes a control unit that, upon detection of an abnormality within the housing, extracts an abnormality record video from the video capture unit, which is a video of a range including the time when the abnormality was detected, and stores the video in a memory unit. This allows an operator to confirm not only the current state of the apparatus after the abnormality has occurred, but also the state of the apparatus during the process of the abnormality by reviewing the abnormality record video stored in the memory unit. As a result, the operator can easily determine the cause of the abnormality. Furthermore, the laser processing apparatus is sealed in a housing to prevent leakage of the laser irradiated from the laser irradiation unit. When an abnormality is detected within the housing, the operator can stop laser processing of wafers, open a door on the housing, visually inspect the inside of the laser processing apparatus, obtain information necessary for recovery work, and then perform the necessary recovery work. Therefore, as described above, by storing the video captured by the video capturing unit and the abnormality recording image in the storage unit, the worker can confirm the current situation inside the device after the abnormality has occurred by checking the current video captured by the video capturing unit, and the worker can confirm the situation inside the device during the process of the abnormality occurring by checking the abnormality recording video. This allows the worker to obtain the information necessary for recovery work before opening the door provided on the housing, thereby enabling the necessary recovery work to be carried out efficiently.

[0011] In the laser processing apparatus according to the above aspect, the video capture unit is preferably positioned to capture at least one of a processing video capture area including a processing position where the wafer is processed by the laser and an alignment mark capture area where an alignment mark provided on the wafer is captured to adjust the position of the wafer held by the wafer holder, and a transport video capture area including a transport path along which the wafer is transported before and after processing by the laser. With this configuration, the video capture unit can capture the processing video capture area, thereby storing the video within the processing video capture area in the memory unit. This allows an operator to check the video stored in the memory unit for abnormalities such as an abnormality in the adjustment of the laser irradiation unit when irradiating the laser to the processing position (e.g., adjustment of the height position for focus adjustment) and an abnormality in the wafer holding unit at the alignment mark capture area, thereby easily identifying the cause of an abnormality occurring in the processing video capture area. Furthermore, the video capture unit can capture the transport video capture area, thereby storing the video within the transport video capture area in the memory unit. This allows the operator to check the video images stored in the memory unit to identify abnormalities such as the wafer falling as it is being transported along the transport path, making it easy to determine the cause of any abnormalities that occur within the transport video imaging area.

[0012] In this case, preferably, the moving image capturing unit includes a laser processing moving image capturing unit arranged at a position where it can capture the processing moving image capturing area, and a transport moving image capturing unit arranged at a position where it can capture the transport moving image capturing area. With this configuration, the laser processing moving image capturing unit can store the moving images in the processing moving image capturing area in the memory unit, and the transport moving image capturing unit can store the moving images in the transport moving image capturing area in the memory unit. Therefore, the worker can check the conditions in both the processing moving image capturing area and the transport moving image capturing area by checking the moving images stored in the memory unit, without having to directly check the inside of the device with his or her eyes.

[0013] In the laser processing apparatus having a video image capturing unit including the laser processing video image capturing unit and the transport video image capturing unit, preferably, the apparatus further includes a wafer transport mechanism unit that transports the wafer before processing to the wafer holding unit and transports the processed wafer from the wafer holding unit, the transport video image capturing unit is disposed at a position where it can capture video images of the wafer transport mechanism unit within the transport video image capturing area, and the control unit is configured to extract an abnormality record video from the transport video image capturing area and store it in the memory unit based on detection of an abnormality during wafer transport. With this configuration, by checking the abnormality record video stored in the memory unit, an operator can confirm abnormalities such as abnormalities in the wafer holding by the wafer transport mechanism unit and abnormalities when the wafer transport mechanism unit transfers the wafer to the wafer holding unit along the transport path, thereby facilitating investigation of the cause of the abnormality caused by the transport operation of the wafer transport mechanism unit.

[0014] The laser processing apparatus equipped with the wafer transport mechanism preferably further includes a wafer storage unit provided with an opening / closing door for opening and closing a wafer entrance for removing wafers before processing and storing wafers after processing, and the transport video imaging unit is disposed in a position within the transport video imaging area where it can capture video images of the wafer entrance and the wafer transport mechanism at the wafer transfer position between the wafer holding unit and the wafer transport mechanism. With this configuration, by checking the abnormality recorded video images stored in the memory unit, the operator can confirm the opening and closing of the opening / closing door, and the transfer of the wafer from the wafer transport mechanism to the wafer holding unit at the wafer transfer position, and the transfer of the wafer from the wafer holding unit to the wafer transport mechanism. This makes it possible to check for abnormalities including improper opening and closing of the opening and closing door, improper operation of the wafer holding part when transferring the wafer from the wafer transfer mechanism part to the wafer holding part at the wafer transfer position, and improper holding of the wafer by the wafer transfer mechanism part when transferring the wafer from the wafer holding part to the wafer transfer mechanism part, thereby making it easy to determine the cause of abnormalities caused by the operation of the opening and closing door, wafer transfer mechanism part, and wafer holding part.

[0015] In the laser processing apparatus having the wafer storage unit, preferably, the wafer transport mechanism includes an intermediate placement unit on which unprocessed wafers are temporarily placed before being transported from the wafer storage unit to the wafer holding unit and on which processed wafers are temporarily placed before being stored in the wafer storage unit from the wafer holding unit, and the transport video imaging unit is disposed in a position within the transport video imaging area where it can capture video images of the wafer entrance / exit, the intermediate placement unit, and the wafer transfer position of the wafer transport mechanism. With this configuration, in addition to video images of the operation of the door and the wafer transport mechanism, video images captured by the transport video imaging unit of the operation of the intermediate placement unit can be stored in the memory. As a result, by checking the video images stored in the memory, an operator can check for abnormalities related to the intermediate placement unit in addition to abnormalities caused by the operation of the door, the wafer transport mechanism, and the wafer holding unit.

[0016] In the laser processing apparatus including the wafer transport mechanism including the intermediate mount portion, preferably, a plurality of transport video imaging units are arranged, and the plurality of transport video imaging units include a first transport video imaging unit arranged at a position on the inner surface of the housing on the wafer accommodating unit side where the wafer entrance and the intermediate mount portion can be imaged, a second transport video imaging unit arranged at a position on the inner surface of the housing on the wafer accommodating unit side where the intermediate mount portion and the wafer transfer position can be imaged, and a third transport video imaging unit arranged at a position on the inner surface of the housing on the opposite side from the wafer accommodating unit side in the direction in which the wafer accommodating unit and the intermediate mount portion are aligned where the intermediate mount portion and the wafer transfer position can be imaged. With this configuration, even when the first transport video imaging unit cannot image the entire intermediate mount portion because it images the wafer entrance and therefore the second transport video imaging unit and the third transport video imaging unit can image the intermediate mount portion, so that the first transport video imaging unit, the second transport video imaging unit, and the third transport video imaging unit can complement each other to image the entire intermediate mount portion. In addition, since the first transport video imaging unit, the second transport video imaging unit, and the third transport video imaging unit can complement each other in the same way in areas other than the intermediate placement section, the entire transport video imaging area can be imaged by having them complement each other.

[0017] In the laser processing apparatus equipped with the wafer transport mechanism including the intermediate placement unit, preferably, the wafer transport mechanism further includes a transport unit that transports the wafer from the wafer accommodation unit to the intermediate placement unit and stores the wafer from the intermediate placement unit to the wafer accommodation unit, and the transport video image capturing unit is disposed in the transport unit at a position within the transport video image capturing area where it can capture images of the wafer entrance / exit, the intermediate placement unit, and the wafer transfer position. With this configuration, the transport video image capturing unit also moves integrally with the transport unit as it is transported, so that the transport video image capturing unit can capture images of the wafer transport to the wafer entrance / exit, the intermediate placement unit, and the wafer transfer position while moving together with the wafer being transported by the transport unit.

[0018] In the laser processing apparatus equipped with a video image capturing unit including the laser processing video image capturing unit and the transport video image capturing unit, the control unit is preferably configured to extract an abnormality recording video image from the processing video image capturing area and store it in the memory unit based on the detection of an abnormality during wafer processing. With this configuration, the operator can check the abnormality recording video image stored in the memory unit for the range including the time when the abnormality occurred in the processing video image capturing area, thereby confirming the status within the apparatus during the process of the abnormality occurring. As a result, the operator can easily investigate the cause of the abnormality in the processing video image capturing area.

[0019] In the laser processing apparatus having a moving image capturing unit including the laser processing moving image capturing unit and the transport moving image capturing unit, preferably, the memory unit stores normal images including an image showing the normal state of the processing moving image capturing area and an image showing the normal state of the transport moving image capturing area, and the control unit is configured to control detection of abnormalities in each of the processing moving image capturing area and the transport moving image capturing area within the housing based on a comparison of images at predetermined operation timings in the moving images captured by each of the laser processing moving image capturing unit and the transport moving image capturing unit with normal images corresponding to the predetermined operation timings. This configuration allows the control unit to detect abnormalities in each of the processing moving image capturing area and the transport moving image capturing area within the housing based on the moving images captured by each of the laser processing moving image capturing unit and the transport moving image capturing unit, thereby more reliably detecting abnormalities than when detecting abnormalities using sensors alone. Furthermore, by detecting abnormalities based on the moving images by the control unit, abnormalities in each of the processing moving image capturing area and the transport moving image capturing area within the housing can be detected regardless of the operator's level of skill.

[0020] In this case, the control unit is preferably configured to control adding, to the storage unit, as a normal image, an image at a predetermined operation timing in which an abnormality has been detected, which image has been registered as an image in a normal state. With this configuration, by registering an image in which an abnormality has been detected as a normal image, it is possible to suppress erroneous detection of an abnormality by the control unit, thereby suppressing the issuance of a false alarm due to erroneous detection and suppressing the oversight of detection of an abnormality for which an alarm should be issued.

[0021] In the laser processing apparatus according to the above aspect, the control unit is preferably configured to perform control to detect an abnormality inside the housing based on the moving image captured by the moving image capturing unit after the laser processing apparatus has been started and before the start of wafer processing. With this configuration, the control unit can detect an abnormality inside the housing after the laser processing apparatus has been started and before the start of wafer processing, even without the operator having to directly visually check the inside of the laser processing apparatus, thereby reducing the workload on the operator.

[0022] In the laser processing apparatus equipped with a moving image capturing unit including the laser processing moving image capturing unit and the transport moving image capturing unit, the control unit is preferably configured to perform control to detect abnormalities within the housing based on the moving images captured by each of the laser processing moving image capturing unit and the transport moving image capturing unit in parallel with at least one of wafer processing by the laser and wafer transport. With this configuration, control to detect abnormalities within the housing based on the moving images can be efficiently performed.

[0023] In the laser processing apparatus having a moving image capturing unit including the laser processing moving image capturing unit and the transport moving image capturing unit, preferably, a still image capturing unit is further provided that captures a still image of the wafer held in the wafer holder during laser processing of the wafer, and the control unit is configured to control extraction of an abnormal recorded moving image of the processing moving image capturing area captured by the laser processing moving image capturing unit and storage in the memory unit based on detection of an abnormality based on the still image of the wafer captured by the still image capturing unit. With this configuration, the operator can check not only the still image of the wafer but also the abnormal recorded moving image, so that the operator can investigate the cause of the abnormality during laser processing of the wafer using both information visually confirmable from the still image of the wafer and information visually confirmable from the abnormal recorded moving image.

[0024] The laser processing apparatus according to the above aspect preferably further includes a display unit, and the control unit is configured to determine whether or not an operator needs to open a door provided on the housing to check based on the type of abnormality inside the housing, and to control the display unit to display the determination result. With this configuration, the operator can tell whether or not they need to open the door and check inside the apparatus just by looking at the determination result, thereby improving convenience for the operator.

[0025] According to the present invention, as described above, the cause of an abnormality that has occurred can be easily investigated.

