Chip recovery device, chip recovery method, and chip recovery system

Abstract

The present invention comprises: a sub-duct (32) having formed therein a first opening for receiving chips of a tape member discharged from a tape feeder provided in a component mounting device (3), and a second opening for discharging the chips (KZ) to a main duct (31); the main duct (31) connected to the sub-duct (32) through the second opening; an air blower (51) which is installed in the sub-duct(32) and moves the chips (KZ) in the sub-duct (32) to the main duct (31) by blowing air toward the second opening; a shutter (53) that opens / closes the second opening; and a control unit (62) that controls the opening / closing of the shutter. The control unit (62) controls to put the shutter in a closed state when the air blower (51) is not blowing air.

Description

Chip collection device, chip collection method, and chip collection system

[0001] The present disclosure relates to a chip collection device, a chip collection method, and a chip collection system that collect chips of a tape member discharged from a tape feeder.

[0002] BACKGROUND ART Conventionally, in a component mounting apparatus that mounts components on a board, a chip recovery system is known that automatically recovers chips of a tape material discharged from a tape feeder serving as a component supply unit (for example, see Patent Document 1 listed below).

[0003] International Publication No. 2021 / 131165

[0004] The present disclosure provides a chip collection device and the like that can suppress backflow of chips and efficiently transport chips.

[0005] A chip collection device according to one aspect of the present disclosure includes a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder provided in a component mounting device and a second opening for discharging the chips to a main duct, a main duct connected to the sub-duct through the second opening, an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct, a shutter for opening and closing the second opening, and a control unit for controlling the opening and closing of the shutter, wherein the control unit controls the shutter to a closed state when the air blower is not blowing air.

[0006] A chip collection method according to one aspect of the present disclosure is a chip collection method carried out by a chip collection device comprising: a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder provided in a component mounting device and a second opening for discharging the chips to a main duct; a main duct connected to the sub-duct through the second opening; an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct; and a shutter for opening and closing the second opening, wherein control information indicating whether the air blower is blowing air or not is obtained, and if the air blower is not blowing air based on the control information, the shutter is controlled to a closed state.

[0007] A chip collection system according to one aspect of the present disclosure includes a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder provided in a component mounting device and a second opening for discharging the chips to a main duct, a main duct connected to the sub-duct through the second opening, an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct, a shutter for opening and closing the second opening, and a control unit for controlling the opening and closing of the shutter, wherein the control unit controls the shutter to a closed state when the air blower is not blowing air.

[0008] According to the chip collection device of the present disclosure, a chip collection device is provided that can suppress backflow of chips and efficiently transport chips.

[0009] FIG. 1 is a perspective view showing a chip collection system according to an embodiment together with a work line of a component mounting device. FIG. 2 is a side view of a component mounting device according to an embodiment. FIG. 3 is a cross-sectional view of a portion of a component mounting device and a portion of a chip collection system according to an embodiment. FIG. 4 is a perspective view of a chip collection system according to an embodiment. FIG. 5A is a diagram showing an example of a schematic plan view of a chip collection system according to an embodiment. FIG. 5B is an enlarged view of a portion of FIG. 5A. FIG. 6 is a cross-sectional view illustrating a first example of a shutter and its surrounding configuration according to this embodiment. FIG. 7 is a cross-sectional view illustrating a first example of a shutter and its surrounding configuration according to this embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 6. FIG. 9 is a cross-sectional view taken along line IX-IX of FIG. 7. FIG. 10 is a cross-sectional view illustrating a second example of a shutter and its surrounding configuration according to this embodiment. FIG. 11 is a cross-sectional view illustrating a second example of a shutter and its surrounding configuration according to this embodiment. FIG. 12 is a cross-sectional view illustrating a third example of a shutter and its surrounding configuration according to this embodiment. FIG. 13 is a cross-sectional view illustrating a third example of a shutter and its surrounding configuration according to this embodiment. FIG. 14 is a cross-sectional view illustrating a third example of the shutter and its peripheral configuration according to the present embodiment. FIG. 15 is a cross-sectional view illustrating a fourth example of the shutter and its peripheral configuration according to the present embodiment. FIG. 16 is a cross-sectional view illustrating the fourth example of the shutter and its peripheral configuration according to the present embodiment. FIG. 17 is a cross-sectional view illustrating another example of the shutter and its peripheral configuration according to the present embodiment. FIG. 18 is a perspective view illustrating the configuration of a collection unit according to the present embodiment. FIG. 19 is a cross-sectional view illustrating the configuration of a collection unit according to the present embodiment. FIG. 20 is a perspective view illustrating the configuration of a cover member. FIG. 21 is a diagram illustrating an example of a control unit and a valve that is a control target thereof in the embodiment. FIG. 22 is a diagram illustrating an example of a control unit and a control target thereof when the shutter and its peripheral configuration is the second example in the present embodiment. FIG. 23 is a diagram illustrating an example of a control unit and a control target thereof when the shutter and its peripheral configuration is the third example in the present embodiment.Fig. 24 is a flowchart showing a first example of a chip collection method of the chip collection system according to the present embodiment. Fig. 25 is a diagram for explaining a first example of the operation of the chip collection system according to the present embodiment. Fig. 26 is a diagram for explaining a second example of the operation of the chip collection system according to the present embodiment. Fig. 27 is a diagram for explaining a third example of the operation of the chip collection system according to the present embodiment. Fig. 28 is a flowchart showing a second example of a chip collection method by the chip collection system according to the present embodiment. Fig. 29 is a cross-sectional view for explaining the configuration of a collection unit when a blower is used as an air blower.

[0010] (Findings that form the basis of the present disclosure) In a chip collection system according to the prior art, chips are transported by air by forming an air flow in a transport section that is formed in a duct shape. The chip collection system has a receiving section that collects chips of the tape material that drop from the component mounting device and a recovery path that feeds the chips into the transport section that transports the chips, and a shutter member that separates the receiving section from the recovery path is arranged at the connection between the receiving section and the recovery path.

[0011] This shutter member is composed of a hinged swingable plate that can be opened and closed unintentionally due to the air pressure that generates the air flow. If the shutter member opens unintentionally, the air pressure can cause chips to flow back from the downstream side to the upstream side. Furthermore, if air is flowing downstream of the shutter member, backflow weakens the air pressure that generates the air flow downstream, which can reduce the efficiency of chip transport. Furthermore, if backflow occurs, air may reach the space where components are mounted on the board via the duct. This can cause dust or chips stirred up by the backflowing air to get into the space where components are mounted on the board, potentially leading to component mounting defects.

[0012] A chip collection device according to a first aspect of the present disclosure includes a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder provided in a component mounting device and a second opening for discharging the chips to a main duct, a main duct connected to the sub-duct through the second opening, an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct, a shutter for opening and closing the second opening, and a control unit for controlling the opening and closing of the shutter, wherein the control unit controls the shutter to a closed state when the air blower is not blowing air.

[0013] According to this, since the shutter is controlled to the closed state when the air blower is not blowing out air, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter when air is not being blown out, thereby preventing chips from flowing back and allowing chips to be transported efficiently.

[0014] A chip collection device according to a second aspect of the present disclosure is the chip collection device according to the first aspect, further comprising a regulating mechanism that regulates the shutter to a closed state, and the control unit controls the shutter to a closed state by maintaining the regulation by the regulating mechanism when the air blower is not blowing air, and controls the shutter to an open state by releasing the regulation by the regulating mechanism when the air blower is blowing air.

[0015] According to this, by using the regulating mechanism to maintain the shutter in a closed state, the shutter is controlled to a closed state when the air blower is not blowing air, so that it is possible to suppress air from flowing back from the downstream side to the upstream side of the shutter when air is not being blown out. Therefore, it is possible to suppress the backflow of chips. Furthermore, when the air blower is blowing air, the shutter is controlled to an open state by releasing the restriction by the regulating mechanism, so that chips can be transported efficiently.

[0016] A chip collection device according to a third aspect of the present disclosure is the chip collection device according to the second aspect, wherein the shutter is freely movable between a first position that blocks the second opening and a second position that opens the second opening, the regulating mechanism is switchable between a regulating state that regulates the shutter to the first position and a non-regulating state that does not regulate movement of the shutter, and the control unit controls the regulating mechanism to the regulating state when the air blower is not blowing air, thereby controlling the shutter to a closed state.

[0017] A chip collection device according to a fourth aspect of the present disclosure is the chip collection device according to the first aspect, further comprising a cylinder for opening and closing the shutter, and the control unit controls the opening and closing of the shutter by driving the cylinder.

[0018] According to this, by using the cylinder to maintain the shutter in a closed state, the shutter is controlled to a closed state when the air blower is not blowing air, so that it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter when air is not being blown out. Therefore, it is possible to prevent chips from flowing back. Also, since the cylinder is used to control the shutter to an open state when the air blower is blowing air, it is possible to efficiently transport chips.

[0019] A chip collection device according to a fifth aspect of the present disclosure is a chip collection device according to any one of the first to fourth aspects, wherein the shutter is a partition plate for closing the second opening, the partition plate being rotatable on a rotation axis near a first side of the partition plate, and the partition plate has a shape that is convexly curved in the direction of the air flow.

[0020] According to this, the shutter partition plate has a shape that is bent convexly in the air flow direction, so that it is easy to receive air from the air blower. Therefore, when the air blower is blowing air, the shutter can be easily opened by the pressing force of the air.

