Light source apparatus and method for manufacturing light source apparatus

Abstract

This light source apparatus may comprise: a substrate; a light-emitting diode on the substrate; and an optical dome which covers the light-emitting diode and is disposed on the substrate. The substrate may include: a first electrode pad provided to receive a positive voltage; a second electrode pad provided to receive a negative voltage and spaced apart from the first electrode pad in a first direction; a third electrode pad spaced apart from the first electrode pad in a second direction intersecting the first direction; and a fourth electrode pad spaced apart from the second electrode pad in the second direction.

Description

Light source device and method for manufacturing the light source device

[0001] Some embodiments of the present disclosure relate to a light source device and a method of manufacturing the light source device.

[0002] In general, a display device is a type of output device that converts acquired or stored electrical information into visual information and displays it to the user, and is used in various fields such as homes and businesses.

[0003] The display device may include a monitor device connected to a personal computer (PC) or a server computer, a portable computer device, a navigation terminal device, a general television device, an Internet Protocol television (IPTV) device, a smart phone, a tablet PC, a personal digital assistant (PDA), or a portable terminal device such as a cellular phone, various display devices used to play images such as advertisements or movies in industrial settings, or various types of audio / video systems.

[0004] A display device (whether a self-luminous display or a non-luminous display) may include a light source device to convert electrical information into visual information, and the light source device may include a plurality of light sources for independently emitting light. Each of the plurality of light sources may include, for example, a light emitting diode (LED) or an organic light emitting diode (OLED).

[0005] In particular, local dimming technology is applied to the light source device (backlight unit) of a non-luminous display to improve the contrast ratio of the image. The multiple light sources are divided into multiple dimming blocks, and the driving element can control the driving current supplied to the light sources included in one or more dimming blocks.

[0006] The driving elements and light sources (e.g., light emitting diodes) can be mounted on the substrate using surface mount technology (SMT).

[0007] Even if the number of light-emitting diodes fixed on the substrate is the same, the number of light-emitting diodes included in the dimming block varies depending on the resolution, and the number of wiring arrangements and driving elements also varies, so various types of substrates are required depending on the resolution.

[0008] According to one aspect of the disclosed invention, a light source device capable of implementing various resolutions using one substrate and a method of manufacturing the same can be provided.

[0009] According to one aspect of the disclosed invention, a light source device and a method for manufacturing the same can be provided, in which the types of substrates can be reduced, the number of production lines can be reduced, and the ease of managing substrates can be increased.

[0010] According to one aspect of the disclosed invention, a light source device and a manufacturing method thereof can be provided that can increase the manufacturing efficiency of the light source device.

[0011] According to some embodiments of the present disclosure, a light source device having improved brightness and image quality compared to the same driving voltage and a method of manufacturing the same can be provided.

[0012] A light source device according to some embodiments of the present disclosure may be provided, and may include: a substrate; at least one light emitting diode on the substrate; and an optical dome on the substrate covering the at least one light emitting diode; wherein the substrate may include: a first electrode pad configured to receive a positive voltage; a second electrode pad configured to receive a negative voltage and spaced apart from the first electrode pad in a first direction; a third electrode pad spaced apart from the first electrode pad in a second direction intersecting the first direction; and a fourth electrode pad spaced apart from the second electrode pad in the second direction.

[0013] A method of manufacturing a light source device according to some embodiments of the present disclosure may be provided, and may include: arranging a mask on a substrate; applying solder to the mask; separating the mask from the substrate; mounting the at least one light emitting diode on the substrate; and covering the at least one light emitting diode with at least one optical dome; wherein the substrate may include a first electrode pad configured to receive a positive voltage; a second electrode pad configured to receive a negative voltage and spaced apart from the first electrode pad in a first direction; a third electrode pad spaced apart from the first electrode pad in a second direction intersecting the first direction; and a fourth electrode pad spaced apart from the second electrode pad in the second direction.

[0014] A method of manufacturing a light source device according to some embodiments of the present disclosure may be provided, and may include providing at least one light emitting diode on a substrate; and providing an optical dome on the substrate that covers the at least one light emitting diode; wherein the substrate may include a first electrode pad configured to receive a positive voltage; a second electrode pad configured to receive a negative voltage and spaced apart from the first electrode pad in a first direction; a third electrode pad spaced apart from the first electrode pad in a second direction intersecting the first direction; and a fourth electrode pad spaced apart from the second electrode pad in the second direction.

[0015] The aspects of the technical problems solved by the embodiments of the present disclosure are not limited to the technical problems and ideas mentioned above, and other aspects of the technical problems solved by the embodiments of the present disclosure that are not mentioned above will be clearly understood by a person having ordinary skill in the technical field to which the present invention pertains from the description below.

[0016] FIG. 1 illustrates an example of the appearance of a display device according to one embodiment.

[0017] FIG. 2 illustrates an example of the structure of a display device according to one embodiment.

[0018] FIG. 3 illustrates an example of the structure of a display panel according to one embodiment.

[0019] Fig. 4 illustrates an example of the structure of a light source device according to one embodiment.

[0020] FIG. 5 is a drawing for explaining that a plurality of light sources are divided into a plurality of dimming blocks according to one embodiment.

[0021] Figure 6 is a control block diagram of a display device according to one embodiment.

[0022] Fig. 7 illustrates a connection structure of a dimming driver, a driving element, and a dimming block according to one embodiment.

[0023] FIG. 8 is a perspective view of an example of a light source device according to one embodiment.

[0024] Fig. 9 is an exploded view of the light source device illustrated in Fig. 8.

[0025] Figures 10A-D schematically illustrate the manufacturing process of the light source device illustrated in Figure 8.

[0026] Figure 11 shows a cross-section along line A-A' shown in Figure 10D.

[0027] Fig. 12 is a perspective view of an example of a light source device according to one embodiment.

[0028] Fig. 13 is an exploded view of the light source device illustrated in Fig. 12.

[0029] Figures 14A-D schematically illustrate the manufacturing process of the light source device illustrated in Figure 12.

[0030] Figure 15 shows a cross-section along line B-B' shown in Figure 14D.

[0031] Figure 16 shows a cross-section along the line C-C' shown in Figure 14D.

[0032] Fig. 17 is a perspective view of an example of a light source device according to one embodiment.

[0033] Fig. 18 is an exploded view of the light source device illustrated in Fig. 17.

[0034] Figures 19A-D schematically illustrate the manufacturing process of the light source device illustrated in Figure 17.

[0035] Figure 20 shows a cross-section along line D-D' shown in Figure 19D.

[0036] Figure 21 shows a cross-section along line E-E' shown in Figure 19D.

[0037] Fig. 22 illustrates an example of a method for manufacturing a light source device according to one embodiment.

[0038] It should be understood that the embodiments and terminology used in this document are not intended to limit the embodiments of the present disclosure to specific embodiments, but rather to encompass various modifications, equivalents, or alternatives of the embodiments.

[0039] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0040] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0041] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0042] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0043] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0044] When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0045] In this disclosure, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0046] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0047] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0048] The terms "part," "module," and "member" may be implemented in hardware or software. Depending on the embodiments, multiple "parts," "modules," or "members" may be implemented as a single component, or a single "part," "module," or "member" may include multiple components.

[0049] Additionally, terms such as "~part", "~device", "~block", "~absence", and "~module" may refer to a unit that processes at least one function or operation. For example, the terms may refer to at least one hardware such as an FPGA (field-programmable gate array) / ASIC (application specific integrated circuit), at least one software stored in a memory, and / or at least one process processed by a processor.

[0050] The symbols attached to each step are used to identify each step and do not indicate the order of the steps, and the steps may be performed in a different order than stated unless the context clearly indicates a specific order.

[0051] Hereinafter, non-limiting embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0052] FIG. 1 illustrates an example of the appearance of a display device according to one embodiment.

[0053] The display device (1) may be a device capable of processing an image signal received from the outside and visually displaying the processed image. In the following, a case in which the display device (1) is a television (TV) is provided as an example, but the embodiments of the present disclosure are not limited thereto. For example, the display device (1) may be implemented in various forms such as a monitor, a portable multimedia device, a portable communication device, etc., and as long as the display device (1) is a device provided to visually display an image, the form of the display device (1) is not limited.

[0054] The display device (1) may be a large format display (LFD) installed outdoors, such as on a building rooftop or a bus stop. Here, "outdoors" is not necessarily limited to the outdoors, and the display device (1) according to one embodiment may be installed in any indoor location where people can enter and exit, such as a subway station, shopping mall, movie theater, company, or store.

[0055] The display device (1) can receive content data including video data and audio data from various content sources, and output video and audio corresponding to the video data and audio data. For example, the display device (1) can receive content data via a broadcast reception antenna or a wired cable, receive content data from a content playback device, or receive content data from a content provider's content provision server.

[0056] As illustrated in Fig. 1, the display device (1) may include a main body (11) and a screen (12) for displaying an image (I). The display device (1) may further include a support provided at the lower portion of the main body (11) to support the main body (11).

[0057] The main body (11) forms the outer shape of the display device (1), and components for displaying an image (I) or performing various functions may be provided inside the main body (11). The main body (11) illustrated in Fig. 1 has a flat plate shape, but the shape of the main body (11) is not limited to that illustrated in Fig. 1. For example, the main body (11) may have a curved plate shape.

[0058] The screen (12) is formed on the front of the main body (11) and can display an image (I). For example, the screen (12) can display a still image or a moving image. In addition, the screen (12) can display a two-dimensional (2D) flat image or a three-dimensional (D) stereoscopic image using the parallax of the user's two eyes.

[0059] A plurality of pixels (P) are formed on the screen (12), and an image (I) displayed on the screen (12) can be formed by light emitted from each of the plurality of pixels (P). For example, an image (I) can be formed on the screen (12) by combining the light emitted from the plurality of pixels (P) like a mosaic.

[0060] Each of the plurality of pixels (P) can emit light of various brightness and colors. For example, each of the plurality of pixels (P) can include a self-luminous panel (e.g., a light-emitting diode panel) that can directly emit light, or a non-luminous panel (e.g., a liquid crystal panel) that can pass through or block light emitted by a light source device or the like.

[0061] To emit light of different colors, each of the plurality of pixels (P) may include sub-pixels.

[0062] Sub-pixels are red sub-pixels (P) that can emit red light. R ) and a green sub-pixel (P) capable of emitting green light. G ) and a blue sub-pixel (P) capable of emitting blue light. B ) can include. For example, red light can be light with a wavelength of approximately 620 nm (nanometer, one billionth of a meter) to 750 nm, green light can be light with a wavelength of approximately 495 nm to 570 nm, and blue light can be light with a wavelength of approximately 450 nm to 495 nm.

[0063] Red subpixel (P R ) of the red light, green sub-pixel (P G ) of the green and blue sub-pixels (P B ) by a combination of blue light, light of various brightness and colors can be emitted from each of the plurality of pixels (P).

[0064] FIG. 2 illustrates an example of the structure of a display device according to one embodiment.

[0065] As illustrated in FIG. 2, the display device (1) may include various components for generating an image (I) on the screen (12).

[0066] The display device (1) may include a light source device (40). The light source device (40) may provide light to a display panel (20) to be described later.

[0067] For example, the light source device (40) may be a surface light source. For example, the light source device (40) may include a point light source that emits monochromatic light or white light, and may refract, reflect, and scatter light to convert light emitted from the point light source into uniform surface light. The light source device (40) may emit uniform surface light by refracting, reflecting, and scattering light emitted from the light source.

[0068] The configuration of the light source device (40) is described in more detail below.

[0069] The display device (1) may include a display panel (20). The display panel (20) may block or transmit light emitted from a light source device (40). The display panel (20) may block or transmit light emitted from the light source device (40) to form an image (I). The display panel (20) may be provided in front of the light source device (40) (for example, in the + X direction).

[0070] The front surface of the display panel (20) can form a screen (12) of the display device (1). The display panel (20) can form a plurality of pixels (P). Each of the plurality of pixels (P) can independently block or transmit light from a light source device (40). Light transmitted by the plurality of pixels (P) can form an image (I) displayed on the screen (12).

[0071] On one side of the display panel (20), a cable (20a) for transmitting image data to the display panel (20) and a display driver integrated circuit (DDI) (30) (hereinafter referred to as a 'panel driver') for processing digital image data and outputting an analog image signal may be provided.

[0072] The cable (20a) can electrically connect the control assembly (50) and / or the power assembly (60) and the panel driver (30). The cable (20a) can electrically connect the panel driver (30) and the display panel (20). For example, the cable (20a) can include a flexible flat cable or a film cable that can be bent.

