Ultra-thin micro electrostatic module and production method

Abstract

Provided in the present invention are an ultra-thin micro-electrostatic module and a production method. The ultra-thin micro-electrostatic module comprises: a micro-electrostatic module core, which comprises several air channels for air circulation and is provided with fixing slots; a frame body, which comprises a plurality of frames arranged corresponding to the micro-electrostatic module core, the micro-electrostatic module core being accommodated inside the frame body; and fixing components, which are embedded in the fixing slots, the fixing components being connected to the frame body and the micro-electrostatic module core, thus fixing the micro-electrostatic module core. The ultra-thin micro-electrostatic module in the present invention solves the technical problem of a loss in purification efficiency and dust-holding capacity in micro-electrostatic modules in the relevant art due to an outer frame occupying the space in the dimension of thickness.

Description

Ultra-thin micro-electrostatic module and production method TECHNICAL FIELD

[0001] The present application relates to the technical field of micro-electrostatic technology, in particular to an ultra-thin micro-electrostatic module and a production method. BACKGROUND

[0002] At present, the mainstream air purification technologies are medium filtration technology and electrostatic purification technology. The medium filtration technology is mature and relatively stable in operation, but has high wind resistance, high energy consumption of the fan, easy breeding of bacteria and viruses, cannot kill bacteria and disinfect, has odor, needs frequent replacement, generates a large amount of consumables, has high operation and maintenance costs, is not energy-saving and environmentally friendly. The electrostatic purification technology can remove particulate matter, kill bacteria and disinfect, has low resistance, and can be repeatedly washed, but has low purification efficiency, high relative power, easy to fire, high ozone, poor safety, short service life, heavy weight, high maintenance cost, is not energy-saving and environmentally friendly. Therefore, it cannot be widely applied in the field of light pollution air purification, and can only be applied in a few scenes. The micro-electrostatic technology combines the advantages of medium filtration technology and electrostatic purification technology, and has the technical advantages of high-efficiency purification and dust removal, sterilization and disinfection, ultra-low power, low resistance, high safety, repeated washing, no consumables, and service life of up to 10 years.

[0003] However, the micro-electrostatic module used in the existing micro-electrostatic technology has an outer frame, which occupies the size in the thickness direction. In the scene where the installation space is limited, the thickness of the module core of the micro-electrostatic module is reduced, and the efficiency and dust capacity are lost due to the insufficient utilization in the thickness direction.

[0004] Therefore, the prior art needs to be further developed. SUMMARY

[0005] The present application aims to overcome the above technical deficiencies, and provides an ultra-thin micro-electrostatic module and a production method to solve the technical problem of loss of purification efficiency and dust capacity of the micro-electrostatic module due to the occupation of the size in the thickness direction by the outer frame in the related art.

[0006] To achieve the above technical purpose, the present application adopts the following technical scheme: an ultra-thin micro-electrostatic module is provided, which comprises: a micro-electrostatic module core, the micro-electrostatic module core comprises a plurality of air passages for air flow, and the micro-electrostatic module core is provided with a fixing groove; a frame, the frame comprises a plurality of frames corresponding to the micro-electrostatic module core, and the frame accommodates the micro-electrostatic module core inside; a fixing component, the fixing component is embedded in the fixing groove, and the fixing component is connected with the frame and the micro-electrostatic module core to fix the micro-electrostatic module core.

[0007] Further, the fixing component comprises a boss integrally formed with the frame, the boss is arranged to protrude in the direction close to the micro-electrostatic module core, and the boss is embedded in the fixing groove.

[0008] Further, the fixing groove comprises a first connecting surface and a second connecting surface connected to each other, and the extending directions of the first connecting surface and the second connecting surface are perpendicular to each other; or the second connecting surface is an arc surface.

[0009] Further, the fixing groove comprises a first connecting surface, and the first connecting surface is an inclined surface; or the first connecting surface is an arc surface.

[0010] Further, the micro-electrostatic module core comprises a first dust collecting surface and a second dust collecting surface arranged oppositely, and a plurality of air passages for air circulation are arranged between the first dust collecting surface and the second dust collecting surface; the first dust collecting surface is arranged protruding from the frame along the extending direction of the air passages; and / or the second dust collecting surface is arranged protruding from the frame along the extending direction of the air passages.

[0011] Further, the fixing component comprises insulating glue, and the insulating glue is filled between the frame and the fixing groove.

