Method for manufacturing electronic component

Abstract

Provided is a method for manufacturing an electronic component capable of disposing a connection film by using a mounter. The method comprises: a peeling step (A1) for holding individual pieces of connection film with a suction nozzle and peeling the individual pieces from a long first film, in which the plurality of pieces of connection film are arranged, by using an edge member for folding back the first film at an acute angle from a first traveling direction to a second traveling direction; and an arrangement step (B1) for arranging the individual pieces peeled from the first film on a wiring board by using the suction nozzle. Here, the edge member is a portion of a feeder for supplying the individual pieces of the film, and is also a portion of the mounter.

Description

Manufacturing method of electronic components

[0001] This technology relates to a method for manufacturing electronic components using a connecting film such as an anisotropic conductive adhesive film (ACF) or a non-conductive adhesive film (NCF). This application claims priority based on Japanese Patent Application No. 2024-086890, filed in Japan on May 29, 2024, which is incorporated herein by reference.

[0002] Conventionally, surface mount devices (SMDs) are mounted on printed circuit boards by, for example, printing solder on the printed circuit board, mounting the surface mount devices on the solder, and then fixing the surface mount devices to the printed circuit board through a reflow process.

[0003] Surface mount components are mainly mounted using a mounter that mounts electronic components on the surface of a printed circuit board. A mounter, also known as a surface mounter or chip mounter, picks up the component to be mounted by suction and places it in the designated position on the board.

[0004] Solder printing depends on the printing plate, and depending on the thickness of the printing plate, more solder particles than necessary may be supplied, which may cause short circuits or bridges. For this reason, a method of attaching a connecting film containing solder particles has been used in the past (see, for example, Patent Document 1).

[0005] However, switching from solder printing to connection film requires the introduction of a temporary attachment machine for attaching the connection film, so it is desirable to use a mounter to place the connection film.

[0006] International Publication No. 2008 / 023452

[0007] The present technology solves the above-mentioned problems and provides a manufacturing method for electronic components that allows a connection film to be placed using a mounter.

[0008] As a result of extensive research, the inventors have found that the above object can be achieved by the following method for manufacturing electronic components, and have completed the present technology. [1] A method for manufacturing electronic components, comprising: a peeling step in which a long first film, on which multiple pieces of connecting film are arranged, is held by a transfer head using an edge member that folds back at an acute angle from a first direction of travel to a second direction of travel, and the pieces are peeled off from the first film; and an arrangement step in which the pieces peeled off from the first film are arranged on a first electronic component using the transfer head. [2] A method for manufacturing electronic components as described in [1], further comprising a mounting step in which a second electronic component is mounted on the pieces. [3] A method for manufacturing electronic components as described in [1], further comprising a mounting step in which a second film is disposed on each piece, and in the arrangement step, the piece and the second film are mounted on a first electronic component using the transfer head. [4] A method for manufacturing electronic components as described in [3], further comprising a mounting step in which the second film is peeled off from the pieces and a second electronic component is mounted on the pieces. [5] The method for manufacturing an electronic component according to [1], wherein in the peeling step, the individual piece is held by a second electronic component held by the transfer and mounting head, and the individual piece is peeled from the first film; and in the placing step, the individual piece and the second electronic component are mounted on the first electronic component using the transfer and mounting head. [6] The method for manufacturing an electronic component according to any one of [1] to [5], wherein in the peeling step, the individual piece is held by the transfer and mounting head, and an edge member is moved in a direction opposite to the moving direction of the first film, and the individual piece is peeled from the first film. [7] The method for manufacturing an electronic component according to any one of [2], [4], or [5], wherein the first electronic component is a wiring board, and the second electronic component is a surface-mount component. [8] The method for manufacturing an electronic component according to any one of [2], [4], or [5], further comprising a connecting step of electrically connecting the first electronic component and the second electronic component via the individual piece. [9] A peeling device comprising: a transfer head; an edge member that folds a long first film on which a plurality of individual pieces of connecting film are arranged at an acute angle from a first traveling direction to a second traveling direction; and a control unit that uses the transfer head to hold the individual pieces and peel the individual pieces from the first film.

[10] The peeling device according to [9], wherein the thickness of the folded end of the edge member is 0.01 mm or more and 0.5 mm or less.

[11] The peeling device according to [9] or

[10] , wherein the acute angle is 38° or less.

[0009] According to the present technology, a mounter can be used to place a connection film on an electronic component.

[0010] FIG. 1 is a flowchart illustrating a method for manufacturing an electronic component according to a first embodiment. FIG. 2 is a diagram illustrating a peeling step according to the first embodiment. FIG. 3 is a diagram illustrating a folded end of an edge member. FIG. 4 is a diagram illustrating an example of the operation of a feeder according to the first embodiment. FIG. 5 is a perspective view schematically illustrating a state in which an individual piece is aligned at a predetermined position on a printed wiring board using a suction nozzle. FIG. 6 is a perspective view schematically illustrating a state in which an individual piece is placed at a predetermined position on a printed wiring board using a suction nozzle. FIG. 7 is a perspective view schematically illustrating a state in which a connector is moved directly above an individual piece using a suction nozzle. FIG. 8 is a perspective view schematically illustrating a state in which a connector is placed on an individual piece using a suction nozzle. FIG. 9 is a perspective view schematically illustrating a state in which the printed wiring board and the connector are heated in a reflow furnace. FIG. 10 is a flowchart illustrating a method for manufacturing an electronic component according to a second embodiment. FIG. 11 is a diagram illustrating a peeling step according to the second embodiment. FIG. 12 is a diagram illustrating an example of the operation of a feeder according to the second embodiment. Fig. 13 is a flowchart showing a method for manufacturing an electronic component according to the third embodiment. Fig. 14 is a diagram for explaining a peeling step according to the third embodiment. Fig. 15 is a diagram for explaining an example of the operation of a feeder according to the third embodiment. Fig. 16 is a plan view showing a first example of the shape of an individual piece. Fig. 17 is a plan view showing a second example of the shape of an individual piece.

[0011] A method for manufacturing an electronic component according to the present technology includes a peeling step in which a long first film on which a plurality of pieces of connection film are arranged is held by a transfer head using an edge member that folds back at an acute angle from a first traveling direction to a second traveling direction, and the pieces are peeled off from the first film, and an arrangement step in which the pieces peeled off from the first film are arranged on a first electronic component using the transfer head. That is, examples of electronic components according to the present technology include a form in which the first electronic component is distributed with the pieces of connection film arranged on it, and a form in which the first electronic component is distributed with the pieces of connection film arranged on it and the first electronic component is connected to the second electronic component via the pieces. Furthermore, examples of the first electronic component and the second electronic component include surface-mounted components and wiring boards, which will be described later.

[0012] Hereinafter, embodiments of the present technology will be described in detail with reference to the drawings in the following order: 1. First embodiment 2. Second embodiment 3. Third embodiment 4. Other embodiments

[0013] 1. First Embodiment> Fig. 1 is a flowchart illustrating a manufacturing method of an electronic component according to a first embodiment. As shown in Fig. 1, the manufacturing method of an electronic component according to the first embodiment includes a peeling process (A1) in which a long first film on which a plurality of pieces of connection film are arranged is held by a transfer head using an edge member that folds back at an acute angle from a first traveling direction to a second traveling direction, and the pieces are peeled off from the first film; a placement process (B1) in which the transfer head is used to place the pieces peeled off from the first film on a wiring board; a mounting process (C1) in which surface-mounted components are mounted on the pieces; and a connection process (D1) in which the wiring board and the surface-mounted components are electrically connected via the pieces. Here, the edge member is part of a feeder that supplies the pieces of film and also part of a mounter that serves as a peeling device that peels off the pieces using the transfer head.

