Nozzle for dispensing dielectric fluid

Abstract

The invention relates to a bidirectional nozzle (50) for dispensing dielectric fluid, comprising a fluid-dispensing side window (55) on one side of the nozzle (50) and a fluid-dispensing axial port (56) at one axial end of the nozzle (50), the fluid-dispensing side window (55) and the fluid-dispensing axial port (56) being oriented in two different directions, in particular at 90° with respect to one another, the dispensing side window (55) and the dispensing axial port (56) being configured to be immersed in the dielectric fluid contained in an enclosure.

Description

[0001] DESCRIPTION

[0002] Title: Dielectric Fluid Dispensing Nozzle

[0003] [1] The present invention relates to the field of immersion cooling in a dielectric fluid, particularly as applied to a power electronic device such as an inverter for an electric vehicle. In particular, the present invention relates to a cooling subassembly for an electronic device, as well as a nozzle for distributing the dielectric fluid.

[0004] [2] An inverter, which is configured to convert direct current (DC) to alternating current (AC), is a relatively complex electronic device. It is common to cool an inverter using a cooler (also called a "cooler") through which a heat transfer fluid circulates. This heat transfer fluid flows through the cooler and remains isolated from the rest of the inverter. This is called indirect cooling because the heat transfer fluid remains confined within the cooler, and it is the cooler that cools the inverter components by conduction through contact with its surfaces.

[0005] [3] This cooler is configured to cool power modules (or "Power Module" in English) which give off a lot of heat in the inverter, in particular due to thermal losses from switching of the transistors belonging to the power modules.

[0006] [4] The inverter is electrically connected to the vehicle's electric motor to power it.

[0007] [5] The present invention aims in particular to better cool an electronic device which tends to heat up strongly, for example an inverter.

[0008] [6] The invention relates to a bidirectional type dielectric fluid distribution nozzle, comprising a lateral fluid distribution window, on one side of the nozzle, and an axial fluid distribution orifice, at an axial end of the nozzle, the lateral window and the axial fluid distribution orifice being oriented in two different directions (in particular at 90° to each other), and the lateral window and the axial distribution orifice are configured to be immersed in the dielectric fluid contained in a chamber.

[0009] [7] According to one aspect of the invention, the nozzle extends along a longitudinal axis, for example substantially vertical, nozzle in which:

[0010] - the axial orifice is configured to distribute dielectric fluid along this longitudinal axis, and - the side window has a height B measured parallel to this longitudinal axis and a width A measured perpendicular to this longitudinal axis, with the width A between 4 and 8 mm, for example being approximately equal to 6 mm, and the height B between 1 and 4 mm, for example being approximately equal to 2 mm.

[0011] [8] According to one aspect of the invention, the nozzle has an internal cavity at the axial end (along the longitudinal axis) of which the axial orifice is present.

[0012] [9] According to one aspect of the invention, the internal cavity of the nozzle is substantially cylindrical in shape over a major part of its height, the cylindrical shape having a diameter between 2 and 8 mm, for example being substantially equal to 6 mm.

[0013]

[0010] According to one aspect of the invention, the axial orifice has a circular shape with a diameter between 0.5 mm and 4 mm, being for example substantially equal to 1 mm.

[0014]

[0011] These dimensions are adapted for use of the nozzle immersed in a dielectric fluid, and not for use of the nozzle in open air. The dimensions of the nozzle according to the invention thus make it possible to produce a jet of dielectric fluid which exits the nozzle while immersed in the dielectric fluid.

[0015]

[0012] According to one aspect of the invention, the internal cavity of the nozzle comprises, at its axial end, a rounded apex.

[0016]

[0013] According to one aspect of the invention, the rounded top has a radius of curvature between 1 and 3 mm, for example being substantially equal to 2 mm.

[0017]

[0014] According to one aspect of the invention, the internal cavity of the nozzle thus has an ogive shape. This avoids an abrupt transition in shape and prevents pressure losses.

[0018]

[0015] According to one aspect of the invention, the angular opening of the side window is greater than 90°, in particular being between 90° and 180°.

[0019]

[0016] According to one aspect of the invention, the side window has a divergently shaped border to produce a divergent (slightly divergent) fluid jet.

[0020]

[0017] According to one aspect of the invention, the nozzle includes a collar configured to be fixed (by force or brazing) onto the structural component.

[0021]

[0018] According to one aspect of the invention, the nozzle is made in one piece, for example by machining.

[0019] According to one aspect of the invention, the nozzle includes a keying element to orient the nozzle according to a predetermined orientation at the time of mounting on the structural component.

[0022]

[0020] The invention also relates to an electronic device, in particular an inverter, comprising:

[0023] - an enclosure formed by a casing and configured to house at least one electronic component immersed in a dielectric fluid,

[0024] - a bidirectional type dielectric fluid distribution nozzle, comprising a lateral fluid distribution window on one side of the nozzle, and an axial fluid distribution orifice at one axial end of the nozzle, the lateral window and the axial fluid distribution orifice being oriented in two different directions (in particular at 90° to each other), and the lateral window and the axial distribution orifice being configured to be immersed in the dielectric fluid contained in the enclosure, the nozzle belonging in particular to a structural component for distributing dielectric fluid which has circulated within the structural component.

[0025]

[0021] According to one aspect of the invention, the structural component includes a fluid flow disturbance element placed in the enclosure, to increase turbulence in the dielectric fluid.

[0026]

[0022] According to one aspect of the invention, the disturbance element is placed opposite a general outlet of dielectric fluid from the enclosure.

[0027]

[0023] For example, the entire fluid flow passes through the general outlet of the enclosure, and this disturbance device makes it possible to generate turbulence in all this fluid flow along the outlet path, allowing for greater heat exchange.