[0026] 1 is a perspective view of a laser processing apparatus according to a first embodiment; FIG. 2 is a plan view of the laser processing apparatus according to the first embodiment; FIG. 3 is a plan view of a wafer before laser processing is performed in the laser processing apparatus according to the first embodiment; FIG. 4 is a plan view schematically showing an imaging range of a moving image imaging unit of the laser processing apparatus according to the first embodiment; FIG. 5 is an image view showing a laser processing moving image captured by the laser processing moving image imaging unit of the laser processing apparatus according to the first embodiment; FIG. 6 is an image view showing a first transfer moving image captured by a first transfer moving image imaging unit of the laser processing apparatus according to the first embodiment; FIG. 7 is an image view showing a second transfer moving image captured by a second transfer moving image imaging unit of the laser processing apparatus according to the first embodiment; FIG. 8 is an image view showing a third transfer moving image captured by a third transfer moving image imaging unit of the laser processing apparatus according to the first embodiment; FIG. 9 is a block diagram showing a control configuration of the laser processing apparatus according to the first embodiment; FIG. 10 is a plan view for explaining supply of wafer ring structures of the laser processing apparatus according to the first embodiment; FIG. 11 is a plan view for explaining replacement of wafer ring structures of the laser processing apparatus according to the second embodiment; FIG. 12 is an image view showing a first transfer moving image in a normal state captured by the first transfer moving image imaging unit of the laser processing apparatus according to the first embodiment; FIG. 1 is an image diagram of a state in which an abnormality in the opening and closing of an inner door is detected based on a first transfer moving image captured by a first transfer moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 2 is an image diagram of a state in which a wafer drop is detected based on a first transfer moving image captured by a first transfer moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 3 is an image diagram of a state in which a third transfer moving image in a normal state captured by a third transfer moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 4 is an image diagram of a state in which a wafer suction failure of a transfer head is detected based on a third transfer moving image captured by a third transfer moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 5 is an image diagram of a state in which a movement failure of a rail portion is detected based on a third transfer moving image captured by a third transfer moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 6 is an image diagram of a state in which a holding failure of a chuck table portion is detected based on a third transfer moving image captured by a third transfer moving image capturing unit of the laser processing apparatus according to the first embodiment.FIG. 1 is an image diagram showing a state in which a sensor cannot detect holding in the chuck table unit of the laser processing apparatus according to the first embodiment. FIG. 1 is an image diagram showing a laser processing moving image in a normal state captured by the laser processing moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 2 is an image diagram showing a state in which poor height adjustment of the laser irradiation unit is detected based on laser processing moving images captured by the laser processing moving image capturing unit of the laser processing apparatus according to the first embodiment. FIG. 3 is an image diagram showing a state in which poor holding in the chuck table unit is detected based on the imaging results of the alignment marks of the laser processing apparatus according to the first embodiment. FIG. 4 is an image diagram displayed on the display unit when poor holding in the chuck table unit of the laser processing apparatus according to the first embodiment is detected. FIG. 5 is an image diagram showing a state in which an abnormality in which a rag is present on the rail unit is detected based on the second transport moving image captured by the second transport moving image capturing unit at the time of startup of the laser processing apparatus according to the first embodiment. 1 is an image diagram of a state in which an abnormality in which a wafer is present on a base is detected based on a second transfer moving image captured by a second transfer moving image capturing unit at the time of startup of the laser processing apparatus according to the first embodiment. FIG. 2 is an image diagram displayed on a display unit when an additional normal image is registered in the laser processing apparatus according to the first embodiment. FIG. 3 is a flowchart showing an abnormality recording process performed in a control unit of the laser processing apparatus according to the first embodiment. FIG. 4 is a plan view schematically showing an imaging range of a moving image capturing unit of a laser processing apparatus according to a second embodiment. FIG. 5 is an image diagram showing a transfer moving image captured by a transfer moving image capturing unit of a laser processing apparatus according to the second embodiment. FIG. 6 is a plan view schematically showing an imaging range of a moving image capturing unit of a laser processing apparatus according to a third embodiment. FIG. 7 is a perspective view in which a first transfer moving image capturing unit and a second transfer moving image capturing unit of a laser processing apparatus according to a third embodiment are arranged in a clamp hand unit. FIG. 8 is an image diagram showing a transfer moving image captured by a first transfer moving image capturing unit and a second transfer moving image capturing unit of a laser processing apparatus according to a third embodiment.

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0028] First Embodiment The configuration of a laser processing apparatus 100 according to a first embodiment of the present invention will be described with reference to FIGS.

[0029] (Configuration of Laser Processing Apparatus) As shown in FIGS. 1 and 2, the laser processing apparatus 100 is configured to perform processing to form a modified layer inside the wafer We for dividing the wafer We.

[0030] The laser processing apparatus 100 includes a base 1, a housing 2, a cassette unit 3, a wafer transport unit 4, a dicing unit 5, a video image capturing unit 6, a control unit 7, and a display unit 8. The cassette unit 3 is an example of a "wafer storage unit" in the claims. The wafer transport unit 4 is an example of a "wafer transport mechanism" in the claims.

[0031] Here, the up-down direction is the Z direction, the up direction is the Z1 direction, and the down direction is the Z2 direction. The horizontal direction perpendicular to the Z direction is the X direction, one side of the X direction is the X1 direction, and the other side of the X direction is the X2 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The Y direction is an example of "the direction in which the wafer accommodation section and the intermediate placement section are aligned" in the claims.

[0032] The base 1 is a platform on which the wafer transfer unit 4, the dicing unit 5 and the control unit 7 are attached.

[0033] The housing 2 is configured to house the base 1, the cassette unit 3, and the video image capturing unit 6 in a sealed state. The housing 2 includes a door 21 and a door 22. The housing 2 does not have a window for viewing the inside.

[0034] Door 21 is provided on the side surface on the Y1 direction side of housing 2. Door 21 is a maintenance door that is opened and closed when an operator Op works inside laser processing apparatus 100. Door 22 is provided on the side surface on the Y2 direction side of housing 2 that faces dicing unit 5 in the Y direction. Door 22 is an inspection door that is opened and closed when an operator Op checks the inside of laser processing apparatus 100 and works inside.

[0035] The cassette unit 3 is configured to accommodate a plurality of cassettes each containing a wafer ring structure W, each of which includes a wafer We attached to a sheet member Wt and a frame Wf. The frame Wf is annular. The wafer We is disposed inside the annular frame Wf.

[0036] 1 and 2, the cassette unit 3 includes a plurality of cassette placement units 31, a Z-direction movement mechanism 32, an inner door 33, and an outer door 34. The inner door 33 is an example of the "openable / closable door" in the claims.

[0037] The multiple cassette mounting units 31 include one cassette mounting unit (not shown) and another cassette mounting unit (not shown). A cassette containing a plurality of unprocessed wafers We is mounted on one cassette mounting unit. The other cassette mounting units are configured to move a plurality of processed wafers We together in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 32 includes, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0038] 1 , the inner door 33 is configured to open and close a wafer entrance 33a for removing wafers We before processing and storing wafers We after processing. The inner door 33 is configured to open when the wafer transfer unit 4 removes and stores wafers We. The inner door 33 is provided on the inner wall of the housing 2 on the laser irradiation unit 51 side of the cassette unit 3.

[0039] (Outer Door) The outer door 34 is a door that is opened and closed when the operator Op places unprocessed wafers We in the cassette unit 3 and when the operator Op takes out processed wafers We from the cassette unit 3. The outer door 34 is provided on the outer wall of the housing 2 on the opposite side of the cassette unit 3 from the laser irradiation unit 51 side.

[0040] 2, the wafer transfer unit 4 is configured to transfer the wafer ring structure W between the cassette unit 3 and the dicing unit 5. That is, the wafer transfer unit 4 is configured to transfer the unprocessed wafer We to a chuck table unit 55 (described later) of the dicing unit 5, and to transfer the processed wafer We from the chuck table unit 55. The chuck table unit 55 is an example of a "wafer holding unit" in the claims.

[0041] Specifically, the wafer transport unit 4 has a clamp hand unit 41, a Y-direction movement mechanism 42, rail units 43 and 44, a transfer head 45 and a transfer head 46, and a Z-direction movement mechanism 47. Each of the rail units 43 and 44 is an example of the "intermediate placement unit" in the claims.

[0042] (Clamp Hand Unit) The clamp hand unit 41 is configured to clamp the frame Wf of the wafer ring structure W and remove it from the cassette unit 3 or store it in the cassette unit 3. The clamp hand unit 41 is moved in each of the Y1 direction and the Y2 direction by a Y-direction movement mechanism 42. The Y-direction movement mechanism 42 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0043] The clamp hand unit 41 is configured to transport the wafer We from the cassette unit 3 to each of the rail units 43 and 44, and to store the wafer We from each of the rail units 43 and 44 into the cassette unit 3. That is, the clamp hand unit 41 uses the Y-direction movement mechanism 42 to transport the wafer ring structure W removed from the cassette unit 3 to each of the rail units 43 and 44. The clamp hand unit 41 uses the Y-direction movement mechanism 42 to store the processed wafer ring structure W placed on each of the rail units 43 and 44 into the cassette unit 3.

[0044] (Rail section) Each of the rail sections 43 and 44 is configured to temporarily place an unprocessed wafer We before it is transported from the cassette section 3 to the chuck table section 55 described later, and to temporarily place a processed wafer We before it is stored from the chuck table section 55 into the cassette section 3.

[0045] The rail portion 43 is configured to support the unprocessed wafer ring structure W placed by the clamp hand portion 41 from the Z2 direction side. The rail portion 43 is configured to support the processed wafer ring structure W placed by the transfer head 45 from the Z2 direction side. The rail portion 44 is configured to support the wafer ring structure W placed by the clamp hand portion 41 from the Z2 direction side. The rail portion 43 is configured to support the processed wafer ring structure W placed by the transfer head 46 from the Z2 direction side. The rail portion 43 and the rail portion 44 are arranged side by side in this order from the Y2 direction side toward the Y1 direction side.

[0046] (Transfer Head) Each of the transfer heads 45 and 46 is configured to suck the frame Wf of the wafer ring structure W. Each of the transfer heads 45 and 46 is provided with a suction unit having suction holes or the like for sucking the frame Wf of the wafer ring structure W. The Z-direction movement mechanism 47 is configured to move each of the transfer heads 45 and 46 independently in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 47 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0047] Here, the path along which the wafer transfer unit 4 transfers the wafer We before and after processing by the laser Ld is the transfer path Rm (see FIG. 4 ). That is, the transfer path Rm includes a path along which the unprocessed wafer We in the cassette unit 3 is pulled out by the clamp hand unit 41 and placed on the rail unit 43 (rail unit 44), and then transferred to the chuck table unit 55 by the transfer head 45 (transfer head 46). The transfer path Rm also includes a path along which the processed wafer We is transferred from the chuck table unit 55 to the rail unit 43 (rail unit 44) by the transfer head 45 (transfer head 46), and then stored into the cassette unit 3 by the clamp hand unit 41.

[0048] 2, the dicing section 5 includes a laser irradiation section 51, a Z-direction moving section 52, a Y-direction moving section 53, an X-direction moving section 54, a chuck table section 55, a low-magnification imaging section 56, a high-magnification imaging section 57, a Z-direction moving mechanism 58, and a frame 59. Each of the low-magnification imaging section 56 and the high-magnification imaging section 57 is an example of the "still image capturing section" in the claims.

[0049] (Laser Irradiation Unit) The laser irradiation unit 51 is configured to irradiate a laser beam Ld to process the wafer We held on the chuck table unit 55. That is, the laser irradiation unit 51 is configured to form a modified layer inside the wafer We by irradiating the laser beam Ld onto the wafer We on which a plurality of semiconductor chips Ch are provided.

[0050] The laser irradiation unit 51 is configured to irradiate the wafer We with the laser Ld along each of a plurality of streets Ws (see FIG. 3) on the wafer We while moving the wafer We relatively to the laser irradiation unit 51 by the chuck table unit 55. Here, the focal position of the laser Ld irradiated from the laser irradiation unit 51 on each of the plurality of streets Ws on the wafer We is the processing position PL (see FIG. 4) on the wafer We. In this way, the processing position PL is the position where the wafer We is processed by the laser Ld.

