Voice recognition device

Abstract

A voice recognition device is disclosed. The voice recognition device according to the present invention may comprise a case, a speaker module, a PCB module, and a waveguide, wherein the waveguide is provided between the speaker module and the PCB module. Accordingly, while the case can be formed in a relatively small size, a distortion phenomenon caused by overlapping and interference of reflected sound waves can be suppressed, thereby enabling miniaturization of the voice recognition device and simultaneously improving product reliability of the voice recognition device.

Description

voice recognition device

[0001] The present invention relates to a voice recognition device, and more particularly, to a voice recognition device that can effectively inform a user of various information according to a voice recognition processing process.

[0002] A voice recognition device is a device that performs voice recognition functions and is used to remotely control home appliances such as air conditioners, washing machines, and vacuum cleaners used in homes or offices.

[0003] Typically, home appliances are equipped with individual control buttons on their respective units or with separate remote controls. In the former case, users must approach each appliance and press the corresponding control button to operate it. In the latter case, while users can control the appliance remotely, they still have to press the control keys on the remote control, which can be inconvenient. This can necessitate the use of separate lighting, especially in dark rooms.

[0004] Recently, research on controlling home appliances using voice recognition technology has been increasing to alleviate such inconveniences. For example, Korean Patent Laid-Open Publication No. 10-1999-00069703 discloses a voice recognition device, which is a remote control for an air conditioner equipped with a voice input unit and a signal processing unit, and which generates and transmits an operation signal based on voice recognition. In addition, Korean Patent Laid-Open Publication No. 10-2006-0015092 discloses a voice recognition device that converts an input voice signal into a digital signal and text, then checks for the presence of a matching control command in a database, and controls each device within the air conditioner immediately based on the presence of a control command, or extracts keywords and controls each device within the air conditioner based on the linked control command.

[0005] However, conventional voice recognition devices, such as the above, have relatively small cases yet contain numerous components, making it difficult to secure sufficient space in front of the speaker. This can limit case miniaturization or lead to distortion caused by overlapping and interference of sound waves, which can reduce product reliability.

[0006] Furthermore, as previously explained, conventional voice recognition devices, such as the above, do not secure sufficient space in front of the speaker. Consequently, resonance between components located around the microphone within the case can be directly transmitted to the microphone. This can lower the microphone's voice recognition rate and compromise product reliability.

[0007] In addition, in the conventional voice recognition device as described above, the output resistance and / or distortion of the voice generated from the speaker increases due to the installation space of the microphone, and as the number of microphones installed is limited, the input range of the voice input from the outside may be limited.

[0008] The purpose of the present invention is to provide a voice recognition device that can suppress distortion caused by overlapping and interference of record labels while forming a relatively small case, thereby increasing the reliability of the product.

[0009] Another object of the present invention is to provide a voice recognition device that can increase the voice recognition rate of a microphone by suppressing resonance between components arranged around a microphone from being transmitted to the microphone as is, even if the front space of the speaker is not sufficiently secured.

[0010] Another object of the present invention is to provide a voice recognition device that can suppress an increase in the output resistance and / or distortion of a voice (or sound wave) generated from a speaker due to the installation space of a microphone, thereby increasing the reliability of the product and minimizing restrictions on the number of microphones that can be installed.

[0011] In order to achieve the object of the present invention, a voice recognition device including a case, a speaker module, a PCB module, and a waveguide can be provided. The case can have a case body having at least one open end among both ends, and a case cover covering the open end of the case body. The speaker module can be accommodated in the case body. The PCB module can be accommodated in the case body. The waveguide can be accommodated in the case body and guide the voice (or sound wave) generated from the speaker module to the outside. The waveguide can be provided between the speaker module and the PCB module. Through this, the size of the case can be formed relatively small, while suppressing distortion caused by overlapping and interference of sound waves, thereby enabling miniaturization of the voice recognition device and increasing product reliability of the voice recognition device.

[0012] For example, the waveguide may have at least a portion of the sound wave guide surface facing the speaker module formed as a curved or inclined surface. This allows a wide and smooth sound wave output space to be secured in front of the speaker module.

[0013] For example, the speaker module may include a speaker body and a bracket assembly in which the speaker body is connected at the center and the edge is connected to the case. The sound wave guide surface of the waveguide may include a first guide surface facing the speaker body and a second guide surface facing the bracket assembly. The second guide surface may be formed so that the gap between the second guide surface and the bracket assembly increases as it moves away from the first guide surface. Through this, a wide and smooth sound wave output space is secured in front of the speaker module, so that the phenomenon of distortion of voice (or sound waves) due to overlapping and interference of sound waves can be minimized.

[0014] In addition, at least one sound wave guide protrusion may be formed on the sound wave guide surface. The sound wave guide protrusion may be formed to be radially long. Through this, the sound (or sound waves) generated from the speaker module can be transmitted radially and evenly.

[0015] For example, the sound wave guide protrusions may be formed in multiple numbers along the circumference. The multiple sound wave guide protrusions may be formed at equal intervals along the circumference. This allows the sound (or sound waves) generated from the speaker module to be distributed radially and evenly, thereby ensuring the widest possible range of use for the voice recognition device.

[0016] As another example, the PCB module may include a PCB board on which various components are mounted. At least one microphone may be mounted on at least one of the two sides of the PCB board. This allows external voices (or sound waves) to be quickly and accurately transmitted to the microphone.

[0017] For example, the microphone may be mounted on one side of the PCB facing the waveguide. The waveguide may be formed such that the damper receiving groove is sunken in the direction toward the speaker module so as to accommodate the first damper surrounding the microphone. Through this, by providing a microphone in the sound wave output space, the voice recognition device can be miniaturized while the sound wave recognition rate of the microphone is improved, so that the user's voice (or sound wave) can be accurately and quickly transmitted to the microphone.

[0018] Specifically, the waveguide may have a plurality of sound wave guide protrusions formed at predetermined intervals along the circumferential direction on a sound wave guide surface facing the speaker module. The damper receiving groove may be formed between two sound wave guide protrusions on both sides that are adjacent in the circumferential direction among the plurality of sound wave guide protrusions. Through this, the damper receiving groove is positioned in a relatively wide sound wave output path, so that a first damper with high damping force can be mounted in the damper receiving groove.

[0019] More specifically, the damper receiving groove may be formed to be spaced circumferentially from at least one of the two sound wave guide projections. This can suppress resonance between components arranged around the microphone from being directly transmitted to the microphone, thereby improving the voice recognition rate of the microphone.

[0020] In addition, the first damper may be formed with a recessed microphone receiving groove on a surface facing the PCB board and a protruding damper fixing protrusion on a surface facing the waveguide. A damper fixing hole may be formed in the damper receiving groove facing the damper fixing protrusion so that the damper fixing protrusion is inserted therein. Through this, when assembling the first damper, the first damper is prevented from being removed, and at the same time, the vibration of the waveguide can be quickly transmitted to the first damper through the damper fixing protrusion and canceled out.