[0012] Further, the micro-electrostatic module core comprises a plurality of dust collecting sheets arranged in stacks and a plurality of separation pieces arranged between the dust collecting sheets, and the air passages are formed between the dust collecting sheets and the separation pieces; the dust collecting sheets are wrapped with conductive materials, and the conductive materials comprise avoiding grooves corresponding to the fixing grooves.

[0013] Further, the conductive materials are electrically connected to the high-voltage power supply through electrode strips, and the high-voltage power supply is a high-voltage power supply installed in the frame or a high-voltage power supply installed outside the frame.

[0014] Further, the fixing component comprises a plurality of fixing components, and the plurality of fixing components are arranged one by one corresponding to the plurality of frames; and the fixing groove is correspondingly provided with a plurality of fixing grooves.

[0015] Further, the fixing component comprises a first fixing component and a second fixing component arranged at intervals, the first fixing component is connected to one end of the frame, and the second fixing component is connected to the end of the frame away from the first fixing component; and the fixing groove comprises a first fixing groove and a second fixing groove arranged at intervals, the first fixing groove is arranged corresponding to the first fixing component, and the second fixing groove is arranged corresponding to the second fixing component.

[0016] Further, the fixing groove comprises a first fixing groove opened on the leeward surface of the micro-electrostatic module core, and the boss is embedded in the first fixing groove to support the micro-electrostatic module core.

[0017] A production method, the production method is suitable for the ultra-thin micro-electrostatic module, and the production method comprises the following steps: obtaining a micro-electrostatic module core; machining a fixing groove on the micro-electrostatic module core, and high temperature generated in the machining process causes melting in the fixing groove; sequentially connecting a plurality of frames to the micro-electrostatic module core corresponding; embedding a fixing component in the fixing groove; and completing the assembly of the ultra-thin micro-electrostatic module.

[0018] Further, the method for processing the fixing groove on the micro-electrostatic module core comprises: fixing the micro-electrostatic module core on a hot cutting device, and processing the fixing groove through hot cutting. Advantages:

[0019] 1. The ultra-thin micro-electrostatic module in the embodiment improves the dust holding capacity and purification efficiency of the micro-electrostatic module, reduces the use cost of the filter core, solves the sealing problem of the micro-electrostatic module through the hot cutting process, and ensures that the ultra-thin micro-electrostatic module has ideal waterproof effect.

[0020] 2. The fixing component is embedded in the fixing groove and connected with the frame body and the micro-electrostatic module core respectively, so as to fix the micro-electrostatic module core on the frame body and complete the installation of the micro-electrostatic module core. The fixing groove is formed on the micro-electrostatic module core, and the step structure is formed on the frame body. The step structure and the fixing groove are fixed by mutual clamping. The fixing of the micro-electrostatic module core is realized. The dust holding area occupied by the fixed micro-electrostatic module core is reduced. The connection area of the outer frame and the micro-electrostatic module core is reduced. The overall thickness of the outer frame is reduced. The structure design of the ultra-thin frame is realized. The dust holding capacity of the micro-electrostatic module is improved. The use cost of the filter core is reduced. The purification efficiency is improved. The technical problem that the purification efficiency and the dust holding capacity are lost due to the size of the outer frame in the thickness direction of the micro-electrostatic module in the related art is solved.

[0021] 3. In the ultra-thin micro-electrostatic module in the embodiment, air first passes through the windward surface of the micro-electrostatic module and then passes through the leeward surface. In order to increase the structural strength of the micro-electrostatic module core, the fixing component adopts the structure design of the boss. That is, a first fixing groove is formed on the leeward surface of the micro-electrostatic module core, and the boss is clamped with the first fixing groove. The wind pressure pushes the micro-electrostatic module core on the boss structure, which plays a good supporting role. The use of the frame material is reduced. The assembly difficulty is reduced. At the same time, the deformation and separation of the micro-electrostatic module core from the frame body can be prevented. The assembly strength and stability of the micro-electrostatic module core are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0022] Fig. 1 is a partial view of the ultra-thin micro-electrostatic module adopted in the embodiment of the application;

[0023] Fig. 2 is a structural schematic view of the first embodiment of the ultra-thin micro-electrostatic module adopted in the embodiment of the application;

[0024] Fig. 3 is a structural schematic view of the second embodiment of the ultra-thin micro-electrostatic module adopted in the embodiment of the application;

