BGA chip packaging structure and testing method

Abstract

The present application relates to the technical fields of chip packaging and testing, and particularly relates to a BGA chip packaging structure and a testing method. The BGA chip packaging structure comprises a BGA chip substrate, wherein ball grid soldering contacts are arranged on the bottom surface of the BGA chip substrate, and a BGA chip main body and lead contacts arranged around the BGA chip main body are arranged on the top surface of the BGA chip substrate; the BGA chip main body is connected to the lead contacts by means of a segmented connection lead on the surface of the side of the BGA chip main body that faces away from the BGA chip substrate; the lead contacts and the ball grid soldering contacts are connected in a manner of corresponding to each other on a one-to-one basis by means of traces inside the BGA chip substrate; and the segmented connection lead comprises a substrate-end lead and a chip-end lead, the chip-end lead being suitable for separating from the substrate-end lead under the action of an external force, and being suitable for resiliently returning to restore connection after the external force is removed. By means of the manufacturing method of the present application, straight-through holes having consistent hole diameters in the direction of depth can be manufactured. The present application can solve the problem of it being difficult to test the soldering quality of a ball grid soldering contact between a BGA chip and a PCB chip.

Description

BGA chip packaging structure and testing method

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202410853953.6, filed on June 28, 2024, and entitled "BGA chip packaging structure and testing method", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application relates to the field of chip packaging and testing, in particular, to a BGA chip packaging structure and testing method. BACKGROUND

[0004] A server is a super complex system composed of a large number of operation, storage and management chips, and needs a PCB (Printed Circuit Board) as support to connect the numerous functional modules. With the development of cloud computing technology, the rate of signals processed by network server chips has increased exponentially, and the speed of chip computing has also increased by the same proportion, and the power consumption has also increased. The structure of the server case cannot be blindly expanded, and it needs to meet industry standards, so the space inside the server case is limited. The area of the PCB does not increase, but the newly added electronic devices, connectors, etc. need to be orderly arranged on the surface of the PCB. In order to solve this problem, a large number of BGA packaged chips are introduced in the industry to reduce the area occupied by the chips on the PCB. This brings some difficult-to-solve problems, specifically: the chip and the corresponding contact on the PCB are connected by soldering to form a ball grid soldering contact. When the welding quality is confirmed and the impedance is tested, the contacts on the chip end cannot be directly measured. Under normal circumstances, the testing of these contacts is usually carried out through other indirect means, such as non-destructive testing by X-ray (as shown in FIG. 5) or destructive testing to grind the chip flat to expose the solder for confirmation; the impedance test can only confirm the contacts on the PCB end, and the ball grid soldering contact part from the solder to the chip can only be confirmed by simulation or by reserving test points on the PCB for testing, which cannot directly test the welding quality. If the contacts under the BGA chip are not reserved for testing on the PCB through soldering, they cannot be measured, which brings a lot of trouble to design verification. SUMMARY

[0005] Therefore, the present application provides a BGA chip packaging structure and testing method to solve the problem that the ball grid soldering contact between the BGA chip and the PCB chip is difficult to test the welding quality.

[0006] According to the first aspect of the present application, a BGA chip packaging structure is provided, comprising: a BGA chip substrate; a ball grid array solder contact provided on the bottom surface of the BGA chip substrate for connecting with a PCB board; a BGA chip main body and a lead contact provided around the BGA chip main body on the top surface of the BGA chip substrate; the BGA chip main body is connected with the lead contact through segmented connecting leads on the back side surface of the BGA chip main body; the lead contact and the ball grid array solder contact are connected one by one through the internal wiring of the BGA chip substrate; wherein the segmented connecting leads comprise: a substrate end lead; the substrate end lead is a hard lead, comprising a vertical segment and a horizontal segment; the vertical segment of the substrate end lead is perpendicular to the surface of the BGA chip substrate and connected with the lead contact; a chip end lead; the chip end lead is a soft lead, one end of which is connected with the BGA chip main body and the other end of which is detachably connected with the horizontal segment of the substrate end lead; the chip end lead is adapted to be separated from the substrate end lead under external force and to be restored to the connected state after the external force is removed.

[0007] In one embodiment, the BGA chip packaging structure further comprises: a support filling glue layer; the support filling glue layer is provided on the top surface of the BGA chip substrate and surrounds the side of the BGA chip main body; the horizontal segment of the substrate end lead and the part of the chip end lead exposed from the BGA chip main body are located on the side surface of the support filling glue layer away from the BGA chip substrate; the support filling glue layer is an elastic glue layer adapted to restore the chip end lead to the connected state with the substrate end lead after the chip end lead is separated from the substrate end lead.

[0008] In one embodiment, the BGA chip packaging structure further comprises: a packaging glue layer; the packaging glue layer is provided on the top surface of the BGA chip substrate and surrounds and covers the BGA chip main body, the lead contact, the support filling glue layer and the segmented connecting leads. A peeling probe; the peeling probe is movably provided in the packaging glue layer and is adapted to abut against the chip end lead to separate the chip end lead from the substrate end lead. The packaging glue layer is provided with a peeling probe hole, the peeling probe hole penetrates through the packaging glue layer in the thickness direction and exposes the chip end lead; the peeling probe is provided in the peeling probe hole and is adapted to move along the extension direction of the peeling probe hole.