[0073] The panel driver (30) can receive image data and power from the control assembly (50) and / or the power assembly (60) via the cable (20a). The panel driver (30) can provide image data and driving current to the display panel (20) via the cable (20a).

[0074] The cable (20a) and the panel driver (30) may be provided as an integrated unit. For example, the cable (20a) and the panel driver (30) may be implemented as a film cable, a chip on film (COF), a tape carrier packet (TCP), etc. In other words, the panel driver (30) may be placed on the cable (20a). However, the embodiments of the present disclosure are not limited thereto, and the panel driver (30) may be placed on the display panel (20).

[0075] The display device (1) may include a control assembly (50) that controls the operation of the light source device (40) and / or the display panel (20). The control assembly (50) may include a control circuit that controls the operation of the display panel (20) and / or the light source device (40). For example, the control circuit may process image data received from an external content source. For example, the control circuit may transmit image data to the display panel (20). For example, the control circuit may transmit dimming data to the light source device (40).

[0076] The display device (1) may include a power assembly (60) that supplies power to the light source device (40) and / or the display panel (20). The power assembly (60) may include a power circuit to supply power to the light source device (40) and / or the display panel (20).

[0077] The control assembly (50) and the power assembly (60) may be implemented as printed circuit boards and various circuits mounted on the printed circuit boards. For example, the control circuit may include memory, a processor, and a control circuit board on which these are mounted. For example, the power circuit may include capacitors, coils, resistors, a processor, and the like, and a power circuit board on which these are mounted.

[0078] The display device (1) may include a chassis for supporting and fixing a display panel (20), a light source device (40), a control assembly (50), and / or a power assembly (60). The body (11) may include the chassis. For example, the chassis may include at least one of a bezel (13), a frame middle mold (14), a bottom chassis (15), or a rear cover (16).

[0079] FIG. 3 illustrates an example of the structure of a display panel according to one embodiment.

[0080] For example, referring to FIG. 3, the display panel (20) may include a first polarizing film (21), a first transparent substrate (22), a pixel electrode (23), a thin film transistor (24), a liquid crystal layer (25), a common electrode (26), a color filter (27), a second transparent substrate (28), and a second polarizing film (29).

[0081] The first transparent substrate (22) and the second transparent substrate (28) can fix and support the pixel electrode (23), the thin film transistor (24), the liquid crystal layer (25), the common electrode (26), and the color filter (27). For example, the first transparent substrate (22) and the second transparent substrate (28) can be made of reinforced glass or transparent resin.

[0082] A first polarizing film (21) and a second polarizing film (29) are provided on the outer side of the first transparent substrate (22) and the second transparent substrate (28).

[0083] The first polarizing film (21) and the second polarizing film (29) can each transmit specific light and block other light. For example, the polarization direction of the light transmitted by the first polarizing film (21) and the polarization direction of the light transmitted by the second polarizing film (29) can be orthogonal to each other. As a result, light generally cannot simultaneously transmit through the first polarizing film (21) and the second polarizing film (29).

[0084] A color filter (27) may be provided on the inner side of the second transparent substrate (28).

[0085] The color filter (27) may include, for example, a red filter (27R) that passes red light, a green filter (27G) that passes green light, and a blue filter (27G) that passes blue light. The red filter (27R), the green filter (27G), and the blue filter (27B) may be arranged parallel to each other. The area where the color filter (27) is formed may correspond to a pixel (P). The area where the red filter (27R) is formed may correspond to a red sub-pixel (P). R) can correspond to the green sub-pixel (P). The area where the green filter (27G) is formed is a green sub-pixel (P G ) can correspond to the blue sub-pixel (P). The area where the blue filter (27B) is formed is a blue sub-pixel (P B ) can be corresponded to.

[0086] A pixel electrode (23) may be provided on the inner side of the first transparent substrate (22). A common electrode (26) may be provided on the inner side of the second transparent substrate (28).

[0087] The pixel electrode (23) and the common electrode (26) are made of a metal material that conducts electricity, and can generate an electric field to change the arrangement of liquid crystal molecules (25a) that constitute the liquid crystal layer (25) described below.

[0088] The pixel electrode (23) and the common electrode (26) are made of a transparent material and can transmit light incident from the outside. For example, the pixel electrode (23) and the common electrode (26) may be made of indium tin oxide (ITO), indium zinc oxide (IZO), silver nanowire (Ag nanowire), carbon nanotube (CNT), graphene, or PEDOT (3,4-ethylenedioxythiophene).

[0089] A thin film transistor (TFT) (24) may be provided on the inner side of the second transparent substrate (28).

[0090] The thin film transistor (24) can pass or block current flowing through the pixel electrode (23). For example, an electric field can be formed or removed between the pixel electrode (23) and the common electrode (26) depending on whether the thin film transistor (24) is turned on (e.g., closed) or turned off (e.g., opened).

[0091] The thin film transistor (24) can be composed of polysilicon and can be formed by a semiconductor process such as lithography, deposition, or ion implantation.

[0092] A liquid crystal layer (25) may be formed between the pixel electrode (23) and the common electrode (26). The liquid crystal layer (25) may be filled with liquid crystal molecules (25a).

[0093] Liquid crystals exhibit a state intermediate between that of a solid (e.g., a crystal) and a liquid. Most liquid crystal substances can be organic compounds, their molecular shapes can be elongated and thin, and their molecular arrangement can resemble an irregular state in some directions, but a regular crystalline structure in others. As a result, liquid crystals possess both the fluidity of a liquid and the optical anisotropy of a crystal (solid).

[0094] Liquid crystals also exhibit optical properties depending on changes in the electric field. For example, the direction of the arrangement of molecules constituting the liquid crystal may change depending on changes in the electric field. When an electric field is generated in the liquid crystal layer (25), the liquid crystal molecules (25a) of the liquid crystal layer (25) are arranged according to the direction of the electric field. When an electric field is not generated in the liquid crystal layer (25), the liquid crystal molecules (25a) may be arranged irregularly or along the alignment layer. As a result, the optical properties of the liquid crystal layer (25) may vary depending on the presence or absence of an electric field passing through the liquid crystal layer (25).

[0095] Fig. 4 illustrates an example of the structure of a light source device according to one embodiment. Fig. 5 is a drawing for explaining that a plurality of light sources according to one embodiment are divided into a plurality of dimming blocks.

[0096] Referring to FIG. 4, the light source device (40) may include a light source module (41) that generates light. The light source device (40) may include a reflective sheet (42) that reflects light. The light source device (40) may include a diffuser plate (43) that uniformly diffuses light. The light source device (40) may include an optical sheet (44) that improves the brightness of the emitted light.

[0097] The light source module (41) may include a plurality of light sources (200) that emit light. The light source module (41) may include a substrate (100) that supports and / or fixes the plurality of light sources (200).

[0098] A plurality of light sources (200) may be arranged in a predetermined pattern so that light is emitted with uniform brightness. The plurality of light sources (200) may be arranged so that the distance between one light source and its adjacent light sources is the same.

[0099] For example, as illustrated in FIG. 4, a plurality of light sources (200) may be arranged in rows and columns. For example, a plurality of light sources (200) may be arranged so that a substantially square is formed by four adjacent light sources. In addition, a single light source may be arranged adjacent to four light sources, and the distance between a single light source and the four adjacent light sources may be substantially the same.

[0100] In some embodiments, a plurality of light sources (200) may be arranged such that an equilateral triangle is substantially formed by three adjacent light sources. In this case, one light source may be arranged adjacent to six light sources. Additionally, the distance between one light source and the six adjacent light sources may be approximately equal.

[0101] However, the arrangement of the plurality of light sources (200) is not limited to the arrangement described above, and the plurality of light sources (200) can be arranged in various ways so that light is emitted with uniform brightness.

[0102] The light source (200) may employ a device that, when supplied with power, can emit monochromatic light (light of a specific wavelength, for example, blue light) or white light (for example, light mixed with red light, green light, and blue light) in various directions. For example, the light source (200) may include a light emitting diode (LED) (210, see FIG. 7). The light emitting diode (210) may be implemented in various sizes, and may include, for example, a mini LED and / or a micro LED.

[0103] The substrate (100) can fix a plurality of light sources (200) so that the positions of the light sources (200) do not change. In addition, the substrate (100) can supply power to each light source (200) for emitting light.

[0104] The substrate (100) may include a synthetic resin and / or reinforced glass and / or a printed circuit board (PCB) on which a plurality of light sources (200) are fixed and conductive power supply lines for supplying power to the light sources (200) are formed.

[0105] Various types of wiring for supplying power to the light source (200) can be formed on the substrate (100). To form various types of wiring on the substrate (100), the printed circuit board can be formed of multiple layers.

[0106] The reflective sheet (42) can reflect light emitted from a plurality of light sources (200). For example, the reflective sheet (42) can reflect light emitted from a plurality of light sources (200) forward or in a direction close to the forward direction.

[0107] The reflective sheet (42) may include a plurality of through holes (42a) corresponding to each of the plurality of light sources (200) of the light source module (41). Each of the light sources (200) of the light source module (41) may pass through each of the through holes (42a) and protrude forward of the reflective sheet (42). For example, each of the plurality of light sources (200) of the light source module (41) may be inserted into a plurality of through holes (42a) formed in the reflective sheet (42). For example, each of the plurality of light sources (200) of the light source module (41) may be inserted into a plurality of through holes (42a) formed in the reflective sheet (42).

[0108] The plurality of light sources (200) can each emit light in various directions. Light can be emitted from the light source (200) toward the diffuser plate (43) as well as from the light source (200) toward the reflective sheet (42), and the reflective sheet (42) can reflect the light emitted toward the reflective sheet (42) toward the diffuser plate (43).

[0109] Light emitted from a light source (200) passes through various objects such as a diffuser plate (43) and an optical sheet (44). When light passes through the diffuser plate (43) and the optical sheet (44), some of the incident light is reflected from the surfaces of the diffuser plate (43) and the optical sheet (44). The reflective sheet (42) can reflect the light reflected by the diffuser plate (43) and the optical sheet (44).

[0110] A diffusion plate (43) is provided in front (e.g., in the + X direction) of the light source module (41) and the reflective sheet (42), so as to evenly disperse the light emitted from the light source (200) of the light source module (41).

[0111] The diffuser (43) can diffuse light emitted from multiple light sources (200) within the diffuser (43) to eliminate unevenness in brightness. In other words, the diffuser (43) can uniformly emit uneven light from multiple light sources (200).

[0112] The optical sheet (44) may include various sheets for improving brightness and uniformity of brightness. For example, the optical sheet (44) may include at least one of a diffusion sheet (44a), a first prism sheet (44b), a second prism sheet (44c), and a reflective polarizing sheet (44d).

[0113] The diffusion sheet (44a) diffuses light to ensure uniformity of brightness. Light emitted from the light source (200) is diffused by the diffusion plate (43) and can be diffused again by the diffusion sheet (44a) included in the optical sheet (44).

[0114] The first prism sheet (44b) and the second prism sheet (44c) can increase brightness by concentrating light diffused by the diffusion sheet (44a). For example, the first prism sheet (44b) and the second prism sheet (44c) can include a prism pattern that can have a triangular prism shape, and a plurality of these prism patterns can be adjacently arranged to form a plurality of band shapes.

[0115] The reflective polarizing sheet (44d) is a type of polarizing film that can transmit some of the incident light and reflect the other part to improve brightness. For example, it can transmit polarized light having the same direction as the predetermined polarization direction of the reflective polarizing sheet (44d) and reflect polarized light having a different direction from the polarization direction of the reflective polarizing sheet (44d). In addition, the light reflected by the reflective polarizing sheet (44d) is recycled within the light source device (40), and the brightness of the display device (1) can be improved by this light recycling.

[0116] The optical sheet (44) is not limited to the sheet or film illustrated in FIG. 4, and may include a wider variety of sheets or films, such as a protective sheet.

[0117] The light source device (40) includes a plurality of light sources (200) and can output surface light by diffusing light emitted from the plurality of light sources (200). The display panel (20) includes a plurality of pixels and can control the plurality of pixels to allow light to pass through or block light, respectively. An image (I) can be formed by light passing through each of the plurality of pixels.

[0118] At this time, the display device (1) can perform local dimming, which varies the brightness of light in each area of ​​the light source device (40) in conjunction with the output image, so as to improve power consumption while increasing the contrast ratio.

[0119] For example, the display device (1) can reduce the brightness of the light of the light source (200) of the light source device (40) corresponding to the dark portion of the image in order to darken the dark portion of the image, and can increase the brightness of the light of the light source (200) of the light source device (40) corresponding to the bright portion of the image in order to brighten the bright portion of the image. As a result, the contrast ratio or brightness ratio of the image can be improved.

