Display module, manufacturing method therefor, and display device

Abstract

The present disclosure relates to the technical field of display, and provides a display module, a manufacturing method therefor, and a display device. The display module of the present disclosure is divided into a middle area and an edge area surrounding the middle area. The display module comprises: a display substrate; a cover plate located on a light exit surface side of the display substrate; a first dam and a second dam both located in the edge area and arranged around the middle area, wherein the first dam is located at the periphery of the display substrate, there is a certain distance between the first dam and the display substrate, the second dam is closer to the middle area than the first dam, the second dam is located on a backlight surface side of the display substrate, and the first dam, the second dam, the display substrate, and the cover plate define an accommodating space located in the edge area; and a sealant filling the accommodating space, and configured to seal the edge of the display substrate.

Description

Display module and its manufacturing method, display device Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display module and its manufacturing method, and a display device. Background Technology

[0002] With the development of active-matrix organic light-emitting diode (AMOLED) display technology, the bezels of flexible AMOLED products are gradually decreasing, the screen-to-body ratio is gradually increasing, and the product thickness is also gradually decreasing. In order to further improve the user experience, a display product with a narrower bezel is a technical problem that urgently needs to be solved. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art, and to provide a display module and its manufacturing method, and a display device.

[0004] This disclosure provides a display module divided into a central region and an edge region surrounding the central region; the display module includes:

[0005] Display substrate;

[0006] A cover plate is located on the light-emitting side of the display substrate;

[0007] The first and second dams are both located in the edge region and are arranged around the middle region; the first dam is located on the periphery of the display substrate and has a certain distance between it and the display substrate; the second dam is closer to the middle region than the first dam and is located on the backlight side of the display substrate; the first dam, the second dam, the display substrate and the cover plate define an accommodating space in the edge region;

[0008] Edge sealing adhesive is used to fill the accommodating space and seal the edges of the display substrate.

[0009] The first buffer portion is provided on the end face of the first dam near the cover plate, and the material hardness of the first buffer portion is less than that of the first dam; and / or, a second buffer portion is provided on the end face of the second dam near the display substrate, and the material hardness of the second buffer portion is less than that of the second dam. The display module further includes at least one connecting portion located on the side of the first and second dams away from the cover plate and connected to the first and second dams.

[0010] The materials of both the first buffer portion and the second buffer portion include silicone.

[0011] Both the first and second cofferdams are made of steel sheets.

[0012] The display substrate includes a display portion, a bending portion, and a pad portion; the display portion is opposite to the cover plate, the pad portion is located on the side of the display portion away from the cover plate, and the bending portion is connected to one side of the display portion, connecting the display portion and the pad portion.

[0013] The second dam includes a first sub-dam disposed on the side of the pad portion away from the display portion, and a second sub-dam disposed on the side of the display portion away from the cover plate; the distance between the first sub-dam and the pad portion is not less than the distance between the second sub-dam and the display portion.

[0014] The second dam includes a first sub-dam disposed on the side of the pad portion away from the display portion, and a second sub-dam disposed on the side of the display portion away from the cover plate; the display module also includes a first connecting portion disposed on the side of the first sub-dam away from the pad portion, the first connecting portion connecting the first dam and the first sub-dam.

[0015] The display module further includes a second connecting part disposed on the side of the second sub-dam away from the display unit, and the second connecting part connects the first dam and the second sub-dam.

[0016] Wherein, the arrangement density of the first connecting part is greater than the arrangement density of the second connecting part; and / or, the size of the first connecting part is greater than the size of the second connecting part.

[0017] The display module further includes a frame; the frame includes a retaining wall portion and a supporting portion, the supporting portion is located on the side of the first dam away from the cover plate and is fixed to the first dam; the retaining wall portion surrounds the first dam and the cover plate and is fixed to the first dam and the cover plate.

[0018] The distance between the retaining wall portion and the bending portion is 0.4 mm.

[0019] The retaining wall includes a first sub-retaining wall opposite to the bending portion, and a second sub-retaining wall connected to the first sub-retaining wall. The maximum width of the first sub-retaining wall is 0.1 mm greater than the maximum width of the second sub-retaining wall.

[0020] The first dam is closer to the middle area than the edge of the cover plate, and the distance from the first dam to the edge of the cover plate is 0.05 to 0.15 mm.

[0021] This disclosure provides a method for manufacturing a display module, wherein the display module is divided into a central region and an edge region surrounding the central region, and the manufacturing method includes:

[0022] The display substrate and cover plate will be positioned relative to each other;

[0023] A first dam and a second dam are formed around the central region in the edge region. The first dam is located on the periphery of the display substrate and has a certain distance between it and the display substrate. The second dam is closer to the central region than the first dam and is located on the backlight side of the display substrate. The first dam, the second dam, the display substrate, and the cover plate define an accommodating space in the edge region.

[0024] The accommodating space is filled with sealing adhesive to seal the edges of the display substrate.

[0025] The edge-sealing adhesive is a UV adhesive; the step of filling the accommodating space with edge-sealing adhesive includes:

[0026] UV adhesive is printed in the accommodating space;

[0027] The UV adhesive is cured using a cold light source, followed by heat curing, to form a UV adhesive edge sealant.

[0028] The preparation method further includes: forming a first buffer portion on the end face of the first dam near the cover plate, and forming a second buffer portion on the end face of the second dam near the display substrate.

[0029] Prior to the step of filling the accommodating space with edge-sealing adhesive, the method further includes:

[0030] At least one connecting portion is formed at the end of the first and second cofferdams away from the cover plate, and the connecting portion is connected to the first and second cofferdams.

[0031] The preparation method further includes:

[0032] A frame is provided, the frame including a retaining wall portion and a load-bearing portion;

[0033] The supporting part is set on the side of the first dam away from the cover plate and fixed to the first dam; the retaining wall part is set around the first dam and the cover plate and fixed to the first dam and the cover plate.