[0009] In one embodiment, the end of the peeling probe away from the chip end lead is a reverse cone structure; the opening of the peeling probe hole is a funnel-shaped opening; an elastic plastic is filled between the peeling probe and the peeling probe hole, the elastic plastic is located at least between the taper surface of the reverse cone of the peeling probe and the wall surface of the funnel-shaped opening of the peeling probe hole.

[0010] In one embodiment, the size difference between the size of the peeling probe and the aperture of the peeling probe hole at any corresponding position is greater than 0.1 mm and less than 0.5 mm.

[0011] In one embodiment, the BGA chip packaging structure further comprises: a test probe; the test probe is movably arranged in the encapsulation layer and is adapted to abut against the horizontal section of the substrate terminal lead to test the lead contact by connecting the substrate terminal lead.

[0012] In one embodiment, the test probe is in a reverse cone structure away from one end of the substrate terminal lead; the opening of the test probe hole is in a funnel shape; and the test probe is filled with elastic plastic between the test probe and the test probe hole, and the elastic plastic is at least between the taper surface of the reverse cone of the test probe and the wall surface of the funnel-shaped opening of the test probe hole.

[0013] In one embodiment, the size difference between the size of the test probe and the aperture of the test probe hole is greater than 0.1 mm and less than 0.5 mm at any corresponding position.

[0014] In one embodiment, the distance between the test probe hole and the stripping probe hole is 0.5 mm to 1.5 mm.

[0015] In one embodiment, the distance between adjacent lead contacts is 0.5 mm to 1.5 mm.

[0016] In one embodiment, the elastic plastic filled between the stripping probe and the stripping probe hole has an allowable elastic deformation of greater than 0.3 mm and less than 0.5 mm when the stripping probe is pressed down; the elastic plastic filled between the test probe and the test probe hole has an allowable elastic deformation of greater than 0.3 mm and less than 0.5 mm when the test probe is pressed down; and the support filled layer has an allowable elastic deformation of greater than 0.3 mm and less than 0.5 mm when the stripping probe is pressed down.

[0017] According to the second aspect of the present application, a test method of a BGA chip packaging structure is also provided, and the BGA chip packaging structure is as provided in the present application; the test method comprises the following steps: using external force to separate the chip terminal lead and the substrate terminal lead, connecting the substrate terminal lead, and testing the lead contact; after the test is completed, the external force is removed, and the chip terminal lead is rebounded to restore the connection with the substrate terminal lead.

[0018] In one embodiment, the BGA chip packaging structure comprises a packaging adhesive layer; the packaging adhesive layer is arranged on the top surface of the BGA chip substrate, and surrounds and covers the BGA chip body, the lead contact and the segmented connecting lead; the BGA chip packaging structure further comprises a peeling probe; the peeling probe is movably arranged in the packaging adhesive layer, and is adapted to abut against the chip end lead to separate the chip end lead from the substrate end lead; the testing method comprises: before the substrate end lead is connected, the peeling probe is pressed down to separate the chip end lead from the substrate end lead; after the testing is completed, the peeling probe is released to make the chip end lead rebound and restore the connection with the substrate end lead.

[0019] In one embodiment, the BGA chip packaging structure comprises a packaging adhesive layer; the packaging adhesive layer is arranged on the top surface of the BGA chip substrate, and surrounds and covers the BGA chip body, the lead contact and the segmented connecting lead; the BGA chip packaging structure further comprises a testing probe; the testing probe is movably arranged in the packaging adhesive layer, and is adapted to abut against the horizontal segment of the substrate end lead to connect the substrate end lead to test the lead contact; the testing method comprises: after the substrate end lead is separated from the chip end lead, the testing probe is pressed down to connect the horizontal segment of the substrate end lead, and the lead contact is tested through the connection of the substrate end lead.

[0020] In one embodiment, in the step of pressing down the peeling probe to separate the chip end lead from the substrate end lead, the pressure of pressing down the peeling probe is 1N-3N.

[0021] The application has the following beneficial effects:

[0022] The BGA chip packaging structure provided by the application is characterized in that: the top surface of the BGA chip substrate is provided with a BGA chip main body and a lead contact arranged around the BGA chip main body; the BGA chip main body is connected to the lead contact through segmented connection leads on the back side surface of the BGA chip main body; the lead contact and the ball grid welding contact are connected one by one through the internal wiring of the BGA chip substrate; wherein the segmented connection lead comprises: a substrate end lead; the substrate end lead is a hard lead, comprising a vertical segment and a horizontal segment; the vertical segment of the substrate end lead is perpendicular to the surface of the BGA chip substrate and connected to the lead contact; a chip end lead; the chip end lead is a soft lead, one end of which is connected to the BGA chip main body, and the other end of which is connected to the horizontal segment of the substrate end lead in a detachable manner; the chip end lead is adapted to be separated from the substrate end lead under the action of external force and to be restored after the external force is removed. By arranging the connection lead between the chip main body and the lead contact as a segmented connection lead, the chip end lead and the substrate end lead are connected in a detachable manner, are adapted to be separated under the action of external force, and are adapted to be restored after the external force is removed. Therefore, when testing the welding quality of the contact, the chip end lead and the substrate end lead can be separated by using external force, the substrate end lead is connected alone, and the lead contact and the ball grid welding contact connected thereto are tested. Since the chip end lead on the chip side has been disconnected during the test, the chip side will not affect and interfere with the test, and the chip will not be affected by the test. Meanwhile, the connection can be restored after the test, without affecting the subsequent normal use of the chip. Therefore, the BGA chip packaging structure provided by the application can solve the problem that the ball grid welding contact between the BGA chip and the PCB chip is difficult to test the welding quality.