[0120] The light source device (40) of the display device (1) can be divided into a plurality of blocks, and the display device (1) can independently control the current for each block according to the input image. The image transmission of the display device (1) can be performed by a method of local dimming driving for each frame, and the current driving can be controlled according to the number of blocks of the divided light sources (200) in the light source device (40).

[0121] As a result, the display device (1) can effectively improve the contrast ratio by lowering the supply current to the dimming block corresponding to the dark area of ​​the input image and increasing the supply current to the dimming block corresponding to the bright area of ​​the input image.

[0122] For local dimming, a plurality of light sources (200) included in the light source device (40) can be classified into a plurality of dimming blocks (300).

[0123] According to various embodiments, the k light sources (200) may be classified into n dimming blocks or m dimming blocks (k, n, m are natural numbers). For example, the k light sources (200) may be classified into n dimming blocks, each of which includes k / n light sources (200). k / n means a value obtained by dividing k by n. As another example, the k light sources (200) may be classified into m dimming blocks, each of which includes k / m light sources (200). k / m means a value obtained by dividing k by m. Here, n and m may be different, and k may be a multiple of n and m.

[0124] For example, if k is 120, n can be 20, m can be 10, and the 120 light sources (200) can be classified into 20 dimming blocks, each containing 6 light sources (200), or into 10 dimming blocks, each containing 12 light sources (200).

[0125] The k / n or k / m light sources (200) included in each dimming block can be arranged in a matrix form. The matrix in which the k / n or k / m light sources (200) included in each dimming block are arranged can have the same number of rows or the same number of columns.

[0126] According to various embodiments, k / n may be 9 or less, and k / m may be 12 or more. That is, the plurality of light sources (200) may be divided into dimming blocks, each of which has 9 or less LEDs, or dimming blocks, each of which has 12 or more LEDs.

[0127] Referring to FIG. 5, each of the plurality of dimming blocks (300) may include at least one light source (200). The light source device (40) may supply the same driving current to the light sources (200) belonging to the same dimming block (300), and the light sources (200) belonging to the same dimming block (300) may emit light of the same brightness.

[0128] In addition, the light source device (40) can supply different driving currents to light sources (200) belonging to different dimming blocks (300) according to dimming data, and the light sources (200) belonging to different dimming blocks (300) can emit light of different brightness.

[0129] Each of the plurality of dimming blocks (300) may include, for example, N*M light sources (200) arranged in the form of an N*M matrix (N and M are natural numbers). An N*M matrix means a matrix having N rows and M columns.

[0130] Figure 6 is a control block diagram of a display device according to one embodiment.

[0131] Referring to FIG. 6, the display device (1) may include a content receiving unit (80), an image processing unit (90), a panel driver (30), a display panel (20), a dimming driver (70), and a light source device (40).

[0132] The content receiving unit (80) may include a receiving terminal (81) and a tuner (82) that receive content including video signals and / or audio signals from content sources.

[0133] The receiving terminal (81) can receive video signals and audio signals from content sources via a cable. For example, the receiving terminal (81) can include a component (YPbPr / RGB) terminal, a composite video blanking and sync (CVBS) terminal, an audio terminal, a High Definition Multimedia Interface (HDMI) terminal, a Universal Serial Bus (USB) terminal, etc.

[0134] The tuner (82) can receive broadcast signals from a broadcast reception antenna or a wired cable. In addition, the tuner (82) can extract broadcast signals of a channel selected by the user from among the broadcast signals. For example, the tuner (82) can pass broadcast signals having a frequency corresponding to the channel selected by the user among a plurality of broadcast signals received through a broadcast reception antenna or a wired cable, and block broadcast signals having other frequencies.

[0135] In this way, the content receiving unit (80) can receive video signals and audio signals from content sources through the receiving terminal (81) and / or the tuner (82). The content receiving unit (80) can output the video signals and / or audio signals received through the receiving terminal (81) and / or the tuner (82) to the image processing unit (90).

[0136] The image processing unit (90) may include a processor (91) that processes image data and a memory (92) that stores / remembers a program and data for processing the image data.

[0137] The memory (92) can store programs and data for processing video signals and / or audio signals. In addition, the memory (92) can temporarily store data generated while processing the video signal and / or audio signal.

[0138] Memory (92) may include non-volatile memory such as ROM (Read Only Memory) and flash memory, and volatile memory such as S-RAM (Static Random Access Memory, S-RAM) and D-RAM (Dynamic Random Access Memory).

[0139] The processor (91) can receive a video signal and / or an audio signal from the content receiving unit (80). The processor (91) can decode the video signal into image data. The processor (91) can generate dimming data from the image data. In addition, the processor (91) can output the image data and dimming data to the panel driver (30) and the dimming driver (70), respectively.

[0140] In this way, the image processing unit (90) can generate image data and dimming data from the video signal acquired by the content receiving unit (80). In addition, the image processing unit (90) can transmit the image data and dimming data to the display panel (20) and the light source device (40), respectively.

[0141] Image data may include information regarding the intensity of light transmitted by each of a plurality of pixels (or a plurality of sub-pixels) included in the display panel (20). The image data may be provided to the display panel (20) via a panel driver (30).

[0142] The display panel (20) includes a plurality of pixels that can transmit or block light, and the plurality of pixels are arranged in a matrix form. In other words, the plurality of pixels can be arranged in a plurality of rows and a plurality of columns.

[0143] The panel driver (30) can receive image data from the image processing unit (90). The panel driver (30) can drive the display panel (20) according to the image data. In other words, the panel driver (30) can convert image data, which may be a digital signal (hereinafter referred to as “digital image data”), into an analog image signal, which may be an analog voltage signal. The panel driver (30) can provide the converted analog image signal to the display panel (20). Depending on the analog image signal, the optical properties (e.g., light transmittance) of a plurality of pixels included in the display panel (20) can change.

[0144] The panel driver (30) may include, for example, a timing controller, a data driver, a scan driver, etc.

[0145] The timing controller can receive image data from the image processing unit (90). The timing controller can output image data and a driving control signal to the data driver and the scan driver. The driving control signal can include a scan control signal and a data control signal. The scan control signal and the data control signal can be used to control the operation of the scan driver and the operation of the data driver, respectively.

[0146] The scan driver can receive a scan control signal from the timing controller. The scan driver can activate input of any one of a plurality of rows on the display panel (20) according to the scan control signal. In other words, the scan driver can convert pixels included in any one of a plurality of pixels arranged in a plurality of rows and a plurality of columns into a state capable of receiving an analog image signal. At this time, pixels other than the pixels whose input is activated by the scan driver may not be able to receive an analog image signal.

[0147] The data driver can receive image data and a data control signal from the timing controller. The data driver can output the image data to the display panel (20) according to the data control signal. For example, the data driver can receive digital image data from the timing controller. The data driver can convert the digital image data into an analog image signal. In addition, the data driver can provide an analog image signal to pixels included in a row that is input-activated by the scan driver. At this time, the pixels whose input is activated by the scan driver can receive the analog image signal. The optical properties (e.g., light transmittance) of the pixels whose input is activated change according to the received analog image signal.

[0148] In this way, the panel driver (30) can drive the display panel (20) according to the image data. As a result, an image corresponding to the image data can be displayed on the display panel (20).

[0149] The dimming driver (70) can control the light source device (40).

[0150] Dimming data may include information regarding the intensity of light emitted by each of the plurality of light sources (200) (or the plurality of dimming blocks (300)) included in the light source device (40). The dimming data may be provided to the light source device (40) via the dimming driver (70).

[0151] The light source device (40) can turn off a plurality of light sources corresponding to dark portions of the image to darken the dark portions of the image. As a result, the contrast ratio of the image can be improved by darkening the dark portions of the image further.

[0152] In this way, the operation of controlling the plurality of light sources so that the light source device (40) emits light in an area corresponding to a bright part of the image and controlling the plurality of light sources so that they do not emit light in an area corresponding to a dark part of the image is referred to as “local dimming” below.

[0153] For local dimming, a plurality of light sources (200) included in the light source device (40) can be divided into a plurality of dimming blocks (300) as illustrated in FIG. 5. In FIG. 5, a total of 48 dimming blocks in 6 rows and 8 columns are illustrated, but the number and arrangement of the dimming blocks are not limited to those illustrated in FIG. 5.

[0154] Each of the plurality of dimming blocks (300) may include at least one light source (200). The light source device (40) may supply the same driving current to the light sources (200) belonging to the same dimming block (300), and the light sources (200) belonging to the same dimming block (300) may emit light of the same brightness. For example, the light sources (200) belonging to the same dimming block (300) are connected in series with each other, and thus the same driving current may be supplied to the light sources (200) belonging to the same dimming block (300).

[0155] In addition, the light source device (40) may further include a plurality of driving elements (500, see FIG. 7) that control the driving current supplied to the light sources included in each of the plurality of dimming blocks (300). The driving elements (500) may be provided to correspond to at least one of the dimming blocks (300). In other words, the driving elements (500) may drive the dimming blocks (300).

[0156] The driving element (500) may include an integrated circuit chip for controlling the driving current applied to at least one dimming block (300).

[0157] In this way, since the light sources belonging to the dimming block are connected in series with each other, the light sources included in the dimming block operate as one unit and can form a light source block as one unit.

[0158] Therefore, hereinafter, “supplying driving current to the dimming block” may have the same meaning as “supplying driving current to the light sources included in the dimming block.”

[0159] As described above, the image processing unit (90) can provide dimming data for local dimming to the light source device (40). The dimming data can include information regarding the brightness of each of the plurality of dimming blocks (300). For example, the dimming data can include information regarding the intensity of light output by the light sources included in each of the plurality of dimming blocks (300).

[0160] The image processing unit (90) can obtain dimming data from image data.

[0161] The image processing unit (90) can convert image data into dimming data in various ways. For example, the image processing unit (90) can divide the image (I) by the image data into a plurality of image blocks. The number of the plurality of image blocks is equal to the number of the plurality of dimming blocks (300), and each of the plurality of image blocks can correspond to a plurality of dimming blocks (300).

[0162] The image processing unit (90) can obtain the luminance values ​​of the plurality of dimming blocks (300) from the image data of the plurality of image blocks. In addition, the image processing unit (90) can generate dimming data by combining the luminance values ​​of the plurality of dimming blocks (300).

[0163] For example, the image processing unit (90) can obtain the luminance value of each of the plurality of dimming blocks (300) based on the maximum value among the luminance values ​​of the pixels included in each of the image blocks.

[0164] One image block includes a plurality of pixels, and the image data of one image block may include image data of a plurality of pixels (e.g., red data, green data, blue data, etc.). The image processing unit (90) may calculate the luminance value of each pixel based on the image data of each pixel.

[0165] The image processing unit (90) can set the maximum value among the luminance values ​​of each pixel included in the image block as the luminance value of the dimming block corresponding to the image block. For example, the image processing unit (90) can set the maximum value among the luminance values ​​of the pixels included in the ith image block as the luminance value of the ith dimming block, and can set the maximum value among the luminance values ​​of the pixels included in the jth image block as the luminance value of the jth dimming block.

[0166] The image processing unit (90) can generate dimming data by combining the luminance values ​​of a plurality of dimming blocks (300).

[0167] The dimming driver (70) can receive dimming data from the image processing unit (90). The dimming driver (70) can drive the light source device (40) according to the dimming data. Here, the dimming data can include information about the brightness of each of the plurality of dimming blocks (300) or information about the brightness of the light sources (200) included in each of the plurality of dimming blocks (300).

[0168] The dimming driver (70) can convert dimming data, which may be a digital voltage signal, into an analog driving current.

[0169] The dimming driver (70) can sequentially provide an analog dimming signal to the driving elements (500) corresponding to each of the dimming blocks (300), for example, in an active matrix manner.

[0170] A plurality of dimming blocks (300) can be divided into a plurality of groups. Driving current can be supplied simultaneously to dimming blocks (300) belonging to the same group, and driving current can be supplied sequentially at different times to dimming blocks (300) belonging to different groups. The dimming driver (70) can activate dimming blocks (300) belonging to any one of the plurality of groups and provide an analog dimming signal to the activated dimming blocks (300). Thereafter, the dimming driver (70) can activate dimming blocks (300) belonging to another group and provide an analog dimming signal to the activated dimming blocks (300). For example, dimming blocks (300) located in the same row can belong to the same group, and dimming blocks (300) located in different rows can belong to different groups, but the method of classifying groups is not limited thereto. A dimming driver (70) can activate dimming blocks (300) belonging to one group and provide an analog dimming signal to the activated dimming blocks (300). Thereafter, the dimming driver (70) can activate inputs of dimming blocks (300) belonging to another row and provide an analog dimming signal to the dimming blocks (300) whose inputs are activated.

