Measuring device, resin molding device, and method for manufacturing resin molded article

Abstract

This measuring device is provided with a mobile apparatus, a measuring unit, and a memory unit. The mobile apparatus includes a reference portion used for measuring the thickness of a board, and moves together with the board. The measuring unit includes first and second optical sensors, each of which measures a distance by means of light, and measures the thickness of the board as the board passes between the first and second optical sensors in conjunction with the movement of the mobile apparatus. The memory unit stores a reference thickness, which is the thickness of the reference portion. The measuring unit measures the thickness of the reference portion as the reference portion moves between the first and second optical sensors, calculates a correction value on the basis of the measurement result of the thickness of the reference portion and the reference thickness, and corrects the measurement result of the thickness of the board on the basis of the correction value.

Description

Measuring device, resin molding device, and method for manufacturing resin molded product

[0001] The present invention relates to a measuring device, a resin molding device, and a method for manufacturing a resin molded product.

[0002] Japanese Patent Laid-Open Publication No. 2019-10886 (Patent Document 1) discloses a resin molding apparatus that molds a substrate with resin.

[0003] JP 2019-10886 A

[0004] In a device that handles substrates, such as a resin molding device, it is important that the thickness of the substrate falls within a desired range. In order to determine whether the thickness of the substrate falls within the desired range, it is necessary to measure the thickness of the substrate. However, Patent Document 1 does not disclose a technique for measuring the thickness of the substrate.

[0005] The present invention has been made to solve such problems, and its purpose is to provide a measuring device, a resin molding device, and a method for manufacturing a resin molded product that can measure the thickness of a substrate relatively accurately.

[0006] A measurement device according to one aspect of the present invention includes a movable device, a measurement unit, and a memory unit. The movable device includes a reference unit used to measure the thickness of a substrate and moves together with the substrate. The measurement unit includes first and second optical sensors, each of which measures distance using light, and measures the thickness of the substrate as the substrate passes between the first and second optical sensors as the movable device moves. The memory unit stores a reference thickness, which is the thickness of the reference unit. The measurement unit measures the thickness of the reference unit as the reference unit passes between the first and second optical sensors, calculates a correction value based on the measurement result of the thickness of the reference unit and the reference thickness, and corrects the measurement result of the thickness of the substrate based on the correction value.

[0007] A resin molding apparatus according to another aspect of the present invention molds a pre-molded substrate, which is not molded from resin, with resin. The resin molding apparatus includes the above-described measuring apparatus.

[0008] A method for producing a resin molded product according to another aspect of the present invention includes producing a resin molded product by molding a pre-molding substrate with resin using the resin molding apparatus.

[0009] According to the present invention, it is possible to provide a measuring device capable of measuring the thickness of a substrate relatively accurately, a resin molding device, and a method for manufacturing a resin molded product.

[0010] 3 is a diagram schematically showing a plan view of a resin molding apparatus. FIG. 4 is a diagram schematically showing a plan view of a carry-out mechanism. FIG. 5 is a diagram schematically showing a III-III cross section of FIG. 2. FIG. 6 is a diagram schematically showing a IV-IV cross section of FIG. 2. FIG. 7 is a diagram schematically showing a V-V cross section of FIG. 2. FIG. 8 is a diagram schematically showing a state in which a molded substrate is transferred from a first carry-out section to a second carry-out section. FIG. 9 is a diagram schematically showing a state in which a substrate transport mechanism pushes a molded substrate from behind. FIG. 10 is a diagram for explaining a method for measuring the thickness of a molded substrate. FIG. 11 is a diagram for explaining a problem relating to thickness measurement of a molded substrate. FIG. 12 is a diagram for explaining a procedure for calculating a correction value. FIG. 13 is a flowchart showing an example of a procedure for correcting measurement results of the thickness of a molded substrate. FIG. 14 is a diagram schematically showing an example of a transition of a calculated thickness. FIG. 15 is a diagram schematically showing a plan view of a substrate transport mechanism including a reference section.

[0011] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that identical or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn in a schematic manner with objects appropriately omitted or exaggerated.

[0012] [1. Configuration] <1-1. Configuration of Resin Molding Apparatus> Fig. 1 is a diagram schematically showing a plan view of a resin molding apparatus 10 according to the present embodiment. Referring to Fig. 1, the resin molding apparatus 10 is configured to resin-seal a substrate W on which electronic components such as semiconductor chips are mounted, thereby producing a resin-molded product (e.g., a semiconductor device). In the resin molding apparatus 10, the component-mounting surface of the substrate W on which the electronic components are mounted is resin-sealed.