[0034] This disclosure provides a display device that includes the display module described in any of the above embodiments. Attached Figure Description

[0035] Figure 1 is a partial cross-sectional schematic diagram of an exemplary display module.

[0036] Figure 2 is a schematic diagram of an exemplary display substrate.

[0037] Figure 3 shows a pixel circuit diagram in a pixel area of ​​a display substrate.

[0038] Figure 4 is a partial cross-sectional schematic diagram of the display module according to an embodiment of the present disclosure.

[0039] Figure 5 is a top view of the backlight side of the display module according to an embodiment of the present disclosure.

[0040] Figure 6 is a top view of the first enclosure, the second enclosure, and the connecting part of the display module in the disclosed embodiment.

[0041] Figure 7 is a cross-sectional view of AA in Figure 6.

[0042] Figure 8 is a cross-sectional view of BB in Figure 6.

[0043] Figure 9 is a cross-sectional view of the CC section in Figure 6.

[0044] Figure 10 is a cross-sectional view of the unfilled edge sealant at position A in Figure 5.

[0045] Figure 11 is a cross-sectional view of the unfilled edge sealant at position B in Figure 5.

[0046] Figure 12 is a cross-sectional view of the filler sealant at position A in Figure 5.

[0047] Figure 13 is a cross-sectional view of the sealant filling at position B in Figure 5.

[0048] Figure 14 is a partial cross-sectional view of another display module according to an embodiment of the present disclosure.

[0049] Figure 15 is a schematic diagram of each film layer of the display section according to an embodiment of the present disclosure. Detailed Implementation

[0050] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0051] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0052] In the following description, when an element or layer is referred to as "on" or "connected to" another element or layer, the element or layer may be directly on or directly connected to the other element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as "directly on" or "directly connected to" another element or layer, there are no intermediate elements or intermediate layers. The term "and / or" includes any and all combinations of one or more of the related listed items.

[0053] Although the terms first, second, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or portion from another element, component, region, layer, and / or portion. Therefore, without departing from the teachings of this disclosure, the first element, first component, first region, first layer, and / or first portion discussed below may be referred to as a second element, second component, second region, second layer, and / or second portion.

[0054] For descriptive purposes, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms are intended to include different orientations of the device during use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as “below” or “under” another element or feature would subsequently be positioned “above” said other element or feature. Thus, the exemplary term “below” may encompass both above and below orientations.

[0055] Figure 1 is a partial cross-sectional schematic diagram of an exemplary display module; as shown in Figure 1, the display module is divided into a middle region Q1 and an edge region Q2. The display module includes a display substrate 1, a cover plate 2 located on the light-emitting surface side of the display substrate 1, and a frame 3 located in the edge region Q2 and surrounding the middle region Q1.

[0056] Figure 2 is a schematic diagram of an exemplary display substrate. As shown in Figure 2, the display substrate is a flexible display substrate, which is divided into a display area AA, a peripheral area PA surrounding the display area AA, a pad area WA located on the side of the peripheral area PA away from the display area AA, and a bending area BA located between the peripheral area PA and the pad area WA, configured to be bent along the bending axis BX. For edge description, the portion of the peripheral area PA located between the bending area BA and the display area AA is referred to as the connection area TPA. Referring to Figure 1, when the display substrate shown in Figure 2 is applied in a display module, the bending area of ​​the display substrate 1 needs to be bent along the bending axis BX so that the pad area WA is placed on the backlight side of the display substrate 1. For ease of understanding, the part of the display substrate 1 that faces the cover plate, namely the display area DA and the peripheral area PA, is called the display section 101. The part of the display substrate 1 that faces the display section 101, namely the pad area WA, is called the pad section 102. The part of the display substrate 1 that connects the display section 101 and the pad section 102, and the part corresponding to the bending area BA, is called the bending section 103.

[0057] The display substrate 1 includes a substrate and signal lines 11 disposed on the substrate. For example, the signal lines 11 include multiple gate lines (GL) extending along the x-direction and multiple data lines (DL) extending along the y-direction. The multiple gate lines (GL) and multiple data lines (DL) intersect to define multiple pixel regions. Each pixel region contains a pixel (P), and each pixel P has an organic light-emitting element, such as an organic light-emitting diode (OLED). Since the light emitted by the organic light-emitting diode can be used to display images, the area containing the multiple pixel regions P is defined as the display region AA. A peripheral region PA is disposed outside the display region AA and cannot display images; it is a non-display region.

[0058] Figure 3 shows a pixel circuit diagram in a pixel region of a display substrate. As shown in Figure 3, each pixel P includes a pixel circuit PC connected to a gate line GL and a data line DL of that pixel P, and an organic light-emitting diode (OLED) connected to the pixel circuit PC. The pixel circuit PC includes a driving thin-film transistor (TFT) Td, a switching TFT Ts, and a storage capacitor Cst. The switching TFT Ts is connected to the gate line GL and the data line DL, and is configured to transmit a data signal received via the data line DL to the driving TFT Td according to a scan signal received via the gate line GL. The storage capacitor Cst is connected to the switching TFT Ts and the driving voltage line PL, and is configured to store a voltage corresponding to the difference between the voltage received from the switching TFT Ts and the driving voltage ELVDD supplied to the driving voltage line PL. The driving TFT Td is connected to the driving voltage line PL and the storage capacitor Cst, and can be used to control the driving current flowing from the driving voltage line PL to the OLED based on the voltage value stored in the storage capacitor Cst. The OLED can emit light with a desired brightness using the driving current. Organic light-emitting diodes (OLEDs) can emit, for example, red, green, blue, or white light. Although Figure 2 shows a pixel P comprising two TFTs and a storage capacitor Cst, exemplary embodiments of this disclosure can employ different arrangements of transistors and memory. In other embodiments, the pixel circuitry PC of pixel P may include three or more TFTs or two or more storage capacitors.

