Electronic device

Abstract

The present disclosure relates to an electronic device. An electronic device according to an embodiment of the present disclosure may comprise: a printed circuit board; a cable including a conducting wire part and a head provided at the end part of the conducting wire part, and electrically connected to the printed circuit board on one surface of the printed circuit board; and a fixing member for fixing the head to the printed circuit board, wherein the printed circuit board comprises: a base part; and a guide part provided on one surface of the base part and guiding the head on the printed circuit board.

Description

electronic devices

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including a structure capable of guiding a cable before the cable is secured to a printed circuit board or the like.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device according to one embodiment of the present disclosure includes a printed circuit board; a cable including a conductor portion and a head provided at an end of the conductor portion, the cable electrically connected to the printed circuit board on one surface of the printed circuit board; and a fixing member fixing the head to the printed circuit board, wherein the printed circuit board may include a base portion and a guide portion provided on one surface of the base portion and guiding the head on the printed circuit board.

[0005] In a method for manufacturing an electronic device according to one embodiment of the present disclosure, the electronic device includes: a printed circuit board including a base portion and a guide portion provided on one surface of the base portion; a cable including a conductor portion and a head provided on an end of the conductor portion and electrically connected to the printed circuit board on one surface of the printed circuit board; and a fixing member for fixing the head to the printed circuit board, and the method for manufacturing the electronic device may include: a step of seating the cable on the guide portion; and a step of connecting the fixing member to the printed circuit board by passing the head through the head.

[0006] The above-described aspects or other aspects, configurations and / or advantages of various embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a perspective view illustrating an electronic device according to one embodiment disclosed in this document.

[0009] Figure 3 is a perspective view showing the electronic device illustrated in Figure 2.

[0010] FIG. 4 is an exploded perspective view showing an electronic device according to one embodiment disclosed in this document.

[0011] FIG. 5 is a plan view showing a part of the configuration of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6 is a rear view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 7 is an enlarged view of a portion of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 8 is a perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 9 is an exploded perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0016] Fig. 10 is a cross-sectional view taken along line A-A' of Fig. 8.

[0017] FIG. 11 illustrates one side of a configuration of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 12 illustrates a side view of a part of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 13 illustrates one side of a configuration of an electronic device according to one embodiment of the present disclosure.

[0020] Fig. 14 is a cross-sectional view taken along line A-A' of Fig. 13.

[0021] Figure 15 is a cross-sectional view taken along line B-B' of Figure 13.

[0022] FIG. 16 illustrates a side view of a part of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 17 illustrates one side of a configuration of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 18 illustrates one side of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 19 illustrates one side of an exploded state of an electronic device according to one embodiment of the present disclosure.

[0026] Figure 20 is a cross-sectional view taken along line A-A' of Figure 18.

[0027] FIG. 21 is an exploded perspective view of a part of an electronic device according to one embodiment of the present disclosure.

[0028] Figure 22 is a cross-sectional view taken along line A-A' of Figure 19.

[0029] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0030] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0031] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0032] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0033] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall-area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0063] FIG. 2 is a three-sided view illustrating an electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is a perspective view illustrating the electronic device (101) illustrated in FIG. 2. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0064] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a display (220), a front plate (202), and a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B), and the display (220). In one embodiment (not shown), the housing (210) may also refer to a structure forming a portion of the first side (210A) of FIG. 2, the second side (210B) of FIG. 3, and the side surface (210C).

[0065] In one embodiment, the front plate (202) may form at least a portion of the first surface (210A). In one embodiment, the front plate (202) may be a glass plate or a polymer plate, at least a portion of which is substantially transparent, and may include various coating layers. The front plate (202) may be referred to as, for example, a display (e.g., display (220) of FIG. 4), a window, and / or a window plate (e.g., window plate (221) of FIG. 4), and may form an exterior of the electronic device (101) together with the housing (210). In one embodiment, a display panel (e.g., display panel (223) of FIG. 4) may be disposed on an inner surface of the front plate (202), and, depending on the embodiment, the front plate (202) itself and / or the front plate (202) and the display panel (223) in combination may be referred to as a 'display'.

[0066] According to one embodiment, the second side (or back) (210B) of the electronic device (101) may be formed by a back plate (e.g., back plate (212) of FIG. 4) provided as part of the housing (210). The back plate (e.g., back plate (212) of FIG. 4) may be formed by a substantially opaque material, such as a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0067] In one embodiment, the side surface (210C) of the electronic device (101) may be formed by a side structure (211) (e.g., a “bezel structure”) that at least partially surrounds a space between the front plate (202) and the back plate (212). For example, the front plate (202) may be coupled to the side structure (211) so as to face the back plate (212) with a predetermined gap therebetween. In one embodiment, the side structure (211) may be provided as a separate component from the back plate (212) and may be coupled to the back plate (212) through a separate assembly process to form the housing (210). In one embodiment, the side structure (211) may be manufactured or formed integrally with the back plate (212) and may comprise the same material (e.g., a metal material such as aluminum). In one embodiment, the back plate (212) and / or the side structure (211) may at least partially comprise an electrically conductive material, a metal material, and / or a polymer material. When the back plate (212) and / or the side structure (211) include an electrically conductive material, the housing (210) can function at least partially as a radiating conductor of an antenna that transmits and receives wireless signals, and / or can function as a ground or electromagnetic shielding structure of the electronic device (101).

[0068] In the illustrated embodiment, the front plate (202) and / or the back plate (212) are substantially flat plate-shaped, but it should be noted that the embodiments disclosed herein are not limited thereto. For example, the front plate (202) and / or the back plate (212) may have a generally flat plate-shaped shape, but at least a portion of an edge may have a curved shape, and a side structure (211) connecting the edge of the front plate (202) and the back plate (212) may have a curved shape. In one embodiment, the thickness of the electronic device (101) at the center of the front plate (202), for example, the thickness measured along the Z-axis direction, may be greater than the thickness measured at the edge of the front plate (202). For example, the thickness of the electronic device (101) may gradually decrease as it approaches the edge on the first surface (210A). When the front plate (202), the rear plate (212) and / or the side structure (211) of the electronic device (101) have a curved shape, a comfortable grip can be provided to the user.

[0069] According to one embodiment, the electronic device (101) may include a display (220), an audio module (213) (e.g., the audio module (170) of FIG. 1), and / or a key input device (218), and may include at least one of a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1), a light-emitting element, or a connector hole (e.g., the connection terminal (178) of FIG. 1), which is not shown. In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (218) or the light-emitting element) or may additionally include other components.

[0070] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0071] According to one embodiment, the display (220) may include, for example, a display panel (e.g., display panel (223) of FIG. 4) disposed on the inside of the front plate (202) and may output visual information such as characters, images, and / or videos through a significant portion of the front plate (202). In one embodiment, substantially the entire area of ​​the front plate (202) may be set as an area for outputting a screen. The area for outputting a screen may be formed to have a shape substantially identical to the edge of the front plate (202). In one embodiment (not shown), the gap between the area for outputting a screen and the outer edge of the front plate (202) may be formed to be substantially identical, thereby increasing the ratio of the area for outputting a screen to the area provided by the front plate (202).

[0072] In one embodiment, the display (220) may form a recess or opening in a portion of the screen display area, and may include at least one of an audio module, a sensor module, a camera module, or a light-emitting element aligned with the recess or opening. In one embodiment, the electronic device (101) may include at least one of an audio module, a sensor module, a camera module, a fingerprint sensor, or a light-emitting element arranged to face in a direction opposite to the screen output direction of the display (220). In one embodiment, the electronic device may include at least one of an audio module, a sensor module, a camera module, or a light-emitting element arranged inside the screen display area of ​​the display (220) while facing in the same direction as the screen output direction. For example, the camera module may be arranged to overlap the screen display area, and may not be visually exposed to the outside, and may include a hidden under-display camera (UDC).

[0073] In one embodiment, the display (220) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic stylus pen. In one embodiment, at least a portion of the sensor module and / or at least a portion of the key input device may be disposed inside the display.

[0074] In one embodiment, the display (220) may include a display (e.g., a flexible display) that is arranged to slide on the housing (210) to provide a screen (e.g., a screen display area). For example, the screen display area of ​​the electronic device (101) is an area that is visually exposed and capable of outputting an image, and the electronic device (101) may reduce or expand the screen display area according to the movement of a sliding plate (not shown) or the movement of the display (220). For example, the electronic device (101) may include a rollable electronic device in which at least a portion (e.g., the housing) is configured to slide at least partially to selectively expand the screen display area. For example, the display (220) may also be referred to as a slide-out display or an expandable display.

[0075] According to one embodiment, the audio module (213) may include a microphone hole and a speaker hole. The microphone hole may have a microphone positioned inside to capture external sounds, and in one embodiment, multiple microphones may be positioned to detect the direction of the sounds. The speaker hole may include an external speaker hole and a receiver hole for calls. In one embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezo speaker). In the illustrated embodiment, the audio module is illustrated as a hole (213) penetrating the side surface (210C) of the electronic device, for example, the side structure (211). However, it should be noted that the embodiment disclosed in this document is not limited thereto. For example, when providing a voice call function, the electronic device (101) may further include an audio module (not illustrated) in the form of a hole penetrating the front plate (202). The number and location of the audio modules may vary depending on the shape, function, and / or actual usage environment of the electronic device (101).

[0076] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include sensors that detect the operating environment of the electronic device (101), such as a proximity sensor, an illuminance sensor, and a temperature / barometric pressure sensor, and may include sensors that obtain a user's biometric information, such as a fingerprint sensor or an HRM sensor. In addition, various other types of sensors, such as a gesture sensor, a gyro sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, or a humidity sensor, may be mounted on the electronic device (101). The arrangement of these sensor modules may be appropriately selected in consideration of the actual usage environment of the electronic device and the functions mounted on the electronic device.

[0077] According to one embodiment, a camera module (e.g., camera module (231) of FIG. 6) may be disposed on at least one of a first surface (210A), which is the front surface, or a second surface (210B), which is the rear surface, of the electronic device (101), and, depending on the embodiment, a plurality of camera modules may be disposed to face the same direction. In one embodiment, the camera module may include a flash that provides illumination toward a subject. The camera module may include, for example, one or more lenses, an image sensor, and / or an image signal processor. The flash may include, for example, a light-emitting diode or a xenon lamp.

[0078] According to one embodiment, the key input device (218) may be disposed on a side surface (210C) of the electronic device (101) and / or the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (218), and the key input devices (218) that are not included may be implemented in other forms, such as soft keys, on the display (220). The number or location of the key input devices (218) is not limited to the illustrated embodiment, and may be additionally installed on the first side (210A), the second side (210B) and / or the non-illustrated side surface (210C) of the electronic device. In one embodiment, some of the key input devices (218) of FIG. 2 may be replaced with slots or connector holes. For example, the electronic device (101) can accommodate a user identification module card or a memory card through a slot formed to penetrate the side structure (211), and can transmit and receive power, audio signals, and / or data to and from an external electronic device through a connector hole.