[0028]

[0024] According to one aspect of the invention, the disturbance element is configured for cooling the busbars. Thus, the disturbance element, even though it can be used to cool different types of components, is essentially dedicated to cooling the busbars (the straight and elongated shape of the latter lends itself well to this type of device).

[0029]

[0025] According to one aspect of the invention, the disturbing element comprises reliefs such as chevrons, bosses, or reliefs of other types.

[0030]

[0026] The invention further relates, independently or in combination with the foregoing, to a structural component configured to be placed in an enclosure of an electronic device, this enclosure housing at least one electronic component to be cooled, the structural component being configured to define a mechanical support for at least one of the electronic components, for example a circuit board, housed in the enclosure, the structural component comprising:

[0031] - at least one internal circulation channel for a dielectric fluid, this internal channel being configured to open into the enclosure so as to distribute dielectric fluid into the enclosure to immerse the electronic component(s) in dielectric fluid (for the purpose of cooling them).

[0032]

[0027] The structural component according to the invention directs the dielectric fluid primarily towards the electronic components to be cooled. The structural component according to the invention thus has a dual function: a mechanical support function (its function as a structural part) and a cooling function, by introducing dielectric fluid into the enclosure to immerse the electronic components to be cooled, thereby providing direct cooling. The structural component is specifically configured to also cool, by conduction (and therefore indirectly), at least one of the electronic components within the enclosure, through contact between the electronic component and the structural component.

[0033]

[0028] The invention thus proposes to use an existing structural component (configured for the mechanical reinforcement of the electronic device) to add a cooling function. Indeed, it is observed that the environment inside an inverter enclosure is often cluttered and complex, with little space available for adding new components.

[0034]

[0029] In the present invention, thanks to the structural component, it is possible to bring the dielectric fluid to the heart of the enclosure.

[0035]

[0030] According to one aspect of the invention, the structural component is in the form of a plate.

[0036]

[0031] According to one aspect of the invention, the structural component is made of aluminum.

[0037]

[0032] Other materials could be used, provided that they give sufficient mechanical strength to the structural component.

[0038]

[0033] According to one aspect of the invention, the structural component comprises a plurality of internal channels for the circulation of dielectric fluid.

[0039]

[0034] According to one aspect of the invention, at least one of the dielectric fluid circulation channels is configured to pass over one of the electronic components in the enclosure.

[0035] According to one aspect of the invention, the structural component is configured to be interposed between an upper electronic board and a lower electronic board housed in the enclosure.

[0040]

[0036] According to one aspect of the invention, the structural component has an overall planar shape.

[0041]

[0037] According to one aspect of the invention, the dielectric fluid distributed by the structural component also serves to cool the electronic board.

[0042]

[0038] According to one aspect of the invention, the structural component comprises one or more fluid inlets configured to distribute dielectric fluid into one or more internal circulation channels, in particular for the purpose of cooling different areas of the enclosure.

[0043]

[0039] According to one aspect of the invention, the internal channel of the structural component is configured to open into the enclosure through one or more fluid outlet ports.

[0044]

[0040] According to one aspect of the invention, the fluid outlet orifice is formed on a fluid distribution nozzle, this distribution nozzle being configured to be immersed in the dielectric fluid contained in the enclosure.

[0045]

[0041] According to one aspect of the invention, the structural component comprises one or more rows of outlet ports configured to distribute dielectric fluid into the enclosure.

[0046]

[0042] According to one aspect of the invention, the distribution nozzles are configured to cool a group of busbars (for example, on the AC side or the DC side)

[0047]

[0043] According to one aspect of the invention, the busbars are straight or have angled shapes. The busbars originate from the inverter input, for example.

[0048]

[0044] The invention makes it possible, thanks to these distribution nozzles, to cool the busbars as closely as possible, and therefore efficiently.

[0049]

[0045] According to one aspect of the invention, the structural component includes an internal channel passing over the power module(s).

[0050]

[0046] According to one aspect of the invention, the nozzle has a lateral fluid distribution window, which allows the fluid to lick the top of the power modules.

[0051]

[0047] According to one aspect of the invention, the nozzle is of the bidirectional type, comprising a lateral fluid distribution window, on one side of the nozzle, and an axial fluid distribution orifice, at an axial end of the nozzle, the lateral window and the axial fluid distribution orifice being oriented in two different directions (in particular at 90° to each other).

[0052]

[0048] According to one aspect of the invention, the side window has a larger fluid passage area than the fluid passage area of ​​the axial distribution orifice. In particular, the fluid passage area of ​​the axial orifice represents 30 to 50% of the total passage area (which is the sum of the passage areas of the side window and the axial orifice). This ratio can, for example, be 40%.

[0053]

[0049] According to one aspect of the invention, the fluid distribution orifice is configured to direct fluid vertically, in particular towards busbars.

[0054]

[0050] According to one aspect of the invention, the bidirectional nozzle can thus have one direction to allow the dielectric fluid to lick the top of the power modules, and a straight direction which allows to cool busbars which are placed below the nozzle.

[0055]

[0051] According to one aspect of the invention, in the enclosure, there is a space between the top of the power modules and the lower face of the structural component, and dielectric fluid can circulate in this space.

[0056]

[0052] For example, the structural component includes three bidirectional type nozzles, each nozzle being, for example, placed opposite a power module.

[0057]

[0053] According to one aspect of the invention, the power module(s) can be exposed, i.e., without their own covers, so as to promote cooling of the power modules by the electrical fluid. Indeed, the electrical fluid can directly cool the transistors of the power modules.

[0058]

[0054] According to one aspect of the invention, the structural component comprises one or more unidirectional and / or bidirectional type nozzles.

[0059]

[0055] According to one aspect of the invention, the enclosure receives an electronic card which has one or more through holes, each through hole allowing the passage of a fluid distribution nozzle.

[0060]

[0056] Thus, one of the nozzles of the structural component passes through a through hole in the electronic board, in particular a lower electronic board.

