Air conditioner

Abstract

The present disclosure relates to an air conditioner. The air conditioner of the present disclosure comprises: a case having a suction port formed on the circumferential surface thereof and a discharge port formed on the upper surface thereof; a fan rotatably disposed inside the case and forming an air flow to the discharge port; a compressor disposed inside the case and compressing and flowing a refrigerant; a control box disposed inside the case; and a cooling device disposed on one side of the control box and cooling the control box. The cooling device comprises: a fixed panel fixedly disposed on one side of the case; a first heat sink disposed on one side of the fixed panel and cooling the control box by means of a refrigerant flowing through the compressor; and a second heat sink disposed on the other side of the fixed panel and including a plurality of heat dissipation fins protruding to the outside of the control box.

Description

air conditioner

[0001] The present disclosure relates to an air conditioner, and more specifically, to a cooling structure of a control box disposed in an outdoor unit of the air conditioner.

[0002] An air conditioner is a device that supplies an appropriate temperature to an indoor space by exchanging heat between a refrigerant flowing through a heat pump and air.

[0003] An air conditioner may have a structure in which the outdoor and indoor units are separate. Furthermore, such a separate air conditioner may have a structure in which multiple indoor units are connected to a single outdoor unit.

[0004] However, these various types of outdoor air conditioner units are equipped with control boxes housing numerous electrical components. These control boxes are prone to overheating, which can lead to functional degradation due to overheating. Furthermore, this overheating can lead to malfunctions in the air conditioner.

[0005] In particular, some semiconductor devices have a problem where the temperature may rise rapidly depending on the situation or the device may malfunction if the temperature is maintained at a high temperature.

[0006] The present disclosure aims to solve the above-mentioned and other problems.

[0007] Another purpose is to provide an air conditioner that keeps the internal temperature of the control box low.

[0008] Another purpose is to provide an air conditioner that lowers the temperature of semiconductor devices, which increase in temperature particularly significantly inside a control box.

[0009] In order to achieve the above object, an air conditioner according to an embodiment of the present disclosure includes a case having an intake port formed on a peripheral surface and an exhaust port formed on an upper surface, a fan rotatably disposed inside the case and forming air flow through the exhaust port, a compressor disposed inside the case and compressing and flowing a refrigerant, a control box disposed inside the case, and a cooling device disposed on one side of the control box and cooling the control box.

[0010] The cooling device includes a fixed panel fixedly arranged on one side of the case, a first heat sink arranged on one side of the fixed panel and cooling the control box through refrigerant flowing through the compressor, and a second heat sink arranged on the other side of the fixed panel and including a plurality of heat dissipation fins protruding outward from the control box.

[0011] The above fixed panel is fixedly placed inside the control box.

[0012] The above fixed panel has a banded structure. The above fixed panel is arranged to be fixed to two different sides of the control box.

[0013] The fixed panel includes a first panel on which the first heat sink is arranged and a second panel on which the second heat sink is arranged. The first panel and the second panel form different slopes.

[0014] The control box further includes a printed circuit board arranged inside the control box. The printed circuit board includes a first semiconductor element and a second semiconductor element spaced apart from the first semiconductor element. The first semiconductor element is arranged to contact the first panel.

[0015] The first semiconductor element is arranged on the first surface of the printed circuit board, and the second semiconductor element is arranged on the second surface in an opposite direction to the first surface.

[0016] The above first heat sink includes a heat sink through which refrigerant flows and a fixing block for fixing the heat sink. The fixing block is fixed to a fixing panel.

[0017] The first heat sink is arranged on the upper and lower sides of the fixed block and further includes a fastening plate fastened to the fixed panel.

[0018] The first heat sink further includes a heat dissipation panel that contacts the heat dissipation tube and is coupled to the fixed block. The heat dissipation panel includes a plurality of outer heat dissipation fins that protrude in the opposite direction from which the heat dissipation tube contacts.

[0019] The above cooling device includes an inner heat dissipation fin arranged inside the fixed panel in an area where the first heat sink is arranged. The inner heat dissipation fin is provided in multiple numbers extending upward and spaced apart in a direction perpendicular to the vertical direction.

[0020] It includes a heat sink expansion valve that expands the refrigerant flowing to the first heat sink.