[0025] Fig. 4 is a structural schematic view of the third embodiment of the ultra-thin micro-electrostatic module adopted in the embodiment of the application;

[0026] Fig. 5 is a structural schematic diagram of a fourth embodiment of the ultra-thin micro-electrostatic module according to the present application;

[0027] Fig. 6 is a structural schematic diagram of a fifth embodiment of the ultra-thin micro-electrostatic module according to the present application;

[0028] Fig. 7 is a structural schematic diagram of a dust collecting sheet of the ultra-thin micro-electrostatic module according to the present application;

[0029] Fig. 8 is a structural schematic diagram of a first fixing component of the ultra-thin micro-electrostatic module according to the present application.

[0030] In the above drawings, the following reference signs are used: 10, air passage; 1, micro-electrostatic module core; 11, first dust collecting surface; 13, second dust collecting surface; 2, fixing groove; 21, first fixing groove; 211, first connecting surface; 212, second connecting surface; 22, second fixing groove; 3, frame; 31, frame; 4, fixing component; 41, boss; 411, first fixing component; 412, second fixing component; 42, insulating glue; 100, dust collecting sheet; 101, spacer; 103, conductive material; 104, avoiding groove. DETAILED DESCRIPTION

[0031] In order to make the persons skilled in the art better understand the present application, the technical solutions in the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the persons skilled in the art without creative labor should be within the protection scope of the present application.

[0032] According to the embodiments of the present application, an ultra-thin micro-electrostatic module is provided, please refer to Figs. 1 to 8, which comprises: a micro-electrostatic module core 1, the micro-electrostatic module core 1 comprises a plurality of air passages 10 for air flow, the micro-electrostatic module core 1 is provided with a fixing groove 2; a frame 3, the frame 3 comprises a plurality of frame 31 corresponding to the micro-electrostatic module core 1, the frame 3 internally accommodates the micro-electrostatic module core 1; a fixing component 4, the fixing component 4 is embedded in the fixing groove 2, the fixing component 4 is connected with the frame 3 and the micro-electrostatic module core 1 to fix the micro-electrostatic module core 1.

[0033] The fixed part 4 is embedded in the fixed groove 2 and connected with the frame 3 and the micro-electrostatic module core 1 respectively, so as to fix the micro-electrostatic module core 1 on the frame 3, complete the installation of the micro-electrostatic module core 1, open the fixed groove 2 on the micro-electrostatic module core 1, form a stepped structure on the frame 3, and realize the fixation of the micro-electrostatic module core 1 through the mutual clamping of the stepped structure and the fixed groove 2, so as to reduce the dust holding surface occupied by the fixed micro-electrostatic module core, reduce the connection area of the outer frame and the micro-electrostatic module core, reduce the overall thickness of the outer frame, realize the structure design of the ultra-thin frame, improve the dust holding capacity of the micro-electrostatic module, reduce the use cost of the filter core, improve the purification efficiency, and solve the technical problems of the loss of purification efficiency and dust holding capacity caused by the size of the outer frame in the thickness direction in the related art.

[0034] The ultra-thin micro-electrostatic module in the embodiment improves the dust holding capacity and purification efficiency of the micro-electrostatic module, reduces the use cost of the filter core, solves the sealing problem of the micro-electrostatic module through the hot cutting process, and ensures that the ultra-thin micro-electrostatic module has ideal waterproof effect.

[0035] In the ultra-thin micro-electrostatic module of some embodiments, referring to FIG. 2, the fixed part 4 includes a boss 41 integrally formed with the frame 31, the boss 41 is arranged to protrude in the direction close to the micro-electrostatic module core 1, and the boss 41 is embedded in the fixed groove 2. The boss 41 is embedded in the fixed groove 2 to increase the supporting force of the fixed part 4 on the micro-electrostatic module core 1 by arranging the boss 41, the boss 41 is clamped with the fixed groove 2 to stop and fix the micro-electrostatic module core, the thickness of the frame 31 is reduced, and the dust holding surface of the micro-electrostatic module core is reduced.

[0036] In some embodiments, the boss 41 is an L-shaped boss.

[0037] In the ultra-thin micro-electrostatic module of some embodiments, referring to FIGS. 2-3, the fixed groove 2 includes a first connecting surface 211 and a second connecting surface 212 connected with each other.