[0051] The laser irradiation unit 51 is attached to a frame 59 via a Z-direction moving unit 52. The laser irradiation unit 51 is movable in the Z1 and Z2 directions by the Z-direction moving unit 52, but its horizontal position is fixed. The Z-direction moving unit 52 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0052] (Y-Direction Movement Unit) The Y-direction movement unit 53 is configured to move the X-direction movement unit 54 and the chuck table unit 55 in the Y1 and Y2 directions, respectively. The Y-direction movement unit 53 is attached to the base 1. The Y-direction movement unit 53 has a drive unit that generates a drive force to move the X-direction movement unit 54 in the Y1 and Y2 directions. The drive unit has, for example, a linear conveyor module or a motor with a ball screw and an encoder.

[0053] (X-Direction Movement Unit) The X-direction movement unit 54 is configured to move the chuck table unit 55 in each of the X1 and X2 directions. The X-direction movement unit 54 is attached to the Y-direction movement unit 53. As a result, the X-direction movement unit 54 moves in the Y1 and Y2 directions by the Y-direction movement unit 53. The X-direction movement unit 54 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0054] (Chuck Table) The chuck table 55 is configured to hold the wafer We attached to the sheet member Wt by suction. The chuck table 55 is configured to rotate about a rotation axis along the vertical direction. This allows the chuck table 55 to rotate while suctioning the frame Wf. The chuck table 55 is also configured to be movable in the horizontal direction by the Y-direction moving unit 53 and the X-direction moving unit 54.

[0055] (Low-magnification imaging unit and high-magnification imaging unit) Each of the low-magnification imaging unit 56 and the high-magnification imaging unit 57 is configured to capture an image of the wafer We held on the chuck table 55. That is, each of the low-magnification imaging unit 56 and the high-magnification imaging unit 57 is configured to capture a still image Im (see FIGS. 22 and 23 ) of the wafer We held on the chuck table 55 when the wafer We is processed by the laser Ld. Each of the low-magnification imaging unit 56 and the high-magnification imaging unit 57 is a near-infrared imaging camera. Each of the low-magnification imaging unit 56 and the high-magnification imaging unit 57 is attached to a frame 59 via a Z-direction movement mechanism 58.

[0056] Each of the low-magnification imaging unit 56 and the high-magnification imaging unit 57 is configured to capture an image of an alignment mark AL (see FIG. 3) provided on the wafer We in order to adjust the position of the wafer We held on the chuck table unit 55. Here, as shown in FIG. 4, an alignment mark imaging position Pa1 at which the alignment mark AL on the wafer We is captured is the focal position of the low-magnification imaging unit 56 when the alignment mark AL on the wafer We is captured by the low-magnification imaging unit 56. Also, an alignment mark imaging position Pa2 at which the alignment mark AL on the wafer We is captured is the focal position of the high-magnification imaging unit 57 when the alignment mark AL on the wafer We is captured by the high-magnification imaging unit 57.

[0057] The Z-direction moving mechanism 58 is configured to integrally move the low-magnification imaging unit 56 and the high-magnification imaging unit 57 in the Z1 direction and the Z2 direction, respectively. The Z-direction moving mechanism 58 has, for example, a linear conveyor module or a drive unit having a ball screw and a motor with an encoder.

[0058] 4, the moving image capturing unit 6 is configured to capture moving images within the housing 2 in order to monitor the transport of the wafer We by the wafer transport unit 4 and the processing of the wafer We by the dicing unit 5. A plurality of moving image capturing units 6 are arranged within the housing 2. Here, the processing moving image capturing area ArL and the transport moving image capturing area ArM within the housing 2 are captured by mutually complementing the imaging field ranges of the plurality of moving image capturing units 6.

[0059] The processing moving image capturing area ArL is an area that includes a processing position PL where the wafer We is processed by the laser Ld, and alignment mark capturing positions Pa1 and Pa2 where images of the alignment marks AL provided on the wafer We held on the chuck table 55 are captured. The processing moving image capturing area ArL includes the upper surface of the base 1 on the X2 direction side, the laser irradiation unit 51, the Z-direction moving unit 52, the Y-direction moving unit 53, the X-direction moving unit 54, the chuck table 55, the low-magnification imaging unit 56, the high-magnification imaging unit 57, the Z-direction moving mechanism 58, and the frame 59.

[0060] The transfer moving image capturing area ArM is an area including the transfer path Rm along which the wafer We is transferred before and after processing by the laser Ld. The transfer moving image capturing area ArM includes the upper surface of the base 1 on the X1 direction side, the cassette unit 3, the clamp hand unit 41, the Y-direction moving mechanism 42, the rail unit 43, the rail unit 44, the transfer head 45, the transfer head 46, and the Z-direction moving mechanism 47.

[0061] In Figure 4, for the sake of convenience of explanation, the processing video imaging area ArL and the transport video imaging area ArM are arranged so that they are separately adjacent to each other in the X direction when viewed from the Z1 direction side, but the processing video imaging area ArL and the transport video imaging area ArM may also be arranged so that they overlap partially in the X direction when viewed from the Z1 direction side.

[0062] The plurality of moving image capturing units 6 include a laser processing moving image capturing unit 61, a first conveyance moving image capturing unit 62, a second conveyance moving image capturing unit 63, and a third conveyance moving image capturing unit 64. Each of the first conveyance moving image capturing unit 62, the second conveyance moving image capturing unit 63, and the third conveyance moving image capturing unit 64 is an example of a "conveyance moving image capturing unit" in the claims.

[0063] <Laser processing video image capturing unit> As shown in Fig. 4, the laser processing video image capturing unit 61 is configured with an infrared camera. The laser processing video image capturing unit 61 is configured with a fixed camera. The laser processing video image capturing unit 61 has an illumination unit 61a (see Fig. 9) that emits infrared light. The laser processing video image capturing unit 61 is disposed in a position where it can capture an image of the processing video image capturing area ArL. The laser processing video image capturing unit 61 is attached to a corner between the inner surface on the X2 direction side and the inner surface on the Y2 direction side of the housing 2.

[0064] The laser processing video capture unit 61 is attached to a corner and captures a video (the laser processing video MoL in FIG. 5 ) of a portion of the imaging field of view (shown by hatching in FIG. 4 as an example) in the processing video capture area ArL. As shown in FIG. 5 , the laser processing video capture unit 61 captures the laser processing video MoL, which includes the upper surface of the base 1 on the X2 direction side, the laser irradiation unit 51, the Z-direction moving unit 52, the Y-direction moving unit 53, the X-direction moving unit 54, the chuck table 55, the low-magnification imaging unit 56, the high-magnification imaging unit 57, the Z-direction moving mechanism 58, and the frame 59. For ease of explanation, the Z-direction moving unit 52 and the high-magnification imaging unit 57 are omitted from the laser processing video MoL in FIG. 5 , but the laser processing video MoL does include the Z-direction moving unit 52 and the high-magnification imaging unit 57.

[0065] <First Transportation Video Capture Unit, Second Transportation Video Capture Unit, and Third Transportation Video Capture Unit> As shown in Fig. 4 , the first transportation video capture unit 62, the second transportation video capture unit 63, and the third transportation video capture unit 64 are each configured with an infrared camera. The first transportation video capture unit 62, the second transportation video capture unit 63, and the third transportation video capture unit 64 are each configured with a fixed camera. The first transportation video capture unit 62, the second transportation video capture unit 63, and the third transportation video capture unit 64 have an illumination unit 62a (see Fig. 9 ), an illumination unit 63a (see Fig. 9 ), and an illumination unit 64a (see Fig. 9 ), respectively, that emit infrared light.

[0066] The first transportation moving image capturing unit 62, the second transportation moving image capturing unit 63, and the third transportation moving image capturing unit 64 are each disposed at a position where they can capture an image of the transportation moving image capturing region ArM.

[0067] <First Transfer Video Capture Unit> The first transfer video capture unit 62 is disposed at a position where it can capture images of the wafer entrance 33a (see FIG. 1), the rails 43, and the rails 44 on the inner surface of the housing 2 on the cassette unit 3 side. The first transfer video capture unit 62 is attached to the inner surface of the housing 2 on the Y2 direction side via an attachment member (not shown).

[0068] The first transfer video imaging unit 62, attached to the inner surface on the Y2 direction side of the housing 2, captures a video image (first transfer video image Mo1 in FIG. 6 ) of a portion of the imaging field of view range (shown by hatching in FIG. 4 as an example) in the processing video imaging area ArL. As shown in FIG. 6 , the first transfer video imaging unit 62 captures the first transfer video image Mo1 that includes the upper surface on the X2 direction side of the base 1, the wafer entrance / exit 33a, the clamp hand unit 41, the rail units 43 and 44, and the transfer head 45. Note that, for convenience of explanation, the Y direction movement mechanism 42 is omitted from the first transfer video image Mo1 in FIG. 6 , but the Y direction movement mechanism 42 is included in the first transfer video image Mo1.

[0069] 4, the second transfer video image capturing unit 63 is disposed at a position on the inner surface of the housing 2 on the cassette unit 3 side where it can capture images of the rails 43, 44 and the wafer We transfer position Pd1 (see FIG. 7). The second transfer video image capturing unit 63 is attached via an attachment member (not shown) to the inner surface of the housing 2 on the X1 direction side. The wafer We transfer position Pd1 is a position where the unprocessed wafer We is transferred from the transfer head 45 to the chuck table 55, and where the processed wafer We is transferred from the chuck table 55 to the transfer head 45.

[0070] The second transport video capturing unit 63, attached to the inner surface of the housing 2 on the X1 direction side, captures a video (second transport video image Mo2 in FIG. 7 ) of a portion of the imaging field of view range (shown by hatching in FIG. 4 as an example) in the processing video capturing area ArL. As shown in FIG. 7 , the second transport video capturing unit 63 captures the second transport video image Mo2, which includes the upper surface of the base 1 on the X1 direction side, the inner surface of the housing 2, the rail portion 43, the transfer head 45, the chuck table portion 55, etc. Note that, for the sake of convenience, the Y-direction movement mechanism 42, the rail portion 44, etc. are omitted from the second transport video image Mo2 in FIG. 7 , but the Y-direction movement mechanism 42, the rail portion 44, etc. are included in the second transport video image Mo2.

[0071] 4, the third transfer video image capturing unit 64 is disposed on the inner surface on the Y2 side of the housing 2 at a position where it can capture images of the rails 44 and a transfer position Pd2 (see FIG. 8) of the wafer We. The third transfer video image capturing unit 64 is attached via an attachment member (not shown) to a corner between the inner surface on the X1 side and the inner surface on the Y1 side of the housing 2. The transfer position Pd2 of the wafer We is a position where the unprocessed wafer We is transferred from the transfer head 46 to the chuck table 55, and where the processed wafer We is transferred from the chuck table 55 to the transfer head 46.

[0072] The third transfer video capturing unit 64 is attached to a corner between the inner surface on the X1 direction side and the inner surface on the Y1 direction side of the housing 2, and captures a video (third transfer video image Mo3 in FIG. 8 ) of a portion of the imaging field of view range (shown by hatching in FIG. 4 as an example) in the processing video capturing area ArL. As shown in FIG. 8 , the third transfer video capturing unit 64 captures the third transfer video image Mo3, which includes the upper surface on the X1 direction side of the base 1, the inner surface of the housing 2, the rail portion 44, the transfer head 46, the chuck table portion 55, and the like. Note that, for convenience of explanation, the Y-direction movement mechanism 42 and the like are omitted from the third transfer video image Mo3 in FIG. 8 , but the Y-direction movement mechanism 42 and the like are actually included in the third transfer video image Mo3.

[0073] 4 , the first transfer video imaging unit 62, the second transfer video imaging unit 63, and the third transfer video imaging unit 64 are each disposed at a position where they can capture a video image of the wafer transfer unit 4 within the transfer video imaging area ArM. That is, the first transfer video imaging unit 62, the second transfer video imaging unit 63, and the third transfer video imaging unit 64 are disposed at a position where they can capture video images (first transfer video image Mo1, second transfer video image Mo2, and third transfer video image Mo3) of the wafer transfer unit 4 at the wafer entrance / exit 33a, the rail portion 43, the rail portion 44, the transfer position Pd1, and the transfer position Pd2 within the transfer video imaging area ArM. As a result, the wafer entrance / exit 33a, rail portion 43, rail portion 44, transfer position Pd1 and transfer position Pd2 within the transport video imaging area ArM are imaged by mutually complementing the imaging field of view ranges of the first transport video imaging unit 62, the second transport video imaging unit 63 and the third transport video imaging unit 64.

