System-in-package module and preparation method, and smart ring

Abstract

The present application provides a system-in-package module and a preparation method, and a smart ring. The system-in-package module comprises a substrate, a functional module, a plastic encapsulation layer, and a shielding layer. The functional module is attached to one surface of the substrate. The plastic encapsulation layer covers the functional module. The shielding layer covers a first area of the plastic encapsulation layer to expose a second area of the plastic encapsulation layer to form a radio frequency antenna, wherein the radio frequency antenna is connected to the substrate. The functional module comprises a master control chip, a first functional chip, and a second functional chip, wherein the first functional chip and the second functional chip are both connected to the master control chip, and the master control chip and the first functional chip achieve signal transmission by means of the radio frequency antenna.

Description

System-in-package module, manufacturing method and smart ring

[0001] The present application claims priority to the Chinese patent application No. 202410864989.4, filed on June 28, 2024, and entitled "System-in-package module, manufacturing method and smart ring", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of packaging technology, and more particularly, an embodiment of the present application relates to a system-in-package module, a manufacturing method and a smart ring. BACKGROUND

[0003] In recent years, with the development of smart wear and other markets, users have more and more functional requirements for products, but have more and more size requirements and more and more weight requirements, which unconsciously compresses the size of each component. The space of the traditional smart ring is not fully utilized, resulting in space waste. Even if it is utilized, the size and weight do not have advantages using the traditional PCBA scheme. Therefore, it is necessary to provide a new technical solution to solve the above technical problems. SUMMARY

[0004] The purpose of the present application is to provide a new technical solution of a system-in-package module, a manufacturing method and a smart ring.

[0005] In a first aspect, the present application provides a system-in-package module. The system-in-package module is applied to a smart ring, and the system-in-package module comprises a substrate, a functional module, a plastic packaging layer and a shielding layer.

[0006] The functional module is attached to a surface of the substrate, the plastic packaging layer covers the functional module, the shielding layer covers a first area of the plastic packaging layer to expose a second area of the plastic packaging layer to form a radio frequency antenna, and the radio frequency antenna is connected to the substrate.

[0007] The functional module comprises a master control chip, a first functional chip and a second functional chip, the first functional chip and the second functional chip are connected to the master control chip, and the master control chip and the first functional chip realize signal transmission through the radio frequency antenna.

[0008] Optionally, the master control chip is a Bluetooth chip.

[0009] Optionally, the second area of the plastic packaging layer forms a first radio frequency antenna, and the first radio frequency antenna is connected to the Bluetooth chip.

[0010] Optionally, the first functional chip comprises at least one of a UWB chip and an NFC chip.

[0011] Optionally, in the case that the first functional chip is a UWB chip, a second region of the plastic sealing layer is formed with a second radio frequency antenna, and the second radio frequency antenna is connected with the UWB chip.

[0012] Optionally, in the case that the first functional chip is a NFC chip, a second region of the plastic sealing layer is formed with a third radio frequency antenna, and the third radio frequency antenna is connected with the NFC chip.

[0013] Optionally, the second functional chip further comprises a power management module, a sensor unit and a crystal oscillator device, and the power management module, the sensor unit and the crystal oscillator device are connected with the master control chip respectively.

[0014] Optionally, the substrate is in a ring structure.

[0015] In a second aspect, the present application further provides a preparation method of a system-in-package module. The preparation method of the system-in-package module comprises the following steps:

[0016] providing a substrate;

[0017] connecting a functional module to a surface of the substrate by surface mounting;

[0018] forming a plastic sealing layer by molding, the plastic sealing layer covering the functional module;

[0019] forming a shielding layer in a first region of the plastic sealing layer;

[0020] forming a radio frequency antenna in a second region of the plastic sealing layer, and the radio frequency antenna is connected with the substrate.

[0021] In a third aspect, the present application further provides a smart ring. The smart ring comprises the system-in-package module according to the first aspect.

[0022] According to the embodiments of the present application, a system-in-package module applied to a smart ring is provided, and the system-in-package module is packaged by using the “SIP+AOP” technology, which meets the requirements of the smart ring on functions and performance, and also meets the pursuit of users on aesthetics and fashion.