[0023] The application provides a BGA chip packaging structure and a packaging method. The BGA chip packaging structure is used, and the test method comprises the following steps: separating the chip end lead and the substrate end lead by using external force, connecting the substrate end lead, and testing the lead contact; after the test is completed, the external force is removed, and the chip end lead is restored to connect the substrate end lead. By arranging the connection lead between the chip main body and the lead contact as a segmented connection lead, the chip end lead and the substrate end lead are connected in a detachable manner, are adapted to be separated under the action of external force, and are adapted to be restored after the external force is removed. Therefore, when testing the welding quality of the lead contact, the chip end lead and the substrate end lead can be separated by using external force, the substrate end lead is connected alone, and the lead contact is tested, so that the chip end lead on the chip side has been disconnected during the test, without affecting the test, and without affecting the chip due to the test. Meanwhile, the connection can be restored after the test, without affecting the subsequent normal use of the chip. Therefore, the BGA chip packaging structure provided by the application can solve the problem that the ball grid welding contact between the BGA chip and the PCB chip is difficult to test the welding quality. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the specific embodiments or the related art, the accompanying drawings needed to be used in the specific embodiments or the related art description will be briefly introduced. Obviously, the accompanying drawings in the following description are some embodiments of the present application, and other accompanying drawings can be obtained by a person of ordinary skill in the art without any creative effort based on these accompanying drawings.

[0025] FIG. 1 is a perspective structural schematic diagram of the back of a BGA chip in the related art;

[0026] FIG. 2 is a structural schematic diagram of the BGA chip in the related art when connected with a PCB board;

[0027] FIG. 3 is a top structural schematic diagram of the BGA chip in the related art;

[0028] FIG. 4 is a side structural schematic diagram of the BGA chip in the related art;

[0029] FIG. 5 is a result schematic diagram of X-ray irradiation test of the BGA chip in the related art;

[0030] FIG. 6 is a structural schematic diagram of a segmented connecting lead in a BGA chip packaging structure according to an embodiment of the present application.

[0031] In the above accompanying drawings, the following reference signs are included: 100, PCB board; 210, BGA chip substrate; 220, ball grid soldering contact; 230, BGA chip main body; 240, lead contact; 251, chip end lead; 252, substrate end lead; 260, support filling glue layer; 270, packaging glue layer; 271, test probe hole; 272, elastic plastic; 280, stripping probe; 290, test probe. Specific embodiments

[0032] Referring to FIGS. 1-4, the chip of the BGA package includes a BGA chip substrate 210, the bottom surface of which is provided with ball grid solder contacts 220 for connecting with a PCB 100; the top surface of the BGA chip substrate 210 is provided with a BGA chip main body 230 and lead contacts 240 arranged around the BGA chip main body 230; the BGA chip main body 230 is connected to the lead contacts 240 through segmented connecting leads on the back surface thereof opposite to the BGA chip substrate 210; the lead contacts 240 and the ball grid solder contacts 220 are connected one-to-one through the internal wiring of the BGA chip substrate 210. In this way, the BGA chip main body is connected to the connecting circuit on the PCB through the lead-lead contact-ball grid solder contact, and signals are transmitted through this path during operation. Since the ball grid solder contacts 220 are shielded by the BGA chip substrate 210, it is difficult to directly contact and measure. If direct contact measurement is performed from the side of the lead contacts 240, since the lead contacts 240 are connected to the BGA chip main body 230 through leads, on the one hand, it is difficult to confirm whether the obtained result is the result of the lead contact-ball grid solder contact side or the result of the lead contact-chip main body side. On the other hand, the test result may be disturbed due to the lead connection to the chip main body, or due to the lead connection during testing, the internal devices of the chip main body may be adversely affected during testing. Therefore, the soldering quality of the ball grid solder contacts 220 is difficult to directly measure.

[0033] To solve the problem that the ball grid solder contacts between the BGA chip and the PCB chip are difficult to test the soldering quality, the application provides a BGA chip package structure and a testing method.

[0034] The BGA chip package structure provided by the application includes: a BGA chip substrate; the bottom surface of the BGA chip substrate is provided with ball grid solder contacts for connecting with a PCB; the top surface of the BGA chip substrate is provided with a BGA chip main body and lead contacts arranged around the BGA chip main body; the BGA chip main body is connected to the lead contacts through segmented connecting leads on the back surface thereof opposite to the BGA chip substrate; the lead contacts and the ball grid solder contacts are connected one-to-one through the internal wiring of the BGA chip substrate; wherein the segmented connecting leads include: a substrate end lead; the substrate end lead is a hard lead, including an upright segment and a horizontal segment; the upright segment of the substrate end lead is perpendicular to the surface of the BGA chip substrate and connected to the lead contacts; a chip end lead; the chip end lead is a soft lead, one end of which is connected to the BGA chip main body and the other end of which is separably connected to the horizontal segment of the substrate end lead; the chip end lead is adapted to be separated from the substrate end lead under external force and to be restored to connection after the external force is removed.