[0059] Referring again to Figure 2, the display substrate 1 also includes multiple connection pads 4 located in the pad area WA. Each connection pad 4 is configured to electrically connect to a signal line 11 extending from the display area AA or the peripheral area PA. The connection pads 4 may be exposed on the surface of the pad area WA, i.e., not covered by any layer, which facilitates electrical connection to the flexible printed circuit board (FPCB). The flexible printed circuit board (FPCB) is electrically connected to an external controller and configured to transmit signals or power from the external controller. For example, the connection pads 4 may be electrically connected to a common signal line, a touch signal line, a drive signal line, or a data connection line (the data connection line is electrically connected to the data line DL in the display area AA). The connection pads 4 are electrically connected to each signal line, thus enabling communication between the signal line 11 and the flexible printed circuit board (FPCB). The number and arrangement of the connection pads 4 are not specifically limited here and can be set according to actual needs.

[0060] The display module further includes a functional film layer (in this embodiment, the functional film layer is a polarizer 11) and a cover plate 2 sequentially disposed on the light-emitting side of the display substrate 1, and a support structure 12 located on the backlight side of the display substrate 1 (the side away from the polarizer 11). The polarizer 11 extends from the display area AA to the peripheral area PA. The polarizer 11 is a circular polarizer, consisting of a polarizer and a quarter-wave plate. The polarizer 11 improves the contrast of the display module and reduces reflected light. A transparent optical adhesive layer is disposed between the cover plate 2 and the polarizer 11 to bond them together. The support structure 12, as its name suggests, provides a certain supporting force for the display substrate 1. The support structure 12 may include a back film 121 and a support layer 122 sequentially disposed along the direction away from the display substrate 1. It is understood that the support layer 122 has a certain strength, thus defining the position of the bending area BA in the display substrate 1; that is, the edge of the support layer 122 is the starting position of the bending area BA. The support layer 122 can be made of metal and extends from the display area AA of the display substrate 1 to the connection area TPA. To facilitate bending, the back film 121 has a groove at the position corresponding to the bending area BA.

[0061] Referring again to Figure 2, after the bending area BA of the display substrate 1 is bent along the bending axis BX, the pad area WA of the display substrate 1 is located on the side of the support layer 122 away from the polarizer 11. Since the connection pads on the pad area WA will be connected to the flexible printed circuit board (or driver chip), in order to avoid signal interference, a thermal conductive layer, an electromagnetic shielding layer, etc. are provided on the side of the support layer 122 away from the back film 121.

[0062] Referring again to Figure 1, a protective layer 5 is applied to the bent portion 103 of the display substrate 1. The protective layer 5 is made of MCL adhesive, namely Micro Coating Layer adhesive, and is used to protect the bent area BA and the exposed connection area TPA to prevent environmental factors such as moisture, oxygen and temperature changes from damaging the OLED device.

[0063] The display module also includes an ink layer 41 located in the peripheral area PA. The ink layer 41 is disposed on the side of the cover plate 2 near the polarizer 11, and the ink layer 41 overlaps with the polarizer 11 to a certain extent, that is, the orthographic projections of the ink layer 41 and the polarizer 11 on the plane of the cover plate 2 overlap. The ink layer 41 can improve the screen's appearance and provide dust and water resistance.

[0064] Referring to Figure 1, the frame 3 includes a support portion 31 and a retaining wall portion 32; wherein, the support portion 31 and the retaining wall portion 32 form a stepped structure for supporting the cover plate 2. The inventors discovered that during the assembly of the display module, due to certain assembly tolerances, in order to avoid damage to the bent portion 103 of the display substrate 1 by the frame, a gap between the frame 3 and the bent portion 103 is reserved in advance based on the bending radius of the bent portion 103. Generally, the gap between the retaining wall portion 32 and the bent portion 103 of the frame 3 is MIN, the width of the stepped structure formed by the retaining wall portion 32 and the support portion 31 is a, and the installation distance between the support portion 31 and the bent portion 103, that is, the tolerance reserve range value is Gap, MIN = a + Gap, MIN is about 0.91mm, which means that the frame 3 of the display module in the existing products is relatively wide.

[0065] To address the aforementioned issues, the following technical solutions are provided in the embodiments disclosed herein.

[0066] Figure 4 is a partial cross-sectional schematic diagram of a display module according to an embodiment of the present disclosure. As shown in Figure 4, an embodiment of the present disclosure provides a display module divided into a central region Q1 and an edge region Q2 surrounding the central region Q1. The display module includes a display substrate 1, a cover plate 2, a first dam 61, a second dam 62, and an edge sealing adhesive 8. The cover plate 2 is located on the light-emitting side of the display substrate 1, and both the cover plate 2 and the display substrate 1 cover the central region Q1 and extend to the edge region Q2. The first dam 61 and the second dam 62 are both located in the edge region Q2 and are disposed around the central region Q1. The first dam 61 is located on the periphery of the display substrate 1 and has a certain distance between it and the display substrate 1. The second dam 62 is closer to the central region Q1 than the first dam 61 and is located on the backlight side of the display substrate 1. The first dam 61, the second dam 62, the display substrate 1, and the cover plate 2 define an accommodating space in the edge region. The edge sealing adhesive 8 fills the accommodating space and is used to seal the edge of the display substrate 1.

[0067] In this embodiment, an edge sealant 8 is provided in the edge region Q2 of the display module to wrap the edge of the display substrate 1. The edge sealant 8 is confined within the first dam 61 and the second dam 62. The edge sealant 8 can protect the edge of the display substrate 1. The first dam 61 and the second dam 62 can fix and limit the edge sealant 8 while also protecting it. Therefore, when the frame 3 is assembled with the display substrate 1, the cover plate 2, etc., the frame 3 can contact the first dam 61, thus shortening the distance between the frame 3 and the edge of the display substrate 1, thereby achieving a narrow frame design.