[0079] According to one embodiment, the light-emitting element may be disposed on the first side (210A) and / or the second side (210B) of the electronic device (101). The light-emitting element may, for example, provide status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element may, for example, provide a light source that is linked to the operation of a camera module. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0080] FIG. 4 is an exploded perspective view showing an electronic device (101) according to one embodiment disclosed in this document.

[0081] Referring to FIG. 4, the electronic device (101) may include a housing (210), a display (220), a printed circuit board (203) (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (204), a speaker module (251), and an antenna (253). In one embodiment, the electronic device (101) may omit at least one of the components or additionally include another component (e.g., a bracket that supports or protects the display (220). According to one embodiment, the electronic device (101) may have a structure in which housings divided into a plurality of regions are folded, including at least one hinge structure. For example, the state of a display operatively connected to the housing may change depending on a change in the state of the hinge structure (e.g., a folded state, an intermediate state, or an unfolded state). For example, a first display corresponding to a first housing and a second display corresponding to a second housing may change to face each other or be spaced apart from each other. According to one embodiment, at least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any overlapping descriptions will be omitted below.

[0082] According to one embodiment, the housing (210) may include a back plate (212) and a side structure (211) extending from the back plate (212) in a thickness direction (e.g., in the Z-axis direction). In one embodiment, the side structure (211) may be manufactured as a separate component from the back plate (212) and may be combined with the back plate (212) to form the housing (210). In one embodiment, the side structure (211) and the back plate (212) may be manufactured and formed as an integral component. Although not shown, the housing (210) may further include a support member (not shown) that isolates the display (220) (e.g., the display panel (223)) from a space in which the printed circuit board (203) or the battery (204) is accommodated, and the support member may be in the form of a flat plate formed integrally with the side structure (211). In the embodiments described below, the rear plate (212) of FIG. 4 and the rear plate (212) of FIG. 3 can be interpreted as being substantially the same.

[0083] According to one embodiment, the back plate (212) and / or the side structure (211) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. For example, the housing (210) may at least partially include an electrically conductive material. In one embodiment, when the back plate (212) includes an electrically conductive material, the housing (210) may be utilized as a structure that provides an electromagnetic shielding structure at least partially. In one embodiment, when the side structure (211) includes an electrically conductive material, at least a portion of the side structure (211) may be utilized as a radiating conductor for transmitting and receiving wireless radio waves. In one embodiment, when a support member (not shown) is disposed between the printed circuit board (203) and the display panel (223), and the support member includes an electrically conductive material, the support member may provide a ground conductor or an electromagnetic shielding structure of the electronic device (101).

[0084] According to one embodiment, the display (220) may include a window plate (221) (e.g., the front plate (202) of FIG. 2 or FIG. 3) and a display panel (223). The display panel (223) is disposed on the inner surface of the window plate (221) and may output visual information by utilizing substantially the entire area of ​​the window plate (221).

[0085] According to one embodiment, the electronic device (101) may include a plurality of through holes (213, 218) formed to penetrate the side structure (211). Among the plurality of through holes (213, 218), the first through hole (213)(s) may be utilized as a path for outputting sound. For example, the audio module (213) of FIG. 2 may include the first through hole (213). In one embodiment, the electronic device (101) may include at least one speaker module (251) positioned at a position corresponding to the first through holes (213), and the speaker module (251) may output sound to the outside of the electronic device (101) through the first through hole (213)(s). Among the plurality of through holes (213, 218), the second through hole (218)(s) may provide a space for installing an input device, for example, a key input device (218) of FIG. 2. In one embodiment, some of the plurality of through holes (213, 218) may be utilized as slots or connector holes for accommodating a storage medium, and, depending on the embodiment, additional slots and / or connector holes may be formed to penetrate the side structure (211).

[0086] According to one embodiment, a printed circuit board (203) disposed as a first circuit board or a main circuit board may have a processor, a memory, and / or an interface disposed thereon. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, the processor or the communication module may be mounted on an electronic component (255), such as an integrated circuit chip, and disposed on the printed circuit board (203). For example, the electronic component (255) may be disposed on the printed circuit board (203) through a surface mount process and may perform wireless communication using an antenna (253) and / or a portion of the side structure (211). According to one embodiment, the electronic device (101) may include a storage device (e.g., memory), such as a hard disk drive (HDD) or a solid state drive (SSD).

[0087] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0088] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0089] According to one embodiment, the battery (204) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (204) may be disposed substantially on the same plane as, for example, the printed circuit board (203). The battery (204) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0090] According to one embodiment, the antenna (253) may be disposed within the housing (210) adjacent to an edge, for example, a side structure (211). In one embodiment, a plurality of antennas (253) may be arranged at appropriate locations along the edge within the housing (210). In one embodiment, the illustrated antenna (253) may perform millimeter wave (mmWave) communication using a frequency of several tens of GHz or more. In one embodiment, although not illustrated, the electronic device (101) may further include a flat antenna disposed between the back plate (212) and the battery (204). The flat antenna may include wires or printed circuit patterns arranged in a plane to form a loop structure and may function as, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the flat antenna may be capable of performing short-range communication with an external device or wirelessly transmitting and receiving power required for charging.

[0091] FIG. 5 is a plan view illustrating a portion of a configuration of an electronic device according to an embodiment of the present disclosure. FIG. 6 is a rear view of an electronic device according to an embodiment of the present disclosure.

[0092] FIG. 5 may be a plan view of an electronic device (101) with a display (e.g., the display (220) of FIG. 4) removed. The electronic device (101) of FIG. 6 may be referred to as the electronic device (101) of FIGS. 1 to 4. The configuration of the housing (210) of FIG. 6 may be all or part of the same or similar to the configuration of the housing (210) of FIGS. 3 and 4.

[0093] In one embodiment, an electronic device (101) (e.g., a tablet PC) may include a housing (210) and a support structure (260).

[0094] In one embodiment, the housing (210) may include a side structure (211) and a rear plate (212). In one embodiment, the side structure (211) and the rear plate (212) are described separately for convenience of explanation, but may be formed or manufactured integrally as a single member. In one embodiment, the side structure (211) and the rear plate (212) may be formed or manufactured separately and then coupled to each other.

[0095] According to one embodiment, the side structure (211) may form a side surface of the electronic device (101) (e.g., side surface (210C) of FIG. 3). For example, the side structure (211) may include a portion extending from the side surface of the electronic device (101) (e.g., side surface (210C) of FIG. 3) to the front surface (e.g., first surface (210A) of FIGS. 2 and 3) and / or the back surface (e.g., second surface (210B) of FIGS. 2 and 3) of the electronic device (101).

[0096] According to one embodiment, at least one slit (217) (or segment) may be formed in a portion of the side structure (211) of the housing (210). For example, the slit (217) may be formed to penetrate at least one axial direction (e.g., Y-axis direction) in a portion of the side structure (211). In other words, the slit (217) may be a portion in which a portion of the side structure (211) is deleted or disconnected. For example, referring to FIG. 6, the electronic device (101) may include a plurality of slits (217) formed at the top (+Y direction end) and / or the bottom (-Y direction end).

[0097] According to one embodiment, the electronic device (101) may further include an insulating region (241) (or insulating tape) and / or a camera module (231) (e.g., the camera module (180) of FIG. 1) disposed on the rear plate (212). For example, the insulating region (241) may be formed integrally with a first portion (261a) and / or a second portion (261b) of a non-conductive first support structure (261) disposed on the inside of the housing (210). Depending on the embodiment, a part of the configuration of the electronic device (101) (e.g., the insulating region (241)) may be omitted.

[0098] In one embodiment, the support structure (260) may include a first support structure (261) and a second support structure (262). For example, the first support structure (261) and the second support structure (262) may be formed or manufactured separately and then joined to each other, or may be formed or manufactured integrally.

[0099] According to one embodiment, the first support structure (261) may include a first portion (261a) disposed in the slit (217) of the housing (210) and a second portion (261b) extending inwardly from the first portion (261a) of the electronic device (101). The first portion (261a) and the second portion (261b) of the first support structure (261) are formed integrally, but may be referred to separately for convenience of description. For example, at least a portion of the first support structure (261) may be in contact with or connected to a portion of the inner surface of the side structure (211). According to one embodiment, the first support structure (261) may be formed of a non-conductive material such as a polymer. For example, the first support structure (261) may be formed or manufactured by injection molding.

[0100] According to one embodiment, the second support structure (262) can be connected to the first support structure (261) and can be disposed inside the electronic device (100) to support components of the electronic device (101). According to one embodiment, a front plate (e.g., the front plate (202) of FIGS. 2 and 3 and the window plate (221) of FIG. 4) can be disposed on one side (e.g., the side facing the +Z direction) of the second support structure (262), and a printed circuit board (e.g., the printed circuit board (203) of FIG. 4) can be disposed on the other side (e.g., the side facing the -Z direction). For example, the second support structure (262) can be formed of a conductive material such as a metal and / or a non-conductive material such as a polymer.

[0101] FIG. 7 is an enlarged view of a portion of an electronic device according to one embodiment of the present disclosure.

[0102] Specifically, FIG. 7 illustrates a state in which a cable (320) is fixed to a portion of an electronic device (301) according to one embodiment of the present disclosure.

[0103] Hereinafter, 'one side' may mean the +Z direction in FIGS. 7 to 21, and 'the other side' may mean the -Z direction in FIGS. 7 to 21. In addition, 'one side' may mean a side facing the +Z direction in FIGS. 7 to 21, and 'the other side' may mean a side facing the -Z direction in FIGS. 7 to 21.

[0104] Hereinafter, an electronic device (301) according to an embodiment of the present disclosure may be understood to be identical to the electronic device (101) described above. An electronic device (301) according to an embodiment of the present disclosure may include a printed circuit board (310), a cable (320), and a fixing member (330), but some of these components may be omitted and implemented, and additional components are not excluded.

[0105] According to one embodiment, the electronic device (301) may include a printed circuit board (310). The printed circuit board (310) may refer to the printed circuit board (203) described with reference to FIGS. 2 to 6, but is not limited thereto, and may be provided separately from the printed circuit board (203) described with reference to FIGS. 2 to 6.

[0106] According to one embodiment, the electronic device (301) may include a cable (320). The cable (320) may be connected to a printed circuit board (310). Specifically, the cable (320) may be electrically connected to the printed circuit board (310) on one side (the side facing the +Z direction) of the printed circuit board (310). The cable (320) may be connected to a connector mounted on one side (the side facing the +Z direction) of the printed circuit board (310).

[0107] According to one embodiment, the cable (320) is described as a coaxial cable that connects between a main printed circuit board (e.g., the main printed circuit board (203) of FIG. 4) and an antenna (e.g., the antenna (253) of FIG. 4) for RF communication and transmits an RF signal for RF communication, but is not limited thereto. For example, one end of the cable (320) may be connected to a component different from the main printed circuit board (e.g., the main printed circuit board (203) of FIG. 4), and the other end may also be connected to a component different from the antenna (e.g., the main printed circuit board (253) of FIG. 4).