[0014] The mounter includes, for example, a head unit having a mechanism for holding and picking up individual electronic components with a transfer head, a drive unit for moving the head unit on the X, Y, and Z axes, a supply unit for supplying electronic components, a recognition unit for recognizing the positions of the wiring board and electronic components with a camera, a transport unit for transporting the wiring board, and a control unit for controlling the head unit, the recognition unit, and the transport unit. When using a mounter to mount individual pieces of connection film, it is preferable to use a feeder as the supply unit, which includes an edge member that folds the film at an acute angle from the first traveling direction to the second traveling direction. In other words, it is preferable that the peeling device includes a transfer head, an edge member that folds a long first film on which multiple pieces of connection film are arranged at an acute angle from the first traveling direction to the second traveling direction, and a control unit that uses the transfer head to hold the individual pieces and peel the individual pieces from the first film.

[0015] The connecting film is not particularly limited as long as it can connect the surface-mounted components and the wiring board, and may be made of only a binder such as NCF, or a binder such as ACF with conductive particles disposed therein. Furthermore, when connecting the surface-mounted components and the wiring board using a reflow furnace, a solder connecting film using solder particles as the conductive particles is preferred. Furthermore, the binder of the connecting film may be thermosetting or thermoplastic.

[0016] Specific examples of surface-mounted components include connectors, IC (Integrated Circuit) and LSI (Large Scale Integration) packages, LEDs (Light Emitting Diodes), and switches. For example, connectors include SMT (Surface Mount) type connectors, which include a first terminal row in which multiple pins (lead frames) extending outward from one side of the short side are arranged in the longitudinal direction, and a second terminal row in which multiple pins (lead frames) extending outward from the other side of the short side are arranged in the longitudinal direction. Furthermore, examples of IC packages include surface-mounted lead-type packages, such as SOP (Small Outline Package) and SOJ (Small Outline J-leaded) which include terminal rows on two opposing sides of a rectangle, and QFP (Quad Flat Package) and QFN (Quad Flat No-leaded package) which include terminal rows on four sides of a rectangle.

[0017] The wiring board is not particularly limited as long as it has wiring, and may be broadly defined as a so-called printed wiring board (PWB) provided with electrodes on which surface-mounted components can be mounted, and may be either a rigid board or a flexible board (FPC: Flexible Printed Circuits). Examples of substrates based on the type of base material include glass substrates, ceramic substrates, and plastic substrates.

[0018] The upper limit of the pitch of the terminal rows of the surface mount components and the wiring board is preferably 2 mm or less, more preferably 1 mm or less, and even more preferably 0.5 mm or less, and the lower limit of the pitch of the terminal rows is preferably 0.06 mm or more, more preferably 0.08 mm or more, and even more preferably 0.1 mm or more.

[0019] Hereinafter, with reference to Figures 2 to 8, the peeling process (A1), placement process (B1), mounting process (C1), and connection process (D1) will be described using a solder connection film, a connector, and a printed wiring board as specific examples of a connection film, a surface-mounted component, and a wiring board, respectively.

[0020] (Solder connection film) The solder connection film contains, for example, a binder, solder particles, and a flux compound. By having the solder connection film in the form of a film, not only can the amount of solder particles be made uniform, but also the film is easy to handle, thereby improving work efficiency.

[0021] The lower limit of the thickness of the solder connection film is preferably 0.6 or more, more preferably 0.8 or more, and even more preferably 0.9 or more, relative to the average particle size of the solder particles. The upper limit of the thickness of the solder connection film is preferably 3.0 or less, more preferably 2.0 or less, and even more preferably 1.5 or less, relative to the average particle size of the solder particles. If the ratio of the average particle size of the solder particles to the thickness of the solder connection film is large, the solder connection film may become difficult to handle. Here, the thickness of the solder connection film refers to the thickness of the binder resin layer only, and does not include the particle size.

[0022] The thickness of the solder connection film can be measured using a known micrometer or digital thickness gauge (e.g., Mitutoyo Corporation: MDE-25M, minimum display 0.0001 mm) that can measure to 1 μm or less, preferably 0.1 μm or less. The film thickness can be determined by measuring at 10 or more locations and averaging. However, when the film thickness is thinner than the particle diameter, a contact-type thickness measuring device is not suitable, so it is preferable to use a laser displacement meter (e.g., Keyence Corporation, spectral interference displacement type SI-T series, etc.).

[0023] The binder of the solder connection film may be either thermosetting or thermoplastic, but is preferably thermosetting, which can be melted and hardened by temperature control in the reflow process. The following describes thermosetting binders (insulating binders).

[0024] (Thermosetting Binder) The thermosetting binder preferably has an exothermic peak temperature higher than the melting point of the solder particles, and also preferably has a minimum melt viscosity temperature lower than the melting point of the solder particles. This allows the thermosetting binder to be melted by heating, the solder particles to aggregate on the terminals, and then the thermosetting binder can be cured. Here, the exothermic peak temperature and the minimum melt viscosity temperature can be measured, for example, using a rotational rheometer (manufactured by Thermo Fisher Scientific) under the following conditions: measurement pressure 1 N, temperature range 30 to 200°C, heating rate 10°C / min, measurement frequency 1 Hz, and measurement plate diameter 8 mm.

[0025] Examples of thermosetting binders include a thermal radical polymerization resin composition containing a (meth)acrylate compound and a thermal radical polymerization initiator, a thermal cationic polymerization resin composition containing an epoxy compound and a thermal cationic polymerization initiator, and a thermal anionic polymerization resin composition containing an epoxy compound and a thermal anionic polymerization initiator. Also, known pressure-sensitive adhesive compositions may be used. The term "(meth)acrylic monomer" refers to both acrylic monomers and methacrylic monomers.

[0026] In the following, a specific example will be described, taking as an example a thermally polymerizable resin composition containing a solid epoxy resin, a liquid epoxy resin, and an epoxy resin curing agent.

[0027] The solid epoxy resin is not particularly limited as long as it is solid at room temperature and has one or more epoxy groups in its molecule. Examples include bisphenol A epoxy resin and biphenyl epoxy resin. Among these, it is preferable to use a crystalline bisphenol A epoxy resin with a low melt viscosity. A specific example of a commercially available crystalline bisphenol A epoxy resin is Mitsubishi Chemical Corporation's "YL6810" (crystalline BPA epoxy resin), which has a viscosity of 40 to 55 P measured by the Gardner-Holdt method. The solid epoxy resin may also be a phenoxy resin synthesized from bisphenols and epichlorohydrin. An example of a phenoxy resin is "YP-50" manufactured by Nippon Steel Chemical & Material Co., Ltd. This allows the film shape to be maintained. Note that room temperature refers to the range of 20°C ± 15°C (5°C to 35°C) as specified in JIS Z 8703.

[0028] The liquid epoxy resin is not particularly limited as long as it is liquid at room temperature, and may be, for example, a bisphenol A epoxy resin, a bisphenol F epoxy resin, hydrogenated bisphenol A glycidyl ether, or a urethane-modified epoxy resin. An example of a bisphenol F epoxy resin is "YL983U" manufactured by Mitsubishi Chemical Corporation, and an example of a hydrogenated bisphenol A glycidyl ether is "YX8000" manufactured by Mitsubishi Chemical Corporation.

[0029] The amount of liquid epoxy resin blended is preferably 160 parts by mass or less, more preferably 140 parts by mass or less, and even more preferably 120 parts by mass or less, per 100 parts by mass of solid epoxy resin. If the amount of liquid epoxy resin blended is too large, it becomes difficult to maintain the film shape. Furthermore, if the amount of liquid epoxy resin blended is too large, the cured physical properties after thermal curing generally become high elasticity due to a high crosslink density, and therefore the stress relaxation ability decreases.

[0030] The epoxy resin curing agent is not particularly limited as long as it is a heat curing agent that initiates curing by heat, and examples thereof include anionic curing agents such as amines and imidazoles, and cationic curing agents such as sulfonium salts. The curing agent may also be microencapsulated to provide resistance to the solvent used in forming the film. Examples of anionic curing agents include imidazole-based epoxy resin curing agents such as "2P4MHZ-PW" manufactured by Shikoku Chemicals Corporation.