[0021] A chip collection device according to a sixth aspect of the present disclosure is the chip collection device according to the second or third aspect, wherein the shutter is a partition plate for closing the second opening, the partition plate being rotatable on a rotation axis near a first side of the partition plate, the partition plate having a third opening, and the partition plate having a wing shape that receives lift in a direction in which the shutter is opened by air flowing from the third opening toward a second side opposite the first side.

[0022] According to this, since the partition plate of the shutter has a wing shape, the shutter can be easily opened by the lift force of the air from the air blower.

[0023] A chip collection device according to a seventh aspect of the present disclosure is the chip collection device according to the sixth aspect, wherein the partition plate has a blade shape in which the area of ​​a first surface on the downstream side of the air is larger than the area of ​​a second surface on the upstream side of the air.

[0024] A chip collection device according to an eighth aspect of the present disclosure is the chip collection device according to the sixth or seventh aspect, wherein the partition plate has a shape that is curved convexly in the air flow direction.

[0025] According to this, the shutter partition plate has a shape that is bent convexly in the air flow direction, so that it is easy to receive air from the air blower. Therefore, when the air blower is blowing air, the shutter can be easily opened by the pressing force of the air.

[0026] A chip collection device according to a ninth aspect of the present disclosure is a chip collection device according to any one of the first to eighth aspects, and includes a first chip transport unit that is installed in the sub-duct and moves the chips in the sub-duct to the main duct by air, a second chip transport unit that moves the chips that have been moved from the sub-duct into the main duct through an opening in the main duct to an outlet of the main duct by air, a first sensor that detects the accumulation of chips in a first portion of the sub-duct downstream of the first chip transport unit, a second sensor that detects the accumulation of chips in a second portion of the main duct downstream of the second chip transport unit, and a control unit that controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor.

[0027] According to this, the operation of the first chip transport unit and the second chip transport unit is controlled depending on whether chips are accumulated in a first portion downstream of the first chip transport unit and whether chips are accumulated in a second portion downstream of the second chip transport unit, so that, for example, it is possible to prevent chips from accumulating more than a predetermined amount, and therefore, it is possible to efficiently move chips of the tape member inside the duct to the outlet of the duct.

[0028] A chip collection method according to a tenth aspect of the present disclosure is a chip collection method carried out by a chip collection device comprising: a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder provided in a component mounting device and a second opening for discharging the chips to a main duct; a main duct connected to the sub-duct through the second opening; an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct; and a shutter for opening and closing the second opening, wherein control information indicating whether the air blower is blowing air or not is obtained, and if the air blower is not blowing air based on the control information, the shutter is controlled to a closed state.

[0029] According to this, since the shutter is controlled to the closed state when the air blower is not blowing out air, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter when air is not being blown out, thereby preventing chips from flowing back and allowing chips to be transported efficiently.

[0030] A chip collection device according to an eleventh aspect of the present disclosure includes a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder provided in a component mounting device and a second opening for discharging the chips to a main duct, a main duct connected to the sub-duct through the second opening, an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct, a shutter for opening and closing the second opening, and a control unit for controlling the opening and closing of the shutter, wherein the control unit controls the shutter to a closed state when the air blower is not blowing air.

[0031] According to this, since the shutter is controlled to the closed state when the air blower is not blowing out air, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter when air is not being blown out, thereby preventing chips from flowing back and allowing chips to be transported efficiently.

[0032] (Embodiments) Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0033] 1 shows a work line 2 on which a chip collection system 1 according to this embodiment is installed. The work line 2 has a configuration in which multiple (here, three) component mounting devices 3a-3c (hereinafter, each of the component mounting devices 3a-3c will also be referred to as a component mounting device 3) that mount components on a circuit board KB are lined up in one direction, and adjacent component mounting devices 3 exchange the circuit board KB and mount components on the circuit board KB. In this embodiment, the direction in which the circuit board KB is exchanged on the work line 2 (the left-right direction, the direction in which the component mounting devices 3a-3c are lined up) is referred to as the X direction, the horizontal direction (front-back direction) perpendicular to the X direction is referred to as the Y direction, and the up-down direction is referred to as the Z direction. The chip collection system 1 is an example of a chip collection device.

[0034] 2, the component mounting device 3 has a base 11 and a cover member 12 that covers the top of the base 11. A work space 13 that is covered by the cover member 12 is formed above the base 11. A board transport unit 14 that extends in the X direction through the work space 13 is installed on the top surface of the base 11. The board transport unit 14 is made up of a pair of conveyor mechanisms aligned in the Y direction. The board transport unit 14 transports the board KB in the X direction and positions the board KB at a predetermined work position within the work space 13.

[0035] 2, feeder carriages 15 are attached to the front and rear ends of base 11. A plurality of tape feeders 16 are attached to each feeder carriage 15 and aligned in the X direction (see also FIG. 1). Each tape feeder 16 takes in carrier tape 18 as a tape material unwound from a tape reel 17 held by feeder carriage 15, transports it in the Y direction (toward board transport section 14), and supplies components BH stored on carrier tape 18 to component supply position 16K.

[0036] 2, two mounting heads 21 are provided above the base 11 and are movable by a head movement mechanism 22. Each mounting head 21 has a nozzle 21N extending downward. The head movement mechanism 22 is, for example, a Cartesian coordinate robot, and moves the two mounting heads 21 independently within a horizontal plane. Each mounting head 21 picks up a component BH supplied to the component supply position 16K by the tape feeder 16 by suctioning it onto the lower end of the nozzle 21N (FIG. 2).

[0037] 2, the component mounting device 3 includes a control device 23. The control device 23 controls the operations of the board transport unit 14, the tape feeder 16, the mounting head 21, the head moving mechanism 22, and the like.

[0038] When performing a component mounting operation, the component mounting device 3 first operates the board transport unit 14 to receive the board KB from an upstream device and position it at the work position. After positioning the board KB at the work position, the component mounting device 3 operates the tape feeder 16 to supply components BH to the component supply position 16K, and then operates the head moving mechanism 22 to have the mounting head 21 repeatedly perform a component transfer operation. During the component transfer operation, the mounting head 21 picks up the components BH supplied by the tape feeder 16 and mounts the components BH on the board KB.

[0039] Each component mounting device 3 mounts the components BH to be mounted on the board KB by repeatedly performing the component transfer operation using the mounting head 21, and then operates the board transport section 14 to transport the board KB downstream. In this way, each of the three component mounting devices 3 mounts a component BH on the board KB, and when the component mounting device 3 located furthest downstream transports the board KB, the component mounting operation on that board KB on the work line 2 is completed.

[0040] Next, the chip collection system 1 will be described. First, the cutting of the carrier tape 18 will be described. As shown in FIG. 2, the feeder cart 15 provided in each component mounting device 3 has a tape cutter 24 and a chute 25. The tape cutter 24 is provided below the tape feeder 16 and cuts the carrier tape 18 after the tape feeder 16 has finished supplying components BH. As also shown in FIG. 3 (an enlarged view of region RY in FIG. 2), the chute 25 is provided below the tape cutter 24. The chute 25 guides chips KZ of the carrier tape 18 that are cut by the tape cutter 24 and fall under their own weight, and discharges them outside the feeder cart 15 through a discharge opening 25K at the bottom end.

[0041] In this way, chips KZ of the carrier tape 18 are generated from each of the component mounting devices 3 that make up the work line 2, and a huge amount of chips KZ of the carrier tape 18 is generated throughout the entire work line 2. The chip collection system 1 in this embodiment automatically collects the large amount of chips KZ of the carrier tape 18 generated from the work line 2 without manual intervention, thereby facilitating the disposal of the chips KZ.

[0042] 1, 4, and 5A, the chip collection system 1 includes two rows of main ducts 31, a plurality of sub-ducts 32, and a collection section 80. Each of the two rows of main ducts 31 extends in the direction of extension of the work line 2 (X direction) below the work line 2 (specifically, below each of the plurality of component mounting devices 3), and has an opening on each of the upstream side (one end) and downstream side (the other end). Hereinafter, the air outlet of the main duct 31 will be referred to as outlet 31D.

[0043] 4 and 5A, the main duct 31 is formed by connecting a plurality of duct pieces 41 in series in one direction (the X direction, which is the direction in which the component mounting devices 3 are arranged). As shown in Fig. 3, the duct piece 41 has a hollow shape with a rectangular cross section and includes two pairs of walls that face each other in the Y direction and the Z direction.

[0044] 4, the main duct 31 is formed by combining two types of duct pieces 41: a main duct piece 41M and a sub-duct piece 41S, which is a duct piece for adjusting the distance (adjustment duct piece). The main duct piece 41M has an opening 41K formed in one of two walls corresponding to the Y direction. Because the main duct 31 has multiple main duct pieces 41M, multiple openings 41K are provided in the main duct 31 in the direction in which the main duct 31 extends (X direction). In the second aspect of the chip collection system, the opening 41K is an example of a first opening.

[0045] 1, 2, and 4, the subducts 32 are each installed on the floor surface FL below the feeder cart 15, and each subduct 32 is connected to two walls facing each other in the front and rear (Y direction) of the two rows of main ducts 31 so as to cover the openings 41K (see also FIG. 5A). The subducts 32 include a plurality of subducts 32 facing the main ducts 31 in the front row of the two rows of main ducts 31, and a plurality of subducts 32 facing the main ducts 31 in the rear row. The subducts 32 facing the main ducts 31 in the front row are connected to and communicate with openings 41K provided in the front walls of the main ducts 31 in the front row. Furthermore, the subducts 32 facing the main ducts 31 in the rear row are connected to and communicate with openings 41K provided in the rear walls of the main ducts 31 in the rear row.