[0074] 9 , the control unit 7 controls each of the cassette unit 3, the wafer transport unit 4, and the dicing unit 5 in order to process the wafer We in the laser processing apparatus 100. The control unit 7 also controls the moving image capturing unit 6 in order to monitor the transport of the wafer We by the wafer transport unit 4 and the processing of the wafer We by the dicing unit 5. The control unit 7 is electrically connected to each of the cassette unit 3, the wafer transport unit 4, the dicing unit 5, the laser processing moving image capturing unit 61, the first transport moving image capturing unit 62, the second transport moving image capturing unit 63, and the third transport moving image capturing unit 64.

[0075] Specifically, the control unit 7 includes a CPU (Central Processing Unit), a storage unit 71 having a HDD (Hard Disk Drive) and the like, and a memory having a ROM (Read Only Memory) and a RAM (Random Access Memory) and the like. The storage unit 71 stores a control program for the laser processing apparatus 100, including processing of the wafer We with the laser Ld. The storage unit 71 also stores a laser processing moving image MoL, a first transport moving image Mo1, a second transport moving image Mo2, a third transport moving image Mo3, an abnormal recording moving image Moa, and a normal image Mon. Control by the control unit 7 regarding the abnormal recording moving image Moa and the normal image Mon will be described in detail later.

[0076] (Display Unit) The display unit 8 is configured to be able to display information regarding the transport of the wafer We by the wafer transport unit 4, information regarding the processing of the wafer We by the dicing unit 5, the laser processing moving image MoL, the first transport moving image Mo1, the second transport moving image Mo2, the third transport moving image Mo3, the abnormal recording moving image Moa, the normal image Mon, etc. The display unit 8 is a liquid crystal display or the like.

[0077] (Wafer Processing Control) As shown in FIGS. 10 and 11, in the laser processing device 100, wafer processing control is performed using both the transfer head 45 and the transfer head 46.

[0078] 10(A) and 10(B), the control unit 7 causes the clamp hand unit 41 to transfer the wafer ring structure W1 from the cassette unit 3 to directly below the transfer head 45 on the rail unit 43. As shown in FIG. 10(C), the control unit 7 moves the chuck table unit 55 to directly below the transfer head 45 (wafer ring structure W1). Then, the wafer ring structure W1 held by the transfer head 45 is handed over to the chuck table unit 55 located directly below.

[0079] 10(D), the control unit 7 moves the chuck table 55 holding the wafer ring structure W1 to a processing position PL where the laser irradiation unit 51 performs laser processing on the wafer We1 of the wafer ring structure W1. Then, the control unit 7 performs processing by irradiating the wafer ring structure W1 held on the chuck table 55 with a laser Ld from the laser irradiation unit 51. While processing the wafer ring structure W1, the control unit 7 transfers the wafer ring structure W2 from the cassette unit 3 to directly below the transfer head 45 on the rail unit 43 using the clamp hand unit 41, as shown in FIG.

[0080] As shown in Figure 11, when the laser processing process is completed for the previous wafer ring structure W1, the control unit 7 swaps the wafer ring structure W1 and wafer ring structure W2 held on the chuck table unit 55, and performs laser processing on the next wafer ring structure W2.

[0081] 11(A), the laser processing process is completed for the wafer ring structure W1 held on the chuck table 55. In FIG. 11(B), the control unit 7 moves the chuck table 55 to directly below the transfer head 46. Then, the control unit 7 hands over the wafer ring structure W1 held on the chuck table 55 to the transfer head 46 located directly above. At this time, the control unit 7 retracts the rails 44 to the retracted position.

[0082] In Fig. 11(C), the control unit 7 moves the chuck table 55 to a position directly below the transfer head 45 (wafer ring structure W2). Then, the control unit 7 transfers the wafer ring structure W2 held by the transfer head 45 to the chuck table 55 located directly below. At this time, the control unit 7 retracts the rails 43 to a retracted position. In Fig. 11(D), the control unit 7 moves the chuck table 55 holding the wafer ring structure W2 to a processing position PL where the laser irradiation unit 51 performs laser processing on the wafer We2 of the wafer ring structure W2. Then, the control unit 7 irradiates the wafer ring structure W2 held on the chuck table 55 with a laser beam Ld from the laser irradiation unit 51 to perform processing.

[0083] 11(E), the control unit 7 processes the wafer ring structure W2 while transferring the wafer ring structure W1 from the transfer head 46 onto the rail unit 44. The control unit 7 then transfers the wafer ring structure W1 on the rail unit 44 to the cassette unit 3 using the clamp hand unit 41. Then, in FIG. 11(F), the control unit 7 then transfers the wafer ring structure W3 from the cassette unit 3 to directly below the transfer head 45 on the rail unit 43 using the clamp hand unit 41.

[0084] The control unit 7 repeats the processes of FIGS. 11A to 11F to sequentially perform laser processing on a plurality of wafer ring structures W.

[0085] (Abnormality recording control) As shown in Figures 12 to 23, the control unit 7 of the first embodiment, based on the detection of an abnormality in the housing 2 during the above-mentioned wafer processing control, controls to extract an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality was detected, from the moving images captured by the moving image capturing unit 6, and store it in the memory unit 71.

[0086] (Abnormality in Transfer Moving Image Imaging Region) First, a case where an abnormality is detected in the transfer moving image imaging region ArM shown in FIGS. 12 to 19 will be described.

[0087] Fig. 12 shows a normal first transport moving image Mo1, Fig. 13 shows an abnormality in which the inner door 33 cannot be opened, and Fig. 14 shows an abnormality in which the wafer We falls from the clamp hand unit 41. Fig. 15 shows a normal third transport moving image Mo3, Fig. 16 shows an abnormality in which the transfer head 46 is not properly suctioned, Fig. 17 shows an abnormality in which the rail unit 44 is not sufficiently moved, Fig. 18 shows an abnormality in which the chuck table unit 55 is not properly held, and Fig. 19 shows an abnormality in which the chuck table unit 55 is not properly detected for holding. Note that the above-mentioned abnormalities in the transport moving image imaging region ArM are merely examples, and the abnormalities are not limited to those described above.

[0088] 12, an image of the first transport moving image Mo1 in which the inner door 33 is open is stored as a normal image Mon in the storage unit 71. The normal image Mon includes an image showing the normal state of the processing moving image capturing area ArL and an image showing the normal state of the transport moving image capturing area ArM.

[0089] The control unit 7 performs control to detect an abnormality in the transport video image capturing area ArM in the housing 2 based on a comparison between an image at a predetermined operation timing in the moving images captured by each of the first transport video image capturing unit 62, the second transport video image capturing unit 63, and the third transport video image capturing unit 64 and a normal image Mon corresponding to the predetermined operation timing. Specifically, as shown in Fig. 13 , the control unit 7 performs control to detect an abnormality in which the inner door 33 is not open based on a comparison between an image at the timing when an open signal for the inner door 33 is output in the first transport video image Mo1 captured by the first transport video image capturing unit 62 and a normal image Mon corresponding to the timing when the open signal for the inner door 33 is output.

[0090] At this time, based on the detection of an abnormality during the transfer of the wafer We, the control unit 7 performs control to extract the abnormality recording moving image Moa from the transfer moving image capturing area ArM and store it in the storage unit 71. Based on the detection of an abnormality that the inner door 33 is not open, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range including the time when the abnormality that the inner door 33 is not open occurs and store it in the storage unit 71. In other words, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range spanning from a time before to a time after the time when the abnormality that the inner door 33 is not open is detected and store it in the storage unit 71. At this time, information that the abnormality is that the inner door 33 is not open, the abnormality recording moving image Moa, the time when the abnormality was detected, information that the abnormality recording moving image Moa was captured by the first transfer moving image capturing unit 62, and the like are stored in the storage unit 71 in association with each other.

[0091] <Falling of Wafer> An image of the first transport moving image Mo1 in which the clamp hand unit 41 pulls out the wafer We from the cassette unit 3, as shown in FIG. 14, is stored in the storage unit 71 as a normal image Mon.

[0092] As shown in Figure 14, the control unit 7 performs control to detect an abnormality, such as the wafer We falling from the clamp hand unit 41, based on a comparison of the image in the first transport moving image Mo1 captured by the first transport moving image capturing unit 62 at the time when a signal indicating that the inner door 33 is closed is output with the normal image Mon corresponding to the time when the signal indicating that the inner door 33 is closed is output.

[0093] At this time, based on the detection of the abnormality that the wafer We has fallen from the clamp hand unit 41, the control unit 7 performs control to extract abnormality recording moving images Moa from a range including the time when the abnormality that the wafer We has fallen from the clamp hand unit 41 occurred, and store the extracted abnormality recording moving images Moa in the storage unit 71. That is, the control unit 7 performs control to extract abnormality recording moving images Moa from a range extending from a time before to a time after the time when the abnormality that the wafer We has fallen from the clamp hand unit 41 was detected, and store the extracted abnormality recording moving images Moa in the storage unit 71. At this time, information that the abnormality is the falling of the wafer We, the abnormality recording moving images Moa, the time when the abnormality was detected, information that the abnormality recording moving images Moa were captured by the first transfer moving image capturing unit 62, and the like are stored in the storage unit 71 in association with each other.

[0094] <Adsorption Failure of Second Transfer Head> An image of the third transfer moving image Mo3 shown in FIG. 15 in which the transfer head 46 adsorbs the wafer We is stored in the storage unit 71 as a normal image Mon.

[0095] As shown in Figure 16, the control unit 7 performs control to detect an abnormality, such as poor suction of the wafer We by the transfer head 46, based on a comparison of an image in the third transfer moving image Mo3 captured by the third transfer moving image capturing unit 64 at the time when a signal indicating that the clamp hand unit 41 and the rail unit 44 have moved to the retracted position is output, with a normal image Mon corresponding to the time when a signal indicating that the clamp hand unit 41 and the rail unit 44 have moved to the retracted position is output.

[0096] At this time, based on the detection of the abnormality that the transfer head 46 has failed to suction the wafer We, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range including the time when the abnormality that the transfer head 46 has failed to suction the wafer We, and store it in the storage unit 71. That is, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range extending from a time point before to a time point after the time when the abnormality that the transfer head 46 has failed to suction the wafer We, and store it in the storage unit 71. At this time, information that the abnormality is the failure to suction the wafer We by the transfer head 46, the abnormality recording moving image Moa, the time when the abnormality was detected, information that the abnormality recording moving image Moa was captured by the third transfer moving image capturing unit 64, and the like are stored in the storage unit 71 in association with each other.

[0097] <Insufficient Movement of Rail Portion> An image of the third transport moving image Mo3 in which the rail portion 44 has moved to the retracted position, as shown in FIG. 17, is stored in the storage unit 71 as a normal image Mon.

[0098] As shown in Figure 17, the control unit 7 performs control to detect an abnormality such as insufficient movement of the rail portion 44 based on a comparison of an image taken at the time when a signal indicating that the rail portion 44 has moved to the retracted position is output with a normal image Mon corresponding to the time when a signal indicating that the rail portion 44 has moved to the retracted position is output.

[0099] At this time, based on the detection of the abnormality that is insufficient movement of the rail portion 44, the control unit 7 performs control to extract abnormality recording moving images Moa from a range including the time when the abnormality that is insufficient movement of the rail portion 44 occurred, and store them in the storage unit 71. In other words, the control unit 7 performs control to extract abnormality recording moving images Moa from a range spanning from a time point before to a time point after the time when the abnormality that is insufficient movement of the rail portion 44 was detected, and store them in the storage unit 71. At this time, information that the abnormality is insufficient movement of the rail portion 44, the abnormality recording moving images Moa, the time when the abnormality was detected, information that the abnormality recording moving images Moa were captured by the third transportation moving image capturing unit 64, and the like are stored in the storage unit 71 in association with each other.

[0100] <Malfunction of Holding Chuck Table> The image of the third transfer moving image Mo3 in which the chuck table 55 holds the wafer We, shown in FIG. 18, is stored in the storage unit 71 as a normal image Mon.