[0031] (Solder Particles) The solder particles can be appropriately selected from, for example, Sn—Pb-based, Pb—Sn—Sb-based, Sn—Sb-based, Sn—Pb—Bi-based, Bi—Sn-based, Sn—Cu-based, Sn—Pb—Cu-based, Sn—In-based, Sn—Ag-based, Sn—Pb—Ag-based, Pb—Ag-based, etc., as specified in JIS Z 3282-1999, depending on the electrode material, connection conditions, etc. Among these, the solder particles are preferably one or more types selected from the group consisting of Sn—Bi—Cu alloy, Sn—Bi—Ag alloy, Sn—Bi alloy, Sn—Pb—Bi alloy, and Sn—In alloy. Specific examples of solder particles include Sn59.9Bi40Cu0.1, Sn30Bi0.5Cu, Sn30Bi, Sn40Bi, Sn50Bi, Sn58Bi, Sn40Bi0.1Cu, Sn43Pb14Bi, Sn20In, etc. This allows for excellent connection reliability to be obtained.

[0032] The lower limit of the melting point of the solder particles is preferably 110°C or higher, more preferably 120°C or higher, and even more preferably 130°C or higher. The upper limit of the melting point of the solder particles may be 250°C or lower, preferably 200°C or lower, more preferably 180°C or lower, and even more preferably 160°C or lower. Furthermore, a flux compound may be directly bonded to the surface of the solder particles for the purpose of activating the surface. Activating the surface can promote metal bonding with the electrode portion.

[0033] The average particle size of the solder particles is preferably 0.5 times or less, more preferably 0.3 times or less, and even more preferably 0.2 times or less, the minimum inter-terminal distance (space distance) between the terminal row of the surface-mounted component and the terminal row of the wiring board. Due to this relationship between the space distance and the average particle size of the solder particles, the terminal row of the surface-mounted component and the terminal row of the wiring board can be joined using a reflow furnace. If the average particle size of the solder particles is greater than 0.5 times the minimum inter-terminal distance between the terminal row of the surface-mounted component and the terminal row of the wiring board, the possibility of a short circuit occurring increases.

[0034] The lower limit of the average particle size of the solder particles is preferably 0.5 μm or more, more preferably 3 μm or more, and even more preferably 5 μm or more, and the upper limit of the average particle size of the solder particles may be 50 μm or less, and is 30 μm or less, preferably 25 μm or less, and even more preferably 20 μm or less, thereby making it possible to obtain a good solder joint state and high reliability.

[0035] The average particle size is the average value of the major axis diameter of particles measured, for example, at N = 20 or more, preferably N = 50 or more, and more preferably N = 200 or more, in observation images using a metallurgical microscope, optical microscope, or electron microscope such as a scanning electron microscope (SEM). In the case of spherical particles, it is the average value of the particle diameter. Also, the observed image may be measured using known image analysis software (such as "WinROOF" from Mitani Shoji Co., Ltd. or "Azokun (registered trademark)" from Asahi Kasei Engineering Co., Ltd.) or may be measured (N = 1000 or more) using an image-based particle size distribution analyzer (e.g., FPIA-3000 (Malvern Instruments)). The average particle size determined from the observed image or image-based particle size distribution analyzer can be the average value of the maximum length of the particles. When preparing a solder connection film, manufacturer values ​​such as the particle size (D50) at which the cumulative frequency in the particle size distribution determined by a simple laser diffraction / scattering method reaches 50% or the arithmetic mean diameter (preferably on a volume basis) may be used.

[0036] The solder particles are preferably dispersed in a binder, and may be arranged randomly or with a certain regularity. The solder particles may also be in the form of aggregates of a plurality of particles.

[0037] The content of solder particles in the solder connection film can be determined appropriately based on the pitch of the terminal rows of the surface-mounted components and the wiring board. For example, when the pitch of the terminal rows of the surface-mounted components and the wiring board is 0.1 mm to 0.4 mm, it is preferably 10 to 60 volume %. For example, when the pitch is 0.4 mm, it is preferably 20 to 58 volume %; when the pitch is 0.35 mm, it is 20 to 58 volume %; when the pitch is 0.2 mm, it is 20 to 48 volume %; when the pitch is 0.15 mm, it is 15 to 48 volume %; and when the pitch is 0.1 mm, it is 10 to 38 volume %. If the solder particle content is too low, excellent conductivity, heat dissipation, and adhesion cannot be obtained, while if the content is too high, anisotropy is easily impaired, making it difficult to obtain excellent conductivity reliability.

[0038] (Flux Compound) The flux compound removes foreign matter and oxide film on the electrode surface, prevents oxidation of the electrode surface, and reduces the surface tension of the molten solder. Examples of the flux compound include carboxylic acids such as levulinic acid, maleic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, and sebacic acid. Among these, glutaric acid is preferably used because it is excellent at removing oxide film.

[0039] (Other Additives) In addition to the above-mentioned binder, solder particles, and flux compound, various additives that have conventionally been used as adhesives can be blended into the solder connection film, as long as they do not impair the effects of the present technology. The particle size of the additive is preferably smaller than the average particle size of the solder particles, but is not particularly limited as long as it does not inhibit the bonding between electrodes.

[0040] The solder connection film can be obtained, for example, by mixing an insulating binder, solder particles, and a flux compound in a solvent, applying the mixture to a release-treated film to a predetermined thickness using a bar coater, and then drying to volatilize the solvent. Alternatively, the mixture may be applied to a release-treated film using a bar coater and then pressurized to a predetermined thickness. To improve the dispersibility of the solder particles, it is preferable to apply a high shear force while the film contains the solvent. For example, a known batch-type planetary stirring device can be used. The residual solvent content of the solder connection film is preferably 2% or less, more preferably 1% or less.

[0041] (Connector) The connector is, for example, a resin-molded product having a vertical mating type mating portion, and may have multiple electrodes protruding in the longitudinal direction from the resin molded product (a so-called centipede-type connector) or not (a flip-chip type connector). Examples of the connector include an SMT (Surface Mount) type connector having a first terminal row in which multiple pins (lead frames) extending outward on one side of the short side are arranged in the longitudinal direction, and a second terminal row in which multiple pins (lead frames) extending outward on the other side of the short side are arranged in the longitudinal direction. Furthermore, the surfaces of the first terminal row and the second terminal row are preferably gold-plated.

[0042] (Printed Wiring Board) The printed wiring board includes a substrate and a first substrate terminal row and a second substrate terminal row corresponding to the first terminal row and the second terminal row of the connector. The printed wiring board may be a so-called printed wiring board (PWB) that can be broadly defined, and may be a rigid substrate or a flexible substrate (FPC: Flexible Printed Circuits). Examples of substrates based on the type of substrate include a glass substrate, a ceramic substrate, and a plastic substrate. Furthermore, it is preferable that the surfaces of the first substrate terminal row and the second substrate terminal row are gold-plated.

[0043] [Peeling Step (A1)] Fig. 2 is a diagram for explaining the peeling step in the first embodiment. As shown in Fig. 2, in the peeling step (A1), a feeder 20 equipped with an edge member 21 is used to hold the individual pieces 10 of the solder connection film with a suction nozzle 31 serving as a transfer head, and the individual pieces 10 are peeled off from the first film 11.

[0044] The first film 11 is a support film that supports the plurality of pieces 10. Examples of the first film 11 include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), and PTFE (Polytetrafluoroethylene). Preferably, the first film 11 has at least the surface facing the pieces treated with a release agent, such as a silicone resin.

[0045] The thickness of the first film 11 is not particularly limited. From the viewpoint of peeling off the individual pieces, the lower limit of the thickness of the first film 11 is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 25 μm or more. The upper limit of the thickness of the first film 11 is preferably 200 μm or less, more preferably 100 μm or less, even more preferably 75 μm or less, and may be 50 μm or less, because if the first film 11 is too thick, there is a concern that excessive pressure will be applied to the individual pieces.