[0038] Specifically, the fixed groove 2 is arranged on the side wall of the micro-electrostatic module core 1 to increase the wrapping of the frame 3 and the fixed part 4 on the micro-electrostatic module core and improve the fixing strength of the micro-electrostatic module core.

[0039] It can be understood that the fixed groove 2 can also be arranged on the end surface of the micro-electrostatic module core 1 and spaced from the electrode groove on the end surface, and at this time, the dust holding surface of the micro-electrostatic module core can reach the maximum.

[0040] In the ultra-thin micro-electrostatic module of some embodiments, referring to FIG. 2, the extension directions of the first connecting surface 211 and the second connecting surface 212 are perpendicular to each other.

[0041] Specifically, the fixed groove 2 is an L-shaped structure, and is clamped and fixed with the boss 41. The fixed groove 2 in the L-shaped structure can reduce the opening area of the fixed groove 2 and increase the dust holding surface of the micro-electrostatic module core 1. In addition, the boss 41 is in close contact with the fixed groove 2 in the L-shaped structure, which reduces the possibility of deformation of the frame 31 and improves the structural strength of the frame 31.

[0042] In some embodiments of the ultra-thin micro-electrostatic module, the second connecting surface 212 is an arc surface, as shown in FIG. 3.

[0043] Specifically, by setting the second connecting surface 212 as an arc surface, after the frame 3 and the micro-electrostatic module core 1 are assembled, there is a gap in the fixed groove 2 except for the boss 41. At this time, the insulating glue can be injected to increase the stability of the assembly and increase the sealing effect of the micro-electrostatic module core, preventing the conductive material in the micro-electrostatic module core from leaking and discharging.

[0044] In some embodiments of the ultra-thin micro-electrostatic module, the fixed groove 2 includes a first connecting surface 211, and the first connecting surface 211 is an inclined surface, as shown in FIGS. 4-6.

[0045] Specifically, the fixed groove 2 is opened on the side wall of the micro-electrostatic module core 1. By using a single fixed groove 2, the cross-sectional area and capacity of the fixed groove 2 can be reduced, the amount of insulating glue used can be reduced, and the size of the avoidance groove 104 can be reduced, thereby increasing the available area of the conductive material 103.

[0046] In some embodiments of the ultra-thin micro-electrostatic module, the first connecting surface 211 is an arc surface, as shown in FIG. 6.

[0047] Specifically, by setting the first connecting surface 211 as an arc surface, compared with the first connecting surface 211 in the inclined surface structure, when the fixed groove 2 is filled with insulating glue, the adhesion of the insulating glue can be increased, and the assembly strength of the micro-electrostatic module core 1 and the frame 3 can be increased.

[0048] In some embodiments of the ultra-thin micro-electrostatic module, the micro-electrostatic module core 1 includes a first dust collecting surface 11 and a second dust collecting surface 13 arranged oppositely, and a plurality of air passages 10 for air circulation are arranged between the first dust collecting surface 11 and the second dust collecting surface 13, as shown in FIG. 4. The first dust collecting surface 11 is arranged protruding from the frame 31 along the extension direction of the air passage 10; and / or, the second dust collecting surface 13 is arranged protruding from the frame 31 along the extension direction of the air passage 10.

[0049] It can be understood that the micro-electrostatic module core assembly structure in the application can adaptively thicken the thickness of the micro-electrostatic module core or use a smaller width specification frame, and can stably realize the assembly of the micro-electrostatic module core. The increase in the thickness of the micro-electrostatic module core can increase the length of the air channel, thereby increasing the dust collection efficiency of the micro-electrostatic module core 1.

[0050] In some embodiments, the structure design of increasing the thickness of the micro-electrostatic module core on one side can be used to thicken the first dust collection surface 11 or the second dust collection surface 13 on one side.

[0051] In some embodiments, the structure design of increasing the thickness of the micro-electrostatic module core on both sides can be used to thicken the first dust collection surface 11 and the second dust collection surface 13.

[0052] In some embodiments of the ultra-thin micro-electrostatic module, referring to FIGS. 4-6, the fixing component 4 includes insulating glue 42 filled between the frame 31 and the fixing groove 2.

[0053] Specifically, by filling the insulating glue 42 in the fixing groove 2, the frame 31 is stably connected with the fixing groove 2, and at the same time, a sealing effect is achieved, preventing the problem of discharge of the conductive material due to the too thin and too close edge of the conductive material 103 in the fixing groove 2, and improving the electrical safety.