[0021] It further includes an expansion coil for expanding the refrigerant flowing through the first heat sink. The expansion coil has a microscopic diameter and extends in a spiral shape.

[0022] The above heat sink expansion valve and the above expansion coil are arranged in parallel.

[0023] The circumference of the above case includes a blocking surface in which the suction port is not formed. The control box is arranged on one side of the blocking surface.

[0024] One side of the control box faces the blocking surface so as to be coupled thereto. The other side, which is positioned opposite the one side of the control box, faces the surface of the circumferential surface of the case where the intake port is formed. The second heat sink is positioned on the other side of the control box. Specific details of other embodiments are included in the detailed description and drawings.

[0025]

[0026] According to the air conditioner of the present disclosure, one or more of the following effects are achieved.

[0027] First, it has the advantage of maintaining an appropriate temperature inside the control box. This can prevent malfunctions in the control box.

[0028] Second, the control box can additionally manage semiconductor devices that generate a lot of heat. That is, the semiconductor devices that generate most of the heat can be quickly cooled by bringing them into contact with a second heat sink that includes heat dissipation fins.

[0029] Third, the first heat sink can be controlled via a heat sink expansion valve. This allows for selective use based on the temperature inside the control box, effectively controlling the temperature.

[0030] The effects of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0031] Figure 1 is a system diagram of the outdoor unit side of an air conditioner according to one embodiment of the present invention.

[0032] FIG. 2 is a drawing for explaining the arrangement of a control box placed inside an outdoor unit of an air conditioner according to one embodiment of the present invention.

[0033] FIG. 3 is a drawing for explaining the arrangement of a printed circuit board and a cooling device arranged inside a control box according to one embodiment of the present invention.

[0034] FIG. 4 is a drawing for explaining a cooling device arranged on one side of a control box according to one embodiment of the present invention.

[0035] FIG. 5 is a drawing for explaining the configuration of a second heat sink arranged on a fixed panel according to one embodiment of the present invention.

[0036] FIG. 6 is a drawing for explaining a fixed panel according to one embodiment of the present invention.

[0037] FIG. 7 is a drawing for explaining a structure in which a cooling device according to one embodiment of the present invention is placed in a control box.

[0038] FIG. 8 is a drawing for explaining the arrangement of semiconductor elements and the arrangement of a cooling device arranged on a printed circuit board according to one embodiment of the present invention.

[0039] Fig. 9 is a cross-sectional view taken along line Ⅸ-Ⅸ' of Fig. 8.

[0040] FIG. 10 is a drawing for explaining a first heat sink with a heat dissipation panel added according to one embodiment of the present invention.

[0041] FIG. 11 is a drawing for explaining a structure in which an inner heat dissipation fin is arranged on the inside of a fixed panel according to one embodiment of the present invention.

[0042] Fig. 12 is a drawing for explaining the structure of a control box in which the fixed panel of Fig. 11 is arranged.

[0043] Figure 13 is a flowchart for explaining an operating method of an air conditioner according to one embodiment of the present invention.

[0044] Figure 14 is data for explaining the temperature related to the first semiconductor device according to one embodiment of the present invention.

[0045] The advantages and features of the present disclosure, and methods for achieving them, will become clearer with reference to the embodiments described below in detail with the accompanying drawings. However, the present disclosure is not limited to the embodiments described below and may be implemented in various different forms. These embodiments are provided solely to ensure that the disclosure is complete and to fully inform those skilled in the art of the disclosure of the scope of the disclosure. The present disclosure is defined solely by the scope of the claims. Like reference numerals designate like elements throughout the specification.

[0046] Hereinafter, the present disclosure will be described with reference to drawings for explaining an air conditioner according to embodiments of the present disclosure.

[0047] Referring to Fig. 1, the configuration of the air conditioner is described.

[0048] Figure 1 is a system diagram schematically showing the configuration of an outdoor unit of an air conditioner.

[0049] The air conditioner of the present invention includes an outdoor unit (10) including a compressor (22). The outdoor unit (10) can be connected to a plurality of indoor units (not shown). An indoor heat exchanger (not shown) is arranged in each of the plurality of indoor units.

[0050] In the air conditioner of the present invention, a refrigerant distributor (not shown) may be placed between the outdoor unit (10) and a plurality of indoor units. High-pressure gaseous refrigerant or liquid refrigerant may be supplied to each of the plurality of indoor units through the refrigerant distributor.