[0046] The width of the first film 11 is also not particularly limited. From the viewpoint of winding, the lower limit of the width of the first film 11 is preferably 1 mm or more, more preferably 2 mm or more, and even more preferably 4 mm or more. The upper limit of the width of the first film 11 is preferably 500 mm or less, more preferably 250 mm or less, and even more preferably 120 mm or less, because if the width is too large, it may be difficult to carry or handle.

[0047] The feeder 20 includes an edge member 21 that folds the long first film 11 at an acute angle from the first traveling direction V1 to the second traveling direction V2, a first roller 22 that transports the long first film 11 from the second traveling direction V2 to the third direction V3, a second roller 23 that transports the long first film 11 from the third traveling direction V3 to the fourth direction V4, and drive rollers 24 and 25 that drive the transport of the long first film 11.

[0048] FIG. 3 is a diagram illustrating the folded end of the edge member 21. The lower limit of the thickness T of the folded end 21A of the edge member 21 is preferably 0.01 mm or more, more preferably 0.05 mm or more, and even more preferably 0.1 mm or more. The upper limit of the thickness T of the folded end 21A of the edge member 21 is preferably 2.0 mm or less, more preferably 1.0 mm or less, and even more preferably 0.5 mm or less. If the thickness T of the folded end 21 is too small, the rigidity will be insufficient, making it difficult to peel the individual pieces 10 from the first film 11. If the thickness of the folded end 21 is too large, the folding angle of the first film will be insufficient, making it difficult to peel the individual pieces 10 from the first film 11. The cross-sectional shape of the folded end 22 of the edge member 21 is not particularly limited as long as it is not cut when the first film 11 is folded back from the first traveling direction V1 to the second traveling direction V2.

[0049] The angle between the extension of the surface relative to the first traveling direction V1 and the extension of the surface relative to the second traveling direction V2, i.e., the acute angle at which the long first film 11 is folded back from the first traveling direction V1 to the second traveling direction V2, is 90° or less, making it possible to peel the pieces 10. Furthermore, the angle can be set to a sharper angle as long as it does not cause the first film to break, and is preferably 40° or less, more preferably 38° or less, and even more preferably 35° or less. By setting the folding angle α within the above range, the pieces 10 can be easily peeled. If the folding angle α exceeds 38°, the reliability of peeling the pieces 10 tends to decrease. The folding angle α is the same as the angle of the cross section of the folded end 21A of the edge member 21.

[0050] In order to improve the transportability of the first film, it is preferable that the leading end of edge member 21 is subjected to a release treatment or is made of a material that is difficult to adhere to, such as a silicone-based material or a fluorine-based material. The surface of edge member 21 may also be coated with a silicone-based material or a fluorine-based material.

[0051] The suction nozzle 31 has a suction section 32 that vacuum-sucks the individual pieces 10 of the solder connection film and suctions them. The suction section 32 is preferably formed of a porous material with a predetermined number of openings and has a predetermined shape corresponding to the shape of the individual pieces 10. Furthermore, to prevent the individual pieces 10 from adhering to the suction section 32 due to the adhesiveness of the individual pieces 10, it is preferable that the tip of the suction section 32 be subjected to a release treatment or be formed of a material that is difficult to adhere to, such as a silicone-based material or a fluorine-based material. Furthermore, the surface of the suction section 32 may be coated with a silicone-based material, a fluorine-based material, or the like.

[0052] The opening diameter (diameter per opening) of the suction nozzle 31 is preferably 40 μm or more and 100 μm or less. If the opening diameter of the suction nozzle 31 is too small, it becomes difficult to pick up the individual piece 10. On the other hand, if the opening diameter of the suction nozzle 31 is too large, even if the individual piece 10 can be picked up, suction marks will be left on the individual piece 10, which is not preferable.

[0053] The vacuum pressure of the suction nozzle 31 when suctioning the individual piece 10 is preferably, for example, −40 KPa or more and −50 KPa or less. If the vacuum pressure is lower than this range, the individual piece 10 may fall off, and if the vacuum pressure is higher than this range, suction marks may appear on the individual piece 10.

[0054] When the suction nozzle 31 picks up the piece 10, the pressure applied to the piece 10 is, for example, 0.01 N / mm ２ 2.8N / mm or more ２ If the temperature is lower than this range, the individual pieces 10 may fall off.

[0055] A long first film 11 on which a plurality of individual pieces 10 are arranged is unwound from an unwinding reel 41 and folded back at an acute angle from a first traveling direction V1 to a second traveling direction V2 by an edge member 21. When the first film 11 is folded back, the individual pieces 10 are peeled off from the first film 11 while being held by a suction nozzle 31, and are picked up by the suction nozzle 31. The first film from which the individual pieces 10 have been peeled off is guided by a first roller 22 from the second traveling direction V2 to a third direction V3, and is guided by a second roller 23 from the third traveling direction V3 to a fourth direction V4, and is taken up by a take-up reel 42.

[0056] 4 is a diagram illustrating an example of the operation of the feeder in the first embodiment. As shown in Fig. 4, when the individual pieces 10 arranged on the first film 11 are folded back at an acute angle from the first traveling direction V1 to the second traveling direction V2 by the edge member 21, the individual pieces 10 are peeled off from the first film 11 and picked up by the suction nozzle 31.

[0057] When edge member 21 is movable, it is preferable to move edge member 21 in a direction V1R opposite to the traveling direction V1 of first film 11 while holding individual piece 10 with suction nozzle 31, thereby peeling individual piece 10 from first film 11. In this case, first roller 22 preferably moves parallel to edge member 21 at the same stroke, and second roller 23 is preferably fixed on approximately the same tangential plane as first roller 22, and guides the conveyance path of first film 11 parallel to the moving direction of edge member 21. By moving edge member 21 and the first roller parallel at the same stroke, it is possible to cancel out any difference in the conveyance path of first film 11 caused by the movement of edge member 21.

[0058] As an example of operation, first, the feeder 20 transports the first film 11 in the first traveling direction V1 using the drive rollers 24 and 25. When the piece 10 is positioned directly below the suction nozzle 31, the transport is stopped and the piece 10 is sucked by the suction nozzle 31, and the position and posture of the piece 10 are grasped. Next, the feeder 20 retracts the edge member 21 and the first roller 22 in a direction V1R opposite to the first traveling direction V1 to peel the piece 10 from the first film 11 and deliver the piece 10 to the suction nozzle 31. The suction nozzle 31 then handles the piece 10 and moves to attach the piece 10 to the printed wiring board 51. Next, the feeder 20 advances the edge member 21 and the first roller 22 in the first traveling direction V1, and then uses the drive rollers 24 and 25 to feed the next piece 10 until it is positioned for suction by the suction nozzle 31. By repeating this operation, the feeder 20 can continuously peel the individual pieces 10 from the first film 11 at high speed and stably, and supply them to the printed wiring board to which they are to be attached.

[0059] An imaging unit (not shown) having a camera may be provided to capture images of the suction nozzle 31 and the chip 10 held by the suction nozzle 31 from below during the operating range of the suction nozzle 31, from the time the suction nozzle 31 picks up the chip 10 to the time the suction nozzle 31 attaches the chip 10 to the printed wiring board 51 and returns to its suction position for picking up the next chip 10 in the above-described operation example. The imaging unit captures an image of the chip held by the suction nozzle 31 before the chip 10 is attached to the printed wiring board 51 and analyzes the captured image to detect the shape and holding state of the held chip 10. After the chip 10 is attached to the printed wiring board 51, an image of the bottom surface of the suction nozzle 31 can be captured to confirm whether the next suction operation can be performed reliably. In either case, the detection results may be used to correct the holding state, or in some cases, to discard the chip 10 or to issue an alarm to prompt cleaning of the suction nozzle 31.

