Packaging structure, display module and display device

Abstract

A packaging structure, a display module and a display device. The packaging structure comprises: a substrate, at least one light-emitting unit, and at least one functional unit, wherein the substrate has a first surface; the light-emitting unit is configured to be turned on or off in response to a first control signal; the functional unit is configured to operate in response to a second control signal; each functional unit is arranged on the first surface of the substrate by means of a corresponding first bonding conductive layer; each light-emitting unit is arranged on the first surface of the substrate side by side with the functional unit by means of a corresponding second bonding conductive layer; alternatively, the light-emitting unit and the functional unit are stacked on the first surface of the substrate. By means of directly integrating the functional unit and the light-emitting unit into one packaging structure, a non-light-emitting region on the substrate is fully utilized, such that a single packaging structure can realize functions other than light emission.

Description

Packaging structure, display module and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202421441490.4, filed on June 21, 2024, entitled “Packaging Structure, Display Module and Display Device”, which is incorporated herein by reference in its entirety. Technical Field

[0003] This application belongs to the field of semiconductor technology, and in particular relates to a packaging structure, a display module, and a display device. Background Technology

[0004] Currently, as the efficiency of light-emitting diode (LED) chips improves and their size continues to decrease, the area of ​​the non-light-emitting region in a single pixel unit is becoming increasingly larger. The area occupied by an LED chip in a single pixel unit is now less than 1 / 10. In 2K or higher resolution displays, even larger non-light-emitting areas will exist. Summary of the Invention

[0005] The purpose of this application is to provide a packaging structure, a display module, and a display device, which aims to solve the problem that traditional pixel units have a lot of useless non-light-emitting areas.

[0006] A first aspect of this application provides a packaging structure, including: a substrate having a first surface; a light-emitting unit for lighting up or turning off in response to a first control signal; and a functional unit for operating in response to a second control signal; wherein the functional unit is disposed on the first surface of the substrate via a corresponding first bonding conductive layer, and the light-emitting unit is disposed on the first surface of the substrate along with the functional unit via a corresponding second bonding conductive layer; or the light-emitting unit and the functional unit are stacked on the first surface of the substrate.

[0007] In one embodiment, the light-emitting unit includes at least one LED chip, which includes at least one of red LED chips, green LED chips, blue LED chips, and LED chips of other colors; the functional unit includes at least one functional device; the LED chip is used to light up or turn off in response to a first control signal, and the functional device is used to operate in response to a second control signal.

[0008] In one embodiment, at least one of the functional devices includes a loudspeaker, the loudspeaker being used to emit a corresponding sound according to the second control signal.

[0009] In one embodiment, at least one of the functional devices includes a driving integrated circuit, which is electrically connected to the light-emitting unit. The driving integrated circuit is used to provide the first control signal to the light-emitting unit based on the second control signal according to the operating voltage.

[0010] In one embodiment, at least one of the functional devices includes one or more of an infrared sensor, a camera unit, a sound sensor, a temperature sensor, a humidity sensor, a light intensity sensor, and a gas sensor.

[0011] In one embodiment, the materials of the first bonding conductive layer and the second bonding conductive layer include conductive adhesive or conductive metal.

[0012] In one embodiment, an encapsulation layer is further included, which is used to encapsulate the light-emitting unit and / or the functional unit.

[0013] A second aspect of this application provides a display module including at least one encapsulation structure as described above.

[0014] In one embodiment, between two adjacent encapsulation structures, the light-emitting unit of one encapsulation structure is arranged adjacent to the functional unit of the other encapsulation structure.

[0015] A third aspect of this application provides a display device including at least one display module as described above.

[0016] The beneficial effects of the embodiments of this application compared with the prior art are: by directly integrating the functional unit and the light-emitting unit into a package structure, the non-light-emitting area on the substrate is fully utilized, and a single package structure can realize functions other than light emission.