[0054] In the ultra-thin micro-electrostatic module of the present embodiment, referring to FIG. 7, the micro-electrostatic module core 1 includes a plurality of dust collection sheets 100 stacked and arranged and a plurality of isolation pieces 101 arranged between the dust collection sheets 100, and the air channel 10 is formed between the dust collection sheet 100 and the isolation piece 101. The dust collection sheet 100 is wrapped with a conductive material 103, and the conductive material 103 includes an avoidance groove 104 corresponding to the fixing groove 2.

[0055] It should be noted that the micro-electrostatic module wraps the conductive material 103 with a dielectric material to form an electrode plate, and uses the strong electric field formed inside the electrode plate after the electrode plate is electrified to capture charged particulate matters in the air.

[0056] Specifically, the electrode groove is provided with an electrode strip, and the electrode strip is in contact with the conductive material 103 in the dust collection sheet 100 to realize electrical connection.

[0057] Specifically, after the fixing groove 2 is formed on the micro electrostatic module core 1, in order to prevent the fixing groove 2 from being too close to the conductive material inside the dust collecting sheet and prevent the discharge problem of the conductive material and the external conductive body, the conductive material is adaptively contracted, and the avoiding groove 104 is formed on the conductive material 103 to avoid the fixing groove 2. The shape of the avoiding groove 104 is adapted to the shape of the fixing groove 2, the distance between the edge of the conductive material 103 and the edge of the dust collecting sheet is ensured to meet the electrical safety distance, and the electrical safety is ensured. At the same time, in order to ensure the purification effect of the micro electrostatic module, the larger the area of the conductive material 103, the larger the purification effect and dust capacity of the micro electrostatic module, therefore, the distance between the edge of the avoiding groove 104 and the edge of the dust collecting sheet is greater than the distance between the conductive material 103 at the non-avoiding groove 104 and the edge of the dust collecting sheet, which ensures the electrical safety and maximizes the purification effect and dust capacity.

[0058] In the ultra-thin micro electrostatic module of the embodiment, referring to FIG. 7, the conductive material 103 is electrically connected to the high-voltage power supply through the electrode strip, and the high-voltage power supply is a high-voltage power supply installed in the frame 3 or a high-voltage power supply installed outside the frame 3.

[0059] In the charging device of the embodiment, the electrode body is connected to the high-voltage power supply, and the high-voltage power supply is an internal high-voltage power supply or an external high-voltage power supply.

[0060] Specifically, by using the internal high-voltage power supply, a power supply compartment is additionally provided in any one of the side frames 31 of the frame 3, and the high-voltage power supply is placed in the power supply compartment. Since a strong electric field needs to be generated in the micro electrostatic module, a high-voltage power supply is required for power supply. When the high-voltage power supply is external, the high-voltage electrode box is exposed to the air for a long time, which may cause the electrode box to have a creepage and arc due to dirt on the high-voltage electrode box, thereby affecting the discharge efficiency of the electrode head and even causing damage to the charging device or the high-voltage power supply. The internal power supply can improve the reliability of the charging device.

[0061] In the ultra-thin micro electrostatic module of the embodiment, the frame 3 includes a plurality of connecting components, and the connecting components are respectively connected to two adjacent side frames 31 to make the plurality of side frames 31 connected end to end. Specifically, the connecting components are corner tenons, and the assembly of the plurality of side frames 31 is completed through the plurality of connecting components.

[0062] In the ultra-thin micro electrostatic module of the embodiment, referring to FIG. 1, the fixing component 4 includes a plurality of fixing components 4, and the plurality of fixing components 4 are arranged one by one corresponding to the plurality of side frames 31; and the fixing groove 2 is correspondingly provided with a plurality of fixing grooves 2.

[0063] It can be understood that each side frame 31 is provided with a fixing component 4, and the micro electrostatic module core 1 is provided with a corresponding fixing groove 2, and the stability of the assembly of the micro electrostatic module core 1 and the frame 3 is improved through the above arrangement.

[0064] In the super-thin micro-electrostatic module of the embodiment, referring to FIG. 8, the fixing component 4 comprises a first fixing component 411 and a second fixing component 412 arranged at intervals, the first fixing component 411 is connected with one end of the frame 31, and the second fixing component 412 is connected with the end of the frame 31 away from the first fixing component 411; the fixing groove 2 comprises a first fixing groove 21 and a second fixing groove 22 arranged at intervals, the first fixing groove 21 is arranged correspondingly with the first fixing component 411, and the second fixing groove 22 is arranged correspondingly with the second fixing component 412.

