LC composite part

Abstract

An LC composite part 1A comprises: an element body 10 formed by laminating ferrite layers 15 in the lamination direction; internal electrode layers 20 that are laminated in the lamination direction with the ferrite layers 15 therebetween inside the element body 10 and extend along the ferrite layers 15 in the plane direction perpendicular to the lamination direction; a first external electrode 30 provided on the surface of the element body 10; and a second external electrode 40 provided, on the surface of the element body 10, at a position away from the first external electrode 30. The internal electrode layers 20 include first capacitor electrode layers 22 that are not electrically connected to the second external electrode 40 and are electrically connected to the first external electrode 30, second capacitor electrode layers 23 that are not electrically connected to the first external electrode 30 and are electrically connected to the second external electrode 40, and an inductor electrode layer 21 located on the same main surface of a corresponding ferrite layer 15 and electrically connected to the first external electrode 30 and the second external electrode 40. The LC composite part has an inductor portion LP including the inductor electrode layer 21, and a capacitor portion CP which is provided on at least one side in the lamination direction with respect to the inductor portion LP and in which the first capacitor electrode layers 22 and the second capacitor electrode layers 23 are opposite to each other with the ferrite layers 15 therebetween.

Description

LC composite parts

[0001] The present invention relates to an LC composite component.

[0002] Patent document 1 discloses a laminated chip inductor comprising a substantially rectangular parallelepiped chip body, an internal conductor embedded within the chip body so that both end portions are exposed from both end faces of the chip body, and a pair of external electrodes covering both end portions of the chip body and electrically connected to the exposed portions of the internal conductor, wherein the internal conductor is constructed by stacking multiple conductive layers with magnetic layers interposed between them.

[0003] Japanese Patent Application Publication No. 10-144526

[0004] Chip beads such as the multilayer chip inductor described in Patent Document 1 are generally used to reduce noise in circuits. Therefore, chip beads are required to have high noise removal performance. Impedance (Z), which is an index of the noise removal performance of chip beads, is expressed as a composite of a resistance component (R) that absorbs noise and converts it to heat, and a reactance component (X) that reflects the noise (Z = R + jX, where j is the imaginary unit).

[0005] The inventors' investigations revealed that when chip beads are incorporated into a circuit to remove noise, the noise reflected by the reactance component returns to the original circuit due to its reflection characteristics, causing problems such as ringing. Based on this, the inventors concluded that, in order to improve the noise removal performance of chip beads, it is important not only to increase the resistance component of the impedance, but also to reduce the absolute value of the reactance component.

[0006] In response to this, the inventors have conducted research and found that, in the multilayer chip inductor described in Patent Document 1, although the resistance component of the impedance is increased, the absolute value of the reactance component is not reduced, and the absolute value of the reactance component is not reduced particularly in frequency bands where the influence of reflected noise is large. In other words, the inventors have conducted research and found that the multilayer chip inductor described in Patent Document 1 does not have sufficient noise removal performance, particularly in frequency bands where the influence of reflected noise is large.

[0007] As described above, conventional chip beads such as the multilayer chip inductor described in Patent Document 1 have room for improvement in terms of enhancing noise removal performance in a desired frequency band.

[0008] The present invention has been made to solve the above problems, and has as its object to provide an LC composite component that has high noise removal performance in a desired frequency band.

[0009] an inductor section including the inductor electrode layer; and a capacitor section provided on at least one side of the inductor section in the stacking direction, the inductor section being formed by stacking the ferrite layers and the capacitor section being formed by stacking the ferrite layers in the stacking direction and having the first capacitor electrode layer and the second capacitor electrode layer facing each other via the ferrite layer.

[0010] According to the present invention, it is possible to provide an LC composite component having high noise removal performance in a desired frequency band.

[0011] FIG. 1 is a perspective view schematically illustrating an example of an LC composite component of the present invention. FIG. 2 is a cross-sectional view schematically illustrating an example of a cross section of the LC composite component taken along line a1-a2 in FIG. 1. FIG. 3 is a perspective view schematically illustrating a state in which attention is focused on the inductor section (inductor electrode layer) in FIG. 1. FIG. 4 is a perspective view schematically illustrating another example of an LC composite component of the present invention. FIG. 5 is a perspective view schematically illustrating a state in which attention is focused on the inductor section (inductor electrode layer) in FIG. 4. FIG. 6 is a perspective view schematically illustrating yet another example of an LC composite component of the present invention. FIG. 7 is a perspective view schematically illustrating a state in which attention is focused on the inductor section (inductor electrode layer) in FIG. 6. FIG. 8 is a perspective view schematically illustrating a simulation model of the LC composite component of Comparative Example 1. FIG. 9 is a perspective view schematically illustrating a simulation model of the LC composite component of Comparative Example 2. FIG. 10 is a graph showing simulation evaluation results of impedance-frequency characteristics for the simulation model of the LC composite component of Example 1. Fig. 11 is a graph showing the results of a simulation evaluation of the impedance frequency characteristics for the simulation model of the LC composite component of Comparative Example 1. Fig. 12 is a graph showing the results of a simulation evaluation of the impedance frequency characteristics for the simulation model of the LC composite component of Comparative Example 2. Fig. 13 is a graph collectively showing the absolute values ​​of the reactance components in Fig. 10 (Example 1), Fig. 11 (Comparative Example 1), and Fig. 12 (Comparative Example 2).

[0012] The LC composite component of the present invention will be described below. Note that the present invention is not limited to the following configurations, and may be modified as appropriate within the scope of the present invention. In addition, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0013] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, scale, etc. may differ from those of the actual product.

[0014] In this specification, unless otherwise specified, terms indicating the relationship between elements (e.g., "parallel," "perpendicular," etc.) and terms indicating the shape of elements not only mean the literal strict form, but also mean a range that is substantially equivalent, for example, a range that includes a difference of about a few percent.

[0015] an inductor section including the inductor electrode layer; and a capacitor section provided on at least one side of the inductor section in the stacking direction, the inductor section being formed by stacking ferrite layers. The inductor section includes: an element body formed by stacking ferrite layers in the stacking direction; an internal electrode layer stacked inside the element body via the ferrite layers in the stacking direction and extending along the ferrite layers in a plane direction perpendicular to the stacking direction; a first external electrode provided on a surface of the element body; and a second external electrode provided on the surface of the element body at a position spaced apart from the first external electrode. The internal electrode layer includes: a first capacitor electrode layer not electrically connected to the second external electrode but electrically connected to the first external electrode; a second capacitor electrode layer not electrically connected to the first external electrode but electrically connected to the second external electrode; and an inductor section including the inductor electrode layer; and a capacitor section provided on at least one side of the inductor section in the stacking direction, the first capacitor electrode layer and the second capacitor electrode layer facing each other with the ferrite layer interposed therebetween.