[0046] 5A , chips KZ discharged from the component mounting device 3a are received by four sub-ducts 32a and transferred to the main duct 31a to which the four sub-ducts 32a are connected. The two sub-ducts 32a located at the front of the four sub-ducts 32a receive chips KZ discharged from one of the front feeder carriages 15 provided in the component mounting device 3a. The two sub-ducts 32a located at the rear of the four sub-ducts 32a receive chips KZ discharged from one of the front feeder carriages 15 provided in the component mounting device 3a. The four sub-ducts 32a are sub-ducts located below the component mounting device 3a among the multiple sub-ducts 32. The main duct 31a is a part of the main duct 31 located below the component mounting device 3a. In other words, the main duct 31a is one of the multiple divided areas that make up the main duct 31, and is the divided area that corresponds to the area below the component mounting device 3a among the multiple divided areas that are arranged in series with each other.

[0047] Similarly, chips KZ discharged from the component mounting device 3b are received by four sub-ducts 32b of the sub-ducts 32 located below the component mounting device 3b and transferred to the main duct 31b to which the four sub-ducts 32b are connected. The two sub-ducts 32b located at the front of the four sub-ducts 32b receive chips KZ discharged from one of the front feeder carriages 15 of the component mounting device 3b. The two sub-ducts 32b located at the rear of the four sub-ducts 32b receive chips KZ discharged from one of the front feeder carriages 15 of the component mounting device 3b. The four sub-ducts 32b are sub-ducts located below the component mounting device 3b of the multiple sub-ducts 32. The main duct 31b is a part of the main duct 31 located below the component mounting device 3b. In other words, the main duct 31b is one of the multiple divided areas that make up the main duct 31, and is the divided area that corresponds to the area below the component mounting device 3b among the multiple divided areas that are arranged in series with each other.

[0048] Similarly, chips KZ discharged from the component mounting device 3c are received by four sub-ducts 32c of the multiple sub-ducts 32 located below the component mounting device 3c and are then transferred to the main duct 31c to which the four sub-ducts 32c are connected. The two sub-ducts 32c located at the front of the four sub-ducts 32c receive chips KZ discharged from one of the front feeder carriages 15 provided for the component mounting device 3c. The two sub-ducts 32c located at the rear of the four sub-ducts 32c receive chips KZ discharged from one of the front feeder carriages 15 provided for the component mounting device 3c. The four sub-ducts 32c are sub-ducts of the multiple sub-ducts 32 located below the component mounting device 3c. The main duct 31c is a part of the main duct 31 located below the component mounting device 3c. In other words, the main duct 31c is one of the multiple divided areas that make up the main duct 31, and is the divided area that corresponds to the area below the component mounting device 3c among the multiple divided areas that are arranged in series with each other.

[0049] 3, an opening 32K that opens upward (toward the tape feeder 16) is provided in the upper wall of each sub-duct 32. The sub-duct 32 receives, through the opening 32K, chips KZ of the carrier tape 18 that fall under their own weight through the corresponding chute 25 located directly above (i.e., chips KZ discharged from the tape feeder 16). In the first aspect of the chip collection system, the opening 32K is an example of a first opening.

[0050] 3 and 5A, an air blower 51 is provided inside each sub-duct 32. The air blower 51 is, for example, made of a pipe-shaped member extending in the X direction and has a plurality of air outlets 51N lined up in the X direction. As shown in FIG. 3, each air outlet 51N opens toward the opening 41K of the main duct 31. This allows each air blower 51 to blow air toward the opening 41K of the main duct 31, thereby moving chips inside the sub-duct 32 toward the main duct 31. The opening 41K is an example of a second opening.

[0051] Each of the sub-ducts 32 is provided with one air blower 51. Four sub-ducts 32a arranged at the bottom of component mounting device 3a are provided with four air blowers 51a, respectively. Four sub-ducts 32b arranged at the bottom of component mounting device 3b are provided with four air blowers 51b, respectively. Four sub-ducts 32c arranged at the bottom of component mounting device 3c are provided with four air blowers 51c, respectively. The air blowers 51 are an example of a first chip transport section.

[0052] Furthermore, a sensor 58 for detecting accumulation of chips KZ is provided in the first region 35 downstream of the air blower 51 in each sub-duct 32. The sensor 58 is provided at a height reached by a first amount of accumulated chips KZ. In other words, when the sensor 58 detects the presence of an object (chips KZ), it indicates that a first amount of chips KZ has accumulated in the first region 35. The first amount is, for example, the amount of chips KZ that can be moved in a predetermined period or less by air at a flow rate that can be blown out by the air blower 51. The sensor 58 is a sensor that detects the presence or absence of an object, and is, for example, a laser sensor, an infrared sensor, or an ultrasonic sensor. The sensor 58 is an example of a first sensor. The first region 35 may be a region where the sub-duct 32 receives chips KZ discharged from the tape feeder 16. In other words, the first region 35 may be a region directly below the opening 32K. The first portion 35 need not necessarily be the portion that receives the chips KZ, as long as it is a portion near the portion where the sub-duct 32 receives the chips KZ discharged from the tape feeder 16. The portion near the portion that receives the chips KZ is, for example, a portion that is closer to the opening 32K than the opening 41K through which the sub-duct 32 discharges the chips to the main duct 31.

[0053] In this embodiment, an air blower 51 is provided for each sub-duct 32 (FIG. 5A). For example, the sub-duct 32a, which is located below the component mounting device 3a, has an air blower 51a and a sensor 58a, the sub-duct 32b, which is located below the component mounting device 3b, has an air blower 51b and a sensor 58b, and the sub-duct 32c, which is located below the component mounting device 3c, has an air blower 51c and a sensor 58c.

[0054] In FIG. 5B , the sub-duct 32 forms a first flow path through which air flows in the X direction, and the main duct 31 forms a second flow path through which air flows in the Y direction. That is, at least one of the main duct 31 and the sub-duct 32 forms a first flow path through which air flows in the X direction and a second flow path through which air flows in the Y direction, connected to the first flow path and intersecting the X direction. The sub-duct 32 has an opening 36 and a filter 37. The opening 36 is disposed on the side surface of the first flow path facing the Y direction. The filter 37 covers the opening 36 and allows air to pass through but blocks chips. The filter 37 is a member having multiple through holes smaller than the size of the chips or dust. The filter 37 may be, for example, a plate-like member having multiple through holes smaller than the size of the chips or dust, or may be a mesh. The opening 36 may also be a multiple through holes smaller than the size of the chips or dust. That is, the multiple through holes may be provided directly in the main duct 31.

[0055] In this way, the opening 36 and the filter 37 may be provided at the end of the Y direction in the main duct 31 and the sub-duct 32, where the air direction changes from the Y direction to the X direction. This allows air passing through the sub-duct 32 in the Y direction to be discharged through the opening 36 and the filter 37, making it possible to maintain the air flow velocity at a certain level or higher with less energy consumption. Note that Figure 5B is an enlarged view of a portion of Figure 5A.

[0056] 4, the multiple air blowers 51 located on the front side of the main duct 31 and lined up in the X direction are each connected to a first air supply path 52A extending in the X direction in front of the main duct 31. Furthermore, the multiple air blowers 51 located on the rear side of the main duct 31 and lined up in the X direction are each connected to a second air supply path 52B extending in the X direction behind the main duct 31.

[0057] 3 and 5A, a shutter 53 for opening and closing an opening 41K is provided on the wall of a main duct piece 41M that constitutes the main duct 31.

[0058] 4, the first air supply passage 52A arranged on the front side of the main duct 31 and the second air supply passage 52B arranged on the rear side of the main duct 31 are each connected to a control valve 61. The control valve 61 is connected to an air generation source (supply source) not shown.

[0059] The operation of the control valve 61 is controlled by a control unit 62 (FIG. 4), and air generated by the air generation source is supplied to the first air supply path 52A or the second air supply path 52B. When air is supplied to the first air supply path 52A by the control valve 61, air is blown out from each of the plurality of air blowers 51 arranged in the plurality of sub-ducts 32 arranged on the front side of the plurality of sub-ducts 32. When air is supplied to the second air supply path 52B by the control valve 61, air is blown out from each of the plurality of air blowers 51 arranged in the plurality of sub-ducts 32 arranged on the rear side of the plurality of sub-ducts 32.

[0060] Each of the plurality of air blowers 51 is provided with a valve 63 (for example, a solenoid valve or an electric valve) that opens and closes to control the on / off of air blowing from the air blower 51. As shown in Fig. 21 , the opening and closing of the plurality of valves 63 corresponding to the plurality of air blowers 51 is controlled by a control unit 62.

[0061] The control unit 62 may be configured, for example, by a processor that executes a program and a memory (non-volatile memory) that stores the program. The control unit 62 may be configured, for example, by a dedicated circuit.

[0062] 4 and 5A , multiple air blowers 71 are provided in the main duct 31. These multiple air blowers 71 are arranged in series in the extension direction of the main duct 31. Furthermore, a shutter 72 having a configuration similar to the shutter 53 is provided downstream of each of the multiple air blowers 71 in the main duct 31. In this embodiment, the air blowers 71 are provided in the sub-duct piece 41S (i.e., between the two main duct units). The multiple air blowers 71 move the chips KZ that have been moved from each sub-duct 32 into the main duct 31 through the opening 41K to the outlet 31D of the main duct 31. Specifically, each of the multiple air blowers 71 blows air toward the outlet 31D of the main duct 31, thereby moving the chips KZ in the main duct 31. The multiple air blowers 71 are an example of multiple second chip conveying units.