[0065] Specifically, the assembling structure in the embodiment is arranged on the first dust collecting surface 11 and the second dust collecting surface 13 of the micro-electrostatic module core, thereby improving the stability of the assembling of the micro-electrostatic module core 1 and the frame 3.

[0066] It should be noted that the first fixing component 411 and the second fixing component 412 and the first fixing groove 21 and the second fixing groove 22 can adopt symmetrical structure design or asymmetrical structure design.

[0067] In the super-thin micro-electrostatic module of the embodiment, the fixing groove 2 comprises the first fixing groove 21 arranged on the leeward surface of the micro-electrostatic module core 1, and the boss 41 is embedded in the first fixing groove 21 to support the micro-electrostatic module core 1.

[0068] Specifically, air first passes through the windward surface of the micro-electrostatic module and then passes through the leeward surface. In order to increase the structural strength of the micro-electrostatic module core, the fixing component adopts the structure design of the boss, that is, the first fixing groove 21 is arranged on the leeward surface of the micro-electrostatic module core 1, and the boss 41 is engaged with the first fixing groove 21. The wind pressure supports the micro-electrostatic module core on the boss structure, which plays a good supporting role, reduces the use of frame material, reduces the difficulty of assembly, and prevents the micro-electrostatic module core from deforming and separating from the frame 3, thereby ensuring the assembling strength and stability of the micro-electrostatic module core.

[0069] Embodiment 1

[0070] Referring to FIG. 2, the first fixing component 411 and the second fixing component 412 and the first fixing groove 21 and the second fixing groove 22 adopt symmetrical structure design, the first fixing component 411 and the second fixing component 412 are in the form of bosses, the first fixing groove 21 and the second fixing groove 22 comprise a first connecting surface 211 and a second connecting surface 212, and the extension directions of the first connecting surface 211 and the second connecting surface 212 are perpendicular to each other.

[0071] It can be understood that, by using the above embodiment, the micro-electrostatic module core 1 is fixed by the bosses on both sides, and at this time, the support strength of the frame 3 on the micro-electrostatic module core 1 is higher.

[0072] Embodiment 2

[0073] As shown in FIG. 3, the first fixing component 411 and the second fixing component 412 and the first fixing groove 21 and the second fixing groove 22 adopt a symmetrical structure design, the first fixing component 411 and the second fixing component 412 are in a boss structure, the first fixing groove 21 and the second fixing groove 22 include a first connecting surface 211 and a second connecting surface 212, and the second connecting surface 212 is an arc surface.

[0074] It can be understood that when the above embodiment is adopted, the insulating glue can be continuously filled in the fixing groove, the fixing strength and the sealing property of the micro-electrostatic module core body 1 can be increased, and the support strength of the frame body 3 to the micro-electrostatic module core body 1 is higher.

[0075] Embodiment 3

[0076] As shown in FIG. 4, the first fixing component 411 and the second fixing component 412 and the first fixing groove 21 and the second fixing groove 22 adopt an asymmetrical structure design, the first fixing component 411 is insulating glue, the second fixing component 412 is in a boss structure, the first fixing groove 21 is an inclined surface, the second fixing groove 22 includes a first connecting surface 211 and a second connecting surface 212, and the second connecting surface 212 is an arc surface.

[0077] It can be understood that when the above embodiment is adopted, the boss and the fixing groove clamped on the leeward surface can play a good supporting role.

[0078] Preferably, the thickness of the first dust collecting surface 11 is thickened to increase the dust collecting efficiency of the micro-electrostatic module core body, and at this time, the first fixing groove 21 is designed as an inclined surface, the occupied area of the first fixing groove 21 can be reduced, and the dust containing surface of the micro-electrostatic module core body 1 is increased.

[0079] Embodiment 4

[0080] As shown in FIG. 5, the first fixing component 411 and the second fixing component 412 adopt an asymmetrical structure design, the first fixing groove 21 and the second fixing groove 22 adopt a symmetrical structure design, the first fixing component 411 is insulating glue, the second fixing component 412 is in a boss structure, the first fixing groove 21 and the second fixing groove 22 include a first connecting surface 211 and a second connecting surface 212, and the second connecting surface 212 is an arc surface.