[0017] When the functional unit includes a speaker, it can emit corresponding sound based on the displayed image while the package structure emits light. When a package structure with a speaker is applied to a display screen, there is no need to create openings in the display screen to accommodate additional speakers / loudspeakers, thereby enhancing the user's sensory experience. Attached Figure Description

[0018] Figure 1 is a top view of a packaging structure provided in an embodiment of this application;

[0019] Figure 2 is a front view of the packaging structure provided in an embodiment of this application;

[0020] Figure 3 is another top view of the packaging structure provided in an embodiment of this application;

[0021] Figure 4 is another top view of the packaging structure provided in an embodiment of this application;

[0022] Figure 5 is a schematic diagram of the structure of the light-emitting unit and the functional unit provided in an embodiment of this application;

[0023] Figure 6 is another structural schematic diagram of the light-emitting unit and functional unit provided in an embodiment of this application;

[0024] Figure 7 is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0025] Figure 8 is another structural schematic diagram of a display module provided in an embodiment of this application;

[0026] Figure 9 is another structural schematic diagram of a display module provided in an embodiment of this application;

[0027] Figure 10 is another structural schematic diagram of a display module provided in an embodiment of this application;

[0028] Figure 11 is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0029] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0031] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] In recent years, with the continuous development of Mini / Micro LED (MLED) chip technology and the gradual reduction in the size of light-emitting chips, integrated packaging technology (Chip on Board; COB) and discrete device technology (MLED in Package; MIP) are gradually becoming the mainstream packaging solutions for MLED applications in large-size display devices. Because these technologies eliminate the need for traditional LED chip support and mask processes, they enable smaller pixel pitch and higher display brightness.

[0034] In an LED integrated unit using COB or MIP, the size of the LED chip can be 250μm×250μm, while in a display using this LED integrated unit, the spacing between each LED chip can be 1250μm, and the area of ​​the LED chip accounts for less than 1 / 10 of the entire pixel unit.

[0035] In non-light-emitting areas, the main visual effect is the superposition of reflected light from the bottom substrate and the display surface. In many cases, due to the uneven reflectivity of the bottom substrate, inconsistent reflection occurs in large-area displays. This phenomenon is described as a "color inconsistency" problem in numerous documents and patents.

[0036] Meanwhile, as LED displays become ubiquitous, they need more diverse interactive and sensing functions. Examples include commonly used touch functionality and on-screen cameras. In the mobile phone display field, a punch-hole design is used to place the infrared sensing module and camera in the "notch" area. However, this design separates the display area from the sensing area, affecting the consumer's perception. To achieve invisible sensors, technologies such as under-display cameras and under-display fingerprint recognition have been developed. However, to achieve under-display visible light sensing, extensive design adjustments to the display unit are required, which is technically challenging and results in a significant loss of image quality.

[0037] Figure 1 shows a top view of a packaging structure provided in an embodiment of this application. For ease of explanation, only the parts relevant to this embodiment are shown, and are described in detail below:

[0038] As shown in Figures 1 to 3, the packaging structure 10 includes: a substrate 100, a light-emitting unit 200, and a functional unit 300.

[0039] The light-emitting unit 200 is used to turn on or off in response to the first control signal. The functional unit 300 is used to operate in response to the second control signal.

[0040] The substrate 100 has a first surface and a second surface opposite to the first surface.

[0041] The functional unit 300 is disposed on the first surface of the substrate 100 through the corresponding first bonding conductive layer 410.

[0042] The light-emitting unit 200 is disposed on the first surface of the substrate 100 via the corresponding second bonding conductive layer 420 and the functional unit 300. The functional unit 300 and the light-emitting unit 200 can each be disposed on the first surface of the substrate 100. The specific arrangement of the functional unit 300 and the light-emitting unit 200 is not limited. For example, they can be arranged side by side, staggered, adjacent to each other, or separated by a certain distance.

[0043] Alternatively, the light-emitting unit 200 and the functional unit 300 are stacked on the first surface of the substrate 100.