[0063] Furthermore, a sensor 73 for detecting accumulation of chips KZ is provided in a second portion of each main duct 31 downstream of the air blower 71. The sensor 73 is provided at a height reached by a second amount of accumulated chips KZ. In other words, when the sensor 73 detects the presence of an object (chips KZ), it indicates that a second amount of chips KZ has accumulated in the second portion. The second amount is, for example, the amount of chips KZ that can be moved within a predetermined period of time by air at a flow rate that can be blown out by the air blower 71. The sensor 73 is a sensor that detects the presence or absence of an object, and is, for example, a laser sensor, an infrared sensor, or an ultrasonic sensor. The sensor 73 is an example of a second sensor. The second portion is a portion of the main duct 31 where the chips KZ discharged from the sub-duct 32 are received. In other words, the second portion is a portion immediately downstream of the opening 32K. The second portion need not be the portion that receives the chips KZ, but may be a portion near the portion where the main duct 31 receives the chips KZ discharged from the sub-duct 32. The portion near the portion that receives the chips KZ is, for example, a portion that is closer to the opening 41K than the portion where the main duct 31 discharges the chips to the next main duct 31.

[0064] In this embodiment, the air blowers 71 are provided for each main duct unit, i.e., at positions that separate two (or more) of the openings 41K (FIG. 5A). That is, the air blowers 71 are installed in the multiple divided regions of the main duct 31, one for each divided region. For example, the air blower 71a and the sensor 73a are provided in the main duct 31a located below the component mounting device 3a, the air blower 71b and the sensor 73b are provided in the main duct 31b located below the component mounting device 3b, and the air blower 71c and the sensor 73c are provided in the main duct 31c located below the component mounting device 3c.

[0065] 4, the plurality of air blowers 71 are connected to air supply pipes 71T (FIG. 4) that extend in the X direction, and the air supply pipes 71T are connected to a control valve 61. When a control unit 62 controls the control valve 61 to supply air to each air blower 71 through the air supply pipes 71T, air is blown out from the air blower 71.

[0066] Each of the plurality of air blowers 71 is provided with a valve 64 (electromagnetic valve or electric valve) that opens and closes to control the on / off of air blowing from the air blower 71. As shown in Fig. 21 , the opening and closing of the plurality of valves 64 corresponding to the plurality of air blowers 71 is controlled by a control unit 62.

[0067] The outlet 31D of the main duct 31 is connected to the recovery section 80. The recovery section 80 receives the chips KZ discharged from the outlet 31D of the main duct 31.

[0068] Figures 6 and 7 are cross-sectional views for explaining a first example of the shutter and its peripheral configuration according to this embodiment. Figure 6 shows the shutter 53 in a closed state, and Figure 7 shows the shutter 53 in an open state. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 6. Figure 9 is a cross-sectional view taken along line IX-IX in Figure 7. Figures 6 and 7 are enlarged views of the main duct 31 and the sub-duct 32 in Figure 3.

[0069] The shutter 53 opens and closes the opening 41K at the connection between the sub-duct 32 and the main duct 31. The shutter 53 is a partition plate for closing the opening 41K and is rotatable on a rotation shaft 55 near a first edge of the partition plate. The shutter 53 is movable between a closed position (first position) in which the opening 41K is closed and an open position (second position) in which the opening 41K is open. When air is not being blown out from the air blower 51, the shutter 53 is in a state in which the edge of the shutter 53 farther from the rotation shaft 55 abuts against the lower end of the opening 41K due to its own weight, and is in the closed position. When air is blown out from the air blower 51 from this state, the shutter 53 is pushed by the air to the open position, and the chips KZ in the sub-duct 32 move from the opening 41K into the main duct 31. When the air blower 51 stops blowing air, the shutter 53 returns to the closed position by its own weight.

[0070] In this embodiment, the shutter 53 is arranged to be able to swing freely within a vertical plane (here, within the YZ plane), and is positioned in a closed position that closes the opening 41K when the air blower 51 is not blowing air, and is positioned in an open position that opens the opening 41K when the air blower 51 is blowing air, as pushed by the air blown out by the air blower 51.

[0071] The shutter 53 may have a rotation shaft 55 and may have a first plate portion 54a closer to the rotation shaft 55 and a second plate portion 54b farther from the rotation shaft 55. The first plate portion 54a and the second plate portion 54b are connected in a state of being bent convexly in the air flow direction. That is, the shutter 53 may have a shape that is bent convexly in the air flow direction. Note that the shutter 53 may have a bent shape or a curved shape as long as it has a shape that is bent convexly in the air flow direction. The shutter 53 may also have a portion that is disposed obliquely with respect to the air flow direction so as to be disposed downstream of the rotation shaft 55 in the air flow direction. With this configuration, when air is blown out by the air blower 51, the shutter 53 is more likely to be pushed up by the air flow at the rotation shaft 55.

[0072] The main duct 31 is also provided with a restriction mechanism 56 that restricts the shutter 53 to a closed state. The restriction mechanism 56 is switchable between a restricted state in which the shutter 53 is restricted to the closed position and an open state in which the movement of the shutter 53 is not restricted. The restriction mechanism 56 is a pin that moves in and out of the main duct 31. As shown in FIG. 8 , the restriction mechanism 56 is positioned in a position where it interferes with the shutter 53 by moving into the main duct 31. As a result, the restriction mechanism 56 enters a restricted state in which the shutter 53 is prevented from moving from a closed state to an open state. As shown in FIG. 9 , the restriction mechanism 56 is positioned in a position where it does not interfere with the shutter 53 by moving from inside the main duct 31 to outside the main duct 31. As a result, the restriction mechanism 56 enters an open state in which the movement of the shutter 53 is not restricted. The restriction mechanism 56 is moved by an actuator such as a cylinder or a motor, and the movement of the restriction mechanism 56 is controlled by the control unit 62.

[0073] When the air blower 51 is not blowing air, the control unit 62 maintains the restriction by the restriction mechanism 56, thereby controlling the shutter 53 to the closed state. In other words, when the air blower 51 is not blowing air, the control unit 62 controls the restriction mechanism 56 to the restricted state, thereby controlling the shutter 53 to the closed state. On the other hand, when the air blower 51 is blowing air, the control unit 62 releases the restriction by the restriction mechanism 56, thereby controlling the shutter 53 to the open state.

[0074] Although the restricting mechanism 56 has been described as being provided in the main duct 31, it may also be provided in the shutter 53. When the restricting mechanism 56 is provided in the shutter 53, the restricting mechanism 56 may restrict the movement of the shutter 53 by switching between a state in which it is caught by a locking portion provided in the main duct 31 (restricted state) and a state in which it is not caught (unrestricted state).

[0075] Furthermore, although the restricting mechanism 56 is exemplified as a pin, it is not limited to a pin as long as it can restrict the movement of the shutter 53 .

[0076] 10 and 11 are cross-sectional views for explaining a second example of the shutter and its peripheral configuration according to the present embodiment. Fig. 10 shows the shutter 53 in a closed state, and Fig. 11 shows the shutter 53 in an open state. Figs. 10 and 11 are enlarged views of the main duct 31 and the sub-duct 32 in Fig. 3.

[0077] The second example differs from the first example in that it does not have the restriction mechanism 56 and has a cylinder 57 for opening and closing the shutter 53. The cylinder 57 moves the shutter 53 from the closed position to the open position. After moving the shutter 53 to the open position, the cylinder 57 maintains the shutter 53 in the open position until it moves to the closed position. The cylinder 57 moves the shutter 53 from the open position to the closed position. After moving the shutter 53 to the closed position, the cylinder 57 maintains the shutter 53 in the closed position until it moves to the open position. The cylinder 57 is controlled by the control unit 62.

[0078] The control unit 62 controls the opening and closing of the shutter 53 by driving the cylinder 57. When the air blower 51 is not blowing air, the control unit 62 controls the shutter 53 to be in a closed state by driving the cylinder 57 to move the shutter 53 from an open position to a closed position. On the other hand, when the air blower 51 is blowing air, the control unit 62 controls the shutter 53 to be in an open state by moving the shutter 53 from the closed position to the open position.

[0079] Next, the shutter 53 may be configured as in the third and fourth examples.

[0080] 12 to 14 are cross-sectional views illustrating a third example of the shutter and its peripheral configuration according to the present embodiment. Fig. 12 shows the shutter 53 in a closed state, Fig. 13 shows the shutter 53 transitioning from the closed state to the open state, and Fig. 14 shows the shutter 53 in an open state. Figs. 12 to 14 are enlarged views of the main duct 31 and the sub-duct 32 in Fig. 3.

[0081] The third example differs from the first example in the shape of the shutter 53A. Like the first example, the shutter 53A has a rotation shaft 55 and includes a first plate portion 54Aa closer to the rotation shaft 55 and a second plate portion 54Ab farther from the rotation shaft 55. The shutter 53A also has an opening 54Ac. The opening 54Ac is provided, for example, in the second plate portion 54Ab. The opening 54Ac penetrates the second plate portion 54Ab. The opening 54Ac is an example of a third opening. The second plate portion 54Ab has a wing shape that receives lift in a direction that opens the shutter 53A due to air flowing from the opening 54Ac toward a second side opposite the first side. The shutter 53A has a wing shape in which the area of ​​a first surface on the downstream side of the air is larger than the area of ​​a second surface on the upstream side of the air. Here, the first side is the side of the first plate portion 54Aa of the shutter 53A that is closer to the rotation shaft 55. The second side is the side of the second plate portion 54Ab of the shutter 53A that is farther from the rotation shaft 55.