[0023] Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and together with the description, serve to explain the principles of the present application.

[0025] FIG. 1 shows a structure schematic diagram of a system-in-package module according to an embodiment of the present application.

[0026] Fig. 2 is a top view of a system-in-package module according to an embodiment of the present application.

[0027] Figs. 3 and 4 are side views of a system-in-package module according to an embodiment of the present application.

[0028] Reference signs: 1, substrate; 2, master control chip; 3, first function chip; 31, UWB chip; 32, NFC chip; 4, second function chip; 41, power management module; 42, sensor unit; 43, crystal oscillator; 44, peripheral interface unit; 5, plastic encapsulation layer; 6, shielding layer; 71, first radio frequency antenna; 72, second radio frequency antenna; 73, third radio frequency antenna. DETAILED DESCRIPTION

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps set forth in the embodiments, numerical expressions, and numerical values are not limiting to the scope of the present application unless specifically stated otherwise.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0031] Techniques and equipment known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the specification where appropriate.

[0032] In all examples shown and discussed herein, any specific value should be interpreted as merely illustrative and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0033] It should be noted that like references and characters herein relate to like items throughout the figures, and once an item is defined in one figure, it need not be discussed further in subsequent figures.

[0034] An embodiment of the present application provides a system-in-package module. The system-in-package module is applied to a smart ring, integrates multiple functions in a compact package, and provides strong functional support for the smart ring.

[0035] Referring to Figs. 1-4, the system-in-package module includes a substrate 1, a function module, a plastic encapsulation layer 5, and a shielding layer 6.

[0036] The functional module is attached to a surface of the substrate 1, the plastic sealing layer 5 covers the functional module, the shielding layer 6 covers a first area of the plastic sealing layer 5 to expose a second area of the plastic sealing layer 5 to form a radio frequency antenna, and the radio frequency antenna is connected to the substrate 1.

[0037] The functional module includes a master control chip 2, a first functional chip 3 and a second functional chip 4, the first functional chip 3 and the second functional chip 4 are connected to the master control chip 2, and the master control chip 2 and the first functional chip 3 realize signal transmission through the radio frequency antenna.

[0038] In the embodiment of the application, the system-in-package module includes a substrate 1, and since the system-in-package module is applied in a smart ring, the shape of the substrate 1 is adapted to the structure of the smart ring. Referring to FIG. 2, in general, the smart ring has a ring structure, and the shape of the substrate 1 is also a ring structure, so that the internal space of the smart ring is fully utilized and the functional module is reasonably arranged. The material of the substrate 1 can be a hard substrate 1 or a flexible substrate 1. When the substrate 1 is a hard substrate 1, the shape of the substrate 1 is adapted to the structure of the smart ring by cutting or the like. When the substrate 1 is a flexible substrate 1, the shape of the substrate 1 is adapted to the structure of the smart ring by bending the flexible substrate 1.

[0039] The functional module is attached to a surface of the substrate 1, realizing the close connection of the functional module and the substrate 1, thereby ensuring the stable transmission of signals. For example, the substrate 1 is mainly made of a BT resin-based copper-clad plate, and the functional module is connected to the substrate 1 by surface mount technology (SMT).

[0040] The plastic sealing layer 5 covers the functional module, playing a role of protection and fixation, and also preventing the interference of the external environment on the internal chips. For example, the surface of the substrate 1 after mounting can be filled with an epoxy resin material by a molding method, so that the system-in-package module has the advantages of strong stability, corrosion and drop.

[0041] The design of the shielding layer 6 further enhances the anti-interference ability of the functional module and ensures the accuracy and stability of signal transmission. For example, by a sputter process, copper, iron, nickel and other elements are sputtered and plated to form the shielding layer 6 except for the second area. The material of the shielding layer 6 has a strong shielding effect on the signals scattered and scattered outside the system-in-package module, so as to ensure that the signal transmission and reception of the radio frequency antenna are not affected.