[0013] Examples of the substrate W include a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, etc. The substrate W may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate W may or may not already have wiring applied thereto.

[0014] The resin molding apparatus 10 includes a substrate supply / storage module 100, two resin molding modules 200, a resin material supply module 300, and a computer 400. The substrate supply / storage module 100, the two resin molding modules 200, and the resin material supply module 300 are arranged in this order along the X-axis. Each module is detachable and replaceable with other modules. Furthermore, the number of modules in the resin molding apparatus 10 can be increased or decreased.

[0015] The substrate supply / storage module 100 includes a substrate storage section 110, a load / unload mechanism 50, a robot hand 120, a substrate temporary storage section 130, and a substrate transport mechanism 140. The substrate storage section 110 has multiple tiers aligned along the Z axis. Some of the upper tiers store substrates W before resin molding (hereinafter also referred to as "pre-molded substrates"). Meanwhile, the remaining tiers (lower tiers) store substrates W that have already been resin molded (hereinafter also referred to as "molded substrates"). The substrate storage section 110 supplies the stored pre-molded substrates W to a load mechanism 590 (described below), and also receives molded substrates W unloaded from an unloading mechanism 500.

[0016] The load / unload mechanism 50 includes a load mechanism 590 and an unload mechanism 500. The load mechanism 590 includes a pair of rails (not shown). The pre-molding substrates W supplied from the substrate storage unit 110 are placed on the pair of rails. The unload mechanism 500 will be described in detail later.

[0017] The robot hand 120 is configured to hold a substrate W and move the held substrate W. The robot hand 120, for example, holds a pre-forming substrate W placed in the carry-in mechanism 590 and moves the pre-forming substrate W to the temporary substrate storage section 130. The robot hand 120 also holds a formed substrate W placed in the temporary substrate storage section 130 and moves the formed substrate W to the carry-out mechanism 500, for example.

[0018] The temporary substrate storage section 130 is configured to temporarily store each of the pre-molding substrates W and the molded substrates W. The substrate transport mechanism 140 is configured to move along the X-axis and the Y-axis in the substrate supply / storage module 100 and each resin molding module 200. The substrate transport mechanism 140, for example, holds the pre-molding substrates W stored in the temporary substrate storage section 130 and transports the pre-molding substrates W to the resin molding modules 200. The substrate transport mechanism 140 also transports the molded substrates W molded with resin in the resin molding modules 200 to the temporary substrate storage section 130.

[0019] Each resin molding module 200 includes a compression molding unit 210. The compression molding unit 210 is configured to manufacture a molded substrate W (a resin molded product) by compression molding. A granular resin material P having thermosetting properties is used in this compression molding. The resin material P may also be a thermoplastic resin material. The resin material P may also be a liquid resin. The compression molding unit 210 includes a molding die 211 and a clamping mechanism 216. The molding die 211 includes an upper die 214 and a lower die 212. The upper die 214 and the lower die 212 are arranged opposite each other along the Z axis. The clamping mechanism 216 raises the lower die 212, thereby clamping the molding die 211.

[0020] A cavity 212C is formed on the upper surface of the lower mold 212. A film (release film) on which resin material P is placed is placed in the cavity 212C. A substrate W is placed on the lower surface of the upper mold 214. With the film on which resin material P is placed placed in the cavity 212C of the lower mold 212 and the substrate W placed on the lower surface of the upper mold 214, the forming mold 211 is clamped. This causes the component mounting surface of the substrate W to be sealed with resin.

[0021] The resin material supply module 300 includes a moving table 310, a resin material storage unit 320, a resin material supply mechanism 330, resin material transport mechanisms 340 and 360, and a temporary resin storage unit 350. The moving table 310 is configured to move along the X-axis and Y-axis in the resin material supply module 300.

[0022] The resin material accommodation unit 320 includes a film and a frame-shaped member (not shown) placed on the upper surface of the film. A space (recess 322) corresponding to the size of the cavity 212C of the lower mold 212 is formed in the resin material accommodation unit 320. The resin material accommodation unit 320 is placed on the moving table 310. The resin material supply mechanism 330 is configured to supply the resin material P to the resin material accommodation unit 320 from above the resin material accommodation unit 320. The resin material P dropping from the discharge port of the resin material supply mechanism 330 is evenly spread in the recess 322 of the resin material accommodation unit 320 by the moving table 310 moving relative to the discharge port of the resin material supply mechanism 330.