[0082] In the third example, the restricting mechanism 56 is controlled in the same manner as in the first example, and therefore a description thereof will be omitted.

[0083] In the third example, the restricting mechanism 56 may not be provided.

[0084] 15 and 16 are cross-sectional views for explaining a fourth example of the shutter and its peripheral configuration according to the present embodiment. Fig. 15 shows the shutter 53 in a closed state, and Fig. 16 shows the shutter 53 in an open state. Figs. 15 and 16 are enlarged views of the main duct 31 and the sub-duct 32 in Fig. 3.

[0085] The shutter 53 opens and closes the opening 41K at the connection between the sub-duct 32 and the main duct 31. The shutter 53 is a partition plate for closing the opening 41K and is rotatable on a rotation shaft 55 near a first edge of the partition plate. The shutter 53 is movable between a closed position (first position) in which the opening 41K is closed and an open position (second position) in which the opening 41K is open. When air is not being blown out from the air blower 51, the shutter 53 is in a state in which the edge of the shutter 53 farther from the rotation shaft 55 abuts against the lower end of the opening 41K due to its own weight, and is in the closed position. When air is blown out from the air blower 51 from this state, the shutter 53 is pushed by the air to the open position, and the chips KZ in the sub-duct 32 move from the opening 41K into the main duct 31. When the air blower 51 stops blowing air, the shutter 53 returns to the closed position by its own weight.

[0086] In this embodiment, the shutter 53 is arranged to be able to swing freely within a vertical plane (here, within the YZ plane), and is positioned in a closed position that closes the opening 41K when the air blower 51 is not blowing air, and is positioned in an open position that opens the opening 41K when the air blower 51 is blowing air, as pushed by the air blown out by the air blower 51.

[0087] The shutter 53 may have a rotation axis 55 and a first plate portion 54a closer to the rotation axis 55 and a second plate portion 54b farther from the rotation axis 55. The first plate portion 54a and the second plate portion 54b are connected in a convexly curved state in the air flow direction. That is, the shutter 53 may have a shape that is convexly curved in the air flow direction. Note that the shutter 53 may have a bent shape or a curved shape as long as it has a shape that is convexly curved in the air flow direction. As described above, since the shutter 53 has a curved shape, it has a larger surface area and is heavier than a flat shutter. Therefore, when air is flowing, the area pressed by the air is larger, and the force from the air is greater, making it more likely to open. Furthermore, since the shutter has a larger weight, it can more easily return to the closed state under its own weight when air is not flowing.

[0088] Furthermore, the shutter 53 may have a portion disposed at an angle to the air flow direction so as to be disposed downstream of the air flow from the rotation shaft 55. With this configuration, when air is blown out by the air blower 51, the shutter 53 is more likely to be pushed up by the air flow at the rotation shaft 55.

[0089] In the first to fourth examples, the shutters 53, 53A have a curved shape having the first plate portions 54a, 54Aa and the second plate portions 54b, 54Ab, but are not limited to this and may not have a curved shape. In other words, they may be configured as flat shutters.

[0090] As shown in FIG. 17 , the main duct 31 may be provided with an opening 33. The opening 33 may be provided with a filter 34 that does not allow chips or external dust to pass through. The filter 34 is a member having a plurality of through holes smaller than the size of the chips or dust. The filter 34 may be, for example, a plate-like member having a plurality of through holes smaller than the size of the chips or dust, or may be a mesh. The opening 33 may also be a plurality of through holes smaller than the size of the chips or dust. In other words, the plurality of through holes may be provided directly in the main duct 31. This allows air to be taken in from outside the main duct 31 even when the shutter 53 is closed, thereby preventing negative pressure from being created inside the main duct 31.

[0091] Fig. 18 is a perspective view for explaining the configuration of the recovery unit according to this embodiment. Fig. 19 is a cross-sectional view for explaining the configuration of the recovery unit according to this embodiment. Fig. 19 is a cross-sectional view of the recovery unit cut near the center in the X direction on the YZ plane.

[0092] The recovery section 80 includes a chip collection path 81 , a chute 82 , a container 83 , and a cover member 84 .

[0093] The chip collection path 81 collects chips KZ from the outlet 31D of the main duct 31 and forms a space for dropping the chips KZ moving in the traveling direction. The chip collection path 81 extends in a direction (Y direction) intersecting the extension direction (X direction) of the main duct 31. The chip collection path 81 has a passage section 81a disposed upstream of the chip collection path 81 in the traveling direction of the chips KZ, and a chip rising and falling section 81b disposed downstream. The passage section 81a has openings 81Ka and 81Kb connected to the main duct 31 and has a hollow shape with a rectangular cross section. The passage section 81a extends in the Y direction (horizontal direction). The main duct 31 is connected to the passage section 81a in a state where it communicates with the openings 81Ka and 81Kb provided in the wall of the passage section 81a. The main duct 31 is connected to the passage section 81a so as to cover the openings 81Ka and 81Kb. The chip rising and dropping section 81b, located downstream of the passage section 81a, is arranged to extend obliquely upward along the Y direction. The chip rising and dropping section 81b is a section that raises and then drops the chips KZ collected in the passage section 81a. The chip rising and dropping section 81b is connected to the chute 82 in a communicating state. Specifically, an opening 81Kc provided on the underside of the downstream end of the chip rising and dropping section 81b is connected to face an opening 82Ka of the chute 82.

[0094] Here, a plurality of air blowers 91 are arranged in the chip collecting path 81 along the traveling direction of the chips KZ. The plurality of air blowers 91 are arranged in the chip collecting path 81 and move the chips KZ to the container 83. The plurality of air blowers 91 move the chips in the chip collecting path 81 to the container 83 by blowing air toward the outlet of the chip collecting path 81. In other words, the plurality of air blowers 91 move the chips KZ in the chip collecting path in the traveling direction by air. Of the plurality of air blowers 91, the air blower 91a arranged in the passage portion 81a moves the chips KZ received from the main duct 31 in the passage portion 81a to the chip rising and falling portion 81b. In addition, the air blower 91b, which is one of the multiple air blowers 91 and is arranged at the chip rising and falling section 81b, moves the chips KZ that have been moved to the chip rising and falling section 81b to the opening 81Kc and drops them from the opening 81Kc toward the chute 82.

[0095] Additionally, sensors 92a and 92b are provided in a third portion of the chip collecting path 81 downstream of the air blower 91 to detect the accumulation of chips KZ. The sensors 92a and 92b are provided at a height reached by a third amount of accumulated chips KZ. In other words, when the sensors 92a and 92b detect the presence of an object (chips KZ), this indicates that a third amount of chips KZ has accumulated in the third portion. The third amount is, for example, the amount of chips KZ that can be moved within a predetermined period of time by air at a flow rate that can be blown out by the air blower 91. The sensors 92a and 92b are sensors that detect the presence or absence of an object, such as a laser sensor, an infrared sensor, or an ultrasonic sensor. The third portion is a portion of the chip collecting path 81 where chips KZ are discharged from the main duct 31. In other words, the third portion is a portion immediately downstream of the openings 81Ka and 81Kb. The third portion does not have to be the portion that receives the chips KZ, as long as it is a portion near the portion where the chip collecting path 81 receives the chips KZ discharged from the main duct 31. The portion near the portion that receives the chips KZ is, for example, a portion in the chip collecting path 81 that is closer to the opening 81Ka than the air blower 91b, and a portion that is closer to the opening 81Kb than the opening 82Ka.

[0096] Each of the plurality of air blowers 91 is provided with a valve 65 (electromagnetic valve or electric valve) that opens and closes to control the on / off of air blowing from the air blower 91. As shown in Fig. 21 , the opening and closing of the plurality of valves 65 corresponding to the plurality of air blowers 91 is controlled by a control unit 62.

[0097] The chute 82 is a cylindrical member with a rectangular cross section that allows chips KZ that fall from the chip collection path 81 (i.e., move in the Z direction) to pass through. The chute 82 is arranged along the Z direction. That is, the chute 82 has a space that penetrates in the Z direction. The chute 82 also has an opening 82Kb and a filter 85. The opening 82Kb is arranged on the side of the upper part of the chute 82, downstream of the air blown by the air blower 91b. The filter 85 covers the opening 82Kb, allowing air to pass through but not allowing the chips KZ to pass through. The filter 85 is a member having multiple through holes that are smaller than the size of the chips or dust. The filter 85 may be, for example, a plate-like member having multiple through holes that are smaller than the size of the chips or dust, or may be a mesh. The opening 82Kb may also be multiple through holes that are smaller than the size of the chips or dust. That is, the multiple through holes may be provided directly in the chute 82.

[0098] The container 83 is disposed below the chute 82 and stores the chips KZ that have passed through the chute 82. For example, the container 83 is a box-shaped member that is open at the top. The container 83 may be provided with wheels 83a so that the container 83 can be easily moved on the floor surface FL.