[0061]

[0057] According to one aspect of the invention, the nozzle(s) are arranged so as to be immersed in the dielectric fluid in the enclosure, and create a jet of fluid by being immersed in the dietary fluid of the enclosure.

[0062]

[0058] This differs from a fluid spray projected into the air above the fluid that immerses the electronic components to be cooled.

[0059] According to one aspect of the invention, the structural component is configured to carry at least one of the electronic boards of the electronic device, in particular the inverter.

[0063]

[0060] According to one aspect of the invention, the structural component is configured to be fixed to a housing.

[0064]

[0061] Thus the structural component forms with the housing a kind of structural framework.

[0065] Specifically, the structural component has dimensions chosen so that it occupies at least 50%, or at least 60% or 70%, of the surface area of ​​the electronic device's housing in which it is mounted. The housing's surface area corresponds, in particular, to the area enclosed by a lateral edge of the housing. Preferably, the structural component, especially if flat, is configured to extend along at least two opposite edges of the electronic device's housing. In particular, the structural component is configured to extend along at least 50%, or at least 60% or 70%, of the total length of the electronic device's housing. In other words, the structural component is large enough to fulfill its function as a structural framework within the housing.The structural component is attached to the housing at multiple points (e.g., screws) arranged around its entire perimeter. This effectively stiffens the housing using the structural component. Preferably, the structural component is positioned at an intermediate height within the electronic device housing (or enclosure). This prevents the structural component from being attached to the bottom or top of the housing. The structural component thus forms a rigid, three-dimensional unit with the housing. Preferably, the structural component extends transversely from a side wall of the housing. Alternatively, the structural component can extend substantially parallel to the bottom of the housing.According to one aspect of the invention, the structural component is an additional part in relation to the housing, and in particular the structural component does not form a double wall with the enclosure defined by the housing.

[0066]

[0062] In other words, the enclosure is formed by walls (and / or a lid), the electronic component being formed at least partially between these walls (and / or the lid) in order to form an internal mechanical support for the enclosure.

[0067]

[0063] According to one aspect of the invention, the power modules comprise a mechanical link with the structural component.

[0068]

[0064] According to one aspect of the invention, the fluid inlet of the structural component opens into a bulge in the structural component.

[0065] According to one aspect of the invention, the bulge defines an internal fluid channel, or fluid distribution rail, to a plurality of nozzles.

[0069]

[0066] According to one aspect of the invention, this bulge connects for example to fluid outlet orifices (for example, six in number), each of which is notably provided with a fluid distribution nozzle.

[0070]

[0067] According to one aspect of the invention, the structural component comprises, for example, a row of three nozzles cooling AC busbars and another row of six nozzles cooling DC busbars.

[0071]

[0068] According to one aspect of the invention, the nozzle or nozzles are configured to produce a relatively thick fluid jet, with a flow rate large enough to overcome the viscosity and inertial forces of the dielectric fluid in which the nozzle is immersed.

[0072]

[0069] According to one aspect of the invention, the structural component is formed by two plates, in particular stamped, assembled together to define internal channels.

[0073]

[0070] According to one aspect of the invention, the structural component and the cooler are separate from a housing and a cover which define the enclosure.

[0074]

[0071] The invention relates, independently or in combination with the foregoing, to a cooler configured to be placed in an enclosure of an electronic device, this enclosure being configured to be filled with a dielectric fluid, this cooler being in particular configured to be placed between several electronic components in the enclosure, in particular between one or more filter capacitors and one or more power modules, in particular on opposite faces of the cooler, the cooler comprising:

[0075] - at least one dielectric fluid circulation channel configured to cool at least one electronic component within the enclosure by indirect heat exchange via conduction between that electronic component and the cooler,

[0076] - at least one fluid opening connected to the dielectric fluid circulation channel of the cooler, this fluid opening leading into the enclosure.

[0077]

[0072] Alternatively, the cooler includes at least one fluid opening connected to the cooler's dielectric fluid circulation channel, this opening being connected to an inlet of the structural component. Thus, the dielectric fluid can be introduced into the cooler, then the dielectric fluid passes into the structural component, and finally the dielectric fluid is distributed throughout the enclosure. In this way, the fluid opening(s) of the cooler do not open directly into the enclosure. Preferably, the cooler and the structural component are fluidically connected to each other such that all the dielectric fluid introduced into the cooler then passes into the structural component, via one or more fluidic connection points.

[0078]

[0073] According to one aspect of the invention, the cooler comprises a double wall forming at least one channel for circulating dielectric fluid.

[0079]

[0074] The cooler thus allows indirect cooling, by conduction.

[0080]

[0075] According to one aspect of the invention, the cooler includes a fluid opening connected to the dielectric fluid circulation channel of the cooler, this fluid opening leading into the enclosure.

[0081]

[0076] Thus, the cooler according to the invention allows that, once the indirect cooling path has been completed within the cooler, the dielectric fluid is injected into the enclosure (where the various electronic components are placed) through this fluid opening to provide cooling by immersion of the electronic components in the dielectric fluid (called direct cooling).

[0082]

[0077] Thus this cooler allows a first step of indirect cooling and then a second step of direct cooling (by immersion).

[0083]

[0078] According to one aspect of the invention, the fluid opening of the cooler is formed by at least one slot, optionally equipped with a nozzle or not.

[0084]

[0079] According to one aspect of the invention, the slot or slots are for example arranged at an end opposite to the fluid inlet in the cooler.

[0085]

[0080] According to one aspect of the invention, the cooler comprises a plurality of slots arranged along the cooler.

[0086]

[0081] According to one aspect of the invention, the slot or slots may have various shapes, for example rectangular, oblong or more complex.

[0087]

[0082] According to one aspect of the invention, the slot or slots can be arranged along a lateral edge of the cooler.