[0051] The air conditioner of the present invention includes a compressor (22) that compresses a flowing refrigerant. The compressor (22) can compress the refrigerant and send it to an outdoor heat exchanger (24) or an indoor heat exchanger.

[0052] The air conditioner of the present invention includes an outdoor heat exchanger (24) that exchanges heat between refrigerant flowing from a compressor (22) and outside air. An outdoor fan (26, or 'fan') may be placed on one side of the outdoor heat exchanger (24).

[0053] The air conditioner of the present invention includes an outdoor expansion valve (28) that expands refrigerant flowing from or to an outdoor heat exchanger (24). The outdoor expansion valve (28) can atomize refrigerant flowing in a liquid state by passing it through a narrow-diameter passage.

[0054] The air conditioner of the present invention includes a switching valve (30, 32) that sends refrigerant discharged from a compressor (22) to an outdoor heat exchanger (24) or an indoor unit (not shown).

[0055] The switching valve (30, 32) includes a first switching valve (30) that sends the refrigerant discharged from the compressor (22) to the outdoor heat exchanger (24) or the indoor unit. The first switching valve (30) can send the refrigerant flowing from the outdoor heat exchanger (24) or the indoor unit to the compressor (22).

[0056] The switching valve (30, 32) may include a second switching valve (32) that sends high-pressure refrigerant discharged from the compressor (22) to the indoor unit.

[0057] The air conditioner of the present invention may include an oil separator (34) that separates and recovers oil contained in the refrigerant discharged from the compressor (22).

[0058] The air conditioner of the present invention may include an accumulator (36) that separates the refrigerant supplied to the compressor (22) and supplies the gaseous refrigerant to the compressor (22).

[0059] The air conditioner of the present invention includes a first engine (40) through which high-pressure refrigerant discharged from a compressor (22) flows. The air conditioner of the present invention includes a second engine (42) through which low-pressure refrigerant supplied to the compressor (22) flows.

[0060] The air conditioner of the present invention includes a liquid pipe (44) extending from an outdoor heat exchanger (24) to an indoor unit or a refrigerant distributor.

[0061] The air conditioner of the present invention includes a supercooling device (38) that expands a portion of the refrigerant flowing in the liquid pipe (44) and exchanges heat with the refrigerant flowing in the liquid pipe (44).

[0062] The air conditioner of the present invention includes a cooling device (120) that expands a portion of the refrigerant flowing through the liquid pipe (44) to cool the control box (100) described below.

[0063] The cooling device (120) includes a heat sink (130) through which refrigerant flows and which is in contact with the control box (100).

[0064] The air conditioner of the present invention includes a heat sink expansion valve (144) that expands refrigerant flowing to a heat sink (130). The heat sink expansion valve (144) can expand refrigerant flowing to the heat sink (130).

[0065] The air conditioner of the present invention includes an expansion coil (146) that expands refrigerant flowing to a heat sink (130). The expansion coil (146) is formed to have a fine diameter and can extend in a spiral shape.

[0066] The expansion coil (146) and the heat sink expansion valve (144) can be connected in parallel. Therefore, even if the operation of the heat sink expansion valve (144) is stopped, the refrigerant can flow to the expansion coil (146).

[0067] Referring to Fig. 2, the structure of the air conditioner of the present invention and the arrangement of the control box are described.

[0068] The air conditioner of the present invention includes a case (12) having an intake port (14) formed on a peripheral surface and an exhaust port (16) formed on an upper surface. The case (12) forms a space in which a compressor (22) is placed inside. The case (12) forms a space in which a control box (100) described below is placed inside.

[0069] The case (12) may have a shape roughly similar to a rectangular parallelepiped. An outlet (16) is formed on the upper surface of the case (12). An intake port (14) may be formed on at least one of the peripheral surfaces of the case (12). The intake port (14) may be formed on three of the four peripheral surfaces included in the case (12).

[0070] The case (12) includes a blocking surface (18) on the circumferential surface where no suction port (14) is formed.

[0071] Inside the case (12), an outdoor heat exchanger (24), an accumulator (36), and an outdoor expansion valve (28) described based on FIG. 1 can be placed.