[0016] The LC composite component of the present invention includes an inductor section including an inductor electrode layer and a capacitor section provided on at least one side of the inductor section in the stacking direction, with a first capacitor electrode layer and a second capacitor electrode layer facing each other via a ferrite layer. Thus, the presence of the capacitor section in addition to the inductor section in the LC composite component of the present invention makes it possible to reduce the absolute value of the reactance component of the impedance in a desired frequency band, compared to, for example, a multilayer chip inductor described in Patent Document 1, which has an inductor section but no capacitor section. As a result, the presence of the capacitor section increases the overall capacitance of the LC composite component, making it easier for the resonance point, which is the impedance peak position, to shift to a lower frequency and be located in the desired frequency band, compared to a multilayer chip inductor described in Patent Document 1, which has an inductor section but no capacitor section. Therefore, the presence of the capacitor section in addition to the inductor section in the LC composite component of the present invention makes it possible to improve noise reduction performance in a desired frequency band, compared to a multilayer chip inductor described in Patent Document 1, which has an inductor section but no capacitor section.

[0017] Furthermore, in the LC composite component of the present invention, the element body is formed by stacking ferrite layers in the stacking direction. In this way, in the LC composite component of the present invention, the element body is formed of ferrite, which is a magnetic material, and therefore it is possible to ensure a large resistance component of impedance in the desired frequency band, compared to, for example, an element body formed of barium titanate, which is a dielectric material. Therefore, in the LC composite component of the present invention, the element body is formed of ferrite, which is a magnetic material, and therefore it is possible to improve noise removal performance in the desired frequency band, compared to, for example, an element body formed of barium titanate, which is a dielectric material.

[0018] As described above, the LC composite component of the present invention has a capacitor portion in addition to an inductor portion, and the element body is made of ferrite, so that in the desired frequency band, it is possible to ensure a large resistance component of the impedance while reducing the absolute value of the reactance component. Therefore, the LC composite component of the present invention can improve noise removal performance in the desired frequency band.

[0019] In the LC composite component of the present invention, it is possible to adjust the desired frequency band for which noise removal performance is to be enhanced by adjusting the size of the element body, the material of the element body, the sizes of the various electrode layers, etc.

[0020] Furthermore, in the LC composite component of the present invention, the element body is composed of the same material, i.e., ferrite, so that differences in the linear expansion coefficients are less likely to occur between adjacent ferrite layers.For example, when heating is performed, such as during solder reflow when mounting the LC composite component of the present invention, stress due to differences in the linear expansion coefficients of the ferrite layers is less likely to occur at the boundaries (interfaces) between the ferrite layers, and as a result, defects due to such stress (for example, cracks inside the element body) are less likely to occur.

[0021] Specific examples of the LC composite component of the present invention will be described below.

[0022] Fig. 1 is a perspective view schematically illustrating an example of an LC composite component of the present invention. Fig. 1 shows a see-through state of the LC composite component (element body) so that the internal structure of the LC composite component can be easily understood. Fig. 2 is a cross-sectional view schematically illustrating an example of a cross section of the LC composite component taken along line a1-a2 in Fig. 1.

[0023] The LC composite component 1A shown in FIGS. 1 and 2 has an element body 10, an internal electrode layer 20, a first external electrode 30, and a second external electrode 40.

[0024] In FIG. 1 and other figures, the first direction D1, the second direction D2, and the third direction D3 are perpendicular to one another.

[0025] Each of the components of the LC composite component 1A will be described below.

[0026] <Element Body> The element body 10 is, for example, a rectangular parallelepiped.

[0027] In this specification, the rectangular parallelepiped shape may refer to any shape that can be said to be substantially rectangular parallelepiped, and includes, for example, a roughly rectangular parallelepiped shape with rounded corners and ridges as described below.

[0028] In the example shown in Figure 1, etc., the base body 10 has a first end face 11a and a second end face 11b facing the first direction D1, a first main face 12a and a second main face 12b facing the second direction D2, and a first side face 13a and a second side face 13b facing the third direction D3.

[0029] At least one of the surfaces of the base body 10, i.e., at least one surface selected from the group consisting of the first end surface 11a, the second end surface 11b, the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b, may be marked to make it easier to identify each surface.

[0030] The first end face 11 a and the second end face 11 b do not need to be strictly perpendicular to the first direction D1. The first main surface 12 a and the second main surface 12 b do not need to be strictly perpendicular to the second direction D2. The first side surface 13 a and the second side surface 13 b do not need to be strictly perpendicular to the third direction D3.

[0031] At least one of the corners and ridges of the element body 10 may be rounded.

[0032] The corners of the element body 10 are the portions where three surfaces of the element body 10 intersect.

[0033] The ridge portion of the element body 10 is the portion where two surfaces of the element body 10 intersect.

[0034] The element body 10 is formed by laminating ferrite layers 15 in the lamination direction.

[0035] In the example shown in FIG. 1 etc., the stacking direction is parallel to the second direction D2.

[0036] The ferrite layer 15 extends in a plane direction perpendicular to the lamination direction.

[0037] In the example shown in FIG. 1 etc., the plane direction is a direction perpendicular to the second direction D2 and includes the first direction D1 and the third direction D3.

[0038] The ferrite constituting the ferrite layer 15 preferably contains Fe, Zn, Cu, and Ni.

[0039] The ferrite constituting the ferrite layer 15 may further contain additives such as Mn, Co, Sn, Bi, and Si, and may further contain inevitable impurities.

[0040] As shown in FIG. 1 and other figures, the boundary (interface) between adjacent ferrite layers 15 is often not clearly visible.

[0041] <Internal Electrode Layers> The internal electrode layers 20 are stacked inside the element body 10 in the stacking direction (here, the second direction D2) via the ferrite layers 15 .

[0042] The internal electrode layers 20 adjacent to each other in the stacking direction (here, the second direction D2) may be stacked so as to sandwich one ferrite layer 15 therebetween, or may be stacked so as to sandwich multiple ferrite layers 15 therebetween.