[0108] According to one embodiment, the electronic device (301) may include a fixing member (330). The fixing member (330) may fix the cable (320) to the printed circuit board (310). The fixing member (330) may be provided as a screw. The fixing member (330) may be coupled to the printed circuit board (310) by penetrating the head (321) of the cable (320), thereby fixing the cable (320) to the printed circuit board (310).

[0109] FIG. 8 is a perspective view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 9 is an exploded perspective view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 10 is a cross-sectional view taken along line A-A' of FIG. 8. FIG. 11 illustrates one side of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 12 illustrates the other side of a portion of an electronic device according to an embodiment of the present disclosure.

[0110] Specifically, FIG. 11 illustrates one side (the side facing the +Z direction) of a cable (320) of an electronic device (301) according to one embodiment of the present disclosure, and FIG. 12 illustrates the other side of a cable (320) of an electronic device (301) according to one embodiment of the present disclosure.

[0111] According to one embodiment, the electronic device (301) may include a printed circuit board (310). A processor, memory, and / or interface may be disposed on the printed circuit board (310).

[0112] According to one embodiment, the printed circuit board (310) may include a base portion (311). The base portion (311) may be provided in a plate shape, but is not limited thereto and may be provided in various shapes depending on the structure of the electronic device (301). The base portion (311) may serve as a structure on which electronic components such as a processor, memory, and / or interface may be mounted.

[0113] According to one embodiment, the printed circuit board (310) may include a guide portion (312). The guide portion (312) may be provided on one surface (a surface facing the +Z direction) of the base portion (311). The guide portion (312) may be fixed to the base portion (311). The guide portion (312) may be surface-mounted on the base portion (311). However, the present invention is not limited thereto, and the guide portion (312) may also be a part of the base portion (311).

[0114] According to one embodiment, the guide portion (312) can guide the head (321) on the printed circuit board (310). For example, the guide portion (312) can pre-fix the head (321) on the printed circuit board (310) before the head (321) is fixed on the printed circuit board (310) by the fixing member (330). It can be understood that the guide portion (312) guides the fixing position of the head (321) before the fixing member (330) fixes the head (321) to the printed circuit board (310).

[0115] According to one embodiment, the guide portion (312) may be disposed on at least one of the two sides of the body (3211). For example, as illustrated in FIGS. 8 and 9 , the guide portion (312) may be disposed on both sides of the head (321). For example, the guide portion (312) may be disposed on both sides of the body (3211). However, the present invention is not limited thereto, and the guide portion (312) may be disposed to surround three or four sides of the body (3211), or may be disposed on only one side of the body (3211).

[0116] According to one embodiment, the guide portion (312) may include a rail groove (312a). The rail groove (312a) may be formed on a side of the guide portion (312) facing the head (321). The rail groove (312a) may extend in a direction corresponding to the direction in which the body (3211) extends. For example, referring to FIGS. 8 to 10, the rail groove (312a) may be formed on the inner side of the guide portion (312) disposed on both sides of the body (3211). At least a portion of the body (3211) may be seated in the rail groove (312a). For example, the body (3211) of the head (321) can be approached from one side in the direction in which the rail groove (312a) extends, and both sides of the body (3211) can be slidably inserted into the rail groove (312a), thereby allowing the body (3211) to be seated on the guide portion (312).

[0117] According to one embodiment, the printed circuit board (310) may include a fastening portion (313). The fastening portion (313) may be disposed on one side (the side facing the +Z direction) of the base portion (311). The fastening portion (313) may be disposed on the other side (the -Z direction side) of the head (321) when the head (321) is fixed to the printed circuit board (310). The fastening portion (313) may be disposed on the side of the guide portion (312). For example, referring to FIGS. 9 and 10, the fastening portion (313) may be disposed between the guide portions (312) disposed on both sides of the body (3211). In one example according to one embodiment, the fastening portion (313) may be a PEM NUT mounted on the base portion (311).

[0118] According to one embodiment, the fastening portion (313) may be formed integrally with the guide portion (312). In this case, the fastening portion (313) and the guide portion (312) may be mounted integrally on one surface (the surface facing the +Z direction) of the base portion (311). However, the present invention is not limited thereto, and the fastening portion (313) and the guide portion (312) may be provided as separate members and mounted separately on the base portion (311).

[0119] According to one embodiment, a fastening groove (313a) may be formed in the fastening portion (313). The fixing member (330) may be coupled to the fastening portion (313) by being inserted into the fastening groove (313a) through the body (3211).

[0120] In one embodiment, the fastening portion (313) may be a terminal on an electrical path of the printed circuit board (310). In one example according to one embodiment, the fastening portion (313) may be a ground terminal of the printed circuit board (310). The ground portion (3212) may be grounded by being electrically connected to the fastening portion (313) through the fixing member (330).

[0121] According to one embodiment, the electronic device (301) may include a cable (320). The cable (320) may be electrically connected to the printed circuit board (310) on one side (the side facing the +Z direction) of the printed circuit board (310). In one embodiment according to the present disclosure, the cable (320) may be a coaxial cable, but is not limited thereto as long as it can transmit an electrical signal.

[0122] According to one embodiment, the cable (320) may include a conductor portion (322). The conductor portion (322) may include a signal line (not shown) connected to a signal portion (3213), a ground line (not shown) connected to a ground portion (3212), an insulator that insulates the signal line (not shown) and the ground line (not shown), and a covering that covers the outer surface of the conductor portion (322).

[0123] According to one embodiment, the cable (320) may include a head (321). The head (321) may be provided at an end of a conductor portion (322). The head (321) may be a portion fixed to a printed circuit board (310). In addition, the head (321) may be a connector that electrically connects the printed circuit board (310) and the conductor portion (322). The head (321) may be guided on the printed circuit board (310) by having both sides of the head (321) seated on guide portions (312).

[0124] According to one embodiment, the head (321) may include a body (3211). The body (3211) may also be referred to as a stiffener. The body (3211) may serve as a structure on which a ground portion (3212) and a signal portion (3213) may be mounted.

[0125] According to one embodiment, the body (3211) may include an insulating material. For example, the body (3211) may be provided as an insulator itself, or may be provided as a structure in which a conductive member is covered with an insulating material. The ground portion (3212) and the signal portion (3213) may be insulated by the body (3211).

[0126] According to one embodiment, the body (3211) may be a plate shape. For example, as illustrated in FIGS. 11 and 12 , the body (3211) may have a 'T' plate shape including wing portions (3211a) protruding in both sides when viewed from one side (+Z direction side). However, the present invention is not limited thereto, and if the body (3211) has a structure that can be slidably inserted into the guide portion (312), the shape of the body (3211) may not be limited to the above-described shape. For example, the body (3211) may have a rectangular or circular shape.

[0127] According to one embodiment, at least a portion of the body (3211) may be seated on the guide portion (312). For example, referring to FIGS. 8 to 10, both sides of the body (3211), i.e., the wing portions (3211a), may be seated on the guide portion (312). The wing portions (3211a) of the body (3211) may be portions that are inserted into and slide in the rail grooves (312a) of the guide portion (312). However, when the body (3211) is, for example, rectangular, the portions seated on the guide portion (312) may be understood to be edge portions of both sides of the body (3211).

[0128] According to one embodiment, the head (321) may include a ground portion (3212) and a signal portion (3213). The ground portion (3212) may be a ground connection terminal of the cable (320). The signal portion (3213) may be a signal connection terminal of the cable (320).

[0129] According to one embodiment, one of the ground portion (3212) and the signal portion (3213) may be disposed around the coupling hole (3211b) on one surface (the surface facing the +Z direction) of the body (3211). One of the ground portion (3212) and the signal portion (3213) may be in contact with the flange portion (332) of the fixing member (330) and electrically connected to the printed circuit board (310). The other of the ground portion (3212) and the signal portion (3213) may be disposed on the other surface (the surface facing the -Z direction) of the body (3211) and electrically connected to the terminal clip (314).

[0130] For example, referring to FIG. 11, the ground portion (3212) may be arranged around the coupling hole (3211b) on one side (the side facing the +Z direction) of the body (3211). The ground portion (3212) may have a pad shape. The ground portion (3212) may be provided in a ring shape around the coupling hole (3211b). However, the present invention is not limited thereto, and the ground portion (3212) may cover the entire one side (the side facing the +Z direction) of the body (3211) or may be provided in a shape other than a ring shape. The ground portion (3212) may be electrically connected to a ground line (not shown) of the conductor portion (322) via a conductor. Referring to FIG. 10, the ground portion (3212) may be in contact with the lower surface of the flange portion (332) of the fixing member (330) provided with a screw. The ground portion (3212) can be electrically connected to the fastening portion (313) to which the fastening member (330) is fastened, through the fastening member (330), which is a conductive member. Through this structure, the ground connection of the cable (320) can be realized.

[0131] Alternatively, the ground portion (3212) may be ground-connected to the guide portion (312). For example, if the ground portion (3212) extends to both sides where it is seated in the rail groove (312a) of the body (3211), the ground portion (3212) may be ground-connected by contacting the upper surface of the rail groove (312a) of the guide portion (312). In addition, if the flange portion (332) of the fixing member (330) is in contact with the guide portion (312), the ground portion (3212) may be ground-connected to the guide portion (312) through the flange portion (332).

[0132] For example, referring to FIG. 12, the signal portion (3213) may be disposed on the other surface (the surface facing the -Z direction) of the body (3211). The signal portion (3213) may be in the shape of a pad, but is not limited thereto, and may also include a protruding portion. The signal portion (3213) may be disposed between the coupling hole (3211b) and the conductor portion (322), but is not limited thereto, and may be disposed at any position on the other surface (the surface facing the -Z direction) of the body (3211) corresponding to the position of the terminal clip (314) mounted on the base portion (311). The signal portion (3213) may be electrically connected to the terminal clip (314) disposed on one surface (the surface facing the +Z direction) of the base portion (311).

[0133] Unlike the above, the signal portion (3213) may be arranged around the coupling hole (3211b) on one side (the side facing the +Z direction) of the body (3211), and the ground portion (3212) may be arranged on the other side (the side facing the -Z direction) of the body (3211). In this case, the signal portion (3213) may be electrically connected to the fastening portion (313) and / or the guide portion (312), and the ground portion (3212) may be electrically connected to a terminal clip (314) arranged on one side (the side facing the +Z direction) of the base portion (311).

[0134] According to one embodiment, the printed circuit board (310) may include a terminal clip (314). The terminal clip (314) may be disposed on one surface (the surface facing the +Z direction) of the base portion (311). The terminal clip (314) may be a terminal for ground and / or signal connection of the printed circuit board (310). For example, the terminal clip (314) of one embodiment of the present disclosure may be a signal connection terminal of the printed circuit board (310).