[0021] Additionally, a second damper may be provided between the case cover and the other side of the PCB board facing it. A damper-receiving rib may be protruded toward the PCB board in the case cover to accommodate the second damper. Through this, the second damper absorbs and cancels out resonance between the PCB module and the case cover, thereby allowing the user's voice (or sound waves) to be accurately and quickly transmitted to the microphone.

[0022] Specifically, the second damper may be provided on the same axis as the microphone or the first damper. A sound transmission hole opening toward the microphone may be formed through the case cover, the second damper, and the PCB board, respectively, on the same axis. This allows external sound to be accurately and quickly transmitted to the microphone.

[0023] In another embodiment, the microphone may be mounted on the other side of the PCB facing the waveguide. A damper-receiving rib may be protruded toward the PCB in the case cover to accommodate a damper that surrounds the microphone. Through this, the damper-receiving groove is excluded from the waveguide, thereby reducing the sound wave output resistance at the sound wave guide surface, and thus the sound waves (or voice) generated from the speaker module may be transmitted more quickly and accurately toward the sound wave output hole.

[0024] Specifically, the damper has a microphone receiving groove formed in a recessed manner on a surface facing the PCB, and a sound transmission hole opening toward the microphone can be formed through the microphone receiving groove and the damper on the same axis. Through this, even when the microphone is placed with its back facing the sound wave guide surface of the waveguide, the voice recognition rate of the microphone is improved, so that the user's voice can be accurately and quickly transmitted to the microphone.

[0025] As another example, the case cover may be formed with a fastening boss extending toward the PCB module, the PCB module may be formed with a boss receiving hole through which the fastening boss passes, and the waveguide may be formed with a fastening member receiving groove that is sunken toward the fastening boss. The waveguide may be coupled to the case cover together with the PCB module by a fastening member having one end supported by the fastening member receiving groove of the waveguide and the other end fastened to the fastening boss of the case cover. Through this, the case body, the first case cover, the speaker module, the waveguide, and the PCB module can be assembled at once, thereby reducing the number of assembly parts and the assembly time.

[0026] A voice recognition device according to the present invention comprises a case, a speaker module, a PCB module, and a waveguide, wherein the waveguide may be provided between the speaker module and the PCB module. This allows for a relatively small case size while suppressing distortion caused by overlapping and interference of record waves, thereby enabling miniaturization of the voice recognition device and enhancing product reliability of the voice recognition device.

[0027] In a voice recognition device according to the present invention, a plurality of sound wave guide protrusions are formed along a circumferential direction on a waveguide, and the plurality of sound wave guide protrusions can be formed at equal intervals along the circumferential direction. Through this, sound waves (or voices) generated from the speaker module are distributed and transmitted radially and evenly, thereby securing the widest possible range of use of the voice recognition device.

[0028] According to the present invention, a voice recognition device includes a PCB module including a PCB board on which various components are mounted, and at least one microphone may be mounted on at least one side of the PCB board. Through this, external voices can be quickly and accurately transmitted to the microphone.

[0029] In the voice recognition device according to the present invention, the microphone is mounted on the other side of the PCB facing the waveguide, and a damper-receiving rib may protrude toward the PCB so that a damper that surrounds the microphone is received in the case cover. Through this, the damper-receiving groove (144) is excluded from the waveguide, so that the sound wave output resistance at the sound wave guide surface is reduced, and the sound wave (or voice) generated from the speaker module can be transmitted toward the sound wave output hole more quickly and accurately.

[0030] The voice recognition device according to the present invention can be connected to a case cover together with a PCB module by a fastening member having one end supported by a fastening member receiving groove of the waveguide and the other end fastened to a fastening boss of the case cover. This allows the case body, the first case cover, the speaker module, the waveguide, and the PCB module to be assembled at once, thereby reducing the number of assembly parts and the assembly time.

[0031] Fig. 1 is a perspective view of a voice recognition device according to the present embodiment, taken from one side.

[0032] Fig. 2 is a perspective view of the voice recognition device according to the present embodiment, taken from the other side.

[0033] Fig. 3 is a perspective view of a part of a voice recognition device according to the present embodiment, broken and disassembled.

[0034] Figure 4 is an assembly cross-sectional view of Figure 3.

[0035] Figure 5 is a cross-sectional view taken along the line “Ⅴ-Ⅴ” of Figure 4.

[0036] Fig. 6 is a perspective view of the second case cover of the voice recognition device according to the present embodiment, disassembled.

[0037] Figure 7 is an assembly cross-sectional view of Figure 6.

[0038] Fig. 8 is a perspective view showing the waveguide and the PCB module in the voice recognition device according to the present embodiment disassembled from the first case cover.

[0039] Fig. 9 is a plan view showing a voice recognition device according to the present embodiment in a broken state.

[0040] Figure 10 is a cross-sectional view taken along the line “Ⅹ-Ⅹ” of Figure 9.

[0041] Fig. 11 is a cross-sectional view taken along line “XI-XI” of Fig. 9.

[0042] Fig. 12 is an exploded perspective view showing a portion of another embodiment of a voice recognition device.

[0043] Figure 13 is an assembly cross-sectional view of Figure 12.

[0044] Hereinafter, a voice recognition device according to the present invention will be described in detail based on an embodiment illustrated in the attached drawings. Hereinafter, the longitudinal direction of the case is referred to as the axial direction, and the direction intersecting the axial direction is defined as the radial direction. In addition, the direction in which sound waves (or voices) are output from the speaker is defined as the front or upper side, and the opposite side is defined as the rear or lower side. Hereinafter, voice and sound wave are used interchangeably, but for convenience, what is input through a microphone is defined as voice, and what is output from a speaker is defined as sound wave. However, broadly, what is input through a microphone can also be understood as a sound wave.

[0045] Typically, a network system is a collection of devices that communicate with each other within a specific space, such as a home or office, forming a network. This network system is described using a voice recognition device (Hub) for a communication network with voice output capabilities as an example, but is not necessarily limited to this. Depending on the perspective, a network system could also be defined as a voice output device.

[0046] For example, a network system may include an accessory, a gateway, an access point, and a voice recognition device (or voice output device).

[0047] Accessories, gateways, access points, and / or voice recognition devices can communicate with each other according to established communication protocols, and such communication can be based on technologies such as Wi-Fi, Ethernet, Zigbee, Z-wave, and Bluetooth.

[0048] Accessories can be installed anywhere the user desires and can be equipped with various sensors, such as temperature sensors, humidity sensors, vibration sensors, proximity sensors, and infrared (IR) sensors. Information acquired by these sensors can be transmitted to a voice recognition device via a network. Conversely, signals for controlling the aforementioned sensors can also be transmitted from the voice recognition device to the accessories.

[0049] Additionally, the accessory may be configured to enable remote control of nearby home appliances. For example, the accessory may include a transmitter that emits an infrared signal in response to a control signal transmitted over a network.