[0088]

[0083] According to one aspect of the invention, the slot(s) of the cooler are oriented towards the bottom and / or the top of the enclosure, for example towards the filter capacitors or in the opposite direction.

[0089]

[0084] According to one aspect of the invention, the cooler is configured to be placed under the power module(s).

[0090]

[0085] According to one aspect of the invention, the power module(s) are interposed between the structural component (which is in particular above) and the cooler (which is in particular below).

[0086] According to one aspect of the invention, the electronic device is configured so as to define, within the enclosure, a path for the dielectric fluid, configured in particular to guide the dielectric fluid exiting the cooler.

[0091]

[0087] The path for the dielectric fluid allows the dielectric fluid to be directed towards electronic components to be cooled in a preferential way.

[0092]

[0088] The path for the dielectric fluid is not sealed with respect to the rest of the enclosure.

[0093]

[0089] For example, it is possible to constrain, by means of this path, the circulation of the dielectric fluid between the cooler and the structural component so that the dielectric fluid follows a U-shaped path.

[0094]

[0090] According to one aspect of the invention, the electronic device includes one or more filtering capacitors (called "DC Link" in English).

[0095]

[0091] According to one aspect of the invention, the cooler is configured to cool the filter capacitor(s) by heat exchange on one face of the cooler.

[0096]

[0092] According to one aspect of the invention, the cooler is configured to be placed between one or more filter capacitors and one or more power modules, in particular on opposite faces of the cooler.

[0097]

[0093] According to one aspect of the invention, the electronic device, in particular an inverter, includes busbars (or electrically conductive bars) configured to ensure power electrical connections.

[0098]

[0094] According to one aspect of the invention, at least some of the busbars are arranged under the structural component, to be cooled by dielectric fluid delivered by this structural component.

[0099]

[0095] According to one aspect of the invention, busbars are for example arranged between the filter capacitors and the power module(s).

[0100]

[0096] According to one aspect of the invention, the electronic device includes at least one general outlet of dielectric fluid, in particular a single general outlet of dielectric fluid, configured to discharge the dielectric fluid out of the enclosure.

[0101]

[0097] Thus, the invention makes it possible to avoid having separate general fluid outlets, dedicated respectively to the enclosure, the cooler, and the structural component. The fluid outlet can be common to all these elements.

[0102]

[0098] According to one aspect of the invention, the general fluid outlet is located on a housing of the electronic device.

[0099] According to one aspect of the invention, the structural component comprises one or more fluid inlets.

[0103]

[0100] According to one aspect of the invention, the fluid inlet of the structural component includes a fluidic connection tip configured to be placed through an orifice of a cover closing a housing of the electronic device.

[0104]

[0101] According to one aspect of the invention, the enclosure is closed by a lid.

[0105]

[0102] Advantageously, the cover is a simple cover from a cooling point of view, because the cover is not provided with internal channels for distributing dielectric fluid.

[0106]

[0103] According to one aspect of the invention, the cooler comprises one or more fluid inlets.

[0107]

[0104] According to one aspect of the invention, the fluid inlet of the cooler communicates with a fluidic connection tip configured on a bottom of a housing of the electronic device.

[0108]

[0105] According to one aspect of the invention, the structural component and the cooler comprise separate fluid inlets.

[0109]

[0106] According to one aspect of the invention, the cooler is of the plate type. In particular, the cooler has a relatively small thickness.

[0110]

[0107] According to one aspect of the invention, the cooler is devoid of a fluid outlet configured to discharge fluid outside the enclosure.

[0111]

[0108] According to one aspect of the invention, the cooler has, on its dielectric fluid circulation channel, reliefs, for example in the form of bumps, to increase the heat exchange surface with the fluid.

[0112]

[0109] According to one aspect of the invention, the cooler comprises two opposing cooling faces, for example for, on the one hand, the power module(s), and on the other hand, for the filter capacitor(s) (DC Link).

[0113]

[0110] The invention further relates to an electronic device, in particular an inverter, comprising a aforementioned structural component and / or a aforementioned cooler, configured to cool electronic components of the electronic device.

[0114]

[0111] According to one aspect of the invention, within the enclosure, power modules are placed under the lower electronic board.

[0115]

[0112] The invention can be implemented with the structural component according to the invention and / or the cooler according to the invention.

[0113] According to one aspect of the invention, the electronic device, in particular an inverter, comprises a cooler including at least one dielectric fluid circulation channel configured to cool at least one electronic component within the enclosure by heat exchange between this electronic component and the dielectric fluid circulating in the channel.

[0116]

[0114] The invention further relates to a cooling sub-assembly configured to be integrated into an electronic device, in particular an inverter, the cooling sub-assembly comprising: a housing defining an enclosure to receive at least one electronic component to be cooled, this enclosure being configured to be filled with a dielectric fluid,

[0117] - a cooler configured to be placed inside the case, this cooler being specifically configured to be placed between several electronic components within the case, the cooler comprising:

[0118] - at least one dielectric fluid circulation channel configured to cool at least one electronic component within the enclosure by indirect heat exchange via conduction between that electronic component and the cooler,

[0119] - at least one fluid opening connected to the dielectric fluid circulation channel of the cooler, this fluid opening leading into the enclosure, wherein the cooler includes one or more fluid inlets for supplying dielectric fluid to said at least one circulation channel, the fluid inlet of the cooler communicating directly with a fluid inlet on the housing, formed for example by a fluid connection fitting on the housing, in particular on a bottom of the housing, and wherein the housing includes at least one general dielectric fluid outlet, in particular a single general dielectric fluid outlet, communicating with the interior of the enclosure and disposed at a distance from the fluid opening of the cooler so that dielectric fluid leaving the fluid opening of the cooler can circulate within the enclosure before exiting the enclosure through the general outlet of the housing.