[0035] The application provides a BGA chip packaging structure test method, the BGA chip packaging structure is as provided by the application; the test method comprises the following steps: using external force to separate the chip end lead and the substrate end lead, connecting the substrate end lead, testing the lead contact; after testing, removing the external force, and making the chip end lead rebound and restore connection with the substrate end lead.

[0036] The technical solutions of the application will be described clearly and completely in combination with the drawings. Obviously, the described embodiments are part of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the application. In the description of the application, it should be noted that the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0037] Embodiment 1

[0038] Referring to FIG. 6 and FIG. 3 and FIG. 4, the application provides a BGA chip packaging structure, comprising:

[0039] The BGA chip substrate 210 is provided with a ball grid welding contact 220 on the bottom surface, which is used for connecting with a PCB board; the top surface of the BGA chip substrate 210 is provided with a BGA chip main body 230 and a lead contact 240 arranged around the BGA chip main body 230; the lead contact 240 and the ball grid welding contact 220 are connected one by one through the internal wiring of the BGA chip substrate 210; the BGA chip main body 230 connects the lead contact 240 through the segmented connection lead on the side surface opposite to the BGA chip substrate 210; wherein the segmented connection lead comprises: a substrate end lead 252; the substrate end lead 252 is a hard lead, comprising a vertical segment and a horizontal segment; the vertical segment of the substrate end lead 252 is perpendicular to the surface of the BGA chip substrate 210 and connected with the lead contact 240; a chip end lead 251; the chip end lead 251 is a soft lead, one end of which is connected with the BGA chip main body 230, and the other end is connected with the horizontal segment of the substrate end lead 252 in a detachable manner; the chip end lead 251 is suitable for being separated from the substrate end lead 252 under the action of external force, and is suitable for rebounding and restoring connection after the external force is removed.

[0040] The BGA chip packaging structure provided in the application, the top surface of the BGA chip substrate 210 is provided with a BGA chip body 230 and a lead contact 240 arranged around the BGA chip body 230; the BGA chip body 230 is connected to the lead contact 240 through segmented connection leads on the back side surface of the BGA chip substrate 210; wherein the segmented connection leads include: a substrate end lead 252; the substrate end lead 252 is a hard lead, including an upright section and a horizontal section; the upright section of the substrate end lead 252 is perpendicular to the surface of the BGA chip substrate 210 and connected to the lead contact 240; a chip end lead 251; the chip end lead 251 is a soft lead, one end of which is connected to the BGA chip body 230 and the other end of which is connected to the horizontal section of the substrate end lead 252 in a detachable manner; the chip end lead 251 is adapted to be separated from the substrate end lead 252 under the action of an external force and to be restored after the external force is removed. By arranging the connection lead between the chip body and the lead contact 240 as a segmented connection lead, the chip end lead 251 and the substrate end lead 252 are connected in a detachable manner, are adapted to be separated under the action of an external force and are adapted to be restored after the external force is removed, so that the chip end lead 251 and the substrate end lead 252 can be separated by using an external force when the welding quality of the lead contact 240 is tested, the substrate end lead 252 is connected alone, and the lead contact 240 is tested, so that the chip end lead 251 on the side of the chip is disconnected during the test, and the test will not be affected, nor will the chip be affected by the test. And the connection can be restored after the test, without affecting the subsequent normal use of the chip. Therefore, the BGA chip packaging structure provided in the application can solve the problem that the ball grid welding contact 220 between the BGA chip and the PCB chip is difficult to test the welding quality.

[0041] In some embodiments, the radial dimension of the substrate end lead 252 is greater than the radial dimension of the chip end lead 251. Since the chip end lead 251 is the moving end during separation, the size of the substrate end lead 252 as the stationary end is relatively larger, which can reduce the difficulty of restoring the connection between the two during elastic recovery and reduce the probability of failure caused by deviation during restoring the connection.

[0042] Alternatively, in other embodiments, the horizontal section of the substrate end lead 252 is in the form of a flat sheet, so as to reduce the difficulty of restoring the connection with the chip end lead 251 during elastic recovery.

[0043] Further, in the embodiment, the BGA chip packaging structure further comprises: a support filling glue layer 260; the support filling glue layer 260 is arranged on the top surface of the BGA chip substrate 210 and surrounds the side of the BGA chip body 230; the horizontal section of the substrate end lead 252 and the chip end lead 251 exposed on the BGA chip body 230 are located on the surface of the support filling glue layer 260 away from the BGA chip substrate 210; the support filling glue layer 260 is an elastic glue layer and is suitable for making the chip end lead 251 and the substrate end lead 252 disconnected and then elastically restored to the connected state after the external force is removed. Since the filling glue layer itself has a certain elasticity and compressibility, it usually supports the horizontal section of the chip end lead 251 and the substrate end lead 252 as a support layer, deforms together with the chip end lead 251 under pressure during testing, and supports the chip end lead 251 to elastically restore to the connected state with the substrate end lead 252 by the elastic force of restoring the shape when the external force is removed. Thus, the separable connection of the two can be realized.