[0068] In some examples, the display substrate 1 in this embodiment can be a flexible display substrate, that is, the display substrate 1 includes a display portion 101, a bent portion 103, and a pad portion 102. Of course, the display substrate 1 in this embodiment can also be a rigid display substrate, for example, the substrate of the display substrate 1 is a glass substrate, in which case the display substrate 1 needs to be bonded to a separate printed circuit board. Regardless of whether the display substrate 1 in this embodiment is a flexible or rigid display substrate, the edge of the display substrate 1 can be wrapped with the aforementioned edge sealing adhesive 8, and the edge sealing adhesive 8 is limited, fixed, and protected by the first dam 61 and the second dam 62. In this embodiment, only the case where the display substrate 1 can be a flexible display substrate is described. The bent portion 103 of the flexible display substrate is sealed and protected by the edge sealing adhesive 8, and the first dam 61 can contact the assembled frame 3, so the distance between the bent portion 103 and the frame 3 can be greatly reduced, thereby achieving a narrow edge.

[0069] In some examples, continuing to refer to Figure 4, the first and second barriers 61 and 62 can be made of materials with higher hardness, such as steel sheets, thereby providing more stable support and robust protection for the sealing adhesive 8. Meanwhile, to prevent the first and second barriers 61 and 62 from being too hard and scratching the circuitry on the cover plate 2 and the pad portion 102 under external impact, in this embodiment, a first buffer portion 71 is provided on the end face of the first barrier 61 near the cover plate 2, and a second buffer portion 72 is provided on the end face of the second barrier 62 near the display substrate 1. Therefore, even if the first and second barriers 61 and 62 are subjected to external impact, the buffering effect of the first and second buffer portions 71 and 72 will prevent scratching of the circuitry on the cover plate 2 and the pad portion 102. Furthermore, the first and second buffer portions 71 and 72 can deform under external force, thus absorbing the unevenness of the contact surfaces between the first barrier 61 and the cover plate 2, and between the second barrier 62 and the display substrate 1, preventing the sealing adhesive 8 from overflowing.

[0070] Furthermore, the first buffer portion 71 and the second buffer portion 72 can be made of silicone with a hardness of 40A. Of course, the first buffer portion 71 and the second buffer portion 72 can also be made of other elastic materials, which will not be listed here.

[0071] In some examples, the display module also includes at least one connecting portion 63 disposed on the side of the first dam 61 and the second dam 62 away from the cover plate 2, and the connecting portion 63 is connected to the first dam 61 and the second dam 62, thereby preventing the impact force in the thickness direction of the display substrate 1 from damaging the edge area of ​​the display module.

[0072] In one example, FIG5 is a top view of the backlight side of the display module according to an embodiment of the present disclosure; FIG6 is a top view of the first dam 61, the second dam 62, and the connecting portion 63 of the display module according to the present disclosure embodiment; as shown in FIG5 and 6, since the bending portion 103 of the display substrate 1 is provided with connecting lines, it is preferable that the connecting portion 63 is provided at the end of the first dam 61 and the second dam 62 away from the cover plate 2 at this position. Specifically, the second dam 62 includes a first sub-dam 621 provided on the side of the pad portion 102 away from the display portion 101, and a second sub-dam 622 provided on the side of the display portion 101 away from the cover plate 2. Taking the display substrate 1 as a quadrilateral as an example, that is, the side of the second dam 62 corresponding to the bending portion 103 is the first sub-dam 621, and the structure formed at the remaining positions is the second sub-dam 622. The first sub-dam 621 and the first cofferdam 61 are connected by a connecting part 63. For ease of understanding, the connecting part 63 connecting the first sub-dam 621 and the first cofferdam 61 is referred to as the first connecting part 631. Of course, the second sub-dam 622 and the first cofferdam 61 can also be connected by a connecting part 63. For ease of understanding, the connecting part 63 connecting the second sub-dam 622 and the first cofferdam 61 is referred to as the second connecting part 632.

[0073] Furthermore, since the bending portion 103 is provided with connecting lines, the arrangement density of the first connecting portion 631 is greater than that of the second connecting portion 632, or the size of the first connecting portion 631 is greater than that of the second connecting portion 632, or, while the arrangement density of the first connecting portion 631 is greater than that of the second connecting portion 632, the size of the first connecting portion 631 is greater than that of the second connecting portion 632. It should be noted that the arrangement density in this embodiment depends on the spacing between multiple identical components arranged adjacent to each other. Specifically, the smaller the spacing between two adjacent components, the greater the arrangement density; conversely, the greater the spacing between two adjacent components, the smaller the arrangement density. Figure 6 only illustrates an exemplary distribution of the first connecting portion 631 and the second connecting portion 632. The arrangement of the first connecting portion 631 and the second connecting portion 632 can be specifically set according to the size of the display module. In one example, when the widths of the first connecting part 631 and the second connecting part 632 are the same, the length of the first connecting part 631 is greater than the length of the second connecting part 632. For example, the length of the first connecting part 631 is about 15mm-25mm, and the length of the second connecting part 632 is about 2mm-3mm.