[0135] According to one embodiment, the terminal clip (314) may be a C-clip comprising an elastic material. The terminal clip (314) may include a portion that is elastically deformable in the vertical direction. Through this, a stable electrical connection between the signal portion (3213) and the terminal clip (314) can be realized even without precise height control of the head (321).

[0136] According to one embodiment, the electronic device (301) may include a fixing member (330). The fixing member (330) may fix the head (321) of the cable (320) to the printed circuit board (310). The fixing member (330) may be fixed to the printed circuit board (310) by passing through a coupling hole (3211b) formed in the body (3211) from one side (+Z direction side) to the other side (-Z direction side). For example, the fixing member (330) may be provided as a screw and may be screw-fixed to a fastening portion (313) on the printed circuit board (310).

[0137] According to one embodiment, the fixing member (330) may include a conductive member. An electrical signal may flow through the fixing member (330). For example, when a ground portion (3212) is arranged around a coupling hole (3211b) on one side (a side facing the +Z direction) of the body (3211), the ground portion (3212) of the cable (320) is electrically connected to the fastening portion (313) through the fixing member (330), thereby allowing the cable (320) to be grounded.

[0138] According to one embodiment, the fixing member (330) may include a pillar portion (331). The pillar portion (331) may extend in a direction penetrating the body (3211). The pillar portion (331) may extend in an up-down direction with reference to FIG. 10. The pillar portion (331) may penetrate the body (3211) and be coupled to the fastening portion (313).

[0139] According to one embodiment, the fixing member (330) may include a flange portion (332). The flange portion (332) may protrude outwardly from one end region (+Z direction side) of the pillar portion (331). The flange portion (332) may be disposed on one side (+Z direction side) of the body (3211) and / or the ground portion (3212) when the fixing member (330) is coupled to the fastening portion (313) by penetrating the body (3211). The lower surface of the flange portion (332) may be in contact with the ground portion (3212). The lower surface of the flange portion (332) may be electrically connected to the ground portion (3212).

[0140] For example, the fixing member (330) may be a screw having a screw head or a rivet having a rivet head, but is not limited thereto.

[0141] Hereinafter, a process of fixing a cable (320) to a printed circuit board (310) in an electronic device (301) according to one embodiment of the present disclosure will be described.

[0142] According to one embodiment, the method of manufacturing the electronic device (301) may include a step of approaching the head (321) of the cable (320) from one side of the guide portion (312). For example, the head (321) may be approached toward the guide portion (312) in the longitudinal direction of the cable (320). However, the present invention is not limited thereto, and the head (321) may also be approached in a direction intersecting the longitudinal direction of the cable (320) depending on the shape of the guide portion (312) and the shape of the head (321).

[0143] According to one embodiment, a method of manufacturing an electronic device (301) may include a step of securing a cable (320) to a guide portion (312). In this step, at least a portion of a body (3211) may be slidably inserted into a rail groove (312a). For example, the body (3211) may be secured to the guide portion (312) by sliding both sides of the body (3211) into the rail groove (312a). By securing the head (321) to the guide portion (312), the head (321) may be guided on the printed circuit board (310). In other words, the cable (320) may be pre-fixed by slidingly inserting at least a portion of the body (3211) into the guide portion (312) before the fixing member (330) is coupled.

[0144] In one example according to one embodiment, as the body (3211) is not attached to the guide portion (312), the signal portion (3213) disposed on the other side (the side facing the -Z direction) of the body (3211) can contact the terminal clip (314) disposed on one side (the side facing the +Z direction) of the base portion (311). At this time, the terminal clip (314) may be pressed by a certain amount in the other side (the -Z direction side) by the signal portion (3213). As the body (3211) is attached to the guide portion (312), the signal portion (3213) can be electrically connected to the terminal clip (314).

[0145] According to one embodiment, a method of manufacturing an electronic device (301) may include a step of connecting a fixing member (330) to a printed circuit board (310) by penetrating the head (321). The fixing member (330) may pass through a coupling hole (3211b) of the body (3211) from one side (+Z direction side) to the other side (-Z direction side) of the body (3211) and then be connected to a fastening portion (313) on the printed circuit board (310). In an example according to one embodiment, when the fixing member (330) is provided as a screw, the fixing member (330) may pass through the body (3211) and then be screw-connected to the fastening portion (313).

[0146] In one example according to one embodiment, when the coupling of the fixing member (330) is completed, the ground portion (3212) disposed on one side (the side facing the +Z direction) of the body (3211) can come into contact with the lower surface of the flange portion (332) of the fixing member (330). Through this, the ground portion (3212) can be electrically connected to the fastening portion (313), which is a ground connection terminal of the printed circuit board (310), through the fixing member (330). In addition, as the fixing member (330) is coupled, the head (321) can move slightly toward the base portion (311), and accordingly, the signal portion (3213) can press the terminal clip (314) toward the other side (the -Z direction side). Through this, the electrical connection between the signal portion (3213) and the terminal clip (314) can be stably established.

[0147] According to the structure of the electronic device (301) and the manufacturing method of the electronic device (301) according to the above-described embodiment of the present disclosure, before the head (321) is fixed to the printed circuit board (310), the cable (320) can be guided or pre-fixed on the printed circuit board (310). Through this, the cable (320) can be doubly fixed to the printed circuit board (310), so that the frequency of occurrence of defective products due to poor assembly of the cable (320) can be reduced. In addition, since the assembly of the cable (320) can be facilitated, the efficiency of the assembly process can be improved. In addition, since the process of the worker separately holding or pressing the head (321) with his / her hand or a tool can be omitted, damage to other components placed close to the connector can be prevented. In addition, since the risk of damage to components close to the connector is reduced, components can be placed close to the connector, so that space efficiency can be improved. Additionally, design freedom can be improved since separate support ribs for cable fixing can be omitted.

[0148] Unlike the above, the ground portion (3212) and the signal portion (3213) may be arranged on the other side (the side facing the -Z direction) of the body (3211). In this case, terminal clips (314) corresponding to the ground portion (3212) and the signal portion (3213) may be provided on one side (the side facing the +Z direction) of the base portion (311), and the ground portion (3212) and the signal portion (3213) may be electrically connected to the corresponding terminal clips (314), respectively. In addition, similarly to the electronic device (401) according to an embodiment of the present disclosure described later with reference to FIGS. 13 to 17, a ground pad and a signal pad may be arranged on the base portion (311), and protrusions may be formed on the ground portion (3212) and the signal portion (3213) of the head (321), respectively, so that the ground portion (3212) may be electrically connected to the ground pad, and the signal portion (3213) may be electrically connected to the signal pad.

[0149] FIG. 13 illustrates one side (the side facing the +Z direction) of a part of a configuration of an electronic device according to an embodiment of the present disclosure. FIG. 14 is a cross-sectional view taken along line A-A' of FIG. 13. FIG. 15 is a cross-sectional view taken along line B-B' of FIG. 13. FIG. 16 illustrates the other side of a part of a configuration of an electronic device according to an embodiment of the present disclosure. FIG. 17 illustrates one side of a part of a configuration of an electronic device according to an embodiment of the present disclosure.

[0150] Specifically, FIG. 16 illustrates a side (a side facing the -Z direction) of a cable (420) of an electronic device (401) according to one embodiment of the present disclosure, and FIG. 17 illustrates a side (a side facing the +Z direction) of a printed circuit board (410) of an electronic device (401) according to one embodiment of the present disclosure.

[0151] Details of an electronic device (401) according to an embodiment of the present disclosure not described below may be identical to the detailed configuration of an electronic device (301) according to an embodiment of the present disclosure described with reference to FIGS. 7 to 12.

[0152] According to one embodiment, the printed circuit board (410) may include a base portion (411). The base portion (411) may be provided in a plate shape, but is not limited thereto and may be provided in various shapes depending on the structure of the electronic device (401). The base portion (411) may serve as a structure on which electronic components such as a processor, memory, and / or interface may be mounted.

[0153] According to one embodiment, the printed circuit board (410) may include a guide portion (412). The guide portion (412) may be provided on one surface (a surface facing the +Z direction) of the printed circuit board (410). The guide portion (412) may be positioned at a position corresponding to the conductor portion (422). The conductor portion (422) may be fixed to the guide portion (412). The guide portion (412) may guide the head (421) on the printed circuit board (410). For example, before the head (421) is fixed on the printed circuit board (410), the conductor portion (422) may be pre-fixed by the guide portion (412), thereby guiding the head (421) to a fixed position.

[0154] According to one embodiment, the guide portion (412) may be provided as a clamp into which the conductor portion (422) can be fitted. For example, referring to FIGS. 13, 15, and 17, the guide portion (412) may include a fixing portion (4121) fixed to the base portion (411), and at least one pair of clamp portions (4122) protruding from the fixing portion (4121) to one side (in the +Z direction). In one example according to one embodiment, the clamp portions (4122) may be provided in two pairs. The width between the ends of one pair of clamp portions (4122) may be smaller than the diameter of the conductor portion (422). The clamp portions (4122) may be elastically deformed during the process of fitting the conductor portion (422). Through this, the conductor portion (422) may be fixed in a state of being fitted into the clamp portions (4122). However, it is not limited to this, and the guide part (412) may also fix the conductor part (422) according to a separate mechanical mechanism.

[0155] According to one embodiment, the printed circuit board (410) may include a terminal pad (414). The terminal pad (414) may be disposed on one surface (the surface facing the +Z direction) of the base portion (411). The terminal pad (414) may be a terminal for ground connection and / or signal connection of the printed circuit board (410). The terminal pad (414) may be provided in a pad shape, thereby forming a margin for contact between the ground portion (4212) and the signal portion (4213), thereby stably performing the ground connection and the signal connection. However, the present invention is not limited thereto, and the terminal pad (414) may be provided as a C-clip instead of a pad. In this case, the ground portion (4212) and the signal portion (4213) may not be provided with a contact protrusion (4214).

[0156] According to one embodiment, the terminal pad (414) may be positioned to overlap the head (421). The terminal pad (414) may be provided to correspond to at least one of the ground portion (4212) or the signal portion (4213).

[0157] For example, referring to FIG. 17, the terminal pad (414) may include a ground pad (4141) and a signal pad (4142). The ground pad (4141) and the signal pad (4142) may be spaced apart from each other. The signal pad (4142) may be positioned to overlap with the signal portion (4213). For example, referring to FIG. 17, the ground pad (4141) may be positioned on the right side with respect to the extension direction of the cable (420), and the signal pad (4142) may be positioned on the left side with respect to the extension direction of the cable (420). The ground pad (4141) may be positioned to overlap with the ground portion (4212). However, without being limited thereto, the ground pad (4141) and the signal pad (4142) may be arranged in various positions and shapes depending on the arrangement of the ground portion (4212) and the signal portion (4213) at a position overlapping the head (421).