[0023] The resin material conveying mechanism 340 is configured to move along the X-axis and Y-axis in the resin material supplying module 300. The resin material conveying mechanism 340 conveys, for example, the resin material accommodation unit 320 that accommodates the resin material P to the temporary resin accommodation unit 350. The temporary resin accommodation unit 350 is configured to temporarily accommodate the resin material accommodation unit 320 that accommodates the resin material P. The resin material conveying mechanism 360 is configured to convey the resin material accommodation unit 320 that is accommodated in the temporary resin accommodation unit 350 to the lower mold 212 and supply the resin material P to the cavity 212C of the lower mold 212.

[0024] The computer 400 is configured to control the entire resin molding apparatus 10. The computer 400 controls, for example, the substrate supply / storage module 100, the two resin molding modules 200, and the resin material supply module 300. The computer 400 includes, for example, a hardware processor such as a central processing unit (CPU), a random access memory (RAM), and a read-only memory (ROM), and is configured to execute information processing based on programs and various data. The computer 400 also includes a storage unit 410. The storage unit 410 is configured, for example, as an auxiliary storage device such as a hard disk drive or a solid-state drive. The computer 400 may be located anywhere within the resin molding apparatus 10, or may be configured by multiple computers.

[0025] 2 is a diagram schematically showing a plan view of the unloading mechanism 500. As shown in Fig. 2, the unloading mechanism 500 includes a first unloading section 501 and a second unloading section 502. The molded substrate W is transferred from the first unloading section 501 to the second unloading section 502, and is then ejected from the second unloading section 502 to the substrate storage section 110. The first unloading section 501 includes a pair of rails RL1, a mover 510, and a distance measuring section 520.

[0026] The pair of rails RL1 extend along the X-axis. The mover 510 is configured to move on the pair of rails RL1 along the X-axis. The mover 510 moves on the pair of rails RL1 from the end opposite the second unloading section 502 to the end on the second unloading section 502 side while holding the shaped substrate W. Furthermore, after the shaped substrate W has been transferred to the second unloading section 502, the mover 510 moves on the pair of rails RL1 from the end on the second unloading section 502 side to the end opposite the second unloading section 502. The mover 510 includes a frame-shaped mover main body 511, a pair of holding mechanisms 512, and a reference section 514.

[0027] Fig. 3 is a diagram schematically showing a cross section taken along line III-III in Fig. 2. Referring to Fig. 3, a pair of holding mechanisms 512 (holding mechanisms 512A, 512B) are fixed to a mobile device main body 511. Each of the pair of holding mechanisms 512 is configured to rotate about a rotation axis. By rotating about the rotation axis, each holding mechanism 512 transitions between a holding state in which the shaped substrate W is held and an release state in which the shaped substrate W is released. By sandwiching the shaped substrate W between the pair of holding mechanisms 512 from above and below, the occurrence of warpage in the shaped substrate W is suppressed. When the shaped substrate W is held by the pair of holding mechanisms 512, at least a portion (e.g., a central portion) of each of the upper and lower surfaces is exposed.

[0028] 2 , the mobile device main body 511 is provided with a reference portion 514 at the end opposite to the second discharge portion 502. The reference portion 514 is a plate-like member that protrudes from the mobile device main body 511 along the X-axis. A through-hole H1 that penetrates the reference portion 514 in the Z-axis direction is formed in the reference portion 514. In a plan view of the discharge mechanism 500, the optical sensors 522 and 524 ( FIG. 4 ) overlap with the through-hole H1 in part of the movement path of the mobile device 510. The role of the reference portion 514 will be explained later.

[0029] FIG. 4 is a schematic diagram showing a cross section taken along line IV-IV in FIG. 2. Referring to FIG. 4, the distance measurement unit 520 includes optical sensors 522 and 524. Each of the optical sensors 522 and 524 is configured to measure the distance from itself to an object by irradiating the object with light. The optical sensor 522 emits light downward along the Z axis, and the optical sensor 524 emits light upward along the Z axis. Each of the optical sensors 522 and 524 can be realized by various known optical sensors. In the distance measurement unit 520, the optical sensors 522 and 524 are arranged so that their optical axes coincide with each other. When the mover 510 moves along the X axis, the shaped substrate W may be positioned between the optical sensors 522 and 524. In this state, the optical sensor 522 measures the distance from the optical sensor 522 to the upper surface of the shaped substrate W, and the optical sensor 524 measures the distance from the optical sensor 524 to the lower surface of the shaped substrate W. Although details will be described later, the thickness of the molded substrate W is measured based on the measurement results of the optical sensors 522 and 524.