[0050] A gateway is a device that connects networks with different protocols, enabling them to exchange information. For example, accessories and voice recognition devices can communicate directly in the manner described above.

[0051] An access point is a device that relays wireless devices to a network, allowing your home network to connect to the Internet. Appliances, voice recognition devices, accessories, and more can connect to the access point via wired (e.g., Ethernet) or wireless (e.g., Wi-Fi).

[0052] For example, a home network system can connect to the Internet via an access point, which can then connect to a server that provides services via the Internet. The server (or cloud) may be managed by the manufacturer of the accessory and / or voice recognition device, the seller of the accessory, or a service provider contracted with the manufacturer or seller. The server stores software and data, which may be received from the home network. Upon request from the voice recognition device, the server can transmit the stored software or data to the home network via the Internet.

[0053] The server can also exchange information with mobile terminals, such as personal computers (PCs) and smartphones, connected to the Internet. Information transmitted from voice recognition devices or accessories can be stored on the server and then transmitted to mobile terminals connected to the server. Furthermore, information transmitted from mobile terminals can also be transmitted to voice recognition devices or accessories via the server. Therefore, controlling voice recognition devices or accessories via mobile terminals is also possible.

[0054] Communication between voice recognition devices and accessories can occur via gateways and access points. For example, signals (or information) output from an accessory can be transmitted to the voice recognition device via the gateway and access point, respectively. Conversely, information output from the voice recognition device can be transmitted to the accessory via the access point and gateway, respectively.

[0055] In addition to the accessories described above, various other accessories may be provided. For example, accessories may include air quality sensors, smart plugs, CT sensors, nest thermostats, and sleep sensors.

[0056] Accessories can be attached to home appliances. For example, an accessory equipped with a vibration sensor can be attached to a washing machine to detect vibrations generated during operation. Signals output from the vibration sensor can be transmitted to a network based on the detected vibrations.

[0057] Accessories can also be attached to locations other than home appliances. For example, to detect the opening and closing of a door in a home, an accessory equipped with a motion sensor (e.g., an infrared sensor) can be attached to a wall to detect the door opening and closing.

[0058] A voice recognition device may include a microphone. In this case, commands can be extracted from voice input via the microphone and control performed accordingly, depending on the built-in voice recognition program. The following describes an example of a voice recognition device equipped with a microphone and speaker, but the device is not limited to a microphone and / or speaker.

[0059] Referring to FIGS. 1 and 2, a voice recognition device (or voice hub) according to the present embodiment may include a case (110), a microphone (120), a speaker module (130), a waveguide (140), a PCB module (150), and a lighting module (160). The case (110) is a member forming the exterior of the voice recognition device, the microphone (120) is a member that receives voice (or sound waves) from the outside, the speaker module (130) is a member that outputs sound waves (or voice) to the outside, the waveguide (140) is a member that radially guides sound waves output from the speaker module (130), the PCB module (150) is a member that processes voice data received through the microphone (120) and controls sound waves to be output through the speaker module (130), and the lighting module (160) is a member that emits light to the outside of the case (110). Among these, since the microphone (120) is integrally mounted on the PCB module (150), from the perspective of assembly between the components, the microphone (120) can be understood as a part of the PCB module (150), and below, the microphone (120) will be described together with the PCB module (150). These speaker module (130), waveguide (140), PCB module (150), and lighting module (160) are all assembled inside the case (110) to form a single product.

[0060] Referring to FIGS. 1 and 2, a case (110) according to the present embodiment may include a case body (111), a first case cover (112), and a second case cover (113). The case body (111) is a member that accommodates a speaker module (130), a waveguide (140), and a PCB module (150), the first case cover (112) is a member that covers the upper part of the case body (111), and the second case cover (113) is a member that covers the lower part of the case body (111).

[0061] The case body (111) may be formed in a cylindrical shape with both ends open. For example, the case body (111) may be formed in a cylindrical shape, and a plurality of sound wave output holes (111a) may be formed along the circumferential direction around the upper portion of the case body (111). Accordingly, sound waves generated in the speaker module (130) described later may be radially dispersed through the waveguide (140) described later and evenly output in all directions through the plurality of sound wave output holes (111a).

[0062] In this case, the plurality of sound wave output holes (111a) are covered by a dust-proof cloth (1115) that is fused to cover the case body (111). Accordingly, external foreign substances such as dust can be prevented from entering the interior of the case (110).

[0063] In addition, a supporting projection (1111) may be formed on the inner surface of the case body (111) to axially support the speaker module (more precisely, the bracket assembly to be described later) (130), the waveguide (140), and the PCB module (more precisely, the PCB board) (150), respectively. For example, the supporting projection (1111) may be formed in a ring shape at a position that protrudes radially toward the center from the inner surface of the case body (111), and is spaced apart by a preset interval between both ends of the inner surface of the case body (111). Accordingly, a supporting surface (1111a) is formed stepwise on the upper end of the supporting projection (1111) to axially support the waveguide (140) and the PCB module (150) to be described later together with the first case cover (112).

[0064] Specifically, the inner diameter of the support protrusion (1111) may be formed to be larger than the outer diameter of the bracket assembly (132) to be described later, and smaller than the outer diameter of the waveguide (140) and the PCB module (150). Accordingly, the waveguide (140) and the PCB module (150) to be described later may be placed on the support surface (1111a) of the support protrusion (1111) and supported in the axial direction. Through this, a sound wave output space (S) may be formed between the upper surface of the bracket assembly (132) and the lower surface of the waveguide (140) so that sound waves generated from the speaker module (130) are transmitted to the outside.

[0065] In addition, referring to FIGS. 1 and 2, a plurality of first fastening protrusions (1112) are formed at predetermined intervals along the circumferential direction on the inner surface of the support protrusion (1111), and a first fastening hole (1112a) may be formed in each of the plurality of first fastening protrusions (1112). In other words, a plurality of first fastening protrusions (1112) are formed to extend radially from the inner surface of the supporting protrusion (1111) toward the center of the case body (111) so as to be supported axially downward by being placed on a second fastening protrusion (132b) of a bracket assembly (132) to be described later, and each of the first fastening holes (1112a) can be formed to penetrate axially through the plurality of first fastening protrusions (1112) so as to be positioned on the same axial line as the second fastening hole (132c) of the second fastening protrusion (132b) to be described later. Accordingly, while the head (not shown) of the first fastening member (171) to be described later is supported on the lower surface of each first fastening projection (1112), the screw portion (not shown) of the first fastening member (171) can be screw-fastened to the fastening groove (1121a) of the first fastening boss (1121) to be described later by passing through the first fastening hole (1112a) and the second fastening hole (132c). Through this, the case body (111) can be screw-fastened to the first case cover (112) with the bracket assembly (132), i.e., the speaker module (130) interposed therebetween.