[0171] The plurality of dimming blocks (300) may be divided into a plurality of groups, each of which is connected to the same driving element (500). For example, the plurality of dimming blocks (300) may be divided into a first group of dimming blocks (300) connected to a first driving element, and a second group of dimming blocks (300) connected to a second driving element.

[0172] The driving circuit of each of the dimming blocks (300) can provide an analog driving current corresponding to an analog dimming signal to the light source module (41). By the analog driving current, the light sources (200) included in the light source device (40) can emit light. Depending on the dimming data, the light sources (200) belonging to the same dimming block (300) can emit light of the same intensity. In addition, depending on the dimming data, the light sources (200) belonging to different dimming blocks (300) can emit light of different intensities.

[0173] Fig. 7 illustrates a connection structure of a dimming driver, a driving element, and a dimming block according to one embodiment.

[0174] Referring to FIG. 7, each of the plurality of dimming blocks (300) may include a plurality of light sources (200) connected in series with each other. Each of the plurality of dimming blocks (300) may include a plurality of light-emitting diodes (210) connected in series with each other.

[0175] For example, when one dimming block (300) includes a first light-emitting diode, a second light-emitting diode, a third light-emitting diode, and a fourth light-emitting diode, the anode of the first light-emitting diode can be connected to a power wiring, the cathode of the first light-emitting diode can be connected to an anode of the second light-emitting diode, the cathode of the second light-emitting diode can be connected to an anode of the third light-emitting diode, the cathode of the third light-emitting diode can be connected to an anode of the fourth light-emitting diode, and the cathode of the fourth light-emitting diode can be connected to a driving element (500).

[0176] That is, among the plurality of light sources (200) connected in series and included in one dimming block (300), the first light source (200) of the series connection can be connected to a power wire (400) and receive power (driving voltage; VLED), and the last light source (200) of the series connection can be connected to a driving element (500).

[0177] The driving element (500) can receive an analog dimming signal from the dimming driver (70) while input-activated by the dimming driver (70) and store the received analog dimming signal. In addition, while input-deactivated, the plurality of driving elements (500) can supply a driving current corresponding to the stored analog dimming signal to the plurality of light-emitting diodes (210).

[0178] The driving element (500) can control the driving current supplied to each of the plurality of dimming blocks (300) when a driving voltage (VLED) is applied to the plurality of dimming blocks (300).

[0179] To this end, the display device (1) may include a scan line (L1) for providing a scan signal to a plurality of driving elements (500) and a data line (L2, L3) for providing an analog dimming signal to a plurality of driving elements (500).

[0180] Additionally, the display device (1) may include power wiring (400) for providing a driving voltage to a plurality of driving elements (500).

[0181] Scan lines (L1), data lines (L2, L3), power wiring (400), etc. can be formed on the substrate (100).

[0182] The plurality of driving elements (500) may include circuits of various topologies to implement active matrix driving.

[0183] For example, each of the plurality of driving elements (500) may include a circuit of a 1C2T (one capacitor two transistor) topology. However, the circuit structure of each driving element (500) is not limited thereto. For example, each driving element (500) may include a circuit of a 3T1C topology to which a transistor is added to compensate for the body effect of the driving transistor.

[0184] The driving element (500) may be provided as a single chip with an integrated driving circuit, for example. In other words, the driving circuit may be integrated into one semiconductor chip.

[0185] The dimming driver (70) can transmit dimming data corresponding to the input image to a plurality of driving elements (500) through data lines (L2, L3).

[0186] The dimming driver (70) can transmit a timing signal corresponding to the light emission timing of the plurality of dimming blocks (300) to the plurality of driving elements (500) through the scan line (L1).

[0187] A plurality of driving elements (500) can control the driving current supplied to each of the plurality of dimming blocks (300) based on dimming data and a timing signal.

[0188] The display device (1) may include more dimming blocks (300), driving elements (500), data lines (L2, L3) connecting them, a scan line (L1), and power lines (400) for local dimming than those illustrated in FIG. 7. Various lines may be formed on the substrate (100), and the embodiments of the present disclosure are not limited to those illustrated in FIG. 7.

[0189] Fig. 8 is a perspective view of an example of a light source device according to one embodiment. Fig. 9 is an exploded view of the light source device illustrated in Fig. 8. Figs. 10A-D schematically illustrate a manufacturing process of the light source device illustrated in Fig. 8. Fig. 11 illustrates a cross-section taken along line A-A' illustrated in Fig. 10D.

[0190] Referring to FIGS. 8 and 9, the light source device (40) may include a light source module (41) and a reflective sheet (42).

[0191] The light source module (41) may include a plurality of light sources (200). The light sources (200) may pass through the through holes (42a) of the reflective sheet (42) and protrude from the reflective sheet (42). The light sources (200) and a portion of the substrate (100) may be exposed through the through holes (42a).

[0192] Each of the plurality of light sources (200) may include at least one light emitting diode (210) and an optical dome (220).

[0193] Hereinafter, a light emitting diode for implementing a first resolution (e.g., 8K) may be referred to / expressed as a light emitting diode (210a), and a light emitting diode for implementing a second resolution (e.g., 4K) that is relatively lower than the first resolution may be referred to / expressed as a light emitting diode (210b). For example, the light emitting diode (210a) may have a first size, and the light emitting diode (210b) may have a second size that is smaller than the first size. For example, the light emitting diode (210a) may have a size of approximately 500 μm x 500 μm, and the light emitting diode (210b) may have a size of approximately 400 μm x 220 μm, but the sizes of each of the light emitting diode (210a) and the light emitting diode (210b) are not limited to the above-described examples. It goes without saying that the size of the light emitting diode may vary depending on various factors such as the configuration of the light source device (40), the type of the display device (1), and the like. Additionally, a light emitting diode that is commonly used regardless of resolution may be referred to / expressed as a light emitting diode (210). That is, the description of the light emitting diode (210) may be a description common to both the light emitting diode (210a) and the light emitting diode (210b).

[0194] A light emitting diode (210) can emit light. The light emitting diode (210) can include a P-type semiconductor and an N-type semiconductor for emitting light by recombination of holes and electrons. In addition, the light emitting diode (210) can include a pair of electrodes (211, 212, see FIG. 11) for supplying holes and electrons to the P-type semiconductor and the N-type semiconductor, respectively. For example, the light emitting diode (210) can include an anode (e.g., electrode (211)) and a cathode (e.g., electrode (212)).

[0195] The light emitting diode (210) can convert electrical energy into light energy. In other words, the light emitting diode (210) can emit light having a maximum intensity at a predetermined wavelength to which power is supplied.

[0196] The light emitting diode (210) may be designed to be mountable on the substrate (100). For example, the light emitting diode (210) may be directly attached to the substrate (100) in a chip on board (COB) manner. In other words, the light source (200) may include a light emitting diode (210) in which a light emitting diode chip or a light emitting diode die is directly attached to the substrate (100) without separate packaging.

[0197] In order to miniaturize the light source (200), a light source module (41) can be manufactured in which a light emitting diode (210), which may be of the flip chip type, is attached to a substrate (100) in a chip-on-board manner.

[0198] The optical dome (220) can cover the light emitting diode (210). The optical dome (220) can be placed on the substrate (100) to cover the light emitting diode (210).

[0199] The optical dome (220) can prevent or suppress damage to the light-emitting diode (210) due to external mechanical action and / or damage to the light-emitting diode (210) due to chemical action.

[0200] The optical dome (220) may be arranged to be spaced apart from the reflective sheet (42). For example, the optical dome (220) may be smaller than the through hole (42a).

[0201] The optical dome (220) may have, for example, a dome shape obtained by cutting a sphere with a plane that does not include its center, or a hemispherical shape obtained by cutting a sphere with a plane that includes its center. The vertical cross-section of the optical dome (220) may be, for example, a curved or semicircular shape.

[0202] The optical dome (220) may be composed of silicone or epoxy resin. For example, molten silicone or epoxy resin may be ejected onto the light-emitting diode (210) through a nozzle or the like, and the ejected silicone or epoxy resin may then be hardened, thereby forming the optical dome (220). The shape of the optical dome (220) may vary depending on the viscosity of the liquid silicone or epoxy resin.

[0203] The optical dome (220) may be optically transparent or translucent. Light emitted from the light emitting diode (210) may pass through the optical dome (220) and be emitted to the outside.

[0204] At this time, the optical dome (220) can refract light like a lens. For example, light emitted from a light-emitting diode (210) can be dispersed by being refracted by the optical dome (220).

[0205] In this way, the optical dome (220) can not only protect the light emitting diode (210) from external mechanical action and / or chemical action or electrical action, but also disperse the light emitted from the light emitting diode (210).

[0206] The substrate (100) may include an insulating base (110), a conductive conduction layer (120), and a protection layer (130). The conductive layer (120) may be disposed between the base (110) and the protection layer (130). The base (110) and the conductive layer (120) may be alternately laminated.

[0207] The dielectric of the base (110) can insulate between the lines or patterns of the conductive layer (120). The base (110) can be composed of a dielectric for electrical insulation, for example, FR-4. The base (110) can be referred to as an insulation layer.

[0208] The conductive layer (120) may be disposed on the base (110). The conductive layer (120) may be formed on one side of the base (110). The conductive layer (120) may cover the base (110). Meanwhile, in this document, the phrase "one configuration 'covers' another configuration" may include not only the meaning that one configuration completely covers the other configuration, but also the meaning that one configuration covers a part of the other configuration.

[0209] A conductive layer (120) may be formed with a line or pattern through which power and / or electrical signals pass. The conductive layer (120) may be composed of various materials having electrical conductivity. For example, the conductive layer (120) may be composed of various metal materials such as copper (Cu), tin (Sn), aluminum (Al), or an alloy thereof.

[0210] The substrate (100) may include electrode patterns (e.g., a first electrode pattern (1201), a second electrode pattern (1202), a third electrode pattern (1203), and / or a fourth electrode pattern (1204)) for supplying electrical signals and / or power to the light-emitting diode (210). The electrode patterns (e.g., the first electrode pattern (1201), the second electrode pattern (1202), and the third electrode pattern (1203), and / or the fourth electrode pattern (1204)) may be electrically connected to the light-emitting diode (210). For example, electrode pads (e.g., first electrode pad (121), second electrode pad (122), third electrode pad (123), and / or fourth electrode pad (124)) may be formed by exposing at least a portion of an electrode pattern (e.g., first electrode pattern (1201), second electrode pattern (1202), and third electrode pattern (1203) and / or fourth electrode pattern (1204)) to the outside of the substrate (100), and the light-emitting diode (210) may be electrically connected to the electrode pads (e.g., first electrode pad (121), second electrode pad (122), and third electrode pad (123) and / or fourth electrode pad (124)). The light emitting diode (210) can be in electrical contact with electrode pads (e.g., a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and / or a fourth electrode pad (124)). The electrode patterns (e.g., a first electrode pattern (1201), a second electrode pattern (1202), a third electrode pattern (1203), and / or a fourth electrode pattern (1204)) can be formed on the conductive layer (120). The electrode pads (e.g., a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and / or a fourth electrode pad (124)) can be implemented by lines or patterns formed on the conductive layer (120).A detailed description of the electrode pads (e.g., the first electrode pad (121), the second electrode pad (122), and the third electrode pad (123) and / or the fourth electrode pad (124)) will be provided later.

[0211] The protective layer (130) may be provided to prevent or suppress damage to the substrate (100) due to external impact, damage due to chemical action (e.g., corrosion, etc.), and / or damage due to optical action. The protective layer (130) may be provided on one side of the substrate (100) facing the light source (200). The protective layer (130) may include a photo solder resist (PSR).

[0212] The protective layer (130) may be disposed on the conductive layer (120). The protective layer (130) may be formed on one side of the conductive layer (120).

[0213] The protective layer (130) can cover the conductive layer (120). A portion of the conductive layer (120) that is not covered by the protective layer (130) can be provided as electrode pads (e.g., a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and / or a fourth electrode pad (124)). The protective layer (130) can include an exposure portion (131) that is provided to expose a portion of the conductive layer (120). At this time, the electrode pads (e.g., the first electrode pad (121), the second electrode pad (122), and the third electrode pad (123), and / or the fourth electrode pad (124)) can be formed as the conductive layer (120) is exposed through the exposure portion (131). For example, the protective layer (130) may be formed as PSR ink is coated (or applied) on the conductive layer (120), and the exposed portion (131) may be formed as PSR ink is not coated (or applied) on the conductive layer (120). The exposed portion (131) may be a window (131) (e.g., an opening).