[0074] In one example, Figure 7 is a cross-sectional view of AA in Figure 6; Figure 8 is a cross-sectional view of BB in Figure 6; and Figure 9 is a cross-sectional view of CC in Figure 6. As shown in Figures 7-9, since the bending portion 103 of the display substrate 1 is provided with connecting lines, the distance s2 between the first sub-dam 621 and the pad portion 102 is not less than the distance s1 between the second sub-dam 622 and the display portion 101, thereby preventing the first sub-dam 621 from damaging the connecting lines when subjected to impact. The distance between the first sub-dam 621 and the pad portion 102 can be approximately 0.7mm-0.8mm, and the distance between the second sub-dam 622 and the display portion 101 is approximately 0.6mm-0.7mm. If a first buffer portion 71 and a second buffer portion 72 are provided, and the thickness d4 of both is approximately 0.2 mm, then the distance S2 between the second buffer portion 72 on the first sub-dam 621 and the pad portion 102 can be approximately 0.5 mm to 0.6 mm, and the distance S1 between the second buffer portion 72 on the second sub-dam 622 and the display portion 101 can be approximately 0.4 mm to 0.5 mm. In some examples, continuing to refer to Figures 7-9, the thickness d1 of the first dam 61 and the thickness d2 of the second dam 62 are both approximately 0.2 mm, and the distance between the first dam 61 and the second dam 62 is approximately 2 mm to 3.2 mm, that is, the width of the sealing adhesive 8 area is approximately 2 mm to 3.2 mm. The thickness d3 of the connecting portion 63 is approximately 0.1 mm to 0.2 mm.

[0075] In some examples, Figure 10 is a cross-sectional view of the unfilled edge sealant 8 at position A in Figure 5; Figure 11 is a cross-sectional view of the unfilled edge sealant 8 at position B in Figure 5. As shown in Figures 10 and 11, the first dam 61 is recessed inward relative to the cover plate 2 toward the central area Q1 by an inward reduction of about 0.05 to 0.15 mm, for example, 0.1 mm. That is to say, the distance between the first dam 61 and the edge of the cover plate 2 is about 0.05 to 0.15 mm, for example, 0.1 mm. In this way, the fastening accuracy of the first dam 61 and the cover plate 2 is reserved. At the same time, there is a gap of about 0.05 to 0.15 mm between the cover plate 2 and the first dam 61, which facilitates the overlap of the cover plate 2 and the frame 3 during assembly and ensures the overlap strength.

[0076] In some examples, Figure 12 shows a cross-sectional view of the filling edge-sealing adhesive 8 at position A in Figure 5; Figure 13 shows a cross-sectional view of the filling edge-sealing adhesive 8 at position B in Figure 5. As shown in Figures 12 and 13, the edge-sealing adhesive 8 specifically uses UV adhesive combined with thermosetting adhesive. During preparation, the UV adhesive is filled into the accommodating space. The adhesive used is a low-viscosity adhesive with a viscosity <200cps, using a UV adhesive printing valve with a diameter of 0.1mm and a printing speed of 50mm / s. A Macro piezoelectric valve is used for printing (voltage 220V, frequency 200Hz). After the UV adhesive is printed, a 370nm LED cold light source is used to cure the UV adhesive. After the UV adhesive is cured, thermosetting is performed at a curing temperature of 60℃ for 30 minutes to ensure the adhesive is fully cured, guaranteeing the extrusion strength of the product, improving its impact and drop resistance, and increasing its waterproof performance.

[0077] In some examples, continuing to refer to Figures 12 and 13, in Figure 12, compared to Figure 13, the side of the display portion 101 facing away from the cover plate 2 does not have a solder pad portion 103, and the support structure 12 is also not provided at this location. Therefore, the distance between the second sub-dam 622 and the display portion 101 is smaller than the distance between the first sub-dam 621 and the display portion 101. That is to say, the lengths of the first sub-dam 621 and the second sub-dam 622 in the second dam 62 are different along the thickness direction of the display module. The lengths of the first sub-dam 621 and the second sub-dam 622 along the thickness direction of the display module need to be specifically set according to the thickness of different locations of the product.

[0078] In some examples, FIG14 is a partial cross-sectional view of another display module according to an embodiment of the present disclosure; as shown in FIG14, the display module of the present disclosure includes not only the above-described structure, but also a frame 3. The frame 3 includes a supporting part 31 and a retaining wall part 32. The supporting part 31 is located on the side of the first dam 61 away from the cover plate 2 and is fixed to the first dam 61; the retaining wall part 32 surrounds the first dam 61 and the cover plate 2 and is fixed to the first dam 61 and the cover plate 2.

[0079] In this embodiment, a stepped structure can be formed at the end of the retaining wall portion 32 near the cover plate 2 to facilitate the overlap and fixation of the cover plate 2 and the retaining wall portion 32. If the distance between the first dam 61 and the edge of the cover plate 2 is about 0.1 mm, then the width of the stepped structure formed on the retaining wall portion 32 is adapted to this distance, that is, about 0.1 mm, thereby ensuring the overlap strength between the cover plate 2 and the retaining wall portion 32. When the first dam 61 and the second enclosure plate are connected by the connecting portion 63, the connecting portion 63 overlaps on the bearing portion 31, thereby ensuring the stability of the display module edge area Q2 and the frame 3. In this embodiment, since the bent portion 103 is wrapped with edge sealing adhesive 8, and the edge sealing adhesive 8 is fixed by the first dam 61 and the second dam 62, the distance between the frame 3 and the connecting portion 63 is shortened. Specifically, referring to Figure 14, the distance between the retaining wall part 32 and the bending part 103 is MIN, where MIN = b + c, b is the overlap between the frame 3 and the cover plate 2. Since the frame 3 also overlaps with the first dam 61 and the connecting part 63 by an amount e, the strength of the middle frame can be guaranteed, so the overlap between the frame 3 and the cover plate 2 can be reduced. Because the fastening accuracy between the first dam 61 and the cover plate 2 is 0.1mm, the maximum value of b is 0.1mm, that is, b ≥ 0.1mm, and c = the thickness of the first dam 61. Degree + d, where d is the minimum gap between the first dam 61 and the bending part 103. To ensure that the sealing adhesive 8 in the narrow gap area between the cover plate 2 and the display substrate 1 can be completely filled, d ≥ 0.1 mm. To ensure the impact resistance of the product, the thickness of the first dam 61 is 0.2 mm. Therefore, the minimum distance between the retaining wall part 32 and the bending part 103 in this embodiment is 0.4 mm. Compared with the width of 0.91 in the existing structure, the frame 3 can achieve a gain of about 0.5 mm.