[0099] The cover member 84 is disposed at a position extending the outlet of the chute 82 and is flexible. The cover member 84 is, for example, a sheet-like member. As shown in FIG. 20 , the cover member 84 is disposed on the periphery of the outlet of the chute 82. The cover member 84 is, for example, disposed on all four sides of the outlet of the chute 82, which has a rectangular cross section. The cover member 84 also has slits 84a extending in the Z direction (vertical direction). The cover member 84 may be four sheet-like members disposed on each side of the outlet of the chute 82. FIG. 20 is a perspective view for explaining the configuration of the cover member.

[0100] Although the opening 36 and the filter 37 are provided in the main duct 31 and the sub-duct 32 at the point where the air direction changes from the Y direction to the X direction and at the end of the Y direction before the change, the opening and the filter may be provided in the chip collecting path 81. For example, the opening and the filter may be provided in the main duct 31 and the chip collecting path 81 at the point where the air direction changes from the X direction to the Y direction and at the end of the chip collecting path 81 in the X direction before the change. This allows the air passing through the main duct 31 in the X direction to be discharged through the opening and the filter, making it possible to maintain a constant air flow velocity or higher with less energy consumption.

[0101] FIG. 21 is a diagram showing an example of the control unit and its controlled object when the shutter and its peripheral configuration are the first and fourth examples in this embodiment.

[0102] As described above, the control unit 62 controls the opening and closing of each valve 63 to control the on / off of the air blower 51 corresponding to that valve 63. Furthermore, the control unit 62 controls the opening and closing of each valve 64 to control the on / off of the air blower 71 corresponding to that valve 64. That is, the control unit 62 controls the operations of the air blowers 51 and 71. Furthermore, the control unit 62 may control the opening and closing of each valve 65 to control the on / off of the air blower 91 corresponding to that valve 65. That is, the control unit 62 also controls the operation of the air blower 91.

[0103] The control unit 62 moves the chips KZ in the sub-duct 32 to the main duct 31 using the multiple air blowers 51, and then independently controls the multiple air blowers 71 to move the chips KZ to the outlet 31D of the main duct 31. Specifically, the control unit 62 independently controls the operation of the multiple air blowers 71 so that the amount of chips KZ moved per unit time by each of the multiple air blowers 71 does not exceed a predetermined amount. This prevents the chips KZ from becoming difficult to move in the main duct 31, and allows the chips KZ to be moved efficiently.

[0104] Furthermore, the control unit 62 controls the opening and closing of the valves 63, 64, and 65 based on the detection results of the sensors 58, 73, and 92, thereby controlling the on / off of the air blowers 51, 71, and 91. When the sensor 58 detects the accumulation of chips KZ, the control unit 62 may change the operation time of the air blower 51 to be longer than the standard time. When the sensor 73 detects the accumulation of chips KZ, the control unit 62 may change the operation time of the air blower 71 to be longer than the standard time. When the sensor 92 detects the accumulation of chips KZ, the control unit 62 may change the operation time of the air blower 91 to be longer than the standard time.

[0105] FIG. 22 is a diagram showing an example of the control unit and its controlled objects when the shutter and its peripheral configuration are the second example in this embodiment.

[0106] In the second example, compared to the first example, the control targets of the control unit 62 further include the regulating mechanism 56. As described above, the control unit 62 controls the shutter 53 to the closed state by maintaining the regulation by the regulating mechanism 56 when the air blower 51 is not blowing air. In other words, the control unit 62 controls the shutter 53 to the closed state by controlling the regulating mechanism 56 to the regulated state when the air blower 51 is not blowing air. On the other hand, the control unit 62 controls the shutter 53 to the open state by releasing the regulation by the regulating mechanism 56 when the air blower 51 is blowing air. Note that in the second example, the control of the valves 63, 64, and 65 by the control unit 62 is the same as in the first example.

[0107] FIG. 23 is a diagram showing an example of a control unit and its controlled objects when the shutter and its peripheral configuration are the third example in this embodiment.

[0108] In the third example, compared to the first example, the control target of the control unit 62 further includes the cylinder 57. As described above, the control unit 62 controls the opening and closing of the shutter 53 by driving the cylinder 57. By driving the cylinder 57, the control unit 62 controls the shutter 53 to be in a closed state by moving the shutter 53 from an open position to a closed position when the air blower 51 is not blowing air. On the other hand, the control unit 62 controls the shutter 53 to be in an open state by moving the shutter 53 from a closed position to an open position when the air blower 51 is blowing air. Note that in the third example, the control of the valves 63, 64, and 65 by the control unit 62 is the same as in the first example.

[0109] FIG. 24 is a flowchart showing a first example of a chip collection method of the chip collection system according to this embodiment.

[0110] The control unit 62 of the chip collection system 1 acquires control information indicating whether or not the air blower 51 is blowing air (S11). The control unit 62 may acquire, as the control information, the determination result of whether or not the air blower 51 is blowing air, or may acquire, as the control information, status information indicating the operating status of the air blower 51 (status indicating whether or not air is being blown out), or may acquire, as the control information, a history of control instructions given by the control unit 62 to the air blower 51.

[0111] The control unit 62 determines whether the air blower 51 is blowing air or not based on the control information (S12).

[0112] If the air blower 51 is blowing air (Yes in S12), the control unit 62 controls the shutter 53 to an open state (S13).

[0113] If the air blower 51 is not blowing air (No in S12), the control unit 62 controls the shutter 53 to a closed state (S14).

[0114] FIG. 25 is a diagram for explaining a first example of the operation of the chip collection system according to this embodiment.

[0115] First, the control unit 62 operates the multiple air blowers 51 over periods P1 and P2. That is, the control unit 62 turns on the blowing of the multiple air blowers 51 (multiple air blowers 51a to 51c) during periods P1 and P2, and moves the chips KZ in the multiple sub-ducts 32 to the main duct 31. When the sensors 58a to 58c detect accumulation of chips KZ, the control unit 62 may control the air blowers 51a to 51c to operate for a period longer than the period P1 and P2 combined (standard time). Here, when the accumulation of chips KZ is detected by any one of the sensors 58a to 58c, the control unit 62 may control the air blowers 51a to 51c to operate for a period longer than the period P1 and the period P2 (standard time), or when the accumulation of chips KZ is detected by any one of the sensors 58a to 58c, the control unit 62 may control only the air blower 51 corresponding to the sensor 58 that detected the accumulation to operate for a period longer than the period P1 and the period P2 (standard time).

[0116] Next, the control unit 62 moves the chips KZ to the outlet 31D of the main duct 31 by sequentially operating the multiple air blowers 71 in the main duct 31 in order from the farthest from the outlet 31D of the main duct 31. Specifically, the control unit 62 operates the air blower 71a arranged in the main duct 31a over periods P3 and P4. That is, the control unit 62 turns on the air blowing of the air blower 71a during periods P3 and P4 to move the chips KZ in the main duct 31a to the main duct 31b. When the sensor 73a detects accumulation of the chips KZ, the control unit 62 may control the air blower 71a to operate for a period longer than the period P3 and P4 (standard time).

[0117] The control unit 62 also operates the air blower 71b over periods P4 and P5. That is, the control unit 62 turns on the air blower 71b during periods P4 and P5 to move the chips KZ in the main duct 31b to the main duct 31c. The air blower 71b operates simultaneously with the air blower 71a during period P4, which overlaps with period P4. In this way, the air blowers 71a and 71b installed in the main ducts 31a and 31b, which are two adjacent divided regions, are controlled by the control unit 62 so that the periods of operation for moving the chips KZ overlap. When the sensor 73b detects accumulation of chips KZ, the control unit 62 may control the air blower 71b to operate for a period longer than the sum of periods P4 and P5 (standard time).

[0118] The control unit 62 also operates the air blower 71c over periods P5 and P6. That is, the control unit 62 turns on the air blower 71c during periods P5 and P6 to move the chips KZ in the main duct 31c to the outlet 31D of the main duct 31. The air blower 71c operates simultaneously with the air blower 71b during period P5, which overlaps with period P5. In this way, the air blowers 71b and 71c installed in the main ducts 31b, 31c, which are two adjacent divided regions, are controlled by the control unit 62 so that the periods of their operations to move the chips KZ overlap. When the sensor 73c detects accumulation of chips KZ, the control unit 62 may control the air blower 71c to operate for a period longer than the sum of periods P5 and P6 (standard time).

[0119] The control unit 62 also operates the air blower 91a over periods P6 and P7. That is, the control unit 62 turns on the air blower 91a during periods P6 and P7 to move the chips KZ in the passage 81a to the chip rising and falling section 81b. The air blower 91a operates simultaneously with the air blower 71c during period P6, which overlaps with period P6. In this way, the control unit 62 controls the air blower 71c installed in the main duct 31c and the air blower 91a installed in the chip collecting path 81 so that the periods of operation for moving the chips KZ overlap. When the sensor 92a detects accumulation of chips KZ, the control unit 62 may control the air blower 91a to operate for a period longer than the sum of periods P6 and P7 (standard time). When the sensor 92b detects accumulation of chips KZ, the control unit 62 may control the air blower 91b to operate for a period longer than the sum of the periods P7 and P8 (standard time).

[0120] Furthermore, when one of the sensors 58a-58c, 73a-73c, 92a, and 92b detects accumulation of chips KZ, the control unit 62 may operate the air blower corresponding to the sensor that detected the accumulation in the period immediately following the timing of the detection. Thereafter, operation may continue in the order of the time chart shown in FIG. 25, starting with the air blower corresponding to the sensor that detected the accumulation. For example, when the sensor 58a detects accumulation of chips in period P4, the control unit 62 may operate the air blowers 51a-51c in periods P5 and P6. The control unit 62 may then control the air blowers 51, 71, and 91 from the next period P7 onward as period P3 in FIG. 25.