[0044] Further, in the embodiment, the BGA chip packaging structure further comprises: a support filling glue layer 260; the support filling glue layer 260 is arranged on the top surface of the BGA chip substrate 210 and surrounds the side of the BGA chip body 230; the horizontal section of the substrate end lead 252 and the chip end lead 251 exposed on the BGA chip body 230 are located on the surface of the support filling glue layer 260 away from the BGA chip substrate 210; the support filling glue layer 260 is an elastic glue layer and is suitable for making the chip end lead 251 and the substrate end lead 252 disconnected and then elastically restored to the connected state after the external force is removed. Since the filling glue layer itself has a certain elasticity and compressibility, it usually supports the horizontal section of the chip end lead 251 and the substrate end lead 252 as a support layer, deforms together with the chip end lead 251 under pressure during testing, and supports the chip end lead 251 to elastically restore to the connected state with the substrate end lead 252 by the elastic force of restoring the shape when the external force is removed. Thus, the separable connection of the two can be realized.

[0045] Further, in the embodiment, the BGA chip packaging structure further comprises: a support filling glue layer 260; the support filling glue layer 260 is arranged on the top surface of the BGA chip substrate 210 and surrounds the side of the BGA chip body 230; the horizontal section of the substrate end lead 252 and the chip end lead 251 exposed on the BGA chip body 230 are located on the surface of the support filling glue layer 260 away from the BGA chip substrate 210; the support filling glue layer 260 is an elastic glue layer and is suitable for making the chip end lead 251 and the substrate end lead 252 disconnected and then elastically restored to the connected state after the external force is removed. Since the filling glue layer itself has a certain elasticity and compressibility, it usually supports the horizontal section of the chip end lead 251 and the substrate end lead 252 as a support layer, deforms together with the chip end lead 251 under pressure during testing, and supports the chip end lead 251 to elastically restore to the connected state with the substrate end lead 252 by the elastic force of restoring the shape when the external force is removed. Thus, the separable connection of the two can be realized.

[0046] Further, in the embodiment, the BGA chip packaging structure further comprises: a support filling glue layer 260; the support filling glue layer 260 is arranged on the top surface of the BGA chip substrate 210 and surrounds the side of the BGA chip body 230; the horizontal section of the substrate end lead 252 and the chip end lead 251 exposed on the BGA chip body 230 are located on the surface of the support filling glue layer 260 away from the BGA chip substrate 210; the support filling glue layer 260 is an elastic glue layer and is suitable for making the chip end lead 251 and the substrate end lead 252 disconnected and then elastically restored to the connected state after the external force is removed. Since the filling glue layer itself has a certain elasticity and compressibility, it usually supports the horizontal section of the chip end lead 251 and the substrate end lead 252 as a support layer, deforms together with the chip end lead 251 under pressure during testing, and supports the chip end lead 251 to elastically restore to the connected state with the substrate end lead 252 by the elastic force of restoring the shape when the external force is removed. Thus, the separable connection of the two can be realized.

[0047] Further, in the embodiment, the peeling probe 280 is in a reverse pyramid structure away from one end of the chip end lead 251; the opening of the peeling probe hole is in a funnel-shaped opening; the peeling probe and the peeling probe hole are filled with elastic plastic 272, and the elastic plastic 272 is located at least between the taper surface of the reverse pyramid of the peeling probe and the wall surface of the funnel-shaped opening of the peeling probe hole. The tip of the reverse pyramid facilitates force application to the probe, reducing the difficulty of displacement of the peeling probe 280. At the same time, in combination with the funnel-shaped opening of the peeling probe hole, the elastic plastic 272 is arranged, which can assist in applying a resilient force in all directions, so that the reset of the probe is as little as possible to be deviated, thereby reducing the difficulty of elastic recovery connection of the chip end lead 251 and reducing the probability of failure of the recovery connection caused by deviation in the recovery process.

[0048] Further, in the embodiment, the size difference between the peeling probe 280 and the aperture of the peeling probe hole is greater than 0.1 mm and less than 0.5 mm at any corresponding position. If the size difference is less than 0.1 mm, there is basically no activity space of the probe, and it is difficult to realize the pressing and lifting reset of the probe; if the size difference is greater than 0.5 mm, the activity space of the probe in the hole is too large, which is easy to loosen, and the probability of failure of the separation of the chip end lead and the substrate end lead caused by deviation in the pressing direction is too large. Therefore, the size difference is in the range of greater than 0.1 mm and less than 0.5 mm, which can balance between sufficient activity space and not too large activity space.

[0049] Further, in the embodiment, the BGA chip packaging structure further comprises: a test probe 290; the test probe 290 is movably arranged in the packaging adhesive layer 270 and is adapted to abut against the horizontal section of the substrate end lead 252 to test the lead contact 240 connected by the substrate end lead 252. By arranging the test probe 290, the contact test with the horizontal section of the substrate end lead 252 can be easily realized.

[0050] Further, in the embodiment, the packaging adhesive layer 270 is provided with a test probe hole 271, and the test probe hole 271 penetrates the packaging adhesive layer 270 in the thickness direction to expose the horizontal section of the substrate end lead 252; the test probe 290 is arranged in the test probe hole 271 and is adapted to move along the extension direction of the test probe hole 271. By arranging the test probe hole 271, the test probe 290 can realize contact with the substrate end lead 252 with the smallest displacement, so that the lead displacement caused by the contact process is as small as possible, reducing the difficulty of recovery connection and the probability of failure of recovery connection.

