Substrate carrying apparatus and film attaching device

Abstract

Disclosed in the present invention are a substrate carrying apparatus and a film attaching device. The substrate carrying apparatus comprises: a first region, in which a first flexible pad is provided, the first flexible pad comprising a first placement surface on which only a middle region of a substrate is placed; and a second region, which is located on the outer side of the first region, and in which an adhesion module is provided, the adhesion module comprising a second flexible pad having a second placement surface located at the same height position as the first placement surface, wherein a plurality of vacuum adhesion holes of different sizes are formed in the second flexible pad in a thickness direction; and with the plurality of vacuum adhesion holes of different sizes, the second flexible pad has greater adhesion force in the area close to the edge or corner of the substrate than in other areas. By means of the substrate carrying apparatus, the substrate can be stably adhered, and the substrate is flattened during the adhesion process, thereby improving the film attaching quality.

Description

Substrate carrier and laminating equipment Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to substrate carrier devices and film bonding equipment. Background Technology

[0002] In semiconductor manufacturing, after the substrate pre-processing is completed, the substrate needs to be directly encapsulated with a film before storage, transportation, or proceeding to the next processing step. Substrate encapsulation requires ensuring the substrate surface is free of air bubbles and that the substrate is level. This places a requirement on the flatness of the substrate; only by ensuring the flatness of the substrate before encapsulation can the quality of the encapsulation be guaranteed. Therefore, a support device is needed to ensure the substrate is leveled when placed on it.

[0003] Summary of the Invention

[0004] To overcome the above-mentioned shortcomings, the present invention aims to provide a substrate carrier device and a film application device that can stably adsorb the substrate and level the substrate during the adsorption process, thereby improving the film application quality.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a substrate carrier device, comprising a carrier body, wherein the carrier body includes:

[0006] A first region, wherein a first flexible pad is provided in the first region, and the first flexible pad includes a first placement surface for placing the middle region of the substrate;

[0007] A second region, located outside the first region, is equipped with an adsorption module, which includes:

[0008] The second flexible pad has a second placement surface at the same height as the first placement surface, and the second flexible pad has a plurality of vacuum adsorption holes of different sizes opened along the thickness direction.

[0009] The multiple vacuum adsorption pores of different sizes provide the second flexible pad with greater adsorption force in areas near the substrate edge or corner than in other areas of the second flexible pad.

[0010] The beneficial effects of this invention are as follows:

[0011] First, the first flexible pad serves as a load-bearing element, while the substrate is adsorbed through the vacuum adsorption holes on the second flexible pad, thus leveling the substrate and improving its flatness.

[0012] 2. Adsorption modules are set up at the edges or corners of the substrate that are prone to warping to provide adsorption force, which can fix and position the substrate while leveling the areas of the substrate that are prone to warping.

[0013] Third, the vacuum adsorption holes on the second flexible pad are of different sizes to provide greater adsorption force near the edge or corner of the substrate, so as to achieve rapid leveling of the substrate.

[0014] Fourth, the flexible materials of the first and second flexible pads can alleviate the adsorption force, thereby preventing severe deformation between the second flexible pad and the substrate, and also preventing the formation of gaps between the second flexible pad and the substrate. It can adapt to substrates with uneven or textured surfaces, ensuring effective flatness and surface uniformity of the substrate.

[0015] Furthermore, on the second flexible pad, the size of the vacuum adsorption holes near the edge or corner of the substrate is larger than the size of other vacuum adsorption holes. The adsorption force is adjusted by regulating the size of the vacuum adsorption holes; the larger the size of the vacuum adsorption hole, the greater its adsorption force.

[0016] Furthermore, the size of the vacuum adsorption holes on the second flexible pad gradually decreases from near the edge or corner of the substrate to away from the edge or corner of the substrate.

[0017] By setting the size of the vacuum adsorption pores to a gradual shape, the adsorption force adapts to the warped flatness, ensuring that the adsorption force is always greatest in the corner or edge areas of the substrate, even for substrates of different sizes.