[0158] According to one embodiment, the base portion (411) may include a guide hole (4111). The guide hole (4111) may be formed through the base portion (411) or may be formed as a groove in the base portion (411). The guide hole (4111) may be formed at a position overlapping the guide pin (4215). The guide pin (4215) may be inserted into the guide hole (4111). For example, the fixing member (430) may be provided as a screw, and by inserting the guide pin (4215) into the guide hole (4111), the angle of the head (421) may be prevented from being distorted by the rotational torque of the fixing member (430). In addition, by inserting the guide pin (4215) into the guide hole (4111), the fixing position of the head (421) may be guided. That is, the guide hole (4111) can be understood as assisting the guide portion (412) in guiding the head (421).

[0159] According to one embodiment, the guide hole (4111) may be formed at a position where the guide portion (412) and the cable (420) overlap in the longitudinal direction. That is, the guide hole (4111) may be arranged on the same axis as the guide portion (412). For example, the guide hole (4111) may be arranged on the opposite side of the guide portion (412) with respect to the opening (4112). Through such an arrangement, the angle of the head (421) can be effectively prevented from being distorted by the rotational torque resulting from the rotation of the fixing member (430). However, the present invention is not limited thereto, and the guide hole (4111) may be arranged at various positions depending on the position of the guide pin (4215) on the position where it overlaps with the head (421).

[0160] According to one embodiment, the base portion (411) may include an opening (4112). The opening (4112) may be formed by penetrating the base portion (411). A boss (B) fixed to a mechanism (S) disposed on the other side (-Z direction side) of the base portion (411) may be disposed on the inside of the opening (4112).

[0161] According to one embodiment, the head (421) may include a ground portion (4212) and a signal portion (4213). At least one of the ground portion (4212) or the signal portion (4213) may be disposed on a surface of the body (4211) facing the printed circuit board (410). At least one of the ground portion (4212) or the signal portion (4213) may be electrically connected to a terminal pad (414).

[0162] For example, referring to FIG. 16, the ground portion (4212) and the signal portion (4213) may be disposed on the other side (the side facing the -Z direction) of the body (4211). The ground portion (4212) and the signal portion (4213) may be disposed spaced apart from each other. The ground portion (4212) may be disposed at a position overlapping the ground pad (4141). The signal portion (4213) may be disposed at a position overlapping the signal pad (4142). For example, referring to FIG. 16, the ground portion (4212) may be disposed on the left side based on the extension direction of the cable (420), and the signal portion (4213) may be disposed on the right side based on the extension direction of the cable (420). However, without being limited thereto, the ground portion (4212) and the signal portion (4213) may be arranged in various positions depending on the arrangement of the ground pad (4141) and the signal pad (4142).

[0163] According to one embodiment, the head (421) may include a contact protrusion (4214). The contact protrusion (4214) may protrude toward the printed circuit board (410) from at least one of the ground portion (4212) or the signal portion (4213). For example, referring to FIGS. 14 and 16 , the contact protrusion (4214) may protrude toward the printed circuit board (410) from each of the ground portion (4212) and the signal portion (4213). The contact protrusion (4214) may be formed of an elastic material. The contact protrusion (4214) is a portion that directly contacts the terminal pad (414), and an electrical connection between the cable (420) and the printed circuit board (410) may be stably realized through the contact protrusion (4214). However, without being limited thereto, when the head (421) is coupled to the printed circuit board (410) by the fixing member (430), if sufficient contact between the terminal pad (414) and the ground portion (4212) and the signal portion (4213) can be made, the contact protrusion (4214) may not be provided.

[0164] According to one embodiment, the head (421) may include a guide pin (4215). The guide pin (4215) may protrude from the body (4211) toward the printed circuit board (410). The guide pin (4215) may be formed at a position overlapping the guide hole (4111). The guide pin (4215) may be inserted into the guide hole (4111). As described above, by inserting the guide pin (4215) into the guide hole (4111), the angle of the head (421) may be prevented from being distorted by the rotational torque of the fixing member (430), and the fixing position of the head (421) may be guided.

[0165] According to one embodiment, the guide pin (4215) may be formed at a position where the conductor portion (422) and the cable (420) overlap in the longitudinal direction. That is, the guide pin (4215) may be arranged on the axis of the conductor portion (422). For example, the guide pin (4215) may be arranged on the opposite side of the conductor portion (422) with respect to the coupling hole (4211b) of the body (4211). The position of the guide pin (4215) may correspond to the position of the guide hole (4111). Through such an arrangement, it is possible to effectively prevent the angle of the head (421) from being distorted due to rotational torque resulting from the rotation of the fixing member (430). However, the present invention is not limited thereto, and the position of the guide pin (4215) may be arranged at various positions depending on the position of the guide hole (4111).

[0166] In one embodiment, the cable (420) may include a conductor portion (422). The conductor portion (422) may be secured to a guide portion (412). In one example according to one embodiment, the conductor portion (422) may be fitted to the guide portion (412) provided with a clamp.

[0167] Hereinafter, a process of fixing a cable (420) to a printed circuit board (410) in an electronic device (401) according to one embodiment of the present disclosure will be described.

[0168] According to one embodiment, a method of manufacturing an electronic device (401) may include a step of approaching a cable (420) to a printed circuit board (410).

[0169] According to one embodiment, a method of manufacturing an electronic device (401) may include a step of securing a conductor portion (422) to a guide portion (412). In one example according to one embodiment, the conductor portion (422) may be fixed to the guide portion (412). For example, the conductor portion (422) may be fitted to the guide portion (412) provided as a clamp. In this step, the position of the head (421) with respect to the printed circuit board (410) may be primarily guided. That is, the cable (420) may be pre-fixed by fixing the conductor portion (422) to the guide portion (412) before the fixing member (430) is coupled.

[0170] In one embodiment, a method of manufacturing an electronic device (401) may include a step of inserting a guide pin (4215) into a guide hole (4111). The step of inserting the guide pin (4215) into the guide hole (4111) may be performed before coupling the fixing member (430) to the printed circuit board (410). The step of inserting the guide pin (4215) into the guide hole (4111) may be performed after the step of securing the conductor portion (422) into the guide portion (412), may be performed simultaneously with the step of securing the conductor portion (422) into the guide portion (412), or may be performed before the step of securing the conductor portion (422) into the guide portion (412).

[0171] According to one embodiment, a method of manufacturing an electronic device (401) may include a step of coupling a fixing member (430). The fixing member (430) may pass through a coupling hole (4211b) of the body (4211) from one side (+Z direction side) to the other side (-Z direction side) of the body (4211) and then be coupled to a boss (B). In an example according to one embodiment, when the fixing member (430) is provided as a screw, the fixing member (430) may pass through the body (4211) and then be screw-coupled to the boss (B).

[0172] In one example according to one embodiment, when the bonding of the fixing member (430) is completed, the ground portion (4212) disposed on the other surface (the surface facing the -Z direction) of the body (4211) can be electrically connected to the ground pad (4141), and the signal portion (4213) disposed on the other surface (the surface facing the -Z direction) of the body (4211) can be electrically connected to the signal pad (4142). At this time, the electrical connection between the ground portion (4212) and the signal portion (4213) can be made through the contact protrusion (4214).

[0173] Unlike the above, in the electronic device (401) according to one embodiment of the present disclosure, the ground connection and signal connection may be similar to those in the electronic device (301) according to one embodiment of the present disclosure. For example, the ground pad (4141) may be placed on one surface (the surface facing the +Z direction) of the body (4211). In addition, a fastening portion (not shown) for ground connection and coupling of the fixing member (430) may be mounted on the base portion (411). At this time, as the fixing member (430) is coupled, the ground portion (4212) is electrically connected to the lower surface of the flange portion (432) of the fixing member (430), and may be ground-connected to the fastening portion through the fixing member (430).

[0174] FIG. 18 illustrates one side of an electronic device according to an embodiment of the present disclosure. FIG. 19 illustrates one side of an electronic device in an exploded state according to an embodiment of the present disclosure. FIG. 20 is a cross-sectional view taken along line A-A' of FIG. 18. FIG. 21 is an exploded perspective view of a portion of an electronic device according to an embodiment of the present disclosure. FIG. 22 is a cross-sectional view taken along line A-A' of FIG. 19.

[0175] Specifically, FIG. 21 is an exploded perspective view of a head (521) and pin (523) portion of an electronic device (501) according to one embodiment of the present disclosure, and FIG. 22 is a cross-sectional view of a printed circuit board (510) of an electronic device (501) according to one embodiment of the present disclosure taken along line A-A' of FIG. 19.

[0176] The detailed configuration of an electronic device (501) according to an embodiment of the present disclosure not described below may be the same as the detailed configuration of an electronic device (301) according to another embodiment of the present disclosure described with reference to FIGS. 7 to 12 and the detailed configuration of an electronic device (401) according to another embodiment of the present disclosure described with reference to FIGS. 13 to 17.

[0177] According to one embodiment, the printed circuit board (510) may include a guide portion (512). The guide portion (512) may be provided on one surface (the surface facing the +Z direction) of the base portion (511). The guide portion (512) may protrude from one side (the +Z direction side) of the base portion (511). The guide portion (512) may be provided as a separate member from the base portion (511) and mounted on the base portion (511), or may be provided integrally with the base portion (511). A pin (523) may be fixed to the guide portion (512).

[0178] According to one embodiment, the guide portion (512) may include a sub-guide portion (5121; 5122). The sub-guide portion (5121; 5122) may be positioned on one side of the head (521). For example, the sub-guide portion (5121; 5122) may be positioned on the opposite side of the conductor portion (522) with respect to the head (521). However, the position of the sub-guide portion (5121; 5122) may not be limited thereto. For example, the sub-guide portion (5121; 5122) may be positioned in a direction intersecting the longitudinal direction of the cable (520).

[0179] According to one embodiment, at least one pair of sub-guide parts (5121; 5122) may be provided. In one example of one embodiment, the sub-guide parts (5121; 5122) may be provided as a pair. The pair of sub-guide parts (5121; 5122) may be arranged laterally to each other while facing the head (521).

[0180] In one embodiment, the sub-guide portions (5121; 5122) may include a conductive material. For example, a pair of sub-guide portions (5121; 5122) may include a ground terminal (5121) and a signal terminal (5122). The ground terminal (5121) may be a ground connection terminal of a printed circuit board (510), and the signal terminal (5122) may be a signal connection terminal of the printed circuit board (510). The ground terminal (5121) may be electrically connected to the ground portion (5212) by a pin (523) connected to the ground portion (5212), and the signal terminal (5122) may be electrically connected to the signal portion (5213) by a pin (523) connected to the signal portion (5213).