[0051] Further, in the embodiment, the test probe 290 is a reverse pyramid structure away from one end of the substrate terminal lead 252; the opening of the test probe hole 271 is a funnel-shaped opening; and the test probe 290 and the test probe hole 271 are filled with elastic plastic, which is at least located between the taper surface of the reverse pyramid of the test probe and the wall surface of the funnel-shaped opening of the test probe hole. The tip of the reverse pyramid facilitates force application to the probe, reducing the difficulty of displacement of the test probe 290. At the same time, in combination with the funnel-shaped opening of the test probe hole 271, the elastic plastic is arranged to apply a rebound force in all directions, so that the reset of the probe is as unbiased as possible, thereby reducing the possible deviation or deformation of the substrate terminal lead due to changes in the force application condition, and thus reducing the difficulty of elastic recovery connection of the substrate terminal lead 252 and the chip terminal lead 251 and the probability of failure of the recovery connection due to deviation during the recovery process.

[0052] Further, in the embodiment, the size difference between the size of the test probe and the aperture of the test probe hole at any corresponding position is greater than 0.1 mm and less than 0.5 mm, for example, it can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm. If the size difference is less than 0.1 mm, there is basically no active space for the probe, making it difficult to achieve the pressing down and lifting reset of the probe; if the size difference is greater than 0.5 mm, the probe has too much space to move in the hole, which is easy to loosen and cause the chip terminal lead and the substrate terminal lead to separate due to deviation in the pressing direction. Therefore, the size difference in the range of greater than 0.1 mm and less than 0.5 mm can balance between sufficient active space and not too much active space.

[0053] Further, in the embodiment, the distance between the test probe hole and the peeling probe hole is 0.5 mm to 1.5 mm, for example, it can be 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm. If the distance between the test probe hole and the peeling probe hole is less than 0.1 mm, on the one hand, the small distance is difficult to process, and on the other hand, the simultaneous operation of the peeling probe and the test probe easily squeezes the operation space, making the operation difficulty too great; if the distance is greater than 0.5 mm, the peeling probe is too close to the chip end, which is easy to cause insufficient force, the chip terminal lead is not completely separated from the substrate terminal lead, and the test result is deviated. Therefore, the distance between the test probe hole and the peeling probe hole is 0.5 mm to 1.5 mm, which can balance between low processing difficulty, operation difficulty and force application conditions.

[0054] Further, in the embodiment, the distance between adjacent lead contacts is 0.5mm-1.5mm, for example, it can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm. If the distance between adjacent lead contacts is too small, crosstalk is prone to occur, and the test between adjacent contacts is prone to occupy the operation space; if the distance is too large, the chip size is affected. Therefore, the distance between adjacent lead contacts is in the range of 0.5mm-1.5mm, which can balance between avoiding crosstalk, facilitating testing and chip miniaturization.

[0055] Further, in the embodiment, the elastic plastic filled between the peeling probe and the peeling probe hole has an allowable elastic deformation amount greater than 0.3mm and less than 0.5mm when the peeling probe is pressed down, for example, it can be 0.3mm, 0.4mm, 0.5mm. The elastic plastic filled between the test probe and the test probe hole has an allowable elastic deformation amount greater than 0.3mm and less than 0.5mm when the test probe is pressed down, for example, it can be 0.3mm, 0.4mm, 0.5mm. The support filled glue layer has an allowable elastic deformation amount greater than 0.3mm and less than 0.5mm when the peeling probe is pressed down, for example, it can be 0.3mm, 0.4mm, 0.5mm. The allowable elastic deformation amount is the deformation amount of the elastic plastic and the support filled glue layer at the pressing position during the pressing process of the probe. If the deformation amount is too small, the movable distance of the probe is too short, and the movable distance of the chip end lead is too short, which is prone to cause incomplete separation; if the deformation amount is too large, the substrate end lead is prone to be misaligned during elastic recovery, causing recovery connection failure. Therefore, the above deformation amount range can balance between meeting the complete separation requirement and meeting the recovery connection requirement.

[0056] Embodiment 2

[0057] The embodiment provides a test method of a BGA chip packaging structure, the BGA chip packaging structure is the BGA chip packaging structure provided in the embodiment 1; the test method comprises the following steps: separating the chip end lead 251 and the substrate end lead 252 by using external force, connecting the substrate end lead 252, and testing the lead contact 240; after the test is completed, the external force is removed, and the chip end lead 251 is bounced back to recover the connection with the substrate end lead 252.