[0120]

[0115] The invention further relates to a cooling sub-assembly comprising a structural component configured to be placed in the enclosure of the housing, the structural component being configured to define a mechanical support for at least one of the electronic components, for example an electronic board, housed in the enclosure, the structural component comprising at least one internal circulation channel for a dielectric fluid, this internal channel being configured to open into the enclosure so as to distribute dielectric fluid into the enclosure to immerse the electronic component(s) in dielectric fluid.

[0121]

[0116] According to one aspect of the invention, the structural component comprises one or more fluid inlets configured to distribute dielectric fluid into one or more internal circulation channels of the structural component, this or these fluid inlets of the structural component being distinct from the fluid inlet(s) of the cooler.

[0122]

[0117] According to one aspect of the invention, the housing thus comprises separate fluid inlets for the cooler, on the one hand, and the structural component, on the other hand.

[0123]

[0118] According to one aspect of the invention, the structural component and the cooler define, between them, an intercalated space configured to receive at least one power module.

[0124]

[0119] Thus the power module(s) can be cooled on its two opposite faces, by the cooler, on the one hand, and the structural component, on the other hand.

[0125]

[0120] The cooling subassembly includes elements for disturbing the fluid in the enclosure.

[0126]

[0121] The invention further relates to an electronic device, in particular an inverter, comprising a cooling sub-assembly as mentioned above, and at least one electronic component to be cooled.

[0127]

[0122] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0128]

[0123] [Fig 1] Figure 1 is a perspective representation of an inverter according to an example of implementation of the invention;

[0129]

[0124] [Fig. 2] Figure 2 is a perspective view of the inverter of Figure 1, without the cover;

[0130]

[0125] [Fig. 3] Figure 3 is a perspective representation of the inverter of Figure 1, with the structural component visible;

[0131]

[0126] [Fig. 4] Figure 4 is an isolated representation of the structural component of Figure 3, in top view;

[0132]

[0127] [Fig. 5] Figure 5 is an isolated representation of the structural component of Figure 3, in view from below;

[0128] [Fig. 6] Figure 6 is a detail view of a bidirectional type nozzle of the structural component of Figure 3;

[0133]

[0129] [Fig. 7] Figure 7 is a perspective representation of the inverter of Figure 1, with the cooler visible;

[0134]

[0130] [Fig. 8] Figure 8 is a cross-sectional view of the fluid inlet of the cooler of Figure 7;

[0135]

[0131] [Fig. 9] Figure 9 is a cross-sectional view of the inverter of Figure 1;

[0136]

[0132] [Fig. 10] Figure 10 is a perspective representation of the inverter of Figure 1, with the cooler and power modules visible;

[0137]

[0133] [Fig. 11] Figure 11 is a front view of the bidirectional type nozzle of the structural component of Figure 6;

[0138]

[0134] [Fig. 12] Figure 12 is a top view of the bidirectional type nozzle of the structural component of Figure 6;

[0139]

[0135] [Fig. 13] Figure 13 is a perspective view of the bidirectional type nozzle of the structural component of Figure 6.

[0140]

[0136] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0141]

[0137] Figure 1 shows an electronic device 100, here an inverter configured for installation on a motor vehicle. The inverter 100 is configured to convert a direct current (DC) into an alternating current (AC).

[0142]

[0138] The electronic device 100 according to the invention includes a cooling sub-assembly 200 which can be seen more clearly in particular in figure 3.

[0143]

[0139] The cooling subassembly 200 comprises a housing 201 (also called a "casing") defining an enclosure 202 for receiving electronic components to be cooled, this enclosure 202 being configured to be filled with a dielectric fluid, for example, a dielectric oil. The enclosure 202 is closed by a cover 220 which is a simple cover from a cooling point of view, since the cover is not provided with internal channels for distributing dielectric fluid.

[0140] As can be seen in Figure 7, the cooling subassembly 200 further comprises a cooler 10 (also called a "cooler") configured to be placed in the enclosure 202 of the housing 201, this cooler 10 being configured to be placed between several electronic components in the enclosure 202.

[0144]

[0141] The cooler 10 includes at least one dielectric fluid circulation channel 11 configured to cool electronic components in the enclosure 202 by indirect heat exchange by conduction between these electronic components and the cooler 10.

[0145]

[0142] The cooler 10 further includes at least one fluid opening 12 connected to the dielectric fluid circulation channel 11 of the cooler 10, this fluid opening 12 opening into the enclosure 202,

[0146]

[0143] The cooler 10 includes one or more fluid inlets 14 for supplying dielectric fluid to at least one circulation channel 11, the fluid inlet 14 of the cooler 10 communicating directly with a fluid inlet 204 on the housing

[0147] 201, formed here by a fluidic connection tip 205 on a base 203 of the housing 201, as illustrated in figure 8. The tip 205 allows a fluidic connection with an external fluid circuit (not shown) which provides the supply of dielectric fluid.

[0148]

[0144] The housing 201 includes a single general outlet 207 for dielectric fluid, communicating with the interior of the enclosure 202 and positioned at a distance from the fluid openings 12 of the cooler 10 so that dielectric fluid leaving the fluid openings 12 of the cooler 10 can circulate within the enclosure 202 before exiting the enclosure 202 through the general outlet 207 of the housing 201. The general fluid outlet 207 extends along a side wall 208 of the housing 201.

[0149]

[0145] The cooling subassembly 200 also includes a structural component 40 (also called a "Bracket"), in the form of a plate, configured to be placed in the enclosure 202 of the housing 201. The structural component 40 is configured to provide mechanical support for an upper electronic board 210 (which defines an electronic component within the meaning of the invention) housed in the enclosure

[0150] 202. The upper electronic board 210 is fixed to the structural component 40 by means of screws 211 (see figure 2) which cooperate with columns 41 (see figure 3) belonging to the structural component 40. Alternative means of fixing the upper electronic board 210 to the structural component 40 may be provided.