[0080] In some examples, due to the presence of the bend 103 in the display substrate 1, the width of the retaining wall portion 32 at the bezel position corresponding to the bend 103 is slightly larger than the width of the retaining wall portions 32 at other bezel positions. For example, the retaining wall portion 32 includes a first sub-retaining wall portion opposite to the bend (i.e., corresponding to the lower bezel position of the display module) and a second sub-retaining wall portion connected to the first sub-retaining wall portion (i.e., corresponding to the other bezel positions outside the lower bezel of the display module). The maximum width of the first sub-retaining wall portion is approximately 0.1 mm larger than the maximum width of the second sub-retaining wall portion. This design effectively prevents damage to the circuitry caused by external impact forces acting on the bend 103.

[0081] In some examples, the retaining wall portion 32 is recessed on the side facing the display substrate 1 to form a first step portion for supporting the cover plate 2. The first step portion includes a first bearing surface and a second bearing surface, the first bearing surface being opposite to the bearing portion 31 and connected to the second bearing surface; the cover plate 2 overlaps the first bearing surface and abuts against the second bearing surface, which can provide stable support for the cover plate 2 in this case.

[0082] In some examples, the supporting portion 31 and the retaining wall portion 32 are connected to form a second step portion, which provides support for the first dam 61 and the connecting portion 63. The second step includes a third supporting surface for supporting the first dam 61 and the connecting portion 63. The third supporting surface is the surface of the supporting portion 31 that protrudes from the retaining wall portion 32 and faces the cover plate. By providing the second step portion, stable support can be provided for the first dam 61 and the connecting portion 63. In some examples, the display module of this disclosure embodiment not only includes the above-described structure, but also includes a polarizer 11 disposed between the light-emitting surface side of the display substrate 11 and the cover plate 2. The polarizer 11 is a circular polarizer, composed of a polarizer and a quarter-wave plate. The polarizer 11 can improve the contrast of the display panel and reduce reflected light. A transparent optical adhesive layer is disposed between the cover plate 2 and the polarizer 11 to bond the two together. An ink layer 41 can also be provided on the edge of the cover plate 2 near the display substrate 1. The ink layer 41 is provided on the side of the cover plate 2 near the polarizer 11, and the ink layer 41 overlaps with the polarizer 11 to a certain extent.

[0083] In some examples, a support structure 12 is also provided on the backlight side of the display substrate 1. The support structure 12 includes a back film 121 and a support layer 122 arranged sequentially in the direction away from the display substrate 1. A protective layer 5 (MCL adhesive) can also be provided on the bending portion 103 to protect the traces on the bending portion 103. The display module also includes a thermally conductive layer 13 and an electromagnetic shielding layer located on the side of the display portion 101 away from the cover plate 2. The thermally conductive layer 13 is made of metal and can also be reused as an electromagnetic shielding layer.

[0084] In some examples, referring to FIG12, the edge of the thermal conductive layer 13 is recessed relative to the edge of the display substrate 1, forming a stepped structure. In this way, when the edges of the display substrate 1 and the thermal conductive layer 13 are sealed by the edge sealing adhesive 8, the stepped structure formed by the edge of the thermal conductive layer 13 and the edge of the display substrate 1 can provide a larger contact area with the edge sealing adhesive 8, thereby ensuring full adhesion and improving sealing stability.

[0085] In some examples, the edge of the thermal conductive layer 13 may be flush with the edge of the display portion 101 of the display substrate 1. In this case, the surface of the thermal conductive layer 13 near the sealing adhesive 8 may be treated to make the surface of the thermal conductive layer 13 in contact with the sealing adhesive 8 rough, thereby increasing the adhesion between the thermal conductive layer 13 and the sealing adhesive 8. Of course, an uneven structure may also be formed on the surface of the thermal conductive layer 13 near the sealing adhesive 8, which can also increase the adhesion between the thermal conductive layer 13 and the sealing adhesive 8.

[0086] In some examples, referring to Figures 13 and 14, after bending, the bent portion 103 forms a receiving space with the display portion 101, the pad portion 102, the support structure 12, and the heat-conducting layer 13. This receiving space can be filled with air, or a filler can be formed by any of the following methods: filling, printing, or injection molding. When a filler is placed within the receiving space, it can provide a certain supporting force to the bent portion 103, thereby preventing the bent portion 103 from collapsing and causing circuit damage.

[0087] In some examples, the substrate of the display substrate 1 in this embodiment of the present disclosure may be a flexible substrate or a rigid substrate. The flexible substrate may include a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked together. The materials of the first flexible material layer and the second flexible material layer may be polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film, etc. The materials of the first inorganic material layer and the second inorganic material layer may be silicon nitride (SiNx) or silicon oxide (SiOx), etc., to improve the substrate's resistance to water and oxygen. The material of the semiconductor layer may be amorphous silicon (a-Si).

[0088] In some examples, the display unit 101 includes a substrate, and signal lines, pixel circuits and light-emitting devices located on the substrate; the pixel circuit may be the pixel circuit shown in FIG3; wherein the transistor includes an active layer, a gate electrode, a source electrode and a drain electrode.