[0030] Each of the optical sensors 522, 524 includes, for example, a light emitter, a light receiver, a first convex lens, and a second convex lens. The light emitter emits light toward an object via the first convex lens. The light reflected by the object is received by the light receiver via the second convex lens. The light receiving position on the light receiver changes depending on the distance between the first convex lens and the object. Based on this position, for example, the distance from the first convex lens to the object is calculated. The configuration of each of the optical sensors 522, 542 is not limited to a configuration including a light emitter, a light receiver, a first convex lens, and a second convex lens, as long as it is configured to emit light onto an object and receive light reflected by the object.

[0031] Referring again to FIG. 2 , the second unloading section 502 includes a pair of rails RL2 and a substrate transport mechanism 530. The pair of rails RL2 extend along the X-axis. The substrate transport mechanism 530 is configured to move along the X-axis on the pair of rails RL2. The substrate transport mechanism 530 includes a base 532, a gripper 534, and a pair of pushers 536. The base 532 moves along the X-axis on the pair of rails RL2, thereby moving the substrate transport mechanism 530 along the X-axis.

[0032] Fig. 5 is a diagram schematically showing the VV cross section of Fig. 2. Referring to Fig. 5, the gripper 534 is provided at the end of the base 532 on the first discharge section 501 side. The gripper 534 is configured to hold the shaped substrate W by clamping the shaped substrate W from above and below. The pair of pushers 536 is provided at the end of the base 532 opposite to the first discharge section 501. The pair of pushers 536 is configured to push the shaped substrate W from behind.

[0033] 6 is a diagram schematically showing how the shaped substrate W is transferred from the first discharge part 501 to the second discharge part 502. Referring to Fig. 6, the pair of holding mechanisms 512 are in an open state in the moving machine 510. In this state, the grippers 534 of the substrate transport mechanism 530 clamp the end of the shaped substrate W on the second discharge part 502 side from above and below.

[0034] In the mover 510, the reference part 514 is provided at the end opposite the second unloading part 502 (the end opposite the direction of movement when the mover 510 moves together with the molded substrate W). Therefore, according to the resin molding apparatus 10, it is possible to prevent the reference part 514 from interfering with the gripper 534 when the molded substrate W is transferred from the first unloading part 501 to the second unloading part 502. In Fig. 6, the direction of movement is to the left, and the direction opposite to the direction of movement is to the right.

[0035] With the gripper 534 clamping the shaped substrate W, the substrate transport mechanism 530 moves along the X-axis. As a result, the shaped substrate W is pulled by the gripper 534, and the shaped substrate W is transferred from the first unloading section 501 to the second unloading section 502. With the gripper 534 clamping the shaped substrate W, the substrate transport mechanism 530 moves toward the end of the pair of rails RL2 on the substrate storage section 110 side. When the substrate transport mechanism 530 arrives near the end of the pair of rails RL2 on the substrate storage section 110 side, it moves along rails (not shown) extending along the Z-axis and X-axis, and wraps around to the rear of the shaped substrate W. The substrate transport mechanism 530 then pushes the shaped substrate W from behind, thereby discharging the shaped substrate W into the substrate storage section 110.

[0036] 7 is a diagram schematically showing the substrate transport mechanism 530 pushing the shaped substrate W from behind. As shown in FIG. 7, the pair of pushers 536 of the substrate transport mechanism 530 contact the rear surface of the shaped substrate W. In this state, the substrate transport mechanism 530 moves along the X axis toward the substrate storage section 110. As a result, the substrate transport mechanism 530 pushes the shaped substrate W from behind and discharges the shaped substrate W into the substrate storage section 110. Once the shaped substrate W has been discharged into the substrate storage section 110, the substrate transport mechanism 530 moves again to the end of the pair of rails RL2 on the first discharge section 501 side.

[0037] [2. Problems Relating to Measurement of Thickness of Molded Substrate] In the resin molding apparatus 10, it is important that the thickness of the manufactured molded substrate W falls within a desired range. In order to determine whether the thickness of the molded substrate W falls within the desired range, it is necessary to measure the thickness of the molded substrate W. As described above, in the resin molding apparatus 10, the thickness of the molded substrate W is measured based on the measurement results of the optical sensors 522 and 524.