[0066] Referring to FIGS. 2 and 3, the first case cover (112) may be formed in a plate shape to cover the upper opening of the case body (111). For example, the first case cover (112) may be formed in a circular shape to correspond to the case body (111). In other words, the first case cover (112) may be formed in a circular shape whose outer diameter is the same as that of the case body (111). Accordingly, the first case cover (112) may be placed on the upper opening of the case body (111) to tightly seal and cover the upper opening of the case (110).

[0067] Here, the first case cover (112) may be interlocked with the case body (111) without a separate fastening member, or may be fastened using a fastening member. In this embodiment, an example in which the first case cover (112) is fastened to the case body (111) using a fastening member is illustrated.

[0068] For example, on the lower surface of the first case cover (112), that is, on one side of the first case cover (112) facing the upper surface of the speaker module (130), a plurality of first fastening bosses (1121) may be formed at predetermined intervals along the circumferential direction. In other words, the plurality of first fastening bosses (1121) may be formed to correspond one-to-one with the first fastening protrusion (1112) and the second fastening protrusion (132b) described above on the same axis. Accordingly, the first case cover (112) may be firmly fastened to the case body (111) by the plurality of first fastening members (171).

[0069] A plurality of first fastening bosses (1121) can be screw-fastened by each first fastening member (171) penetrating the second fastening protrusion (132b) while being in close contact with the first fastening protrusion (1112) of the bracket assembly (132) to be described later by passing through the PCB module (150) and wave guide (140) to be described later in sequence. Accordingly, the first case cover (112) can be screw-fastened to the case body (111) with the wave guide (140) and PCB module (150) to be described later placed between the speaker module (more precisely, the bracket assembly) (130). Through this, the case body (111), first case cover (112), bracket assembly (132), wave guide (140), and PCB module (150) can be assembled at once, thereby reducing the number of assembly parts and assembly work.

[0070] In this case, in addition to the first fastening boss (1121), a second fastening boss (1122) may be formed on the lower surface of the first case cover (112) to penetrate the PCB module (150) described later and be screw-fastened to the waveguide (140). The second fastening boss (1122) may be formed lower than the first fastening boss (1121) so that its leading edge is in close contact with the lower surface of the waveguide (140). Accordingly, the waveguide (140) and the PCB module (150) are temporarily fastened together to the first case cover (112) by the second fastening member (172), thereby suppressing misalignment between the parts during the assembly process with the case body (111) described above.

[0071] In other words, the second fastening boss (1122) can be formed to be close to both sides of the circumference with respect to the microphone (120) to be described later as the center. Accordingly, the second damper (182) to be described later is closely attached between the waveguide (140) and the PCB module (150) to be described later by the second fastening member (172) fastened to the second fastening boss (1122), thereby more effectively suppressing the resonance transmitted to the microphone (120). The second fastening boss (1122) will be described again later together with the waveguide (140).

[0072] In addition, a sealing protrusion (1123) may be formed on the lower surface of the first case cover (112) to be inserted into the inner surface of the case body (111) and to be in close contact with the inner surface of the case body (111). For example, the sealing protrusion (1123) may be formed in an arc shape on the outer surface of the plurality of first fastening bosses (1121). Accordingly, when the case body (111) and the first case cover (112) are assembled, the sealing protrusion (1123) may be in close contact with the upper inner surface of the case body (111), thereby increasing the sealing force between the case body (111) and the first case cover (112).

[0073] In addition, the first case cover (112) may be formed with at least one voice input hole (1124) penetrating between the upper and lower surfaces. For example, two voice input holes (1124) may be formed on each side with a 180-degree interval in the circumferential direction. Accordingly, the user's voice may pass through each voice input hole (1124) and be quickly and accurately transmitted to the microphone (120) provided inside the case (110).

[0074] In this case, as shown in FIGS. 9 and 10, a damper-receiving rib (1125) is formed around the voice input hole (1124), that is, on the lower surface of the first case cover (112), to surround the voice input hole (1124), and a damper (hereinafter referred to as a second damper) (182) having a first voice transmission hole (1821) can be inserted into the inside of the damper-receiving rib (1125) to correspond to the voice input hole (1124) of the first case cover (112). Accordingly, the second damper (182) absorbs and cancels out the resonance between the PCB module (150) and the first case cover (112), which will be described later, so that the user's voice can be accurately and quickly transmitted to the microphone (120).

[0075] Referring to FIGS. 6 and 7, the second case cover (113) may be formed in a plate shape to cover the lower opening of the case body (111). For example, the second case cover (113) may be formed in a circular shape to correspond to the case body (111), similar to the first case cover (112). In other words, the second case cover (113) may be formed in a circular shape whose outer diameter is the same as that of the case body (111). Accordingly, the second case cover (113) may tightly cover the lower opening of the case body (111).

[0076] Here, the second case cover (113) may be interlocked with the case body (111) without a separate fastening member, or may be coupled using a fastening member. In this embodiment, an example in which the second case cover (113) is interlocked with the case body (111) without a fastening member is illustrated. Accordingly, by eliminating the fastening member exposed to the outside of the case (110), not only can the assembly process of the case (110) be simplified, but also the aesthetic appeal can be enhanced.

[0077] For example, a first hook portion (132a) may be formed on the upper surface of the second case cover (113), that is, the upper side of the second case cover (113) facing the lower surface of the speaker module (130), so that a second hook portion (1322a), which will be described later, may be inserted therein. A plurality of first hook portions (132a) may be formed at predetermined intervals along the circumferential direction. Accordingly, the second case cover (113) may be hook-connected to the speaker module (130) in a state where the lower end of the case body (111) is covered. This reduces the number of parts required to assemble the second case cover (113) to the case body (111), while simplifying the assembly process for the second case cover (113).

[0078] Although not shown in the drawing, the case body (111) may be formed in a cup shape with one end closed. For example, the case (110) may be formed of the case body (111) and the second case cover (113). In other words, the first case cover (112) may be formed as a single body on the upper part of the case body (111). Accordingly, when the case body (111) and the first case cover (112) are post-assembled, machining errors and / or assembly errors that may occur between the case body (111) and the first case cover (112) can be prevented in advance, thereby simplifying the assembly of the case (110) as a whole and enhancing the aesthetics.

[0079] In the case where the upper side of the case body (111) is formed in a closed shape as described above, the number of parts and / or assembly work for the upper side of the case body (111) forming the first case cover (112) is reduced as described above, so that the assembly cost for the voice recognition device can be further reduced. In addition, since the upper side of the case body (111) is formed as a single body, the aesthetic appeal of the voice recognition device including the case (110) can be further improved.

[0080] Referring to FIGS. 1 to 5, a speaker module (130) according to the present embodiment may include a speaker body (131) and a bracket assembly (132). The speaker body (131) is a member that outputs sound waves (or voice), and the bracket assembly (132) is a member that accommodates the speaker body (131) and is coupled to a case (110).