[0089] Further, FIG15 is a schematic diagram of each film layer of the display section according to an embodiment of the present disclosure; as shown in FIG15, each film layer of the display section 101 may include: a buffer layer BFL disposed on the substrate 10, an active layer 142 of a transistor 14 disposed on the buffer layer BFL, a first gate insulating layer GI1 covering the active layer 142, a gate electrode 141 and a first capacitor electrode 145 of the transistor 14 disposed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the gate electrode 141 and the first capacitor electrode 145, a second capacitor electrode 146 disposed on the second gate insulating layer GI2, and an interlayer insulating layer ILD covering the second capacitor electrode 146. A via is formed in the interlayer insulating layer ILD, exposing the active layer 142. The source electrode 143 and the drain electrode 144 of the transistor 14 are disposed on the interlayer insulating layer ILD, and the source electrode 143 and the drain electrode 144 are respectively connected to the active layer 142 through the via. A planarization layer PLN is located on the side of the source electrode 143 and the drain electrode 144 away from the substrate 11. The first capacitor electrode 145 and the second capacitor electrode 146 constitute a storage capacitor. In some possible implementations, the buffer layer BFL, the first gate insulating layer GI1, the second gate insulating layer GI2, and the interlayer insulating layer ILD can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or a composite layer. The gate electrode 141, the source electrode 143, the drain electrode 144, the first capacitor electrode 145, and the second capacitor electrode 146 can be made of metallic materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb), and can be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti. The active layer 142 can be made of amorphous indium gallium zinc oxide (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, or polythiophene, etc. That is, this disclosure applies to transistors manufactured based on oxide technology, silicon technology, or organic technology. The active layer 142 based on oxide technology can be made of oxides containing indium and tin, oxides containing tungsten and indium, oxides containing tungsten, indium, and zinc, oxides containing titanium and indium, oxides containing titanium, indium, and tin, oxides containing indium and zinc, oxides containing silicon, indium, and tin, oxides containing indium, gallium, and zinc, etc.

[0090] Referring again to Figure 15, in some examples, the light-emitting structure layer 15 may include an anode 151, a pixel definition layer PDL, an organic light-emitting layer 153, and a cathode 152. The anode 151 is disposed on the planarization layer PLN and is connected to the drain electrode 144 through vias formed in the planarization layer PLN. The pixel definition layer PDL is disposed on the anode 151 and the planarization layer PLN, and has pixel openings that expose the anode 151. The organic light-emitting layer 153 is disposed within the pixel openings, and the cathode 152 is disposed on the organic light-emitting layer 153. The organic light-emitting layer 153 emits light of the corresponding color under the action of a voltage applied to the anode 151 and the cathode 152.

[0091] In some examples, the organic light-emitting layer 153 may include at least a stacked hole injection layer (HIL), hole transport layer (HTL), emission layer (EML), electron transport layer (ETL), and electron injection layer (EIL), wherein the hole injection layer and hole transport layer may be collectively referred to as the hole layer, and the electron transport layer and electron injection layer may be collectively referred to as the electron layer.

[0092] Referring again to Figure 15, in some examples, the encapsulation layer 16 may include a first encapsulation layer 161, a second encapsulation layer 162, and a third encapsulation layer 163 stacked together. The first encapsulation layer 161 and the third encapsulation layer 163 may be made of inorganic materials, while the second encapsulation layer 162 may be made of organic materials. The second encapsulation layer 162 is disposed between the first encapsulation layer 161 and the third encapsulation layer 163, which can ensure that external moisture cannot enter the light-emitting structure layer 13.

[0093] To further illustrate the display module in this embodiment, a 192.5g pendulum ball was used to strike the bending portion 103 of the existing display module and the bending portion 103 of this embodiment, respectively. The minimum pendulum ball angle and energy when an X-Line appeared were recorded, as detailed in the table below.

[0094] Conclusion: The impact resistance of the bent portion 103 of the display module in this embodiment is significantly improved.

[0095] This disclosure also provides a method for manufacturing a display module, which can be used to manufacture the aforementioned display module. Referring to FIG4, the display module is divided into a middle region Q1 and an edge region Q2; the manufacturing method of this disclosure specifically includes the following steps:

[0096] S1. Display substrate 1 and cover plate 2 are positioned opposite each other.

[0097] In some examples, if the display substrate 1 is a flexible display substrate, it includes a display portion 101, a pad portion 102, and a connecting portion 63 connecting the display portion 101 and the bending portion 103. The bending portion 103 bends around a bending axis, folding the pad portion 102 to the backlight side of the display portion 101, and the cover plate 2 is placed on the light-emitting side of the display portion 101.

[0098] S2. A first dam 61 and a second dam 62 are formed in the edge region Q2, surrounding the middle region Q1. The first dam 61 is located on the periphery of the display substrate 1 and has a certain distance between it and the display substrate 1. The second dam 62 is closer to the middle region Q1 than the first dam 61 and is located on the backlight side of the display substrate 1. The first dam 61, the second dam 62, the display substrate 1 and the cover plate 2 define the accommodating space in the edge region Q2.

[0099] S3. Fill the accommodating space with edge sealing adhesive 8 to seal the edges of the display substrate 1.

[0100] In some examples, the edge-sealing adhesive 8 specifically uses UV adhesive. Step S3 may include: filling the accommodating space with UV adhesive. The adhesive required is a low-viscosity adhesive with a viscosity <200cps, using a UV adhesive printing valve with a diameter of 0.1mm and a printing speed of 50mm / s. A Macro piezoelectric valve is used for printing (voltage 220V, frequency 200Hz). After the UV adhesive is printed, a 370nm LED cold light source is used to cure the UV adhesive. After the UV adhesive is cured, heat curing is performed at a curing temperature of 60℃ for 30 minutes to ensure the adhesive is fully cured, ensuring the extrusion strength of the product, improving its impact and drop resistance, and increasing the product's waterproof performance.

[0101] In some examples, the steps of forming a first buffer portion 71 and a second buffer portion 72 may be included before forming the first dam 61 and the second dam 62. The first buffer portion 71 is on the end face of the first dam 61 near the cover plate 2, and the second buffer portion 72 is on the end face of the second dam 62 near the display substrate 1.

[0102] In some examples, before UV adhesive filling, i.e. before forming edge sealing adhesive 8, at least one connecting portion 63 is formed, which is connected to the first dam 61 and the second dam 62.