[0042] In the functional module, the master chip 2 serves as the core and is responsible for the overall control and scheduling. The first functional chip 3 and the second functional chip 4 are responsible for implementing specific functions, and the first functional chip 3 and the second functional chip 4 are connected with the master chip 2 to jointly constitute the functional basis of the smart ring. The master chip 2 and the first functional chip 3 can realize signal transmission through the radio frequency antenna, providing the smart ring with the ability of wireless communication. In one example, each of the master chip 2 and the first functional chip 3 corresponds to a radio frequency antenna, and according to the number of the master chip 2 and the first functional chip 3, a corresponding number of radio frequency antennas are externally arranged on the surface of the package, with reference to FIG. 1, FIG. 3 and FIG. 4. Or in another example, according to the arrangement of the master chip 2 and the first functional chip 3, one of the master chip 2 and the first functional chip 3 or two or more of them share one radio frequency antenna; or two or more of the first functional chip 3 share one radio frequency antenna.

[0043] In the embodiment of the present application, the radio frequency antenna is externally arranged on the surface of the package, specifically, the radio frequency antenna is formed by using a specific area of the plastic packaging layer 5, and the radio frequency antenna is connected with the substrate 1, not only realizing the reception and transmission of signals, but also making the whole module more compact and beautiful. For example, the radio frequency antenna is formed by AOP antenna (AOP antenna, Antenna-on-Package antenna) packaging technology, and the radio frequency antenna can be connected with the substrate 1 through the via hole mode to ensure that the signals in the module can be radiated and transmitted outward. The radio frequency antenna formed by the AOP antenna packaging technology not only ensures the connection of the radio frequency antenna, but also reserves a certain clearance area, thus ensuring the efficiency and stability of the radio frequency antenna.

[0044] Therefore, in the embodiment of the present application, a system-level packaging module applied in a smart ring is provided, and the system-level device module is packaged by using the “SIP+AOP” technology, meeting the needs of the smart ring for functions and performance, and also meeting the pursuit of users for beauty and fashion.

[0045] In one embodiment, the master chip 2 is a Bluetooth chip.

[0046] In this embodiment, the Bluetooth chip is used as the master chip 2, which brings the smart ring the ability of wireless communication, especially the Bluetooth communication capability, so that the smart ring can be seamlessly connected with other Bluetooth devices to realize data transmission and control.

[0047] The application of the Bluetooth chip not only improves the functionality and practicality of the smart ring, but also expands its application scenarios. For example, the smart ring can be paired with a smart phone to realize remote control, data transmission and other functions; it can also be connected with smart home devices to realize the control of smart home. In addition, the low-power characteristic of the Bluetooth chip also ensures that the smart ring can maintain stable performance in long-term use.

[0048] At the same time, the cooperation of the Bluetooth chip with the first functional chip 3 and the second functional chip 4 enables the smart ring to realize more functions. The first functional chip 3 and the second functional chip 4 can be designed according to specific needs, such as health monitoring, motion tracking, identity recognition, etc., and through the connection of the Bluetooth chip with devices such as smartphones, real-time data transmission and processing are realized.

[0049] In addition, the cooperation of the radio frequency antenna with the Bluetooth chip makes the smart ring more outstanding in wireless communication. The Bluetooth chip sends and receives signals through the radio frequency antenna, realizing stable communication between the smart ring and other devices. The design of the radio frequency antenna also takes into account aesthetics and practicality, so that the entire smart ring reaches a high level in appearance and performance.

[0050] In one embodiment, referring to FIG. 3, the second region of the plastic packaging layer 5 is formed with a first radio frequency antenna 71, which is connected with the Bluetooth chip.

[0051] In this embodiment, the second region of the plastic packaging layer 5 is ingeniously designed as the first radio frequency antenna 71. This design not only optimizes the overall structure of the module, but also ensures stable connection between the first radio frequency antenna 71 and the Bluetooth chip.