[0081] The speaker body (131) may be formed in a convex plate shape with the center thereof facing the bracket assembly (132) to be described later, and may be fastened to the bracket assembly (132). For example, a speaker support portion (1311) may be formed in a flange shape on the outer surface of the speaker body (131), and a speaker mounting portion (1321a) may be formed in the bracket assembly (132) so that the speaker support portion (1311) may be inserted and fastened. Accordingly, the speaker body (131) may be fastened to the bracket assembly (132) with screws, and may be firmly fixed to the case (110) together with the bracket assembly (132).

[0082] The bracket assembly (132) may include a first bracket (1321) and a second bracket (1322). For example, the bracket assembly (132) may be assembled such that the first bracket (1321) and the second bracket (1322) are each formed in an annular shape with an opening and the openings face each other. Accordingly, the bracket assembly (132) is formed in an annular shape with a hollow cavity, so that the sound quality of the sound generated from the speaker body (131) can be improved.

[0083] In this case, a first fastening member receiving groove (132a) may be formed on the outer surface of the bracket assembly (132), that is, on the outer surface of the first bracket (1321) and the second bracket (1322), so as to receive the first fastening member (171) described above. Accordingly, even if the first fastening member (171) vertically terminates the bracket assembly (132), interference between the first fastening member (171) and the inner surface of the case (110) can be suppressed since the first fastening member (171) is received within the outer surface of the bracket assembly (132).

[0084] For example, the first fastening member receiving groove (132a) may be formed to be radially recessed on the outer surface of the bracket assembly (132) and extend vertically, and a second fastening protrusion (132b) may be formed in a stepped manner on one end of the first fastening member receiving groove (132a), that is, on one end of the first bracket (1321) among the first fastening member receiving grooves (132a). Accordingly, the lower surface of the second fastening protrusion (132b) may be in close contact with the upper surface of the first fastening protrusion (1112) of the case body (111) described above, and the upper surface of the second fastening protrusion (132b) may be in close contact with the front end surface of the first fastening boss (1121) described above, so that they may be supported in both axial directions by the case body (111) and the first case cover (112).

[0085] In this case, a second fastening hole (132c) may be formed on the same axis as the first fastening hole (1112a) of the first fastening protrusion (1112) described above so that the first fastening member (171) passes through the second fastening protrusion (132b). Accordingly, while the head of the first fastening member (171) is supported by the first fastening protrusion (1112) described above, the screw portion of the first fastening member (171) may pass through the second fastening hole (132c) and be fastened to the first fastening boss (1121) of the first case cover (112). Through this, the bracket assembly (132) forming the speaker module (130) may be firmly assembled to the case (110) while minimizing the length of the first fastening member (171).

[0086] The first bracket (1321) may have a speaker mounting portion (1321a) formed around the inner circumference thereof so that the speaker body (131) described above may be inserted and fastened thereto, and a boss support rib (1321b) may be formed on the outer circumference of the speaker mounting portion (1321a) so that the tip of the first fastening boss (1121) may be inserted and supported therein. In other words, a boss support rib (1321b) may be formed on the upper surface of the first bracket (1321) facing the lower surface of the waveguide (140) described later, extending toward the lower surface of the waveguide (140) by a preset height. Accordingly, when the first fastening boss (1121) is pressed against the first bracket (1321), the front end of the first fastening boss (1121) is inserted into the boss support rib (1321b), thereby improving the bonding strength with the first bracket (1321).

[0087] In this case, the boss support rib (1321b) may be formed in a circular shape or may be formed in an arc shape cut in the longitudinal direction. In the former case, the manufacturing of the boss support rib (1321b) is easy and the bonding strength to the first fastening boss (1121) can be improved. In the latter case, the boss support rib (1321b) can be flexibly changed when assembling the first fastening boss (1121), so that an allowance for processing errors and / or assembly errors can be secured. This embodiment illustrates an example in which the boss support rib (1321b) is formed in an arc shape.

[0088] The second bracket (1322) may be formed with a second hook portion (1322a) that is inserted into and engaged with the first hook portion (132a) of the second case cover (113) described above. A plurality of second hook portions (1322a) may be provided to correspond to the first hook portion (132a) and may be spaced apart from each other by a preset interval in the circumferential direction. Accordingly, the second case cover (113), which forms a part of the case (110), is hook-connected to the second bracket (1322), thereby reducing the number of parts for the second case cover (113) and reducing the assembly work.

[0089] In this case, the second hook portion (1322a) can be formed to correspond to the first hook portion (132a) of the second case cover (113) at the lower edge of the second bracket (1322). Accordingly, the fastening point between the second case cover (113) and the second bracket (1322) is positioned as far as possible from the center of the second bracket (1322), thereby increasing the bonding force between the second case cover (113) and the second bracket (1322). In addition, while forming the thickness of the second case cover (113) thin, the second case cover (113) and the second bracket (1322) can be easily hook-assembled.

[0090] Referring to FIGS. 1 to 5, the waveguide (140) according to the present embodiment may be formed in a plate shape. For example, the waveguide (140) may be formed in a circular plate shape to correspond to the case body (111). In other words, the outer diameter of the waveguide (140) may be formed to be smaller than or equal to the inner diameter of the sealing protrusion (1123) of the first case cover (112) described above. Accordingly, the waveguide (140) may be accommodated in the sound wave output space (S) between the first case cover (112) and the first bracket (1321) to guide sound waves generated from the speaker module (130) to the sound wave output hole (111a) of the case body (111). Through this, even if the sound wave output space (S) is not sufficiently secured in the front side of the speaker module (130), not only can the overlap and interference of the record wave with the sound waves generated from the speaker module (130) be suppressed, but also the sound waves generated from the speaker module (130) are evenly distributed through the waveguide (140), so that the sound distortion phenomenon can be suppressed more effectively.

[0091] Specifically, the waveguide (140) may be formed in a circular shape as described above, but may be formed to be inclined so as to approach the first case cover (112) from the center toward the edge. In other words, the waveguide (140) has a sound wave guide surface (141) formed on the lower surface facing the speaker module (130) and / or the first bracket (1321) to guide sound waves, and the sound wave guide surface (141) may be formed continuously with a first guide surface (1411) facing the speaker module (130) and a second guide surface (1412) facing the first bracket. Accordingly, the sound wave generated from the speaker module (130) travels toward the first sound wave output hole (111a) of the case body (111) along the sound wave guide surface (141) formed of the first guide surface (1411) and the second guide surface (1412).

[0092] In this case, the first guide surface (1411) is formed as a convex curved surface toward the first case cover (112) to correspond to the speaker module (130), and the second guide surface (1412) may be formed to be inclined or curved so as to extend from the outer side of the first guide surface (1411) and approach the lower surface of the first case cover (112) as it goes toward the outer surface of the waveguide (140). In other words, the second guide surface (1412) may be formed so that the gap with the bracket assembly (132) increases as it moves away from the first guide surface (1411). Accordingly, the sound wave guide surface (141) may be formed to be narrow in a portion close to the speaker module (130), which is the sound source, while it may be formed to be wide as it moves away from the speaker module (130). Through this, a wide and smooth sound wave output space (S) is secured in front of the speaker module (130), so that sound wave distortion caused by overlapping and interference of record waves can be minimized.