[0121] FIG. 26 is a diagram for explaining a second example of the operation of the chip collection system according to this embodiment.

[0122] The second example differs from the first example in that the control unit 62 controls the air blower 71a to operate simultaneously during period P2, which overlaps with the operation of the multiple air blowers 51. Also, as a result of advancing the operation timing of the air blower 71a so that it operates during period P2 as described above, the air blowers 71a to 71c, 91a, and 91b operate over periods P2 to P7. Other operations are the same as those in the first example.

[0123] FIG. 27 is a diagram for explaining a third example of the operation of the chip collection system according to the present embodiment.

[0124] The third example differs from the first example in that the control unit 62 operates the air blowers 91a and 91b during periods P7 to P9 when the plurality of air blowers 51a to 51c and the plurality of air blowers 71a to 71c are not operating. In other words, the control unit 62 operates the air blower 91a during periods P7 to P9 when the plurality of air blowers 51a to 51c and the plurality of air blowers 71a to 71c are not operating.

[0125] As described above, the chip collection system 1 performs the chip collection method.

[0126] FIG. 28 is a flowchart showing a second example of a chip collection method using the chip collection system according to this embodiment.

[0127] The control unit 62 of the chip recovery system 1 acquires the detection results of the sensors 58a to 58c, 73a to 73c, 92a, and 92b (S1). The control unit 62 only needs to acquire the detection result of at least one of the sensors 58a to 58c, 73a to 73c, 92a, and 92b, and does not need to acquire the detection results of all of the sensors 58a to 58c, 73a to 73c, 92a, and 92b.

[0128] The control unit 62 controls the operation of the air blowers 51a to 51c, 71a to 71c, 91a, and 91b based on the detection results of the sensors 58a to 58c, 73a to 73c, 92a, and 92b (S2). When the accumulation of chips KZ is detected by one of the sensors 58a to 58c, 73a to 73c, and 92a, 92b, the control unit 62 operates the air blower corresponding to the sensor that detected the accumulation, for a period immediately after the timing at which the accumulation is detected.

[0129] The chip collection system 1 according to this embodiment includes a sub-duct 32, a main duct 31, an air blower 51, a shutter 53, and a control unit 62. The sub-duct 32 has an opening 32K (first opening) for receiving chips KZ of the carrier tape (tape member) 18 discharged from the tape feeder 16 of the component mounting device 3, and an opening 41K for discharging the chips KZ to the main duct 31. The main duct 31 is connected to the sub-duct 32 through the opening 41K (second opening). The air blower 51 is installed in the sub-duct 32 and blows air toward the opening 41K to move the chips KZ in the sub-duct 32 to the main duct 31. The shutter 53 opens and closes the opening 41K. The control unit 62 controls the opening and closing of the shutter 53. The control unit 62 controls the shutter 53 to a closed state when the air blower 51 is not blowing air.

[0130] According to this, when the air blower 51 is not blowing out air, the shutter 53 is controlled to be in a closed state, so that when air is not being blown out, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter 53. Therefore, it is possible to prevent chips from flowing back, and chips can be transported efficiently.

[0131] The chip collection system 1 according to this embodiment further includes a regulating mechanism 56. The regulating mechanism 56 regulates the shutter to a closed state. The control unit 62 maintains the regulation by the regulating mechanism 56 when the air blower 51 is not blowing air, thereby controlling the shutter 53 to a closed state. When the air blower 51 is blowing air, the control unit 62 releases the regulation by the regulating mechanism 56, thereby controlling the shutter 53 to an open state.

[0132] According to this, by using the regulating mechanism 56 to maintain the shutter 53 in a closed state, the shutter 53 is controlled to a closed state when the air blower 51 is not blowing air, and therefore, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter 53 when air is not being blown out. Therefore, it is possible to prevent the chips KZ from flowing back. Furthermore, when the air blower 51 is blowing air, the restriction by the regulating mechanism 56 is released, and the shutter 53 is controlled to an open state, so that the chips can be transported efficiently.

[0133] The chip recovery system 1 according to this embodiment further includes a cylinder 57. The cylinder 57 is a cylinder for opening and closing the shutter 53. The control unit 62 drives the cylinder 57 to control the opening and closing of the shutter 53.

[0134] According to this, by using the cylinder 57 to maintain the shutter 53 in a closed state, the shutter 53 is controlled to be in a closed state when the air blower 51 is not blowing air, and therefore, it is possible to prevent air from flowing back from the downstream side to the upstream side of the shutter 53 when air is not being blown out. Therefore, it is possible to prevent the chips KZ from flowing back. Furthermore, since the shutter 53 is controlled to be in an open state using the cylinder 57 when the air blower 51 is blowing air, it is possible to efficiently transport the chips.

[0135] In the chip recovery system 1 according to the present embodiment, the shutter 53 is a partition plate for closing the opening 41K, and is rotatable on a rotation shaft 55 near a first side of the partition plate. The partition plate has a shape that is curved convexly in the air flow direction.

[0136] According to this, the shutter 53 has a shape that is curved convexly in the air flow direction, and therefore it is easy for it to receive air from the air blower 51. Therefore, when the air blower 51 is blowing air, the shutter 53 can be easily opened by the pressing force of the air.

[0137] In the chip recovery system 1 according to the present embodiment, the shutter 53A is a partition plate for closing the opening 41K and is rotatable on a rotation shaft 55 near a first side of the partition plate. The shutter 53A has an opening 54Ac. The shutter 53A has a wing shape that receives lift in a direction that opens the shutter 53A due to air flowing from the opening 54Ac toward a second side opposite the first side.

[0138] According to this, since the shutter 53A has a wing shape, the shutter 53A can be easily opened by the lift force of the air from the air blower 51.

[0139] The chip collection system 1 according to this embodiment includes a sub-duct 32, a main duct 31, an air blower 51 (first chip conveying section), an air blower 71 (second chip conveying section), a sensor 58 (first sensor), a sensor 73 (second sensor), and a control unit 62. The sub-duct 32 receives chips KZ of the tape member 18 discharged from a tape feeder included in the component mounting device 3. The main duct 31 is connected to the sub-duct 32 and has an opening 31K (first opening) communicating with the sub-duct 32. The air blower 51 is installed within the sub-duct 32 and uses air to move the chips KZ in the sub-duct 32 to the main duct 31. The air blower 71 uses air to move the chips KZ that have been moved from the sub-duct 32 into the main duct 31 through the opening 31K to an outlet of the main duct 31. The sensor 58 detects accumulation of chips KZ in a first portion 35 downstream of the air blower 51 in the sub-duct 32. The sensor 73 detects accumulation of chips KZ in a second portion downstream of the air blower 71 in the main duct 31. The control unit 62 controls the operation of the air blower 51 and the air blower 71 based on the detection results of the sensor 58 and the sensor 73.

[0140] According to this, the operation of the air blower 51 and the air blower 71 is controlled depending on whether or not the chips KZ are accumulated in the first portion 35 downstream of the air blower 51 and whether or not the chips KZ are accumulated in the second portion downstream of the air blower 71, so that it is possible to prevent the chips KZ from accumulating in an amount greater than a predetermined amount, for example. Therefore, the chips of the tape member inside the duct can be efficiently moved to the outlet of the duct.

[0141] In the chip collection system 1 according to this embodiment, the first portion 35 includes a portion where the subduct 32 receives the chips KZ discharged from the tape feeder or a portion in the vicinity of this portion.

[0142] According to this, the operation of the air blower 51 and the air blower 71 is controlled depending on whether or not chips KZ are accumulated in the first portion 35 where the sub-duct 32 receives the chips KZ, so that, for example, it is possible to prevent chips from accumulating in an amount greater than a predetermined amount.

[0143] In the chip collection system 1 according to this embodiment, the second region includes a region where the main duct 31 receives the chips KZ discharged from the sub-duct 32 or a region in the vicinity of this region.

[0144] According to this, since the operation of the air blower 51 and the air blower 71 is controlled depending on whether or not the chips KZ are accumulated in the first portion 35 where the sub-duct 32 receives the chips KZ, and whether or not the chips KZ are accumulated in the second portion where the main duct 31 receives the chips KZ, it is possible to prevent the chips KZ from accumulating in an amount greater than a predetermined amount, for example. Therefore, the chips KZ of the tape member inside the duct can be efficiently moved to the outlet of the duct.

[0145] In the chip collection system 1 according to this embodiment, when the sensor 58 detects accumulation of chips KZ, the control unit 62 changes the operating time of the air blower 51 to a longer time.

[0146] According to this, when chips KZ are accumulated in the first portion 35 where the sub-duct 32 receives the chips KZ, the operating time of the air blower 51 is changed to a longer time, thereby preventing the chips KZ from accumulating in the first portion 35 by more than a predetermined amount.

[0147] In the chip recovery system 1 according to this embodiment, when the sensor 73 detects accumulation of chips KZ, the control unit 62 changes the operating time of the air blower 71 to a longer time.

[0148] According to this, when chips KZ are accumulated in the second portion where the main duct 31 receives the chips KZ, the operating time of the air blower 71 is changed to a longer time, thereby preventing the chips KZ from accumulating in the second portion by more than a predetermined amount.