[0060] In the feeder shown in Figure 4, any or all of the drive rollers 24, 25, first roller 22, and second roller 34 may be replaced with sprockets having gears, and fitting holes may be provided on both ends of the first film 11 in the width direction so that the first film 11 is conveyed by engaging with the sprockets.

[0061] Furthermore, if the first roller 22 and the second roller 23 are not provided, a difference in the length of the conveying path through which the first film 11 passes occurs by the amount of the drive stroke when the edge member 21 is driven back and forth, but the tension of the first film 11 can be maintained by feeding out the first film 11 by the difference in the conveying path in synchronization with the retreat of the edge member 21 to peel off the individual pieces 10 using the drive rollers 24, 25. Furthermore, when the edge member 21 retreats, the film conveying path becomes shorter, so the first film 11 can be supplied by the drive rollers 24, 25 in synchronization with the advancement of the edge member 21.

[0062] Furthermore, in the series of operations in the peeling step (A1), the tension in the traveling direction of the first film 11 is preferably, for example, 240 g or less, although this depends on the thickness and material of the first film 11. If the tension load on the first film 11 exceeds the above range, the first film 11 is likely to be stretched or broken. Furthermore, the stretching of the first film 11 may cause deformation or displacement of the individual pieces 10 due to stretching, and in some cases, it is possible that the individual pieces 10 may peel off from the first film 11 before adsorption. The lower limit of the tension load on the first film 11 is preferably, for example, 120 g or more.

[0063] [Placement Step (B1)] Fig. 5 is a perspective view schematically showing a state in which an individual piece is aligned at a predetermined position on a printed wiring board using a suction nozzle, and Fig. 6 is a perspective view schematically showing a state in which an individual piece is placed at a predetermined position on a printed wiring board using a suction nozzle. As shown in Figs. 5 and 6, in the placement step (B1), an individual piece 10 peeled from the first film 11 is placed on a printed wiring board 51 using a suction nozzle 31. Specifically, the individual piece 10 is placed on a first board terminal row and a second board terminal row on the printed wiring board 51 that correspond to the first terminal row and the second terminal row of the connector. Note that a pressure is also required when placing the individual piece 10 on the printed wiring board 51, and the pressure at this time may be, for example, 0.01 N / mm ２ 1.0N / mm or more ２ It can be as follows:

[0064] [Mounting Step (C1)] Fig. 7 is a perspective view schematically illustrating a state in which a connector is moved directly above an individual chip using a suction nozzle, and Fig. 8 is a perspective view schematically illustrating a state in which the connector is placed on an individual chip using a suction nozzle. As shown in Figs. 7 and 8 , in the mounting step (C1), a connector 52 is mounted on the individual chip 10 using a suction nozzle 33. Specifically, the first and second board terminal rows of the printed wiring board 51 are aligned with the first and second terminal rows of the connector 52, and the connector 52 is mounted on the individual chip 10. The suction nozzle 33 has a suction portion 34 that vacuum-sucks the connector 52 and suctions it. The suction portion 34 is preferably formed of a porous material with a predetermined number of openings and has a predetermined shape corresponding to the shape of the connector 52.

[0065] [Connection Step (D1)] Fig. 9 is a perspective view schematically showing the state in which the printed wiring board and the connector are heated in a reflow furnace. As shown in Fig. 9, in the connection step (D1), the printed wiring board 51 and the connector 52 are electrically connected using, for example, a reflow furnace 60. The reflow furnace 60 is set to, for example, a temperature equal to or higher than the melting point of the solder particles, and the first and second board terminal rows of the printed wiring board 51 and the first and second terminal rows of the connector 52 are joined by solder, and the printed wiring board 51 and the connector 52 are bonded by the binder of the solder connection film.

[0066] Examples of reflow furnaces include atmospheric pressure reflow, vacuum reflow, atmospheric pressure ovens, and autoclaves (pressure ovens). Among these, it is preferable to use vacuum reflow and autoclaves, which can eliminate air bubbles contained in the joints. A reflow furnace can heat and bond the components without applying mechanical pressure and without load, thereby preventing damage to the printed wiring board 51 and the connector 52. Here, "without load" refers to a state in which no mechanical pressure is applied.

[0067] The lower limit of the peak temperature (maximum temperature reached) in the reflow furnace should be equal to or higher than the temperature at which the solder particles melt and the solder connection film begins to harden, and is preferably 150°C or higher, more preferably 180°C or higher, and even more preferably 200°C or higher. The upper limit of the peak temperature in the reflow furnace is 300°C or lower, more preferably 290°C or lower, and even more preferably 280°C or lower. This results in solder-joining the first and second board terminal rows of the printed wiring board 51 and the first and second terminal rows of the connector 52. Furthermore, areas other than the solder-joined portions within the terminals are bonded with a thermosetting binder. Here, solder-joining refers to connecting the terminals (electrodes) of opposing electronic components by melting solder.

[0068] According to the method for manufacturing an electronic component in the first embodiment described above, the connection film can be placed on the electronic component using a mounter, thereby reducing the introduction cost of a temporary attachment machine for attaching the connection film.

[0069] In the first embodiment described above, the suction nozzle 31 is used as the transfer head. However, as a modification, a head unit without a suction function may be used instead. In this case, the head unit may hold the chip 10 by utilizing the adhesive property of the chip 10. Furthermore, the chip 10 may also be attached to the printed wiring board 51 by utilizing the adhesive property of the chip 10. The holding portion of the head unit for holding the chip 10 may be made of, for example, silicone resin. In this case, it is preferable that the adhesive strength of the chip 10 to the first film 11 is lower than the adhesive strength of the chip 10 to the holding portion provided on the head unit. Furthermore, when holding the chip 10 to the head unit or attaching the chip 10 to the printed wiring board 51, the peel force may be adjusted by heating or cooling the first film 11 or the printed wiring board 51 supporting the chip 10. For example, a blower attached from below the edge of the first film 11 may be used as a heating means for the first film 11. Alternatively, a heater built into the edge may be used as a heating means for the first film 11.

[0070] 2. Second Embodiment> Fig. 10 is a flowchart showing a manufacturing method of an electronic component according to a second embodiment. As shown in Fig. 10, the manufacturing method of an electronic component according to the second embodiment includes a peeling process (A2) in which an edge member, which folds a long first film, on which a plurality of pieces of connection film and a plurality of second films are arranged, is used to hold the pieces with a suction nozzle and peel the pieces and the second film from the first film, and a placement process (B2) in which the pieces peeled from the first film and the second film are placed on a wiring board using a suction nozzle, a mounting process (C21, C22) in which the second film is peeled from the pieces and surface-mounted components are mounted on the pieces, and a connection process (D2) in which the wiring board and the surface-mounted components are electrically connected via the pieces. Here, the edge member is part of a feeder that supplies the pieces of film and also part of a mounter. Furthermore, the mounter, connection film, wiring board, surface-mounted components, etc. are the same as those in the first embodiment, and therefore descriptions thereof will be omitted.

[0071] In the second embodiment, the individual pieces of the connection film are sandwiched between the first film and the second film, and the individual pieces and the second film are peeled off from the first film. The second film may be provided for each individual piece in advance, or may be obtained by cutting a long second film into individual pieces before the peeling step (A2).

[0072] The peeling step (A2), placement step (B2), mounting step (C21, C22), and connection step (D2) will be described below with reference to Figures 11 and 12, using a solder connection film, a connector, and a printed wiring board as specific examples of the connection film, surface mount component, and wiring board, respectively. Note that the same reference numerals are used to designate the same components as in the first embodiment, and their description will be omitted.

[0073] 11 is a diagram illustrating the peeling step in the second embodiment. As shown in FIG. 11 , in the peeling step (A1), the individual pieces 10 and the second film 12 of the solder connection film are held by the suction nozzle 31 using the feeder 20 equipped with the edge member 21, and the individual pieces 10 and the second film 12 are peeled off from the first film 11.