[0038] 8 is a diagram for explaining a method for measuring the thickness of the molded substrate W. Referring to FIG. 8 , in the resin molding apparatus 10, the distance Lt between the optical sensors 522 and 524 is measured in advance, and the measured distance Lt is stored. Information regarding the distance Lt is stored, for example, in the storage unit 410 of the computer 400. The optical sensor 522 measures a distance La1 from the optical sensor 522 to the upper surface of the molded substrate W by irradiating the upper surface of the molded substrate W with light and receiving reflected light. The optical sensor 524 measures a distance Lb1 from the optical sensor 524 to the lower surface of the molded substrate W by irradiating the lower surface of the molded substrate W with light and receiving reflected light. The computer 400 measures the thickness of the molded substrate W by subtracting the distance La1 and the distance Lb1 from the distance Lt stored in the storage unit 410.

[0039] FIG. 9 is a diagram for explaining a problem associated with measuring the thickness of the molded substrate W. Referring to FIG. 9 , for example, no problem occurs if the optical axes of the optical sensors 522 and 524 are aligned with the normal to the molded substrate W. The optical sensors 522 and 524 are installed, for example, during the manufacturing process of the resin molding apparatus 10. For example, if the optical sensors 522 and 524 are installed in a short period of time, the optical axes of the optical sensors 522 and 524 do not necessarily perfectly align. In this example, the optical sensor 522 is tilted. Therefore, the measurement result of the optical sensor 522 is longer than the actual distance between the optical sensor 522 and the upper surface of the molded substrate W. As a result, when the distance Lt - (distance La1 + distance Lb1) (see FIG. 8) is calculated, the calculated result is shorter than the actual thickness of the molded substrate W.

[0040] Furthermore, each of the optical sensors 522 and 524 includes one or more lenses. The measurement results of the optical sensors 522 and 524 are affected by contamination of the lenses included in the optical sensors 522 and 524. Therefore, depending on the contamination of the lenses included in the optical sensors 522 and 524, the difference between the measured thickness of the shaped substrate W and the actual thickness of the shaped substrate W may exceed the tolerance range.

[0041] In the resin molding apparatus 10, the thickness of the reference portion 514 is measured in advance, and the measured thickness of the reference portion 514 is stored. The stored thickness of the reference portion 514 is the actual thickness of the reference portion 514. The actual thickness of the reference portion 514 is measured in advance, for example, by using a micrometer or the like. Information regarding the thickness of the reference portion 514 (hereinafter also referred to as the "reference thickness") is stored, for example, in the memory unit 410 of the computer 400. In the resin molding apparatus 10, the measured thickness of the molded substrate W is corrected by using the reference thickness stored in the memory unit 410.

[0042] 10 is a diagram illustrating a procedure for calculating the correction value. Referring to FIG. 10 , as the reference portion 514 passes between the optical sensors 522 and 524, the optical sensor 522 measures a distance La2 from the optical sensor 522 to the upper surface of the reference portion 514, and the optical sensor 524 measures a distance Lb2 from the optical sensor 524 to the lower surface of the reference portion 514. The computer 400 measures the thickness of the reference portion 514 by subtracting the distance La2 and the distance Lb2 from the distance Lt stored in the memory unit 410. The computer 400 calculates a correction value by subtracting the measurement result of the thickness of the reference portion 514 from the reference thickness. The computer 400 corrects the measurement result of the thickness of the molded substrate W by adding the correction value to the measured thickness of the molded substrate W. Alternatively, the computer 400 may calculate the correction value by subtracting the reference thickness from the measurement result of the thickness of the reference portion 514, and correct the measurement result of the thickness of the molded substrate W by subtracting the correction value from the measured thickness of the molded substrate W.

[0043] In the resin molding apparatus 10, a correction value is calculated based on the measurement result of the thickness of the reference portion 514 and the reference thickness, and the measurement result of the thickness of the molded substrate W is corrected based on the correction value. Therefore, according to the resin molding apparatus 10, even if the measurement result of at least one of the optical sensors 522, 524 is inaccurate, the thickness of the molded substrate W can be measured relatively accurately. As a result, for example, the number of steps required to install the optical sensors 522, 524 in the manufacturing process of the resin molding apparatus 10 can be reduced.

[0044] Furthermore, in the resin molding apparatus 10, the measurement results of the thickness of the molded substrate W are corrected by adding a correction value to the measurement results of the thickness of the molded substrate W. Therefore, according to the resin molding apparatus 10, the measurement results of the thickness of the molded substrate W can be corrected relatively easily.

[0045] 11 is a flowchart showing an example of a procedure for correcting the measurement results of the thickness of the molded substrate W. The processing shown in this flowchart is executed by the computer 400.