[0043] It is preferable that at least one ferrite layer 15 is stacked toward one side in the stacking direction (here, the second direction D2) in the internal electrode layer 20 located outermost on one side in the stacking direction (here, the second direction D2).

[0044] In the example shown in Figure 1, etc., at least one ferrite layer 15 is stacked toward the first main surface 12a side (bottom side) in the second direction D2 in the internal electrode layer 20 located outermost on the first main surface 12a side (bottom side) in the second direction D2.

[0045] It is preferable that at least one ferrite layer 15 is stacked toward the other side in the stacking direction (here, the second direction D2) on the internal electrode layer 20 located outermost on the other side in the stacking direction (here, the second direction D2).

[0046] In the example shown in Figure 1, etc., at least one ferrite layer 15 is stacked toward the second main surface 12b side (upper side) in the second direction D2 in the internal electrode layer 20 located outermost on the second main surface 12b side (upper side) in the second direction D2.

[0047] The internal electrode layers 20 extend along the ferrite layers 15 in the planar direction (here, a direction including the first direction D1 and the third direction D3).

[0048] The internal electrode layers 20 include an inductor electrode layer 21 , a first capacitor electrode layer 22 , and a second capacitor electrode layer 23 .

[0049] The inductor electrode layer 21 is located on the same main surface of the ferrite layer 15. Specifically, the inductor electrode layer 21 is located on one of a pair of main surfaces of the ferrite layer 15 that face each other in the stacking direction (here, the second direction D2).

[0050] The inductor electrode layer 21 is electrically connected to the first external electrode 30 and the second external electrode 40 .

[0051] In the example shown in Figure 1, etc., the inductor electrode layer 21 is exposed from the first end face 11a and the second end face 11b of the base body 10, and is electrically connected to the first external electrode 30 at the exposed portion at the first end face 11a, and is electrically connected to the second external electrode 40 at the exposed portion at the second end face 11b.

[0052] The inductor electrode layer 21 may be exposed from surfaces other than the first end face 11 a and second end face 11 b of the element body 10 as long as it is in a position that allows electrical connection to the first external electrode 30 and the second external electrode 40 .

[0053] Examples of conductive materials that can be used to form the inductor electrode layer 21 include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals. Among these, Ag is preferred as the conductive material that can be used to form the inductor electrode layer 21.

[0054] The number of inductor electrode layers 21 in the internal electrode layer 20 may be one or more.

[0055] When the internal electrode layer 20 has a plurality of inductor electrode layers 21, the plurality of inductor electrode layers 21 may be located on the main surface of the same ferrite layer 15, or may be located on the main surfaces of different ferrite layers 15, or some of the inductor electrode layers 21 may be located on the main surface of the same ferrite layer 15 and the rest may be located on the main surfaces of different ferrite layers 15.

[0056] The first capacitor electrode layer 22 is not electrically connected to the second external electrode 40 but is electrically connected to the first external electrode 30 .

[0057] In the example shown in Figure 1, etc., the first capacitor electrode layer 22 is exposed from the first end face 11a but not the second end face 11b of the base body 10, and the exposed portion at the first end face 11a is electrically connected to the first external electrode 30 but not the second external electrode 40.

[0058] The first capacitor electrode layer 22 may be exposed from a surface other than the first end surface 11a of the base body 10 as long as it is not electrically connected to the second external electrode 40 and is in a position where it can be electrically connected to the first external electrode 30.

[0059] The first capacitor electrode layer 22 is preferably located on the same main surface of the ferrite layer 15. Specifically, the first capacitor electrode layer 22 is preferably located on one of a pair of main surfaces of the ferrite layer 15 that face each other in the stacking direction (here, the second direction D2).

[0060] Examples of conductive materials constituting the first capacitor electrode layer 22 include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals. Among these, Ag is preferred as the conductive material constituting the first capacitor electrode layer 22.

[0061] The number of first capacitor electrode layers 22 in the internal electrode layer 20 may be one or more.

[0062] The second capacitor electrode layer 23 is not electrically connected to the first external electrode 30 but is electrically connected to the second external electrode 40 .

[0063] In the example shown in Figure 1, etc., the second capacitor electrode layer 23 is exposed from the second end face 11b rather than the first end face 11a of the base body 10, and the exposed portion at the second end face 11b is electrically connected to the second external electrode 40 rather than the first external electrode 30.

[0064] The second capacitor electrode layer 23 may be exposed from a surface other than the second end surface 11b of the base body 10, as long as it is not electrically connected to the first external electrode 30 and is in a position where it can be electrically connected to the second external electrode 40.

[0065] The second capacitor electrode layer 23 is preferably located on the same main surface of the ferrite layer 15. Specifically, the second capacitor electrode layer 23 is preferably located on one of a pair of main surfaces of the ferrite layer 15 that face each other in the stacking direction (here, the second direction D2).

[0066] Examples of conductive materials constituting the second capacitor electrode layer 23 include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals. Among these, Ag is preferred as the conductive material constituting the second capacitor electrode layer 23.

[0067] The number of second capacitor electrode layers 23 in the internal electrode layer 20 may be one or more.

[0068] <First External Electrode> The first external electrode 30 is provided on the surface of the element body 10 .

[0069] 1 and the like, the first external electrode 30 is provided on the first end surface 11 a of the element body 10. The first external electrode 30 may be provided on a portion of the first end surface 11 a of the element body 10, or may be provided on the entire first end surface 11 a.

[0070] As shown in FIG. 1 etc., the first external electrode 30 may extend from the first end face 11a over a portion of at least one surface of the body 10 selected from the group consisting of the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b.

[0071] The first external electrode 30 may be provided on a surface other than the first end surface 11 a of the element body 10 as long as it is located in a position that allows electrical connection to the inductor electrode layer 21 and the first capacitor electrode layer 22 .

[0072] Examples of conductive materials that form the first external electrode 30 include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0073] The first external electrode 30 may have a single-layer structure or a multi-layer structure.

[0074] When the first external electrode 30 has a multi-layer structure, the first external electrode 30 preferably has, in order from the element body 10 side, an Ag base electrode layer and a Ni-plated electrode layer. Furthermore, the first external electrode 30 more preferably has, in order from the element body 10 side, an Ag base electrode layer, a Ni-plated electrode layer, and a Sn-plated electrode layer.