[0101] As shown in FIG. 18, the control unit 7 performs control to detect an abnormality, such as a malfunction of the holding operation of the chuck table unit 55, based on a comparison of an image taken at the time when a signal to hold the wafer We is output by the chuck table unit 55 with a normal image Mon corresponding to the time when a signal to hold the wafer We is output by the chuck table unit 55.

[0102] At this time, based on the detection of the abnormality, that is, the malfunction of the holding of the chuck table 55, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range including the time when the abnormality, that is, the malfunction of the holding of the chuck table 55, and store it in the storage unit 71. In other words, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range spanning from a time point before to a time point after the time when the abnormality, that is, the malfunction of the holding of the chuck table 55, and store it in the storage unit 71. At this time, information that the abnormality is the malfunction of the holding of the chuck table 55, the abnormality recording moving image Moa, the time when the abnormality was detected, information that the abnormality recording moving image Moa was captured by the third transport moving image capturing unit 64, and the like are stored in the storage unit 71 in association with each other.

[0103] 19 , when a signal to cause the chuck table 55 to hold the wafer We is output, the control unit 7, based on the fact that the sensor was unable to detect that the chuck table 55 was holding the wafer We, performs control to extract an abnormality recording moving image Moa covering a range including the time when the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality, i.e., the detection of the abnormality recording moving image Moa, the time when the abnormality was detected, the information that the abnormality recording moving image Moa was captured by the third transfer moving image capturing unit 64, information about the sensor that detected the abnormality, and the like, are stored in the storage unit 71 in association with each other.

[0104] (Abnormality in Processed Moving Image Capture Area) Next, a case where an abnormality is detected in the processed moving image capture area ArL shown in FIGS. 20 to 23 will be described.

[0105] Fig. 20 shows a normal laser processing moving image MoL, Fig. 21 shows an abnormality in which the height position of the laser irradiation unit 51 is not adjusted, Fig. 22 shows an abnormality in which the chuck table unit 55 is not properly held, and Fig. 23 shows an abnormality in which the wafer We held on the chuck table unit 55 is misaligned. Note that abnormalities in the processing moving image capturing area ArL are not limited to the abnormalities described above.

[0106] <Abnormality in Height Position Adjustment> An image of the laser processing moving image MoL shown in FIG. 21 in which the height position of the laser irradiation unit 51 has been adjusted is stored in the storage unit 71 as a normal image Mon.

[0107] The control unit 7 performs control to detect an abnormality in the processing moving image capturing area ArL in the housing 2 based on a comparison between an image at a predetermined operation timing in the moving image captured by the laser processing moving image capturing unit 61 and a normal image Mon corresponding to the predetermined operation timing. Specifically, as shown in Fig. 20 , the control unit 7 performs control to detect an abnormality in which the height position of the laser irradiation unit 51 is not adjusted based on a comparison between an image captured by the laser processing moving image capturing unit 61 at the timing when a signal indicating completion of movement in the Z1 direction (or Z2 direction) for adjusting the height position of the laser irradiation unit 51 is output and a normal image Mon corresponding to the timing when the signal indicating completion of movement is output.

[0108] At this time, based on the detection of an abnormality during processing of the wafer We, the control unit 7 controls to extract the abnormality recorded moving image Moa from the processing moving image capturing area ArL and store it in the storage unit 71. Based on the detection of an abnormality that the height position of the laser irradiation unit 51 is not adjusted, the control unit 7 controls to extract the abnormality recorded moving image Moa from a range including the time when the abnormality that the height position of the laser irradiation unit 51 is not adjusted occurs and store it in the storage unit 71. That is, the control unit 7 controls to extract the abnormality recorded moving image Moa from a range spanning from a time before to a time after the time when the abnormality that the height position of the laser irradiation unit 51 is not adjusted is detected and store it in the storage unit 71. At this time, information that the abnormality is an abnormality that the height position of the laser irradiation unit 51 is not adjusted, the abnormality recorded moving image Moa, the time when the abnormality was detected, and information that the abnormality recorded moving image Moa was captured by the laser processing moving image capturing unit 61 are stored in association with each other in the storage unit 71.

[0109] <Malfunction in holding the chuck table portion> As shown in Figure 22, based on detecting an abnormality based on the still image Im of the wafer We captured by the low-magnification imaging unit 56 (or the high-magnification imaging unit 57), the control unit 7 controls to extract an abnormal recorded moving image Moa of the processing moving image imaging area ArL captured by the laser processing moving image imaging unit 61 and store it in the memory unit 71.

[0110] Specifically, the control unit 7 performs control to detect misalignment of the wafer We held on the chuck table unit 55 based on a comparison between a still image Im of the alignment mark AL of the wafer We held on the chuck table unit 55 by the low-magnification imaging unit 56 and a normal image Imn of the alignment mark AL. Based on the detection of the misalignment of the wafer We, the control unit 7 performs control to extract abnormal recorded moving images Moa from a range including the time when the abnormality, i.e., the detection of the misalignment of the wafer We, occurs, and stores the extracted moving images in the storage unit 71. In other words, the control unit 7 performs control to extract abnormal recorded moving images Moa from a range spanning from a time before to a time after the time when the abnormality, i.e., the detection of the misalignment of the wafer We, occurs, and stores the extracted moving images in the storage unit 71.

[0111] The control unit 7 then performs control to determine whether or not there is a malfunction in the holding of the chuck table unit 55, based on the extracted abnormality recording moving image Moa. In Fig. 19, one of the clampers of the chuck table unit 55 is not moving. This causes the control unit 7 to perform control to determine that there is a malfunction in the holding of the chuck table unit 55. At this time, information that the abnormality is a malfunction in the holding of the chuck table unit 55, the abnormality recording moving image Moa, the time when the abnormality was detected, information that the abnormality recording moving image Moa was captured by the laser processing moving image capturing unit 61, information that the abnormality was detected using the low-magnification capturing unit 56, and the like are stored in the storage unit 71 in association with each other.

[0112] In addition, the determination that the holding operation of the chuck table portion 55 is malfunctioning may be made by the worker Op who sees the abnormal recorded moving image Moa, and the determination result may be acquired by the control portion 7 by performing an operation to input the determination result.

[0113] (Wafer position misalignment) Furthermore, as shown in FIG. 23 , based on detecting an abnormality based on the still image Im of the wafer We captured by the low-magnification imaging unit 56 (or the high-magnification imaging unit 57), the control unit 7 controls to extract the abnormal recorded moving image Moa of the processing moving image imaging area ArL captured by the laser processing moving image imaging unit 61 and store it in the memory unit 71.

[0114] Specifically, the control unit 7 performs control to detect misalignment of the wafer We held on the chuck table unit 55 based on a comparison between a still image Im of the alignment mark AL of the wafer We held on the chuck table unit 55 by the low-magnification imaging unit 56 and a normal image Imn of the alignment mark AL. Based on the detection of the misalignment of the wafer We, the control unit 7 performs control to extract abnormal recorded moving images Moa from a range including the time when the abnormality, i.e., the detection of the misalignment of the wafer We, occurs, and stores the extracted moving images in the storage unit 71. In other words, the control unit 7 performs control to extract abnormal recorded moving images Moa from a range spanning from a time before to a time after the time when the abnormality, i.e., the detection of the misalignment of the wafer We, occurs, and stores the extracted moving images in the storage unit 71.

[0115] The control unit 7 then performs control to determine whether or not there is a malfunction in the holding of the chuck table unit 55, based on the extracted abnormality recording moving image Moa. In Fig. 20, holding by the chuck table unit 55 is being performed normally. As a result, the control unit 7 performs control to determine that the holding operation of the chuck table unit 55 is normal. At this time, information that the abnormality is not a malfunction in the holding of the chuck table unit 55, the abnormality recording moving image Moa, the time when the abnormality was detected, information that the abnormality recording moving image Moa was captured by the laser processing moving image capturing unit 61, information that the abnormality was detected using the low-magnification capturing unit 56, and the like are stored in the storage unit 71 in association with each other.

[0116] The abnormality recording control as described above is performed in parallel with at least one of the processing of the wafer We by the laser Ld and the transport of the wafer We. That is, in parallel with at least one of the processing of the wafer We by the laser Ld and the transport of the wafer We, the control unit 7 performs control to detect an abnormality within the housing 2 based on the moving images captured by each of the laser processing moving image capturing unit 61, the first transport moving image capturing unit 62, the second transport moving image capturing unit 63, and the third transport moving image capturing unit 64. Then, based on the detection of an abnormality within the housing 2, the control unit 7 performs control to notify the user of the abnormality.

[0117] (Determination of Confirmation by Operator After Opening Door) Here, in the case of an abnormality such as the wafer We falling from the clamp hand portion 41 in Fig. 14 , an abnormality such as insufficient movement of the rail portion 44 in Fig. 17 , an abnormality such as a malfunction in holding the chuck table portion 55 in Fig. 18 , or an abnormality such as a malfunction in holding the chuck table portion 55 in Fig. 22 , the operator Op needs to open the door 22, enter the housing 2, and retrieve the wafer We and repair the chuck table portion 55. By having this determination made by the control unit 7 rather than by the operator Op, it becomes possible to make an appropriate determination regardless of the operator Op's level of proficiency.

[0118] Specifically, the control unit 7 determines whether or not it is necessary for an operator Op to open the door 22 provided on the housing 2 and check, based on the type of abnormality inside the housing 2, and controls the display unit 8 to display the determination result. As an example, in the case of an abnormality such as a malfunction in the holding of the chuck table unit 55 in Fig. 22, it is necessary for the operator Op to open the door 22 and check, and therefore, as the determination result, the display unit 8 displays the still image Im, an enlarged image of the chuck table unit 55 in the abnormality recording moving image Moa, and a message saying "Please open the door and check the holding state of the wafer on the chuck table unit."

[0119] (At startup) Furthermore, the above-mentioned abnormality recording control has been described as being performed in parallel with at least one of the processing of the wafer We by the laser Ld and the transportation of the wafer We, but as shown in Figures 25 to 27, the abnormality recording control is also performed at the startup of the laser processing apparatus 100.

[0120] 25 shows an abnormality in which the rag CL is on the rail portion 43, FIG. 26 shows an abnormality in which the test wafer We is still held on the chuck table portion 55, and FIG. 27 shows an abnormality in which the wafer We is on the base 1.

[0121] That is, after the laser processing apparatus 100 is started and before processing of the wafer We begins, the control unit 7 performs control to detect abnormalities within the housing 2 based on the moving images captured by the moving image capturing unit 6.

[0122] 25 , the control unit 7 performs control to detect an abnormality inside the housing 2 based on a comparison between the second transport moving image Mo2 captured by the second transport moving image capturing unit 63 and the normal image Mon. The normal image Mon is stored in the storage unit 71 as an image of a normal state captured by the second transport moving image capturing unit 63 after the laser processing apparatus 100 is started and before processing of the wafer We is started.

[0123] Based on the detection of an abnormality in the housing 2 (the abnormality that the rag CL is on the rail portion 43), the control unit 7 performs control to extract the abnormality recording moving image Moa from a range including the time when the abnormality occurred in the housing 2 and store it in the storage unit 71. In other words, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range spanning from a time before to a time after the time when the abnormality was detected in the housing 2 and store it in the storage unit 71. At this time, information that the abnormality is that the rag CL is on the rail portion 43, the abnormality recording moving image Moa, the time when the abnormality was detected, and information that the abnormality recording moving image Moa was captured by the second transport moving image capturing unit 63 are stored in association with each other in the storage unit 71.

[0124] 26 , the control unit 7 performs control to detect an abnormality inside the housing 2 based on a comparison between the laser processing moving image MoL captured by the laser processing moving image capturing unit 61 and the normal image Mon. The normal image Mon is stored in the storage unit 71 as an image of a normal state captured by the laser processing moving image capturing unit 61 after the laser processing apparatus 100 is started and before processing of the wafer We is started.