[0074] The second film 12 is made of the same material as the first film 11, and the thickness of the second film 12 is also in the same range. The adhesive strength between the individual pieces 10 and the second film 12 is preferably greater than the adhesive strength between the individual pieces 10 and the first film 11. This allows the individual pieces 10 and the second film 12 to be easily peeled off and picked up from the first film 11 using the suction nozzle 31.

[0075] 12 is a diagram illustrating an example of the operation of the feeder in the second embodiment. As an example of the operation, first, the feeder 20 transports the first film 11 in the first traveling direction V1 using the drive rollers 24 and 25. When the chip 10 and the second film 12 are positioned directly below the suction nozzle 31, the transport is stopped and the chip 10 and the second film 12 are suctioned by the suction nozzle 31, and the position and posture of the chip 10 are grasped. Next, the feeder 20 retracts the edge member 21 and the first roller 22 in a direction V1R opposite to the first traveling direction V1 to peel the chip 10 and the second film 12 from the first film 11 and deliver the chip 10 and the second film 12 to the suction nozzle 31. The suction nozzle 31 then handles the chip 10 and the second film 12 and moves to attach the chip 10 and the second film 12 to the printed wiring board. Next, feeder 20 advances edge member 21 and first roller 22 in first traveling direction V1, and then uses drive rollers 24 and 25 to feed the next piece 10 and second film 12 until they reach the suction position of suction nozzle 31. By repeating this operation, feeder 20 can continuously peel piece 10 and second film 12 from first film 11 at high speed and stably, and supply them to the printed wiring board to which they are to be attached.

[0076] [Placement Step (B2), Mounting Steps (C21, C22), and Connection Step (D2)] In the placement step (B2), the individual pieces 10 and the second film 12 peeled from the first film 11 are placed on the printed wiring board 51 using the suction nozzle 31. Specifically, the individual pieces 10 and the second film 12 are placed on the first board terminal row and the second board terminal row corresponding to the first terminal row and the second terminal row of the connector.

[0077] In the mounting steps (C21, C22), the second film 12 is peeled off from the individual chip 10, and then the connector 52 is mounted on the individual chip 10 using the suction nozzle 33. The connection step (D2) is the same as the connection step (D1) in the first embodiment.

[0078] According to the method for manufacturing an electronic component in the second embodiment, the connection film can be placed on the electronic component using a mounter, which reduces the cost of introducing a temporary attachment machine for attaching the connection film. Furthermore, after the placement step (B2), the pieces of the connection film placed on the electronic component are covered with the second film, which is very useful in a form in which the electronic component is distributed with the pieces of the connection film placed thereon.

[0079] 3. Third Embodiment> FIG. 13 is a flowchart illustrating a manufacturing method for electronic components according to a third embodiment. As shown in FIG. 13 , the manufacturing method for electronic components according to the third embodiment includes a peeling process (A31, A32) in which a surface-mounted component is picked up using a suction nozzle, and an edge member is used to fold a long first film on which multiple pieces of connection film are arranged at an acute angle from a first direction of travel to a second direction of travel to hold the pieces on the surface-mounted component and peel the pieces from the first film; a mounting process (C3) in which the surface-mounted component picked up by the suction nozzle and the pieces transferred to the surface-mounted component are mounted on a wiring board; and a connecting process (D2) in which the wiring board and the surface-mounted component are electrically connected via the pieces. Here, the edge member is part of a feeder that supplies the film pieces and also part of a mounter. The mounter, connection film, wiring board, surface-mounted component, and the like are similar to those in the first embodiment, and therefore their description will be omitted.

[0080] In the third embodiment, first, a surface mount component is sucked up by a suction nozzle, an edge member is used to hold the individual piece with the surface mount component sucked up by the suction nozzle, and then the individual piece is peeled off from the first film.

[0081] The peeling step (A3), the mounting step (C3), and the connection step (D3) will be described below with reference to Figures 14 and 15, using a solder connection film, a connector, and a printed wiring board as specific examples of the connection film, the surface-mounted component, and the wiring board, respectively. Note that the same reference numerals are used to designate the same components as those in the first embodiment, and their description will be omitted.

[0082] [Peeling Step (A3)] Fig. 14 is a diagram for explaining the peeling step in the third embodiment. As shown in Fig. 14, in the peeling step (A3), a feeder 20 equipped with an edge member 21 is used to hold the solder connection film pieces 10 with connectors 52 sucked by suction nozzles 33, and the pieces 10 are peeled off from the first film 11. The suction nozzles 33 may be the same as those used in the mounting step (C1) in the first embodiment.

[0083] The adhesive strength between the individual pieces 10 and the connector 52 is preferably greater than the adhesive strength between the individual pieces 10 and the first film 11. This allows the individual pieces 10 and the connector 52 to be easily peeled off and picked up from the first film 11 using the suction nozzle 33.

[0084] 15 is a diagram illustrating an example of the operation of the feeder in the third embodiment. As an example of the operation, first, the suction nozzle 33 picks up the connector 52, and then the suction nozzle 33 with the connector 52 picked up is moved to the transfer position of the individual piece 10. The surface of the connector 52 to which the individual piece 10 is transferred is provided with a first terminal row and a second terminal row.

[0085] The feeder 20 transports the first film 11 in the first traveling direction V1 using the drive rollers 24 and 25, and when the individual piece 10 is positioned directly below the suction nozzle 33, stops the transport and grasps the position and posture of the individual piece 10 using the connector 52 sucked by the suction nozzle 31. Next, the feeder 20 retracts the edge member 21 and the first roller 22 in a direction V1R opposite to the first traveling direction V1 to peel the individual piece 10 from the first film 11 and deliver the individual piece 10 to the connector 52. The suction nozzle 33 then handles the connector 52 to which the individual piece 10 has been transferred and moves to mount it on the printed wiring board 51. Next, the feeder 20 advances the edge member 21 and the first roller 22 in the first traveling direction V1, and then uses the drive rollers 24 and 25 to feed the next individual piece 10 until it is in the transfer position. By repeating this operation, the feeder 20 can continuously peel the individual pieces 10 from the first film 11 at high speed and stably, and supply them to the printed wiring board to which they are to be attached.

[0086] [Mounting Step (C3) and Connection Step (D3)] In the mounting step (C3), the connector 52 to which the individual piece 10 has been transferred is mounted using the suction nozzle 33. The connection step (D3) is the same as the connection step (D3) in the first embodiment.

[0087] According to the manufacturing method for electronic components in the third embodiment, the connection film can be placed on the electronic components using a mounter, which reduces the cost of introducing a temporary attachment machine for attaching the connection film. Furthermore, according to the manufacturing method for electronic components in the third embodiment, the surface-mounted components are sucked by the suction nozzle, and the surface-mounted components sucked by the suction nozzle are held by the edge member, and the individual pieces are peeled off from the first film. This eliminates the need to install two mounters, one for the connection film and one for the surface-mounted components, and reduces the number of processes.

[0088] 4. Other Embodiments FIG. 16 is a plan view showing a first example of the shape of the individual pieces, and FIG. 17 is a plan view showing a second example of the shape of the individual pieces. The individual pieces of the connection film are not particularly limited and may have a shape corresponding to, for example, the electronic components to be mounted. For example, as shown in FIGS. 16 and 17 , the shapes of the individual pieces may be substantially rectangular first pieces 10A and second pieces 10B corresponding to the first and second terminal rows of the connector, respectively. Furthermore, the first pieces 10A and second pieces 10B may be formed so that their long sides are aligned with the longitudinal direction of the first film, or so that their short sides are aligned with the longitudinal direction of the first film. This can limit the movement of solder particles between the first and second terminal rows due to the self-alignment effect during reflow.