[0151]

[0146] As illustrated in Figure 4, the structural component 40 is formed by two stamped plates 43, assembled together to define internal channels which are described below.

[0147] The structural component 40 is configured to be fixed to a housing 201. The structural component 40 and the cooler 10 are separate from the housing 201 and the cover 220 which define the enclosure 202.

[0152]

[0148] A spacer 217 (or “Spacer” in English) is interposed between the housing 201 and the cover 220.

[0153]

[0149] The structural component 40 forms a kind of structural framework with the housing 201. In particular, the structural component 40 has dimensions chosen such that it occupies at least 50%, or at least 60% or 70%, of the surface area of ​​a housing 201 of the electronic device in which the structural component 40 is mounted. The surface area of ​​the housing 201 corresponds in particular to the area delimited by a lateral perimeter of the housing 201. Preferably, the structural component 40, generally in the form of a plate, is configured to extend along at least two opposite edges of the perimeter of the housing 201 of the electronic device. In particular, the structural component 40 is configured to extend along at least 50%, or at least 60% or 70%, of the total length of the perimeter of the housing 201 of the electronic device. In other words, the structural component 40 is large enough to fulfill its function as a structural framework within the housing.The structural component 40 is attached to the housing 201 at a plurality of fixing points (for example, by screws) arranged around its entire perimeter. This effectively stiffens the housing using this structural component 40. Preferably, the structural component 40 is configured to be placed within the housing 201 of the electronic device (or the enclosure 202) at an intermediate height. Thus, the structural component 40 is not attached to a bottom 203 of the housing 201, nor is it attached to a cover 220. Preferably, the structural component 40 extends transversely with respect to a side wall 208 of the housing 201. Furthermore, the structural component 40 can extend substantially parallel to a bottom 203 of the housing 201.Structural component 40 is an additional part in relation to the housing 201, and in particular structural component 40 does not form a double wall with the enclosure 202 defined by the housing 201.

[0154]

[0150] The structural component 40 comprising at least one internal channel 42 for circulation of a dielectric fluid, this internal channel 42 being configured to open into the enclosure 202 so as to distribute dielectric fluid into the enclosure 202 to immerse the electronic components in the dielectric fluid (for the purpose of cooling them).

[0155]

[0151] The structural component 40 has one or more fluid inlets 44 configured to distribute dielectric fluid into one or more internal circulation channels 42 of the structural component 40, this or these fluid inlets 44 of the structural component 40 being distinct from the fluid inlet(s) 14 of the cooler 10.

[0156]

[0152] In the described example, the structural component 40 has two fluid inlets 44 each formed by a fluid connection tip 45, fixed on an orifice 46 of the structural component 40, as can be seen for example in Figure 9. The tip 45 is oriented towards the side of the upper electronic board 210, namely the top of the enclosure.

[0157]

[0153] Each fluidic connection tip 45 is placed through an orifice 221 of the cover 220 closing a housing 201, as can be seen in Figure 1.

[0158]

[0154] The structural component 40 and the cooler 10 define, between them, an intercalated space configured to receive power modules 214 (which define electronic components within the meaning of the invention), as can be seen for example in figure 9.

[0159]

[0155] Thus, the power modules 214, clearly visible in Figure 10, can be cooled by conduction (and therefore indirectly) on their two opposite faces, by the cooler 10, on the one hand, and the structural component 40, on the other. Additional cooling (which is of the direct type) is achieved by immersion in the dielectric fluid.

[0160]

[0156] The structural component 40 according to the invention allows the dielectric fluid to be directed first towards the electronic components to be cooled. The structural component

[0161] 40 according to the invention thus presents a dual function, namely a mechanical support function (this is the structural part / plate function) and a cooling function (by bringing dielectric fluid into the enclosure 202 to immerse the electronic components to be cooled).

[0162]

[0157] In the present invention, thanks to the structural component 40, it is possible to bring the dielectric fluid to the heart of the enclosure 202.

[0163]

[0158] The structural component 40 is made of aluminum. Other materials could be used, provided they give sufficient mechanical strength to the structural component 40.

[0164]

[0159] The structural component 40 is configured to be interposed between the upper electronic board 210 and a lower electronic board 219 housed in the enclosure 202.

[0165]

[0160] In the described example, the structural component 40 comprises a plurality of internal channels 42 for circulating dielectric fluid, arranged in two groups 48 and 49 of internal channels.

[0161] The group 48 of internal channels comprises internal channels 42 (here three in number) radiating from one of the fluid inlets 44, as can be seen in Figure 5. The channels 42 of group 48 each open into the enclosure 202 through a fluid distribution nozzle 50, each distribution nozzle 50 being configured to be immersed in the dielectric fluid contained in the enclosure 202. The nozzles 50 are bidirectional, as described in more detail below.

[0166]

[0162] The other group 49 of internal channels (fed by the other of the fluid inlets 44) includes a bulge 51 of the structural component 40 which defines a fluid distribution rail 52, above the power modules 214, to a row of nozzles 53 (for example, six in number), as can be seen in Figures 4 and 5.

[0167]

[0163] The unidirectional nozzles 53 are also configured to be immersed in the dielectric fluid contained in the enclosure 202. The unidirectional nozzles 53 are configured to produce a single jet of dielectric fluid along a longitudinal axis Z (for example, substantially vertical). These nozzles 53 do not have a side window.

[0168]

[0164] This is different from a fluid spray projected into the air, above the fluid that immerses the electronic components to be cooled.

[0169]

[0165] As can be seen in Figure 9, the distribution nozzles 50 and 53 are arranged opposite the busbar groups 230, on the AC (alternating current) and DC (direct current) sides of the inverter, for cooling purposes. These busbar groups 230 are electrically connected to the power modules 214 to provide power electrical connections.