[0046] 11, computer 400 calculates the thickness of an object that has passed between optical sensors 522 and 524 based on the measurement results of each of optical sensors 522 and 524 from when mobile device 510 starts moving until when mobile device 510 has completely passed between optical sensors 522 and 524 (step S100). Optical sensors 522 and 524 continuously measure the distance at a predetermined cycle.

[0047] Fig. 12 is a diagram schematically showing an example of the transition of the calculated thickness. Referring to Fig. 12, the horizontal axis represents time, and the vertical axis represents the calculated thickness. In this example, the thickness of the molded substrate W is calculated from time t1 to t4. In particular, the thickness of the resin-sealed portion of the molded substrate W is calculated from time t2 to t3. The thickness of the reference portion 514 is calculated from time t5 to t8. In particular, the through-hole H1 passes between the optical sensors 522 and 524 from time t6 to t7. The reference thickness stored in the memory unit 410 corresponds to the thickness calculated from time t7 to t8.

[0048] 11 again, computer 400 identifies data indicating the thickness of reference portion 514 from among the data indicating the calculated change in thickness (see FIG. 12) (step S110). Computer 400 identifies, for example, the section corresponding to through hole H1 (time t6-t7 in FIG. 12), and regards the thickness measured immediately after that section (thickness between times t7-t8 in FIG. 12) as the thickness of reference portion 514.

[0049] As described above, in a plan view of the discharge mechanism 500, each of the optical sensors 522, 524 overlaps with the through-hole H1 of the reference portion 514 at a portion of the movement path of the mover 510. Therefore, according to the resin molding apparatus 10, the measurement results of the optical sensors 522, 524 when each of the optical sensors 522, 524 overlaps with the through-hole H1 of the reference portion 514 are characteristic (the thickness is 0 (zero)), and therefore it is relatively easy to identify the measurement results of the optical sensors 522, 524 that relate to the thickness of the reference portion 514.

[0050] Once the thickness of the reference portion 514 has been identified, the computer 400 calculates a correction value based on the thickness of the identified reference portion 514 (step S120). Specifically, the computer 400 calculates the correction value by subtracting the thickness of the identified reference portion 514 from the reference thickness stored in the storage unit 410.

[0051] The computer 400 identifies (step S130) data indicating the thickness of the formed substrate W from the data indicating the transition of thickness calculated in step S100 (see FIG. 12). The computer 400 regards, for example, each thickness in the longest section (times t1-t4 in FIG. 12) during which thickness is continuously detected as the thickness of the formed substrate W.

[0052] The computer 400 corrects each thickness of the identified formed substrate W by using the correction value calculated in step S120 (step S140). Specifically, the computer 400 corrects each thickness of the identified formed substrate W by adding the correction value to the thickness of the identified formed substrate W.

[0053] [4. Features] As described above, in the resin molding apparatus 10 according to the present embodiment, a correction value is calculated based on the measurement result of the thickness of the reference portion 514 and the reference thickness, and the measurement result of the thickness of the molded substrate W is corrected based on the correction value. Therefore, with the resin molding apparatus 10, even if the measurement result of at least one of the optical sensors 522, 524 is inaccurate, the thickness of the molded substrate W can be measured relatively accurately.

[0054] The substrate W is an example of the "substrate" in the present invention, the reference unit 514 is an example of the "reference unit" in the present invention, and the mover 510 is an example of the "mover" in the present invention. The optical sensors 522 and 524 are each an example of the "first and second optical sensors" in the present invention. The configuration consisting of the distance measuring unit 520 and the computer 400 is an example of the "measurement unit" in the present invention. The memory unit 410 is an example of the "memory unit" in the present invention. The holding mechanism 512 is an example of the "holding mechanism" in the present invention. The rail RL1 is an example of the "first rail" in the present invention, and the rail RL2 is an example of the "second rail" in the present invention.

[0055] 5. Other Embodiments The concept of the above-described embodiment is not limited to the embodiment described above. Hereinafter, examples of other embodiments to which the concept of the above-described embodiment can be applied will be described.

[0056] <5-1> In the above embodiment, the reference unit 514 is provided on the movable unit 510. However, the location where the reference unit 514 is provided is not limited to this. The reference unit 514 may be provided on the substrate transport mechanism 530, for example.