[0018] Furthermore, the first placement surface and the second placement surface are joined together to form a placement surface for placing the substrate. The area of ​​the placement surface is larger than the area of ​​the substrate, ensuring that the placement surface can cover the substrate.

[0019] Furthermore, the adsorption module also includes:

[0020] A vacuum generator, which is connected to a plurality of vacuum adsorption holes, is used to create a low-pressure vacuum at the vacuum adsorption holes;

[0021] An adsorption shell, wherein the adsorption shell defines a cavity, and the vacuum generator is connected to the cavity;

[0022] A support plate is fixed between the adsorption shell and the second flexible pad. The top plate of the adsorption shell and the support plate are provided with suction channels corresponding to the vacuum adsorption holes. The suction channels connect the vacuum adsorption holes and the cavity.

[0023] The vacuum generator provides a vacuum negative pressure to the cavity, which in turn generates an adsorption force at the vacuum adsorption hole through the suction channel. At this time, the adsorption module becomes a modular structure, which is easy to replace.

[0024] Furthermore, the support plate and the second flexible pad are glued or bolted together, which allows for quick fixation of the second flexible pad and facilitates its replacement.

[0025] Furthermore, the vacuum adsorption pores can be circular, triangular, square, or polygonal. The shape of the vacuum adsorption pores is not limited, as long as they can generate negative pressure for adsorption.

[0026] Furthermore, both the substrate and the carrier body are square, the adsorption module is located on both sides of the first flexible pad in the first direction, and the size of the vacuum adsorption hole of the second flexible pad away from the first flexible pad is larger than the size of the vacuum adsorption hole in other areas of the second flexible pad.

[0027] For square substrates, warping usually occurs in the corner areas. Therefore, by placing the adsorption modules on both sides of the first flexible pad, the four corner areas of the substrate can be adsorbed to achieve leveling.

[0028] Furthermore, the substrate and the carrier body are circular, the adsorption module is arranged around the first flexible pad, and the multiple vacuum adsorption holes are distributed on multiple concentric circles with the center of the first flexible pad as the center. The size of the vacuum adsorption holes on the concentric circles farther away from the first flexible pad is larger than the size of the vacuum adsorption holes at other positions.

[0029] Because circular substrates are prone to warping at the edges, the adsorption module is positioned on the outer periphery corresponding to the edge of the substrate. The edge of the circular substrate abuts against the outermost part of the second flexible pad; therefore, the size of the vacuum adsorption pores at this location is increased to enhance the adsorption force and flatten the easily warped edge area of ​​the circular substrate.

[0030] Furthermore, the supporting body also includes a support frame, within which the adsorption module and the first flexible pad are fixed. The support frame provides support and fixation, allowing the supporting body to form a single, integral unit.

[0031] The present invention also provides a film-applying device for applying film to a substrate, the film-applying device including the substrate carrier device described above.

[0032] During the placement process, the substrate is placed on the substrate carrier, with the central area of ​​the substrate abutting against the first placement surface and the edges or corners against the second placement surface. The vacuum generator then initiates suction. Because the vacuum suction holes can adsorb edges or corners of the substrate that are prone to warping, and the first flexible pad lacks suction or has weak suction force, the substrate is flattened during the suction process, improving its flatness. In particular, edges or corners prone to warping are drawn downwards by a stronger suction force, further enhancing the flattening effect. With the substrate flattened on the substrate carrier, no air bubbles are generated on the substrate surface for film placement. Attached Figure Description

[0033] Figure 1 is a top view of an embodiment of the present invention;

[0034] Figure 2 is a three-dimensional structural schematic diagram of an embodiment of the present invention;

[0035] Figure 3 is a partial cross-sectional view along line AA in Figure 1;

[0036] Figure 4 is a partial cross-sectional view along line BB in Figure 1;

[0037] Figure 5 is a three-dimensional structural diagram of the adsorption module in one embodiment of the present invention;

[0038] Figure 6 is a top view of another embodiment of the present invention;

[0039] Figure 7 is a partial enlarged view of the substrate in one embodiment of the present invention.