[0214] For example, a portion of the first electrode pattern (1201) exposed through the exposed portion (131) may be provided as a first electrode pad (121). A portion of the first electrode pattern (1201) exposed to the outside of the substrate (100) by the exposed portion (131) may form a first electrode pad (121).

[0215] For example, a portion of the second electrode pattern (1202) exposed through the exposed portion (131) may be provided as a second electrode pad (122). A portion of the second electrode pattern (1202) exposed to the outside of the substrate (100) by the exposed portion (131) may form a second electrode pad (122).

[0216] For example, a portion of the third electrode pattern (1203) exposed through the exposed portion (131) may be provided as a third electrode pad (123). A portion of the third electrode pattern (1203) exposed to the outside of the substrate (100) by the exposed portion (131) may form a third electrode pad (123).

[0217] For example, a portion of the fourth electrode pattern (1204) exposed through the exposed portion (131) may be provided as a fourth electrode pad (124). A portion of the fourth electrode pattern (1204) exposed to the outside of the substrate (100) by the exposed portion (131) may form a fourth electrode pad (124).

[0218] FIG. 10A illustrates a substrate (100). The substrate (100) may include at least one electrode pad (e.g., a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and / or a fourth electrode pad (124)). The electrode pad (e.g., the first electrode pad (121), the second electrode pad (122), and the third electrode pad (123), and / or the fourth electrode pad (124)) may be electrically connected to a light-emitting diode (210) mounted on the substrate (100) and may transmit electrical signals, etc., to the light-emitting diode (210).

[0219] The substrate (100) may include a first electrode pad (121) to which a positive voltage is applied. The substrate (100) may include a second electrode pad (122) to which a negative voltage is applied. The second electrode pad (122) may be spaced apart from the first electrode pad (121) in a first direction (D1). The substrate (100) may include a third electrode pad (123) spaced apart from the first electrode pad (121) in a second direction (D2). The second direction (D2) may be a direction intersecting the first direction (D1). The second direction (D2) may be a direction perpendicular to the first direction (D1). The substrate (100) may include a fourth electrode pad (124) spaced apart from the second electrode pad (122) in the second direction (D2).

[0220] The first electrode pad (121) and the second electrode pad (122) may be arranged along the first direction (D1). The first electrode pad (121) and the third electrode pad (123) may be arranged along the second direction (D2). The second electrode pad (122) and the fourth electrode pad (124) may be arranged along the second direction (D2). The first electrode pad (121) and the fourth electrode pad (124) may be arranged in a diagonal direction with respect to the first direction (D1) and the second direction (D2). The second electrode pad (122) and the third electrode pad (123) may be arranged in the diagonal direction.

[0221] Some of the plurality of electrode pads (121, 122, 123, 124) may be formed integrally. As will be described later, for example, the third electrode pad (123) and the fourth electrode pad (124) may be formed integrally.

[0222] Meanwhile, a mask (600) may be provided to form a solder portion (S) on a substrate (100). The mask (600) may include a substrate body for covering the substrate (100) and an opening formed through the substrate body. When the mask (600) is placed on the substrate (100) and solder is applied, and then the mask (600) is separated from the substrate (100), solder may remain only in an area of ​​the substrate (100) corresponding to the opening of the mask (600). At this time, the solder remaining on the substrate (100) may be referred to as a solder portion (S). The solder portion (S) may have electrical conductivity. The solder portion (S) may be configured to electrically connect the electrode pads (e.g., the first electrode pad (121), the second electrode pad (122), and the third electrode pad (123) and / or the fourth electrode pad (124)) of the substrate (100) and the electrodes (211 and / or 212) of the light-emitting diode (210).

[0223] The mask (600) may be provided in various types (e.g., a first mask (600a), a second mask (600b), a third mask (600c), etc.). The type of the mask (600) may vary depending on the shape, number, and / or arrangement of the openings formed in the mask (600). Based on the type of the mask (600), the shape, number, and / or arrangement of the solder portions (S) formed on the substrate (100) may be determined. Based on the type of the mask (600), the size and / or number of the light-emitting diodes (210) mounted on the substrate (100) may be determined. Hereinafter, a mask for implementing a first resolution (e.g., 8K) may be referred to / expressed as a first mask (600a). A mask for implementing a second resolution (e.g., 4K) that is relatively lower than the first resolution may be referred to / expressed as a second mask (600b) or a third mask (600c).

[0224] Figure 10B illustrates a first mask (600a). The first mask (600a) may include a first opening (610) and a second opening (620).

[0225] The first opening (610) may correspond to (e.g., overlap) the first electrode pad (121), the third electrode pad (123), and the area between the first electrode pad (121) and the third electrode pad (123). The first opening (610) may be provided to form a first solder portion (S1) to be described later. The first opening (610) may form the first solder portion (S1) by allowing solder to pass through the first opening (610) and be disposed on the substrate (100).

[0226] The second opening (620) may correspond to (e.g., overlap) the second electrode pad (122), the fourth electrode pad (124), and the area between the second electrode pad (122) and the fourth electrode pad (124). The second opening (620) may be provided to form a second solder portion (S2) to be described later. The second opening (620) may form the second solder portion (S2) by allowing solder to pass through the second opening (620) and be disposed on the substrate (100).

[0227] The first opening (610) and the second opening (620) may be spaced apart along the first direction (D1). The first opening (610) and the second opening (620) may be arranged along the first direction (D1).

[0228] FIG. 10C illustrates a state in which a first mask (600a) is placed on a substrate (100), solder is applied to the first mask (600a), and then the first mask (600a) is separated from the substrate (100).

[0229] The solder applied to the first mask (600a) may be arranged to pass through the first opening (610) and the second opening (620) and be placed on the substrate (100). As the first mask (600a) is separated from the substrate (100), a solder portion (S) may be provided on the substrate (100).

[0230] The substrate (100) may be provided in a first state (C1). A first solder portion (S1) and a second solder portion (S2) may be arranged on the substrate (100). The first solder portion (S1) may be arranged to connect the first electrode pad (121) and the third electrode pad (123). As solder passes through the first opening (610) and is arranged on the substrate (100), the first solder portion (S1) may be formed. The first solder portion (S1) may be arranged to cover the first electrode pad (121), the third electrode pad (123), and the area between the first electrode pad (121) and the third electrode pad (123). The second solder portion (S2) may be arranged to connect the second electrode pad (122) and the fourth electrode pad (124). As the solder passes through the second opening (620) and is placed on the substrate (100), a second solder portion (S2) may be formed. The second solder portion (S2) may be arranged to cover the second electrode pad (122), the fourth electrode pad (124), and the area between the second electrode pad (122) and the fourth electrode pad (124). The first solder portion (S1) and the second solder portion (S2) may be arranged along the first direction (D1).

[0231] Figure 10D illustrates a state in which one light-emitting diode (210a) is mounted on a substrate (100) provided with a first solder portion (S1) and a second solder portion (S2).

[0232] The light emitting diode (210a) can be mounted on the substrate (100). The light emitting diode (210a) can be mounted on the substrate (100). The light emitting diode (210a) can have a first size. For example, the light emitting diode (210a) can have a size of approximately 500 μm x 500 μm.

[0233] Referring to FIG. 11, the anode (211a) of the light emitting diode (210a) may be arranged to contact the first solder portion (S1). The anode (211a) of the light emitting diode (210a) may be electrically connectable to the first electrode pad (121). The anode (211a) of the light emitting diode (210a) may be electrically connected to the first electrode pad (121) through the first solder portion (S1). The cathode (212a) of the light emitting diode (210a) may be arranged to contact the second solder portion (S2). The cathode (212a) of the light emitting diode (210a) may be electrically connectable to the second electrode pad (122). The cathode (212a) of the light-emitting diode (210a) can be electrically connected to the second electrode pad (122) via the second solder portion (S2). The anode (211a) of the light-emitting diode (210a) and the cathode (212a) of the light-emitting diode (210a) can be arranged along the first direction (D1).

[0234] In summary, the light emitting diode (210a) can be mounted on a substrate (100) prepared in a first state (C1). While the substrate (100) is prepared in the first state (C1), the anode (211a) of the light emitting diode (210a) can be electrically connected to a first electrode pad (121), and the cathode (212a) of the light emitting diode (210a) can be electrically connected to a second electrode pad (122).

[0235] The light source device (40) illustrated in FIGS. 8 to 11 may include an optical dome (220) and a light emitting diode (210a) disposed within the optical dome (220). The size of the light emitting diode (210a) may be relatively larger than the size of the light emitting diode (210b). The light source device (40) illustrated in FIGS. 8 to 11 may implement a display device having a relatively high resolution. For example, the light source device (40) illustrated in FIGS. 8 to 11 may implement an 8K display device. However, the embodiments of the present disclosure are not limited to the above-described examples, and the light source device (40) may be provided as a component of a display device having various resolutions.

[0236] Fig. 12 is a perspective view of an example of a light source device according to one embodiment. Fig. 13 is an exploded view of the light source device illustrated in Fig. 12. Figs. 14A-D schematically illustrate a manufacturing process of the light source device illustrated in Fig. 12. Fig. 15 illustrates a cross-section taken along line B-B' illustrated in Fig. 14D. Fig. 16 illustrates a cross-section taken along line C-C' illustrated in Fig. 14D.

[0237] Descriptions that overlap with those of the previously described embodiments may not be repeated. Components substantially identical to those described above are assigned the same reference numbers, and repeated detailed descriptions thereof may be omitted.

[0238] Referring to FIGS. 12 and 13, the light source device (40) may include a light source module (41) and a reflective sheet (42). The light source module (41) may include a substrate (100) and a light source (200) disposed on the substrate (100).

[0239] The light source (200) may include a plurality of light emitting diodes (210b). The plurality of light emitting diodes (210b) may be electrically connected to each other. The plurality of light emitting diodes (210b) may be connected in series. Hereinafter, for convenience of explanation, an example in which the light source (200) includes two light emitting diodes (210b) will be described, and one of the two may be referred to / expressed as a first light emitting diode (210ba), and the other of the two may be referred to / expressed as a second light emitting diode (210bb). The second light emitting diode (210bb) may be electrically connected to the first light emitting diode (210ba). The second light emitting diode (210bb) may be connected in series to the first light emitting diode (210ba).

[0240] An optical dome (220) may be provided to cover a plurality of light-emitting diodes (210b). The optical dome (220) may be provided to cover a first light-emitting diode (210ba) and a second light-emitting diode (210bb). The first light-emitting diode (210ba) and the second light-emitting diode (210bb) may be arranged within the optical dome (220).

[0241] Fig. 14A illustrates a substrate (100). The substrate (100) illustrated in Fig. 14A is substantially the same as the substrate (100) illustrated in Fig. 10A. The substrate (100) may include a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and a fourth electrode pad (124). A positive voltage may be applied to the first electrode pad (121), and a negative voltage may be applied to the second electrode pad (122).

[0242] Figure 14B illustrates a second mask (600b). The second mask (600b) may include a third opening (630), a fourth opening (640), and a fifth opening (650).

[0243] The third opening (630) may correspond to (e.g., overlap with) the first electrode pad (121). The third opening (630) may be provided to form a third solder portion (S3) to be described later. The third opening (630) may form the third solder portion (S3) by allowing solder to pass through the third opening (630) and be disposed on the substrate (100).

[0244] The fourth opening (640) may correspond to (e.g., overlap with) the second electrode pad (122). The fourth opening (640) may be provided to form a fourth solder portion (S4) to be described later. The fourth opening (640) may form the fourth solder portion (S4) by allowing solder to pass through the fourth opening (640) and be disposed on the substrate (100).

[0245] The fifth opening (650) may correspond to (e.g., overlap) the third electrode pad (123), the fourth electrode pad (124), and the area between the third electrode pad (123) and the fourth electrode pad (124). The fifth opening (650) may form a fifth solder portion (S5) by allowing solder to pass through the fifth opening (650) and be disposed on the substrate (100).

[0246] The third opening (630) and the fourth opening (640) can be spaced apart along the first direction (D1). The third opening (630) and the fourth opening (640) can be arranged along the first direction (D1). The third opening (630) and the fifth opening (650) can be spaced apart along the second direction (D2). The third opening (630) and the fifth opening (650) can be arranged along the second direction (D2). The fourth opening (640) and the fifth opening (650) can be spaced apart along the second direction (D2). The fourth opening (640) and the fifth opening (650) can be arranged along the second direction (D2).

[0247] FIG. 14C illustrates a state in which a second mask (600b) is placed on a substrate (100), solder is applied to the second mask (600b), and then the second mask (600b) is separated from the substrate (100).