[0075] <Second External Electrode> The second external electrode 40 is provided on the surface of the element body 10 at a position spaced apart from the first external electrode 30 .

[0076] 1 and the like, the second external electrode 40 is provided on the second end surface 11b of the element body 10 at a position spaced apart from the first external electrode 30 in the first direction D1. The second external electrode 40 may be provided on a portion of the second end surface 11b of the element body 10, or may be provided on the entire second end surface 11b.

[0077] As shown in FIG. 1, etc., the second external electrode 40 may extend from the second end face 11b over a portion of at least one surface of the body 10 selected from the group consisting of the first main surface 12a, the second main surface 12b, the first side surface 13a, and the second side surface 13b.

[0078] The second external electrode 40 may be provided on a surface other than the second end surface 11 b of the element body 10 as long as it is located in a position that allows electrical connection to the inductor electrode layer 21 and the second capacitor electrode layer 23 .

[0079] Examples of conductive materials that form the second external electrode 40 include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0080] The conductive material that constitutes the second external electrode 40 may be the same as or different from the conductive material that constitutes the first external electrode 30 .

[0081] The second external electrode 40 may have a single-layer structure or a multi-layer structure.

[0082] When the second external electrode 40 has a multi-layer structure, the second external electrode 40 preferably has, in order from the element body 10 side, an Ag base electrode layer and a Ni-plated electrode layer. Furthermore, the second external electrode 40 more preferably has, in order from the element body 10 side, an Ag base electrode layer, a Ni-plated electrode layer, and a Sn-plated electrode layer.

[0083] The following describes the configuration of the LC composite component 1A, which is characterized by the combination of the ferrite layer 15, the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23.

[0084] The LC composite component 1A includes an inductor section LP including an inductor electrode layer 21 and a capacitor section CP provided on at least one side of the inductor section LP in the stacking direction (here, the second direction D2), with a first capacitor electrode layer 22 and a second capacitor electrode layer 23 facing each other via a ferrite layer 15. In this way, the presence of the capacitor section CP in addition to the inductor section LP in the LC composite component 1A makes it possible to reduce the absolute value of the reactance component of the impedance in a desired frequency band, compared to, for example, a multilayer chip inductor described in Patent Document 1 that includes an inductor section LP but does not include a capacitor section CP. As a result, the LC composite component 1A, combined with the increase in the capacitance of the entire component due to the presence of the capacitor section CP, tends to shift the resonance point, which is the impedance peak position, to a lower frequency and more likely to be located in a desired frequency band, compared to a multilayer chip inductor described in Patent Document 1 that includes an inductor section LP but does not include a capacitor section CP. Therefore, in the LC composite component 1A, the presence of the capacitor section CP in addition to the inductor section LP makes it possible to improve noise removal performance in the desired frequency band compared to a case where the inductor section LP is present but the capacitor section CP is not.

[0085] The following describes the configuration of the element body 10, which is another feature of the LC composite component 1A.

[0086] In the LC composite component 1A, the element body 10 is formed by stacking the ferrite layers 15 in the stacking direction (here, the second direction D2). In this way, in the LC composite component 1A, the element body 10 is made of ferrite, which is a magnetic material, and therefore it is possible to ensure a large resistance component of impedance in a desired frequency band, compared to when the element body 10 is made of, for example, a dielectric material such as barium titanate. Therefore, in the LC composite component 1A, the element body 10 is made of ferrite, which is a magnetic material, and therefore it is possible to improve noise removal performance in a desired frequency band, compared to when the element body 10 is made of, for example, a dielectric material such as barium titanate.

[0087] As described above, the LC composite component 1A includes the capacitor portion CP in addition to the inductor portion LP, and the element body 10 is made of ferrite, so that in the desired frequency band, it is possible to ensure a large resistance component of the impedance while reducing the absolute value of the reactance component. Therefore, the LC composite component 1A can improve noise removal performance in the desired frequency band.

[0088] In the LC composite component 1A, it is possible to adjust the desired frequency band in which noise removal performance is to be improved by adjusting the size of the element body 10, the material of the element body 10, the sizes of the various electrode layers (the inductor electrode layer 21, the first capacitor electrode layer 22, the second capacitor electrode layer 23, etc.). In the LC composite component 1A, it is possible to improve noise removal performance in a desired frequency band, for example, a frequency band of 10 MHz or more and 100 MHz or less. In the LC composite component 1A, it is also possible to improve noise removal performance in frequency bands other than the frequency band of 10 MHz or more and 100 MHz or less (for example, frequency bands higher than 100 MHz).

[0089] Furthermore, in the LC composite component 1A, the base body 10 is made of the same type of material, i.e., ferrite, so that differences in the linear expansion coefficients of adjacent ferrite layers 15 are less likely to occur. Therefore, for example, when heating is performed during solder reflow or other processes when mounting the LC composite component 1A, stress due to differences in the linear expansion coefficients of the ferrite layers 15 is less likely to occur at the boundaries (interfaces) between the ferrite layers 15, and as a result, defects due to such stress (e.g., cracks inside the base body 10) are less likely to occur.

[0090] Specific examples of the inductor section LP (inductor electrode layer 21) and the capacitor section CP (first capacitor electrode layer 22 and second capacitor electrode layer 23) will be described below.

[0091] Fig. 3 is a perspective view schematically illustrating a state focusing on the inductor section (inductor electrode layer) in Fig. 1. Note that Fig. 3 shows a see-through state of the LC composite component (element body) with the first capacitor electrode layer, the second capacitor electrode layer, the first external electrode, and the second external electrode removed, so that the shape of the inductor section (inductor electrode layer) can be easily seen.

[0092] As shown in FIG. 3, when viewed from the stacking direction (here, the second direction D2), the inductor electrode layer 21 may be linear.

[0093] 3, the inductor electrode layer 21 extends linearly without bending when viewed from the stacking direction (here, the second direction D2). Therefore, in the example shown in FIG. 3, it can also be said that the inductor electrode layer 21 is unbent when viewed from the stacking direction (here, the second direction D2).

[0094] When the inductor electrode layer 21 is linear (non-bent), the DC resistance (Rdc) of the inductor electrode layer 21 is more likely to decrease than when the inductor electrode layer 21 is circular (e.g., spiral), and as a result, the DC resistance of the LC composite component 1A is more likely to decrease.