[0040] In the figure: 100, carrier body; 1a, first region; 1b, second region; 200, substrate; 1, first flexible pad; 11, first placement surface; 2, adsorption module; 21, second flexible pad; 211, second placement surface; 22, vacuum adsorption hole; 23, support plate; 24, adsorption shell; 241, cavity; 25, suction channel; 3, support frame. Detailed Implementation

[0041] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0042] Before lamination, the substrate undergoes various processing steps. During these steps, residual stress may cause warping, especially at the edges and, more importantly, at the corners (four sharp corners) of square substrates. Applying lamination to a warped substrate easily leads to air bubbles forming on the surface. Therefore, a support device is typically used to support and level the substrate before lamination. This support device usually employs an adsorption method for supporting and leveling the substrate.

[0043] In one embodiment, a conventional substrate carrier typically includes a vacuum chuck with a bearing surface on which the substrate 200 rests. Vacuum suction holes 22 are evenly distributed across the bearing surface on the vacuum chuck. These holes 22 are connected to a vacuum generator via vacuum lines, which are typically located in the central region of the vacuum chuck. The vacuum generator evacuates air, creating a negative pressure at the vacuum suction holes 22 to adhere the substrate 200 to the bearing surface. This structure ensures precise alignment of the suction force with the center of mass of the substrate 200, thereby ensuring the substrate 200 is securely fixed.

[0044] However, with this type of substrate carrier device, the suction force is concentrated in the central area of ​​the vacuum chuck. The lack of suction at the edges or corners of the carrier surface will cause the central area of ​​the substrate 200 to be firmly adsorbed, but the edges of the substrate 200 will have no suction or insufficient suction, causing the edges of the substrate 200 to warp. The edges of the substrate 200 are already prone to warping during the previous processing, and this type of substrate carrier device will make the warping of the edges even more serious.

[0045] Furthermore, due to the varying surface roughness of different substrates, adsorption on the ordinary hard, smooth surface of the support device can lead to instability and poor leveling of the substrate. Vacuum leakage can occur between the support surface and the substrate 200, reducing airflow in the central area of ​​the vacuum chuck and resulting in insufficient suction. Consequently, the substrate 200 cannot be leveled on this type of substrate support device, and the stability of substrate adsorption is poor.

[0046] Therefore, this invention discloses a substrate support device that has a large adsorption force on the substrate 200, improving the stability of the substrate 200 during placement. After processing through various processes, residual stress can cause the substrate 200 to warp as a whole, especially at the edges, and even more so at the corners (four sharp corners) of square substrates. Therefore, a large adsorption force is provided for the areas of the substrate 200 prone to warping to flatten the substrate 200, facilitating subsequent film application.

[0047] In one embodiment, referring to Figures 1, 2, and 4, the substrate support device includes a support body 100, which includes a first region 1a and a second region 1b. The second region 1b is located outside the first region 1a, meaning the first region 1a is located in the middle of the second region 1b. A first flexible pad 1 is provided in the first region 1a, and an adsorption module 2 is provided in the second region 1b. The adsorption module 2 includes a second flexible pad 21. The first flexible pad 1 and the second flexible pad 21 respectively have a first placement surface 11 and a second placement surface 211 located at the same height. The first placement surface 11 and the second placement surface 211 contact the substrate 200 and are used to support the substrate 200. Multiple vacuum adsorption holes 22 of different sizes are formed on the second flexible pad 21 along the thickness direction (Z direction). The vacuum adsorption holes 22 are connected to an external vacuum generator, which is used to create a low-pressure vacuum at the vacuum adsorption holes 22. The multiple vacuum adsorption holes 22 of different sizes provide the second flexible pad 21 with a greater adsorption force than other areas of the second flexible pad 21 near the edge or corner of the substrate 200.