[0044] It is understandable that when the light-emitting unit 200 lights up in response to the first control signal, it can emit light of the corresponding color according to the requirements of the first control signal and its own light-emitting conditions.

[0045] Both the first control signal and the second control signal can be electrical signals input from devices or circuits outside the package structure 10. The functional unit 300 can operate in response to the second control signal to realize functions including sound generation, infrared sensing, and touch feedback.

[0046] In some embodiments, the second surface of the substrate 100 can be used to house a transmission circuit or to connect and fix it to other substrates, conductive glass, or circuit boards. The transmission circuit can be connected to an external circuit to transmit electrical signals, including a first control signal and a second control signal.

[0047] In this embodiment of the application, by directly integrating the functional unit 300 and the light-emitting unit 200 into a single package structure 10, the single package structure 10 can realize functions other than light emission, thereby making full use of the surface of the upper substrate 100 other than the surface of the light-emitting unit 200.

[0048] Since this application utilizes the non-light-emitting area on the substrate 100, it makes full use of the surface space of the substrate 100 while ensuring the display effect, and can provide users with richer content and more effective real-time interaction.

[0049] It should be noted that the packaging structure 10 can adopt two packaging methods. One is a common packaging method, in which the light-emitting unit 200 and the functional unit 300 are connected to the substrate 100 as a whole through a single bonding process. The other is a separate bonding method, in which each light-emitting unit 200 and each functional unit 300 is individually bonded to the substrate 100 and then integrated into a single packaging structure 10.

[0050] In some embodiments, the packaging structure 10 uses a MIP process to bond the light-emitting unit 200 and the functional unit 300 to the substrate 100.

[0051] In some embodiments, the encapsulation structure 10 is a thin-film encapsulation structure or an encapsulating adhesive structure. It is understood that the thin-film encapsulation structure has a smaller volume to facilitate subsequent installation and use.

[0052] In one embodiment, as shown in FIG3, the first surface of the functional unit 300 is disposed on the first surface of the substrate 100 through a corresponding first bonding conductive layer 410; the light-emitting unit 200 is disposed on the second surface of the functional unit 300 away from the substrate 100.

[0053] It is understandable that the light-emitting unit 200 can be stacked with the functional unit 300 to further reduce the space occupied on the first surface of the substrate 100.

[0054] In one embodiment, as shown in FIG4, the functional unit 300 can also be disposed on the light-emitting unit 200. Specifically, it can be configured according to the actual situation. For example, when the functional unit 300 is light-transmitting, the functional unit 300 can be disposed on the light-emitting unit 200, or when the functional unit 300 is disposed on the light-emitting unit 200, the functional unit 300 can have a certain gap or be misaligned with the light-emitting unit 200 to transmit light.

[0055] In one embodiment, as shown in FIG5, the light-emitting unit 200 includes at least one LED chip 210, and the functional unit 300 includes at least one functional device 310. The LED chip 210 is used to light up or turn off in response to a first control signal, and the functional device 310 is used to operate in response to a second control signal.

[0056] It is understandable that after receiving the first control signal, the light-emitting unit 200 can individually control each LED chip 210, for example, controlling only some of the LEDs to light up, or controlling the brightness of some of the LED chips 210, ultimately causing the light-emitting unit 200 to emit light of the color corresponding to the first control signal. The functional unit 300 can also individually control each functional device 310 according to the second control signal to achieve a certain function.

[0057] In one embodiment, a light-emitting unit 200 includes at least one of a red LED chip 211, a green LED chip 212, a blue LED chip 213, and other colored LED chips. The red LED chip 211 is used to emit red light, the green LED chip 212 is used to emit green light, the blue LED chip 213 is used to emit blue light, and the other colored LED chips can be white LED chips, yellow LED chips, etc.

[0058] It is understandable that a light-emitting unit 200 may include only one color of LED chip 210 or multiple colors of LED chip 210.

[0059] For example, as shown in FIG6, a light-emitting unit 200 may include a red LED chip 211, a green LED chip 212 and a blue LED chip 213.