[0052] As a key component of wireless communication, the first radio frequency antenna 71 undertakes the task of signal transmission and reception. Through connection with the Bluetooth chip, the first radio frequency antenna 71 can transmit data in real time and accurately, so that the smart ring can communicate efficiently and stably with other Bluetooth devices.

[0053] In addition, since the first radio frequency antenna 71 is directly formed on the second region of the plastic packaging layer 5, this integrated design not only improves the integration of the module, but also reduces signal transmission loss, further improving communication efficiency.

[0054] In a specific embodiment, in a smart home, for example, air conditioner, TV, sound, etc., first, Bluetooth pairing is performed, the distance, angle, acceleration, etc. information is captured by the sensor placed in the smart ring, and the previously defined action language is interpreted, the Bluetooth chip sends signals through the first radio frequency antenna 71, and the receiving device decodes the signals after receiving, realizing the instruction operation.

[0055] In one embodiment, referring to FIGS. 1, 3 and 4, the first functional chip 3 includes at least one of a UWB chip 31 and an NFC chip 32.

[0056] In this embodiment, the first functional chip 3 in the system-in-package module of the smart ring includes at least one of a UWB (Ultra-Wide band) chip and an NFC (Near Field Communication) chip. This design enables the smart ring to have more diversified communication and positioning functions, further enriching its application scenarios and user experience.

[0057] If the first functional chip 3 includes a UWB chip 31, the smart ring will be able to achieve high-speed data transmission and precise positioning. UWB technology has characteristics such as high speed, low power consumption, and high-precision positioning, and has wide applications in indoor positioning, personnel tracking, smart home, etc. Integrating a UWB chip 31 in the smart ring can achieve precise positioning of the wearer and high-speed data transmission with other UWB-enabled devices, improving user experience.

[0058] On the other hand, if the first functional chip 3 includes an NFC chip 32, the smart ring will have near-field communication functions. NFC technology allows electronic devices to perform non-contact point-to-point data transmission in close proximity, enabling the smart ring to be used in payment, access control, file transfer, and other scenarios. Through interaction with other NFC-enabled devices, the smart ring can achieve more convenient and secure operations.

[0059] It is worth noting that the smart ring can also integrate both a UWB chip 31 and an NFC chip 32 to achieve more comprehensive functional coverage. This design will enable the smart ring to achieve higher performance in communication and positioning, meeting user needs in different scenarios.

[0060] In summary, by integrating a UWB chip 31 and an NFC chip 32 in the system-in-package module of the smart ring, more diversified functions can be given to it, improving user experience,

[0061] In one embodiment, referring to FIG. 4, in the case where the first functional chip 3 is a UWB chip 31, a second area of the plastic packaging layer 5 is formed with a second radio frequency antenna 72, which is connected with the UWB chip 31.

[0062] In this embodiment, when the first functional chip 3 is a UWB (Ultra-Wide band) chip, the second area of the plastic packaging layer 5 is specially designed to form a second radio frequency antenna 72. This second radio frequency antenna 72 is directly connected with the UWB chip 31, thereby realizing signal transmission between the two.

[0063] Wherein by directly integrating the second radio frequency antenna 72 on the chip package, the overall size of the system is greatly reduced, and the integration level is improved. In addition, due to the shortening of the connection distance between the antenna and the chip, the efficiency and quality of signal transmission are improved, and signal loss and interference are reduced. In addition, this integrated design also helps to simplify the manufacturing process and reduce costs.

[0064] In this embodiment, by closely integrating the second radio frequency antenna 72 with the UWB chip 31, the stability and reliability of the signal during transmission can be ensured, meeting the needs of various application scenarios.

[0065] It should be noted that the second area of the plastic package layer 5 can be specially designed to form the first radio frequency antenna 71 and the second radio frequency antenna 72. For example, the plastic package layer 5 includes a plurality of second areas arranged at intervals, one of which is designed to form the first radio frequency antenna 71, and the other is designed to form the second radio frequency antenna 72.

[0066] In a specific embodiment, the UWB chip 31 in the system-in-package module of the smart ring has higher precision and sensitivity, and is more accurate and faster in distance information calculation. The smart ring can be paired with the vehicle to control the vehicle. After the smart ring is paired with the vehicle, different controls of the vehicle can be realized through pre-set configurations.