[0048] In this embodiment, the first flexible pad 1 is used for placing the substrate 200 in the middle region. The middle region of the substrate 200 refers to a portion of the substrate 200 extending outward from its centroid, excluding all corners and edges of the substrate 200. The second flexible pad 21 is used for placing the substrate 200 in the edge or corner regions.

[0049] In one embodiment, no adsorption force is provided for the central region of the substrate 200, and the first flexible pad 1 merely serves a load-bearing function. While fixing and positioning the substrate 200, it is necessary to level the entire substrate 200, which is prone to warping. Furthermore, the vacuum adsorption holes 22 on the second flexible pad 21 are of different sizes to provide greater adsorption force near the edges or corners of the substrate 200, thereby achieving rapid leveling of local areas of the substrate 200.

[0050] In this embodiment, the problem of substrate 200 easily warping at its edges and corners was discovered. The adsorption module 2 was strategically positioned on the outer side corresponding to the edges or corners of substrate 200. Compared to suction cups that adsorb across the entire plane or in the central area, this arrangement allows for better leveling of the substrate 200. Simultaneously, by utilizing the size of the vacuum adsorption holes 22, different adsorption forces are set for different areas on the adsorption module 2. This allows for greater adsorption force near the edges or corners of substrate 200, and by rationally distributing the force generated by the vacuum generator, the substrate 200 is more effectively adsorbed and fixed, and leveled in the process. The positioning of the adsorption module 2 and the size of the vacuum adsorption holes 22 on the adsorption module 2 improve the adsorption stability and leveling efficiency of substrate 200 from two aspects.

[0051] In one embodiment, the carrier body 100 may also have a third region, a fourth region, etc., such as the third region being located between the first region 1a and the second region 1b, or the third region being located outside the second region 1b, etc. However, it is sufficient to ensure that the first region 1a is used for placement in the central region of the substrate 200, and the second region 1b is used for placement in the edge or corner region of the substrate 200.

[0052] The first placement surface 11 and the second placement surface 211 are joined together to form a flat placement surface. The substrate 200 is placed on the placement surface, and the area of ​​the placement surface is larger than the area of ​​the substrate 200, so as to ensure that the substrate 200 can be adsorbed by the adsorption module 2.

[0053] In one embodiment, both the first flexible pad 1 and the second flexible pad 21 are foam pads or sponge pads, and the foam pads or sponge pads also contain antistatic material. The flexible material of the first flexible pad 1 and the second flexible pad 21 has medium hardness and compressive strength, enabling it to withstand considerable loads while maintaining its rigidity and surface uniformity. The hardness of the first flexible pad 1 and the second flexible pad 21 is Shore A 26.

[0054] The flexible materials of the first flexible pad 1 and the second flexible pad 21 can alleviate the adhesion force, thereby preventing severe deformation between the second flexible pad 21 and the substrate 200, and also preventing the formation of gaps between the second flexible pad 21 and the substrate 200. In addition, the flexible materials of the first flexible pad 1 and the second flexible pad 21 have sufficient flexibility to adapt to the uneven or textured surface of the substrate 200, ensuring effective flatness and surface uniformity of the substrate 200. Referring to Figure 7, the substrate of the substrate 200 may have textures, resulting in an uneven surface and depressions between the textures. When the second flexible pad 21 adsorbs the substrate 200, since the first flexible pad 1 and the second flexible pad 21 are made of foam or sponge, the substrate 200 can be pressed tightly onto the placement surface of the first flexible pad 1 and the second flexible pad 21. The first flexible pad 1 and the second flexible pad 21 themselves deform and come into close contact with the substrate of the substrate 200, that is, they can contact both the concave and protruding parts of the substrate, thus preventing the substrate 200 from deforming in the concave parts of the substrate and ensuring the flatness of the substrate 200.