[0089] Furthermore, when the first piece 10A and the second piece 10B are formed to have a substantially rectangular shape corresponding to the first and second terminal rows of the connector, respectively, both the first piece 10A and the second piece 10B may be peeled off from the first film using a single suction nozzle. Furthermore, the piece may have a first region and a second region containing conductive particles corresponding to the first and second terminal rows of the connector, respectively, and a region not containing conductive particles between the first region and the second region.

[0090] The shape of the individual pieces may be, for example, as described in Japanese Patent Publication No. 2020-198422, a U-shape with two horizontal sides and one vertical side, a square-shaped shape with two horizontal sides and two vertical sides, an L-shape, a U-shape, a C-shape, or the like. When the individual pieces contain conductive particles, as described in Japanese Patent Publication No. 6187665, the conductive particles may be embedded in an insulating resin. The individual pieces may have conductive particles arranged randomly or regularly, or may be aligned in the film thickness direction. When the individual pieces contain solder particles, as described in Japanese Patent Publication No. 6898413, the individual pieces may be blended with a thermoplastic resin that is solid at room temperature and has a melt flow rate of 10 g / 10 min or more measured at a temperature of 190°C and a load of 2.16 kg. The individual pieces may have a minimum melt viscosity of less than 100 Pa s, as described in Japanese Patent Publication No. 7032367.

[0091] The individual pieces may be configured with two or more layers, including a layer containing conductive particles or solder particles and a layer not containing conductive particles, or may be configured with two or more layers including layers containing conductive particles, or may be configured with two or more layers not containing conductive particles.

[0092] The thickness of the individual pieces is not particularly limited, and the lower limit of the thickness of the individual pieces is preferably 1 μm or more, more preferably 3 μm or more, and even more preferably 4 μm or more, and the upper limit of the thickness of the individual pieces is preferably 100 μm or less, more preferably 80 μm or less, and even more preferably 50 μm or less.

[0093] The thickness of the individual pieces can be measured using a known micrometer or digital thickness gauge (e.g., minimum display of 0.0001 mm). However, when the thickness of the individual pieces is thinner than the particle diameter of the conductive particles, a contact-type thickness gauge is not suitable, so it is preferable to use a laser displacement meter (e.g., a spectral interference displacement type). Here, the thickness of the individual pieces refers to the thickness of the binder resin layer only and does not include the particle diameter of the conductive particles.

[0094] Furthermore, in the first to third embodiments described above, in the connection steps (D1, D2, D3), the wiring board and the surface-mounted components are electrically connected using a reflow furnace, but this is not limited to this, and for example, thermocompression bonding in which pressure is applied from the surface-mounted component side using a thermocompression bonding tool may also be used.

[0095] In this example, an anisotropic conductive film containing solder particles was produced as a form of solder connection film. Then, as shown in Fig. 16, the anisotropic conductive film was used to produce first and second rectangular pieces on a long support film, and peeling of the pieces from the support film was examined.

[0096] [Preparation of Anisotropic Conductive Film] A binder was prepared by blending 45 parts by mass of phenoxy resin (YP-50, Nippon Steel Chemical & Material Co., Ltd.), 10 parts by mass of hydrogenated bisphenol A glycidyl ether (YX8000, Mitsubishi Chemical Corporation), 45 parts by mass of crystalline bisphenol A epoxy resin (YL6810, Mitsubishi Chemical Corporation), 10 parts by mass of imidazole-based epoxy resin curing agent (2P4MHZ-PW (2-phenyl-4-methyl-5-hydroxymethylimidazole), Shikoku Chemical Industry Co., Ltd.), and 8 parts by mass of glutaric acid (1,3-propanedicarboxylic acid, Tokyo Chemical Industry Co., Ltd.). A predetermined amount of solder particles (Sn59.9Bi40Cu0.1) with an average particle size of 20 μm was blended with 118 parts by mass of the binder to prepare an anisotropic conductive film having a thickness of 40 μm.

[0097] [Production of Individual Pieces] The anisotropic conductive film was cut and removed, and for example, as shown in Figure 16, a first piece and a second piece each having an approximately rectangular shape (width 0.5 mm, length 5.0 mm) were formed on a support film having a thickness of 40 μm, with the long sides of the pieces aligned with the longitudinal direction of the support film.

[0098] [Evaluation Test 1 for Piece Peeling] For example, as shown in Figure 16, a long support film on which a plurality of substantially rectangular first and second pieces were arranged was prepared, and the number of usable pieces that were peeled from the support film was counted. Evaluation was then performed based on the count ratio of usable pieces relative to the number of attempts to peel the pieces. The evaluation criteria for A to C were as follows: A: Count ratio of 90% or more B: Count ratio of 60% or more but less than 90% C: Count ratio of less than 60%

[0099] <Verification Example 1> For example, as shown in Figures 2 to 4, an attempt was made to peel the piece 10 from the first film 11 by moving the edge member 21 in a direction V1R opposite to the moving direction V1 of the first film 11 while holding the piece 10 with the suction nozzle 31. The edge member used had a thickness T of 0.5 mm at the folded end and a folding angle α of 25°. The opening diameter of the suction nozzle, the vacuum pressure of the suction nozzle, the pressure applied to the piece 10 by the suction nozzle, the tension load of the first film, and the plate slippage of the edge member were set under the following conditions. As shown in Table 1, the evaluation of the peeling of the piece in Verification Example 1 was A. Opening diameter of the suction nozzle: 70 µm Surface treatment of the suction nozzle: coating with fluororesin Vacuum pressure of the suction nozzle: -45 KPa Pressure applied to the piece by the suction nozzle: 0.4 N / mm ２ Tension load of first film: 160 g Surface treatment of edge member: Full surface coating with fluororesin

[0100] <Verification Example 2> Except for using an edge member having a thickness of 0.1 mm at the folded end, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 1. As shown in Table 1, the evaluation of the individual piece peeling in Verification Example 2 was A.

[0101] <Verification Example 3> Except for using an edge member having a thickness of 0.01 mm at the folded end, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 1. As shown in Table 1, the evaluation of the individual piece peeling in Verification Example 3 was B.

[0102] <Verification Example 4> Except for using an L-blade (thickness 0.5 mm) of a commercially available cutter as the edge member, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 1. As shown in Table 1, the evaluation of the individual piece peeling in Verification Example 4 was C.

[0103] <Verification Example 5> In verification example 1, the chip 10 was not held by the suction nozzle 31, and only the edge member 21 was moved in a direction V1R opposite to the moving direction V1 of the first film 11, and an attempt was made to peel the chip 10 from the first film 11. As shown in Table 1, the evaluation of chip peeling in verification example 1 was C.

[0104]

[0105] In Verification Example 4, the cutter blade sometimes dug into the support film, causing cutting. In Verification Example 5, the individual pieces were not held by a suction nozzle, so it was not possible to peel the individual pieces from the support film. In Verification Examples 1 to 3, edge members with folded end thicknesses of 0.5 mm, 0.1 mm, and 0.01 mm, respectively, were used, and the individual pieces were held by a suction nozzle, so it was possible to peel the individual pieces from the support film. In particular, in Verification Examples 1 and 2, the high rigidity of the edge end allowed the individual pieces to be peeled from the support film with high frequency.

[0106] [Evaluation Test of Peeling and Placement of Individual Pieces] For example, as shown in Fig. 3, the angle (folding angle α) of the surface along each of the traveling direction V1 and traveling direction V2 of the first film 11 was changed to verify the peelability of the individual pieces from the first film 11 using the suction nozzle. The peelability was evaluated by counting the number of successful peelings (number of successful peelings / 5) by the suction nozzle 31 and the number of successful placements (number of successful placements / number of successful peelings) of the successfully peeled individual pieces 10 on the substrate for five individual pieces 10 provided on the first film 11. Note that an edge member with a predetermined folding angle α was used, and a pressure of 0.4 N / mm was applied during peeling and placement.２ The test was carried out under the same conditions as in the evaluation test 1 for individual peeling described above, except that:

[0107] <Verification Example 6> For example, as shown in Figures 2 to 4, while the suction nozzle 31 held the chip 10, the edge member 21 was moved in a direction V1R opposite to the direction V1 of travel of the first film 11, and an attempt was made to peel the chip 10 from the first film 11. At this time, an edge member having an end shape such that, when the suction nozzle 31 picked up the chip 10, the angle α between the surface along the direction V1 of travel of the first film 11 and the surface along the direction V2 of travel was 25° was used. The edge member end thickness was 0.5 mm. The thickness of the first film was 50 μm. As shown in Table 2, the number of successful peel attempts in Verification Example 6 was 5 / 5, and the number of successful placement attempts was 5 / 5.