[0081] It can be understood that when the above embodiment is adopted, the boss and the fixing groove clamped on the leeward surface can play a good supporting role.

[0082] It can be understood that when the above embodiment is adopted, the second fixing groove 22 can also be continuously supplemented with insulating glue, and the two fixing grooves are filled with insulating glue, so that the sealing property of the micro-electrostatic module core body is increased.

[0083] Embodiment 5

[0084] Referring to FIG. 6, the first and second fixing components 411 and 412 and the first and second fixing grooves 21 and 22 are designed in a symmetrical structure, the first and second fixing components 411 and 412 are insulating glue, and the first and second fixing grooves 21 and 22 include a first connecting surface 211 which is an arc surface.

[0085] It can be understood that when the above embodiment is adopted, the two side dust collecting surfaces of the micro-electrostatic module core 1 are designed in a structure without protrusions, at this time, the thickness of the frame is the thinnest, and the dust collecting surface of the micro-electrostatic module core 1 reaches the maximum.

[0086] In the production method of the embodiment, referring to FIG. 1, the production method is suitable for the above-mentioned ultra-thin micro-electrostatic module, and the production method includes: obtaining a micro-electrostatic module core 1; machining a fixing groove 2 on the micro-electrostatic module core 1, high temperature generated in the machining process causes melting in the fixing groove 2; sequentially connecting a plurality of frames 31 with the micro-electrostatic module core 1 in correspondence; embedding a fixing component 4 in the fixing groove 2; and completing the assembly of the ultra-thin micro-electrostatic module.

[0087] In some embodiments, after the micro-electrostatic module core 1 is integrally formed, the fixing groove 2 is machined, high temperature generated in the machining process causes melting in the fixing groove 2, after the fixing groove 2 is machined, the frame 31 is connected with the micro-electrostatic module core 1 in correspondence, the protrusion 41 is clamped in the corresponding fixing groove 2, the connecting component is connected with each frame 31, and thus the assembly of the ultra-thin micro-electrostatic module is completed.

[0088] In some embodiments, after the micro-electrostatic module core 1 is integrally formed, the fixing groove 2 is machined, after the fixing groove 2 is machined, the frame 31 is connected with the micro-electrostatic module core 1 in correspondence, the connecting component is connected with each frame 31, and the insulating glue is filled in the fixing groove 2, and thus the assembly of the ultra-thin micro-electrostatic module is completed.

[0089] The ultra-thin micro-electrostatic module of the embodiment solves the sealing problem of the micro-electrostatic module by adopting a hot cutting process, high temperature generated in the machining process causes melting in the fixing groove 2, the micro-electrostatic module core 1 is hot-melted and liquefied to form a curled edge, the layers and the cutting edges between the layers are intermingled after cooling, the conductive material 103 can be completely wrapped without being damaged, and thus a sealing effect is generated between each dust collecting sheet of the micro-electrostatic module core 1, the occurrence of an electrical safety problem is avoided, and the ultra-thin micro-electrostatic module of the embodiment has a relatively ideal waterproof effect.

[0090] In some embodiments, when the frame 31 is fixed to the micro-electrostatic module core 1, a layer of glue can be applied around the inside of the frame 31 or along the first side wall 12 of the micro-electrostatic module core to increase the firmness and sealing of the connection between the frame 31 and the micro-electrostatic module core.

[0091] In the production method of some embodiments, referring to FIG. 1, the method for processing the fixing groove 2 on the micro-electrostatic module core 1 includes: fixing the micro-electrostatic module core 1 on a hot cutting device, and processing the fixing groove 2 by hot cutting.

[0092] Specifically, the edge of the micro-electrostatic module core 1 is fused and cut off by the electrode wire directional walking, and a seal is formed between the adjacent stacked isolation pieces after the fusion and cutting, so that the conductive material is completely sealed in the isolation piece, and it is ensured that the ultra-thin micro-electrostatic module of the embodiment can be repeatedly washed and soaked.

[0093] The above description is only the preferred embodiment of the present application, and cannot limit the scope of the present application. Any equivalent changes and modifications made within the scope of the present application should still be included in the scope of the present application.