[0055] The material of the second flexible pad 21 gives it a certain degree of porosity. However, the pores on the second flexible pad 21 are relatively uniform, which is insufficient to provide a relatively large adsorption force at the edges or corners of the substrate 200 compared to other areas. Furthermore, the pores of the second flexible pad 21 are relatively small, requiring the vacuum generator to consume more power to achieve adsorption. Therefore, vacuum adsorption holes 22 are formed on the second flexible pad 21. Vacuum airflow is adjusted solely through these holes, while the porosity of the second flexible pad 21 is ignored. When vacuum adsorption holes 22 are present, gas flows more easily through them rather than within the gaps, resulting in reduced air consumption and minimized vacuum leakage. This reduces the power consumption of the vacuum generator and achieves energy savings. In this case, the vacuum generator requires only a small amount of work to generate a large adsorption force at the vacuum adsorption holes 22. The vacuum adsorption holes 22 can be formed by drilling holes in the second flexible pad 21 using a drilling device.

[0056] In one embodiment, the adsorption force is adjusted by regulating the size of the vacuum adsorption hole 22; that is, the larger the size of the vacuum adsorption hole 22, the greater the adsorption force it exerts. Therefore, on the second flexible pad 21, the size of the vacuum adsorption holes 22 near the edge or corner of the substrate 200 is larger than the size of other vacuum adsorption holes 22. The size of the vacuum adsorption hole 22 is also the area of ​​its cross-section in the horizontal plane (XY plane); the larger the cross-sectional area, the larger the size.

[0057] The vacuum adsorption hole 22 can be circular, triangular, square or polygonal, as shown in Figures 5 and 6. In this case, the vacuum adsorption hole 22 is circular.

[0058] In one embodiment, referring to Figures 5 and 3, the adsorption module 2 further includes a support plate 23 and an adsorption housing 24. The adsorption housing 24 defines a cavity 241. The support plate 23 is fixed between the adsorption housing 24 and the second flexible pad 21, and the support plate 23 is used to support the second flexible pad 21. The adsorption housing 24 includes a top plate, and the support plate 23 is fixed on the top plate. The top plate and the support plate 23 have suction channels 25 corresponding to the vacuum adsorption holes 22. The suction channels 25 connect the vacuum adsorption holes 22 and the cavity 241. A vacuum generator is connected to the cavity 241 to provide a vacuum negative pressure to the cavity 241, thereby generating an adsorption force at the vacuum adsorption holes 22 through the suction channels 25.

[0059] Referring to Figure 3, the vacuum generator operates, drawing external airflow into the cavity 241 through the vacuum adsorption hole 22 and the suction channel 25. The direction of the gas flow is shown by the arrow in Figure 3, forming a pressure difference that adsorbs the substrate 200 onto the second flexible pad 21, applying a downward pressure force F to the substrate 200.

[0060] In one embodiment, one second flexible pad 21 corresponds to one support plate 23 and one adsorption shell 24, and the shapes of the three are matched. Alternatively, one second flexible pad 21 can correspond to multiple support plates 23 and adsorption shells 24, as long as all vacuum adsorption holes 22 on the second flexible pad 21 can generate adsorption force.

[0061] In one embodiment, a single vacuum generator can be provided, and all adsorption housings 24 can be connected to this vacuum generator. Alternatively, when multiple adsorption housings 24 are provided, multiple vacuum generators can be provided, with each vacuum generator corresponding to one adsorption housing 24. The vacuum generator evacuates the gas inside the cavity 241 of the corresponding adsorption housing 24.

[0062] Referring to Figure 2, the adsorption module 2 and the first flexible pad 1 are fixed together within a support frame 3. The adsorption module 2 forms a modular structure and is detachably connected to the support frame 3 via bolts, clips, or other means for easy replacement. In some cases, it is sufficient to replace the entire adsorption module 2, which consists of the second flexible pad 21, the support plate 23, and the adsorption housing 24, as needed, reducing the workload of machine operators or maintenance personnel.