[0170]

[0166] Busbars are straight or have angled shapes. Busbars originate from the inverter's electrical input, for example. Busbars are, for example, arranged between filter capacitors 215 and power modules 214. The filter capacitors 215 are called DC link capacitors.

[0171]

[0167] The invention makes it possible, thanks to these distribution nozzles 50 and 53, to cool the busbars as closely as possible, and therefore efficiently.

[0172]

[0168] As can be seen in Figure 6, each bidirectional nozzle 50 has a lateral window 55 for fluid distribution on one side of the nozzle and an axial orifice 56 for fluid distribution at one axial end of the nozzle. The lateral window 55 and the axial orifice 56 for fluid distribution are oriented in two different directions, here at 90° to each other.

[0169] The lateral window 55 has a larger fluid passage area than the fluid passage area of ​​the axial orifice 56 for distribution.

[0173]

[0170] The bidirectional nozzle 50 can thus have one direction to allow the dielectric fluid to flow over the top of the power modules 214 (through the side window 55), and a straight direction to cool the busbars 230 located below the nozzle 50 (through the axial orifice 56). These flows are illustrated by the arrows visible in Figure 9.

[0174]

[0171] The lower electronic board 219 has several through holes 223, each through hole 223 allowing the passage of a bidirectional nozzle 50. The through hole 223 is notably circular in circumference.

[0175]

[0172] The bidirectional type nozzle 50 extends along the longitudinal axis Z and the axial orifice 56 is configured to distribute dielectric fluid along this longitudinal axis Z.

[0176]

[0173] As illustrated in Figure 11, the side window 55 has a height B measured parallel to this longitudinal axis Z and a width A measured perpendicular to this longitudinal axis, with the width A between 4 and 8 mm, for example being approximately equal to 6 mm, and the height B between 1 and 4 mm, for example being approximately equal to 2 mm.

[0177]

[0174] The nozzle 50 has an internal cavity 57 at the axial end (along the longitudinal axis Z) of which is present the axial orifice 56.

[0178]

[0175] The internal cavity 57 of the nozzle is substantially cylindrical in shape over a major part of its height, the cylindrical shape having a diameter D1 between 2 and 8 mm, being for example substantially equal to 6 mm (see figure 12).

[0179]

[0176] The axial orifice 56 has a circular shape with a diameter D2 between 0.5 mm and 4 mm, being for example substantially equal to 1 mm (see figure 13).

[0180]

[0177] These dimensions are adapted for use of the nozzle 50 immersed in a dielectric fluid, and not for use of the nozzle in open air. The dimensions of the nozzle according to the invention thus make it possible to produce a jet of dielectric fluid which exits the nozzle 50 while immersed in the dielectric fluid.

[0181]

[0178] In particular, the fluid passage area of ​​the axial orifice 56 represents 30 to 50% of the total passage area (which is the sum of the passage areas of the side window and the axial orifice). This ratio can, for example, be 40%.

[0182]

[0179] The internal cavity 57 of the nozzle includes, at its axial end, a rounded apex 59.

[0180] The rounded apex 59 has a radius of curvature R between 1 and 3 mm, being for example substantially equal to 2 mm.

[0183]

[0181] The internal cavity 57 of the nozzle thus has an ogival shape. This prevents an abrupt transition in shape and avoids pressure losses.

[0184]

[0182] The angular opening of the side window 55 is greater than 90°, being in particular between 90° and 180°.

[0185]

[0183] The side window 55 has a divergent shaped border to produce a divergent (slightly divergent) fluid jet.

[0186]

[0184] The nozzle has a collar 61 configured to be fixed (by force or brazing) onto the structural component 40.

[0187]

[0185] The nozzle 50 is made from a single piece, for example by machining.

[0188]

[0186] The nozzle 50 includes a keying element 62 defined by a chamfer (see figure 12) to orient the nozzle according to a predetermined orientation at the time of assembly on the structural component 40.

[0189]

[0187] In the enclosure 202, there is a space 222 between the top of the power modules 214 and the lower face 58 of the structural component 40, and dielectric fluid can circulate in this space.

[0190]

[0188] As a reminder, the power modules 214 are sandwiched between the structural component 40 (which is notably above) and the heatsink 10 (which is notably below). The heatsink 10 is configured to be placed between filter capacitors 215 and the power modules 214.

[0191]

[0189] We will now describe cooler 10 in more detail.

[0192]

[0190] The cooler 10 is of the plate (or double-walled) type with an upper plate 18 and a lower plate 19. The cooler 10 has a relatively small thickness. The upper plate 18 has raised features or studs 21 to increase the heat exchange surface area in its dielectric fluid circulation channel 11.

[0193]

[0191] The cooler 10 is without a fluid outlet configured to discharge fluid outside the enclosure 202.

[0194]

[0192] The cooler 10 comprises two opposing cooling faces 21 and 22, respectively for, on the one hand, the power modules 214, and on the other hand, for the filter capacitors 215.

[0195]

[0193] The cooler 10 according to the invention allows that, once the indirect cooling path has been completed within the cooler 10, the dielectric fluid is injected into the enclosure 202 (where the various electronic components are placed) through this fluid opening 12 to provide cooling by immersion of the electronic components in the dielectric fluid (called direct cooling).

[0196]

[0194] Thus this cooler 10 allows a first step of indirect cooling and then a second step of direct cooling (by immersion).

[0197]

[0195] In the described example, the fluid opening 12 of the cooler 10 is formed by slots 16, optionally equipped with a nozzle or not. The slots 16 are arranged along the cooler 10.

[0198]

[0196] The slots 16 can have various shapes, for example rectangular, oblong or more complex.

[0199]

[0197] In an unshown variant, the slots 16 can be arranged along a lateral edge 17 of the cooler 10.