[0072] The air conditioner of the present invention includes an outdoor fan (26) placed inside a case (12). The outdoor fan (26) may be placed on the lower side of the discharge port (16).

[0073] The air conditioner of the present invention includes a control box (100) in which electrical components are arranged inside. The control box (100) is arranged on one side of a blocking surface (18). The control box (100) is arranged on the upper part of the blocking surface (18).

[0074] The control box (100) is positioned closer to the outdoor fan (26) than the bottom surface (20) of the case (12). The control box (100) is positioned above the compressor (22). A cooling device (120), which will be described below, is positioned on one side of the control box (100).

[0075] The air conditioner of the present invention includes a cooling device (120) that cools the inside of a control box (100).

[0076] The cooling device (120) is arranged on one side of the control box (100) and includes a first heat sink (130) that cools the control box (100) through a refrigerant.

[0077] The first heat sink (130) can cool the control box (100) by using a portion of the refrigerant flowing by the compressor (22). The first heat sink (130) can include a heat dissipation pipe (132) through which the refrigerant flows, and a fixing block (134) that fixes the heat dissipation pipe (132).

[0078] The cooling device (120) is placed on the other side of the control box (100) and includes a second heat sink (150) that cools the control box (100) through air.

[0079] The second heat sink (150) includes a plurality of heat dissipation fins (152).

[0080] The air conditioner may include two cooling devices (120) spaced vertically apart from each other. Each of the plurality of cooling devices (120) may include a first heat sink (130) and a second heat sink (150).

[0081] Referring to FIG. 3, a printed circuit board (110) placed inside a control box (100) and a cooling device (120) placed on one side of the control box (100) are described.

[0082] The control box (100) may be formed in the shape of a roughly rectangular parallelepiped. A plurality of electrical components may be arranged inside the control box (100). A placement space (101) in which a plurality of electrical components are arranged is formed inside the control box (100).

[0083] At least one printed circuit board (110) may be placed inside the control box (100). A plurality of semiconductor elements (112, 114) may be placed on the printed circuit board (110). A first semiconductor element (112) may be placed on the printed circuit board (110).

[0084] The first semiconductor element (112) may be a device that generates heat above a certain temperature during operation. The first semiconductor element (112) may be an IGBT (Insulated Gate Bipolar Transistor) element.

[0085] A second semiconductor element (114) may be placed on the printed circuit board (110) to be spaced apart from the first semiconductor element (112). The second semiconductor element (114) may be an element that generates relatively less heat than the first semiconductor element (112).

[0086] The cooling device (120) may include a fixed panel (160) that is fixedly arranged to the control box (100). The fixed panel (160) may be arranged on the inside of the control box (100). A portion of the fixed panel (160) may be arranged to face the printed circuit board (110).

[0087] The fixed panel (160) may have a banded shape in some areas.

[0088] Below, with reference to Fig. 4, a cooling device placed on one side of the control box is described.

[0089] The air conditioner includes a first cooling device (120a) and a second cooling device (120b) positioned below the first cooling device (120a). The configuration of the cooling device described below can be applied to each of the first cooling device (120a) and the second cooling device (120b).

[0090] The cooling device (120) includes a first heat sink (130) and a second heat sink (150). The first heat sink (130) and the second heat sink (150) are arranged on different surfaces of the control box (100).

[0091] The first heat sink (130) is placed on the first wall (102) of the control box (100). The second heat sink (150) is placed on the second wall (104) of the control box (100). The first wall (102) and the second wall (104) may be placed perpendicular to each other.

[0092] The first heat sink (130) includes a heat dissipation pipe (132) through which refrigerant flows. The heat dissipation pipe (132) may have a tubular structure in the shape of a 'U'.

[0093] The first heat sink (130) may be equipped with a pair of heat dissipation tubes through which refrigerant flows in different directions.

[0094] The first heat sink (130) includes a fixing block (134) that fixes a heat sink (132). The fixing block (134) is arranged to be fixed to the control box (100).

[0095] The air conditioner includes a fastening plate (136) that secures the cooling device (120) to the control box (100). The fastening plate (136) is arranged on one side of the control box (100). The fastening plate (136) is arranged on the outside of the control box (100).