[0063] In one embodiment, the support plate 23 is a metal plate, and the support plate 23 and the adsorption housing 24 are detachably connected, such as by bolts. Alternatively, they can be glued together with an adhesive layer, in which case it is not convenient to replace the metal plate separately.

[0064] In one embodiment, the second flexible pad 21 and the support plate 23 are glued together, meaning that an adhesive layer is also provided between the second flexible pad 21 and the support plate 23. Of course, the second flexible pad 21 and the support plate 23 can also be connected by detachable methods such as positioning posts or bolts.

[0065] In one embodiment, the first flexible pad 1 is also equipped with a vacuum generator, which provides vacuum adsorption force to the first flexible pad 1. However, the first flexible pad 1 does not have vacuum adsorption holes, and the adsorption force generated by its own gaps is much smaller than the adsorption force at the vacuum adsorption holes on the second flexible pad. At this time, the first flexible pad 1 supports the substrate while providing an adsorption force much smaller than that at the vacuum adsorption holes.

[0066] In one embodiment, the size of the vacuum adsorption holes 22 on the second flexible pad 21 gradually decreases from near the edge or corner of the substrate to away from the edge or corner. Setting the size of the vacuum adsorption holes 22 in a gradual manner allows the adsorption force to better adapt to the flattening of the warped substrate, ensuring that the adsorption force is always greatest in the corner or edge areas, even for substrates of different sizes.

[0067] Of course, in one embodiment, the size of the vacuum adsorption hole 22 is not in a gradual form; it may be larger only near the edge or corner of the substrate. However, this is only applicable to substrates of a certain size. For substrates of a smaller size, the carrier body 100 cannot flatten the edge at this time.

[0068] In one embodiment, the substrate 200 is square, and the supporting body 100 is also square. Referring to Figures 1 and 2, an adsorption module 2 is respectively disposed on both sides of the first flexible pad 1 in the X direction (first direction), meaning the first region 1a is located in the middle, and the two sides of the first region 1a in the X direction are the second regions 1b. The four corner areas of the square substrate 200 are most prone to warping; therefore, the positions of the two adsorption modules 2 can respectively adsorb the four corner areas of the substrate 200, leveling the substrate 200 during the adsorption process.

[0069] Referring to Figures 5 and 3, the second flexible pad 21 has a square structure, and vacuum adsorption holes 22 are arrayed on the second flexible pad 21. The size of the vacuum adsorption holes 22 on the second flexible pad 21 that are far from the first flexible pad 1 is larger than the size of the vacuum adsorption holes 22 in other areas of the second flexible pad 21. That is, the vacuum adsorption holes 22 at both ends of the second flexible pad 21 in the Y direction (second direction) are larger. As shown by the hollow arrow in Figure 3, the airflow increases at the vacuum adsorption holes 22 at both ends of the Y direction, improving the adsorption force in these end areas of the second flexible pad 21. At the same time, the vacuum adsorption holes on the second flexible pad 21 that are far from the first flexible pad 1 in the X direction (first direction) are also larger. As shown by the hollow arrow in Figure 4, the airflow increases at the vacuum adsorption holes 22 in the X direction that are far from the first flexible pad, improving the adsorption force in these edge areas of the second flexible pad 21. When the substrate 200 is placed on the placement surface, the four corner areas of the substrate 200 abut against the two ends of the second flexible pad 21 in the Y direction, and the edge abuts against the end of the second flexible pad in the X direction. Therefore, the two ends of the second flexible pad 21 in the Y direction and the end of the second flexible pad in the X direction away from the first flexible pad require a large adsorption force. The size of the vacuum adsorption hole 22 at this point is increased to increase the adsorption force.