[0093] In addition, in this case, a sound wave guide protrusion (142) may be formed on the sound wave guide surface (141) of the wave guide (140) to guide the sound waves generated from the speaker module (130) toward the first sound wave output hole (111a). For example, the sound wave guide protrusion (142) may be formed on the second guide surface (1412) and may be formed to extend radially from the first guide surface (1411). The sound wave guide protrusions (142) may be formed at equal intervals along the circumferential direction. Accordingly, the sound waves generated from the speaker module (130) are evenly transmitted radially, so that the usable range of the voice recognition device can be secured as wide as possible.

[0094] The sound wave guide protrusion (142) may be formed to protrude from the sound wave guide surface (141) in a direction toward the first bracket (1321), but to be recessed on the opposite side of the sound wave guide surface (141) and raised toward the sound wave guide surface (141). Accordingly, while the sound wave guide protrusion (142) is formed on one side of the wave guide (140), the overall thickness of the wave guide (140) may be formed the same, thereby suppressing an increase in the weight of the wave guide (140).

[0095] In addition, referring to FIGS. 8 to 11, a first boss receiving hole (143) through which a first fastening boss (1121) passes may be formed at the edge of the waveguide (140). Accordingly, the first fastening boss (1121) passing through the second boss receiving hole (1511) of the PCB module (150) to be described later may pass through the first boss receiving hole (143) and be in close contact with the second fastening protrusion (132b) of the speaker module (130). Through this, the waveguide (140) may be radially restrained by the first fastening boss (1121) while being axially supported between the first case cover (112) and the speaker module (130) together with the PCB module (150) to be described later.

[0096] In this case, the first boss receiving hole (143) may be formed on the same axis as the first fastening hole (1112a) of the case body (111) described above, the second fastening hole (132c) of the speaker module (130), and the second boss receiving hole (1511) of the PCB module (150) described later, along with the fastening groove (1121a) of the first fastening boss (1121). Accordingly, the waveguide (140) can be connected in one piece by the first fastening member (171) that passes through the first fastening hole (1112a) of the case body (111), the second fastening hole (132c) of the speaker module (130), the first boss receiving hole (143) of the waveguide (140), and the second boss receiving hole (1511) of the PCB module (150) to be described later, and is fastened to the first fastening boss (1121) of the first case cover (112).

[0097] In addition, referring to FIGS. 8 and 11, at least one microphone (120) may be mounted on the lower surface of the PCB module (150) facing the waveguide (140). For example, two microphones (120) may be mounted on the lower surface of the PCB board (151) at equal intervals in the circumferential direction. In other words, the microphone (120) may be mounted on the lower surface of the PCB board (151) at a position axially overlapping with the sound wave output path (F) defined by the space between the sound wave guide protrusions (142) of the waveguide (140). Accordingly, the damper receiving groove (144) described later is positioned in the relatively wide sound wave output path (F), so that the first damper (181) accommodated in the damper receiving groove (144) can be formed relatively wide.

[0098] Although not shown in the drawing, the microphone (120) may be mounted on the PCB module (150) between the two sound wave output passages (F), that is, at a position axially overlapping with the sound wave guide protrusion (142). In this case, since the second fastening bosses (1122) are formed to correspond to the two sound wave output passages (F), the heads (not shown) of the second fastening members (172) that are relatively smaller than the second dampers (182) can be accommodated in the two sound wave output passages (F). Accordingly, the sound wave movement resistance in the two sound wave output passages (F) is reduced, so that the sound waves output from the speaker body (131) can move smoothly.

[0099] In addition, in this case, the waveguide (140) may have a damper receiving groove (144) formed to be sunken in a direction away from the PCB (151), and a first damper (181) may be inserted into the damper receiving groove (144). For example, the damper receiving groove (144) may be formed to be sunken by a preset depth from the upper surface of the waveguide (140) facing the microphone (120), that is, the back surface of the sound wave guide surface (141) toward the sound wave guide surface (141) facing the first bracket (1321). Accordingly, even if the gap between the waveguide (140) and the PCB module (150) becomes narrow, the microphone (120) may be placed as far as possible on the outermost side of the first case cover (112). Through this, the user's voice can be accurately and quickly transmitted to the microphone (120).

[0100] Specifically, the damper receiving groove (144) is formed on the same axis as the microphone (120), but the cross-sectional area of ​​the damper receiving groove (144) can be formed to be larger than the cross-sectional area of ​​the microphone (120). Accordingly, the microphone (120) is positioned at the center of the damper receiving groove (144), and is accommodated in the center of the first damper (181) described later, thereby more effectively suppressing resonance with neighboring members.

[0101] In this case, the damper receiving groove (144) may be formed by being sunken to a preset depth between the sound wave guide protrusions (142) on both sides of the wave guide (140), that is, in the direction from the sound wave output path (F) toward the speaker module (130). Accordingly, even if a microphone (120) is mounted together with various elements (152) on the lower surface of the PCB (151) to be described later facing the wave guide (140), a second damper (182) having a depth greater than or equal to the damper receiving groove (144) may be inserted between the microphone (120) and the wave guide (140).

[0102] Also, in this case, the damper receiving groove (144) may be formed into an approximately square shape when projected in the axial direction, or may be formed into an elongated rectangle along the direction of sound wave movement. In the former case, the damper receiving groove (144) is formed on a relatively wide outer side of the sound wave output path (F), so that the sound wave movement resistance can be lowered while ensuring a relatively large cross-sectional area of ​​the second damper (182). On the other hand, in the latter case, the damper receiving groove (144) is formed long along the sound wave output path (F), so that the cross-sectional area of ​​the second damper (182) can be secured even larger while reducing the sound wave movement resistance in the sound wave output path (F). This embodiment illustrates an example in which the damper receiving groove (144) is formed into an approximately square shape. Accordingly, the back surface of the damper receiving home (144) is in close contact with the lower surface of the PCB (151) to be described later, so that the wave guide (140) can be stably supported on the PCB (151).

[0103] Also, in this case, referring to FIGS. 9 and 11, second fastening member receiving grooves (145) into which the heads (not shown) of the second fastening members (172) are respectively inserted may be formed on both sides of the damper receiving groove (144) in the circumferential direction. For example, the second fastening member receiving groove (145) may be formed to be sunken by a preset depth toward the PCB module (150) facing the back surface of the sound wave guide surface (141). Accordingly, the depth of the second fastening member receiving groove (145) is formed sufficiently deep, so that the head of the second fastening member (172) can be smoothly concealed.

[0104] Although not shown in the drawing, the damper receiving groove (144) may be formed into a circular cross-section when projected in the axial direction. In other words, the damper receiving groove (144) protrudes from the middle of the sound wave output passage (F), and the outer surface of the damper receiving groove (144) may be formed into a circular curve. In this case, the outer surface of the damper receiving groove (144) forms a curved surface, thereby minimizing the sound wave movement resistance in the sound wave output passage (F).