[0181] According to one embodiment, the sub-guide portion (5121; 5122) may include a side surface (512b) inclined relative to the approach direction so that the pin (523) moves in a direction intersecting the approach direction in which the pin (523) approaches the sub-guide portion (5121; 5122). For example, the side surface (512b) of the sub-guide portion (5121; 5122) that the pin (523) approaches and first makes contact with may be inclined in a direction opposite to the direction in which the pin (523) bends or folds as it moves away from the body (5211). In one example according to one embodiment, a pair of pins (523) can be bent in a direction facing each other, and the side surface (512b) that the pins (523) first come into contact with when approaching the sub-guide portion (5121; 5121) can be inclined in a direction that moves away from each other as they move away from the body (5211). Through this structure, in the process of approaching the head (521) to the sub-guide portion (5121; 5122) to fix the pins (523) to the sub-guide portion (5121; 5122), the pins (523) can be naturally elastically deformed along the inclined side surface (512b) of the guide portion (5121; 5122).

[0182] According to one embodiment, the guide portion (512) may include a groove (512a). The groove (512a) may be formed on a side surface of the sub-guide portion (5121; 5122). For example, the groove (512a) may be formed on an area of ​​the side surface of the sub-guide portion (5121; 5122) opposite the head (521). A wedge portion (523a) protruding from the pin (523) may be seated in the groove (512a). Not limited thereto, if the fixing force of the head (521) to the guide portion (512) is secured only by the pin (523) bent in a hook shape surrounding the side surface of the guide portion (512), the groove (512a) may not be formed in the guide portion (512).

[0183] According to one embodiment, the grooves (512a) formed in the pair of sub-guide parts (5121; 5122) may be formed at positions corresponding to the heights of the wedge parts (523a) formed in the pair of pins (523), respectively. For example, as illustrated in FIGS. 20 and 22, when the ground part (5212) is disposed on one side (+Z direction side) of the body (5211) and the signal part (5213) is disposed on the other side (-Z direction side) of the body (5211), and the pair of pins (523) protrude from the ground part (5212) and the signal part (5213), respectively, the heights of the pair of pins (523) may be different from each other. At this time, if the grooves (512a) formed in the pair of sub-guide parts (5121; 5122) are formed to correspond to the heights of the pair of pins (523) of different heights, each pin (523) can be stably fixed to the sub-guide parts (5121; 5122). However, the present invention is not limited thereto, and if the grooves (512a) extend in the height direction from the side of the sub-guide parts (5121; 5122), the wedge portions (523a) of the pins (523) can be fixed to the grooves (512a) regardless of the height of each pin (523). In addition, when at least one of the pair of pins (523) protrudes so as to be inclined in the height direction and the wedge portions (523a) of the pair of pins (523) are arranged at the same height, the heights of the grooves (512a) formed in each of the pair of sub-guide portions (5121; 5122) may be the same.

[0184] According to one embodiment, the body (5211) may include a ground portion (5212) and a signal portion (5213). The ground portion (5212) may be disposed on either one of a surface (a surface facing the +Z direction) and the other surface (a surface facing the -Z direction) of the body (5211). The signal portion (5213) may be disposed on the other of the surface (a surface facing the +Z direction) and the other surface (a surface facing the -Z direction) of the body (5211). In another embodiment, the ground portion (5212) may be disposed on one surface (a surface facing the +Z direction) of the body (5211), and the signal portion (5213) may be disposed on the other surface (a surface facing the -Z direction) of the body (5211). A joining hole (5211b) may be formed at a position where the body (5211), the ground portion (5212), and the signal portion (5213) overlap each other. Through a structure in which the body (5211), the ground portion (5212), and the signal portion (5213) are stacked, the manufacturing of the head (521) can be simplified, and the ground portion (5212) and the signal portion (5213) can be naturally insulated from each other by the body (5211) including an insulating material.

[0185] In one embodiment, the cable (520) may include a pin (523). The pin (523) may protrude laterally from the head (521). The pin (523) may protrude from the head (521) in a direction in which the sub-guide portions (5121; 5122) are arranged. The pin (523) may be fixed to the sub-guide portions (5121; 5122). The pin (523) may be fixed by approaching the sub-guide portions (5121; 5122) laterally.

[0186] According to one embodiment, the pin (523) may include an elastic material. The pin (523) may be elastically deformed during the process of being coupled to the sub-guide portion (5121; 5122).

[0187] According to one embodiment, at least one pair of pins (523) may be provided. In one example according to one embodiment, the pins (523) may be provided as a pair. The pair of pins (523) may be provided in a hook shape that is bent or curved in a direction facing or away from each other so as to be caught and fixed on the sub-guide portions (5121; 5122).

[0188] In one embodiment, as illustrated in FIGS. 18 and 19, a pair of pins (523) may be provided in a hook shape that bends in a direction facing each other. The pair of pins (523) may be fixed to the guide portion (512) by being caught by a pair of sub-guide portions (5121; 5122). Specifically, as the head (521) approaches the sub-guide portions (5121; 5122) from the side, the pair of pins (523) may come into contact with the inclined side surface (512b) of the sub-guide portions (5121; 5122) and then be elastically deformed outward along the inclined side surface (512b). As the head (521) approaches the sub-guide portion (5121; 5122), a pair of pins (523) can be restored and caught on the sub-guide portion (5121; 5122). By the pair of pins (523) being caught on the sub-guide portion (5121; 5122), the position of the head (521) can be guided before the fixing member (530) is engaged.

[0189] According to one embodiment, a pair of pins (523) may include a ground pin (5231) and a signal pin (5232). The ground pin (5231) may be electrically connected to a ground portion (5212), and the signal pin (5232) may be electrically connected to a signal portion (5213). The ground pin (5231) may be formed integrally with the ground portion (5212), and the signal pin (5232) may be formed integrally with the signal portion (5213). By fixing the ground pin (5231) to a ground terminal (5121) of the printed circuit board (510) and connecting the signal pin (5232) to a signal terminal (5122) of the printed circuit board (510), ground and signal connections between the printed circuit board (510) and the cable (520) may be realized.

[0190] According to one embodiment, the pin (523) may include a wedge portion (523a). The wedge portion (523a) may protrude from an end of the pin (523) toward the sub-guide portion (5121; 5122). The wedge portion (523a) may be seated in a groove (512a) formed on a side surface of the sub-guide portion (5121; 5122). As the wedge portion (523a) is seated in the groove (512a), the head (521) may be stably fixed to the printed circuit board (510). In addition, the electrical connection between the printed circuit board (510) and the cable (520) may be stably maintained.

[0191] Through this structure, it is possible to provide a guide and / or a pre-fixing structure for the cable (520) while simultaneously implementing an electrical connection between the printed circuit board (510) and the cable (520), thereby improving manufacturing efficiency.

[0192] Hereinafter, a process of fixing a cable (520) on a printed circuit board (510) in an electronic device (501) according to one embodiment of the present disclosure will be described.

[0193] According to another embodiment, the method of assembling the cable (520) may include a step of approaching the head (521) from one side of the sub-guide portion (5121; 5122). For example, the head (521) may be approached so that the pin (523) and the sub-guide portion (5121; 5122) face each other.

[0194] According to one embodiment, the method of assembling the cable (520) may include a step of securing the pin (523) to the sub-guide portion (5121; 5122). Specifically, in this step, the pin (523) may be fixed to the sub-guide portion (5121; 5122) by being hooked onto the sub-guide portion (5121; 5122). In one example of one embodiment, a pair of pins (523) having a hook shape that is bent to face each other may come into contact with an inclined side surface (512b) of the sub-guide portion (5121; 5122) as the head (521) approaches the sub-guide portion (5121; 5122). As the head (521) approaches the sub-guide portion (5121; 5122), a pair of pins (523) can be splayed outward along the inclined side surface (512b) of the sub-guide portion (5121; 5122). As the head (521) approaches the sub-guide portion (5121; 5122), a pair of pins (523) can be elastically restored inward again, and in this process, a wedge portion (523a) can be seated in a groove (512a) formed in the side surface of the sub-guide portion (5121; 5122). In this way, the cable (520) can be pre-fixed by the pins (523) being caught on the sub-guide portion (5121; 5122) before the fixing member (530) is engaged. At the same time, the cable (520) can be electrically connected to the printed circuit board (510) through the ground terminal (5121) and the signal terminal (5122), and the ground pin (5231) and the signal pin (5232) in contact therewith.

[0195] According to one embodiment, a method of assembling a cable (520) may include a step of coupling a fixing member (530). The fixing member (530) may pass through a coupling hole (5211b) of the body (5211), the ground portion (5212), and the signal portion (5213) from one side (+Z direction side) to the other side (-Z direction side) of the body (5211), and then may be screw-coupled to a boss (B) arranged in an opening (5112) of the base portion (511).

[0196] Unlike the above, in the electronic device (501) according to one embodiment of the present disclosure, the pin (523) may be connected to the body (5211) of the head (521). In addition, the pin (523) may include an insulating material. In addition, the guide portion (512) may include an insulating material. In addition, when the pins (523) are provided in pairs, the pair of pins (523) may be provided at the same height.

[0197] In this case, the electrical connection between the printed circuit board (510) and the cable (520) may be implemented similarly to the electronic device (301) according to an embodiment of the present disclosure described with reference to FIGS. 7 to 12. For example, a ground connection terminal, a pawl nut, may be mounted on the base portion (511) when the fixing member (530) is coupled. At this time, as the fixing member (530) is coupled, the ground portion (5212) is electrically connected to the lower surface of the flange portion (532) of the fixing member (530) and may be ground-connected to a fastening portion (not shown) through the fixing member (530). In addition, the electrical connection between the printed circuit board (510) and the cable (520) may be implemented similarly to the electronic device (401) according to an embodiment of the present disclosure described with reference to FIGS. 13 to 17. For example, both the ground portion (5212) and the signal portion (5213) may be arranged on the other side (-Z direction side) of the body (5211). In addition, a ground pad (not shown) may be arranged on one side (the side facing the +Z direction) of the base portion (511) at a position overlapping the ground portion (5212), and a signal pad (not shown) may be arranged at a position overlapping the signal portion (5213). In this case, by combining the fixing member (530), the ground portion (5212) and the ground pad may be electrically connected, and the signal portion (5213) and the signal pad may be electrically connected.

[0198] Unlike the above, in the electronic device (501) according to one embodiment of the present disclosure, the pin (523) may extend straight toward the guide portion (512) without being bent or folded. The guide portion (512) may have a through hole (not shown) formed therein through which the pin (523) may laterally pass. In this case, as the head (521) approaches the guide portion (512), the pin (523) is inserted into the through hole of the guide portion (512), thereby allowing the cable (520) to be pre-fixed.

[0199] Electronic devices include printed circuit boards and cables. Recently, with the introduction of MIMO technology in 5G and Wi-Fi communication systems, up to seven to nine cables are used in a single product. Furthermore, due to the trend toward thinner and more compact products, cable connectors are becoming increasingly smaller. Previously, these small connectors were assembled by manually pressing them together. However, this method suffered from a high incidence of defective products due to poorly assembled connectors. Furthermore, the high difficulty of the cable assembly process reduced assembly efficiency. Furthermore, the manual pressing of connectors resulted in damage to components surrounding the connectors. Furthermore, the risk of damage to adjacent components limited the placement of components close to the connectors, resulting in reduced space efficiency. Furthermore, separate support ribs were required to secure the cables, which reduced design freedom.