[0060] A red LED chip 211, a green LED chip 212, and a blue LED chip 213 are disposed on the substrate 100 along a first direction parallel to the first surface of the substrate 100. Theoretically, the combination of the red LED chip 211, the green LED chip 212, and the blue LED chip 213 can enable the light-emitting unit 200 to emit light of any color.

[0061] In one embodiment, at least one functional device 310 includes a speaker for emitting a corresponding sound according to a second control signal.

[0062] When the functional unit 300 includes a speaker, it can emit corresponding sound according to the displayed image while the encapsulation structure 10 emits light. In conventional technology, the speaker is placed on the back of the display screen. In order to hear clear sound from the front of the display screen, a hole is often made in the display screen. However, when the encapsulation structure 10 with a speaker is applied to the display screen in this embodiment, there is no need to make a hole in the display screen to accommodate the speaker, thereby improving the user's sensory experience.

[0063] In one embodiment, at least one functional device 310 includes a driver integrated circuit (IC), which is electrically connected to the light-emitting unit 200. The driver integrated circuit is used to provide a first control signal to the light-emitting unit 200 based on a second control signal according to the operating voltage / operating current.

[0064] It is understood that in this embodiment, the first control signal can be a driving voltage / current, and the second control signal can be a data signal. The driving integrated circuit can control the light-emitting unit 200 according to the second control signal. Since the driving integrated circuit is an essential functional device 310 of the light-emitting unit 200, by integrating the driving integrated circuit on the first surface of the substrate 100, there is no need for additional circuit boards or space to set up the driving integrated circuit, thereby achieving miniaturization of the overall circuit.

[0065] In some embodiments, the light-emitting unit 200 is stacked with the driving integrated circuit to further reduce the space occupied on the first surface of the substrate 100.

[0066] In one embodiment, at least one functional device 310 includes one or more of an infrared sensor, a camera unit, a sound sensor, a temperature sensor, a humidity sensor, a light intensity sensor, and a gas sensor.

[0067] It is understandable that a functional unit 300 may include multiple functional devices 310 of different types.

[0068] Infrared touch detection is achieved through an infrared sensor. When the infrared sensor packaging structure 10 is applied to a display screen, the display screen can collect touch data via the infrared sensor, thereby enabling touch operation of the display screen. The infrared sensor can be a time-of-flight (ToF) infrared sensor. In some embodiments, the second control signal is a voltage signal that drives the infrared sensor.

[0069] The camera unit can capture images from a corresponding direction, then generate and output corresponding video signals. When the camera unit's packaging structure 10 is applied to a display screen, it can replace a separate front-facing camera for shooting, thereby ensuring the integrity of the display screen and improving the user's sensory experience. Specifically, the camera unit can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) sensor. In some embodiments, the second control signal is the voltage signal that drives the camera unit to operate.

[0070] The sound sensor can collect sound. When the sound sensor's encapsulation structure 10 is applied to a display screen, it can replace a microphone to collect sound from the area surrounding the display screen. In some embodiments, the second control signal is a voltage signal that drives the camera unit to operate.

[0071] The temperature sensor can detect temperature. When the temperature sensor-equipped package structure 10 is applied to the display screen, the brightness, color, etc. of the light-emitting unit 200 can be controlled according to the ambient temperature and the temperature of the display screen. For example, the brightness of the light-emitting unit 200 can be reduced when the temperature of the package structure is too high, and the hue, brightness, etc. of the light-emitting unit 200 can be changed when the ambient temperature is low.

[0072] A humidity sensor can detect the humidity of the air. When the humidity sensor's encapsulation structure 10 is applied to a display screen, it can monitor the humidity of the air surrounding the display screen. In some embodiments, the second control signal is a voltage signal that drives the humidity sensor to operate.

[0073] A light intensity sensor can sense light intensity. When the light intensity sensor packaging structure 10 is applied to a display screen, the brightness of the display screen can be adjusted according to the light intensity (ambient brightness) in front of the display screen. For example, when the light intensity in front of the display screen is low, the brightness of the display screen can be reduced to achieve vision protection in low light environments.