[0200]

[0198] The slots 16 of the cooler 10 are oriented towards the bottom and / or the top of the enclosure, for example towards the filter capacitors 215 or in the opposite direction.

[0201]

[0199] The electronic device 100 is configured so as to define in the enclosure 202, a path for the dielectric fluid, configured in particular to guide the dielectric fluid which exits the cooler 10.

[0202]

[0200] The FP path for the dielectric fluid allows the dielectric fluid to be directed towards electronic components to be cooled in a preferential way, in particular the power modules 214.

[0203]

[0201] The FP path for the dielectric fluid is not sealed with respect to the rest of the enclosure 202.

[0204]

[0202] For example, it is possible to constrain, by means of this path FP, the circulation of the dielectric fluid between the cooler 10 and the structural component 40 so that the dielectric fluid completes a U-shaped path FP.

[0205]

[0203] The cooler 10 is configured to cool the filter capacitors 215, by heat exchange on one face of the cooler 10.

[0206]

[0204] Optionally, the power modules 214 can be exposed, i.e., without their individual covers, in order to facilitate cooling of the power modules by the electrical fluid. Indeed, the electrical fluid can directly cool the transistors of the power modules.

[0207]

[0205] As illustrated in particular in Figures 4 and 5, the structural component 40 includes a fluid flow disturbance element 65 located in the enclosure 202, to increase turbulence in the dielectric fluid.

[0206] The disturbance element 65 is located opposite the main outlet 207 of the dielectric fluid from the enclosure 202.

[0208]

[0207] The entire fluid flow passes through the general outlet 207 of the enclosure 202, and this disturbance element 65 makes it possible to generate turbulence in all this fluid flow on the outlet path, allowing a greater exchange of heat.

[0209]

[0208] The disturbing element 65 includes reliefs such as chevrons 66, present on a flat lower face 69 of the disturbing element 65. Other reliefs such as bosses may be provided.

[0210]

[0209] The disturbance member 65 is fixed in a through passage 68 of the structural component 40, and includes a plate 70 fixed, for example by screwing, onto the structural component 40.

Claims

DEMANDS

1. Bidirectional type dielectric fluid dispensing nozzle (50) comprising a lateral fluid dispensing window (55) on one side of the nozzle (50) and an axial fluid dispensing orifice (56) at an axial end of the nozzle (50), the lateral window (55) and the axial fluid dispensing orifice (56) being oriented in two different directions, in particular at 90° to each other, and the lateral window (55) and the axial dispensing orifice (56) are configured to be immersed in the dielectric fluid contained in a housing (202).

2. Nozzle according to the preceding claim, the nozzle (50) extending along a longitudinal axis (Z), nozzle (50) in which: - the axial orifice (56) is configured to distribute dielectric fluid along this longitudinal axis, and - the side window (55) has a height (B) measured parallel to this longitudinal axis and a width (A) measured perpendicular to this longitudinal axis, with the width (A) between 4 and 8 mm, for example being approximately equal to 6 mm, and the height (B) between 1 and 4 mm, for example being approximately equal to 2 mm.

3. Nozzle according to claim 1 or 2, wherein the nozzle (50) has an internal cavity (57) at the axial end of which is present the axial orifice (56), the internal cavity of the nozzle (50) in particular being substantially cylindrical in shape over a major part of its height, the cylindrical shape having in particular a diameter between 2 and 8 mm, being for example substantially equal to 6 mm.

4. Nozzle according to any one of the preceding claims, wherein the internal cavity (57) of the nozzle (50) comprises, at its axial end, a rounded apex (59), this rounded apex having in particular a radius of curvature between 1 and 3 mm, being for example substantially equal to 2 mm.

5. Nozzle according to any one of the preceding claims, wherein the axial orifice (56) has a circular shape with a diameter between 0.5 mm and 4 mm, being for example substantially equal to 1 mm.

6. A nozzle according to any one of the preceding claims, wherein the angular opening of the side window (55) is greater than 90°, in particular being between 90° and 180°, and the side window (55) in particular having a rim at divergent shape to produce a divergent fluid jet.

7. An electronic device, in particular an inverter, comprising: - an enclosure (202) formed by a housing (201) and configured to house at least one electronic component immersed in a dielectric fluid, - a bidirectional type dielectric fluid distribution nozzle (50) comprising a lateral fluid distribution window (55) on one side of the nozzle (50) and an axial fluid distribution orifice (56) at one axial end of the nozzle (50), the lateral window (55) and the axial fluid distribution orifice (56) being oriented in two different directions, in particular at 90° to each other, and the lateral window (55) and the axial distribution orifice (56) being configured to be immersed in the dielectric fluid contained in the enclosure (202).

8. Electronic device according to the preceding claim, comprising a structural component configured to be placed in the enclosure (202) of the housing (201), the structural component (40) being configured to define a mechanical support for at least one of the electronic components housed in the enclosure (202), the structural component (40) comprising at least one internal channel (42) for the circulation of a dielectric fluid, this internal channel being configured to open into the enclosure (202) so as to distribute dielectric fluid into the enclosure (202) to immerse the electronic component(s) in dielectric fluid.

9. Electronic device according to the preceding claim, wherein the internal channel (42) of the structural component (40) is configured to open into the enclosure (202) through one or more fluid outlet orifices, and the fluid outlet orifice is formed on a fluid distribution nozzle (50), this distribution nozzle (50) being configured to be immersed in the dielectric fluid contained in the enclosure (202).

10. Electronic device according to any one of claims 8 and 9, wherein the structural component (40) comprises one or more unidirectional and / or bidirectional type nozzles (50).

11. Electronic device according to any one of the preceding claims 7 to 10, wherein the enclosure (202) receives an electronic card which has one or more through holes, each through hole allowing the passage of a fluid distribution nozzle (50).

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