[0070] When the substrate 200 is warped, the warped edges cannot adhere to the second placement surface 211, especially when the warping is significant, the small vacuum adsorption holes 22 cannot adsorb the warped portion onto the second placement surface 211. In this case, the substrate 200 is vacuum-adsorbed and stabilized by the vacuum adsorption holes 22 close to the first flexible pad 1, and then the warped portion is leveled by the relatively larger vacuum adsorption holes 22 further away from the first flexible pad 1. When the relatively larger vacuum adsorption holes 22 further away from the first flexible pad 1 draw a vacuum, a larger airflow is generated between the substrate 200 and the surface of the second flexible pad 21. This airflow velocity is greater than that of the outside, creating a pressure difference between this area and the outside space, producing an effect similar to Bernoulli's, thereby leveling the warped substrate 200. The small vacuum adsorption hole 22 is used for adsorption first, and then the adsorption hole, which is larger than the small vacuum adsorption hole 22, has a significant effect on leveling the edge or corner area. Even if the substrate 200 itself still has slight stress, when the subsequent film-applying equipment applies film to it using rollers, the pressure of the rollers will release the residual stress of the adsorbed and leveled substrate 200, making the substrate flatness and film application more stable and reliable.

[0071] In one embodiment, referring to Figure 3, the size of the vacuum adsorption hole 22 on the second flexible pad 21 gradually increases from the middle position to both ends along the Y direction. Simultaneously, referring to Figure 4, the size of the vacuum adsorption hole 22 on the second flexible pad 21 gradually increases along the X direction from near the first flexible pad to far away from the first flexible pad. Because when the substrate 200 warps, the vertical distance in the Z direction between the outer edge of the substrate 200 and the second flexible pad 21 gradually increases from far away from the corner of the substrate 200 to near the corner. Therefore, the adsorption force required to correct the warped substrate 200 becomes increasingly stronger near the corner. Setting the size of the vacuum adsorption hole 22 in a gradual manner makes the adsorption force more uniform. This gradual form of the vacuum adsorption hole 22 ensures that even for square substrates 200 of different sizes, the adsorption force of the substrate 200 is always greatest in the corner region.

[0072] Of course, simply increasing the size of the vacuum adsorption holes 22 at both ends of the second flexible pad 21Y while keeping the other vacuum adsorption holes 22 the same size can also meet the leveling requirements.

[0073] In one embodiment, the substrate 200 is circular, as shown in Figure 6. The carrier body 100 is also circular. In this case, the first region 1a is circular, and the second region 1b is an annular region surrounding the first region 1a. The adsorption module 2 is disposed in the second region 1b, matching the shape of the second region 1b. Because the circular substrate 200 is prone to warping at the edges, the second region 1b is disposed at the outer periphery corresponding to the edge of the substrate 200.

[0074] In this embodiment, referring to Figure 6, a plurality of vacuum adsorption holes 22 are densely distributed on a plurality of concentric circles centered on the center of the first flexible pad 1. In the radial direction of the first flexible pad 1, the size of the vacuum adsorption holes 22 on the concentric circles furthest from the first flexible pad 1 is larger than the size of the vacuum adsorption holes 22 at other locations. Because the edge of the circular substrate 200 abuts against the outermost edge of the second flexible pad 21, the size of the vacuum adsorption holes 22 at these locations is increased to enhance the adsorption force and flatten the easily warped edge region of the circular substrate 200.

[0075] In one embodiment, the size of the vacuum adsorption holes 22 on the concentric circles near the first flexible pad 1 gradually increases to the size of the vacuum adsorption holes 22 on the concentric circles away from the first flexible pad 1. Setting the size of the vacuum adsorption holes 22 in a gradual manner makes the adsorption force more uniform. With this gradual form of the vacuum adsorption holes 22, even for circular substrates 200 of different sizes, the adsorption force of the substrate 200 is always greatest in the edge region.

[0076] In one embodiment, the substrate 200 is polygonal, and the carrier body 100 is a polygon or circle with the same shape as the substrate 200. It is sufficient that the adsorption module 2 can adsorb the corners of the polygonal substrate 200, while the central area of ​​the polygonal substrate 200 has no adsorption force.