[0074] Gas sensors can identify specific substances in the air. When the gas sensor encapsulation structure 10 is applied to a display screen, it can monitor the air around the display screen. When air quality deteriorates, causing an increase in the concentration of a certain substance in the air, the gas sensor can detect this situation in a timely manner, allowing for prompt action. In some embodiments, the second control signal is a voltage signal that drives the gas sensor to operate.

[0075] In one embodiment, the first bonding conductive layer 410 and the second bonding conductive layer 420 are made of conductive adhesive or conductive metal.

[0076] Understandably, the bonding processes that can be used include die bonding, metal bonding, and conductive adhesive bonding. The appropriate process can be selected to bond the light-emitting unit 200 and the functional unit 300 based on actual requirements. For example, the appropriate process can be selected based on the structure of the specific device in the light-emitting unit 200 or the functional unit 300, and the specific bonding requirements of that device.

[0077] In one embodiment, the encapsulation structure 10 further includes an encapsulation layer for encapsulating the light-emitting unit 200 and / or the functional unit 300.

[0078] Specifically, the encapsulation layer can be an encapsulating adhesive or an encapsulation film. For example, the light-emitting unit 200 and / or the functional unit 300 can be encapsulated by applying and curing the encapsulating adhesive, or by attaching the encapsulation film to the substrate 100 to encapsulate the light-emitting unit 200 and / or the functional unit 300. The main component of the encapsulating adhesive and the encapsulation film can be epoxy resin.

[0079] Using a film for encapsulation can reduce the overall size of the package, making it easier to install and use the package structure 10 and improving its practicality.

[0080] In some embodiments, the size of a single package structure 10 is 1mm × 1mm.

[0081] Figure 7 shows a schematic diagram of the structure of a display module provided in an embodiment of this application. For ease of explanation, only the parts related to this embodiment are shown, and the details are as follows:

[0082] The display module 20 includes at least one encapsulation structure 10 as described in any of the above embodiments.

[0083] The display module 20 may include multiple encapsulation structures 10, which are arranged in a certain array.

[0084] For example, the individual package structures 10 can be arranged in a rectangular array.

[0085] It is understandable that by individually controlling the light emitted by each encapsulation structure 10, the display module 20 can display the corresponding image. The functional units 300 of each encapsulation structure 10 in a display module 20 can be different, and the corresponding encapsulation structure 10 can be selected according to the functional requirements of the display module 20.

[0086] In one embodiment, the size of a single package structure 10 is 1mm × 1mm. The edge spacing between the package structure 10 and adjacent package structures 10 or other devices is 0.8mm, so the center-to-center spacing between two adjacent package structures 10 is 1.8mm. It is understood that a single package structure 10 can also be of other sizes, such as 0.25mm × 0.25mm, and the center-to-center spacing between two adjacent package structures 10 can also be of other sizes, such as 1.25mm; no specific limitation is made.

[0087] In one embodiment, as shown in FIG8, the display module 20 may also use a combination of encapsulation structure 10 and conventional pixel unit 30, such that there is at least one conventional pixel unit 30 between encapsulation structures 10. By using a combination of encapsulation structure 10 and conventional pixel unit 30, the manufacturing cost can be reduced while achieving the corresponding functions through encapsulation structure 10.

[0088] In one embodiment, as shown in FIG9, the light-emitting units 200 of the encapsulation structure 10 used in the display module 20 are all stacked with the corresponding functional units 300.

[0089] In one embodiment, as shown in FIG10, between two adjacent encapsulation structures 10, the light-emitting unit 200 of one encapsulation structure 10 is arranged adjacent to the functional unit 300 of the other encapsulation structure 10.

[0090] By arranging the light-emitting unit 200 and the functional unit 300 adjacent to each other, it is possible to ensure that the display module 20 emits light evenly, thus ensuring the display effect of the display module 20 and avoiding the light-emitting unit 200 being too concentrated or too sparse, which would affect the display effect.