[0067] For example, after the smart ring is paired with the vehicle, when the distance from the vehicle is x meters and gradually decreases, the UWB signal is sent through the second radio frequency antenna 72, and the vehicle decodes the instruction to unlock the vehicle after receiving the UWB signal, realizing the functions of starting and unlocking the vehicle. The distance between the vehicle and the smart ring can be set according to user needs.

[0068] When the distance between the smart ring and the vehicle is y meters and gradually decreases, the UWB signal is sent through the second radio frequency antenna 72, and the vehicle opens the welcome mode and adjusts the seat after receiving the signal; wherein the parameter y is less than the parameter x.

[0069] When the distance between the smart ring and the vehicle is z meters and gradually increases, the UWB signal is sent through the second radio frequency antenna 72, and the vehicle decodes the instruction to turn off the vehicle after receiving the UWB signal, realizing the functions of turning off the vehicle and locking the windows.

[0070] In one embodiment, referring to FIG. 3, in the case where the first functional chip 3 is an NFC chip 32, the second area of the plastic package layer 5 forms a third radio frequency antenna 73, and the third radio frequency antenna 73 is connected with the NFC chip 32.

[0071] In this embodiment, when the first functional chip 3 is an NFC (Near Field Communication) chip, the second area of the plastic packaging layer 5 is designed to form a third radio frequency antenna 73. This third radio frequency antenna 73 is directly connected to the NFC chip 32 to achieve signal transmission between the two.

[0072] By integrating the third radio frequency antenna 73 on the chip package, the system achieves high integration and miniaturization, meeting the requirements of modern electronic devices for space utilization and portability. Secondly, due to the shortened connection distance between the antenna and the chip, the efficiency and quality of signal transmission are improved, reducing signal loss and interference, thereby enhancing the reliability and stability of communication. In addition, this integrated design helps to simplify the manufacturing process and reduce production costs.

[0073] NFC technology, as a short-range wireless communication technology, is widely used in mobile payment, access control systems, data transmission, and other fields. Therefore, the requirements for antenna performance are particularly strict. By closely integrating the third radio frequency antenna 73 with the NFC chip 32, the stability and reliability of the signal during transmission can be ensured, meeting the needs of various NFC applications.

[0074] It should be noted that the second area of the plastic packaging layer 5 can be specially designed to form the first radio frequency antenna 71, the second radio frequency antenna 72, and the third radio frequency antenna 73. For example, the plastic packaging layer 5 includes three second areas arranged at intervals, where the first second area is designed to form the first radio frequency antenna 71, the second second area is designed to form the second radio frequency antenna 72, and the third second area is designed to form the third radio frequency antenna 73.

[0075] In a specific embodiment, the NFC function in the smart ring can be applied to access cards, public transportation cards, mobile payments, and other fields. Based on the characteristics of NFC, after the smart ring is turned off, NFC interaction functions can still be realized, such as unlocking and taking the bus. When the smart ring is close to the controlled device, the third radio frequency antenna 73 sends an NFC signal, and the device decodes after receiving the NFC signal, completing the instruction.

[0076] In one embodiment, the master control chip 2 is a BLE chip.

[0077] In this embodiment, BLE technology, as a widely used wireless communication technology, has the characteristics of low power consumption, low cost, and short-range communication, and is particularly suitable for mobile devices, wearable devices, and Internet of Things applications. By using a BLE chip as the master control chip 2, wireless communication and data transmission with other BLE-enabled devices can be achieved.

[0078] Specifically, the BLE chip serves as the core control unit of the entire system, responsible for coordinating and managing the work of various functional chips. The BLE chip enables the system to receive and send BLE signals, thereby realizing connection and data exchange with other BLE devices. This connection method not only simplifies the system structure, but also improves communication efficiency and stability.