[0095] When the inductor electrode layer 21 is linear (non-bent), the capacitance of the inductor electrode layer 21 is smaller than when the inductor electrode layer 21 is circular (e.g., spiral), and therefore the resonance point, which is the impedance peak position, tends to shift to higher frequencies, for example, in a frequency band higher than 100 MHz. In contrast, the LC composite component 1A includes a capacitor section CP, which includes the first capacitor electrode layer 22 and the second capacitor electrode layer 23, in addition to the inductor section LP, which includes the inductor electrode layer 21. Therefore, even if the inductor electrode layer 21 is linear (non-bent), the resonance point, which is the impedance peak position, is less likely to shift to higher frequencies and is more likely to be located in a desired frequency band, for example, a frequency band of 10 MHz or more and 100 MHz or less. Therefore, even if the inductor electrode layer 21 is linear (non-bent), the LC composite component 1A can improve noise removal performance in a desired frequency band, for example, a frequency band of 10 MHz or more and 100 MHz or less.

[0096] When viewed from the stacking direction (here, the second direction D2), the shape of the inductor electrode layer 21 may be other than a straight line (non-bent line).

[0097] Fig. 4 is a perspective view schematically showing another example of the LC composite component of the present invention. Fig. 5 is a perspective view schematically showing a state focusing on the inductor section (inductor electrode layer) in Fig. 4. Note that Figs. 4 and 5 each show a see-through state of the LC composite component (element body), similar to Figs. 1 and 3.

[0098] In the LC composite component 1B shown in FIG. 4, the inductor electrode layer 21 may have a meandering shape when viewed from the stacking direction (here, the second direction D2) as shown in FIG.

[0099] Fig. 6 is a perspective view schematically showing yet another example of the LC composite component of the present invention. Fig. 7 is a perspective view schematically showing a state focusing on the inductor section (inductor electrode layer) in Fig. 6. Note that Figs. 6 and 7 each show a see-through state of the LC composite component (element body), similar to Figs. 1 and 3.

[0100] Regarding the LC composite component 1C shown in FIG. 6, when viewed from the stacking direction (here, the second direction D2), as shown in FIG. 7, the inductor electrode layer 21 may be simply curved rather than meandering.

[0101] As described above, when viewed from the stacking direction (here, the second direction D2), the inductor electrode layer 21 may have a bent shape including a meandering shape ( FIG. 5 ), a simple curved shape ( FIG. 7 ), etc. Note that when viewed from the stacking direction (here, the second direction D2), the inductor electrode layer 21 may have a bent shape other than those shown in FIGS. 5 and 7 .

[0102] The capacitor section CP is preferably provided on both sides of the inductor section LP in the stacking direction (here, the second direction D2). In other words, the inductor section LP is preferably sandwiched between the capacitor sections CP in the stacking direction (here, the second direction D2).

[0103] When the capacitor section CP is provided on both sides of the inductor section LP in the stacking direction (here, the second direction D2), it is preferable that the total number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the capacitor section CP provided on one side of the inductor section LP in the stacking direction (here, the second direction D2) is the same as the total number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the capacitor section CP provided on the other side of the inductor section LP in the stacking direction (here, the second direction D2).

[0104] In the example shown in Figure 1 etc., the total number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the capacitor section CP provided on the first main surface 12a side (lower side) of the inductor section LP in the second direction D2 and the total number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the capacitor section CP provided on the second main surface 12b side (upper side) of the inductor section LP in the second direction D2 are both 15, which is the same.

[0105] As described above, in a configuration in which the capacitor sections CP are provided on both sides of the inductor section LP in the stacking direction (here, the second direction D2), if the total number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the capacitor section CP provided on one side of the inductor section LP in the stacking direction (here, the second direction D2) is the same as the total number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the capacitor section CP provided on the other side of the inductor section LP in the stacking direction (here, the second direction D2), the electrical characteristics of the LC composite component 1A in the circuit do not change whether the LC composite component 1A is mounted on a mounting target (e.g., a substrate) from the first main surface 12 a or the second main surface 12 b. Alternatively, the electrical characteristics of the LC composite component 1A in the circuit do not change whether the LC composite component 1A is mounted on a mounting target from the first side surface 13 a or the second side surface 13 b. In other words, when mounting the LC composite component 1A on an object to be mounted to form a circuit, as described above, the electrical characteristics of the LC composite component 1A in the circuit do not change regardless of which of the pair of opposing surfaces of the LC composite component 1A (base body 10) is used as the mounting surface (the surface facing the object to be mounted) (whether the first main surface 12a or the second main surface 12b is used as the mounting surface, or whether the first side surface 13a or the second side surface 13b is used as the mounting surface).

[0106] The number of inductor sections LP may be one or more.

[0107] When there are a plurality of inductor sections LP, the DC resistance of the LC composite component 1A tends to decrease.

[0108] When there are multiple inductor sections LP, adjacent inductor sections LP in the stacking direction (here, the second direction D2) may be arranged so as not to sandwich a capacitor section CP therebetween, or may be arranged so as to sandwich at least one capacitor section CP therebetween.

[0109] The number of inductor electrode layers 21 in the same inductor section LP may be one or more.

[0110] The number of capacitor units CP may be one or more.

[0111] When there are multiple capacitor sections CP, the overall capacitance of the LC composite component 1A tends to increase, and the resonance point, which is the peak position of the impedance, tends to shift to the lower frequency side, and tends to be located in the desired frequency band, for example, a frequency band of 10 MHz or more and 100 MHz or less.

[0112] When there are multiple capacitor sections CP, adjacent capacitor sections CP in the stacking direction (here, the second direction D2) may be arranged so as not to sandwich an inductor section LP therebetween, or may be arranged so as to sandwich at least one inductor section LP therebetween.

[0113] The number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the same capacitor portion CP may be one each, or may be a plurality of each.

[0114] The number of first capacitor electrode layers 22 and second capacitor electrode layers 23 in the same capacitor portion CP may be the same as or different from each other.

[0115] 1 and other examples, the number of inductor electrode layers 21 is one, and the number of first capacitor electrode layers 22 and the number of second capacitor electrode layers 23 are multiple. Thus, in the example shown in Fig. 1 and other examples, even if the number of inductor electrode layers 21 is one, the number of first capacitor electrode layers 22 and the number of second capacitor electrode layers 23 are multiple, which makes it easier to increase the capacitance of the LC composite component 1A as a whole, and therefore the resonance point, which is the impedance peak position, is more likely to shift to the lower frequency side and be located in a desired frequency band, for example, a frequency band of 10 MHz or more and 100 MHz or less.