[0125] Based on the detection of an abnormality in the housing 2 (an abnormality in which the test wafer We is still held on the chuck table 55), the control unit 7 performs control to extract the abnormality recording moving image Moa covering a range including the time when the abnormality occurred in the housing 2 and store it in the storage unit 71. In other words, the control unit 7 performs control to extract the abnormality recording moving image Moa covering a range from a time before to a time after the time when the abnormality was detected in the housing 2 and store it in the storage unit 71. At this time, information that the abnormality is an abnormality in which the test wafer We is still held on the chuck table 55, the abnormality recording moving image Moa, the time when the abnormality was detected, and information that the abnormality recording moving image Moa was captured by the laser processing moving image capturing unit 61 are stored in association with each other in the storage unit 71.

[0126] 27 , the control unit 7 performs control to detect an abnormality inside the housing 2 based on a comparison between the third transfer moving image Mo3 captured by the third transfer moving image capturing unit 64 and the normal image Mon. The normal image Mon is stored in the storage unit 71 as an image of a normal state captured by the third transfer moving image capturing unit 64 after the laser processing apparatus 100 is started and before processing of the wafer We is started.

[0127] Based on the detection of an abnormality in the housing 2 (the abnormality that the wafer We is on the base 1), the control unit 7 performs control to extract the abnormality recording moving image Moa from a range including the time when the abnormality occurred in the housing 2 and store it in the storage unit 71. That is, the control unit 7 performs control to extract the abnormality recording moving image Moa from a range extending from a time point before to a time point after the time when the abnormality was detected in the housing 2 and store it in the storage unit 71. At this time, information that the abnormality is that the wafer We is on the base 1, the abnormality recording moving image Moa, the time when the abnormality was detected, and information that the abnormality recording moving image Moa was captured by the third transfer moving image capturing unit 64 are stored in association with each other in the storage unit 71.

[0128] (Registration of normal image) As shown in Fig. 28, the control unit 7 performs control to accept the addition of a normal image Mon in order to prevent excessive abnormality detection. That is, the control unit 7 performs control to add, to the storage unit 71, an image at a predetermined operation timing that has been registered as an image of a normal state, from among images at a predetermined operation timing in which an abnormality has been detected. Here, the images at the predetermined operation timing are the images shown in Figs. 13, 14, 16 to 19, 21 to 23, and 25 to 27.

[0129] The control unit 7 controls the display unit 8 to display a message asking "Do you want to register the image determined to be abnormal as a normal image?" and messages of "Yes" and "No." Then, based on receiving an operation of selecting "Yes" from the worker Op, the control unit 7 controls to add the image of the predetermined operation timing at which an abnormality was detected as a normal image Mon to the storage unit 71. Furthermore, based on receiving an operation of selecting "No" from the worker Op, the control unit 7 controls not to add the image of the predetermined operation timing at which an abnormality was detected as a normal image Mon to the storage unit 71.

[0130] (Abnormality Recording Process) Here, with reference to FIG. 29, the abnormality recording process executed by the control unit 7 will be described.

[0131] As shown in Fig. 29, in step S1, it is determined whether a start operation has been received from the operator Op. If a start operation has been received from the operator Op, the process proceeds to step S2; if a start operation has not been received from the operator Op, step S1 is repeated. In step S2, the video imaging unit 6 starts capturing video images of the inside of the housing 2 (see Figs. 25 to 27). In step S3, it is determined whether an abnormality has been detected. If an abnormality has been detected, the process proceeds to step S4; if no abnormality has been detected, the process proceeds to step S7.

[0132] In step S4, the abnormality is notified to the operator Op via the display unit 8 or the like. In step S5, it is determined whether an operation indicating no abnormality has been received from the operator Op. That is, after the display unit 8 displays a message asking "Do you want to register the image determined to be abnormal as a normal image?" and a message offering "Yes" or "No," it is determined whether an operation selecting either "Yes" or "No" from the operator Op has been received (see FIG. 28). If an operation indicating no abnormality has been received from the operator Op (selection of "Yes"), the process proceeds to step S6, where an image of a predetermined operation timing at which an abnormality was detected is added to the storage unit 71 as a normal image Mon. If an operation indicating an abnormality has been received from the operator Op (selection of "No"), the process proceeds to step S7 based on the reception of an operation from the operator Op to notify that the abnormality has been corrected.

[0133] In step S7, processing of the wafer We begins. In step S8, it is determined whether or not an abnormality has been detected based on the captured moving image and information from various sensors provided in the laser processing apparatus 100. If an abnormality has been detected, the process proceeds to step S9, and if no abnormality has been detected, the process proceeds to step S10.

[0134] In step S9, an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality occurred, is extracted from the moving images captured by each of the laser processing moving image capturing unit 61, the first conveyance moving image capturing unit 62, the second conveyance moving image capturing unit 63, and the third conveyance moving image capturing unit 64, and is stored in the storage unit 71. In step S10, it is determined whether or not an end operation has been received from the operator Op. If an end operation has been received from the operator Op, the abnormality recording process is ended, and if an end operation has not been received from the operator Op, the process returns to step S8.

[0135] (Effects of First Embodiment) In the first embodiment, the following effects can be obtained.

[0136] In the first embodiment, as described above, the laser processing apparatus 100 includes the control unit 7 that, upon detection of an abnormality within the housing 2, extracts an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality was detected, from the moving images captured by the moving image capturing unit 6 and stores the extracted moving image Moa in the storage unit 71. This allows the operator Op to confirm not only the current status within the apparatus after the abnormality has occurred, but also the status within the apparatus during the process of the abnormality by checking the abnormality recording moving image Moa stored in the storage unit 71. As a result, the operator Op can easily investigate the cause of the abnormality. Furthermore, the laser processing apparatus 100 is sealed by the housing 2 to prevent leakage of the laser Ld irradiated from the laser irradiation unit 51. When an abnormality within the housing 2 is detected, the operator Op stops processing the wafer We with the laser Ld, opens the door 21 provided on the housing 2, visually inspects the inside of the laser processing apparatus 100, obtains information necessary for recovery work, and then performs the necessary recovery work. Therefore, as described above, by storing the moving images captured by the moving image capturing unit 6 and the abnormality recording image Moa in the storage unit 71, the worker Op can confirm the current situation inside the device after the abnormality has occurred by checking the current moving images captured by the moving image capturing unit 6, and the worker Op can confirm the situation inside the device during the process of the abnormality occurring by checking the abnormality recording moving images Moa. This allows the worker Op to obtain information necessary for recovery work before opening the door 21 provided on the housing 2, and therefore allows the necessary recovery work to be carried out efficiently.

[0137] Furthermore, in the first embodiment, as described above, the moving image capturing unit 6 is disposed in a position where it can capture images of the machining position PL and the machining moving image capturing area ArL including the alignment mark imaging position Pa1 (alignment mark imaging position Pa2), and the transport moving image capturing area ArM including the transport path Rm. Thus, by capturing an image of the machining moving image capturing area ArL by the moving image capturing unit 6, a moving image within the machining moving image capturing area ArL can be stored in the storage unit 71. Thus, by checking the moving images stored in the storage unit 71, the operator Op can confirm abnormalities such as an abnormality in the adjustment of the laser irradiation unit 51 (for example, adjustment of the height position for focus adjustment) when irradiating the machining position PL with the laser Ld, and a faulty holding by the chuck table unit 55 at the alignment mark imaging position Pa1 (alignment mark imaging position Pa2). This allows the operator Op to easily identify the cause of an abnormality that has occurred within the machining moving image capturing area ArL. Furthermore, by capturing an image of the transport video image capturing area ArM using the video image capturing unit 6, the video image within the transport video image capturing area ArM can be stored in the storage unit 71. This allows the operator Op to check the video image stored in the storage unit 71 to confirm an abnormality, such as a falling of the wafer We being transported along the transport path Rm, and thus facilitates the investigation of the cause of an abnormality that has occurred within the transport video image capturing area ArM.

[0138] In the first embodiment, as described above, the moving image capturing unit 6 includes the laser processing moving image capturing unit 61 arranged at a position where it can capture the processing moving image capturing area ArL. The moving image capturing unit 6 also includes the first conveyance moving image capturing unit 62 (the second conveyance moving image capturing unit 63 and the third conveyance moving image capturing unit 64) arranged at a position where it can capture the conveyance moving image capturing area ArM. This allows the laser processing video imaging unit 61 to store the laser processing video image MoL within the processing video imaging area ArL in the memory unit 71, and the first transport video imaging unit 62 (second transport video imaging unit 63 and third transport video imaging unit 64) to store the first transport video image Mo1 (second transport video image Mo2 and third transport video image Mo3) within the transport video imaging area ArM in the memory unit 71, so that the worker Op can check the conditions both within the processing video imaging area ArL and within the transport video imaging area ArM by checking the videos stored in the memory unit 71 without having to directly visually check the inside of the device.

[0139] Furthermore, in the first embodiment, as described above, the laser processing apparatus 100 includes the wafer transport unit 4 that transports the unprocessed wafer We to the chuck table 55 and transports the processed wafer We from the chuck table 55. The first transport video image capturing unit 62 (the second transport video image capturing unit 63 and the third transport video image capturing unit 64) are disposed in positions within the transport video image capturing area ArM where they can capture video images of the wafer transport unit 4. The control unit 7 extracts abnormality recording video images Moa from the transport video image capturing area ArM and stores the video images in the memory unit 71 based on the detection of an abnormality during the transport of the wafer We. By checking the abnormality recording video images Moa stored in the memory unit 71, the operator Op can confirm abnormalities, such as abnormalities in the wafer We held by the wafer transport unit 4 along the transport path Rm and abnormalities during the transfer of the wafer We to the chuck table 55 by the wafer transport unit 4. This facilitates the investigation of the cause of the abnormality due to the transport operation of the wafer transport unit 4.

[0140] Furthermore, in the first embodiment, as described above, the laser processing apparatus 100 includes the cassette unit 3 provided with the inner door 33 that opens and closes the wafer entrance 33 a for removing the wafer We before processing and for storing the wafer We after processing. The first transfer video image capturing unit 62 (the second transfer video image capturing unit 63 and the third transfer video image capturing unit 64) are disposed in a transfer video image capturing area ArM at a position where they can capture video images of the wafer entrance 33 a and the wafer transfer unit 4 at the transfer position Pd1 (transfer position Pd2) of the wafer We between the chuck table 55 and the wafer transfer unit 4. Thus, by checking the abnormality recorded moving image Moa stored in the memory unit 71, the operator Op can check the opening and closing of the inner door 33, the transfer of the wafer We from the wafer transport unit 4 to the chuck table unit 55 at the wafer We transfer position Pd1 (transfer position Pd2), and the transfer of the wafer We from the chuck table unit 55 to the wafer transport unit 4. This allows the operator Op to check abnormalities including improper opening and closing of the inner door 33, improper holding of the wafer We by the chuck table unit 55 when transferring the wafer We from the wafer transport unit 4 to the chuck table unit 55 at the wafer We transfer position Pd1 (transfer position Pd2), and improper holding of the wafer We by the wafer transport unit 4 when transferring the wafer We from the chuck table unit 55 to the wafer transport unit 4. This makes it easy to identify the cause of an abnormality caused by the operations of the inner door 33, the wafer transport unit 4, and the chuck table unit 55.

[0141] Furthermore, in the first embodiment, as described above, the wafer transport unit 4 includes the rail portion 43 (rail portion 44) on which the unprocessed wafer We is temporarily placed before being transported from the cassette unit 3 to the chuck table unit 55, and on which the processed wafer We is temporarily placed before being stored from the chuck table unit 55 in the cassette unit 3. The first transport video image capturing unit 62 (second transport video image capturing unit 63 and third transport video image capturing unit 64) are disposed in positions within the transport video image capturing area ArM where they can capture video images of the wafer entrance 33a, the rail portion 43 (rail portion 44), and the wafer transport unit 4 at the wafer We transfer position Pd1 (transfer position Pd2). This allows video images of the operation of the rail portion 43 (rail portion 44) captured by the second transport video image capturing unit 63 (third transport video image capturing unit 64) to be stored in the storage unit 71, in addition to video images of the operations of the inner door 33, the wafer transport unit 4, and the chuck table unit 55. As a result, by checking the moving images stored in the memory unit 71, the operator Op can check for abnormalities related to the rail unit 43 (rail unit 44) in addition to abnormalities caused by the operation of the inner door 33, the wafer transport unit 4, and the chuck table unit 55.