[0105] Also, in this case, the damper receiving groove (144) can be formed to be spaced apart in the circumferential direction from at least one of the sound wave guide projections (142) on both sides. Accordingly, a sound wave output path (F) is formed between the outer surface of the damper receiving groove (144) and the outer surface of the sound wave guide projection (142), thereby further reducing the sound wave movement resistance in the sound wave output path (F).

[0106] Referring to FIGS. 9 to 11, the first damper (181) may be formed larger than the microphone (120) so as to surround the microphone (120). For example, the first damper (181) may be formed in a square shape when projected axially, and a microphone receiving groove (1811) may be formed sunken on the surface facing the PCB module (150), and at least one first damping protrusion (1812) may be formed on one side of the first damper (181) so as to protrude toward the PCB module (150) around the microphone receiving groove (1811). Accordingly, when the first damping protrusion (1812) of the first damper (181) is in close contact with the PC module (150), the vibration transmitted through the PC module (150) is absorbed by the first damper (181), thereby preventing the vibration from being transmitted to the microphone (120).

[0107] In addition, a damper fixing protrusion (1813) may protrude toward the waveguide (140) at the center of the other side of the first damper (181). For example, a damper fixing hole (1441) penetrating toward the speaker module (130) may be formed in the damper receiving groove (144) of the waveguide (140), and the damper fixing protrusion (1813) of the first damper (181) described above may be inserted and fixed into the damper fixing hole (1441). Accordingly, when assembling the first damper (181), the first damper (181) is prevented from being removed, and at the same time, the vibration of the waveguide (140) may be quickly transmitted to the first damper (181) through the damper fixing protrusion (1813) and canceled out.

[0108] Referring to FIGS. 1 to 5, a PCB module (150) according to the present embodiment may include a PCB substrate (151) and various components (152). The PCB substrate (151) is disposed between the first case cover (112) and the waveguide (140), and the various components (152) may be mounted on the lower surface of the PCB substrate (151), that is, the lower surface facing the waveguide (140). Accordingly, the PCB substrate (151) may be spaced apart from the waveguide (140) by a preset interval, and the microphone (120) may be disposed on the lower surface of the PCB substrate (151) together with the various components (152).

[0109] The PCB substrate (151) is formed in a circular shape, and may be formed to have approximately the same outer diameter as the waveguide (140) or may be formed to have a slightly smaller outer diameter than the waveguide (140). In the former case, the lower surface of the PCB substrate (151) is in close contact with the upper surface of the waveguide (140) and is radially restrained by the first fastening boss (1121) and the second fastening boss (1122) described above, whereas in the latter case, a PCB support protrusion (not shown) that surrounds the outer surface of the PCB substrate (151) is formed at the edge of the waveguide (140) to support the PCB substrate (151) in the radial direction.

[0110] For example, a second boss receiving hole (1511) through which a first fastening boss (1121) of a first case cover (112) passes and a third boss receiving hole (1512) through which a second fastening boss (1122) passes may be formed at the edge of the PCB board (151). Accordingly, the PCB board (151) may be fastened to the first case cover (112) together with the waveguide (140) by the second fastening member (172) and may be fastened to the first case cover (112) by the waveguide (140) and the bracket assembly (132) by the first fastening member (171). Through this, the assembly position of the PCB board (151) can be maintained during assembly of the PCB board (151), thereby increasing assembly reliability.

[0111] In addition, a second sound transmission hole (1513) may be formed in the PCB board (151). The second sound transmission hole (1513) may be formed on the same axis as the first sound transmission hole (1821) of the second damper (182) to be described later. In this case, the microphone (120) described above may be attached to the lower surface of the PCB board (151), and the microphone (120) may be attached so as to be positioned on the same axis as the second sound transmission hole (1513). Accordingly, the user's voice may pass through the voice input hole (1124) of the first case cover (112) and the first sound transmission hole (1821) to the second sound transmission hole (1513) of the PCB board (151), and this voice may pass through the second sound transmission hole (1513) to be transmitted to the microphone (120). Through this, the voice recognition rate of the microphone (120) is improved, so that the user's voice can be transmitted to the microphone (120) quickly and accurately.

[0112] In addition, a second damper (182) may be provided between the PCB board (151) and the upper surface of the first case cover (112) facing it. For example, the second damper (182) may be inserted into a damper receiving rib (1125) provided in the first case cover (112) and fixed between the PCB board (151) and the upper surface of the first case cover (112) facing it. Accordingly, as described above, the second damper (182) can absorb and cancel out the resonance between the PCB module (150) and the first case cover (112). Through this, the voice recognition rate of the microphone (120) is improved, so that the user's voice can be accurately and quickly transmitted to the microphone (120).

[0113] In this case, the second damper (182) may be formed in a rectangular shape, and a first sound transmission hole (1821) may be formed through the center thereof. The first sound transmission hole (1821) may be formed on the same axis as the sound input hole (1124) of the first case cover (112) described above and the second sound transmission hole (1513) of the PCB (151). Accordingly, the user's voice may be accurately and quickly transmitted to the microphone (120).

[0114] In addition, in this case, at least one second damping protrusion (1812) may be formed on one side of the second damper (182), for example, on the upper side facing the first case cover (112), and protruding toward the first case cover (112) around the first sound transmission hole (1821). Accordingly, when the second damping protrusion (1812) of the second damper (182) is in close contact with the first case cover (112), the vibration transmitted through the first case cover (112) is absorbed by the second damper (182), thereby preventing the vibration from being transmitted to the microphone (120) through the PCB (151).

[0115] Thus, by integrating a waveguide at the front of the speaker module, the case can be made relatively small while suppressing distortion caused by overlapping and interference of sound waves. This allows for the miniaturization of voice recognition devices while also enhancing their reliability.

[0116] Additionally, even if the speaker's frontal space is insufficient, a damper surrounding the microphone can suppress resonance between components located around the microphone from being directly transmitted to the microphone. This improves the microphone's voice recognition rate, ensuring the user's voice is accurately and quickly transmitted to the microphone.

[0117] Additionally, the increase in sound wave output resistance and / or distortion generated by the speaker due to the microphone installation space can be minimized as much as possible. This increases product reliability while minimizing restrictions on the number of microphones installed.

[0118] Meanwhile, there are other embodiments of the voice recognition device as follows.

[0119] That is, in the embodiments described above, a damper receiving groove is formed in the waveguide, but in some cases, the damper receiving groove may be excluded from the waveguide or formed shallowly.

[0120] Referring to FIGS. 12 and 13, the basic configuration and the resulting operational effects of the voice recognition device according to the present embodiment are similar to those of the above-described embodiment. For example, the voice recognition device according to the present embodiment includes a case (110), a microphone (120), a bracket assembly (132), a waveguide (140), and a PCB module (150). However, the microphone (120), the speaker module (130), the waveguide (140), and the PCB module (150) can be fastened to the inside of the case (110) using the same fastening member (for example, the first fastening member (171). Accordingly, the number of parts and assembly work for the voice recognition device can be reduced, thereby reducing manufacturing costs.