[0058] The application provides a BGA chip packaging structure and a packaging method. The test method using the BGA chip packaging structure provided by the application comprises the following steps: separating the chip end lead wire 251 and the substrate end lead wire 252 by using external force, connecting the substrate end lead wire 252, and testing the lead wire contact 240; after the testing is completed, the external force is removed, and the chip end lead wire 251 is rebounded to restore the connection with the substrate end lead wire 252. By arranging the connecting lead wire between the chip body and the lead wire contact 240 as a segmented connecting lead wire, the chip end lead wire 251 and the substrate end lead wire 252 can be connected in a separable manner, are suitable for being separated under the action of external force, and are suitable for being rebounded to restore the connection after the external force is removed. When the welding quality of the lead wire contact 240 is tested, the chip end lead wire 251 is first separated from the substrate end lead wire 252 by using external force, the substrate end lead wire 252 is connected separately, and the lead wire contact 240 is tested. Therefore, during the testing, the chip end lead wire 251 on the chip side has been disconnected, and the testing is not affected, and the chip is not affected by the testing. After the testing, the connection can be restored by rebounding, and the normal use of the chip is not affected. Therefore, the BGA chip packaging structure provided by the application can solve the problem that the ball grid welding contact 220 between the BGA chip and the PCB chip is difficult to test the welding quality.

[0059] Further, in the embodiment, the BGA chip packaging structure comprises a packaging adhesive layer 270; the packaging adhesive layer 270 is arranged on the top surface of the BGA chip substrate 210, surrounds and covers the BGA chip body 230, the lead wire contact 240 and the segmented connecting lead wire; the BGA chip packaging structure further comprises a peeling probe; the peeling probe is movably arranged in the packaging adhesive layer 270, is suitable for abutting against the chip end lead wire 251, and separates the chip end lead wire 251 from the substrate end lead wire 252; the test method comprises the following steps: before the substrate end lead wire 252 is connected, the peeling probe is pressed down to separate the chip end lead wire 251 from the substrate end lead wire 252; after the testing is completed, the peeling probe is released, and the chip end lead wire 251 is rebounded to restore the connection with the substrate end lead wire 252.

[0060] Further, in the embodiment, the BGA chip packaging structure comprises a packaging adhesive layer 270; the packaging adhesive layer 270 is arranged on the top surface of the BGA chip substrate 210, surrounds and covers the BGA chip body 230, the lead wire contact 240 and the segmented connecting lead wire; the BGA chip packaging structure further comprises a test probe; the test probe is movably arranged in the packaging adhesive layer 270, is suitable for abutting against the horizontal section of the substrate end lead wire 252, connects the substrate end lead wire 252, and tests the lead wire contact 240; the test method comprises the following steps: after the substrate end lead wire 252 is separated from the chip end lead wire 251, the test probe is pressed down to connect the horizontal section of the substrate end lead wire 252, and the lead wire contact 240 is tested through the substrate end lead wire 252.

[0061] Further, in the embodiment, the pressure of the peeling probe in the step of separating the chip end lead wire from the substrate end lead wire is 1N-3N, for example, 1N, 2N, 3N. If the pressure is less than 1N, the probe moves too short a distance, so that the chip end lead wire is not forced enough, and the separation is not complete. If the pressure is greater than 3N, the probe moves too large a distance, so that the connection is not restored accurately, and the connection fails. Therefore, the pressure of the peeling probe is in the range of 1N-3N, so that the separation of the lead wire and the restoration of the connection are balanced.

[0062] Obviously, the above-mentioned embodiments are only examples for clearly illustrating the present application, and are not intended to limit the present application. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, all the embodiments are not required to be enumerated, and the obvious changes or variations derived therefrom are still within the scope of protection of the present application.

Claims

1. A BGA chip packaging structure, characterized in that, include: BGA chip substrate; the bottom surface of the BGA chip substrate is provided with ball grid soldering contacts, configured to connect to the PCB board; the top surface of the BGA chip substrate is provided with a BGA chip body and lead contacts surrounding the BGA chip body; the BGA chip body is connected to the lead contacts through segmented connecting leads on its surface facing away from the BGA chip substrate; the lead contacts and the ball grid soldering contacts are connected one-to-one through the traces inside the BGA chip substrate. The segmented connecting leads include: Substrate end lead; the substrate end lead is a rigid lead, including an upright section and a horizontal section; the upright section of the substrate end lead is perpendicular to the surface of the BGA chip substrate and is connected to the lead contact. Chip-end leads; the chip-end leads are flexible leads, one end of which is connected to the BGA chip body, and the other end is detachably connected to the horizontal segment of the substrate-end leads; The chip-end lead is adapted to separate from the substrate-end lead under external force, and is adapted to spring back and restore connection after the external force is removed.

2. The BGA chip packaging structure according to claim 1, characterized in that, Also includes: Supporting filler layer; The supporting filler layer is disposed on the top surface of the BGA chip substrate and surrounds the side of the BGA chip body; The horizontal section of the substrate end lead and the portion of the chip end lead exposed on the BGA chip body are located on the surface of the support filler layer facing away from the BGA chip substrate; the support filler layer is an elastic adhesive layer adapted to allow the chip end lead to elastically return to the connected state after the external force is removed after it is disconnected from the substrate end lead.

3. The BGA chip packaging structure according to claim 2, characterized in that, Also includes: Encapsulating adhesive layer; the encapsulating adhesive layer is disposed on the top surface of the BGA chip substrate, surrounding and covering the BGA chip body, the lead contacts, the supporting filler adhesive layer and the segmented connecting leads; A peeling probe; the peeling probe is movably disposed in the encapsulating adhesive layer and is adapted to contact the chip terminal lead, thereby separating the chip terminal lead from the substrate terminal lead; The encapsulating adhesive layer is provided with a release probe hole, which penetrates the encapsulating adhesive layer in the thickness direction to expose the chip terminal lead; The stripping probe is disposed in the stripping probe hole and is adapted to move along the extension direction of the stripping probe hole.