[0096] The fastening plate (136) is fastened to a fixed panel (160) placed on the inside of the control box (100). The fastening plate (136) can be connected to the fixed panel (160) via a separate fastening screw (138). The fastening screw (138) can be fastened to the fixed panel (160) by penetrating one side of the control box (100).

[0097] The fastening plate (136) can be placed on the upper and lower sides of the fixed block (134). The fastening plate (136) includes an upper fastening plate (136a) placed on the upper side of the fixed block (134) and a lower fastening plate (136b) placed on the lower side of the fixed block (134).

[0098] The second heat sink (150) includes a plurality of heat dissipation fins (152). The plurality of heat dissipation fins (152) may be arranged in parallel with each other. Each of the plurality of heat dissipation fins (152) may extend in the vertical direction and be arranged to be spaced apart in a direction perpendicular to the vertical direction.

[0099] Referring to FIGS. 5 and 6, the structure of the fixed panel and the first heat sink and the second heat sink attached to the fixed panel are described.

[0100] The fixed panel (160) may have an 'ㄱ' shape when viewed from above. The fixed panel (160) may have a banded shape. The fixed panel (160) includes a first panel (162) on which a first heat sink (130) is arranged, and a second panel (164) on which a second heat sink (150) is arranged.

[0101] The first panel (162) and the second panel (164) are arranged vertically. A banded structure may be formed between the first panel (162) and the second panel (164).

[0102] The first panel (162) is positioned so as to contact the inner surface of the first wall (102) of the control box (100). The second panel (164) is positioned so as to contact the inner surface of the second wall (104) of the control box (100).

[0103] A separate fastening member (not shown) for fastening the fixed block (134) may be placed on the first panel (162). A fastening hole (161) may be formed on the first panel (162) to connect with the fastening plate (136).

[0104] A fastening screw (165) to which a second heat sink (150) is coupled may be mounted on the second panel (164). A separate fastening screw (167) may be placed on the second panel (164) to secure it to the second wall (104) of the control box (100).

[0105] A waterproof panel (166) may be placed on each of the first panel (162) and the second panel (164).

[0106] The waterproof panel (166) placed on the first panel (162) can be placed around the area where the fixing block (134) is placed. The waterproof panel (166) placed on the second panel (164) can be placed around the area where the second heat sink (150) is placed.

[0107] A plurality of first cavities (162a) may be formed inside the first panel (162) in an area where a fixed block (134) is arranged. A plurality of first inner ribs (162b) may be arranged inside the first panel (162) to partition between the plurality of first cavities (162a) extending in a direction perpendicular to the vertical direction.

[0108] A plurality of second cavities (164a) may be formed inside the second panel (164) in an area where the second heat sink (150) is arranged. A plurality of second inner ribs (164b) may be arranged inside the second panel (164) to partition between the plurality of second cavities (164a) extending in a direction perpendicular to the vertical direction.

[0109] Referring to Fig. 7, the state in which the cooling device is mounted in the control box is described.

[0110] The fixed panel (160) is positioned so as to be in contact with the inner surface of the control box (100). The fixed block (134) is mounted on the fixed panel (160). The fixed block (134) is positioned so as to protrude outwardly from the control box (100). The heat dissipation pipe (132) can be mounted on the fixed block (134) protruding outwardly from the control box (100).

[0111] The second heat sink (150) is mounted on the fixed panel (160). The second heat sink (150) is positioned to protrude outward from the control box (100).

[0112] A plurality of heat dissipation fins arranged in the second heat sink (150) can dissipate heat by external air of the control box (100). Referring to Fig. 2, the second heat sink (150) is arranged to face the intake port (14), so that heat can be dissipated by air introduced into the case (12) through the intake port (14).

[0113] Referring to FIGS. 8 and 9, the arrangement area of ​​the printed circuit board and the first semiconductor element placed inside the control box (100) is described.

[0114] A printed circuit board (110) is placed inside a control box (100). A plurality of printed circuit boards (110) may be placed inside the control box (100).

[0115] A plurality of semiconductor elements (112, 114) may be arranged on a printed circuit board (110). A first semiconductor element (112) may be arranged on a first surface (110a) of the printed circuit board (110). A plurality of second semiconductor elements (114) may be arranged on a second surface (110b) of the printed circuit board (110).