[0121] In this case, as the waveguide (140) is arranged at the front side of the speaker module (130), the sound waves (or voice) output from the speaker module (130) travel radially toward the sound wave output hole (111a) of the case (110) along the waveguide (140). Accordingly, even if the sound wave output space (S) is not sufficiently secured at the front side of the speaker module (130), not only can the overlap and interference of the record wave with the sound waves generated from the speaker module (130) be suppressed, but also the sound waves generated from the speaker module (130) are evenly distributed through the waveguide (140), so that the sound distortion phenomenon can be suppressed more effectively. Since the basic configuration and the resulting operational effects of the waveguide (140) are almost the same as those of the above-described embodiment, the description thereof will be replaced with the description of the above-described embodiment.

[0122] However, in the present embodiment, the microphone (120) may be placed in a direction facing away from the waveguide (140), that is, on the upper side facing the first case cover (112) among the two sides of the PCB (151). Accordingly, a damper (e.g., the first damper) (181) that directly surrounds the microphone (120) may be excluded between the waveguide (140) and the PCB module (150).

[0123] For example, a microphone (120) may be mounted on the upper side of a PCB (151) facing a first case cover (112) together with various components (152), and a damper (e.g., a second damper) (182) that surrounds the microphone (120) may be provided between the first case cover (112) and the PCB (151). A microphone receiving groove (1823) may be formed to be recessed in the damper (182) so that the microphone (120) may be inserted, and a sound transmission hole (e.g., a first sound transmission hole) (1821) may be formed in the microphone receiving groove (1823) so as to be positioned on the same axis as a sound input hole (1124) of the first case cover (112). Accordingly, the resonance between the first case cover (112) and the PCB board (151) can be absorbed by the damper (182) and suppressed from being transmitted to the microphone (120). This improves the voice recognition rate of the microphone (120), so that the user's voice can be transmitted to the microphone (120) accurately and quickly.

[0124] As described above, when the microphone (120) is placed on the side facing away from the waveguide (140) among the two sides of the PCB (151), the damper receiving groove (144) disclosed in the above-described embodiment in the waveguide (140) can be excluded. Accordingly, the sound wave guide surface (141) of the waveguide (140) is formed flat, and the sound wave output resistance at the sound wave guide surface (141) is reduced, so that the sound waves generated from the speaker module (130) can be transmitted more effectively toward the sound wave output hole (111a). Through this, the height of the sound wave output space (S) can be formed as low as possible, so that the voice recognition device can be further miniaturized.

[0125] In addition, the voice recognition device according to the present embodiment generates little or no sound wave output resistance on the sound wave guide surface (141) due to the microphone (120), so that the number of microphones (120) can be further increased. In other words, in the above-described embodiment, an example in which only two microphones (120) are provided on each side is shown, but three or more microphones (120) may be provided. Accordingly, a plurality of microphones (120) are arranged radially, so that the range in which the user's voice is transmitted is expanded, and the user's voice can be transmitted accurately.

Claims

1. A case comprising a case body having at least one open end among both ends and a case cover covering the open end of the case body; A speaker module accommodated in the above case body; A PC module accommodated in the case body; and It includes a waveguide that is accommodated in the case body and guides sound waves generated from the speaker module to the outside. The above waveguide, A voice recognition device provided between the above speaker module and the above PCB module.

2. In paragraph 1, The above waveguide, A voice recognition device in which at least a portion of the sound wave guide surface facing the speaker module is formed as a curved or inclined surface.

3. In paragraph 2, The above speaker module includes a speaker body and a bracket assembly in which the speaker body is connected at the center and the edge is connected to the case, The sound wave guide surface of the above wave guide includes a first guide surface facing the speaker body and a second guide surface facing the bracket assembly. The above second guide surface is, A voice recognition device formed so that the distance from the bracket assembly increases as it moves away from the first guide surface.

4. In paragraph 2, At least one sound wave guide protrusion is formed on the above sound wave guide surface, The above sound wave guide projection is, A voice recognition device that is formed radially and elongated.

5. In paragraph 4, The above sound wave guide protrusions are formed in multiple numbers along the circumferential direction, The above plurality of sound wave guide projections are, A voice recognition device formed at equal intervals along the circumference.

6. In paragraph 1, The above PCB module includes a PCB board on which various components are mounted, A voice recognition device having at least one microphone mounted on at least one side among both sides of the above-mentioned PCB.

7. In paragraph 6, The above microphone is mounted on one side of the PCB facing the waveguide, The above waveguide, A voice recognition device in which a damper receiving groove is formed to be sunken in a direction toward the speaker module so as to accommodate a first damper that surrounds the microphone.

8. In paragraph 7, The above waveguide, A plurality of sound wave guide protrusions are formed at preset intervals along the circumferential direction on the sound wave guide surface facing the speaker module. The above damper receiving home is, A voice recognition device formed between two sound wave guide protrusions adjacent to each other in the circumferential direction among the above plurality of sound wave guide protrusions.

9. In paragraph 8, The above damper receiving home is, A voice recognition device formed so as to be spaced apart in the circumferential direction from at least one of the above two sound wave guide protrusions.

10. In paragraph 7, The above first damper, A microphone receiving groove is formed to be sunken on the surface facing the above PCB, and a damper fixing protrusion is formed to be protruded on the surface facing the waveguide. In the damper receiving groove facing the above damper fixing projection, A voice recognition device in which a damper fixing hole is formed so that the above damper fixing protrusion is inserted.

11. In paragraph 7, A second damper is provided between the case cover and the other side of the PCB facing it. In the above case cover, A voice recognition device in which a damper receiving rib protrudes toward the PCB board so that the second damper is received.

12. In paragraph 11, The second damper is provided on the same axis as the microphone or the first damper, In the case cover, the second damper and the PCB, A voice recognition device in which the voice transmission holes opening toward the above microphone are formed by penetrating each other on the same axis.

13. In paragraph 6, The above microphone is mounted on the other side of the PCB facing the waveguide, In the above case cover, A voice recognition device in which a damper-receiving rib protrudes toward the PCB so as to accommodate a damper that surrounds the microphone.

14. In paragraph 13, The above damper, A voice recognition device in which a microphone receiving groove is formed in a sunken manner on a surface facing the above-mentioned PCB, and a sound transmission hole opening toward the microphone is formed through the microphone receiving groove and the above-mentioned damper on the same axis.

15. In any one of paragraphs 1 to 14, A fastening boss extending toward the PCB module is formed in the case cover, a boss receiving hole is formed in the PCB module to allow the fastening boss to pass through, and a fastening member receiving groove recessed toward the fastening boss is formed in the wave guide. The above waveguide, A voice recognition device that is connected to the case cover together with the PCB module by a fastening member, one end of which is supported by the fastening member receiving groove of the wave guide and the other end is fastened to the fastening boss of the case cover.

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