[0116] It is preferable that the conductive materials constituting the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23 are the same. In this case, when manufacturing the LC composite component 1A, the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23 can be formed using the same conductive material, which can improve the manufacturing efficiency of the LC composite component 1A.

[0117] When the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23 are made of the same conductive material, it is preferable that the conductive materials used to make the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23 are all Ag. In this case, it is possible to significantly reduce the electrical resistivity of the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23, and as a result, it is possible to significantly reduce the electrical resistivity of the LC composite component 1A.

[0118] The LC composite component 1A is manufactured, for example, by the following method.

[0119] <Step of Producing Mother Laminate> First, a ferrite paste is applied to produce a ferrite green sheet, which will later become the ferrite layer 15.

[0120] A conductive paste (e.g., Ag paste) is applied to one main surface of the ferrite green sheet so as to reach one end of the ferrite green sheet in the first direction D1 but not the other end, thereby producing a ferrite green sheet with a first conductive layer. The first conductive layer will later become the first capacitor electrode layer 22.

[0121] A conductive paste (e.g., Ag paste) is applied to one main surface of the ferrite green sheet in the first direction D1 so as to reach the other end of the ferrite green sheet but not reach the one end, thereby producing a ferrite green sheet with a second conductive layer. The second conductive layer will later become the second capacitor electrode layer 23.

[0122] A conductive paste (e.g., Ag paste) is applied to one main surface of the ferrite green sheet so as to reach both ends of the ferrite green sheet in the first direction D1, thereby producing a ferrite green sheet with a third conductive layer. The third conductive layer will later become the inductor electrode layer 21.

[0123] Examples of methods for applying the ferrite paste and the conductive paste include printing methods such as screen printing and inkjet printing.

[0124] Next, in the second direction D2, a predetermined number of ferrite green sheets are stacked, and then a predetermined number of ferrite green sheets with first conductive layers and ferrite green sheets with second conductive layers are stacked alternately on top of them, and then a predetermined number of ferrite green sheets are stacked on top of them, and then a ferrite green sheet with a third conductive layer is stacked on top of them, and then a predetermined number of ferrite green sheets are stacked on top of them, and then a predetermined number of ferrite green sheets are stacked on top of them, and then a predetermined number of ferrite green sheets are stacked on top of them.

[0125] In this way, a mother laminate is produced.

[0126] The mother laminate may be pressed in the second direction D2, in which case the ferrite green sheet, the ferrite green sheet with the first conductive layer, the ferrite green sheet with the second conductive layer, and the ferrite green sheet with the third conductive layer that constitute the mother laminate are pressed together, thereby improving the adhesion between the sheets.

[0127] The mother laminate may be pressed using, for example, a hydrostatic press or a rigid press.

[0128] <Process for forming element body and internal electrode layers> First, the mother laminate is cut along the second direction D2 to separate it into a plurality of laminate chips. When cutting the mother laminate, the first conductive layer is exposed from one end face but not from the other end face, the second conductive layer is exposed from the other end face but not from the one end face, and the third conductive layer is exposed from both end faces of the resulting laminate chip, each end face facing the first direction D1.

[0129] The mother laminate can be cut by, for example, dicing, laser cutting, or pressure cutting.

[0130] Next, the laminated chip is fired.

[0131] When the laminated chip is fired, the ferrite green sheets become ferrite layers 15, and an element body 10 is formed in which the ferrite layers 15 are stacked in the second direction D2.

[0132] Furthermore, when the laminated chip is fired, the first conductive layer becomes the first capacitor electrode layer 22, the second conductive layer becomes the second capacitor electrode layer 23, and the third conductive layer becomes the inductor electrode layer 21, thereby forming the internal electrode layer 20 including the inductor electrode layer 21, the first capacitor electrode layer 22, and the second capacitor electrode layer 23. Here, the inductor electrode layer 21 is exposed from the first end face 11 a and the second end face 11 b of the element body 10, the first capacitor electrode layer 22 is exposed from the first end face 11 a but not the second end face 11 b of the element body 10, and the second capacitor electrode layer 23 is exposed from the second end face 11 b but not the first end face 11 a of the element body 10.

[0133] Then, in the laminated chip after firing, an inductor section LP including an inductor electrode layer 21 and capacitor sections CP are formed on both sides of the inductor section LP in the second direction D2, with a first capacitor electrode layer 22 and a second capacitor electrode layer 23 facing each other via a ferrite layer 15.

[0134] The element body 10 may be subjected to barrel polishing, for example, to round off at least one of the corners and ridges.

[0135] <Step of forming first external electrode and second external electrode> First, a conductive paste (e.g., Ag paste) is applied to the first end face 11 a of the element body 10 and baked so as to connect to the exposed portions of the inductor electrode layer 21 and the first capacitor electrode layer 22 exposed from the first end face 11 a of the element body 10. This forms a first external electrode 30 that is provided on the first end face 11 a of the element body 10 and electrically connected to the inductor electrode layer 21 and the first capacitor electrode layer 22.

[0136] Furthermore, a conductive paste (e.g., Ag paste) is applied to the second end face 11b of the element body 10 and baked so as to connect to the exposed portions of the inductor electrode layer 21 and the second capacitor electrode layer 23 that are exposed from the second end face 11b of the element body 10. This forms a second external electrode 40 that is provided on the second end face 11b of the element body 10 and electrically connected to the inductor electrode layer 21 and the second capacitor electrode layer 23.

[0137] In the method described above, the first external electrode 30 and the second external electrode 40 are formed by the so-called post-firing method at a timing separate from that of the element body 10, specifically after the element body 10 is formed.

[0138] The first external electrode 30 and the second external electrode 40 may be formed at the same time as the element body 10 by a so-called co-firing method. In this case, for example, a conductive paste is applied to both end faces of the laminate chip before firing, and then the laminate chip with the conductive paste attached is fired.

[0139] When forming the first external electrode 30 and the second external electrode 40, an electrode obtained by baking or firing the above-mentioned conductive paste may be used as a base electrode layer, and a plating electrode layer (e.g., a Ni-plated electrode layer and a Sn-plated electrode layer) may be formed on the surface of the base electrode layer (e.g., an Ag base electrode layer) by plating.