[0057] 13 is a diagram schematically illustrating a plan view of a substrate transport mechanism 530X including a reference portion 514. As shown in FIG. 13, in the substrate transport mechanism 530X, the reference portion 514 is attached to a base portion 532, and is positioned between a pair of pushers 536. In this case, for example, a distance measurement unit 520 is provided between a pair of rails RL2. As the substrate transport mechanism 530X passes between the optical sensors 522, 524 while holding a shaped substrate W, the thickness of the object passing between the optical sensors 522, 524 is measured. A correction value is calculated based on the measured thickness of the reference portion 514, and the measured thickness of the shaped substrate W is corrected based on the correction value.

[0058] <5-2> In the above embodiment, the correction value was calculated by subtracting the measured thickness of the reference portion 514 from the reference thickness. However, the method of calculating the correction value is not limited to this. For example, the correction value may be calculated by dividing the reference thickness by the measured thickness of the reference portion 514. In this case, the measured thickness of the formed substrate W may be corrected by multiplying the measured thickness of the formed substrate W by the correction value. Alternatively, the correction value may be calculated by dividing the measured thickness of the reference portion 514 by the reference thickness, in which case the measured thickness of the formed substrate W may be corrected by dividing the measured thickness of the formed substrate W by the correction value.

[0059] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0060] Furthermore, the above-described embodiments are merely illustrative of the present invention in all respects. Various improvements and modifications to the above-described embodiments are possible within the scope of the present invention. For example, at least a portion of the configuration of any of the embodiments may be combined with at least a portion of the configuration of any of the other embodiments. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0061] [6. Supplementary Notes] This specification discloses various technical ideas including at least the following techniques.

[0062] <Technology 1> (Configuration) A measurement device comprising: a movable device including a reference portion used to measure the thickness of a substrate and moving together with the substrate; a measurement unit including first and second optical sensors, each of which measures distance using light, and measuring the thickness of the substrate as the substrate passes between the first and second optical sensors as the movable device moves; and a memory unit storing a reference thickness, which is the thickness of the reference portion; wherein the measurement unit measures the thickness of the reference portion as the reference portion passes between the first and second optical sensors, calculates a correction value based on the measurement result of the thickness of the reference portion and the reference thickness, and corrects the measurement result of the thickness of the substrate based on the correction value. (Effects, etc.) In this measurement device, the correction value is calculated based on the measurement result of the thickness of the reference portion and the reference thickness, and the measurement result of the thickness of the substrate is corrected based on the correction value. Therefore, with this measurement device, the thickness of the substrate can be measured relatively accurately even if, for example, the measurement result of at least one of the first and second optical sensors is inaccurate.

[0063] <Technology 2> (Configuration) The measuring device according to Technology 1, wherein the substrate is a molded substrate molded from resin. (Effects, etc.) In this measuring device, a correction value is calculated based on the measurement result of the thickness of the reference portion and the reference thickness, and the measurement result of the thickness of the molded substrate is corrected based on the correction value. Therefore, with this measuring device, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the thickness of the molded substrate can be measured relatively accurately.

[0064] <Technology 3> (Configuration) The measuring device according to Technology 1 or Technology 2, wherein the mover further includes a holding mechanism that holds the substrate with at least a portion of each of the first and second surfaces of the substrate exposed, and the holding mechanism holds the substrate by clamping at least a portion of the peripheral edge of the substrate. (Effects, etc.) In this measuring device, the substrate is held by the holding mechanism by clamping at least a portion of the peripheral edge of the substrate. Therefore, with this measuring device, at least a portion of the peripheral edge of the substrate is clamped by the holding mechanism when measuring the thickness of the substrate, so that warping of the substrate when measuring the thickness of the substrate can be suppressed.

[0065] <Technology 4> (Configuration) The measurement device according to any one of Technologies 1 to 3, wherein a through-hole is formed in the reference portion, and in plan view, each of the first and second optical sensors overlaps with the through-hole at a portion of the movement path of the mobile device. (Effects, etc.) In this measurement device, in plan view, each of the first and second optical sensors overlaps with the through-hole in the reference portion at a portion of the movement path of the mobile device. Therefore, with this measurement device, the measurement results of the first and second optical sensors when each of the first and second optical sensors overlaps with the through-hole in the reference portion are distinctive, making it relatively easy to identify the measurement results of the first and second optical sensors that relate to the thickness of the reference portion.

[0066] <Technology 5> (Configuration) The measurement device according to any one of Technologies 1 to 4, wherein the correction value is the difference between the reference thickness and the measurement result of the thickness of the reference portion. (Effects, etc.) In this measurement device, the correction value is the difference between the reference thickness and the measurement result of the thickness of the reference portion. Therefore, with this measurement device, it is possible to relatively easily correct the measurement result of the thickness of the substrate.