[0142] In the first embodiment, as described above, the first transfer video imaging unit 62 is disposed at a position where it can image the wafer entrance 33a and the rail 43 (rail 44) on the inner surface of the cassette unit 3 side of the casing 2. The second transfer video imaging unit 63 is disposed at a position where it can image the rail 43 (rail 44) and the wafer We transfer position Pd1 (transfer position Pd2) on the inner surface of the cassette unit 3 side of the casing 2. The third transfer video imaging unit 64 is disposed at a position where it can image the rail 43 (rail 44) and the wafer We transfer position Pd1 (transfer position Pd2) on the inner surface of the casing 2 opposite the cassette unit 3 side in the direction in which the cassette unit 3 and the rail 43 (rail 44) are aligned. As a result, even in cases where the first transfer moving image capturing unit 62 cannot capture an image of the entire rail portion 43 (rail portion 44) because it captures an image of the wafer entrance / exit 33 a, the second transfer moving image capturing unit 63 and the third transfer moving image capturing unit 64 can capture an image of the rail portion 43 (rail portion 44), so that the first transfer moving image capturing unit 62, the second transfer moving image capturing unit 63, and the third transfer moving image capturing unit 64 can complement each other to capture an image of the entire rail portion 43 (rail portion 44). Furthermore, since portions other than the rail portion 43 (rail portion 44) can be similarly complemented by each other, the first transfer moving image capturing unit 62, the second transfer moving image capturing unit 63, and the third transfer moving image capturing unit 64 can complement each other to capture an image of the entire inside of the transfer moving image capturing area ArM.

[0143] Furthermore, in the first embodiment, as described above, the control unit 7, based on the detection of an abnormality during processing of the wafer We, extracts the abnormality recording moving image Moa from the processing moving image capturing area ArL and stores it in the memory unit 71. This allows the operator Op to check the abnormality recording moving image Moa stored in the memory unit 71 for the range including the time when the abnormality occurred in the processing moving image capturing area ArL, thereby enabling the operator Op to check the status within the apparatus during the process of the abnormality occurring. As a result, the operator Op can easily investigate the cause of the abnormality in the processing moving image capturing area ArL.

[0144] Furthermore, in the first embodiment, as described above, the storage unit 71 stores normal images Mon including an image showing a normal state of the processing video imaging area ArL and an image showing a normal state of the transport video imaging area ArM. The control unit 7 performs control to detect abnormalities in each of the processing video imaging area ArL and the transport video imaging area ArM in the housing 2 based on a comparison between an image at a predetermined operation timing in the moving images captured by each of the laser processing video imaging unit 61 and the first transport video imaging unit 62 (the second transport video imaging unit 63 and the third transport video imaging unit 64) and the normal image Mon corresponding to the predetermined operation timing. This allows the control unit 7 to detect abnormalities in each of the processing video imaging area ArL and the transport video imaging area ArM in the housing 2 based on the moving images captured by each of the laser processing video imaging unit 61 and the first transport video imaging unit 62 (the second transport video imaging unit 63 and the third transport video imaging unit 64). This makes it possible to more reliably detect abnormalities compared to when abnormalities are detected by sensors alone. Furthermore, by detecting abnormalities based on moving images using the control unit 7, it is possible to detect abnormalities in each of the processing video imaging area ArL and the transport video imaging area ArM within the housing 2, regardless of the level of skill of the worker Op.

[0145] Furthermore, in the first embodiment, as described above, the control unit 7 performs control to add, from among images at predetermined operation timings in which an abnormality has been detected, images at predetermined operation timings that have been registered as images in a normal state as normal images Mon to the storage unit 71. By registering images in which an abnormality has been detected as normal images Mon, it is possible to reduce false detections of abnormalities by the control unit 7, thereby suppressing the issuance of erroneous alarms due to false detections and suppressing the failure to detect abnormalities that require the issuance of an alarm.

[0146] Furthermore, in the first embodiment, as described above, the control unit 7 performs control to detect an abnormality inside the housing 2 after the laser processing apparatus 100 is started and before processing of the wafer We is started, based on the moving image captured by the moving image capturing unit 6. As a result, after the laser processing apparatus 100 is started and before processing of the wafer We is started, the control unit 7 can detect an abnormality inside the housing 2 without the operator Op having to directly visually check the inside of the laser processing apparatus 100, thereby reducing the workload of the operator Op.

[0147] Furthermore, in the first embodiment, as described above, the control unit 7 performs control to detect abnormalities inside the housing 2 based on the moving images captured by the laser processing moving image capturing unit 61 and the first transport moving image capturing unit 62 (the second transport moving image capturing unit 63 and the third transport moving image capturing unit 64) in parallel with at least one of the processing of the wafer We by the laser Ld and the transport of the wafer We. This allows for efficient control to detect abnormalities inside the housing 2 based on the moving images.

[0148] Furthermore, in the first embodiment, as described above, the laser processing apparatus 100 includes the low-magnification imaging unit 56 (high-magnification imaging unit 57) that captures a still image Im of the wafer We held on the chuck table 55 when the wafer We is processed by the laser Ld. The control unit 7, upon detecting an abnormality based on the still image Im of the wafer We captured by the low-magnification imaging unit 56 (high-magnification imaging unit 57), controls the extraction of an abnormality recording moving image Moa from the processing moving image capture area ArL captured by the laser processing moving image capture unit 61 and storage of the abnormality recording moving image Moa in the storage unit 71. This allows the operator Op to view not only the still image of the wafer We but also the abnormality recording moving image Moa. Therefore, the operator Op can use both visually confirmable information from the still image Im of the wafer We and visually confirmable information from the abnormality recording moving image Moa to investigate the cause of the abnormality when the wafer We is processed by the laser Ld.

[0149] Furthermore, in the first embodiment, as described above, the laser processing apparatus 100 is provided with the display unit 8. The control unit 7 determines whether or not it is necessary for the operator Op to open the door 21 provided on the housing 2 to check, based on the type of abnormality inside the housing 2, and performs control to display the determination result on the display unit 8. This allows the operator Op to know whether or not it is necessary to open the door 21 and check inside the apparatus, simply by looking at the determination result, thereby improving convenience for the operator Op.

[0150] 30 and 31, the configuration of a laser processing apparatus 200 according to a second embodiment will be described. In the second embodiment, the laser processing apparatus 200 includes a moving image capturing unit 206 having a laser processing moving image capturing unit 61 and a conveyance moving image capturing unit 262. Note that in the second embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0151] (Configuration of Laser Processing Apparatus) As shown in FIG. 30, a laser processing apparatus 200 is configured to perform processing to form a modified layer inside a wafer We for dividing the wafer We.

[0152] The laser processing apparatus 200 includes a base 1, a housing 2, a cassette unit 3, a wafer transport unit 4, a dicing unit 5, a video image capturing unit 206, a control unit 7, and a display unit 8. The cassette unit 3 is an example of a "wafer storage unit" in the claims. The wafer transport unit 4 is an example of a "wafer transport mechanism" in the claims.

[0153] Here, the up-down direction is the Z direction, the up direction is the Z1 direction, and the down direction is the Z2 direction. The horizontal direction perpendicular to the Z direction is the X direction, one side of the X direction is the X1 direction, and the other side of the X direction is the X2 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The Y direction is an example of "the direction in which the wafer accommodation section and the intermediate placement section are aligned" in the claims.

[0154] 30 and 31 , the moving image capturing unit 206 is configured to capture moving images within the housing 2 in order to monitor the transport of the wafer We by the wafer transport unit 4 and the processing of the wafer We by the dicing unit 5. A plurality of moving image capturing units 206 are arranged within the housing 2. Here, the processing moving image capturing area ArL and the transport moving image capturing area ArM within the housing 2 are captured by mutually complementing the imaging field ranges of the plurality of moving image capturing units 206.

[0155] The plurality of moving image capturing units 206 include a laser processing moving image capturing unit 61 and a transportation moving image capturing unit 262. The transportation moving image capturing unit 262 is an example of the "transportation moving image capturing unit" in the claims.

[0156] <Transportation Moving Image Capturing Unit> As shown in FIGS. 30 and 31, the transportation moving image capturing unit 262 is disposed in a position where it can capture an image of the transportation moving image capturing region ArM.

[0157] The transport video image capturing unit 262 is disposed at a position where it can capture images of the wafer entrance 33a, the clamp hand unit 41, the rails 43 and 44, the transfer head 46, and the wafer We transfer position Pd2 (see FIG. 31 ) on the inner surface on the Y2 direction side of the housing 2. The transport video image capturing unit 262 is attached to the inner surface on the Y1 direction side of the housing 2 via an attachment member (not shown).

[0158] The transport video imaging unit 262, attached to the inner surface on the Y1 direction side of the housing 2, captures a video image (transport video image Mo in FIG. 31 ) of a portion of the imaging field of view range (shown by hatching in FIG. 30 as an example) in the processing video imaging area ArL. As shown in FIG. 31 , the transport video imaging unit 262 captures the transport video image Mo, which includes the upper surface on the X1 direction side of the base 1, the inner surface of the housing 2, the inner door 33, the wafer entrance 33a, the clamp hand unit 41, the rail unit 43, the rail unit 44, the transfer head 46, and the chuck table unit 55. Note that, for ease of explanation, the transfer head 45 and the like are omitted from the transport video image Mo in FIG. 31 , but the transfer head 45 and the like are included in the transport video image Mo.

[0159] (Abnormality recording control) In the second embodiment, based on detecting an abnormality in the housing 2 during the above-mentioned wafer processing control, the control unit 7 controls the extraction of an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality was detected, from the moving images captured by each of the laser processing moving image capturing unit 61 and the transport moving image capturing unit 262, and storing the image in the memory unit 71.

[0160] The other configurations of the second embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0161] (Effects of Second Embodiment) In the second embodiment, the following effects can be obtained.

[0162] In the second embodiment, as described above, the laser processing device 200 includes the control unit 7 that, based on the detection of an abnormality in the housing 2, extracts an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality was detected, from the moving images captured by the moving image capturing unit 206, and controls the extraction and storage of the abnormality recording moving image Moa in the storage unit 71. This allows the operator Op to easily investigate the cause of the abnormality that has occurred.

[0163] The other effects of the second embodiment are the same as those of the first embodiment, and therefore will not be described.

[0164] 32 to 34, the configuration of a laser processing apparatus 300 according to the third embodiment will be described. In the third embodiment, the laser processing apparatus 300 includes a clamp hand unit 41 provided with a moving image capturing unit 306. Note that in the third embodiment, detailed description of the same configuration as in the first embodiment will be omitted.

[0165] (Configuration of Laser Processing Apparatus) As shown in FIG. 32, a laser processing apparatus 300 is configured to perform processing to form a modified layer inside a wafer We for dividing the wafer We.

[0166] The laser processing apparatus 300 includes a base 1, a housing 2, a cassette unit 3, a wafer transport unit 4, a dicing unit 5, a video image capturing unit 306, a control unit 7, and a display unit 8. The cassette unit 3 is an example of a "wafer storage unit" in the claims. The wafer transport unit 4 is an example of a "wafer transport mechanism" in the claims.

[0167] Here, the up-down direction is the Z direction, the up direction is the Z1 direction, and the down direction is the Z2 direction. The horizontal direction perpendicular to the Z direction is the X direction, one side of the X direction is the X1 direction, and the other side of the X direction is the X2 direction. The horizontal direction perpendicular to the X direction is the Y direction, one side of the Y direction is the Y1 direction, and the other side of the Y direction is the Y2 direction. The Y direction is an example of "the direction in which the wafer accommodation section and the intermediate placement section are aligned" in the claims.

[0168] 32 and 33 , the moving image capturing unit 306 is configured to capture moving images within the housing 2 in order to monitor the transport of the wafer We by the wafer transport unit 4 and the processing of the wafer We by the dicing unit 5. A plurality of moving image capturing units 206 are arranged within the housing 2. Here, the processing moving image capturing area ArL and the transport moving image capturing area ArM within the housing 2 are captured by mutually complementing the imaging field ranges of the plurality of moving image capturing units 306.

[0169] The plurality of moving image capturing units 306 include a laser processing moving image capturing unit 61, a first conveyance moving image capturing unit 362, and a second conveyance moving image capturing unit 363. Each of the first conveyance moving image capturing unit 362 and the second conveyance moving image capturing unit 363 is an example of a "conveyance moving image capturing unit" in the claims.