[0140] In this way, the LC composite component 1A is manufactured.

[0141] The above description is not limited to the LC composite component 1A (FIG. 1), but also applies to, for example, the LC composite component 1B (FIG. 4) and the LC composite component 1C (FIG. 6).

[0142] The LC composite component of the present invention is not limited to the above-described embodiment, and various applications and modifications can be made within the scope of the present invention with respect to the configuration, manufacturing conditions, etc. of the LC composite component.

[0143] EXAMPLES Hereinafter, examples will be given that more specifically disclose the LC composite component of the present invention, but the present invention is not limited to the following examples.

[0144] Example 1 An LC composite component 1A shown in Fig. 1 was used as a simulation model of an LC composite component of Example 1. The specifications of the simulation model of the LC composite component of Example 1 were as follows. <Element body> Constituent material: ferrite Relative permittivity of ferrite: 15 Relative permeability of ferrite: 220 (frequency: 10 kHz) Length (dimension in first direction): 1.6 mm Thickness (dimension in second direction): 0.8 mm Width (dimension in third direction): 0.8 mm <Inductor electrode layer> Constituent material (conductive material): Ag Shape: linear Thickness (dimension in second direction): 32 μm Width (dimension in third direction): 500 μm <Inductor section> Number of inductor sections: 1 Number of inductor electrode layers in the same inductor section: 1 <First capacitor electrode layer> Constituent material (conductive material): Ag Thickness (dimension in second direction): 8 μm Width (dimension in third direction): 500 μm <Second capacitor electrode layer> Constituent material (conductive material): Ag Thickness (dimension in second direction): 8 μm Width (dimension in third direction): 500 μm <Capacitor section> Number of capacitor sections: 2 (arranged so as to sandwich the inductor section) Total number of first capacitor electrode layers and second capacitor electrode layers in the same capacitor section: 15

[0145] Comparative Example 1 FIG. 8 is a perspective view schematically showing a simulation model of an LC composite component of Comparative Example 1. As shown in FIG.

[0146] 8 is similar to the LC composite component 1A shown in Fig. 1 except that it does not have the first capacitor electrode layer 22 or the second capacitor electrode layer 23, i.e., it does not have the capacitor portion CP. The LC composite component 101A is based on the multilayer chip inductor described in Patent Document 1 (e.g., Fig. 1).

[0147] The specifications of the simulation model of the LC composite component of Comparative Example 1 are the same as those of the simulation model of the LC composite component of Example 1, except that there is no specification related to the first capacitor electrode layer, the second capacitor electrode layer, or the capacitor section.

[0148] Comparative Example 2 FIG. 9 is a perspective view schematically showing a simulation model of an LC composite component of Comparative Example 2. As shown in FIG.

[0149] The LC composite component 101B shown in FIG. 9 is similar to the LC composite component 1A shown in FIG. 1 except that a barium titanate layer 115 is provided instead of the ferrite layer 15 .

[0150] The specifications of the simulation model for the LC composite component of Comparative Example 2 are the same as those of the simulation model for the LC composite component of Example 1, except that the constituent material of the element body is changed to barium titanate (relative dielectric constant: 1900, relative permeability: 1.0 (frequency: 10 kHz)).

[0151] [Evaluation] Simulation evaluation of the frequency characteristics of impedance was performed using the simulation models of the LC composite components of Example 1, Comparative Example 1, and Comparative Example 2. CAE software "Femtet (registered trademark) 2023.1" manufactured by Murata Software Co., Ltd. was used to perform the simulation evaluation.

[0152] FIG. 10 is a graph showing the results of a simulation evaluation of the impedance frequency characteristics of the simulation model of the LC composite component of Example 1. FIG. 11 is a graph showing the results of a simulation evaluation of the impedance frequency characteristics of the simulation model of the LC composite component of Comparative Example 1. FIG. 12 is a graph showing the results of a simulation evaluation of the impedance frequency characteristics of the simulation model of the LC composite component of Comparative Example 2. FIG. 13 is a graph collectively showing the absolute values ​​of the reactance components in FIGS. 10 (Example 1), 11 (Comparative Example 1), and 12 (Comparative Example 2). In FIGS. 10, 11, and 12, the impedance is indicated as "Z," the resistance component is indicated as "R," and the reactance component is indicated as "X." In FIG. 13, the absolute value of the reactance component is indicated as "|X|." Although the scales on the vertical axes are omitted in FIGS. 10, 11, 12, and 13, the scales on the vertical axes are the same in each figure.

[0153] In the LC composite component of Example 1, which has a capacitor component in addition to an inductor component and whose element body is made of ferrite, as shown in FIG. 10 , in the frequency band from 10 MHz to 100 MHz, the resistance component (R) of the impedance (Z) was large and the absolute value of the reactance component (X) was small. As a result, in the LC composite component of Example 1, the resonance point, which is the peak position of the impedance (Z), was located in the frequency band from 10 MHz to 100 MHz. Therefore, it was considered that the LC composite component of Example 1 had high noise removal performance in the frequency band from 10 MHz to 100 MHz. Note that in FIG. 10 , the frequency corresponding to the intersection of the resistance component (R) and the reactance component (X) was 27 MHz.

[0154] In the LC composite component of Comparative Example 1, which had a ferrite element body and an inductor portion but no capacitor portion, the resistance component (R) of the impedance (Z) was large in the frequency band of 10 MHz or more and 100 MHz or less, as shown in FIG. 11 . However, in the LC composite component of Comparative Example 1, the absolute value of the reactance component (X) of the impedance (Z) was not smaller than that of the LC composite component of Example 1 in the frequency band of 10 MHz or more and 100 MHz or less, as shown in FIG. 13 . In the LC composite component of Comparative Example 1, the absolute value of the reactance component (X) was not smaller than that of the LC composite component of Example 1, particularly in the frequency band around 100 MHz, as shown in FIG. 13 . Therefore, it was considered that the LC composite component of Comparative Example 1 was more likely to generate ringing in the frequency band of 10 MHz or more and 100 MHz or less, compared to the LC composite component of Example 1. Furthermore, in the LC composite component of Comparative Example 1, the absolute value of the reactance component (X) was not reduced in the frequency band of 10 MHz or more and 100 MHz or less, and as shown in Figure 11, the resonance point, which is the peak position of the impedance (Z), was not located in the frequency band of 10 MHz or more and 100 MHz or less. Therefore, it was considered that the LC composite component of Comparative Example 1 had lower noise removal performance in the frequency band of 10 MHz or more and 100 MHz or less than the LC composite component of Example 1. In Figure 11, the frequency corresponding to the intersection of the resistance component (R) and the reactance component (X) was 37 MHz.