[0116] The first side (110a) and the second side (110b) of the printed circuit board (110) may be opposite sides. The first side (110a) of the printed circuit board (110) may be the side facing the direction in which the second heat sink (150) is arranged.

[0117] The printed circuit board (110) is placed perpendicular to the surface of the control box (100) where the first heat sink (130) is placed and facing the surface of the control box (100) where the second heat sink (150) is placed.

[0118] Referring to FIG. 9, the first semiconductor element (112) may be placed in contact with the cooling device (120). The first semiconductor element (112) may be placed in contact with the second heat sink (150). The first semiconductor element (112) may be placed in contact with the fixed panel (160).

[0119] The first semiconductor element (112) can be placed in contact with the second heat sink (150) through the fixed panel (160). The first semiconductor element (112) can be coupled to the fixed panel (160) through a separate fastening means.

[0120] A thermal pad (not shown) may be placed between the first semiconductor element (112) and the fixed panel (160). The thermal pad can transfer heat generated from the first semiconductor element (112) to the cooling device (120).

[0121] Referring to FIG. 10, a first heat sink including a first additional heat dissipation fin is described.

[0122] The first heat sink (130) is coupled to a fixed block (134) and may further include a heat dissipation panel (139) that cools the heat dissipation pipe (132). The heat dissipation panel (139) may be coupled to the fixed block (134). The heat dissipation panel (139) may include a plurality of outer heat dissipation fins (140).

[0123] The heat dissipation panel (139) is arranged in contact with the heat dissipation pipe (132). The heat dissipation panel (139) is arranged so that one side is in contact with the heat dissipation pipe (132). The heat dissipation panel (139) has an outer heat dissipation fin (140) arranged on the other side opposite to one side.

[0124] The outer heat dissipation fin (140) is arranged on the other side of the area in contact with the heat dissipation pipe (132). The outer heat dissipation fin (140) may have a structure extending in the vertical direction.

[0125] Referring to FIGS. 11 and 12, a first heat sink including a second additional heat dissipation fin is described.

[0126] In the area where the first heat sink (130) is placed, an inner heat dissipation fin (142) may be placed inside the fixed panel (160). The inner heat dissipation fin (142) may be placed on the inner surface of the first panel (162). A plurality of inner heat dissipation fins (142) may be provided that extend in the vertical direction and are spaced apart in a direction perpendicular to the vertical direction.

[0127] Referring to FIGS. 13 and 14, a control method of the air conditioner of the present invention is described.

[0128] The air conditioner goes through the operation stage (S10).

[0129] The step (S10) in which the air conditioner operates may be a step in which the compressor (22) operates. The step (S10) in which the air conditioner operates may be a step in which the outdoor fan (26) or the indoor fan operates.

[0130] A step () of detecting the temperature of the first semiconductor element (112) is performed.

[0131] A method for detecting the temperature of the first semiconductor element (112) may be a method for directly detecting the temperature of the first semiconductor element (112). That is, the temperature of the first semiconductor element (112) may be detected through a temperature sensor (not shown) that comes into contact with the first semiconductor element (112) or faces the first semiconductor element (112).

[0132] The method for detecting the temperature of the first semiconductor element (112) may include indirectly detecting the temperature of a component in contact with the first semiconductor element (112) or detecting the temperature or pressure of a coolant flowing through one side of the control box (100).

[0133] The step (S20) of detecting the temperature of the first semiconductor element (112) can be continuously performed thereafter. Accordingly, the temperature change of the first semiconductor element (112) can be detected at regular intervals.

[0134] A step (S30) is performed to determine whether the temperature of the first semiconductor element (112) is higher than or equal to a first set temperature. Referring to FIG. 14, the first set temperature may be a fixed temperature value. The first set temperature may be a temperature that is a certain level lower than the maximum limit temperature of the first semiconductor element (112).

[0135] The first set temperature may be a temperature 10 degrees or more lower than the maximum limit temperature of the first semiconductor element (112).

[0136] When the temperature of the first semiconductor element (112) is higher than the first set temperature, a step (S40) of opening the heat sink expansion valve (144) is performed. At this time, the heat sink expansion valve (144) can be opened within a certain range. In addition, it is also possible to additionally open the heat sink expansion valve (144) within a certain range.