Claims

1. An ultra-thin micro-electrostatic module, characterized in that, The utility model relates to a micro electrostatic module core (1) including several air passages (10) for air flow, the micro electrostatic module core (1) is provided with fixed groove (2), frame (3) including multiple edge frame (31) corresponding with the micro electrostatic module core (1) is arranged, the micro electrostatic module core (1) is contained in the frame (3) inside, fixed component (4) is embedded in the fixed groove (2), and the fixed component (4) is connected with the frame (3) and the micro electrostatic module core (1) to fix the micro electrostatic module core (1). The fixed component (4) includes a boss (41) integrally formed with the edge frame (31), the boss (41) is arranged to protrude in a direction close to the micro electrostatic module core (1), and the boss (41) is embedded in the fixed groove (2). The fixed groove (2) includes a first connecting surface (211) and a second connecting surface (212) connected to each other, and the extension directions of the first connecting surface (211) and the second connecting surface (212) are perpendicular to each other; or The second connecting surface (212) is an arc surface.

2. The ultra-thin micro-electrostatic module according to claim 1, wherein, The fixed groove (2) includes a first connecting surface (211), and the first connecting surface (211) is an inclined surface; or 3. The ultra-thin micro-electrostatic module according to claim 1, wherein, The first connecting surface (211) is an arc surface. The micro electrostatic module core (1) includes oppositely arranged first dust collecting surfaces (11) and second dust collecting surfaces (13), and a plurality of air passages (10) for air flow are arranged between the first dust collecting surfaces (11) and the second dust collecting surfaces (13); 4. The ultra-thin micro-electrostatic module according to claim 1, wherein, The first dust collecting surfaces (11) protrude from the edge frame (31) along the extension direction of the air passage (10); and / or The second dust collecting surfaces (13) protrude from the edge frame (31) along the extension direction of the air passage (10).

5. The ultra-thin micro-electrostatic module according to claim 1, wherein, The fixed component (4) includes insulating glue (42) filled between the edge frame (31) and the fixed groove (2). The micro electrostatic module core (1) includes a plurality of dust collecting sheets (100) arranged in stacks and a plurality of separators (101) arranged between the dust collecting sheets (100), the air passages (10) are formed between the dust collecting sheets (100) and the separators (101), the dust collecting sheets (100) are wrapped with conductive materials (103), and the conductive materials (103) include avoidance grooves (104) corresponding to the fixed groove (2). The conductive materials (103) are electrically connected to a high-voltage power supply through electrode strips, and the high-voltage power supply is a high-voltage power supply installed in the frame (3) or a high-voltage power supply installed outside the frame (3).

6. The ultra-thin micro-electrostatic module according to claim 1, wherein, The fixed component (4) includes a plurality of fixed components (4) corresponding to a plurality of edge frames (31); and 7. The ultra-thin micro-electrostatic module of claim 1, wherein, The fixed groove (2) is correspondingly provided with a plurality of fixed grooves (2).

8. The ultra-thin micro-electrostatic module according to claim 7, wherein, ​ 9. The ultra-thin micro-electrostatic module of claim 1, wherein, ​ ​ 10. The ultra-thin micro-electrostatic module of claim 1, wherein, The fixing part (4) comprises a first fixing part (411) and a second fixing part (412) arranged at intervals, the first fixing part (411) is connected with one end of the frame (31), and the second fixing part (412) is connected with the other end of the frame (31) away from the first fixing part (411); The fixing groove (2) comprises a first fixing groove (21) and a second fixing groove (22) arranged at intervals, the first fixing groove (21) is arranged correspondingly with the first fixing part (411), and the second fixing groove (22) is arranged correspondingly with the second fixing part (412).

11. The ultra-thin micro-electrostatic module according to claim 2, wherein, The fixing groove (2) comprises a first fixing groove (21) opened on the leeward surface of the micro electrostatic module core (1), and the boss (41) is embedded in the first fixing groove (21) to support the micro electrostatic module core (1).

12. A production method suitable for the ultrathin micro electrostatic module according to any one of claims 1-11, the production method comprising: obtaining the micro electrostatic module core (1); processing the fixing groove (2) on the micro electrostatic module core (1), and the high temperature generated in the processing process causes the fixing groove (2) to melt; connecting a plurality of frames (31) with the micro electrostatic module core (1) correspondingly in sequence; embedding the fixing part (4) in the fixing groove (2); completing the assembly of the ultrathin micro electrostatic module.

13. The production method according to claim 12, characterized by, The method for processing the fixing groove (2) on the micro electrostatic module core (1) comprises: fixing the micro electrostatic module core (1) on a hot cutting device, and processing the fixing groove (2) by hot cutting.

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