[0155] In the LC composite component of Comparative Example 2, which had a capacitor portion in addition to an inductor portion but whose element body was made of barium titanate, the resistance component (R) of the impedance (Z) was much smaller than that of the LC composite component of Example 1, as shown in FIG. 12 (the resistance component (R) of the LC composite component of Comparative Example 2 was approximately 0 Ω). In the LC composite component of Comparative Example 2, the resistance component (R) was much smaller than that of the LC composite component of Example 1, particularly in the frequency band of 10 MHz or higher and 100 MHz or lower. As a result, the impedance (Z) of the LC composite component of Comparative Example 2 was much smaller than that of the LC composite component of Example 1. Therefore, it was considered that the LC composite component of Comparative Example 2 had lower noise removal performance in the frequency band of 10 MHz or higher and 100 MHz or lower than that of the LC composite component of Example 1. As shown in FIG. 13 , in the LC composite component of Comparative Example 2, the absolute value of the reactance component (X) was not large compared to the LC composite component of Example 1 in the frequency band of 10 MHz or more and 100 MHz or less. However, as described above, the impedance (Z) was much smaller compared to the LC composite component of Example 1. Therefore, it was considered that the LC composite component of Comparative Example 2 had lower noise removal performance compared to the LC composite component of Example 1 in the frequency band of 10 MHz or more and 100 MHz or less.

[0156] The present specification discloses the following:

[0157] an inductor electrode layer located on the same main surface of the ferrite layer and electrically connected to the first external electrode; and an inductor section including the inductor electrode layer; and a capacitor section provided on at least one side of the inductor section in the stacking direction, the capacitor section being formed by stacking the first capacitor electrode layer and the second capacitor electrode layer opposite each other via the ferrite layer.

[0158] <2> The LC composite component according to <1>, wherein the inductor electrode layer has a linear shape when viewed from the stacking direction.

[0159] <3> The LC composite component according to <1>, wherein the inductor electrode layer has a curved shape when viewed from the stacking direction.

[0160] <4> The LC composite component according to <3>, wherein the inductor electrode layer has a meandering shape when viewed from the stacking direction.

[0161] <5> The LC composite component according to any one of <1> to <4>, wherein the capacitor section is provided on both sides of the inductor section in the stacking direction.

[0162] <6> The LC composite component according to <5>, wherein the total number of the first capacitor electrode layers and the second capacitor electrode layers in the capacitor section provided on one side of the inductor section in the stacking direction is the same as the total number of the first capacitor electrode layers and the second capacitor electrode layers in the capacitor section provided on the other side of the inductor section in the stacking direction.

[0163] <7> The LC composite component according to any one of <1> to <6>, wherein the number of the inductor electrode layer is one, and the number of the first capacitor electrode layer and the number of the second capacitor electrode layer are each plural.

[0164] <8> The LC composite component according to any one of <1> to <7>, wherein the conductive materials constituting the inductor electrode layer, the first capacitor electrode layer, and the second capacitor electrode layer are the same as one another.

[0165] <9> The LC composite component according to <8>, wherein the conductive materials constituting the inductor electrode layer, the first capacitor electrode layer, and the second capacitor electrode layer are all Ag.

[0166] DESCRIPTION OF SYMBOLS 1A, 1B, 1C, 101A, 101B LC composite component 10 Element body 11a First end face 11b Second end face 12a First main surface 12b Second main surface 13a First side face 13b Second side face 15 Ferrite layer 20 Internal electrode layer 21 Inductor electrode layer 22 First capacitor electrode layer 23 Second capacitor electrode layer 30 First external electrode 40 Second external electrode 115 Barium titanate layer CP Capacitor section D1 First direction D2 Second direction D3 Third direction LP Inductor section

Claims

1. An LC composite component comprising: an element body formed by stacking ferrite layers in a stacking direction; internal electrode layers stacked inside the element body via the ferrite layers in the stacking direction and extending along the ferrite layers in a plane direction perpendicular to the stacking direction; first external electrodes provided on the surface of the element body; and second external electrodes provided on the surface of the element body at a position spaced from the first external electrodes, wherein the internal electrode layers include a first capacitor electrode layer not electrically connected to the second external electrode but electrically connected to the first external electrode, a second capacitor electrode layer not electrically connected to the first external electrode but electrically connected to the second external electrode, and an inductor electrode layer located on the same main surface of the ferrite layer and electrically connected to the first external electrode and the second external electrode; and an inductor section including the inductor electrode layer; and a capacitor section provided on at least one side of the inductor section in the stacking direction, the first capacitor electrode layer and the second capacitor electrode layer facing each other via the ferrite layer.

2. The LC composite component according to claim 1, wherein the inductor electrode layer is linear when viewed from the stacking direction.

3. The LC composite component according to claim 1, wherein the inductor electrode layer has a curved shape when viewed from the stacking direction.

4. The LC composite component according to claim 3, wherein the inductor electrode layer has a meandering shape when viewed from the lamination direction.

5. The LC composite component according to any one of claims 1 to 4, wherein the capacitor sections are provided on both sides of the inductor section in the lamination direction.

6. An LC composite component as described in claim 5, wherein the total number of the first capacitor electrode layers and the second capacitor electrode layers in the capacitor section provided on one side of the inductor section in the stacking direction is the same as the total number of the first capacitor electrode layers and the second capacitor electrode layers in the capacitor section provided on the other side of the inductor section in the stacking direction.

7. An LC composite component according to any one of claims 1 to 6, wherein the number of the inductor electrode layer is one, and the number of the first capacitor electrode layer and the number of the second capacitor electrode layer are each plural.

8. The LC composite component according to any one of claims 1 to 7, wherein the conductive materials constituting the inductor electrode layer, the first capacitor electrode layer, and the second capacitor electrode layer are the same.

9. The LC composite component according to claim 8, wherein the conductive materials constituting the inductor electrode layer, the first capacitor electrode layer, and the second capacitor electrode layer are all Ag.

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