[0079] In a specific embodiment, the first functional chip 3 includes a UWB chip 31, which has relatively high power consumption. Since the BLE chip serves as the master control chip 2, in the smart ring, the UWB chip 31 combined with the BLE chip (Bluetooth low power consumption mode) can realize a low-power consumption car key. When the distance from the car is far, the UWB remains in a dormant state, and the Bluetooth is always on. When the distance is close to a certain range, the Bluetooth sends a wake-up signal to the UWB, and the UWB remains on. In this embodiment, the UWB chip 31 and the BLE chip are combined to realize the advantages of ultra-low power consumption and high precision.

[0080] In an embodiment, referring to FIGS. 1-4, the second functional chip 4 includes a power management module 41, a sensor unit 42, and a crystal oscillator device 43, which are respectively connected with the master control chip 2.

[0081] In this embodiment, the second functional chip 4 integrates the power management module 41, the sensor unit 42, and the crystal oscillator device 43. These components are respectively connected with the master control chip 2, and together constitute a functional and efficient system.

[0082] The power management module 41 is responsible for power distribution and management of the entire system, ensuring that each chip and component can work stably and efficiently. Through connection with the master control chip 2, the power management module 41 can dynamically adjust power supply according to the running state and needs of the system, optimizing energy consumption performance.

[0083] The sensor unit 42 contains various sensors for sensing and collecting information of the external environment. These sensors may include temperature sensors, humidity sensors, acceleration sensors, etc., which transmit the collected data to the master control chip 2 for processing and analysis through connection with the master control chip 2. The master control chip 2 can make corresponding control decisions based on these data, realizing intelligent and automated functions.

[0084] The crystal oscillator device 43 provides a stable clock signal, providing an accurate time reference for the operation of the entire system. Through connection with the master control chip 2, the crystal oscillator device 43 ensures synchronization and coordination between various parts of the system, improving the stability and reliability of the system.

[0085] It should be noted that the system-in-package module can further include a peripheral interface unit 44 connected with the master chip 2. The design of the system-in-package module further containing the peripheral interface unit 44 significantly enhances the connection and interaction capability between the module and external devices or systems. The connection of the peripheral interface unit 44 with the master chip 2 enables the entire system to be conveniently connected with other devices or systems, realizing functions such as data transmission, receiving and sending of control instructions, etc.

[0086] Specifically, the peripheral interface unit 44 can include multiple different types of interfaces to meet the needs of different application scenarios. For example, it can contain a USB interface for connecting with a computer or other USB devices to realize fast data transmission; it can also contain an HDMI interface for outputting high-definition video and audio; in addition, network interfaces, serial ports, etc. are also common interface types, which enable the system to access the network and communicate with other devices, realizing more extensive functions.

[0087] In a second aspect, the embodiments of the present application further provide a preparation method of a system-in-package module, which includes the following steps:

[0088] providing a substrate 1;

[0089] connecting a functional module to a surface of the substrate 1 by surface mounting;

[0090] forming a plastic encapsulation layer 5 by molding, which covers the functional module;

[0091] forming a shielding layer 6 in a first area of the plastic encapsulation layer 5;

[0092] forming a radio frequency antenna in a second area of the plastic encapsulation layer 5, which is connected with the substrate 1.

[0093] In this embodiment, the design structure of the system-in-package module of the smart ring is composed of the substrate 1, the functional module, the plastic encapsulation layer 5 formed by the molding material, and the shielding layer 6 formed by surface sputtering.

[0094] The substrate 1 is mainly made of BT resin-based copper-clad plate, and the functional module is connected to the substrate 1 by surface mounting technology (SMT). Then, the surface of the SIP substrate 1 after mounting is filled with epoxy resin material to form the plastic encapsulation layer 5 by the method of molding.

[0095] After the molding is fixed, copper, iron, nickel and other elements are sputtered to form a shielding layer 6 on the surfaces other than the AOP antenna area by a sputtering process. The material of the shielding layer 6 has a strong shielding effect on the signals scattered and radiated outward from the module, so as to ensure that the signal transmission and reception of the antenna are not affected. The radio frequency antenna formed by the AOP antenna packaging technology can be connected to the substrate 1 through a via, so as to ensure that the signals in the module can be radiated and transmitted outward.