[0077] In one embodiment, the present invention discloses a film-applying device for applying a film to a substrate 200, the film-applying device including the aforementioned substrate carrier device.

[0078] During the film application process, the substrate 200 is placed on the substrate carrier. At this time, the middle area of ​​the substrate 200 abuts against the first placement surface 11, and the edge or corner areas abut against the second placement surface 211. The vacuum generator begins its suction action. Because the vacuum suction holes 22 can adsorb the edges or corners of the substrate 200 that are prone to warping, and the first flexible pad 1 lacks adsorption function or has insufficient adsorption capacity (meaning the middle area of ​​the substrate 200 is not adsorbed), no adsorption force is applied. Therefore, the warped edges or corners of the substrate 200 are adsorbed downwards, flattening the substrate 200. Simultaneously, adsorption at the edges or corners of the substrate 200 increases its stability and prevents slippage. After the substrate 200 has been placed on the carrier body 100 for a period of time, it is flattened and ready for film application. Because the substrate 200 has been flattened on the carrier body 100, no air bubbles are generated on the surface of the substrate 200 after film application.

[0079] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A substrate carrier device, comprising a carrier body, characterized in that: The carrier body includes: A first region, wherein a first flexible pad is provided in the first region, and the first flexible pad includes a first placement surface for placing the middle region of the substrate; A second region, located outside the first region, is equipped with an adsorption module, which includes: The second flexible pad has a second placement surface at the same height as the first placement surface, and the second flexible pad has a plurality of vacuum adsorption holes of different sizes opened along the thickness direction. A vacuum generator, which is connected to a plurality of vacuum adsorption holes, is used to create a low-pressure vacuum at the vacuum adsorption holes; An adsorption shell, wherein the adsorption shell defines a cavity, and the vacuum generator is connected to the cavity; A support plate is fixed between the adsorption shell and the second flexible pad. The top plate of the adsorption shell and the support plate are provided with suction channels corresponding to the vacuum adsorption holes. The suction channels connect the vacuum adsorption holes and the cavity. On the second flexible pad, the size of the vacuum adsorption holes near the edge or corner of the substrate is larger than the size of other vacuum adsorption holes.

2. The substrate carrier device according to claim 1, characterized in that: The size of the vacuum adsorption holes on the second flexible pad gradually decreases from near the edge or corner of the substrate to away from the edge or corner of the substrate.

3. The substrate carrier device according to claim 1, characterized in that: The first placement surface and the second placement surface are joined together to form a placement surface for placing the substrate, and the area of ​​the placement surface is larger than the area of ​​the substrate.

4. The substrate carrier device according to claim 1, characterized in that: The support plate and the second flexible pad are glued or fixed by bolts.

5. The substrate carrier device according to claim 1, characterized in that: The vacuum adsorption pores can be circular, triangular, square, or polygonal.

6. The substrate carrier device according to any one of claims 1-5, characterized in that: Both the substrate and the carrier body are square. The adsorption module is located on both sides of the first flexible pad in the first direction. The size of the vacuum adsorption hole of the second flexible pad away from the first flexible pad is larger than the size of the vacuum adsorption hole in other areas of the second flexible pad.

7. The substrate carrier device according to any one of claims 1-5, characterized in that: The substrate and the carrier body are circular. The adsorption module is arranged around the first flexible pad. The multiple vacuum adsorption holes are distributed on multiple concentric circles with the center of the first flexible pad as the center. The size of the vacuum adsorption holes on the concentric circles away from the first flexible pad is larger than the size of the vacuum adsorption holes at other positions.

8. The substrate carrier device according to claim 1, characterized in that: The supporting body also includes a support frame, and the adsorption module and the first flexible pad are fixed together within the support frame.

9. A film-applying device, wherein the film-applying device is used for applying a film to a substrate, characterized in that: The film application device includes the substrate carrier device as described in any one of claims 1-8.

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