4. The BGA chip packaging structure according to claim 3, characterized in that, The end of the stripping probe furthest from the chip lead has an inverted cone structure; and / or The opening of the stripping probe hole is funnel-shaped.

5. The BGA chip packaging structure according to claim 4, characterized in that, The space between the stripping probe and the stripping probe hole is filled with elastic plastic, which is located at least between the conical surface of the inverted cone of the stripping probe and the wall of the funnel-shaped opening of the stripping probe hole.

6. The BGA chip packaging structure according to claim 3, characterized in that, The size difference between the size of the stripping probe and the diameter of the stripping probe hole at any corresponding position is greater than 0.1 mm and less than 0.5 mm.

7. The BGA chip packaging structure according to claim 3, characterized in that, Also includes: Test probe; The test probe is movably disposed in the encapsulating adhesive layer and is adapted to contact the horizontal section of the substrate end lead, and connect to the substrate end lead to test the lead contact; The encapsulating adhesive layer is provided with a test probe hole, which penetrates the encapsulating adhesive layer in the thickness direction and exposes the horizontal section of the substrate end lead; the test probe is disposed in the test probe hole and is adapted to move along the extension direction of the test probe hole.

8. The BGA chip packaging structure according to claim 7, characterized in that, The end of the test probe furthest from the substrate has an inverted cone structure; and / or The opening of the test probe hole is funnel-shaped.

9. The BGA chip packaging structure according to claim 7, characterized in that, The test probe and the test probe hole are filled with elastic plastic, which is located at least between the conical surface of the inverted cone of the test probe and the wall of the funnel-shaped opening of the test probe hole.

10. The BGA chip packaging structure according to claim 7, characterized in that, The size difference between the test probe and the diameter of the test probe hole at any corresponding position is greater than 0.1 mm and less than 0.5 mm.

11. The BGA chip packaging structure according to claim 10, characterized in that, The distance between the test probe hole and the stripping probe hole is 0.5 mm to 1.5 mm.

12. The BGA chip packaging structure according to claim 1, characterized in that, The spacing between adjacent lead contacts is 0.5mm to 1.5mm.

13. The BGA chip packaging structure according to claim 5, characterized in that, The elastic plastic filling the space between the peeling probe and the peeling probe hole has an allowable elastic deformation of greater than 0.3 mm and less than 0.5 mm when the peeling probe is pressed down.

14. The BGA chip packaging structure according to claim 9, characterized in that, The elastic plastic filling the space between the test probe and the test probe hole has an allowable elastic deformation of greater than 0.3 mm and less than 0.5 mm when the test probe is pressed down.

15. The BGA chip packaging structure according to claim 3, characterized in that, The allowable elastic deformation of the support filler layer when the peeling probe is pressed down is greater than 0.3 mm and less than 0.5 mm.

16. The BGA chip packaging structure according to any one of claims 1 to 15, characterized in that, The radial dimension of the substrate end lead is greater than the radial dimension of the chip end lead.

17. The BGA chip packaging structure according to any one of claims 1 to 15, characterized in that, The horizontal section of the substrate end lead is flat and sheet-like.

18. A test method for a BGA chip package structure, characterized in that, The BGA chip packaging structure is the BGA chip packaging structure as described in any one of claims 1 to 17; The testing method includes the following steps: Use external force to separate the chip-end lead from the substrate-end lead, connect the substrate-end lead, and test the lead contacts. After the test is completed, the external force is removed, allowing the chip-end leads to spring back and reconnect with the substrate-end leads.

19. The test method for the BGA chip package structure according to claim 18, characterized in that, The BGA chip packaging structure includes an encapsulating adhesive layer; the encapsulating adhesive layer is disposed on the top surface of the BGA chip substrate, surrounding and covering the BGA chip body, the lead contacts and the segmented connecting leads; The BGA chip packaging structure further includes a release probe; the release probe is movably disposed in the encapsulating adhesive layer and is adapted to contact the chip terminal lead, thereby separating the chip terminal lead from the substrate terminal lead; The testing method further includes: before connecting the substrate end lead, pressing down the stripping probe to separate the chip end lead from the substrate end lead; After the test is completed, release the stripping probe to allow the chip-end lead to spring back and reconnect with the substrate-end lead.

20. The test method for the BGA chip package structure according to claim 18, characterized in that, The BGA chip packaging structure includes an encapsulating adhesive layer; the encapsulating adhesive layer is disposed on the top surface of the BGA chip substrate, surrounding and covering the BGA chip body, the lead contacts and the segmented connecting leads; The BGA chip packaging structure also includes a test probe; the test probe is movably disposed in the encapsulating adhesive layer, adapted to contact the horizontal section of the substrate end lead, and connects to the substrate end lead to test the lead contact. The testing method includes: after the substrate end lead and the chip end lead are separated, pressing down the test probe, connecting the horizontal segment of the substrate end lead, and connecting the lead contact through the substrate end lead to perform the test.

21. The test method for the BGA chip package structure according to claim 19, characterized in that, In the step of pressing down the stripping probe to separate the chip-end lead from the substrate-end lead, the pressure applied to the stripping probe is 1N to 3N.

Images