[0096] In this embodiment, the system-in-package module provided by the embodiment of the application is designed based on a circuit design, and the EMI shielding and AOP antenna design are realized by a sputtering process. Optionally, a protective coating can be sputtered on the EMI shielding layer 6, which can effectively prevent the scattering and crosstalk of various signals to the outside, and improve the waterproof, moisture-proof and corrosion-proof levels.

[0097] In a third aspect, the embodiment of the application further provides a smart ring. The smart ring comprises the system-in-package module as described above.

[0098] In the embodiment of the application, the system-in-package module of the smart ring realized by the "SIP+AOP" technology makes full use of the space of the ring, reduces the size and weight of the smart ring, and reduces the power consumption of the smart ring. By combining the main control chip 2 with other types of chips, a plurality of use scenarios are defined, and a more portable and efficient smart lifestyle is realized.

[0099] In the above embodiments, the differences between the various embodiments are mainly described. The different optimization features of the various embodiments can be combined to form a more optimal embodiment as long as they are not contradictory. In view of the brevity of the text, further description is omitted here.

[0100] Although some specific embodiments of the application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration and are not intended to limit the scope of the application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims

1. A system-in-a-package module, comprising: The system-in-package module applied to the intelligent ring comprises a substrate (1), a functional module, a plastic encapsulation layer (5) and a shielding layer (6). The functional module is attached to a surface of the substrate (1), the plastic encapsulation layer (5) covers the functional module, the shielding layer (6) covers a first area of the plastic encapsulation layer (5) to expose a second area of the plastic encapsulation layer (5) to form a radio frequency antenna, and the radio frequency antenna is connected to the substrate (1). The functional module comprises a master control chip (2), a first functional chip (3) and a second functional chip (4), the first functional chip (3) and the second functional chip (4) are connected to the master control chip (2), and the master control chip (2) and the first functional chip (3) realize signal transmission through the radio frequency antenna.

2. The system-in-a-package module of claim 1, wherein, The master control chip (2) is a Bluetooth chip.

3. The system-in-a-package module of claim 2, wherein, The second area of the plastic encapsulation layer (5) is formed with a first radio frequency antenna (71), and the first radio frequency antenna (71) is connected to the Bluetooth chip.

4. The system-in-a-package module of any of claims 1-3, wherein, The first functional chip (3) comprises at least one of a UWB chip (31) and an NFC chip (32).

5. The system-in-a-package module of claim 4, wherein, In the case that the first functional chip (3) is a UWB chip (31), the second area of the plastic encapsulation layer (5) is formed with a second radio frequency antenna (72), and the second radio frequency antenna (72) is connected to the UWB chip (31).

6. The system-in-a-package module of claim 4, wherein, In the case that the first functional chip (3) is an NFC chip (32), the second area of the plastic encapsulation layer (5) is formed with a third radio frequency antenna (73), and the third radio frequency antenna (73) is connected to the NFC chip (32).

7. The system-in-a-package module of any of claims 1-6, wherein, The second functional chip (4) comprises a power management module (41), a sensor unit (42) and a crystal oscillator device (43), and the power management module (41), the sensor unit (42) and the crystal oscillator device (43) are connected to the master control chip (2) respectively.

8. The system-in-a-package module of claim 7, wherein, The substrate (1) has a ring structure.

9. A method for fabricating a system-in-package module, characterized in that, The method comprises the following steps: providing a substrate (1); connecting a functional module to a surface of the substrate (1) by surface mounting; forming a plastic encapsulation layer (5) by molding, and the plastic encapsulation layer (5) covers the functional module; forming a shielding layer (6) on a first area of the plastic encapsulation layer (5); forming a radio frequency antenna on a second area of the plastic encapsulation layer (5), and the radio frequency antenna is connected to the substrate (1).

10. A smart ring, characterized by The intelligent ring comprises the system-in-package module according to any one of claims 1-8. The intelligent ring comprises the system-in-package module according to any one of claims 1-8.

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