[0248] The solder applied to the second mask (600b) may be arranged to pass through the third opening (630), the fourth opening (640), and the fifth opening (650) and be placed on the substrate (100). As the second mask (600b) is separated from the substrate (100), a solder portion (S) may be provided on the substrate (100).

[0249] The substrate (100) may be provided in a second state (C2). A third solder portion (S3), a fourth solder portion (S4), and a fifth solder portion (S5) may be arranged on the substrate (100). The third solder portion (S3) may be arranged on the first electrode pad (121). As the solder passes through the third opening (630) and is arranged on the substrate (100), the third solder portion (S3) may be formed. The third solder portion (S3) may be arranged to cover the first electrode pad (121). The fourth solder portion (S4) may be arranged on the second electrode pad (122). As the solder passes through the fourth opening (640) and is arranged on the substrate (100), the fourth solder portion (S4) may be formed. The fourth solder portion (S4) may be provided to cover the second electrode pad (122). The fifth solder portion (S5) may be arranged to connect the third electrode pad (123) and the fourth electrode pad (124). As solder passes through the fifth opening (650) and is placed on the substrate (100), the fifth solder portion (S5) may be formed. The fifth solder portion (S5) may be provided to cover the third electrode pad (123), the fourth electrode pad (124), and the area between the third electrode pad (123) and the fourth electrode pad (124). The third solder portion (S3) and the fourth solder portion (S4) may be arranged along the first direction (D1). The third solder portion (S3) and the fifth solder portion (S5) may be arranged along the second direction (D2). The fourth solder portion (S4) and the fifth solder portion (S5) can be arranged along the second direction (D2).

[0250] FIG. 14D illustrates a state in which a plurality of light-emitting diodes (210b) are mounted on a substrate (100) provided with a third solder portion (S3), a fourth solder portion (S4), and a fifth solder portion (S5).

[0251] The first light emitting diode (210ba) and the second light emitting diode (210bb) can be mounted on the substrate (100). The first light emitting diode (210ba) and the second light emitting diode (210bb) can be mounted on the substrate (100). For example, each of the first light emitting diode (210ba) and the second light emitting diode (210bb) can have a size of approximately 400 μm x 220 μm.

[0252] Referring to FIG. 15, the anode (211ba) of the first light-emitting diode (210ba) may be arranged to contact the third solder portion (S3). The anode (211ba) of the first light-emitting diode (210ba) may be electrically connectable to the first electrode pad (121). The anode (211ba) of the first light-emitting diode (210ba) may be electrically connected to the first electrode pad (121) via the third solder portion (S3). The cathode (212bb) of the second light-emitting diode (210bb) may be arranged to contact the fourth solder portion (S4). The cathode (212bb) of the second light-emitting diode (210bb) may be electrically connectable to the second electrode pad (122). The cathode (212bb) of the second light-emitting diode (210bb) can be electrically connected to the second electrode pad (122) via the fourth solder portion (S4). The anode (211ba) of the first light-emitting diode (210ba) and the cathode (212bb) of the second light-emitting diode (210bb) can be arranged along the first direction (D1).

[0253] Referring to Fig. 16, the cathode (212ba) of the first light-emitting diode (210ba) may be arranged to contact the fifth solder portion (S5). The anode (211bb) of the second light-emitting diode (210bb) may be arranged to contact the fifth solder portion (S5). The anode (211bb) of the second light-emitting diode (210bb) may be electrically connected to the cathode (212ba) of the first light-emitting diode (210ba). The cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) may be electrically connected through the fifth solder portion (S5). The cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) may be arranged along the first direction (D1).

[0254] In summary, the first light-emitting diode (210ba) and the second light-emitting diode (210bb) can be mounted on the substrate (100) prepared in the second state (C2). While the substrate (100) is prepared in the second state (C2), the anode (211ba) of the first light-emitting diode (210ba) is electrically connected to the first electrode pad (121), the cathode (212bb) of the second light-emitting diode (210bb) is electrically connected to the second electrode pad (122), and the cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) can be electrically connected through the fifth solder portion (S5). As a result, the first light-emitting diode (210ba) and the second light-emitting diode (210bb) can be connected in series.

[0255] The light source device (40) illustrated in FIGS. 12 to 15 may include an optical dome (220) and a plurality of light emitting diodes (210b) arranged within the optical dome (220). The size of each of the plurality of light emitting diodes (210b) may be relatively smaller than the size of the light emitting diode (210a). The light source device (40) illustrated in FIGS. 12 to 15 may implement a display device having a relatively lower resolution than the light source device (40) illustrated in FIGS. 8 to 11. For example, the light source device (40) illustrated in FIGS. 12 to 15 may implement a 4K display device. However, embodiments of the present disclosure are not limited to the above-described examples, and the light source device (40) may be provided as a component of a display device having various resolutions.

[0256] Meanwhile, a plurality of light emitting diodes may be spaced apart from each other on the substrate (100). A first light emitting diode (210ba) and a second light emitting diode (210bb) may be spaced apart from each other on the substrate (100). The second light emitting diode (210bb) may be spaced apart from the first light emitting diode (210ba). The second light emitting diode (210bb) may be spaced apart from the first light emitting diode (210ba) along a first direction (D1). The first light emitting diode (210ba) and the second light emitting diode (210bb) may be arranged along the first direction (D1).

[0257] The smaller the separation distance (L) between the first light emitting diode (210ba) and the second light emitting diode (210bb), the more the brightness of the light source (200) can be improved. In addition, the smaller the separation distance (L) between the first light emitting diode (210ba) and the second light emitting diode (210bb), the more the optical defects (e.g., mura) of the light source (200) can be prevented or reduced. However, it is practically impossible to infinitely minimize the separation distance (L) between the first light emitting diode (210ba) and the second light emitting diode (210bb).

[0258] Considering the luminance performance and manufacturing efficiency of the light source (200), it is preferable that the separation distance (L) between the first light-emitting diode (210ba) and the second light-emitting diode (210bb) be in the range of approximately 100 μm to 300 μm.

[0259] If the separation distance (L) is designed to be less than 100 μm, it may be very difficult to mount the first light-emitting diode (210ba) and the second light-emitting diode (210bb) on the substrate (100). For example, in the light-emitting diode mounting process, there may be limitations on the movement of the mounting device. In order to stably mount the first light-emitting diode (210ba) and the second light-emitting diode (210bb) on the substrate (100), the separation distance (L) may be approximately 100 μm or more.

[0260] If the separation distance (L) is designed to be greater than 300 μm, the luminance of the light source (200) may be reduced as described above. In addition, the optical dome (220) must cover both the first light emitting diode (210ba) and the second light emitting diode (210bb), and if the separation distance (L) is large, a lot of raw materials (e.g., silicone, epoxy resin, etc.) may be used to form the optical dome (220). In addition, the raw materials constituting the optical dome (220) may have to be ejected multiple times onto the light emitting diodes (210b), which may increase the process time. In order to secure the luminance of the light source (200) while increasing manufacturing efficiency, the separation distance (L) may be approximately 300 μm or less.

[0261] Typically, implementing a display device may require a substrate manufactured for each resolution. For example, the first substrate of a light source device used to implement an 8K display device may be different from the second substrate of a light source device used to implement a 4K display device. The first and second substrates may have different wiring and / or component arrangements. Accordingly, to manufacture multiple display devices with different resolutions, substrates tailored to each display device may be required. Consequently, numerous production lines may be required to manufacture each substrate. Furthermore, managing multiple types of substrates is challenging.

[0262] In contrast, according to embodiments of the present disclosure, display devices having various resolutions can be implemented using a single substrate (100). For example, in order to implement an 8K display device and a 4K display device, one type of substrate (100) may be required. As described above, various combinations of solder portions (S) can be formed on a single substrate (100) using various types of masks (600). Depending on the shape and / or arrangement of the solder portions (S) provided on the substrate (100), the size, number, etc. of the light emitting diodes (210) mounted on the substrate (100) can vary. Consequently, both a high-resolution display device and a low-resolution display device can be manufactured using only a single substrate (100). Accordingly, the number of production lines for producing the substrate can be reduced, and management of the substrate can be facilitated. Consequently, the manufacturing efficiency of the substrate (100) and the manufacturing efficiency of the light source device (40) including the substrate (100) can be increased.

[0263] Fig. 17 is a perspective view of an example of a light source device according to one embodiment. Fig. 18 is an exploded view of the light source device illustrated in Fig. 17. Figs. 19A-D schematically illustrate a manufacturing process of the light source device illustrated in Fig. 17. Fig. 20 illustrates a cross-section taken along line D-D' illustrated in Fig. 19D. Fig. 21 illustrates a cross-section taken along line E-E' illustrated in Fig. 19D.

[0264] Descriptions that overlap with those of the previously described embodiments may not be repeated. Components substantially identical to those described above are assigned the same reference numbers, and repeated detailed descriptions thereof may be omitted.

[0265] Referring to FIGS. 17 and 18, the light source device (40) may include a light source module (41) and a reflective sheet (42). The light source module (41) may include a substrate (100) and a light source (200) disposed on the substrate (100).

[0266] The light source (200) may include a plurality of light emitting diodes (210b). The light source (200) may include a first light emitting diode (210ba) and a second light emitting diode (210bb). The light source (200) may include an optical dome (220). The optical dome (220) may be provided to cover the first light emitting diode (210ba) and the second light emitting diode (210bb).

[0267] Fig. 19A illustrates a substrate (100). The substrate (100) illustrated in Fig. 19A may differ from the substrate (100) illustrated in Fig. 10A and the substrate (100) illustrated in Fig. 19A in that it may include a fifth electrode pad (125). The substrate (100) illustrated in Fig. 19A may be substantially the same as the substrate (100) illustrated in Fig. 10A and the substrate (100) illustrated in Fig. 19A, except for the fifth electrode pad (125).

[0268] The substrate (100) may include a first electrode pad (121), a second electrode pad (122), and a fifth electrode pad (125). The third electrode pad (123) and the fourth electrode pad (124) may be formed integrally, and the third electrode pad (123) and the fourth electrode pad (124) formed integrally may be referred to as a fifth electrode pad (125). For example, the fifth electrode pattern (1205) may be formed as the third electrode pattern (1203) and the fourth electrode pattern (1204) are formed integrally, and the fifth electrode pad (125) may be formed as the fifth electrode pattern (1205) is exposed to the outside of the substrate through the exposed portion (131) of the protective layer (130). The fifth electrode pad (125) may be spaced apart from the first electrode pad (121) in the second direction (D2). The first electrode pad (121) and the fifth electrode pad (125) may be arranged along the second direction (D2). The fifth electrode pad (125) may be spaced apart from the second electrode pad (122) in the second direction (D2). The second electrode pad (122) and the fifth electrode pad (125) may be arranged along the second direction (D2).

[0269] Figure 19B illustrates a third mask (600c). The third mask (600c) may include a sixth opening (660), a seventh opening (670), an eighth opening (680), and a ninth opening (690).

[0270] The sixth opening (660) may correspond to (e.g., overlap with) the first electrode pad (121). The sixth opening (660) may be provided to form a sixth solder portion (S6) to be described later. The sixth opening (660) may form the sixth solder portion (S6) by allowing solder to pass through the sixth opening (660) and be disposed on the substrate (100).

[0271] The seventh opening (670) may correspond to (e.g., overlap with) the second electrode pad (122). The seventh opening (670) may be provided to form a seventh solder portion (S7) to be described later. The seventh opening (670) may form the seventh solder portion (S7) by allowing solder to pass through the seventh opening (670) and be disposed on the substrate (100).

[0272] The eighth opening (680) may correspond to a portion of the fifth electrode pad (125) (e.g., may overlap). The eighth opening (680) may correspond to a portion of the third electrode pad (123) and the fourth electrode pad (124) that are formed integrally. The eighth opening (680) may be provided to form an eighth solder portion (S8) to be described later. The eighth opening (680) may form the eighth solder portion (S8) by allowing solder to pass through the eighth opening (680) and be disposed on the substrate (100).

[0273] The ninth opening (690) may correspond to the remaining portion of the fifth electrode pad (125). The ninth opening (690) may correspond to the remaining portion of the third electrode pad (123) and the fourth electrode pad (124) that are formed integrally. The ninth opening (690) may be provided to form a ninth solder portion (S9) to be described later. The ninth opening (690) may form the ninth solder portion (S9) by allowing solder to pass through the ninth opening (690) and be disposed on the substrate (100).