[0200] The problem that this disclosure seeks to solve is to reduce the frequency of defective products occurring due to poor cable assembly.

[0201] The problem that this disclosure seeks to solve is to reduce the difficulty of the assembly process and improve the efficiency of the assembly process.

[0202] The problem that the present disclosure seeks to solve is to prevent damage to components surrounding a connector during the cable assembly process.

[0203] The problem that the present disclosure seeks to solve is to reduce the risk of damage to components around the connector, thereby improving space efficiency by enabling components to be arranged around the connector.

[0204] The problem that the present disclosure seeks to solve is to improve the degree of design freedom by omitting a separate support rib for cable fixation.

[0205] Electronic devices according to various embodiments of the present disclosure can reduce the frequency of occurrence of defective products due to cable assembly defects.

[0206] Electronic devices according to various embodiments of the present disclosure can reduce the difficulty of an assembly process and improve assembly process efficiency.

[0207] An electronic device according to various embodiments of the present disclosure can prevent components surrounding a connector from being damaged during a cable assembly process.

[0208] Electronic devices according to various embodiments of the present disclosure can improve space efficiency by reducing the risk of damage to components around connectors and thereby enabling components to be placed around connectors.

[0209] Electronic devices according to various embodiments of the present disclosure can improve design freedom by omitting separate support ribs for cable fixation.

[0210] An electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a printed circuit board (310; 410; 510).

[0211] An electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a conductor portion (322; 422; 522) and a head (321; 421; 521) provided at an end of the conductor portion (322; 422; 522), and may include a cable (320; 420; 520) electrically connected to the printed circuit board (310; 410; 510) on one surface (a surface facing the +Z direction) of the printed circuit board (310; 410; 510).

[0212] An electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a fixing member (330; 430; 530) that fixes the head (321; 421; 521) to the printed circuit board (310; 410; 510).

[0213] A printed circuit board (310; 410; 510) of an electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a base portion (311; 411; 511) and a guide portion (312; 412; 512) provided on one surface (a surface facing the +Z direction) of the base portion (311; 411; 511) and guiding the head (321; 421; 521) on the printed circuit board (310; 410; 510).

[0214] A head (321; 421; 521) of an electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a body (3211; 4211; 5211), a ground portion (3212; 4212; 5212), and a signal portion (3213; 4213; 5213).

[0215] The body (3211; 4211; 5211) of the electronic device (301; 401; 501) according to one embodiment of the present disclosure may include an insulating material.

[0216] According to one embodiment of the present disclosure, the ground portion (3212; 4212; 5212) and the signal portion (3213; 4213; 5213) of the electronic device (301; 401; 501) may be insulated by the body (3211; 4211; 5211).

[0217] An electronic device (301; 401; 501) according to one embodiment of the present disclosure is a coaxial cable, and the cable (320; 420; 520) can connect the printed circuit board (310; 410; 510) and an antenna.

[0218] The head (321) of the electronic device (301) according to one embodiment of the present disclosure may include a plate-shaped body (3211).

[0219] The guide portion (312) of the electronic device (301) according to one embodiment of the present disclosure may be placed on at least one side among the two sides of the body (3211).

[0220] At least a portion of the body (3211) of the electronic device (301) according to one embodiment of the present disclosure may be mounted on the guide portion (312).

[0221] According to one embodiment of the present disclosure, a rail groove (312a) may be formed on the side of the guide portion (312) of the electronic device (301) facing the head (321) and extending in a direction corresponding to the direction in which the body (3211) extends, and in which at least a portion of the body (3211) is seated.

[0222] The fixing member (330) of the electronic device (301) according to one embodiment of the present disclosure may include a pillar portion (331) penetrating the coupling hole (3211b) of the body (3211), and a flange portion (332) protruding outward from one end (+Z direction side) of the pillar portion (331).

[0223] The head (321) of the electronic device (301) according to one embodiment of the present disclosure may further include a ground portion (3212) and a signal portion (3213).

[0224] According to one embodiment of the present disclosure, one of the ground portion (3212) and the signal portion (3213) of the electronic device (301) is disposed around the coupling hole (3211b) on one side (the side facing the +Z direction) of the body (3211), and may be electrically connected to the printed circuit board (310) by contacting the flange portion (332) of the fixing member (330).

[0225] The printed circuit board (310) of the electronic device (301) according to one embodiment of the present disclosure may include a terminal clip (314) disposed on one surface (the surface facing the +Z direction) of the base portion (311).

[0226] According to one embodiment of the present disclosure, the other of the ground portion (3212) and the signal portion (3213) of the electronic device (301) may be disposed on the other surface (the surface facing the -Z direction) of the body (3211) and electrically connected to the terminal clip (314).

[0227] The guide portion (412) of the electronic device (401) according to one embodiment of the present disclosure may be placed at a position corresponding to the conductor portion (422).

[0228] The conductor portion (422) of the electronic device (401) according to one embodiment of the present disclosure can be fixed to the guide portion (412).

[0229] The head (421) of the electronic device (401) according to one embodiment of the present disclosure may include a body (4211) and a guide pin (4215) protruding from the body (4211) toward the printed circuit board (410).

[0230] In the base portion (411) of the electronic device (401) according to one embodiment of the present disclosure, a guide hole (4111) may be formed at a position corresponding to the guide pin (4215).

[0231] The guide pin (4125) of the electronic device (401) according to one embodiment of the present disclosure can be inserted into the guide hole (4111).

[0232] The head (421) of the electronic device (401) according to one embodiment of the present disclosure may include a body (4211), a ground portion (4212), and a signal portion (4213).

[0233] At least one of the ground portion (4212) or the signal portion (4213) of the electronic device (401) according to one embodiment of the present disclosure may be disposed on a surface of the body (4211) facing the printed circuit board (410).

[0234] The printed circuit board (410) of the electronic device (401) according to one embodiment of the present disclosure may include a terminal pad (414) disposed on one surface (a surface facing the +Z direction) of the base portion (411) corresponding to at least one of the ground portion (4212) or the signal portion (4213).

[0235] At least one of the ground portion (4212) or the signal portion (4213) of the electronic device (401) according to one embodiment of the present disclosure may be electrically connected to the terminal pad (414).

[0236] The head (421) of the electronic device (401) according to one embodiment of the present disclosure may include a body (4211), a ground portion (4212), and a signal portion (4213).

[0237] At least one of the ground portion (4212) or the signal portion (4213) of the electronic device (401) according to one embodiment of the present disclosure may be disposed on a surface of the body (4211) facing the printed circuit board (410).

[0238] The head (421) of the electronic device (401) according to one embodiment of the present disclosure may further include a contact protrusion (4214) protruding toward the printed circuit board (410) from at least one of the ground portion (4212) and the signal portion (4213).

[0239] The guide portion (512) of the electronic device (501) according to one embodiment of the present disclosure may include at least one pair of sub-guide portions (5212; 5122) arranged on one side of the head (521).

[0240] The cable (520) of the electronic device (501) according to one embodiment of the present disclosure may include at least one pair of pins (523) that protrude from the head (521) in the direction in which the sub-guide portion (5121; 5122) is arranged and are fixed to the sub-guide portion (5121; 5122).

[0241] The at least one pair of pins (523) of the electronic device (501) according to one embodiment of the present disclosure may be provided in a hook shape that is bent or curved in a direction facing or moving away from each other so as to be caught and fixed on the sub-guide portion (5121; 5122).

[0242] The pin (523) of the electronic device (501) according to one embodiment of the present disclosure can be laterally approached to the sub-guide portion (5121; 5122) and fixed to the sub-guide portion (5121; 5122).

[0243] The sub-guide portion (5121; 5122) of the electronic device (501) according to one embodiment of the present disclosure may include a side surface (512b) inclined with respect to the approach direction so that the pin (523) moves in a direction crossing the approach direction in which the sub-guide portion (5121; 5122) approaches.

[0244] The pin (523) of the electronic device (501) according to one embodiment of the present disclosure may include a wedge portion (523a) protruding from an end of the pin (523) toward the sub-guide portion (5121; 5122).

[0245] According to one embodiment of the present disclosure, a groove (512a) may be formed on the side of the sub-guide portion (5121; 5122) of the electronic device (501) in which the wedge portion (523a) can be seated.

[0246] The head (521) of the electronic device (501) according to one embodiment of the present disclosure may include a body (5211), a ground portion (5212) disposed on one of one side (the side facing the +Z direction) and the other side (the side facing the -Z direction) of the body (5211), and a signal portion (5213) disposed on the other of one side (the side facing the +Z direction) and the other side (the side facing the -Z direction) of the body (5211).

[0247] According to one embodiment of the present disclosure, one of the pair of pins (523) of the electronic device (501) may be electrically connected to the ground portion (5212), and the other of the pair of pins (523) may be electrically connected to the signal portion (5213).

[0248] According to one embodiment of the present disclosure, one of the pair of sub-guide parts (5121, 5122) of the electronic device (501) may be electrically connected to the ground part (5212) via the pin (523), and the other of the pair of guide parts (512) may be electrically connected to the signal part (5213) via the pin (523).

[0249] An electronic device (301) according to one embodiment of the present disclosure may include a printed circuit board (310).

[0250] An electronic device (301) according to one embodiment of the present disclosure may include a conductor portion (322) and a head (321) provided at an end of the conductor portion (322), and may include a cable (320) electrically connected to the printed circuit board (310) on one surface of the printed circuit board (310).

[0251] An electronic device (301) according to one embodiment of the present disclosure may include a fixing member (330) that fixes the head (321) to the printed circuit board (310).

[0252] A printed circuit board (310) of an electronic device (301) according to one embodiment of the present disclosure may include a base portion (311) and guide portions (312) fixed to the base portion (311) and arranged on both sides of the head (321).

[0253] According to one embodiment of the present disclosure, the head (321) of the electronic device (301) can be guided on the printed circuit board (310) by having both sides of the head (321) mounted on the guide portion (312).

[0254] The head (321) of the electronic device (301) according to one embodiment of the present disclosure may include a body (3211), a ground portion (3212), and a signal portion (3213).

[0255] The body (3211) of the electronic device (301) according to one embodiment of the present disclosure may include an insulating material.

[0256] The ground portion (3212) and the signal portion (3213) of the electronic device (301) according to one embodiment of the present disclosure may be insulated by the body (3211).

[0257] The head (321) of the electronic device (301) according to one embodiment of the present disclosure may include a plate-shaped body (3211).

[0258] According to one embodiment of the present disclosure, a rail groove (312a) may be formed on the side of the guide portion (312) of the electronic device (301) facing the head (321) so as to extend in a direction corresponding to the direction in which the body (3211) extends and in which at least a portion of the body (3211) is seated.