[0108] Verification Example 7 Except for using an edge member with a folding angle α of 30°, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 6. As shown in Table 2, in Verification Example 7, the number of successful peel attempts was 2 / 5, and the number of successful placement attempts was 2 / 2.

[0109] Verification Example 8 Except for using an edge member with a folding angle α of 38°, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 6. As shown in Table 2, the number of successful peel attempts in Verification Example 8 was 0 / 5.

[0110] Verification Example 9 Except for changing the thickness of the first film 11 to 25 μm, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 6. As shown in Table 2, in Verification Example 9, the number of successful peel attempts was 5 / 5, and the number of successful placement attempts was 5 / 5.

[0111] Verification Example 10 Except for using an edge member with a folding angle α of 30°, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 9. As shown in Table 2, in Verification Example 10, the number of successful peel attempts was 5 / 5, and the number of successful placement attempts was 5 / 5.

[0112] Verification Example 11 Except for using an edge member with a folding angle α of 38°, an attempt was made to peel the individual pieces 10 from the first film 11 in the same manner as in Verification Example 9. As shown in Table 2, in Verification Example 11, the number of successful peel attempts was 2 / 5, and the number of successful placement attempts was 2 / 2.

[0113]

[0114] When an edge member with a folding angle α of 25° was used as in Verification Examples 6 and 9, it was possible to reliably peel the pieces from the first film and place them on the substrate regardless of the thickness of the first film. When an edge member with a folding angle α of 30° or more was used as in Verification Examples 7, 8, 10, and 11, the number of successful peel attempts varied depending on the thickness of the first film. In particular, when an edge member with a first film thickness of 50 μm and a folding angle α of 38° was used as in Verification Example 8, peeling of the pieces was difficult. Evaluation 2 of peeling of pieces revealed that the smaller the thickness of the first film, the wider the tolerance range of the folding angle α of the edge member.

[0115] [Evaluation Test 2 for Peeling and Placement of Individual Pieces] For example, as shown in FIGS. 2 to 4 , the pressure applied to the individual pieces 10 by the suction nozzle 31 during peeling and placement on the substrate was varied when peeling the individual pieces 10 from the first release film 11 and placing them on the substrate, thereby verifying the peelability of the individual pieces 10 from the first film 11 using the suction nozzle 31 and their placement on the substrate. The peelability and placement were measured by counting the number of successful peels (number of successful peels / 2) and the number of successful placements (number of successful placements / number of successful peels) of two individual pieces 10 provided on the first film 11 using the suction nozzle 31. The test was conducted under the same conditions as in the evaluation test 1 for peeling, except that the folding angle α was set to 30° and the thickness of the first film was set to 25 μm. The pressure was the same during peeling and placement on the substrate.

[0116] <Verification Example 12> While the chip 10 was held by the suction nozzle 31, the edge member 21 was moved in a direction V1R opposite to the moving direction V1 of the first film 11, and an attempt was made to peel the chip 10 from the first film 11. When the chip 10 was suctioned by the suction nozzle 31 at this time, the pressure applied to the chip 10 was 0.4 N / mm ２ The vacuum pressure was set to -43.6 KPa. As shown in Table 3, in Verification Example 12, the number of successful peeling attempts was 2 / 2, and the number of successful placement attempts was 2 / 2.

[0117] <Verification Example 13> Pressurized force: 0.8 N / mm ２ Except for setting the vacuum pressure to −44.4 KPa, attempts were made to peel and place the individual pieces 10 from the first film 11 in the same manner as in Verification Example 12. As shown in Table 3, in Verification Example 13, the number of successful peel attempts was 2 / 2, and the number of successful placement attempts was 1 / 2.

[0118] <Verification Example 14> Pressurized force: 1.0 N / mm ２ Except for setting the vacuum pressure to −44.6 KPa, an attempt was made to peel and place the individual pieces 10 from the first film 11 in the same manner as in Verification Example 12. As shown in Table 3, in Verification Example 14, the number of successful peel attempts was 2 / 2, and the number of successful placement attempts was 0 / 2.

[0119] <Verification Example 15> Pressurized force: 2.8 N / mm ２ Except for setting the vacuum pressure to −46.8 KPa, an attempt was made to peel and place the individual pieces 10 from the first film 11 in the same manner as in Verification Example 12. As shown in Table 3, in Verification Example 15, the number of successful peel attempts was 2 / 2, and the number of successful placement attempts was 0 / 2.

[0120] As shown in Test Examples 12 to 15, the peeling strength of the individual pieces 10 from the first release film was 0.4 to 2.8 N / mm ２ On the other hand, when placing the piece 10 on the substrate, the pressure applied to the piece 10 was 0.8 N / mm during peeling. ２ It has been found that it is preferable that:

[0121] 10 Piece, 10A First piece, 10B Second piece, 11 First film, 12 Second film, 20 Feeder, 21 Edge member, 21A Folded end, 22 First roller, 23 Second roller, 24, 25 Drive roller, 31 Suction nozzle, 32 Suction unit, 33 Suction nozzle, 34 Suction unit, 41 Unwinding reel, 42 Winding reel, 51 Printed wiring board, 52 Connector, 60 Reflow furnace

Claims

1. A method for manufacturing electronic components, comprising: a peeling step in which a long first film on which a plurality of individual pieces of connecting film are arranged is held by a transfer head using an edge member that folds back at an acute angle from a first direction of travel to a second direction of travel, and the individual pieces are peeled off from the first film; and an arrangement step in which the transfer head is used to arrange the individual pieces peeled off from the first film on a first electronic component.

2. A method for manufacturing an electronic component according to claim 1, further comprising a mounting step of mounting a second electronic component on said individual piece.

3. A method for manufacturing electronic components as described in claim 1, wherein a second film is placed on each individual component, and in the placement process, the individual component and the second film are placed on the first electronic component using the transfer head.

4. A method for manufacturing an electronic component according to claim 3, further comprising a mounting step of peeling the second film from the individual piece and mounting a second electronic component on the individual piece.

5. A method for manufacturing electronic components as described in claim 1, wherein in the peeling step, the individual pieces are held by a second electronic component held by the transfer head, and the individual pieces are peeled off from the first film, and in the placement step, the individual pieces and the second electronic component are mounted on the first electronic component using the transfer head.

6. A method for manufacturing electronic components as described in any one of claims 1 to 5, wherein in the peeling process, the edge member is moved in a direction opposite to the direction of travel of the first film while the individual piece is held by the transfer head, thereby peeling the individual piece from the first film.

7. A method for manufacturing an electronic component according to any one of claims 2, 4 or 5, wherein the first electronic component is a wiring board and the second electronic component is a surface-mounted component.

8. A method for manufacturing an electronic component according to any one of claims 2, 4 and 5, further comprising a connecting step of electrically connecting the first electronic component and the second electronic component via the piece.

9. A peeling device comprising: a transfer head; an edge member that folds a long first film on which a plurality of individual pieces of connecting film are arranged at an acute angle from a first traveling direction to a second traveling direction; and a control unit that uses the transfer head to hold the individual pieces and peel the individual pieces from the first film.

10. A peeling device according to claim 9, wherein the thickness of the folded end of the edge member is 0.01 mm or more and 0.5 mm or less.

11. The peeling device according to claim 9 or 10, wherein the acute angle is 38° or less.

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