[0137] The control box (100) can be cooled as the refrigerant flows to the first heat sink (130) through the step (S40) of opening the heat sink expansion valve (144). The control box (100) can be cooled as the amount of refrigerant flowing to the first heat sink (130) increases through the step () of opening the heat sink expansion valve (144).

[0138] Afterwards, the temperature of the first semiconductor element (112) is compared with the second set temperature (S50).

[0139] When the temperature of the first semiconductor element (112) is lower than the second set temperature, a step (S60) of closing the heat sink expansion valve (144) is performed.

[0140] Here, the second set temperature is a temperature that can change depending on the temperature of the first semiconductor element (112). Referring to Fig. 14, the second set temperature can increase as the temperature of the first semiconductor element (112) increases.

[0141] The second set temperature may be a temperature higher than the outside temperature. The second set temperature may be a temperature that prevents condensation from forming around the heat dissipation pipe (132) of the first heat sink (130).

[0142] Although the preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical idea or prospect of the present disclosure.

Claims

1. A case in which an intake port is formed on the circumference and an exhaust port is formed on the upper surface; A fan rotatably positioned inside the case and forming air flow through the outlet; A compressor disposed inside the case and compressing and flowing the refrigerant; A control box placed inside the above case; A cooling device is disposed on one side of the control box and includes a cooling device that cools the control box. The above cooling device: A fixed panel fixedly placed on one side of the case; A first heat sink arranged on one side of the fixed panel and cooling the control box through refrigerant flowing through the compressor; and An air conditioner comprising a second heat sink disposed on the other side of the fixed panel and including a plurality of heat dissipation fins protruding outward from the control box.

2. In paragraph 1, An air conditioner in which the above fixed panel is fixedly placed inside the above control box.

3. In paragraph 1, The above fixed panel has a banded structure, An air conditioner in which the above fixed panels are fixedly arranged on two different sides of the above control box.

4. In paragraph 1, The fixed panel includes a first panel on which the first heat sink is arranged and a second panel on which the second heat sink is arranged. An air conditioner in which the first panel and the second panel form different slopes.

5. In paragraph 4, Further comprising a printed circuit board arranged inside the above control box, The above printed circuit board includes a first semiconductor element and a second semiconductor element spaced apart from the first semiconductor element, An air conditioner in which the first semiconductor element is arranged in contact with the first panel.

6. In paragraph 5, An air conditioner in which the first semiconductor element is arranged on the first surface of the printed circuit board, and the second semiconductor element is arranged on the second surface in an opposite direction to the first surface.

7. In paragraph 1, The above first heat sink, A radiator tube through which refrigerant flows, Including a fixing block for fixing the above heat sink, The above fixed block is an air conditioner fixed to a fixed panel.

8. In paragraph 7, An air conditioner, wherein the first heat sink is arranged on the upper and lower sides of the fixed block and further includes a fastening plate fastened to the fixed panel.

9. In paragraph 7, The first heat sink further includes a heat dissipation panel that contacts the heat dissipation pipe and is coupled to the fixed block, An air conditioner in which the above heat dissipation panel includes a plurality of outer heat dissipation fins protruding in the opposite direction from which the heat dissipation tube is in contact.

10. In paragraph 1, The above cooling device includes an inner heat dissipation fin arranged inside the fixed panel in an area where the first heat sink is arranged, An air conditioner having a plurality of inner heat dissipation fins extending upward and spaced apart in a direction perpendicular to the vertical direction.

11. In paragraph 1, An air conditioner including a heat sink expansion valve that expands refrigerant flowing to the first heat sink.

12. In paragraph 11, It further includes an expansion coil that expands the refrigerant flowing to the first heat sink, The above expansion coil is an air conditioner having a microscopic diameter and extending in a spiral shape.

13. In paragraph 12, An air conditioner in which the above heat sink expansion valve and the above expansion coil are arranged in parallel.

14. In paragraph 1, The circumference of the case includes a blocking surface in which the suction port is not formed, The above control box is an air conditioner placed on one side of the above blocking surface.

15. In paragraph 14, One side of the above control box faces so as to be coupled to the above blocking surface, The other side, which is placed on the opposite side of one side of the above control box, faces the side of the circumference of the above case where the suction port is formed, The above second heat sink is an air conditioner arranged on the other side of the control box.

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