[0274] The sixth opening (660) and the seventh opening (670) may be spaced apart along the first direction (D1). The sixth opening (660) and the seventh opening (670) may be arranged along the first direction (D1). The eighth opening (680) and the ninth opening (690) may be spaced apart along the first direction (D1). The eighth opening (680) and the ninth opening (690) may be arranged along the first direction (D1). The sixth opening (660) and the eighth opening (680) may be spaced apart along the second direction (D2). The sixth opening (660) and the eighth opening (680) may be arranged along the second direction (D2). The seventh opening (670) and the ninth opening (690) may be spaced apart along the second direction (D2). The seventh opening (670) and the ninth opening (690) can be arranged along the second direction (D2).

[0275] FIG. 19C illustrates a state in which a third mask (600c) is placed on a substrate (100), solder is applied to the third mask (600c), and then the third mask (600c) is separated from the substrate (100).

[0276] The solder applied to the third mask (600c) may be arranged to pass through the sixth opening (660), the seventh opening (670), the eighth opening (680), and the ninth opening (690) and be placed on the substrate (100). As the third mask (600c) is separated from the substrate (100), a solder portion (S) may be provided on the substrate (100).

[0277] A sixth solder portion (S6), a seventh solder portion (S7), an eighth solder portion (S8), and a ninth solder portion (S9) may be arranged on the substrate (100). The sixth solder portion (S6) may be arranged on the first electrode pad (121). As solder passes through the sixth opening (660) and is arranged on the substrate (100), the sixth solder portion (S6) may be formed. The sixth solder portion (S6) may be arranged to cover the first electrode pad (121). The seventh solder portion (S6) may be arranged on the second electrode pad (122). As solder passes through the seventh opening (670) and is arranged on the substrate (100), the seventh solder portion (S7) may be formed. The seventh solder portion (S7) may be arranged to cover the second electrode pad (122). The eighth solder portion (S8) may be disposed on a portion of the fifth electrode pad (125). As the solder passes through the eighth opening (680) and is disposed on the substrate (100), the eighth solder portion (S8) may be formed. The eighth solder portion (S8) may be provided to cover a portion of the fifth electrode pad (125). The eighth solder portion (S8) may cover a portion of the third electrode pad (123) and the fourth electrode pad (124) that are formed integrally. The ninth solder portion (S9) may be disposed on the remaining portion of the fifth electrode pad (125). As the solder passes through the ninth opening (690) and is disposed on the substrate (100), the ninth solder portion (S9) may be formed. The ninth solder portion (S9) may be provided to cover a remaining portion of the fifth electrode pad (125). The ninth solder portion (S9) can cover the remaining portion of the third electrode pad (123) and the fourth electrode pad (124) that are formed integrally. The sixth solder portion (S6) and the seventh solder portion (S7) can be arranged along the first direction (D1). The eighth solder portion (S8) and the ninth solder portion (S9) can be arranged along the first direction (D1). The sixth solder portion (S6) and the eighth solder portion (S8) can be arranged along the second direction (D2). The seventh solder portion (S7) and the ninth solder portion (S9) can be arranged along the second direction (D2).

[0278] FIG. 19D illustrates a state in which a plurality of light-emitting diodes (210b) are mounted on a substrate (100) provided with a sixth solder portion (S6), a seventh solder portion (S7), an eighth solder portion (S8), and a ninth solder portion (S9).

[0279] The first light emitting diode (210ba) and the second light emitting diode (210bb) can be mounted on the substrate (100). The first light emitting diode (210ba) and the second light emitting diode (210bb) can be mounted on the substrate (100). For example, each of the first light emitting diode (210ba) and the second light emitting diode (210bb) can have a size of approximately 400 μm x 220 μm.

[0280] The first light-emitting diode (210ba) and the second light-emitting diode (210bb) may be spaced apart. For example, the distance (L) between the first light-emitting diode (210ba) and the second light-emitting diode (210bb) may be approximately 100 μm to 300 μm.

[0281] Referring to FIG. 20, the anode (211ba) of the first light-emitting diode (210ba) may be arranged to contact the sixth solder portion (S6). The anode (211ba) of the first light-emitting diode (210ba) may be electrically connectable to the first electrode pad (121). The anode (211ba) of the first light-emitting diode (210ba) may be electrically connected to the first electrode pad (121) via the sixth solder portion (S6). The cathode (212bb) of the second light-emitting diode (210bb) may be arranged to contact the seventh solder portion (S7). The cathode (212bb) of the second light-emitting diode (210bb) may be electrically connectable to the second electrode pad (122). The cathode (212bb) of the second light-emitting diode (210bb) can be electrically connected to the second electrode pad (122) via the seventh solder portion (S7). The anode (211ba) of the first light-emitting diode (210ba) and the cathode (212bb) of the second light-emitting diode (210bb) can be arranged along the first direction (D1).

[0282] Referring to Fig. 21, the cathode (212ba) of the first light-emitting diode (210ba) may be arranged to contact the eighth solder portion (S8). The cathode (212ba) of the first light-emitting diode (210ba) may be electrically connected to the fifth electrode pad (125). The cathode (212ba) of the first light-emitting diode (210ba) may be electrically connected to the fifth electrode pad (125) through the eighth solder portion (S8). For example, the third electrode pad (123) and the fourth electrode pad (124) may be formed integrally to form the fifth electrode pad (125). At this time, the cathode (212ba) of the first light-emitting diode (210ba) may be arranged on a part of the third electrode pad (123) and the fourth electrode pad (124) formed integrally. The anode (211bb) of the second light-emitting diode (210bb) may be arranged to contact the ninth solder portion (S9). The anode (211bb) of the second light-emitting diode (210bb) may be electrically connectable to the fifth electric pad (125). The anode (211bb) of the second light-emitting diode (210bb) may be electrically connected to the fifth electrode pad (125) through the ninth solder portion (S9). For example, the third electrode pad (123) and the fourth electrode pad (124) may be formed integrally to form the fifth electrode pad (125). At this time, the anode (211bb) of the second light-emitting diode (210bb) may be arranged on the remaining portion of the integrally formed third electrode pad (123) and fourth electrode pad (124). The cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) are electrically connectable. The cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) can be electrically connected via the fifth electrode pad (125). The cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) can be arranged along the first direction (D1).

[0283] The anode (211ba) of the first light-emitting diode (210ba) is electrically connected to the first electrode pad (121), the cathode (212bb) of the second light-emitting diode (210bb) is electrically connected to the second electrode pad (122), and the cathode (212ba) of the first light-emitting diode (210ba) and the anode (211bb) of the second light-emitting diode (210bb) can be electrically connected via the fifth electrode pad (125). Thus, the first light-emitting diode (210ba) and the second light-emitting diode (210bb) can be connected in series.

[0284] Meanwhile, the third mask (600c) illustrated in B of FIG. 19 may be replaced with the second mask (600b) illustrated in B of FIG. 14. Accordingly, the shape of the solder portion (S) illustrated in C of FIG. 19 may be replaced with the shape of the solder portion (S) illustrated in C of FIG. 14. At this time, the eighth solder portion (S8) and the ninth solder portion (S9) illustrated in C of FIG. 19 may be provided as a single body. In addition, in FIG. 21, solder may be filled between the eighth solder portion (S8) and the ninth solder portion (S9).

[0285] According to various embodiments, each of the plurality of light sources (200) may include a plurality of light emitting diodes (210b) and an optical dome (220) for covering the plurality of light emitting diodes (210b). When the plurality of light emitting diodes (210b) are arranged within the optical dome (220), improved image quality can be realized compared to the same driving voltage. For example, if the number of light emitting diodes is the same, when the plurality of light emitting diodes (210b) are arranged within the optical dome (220), the area of ​​the dimming block (300) itself can be reduced compared to the case where it is not. In addition, for example, when the number of light emitting diodes is the same, when the plurality of light emitting diodes (210b) are arranged within the optical dome (220), the number of through holes (42a) of the reflective sheet (42) can be reduced compared to the case where it is not. As a result, the reflection efficiency of the reflective sheet (42) can be improved.

[0286] Fig. 22 illustrates an example of a method for manufacturing a light source device according to one embodiment.

[0287] A method for manufacturing a light source device (40) according to one embodiment may include placing a mask (600) on a substrate (100) (1000). The substrate (100) may include a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and a fourth electrode pad (124). For example, the third electrode pad (123) and the fourth electrode pad (124) may be formed integrally. The mask (600) may be prepared in various types. After selecting the type of mask (600) based on the resolution to be implemented, the selected mask (600) may be placed on the substrate (100). For example, the first mask (600a) may include a first opening (610) and a second opening (620) (see FIG. 10B). For example, the second mask (600b) may include a third opening (630), a fourth opening (640), and a fifth opening (650) (see FIG. 14B). For example, the third mask (600c) may include a sixth opening (660), a seventh opening (670), an eighth opening (680), and a ninth opening (690).

[0288] A method for manufacturing a light source device (40) according to one embodiment may include applying solder to a mask (600) (2000). The solder may be applied while the mask (600) is placed on a substrate (100). The solder applied to the mask (600) may be pressed to force the solder into the opening of the mask (600). For example, when the first mask (600a) is selected, the solder applied to the first mask (600a) may pass through the first opening (610) and the second opening (620) and be placed on the substrate (100). For example, when the second mask (600b) is selected, the solder applied to the second mask (600b) may pass through the third opening (630), the fourth opening (640), and the fifth opening (650) and be placed on the substrate (100). For example, when the third mask (600c) is selected, the solder applied to the third mask (600c) can pass through the sixth opening (660), the seventh opening (670), the eighth opening (680), and the ninth opening (690) and be placed on the substrate (100).

[0289] A method for manufacturing a light source device (40) according to one embodiment may include separating a mask (600) from a substrate (100) (3000). As the mask (600) is separated from the substrate (100), solder may remain in an area corresponding to an opening of the mask (600). That is, a solder portion (S) may be formed on the substrate (100). For example, when a first mask (600a) is selected, a first solder portion (S1) and a second solder portion (S2) may be formed on the substrate (100) as the first mask (600a) may be separated from the substrate (100) (see FIG. 10C). For example, when the second mask (600b) is selected, a third solder portion (S3), a fourth solder portion (S4), and a fifth solder portion (S5) can be formed on the substrate (100) by separating the second mask (600b) from the substrate (100) (see C of FIG. 14). For example, when the third mask (600c) is selected, a sixth solder portion (S6), a seventh solder portion (S7), an eighth solder portion (S8), and a ninth solder portion (S9) can be formed on the substrate (100) by separating the third mask (600c) from the substrate (100) (see C of FIG. 19).

[0290] A method for manufacturing a light source device (40) according to one embodiment may include mounting (4000) at least one light emitting diode (210) on a substrate (100). The light emitting diode (210) may be electrically connected to electrode pads (e.g., a first electrode pad (121), a second electrode pad (122), a third electrode pad (123), and / or a fourth electrode pad (124)) as it is mounted on the substrate (100). At least one electrode (211 and / or 212) of the light emitting diode (210) may be in electrical contact with a solder portion (S). For example, when the first mask (600a) is selected, one light emitting diode (210a) may be mounted on the substrate (100) (see D of FIG. 10). For example, when the second mask (600b) or the third mask (600c) is selected, a plurality of light-emitting diodes (210b) can be mounted on the substrate (100), and the plurality of light-emitting diodes (210b) can be connected in series with each other (see D of FIG. 14 and D of FIG. 19).

[0291] A method for manufacturing a light source device (40) according to one embodiment may include (5000) arranging an optical dome (220) on a substrate (100) to cover at least one diode (210). At least one diode (e.g., diode (210)) may be arranged within the optical dome (220). For example, when the first mask (600a) is selected, the optical dome (220) may be arranged to cover one light emitting diode (210a). For example, when the second mask (600b) or the third mask (600c) is selected, the optical dome (220) may be arranged to cover a plurality of light emitting diodes (210b). For example, the optical dome (220) may be arranged to cover both the first light emitting diode (210ba) and the second light emitting diode (210bb).

[0292] According to one embodiment of the present disclosure, a light source device (40) may include a substrate (100); a light emitting diode (210) mountable on the substrate (100); and an optical dome (220) disposed on the substrate (100) to cover the light emitting diode (210). The substrate (100) may include a first electrode pad (121) to which a positive voltage is applied; a second electrode pad (122) to which a negative voltage is applied and which is spaced apart from the first electrode pad (121) in a first direction (D1); a third electrode pad (123) spaced apart from the first electrode pad (121) in a second direction (D2) intersecting the first direction (D1); and a fourth electrode pad (124) spaced apart from the second electrode pad (122) in the second direction (D2).