[0170] <Transportation Moving Image Capturing Unit> As shown in FIGS. 32 and 33, each of the first transportation moving image capturing unit 362 and the second transportation moving image capturing unit 363 is disposed at a position where it can capture an image of the transportation moving image capturing region ArM.

[0171] The first transfer video imaging unit 362 and the second transfer video imaging unit 363 are each disposed on the clamp hand unit 41 at a position where they can image the wafer entrance 33a, the rails 43 and 44, the transfer head 46, and the wafer We transfer position Pd2 (see FIG. 34 ) on the inner surface on the Y2 direction side of the housing 2. The first transfer video imaging unit 362 and the second transfer video imaging unit 363 are disposed side by side in the Z direction. The first transfer video imaging unit 362 is attached to a portion of the clamp hand unit 41 on the Z1 direction side. The second transfer video imaging unit 363 is attached to a portion of the clamp hand unit 41 on the Z2 direction side.

[0172] Each of the first transfer video imaging unit 362 and the second transfer video imaging unit 363, when attached to the clamp hand unit 41, captures a video image (transfer video image Mo in FIG. 34 ) of a portion of the imaging field of view range (shown by hatching in FIG. 32 as an example) in the processing video imaging area ArL. As shown in FIG. 34 , the transfer video imaging unit 262 captures a transfer video image Mo that includes the upper surface of the base 1 on the X1 direction side, the inner surface of the housing 2, the inner door 33, the wafer entrance 33a, the rails 43 and 44, the transfer head 46, and the chuck table 55. Note that, for ease of explanation, the transfer head 45 and the like are omitted from the transfer video image Mo in FIG. 34 , but the transfer head 45 and the like are included in the transfer video image Mo.

[0173] (Abnormality recording control) Based on the detection of an abnormality in the housing 2 during the above-mentioned wafer processing control, the control unit 7 of the third embodiment controls the extraction of an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality was detected, from the moving images captured by each of the laser processing moving image capturing unit 61, the first transport moving image capturing unit 362 and the second transport moving image capturing unit 363, and stores the extracted moving image in the memory unit 71.

[0174] The other configurations of the third embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0175] (Effects of the Third Embodiment) In the third embodiment, the following effects can be obtained.

[0176] In the third embodiment, as described above, the laser processing device 300 includes the control unit 7 that, based on the detection of an abnormality in the housing 2, extracts an abnormality recording moving image Moa, which is a moving image of a range including the time when the abnormality was detected, from the moving images captured by the moving image capturing unit 306, and controls the extraction to store the abnormality recording moving image Moa in the storage unit 71. This enables the operator Op to easily investigate the cause of the abnormality that has occurred.

[0177] Furthermore, in the third embodiment, as described above, the wafer transport unit 4 includes the clamp hand unit 41 that transports the wafer We from the cassette unit 3 to the rail unit 43 (rail unit 44) and stores the wafer We from the rail unit 43 (rail unit 44) into the cassette unit 3. The first transport moving image capturing unit 362 and the second transport moving image capturing unit 363 are disposed in the clamp hand unit 41 at positions that enable capturing images of the wafer entrance 33a, the rail unit 43 (rail unit 44), and the wafer We transfer position Pd1 (transfer position Pd2) within the transport moving image capturing area ArM. As a result, the first transport video imaging unit 362 and the second transport video imaging unit 363 also move integrally as the clamp hand unit 41 is transported, so that the first transport video imaging unit 362 and the second transport video imaging unit 363 can move together with the wafer We being transported by the clamp hand unit 41, and capture images of the wafer We being transported to the wafer entrance / exit 33a, the rail unit 43 (rail unit 44), and the transfer position Pd1 (transfer position Pd2).

[0178] The other effects of the third embodiment are the same as those of the first embodiment, and therefore description thereof will be omitted.

[0179] [Modifications] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above-mentioned embodiments, and further includes all modifications (modifications) within the meaning and scope of the claims.

[0180] For example, in the above first to third embodiments, the laser processing apparatus 100 (200, 300) is configured to perform processing to form a modified layer inside the wafer We for dividing the wafer We, but the present invention is not limited to this. In the present invention, the laser processing apparatus may be configured to perform grooving, which forms grooves by irradiating the streets of the wafer with a laser in order to divide a current test pattern or the like set on the streets of the wafer.

[0181] In the first to third embodiments, the moving image capturing unit 6 (206, 306) is disposed at a position where it can capture images of both the processing moving image capturing area ArL and the transport moving image capturing area ArM, but the present invention is not limited to this. In the present invention, the moving image capturing unit may be disposed at a position where it can capture images of either the processing moving image capturing area or the transport moving image capturing area.

[0182] In the third embodiment, the first transport video image capturing unit 362 and the second transport video image capturing unit 363 (transport video image capturing units) are disposed in the clamp hand unit 41 (transport unit), but the present invention is not limited to this. In the present invention, one transport video image capturing unit, or three or more transport video image capturing units may be disposed in the transport unit.

[0183] In the above embodiment, for convenience of explanation, the control processing of the control unit 7 is explained using a flow-driven flowchart in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven processing.

[0184] DESCRIPTION OF SYMBOLS 2 Housing 3 Cassette section (wafer storage section) 4 Wafer transport section (wafer transport mechanism section) 6, 206, 306 Moving image capturing section 7 Control section 8 Display section 21, 22 Door 33 Inner door (opening / closing door) 33a Wafer entrance / exit 41 Clamp hand section (transport section) 43, 44 Rail section (intermediate placement section) 51 Laser irradiation section 55 Chuck table section (wafer holding section) 56 Low magnification capturing section (still image capturing section) 57 High magnification capturing section (still image capturing section) 61 Laser processing moving image capturing section 62 First transport moving image capturing section (transport moving image capturing section) 63 Second transport moving image capturing section (transport moving image capturing section) 64 Third transport moving image capturing section (transport moving image capturing section) 71 Memory section 100, 200, 300 Laser processing device 262 Transport moving image capturing section (transport moving image capturing section) 362 First transfer moving image imaging unit (transfer moving image imaging unit) 363 Second transfer moving image imaging unit (transfer moving image imaging unit) AL Alignment mark ArL Processing moving image imaging area ArM Transfer moving image imaging area Im Still image Ld Laser Mo Transfer moving image (moving image) Mo1 First transfer moving image (moving image) Mo2 Second transfer moving image (moving image) Mo3 Third transfer moving image (moving image) MoL Laser processing moving image (moving image) Moa Abnormal recording moving image Mon Normal image Op Worker PL Processing position Pa1, Pa2 Alignment mark imaging position Pd1, Pd2 Delivery position Rm Transfer path We Wafer

Claims

1. A laser processing device comprising: a wafer holding unit that holds a wafer; a laser irradiation unit that processes the wafer held in the wafer holding unit by irradiating it with a laser; a housing that houses the wafer holding unit and the laser irradiation unit; a video capture unit that is disposed within the housing and captures video images of the interior of the housing; a memory unit that stores the video images captured by the video capture unit; and a control unit that, based on the detection of an abnormality within the housing, extracts an abnormality recording video image, which is a video image of a range including the time when the abnormality occurred from the video images captured by the video capture unit, and stores the extracted video image in the memory unit.

2. The laser processing device described in claim 1, wherein the moving image capturing unit is arranged at a position where it can capture at least one of: a processing moving image capturing area including a processing position where the wafer is processed by a laser and an alignment mark capturing position where an alignment mark provided on the wafer is captured to adjust the position of the wafer held by the wafer holding unit; and a transport moving image capturing area including a transport path along which the wafer is transported before and after processing by the laser.

3. The laser processing device described in claim 2, wherein the moving image capturing unit includes a laser processing moving image capturing unit arranged at a position where it can capture the processing moving image capturing area, and a transport moving image capturing unit arranged at a position where it can capture the transport moving image capturing area.

4. A laser processing device as described in claim 3, further comprising a wafer transport mechanism that transports the wafer before processing to the wafer holding unit and transports the wafer after processing from the wafer holding unit, wherein the transport video imaging unit is positioned in a position where it can capture video images of the wafer transport mechanism unit within the transport video imaging area, and the control unit is configured to extract the abnormal recorded video images from the transport video imaging area and store them in the memory unit based on the detection of an abnormality during the transport of the wafer.

5. A laser processing device as described in claim 4, further comprising a wafer storage section provided with an opening / closing door for opening and closing a wafer entrance / exit for removing the wafer before processing and storing the wafer after processing, and wherein the transport video imaging section is positioned within the transport video imaging area at a position where it can capture video images of the wafer entrance / exit and the wafer transport mechanism section at the wafer transfer position between the wafer holding section and the wafer transport mechanism section.

6. The laser processing device of claim 5, wherein the wafer transport mechanism includes an intermediate placement section on which the unprocessed wafer is temporarily placed before being transported from the wafer storage section to the wafer holding section, and on which the processed wafer is temporarily placed before being stored from the wafer holding section in the wafer storage section, and the transport video imaging section is disposed in a position within the transport video imaging area where it can capture video images of the wafer entrance / exit, the intermediate placement section, and the wafer transport mechanism at the transfer position of the wafer.

7. The laser processing device according to claim 6, wherein a plurality of the transport video imaging units are arranged, and the plurality of transport video imaging units include: a first transport video imaging unit arranged at a position on the inner surface of the housing on the wafer accommodating unit side where it can image the wafer entrance / exit and the intermediate placement unit; a second transport video imaging unit arranged at a position on the inner surface of the housing on the wafer accommodating unit side where it can image the intermediate placement unit and the transfer position of the wafer; and a third transport video imaging unit arranged at a position on the inner surface of the housing on the opposite side from the wafer accommodating unit side in the direction in which the wafer accommodating unit and the intermediate placement unit are aligned where it can image the intermediate placement unit and the transfer position of the wafer.

8. The laser processing device of claim 6, wherein the wafer transport mechanism further includes a transport section that transports the wafer from the wafer storage section to the intermediate placement section and stores the wafer from the intermediate placement section to the wafer storage section, and the transport video imaging section is disposed in the transport section at a position that allows imaging of the wafer entrance / exit, the intermediate placement section, and the transfer position of the wafer within the transport video imaging area.

9. The laser processing device of claim 3, wherein the control unit is configured to control the extraction of the abnormal recorded moving image from the processing moving image capturing area and storage in the memory unit based on the detection of an abnormality during processing of the wafer.

10. The laser processing device of claim 3, wherein the memory unit stores normal images including an image showing the normal state of the processing video imaging area and an image showing the normal state of the transport video imaging area, and the control unit is configured to perform control to detect abnormalities in each of the processing video imaging area and the transport video imaging area within the housing based on a comparison between an image of a predetermined operation timing in the moving images captured by each of the laser processing video imaging unit and the transport video imaging unit and the normal image corresponding to the predetermined operation timing.

11. The laser processing device described in claim 10, wherein the control unit is configured to control adding to the memory unit as the normal image an image at the specified operation timing that is registered as being an image of a normal state, from among images at the specified operation timing in which an abnormality is detected.

12. The laser processing device according to claim 1, wherein the control unit is configured to perform control to detect abnormalities within the housing based on moving images captured by the moving image capturing unit after the laser processing device is started and before processing of the wafer begins.

13. The laser processing device described in claim 3, wherein the control unit is configured to perform control to detect abnormalities within the housing based on moving images captured by each of the laser processing video imaging unit and the transport video imaging unit, in parallel with at least one of the processing of the wafer by laser and the transport of the wafer.

14. A laser processing apparatus as described in claim 3, further comprising a still image capturing unit that captures a still image of the wafer held in the wafer holding unit when the wafer is processed by a laser, and the control unit is configured to control the extraction of the abnormal recorded moving image of the processing video capturing area captured by the laser processing video capturing unit and storing it in the memory unit based on the detection of an abnormality based on the still image of the wafer captured by the still image capturing unit.

15. A laser processing device as described in claim 1, further comprising a display unit, wherein the control unit is configured to determine whether or not an operator needs to open a door on the housing to check the device based on the type of abnormality inside the housing, and to control the display unit to display the determination result.

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