[0259] The fixing member (330) of the electronic device (301) according to one embodiment of the present disclosure may include a pillar portion (331) penetrating the coupling hole (3211b) of the body (3211), and a flange portion (332) protruding outward from one end region of the pillar portion (331).

[0260] An electronic device (301) according to one embodiment of the present disclosure may further include a head (321) and a signal portion (3213).

[0261] According to one embodiment of the present disclosure, one of the ground portion (3212) and the signal portion (3213) of the electronic device (301) is arranged around the coupling hole (3211b) on one surface of the body (3211), and may be electrically connected to the printed circuit board (310) by contacting the flange portion (332) of the fixing member (330).

[0262] The printed circuit board (310) of the electronic device (301) according to one embodiment of the present disclosure may include a terminal clip (314) disposed on one surface of the base portion (311).

[0263] According to one embodiment of the present disclosure, the other of the ground portion (3212) and the signal portion (3213) of the electronic device (301) may be disposed on the other surface of the body (3211) and electrically connected to the terminal clip (314).

[0264] In a method for manufacturing an electronic device (301; 401; 501) according to one embodiment of the present disclosure, the electronic device (301; 401; 501) may include a printed circuit board (310; 410; 510) including a base portion (311; 411; 511) and a guide portion (312; 412; 512) provided on one surface (a surface facing the +Z direction) of the base portion (311; 411; 511).

[0265] In a method for manufacturing an electronic device (301; 401; 501) according to one embodiment of the present disclosure, the electronic device (301; 401; 501) may include a conductor portion (322; 422; 522) and a head (321; 421; 521) provided at an end of the conductor portion (322; 422; 522), and may include a cable (320; 420; 520) electrically connected to the printed circuit board (310; 410; 510) on one side (a side facing the +Z direction) of the printed circuit board (310; 410; 510).

[0266] In a method for manufacturing an electronic device (301; 401; 501) according to one embodiment of the present disclosure, the electronic device (301; 401; 501) may include a fixing member (330; 430; 530) that fixes the head (321; 421; 521) to the printed circuit board (310; 410; 510).

[0267] A method for manufacturing an electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a step of mounting the cable (320; 420; 520) to the guide portion (312; 412; 512).

[0268] A method for manufacturing an electronic device (301; 401; 501) according to one embodiment of the present disclosure may include a step of connecting the fixing member (330; 430; 530) to the printed circuit board (310; 410; 510) by penetrating the head (321; 421; 521).

[0269] In a method for manufacturing an electronic device (301) according to one embodiment of the present disclosure, the head (321) may include a plate-shaped body (3211).

[0270] In a method for manufacturing an electronic device (301) according to one embodiment of the present disclosure, the guide portion (312) may be arranged on at least one side among both sides of the body (3211).

[0271] In a method for manufacturing an electronic device (301) according to one embodiment of the present disclosure, a rail groove (312a) extending in a direction corresponding to the direction in which the plate-shaped body (3211) extends may be formed on a surface of the guide portion (312) facing the head (321).

[0272] In the step of mounting the cable (320) to the guide portion (312) of the method for manufacturing an electronic device (301) according to one embodiment of the present disclosure, at least a portion of the body (3211) can be slidably inserted into the rail groove (312a).

[0273] In a method for manufacturing an electronic device (401) according to one embodiment of the present disclosure, the guide portion (412) may be placed at a position corresponding to the conductor portion (422).

[0274] In the step of fixing the cable (420) to the guide portion (412) in the manufacturing method of the electronic device (401) according to one embodiment of the present disclosure, the conductor portion (422) may be fixed to the guide portion (412).

[0275] In a method for manufacturing an electronic device (401) according to one embodiment of the present disclosure, the head (421) may include a guide pin (4215) protruding toward the base portion (411).

[0276] In a method for manufacturing an electronic device (401) according to one embodiment of the present disclosure, a guide hole (4111) may be formed in the base portion (411) at a position overlapping the guide pin (4215), into which the guide pin (4215) is inserted.

[0277] A method for manufacturing an electronic device (401) according to one embodiment of the present disclosure may further include a step of inserting the guide pin (4215) into the guide hole (4111) before bonding the fixing member (430) to the printed circuit board (410).

[0278] In a method for manufacturing an electronic device (501) according to one embodiment of the present disclosure, the guide portion (512) may include at least one pair of sub-guide portions (5121; 5122) arranged on one side of the head (521).

[0279] In a method for manufacturing an electronic device (501) according to one embodiment of the present disclosure, the cable (520) may include at least one pair of pins (523) that protrude from the head (521) in the direction in which the sub-guide portions (5121; 5122) are arranged.

[0280] In a method for manufacturing an electronic device (501) according to one embodiment of the present disclosure, the pin (523) may be provided in a hook shape that is bent or folded in a direction facing each other or in a direction moving away from each other.

[0281] In the step of fixing the cable (520) to the sub-guide part (5121; 5122) of the manufacturing method of the electronic device (501) according to one embodiment of the present disclosure, the pin (523) can be fixed to the sub-guide part (5121; 5122) by being caught by the sub-guide part (5121; 5122).

[0282] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

In the electronic device (301; 401; 501), Printed circuit board (310; 410; 510); A cable (320; 420; 520) comprising a conductor (322; 422; 522) and a head (321; 421; 521) provided at an end of the conductor (322; 422; 522), and electrically connected to the printed circuit board (310; 410; 510) on one side of the printed circuit board (310; 410; 510); and It includes a fixing member (330; 430; 530) that fixes the head (321; 421; 521) to the printed circuit board (310; 410; 510), An electronic device (301; 401; 501) including a printed circuit board (310; 410; 510) having a base portion (311; 411; 511) and a guide portion (312; 412; 512) provided on one surface of the base portion (311; 411; 511) and guiding the head (321; 421; 521) on the printed circuit board (310; 410; 510). In the first paragraph, The above head (321; 421; 521) includes a body (3211; 4211; 5211), a ground portion (3212; 4212; 5212), and a signal portion (3213; 4213; 5213). The above body (3211; 4211; 5211) includes an insulating material, The above ground portion (3212; 4212; 5212) and the signal portion (3213; 4213; 5213) are insulated by the body (3211; 4211; 5211). The above cable (320; 420; 520) is a coaxial cable, and the cable (320; 420; 520) connects the printed circuit board (310; 410; 510) and the electronic device (301; 401; 501) to the antenna. In claim 1 or 2, The above head (321) includes a plate-shaped body (3211), The above guide part (312) is arranged on at least one side among the two sides of the body (3211), An electronic device (301) in which at least a portion of the body (3211) is mounted on the guide portion (312). In the third paragraph, An electronic device (301) in which a rail groove (312a) is formed on the side of the guide portion (312) facing the head (321) and extending in a direction corresponding to the direction in which the body (3211) extends, and in which at least a portion of the body (3211) is seated. In any one of the second to fourth paragraphs, The above fixed member (330) includes a pillar portion (331) penetrating the joining hole (3211b) of the body (3211), and a flange portion (332) protruding outward from one end of the pillar portion (331). The above head (321) further includes a ground portion (3212) and a signal portion (3213), An electronic device (301) in which one of the ground portion (3212) and the signal portion (3213) is arranged around the coupling hole (3211b) on one side of the body (3211) and is in contact with the flange portion (332) of the fixing member (330) and is electrically connected to the printed circuit board (310). In paragraph 5, The printed circuit board (310) includes a terminal clip (314) arranged on one surface of the base portion (311), An electronic device (301) in which the other of the ground portion (3212) and the signal portion (3213) is disposed on the other surface of the body (3211) and electrically connected to the terminal clip (314). In the first paragraph, The above guide part (412) is placed at a position corresponding to the above conductor part (422), The above conductor (422) is an electronic device (401) fixed to the above guide (412). In the first paragraph, The above head (421) includes a body (4211) and a guide pin (4215) protruding from the body (4211) toward the printed circuit board (410), In the above base portion (411), a guide hole (4111) is formed at a position corresponding to the guide pin (4215), The above guide pin (4125) is an electronic device (401) inserted into the above guide hole (4111). In any one of paragraphs 1, 7 and 8, The above head (421) includes a body (4211), a ground portion (4212), and a signal portion (4213). At least one of the ground portion (4212) or the signal portion (4213) is disposed on the surface of the body (4211) facing the printed circuit board (410), The printed circuit board (410) includes a terminal pad (414) arranged on one surface of the base portion (411) corresponding to at least one of the ground portion (4212) or the signal portion (4213), An electronic device (401) in which at least one of the ground portion (4212) or the signal portion (4213) is electrically connected to the terminal pad (414). In any one of the first and seventh to ninth paragraphs, The above head (421) includes a body (4211), a ground portion (4212), and a signal portion (4213). At least one of the ground portion (4212) or the signal portion (4213) is disposed on the surface of the body (4211) facing the printed circuit board (410), An electronic device (401) wherein the head (421) further includes a contact protrusion (4214) protruding toward the printed circuit board (410) from at least one of the ground portion (4212) or the signal portion (4213). In the first paragraph, The above guide part (512) includes at least one pair of sub-guide parts (5121; 5122) arranged on one side of the head (521), The above cable (520) includes at least one pair of pins (523) that protrude from the head (521) in the direction in which the sub-guide part (5121; 5122) is arranged and are fixed to the sub-guide part (5121; 5122). An electronic device (501) in which at least one pair of pins (523) are provided in a hook shape that is bent or folded in a direction facing or moving away from each other so as to be fixed by being caught on the sub-guide part (5121; 5122). In Article 11, The above pin (523) approaches the sub-guide part (5121; 5122) laterally and is fixed to the sub-guide part (5121; 5122). An electronic device (501) in which the sub-guide portion (5121; 5122) includes a side surface (512b) inclined with respect to the approach direction so that the pin (523) moves in a direction intersecting the approach direction in which the sub-guide portion (5121; 5122) approaches. In paragraph 11 or 12, The above pin (523) includes a wedge portion (523a) protruding from the end of the pin (523) toward the sub-guide portion (5121; 5122), An electronic device (501) in which a groove (512a) is formed on the side of the above sub-guide portion (5121, 5122) in which the wedge portion (523a) can be seated. In any one of Articles 11 to 13, The above head (521) includes a body (5211), a ground portion (5212) arranged on one of one side and the other side of the body (5211), and a signal portion (5213) arranged on the other of one side and the other side of the body (5211). An electronic device (501) wherein one of the pair of pins (523) is electrically connected to the ground portion (5212), and the other of the pair of pins (523) is electrically connected to the signal portion (5213). In Article 14, An electronic device (501) wherein one of the pair of sub-guide parts (5121; 5122) is electrically connected to the ground part (5212) via the pin (523), and the other of the pair of guide parts (512) is electrically connected to the signal part (5213) via the pin (523).

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