[0293] The substrate (100) may be provided in a first state (C1) or a second state (C2). The substrate (100) may be provided in a first state (C1) in which a first solder portion (S1) is arranged to connect the first electrode pad (121) and the third electrode pad (123), and a second solder portion (S2) is arranged to connect the second electrode pad (122) and the fourth electrode pad (124). Alternatively, the substrate (100) may be provided in a second state (C2) in which a third solder portion (S3) is arranged on the first electrode pad (121), a fourth solder portion (S4) is arranged on the second electrode pad (122), and a fifth solder portion (S5) is arranged to connect the third electrode pad (123) and the fourth electrode pad (124).

[0294] When the substrate (100) is provided in the first state (C1), the light-emitting diode (210) may be a single first light-emitting diode (210a) having a first size. When the substrate (100) is provided in the second state (C2), the light-emitting diode (210) may be a plurality of second light-emitting diodes (210b) having a second size smaller than the first size.

[0295] While the substrate is prepared in the first state (C1), the anode (211a) of the light-emitting diode (210a) is arranged to contact the first solder portion (S1) and is electrically connectable to the first electrode pad (121). While the substrate is prepared in the first state (C1), the cathode (212a) of the light-emitting diode (210a) is arranged to contact the second solder portion (S2) and is electrically connectable to the second electrode pad (122).

[0296] The light emitting diode may be a first light emitting diode (210ba). The light source device (40) may further include a second light emitting diode (210bb) that is electrically connectable to the first light emitting diode and is provided to be covered by the optical dome (220). While the substrate is prepared in the second state (C2), the anode (211ba) of the first light emitting diode (210ba) may be provided to contact the third solder portion (S3) and be electrically connectable to the first electrode pad (121). While the substrate is prepared in the second state (C2), the cathode (212ba) of the first light emitting diode (210ba) may be provided to contact the fifth solder portion (S5). While the substrate is prepared in the second state (C2), the anode (211bb) of the second light-emitting diode (210bb) is arranged to contact the fifth solder portion (S5) and is electrically connectable to the cathode (212ba) of the first light-emitting diode (210ba). While the substrate is prepared in the second state (C2), the cathode (212bb) of the second light-emitting diode (210bb) is arranged to contact the fourth solder portion (S4) and is electrically connectable to the second electrode pad (122).

[0297] When a first mask (600a) is placed on the substrate (100) and solder is applied thereto, and the first mask is separated from the substrate, a first solder portion (S1) may be placed to connect the first electrode pad (121) and the third electrode pad (123), and a second solder portion (S2) may be placed to connect the second electrode pad (122) and the fourth electrode pad (124). When a second mask (600b) is placed on the substrate (100) and solder is applied thereto, and the second mask is separated from the substrate, a third solder portion (S3) may be placed on the first electrode pad (121), a fourth solder portion (S4) may be placed on the second electrode pad (122), and a fifth solder portion (S5) may be placed to connect the third electrode pad (123) and the fourth electrode pad (124).

[0298] The first mask (600a) may include a first opening (610) corresponding to (e.g., overlapping) the first electrode pad (121), the third electrode pad (123), and an area between the first electrode pad and the third electrode pad, such that the solder passes through the first opening and is disposed on the substrate, thereby forming the first solder portion. The first mask (600a) may include a second opening (620) corresponding to (e.g., overlapping) the second electrode pad (122), the fourth electrode pad (124), and an area between the second electrode pad and the fourth electrode pad, such that the solder passes through the second opening and is disposed on the substrate, thereby forming the second solder portion.

[0299] The second mask (600b) may include a first opening (630) corresponding to (e.g., overlapping with) the first electrode pad (121) to form the third solder portion (S3) by allowing the solder to pass through the first opening and be placed on the substrate. The second mask (600b) may include a second opening (640) corresponding to (e.g., overlapping with) the second electrode pad (122) to form the fourth solder portion (S4) by allowing the solder to pass through the second opening and be placed on the substrate. The second mask (600b) may include a third opening (650) corresponding to (e.g., overlapping) the third electrode pad (123), the fourth electrode pad (124), and an area between the third electrode pad and the fourth electrode pad, such that the solder passes through the third opening and is disposed on the substrate, thereby forming the fifth solder portion (S5).

[0300] The light emitting diode may be a first light emitting diode (210ba). The light source device (40) may further include a second light emitting diode (210bb) that is spaced apart from the first light emitting diode (210ba) and is arranged to be covered by the optical dome (220).

[0301] The first light-emitting diode (210ba) and the second light-emitting diode (210bb) can be arranged along the first direction (D1).

[0302] The distance (L) between the first light-emitting diode (210ba) and the second light-emitting diode (210bb) may be 100 μm to 300 μm.

[0303] The third electrode pad (123) and the fourth electrode pad (124) can be formed integrally.

[0304] The cathode (212ba) of the first light-emitting diode (210ba) may be placed on the third electrode pad (123) and a portion of the fourth electrode pad (124). The anode (211bb) of the second light-emitting diode (210bb) may be placed on the remaining portion of the third electrode pad (123) and the fourth electrode pad (124).

[0305] The first electrode pad (121) and the fourth electrode pad (124) may be arranged diagonally with respect to the first direction (D1) and the second direction (D2). The second electrode pad (122) and the third electrode pad (123) may be arranged in the diagonal direction.

[0306] The substrate (100) may include a base (110) having insulation; a conductive layer (120) disposed on the base; and a protective layer (130) disposed on the conductive layer and including an exposed portion (131) provided to expose a portion of the conductive layer. The first electrode pad (121), the second electrode pad (122), the third electrode pad (123), and the fourth electrode pad (124) may be formed as the conductive layer (120) is exposed through the exposed portion (131).

[0307] According to one embodiment of the present disclosure, a method for manufacturing a light source device (40) including a substrate (100), at least one light emitting diode (210), and an optical dome (220) may include: placing a mask (600) on the substrate (100) (1000); applying solder to the mask (600) (2000); separating the mask (600) from the substrate (100) (3000); mounting the at least one light emitting diode (210) on the substrate (100) (4000); and placing the optical dome (220) on the substrate (100) so as to cover the at least one light emitting diode (210) (5000). The substrate (100) includes: a first electrode pad (121) to which a positive voltage is applied; A negative voltage is applied, and may include a second electrode pad (122) spaced apart from the first electrode pad (121) in a first direction (D1); a third electrode pad (123) spaced apart from the first electrode pad (121) in a second direction (D2) intersecting the first direction (D1); and a fourth electrode pad (124) spaced apart from the second electrode pad (122) in the second direction (D2).

[0308] The mask (600a) may include a first opening (610) corresponding to (e.g., overlapping) the first electrode pad (121), the third electrode pad (123), and the area between the first electrode pad and the third electrode pad; and a second opening (620) corresponding to (e.g., overlapping) the second electrode pad (122), the fourth electrode pad (124), and the area between the second electrode pad and the fourth electrode pad. The solder applied to the mask (600a) may be arranged to pass through the first opening (610) and the second opening (620) and be placed on the substrate (100).

[0309] The mask (600b) may include a third opening (630) corresponding to (e.g., overlapping) the first electrode pad (121); a fourth opening (640) corresponding to (e.g., overlapping) the second electrode pad (122); and a fifth opening (650) corresponding to (e.g., overlapping) the third electrode pad (123), the fourth electrode pad (124), and an area between the third electrode pad (123) and the fourth electrode pad (124). The solder applied to the mask (600b) may be arranged to pass through the third opening (630), the fourth opening (640), and the fifth opening (650) and be placed on the substrate (100).

[0310] The third electrode pad (123) and the fourth electrode pad (124) may be formed integrally. The mask (600c) may include a sixth opening (660) corresponding to the first electrode pad (121); a seventh opening (670) corresponding to (e.g., overlapping with) the second electrode pad (122); an eighth opening (680) corresponding to (e.g., overlapping with) a portion of the third electrode pad (123) and the fourth electrode pad (124); and a fourth opening (690) corresponding to (e.g., overlapping with) the remaining portion of the third electrode pad (123) and the fourth electrode pad (124). The solder applied to the mask may be arranged to pass through the sixth opening (660), the seventh opening (670), the eighth opening (680), and the fourth opening (690) and be placed on the substrate (100).

[0311] The at least one light emitting diode (210) may include a first light emitting diode (210ba) covered by the optical dome (220); and a second light emitting diode (210bb) spaced apart from the first light emitting diode (210ba) in the first direction (D1) and covered by the optical dome (220).

[0312] According to various embodiments of the present disclosure, light source devices with various resolutions can be implemented using a single substrate. For example, substrates for 4K display devices and substrates for 8K display devices may not be required. 4K display devices and 8K display devices can be manufactured using just one type of substrate. This reduces the number of production lines and facilitates substrate management. The manufacturing efficiency of light source devices can be increased.

[0313] According to various embodiments of the present disclosure, a plurality of light-emitting diodes can be arranged within a single optical dome. This can provide a light source device having improved brightness and image quality at the same driving voltage.

[0314] Additional aspects of the present disclosure may be understood through the detailed description or by studying the present disclosure.

[0315] Although non-limiting embodiments of the present disclosure have been specifically described with reference to the accompanying drawings, it will be understood by those skilled in the art that various modifications may be made therein without departing from the technical spirit and scope of the present disclosure.

Claims

1. Substrate; At least one light emitting diode on the substrate; and an optical dome on the substrate covering the at least one light emitting diode; The above substrate is, A first electrode pad configured to receive a positive voltage; A second electrode pad arranged to receive a negative voltage and spaced apart from the first electrode pad in a first direction; a third electrode pad spaced apart from the first electrode pad in a second direction intersecting the first direction; and A light source device comprising a fourth electrode pad spaced apart from the second electrode pad in the second direction.

2. In paragraph 1, A first solder portion connecting the first electrode pad and the third electrode pad; and A light source device further comprising a second solder portion connecting the second electrode pad and the fourth electrode pad.

3. In paragraph 1, A third solder portion on the first electrode pad; a fourth solder portion on the second electrode pad; and A light source device further comprising a fifth solder portion connecting the third electrode pad and the fourth electrode pad.

4. In paragraph 2, A light source device wherein at least one light emitting diode is a light emitting diode.

5. In paragraph 3, A light source device in which at least one light emitting diode is a plurality of light emitting diodes.

6. In paragraph 2, The anode of at least one light-emitting diode is in contact with the first solder portion and is electrically connected to the first electrode pad, A light source device in which the cathode of at least one light-emitting diode is in contact with the second solder portion and is electrically connected to the second electrode pad.

7. In paragraph 3, wherein said at least one light emitting diode comprises a first light emitting diode and a second light emitting diode electrically connected to each other and covered by said optical dome, The anode of the first light-emitting diode is in contact with the first solder portion and is electrically connected to the first electrode pad, The cathode of the first light-emitting diode is in contact with the third solder portion, The anode of the second light-emitting diode is in contact with the third solder portion and is electrically connected to the cathode of the first light-emitting diode, A light source device in which the cathode of the second light-emitting diode is in contact with the second solder portion and electrically connected to the second electrode pad.

8. In paragraph 1, A light source device comprising a first light emitting diode and a second light emitting diode, wherein at least one of the light emitting diodes is spaced apart from each other and covered by the optical dome.

9. In paragraph 8, A light source device in which the first light-emitting diode and the second light-emitting diode are arranged along the first direction.

10. In paragraph 8, A light source device in which the distance between the first light-emitting diode and the second light-emitting diode is 100 μm to 300 μm.

11. In paragraph 8, A light source device in which the third electrode pad and the fourth electrode pad are formed integrally with each other.

12. In paragraph 11, The cathode of the first light-emitting diode is disposed on a part of the third electrode pad and a part of the fourth electrode pad, A light source device in which the anode of the second light-emitting diode is disposed on the remaining part of the third electrode pad and the remaining part of the fourth electrode pad.

13. In paragraph 1, The first electrode pad and the fourth electrode pad are arranged diagonally with respect to the first direction and the second direction, The second electrode pad and the third electrode pad are a light source device arranged in the diagonal direction.

14. In paragraph 1, The above substrate is, A base with insulating properties; a conductive layer disposed on the above base; and A protective layer disposed on the conductive layer and including a window exposing a portion of the conductive layer; A light source device in which the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad are formed as the conductive layer is exposed through the window.

15. Place the mask on the substrate; Apply solder to the above mask; Separating the mask from the substrate; Mounting at least one light emitting diode on the substrate; Covering said at least one light emitting diode with at least one optical dome, The above substrate is, A first electrode pad configured to receive a positive voltage; A second electrode pad arranged to receive a negative voltage and spaced apart from the first electrode pad in a first direction; a third electrode pad spaced apart from the first electrode pad in a second direction intersecting the first direction; and A method for manufacturing a light source device, comprising: a fourth electrode pad spaced apart from the second electrode pad in the second direction.

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