[0067] <Technology 6> (Configuration) The measuring device according to any one of Technology 1 to Technology 5, wherein the mover moves along a first rail, and the substrate is transferred to a second rail as the mover moves to the end of the first rail together with the substrate, and the transfer of the substrate to the second rail is performed by a gripper pulling the substrate, and the reference unit is provided at an end of the mover in a direction opposite to the direction of movement of the mover when the mover moves together with the substrate. (Effects, etc.) In this measuring device, the reference unit is provided at an end of the mover in a direction opposite to the direction of movement of the mover when the mover moves together with the substrate. Therefore, this measuring device can prevent the reference unit from interfering with the gripper.

[0068] <Technology 7> (Configuration) A resin molding apparatus that uses resin to mold a pre-molded substrate that is not molded from resin, the resin molding apparatus comprising the measuring device according to any one of Technologies 1 to 6. (Effects, etc.) With this resin molding apparatus, for example, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the thickness of the substrate can be measured relatively accurately.

[0069] <Technology 8> (Configuration) A method for manufacturing a resin molded product, comprising manufacturing a resin molded product by molding the pre-molding substrate with resin using the resin molding device described in Technology 7. (Effects, etc.) According to this method for manufacturing a resin molded product, for example, even if the measurement result of at least one of the first and second optical sensors is inaccurate, the thickness of the resin molded product can be measured relatively accurately.

[0070] 10 Resin molding device, 50 Loading and unloading mechanism, 100 Substrate supply and storage module, 110 Substrate storage section, 120 Robot hand, 130 Substrate temporary storage section, 140, 530 Substrate transport mechanism, 200 Resin molding module, 210 Compression molding section, 211 Molding mold, 212 Lower mold, 212C Cavity, 214 Upper mold, 216 Mold clamping mechanism, 300 Resin material supply module, 310 Moving table, 320 Resin material storage section, 322 Recess, 330 Resin material supply mechanism, 340, 360 Resin material transport mechanism, 350 Resin temporary storage section, 400 Computer, 410 Memory section, 500 Unloading mechanism, 501 First unloading section, 502 Second unloading section, 510 Moving machine, 511 Moving machine main body, 512 Holding mechanism, 514 Reference unit, 520 distance measurement unit, 522, 524 optical sensor, 532 base, 534 gripper, 536 pusher, 590 carry-in mechanism, H1 through hole, P resin material, RL1, RL2 rails, W substrate.

Claims

1. A measuring device comprising: a moving machine including a reference part used to measure the thickness of a substrate and moving together with the substrate; a measuring unit including first and second optical sensors each for measuring distance by light, measuring the thickness of the substrate as the substrate passes between the first and second optical sensors as the moving machine moves; and a memory unit for storing a reference thickness, which is the thickness of the reference part; wherein the measuring unit measures the thickness of the reference part as the reference part passes between the first and second optical sensors, calculates a correction value based on the measurement result of the thickness of the reference part and the reference thickness, and corrects the measurement result of the thickness of the substrate based on the correction value.

2. The measuring device according to claim 1, wherein the substrate is a molded substrate made of resin.

3. A measuring device according to claim 1 or claim 2, wherein the mover further includes a holding mechanism that holds the substrate with at least a portion of each of the first and second surfaces of the substrate exposed, and the holding mechanism holds the substrate by clamping at least a portion of the peripheral edge of the substrate.

4. A measuring device as claimed in any one of claims 1 to 3, wherein a through hole is formed in the reference portion, and in a plan view, each of the first and second optical sensors overlaps with the through hole in a portion of the movement path of the mobile device.

5. A measuring device according to any one of claims 1 to 4, wherein the correction value is the difference between the reference thickness and the measurement result of the thickness of the reference portion.

6. A measuring device as claimed in any one of claims 1 to 5, wherein the mover moves along a first rail, the substrate is transferred to a second rail as the mover moves together with the substrate to the end of the first rail, the transfer of the substrate to the second rail is achieved by a gripper pulling the substrate, and the reference portion is provided at the end of the mover in the direction opposite to the direction of movement when the mover moves together with the substrate.

7. A resin molding apparatus for molding a pre-molded substrate, which is not molded from resin, with resin, the resin molding apparatus comprising the measuring device according to any one of claims 1 to 6.

8. A method for manufacturing a resin molded product, comprising using the resin molding device according to claim 7 to mold the pre-molding substrate with resin to manufacture the resin molded product.

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