[0091] Figure 11 shows a schematic diagram of a display device according to an embodiment of this application. For ease of explanation, only the parts related to this embodiment are shown, and the details are as follows:

[0092] The display device 30 includes a frame 31 and at least one display module 20 as described in any of the above embodiments, the display module 20 being mounted on the frame 31, the frame 31 being used to support each display module 20.

[0093] As exemplarily shown in FIG11, the display device 30 includes four display modules 20 arranged in a grid pattern.

[0094] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0095] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0096] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A packaging structure, comprising: The substrate has a first surface; A light-emitting unit, which is electrically connected to the substrate, is used to light up or turn off in response to a first control signal; Functional unit, which is electrically connected to the substrate, is used to operate in response to a second control signal; The light-emitting unit and the functional unit are disposed on the first surface of the substrate.

2. The packaging structure as described in claim 1, wherein, The light-emitting unit and the functional unit are stacked on the first surface of the substrate.

3. The packaging structure as described in claim 1, wherein, The light-emitting unit and the functional unit are arranged side by side and alternately on the first surface of the substrate.

4. The packaging structure as described in any one of claims 1 to 3, wherein, The substrate has a second surface opposite to the first surface, and the second surface of the substrate is provided with a transmission circuit. The transmission circuit is connected to an external circuit to transmit the first control signal and the second control signal.

5. The packaging structure according to any one of claims 1 to 4, further comprising a packaging layer, wherein, The encapsulation layer is used to encapsulate the light-emitting unit and the functional unit in an integrated manner.

6. The packaging structure as described in claim 5, wherein, The encapsulation layer is an encapsulating adhesive or an encapsulating film.

7. The packaging structure according to any one of claims 1 to 6, wherein, The light-emitting unit includes at least one LED chip, which includes at least one of red LED chips, green LED chips, blue LED chips, and LED chips of other colors; the functional unit includes at least one functional device; the LED chip is used to light up or turn off in response to a first control signal, and the functional device is used to operate in response to a second control signal.

8. The packaging structure according to any one of claims 1 to 7, wherein, At least one of the functional devices includes a driver integrated circuit, which is electrically connected to the light-emitting unit and is used to provide the first control signal to the light-emitting unit based on the second control signal according to the operating voltage or operating current.

9. The packaging structure according to any one of claims 1 to 7, wherein, At least one of the functional devices includes a loudspeaker, the loudspeaker being used to emit a corresponding sound according to the second control signal.

10. The packaging structure according to any one of claims 1 to 7, wherein, At least one of the aforementioned functional devices includes one or more of an infrared sensor, a camera unit, a sound sensor, a temperature sensor, a humidity sensor, a light intensity sensor, and a gas sensor.

11. The packaging structure as described in claim 10, wherein, The infrared sensor is a time-of-flight (ToF) infrared sensor.

12. The packaging structure according to any one of claims 1 to 11, wherein, The package structure has dimensions of 1mm×1mm-0.25mm×0.25mm.

13. A display module comprising at least one encapsulation structure as described in any one of claims 1 to 12.

14. The display module as described in claim 13, wherein, Between two adjacent encapsulation structures, the light-emitting unit of one encapsulation structure is arranged adjacent to the functional unit of the other encapsulation structure.

15. The display module as described in claim 13, wherein, The light-emitting units of the encapsulation structure are all stacked with the corresponding functional units.

16. The display module as described in claim 13 or 14, wherein, The display module includes an array-arranged encapsulation structure.

17. The display module as claimed in claim 13, wherein, The display module also includes a pixel unit, which includes at least one red LED chip, one green LED chip, and one blue LED chip.

18. A display device, comprising a frame and at least one display module as described in any one of claims 13 to 17, wherein, The display module is mounted on the frame, and the frame is used to support the display module.

19. The display device as claimed in claim 18, wherein, The display device includes four display modules arranged in a grid pattern.

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