[0103] In some examples, the method for manufacturing a display module according to an embodiment of the present disclosure, referring to FIG14, further includes: providing a frame 3, the frame 3 including a retaining wall portion 32 and a supporting portion 31. The supporting portion 31 is disposed on the side of the first dam 61 away from the cover plate 2 and fixed to the first dam 61; the retaining wall portion 32 is disposed around the first dam 61 and the cover plate 2 and fixed to the first dam 61 and the cover plate 2.

[0104] Of course, the method for preparing the display module in this embodiment may also include steps such as forming the polarizer, support structure, thermal conductive layer and electromagnetic shielding layer described above, which will not be listed here one by one.

[0105] This disclosure also provides a display device, including the display module described in the above embodiments. The display device can include any device or product with display functionality. For example, the display device can be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), etc.

[0106] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display module, divided into a central region and an edge region surrounding the central region; the display module comprising: Display substrate; A cover plate is located on the light-emitting side of the display substrate; The first and second dams are both located in the edge region and are arranged around the middle region; the first dam is located on the periphery of the display substrate and has a certain distance between it and the display substrate; the second dam is closer to the middle region than the first dam and is located on the backlight side of the display substrate. The first dam, the second dam, the display substrate, and the cover plate define an accommodating space located in the edge region; Edge sealing adhesive is used to fill the accommodating space and seal the edges of the display substrate.

2. The display module according to claim 1, wherein, A first buffer portion is provided on the end face of the first dam near the cover plate, and the material hardness of the first buffer portion is less than that of the first dam; and / or, a second buffer portion is provided on the end face of the second dam near the display substrate, and the material hardness of the second buffer portion is less than that of the second dam.

3. The display module according to claim 2, wherein, Both the first and second buffer portions are made of silicone.

4. The display module according to claim 1, wherein, Both the first and second cofferdams are made of steel sheets.

5. The display module according to claim 1, wherein, It also includes at least one connecting part located on the side of the first and second dams away from the cover plate and connected to the first and second dams.

6. The display module according to claim 1, wherein, The display substrate includes a display portion, a bending portion, and a pad portion; the display portion is opposite to the cover plate, the pad portion is located on the side of the display portion away from the cover plate, and the bending portion is connected to one side of the display portion, connecting the display portion and the pad portion.

7. The display module according to claim 6, wherein, The second dam includes a first sub-dam disposed on the side of the pad portion away from the display portion, and a second sub-dam disposed on the side of the display portion away from the cover plate; the distance between the first sub-dam and the pad portion is not less than the distance between the second sub-dam and the display portion.

8. The display module according to claim 6, wherein, The second dam includes a first sub-dam disposed on the side of the pad portion away from the display portion, and a second sub-dam disposed on the side of the display portion away from the cover plate; the display module also includes a first connecting portion disposed on the side of the first sub-dam away from the pad portion, the first connecting portion connecting the first dam and the first sub-dam.

9. The display module according to claim 8, wherein, It also includes a second connecting part disposed on the side of the second sub-dam away from the display unit, the second connecting part connecting the first dam and the second sub-dam.

10. The display module according to claim 9, wherein, The arrangement density of the first connecting part is greater than that of the second connecting part; and / or, the size of the first connecting part is greater than that of the second connecting part.

11. The display module according to claim 6, wherein, It also includes a frame; the frame includes a retaining wall portion and a supporting portion, the supporting portion being located on the side of the first dam away from the cover plate and fixed to the first dam; the retaining wall portion surrounds the first dam and the cover plate and is fixed to the first dam and the cover plate.

12. The display module according to claim 11, wherein, The distance between the retaining wall portion and the bending portion is 0.4 mm.

13. The display module according to claim 11, wherein, The retaining wall includes a first sub-retaining wall opposite to the bending portion, and a second sub-retaining wall connected to the first sub-retaining wall. The maximum width of the first sub-retaining wall is 0.1 mm greater than the maximum width of the second sub-retaining wall.

14. The display module according to any one of claims 1-13, wherein, The first dam is closer to the middle area than the edge of the cover plate, and the distance from the first dam to the edge of the cover plate is 0.05 to 0.15 mm.

15. A method for manufacturing a display module, wherein the display module is divided into a central region and an edge region surrounding the central region, the manufacturing method comprising: The display substrate and cover plate will be positioned relative to each other; A first dam and a second dam are formed around the central region in the edge region. The first dam is located on the periphery of the display substrate and has a certain distance between it and the display substrate. The second dam is closer to the central region than the first dam and is located on the backlight side of the display substrate. The first dam, the second dam, the display substrate, and the cover plate define an accommodating space in the edge region. The accommodating space is filled with sealing adhesive to seal the edges of the display substrate.

16. The preparation method according to claim 15, wherein, The edge banding adhesive is a UV adhesive; The step of filling the accommodating space with edge sealing adhesive includes: UV adhesive is printed in the accommodating space; The UV adhesive is cured using a cold light source, followed by heat curing, to form a UV adhesive edge sealant.

17. The preparation method according to claim 15, wherein, It also includes: forming a first buffer portion on the end face of the first dam near the cover plate, and forming a second buffer portion on the end face of the second dam near the display substrate.

18. The preparation method according to claim 15, wherein, Before the step of filling the accommodating space with edge sealing adhesive, the method further includes: At least one connecting portion is formed at the end of the first and second cofferdams away from the cover plate, and the connecting portion is connected to the first and second cofferdams.

19. The preparation method according to claim 15, wherein, Also includes: A frame is provided, the frame including a retaining wall portion and a load-bearing portion; The supporting part is set on the side of the first dam away from the cover plate and fixed to the first dam; the retaining wall part is set around the first dam and the cover plate and fixed to the first dam and the cover plate.

20. A display device comprising the display module according to any one of claims 1-14.

Images