[0149] In the chip collection system 1 according to this embodiment, at least one of the main duct 31 and the sub-duct 32 forms a first flow path through which air flows in the Y direction (first direction), and a second flow path that is connected to the first flow path and through which air flows in the X direction that intersects with the Y direction. At least one of the main duct 31 and the sub-duct 32 has an opening 36 (second opening) that is arranged on a side surface on the Y direction side of the first flow path, and a filter 37 (first filter) that covers the opening 36, allows air to pass through, but does not allow chips KZ to pass through.

[0150] Therefore, the air flowing in the Y direction can easily pass through the opening 36, and the air flow velocity can be maintained at a certain level or higher with less energy consumption. Therefore, the chips KZ can be moved efficiently.

[0151] The chip collection system 1 according to this embodiment further includes a chip collection path 81, a chute 82, and a container 83. The chip collection path 81 drops the chips KZ that have been moved in the traveling direction. The chute 82 passes the chips KZ that drop from the chip collection path 81. The container 83 is installed below the chute 82 and collects the chips KZ that have passed through the chute 82. The chip collection path 81 has an air blower 91 that uses air to move the chips KZ in the traveling direction. The chute 82 has an opening 82Kb (third opening) at its upper part and located on the side downstream of the air from the air blower 91, and a filter 85 that covers the opening 82Kb and allows air to pass through but does not allow the chips KZ to pass through.

[0152] This allows the air flowing in the direction of travel to easily pass through the opening 82Kb, and the air flow velocity can be maintained at a constant level or higher with less energy consumption. As a result, the chips KZ can be moved efficiently.

[0153] In the above-described embodiment, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that realizes the control unit 62 of the chip recovery system 1 of the above-described embodiment is a program that causes a computer to execute each step included in the flowchart shown in the figure.

[0154] As another example of the air blower 91, a blower that blows air by rotating an impeller (or fan) may be used. FIG. 29 is a cross-sectional view illustrating the configuration of the collection unit when a blower is used as the air blower. As shown in FIG. 29, the collection unit 180 includes air blowers 191a and 191b that are realized by blowers. The air blower 191a is disposed in the passage portion 81a, and the air blower 191b is disposed in the chip rising and falling portion 81b. In this way, by realizing the air blowers 191a and 191b as blowers that blow air by rotating an impeller, the valve 65 and the like are not required, and the chips KZ can be transported with a simple configuration.

[0155] In the above-described embodiment, the air blowers 51, 71, 91, and 191 are not limited to those that transport chips by air, as long as they are capable of transporting chips. For example, a device for transporting chips, such as a conveyor, may be provided in place of each of the air blowers 51, 71, 91, and 191.

[0156] At least a portion of the wall surface of the main duct 31 or the sub-duct 32 may have an uneven shape, or may have a convex curved surface on the outside of the duct. The uneven shape may be, for example, an embossed shape or a wavy shape. At least a portion of the wall surface of the main duct 31 or the sub-duct 32 may be, for example, the bottom surface of the main duct 31 or the sub-duct 32, or may include side surfaces in addition to the bottom surface. Therefore, the chips KZ accumulate with a space between them and at least a portion of the wall surface of the main duct 31 or the sub-duct 32. This makes it easier for air from the air blower 51 or the air blower 71 to pass through the space between the chips KZ and at least a portion of the wall surface, thereby efficiently moving the chips KZ.

[0157] The following cases are also included in this disclosure:

[0158] (1) Specifically, each of the above devices is a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or hard disk unit. Each device achieves its function when the microprocessor operates in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to a computer to achieve a specified function.

[0159] (2) Some or all of the components constituting each of the above devices may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions by the microprocessor operating in accordance with the computer program.

[0160] (3) Some or all of the components constituting each of the above devices may be configured as an IC card or a standalone module that can be attached to each device. The IC card or module may be a computer system configured with a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned ultra-multifunctional LSI. The IC card or module achieves its functions when the microprocessor operates in accordance with a computer program. The IC card or module may be tamper-resistant.

[0161] (4) The present disclosure may be embodied as the above-described methods, a computer program for implementing these methods on a computer, or a digital signal comprising the computer program.

[0162] The present disclosure may also be a computer program or a digital signal recorded on a computer-readable recording medium, such as a flexible disk, a hard disk, a CD-ROM, an MO, a DVD, a DVD-ROM, a DVD-RAM, a BD (Blu-ray (registered trademark) Disc), a semiconductor memory, etc. Alternatively, the present disclosure may be a digital signal recorded on such a recording medium.

[0163] Furthermore, the present disclosure may also be applied to transmitting the computer program or the digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0164] The present disclosure may also be a computer system including a microprocessor and a memory, wherein the memory stores the computer program, and the microprocessor operates in accordance with the computer program.

[0165] The program or the digital signal may also be implemented by another independent computer system by recording it on the recording medium and transferring it, or by transferring it via the network or the like.

[0166] (5) The above-described embodiments and modifications may be combined with each other.

[0167] This can be realized as a chip collection system that can efficiently move chips from the tape material inside the duct to the outlet of the duct.

[0168] 1 Chip recovery system 2 Work line 3 Component mounting device 16 Tape feeder 18 Carrier tape (tape member) 31 Main duct 31D Outlet 32 ​​Sub-duct 32K, 33, 36 Opening 34, 37 Filter 35 First portion 41K Opening 51, 71, 91, 191 Air blower 53, 53A Shutter 54a, 54Aa First plate portion 54b, 54Ab Second plate portion 54Ac Opening 55 Rotating shaft 56 Restricting mechanism 57 Cylinder 58, 58a to 58c, 73, 73a to 73c, 92, 92a, 92b Sensor 62 Control unit 80 Recovery section 81 Chip collection path 81a Passage section 81b Chip rising and falling section 81Ka, 81Kb, 81Kc Opening 82 Chute 83 Container 83a Wheel 84 Cover member 84a Cut KZ Chips BH Part KB Board

Claims

1. A chip collection device comprising: a sub-duct having a first opening for receiving chips of tape material discharged from a tape feeder equipped in a component mounting device and a second opening for discharging the chips to a main duct; a main duct connected to the sub-duct through the second opening; an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct; a shutter for opening and closing the second opening; and a control unit for controlling the opening and closing of the shutter, wherein the control unit controls the shutter to be in a closed state when the air blower is not blowing air.

2. The chip collection device according to claim 1, further comprising a regulating mechanism that regulates the shutter to a closed state, wherein the control unit controls the shutter to a closed state by maintaining the regulation by the regulating mechanism when the air blower is not blowing air, and controls the shutter to an open state by releasing the regulation by the regulating mechanism when the air blower is blowing air.

3. The chip collection device according to claim 2, wherein the shutter is movable between a first position that blocks the second opening and a second position that opens the second opening, the regulating mechanism is switchable between a regulating state that regulating the shutter to the first position and a non-regulating state that does not regulating movement of the shutter, and the control unit controls the regulating mechanism to the regulating state when the air blower is not blowing air, thereby controlling the shutter to a closed state.

4. The chip recovery device according to claim 1, further comprising a cylinder for opening and closing the shutter, wherein the control unit controls the opening and closing of the shutter by driving the cylinder.

5. A chip recovery device as claimed in any one of claims 1 to 4, wherein the shutter is a partition plate for closing the second opening, the partition plate being rotatable on a rotation axis near the first side of the partition plate, and the partition plate has a shape that is curved convexly in the direction of the air flow.

6. A chip recovery device as described in claim 2 or 3, wherein the shutter is a partition plate for closing the second opening, the partition plate being rotatable on a rotation axis near a first side of the partition plate, the partition plate having a third opening, and the partition plate having a wing shape that receives lift in a direction in which the shutter is opened by air flowing from the third opening toward a second side opposite the first side.

7. The chip recovery device according to claim 6, wherein the partition plate has a blade shape in which the area of ​​a first surface on the downstream side of the air is larger than the area of ​​a second surface on the upstream side of the air.

8. The chip collection device according to claim 6, wherein the partition plate has a shape that is curved convexly in the direction of the air flow.

9. A chip recovery device according to any one of claims 1 to 4, comprising: a first chip transport unit installed in the sub-duct and transporting the chips in the sub-duct to the main duct by air; a second chip transport unit that transports the chips, which have been transported from the sub-duct into the main duct through an opening in the main duct, to an outlet of the main duct by air; a first sensor that detects the accumulation of chips in a first portion of the sub-duct downstream of the first chip transport unit; a second sensor that detects the accumulation of chips in a second portion of the main duct downstream of the second chip transport unit; and a control unit that controls the operation of the first chip transport unit and the second chip transport unit based on the detection results of the first sensor and the second sensor.

10. A chip collection method carried out by a chip collection device comprising: a sub-duct having a first opening for receiving chips of tape material discharged from a tape feeder equipped in a component mounting device and a second opening for discharging the chips to a main duct; a main duct connected to the sub-duct through the second opening; an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct; and a shutter for opening and closing the second opening, the chip collection method comprising: obtaining control information indicating whether the air blower is blowing air or not; and controlling the shutter to a closed state when the air blower is not blowing air based on the control information.

11. A chip collection system comprising: a sub-duct having a first opening for receiving chips of a tape material discharged from a tape feeder equipped in a component mounting device and a second opening for discharging the chips into a main duct; a main duct connected to the sub-duct through the second opening; an air blower installed in the sub-duct and blowing air toward the second opening to move the chips in the sub-duct to the main duct; a shutter for opening and closing the second opening; and a control unit for controlling the opening and closing of the shutter, wherein the control unit controls the shutter to a closed state when the air blower is not blowing air.

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